CN104060304A - Acid tinning electrolyte - Google Patents
Acid tinning electrolyte Download PDFInfo
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- CN104060304A CN104060304A CN201410265454.1A CN201410265454A CN104060304A CN 104060304 A CN104060304 A CN 104060304A CN 201410265454 A CN201410265454 A CN 201410265454A CN 104060304 A CN104060304 A CN 104060304A
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Abstract
The invention discloses an acid tinning electrolyte. The electrolyte is characterized by comprising the following components in percentage by mass: 20-100g/l of SnSO4, 90-100ml/l of sulfuric acid, 100-120g/l of cresol sulfonic acid C7H6OH.HSO3, 1-1.25g/l of B-naphthol and 2-2.5g/l of gel, wherein the bath temperature is 25 DEG C, the current density is 27-32A/dm<2>, the current efficiency is 100 percent, the area ratio is 1:1, anode tin is adopted, and the bath pressure is 6-12Volt. The acid tinning electrolyte has the beneficial effects that (1) tin is reduced from divalent, and the electricity consumption is saved; (2) the plating bath electroconductibility is high, the bath pressure is low, and the current efficiency is high; (3) the operation temperature is close to room temperature, and heating equipment is not needed; (4) a proper amount of additive is used so as to prepare a bright plating; (5) substrates are slightly damaged.
Description
Technical field
The present invention relates to electrolyte solution field, be specifically related to a kind of acid tin plating electrolyte.
Background technology
Zinc-plated and alloy is a kind of good weldability the coating with certain anti-corrosion capability, widespread use in electronic component, printed circuit board.The preparation of tin layer except the Physicals such as hot dipping, spraying, the methods such as plating, immersion plating and electroless plating because of simple in industrial widespread use.
Immersion plating is workpiece to be immersed to contain want to plate out in the solution of metal-salt, by chemical replacement principle, at workpiece surface, deposits metal plating.These are different from general electroless plating principle, because not containing reductive agent in its plating solution.Also different with contact plating, contact plating is must closely be connected with an active metal when workpiece immersion is wanted to plate out in metal salt solution, this active metal is that anode enters solution ejected electron, and the metal ion that in solution, current potential is higher obtains being deposited on workpiece surface after electronics.Immersion tin is only carried out on iron, copper, aluminium and alloy separately thereof.The reductive agent that copper or nickel self-catalyzed deposition are used all can not be used for reducing tin.The most simply explain it is because overpotential of hydrogen evolution is high on tin surfaces, and above-mentioned reductive agent is evolving hydrogen reaction, so tin ion can not be reduced to tin simple substance.Want chemical plating stannum just must select the strong reductant of another kind of not liberation of hydrogen, as Ti3+, V2+, Cr2+ etc., only have the report with T3+/Ti4+ system.Based on this, now study a kind of acid tin plating electrolyte and improve electrolytic efficiency, save and electroplate current consumption.
Summary of the invention
For the problems referred to above, the invention provides a kind of acid tin plating electrolyte, improve electrolytic efficiency, save and electroplate current consumption.
In order to address the above problem, technical scheme provided by the invention is:
A kind of acid tin plating electrolyte, it is characterized in that: comprise following mass percent component: SnSo420-100g/l, sulfuric acid 90-100ml/l, cresol sulfonic acid C7H6OH.HSO3100-120g/l, B-naphthol 1-1.25g/l, gel 2-2.5g/l, bathes 25 ℃ of temperature, current density 27-32A/dm2, current efficiency 100%, Area Ratio 1:1, anode tin, bathes and presses 6-12Volt.
Preferably, described each mass percent component is: SnSo430-90g/l, sulfuric acid 92-98ml/l, cresol sulfonic acid C7H6OH.HSO3105-115g/l, B-naphthol 1.1-1.15g/l, gel 2.1-2.4g/l, bathes 25 ℃ of temperature, current density 28-31A/dm2, current efficiency 100%, Area Ratio 1:1, anode tin, bathes and presses 8-10Volt.
Preferably, described each mass percent component is: SnSo460g/l, sulfuric acid 95ml/l, cresol sulfonic acid C7H6OH.HSO3110g/l, B-naphthol 1.125g/l, gel 2.25g/l, bathes 25 ℃ of temperature, current density 29.5A/dm2, current efficiency 100%, Area Ratio 1:1, anode tin, bathes and presses 9Volt.
Beneficial effect of the present invention is: (1) tin is to be reduced by divalence, and power consumption is economized; (2) plating bath electroconductibility is high, and bath voltage is low, and current efficiency is high; (3) operation wish temperature approaches room temperature, exempts from heating installation; (4) use suitable additives can obtain gloss coating; (5) less to ground damaging.
Embodiment
Below the present invention will be further described:
Embodiment mono-:
An acid tin plating electrolyte, comprises following mass percent component:
SnSo420g/l, sulfuric acid 90ml/l, cresol sulfonic acid C7H6OH.HSO3100g/l, B-naphthol 1g/l, gel 2g/l, bathes 25 ℃ of temperature, current density 27A/dm2, current efficiency 100%, Area Ratio 1:1, anode tin, bathes and presses 6Volt.
Beneficial effect of the present invention is: (1) tin is to be reduced by divalence, and power consumption is economized; (2) plating bath electroconductibility is high, and bath voltage is low, and current efficiency is high; (3) operation wish temperature approaches room temperature, exempts from heating installation; (4) use suitable additives can obtain gloss coating; (5) less to ground damaging.
Embodiment bis-:
An acid tin plating electrolyte, comprises following mass percent component:
SnSo4100g/l, sulfuric acid 100ml/l, cresol sulfonic acid C7H6OH.HSO3120g/l, B-naphthol 1.25g/l, gel 2.5g/l, bathes 25 ℃ of temperature, current density 32A/dm2, current efficiency 100%, Area Ratio 1:1, anode tin, bathes and presses 12Volt.
Beneficial effect of the present invention is: (1) tin is to be reduced by divalence, and power consumption is economized; (2) plating bath electroconductibility is high, and bath voltage is low, and current efficiency is high; (3) operation wish temperature approaches room temperature, exempts from heating installation; (4) use suitable additives can obtain gloss coating; (5) less to ground damaging.
Embodiment tri-:
An acid tin plating electrolyte, comprises following mass percent component:
SnSo460g/l, sulfuric acid 95ml/l, cresol sulfonic acid C7H6OH.HSO3110g/l, B-naphthol 1.125g/l, gel 2.25g/l, bathes 25 ℃ of temperature, current density 29.5A/dm2, current efficiency 100%, Area Ratio 1:1, anode tin, bathes and presses 9Volt.
Beneficial effect of the present invention is: (1) tin is to be reduced by divalence, and power consumption is economized; (2) plating bath electroconductibility is high, and bath voltage is low, and current efficiency is high; (3) operation wish temperature approaches room temperature, exempts from heating installation; (4) use suitable additives can obtain gloss coating; (5) less to ground damaging.
Embodiment tetra-:
An acid tin plating electrolyte, comprises following mass percent component:
SnSo430g/l, sulfuric acid 92ml/l, cresol sulfonic acid C7H6OH.HSO3105g/l, B-naphthol 1.1g/l, gel 2.1g/l, bathes 25 ℃ of temperature, current density 28A/dm2, current efficiency 100%, Area Ratio 1:1, anode tin, bathes and presses 8Volt.
Beneficial effect of the present invention is: (1) tin is to be reduced by divalence, and power consumption is economized; (2) plating bath electroconductibility is high, and bath voltage is low, and current efficiency is high; (3) operation wish temperature approaches room temperature, exempts from heating installation; (4) use suitable additives can obtain gloss coating; (5) less to ground damaging.
Embodiment five:
An acid tin plating electrolyte, comprises following mass percent component:
SnSo490g/l, sulfuric acid 98ml/l, cresol sulfonic acid C7H6OH.HSO3115g/l, B-naphthol 1.15g/l, gel 2.4g/l, bathes 25 ℃ of temperature, current density 31A/dm2, current efficiency 100%, Area Ratio 1:1, anode tin, bathes and presses 10Volt.
Beneficial effect of the present invention is: (1) tin is to be reduced by divalence, and power consumption is economized; (2) plating bath electroconductibility is high, and bath voltage is low, and current efficiency is high; (3) operation wish temperature approaches room temperature, exempts from heating installation; (4) use suitable additives can obtain gloss coating; (5) less to ground damaging.
More than show and described ultimate principle of the present invention, principal character and advantage of the present invention.The technician of the industry should understand; the present invention is not restricted to the described embodiments; that in above-described embodiment and specification sheets, describes just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.The claimed scope of the present invention is defined by appending claims and equivalent thereof.
Claims (3)
1. an acid tin plating electrolyte, it is characterized in that: comprise following mass percent component: SnSo420-100g/l, sulfuric acid 90-100ml/l, cresol sulfonic acid C7H6OH.HSO3100-120g/l, B-naphthol 1-1.25g/l, gel 2-2.5g/l, bathes 25 ℃ of temperature, current density 27-32A/dm2, current efficiency 100%, Area Ratio 1:1, anode tin, bathes and presses 6-12Volt.
2. acid tin plating electrolyte according to claim 1, it is characterized in that: described each mass percent component is: SnSo430-90g/l, sulfuric acid 92-98ml/l, cresol sulfonic acid C7H6OH.HSO3105-115g/l, B-naphthol 1.1-1.15g/l, gel 2.1-2.4g/l, bathes 25 ℃ of temperature, current density 28-31A/dm2, current efficiency 100%, Area Ratio 1:1, anode tin, bathes and presses 8-10Volt.
3. acid tin plating electrolyte according to claim 1, it is characterized in that: described each mass percent component is: SnSo460g/l, sulfuric acid 95ml/l, cresol sulfonic acid C7H6OH.HSO3110g/l, B-naphthol 1.125g/l, gel 2.25g/l, bathes 25 ℃ of temperature, current density 29.5A/dm2, current efficiency 100%, Area Ratio 1:1, anode tin, bathes and presses 9Volt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410265454.1A CN104060304A (en) | 2014-06-13 | 2014-06-13 | Acid tinning electrolyte |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410265454.1A CN104060304A (en) | 2014-06-13 | 2014-06-13 | Acid tinning electrolyte |
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| Publication Number | Publication Date |
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| CN104060304A true CN104060304A (en) | 2014-09-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410265454.1A Pending CN104060304A (en) | 2014-06-13 | 2014-06-13 | Acid tinning electrolyte |
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2240265A (en) * | 1937-03-30 | 1941-04-29 | John S Nachtman | Method of continuously tin plating ferrous metal stock |
| JPS50109139A (en) * | 1974-02-06 | 1975-08-28 | ||
| JPS57140882A (en) * | 1981-02-24 | 1982-08-31 | Tokyo Mekki:Kk | Bright electroplating method for tin or solder |
| CN87103801A (en) * | 1986-05-22 | 1987-12-09 | 耐用电极株式会社 | Durable electrolytic electrode and manufacture method thereof |
| CN1335419A (en) * | 2000-05-25 | 2002-02-13 | 日本科技股份有限公司 | Electroplating method using with combination of electroplating liquid vibrating flow and pulse type electroplating current |
| CN101358361A (en) * | 2007-08-01 | 2009-02-04 | 太阳化学工业株式会社 | Tin electrolysis applying liquid for electronic unit, applying method and electronic unit |
| CN101962790A (en) * | 2010-08-20 | 2011-02-02 | 河南科技大学 | Electrolyte composition for half bright acid tinning |
| CN103060858A (en) * | 2012-12-12 | 2013-04-24 | 郎溪县金科金属有限公司 | Tin plating electrolyte |
| CN103184493A (en) * | 2011-12-31 | 2013-07-03 | 赵春美 | Tin plating method |
| CN103184484A (en) * | 2011-12-31 | 2013-07-03 | 赵春美 | Tin plating solution |
-
2014
- 2014-06-13 CN CN201410265454.1A patent/CN104060304A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2240265A (en) * | 1937-03-30 | 1941-04-29 | John S Nachtman | Method of continuously tin plating ferrous metal stock |
| JPS50109139A (en) * | 1974-02-06 | 1975-08-28 | ||
| JPS57140882A (en) * | 1981-02-24 | 1982-08-31 | Tokyo Mekki:Kk | Bright electroplating method for tin or solder |
| CN87103801A (en) * | 1986-05-22 | 1987-12-09 | 耐用电极株式会社 | Durable electrolytic electrode and manufacture method thereof |
| CN1335419A (en) * | 2000-05-25 | 2002-02-13 | 日本科技股份有限公司 | Electroplating method using with combination of electroplating liquid vibrating flow and pulse type electroplating current |
| CN101358361A (en) * | 2007-08-01 | 2009-02-04 | 太阳化学工业株式会社 | Tin electrolysis applying liquid for electronic unit, applying method and electronic unit |
| CN101962790A (en) * | 2010-08-20 | 2011-02-02 | 河南科技大学 | Electrolyte composition for half bright acid tinning |
| CN103184493A (en) * | 2011-12-31 | 2013-07-03 | 赵春美 | Tin plating method |
| CN103184484A (en) * | 2011-12-31 | 2013-07-03 | 赵春美 | Tin plating solution |
| CN103060858A (en) * | 2012-12-12 | 2013-04-24 | 郎溪县金科金属有限公司 | Tin plating electrolyte |
Non-Patent Citations (3)
| Title |
|---|
| 双鱼木心: "镀锌", 《百度百科》 * |
| 张胜涛: "《电镀实用技术》", 30 November 2011, 中国纺织出版社 * |
| 黄玉媛等: "《精细化学品实用配方手册》", 31 January 2009, 中国纺织出版社 * |
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Application publication date: 20140924 |