KR20010107788A - The Electroplating Method Using Association With Vibration Flow Of Coating Receptacle And Coating Current Over Pulse - Google Patents

Abstract

The present invention relates to a plating method capable of forming a plated film of a microstructured conductive pattern at a high efficiency with good quality without defects and unevenness of film thickness and at a high speed.

The vibrating vane 16f connected to the vibration generating means 16d is vibrated in the plating bath 14 at an amplitude of 0.1 to 10 mm and a frequency of 200 to 800 times per minute so that the plating bath 14 is supplied with a three- The surface plating product X having the fine structure disposed in the plating bath 14 while generating the oscillating flow described above is used as the negative electrode and the metal member 56 is used as the positive electrode to apply a voltage between the negative electrode and the positive electrode, At this time, a first state in which the plating current flowing from the anode to the cathode through the plating bath 14 in the pulse state lasts from the first value I1 to the first time T1, The first value I1 is at least five times the second value I2, and the first time T1 is the second time T2, which is the second time T2, Three times or more.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an electroplating method using a combination of a vibrating flow of a plating bath and a plating current in a pulse form,

The present invention relates to a plating method, and more particularly to a plating method characterized by a specific combination of the physical condition of the plating bath and the electrical condition of the plating current.

BACKGROUND ART Conventionally, in the field of manufacturing articles such as electronic parts, electroplating for forming a film of a conductive material on the surface of an article is widely used.

Particularly, recently, in order to satisfy the demand for miniaturization and high functionality of electronic parts, a fine conductive pattern formed on the surface of the article (including the inner surface of the through hole and the inner surface of the blind via hole) is required.

For example, it is recommended to miniaturize the wiring pattern corresponding to the pitching of the input / output terminals accompanied with the high integration of the semiconductor device, and the inner diameter of the through hole and the blind via hole to be accompanied therewith is 100 mu m or less, Mu] m or less. In addition, it is required that the aspect ratio of the through hole and the blind via hole is as large as 5 or more or 8 or more.

For example, in a multilayer wiring in a semiconductor device, copper wiring is used instead of a conventional aluminum wiring in order to reduce inter-wiring capacitance caused by miniaturization of wiring accompanying high integration, A damascene method using electroplating is used to form wiring. In this method, cohesive deposition in an extremely small blind via hole with an inner diameter of 1 탆 or less is required.

In addition, for example, it is required to form one electrode film on the surface of a pitch component having a length of about 0.3 mm.

On the other hand, the applicant of the present invention has proposed a plating method which is effective especially for an article having a microstructure such as a fine hole (see Japanese Patent Application Laid-Open No. 11-189880). In this method, a vibrating flow is generated in the plating bath, and this is used together with barbing by an air diffuser. This method is also applicable to electroless plating in addition to electroplating.

However, in this method, it is necessary to dispose an air diffuser in the plating vessel that houses the plating bath and air piping to the diffuser. Therefore, the plating bath amount and the length of the plating vessel must be relatively large, There is a disadvantage in that the size is increased.

On the other hand, as described above, a DC power source is generally used as a power source for the electroplating method. However, recently, in order to improve the quality of the plated film, it has been proposed to perform plating while periodically changing the plating current. In this method, the positive current and the negative current alternately flow. That is, by concentrating and partially melting the convex portion of the minute concavities and convexities on the surface of the plated film once formed by the positive polarity energization to the negative polarity, the surface is flat and defects such as microcavities And aims to obtain a high-quality plating film without a high quality. However, this method is disadvantageous in terms of improving the rate at which the film is formed (i.e., improving the plating processing speed) because the surface portion of the plated film once formed is removed.

In recent years, the conductive pattern tends to become finer, and when the plating film is formed with such a conductive pattern, defect and film thickness non-uniformity are likely to occur, and it is difficult to maintain a good quality of the plating film.

The present applicant has proposed a plating method for performing chromium plating while vibrating and stirring a plating bath, and a method for chrome plating while stirring a plating bath by receiving a plurality of surface plating qualities in barrels (Japanese Patent Application Laid- 7-54192, and No. 6-330395, incorporated herein by reference)

However, in such a method, direct current is used as a plating current, and the present invention is applied to a surface-plated article having a minute length of 5 mm or less, for example, 0.3 to 1.0 mm in the direction crossing the rectangular direction It is not specifically mentioned. In the barrel plating of such a fine-length surface-plated article, the surface plating products overlap each other within the barrel, and the flowability of the plating solution is extremely reduced as a required portion of the plating film. Therefore, there is a technical difficulty which is incomparable in the case of a relatively large surface-plated article, and there is room for a new improvement in terms of the uniformity after the film formation speed and the plating film thickness.

It is therefore a first object of the present invention to provide a plating method capable of forming a plating layer of a conductive pattern having a fine structure and having good quality without defects and uniformity of film thickness.

It is another object of the present invention to provide a plating method capable of rapidly obtaining a plated film of a good quality of a fine conductive pattern.

It is a further object of the present invention to provide a plating method capable of increasing the efficiency of a plated film of good quality of a microstructured conductive pattern with a relatively small device configuration.

According to the present invention, in order to achieve the above object,

A surface plating member arranged to be in contact with the plating bath while vibrating flow is generated in the plating bath by vibrating a vibrating vane fixed to one end or a plurality of stages to a vibration bar vibrating in the plating bath in conjunction with the vibration generating means, A negative electrode and a metal member arranged to be in contact with the plating bath are used as positive electrodes and a voltage is applied between the negative electrode and the positive electrode so that plating current flowing from the positive electrode to the negative electrode through the plating bath becomes a pulse State, a first state in which a first value I1 lasts for a first time T1, and a second state in which a second value I2 of the same value as the first value lasts for a second time T2, The first value I1 is at least five times the second value I2 and the first time T1 is at least three times the second time T2.

In an embodiment of the present invention, the first value I1 is 6 to 25 times the second value I2, and the first time T1 is 4 to 25 times the second time T2. One embodiment of the present invention fh The first time T1 is from 0.01 second to 300 seconds. In one embodiment of the present invention, the vibrating vane can be oscillated with an amplitude of 0.05 to 10.0 mm and a frequency of 200 to 1,500 times / min. In one embodiment of the present invention, the oscillating flow of the plating bath has a three-dimensional flow rate of at least 150 mm / second. In one embodiment of the present invention, the vibration generating means vibrates at 10 to 500 Hz.

In one embodiment of the present invention, the surface-plated article is vibrated at an amplitude of 0.05 to 5.0 mm and a frequency of 100 to 300 times / minute. In one embodiment of the present invention, the surface-plated article is rocked at a swinging width of 10 to 100 mm and a swinging width of 10 to 30 times / minute.

In one embodiment of the present invention, the surface-plated article has a surface plated surface having a fine structure with a length of 50 mu m or less.

In one embodiment of the present invention, a plurality of said surface-plated articles are provided with small holes for allowing the liquid of the plating bath to easily pass therethrough, and in order to flow a plating current to the nuclear surface plating article by contact with the surface- And rotating the holding vessel in the plating bath around the rotation center in the non-vertical direction to roll the plurality of surface-plating articles in the holding vessel, The contact and separation of the conductive member are repeated.

In one embodiment of the present invention, the width of the surface-plated article is 5 mm or less.

Fig. 1 is a cross-sectional view showing a configuration of a plating apparatus in which a first embodiment of a plating method according to the present invention is implemented;

Fig. 1 is a cross-sectional view showing a configuration of a plating apparatus in which a first embodiment of a plating method according to the present invention is implemented;

3. 1 is a plan view showing a configuration of a plating apparatus in which a first embodiment of the plating method according to the present invention is implemented;

FIG. Sectional view of the mounting portion of the vibration transmission rod to the vibration member.

Figure 5. Sectional view of the mounting portion of the vibration transmission rod to the vibration member.

6. Another embodiment of a mounting portion of a vibrating collar to a vibration transmission rod.

7. Fig. 6 is a cross-sectional view showing another embodiment of the installation of a cathode bus bar of a surface plated article. Fig.

Figure 8. A graph showing the change in plating current flowing through a surface plated article.

Figure 9. Sectional view showing a configuration of a plating apparatus to which a second embodiment of the plating method according to the present invention is applied.

10. Sectional view showing a configuration of a plating apparatus to which a second embodiment of the plating method according to the present invention is applied.

11. Fig. 6 is a plan view showing a configuration of a plating apparatus in which a second embodiment of a plating method according to the present invention is implemented. Fig.

12 is a cross-sectional view showing a plating apparatus used in the practice of the plating method according to the present invention.

13. 1 is a partially cut-away plan view of the plating apparatus of Fig. 1; Fig.

FIG. Sectional view showing the installation of the vibration flow generating portion constituting the plating apparatus used in the plating method according to the present invention in the plating vessel.

15. Sectional view showing the installation of the vibration flow generating portion constituting the plating apparatus used in the plating method according to the present invention in the plating vessel.

16. Sectional view showing the installation of the plating vessel of the vibration flow generating section constituting the plating apparatus used in the practice of the plating method according to the present invention.

17. A top view of a laminate.

18. Sectional view showing a clipping mode of the upper portion of the plating vessel by the laminate.

19. Fig.

FIG. A graph showing the change in plating current flowing through a surface plated article.

Fig. Sectional view showing a modification of the vibration flow generating portion.

22. 21 is a plan view showing the vibration flow generating portion of Fig. 21; Fig.

23. Fig. 8 is a view showing an example of a power supply for pulse plating;

Description of the Related Art

1, 1 ', 1 ": metal plate 2, 2': rubber plate 2a, 2c: solid rubber layer

2b: sponge rubber layer 3: laminate 5: through-hole

6: opening 12: plating vessel 13:

14: Plating bath 15: Paper guide 16:

16a: base unit 16b: coil barrel 16c: vibration member

16d: vibration motor 16e: vibration transmission rod 16f: vibrating vest

16g1, 16g2: Vibration stress distribution member 16h1, 16h2:

16i1, 16i2; 16i3, 16i4: Nuts 16j: Vibrating member

16k: Spacing 16m, 16n: Nut 16p: Elastic member sheet

20: swing motor 22: connecting rod 24: swing frame

26: rail 28: vibration motor 30: cathode bus bar

32: anode bus bar 34: power supply circuit 40: surface plated article holding member

40a: upper hook portion 40b: lower club portion 40c: compression barb

44: Vibration frame 46: Coil barrel 48: Vibration motor

49: Balance weight 50: Barrel 52a: Pipe member

54 '56': insulated covered wiring 56: anode metal member 112: anti-vibration rubber

116: bolt 117: nut 118: mounting member

119: rubber ring 123: upper guide member 124: lower guide member

131, 132: bolt 136: pre-bent bush member

X: Surface plated article

Hereinafter, a specific embodiment of the present invention will be described with reference to the drawings. In the drawings, members or parts having the same shape are denoted by the same reference numerals.

1 and 2 are cross-sectional views showing a configuration of a plating apparatus according to a first embodiment of a plating method according to the present invention, and Fig. 3 is a plan view of Fig. 1 and Fig.

In these drawings, reference numeral 12 denotes a plating vessel, and the plating bath 14 is accommodated in the plating vessel. Reference numeral 16 denotes a vibration flow generating portion. The vibration flow generating portion 16 includes a basic pedestal 16a provided on the plating vessel 12 with a vibration proof rubber interposed therebetween, a coil barb 16b as a vibration absorbing member whose lower end is fixed to the basic pedestal, A vibration motor 16d as a vibration generating means provided in the vibration member, a vibration transmitting rod 16e having an upper end provided in the vibration member 16c, And has a vibrating vane 16f provided at a position to be immersed in the plating bath 14. In the coil barrel 16b, a rod-shaped guide member can be disposed as shown in Fig. 12 to be described later.

The vibration motor 16d vibrates at 10 to 500 Hz, preferably 20 to 60 Hz, and more preferably 30 to 50 Hz, for example, under the control using an inverter. The vibration generated in the vibration motor 16d is transmitted to the vibrating vane 16f via the vibrating member 16c and the vibration transmitting rod 16e. The vibrating vane (16f) oscillates at the end portion thereof within the plating bath (14). This vibration causes the vibrating vane 16f to be bent to the end portion at the portion provided on the vibration transmission rod 16e. The amplitude and the frequency of the vibration are different from those of the vibration motor 16d but are determined in relation to the mechanical characteristics of the vibration transmission path and the interaction with the plating bath 14 and the amplitude is 0.05 to 10.0 mm , 0,1 to 10.0 mm) at a frequency of 200 to 1,500 times / minute (for example, 200 to 800 times / minute).

4 is an enlarged cross-sectional view of the mounting portion of the vibration member 16c and the vibration transmission rod 16e. 16i2, 16i2, 16i2, and 16i3 are sandwiched by the vibration stress distributing members 16g1, 16g2 and the washers 16h1, 16h2 at both upper and lower sides of the vibration member 16c at the male thread portion formed on the upper end of the vibration transmitting rod 16e , And 16i4. The vibration stress distribution members 16g1 and 16g2 are made of, for example, rubber.

5 is an enlarged cross-sectional view of a portion where the vibrating vane 16f is provided by the vibration transmitting rod 16e. On both upper and lower sides of each of the seven vibrating vanes 16f, a vibrating vane fixing member 16j is disposed. A sparker ring 16k for setting the interval of the vibrating vanes 16f is disposed between adjacent vibrating vanes 16f with a fixing member 16j interposed therebetween. A nut 16m suitable for the male screw formed in the vibration transmission lot 16e is disposed below the upper and lower vibration flanks 16f of the uppermost vibrating vane 16f.

6 is a view showing a modified example of a portion where the vibrating vane 16f is mounted to the vibration transmitting rod 16e. In this modified example, the vibrating vanes 16f are provided on the vibration transmission rod 16e individually from the upper and lower nuts 16n. Further, by interposing an elastic member sheet 16p between the vibrating vane 16f and the fixing member 16j from a foot-based resin (resin) and a foot-series rubber or the like, breakage of the vibrating vane 16f Can be prevented. As shown in the figure, the lower surface (pressing surface) of the upper fixing member 16j is a convex cylindrical circle, and the upper surface (pressing surface) of the lower fixing member 16j is a concave cylindrical It is a circle. Prior to this, the portion of the vibrating vane 16f pressed by the fixing member 16j in the vertical direction is bent, and the end portion of the vibrating vane 16f forms an angle? With respect to the horizontal plane. This angle may be, for example, from -30 DEG to 30 DEG, more preferably from -20 DEG to 20 DEG. In particular, it is preferable that the angle? Is not less than -30 degrees and not more than -5 degrees or not less than 5 degrees and not more than 30 degrees, preferably not less than -20 degrees and not more than -10 degrees, or not less than 10 degrees and not more than 20 degrees. When the pressing surface of the fixing member 16j is flat, the angle alpha is 0 deg. The angle? Does not have to be the same for all the vibrating vanes 16f and, for example, as shown in Fig. 1, a value of - (for the downward direction: (In the direction opposite to that shown in Fig. 6), and the vibrating vanes 16 other than the vibrating vanes 16 may have a positive value (i.e., upward direction: the direction shown in Fig. 6).

As the vibration vane 16f, a flexible metal plate, a synthetic resin plate, a rubber plate, or the like can be used. The thickness of the vibrating vane 16f is set so that the end of the vibrating vane 16f exhibits a floatation phenomenon (phenomenon such as a wave) at the time of operation of the vibrating flow generating portion 16. [ When the vibrating vane 16f is made of a metal plate such as a stainless steel plate, its thickness may be 0.2 to 2 mm. When the vibrating vanes 16f are made of a synthetic resin plate and a rubber plate, the thickness thereof may be 0.5 to 10 mm.

1 to 3, the swing motor 20 is in contact with the swing frame 24 with the connecting rod 22 interposed therebetween. The pivot frame 24 is arranged on the rail 26 so as to reciprocate in a horizontal direction (left-right direction in Fig. 1). A vibration motor (28) is provided in the swing frame (25). The negative busbar 30 and the positive busbar 32 are kept in an insulated state from the swing frame 24 and are connected to the negative terminal and the positive terminal of the power supply circuit 34, Respectively. The power supply circuit 34 can generate a rectangular wave state voltage from an AC voltage. Such a power supply circuit is known as a pulse power supply device having, for example, a rectifier circuit using transistors.

In the present invention, as a power supply circuit (power supply device) used for generating a plating current, rectification (including addition of a direct current component) is performed and output is used. Examples of such a power supply device or rectifier include a transistor regulated power supply, a dropper type power supply, a switching power supply, a silicon rectifier, an SCR type rectifier, a high frequency rectifier, an inverter digital control type rectifier (for example, Power Master ), KTS series (manufactured by Sansa Electric Co., Ltd.), RCV power supply from Sanko Electric Co., Ltd., and switching regulator type power source and transistor switch. The transistor switch is on-off, , A high-frequency switching power supply (transforming an AC from a diode to a DC, adding a high frequency of 20 to 30 KHz to a transformer by Powderlander, and rectifying and smoothing the output once again) A rectifier, and a high-speed pulse-type PR power source of high frequency control type (for example, HiPR series Chiyoda).

Here, the current waveform will be described. Selection of the plating current waveform is important in order to realize high-speed plating and improve the characteristics of the plating film. The conditions of voltage and current required for electroplating vary depending on the type of plating, the composition of the plating bath, and the length of the plating vessel, and it is difficult to define them as one concept. However, in the current state, Can sufficiently cover. Therefore, the rated output of the DC power supply for plating is standardized in the industry such as 6V, 8V, 12V and 15V. Since the voltage below this rated voltage is adjustable, it is desirable to select a power source having a rated voltage with a little margin for the desired voltage value required for plating. In the industry, the rated output current of the power supply is standardized to 500A, 1000A, 2000A to 1000A, and other customized output currents are taken. It is advisable to determine the required current density of the surface plating item and the required current capacity of the power supply as the surface layer of the surface-plated article in the surface plating type and the surface layer.

The pulse wave is inherently shorter in width W than in cycle T, but this definition is not rigorous. The pulse wave includes other than the square wave. The operating speed of the element used in the pulse circuit is increased, and the pulse width becomes ns (10 ^-9s ) or less. As the width of the pulse narrows, it is difficult to maintain a sharp waveform of the leading edge and the trailing edge. This is because it contains high frequency components.

Examples of the type of pulsed spark include sawn wave, ramp wave, triangular wave, compound wave, and rectangular wave (square wave). In the present invention, quadrature waves are particularly preferable for electric efficiency and smoothness.

As shown in Fig. 23, a power source for pulse plating includes a switching megger-type DC power source and a transistor switch, and the transistor switch is turned on / off at a high speed, To the load.

The upper portion of the conductive holding member 40 is mechanically and electrically connected to the cathode bus bar 30 for holding the surface-plated article X. [ The lower surface of the surface plating article holding member 40 is immersed in the plating bath 14, and the surface plating article X is electrically connected to this portion and held by a clamp or the like. Although not shown in the figure, the anode bus bar 32 is mechanically and electrically connected to a negative metal member (for example, a container made of plastic) originating from a metal to be plated, And is immersed in bath 14. Furthermore, various methods known in the art can be used for the installation of the surface plating article of the cathode busbar and the method of installing the cathode metal member of the cathode busbar and the form and structure of the cathode busbar and the anode busbar.

7 is a cross-sectional view showing a modified example of the installation of the cathode bus bar of the surface-plated article. In this example, the conductive holding member 40 is provided with the upper hook portion 40a provided on the cathode bus bar 30, the lower crumb portion 40b holding the surface plating product X, And a compression barrel 40c for generating a negative crank force.

1 to 3, by operating the swing motor 20, the swing frame 24, the holding member 40, and the surface plated article X provided thereon can be swung with a swing width of 10 to 00 mm, It can be rocked at several tens to thirty times / minute. Further, the vibration motor 28 vibrates at 10 to 60 Hz, preferably 20 to 35 Hz, for example, according to control using an inverter. The vibration generated by the vibration motor 28 is transmitted to the surface plated article X via the vibrating frame 24 and the holding member 40 so that the surface plated article X has an amplitude of 0.05 to 5.0 mm (for example, 0.1 to 5.0 mm) at a frequency of 100 to 300 times / minute.

8 is a graph showing the relationship between the plating current (current density) flowing through the surface-plated article X based on the voltage applied between the cathode bus bar 30 and the cathode bus bar 32 by the power supply circuit 34 It is a graph showing the change. As shown, the plating current is interchanged between a first state in which the first value I1 lasts for a first time T1 and a second state in which a second time T2 is maintained at a second value I2 (< I1) It is a rectangular pulse state. Here, the first value I1 and the second value I2 are the same. I1 is 5 times or more (for example, 6 times or more, for example, 6 to 25 times) of I2, and preferably 8 to 20 times. T1 is at least three times (for example, at least four times: four to twenty-five times) T2, and preferably at least six times to twenty times. By combining such a plating current with the oscillating flow of the plating bath 14 by the oscillating flow generating portion 16, a good quality and a high film forming speed can be obtained even in plating of a fine conductive structure pattern.

The first value I1 and the first time T1 can be determined by the plating type (for example, sulfuric acid copper plating, cyanating copper plating, copper pyrophosphate plating, nickel plating, graphite nickel plating, zinc sladmate nickel plating, chrome plating, zinc cyanide plating, Zinc-plated gold, gold-plated copper, lead-plated copper, etc.) or plating baths, such as copper plating, cyanide plating, cyanide plating, alkali plating, acid plating, silver plating, cyanide gold plating, acid gold plating, appropriately set for the composition, but, for example, I1 may be in the range of ^{0.01 ~ 100 [a / dm 2} ], in the range of T1 is in the range of 0.01 ~ 300 [s] (e.g. 3-300 [sec]) It is possible. However, it is not limited to this. The optimum I1, I2, T1, and T2 vary in a wide range in the kind of the plating and the composition of the plating bath, for example, when the plating progresses, the composition of the plating bath changes.

The plating bath 14 is selected at the same time as the known electroplating method for the plating film to be formed. For example, in the case of performing a wire-roughening plating,

Acidification: 60 to 100 g / L (liter)

Heritage: 170 ~ 210g / L

Polishing agent:

Chlorine Zion: 30 to 80 mL / L

Can be used.

In the case of nickel plating, for example,

Lithium Nickel: 270 g / L

Nickel chloride: 68 g / L

Boric acid: 40 g / L

Lactic Magnesium: 225 g / L

May be used, and as the ordinary bath,

Lactic acid nickel: 150 g / L

Ammonium chloride: 15 g / L

Boric acid: 15 g / L

Can be used, and as the watt bath,

Lithium Nickel: 240 g / L

Ammonium chloride: 45 g / L

pH: 4 to 5

Bath temperature: 45 ~ 55 ℃

Can be used.

In addition, for example, in the case of performing acidic sponge plating,

Herbicide -st: 50g / L

Lactic acid: 100 g / L

Crezo-Lusolic acid: 100 g / L

Gelatin: 2 g / L

Naphthalene: 1 g / L

Can be used.

Examples of the surface-plated article X include electronic parts, mechanical parts and the like, and there are no particular limitations. The reason why the features of the present invention are remarkably exhibited is the case of forming a plated film having a fine structure, Examples of the plating of such a surface-plated article include a method of plating a surface-plated article on a multi-layered wiring base with a smile (for example, Formation of plating conductive film on the inner surface of one blind via hole and through hole (for example, having a depth of 10 to 100 占 퐉): pitch of wiring base: 50 占 퐉 or less (for example, 20 to 50 占 퐉: (Particularly 20 μm or less, or 10 μm or less, for example, 5 μm or 3 μm) for a high-density wiring pattern of 20 μm or less, for example, 10 μm or 5 μm, (For example, having a depth of 7 to 70 占 퐉): In the formation of a multilayer wiring of a semiconductor device, A very fine blind via hole having an inner diameter of about 0.3 mu m or less and a very small gap (for example, having a width of 0.1 mu m and a depth of 1.5 mu m) in the soldering method to form a conductive film: Forming an electrode bump; Etc. may be exemplified. Particularly, the present invention has a large improvement effect when it is applied to a structure having a high aspect ratio (for example, three times or more, especially five times or more).

As the surface-plated article X, a very small one having an average diameter of 5 to 500 mu m can be used. Here, the average diameter refers to an average value of representative lengths in three directions orthogonal to each other. Examples of such a surface-plated article X include a copper powder, a metal powder such as a pretreated aluminum powder and an iron powder powder, a synthetic resin powder such as a resinized ABS resin powder, and a ceramic chip subjected to a conductorization treatment have. In addition, electronic parts and mechanical parts, metal powder alloys, fine particle inorganic and organic pigments, metal balls and the like can be mentioned.

For example, by forming a nickel (Ni) plated film on a metal particle having a diameter of about 300 mu m, for example, copper (Cu) particles, or forming a gold (Au) plated film and a silver (Ag) plated film on a nickel plated film A composite plating film can be formed.

In the case where the surface-plated article is of electric insulation such as plastic, it is treated as a pretreatment of electroplating, and in the case of a plated surface having a high aspect ratio with a fine structure, It is difficult to form a uniform and good conductive undercoat even when subjected to the undercut treatment, and thus the thickness of the plated film that can be obtained by electroplating is likely to become uneven. In order to solve such a problem, it is also conceivable to apply the conductive underlayer by sputtering or vacuum evaporation. However, in such a case, since the processing is performed in the decompressor, the cost of the processing apparatus is increased, There is a difficulty that can not be. On the other hand, when the conductive under-treatment treatment such as electroless plating is performed while vibrating the treatment liquid by means of means such as vibration flow means used in the present invention, It is possible to impart a conductive undercoat having a high uniformity. Therefore, by combining such an undercoating treatment and the electroplating method of the present invention, it is possible to continuously perform the steps from the pretreatment to the electroplating, and the productivity is remarkably improved.

In the plating method of the present invention, the flowability of the plating bath is improved in the concavo-convex portion of the microstructure due to the oscillatory flow generated in the plating bath 14 by the oscillating flow generating portion 16, The film thickness uniformity can be increased as long as it is sufficiently low in accordance with the state and the first state but is repeatedly pulsed while repeating the second state and the second state sufficiently short by the first state at the same time as the value of the identity. It is possible to lower the occurrence of defects such as film thickness irregularities due to the formation of intensive plated films on the same convex portion and the outermost portion and gas pits on through holes and via holes and to obtain a high surface gloss, It is possible to obtain the rate of formation of the deposited film and to simplify the structure of the manufacturing apparatus since the plating film is not accompanied by partial dissolution of the plated film once formed as in the case of the pulse plating current. Therefore, a desired plating film can be formed efficiently and at a high speed with respect to a wide range of plated articles.

In the present invention, the distance between the surface-plated article X and the anode metal member is narrowed by the action of the oscillating flow generated in the plating bath 14, so that the current density is increased and short-circuiting is unlikely to occur. This can also be considered as a factor that can form a plating film at a high rate without causing any side effects such as sooting and pitting and at a high rate.

In order to obtain such an action well, it is highly desirable that the three-dimensional flow velocity of the oscillating flow of the plating bath 14 is at least 150 mm / sec. Such a high three-dimensional flow velocity is effectively realized by vibrating the plating bath, and it is disadvantageous in that an extremely large-scale apparatus configuration is required even if it is difficult to realize by stirring.

In the present embodiment, the above effects are further improved by the rocking and / or oscillation of the rocking frame 24 and the rocking and / or vibration of the surface-plated article X. However, A good effect can be obtained. The positive electrode bus bar 32, the surface plated article X and the positive electrode metal member without using the swinging frame 24, the swing motor 20 and the vibration motor 28, And the device configuration is further simplified. In the case where the surface-plated article X is a relatively large-length or long-length flat plate such as a multi-layered wiring base or the like, the fluctuation is effective for moving along the in-plane direction.

Fig. 9 and Fig. 10 are cross-sectional views showing the configuration of the plating apparatus in which the second embodiment of the plating method according to the present invention is implemented, and Fig. 11 is a plan view thereof.

This embodiment differs from the first embodiment described above with reference to Figs. 1 to 8 in that the form of holding the surface-plated article X and the sum of the surface-plated article and the surface- will be.

9 to 11, the vibration frame 44 is provided in the plating vessel 12 with the coil barrel 46 serving as the vibration absorbing member interposed therebetween. The vibration frame 44 is provided with a vibration motor 48 and a balance weight 49 for balancing the weight with the vibration motor 48. In the vibration frame 44, a barrel 52 is provided with a support member 50 therebetween. The barrel is rotatably provided with respect to the support member 50 and is rotated in a direction indicated by an arrow in Fig. 9 by a drive means (not shown). In the barrel 52, a number of minute surface-plated articles X are accommodated. On the outer peripheral surface of the barrel 52, a plurality of small holes are formed to prevent the passage of the surface-plated article X and allow the liquid of the plating bath 14 to pass therethrough. In the barrel 52, a cathode conductive member 54 extending to the lower portion thereof is disposed. The cathode conductive member 54 is connected to the negative electrode terminal of the power supply circuit 34 through the insulated covering line 54 and through the pipe member 52a provided on the barrel 52 with the barrel 52 as the center of rotation . The rolled surface-plated article X that is accompanied by the barrel rotation does not contact the cathode conductive member 54 and the cathode conductive member 54 is separated from the cathode conductive member 54. Therefore, . Reference numeral 56 denotes a positive electrode metallic member having a bottom immersed in a plating bath 14. The positive electrode metal member 56 is accommodated in, for example, a plastic container and is connected to the positive electrode terminal of the power supply circuit 34 via the insulating covered wiring 56. As shown in FIG. 9, the anode metal member 56 is disposed on both sides of the barrel 52. However, the anode metal member 56 may be disposed on only one side.

The vibration motor 48 vibrates at an amplitude and a frequency equal to that of the vibration motor 28 and the surface-plated article X has an amplitude of 0.05 to 5.0 mm (for example, 0.1 to 5.0 mm) 100 to 300 times / minute. Even in this embodiment, a good effect can be obtained even if the surface-plated article X due to the vibration of the vibration frame 44 does not vibrate. The device structure can be further simplified by supporting the support member 50 and the barrel 52 without using the vibration frame 44 and the vibration motor 48 or the like.

In the present embodiment, the plating current density is set as described above with reference to FIG. In this embodiment, in each of the surface-plated articles X, a plating current in a process of changing between the first state or the second state or between the first state and the second state when each contact with the cathode conductive member 54 is If only the current density at the time of contact is continuously displayed, on the average, it is as shown in Fig. 8, and the same effect as that of the first embodiment can be obtained.

The present embodiment is particularly applicable to chip parts such as ceramic chip capacitors having a length of about 0.6 mm x 0.3 mm x 0.2 mm, for example, to form an electrode film and to form an electrode film having a diameter of 0.5 mm x length x 20 mm In the case where a plating film is formed on a plurality of the surface-plated articles X at the same time. In the case of using a minute plate having a length of 5 mm or less, particularly 2 mm or less, particularly 1 mm or less, in the direction transverse to the rectangular direction as the surface-plated article as described above, The improvement effect is great. Examples of the surface-plated article X include a metal powder alloy, an organic pigment, and a metal ball.

Needless to say, a necessary pretreatment step is carried out before the electroplating method according to the present invention is carried out. These pre-treatments may be performed in the same manner as in the conventionally known electroplating method.

In the method of the present invention, the vibration flow generating unit having the vibrating vanes used for generating the oscillating flow necessary for the plating bath may be the one described in the above Japanese Patent Application Laid-Open No. 11-189880 (for example, 8, a vibration collar is disposed in a lower portion of a plating vessel, and a vibration motor transmits vibration to a vibrating collar with a vibration transmitting needle interposed therebetween to vibrate the collar collar in a horizontal direction ) And those described in publications cited in the corresponding publications can be suitably used.

For example, as shown in Figs. 21 and 22, a vibration flow generating portion can be used. In these figures, two vibrating flow generating portions 16 are supported by a guide 15 fixed to a support base 13 on which a plating vessel 12 is installed. Is provided at the upper end of the vibration transmission rod 16e "in the vertical direction on the vibration member 16c 'receiving vibration transmission in the vibration motor 16d in the vibration flow generating portion 16. The vibration transmission rod 16e" Is extended into the plating vessel 12, and the end portion of the vibration transmission rod 16e 'in the horizontal direction is provided at a lower end portion thereof. The vibration transmitting rod 16e 'is shared by the two vibrating flow generators 16, and the vibrating vanes 16f in the vertical direction are provided. The vibrating motor 16d transmits the vibration to the vibrating vane 16f via the vibrating member 16c 'and the vibration transmitting rod 16e' to vibrate the vibrating vane 16f in the horizontal direction.

Fig. 12 is a cross-sectional view showing another embodiment of a plating apparatus used for carrying out the plating method according to the present invention, and Fig. 13 is a plan view showing a part of the plating apparatus. This configuration differs from the above-described embodiment in the configuration of the vibration flow generating portion 16. That is, the lower end of the coil barb 16b is fixed with respect to the attachment member 118 fixed to the upper end of the plating vessel 12, and the lower end of the coil member 16b is fixed to the upper end of the vibration member 16c And a vibration motor 16d is provided at the lower part. A lower guide member 124 having a lower end fixed to the mounting member 118 and an upper guide member 123 having an upper end fixed to the oscillating member 16c are disposed in the coil barrel 16b at appropriate intervals .

Fig. 14 and Fig. 15 are cross-sectional views showing other forms of installation in the plating vessel of the vibration flow generating unit constituting the plating apparatus used in the plating method according to the present invention, and Fig. 16 is a plan view thereof. FIGS. 14 and 15 correspond to the X-X 'and Y-Y' cross-sectional views of FIG. 16, respectively. Further, in these drawings, a cathode anode and a power source circuit for plating are not shown.

In this embodiment, a laminated body 3 of a rubber plate 2 and a metal plate 1, 1 'is used as a vibration absorbing member in place of the coil barb 16b. That is, the laminate 3 is fixed to the mounting member 118 fixed to the upper end of the plating vessel 12 by fixing the metal plate 1 'provided on the bolt 131 via the vibration-proof rubber 112, The rubber plate 2 is disposed on the metal plate 1 'and the metal plate 1 is disposed on the rubber plate 2 and integrated with the bolts 116 and the nuts 117.

The vibration motor 16d is fixed to the metal plate 1 by bolts 132 with a support member 115 interposed therebetween. The upper end of the vibration transmitting rod 16e is provided on the laminate 3, particularly the metal plate 1 and the rubber plate 2, with the rubber ring 119 interposed therebetween. That is, the upper metal plate 1 exhibits the function of the vibrating member 16c of the embodiment shown in Fig. 1 and other embodiments, and the lower metal plate 1 'corresponds to the base plate of the embodiment shown in Fig. 16a. The laminated body 3 (mainly the rubber plate 2) including these metal plates 1 and 1 'exhibits a vibration absorbing function similar to that of the coil barb 16b described in FIG.

17 shows a plan view of the layered product 3. Fig. 17A corresponding to the shapes of Figs. 11 to 16, through-holes 5 are formed in the laminate 3 in order to pass through the vibration transmission rod 16e. In the example shown in Fig. 17 (b), the laminate 3 originates from two portions 3a and 3b divided by a dividing line passing through the through-hole 5, So that it can easily pass through the opening 16e. 17 (c), the layered product 3 has an annular shape corresponding to the upper end portion of the plating vessel 12, and an opening 6 is formed at the center thereof.

17A and 17B, the upper part of the plating vessel 12 is clogged by the layered body 3, so that when the plating treatment is carried out, the plating liquid, which vaporizes in the plating bath 14, It can prevent leaking.

18 is a cross-sectional view showing a state in which the upper part of the plating vessel is closed by the layered product 3 as described above. 18 (a), the rubber plate 2 is in contact with the vibration transmission rod 16e in the through hole 5 and is closed. 18 (b), in the opening 6 of the layered product 3, there is provided a pre-blanket seal member 136 provided on the laminate body 3 and the vibration transmission rod 16e to seal the gap therebetween ).

19 shows an example of the layered product 3 as the vibration absorbing member. The example of FIG. 19 (b) is the embodiment of FIG. 14 to FIG. In the example of Fig. 19 (a), the layered product 3 originates from the metal plate 1 and the rubber plate 2. Fig. 19 (c), the laminate 3 is derived from the upper metal plate 1, the upper rubber plate 2, the lower metal plate 1 'and the lower rubber plate 2'. 19 (d), the laminate 3 is derived from the upper metal plate 1, the upper rubber plate 2, the intermediate metal plate 1 ", the lower rubber plate 2 'and the lower metal plate 1' The number of the metal plate and the rubber plate in the body 3 may be, for example, 1 to 5. Further, in the present invention, it is also possible to constitute the vibration absorbing member using only the rubber plate.

As the material of the metal plates 1, 1 ', 1 ", stainless steel, steel, copper, and other suitable alloys can be used. The thickness of the metal plate is, for example, 10 to 40 mm, (For example, the intermediate metal plate 1 ") which is not directly fixed to the metal plate 1 can be thinned to 0.3 to 10 mm.

As the material of the rubber plates 2 and 2 ', a synthetic rubber or a residue of natural rubber can be used, and the vibration proof rubber specified in JIS K6386 is preferable, and the static elastic modulus is 4 to 22 Kgf / cm 2, preferably 5 to 10 Kgf / Cm &lt; 2 &gt;, and an elongation of 250% or more is preferable. Examples of synthetic rubbers include chloroprene rubber, nitrile rubber, nitrile chloroprene rubber, styrene chloroprene rubber, acrylonitrile butadiene rubber, imprene rubber, ethenylene fluoride co-alloy rubber, epichlorphydrin rubber, Based rubber, an oxicide-based rubber, a foot-based rubber, a silicone-based rubber, a urea-based rubber, a hypoaluminous rubber and a foparvin rubber. The thickness of the rubber plate is, for example, 5 to 6 mm.

19 (d), the layered product 3 is composed of the upper metal plate 1, the rubber plate 2 and the lower metal plate 1 ', and the rubber plate 2 is sandwiched between the upper solid rubber layer 2a and the spore A rubber layer 2b and a lower solid rubber layer 2c. One of the lower solid rubber layers 2a and 2c may be removed or a plurality of solid rubber layers and a plurality of sponge rubber layers may be laminated.

20 shows a case where the power source circuit 34 in the embodiment described above is applied with the surface plating product X flowing therebetween based on the voltage applied between the cathode bus bar 30 and the cathode bus bar 32 FIG. 5 is a graph showing a variation example of a change in plating current (current density). FIG. In this modified example, the current density waveforms of the first state and the second state are not in a rectangular state as shown in Fig. 8 but slightly pulsation occurs. Such pulsation is based on the configuration of the power supply circuit 34, and in the present invention, the plating current may be based on such a pulsating current. The currents I1 I2f in the first and second states may each have a peak value as a state.

Further, in the present invention, the power supply circuit 34 is provided with a voltage supply system for the first state and a voltage supply system for the second state so that mutual output is performed between these two systems (that is, Change the device and disconnect it).

As described above, the combination of the oscillating flow of the plating bath and the plating current in the pulse can also be applied to the anodic oxidation method in which the surface treatment of the surface-treated material is performed using the current in the treatment bath, electrolytic polishing method, have. Of course, the surface treatment is disposed on the anode side or the negative side with respect to the treatment contents. Thus, the surface treatment of the surface-treated article having a fine structure can be satisfactorily performed.

Hereinafter, the present invention will be described with reference to examples.

Example 1:

The apparatus described with reference to Figs. 1 to 3 was used. Here, as the power source circuit 34, a Power Master manufactured by Central Co., Ltd. was used as the vibration motor 16d using 150 W x 200 V x 3 phi and using the capacity of 300 liters as the plating vessel 12.

A silicon wafer of 8 inches (200 mm in diameter) subjected to a predetermined pretreatment according to the usual rules as the surface-plated article (X) was used to form a blind via hole having the same seed layer Thereby forming a conductive film. A plurality of blind via holes are formed in a nitride chitilane insulating layer having a thickness of 0.35 mu m and an inner diameter of 24 mu m.

As the plating bath 1,

Southeastern: 75g / L

Lactic acid: 190 g / L

Polishing agent: Appropriate amount

Chloride ion: 40 ml / l

Respectively.

The vibrating motor 16d of the vibrating flow generating portion 16 was vibrated at 45 Hz to vibrate the vibrating vane 16f in the plating bath 14 with an amplitude of 0.2 mm and a frequency of 650 revolutions per minute. Further, the vibration motor 28 was vibrated at 25 Hz, and the surface-plated article X was oscillated in the plating bath 14 at an amplitude of 0.15 mm and a frequency of 200 times / minute. At this time, the three-dimensional flow rate of the plating bath was defined as a three-dimensional electrode anemometer ACM-300A (manufactured by ALEX ELECTRONICS CO., LTD.), Which was 200 mm / second.

A 1 / Wafer = 3 [A / dm ² ], 12 = 0.6 [A / Wafer], and T1 = 10 [Sec] and T2 = 1 [sec], the plating current of the rectangular wave was shed.

After 10 minutes of treatment, a copper plating film having a thickness of about 10 탆 was formed, and all of the blind via holes were well formed.

Comparative Example 1-1

(58%) of a large number of blind via holes were treated in the same manner as in Example 1 except that T2 = 0 [sec], and the good copper plating film treatment was performed on the part (58% In addition, the test results were confirmed by electrification microscope.

Comparative Example 1-2

A good copper plating treatment was performed on a part (10%) of a large number of blind via holes by performing the same treatment as in Example 1 except that the vibration flow generating portion 16 was not operated, but the remainder were treated with a good copper plating film (Such as soot or squeezing occurred), electrification, microscope, and other test results.

Example 2

(The vibrating motor 16d and the plating vessel 12 and the power supply circuit 34 are the same as those in Embodiment 1) described with reference to Figs. 1 to 3, Was used to form a plated conductive film on the inner surface of the through hole. Many through-holes had an asphalt ratio of 10 with an inner diameter of 30 mu m.

As the plating bath 14, the ordinary bath of the copper-

Lactic acid: 200g / L

Lactic acid: 50 g / L

Polisher: applied

Chloride ion: 60 mL / L

Was used.

The vibrating motor 16d of the vibrating flow generating portion 16 was vibrated at 50 Hz to vibrate the vibrating vane 16 in the plating bath 14 at an amplitude of 0.2 mm and a frequency of 700 revolutions per minute. The vibration motor 28 was vibrated at 25 Hz to oscillate the surface-plated article X in the plating bath 14 with an amplitude of 0.15 mm and a frequency of 200 times / minute. Further, the oscillating motor 20 was driven to vibrate the surface-plated article X at a vibration amplitude of 30 mm and a shaking motion of 20 times / minute in the plating bath. The three-dimensional flow velocity in the plating bath at this time was defined as a three-dimensional electrode anemometer ACM300-A, and the result was 399 mm / sec.

By the power supply circuit 34, shown in Figure 8 I1, I2, T1, T2 are respectively ^{I1 = 4 [A / dm 2} ], is ^{I2 = [A / dm 2]} , T1 = 180 [ sec]. T2 = 20 [sec], and the plating current in the rectangular wave state was passed.

After 10 minutes of treatment, a good copper plating film was formed with respect to 99.9% of a large number of through holes, as a result of energization, microscopic examination and other tests.

Comparative Example 2-1:

A good copper plating film was formed over a whole length of a part (50%) of a large number of through holes by performing the same treatment as in Example 2 except that T2 = 0 [second], and a good copper plating film was formed for the remainder The result of the energization, the microscope and other tests proved that it is not.

Comparative Example 2-2:

A good copper plating film was formed on a part (10%) of a large number of through holes by performing the same treatment as in Example 2 except that the vibration flow generating portion 16 was not operated, but a good copper plating film was not formed in the remainder (There was a defect such as soot and burning), energization, microscope and other test results.

Example 3:

(The vibration motor 16d and the plating container 12 and the power supply circuit 34 are the same as those of the first embodiment) and the surface-plated article X is a predetermined , 800 pieces of ceramic chips each having a length of 0.6 mm x 0.3 mm x 0.2 mm were subjected to the pretreatment of the surface of each side of the 0.6 mm x 0.3 mm surface A nickel plating film was formed to form an electrode film.

The plating bath 14 at the time of nickel plating is a plating bath

Lithium Nickel: 270 g / L

Softened nickel: 68 g / L

Boric acid: 40 g / L

Magnesium lactate: 225 g / L

Was used.

The vibrating motor 16d of the vibrating flow generating portion 16 was vibrated at 55 Hz and the vibrating vane 16f was vibrated in the plating bath 14 at an amplitude of 0.2 mm and a frequency of 750 times per minute. Further, the vibration motor 48 was vibrated, and the surface-plated article X was vibrated in the plating bath 14 at 0.12 mm and at a frequency of 250 times / minute. At this time, the three-dimensional flow rate of the plating bath was 210 mm / sec as defined by the three-dimensional electrode anemometer ACM300-A. As the barrel 52, a barrel having a mesh opening rate of 20% was used and the number of barrel revolutions was set to 10 rpm.

Power supply circuit 34, the I1, I2, T1, T2, which, indicated in Figure 8 by each of ^{I1 = 0.4 [A / dm 2} ], I2 = 0.04 [A / dm 2], I2 = 0.04 [A / dm 2 ], T1 = 20 [ch], and T2 = 2 [ch].

When the treatment was performed at 50 占 폚 for 30 minutes, a good nickel plating film with a thickness of about 2 占 퐉 was formed on all the chips as a result of energization, microscope and other inspection.

Comparative Example 3-1:

A good nickel plating film was formed in a part (12%) of the chip, but the remaining nickel plating film was not formed. The results are shown in Table 3 below. Other test results were found.

Comparative Example 3-2:

A good nickel plating film was formed on a part (60%) of a large number of through holes by performing the same treatment as in Example 3 except that the vibration flow generating portion 16 was not operated, but a good nickel plating film was formed for the remainder The results of the energization, the microscope and other tests proved to be unintentional.

Example 4:

Instead of nickel plating, as in the third embodiment. As the plating bath 14, a sulfate bath of acidic zinc plating,

Lactic acid -Suz: 50g / L

Lactic acid: 100 g / L

Cresol Seeds Mixture: 100 g / L

Gelatan: 2 g / L

Naphthalene: 1 g / L

.

The I1, I2, T1, T2 shown in Figure 8 by the power supply circuit (34) I1 = 0.4, respectively ^{[A / dm 2], I2} = 0.04 [A / dm 2], T1 = 20 [A / dm 2] , And T2 = 2 [sec].

After 60 minutes of treatment at 50 占 폚, it was found out that a good sputtered film was formed on all the chips, usually in addition to a microscope.

Comparative Example 4-1:

A good nickel plating film was formed on a part (10%) of the chip by performing the same treatment as in Example 4 except that T2 = 0 [second], and the remaining nickel plating film was not formed, , And the result of examination other than the microscope was proved.

Comparative Example 4-2:

Perform the same processing as in the third embodiment except that the vibration flow generating section 16 is not operated. A good nickel plating film was formed on a part (57%) of a large number of through holes, but the remaining nickel plating film was not formed, which proved to be the result of inspection other than energization and microscopy.

Example 5:

9 to 11 (the vibration motor 16d, the plating 12 and the power supply circuit 34 are the same as those of the first embodiment), and the surface-plated article X , A nickel plating film was formed on the other surface by using 30 pins with an outer diameter of 0.5 mm and a length of 20 mm.

As the plating bath 14 at the time of nickel plating,

Lithium Nickel: 270 g / L

Nickel chloride: 68 g / L

Boric acid: 40 g / L

Magnesium lactate: 225 g / L

Was used.

The vibrating motor 16d of the vibrating flow generating portion 16 was vibrated at 45 Hz and the vibrating vane 16f was vibrated in the plating bath 14 at an amplitude of 0.2 mm and a frequency of 500 times per minute. Further, the vibration motor 48 was vibrated, and the surface-plated article X was vibrated in the plating bath 14 at an amplitude of 0.15 mm and a frequency of 200 times / minute. At this time, the three-dimensional flow velocity of the plating bath was measured by the three-dimensional electrode anemometer ACM300-A to be 200 mm / second. As the barrel 52, a barrel having a mesh opening rate of 20% was used and the number of barrel revolutions was set at 10 rpm.

The I1, I2, T1, T2 shown in Figure 8 by the power supply circuit 34, respectively, ^{I1 = 3 [A / dm 2} ], I2 = 0.3A / dm 2], T1 = 30 [ seconds], T2 = 3 [Sec], the plating current in the rectangular wave state is used.

Let proceed for 20 minutes at 50 ° C. It was found that the nickel plating film having a good film thickness uniformity was formed on the entire pin as a result of inspection other than film thickness measurement, electrification and microscopy.

Comparative Example 5-1:

A good nickel plating film was formed on a part (17%) of the pin by performing the same treatment as in Example 5 except that T2 = 0 [second], but the remaining was not formed with a nickel plating film having good film thickness uniformity Film thickness measurement, electrification, microscope and other inspection results.

Comparative Example 5-2:

The same treatment as in Example 5 was performed except that the vibration flow generating portion 16 was not operated. A good nickel plating film was not formed in a part of the fin, but the other was a nickel plating film with a good film thickness uniformity (Such as occurrence of soot and inconveniences) was found to result from inspection other than film thickness measurement, electrification, and microscopy.

Example 6:

1 to 9 (vibration motor 16d and plating vessel 12 and power supply circuit 34 are the same as in Embodiment 1), the general rule as the surface-plated article X is Approximately 30,000 spheres of 3mmΦ diameter of chloronitrile and butadiene styrene polymer (ABS resin) were subjected to predetermined pretreatment (including degreasing treatment and electrification), and copper plating films were formed on the other surfaces.

As the plating bath 14 for copper plating,

Lactic acid: 200g / L

Lactic acid: 50 g / L

Polisher: applied

Chloride ion: 40 mL / L

Respectively.

The vibrating motor 16d of the vibration generating section 16 was vibrated at 40 Hz and the vibrating vane 16f was vibrated in the plating bath 14 at an amplitude of 0.2 and a frequency of 700 times per minute. Further, the vibration motor 48 was vibrated to vibrate the surface-plated article X in the plating bath 14 at an amplitude of 0.15 mm and a frequency of 250 times / minute. At this time, the three-dimensional flow velocity of the plating bath was measured with a three-dimensional electrode anemometer ACM300-A, which was 210 mm / second. As the barrel 52, a barrel having a mesh opening rate of 20% was used and the number of barrel revolutions was set to 10 rpm.

The I1, I2, T1, T2, which, indicated in Figure 8 by the power supply circuit 34, respectively, ^{I1 = 0.5 [A / dm 2} ], I2 = 0.04 [A / dm 2], T1 = 30 [ seconds], T2 = 3 [sec]. &Lt; tb &gt;&lt; TABLE &gt;

The result of the film thickness measurement, energization, microscope and other inspection results revealed that a copper plating film having a good film thickness uniformity was formed with respect to 99.5% of the spheres after the treatment at 50 캜 for 30 minutes.

Comparative Example 6-1:

Let T2 = 0 [seconds] be the same as in the sixth embodiment. A good nickel plating film was formed on a part of the spheres (40%), but the remaining copper plating films having a good film thickness uniformity were not found to be formed as a result of film thickness measurement, electrification, microscopic examination or the like.

Comparative Example 6-2

A good nickel plating film was formed on a part (50%) of the spheres by performing the same treatment as in Example 6 except that the vibration generating portion 16 was not operated, but the remaining nickel plated layer having a good film thickness uniformity The results of film thickness measurement, energization, microscopy, and other tests revealed that no film was formed.

Example 7:

The apparatus described with reference to Figs. 1 to 3 was used. Here, as the vibration motor 16d, 150 W × 200 V × 3Φ was used, and the plating vessel 12 was used with a capacity of 300 liters. As the power supply circuit 34, Power Master PMDI type manufactured by Central Co., Ltd. was used.

A silicon wafer having a thickness of 40 mm and a thickness of 1 mm, which was subjected to a predetermined pretreatment as a rule for the surface plated article X, was used. A large number of blind via holes each having an inner diameter of 20 mu m and a depth of 70 mu m are formed on the surface of this silicon wafer.

The plating bath 14 is a through-hole bath,

Southeastern: 75g / L

Lactic acid: 190 g / L

Polisher: applied

Chloride ion: 40 mL / L

Respectively.

Further, a ceramic partition tube (outer diameter 75 mm?: Inner diameter 50 mm?: Length 500 mm: base hole diameter 50 to 60 占 퐉: base hole ratio: 33 to 38%) was disposed in the plating vessel 12, .

The vibrating motor 16d of the vibrating flow generating portion 16 was vibrated at 40 Hz to vibrate the vibrating vane 16f in the plating bath 14 at an amplitude of 0.1 mm and at a frequency of 650 revolutions per minute. The surface-plated article X was vibrated in the plating bath 14 at an amplitude of 0.15 mm and a frequency of 200 times / minute by vibrating the vibration motor 28 of 75 W x 200 V x 3Φ at 25 Hz. At this time, the three-dimensional flow rate of the plating bath was 200 mm / sec as defined by a three-wire electric current meter ACM300-A (manufactured by ALEX ELECTRONICS CO., LTD.).

I1 = 1.5 [A / wafer], I2 = 0.1 [A / wafer], T1 = 0.08 [sec], and T2 = 0.02 [sec] in each of I1, I2, ], The plating current in the rectangular wave state was passed.

It was found that copper plating films having a uniform thickness of about 7 탆 were formed on the inner surfaces of all of the blind via holes with 2.5 hours of processing.

Comparative Example 7:

Let T2 = 0 [seconds] be the same as in the seventh embodiment. It was found that the openings of the blind via holes were closed by the plating film as a result of the inspection other than the energization and the microscope.

Example 8:

The vibrating motor 16d of the vibrating flow generating part 16 vibrates the vibrating plume 16f at a frequency of 150 Hz by using a high frequency vibration motor so that the amplitude is 0.2 mm and the frequency is 1200 times / And the treatment time was changed to about 1.5 hours. As a result, it was found that copper plating films having a uniform thickness of about 7 mu m were formed on the inner surfaces of all the blind via holes as a result of inspection other than energization and microscopy.

Example 9:

As the surface-plated article (X), a pokin resin plate was used for the wiring board. A plurality of blind via holes each having an inner diameter of 15 탆 and a depth of 40 탆 are formed on the surface of the epoxy resin plate.

Electroplating treatment to degrease - rinse - etch - rinse - neutralize - rinse - rinse - catarist - rinse - rinse - accelerate - rinse - electroless copper plating to provide conductivity and further rinse - activated - rinse - strike plating. In the electroless copper plating and strike plating, as described with reference to Figs. 1 to 3, the same vibration flow was generated in the plating solution by the vibration flow generating portion.

The electroplating was performed in the same manner as in Example 7. However, the swing motor 20 was driven to swing the surface-plated article X in the plating bath 14 at a swing width of 30 mm and a shaking motion of 20 times / minute. In this case, the three-dimensional flow velocity of the plating bath was measured with a three-dimensional electrode anemometer ACM300-A, which was 200 mm / second.

Power supply circuit 34 by, respectively, I1, I2, T1, T2 shown in Fig. 8 I1 = 4.5 [A / dm 2], I2 = 0.4 [A / dm 2], T1 = 0.08 [ sec], T2 = 0.015 [sec], the plating current in the rectangular wave state was passed.

After 1 hour of treatment, good results were observed in all of the blind via holes.

Comparative Example 8:

Let T2 = 0 [seconds] be the same as in the ninth embodiment. The openings of the blind via holes were closed by the plated film, but the presence of gaps in the corners of the blind via holes proved to be the result of energization, microscopy and other tests.

INDUSTRIAL APPLICABILITY As described above, according to the electroplating method of the present invention, even if the plating film conductive pattern is fine, it is possible to form the plating film with good quality without defects and unevenness in film thickness. In addition, according to the present invention, a plated film of a good quality of a fine conductive pattern can be obtained at high speed. Further, according to the present invention, high efficiency can be obtained with a relatively small apparatus constitution of a plated film of a good quality of a fine conductive pattern.

Claims (11)

A surface plating product disposed in contact with the plating bath while causing vibration flow in the plating bath by vibrating a vibrating vane fixed to one or more stages to a vibration bar vibrating in the plating bath in association with the vibration generating means, A negative electrode and a metal portion arranged to be in contact with the plating bath are used as positive electrodes, and a voltage is applied between the negative electrode and the above-described positive electrode. At this time, a plating current Is in pulse state and continues at a first value &lt; RTI ID = 0.0 &gt; I1 &lt; / RTI &gt; for a first time T1 and a second state in which a second time T2 lasts from a second value I2 of the same polarity as the first value ), Wherein the first value I1 is at least five times the second value I2, and the first time T1 is at least three times the second time T2. 2. The method of claim 1, wherein the first value I1 is 6 to 25 times the second value I2 and the first time T1 is 4 to 25 times the second time T2. Way. The electroplating method according to claim 1 or 2, wherein the first time T1 takes 0.01 seconds to 300 seconds. The electroplating method according to any one of claims 1 to 2, wherein the vibrating vane oscillates finely with an amplitude of 0.05 to 10.0 mm and a frequency of 200 to 1,500 times / min. 5. The electroplating method according to any one of claims 1 to 4, wherein the oscillating flow of the plating bath has a three-dimensional flow velocity of not less than 150 mm / second. The electroplating method according to any one of claims 1 to 5, wherein the vibration generating means oscillates at 10 to 500 Hz. The electroplating method according to any one of claims 1 to 6, wherein the plated article is oscillated at an amplitude of 0.05 to 5.0 mm and a frequency of 100 to 300 times / min. The electroplating method according to any one of claims 1 to 7, wherein the surface-plated article is oscillated at a vibration amplitude of 10 to 100 mm and a frequency of 10 to 30 times / minute. 9. The electroplating method according to any one of claims 1 to 8, wherein the surface-plated article is characterized by a surface plated surface having a fine structure of 50 mu m or less. 10. A method according to any one of claims 1 to 9, characterized in that the various surface-plated articles are subjected to a challenge which has a small hole through which the liquid of the plating bath can pass and which makes contact with the surface- Rotating the plurality of surface-plated articles in the holding vessel by holding the members in a holding vessel and rotating the holding vessel around the rotation center in the non-vertical direction in the plating bath, And returning with a contact with and spacing from the electroplating method. The electroplating method according to claim 10, wherein the width of the surface plated article is 5 mm or less.