CN114964573A - Pressure sensor and manufacturing method thereof - Google Patents
Pressure sensor and manufacturing method thereof Download PDFInfo
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- CN114964573A CN114964573A CN202210534951.1A CN202210534951A CN114964573A CN 114964573 A CN114964573 A CN 114964573A CN 202210534951 A CN202210534951 A CN 202210534951A CN 114964573 A CN114964573 A CN 114964573A
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- sacrificial
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- sensitive layer
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0001—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means
- G01L9/0002—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using variations in ohmic resistance
Abstract
The application discloses pressure sensor and a manufacturing method thereof, wherein the method comprises the following steps: providing a sacrificial framework and a mixed slurry; the sacrificial framework has a negative Poisson ratio structure, and the mixed slurry comprises matrix resin and conductive filler which are uniformly mixed; coating the mixed slurry on at least part of the surface of the sacrificial skeleton, and curing the mixed slurry; removing the sacrificial skeleton to obtain a high-molecular sensitive layer with a negative Poisson structure; and respectively arranging electrode layers on two opposite sides of the high-molecular sensitive layer to obtain the pressure sensor. Through the mode, the negative Poisson ratio structure of the high-molecular sensitive layer can be designed, and the pressure sensor with large volume change, high sensitivity and stable sensing performance is obtained.
Description
Technical Field
The present disclosure relates to the field of sensors, and in particular, to a method for manufacturing a pressure sensor and a pressure sensor.
Background
At present, quite extensive research is carried out on porous material pressure sensors based on volume compression to change resistance or capacitance, and most of the pressure sensors utilize a foam porous structure to reduce the modulus of a conductive polymer composite material so as to improve the sensitivity of the sensor.
However, the porous material mostly has a positive poisson's ratio, that is, when the porous material is longitudinally compressed, the transverse area is increased, so that the volume change of the porous material and the change of the concentration of the internal conductive filler are reduced, and the change of the internal resistance is reduced, so that the sensitivity of the sensor is limited.
Unlike positive poisson's ratio materials, negative poisson's ratio materials also decrease in lateral area when compressed longitudinally, and have a greater volume change relative to positive poisson's ratio materials, which makes them of great interest in the field of strain sensors. At present, the negative poisson ratio material can be prepared by using a foaming technology, but the secondary processing of the positive poisson ratio foaming material is generally adopted, and the steps are various. In addition, the shape, size, position, uniformity and the like of the foam holes are difficult to control accurately, an expected negative Poisson's ratio structure cannot be obtained, so that the performance difference of the structure, sensitivity, sensing range and the like among different products is increased, and the sensing performance is unstable.
Disclosure of Invention
The technical problem mainly solved by the application is to provide a pressure sensor and a manufacturing method thereof, which can design a negative poisson ratio structure of a high-molecular sensitive layer and obtain the pressure sensor with large volume change, high sensitivity and stable sensing performance.
In order to solve the technical problem, the application adopts a technical scheme that: provided is a method for manufacturing a pressure sensor, comprising the following steps: providing a sacrificial framework and a mixed slurry; the sacrificial skeleton has a negative Poisson ratio structure, and the mixed slurry comprises uniformly mixed matrix resin and conductive filler; coating the mixed slurry on at least part of the surface of the sacrificial skeleton and curing the mixed slurry; removing the sacrificial skeleton to obtain a high-molecular sensitive layer with a negative Poisson structure; and respectively arranging electrode layers on two opposite sides of the high-molecular sensitive layer to obtain the pressure sensor.
Wherein the step of coating the mixed slurry on at least a part of the surface of the sacrificial skeleton comprises: and coating the mixed slurry on the whole surface of the sacrificial skeleton.
Further, the step of removing the sacrificial skeleton may be preceded by: and removing the partially cured mixed slurry on the outer surface of the sacrificial skeleton.
And removing the partially cured mixed slurry on the outer surface of the sacrificial skeleton by polishing and laser etching.
Wherein the material of the sacrificial skeleton comprises at least one of a metal material, an inorganic non-metal material and an organic material; and/or the unit body structure of the negative Poisson ratio structure comprises at least one of a polygon and a circle.
Wherein the matrix resin comprises polyurethane; and/or the conductive filler comprises any one or more of a conductive carbon material, a conductive high polymer material and a metal material; and/or the conductive filler accounts for 0.1-10% of the mass fraction of the matrix resin.
Wherein the method for coating the mixed slurry on at least part of the surface of the sacrificial skeleton comprises a spraying method, a soaking method or a smearing method.
Wherein a thermal catalyst is included in the mixed slurry, and the step of curing the mixed slurry comprises: allowing the temperature of the mixed slurry to exceed a preset temperature to solidify the mixed slurry; or, the mixed slurry contains a photocatalyst, and the step of curing the mixed slurry comprises: and irradiating the mixed slurry by using light with a preset wavelength to cure the mixed slurry.
The step of removing the sacrificial skeleton comprises the step of immersing the sacrificial skeleton covered with the mixed slurry into corrosive liquid, wherein the corrosive liquid corrodes the sacrificial skeleton; further, the etching solution comprises at least one of hydrochloric acid, sulfuric acid, nitric acid and hydrogen peroxide.
The step of respectively arranging electrode layers on the two sides of the polymer sensitive layer which are arranged back to back comprises the following steps of: determining the direction with the largest deformation amount in the macromolecule sensitive layer; further, electrode layers are arranged on two opposite sides of the polymer sensitive layer with the largest deformation direction.
In order to solve the above technical problem, another technical solution adopted by the present application is: the pressure sensor is manufactured by the manufacturing method of any one of the above embodiments.
Different from the prior art, the beneficial effects of the application are that: the application provides a manufacturing method of a pressure sensor, which comprises the following steps: providing a sacrificial framework and a mixed slurry; the sacrificial framework has a negative Poisson ratio structure, and the mixed slurry comprises uniformly mixed matrix resin and conductive filler; coating the mixed slurry on at least part of the surface of the sacrificial skeleton, and curing the mixed slurry; removing the sacrificial framework to obtain a polymer sensitive layer with a negative Poisson structure; and respectively arranging electrode layers on two opposite sides of the high-molecular sensitive layer to obtain the pressure sensor. By the technical scheme, the expected pressure sensor with the negative poisson ratio high-molecular sensitive layer can be obtained by designing the negative poisson ratio mechanism of the sacrificial framework; compared with a common positive Poisson ratio structure pressure sensor, the volume change amount is large, the resistance change value is large, the sensitivity is high, and the sensing performance is stable.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:
FIG. 1 is a schematic flow chart diagram illustrating one embodiment of a method for fabricating a pressure sensor according to the present disclosure;
FIG. 2 is a schematic cross-sectional view of one embodiment of the sacrificial skeleton in step S101;
FIG. 3 is a schematic perspective view of one embodiment of the sacrificial skeleton in step S101;
fig. 4 is a schematic structural diagram of an embodiment of the pressure sensor according to the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, fig. 1 is a schematic flow chart illustrating a method for manufacturing a pressure sensor according to an embodiment of the present disclosure. The manufacturing method of the pressure sensor comprises the following steps:
s101: providing a sacrificial framework and a mixed slurry; the sacrificial framework has a negative Poisson ratio structure, and the mixed slurry comprises uniformly mixed matrix resin and conductive filler.
Specifically, the material of the sacrificial skeleton may be at least one of a metal material, an inorganic non-metal material, and an organic material, for example, the material of the sacrificial skeleton may be iron, copper, aluminum, calcium carbonate, polysiloxane, polyester, polyamide, and the like, and the surface of the sacrificial skeleton is smooth and has no substantial defect. The unit body structure of the sacrificial skeleton negative Poisson ratio structure can be one of a polygon and a circle and a combination thereof. Optionally, as shown in fig. 2, fig. 2 is a schematic cross-sectional view of an embodiment of the sacrificial skeleton in step S101. The unit body structure of the negative poisson's ratio framework of the sacrificial skeleton can be an inwards concave hexagon, and the size of the inwards concave hexagon can be as follows: the sides of the non-fovea are 0.1cm to 10cm (e.g., 0.9cm) on a side, the minimum distance between the sides of the non-fovea is 0.1cm to 10cm (e.g., 1.35cm), and the sides of the non-fovea are symmetrical about a line connecting intersection a and intersection B of adjacent sides of the fovea, and the linear distance between point a and point B is 0.1cm to 10cm (e.g., 0.6 cm). Alternatively, the sacrificial skeleton has a wall thickness of 0.1-2cm (e.g., 0.1cm, 0.2cm, 0.5cm, 1cm, 1.5cm, 2cm, etc.). Alternatively, the step of providing the sacrificial skeleton may be: and forming the sacrificial skeleton by using the technologies of casting, injection molding, 3D printing and the like.
Further, the matrix resin in the above-mentioned mixed slurry may be an uncured polyurethane, and the curing degree of the polyurethane is represented by a free isocyanate group content, for example, the free isocyanate group content of the uncured polyurethane is 5% or more (e.g., 5%, 8%, 10%, etc.). The conductive filler may be at least one of a conductive carbon material, a conductive polymer material, and a metal material (e.g., one of carbon nanotube, carbon fiber, carbon black, carbon fiber, polyacetylene, polyphenylene sulfide, polyaniline, and silver, and a combination thereof). In one embodiment, the conductive filler may be carbon nanotubes, and optionally, the size of the carbon nanotubes may be: a diameter of 5-20nm (e.g., 5nm, 10nm, 15nm, 20nm, etc.) and a length of 10-20 μm (e.g., 10 μm, 12 μm, 15 μm, 18 μm, 20 μm, etc.); and the mass fraction of the carbon nanotubes in the polyurethane may be 0.1% to 10% (e.g., 1%, 3%, 5%, 8%, 10%, etc.). In another embodiment, the conductive filler may be a mixture of carbon black and silver powder, and optionally, the mass ratio of the carbon black to the silver powder may be: 10:1 to 1:10 (e.g., 10:1, 5:1, 2:1, 1:2, 5:1, 10:1, etc.); the size of the carbon black may be: particle size of 10-500nm (e.g., 10nm, 100nm, 200nm, 500nm, etc.); the size of the silver powder may be: 10-800nm (e.g., 10nm, 100nm, 200nm, 500nm, 800nm, etc.); and the mixture of carbon black and silver powder may account for 0.1% to 10% (e.g., 1%, 3%, 5%, 8%, 10%, etc.) by mass of the polyurethane. The viscosity of the mixed slurry can be 100-100000cps, and the mixed slurry has better fluidity and adhesiveness with a sacrificial framework. In addition, the mixed slurry may further include other functional aids, for example, catalysts, reinforcing agents, plasticizers, modifiers, stabilizers, surfactants, dispersants, and the like. Optionally, the step of providing a mixed slurry comprises: weighing a certain proportion of matrix resin and conductive filler, and stirring for a preset time by using a magnetic stirring or mechanical stirring mode to form mixed slurry.
S102: and coating the mixed slurry on at least part of the surface of the sacrificial skeleton, and curing the mixed slurry.
Specifically, in one embodiment, the step of coating the mixed slurry on at least a part of the surface of the sacrificial skeleton in the step S102 and curing the mixed slurry includes: the mixed slurry is coated on the entire surface of the sacrificial skeleton, and the mixed slurry is cured. For example, the sacrificial skeleton may be completely soaked in the mixed slurry and ultrasonic waves may be applied to quickly and uniformly coat the surface of the sacrificial skeleton, including all surfaces in contact with the external air. Optionally, the soaking time may be 20-120min (e.g., 20min, 30min, 60min, 90min, 120min, etc.); the ultrasonic vibration frequency may be 20 to 40kHZ (for example, 20kHZ, 25kHZ, 30kHZ, 35kHZ, 40kHZ, etc.). Further, the sacrificial skeleton after being soaked in the mixed slurry is taken out, transferred to a heating bin and heated and cured, so that the matrix resin in the mixed slurry is cured.
In an application scenario, the mixed slurry provided in step S101 contains a thermal catalyst, and the thermal catalyst can quickly solidify and shape the mixed slurry under the action of heating temperature, so as to reduce loss caused by the flow of the mixed slurry; alternatively, the preset heating temperature may be 100 to 200 ℃ (e.g., 100 ℃, 120 ℃, 150 ℃, 180 ℃, 200 ℃, etc.), and the heating time may be 30 to 120min (e.g., 30min, 60min, 90min, 120min, etc.).
In another application scenario, the mixed slurry provided in step S101 contains a photocatalyst, an ultraviolet irradiation lamp is disposed in the heating chamber, and the photocatalyst can rapidly cure and mold the mixed slurry under the action of ultraviolet rays; alternatively, the ultraviolet irradiation time may be 30min to 120min (e.g., 30min, 60min, 90min, 120min, etc.), and the preset wavelength may be 200 and 400nm (e.g., 200nm, 300nm, 400nm, etc.). Alternatively, the thickness of the cured hybrid paste at the surface of the sacrificial skeleton may be 0.1mm to 10mm (e.g., 0.1mm, 0.5mm, 1mm, 2mm, etc.). In addition, the mixed slurry is formed on the surface of the sacrificial skeleton by using a dipping method, and in other embodiments, the mixed slurry may be formed on the surface of the sacrificial skeleton by using a spraying method or a painting method, which is not limited in the present application.
In another embodiment, the step of coating the mixed slurry on at least a part of the surface of the sacrificial skeleton and curing the mixed slurry in step S102 includes: coating the mixed slurry on part of the surface of the sacrificial skeleton, and curing the mixed slurry; for example, the sacrificial skeleton has a direction of maximum deformation, and the partial surface of the sacrificial skeleton may include all surfaces located in the direction of maximum deformation thereof. The mixed slurry may be formed on a part of the surface of the sacrificial skeleton by means of local spraying or local painting, which is not limited in this application.
S103: and removing the sacrificial skeleton to obtain the polymer sensitive layer with the negative Poisson structure.
Specifically, in one embodiment, when all surfaces of the sacrificial skeleton are covered with the mixed slurry in step S102, the step S103 described above includes, before: and removing the partially cured mixed slurry on the outer surface of the sacrificial skeleton. Referring to fig. 3, fig. 3 is a perspective view of an embodiment of the sacrificial skeleton in step S101. In an application scenario, the cured object is taken out from the heating chamber, and the cured mixed slurry on the surface a shown in fig. 3 is ground by a grinding wheel until the sacrificial skeleton on the surface a is completely exposed. Optionally, the sacrificial skeleton has a direction of maximum deformation, and the a-plane is a side perpendicular to the direction of maximum deformation. In addition, the partially cured mixed slurry on the outer surface of the sacrificial skeleton can be removed by adopting a laser etching mode and the like.
In another embodiment, the specific implementation process of step S103 may be: the treated material after step S102 is immersed in an etching solution having a concentration of 3 to 10% (e.g., 3%, 5%, 8%, 10%, etc.), and ultrasonic waves are applied thereto, optionally, the ultrasonic wave vibration frequency may be 20 to 40kHZ (e.g., 20kHZ, 25kHZ, 30kHZ, 35kHZ, 40kHZ, etc.), thereby accelerating the diffusion of the etching solution from the surface of the sacrificial skeleton to the inside, and simultaneously accelerating the diffusion of the sacrificial skeleton, which is dissolved by the etching solution, into the etching solution, thereby improving the etching efficiency. The corrosive liquid can react with the sacrificial skeleton chemically without causing substantial damage to the polymer sensitive layer. For example, the corrosive solution may be a hydrochloric acid solution, which may chemically react with the sacrificial skeleton to generate chloride; for another example, the etching solution may be a sulfuric acid solution and an aqueous solution of hydrogen peroxide, optionally, the mass ratio of sulfuric acid to hydrogen peroxide is 1: 1-10: 1 (e.g., 1:1, 2:1, 5:1, 10:1, etc.), an aqueous solution of sulfuric acid and hydrogen peroxide chemically reacts with the sacrificial framework to form sulfuric acid compounds and oxides; for another example, the etching solution may be a nitric acid solution, and the nitric acid solution may chemically react with the sacrificial framework to generate a nitric acid compound. And after the corrosion is completed, taking out the obtained high polymer sensitive layer, cleaning and drying for later use. Alternatively, the cleaning may be performed by using an ultrasonic water bath, the cleaning time may be 10min to 60min (e.g., 10min, 30min, 60min, etc.), and the ultrasonic vibration frequency may be 20 to 40kHZ (e.g., 20kHZ, 25kHZ, 30kHZ, 35kHZ, 40kHZ, etc.); the drying can be heating chamber drying, drying temperature is 70-150 deg.C (e.g., 70 deg.C, 80 deg.C, 90 deg.C, 100 deg.C, 120 deg.C, etc.), and drying time can be 10min-120min (e.g., 10min, 30min, 60min, etc.).
S104: and respectively arranging electrode layers on two opposite sides of the high-molecular sensitive layer to obtain the pressure sensor.
Specifically, in an embodiment, a pressure sensor is provided, and referring to fig. 4, fig. 4 is a schematic structural diagram of an embodiment of the pressure sensor of the present application. The pressure sensor may comprise a polymer sensitive layer 11, a first electrode layer 21 and a second electrode layer 22. The unit body structure of the negative poisson's ratio structure of the high-molecular sensitive layer can be a concave hexagonal structure in fig. 2. The direction of the maximum deformation amount in the polymer sensitive layer 11 is the direction shown by the arrow in fig. 4, and when the polymer sensitive layer 11 is compressed in the direction of the maximum deformation amount, the polymer sensitive layer is also compressed in the direction perpendicular to the direction of the maximum deformation amount, so that the concentration of the conductive filler in the polymer sensitive layer is remarkably changed, and the sensitivity is high; the first electrode layer 21 and the second electrode layer 22 are disposed on opposite sides having the direction of the greatest amount of deformation. The material of the first electrode layer 21 and the second electrode layer 22 may be a flexible conductive material, such as a polyurethane film uniformly mixed with silver powder. The first electrode layer 21 and the second electrode layer 22 may be bonded to the polymer sensitive layer 11 by conductive adhesive bonding or tin bonding. Wires can be connected to the surfaces of the first electrode layer 21 and the second electrode layer 22, which are not in contact with the polymer sensitive layer, and the surfaces are electrically connected to an electrical property testing device, so that the change of the electrical property (e.g., resistance) of the pressure sensor caused by the deformation of the polymer sensitive layer can be obtained and analyzed.
According to the invention, the mixed slurry of the matrix resin and the conductive filler is coated on the sacrificial framework for curing, then the sacrificial framework is removed to prepare the high-molecular sensitive layer, and the high-molecular sensitive layer is combined with the electrode layer to prepare the pressure sensor, so that the preparation method is simple and convenient to operate, the prepared pressure sensor with the Poisson ratio structure can generate larger deformation under the action of small stress, and the sensitivity is obviously improved; meanwhile, based on the design of the sacrificial framework, the structure of the sensor is easy to control stably, the sensing stability is high, the application range is wide, for example, the sensor can be applied to the field of semiconductors, the pressure sensor is combined with a component which is easy to deform, such as a semiconductor packaging substrate, the warping degree of the substrate in the semiconductor packaging process is measured, and therefore the quality of a product is controlled, and the packaging process is adjusted.
The above embodiments are merely examples and are not intended to limit the scope of the present disclosure, and all modifications, equivalents, and flow charts using the contents of the specification and drawings of the present disclosure or those directly or indirectly applied to other related technical fields are intended to be included in the scope of the present disclosure.
Claims (10)
1. A method of making a pressure sensor, comprising:
providing a sacrificial framework and a mixed slurry; the sacrificial skeleton has a negative Poisson ratio structure, and the mixed slurry comprises uniformly mixed matrix resin and conductive filler;
coating the mixed slurry on at least part of the surface of the sacrificial skeleton and curing the mixed slurry;
removing the sacrificial skeleton to obtain a high-molecular sensitive layer with a negative Poisson structure;
and respectively arranging electrode layers on two opposite sides of the high-molecular sensitive layer to obtain the pressure sensor.
2. The method of manufacturing according to claim 1,
the step of coating the mixed slurry on at least part of the surface of the sacrificial skeleton comprises the following steps: coating the mixed slurry on the whole surface of the sacrificial skeleton;
the step of removing the sacrificial skeleton comprises: and removing the partially cured mixed slurry on the outer surface of the sacrificial skeleton.
3. The method according to claim 2, wherein the removing the partially cured mixed slurry from the outer surface of the sacrificial skeleton comprises grinding and laser etching.
4. The manufacturing method according to claim 1, wherein the material of the sacrificial skeleton comprises at least one of a metal material, an inorganic non-metal material, and an organic material; and/or the unit body structure of the negative Poisson ratio structure comprises at least one of a polygon and a circle.
5. The method of manufacturing according to claim 1,
the matrix resin comprises polyurethane; and/or the conductive filler comprises at least one of a conductive carbon material, a conductive high polymer material and a metal material; and/or the conductive filler accounts for 0.1-10% of the mass fraction of the matrix resin.
6. The method for manufacturing the sacrificial skeleton according to claim 1, wherein the method for coating the mixed slurry on at least a part of the surface of the sacrificial skeleton comprises a spraying method, a soaking method or a smearing method.
7. The method of manufacturing according to claim 1,
the mixed slurry includes a thermal catalyst therein, and the step of curing the mixed slurry includes: allowing the temperature of the mixed slurry to exceed a preset temperature to solidify the mixed slurry;
or, the mixed slurry contains a photocatalyst, and the step of curing the mixed slurry comprises: and irradiating the mixed slurry by using light with a preset wavelength to cure the mixed slurry.
8. The method of manufacturing according to claim 1,
the step of removing the sacrificial skeleton comprises: immersing the sacrificial framework covered with the mixed slurry into a corrosive liquid, wherein the corrosive liquid corrodes the sacrificial framework; wherein, the corrosive liquid comprises at least one of hydrochloric acid, sulfuric acid, nitric acid and hydrogen peroxide.
9. The method according to claim 1, wherein the step of respectively disposing electrode layers on opposite sides of the polymer sensitive layer comprises:
determining the direction with the largest deformation amount in the macromolecule sensitive layer;
and arranging electrode layers on two opposite sides of the polymer sensitive layer with the largest deformation direction.
10. A pressure sensor manufactured by the manufacturing method of any one of claims 1 to 9.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20180073943A1 (en) * | 2015-05-04 | 2018-03-15 | The Florida State University Research Foundation, Inc. | Negative poisson ratio piezoresistive sensor and method of manufacture |
| CN111289158A (en) * | 2018-12-07 | 2020-06-16 | 深圳大学 | Flexible pressure sensor and flexible pressure sensing array |
| CN113218543A (en) * | 2021-05-07 | 2021-08-06 | 中国科学院苏州纳米技术与纳米仿生研究所 | Flexible pressure sensor, dielectric layer thereof and preparation method of dielectric layer |
| CN114076564A (en) * | 2020-08-20 | 2022-02-22 | 广州市香港科大霍英东研究院 | Strain sensor array based on negative Poisson ratio structure and preparation method and application thereof |
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2022
- 2022-05-17 CN CN202210534951.1A patent/CN114964573A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180073943A1 (en) * | 2015-05-04 | 2018-03-15 | The Florida State University Research Foundation, Inc. | Negative poisson ratio piezoresistive sensor and method of manufacture |
| CN111289158A (en) * | 2018-12-07 | 2020-06-16 | 深圳大学 | Flexible pressure sensor and flexible pressure sensing array |
| CN114076564A (en) * | 2020-08-20 | 2022-02-22 | 广州市香港科大霍英东研究院 | Strain sensor array based on negative Poisson ratio structure and preparation method and application thereof |
| CN113218543A (en) * | 2021-05-07 | 2021-08-06 | 中国科学院苏州纳米技术与纳米仿生研究所 | Flexible pressure sensor, dielectric layer thereof and preparation method of dielectric layer |
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