CN114525559A - Plating apparatus and plating method - Google Patents
Plating apparatus and plating method Download PDFInfo
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- CN114525559A CN114525559A CN202011321153.8A CN202011321153A CN114525559A CN 114525559 A CN114525559 A CN 114525559A CN 202011321153 A CN202011321153 A CN 202011321153A CN 114525559 A CN114525559 A CN 114525559A
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- 238000007747 plating Methods 0.000 title claims abstract description 195
- 238000000034 method Methods 0.000 title claims abstract description 80
- 238000009713 electroplating Methods 0.000 claims abstract description 116
- 230000010355 oscillation Effects 0.000 claims abstract description 37
- 229910052751 metal Inorganic materials 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 26
- 239000007788 liquid Substances 0.000 claims description 28
- 230000007246 mechanism Effects 0.000 claims description 23
- 238000005381 potential energy Methods 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 9
- 238000013459 approach Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 8
- 230000006698 induction Effects 0.000 claims description 6
- 239000003792 electrolyte Substances 0.000 claims description 4
- 230000001939 inductive effect Effects 0.000 claims description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 2
- 230000008569 process Effects 0.000 abstract description 25
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 239000000243 solution Substances 0.000 description 98
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 23
- 150000002500 ions Chemical class 0.000 description 19
- 239000001257 hydrogen Substances 0.000 description 11
- 229910052739 hydrogen Inorganic materials 0.000 description 11
- 229910052759 nickel Inorganic materials 0.000 description 11
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 9
- 239000000047 product Substances 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005238 degreasing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 150000002431 hydrogen Chemical class 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 230000010287 polarization Effects 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000012266 salt solution Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 235000015842 Hesperis Nutrition 0.000 description 1
- 235000012633 Iberis amara Nutrition 0.000 description 1
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 235000006694 eating habits Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- -1 nickel salt Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/20—Electroplating using ultrasonics, vibrations
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses an electroplating device and an electroplating method, wherein the electroplating method comprises the following steps: (a) electrically connecting an anode of a plating metal in an electroplating solution to a power supply, and electrically connecting a workpiece in the electroplating solution to a cathode of the power supply; (b) maintaining the electroplating solution in an oscillation state; and (c) forming a plating layer on the surface of the workpiece. The electroplating solution is always in the oscillation state in the electroplating process, which is beneficial to optimizing the performance of the plating layer formed on the workpiece and improving the quality of the plating layer.
Description
Technical Field
The invention relates to the field of electroplating, in particular to an electroplating device and an electroplating method.
Background
The electroplating process is widely applied to various fields, products applying the electroplating process relate to various aspects of people's clothes and eating habits, and the products are as small as one screw and as large as airplanes, rockets and nuclear reactors and are closely related to the electroplating process. Therefore, the electroplating process is important in daily life and industrial production.
Briefly, electroplating refers to the electrolytic reaction in a metal salt solution under the action of direct current to deposit a metal or alloy layer on the surface of an electrical conductor, such as a metal. The electroplating increases the appearance gloss of the product, for example, common faucets in life usually form a copper plating layer, a nickel plating layer and the like on the surface of the faucet through electroplating, and also form a part of ornaments, namely a gold plating layer and a silver plating layer by utilizing an electroplating process, so that the product is attractive. In addition, the electroplating improves the corrosion resistance of the product and prolongs the service life of the product, for example, the iron plate is easy to oxidize and rust after being exposed in the air for a long time, and the iron plate has better corrosion resistance after being formed with a zinc coating and a nickel coating by an electroplating process. In addition, the electroplating can also repair damaged parts and form coatings with special performance, such as a reflective silver coating, a conductive silver coating, an anti-reflection black nickel coating and the like. In conclusion, the electroplating process greatly improves the functionality, decorativeness and protection of the product.
In the following description, the specific electroplating process is described by taking electroplated nickel coating as an example, a metal nickel plate is electrically connected to an anode of a power supply, and an electrically conductive workpiece is electrically connected to a cathode of the power supply, wherein the metal nickel plate and the workpiece are immersed in an electroplating solution (e.g., a solution of metal nickel salt), under the action of direct current, the negative and positive ions in the electroplating solution are regularly moved, the workpiece at the cathode gradually deposits a layer of metal nickel, and the metal nickel plate at the anode is continuously dissolved to supplement the nickel ions consumed in the electroplating solution. In this manner, the metallic nickel attached to the anode is gradually transferred to the surface of the workpiece.
In the existing electroplating process, the electroplating solution is always in a static state, the movement speed of ions in the solution is slow, and after a period of time, the ions in the electroplating solution are not uniformly dispersed, so that the concentration of the solution is easy to have a large concentration difference, and the electroplating efficiency and the current efficiency are low. In addition, hydrogen gas is often generated during the electroplating process, the performance of the plating layer is reduced due to hydrogen contained in the plating layer, and the released hydrogen easily causes spots and stripes on the surface of the plating layer to affect the quality of the plating layer.
Disclosure of Invention
An object of the present invention is to provide an electroplating apparatus and an electroplating method, in which an electroplating solution is always in an oscillating state during electroplating, which is advantageous for optimizing the performance of a plating layer formed on a workpiece and improving the quality of the plating layer.
Another object of the present invention is to provide an electroplating apparatus and an electroplating method, wherein in the electroplating method, the electroplating solution is kept in the oscillation state during the electroplating process by means of ultrasonic oscillation of the electroplating solution, which is beneficial to accelerate the movement of ions in the electroplating solution, reduce the concentration gradient of the solution, reduce the polarization of the solution, accelerate the electrode process, and improve the current efficiency and the electroplating efficiency.
It is another object of the present invention to provide a plating apparatus and a plating method in which the plating solution is oscillated by using an ultrasonic generator to generate ultrasonic waves to accelerate the movement of ions.
Another object of the present invention is to provide an electroplating apparatus and an electroplating method, wherein in the electroplating method, the cavitation of the ultrasonic wave is utilized to make hydrogen enter cavitation bubbles or serve as cavitation nuclei to accelerate the evolution of hydrogen, and the generated hydrogen is prevented from influencing the performance and the appearance of the coating.
It is another object of the present invention to provide a plating apparatus and a plating method in which the ultrasonic generator oscillates the plating solution in a direction parallel to the workpiece to accelerate the movement of ions in the plating solution.
Another object of the present invention is to provide a plating apparatus and a plating method in which the plating solution is oscillated by the ultrasonic generator in a direction perpendicular to the workpiece to accelerate the movement of ions in the plating solution.
It is another object of the present invention to provide a plating apparatus and a plating method in which the ultrasonic generator oscillates the plating solution in a direction parallel to the workpiece and a direction perpendicular to the workpiece so that the plating solution is agitated by oscillation, increasing the oscillation amplitude of the plating solution, and greatly increasing the movement speed of ions in the solution.
Another object of the present invention is to provide a plating apparatus and a plating method in which the power of the ultrasonic wave generating means is between 700w and 1200w and ultrasonic waves of 20KHz to 800KHz are generated to maximize current efficiency and plating efficiency at the time of plating.
Another object of the present invention is to provide a plating apparatus and a plating method, in which the plating solution is maintained in the oscillation state during plating by means of movement of a cathode, so as to accelerate movement of ions in the plating solution, thereby improving current efficiency and plating efficiency during plating.
Another object of the present invention is to provide a plating apparatus and a plating method in which the cathode is vibrated in a direction parallel to the workpiece to accelerate the movement of ions in the plating solution.
It is another object of the present invention to provide a plating apparatus and a plating method in which the cathode is vibrated in a direction perpendicular to the workpiece to accelerate the movement of ions in the plating liquid.
It is another object of the present invention to provide a plating apparatus and a plating method in which the cathode is vibrated in a direction parallel to the work and a direction perpendicular to the work to cause the plating solution to be agitated in oscillation, increasing the oscillation amplitude of the plating solution, thereby greatly improving the plating efficiency.
It is another object of the present invention to provide a plating apparatus and a plating method in which the vibration frequency of the cathode is maintained at 5Hz to 20Hz and the vibration amplitude of the cathode is maintained at 1mm to 5mm to maximize the current efficiency and plating efficiency at the time of plating.
According to one aspect of the present invention, there is further provided an electroplating method comprising the steps of:
(a) electrically connecting an anode of a plating metal in an electroplating solution to a power supply, and electrically connecting a workpiece in the electroplating solution to a cathode of the power supply;
(b) maintaining the electroplating solution in an oscillation state; and
(c) and forming a plating layer on the surface of the workpiece.
According to one embodiment of the present invention, in the step (b), an ultrasonic wave is generated toward the plating liquid, and the plating liquid is vibrated by the ultrasonic wave so as to be in the oscillation state.
According to one embodiment of the present invention, the ultrasonic wave vibrates the plating liquid in a direction parallel to the workpiece.
According to an embodiment of the present invention, the ultrasonic waves vibrate the plating liquid in a direction perpendicular to the workpiece.
According to one embodiment of the present invention, the ultrasonic waves vibrate the plating liquid simultaneously in a direction parallel to the workpiece and in a direction perpendicular to the workpiece.
According to an embodiment of the present invention, in the step (b), the operating power of the ultrasonic generator generating the ultrasonic wave is set to be 700W-1200W, and the ultrasonic wave of 20KHz-800KHz is generated.
According to one embodiment of the present invention, in the step (b), the plating solution is maintained in the oscillation state by means of cathode movement.
According to one embodiment of the present invention, in the step (b), the plating solution is maintained in the oscillation state by means of cathode movement.
According to an embodiment of the present invention, in the above step, the vibration frequency of the cathode is maintained at 5Hz to 20Hz, and the vibration amplitude of the cathode is maintained at 1mm to 5 mm.
According to an embodiment of the present invention, in the above step, the vibration frequency of the cathode is maintained at 5Hz to 20Hz, and the vibration amplitude of the cathode is maintained at 1mm to 5 mm.
According to an embodiment of the present invention, in the above step, a movable rod is driven to rotate around a support base, and the workpiece connected to one end of the movable rod is driven to move in the plating solution.
According to an embodiment of the present invention, in the above step, a movable rod is driven to rotate around a support base, and the workpiece connected to one end of the movable rod is driven to move in the plating solution.
According to an embodiment of the invention, in the above step, an inductance coil is energized at intervals, and the inductance coil attracts the movable rod at intervals and drives the movable rod to rotate around the support seat.
According to an embodiment of the present invention, in the above step, an inductance coil is energized at intervals, and the inductance coil attracts the movable rod at intervals and drives the movable rod to rotate around the supporting seat.
According to an embodiment of the present invention, in the above step, when the inductor is powered on, the inductor and the movable rod approach each other and press an elastic element, and after the inductor is powered off, the attraction force of the inductor to the movable rod disappears, and the elastic element releases elastic potential energy to drive the movable rod to rotate back and forth around the support seat.
According to an embodiment of the present invention, in the above step, when the inductor is powered on, the inductor and the movable rod approach each other and press an elastic element, and after the inductor is powered off, the attraction force of the inductor to the movable rod disappears, and the elastic element releases elastic potential energy to drive the movable rod to rotate back and forth around the support seat.
According to an embodiment of the present invention, in the above step, a movable rod is driven to slide relative to the support base, and the workpiece connected to one end of the movable rod is driven to move in the plating solution.
According to an embodiment of the present invention, in the above step, a movable rod is driven to slide relative to the support base, and the workpiece connected to one end of the movable rod is driven to move in the plating solution.
According to another aspect of the present invention, there is provided an electroplating apparatus adapted to electroplate a plating layer on a workpiece placed in an electroplating solution after being connected to a power supply, the electroplating apparatus comprising:
the accommodating device is provided with an accommodating groove for accommodating the electroplating solution;
an anode connection member, wherein said anode connection member is conductively electrically connected to the anode of said power supply;
a cathode connection member, wherein said cathode connection member is conductively electrically connected to the cathode of said power source for electrically connecting to said workpiece; and
a cathode drive mechanism, wherein said cathode drive mechanism is connected to said cathode connection member, wherein said cathode drive mechanism drives said workpiece connected to said cathode connection member to move in said plating solution and to cause said plating solution to be maintained in an oscillating state.
According to one embodiment of the invention, the frequency of the movement of the workpiece in the plating bath is maintained at 5Hz to 20Hz and the amplitude of the vibration is maintained at 1mm to 5 mm.
According to an embodiment of the present invention, the plating apparatus further comprises an ultrasonic generator, wherein the ultrasonic generator generates an ultrasonic wave toward the plating liquid, the ultrasonic wave vibrating the electrolyte so that the electrolyte is maintained in the oscillation state.
According to one embodiment of the invention, the working frequency of the ultrasonic generator is 700w to 1200w, and the ultrasonic wave of 20KHz to 800KHz is generated.
According to an embodiment of the present invention, the cathode driving mechanism includes a movable support, an inductance coil, and a cathode clamp, wherein the movable support includes a movable rod and a supporting base, the movable rod is movably disposed on the supporting base, one end of the cathode clamp is fixed to the movable rod, the other end of the cathode clamp is connected to the cathode connecting member, and the inductance coil can drive the movable rod to move, so as to drive the workpiece to move in the electroplating solution.
According to an embodiment of the invention, the cathode drive mechanism further comprises an elastic element, wherein the elastic element is held between the inductor coil and the movable rod.
According to an embodiment of the invention, the movable rod is rotatably mounted to the support base and forms a lever structure, and the inductance coil drives the movable rod to rotate around the support base.
According to an embodiment of the invention, the movable rod is slidably mounted to the support base, and the inductance coil drives the movable rod to slide along the support base.
Drawings
FIG. 1 is a schematic diagram of a plating apparatus according to a preferred embodiment of the invention.
FIGS. 2A and 2B are schematic views showing an application of an ultrasonic generator to the plating apparatus according to the above preferred embodiment of the present invention.
FIGS. 3A and 3B are schematic diagrams illustrating the application of a cathode driving mechanism of the electroplating apparatus according to the above preferred embodiment of the present invention.
FIG. 4A is a schematic diagram of a process of an electroplating method according to another preferred embodiment of the present invention.
FIG. 4B is a schematic view of another process of the electroplating method according to the above preferred embodiment of the present invention.
FIG. 4C is a schematic view of another process of the electroplating method according to the above preferred embodiment of the present invention.
FIG. 4D is a schematic view of another process of the electroplating method according to the above preferred embodiment of the present invention.
FIG. 4E is a schematic view of another process of the electroplating method according to the above preferred embodiment of the present invention.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be constructed and operated in a particular orientation and thus are not to be considered limiting.
It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.
Referring to FIG. 1, an electroplating apparatus 100 according to a preferred embodiment of the present invention will be described in the following description, wherein the electroplating apparatus 100 comprises a container 10, an anode connector 20, and a cathode connector 30, wherein the container 10 has a container 101 for containing a plating solution 300. One end of the anode connection member 20 is conductively connected to an anode of a power supply 500, and the other end of the anode connection member 20 is connected to a plated metal. One end of the cathode connecting member 30 is conductively connected to the cathode of the power supply, and the other end of the cathode connecting member 30 is connected to a workpiece 200. After the plating metal and the workpiece 200 are immersed in the plating solution 300, under the action of the direct current, the positive and negative ions in the plating solution 300 move regularly, and the plating metal connected to the positive electrode is gradually transferred to the surface of the workpiece 200, thereby forming a plating layer 400 on the surface of the workpiece 200.
In this particular embodiment of the electroplating apparatus 100 of the present invention, the electroplating solution 300 is always in an oscillating state during the electroplating process, thereby increasing the movement of ions in the electroplating solution 300, reducing the concentration gradient of the electroplating solution 300, decreasing the polarization of the electroplating solution 300, and further increasing the current efficiency and the electroplating efficiency.
It should be noted that the embodiments of the plating metal, the plating solution, and the workpiece are not limited, the plating metal may be implemented as a metal such as nickel, silver, copper, gold, chromium, etc., the plating solution 300 may be implemented as a corresponding metal salt solution, and the workpiece 200 may be implemented as a metal product such as iron, copper, silver, etc. The nickel plating, silver plating, copper plating, and the like of the workpiece 200 can be plated by the plating apparatus 100.
In a specific embodiment of the present invention, the electroplating apparatus 100 further comprises an ultrasonic wave generating device 40, wherein the ultrasonic wave generating device 40 comprises an ultrasonic wave generator 41 and a supporting device 42, wherein the ultrasonic wave generating device 41 is mounted on the supporting device 42. The ultrasonic wave generator 40 generates an ultrasonic wave toward the housing tank 101 of the housing device 10, and the ultrasonic wave makes the plating solution 300 in the oscillation state, so that the movement of ions in the plating solution 300 is accelerated, the concentration gradient of the plating solution 300 is reduced, the deposition rate is accelerated, and the quality of the plating layer 400 is also improved. In addition, the ultrasonic wave can also expand the current density range, so that the current efficiency and the electroplating efficiency are improved, and the cavitation action of the ultrasonic wave is utilized to enable hydrogen to enter cavitation bubbles or serve as cavitation nuclei so as to accelerate the separation of the hydrogen, so that the performance and the attractiveness of the plating layer 400 are prevented from being influenced by the generated hydrogen.
It should be noted that the specific installation position of the ultrasonic generator 40 is not limited, for example, but not limited to, the ultrasonic generator 40 is installed at the bottom, the side wall or above the container 10. Alternatively, the ultrasonic wave generating device 40 is held in the housing groove 101 of the housing device 10. Alternatively, the ultrasonic wave generating device 40 is held at a side of the housing device 10 at intervals.
Preferably, the ultrasonic wave generated by the ultrasonic generator 41 of the ultrasonic wave generating device 40 oscillates the plating liquid 300 in a direction parallel to the workpiece 200. Preferably, the ultrasonic waves generated by the ultrasonic generator 41 vibrate the plating liquid 300 in a direction perpendicular to the workpiece 200. More preferably, the ultrasonic wave generated by the ultrasonic wave generator 41 simultaneously vibrates the plating liquid 300 in the direction perpendicular to the workpiece 200 and the direction parallel to the workpiece 200, so that the plating liquid 300 is agitated in the oscillation state.
In this particular embodiment of the plating apparatus 100 according to the present invention, the operating power of the ultrasonic generator 41 is set to 700W to 1200W and the ultrasonic wave of 20KHz to 800KHz is generated, so that the plating efficiency and the current efficiency are maximized, and the plating layer 400 formed after plating using the ultrasonic wave in this wavelength band has better performance.
In an embodiment of the invention, the resistor apparatus 100 further comprises at least one cathode driving mechanism 50, wherein the cathode driving mechanism 50 is connected to the cathode connecting member 30, and the cathode driving mechanism 50 can drive the workpiece 200 to move back and forth in the electroplating solution, so as to stir the electroplating solution 300, so that the electroplating solution 300 is in the oscillation state. That is, the resistance device 100 agitates the plating solution 300 by means of cathodic movement.
Specifically, the cathode driving mechanism 50 includes a movable bracket 51, an inductor 52 and a cathode holder 53, wherein the movable bracket 51 includes a supporting base 511 and a movable rod 512, and the movable rod 512 is movably disposed on the supporting base 511. One end of the cathode clamp 53 is fixed to the movable rod 512, the other end of the cathode clamp 53 is connected to the cathode connecting member 30 or the workpiece 200, and the inductance coil 52 can drive the movable rod 512 to move, so as to drive the cathode connecting member 30 and the workpiece 200 to move in the electroplating solution 300, so that the electroplating solution 300 is kept in the oscillation state.
In a specific example of the present invention, the movable rod 512 is rotatably mounted to the supporting base 511, and forms a lever structure. The inductor coil 52 is operatively held at one end of the movable rod 512, the cathode holder 53 is disposed at the other end of the movable rod 512, and the support base 511 is disposed close to the inductor coil 52, and the movable rod 512 is obliquely disposed at the movable rod 512 with its end away from the inductor coil 52. The cathode holder 53 is connected to the cathode connection member 30. The inductor 52 and the support base 511 are located on the same side of the movable rod 512, and the inductor 52 can drive the movable rod 512 to rotate relative to the support base 511, so as to drive the cathode clamp 53, the cathode connector 30 and the workpiece 200 to move in the electroplating solution 300, and stir the electroplating solution 300, so that the electroplating solution 300 is in the vibration state.
Further, a magnetic conductive surface 5121 is disposed at an end of the movable rod 512, the magnetic conductive surface 5121 corresponds to the inductor coil 52, the inductor coil 52 generates a magnetic field after being energized, the magnetic conductive surface 5121 of the movable rod 512 and the inductor coil 52 attract each other, one end of the movable rod 512 rotates around the support seat 511 in a manner that the magnetic conductive surface 5121 is close to the inductor coil 52, and the other end of the movable rod 512 drives the cathode clamp 53, the cathode connector 30 and the workpiece 200 to move in the electroplating solution 300. When the inductor 52 is powered off, the attractive force between the inductor 52 and the movable rod 512 disappears, one end of the movable rod 512 rotates around the support base 511 in a manner that the magnetic conductive surface 512 is away from the inductor 52, and the other end of the movable rod 512 drives the cathode clamp 53, the cathode connector 30 and the workpiece 200 to move in opposite directions in the electroplating solution 300. Thus, the plating liquid 300 is kept in the oscillation state during the plating process.
Preferably, the end of the movable rod 512 is covered with a metal sheet, and the metal sheet forms the magnetic conductive surface 5121. Preferably, a magnet is disposed at an end of the movable rod 512, and the magnet forms the magnetic conductive surface. Preferably, the magnetic conductive surface 5121 is disposed downward, and the inductor coil 53 is located below the movable rod 512. Preferably, the magnetic conductive surface 5121 is disposed upward, and the inductor coil 53 is located above the movable rod 512. Optionally, the magnetic conductive surface 5121 is disposed at a side portion, and the inductor coil 53 is located at a side of the movable rod 512.
The cathode drive mechanism 50 further includes a resilient member 54, wherein the resilient member 54 is held between the inductor 52 and the movable rod 512. Specifically, both ends of the elastic element 53 are connected to the inductor 52 and the movable rod 512, respectively, and when the inductor 52 is energized and the inductor 52 and the movable rod 512 attract and approach each other, the elastic element 54 is pressed, and the elastic element 54 accumulates elastic potential energy. When the inductor 52 is powered off, the attraction force between the inductor 52 and the movable rod 512 disappears, the elastic element 54 releases the elastic potential energy, and under the inertia effect, the movable rod 512 rotates around the support seat 511 back and forth clockwise and counterclockwise, so that the cathode clamp 52 connected to the movable rod 512, the cathode connecting member 30 and the workpiece 200 vibrate in the electroplating solution 300, and the electroplating solution 300 is stirred. By energizing the induction coil 52 at intervals, it is possible to realize cathode vibration, on the one hand, to keep the plating solution 300 constantly in the oscillation state, and on the other hand, to vibrate the work 200 in the oscillation state under the drive of the cathode drive mechanism 50, and to vibrate out bubbles in the plating layer 400 formed on the surface of the work 200, and to make the plating layer 400 tighter, thereby improving the quality of the plating layer 400 formed on the surface of the work 200. The elastic element 54 may be embodied as, but not limited to, a spring, a lead spring, or the like.
Preferably, the cathode connection member 30 and the workpiece 200 are driven in a movement parallel to the extension of the workpiece 200. For example, the extending direction of the workpiece 200 immersed in the plating solution is perpendicular to the horizontal direction, the movable rod 512 is laterally held at one side of the cathode connecting member 30, the direction of the attraction force of the movable rod 512 and the energized induction coil 52 is perpendicular to the horizontal direction, the workpiece 200 and the cathode connecting member 30 are driven to move in the extending direction parallel to the workpiece 200 by the induction coil 52, and the workpiece 200 and the cathode connecting member 30 move up and down to keep the plating solution 300 in the oscillation state.
Preferably, the cathode connection member 30 and the workpiece 200 are drivingly moved in a direction perpendicular to the extension direction of the workpiece 200. For example, the extending direction of the workpiece 200 immersed in the plating solution 300 is perpendicular to the horizontal direction, the movable rod 512 is longitudinally held at one side of the cathode connection member 30, the direction of the attraction force of the movable rod 512 and the energized induction coil 52 is parallel to the horizontal direction, the workpiece 200 and the cathode connection member 30 are driven to move in the direction perpendicular to the extending direction of the workpiece 200 by the induction coil 52, and the workpiece 200 and the cathode connection member 30 move left and right to keep the plating solution 300 in the oscillation state.
More preferably, the cathode connecting member 30 and the workpiece 200 are driven to move along the extending direction parallel to the workpiece 200 and the extending direction perpendicular to the workpiece 200, so as to further accelerate the movement of ions in the electroplating solution 300 and reduce the concentration gradient in the electroplating solution 300, thereby being beneficial to improving the current efficiency and the electroplating efficiency. For example, the cathode driving mechanisms 20 may be implemented in two, wherein one of the cathode driving mechanisms 20 drives the cathode connecting member 30 and the workpiece 200 to move in a direction parallel to the extending direction of the workpiece 200, and the other cathode driving mechanism 20 drives the cathode connecting member 30 and the workpiece 200 to move in a direction perpendicular to the extending direction of the workpiece 200.
In a specific example of the present invention, the movable rod 512 of the movable bracket 51 of the cathode mover 50 is slidably disposed at the support base 511, the inductor coil 52 is held at one side of an end portion of the movable rod 512, and the magnetic conductive surface 5121 of the movable rod 512 is disposed at a side portion of the movable rod 5121. When the inductor coil 52 is energized, a magnetic attraction force is generated on the movable rod 512, so that the movable rod 512 slides along the support seat 511, the movable rod 512 approaches the inductor coil 52, the movable rod 512 and the inductor coil press the elastic element 54, and the elastic element 54 accumulates elastic potential energy. When the inductor 52 is powered off, the elastic force between the inductor 52 and the movable rod 512 disappears, and the elastic element 54 releases the elastic potential energy and allows the movable rod 512 to slide along the support 511. In this way, the movable rod 512 slides back and forth along the support base 511 by energizing the inductance coil 52 at intervals, the cathode clamp 53 disposed on the movable rod 512 drives the cathode connection member 30 and the workpiece 200 to vibrate in the plating solution 300, and the plating solution 300 can be maintained in the oscillation state all the time.
It should be noted that the manner of driving the cathode to move is merely exemplary and should not be construed as limiting the scope and content of the electroplating apparatus 100 of the present invention. In another specific example of the present invention, the cathode driving mechanism 50 is implemented as an inductive vibrator, and the cathode connecting member 30 and the workpiece 200 are driven to move in the plating solution 300 by the cathode driving mechanism 50. Preferably, the vibration frequency of the cathode connection member 30 and the work piece 200 is maintained at 5Hz to 20Hz, and the vibration amplitude of the cathode connection member 30 and the work piece 200 is maintained at 1mm to 5mm, so as to maximize current efficiency and plating efficiency at the time of plating. It should be understood by those skilled in the art that the vibration amplitudes shown in the figures are for illustration purposes only and are not intended to limit the scope and content of the electroplating apparatus 100 and the electroplating method thereof of the present invention.
In accordance with another aspect of the present invention, an electroplating method according to a preferred embodiment of the present invention by which the quality of the plated layer 400 formed on the workpiece 200 can be optimized will be described in the following description. Specifically, the electroplating method comprises the following steps:
(a) electrically connecting the plating metal in the plating solution 300 and the work 200 to the anode and the cathode of the power supply 500, respectively;
(b) maintaining the plating liquid 300 in the oscillation state; and
(c) the plating layer 400 is formed on the surface of the work piece 200.
That is, in the step (a), the plating metal in the plating solution 300 is electrically connected to the anode of the power supply 500, and the work 200 in the plating solution 300 is electrically connected to the cathode of the power supply 500.
It is noted that the step (b) may be performed before the step (a) so as to firstly maintain the plating solution 300 in the oscillation state and secondly electrically connect the plating metal in the plating solution 300 and the workpiece 200 to the anode and the cathode of the power supply 500, respectively.
In the electroplating method, the electroplating solution 300 is always kept in the oscillation state, so that the movement of ions in the electroplating solution is accelerated, the concentration gradient of the solution is reduced, the polarization of the solution is reduced, the electrode process is accelerated, and the current efficiency and the electroplating efficiency are improved.
In one specific example of the present invention, in the step (b), an ultrasonic wave is continuously generated toward the plating liquid 300, and the ultrasonic wave vibrates the plating liquid 300 and shakes the plating liquid 300, thereby bringing the plating liquid 300 into the oscillation state. On one hand, the ultrasonic vibration can accelerate the movement speed of ions in the electroplating solution 300, and on the other hand, the cavitation of the ultrasonic wave is utilized to enable hydrogen to enter cavitation bubbles or serve as cavitation nuclei to accelerate the separation of the hydrogen, so that the performance and the attractiveness of the plating layer 400 are prevented from being influenced by the generated hydrogen.
Preferably, the ultrasonic waves vibrate the plating liquid 300 in a direction parallel to the workpiece 200. Preferably, the ultrasonic waves vibrate the plating solution 300 in a direction perpendicular to the workpiece 200. More preferably, the ultrasonic waves vibrate the plating liquid 300 simultaneously in a direction parallel to the workpiece 200 and in a direction perpendicular to the workpiece 200.
In this particular embodiment of the present invention, the power of the ultrasonic generator 42 generating the ultrasonic wave is maintained between 700w to 1200w, and the ultrasonic wave of 20KHz to 800KHz is generated, so as to maximize the current efficiency and the plating efficiency at the time of plating.
Further, in the step (b), the plating liquid 300 is maintained in the oscillation state by means of cathode movement.
In an embodiment of the present invention, in the above method, the movable rod 512 is driven to rotate around the supporting seat 511, and the workpiece 200 connected to one end of the movable rod 512 is driven to move in the plating solution 300, so that the plating solution 300 is maintained in the oscillation state.
Specifically, in the above method, the inductor 52 is energized at intervals, and the inductor 52 attracts the end of the movable rod 512 at intervals to drive the movable rod 512 to rotate around the support base 511.
Preferably, when the inductor 52 is energized, the inductor 52 and the movable rod 512 approach each other and press the elastic element 54, and after the attraction force of the inductor 52 to the movable rod 512 is removed, the elastic element 54 releases the elastic potential energy to drive the movable rod 512 to rotate back and forth around the support seat 511.
In one embodiment of the present invention, in the above method, the movable rod 512 slides relative to the support seat 511, and drives the workpiece 200 connected to one end of the movable rod 512 to move in the electroplating solution 300, so that the electroplating solution 300 is maintained in the oscillation state.
Specifically, in the above method, the inductor 52 is energized at intervals, and the inductor 52 attracts the end of the movable rod 512 at intervals to drive the movable rod 512 to slide along the support base 511.
Preferably, when the inductor 52 is energized, the inductor 52 and the movable rod 512 approach each other and press an elastic element 54, and after the attraction force of the inductor 52 to the movable rod 512 is removed, the elastic element 54 releases the elastic potential energy to drive the movable rod 512 to move back and forth along the support seat 511.
In another embodiment of the present invention, in the above method, the workpiece 200 is driven to vibrate by an inductive vibrator during the electroplating process, and the electroplating solution 300 is kept in the oscillation state all the time.
Preferably, in the plating method, the vibration frequency of the cathode is maintained at 5Hz to 20Hz, and the vibration amplitude of the cathode is maintained at 1mm to 5mm, so as to maximize current efficiency and plating efficiency at the time of plating.
Referring to fig. 4A to 4E, a process of an electroplating process according to an embodiment of the present invention is illustrated. Specifically, referring to fig. 4A, the workpiece 200 is degreased. For example, the impurity oil stain and the like on the surface and in the hole of the workpiece 200 can be removed by using organic solvent degreasing, chemical degreasing, electrochemical degreasing and the like. Referring to fig. 4B, the workpiece 200 is washed with water, and the residual chemical liquid on the surface and in the hole of the workpiece 200 is cleaned. Referring to fig. 4C, the workpiece 200 is activated, for example, the workpiece 200 is immersed in a sulfuric acid solution, to remove the micro-etching on the surface of the workpiece 200 and the oxide film on the surface, so as to enhance the bonding capability of the cathode driving mechanism and the workpiece 200 in the subsequent electroplating process. Referring to fig. 4D, the workpiece 200 is again subjected to a water washing process. In fig. 4E, the workpiece 200 is immersed in the plating solution 300 after being electrically connected to the cathode of the power supply 500. Under the action of the direct current, the positive and negative ions in the plating solution 300 move regularly, a layer of metallic nickel is gradually deposited on the workpiece 200 at the cathode, and the plating metal at the anode is continuously dissolved to replenish the ions consumed in the plating solution 300. In this manner, the plating metal connected to the anode is gradually transferred to the surface of the work 200.
It will be appreciated by persons skilled in the art that the above embodiments are only examples, wherein features of different embodiments may be combined with each other to obtain embodiments which are easily conceivable in accordance with the disclosure of the invention, but which are not explicitly indicated in the drawings.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the present invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.
Claims (26)
1. An electroplating method, characterized in that the electroplating method comprises the following steps:
(a) electrically connecting an anode of a plating metal in an electroplating solution to a power supply, and electrically connecting a workpiece in the electroplating solution to a cathode of the power supply;
(b) maintaining the electroplating solution in an oscillation state; and
(c) and forming a plating layer on the surface of the workpiece.
2. The plating method as recited in claim 1, wherein in said step (b), an ultrasonic wave is generated toward said plating liquid, and said plating liquid is brought into said oscillation state by vibrating said plating liquid with said ultrasonic wave.
3. The plating method as recited in claim 2, wherein said ultrasonic wave vibrates said plating liquid in a direction parallel to said work.
4. The plating method as recited in claim 2, wherein said ultrasonic wave vibrates said plating liquid in a direction perpendicular to said work.
5. The plating method as recited in claim 2, wherein said ultrasonic wave simultaneously vibrates said plating liquid in a direction parallel to said work and a direction perpendicular to said work.
6. The plating method according to any one of claims 2 to 5, wherein in said step (b), an operating power of said ultrasonic generator for generating said ultrasonic wave is set to be 700W to 1200W, and said ultrasonic wave of 20KHz to 800KHz is generated.
7. The plating method according to any one of claims 1 to 5, wherein in said step (b), said plating solution is maintained in said oscillation state by means of cathode movement.
8. The plating method as recited in claim 6, wherein in said step (b), said plating solution is maintained in said oscillation state by means of cathode movement.
9. The plating method according to claim 7, wherein in the above step, the vibration frequency of the cathode is kept at 5Hz to 20Hz, and the vibration amplitude of the cathode is kept at 1mm to 5 mm.
10. The plating method according to claim 8, wherein in the above step, the vibration frequency of the cathode is kept at 5Hz to 20Hz, and the vibration amplitude of the cathode is kept at 1mm to 5 mm.
11. A plating method according to claim 9, wherein in said step, a movable rod is driven to rotate about a support base, and the work attached to one end of said movable rod is moved in the plating solution.
12. A plating method according to claim 10, wherein in said step, a movable rod is driven to rotate about a support base, and the work attached to one end of said movable rod is moved in the plating solution.
13. The plating method according to claim 11, wherein in said step, an inductor is energized at intervals, and said inductor attracts said movable rod at intervals and drives said movable rod to rotate around said supporting base.
14. The plating method according to claim 12, wherein in said step, an inductor is energized at intervals, and said inductor attracts said movable rod at intervals and drives said movable rod to rotate around said supporting base.
15. The plating method as recited in claim 13, wherein in the above step, when the inductor is energized, the inductor and the movable rod approach each other and press a resilient member, and when the inductor is de-energized, the attraction force of the inductor to the movable rod disappears, and the resilient member releases the elastic potential energy to drive the movable rod to rotate back and forth around the supporting seat.
16. The plating method as recited in claim 14, wherein in the above step, when the inductor is energized, the inductor and the movable rod approach each other and press a resilient member, and when the inductor is de-energized, the attraction force of the inductor to the movable rod disappears, and the resilient member releases the elastic potential energy to drive the movable rod to rotate back and forth around the supporting seat.
17. A plating method according to claim 9, wherein in said step, a movable rod is driven to slide relative to said support base, and said workpiece attached to one end of said movable rod is driven to move in said plating solution.
18. A plating method according to claim 10, wherein in said step, a movable rod is driven to slide relative to said support base, and said workpiece attached to one end of said movable rod is driven to move in said plating solution.
19. An electroplating apparatus adapted to electroplate a coating on a workpiece disposed in an electroplating solution after being connected to a power source, the electroplating apparatus comprising:
the accommodating device is provided with an accommodating groove for accommodating the electroplating solution;
an anode connection member, wherein said anode connection member is conductively electrically connected to the anode of said power supply;
a cathode connection member, wherein said cathode connection member is conductively electrically connected to the cathode of said power source for electrically connecting to said workpiece; and
a cathode drive mechanism, wherein said cathode drive mechanism is connected to said cathode connection member, wherein said cathode drive mechanism drives said workpiece connected to said cathode connection member to move in said plating solution and to cause said plating solution to be maintained in an oscillating state.
20. The plating apparatus as recited in claim 19, wherein a frequency of movement of said workpiece in said plating solution is maintained at 5Hz to 20Hz, and an amplitude of vibration is maintained at 1mm to 5 mm.
21. The plating apparatus as recited in claim 20, further comprising an ultrasonic generator, wherein said ultrasonic generator generates an ultrasonic wave toward said plating liquid, said ultrasonic wave vibrating said electrolyte so that said electrolyte is maintained in said oscillation state.
22. The plating apparatus as recited in claim 21, wherein said ultrasonic generator has an operating frequency of 700w to 1200w and generates 20KHz to 800KHz ultrasonic waves.
23. The electroplating apparatus as claimed in any one of claims 19 to 22, wherein the cathode driving mechanism comprises a movable support, an inductor coil and a cathode holder, wherein the movable support comprises a movable rod and a supporting base, wherein the movable rod is movably disposed on the supporting base, one end of the cathode holder is fixed to the movable rod, the other end of the cathode holder is connected to the cathode connecting member, and the inductor coil can drive the movable rod to move, so as to drive the workpiece to move in the electroplating solution.
24. A plating apparatus according to claim 23, wherein said cathode drive mechanism further comprises an elastic member, wherein said elastic member is held between said inductance coil and said movable rod.
25. A plating apparatus according to claim 24, wherein said movable bar is rotatably mounted to said support base and forms a lever structure, and said induction coil drives said movable bar to rotate about said support base.
26. The electroplating apparatus of claim 24 wherein the movable rod is slidably mounted to the support pedestal, the inductive coil driving the movable rod to slide along the support pedestal.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117265608A (en) * | 2023-09-27 | 2023-12-22 | 安徽华晟新能源科技有限公司 | Electroplating method and electroplating device |
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| JPS6393871A (en) * | 1986-10-06 | 1988-04-25 | Inoue Japax Res Inc | Plating device |
| CN101328600A (en) * | 2008-07-08 | 2008-12-24 | 河南科技大学 | Electroforming composite processing apparatus and electroforming tank used by the apparatus |
| CN201224773Y (en) * | 2008-07-08 | 2009-04-22 | 河南科技大学 | Electroforming composite processing equipment |
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