CN208046998U - Circuit board and medical imaging devices - Google Patents
Circuit board and medical imaging devices Download PDFInfo
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- CN208046998U CN208046998U CN201820463060.0U CN201820463060U CN208046998U CN 208046998 U CN208046998 U CN 208046998U CN 201820463060 U CN201820463060 U CN 201820463060U CN 208046998 U CN208046998 U CN 208046998U
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- face
- wiring board
- chip
- circuit board
- electric signal
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Abstract
The utility model is related to a kind of circuit board and medical imaging devices, wherein circuit board includes：Wiring board, the wiring board include the first face and the second face being oppositely arranged；Multiple chips, the multiple chip are separately positioned on the first face and the second face of the wiring board；Electric signal transmission layer is provided in the wiring board, the multiple chip is connect by via with the electric signal transmission layer；Heat dissipating layer is additionally provided in the wiring board, the heat dissipating layer is set between the first face of the wiring board and the electric signal transmission layer.In foregoing circuit plate, heat dissipating layer is set between the first face and electric signal transmission layer.Increasing heat dissipating layer can be with effective heat dissipation area of increasing circuit plate so that the heat of electric signal transmission layer generation is as much as possible to be transmitted to in-plane, so that the heat dissipation effect of each chip of circuit board is preferable.Therefore, the working performance of circuit board is preferable.
Description
Technical field
The utility model is related to medical imaging technology fields, more particularly to a kind of circuit board and medical imaging devices.
Background technology
Multiple chips would generally be provided on the circuit board of medical imaging devices.The power consumption of each chip not fully phase
There are high power consumption chip and low-power chips together namely on same circuit board.The heat that high power consumption chip generates is easy to influence low
The operating ambient temperature of power dissipating chip can influence the work of low-power chip in this way, so as to cause the work shape of whole circuit board
State is undesirable.
Utility model content
Based on this, it is necessary to for the working condition of circuit board undesirable a kind of circuit board of problem offer and medical imaging
Equipment.
The utility model provides a kind of circuit board, including：
Wiring board, the wiring board include the first face and the second face being oppositely arranged；
Multiple chips, the multiple chip are separately positioned on the first face and the second face of the wiring board；
Electric signal transmission layer is provided in the wiring board, the multiple chip passes through via and the electric signal transmission layer
Connection；
Heat dissipating layer is additionally provided in the wiring board, the heat dissipating layer is set to the first face of the wiring board and the electricity
Between signal transmitting layer.
In foregoing circuit plate, heat dissipating layer is provided on wiring board.Heat dissipating layer be set to the first face and electric signal transmission layer it
Between.Increase heat dissipating layer can with effective heat dissipation area of increasing circuit plate, i.e., by increase electric signal transmission layer in the horizontal direction (
That is the in-plane of parallel circuit plate) thermal coefficient so that electric signal transmission layer generate heat it is as much as possible to plane
Direction is transmitted, so that the heat dissipation effect of each chip of circuit board is preferable.Therefore, the working performance of circuit board is preferable.
Chip dislocation on chip and second face on first face of the wiring board in one of the embodiments,
Setting.
The quantity of the chip on the first face of the wiring board is less than on second face in one of the embodiments,
The quantity of chip.
The power consumption of any chip on the first face of the wiring board is different from the line in one of the embodiments,
The power consumption of any chip on second face of road plate.
The electric signal transmission layer and the first face of the wiring board or second face are flat in one of the embodiments,
Row
The material of the electric signal transmission layer is carbon in one of the embodiments,.
The via runs through the heat dissipating layer in one of the embodiments,.
In one of the embodiments, auxiliary heat dissipation area is additionally provided in the wiring board；The auxiliary heat dissipation area setting
It is contacted around the chip on first face and with the heat dissipating layer.
The auxiliary heat dissipation area includes the multiple cooling fins contacted with the heat dissipating layer in one of the embodiments,.
The utility model additionally provides a kind of medical imaging devices, including the circuit board described in aforementioned any embodiment.
Description of the drawings
Fig. 1 is the diagrammatic cross-section of the circuit board in an embodiment；
Fig. 2 is the schematic diagram of the heat dissipating layer of the circuit board in embodiment shown in FIG. 1.
Specific implementation mode
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to explain
The utility model is not used to limit the utility model.
Fig. 1 is the diagrammatic cross-section of the circuit board in an embodiment.Fig. 2 is the circuit board in embodiment shown in FIG. 1
The schematic diagram of heat dissipating layer.As depicted in figs. 1 and 2, which includes wiring board 110 and multiple chips 120.Wherein, circuit
Plate 110 includes the first face 112 and the second face 114 being oppositely arranged.Electric signal transmission layer 116 is additionally provided on wiring board 110.?
In one embodiment, the material filled in material and via 130 which uses is conductive material, such as
The conductive metal materials such as copper.Heat dissipating layer 118 is additionally provided on wiring board 110.Heat dissipating layer 118 is set to the first of wiring board 110
Between face 112 and electric signal transmission layer 116.
In the present embodiment, multiple chips 120 are respectively set on the first face 112 and the second face 114 of assist side 110.
Each chip 120 is contacted by the via 130 filled with conducting medium with electric signal transmission layer 116, i.e. core on wiring board 110
Piece 120 is connect with electric signal transmission layer 116 by via, to flowing through using electric signal transmission layer 116 as electric signal
Layer.
In foregoing circuit plate, the inside of wiring board 110 is additionally provided with heat dissipating layer 118.Heat dissipating layer 118 is set to wiring board
Between 110 the first face 112 and electric signal transmission layer 116.Increasing heat dissipating layer 118 can be with effective radiating surface of increasing circuit plate
Product, i.e. the heat conduction system by increasing electric signal transmission layer 116 (namely in-plane of parallel circuit plate 110) in the horizontal direction
Number so that the heat of the generation of electric signal transmission layer 116 is as much as possible to be transmitted to in-plane, so that circuit board
The heat dissipation effect of each chip 120 is preferable.Therefore, the working performance of circuit board is preferable.
In one embodiment, the chip 120 on the chip 120 and the second face 114 on the first face 112 of wiring board 110 is wrong
The geometry of the geometric center and the chip on the second face 114 of chip 120 on first face 112 of position setting namely wiring board 110
Center is not on same on the direction of wiring board 110.
In one embodiment, the quantity of the chip 120 on the first face 112 of wiring board 110 is less than the core on the second face 114
The quantity of piece 120, so that it is guaranteed that high power consumption chip on the first face 112 have it is relatively larger transverse (namely along being parallel to the first face 112
Direction on) heat dissipation area, be conducive to the heat dissipation of high power consumption chip, and then reduce the high power consumption chip pair on the first face 112 the
The performance of low-power chip on two faces 114 influences.In other embodiments, the chip on the first face 112 of wiring board 110
120 quantity and the quantitative relation of the chip 120 on the second face 114 are not limited to this.For example, the chip 120 on the first face 112
Quantity can be equal to or more than the second face 114 on chip 120 quantity.
In one embodiment, the power consumption of any chip 120 on the first face 112 of wiring board 110 is all higher than wiring board 110
The second face 114 on any chip 120 power consumption.In the present embodiment, the chip 120 on the first face 112 is referred to as
For high power consumption chip, and the chip 120 on the second face 114 is then referred to as low-power chip.It is appreciated that the application text
In part signified "high" and " low " be all in contrast namely high power consumption chip be relative to low on the second face 114
For power dissipating chip.Chip 120 is respectively set on assist side 110 opposite the first face 112 and the second face 114, and first
The power consumption of chip 120 on face 112 is more than the power consumption on the second face 114, also distinguishes high power consumption chip and low-power chip
The both sides of assist side 110 are set, the heat transfer between big power dissipating chip and low-power chip is isolated, advantageously reduces Gao Gong
Consuming chip influences the performance of low-power chip.
In one embodiment, electric signal transmission layer 116 and the material of the filling in via 130 are all made of carbon.By making
Use conductive athermanous material as the via material of electric signal transmission layer 116, since the thermal coefficient of this material is far below
Copper material can reduce the Equivalent Thermal Conductivities that high power consumption chip carries out hot transmission to low-power chip.The equivalent heat conduction system
Thickness, wiring board sheet material heat conducting coefficient, electric signal transmission layer material thermal coefficient and via diameter of the number depending on wiring board
Etc. parameters.It therefore,, can using conductive athermanous material as the via material of electric signal transmission layer 116 under equivalent condition
The accounting of heat transfer is carried out to reduce high power consumption chip to low-power chip region, and then reduces high power consumption chip to low work(
Consuming the performance of chip influences.In another embodiment, electric signal transmission layer 116 and first face 112 or second face 114
It is parallel.Specifically, electric signal transmission layer 116 is set between the first face 112 and the second face 114.It can make circuit board in this way
It is easy to make.
In one embodiment, via 130 runs through heat dissipating layer 118.May be implemented in this way chip 120 on the first face 112 with
The via 130 of electric connection between electric signal transmission layer 116 is contacted with heat dissipating layer 118.Enhance heat dissipation effect.
In one embodiment, it is additionally provided with auxiliary heat dissipation area 119 on wiring board 110.Auxiliary heat dissipation area 119 is arranged in circuit
It around chip 120 on first face 112 of plate 110, and is contacted with heat dissipating layer 118, as shown in Figure 2.In one embodiment, auxiliary
Help radiating area 119 then can be filled to obtain by borehole in assist side 110.The material in auxiliary heat dissipation area 119 is to lead
Hot non electrically conductive material.Material of heat conduction non-conducting such as aluminium oxide, rubber etc..Therefore, the heat that high power consumption chip generates can
To be transferred to auxiliary heat dissipation area 119 after via 130, heat dissipating layer 118 successively, (heat dissipating layer 118 is as in wiring board 110 at this time
The heat-conducting layer presence in portion), the heat dissipation area of high power consumption chip in the in-plane direction is increased, is conducive to improve high power consumption chip
Heat dissipation, reducing high power consumption chip influences the performance of low-power chip.
In one embodiment, auxiliary heat dissipation area includes the multiple cooling fins contacted with the heat dissipating layer.It in this way can be into one
Step improves the heat dispersal situations of high power consumption chip.
The utility model also provides a kind of medical imaging devices comprising the circuit board described in aforementioned any embodiment.
The medical imaging devices can set for positron emission tomography equipment, MR imaging apparatus, computed tomography
Standby, ultrasonic device, x-ray imaging equipment, positron emission tomography-MR imaging apparatus, positron emission fault at
One or more combinations in picture-computer tomography equipment etc..
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
1. a kind of circuit board, which is characterized in that including：
Wiring board, the wiring board include the first face and the second face being oppositely arranged；
Multiple chips, the multiple chip are separately positioned on the first face and the second face of the wiring board；
Electric signal transmission layer is provided in the wiring board, the multiple chip is connected by via and the electric signal transmission layer
It connects；
Heat dissipating layer is additionally provided in the wiring board, the heat dissipating layer is set to the first face of the wiring board and the electric signal
Between transport layer.
2. circuit board according to claim 1, which is characterized in that the chip on the first face of the wiring board and described
Chip on two faces shifts to install.
3. circuit board according to claim 1, which is characterized in that the quantity of the chip on the first face of the wiring board is not
It is same as the quantity of the chip on second face.
4. circuit board according to claim 1, which is characterized in that the work(of any chip on the first face of the wiring board
Consumption is all higher than the power consumption of any chip on the second face of the wiring board.
5. circuit board according to claim 1, which is characterized in that the electric signal transmission layer and the first of the wiring board
Face or the second face are parallel.
6. circuit board according to claim 1, which is characterized in that the material of the electric signal transmission layer is carbon.
7. circuit board according to claim 1, which is characterized in that the via runs through the heat dissipating layer.
8. circuit board according to claim 1, which is characterized in that be additionally provided with auxiliary heat dissipation area, institute in the wiring board
It states around the chip that auxiliary heat dissipation area is set on the first face of the wiring board and is contacted with the heat dissipating layer.
9. circuit board according to claim 7, which is characterized in that the auxiliary heat dissipation area includes being contacted with the heat dissipating layer
Multiple cooling fins.
10. a kind of medical imaging devices, which is characterized in that including such as claim 1~9 any one of them circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820463060.0U CN208046998U (en) | 2018-03-30 | 2018-03-30 | Circuit board and medical imaging devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820463060.0U CN208046998U (en) | 2018-03-30 | 2018-03-30 | Circuit board and medical imaging devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208046998U true CN208046998U (en) | 2018-11-02 |
Family
ID=63945667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820463060.0U Active CN208046998U (en) | 2018-03-30 | 2018-03-30 | Circuit board and medical imaging devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208046998U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109639947A (en) * | 2018-12-25 | 2019-04-16 | 维沃移动通信有限公司 | Camera module and terminal device |
-
2018
- 2018-03-30 CN CN201820463060.0U patent/CN208046998U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109639947A (en) * | 2018-12-25 | 2019-04-16 | 维沃移动通信有限公司 | Camera module and terminal device |
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| CP01 | Change in the name or title of a patent holder |
Address after: 201807 Shanghai City, north of the city of Jiading District Road No. 2258 Patentee after: Shanghai Lianying Medical Technology Co., Ltd Address before: 201807 Shanghai City, north of the city of Jiading District Road No. 2258 Patentee before: SHANGHAI UNITED IMAGING HEALTHCARE Co.,Ltd. |