CN108630638A - Power device heat dissipating method and power device - Google Patents
Power device heat dissipating method and power device Download PDFInfo
- Publication number
- CN108630638A CN108630638A CN201810276961.3A CN201810276961A CN108630638A CN 108630638 A CN108630638 A CN 108630638A CN 201810276961 A CN201810276961 A CN 201810276961A CN 108630638 A CN108630638 A CN 108630638A
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- CN
- China
- Prior art keywords
- power device
- shell
- nano carbon
- radiator
- carbon microsphere
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
Abstract
The present invention provides a kind of power device heat dissipating method and power devices, using the grapheme material of implantation nano carbon microsphere on power device shell, and/or the substrate of the grapheme material of implantation nano carbon microsphere are used between the shell and radiator of power device.Pass through graphene and nano carbon microsphere composite construction heat dissipation vehicle in the present invention, simultaneously using conducting and radiation two ways reduces shell to environment and shell to the thermal resistance between radiator, the final knot that reduces arrives environment thermal resistance, effectively control junction temperature, the risk of power device high temperature damage is reduced, ensures that power device is reliablely and stablely run.
Description
Technical field
The present invention relates to power tube technical field of heat dissipation, and in particular, to power device heat dissipating method and power device.
Background technology
Power tube is the device that damage is most susceptible in circuit, the major part of damage the reason is that due to pipe practical consumption
Scattered power has been more than rating number.The size of power device dissipated power depends on tube interior junction temperature Tj, when the value of Tj is more than
After permissible value, electric current will increased dramatically and burn power device.The power of power device consumption is bigger, and junction temperature is higher.Ensure
Junction temperature, which is no more than permissible value, must just distribute the heat of generation, and the radiating condition the good then to correspond to what identical junction temperature allowed
Pipe consumption is bigger, and output is also bigger.Therefore, the heat dissipation problem of power tube is vital.
As shown in Figure 1 and Figure 2, equivalent circuit diagram when sinking path and the heat dissipation of power tube is set forth in figure.From
Tube core (J-Junction) is to mainly there is two sinking paths between environment (A-Ambient)：
1) tube core is to shell (C-Case), by shell directly to function of environment heat emission；
2) by radiator S (there is interface in centre, including insulating cell) to function of environment heat emission.
The heat dispersal situations of different material itself are different, and the thermal resistance of shell, radiator etc. is also different, by Fig. 2
Equivalent circuit simulate two kinds of above-mentioned heat dispersal situations.The thermal energy Pc distributed in Fig. 2 is expressed as the form of electric current, the both ends Pc
Temperature is respectively junction temperature Tj and environment temperature Ta；Rjc indicate knot to shell thermal resistance, Rca indicate shell to environment thermal resistance,
Rcs indicates shell to the thermal resistance of radiator, the thermal resistance of Rsa expression radiators to environment.Reducing Rcs and Rsa can effectively enhance
Power device radiates, and in time by tube core heat derives, reduces tube core junction temperature.
Invention content
For the defects in the prior art, the object of the present invention is to provide a kind of power device heat dissipating method and power devices
Part.
According to power device heat dissipating method provided by the invention, include the following steps：
The grapheme material of nano carbon microsphere is implanted on power device shell, and/or
The substrate of the grapheme material of implantation nano carbon microsphere is used between the shell and radiator of power device.
Preferably, by increasing graphene on power device shell and/or between the shell and radiator of power device
It is specifically reduced by the way of the graphene film of implantation nano carbon microsphere outer with the heat dissipation vehicle of nano carbon microsphere composite construction
Shell is to environment and/or shell to the thermal resistance between radiator.
According to power device provided by the invention, radiated using any of the above-described kind of radiating mode.
Compared with prior art, the present invention has following advantageous effect：
1, power device heat dissipating method provided by the invention is by graphene and nano carbon microsphere composite construction heat dissipation vehicle, together
When using conducting and radiation two ways reduces shell to environment and shell to the thermal resistance between radiator, the final knot that reduces is to ring
Border thermal resistance effectively controls junction temperature, reduces the risk of power device high temperature damage, ensures the reliable and stable operation of system.
2, the present invention can exclude the heat that power device generates in time, so that it is operated in lower temperature, it is maintained to fix resistance
Anti- and higher power supply conversion efficiency.
3, to avoid power device because of high temperature avalanche breakdown can occur for the method in the present invention, extend element service life.
4, the method in the present invention can in time be discharged power device thermal energy, enable product in the environment of large temperature range
In operated, effectively increase the reliability of power device.
5, present invention can apply to various power device package forms, while reducing power device shell and environment and shell
Thermal resistance between radiator, it is applied widely, it is simple in structure.
Description of the drawings
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, other feature of the invention,
Objects and advantages will become more apparent upon：
Fig. 1 is the structural schematic diagram of power device；
Fig. 2 is equivalent thermal resistance schematic diagram of the power device knot in Fig. 1 to environment；
Fig. 3 is conventional power devices heat dissipation schematic diagram；
Fig. 4 is the power device heat dissipation schematic diagram in the present invention；
In figure：
1- environment；
2- shells；
3- tube cores；
The interfaces 4-；
5- radiators；
6- conventional insulator substrates；
7- pins；
8- leads；
9- slicken solders；
The graphite film of 10- nano carbon microspheres.
Specific implementation mode
With reference to specific embodiment, the present invention is described in detail.Following embodiment will be helpful to the technology of this field
Personnel further understand the present invention, but the invention is not limited in any way.It should be pointed out that the ordinary skill of this field
For personnel, without departing from the inventive concept of the premise, several changes and improvements can also be made.These belong to the present invention
Protection domain.
According to power device heat dissipating method provided by the invention, include the following steps：
The grapheme material of nano carbon microsphere is implanted on power device shell, and/or
The substrate of the grapheme material of implantation nano carbon microsphere is used between the shell and radiator of power device.
By increasing graphene and nano-sized carbon on power device shell and/or between the shell and radiator of power device
The heat dissipation vehicle of ball composite construction specifically reduces shell to environment by the way of the graphene film of implantation nano carbon microsphere,
And/or shell is to the thermal resistance between radiator.
The present invention also provides a kind of power devices, are radiated using any of the above-described kind of radiating mode.
More detailed description is done to the technical solution in the present invention below in conjunction with the accompanying drawings.
Fig. 3 is conventional power devices radiating mode, and conventional power devices encapsulate between plastic shell and environment mainly by right
It is wandering, between device outer case and radiator isolation voltage is padded using conventional insulator.
Fig. 4 is New Type Power Devices heat dissipation design of the present invention.Increase implantation nano carbon microsphere between device outer case and environment
Grapheme material, in addition to reinforcing heat loss through conduction, the carbon ball between graphene crystal structure grid can make the heat on shell logical
The mode of overshoot distributes, and effectively reduces power device plastic package envelope to environment thermal resistance, improves the heat dissipation of power device front
Ability.It is also padded, is utilized instead of conventional insulator using the grapheme material of implantation nano carbon microsphere between device outer case and radiator
The heat gathered on shell is quickly transmitted on radiator by grapheme material high thermal conductivity coefficient；Other than conduction pattern, may be used also
The heat that shell gathers is dispersed into environment by radiation mode.
By graphene and nano carbon microsphere composite construction heat dissipation vehicle in the present invention, while using two kinds of sides of conduction and radiation
Formula reduces shell to environment and shell to the thermal resistance between radiator, and final reduction, which is tied, arrives environment thermal resistance, effectively controls junction temperature, drops
The risk of low power devices high temperature damage, ensures the reliable and stable operation of system.
Specific embodiments of the present invention are described above.It is to be appreciated that the invention is not limited in above-mentioned
Particular implementation, those skilled in the art can make a variety of changes or change within the scope of the claims, this not shadow
Ring the substantive content of the present invention.In the absence of conflict, the feature in embodiments herein and embodiment can arbitrary phase
Mutually combination.
Claims (3)
1. a kind of power device heat dissipating method, which is characterized in that include the following steps：
Using the grapheme material of implantation nano carbon microsphere on power device shell, and/or
The substrate of the grapheme material of implantation nano carbon microsphere is used between the shell and radiator of power device.
2. power device heat dissipating method according to claim 1, which is characterized in that by power device shell and/
Or the heat dissipation vehicle of increase graphene and nano carbon microsphere composite construction is specifically adopted between the shell and radiator of power device
Shell is reduced to environment and/or shell to the thermal resistance between radiator with the mode of the graphene film of implantation nano carbon microsphere.
3. a kind of power device, which is characterized in that radiated using any radiating mode in claims 1 or 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810276961.3A CN108630638A (en) | 2018-03-30 | 2018-03-30 | Power device heat dissipating method and power device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810276961.3A CN108630638A (en) | 2018-03-30 | 2018-03-30 | Power device heat dissipating method and power device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108630638A true CN108630638A (en) | 2018-10-09 |
Family
ID=63696429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810276961.3A Pending CN108630638A (en) | 2018-03-30 | 2018-03-30 | Power device heat dissipating method and power device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108630638A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103025127A (en) * | 2012-12-05 | 2013-04-03 | 吴江朗恩电子科技有限公司 | Radiating film |
| US20150266739A1 (en) * | 2014-03-20 | 2015-09-24 | Aruna Zhamu | Production process for highly conductive graphitic films |
| CN105517953A (en) * | 2014-09-09 | 2016-04-20 | 石墨烯平台株式会社 | Composite conductive material, power storage device, conductive dispersion, conductive device, conductive composite and thermally conductive composite |
| CN106634047A (en) * | 2016-12-16 | 2017-05-10 | 中南民族大学 | Graphene-containing composite electronic heat-conducting heat-dissipation material, and preparation method and application thereof |
| WO2017116657A1 (en) * | 2015-12-28 | 2017-07-06 | Nanotek Instruments, Inc. | Graphene-Carbon Hybrid Foam |
-
2018
- 2018-03-30 CN CN201810276961.3A patent/CN108630638A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103025127A (en) * | 2012-12-05 | 2013-04-03 | 吴江朗恩电子科技有限公司 | Radiating film |
| US20150266739A1 (en) * | 2014-03-20 | 2015-09-24 | Aruna Zhamu | Production process for highly conductive graphitic films |
| CN105517953A (en) * | 2014-09-09 | 2016-04-20 | 石墨烯平台株式会社 | Composite conductive material, power storage device, conductive dispersion, conductive device, conductive composite and thermally conductive composite |
| WO2017116657A1 (en) * | 2015-12-28 | 2017-07-06 | Nanotek Instruments, Inc. | Graphene-Carbon Hybrid Foam |
| CN106634047A (en) * | 2016-12-16 | 2017-05-10 | 中南民族大学 | Graphene-containing composite electronic heat-conducting heat-dissipation material, and preparation method and application thereof |
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Application publication date: 20181009 |