CN219938795U - Radiator for electronic equipment - Google Patents
Radiator for electronic equipment Download PDFInfo
- Publication number
- CN219938795U CN219938795U CN202320363804.2U CN202320363804U CN219938795U CN 219938795 U CN219938795 U CN 219938795U CN 202320363804 U CN202320363804 U CN 202320363804U CN 219938795 U CN219938795 U CN 219938795U
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- China
- Prior art keywords
- heat
- conducting plate
- fin group
- heat pipe
- groove
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- 230000005855 radiation Effects 0.000 claims abstract description 13
- 230000017525 heat dissipation Effects 0.000 abstract description 11
- 238000010586 diagram Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004519 grease Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a radiator of electronic equipment, comprising: the heat source comprises a left heat radiation fin group and a right heat radiation fin group, wherein a first heat conducting plate and a second heat conducting plate which are overlapped up and down are arranged between the left heat radiation fin group and the right heat radiation fin group, the first heat conducting plate connected with the heat source is positioned below the second heat conducting plate, a plurality of first grooves are formed in the upper surface of the first heat conducting plate, a second groove is formed in the lower surface of the second heat conducting plate corresponding to the first grooves, a third groove is formed in the upper surface of the second heat conducting plate, one ends of a left heat pipe and a right heat pipe are respectively embedded and installed in the left heat radiation fin group and the right heat radiation fin group, and the other ends of the left heat pipe and the right heat pipe are respectively wrapped between the inner walls of the first grooves and the inner walls of the second grooves and are embedded and installed in the third grooves. The electronic equipment radiator increases the contact area of the heat pipe and the heat conducting plate, improves the heat transfer efficiency, and also ensures the stability of the heat transfer, thereby improving the overall heat dissipation efficiency.
Description
Technical Field
The utility model relates to the field of electronic equipment heat dissipation, in particular to an electronic equipment heat radiator.
Background
The electronic equipment is an electrical equipment composed of microelectronic devices, such as a projector, and the internal elements are more and generate heat during working, and the internal elements have strict requirements on temperature environment, and if the temperature in the shell is unstable, the electronic equipment is easy to cause the normal working of the projector, and a radiator is required to be arranged on the projector.
When the existing radiator is used, the generated heat is generally transferred and radiated through the connection of the heat pipe and the heat conducting plate, but the heat pipe is generally in contact with the heat conducting plate only on the lower surface, so that the heat transfer efficiency is low, and the radiating effect is poor.
Disclosure of Invention
The utility model aims to provide the electronic equipment radiator which increases the contact area of the heat pipe and the heat conducting plate, improves the heat transfer efficiency, ensures the stability of the heat transfer and further improves the overall heat dissipation efficiency.
In order to achieve the above purpose, the utility model adopts the following technical scheme: an electronic device heat sink, comprising: the heat source comprises a left heat radiation fin group and a right heat radiation fin group, wherein a first heat conduction plate and a second heat conduction plate which are overlapped up and down are arranged between the left heat radiation fin group and the right heat radiation fin group, and the first heat conduction plate connected with the heat source is positioned below the second heat conduction plate; the upper surface of the first heat-conducting plate is provided with a plurality of first grooves, the lower surface of the second heat-conducting plate is provided with a second groove corresponding to the first grooves, and the upper surface of the second heat-conducting plate is provided with a third groove; one ends of a left heat pipe and a right heat pipe are respectively embedded and installed in the left radiating fin group and the right radiating fin group, and the other ends of the left heat pipe and the right heat pipe are respectively coated between the inner walls of the first groove and the second groove and embedded and installed in the third groove.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the left heat pipe and the right heat pipe are respectively provided with two groups up and down, the left heat pipe and the right heat pipe positioned at the lower layer are correspondingly embedded between the inner walls of the first groove and the second groove, and the left heat pipe and the right heat pipe positioned at the upper layer are correspondingly embedded and installed in the third groove.
2. In the above scheme, the left heat pipes and the right heat pipes are arranged in a staggered manner.
3. In the above scheme, the left heat pipe and the right heat pipe which are positioned at the lower layer are respectively provided with four, the left heat pipe is positioned between the right heat pipes, and the two left heat pipes in the middle are positioned between the two right heat pipes which are arranged at intervals.
4. In the above scheme, the left heat pipe and the right heat pipe which are positioned on the upper layer are respectively provided with two, and the two left heat pipes are positioned between the two right heat pipes which are arranged at intervals.
5. In the above scheme, the left radiating fin group and the right radiating fin group are composed of a plurality of radiating fins, the surface of each radiating fin is provided with a plurality of first through holes, a second through hole is arranged above each first through hole, and the first through holes are communicated with the second through holes.
6. In the above scheme, a flange is arranged at one side of the first through hole along the circumferential direction of the first through hole, and the flange between two adjacent radiating fins is tightly connected with the first through hole.
7. In the above scheme, the left heat pipe and the right heat pipe are round pipes.
8. In the above scheme, the second grooves and the third grooves are distributed in a staggered manner.
Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages and effects:
the utility model relates to a radiator for electronic equipment, which is characterized in that a first heat conducting plate and a second heat conducting plate which are overlapped up and down are positioned between a left heat radiating fin group and a right heat radiating fin group, the first heat conducting plate connected with a heat source is positioned below the second heat conducting plate, the upper surface of the first heat conducting plate is provided with a plurality of first grooves, the lower surface of the second heat conducting plate is provided with a second groove corresponding to the first grooves, the upper surface of the second heat conducting plate is provided with a third groove, one end of a left heat pipe and one end of a right heat pipe are respectively embedded and installed in the left heat radiating fin group and the right heat radiating fin group, the other end of the left heat pipe and the other end of the right heat pipe are respectively coated between the inner walls of the first groove and the second groove and are embedded and installed in the third groove, the first heat conducting plate is contacted with a heat source, absorbed heat is transferred to the left heat pipe and the right heat pipe between the first heat conducting plate and the second heat conducting plate, the left heat pipe and the right heat pipe arranged between the first groove and the second groove and inside the third groove transfer heat to the left heat radiating fin group and the right heat radiating fin group at two ends, the uniformity of heat distribution is improved through the first heat conducting plate and the second heat conducting plate, the contact area between the left heat pipe and the right heat pipe and the first heat conducting plate and the second heat conducting plate is also increased, the heat transfer efficiency is improved, the heat transfer stability is also ensured, and the integral heat radiating efficiency is further improved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a heat sink for an electronic device according to the present utility model;
FIG. 2 is an enlarged view of the utility model at A of FIG. 1;
FIG. 3 is a schematic diagram of a partial structure of a heat sink for an electronic device according to the present utility model;
fig. 4 is a schematic diagram of an exploded structure of the heat sink of the electronic device according to the present utility model.
In the above figures: 1. a left heat radiation fin group; 2. a right set of heat fins; 3. a first heat-conducting plate; 4. a second heat-conducting plate; 5. a first groove; 6. a second groove; 7. a left heat pipe; 8. a right heat pipe; 9. a third groove; 10. a heat dissipation buckle plate; 11. a first through hole; 12. a second through hole; 13. and a flange.
Detailed Description
The present patent will be further understood by the specific examples given below, which are not intended to be limiting.
Example 1: an electronic device heat sink, comprising: a left radiating fin group 1 and a right radiating fin group 2, a first heat conducting plate 3 and a second heat conducting plate 4 which are overlapped up and down are arranged between the left radiating fin group 1 and the right radiating fin group 2, and the first heat conducting plate 3 connected with a heat source is positioned below the second heat conducting plate 4;
the upper surface of the first heat-conducting plate 3 is provided with a plurality of first grooves 5, the lower surface of the second heat-conducting plate 4 is provided with a second groove 6 corresponding to the first grooves 5, and the upper surface of the second heat-conducting plate is provided with a third groove 9;
one ends of a left heat pipe 7 and a right heat pipe 8 are respectively embedded and installed in the left radiating fin group 1 and the right radiating fin group 2, and the other ends of the left heat pipe 7 and the right heat pipe 8 are respectively coated between the inner walls of the first groove 5 and the second groove 6 and are embedded and installed in the third groove 9;
the first heat conducting plate is contacted with the heat source, the left heat pipe and the right heat pipe which are arranged between the first heat conducting plate and the second heat conducting plate and are arranged on the upper surface of the second heat conducting plate fully absorb the heat transferred to the first heat conducting plate and the second heat conducting plate by the heat source, and the heat is transferred to the left heat radiating fin group and the right heat radiating fin group at two ends, so that heat dissipation is realized.
The left heat pipe 7 and the right heat pipe 8 are respectively provided with two groups from top to bottom, one ends of the left heat pipe 7 and the right heat pipe 8 which are positioned at the lower layer and are close to each other are respectively positioned between the inner walls of the first groove 5 and the second groove 6, and one ends of the left heat pipe 7 and the right heat pipe 8 which are positioned at the upper layer and are close to each other are embedded and installed in the third groove 9.
The second grooves 6 and the third grooves 9 are distributed in a staggered manner.
Four left heat pipes 7 and four right heat pipes 8 are arranged on the lower layer, the left heat pipes 7 are arranged between the right heat pipes 8, and the two left heat pipes 7 in the middle are arranged between the two right heat pipes 8 at intervals; the two left heat pipes 7 and the two right heat pipes 8 positioned on the upper layer are respectively arranged, and the two left heat pipes 7 are positioned between the two right heat pipes 8 which are arranged at intervals.
The left radiating fin group 1 and the right radiating fin group 2 are composed of a plurality of radiating fins 10, a plurality of first through holes 11 are formed on the surface of the radiating fins 10, a second through hole 12 is formed above the first through holes 11, and the first through holes 11 are communicated with the second through holes 12; the left heat pipe 7 and the right heat pipe 8 are filled with heat conduction paste between the left radiating fin group 1 and the right radiating fin group 2; the heat-conducting paste is heat-conducting silicone grease.
The left heat pipe 7 and the right heat pipe 8 are round pipes.
And heat conducting paste is filled between the left heat pipe 7 and the right heat pipe 8 and the first heat conducting plate 3 and the second heat conducting plate 4.
The first heat-conducting plate 3 and the second heat-conducting plate 4 are aluminum plates.
The left heat pipe 7 and the right heat pipe 8 are aluminum pipes.
Example 2: the radiator for the electronic equipment comprises a left radiating fin group 1 and a right radiating fin group 2, wherein a first heat conducting plate 3 and a second heat conducting plate 4 which are overlapped up and down are arranged between the left radiating fin group 1 and the right radiating fin group 2, and the first heat conducting plate 3 connected with a heat source is positioned below the second heat conducting plate 4;
the upper surface of the first heat-conducting plate 3 is provided with a plurality of first grooves 5, the lower surface of the second heat-conducting plate 4 is provided with a second groove 6 corresponding to the first grooves 5, and the upper surface of the second heat-conducting plate is provided with a third groove 9;
one ends of a left heat pipe 7 and a right heat pipe 8 are respectively embedded and installed in the left radiating fin group 1 and the right radiating fin group 2, and the other ends of the left heat pipe 7 and the right heat pipe 8 are respectively coated between the inner walls of the first groove 5 and the second groove 6 and are embedded and installed in the third groove 9;
the first heat conducting plate is contacted with a heat source, absorbed heat is transferred to the left heat pipe and the right heat pipe between the first heat conducting plate and the second heat conducting plate, the left heat pipe and the right heat pipe arranged between the first groove and the second groove and inside the third groove transfer heat to the left heat radiating fin group and the right heat radiating fin group at two ends, the uniformity of heat distribution is improved through the first heat conducting plate and the second heat conducting plate, the contact area between the left heat pipe and the right heat pipe and the first heat conducting plate and the second heat conducting plate is also increased, the heat transfer efficiency is improved, the heat transfer stability is also ensured, and the integral heat radiating efficiency is further improved.
The left heat pipe 7 and the right heat pipe 8 are respectively provided with two groups from top to bottom, one ends of the left heat pipe 7 and the right heat pipe 8 which are positioned at the lower layer and are close to each other are respectively positioned between the inner walls of the first groove 5 and the second groove 6, and one ends of the left heat pipe 7 and the right heat pipe 8 which are positioned at the upper layer and are close to each other are embedded and installed in the third groove 9.
The second grooves 6 and the third grooves 9 are distributed in a staggered manner.
The left heat pipes 7 and the right heat pipes 8 are staggered.
The left heat pipes 7 and the right heat pipes 8 positioned at the lower layer are respectively provided with four, the left heat pipes 7 are positioned between the right heat pipes 8, and the two left heat pipes 7 in the middle are positioned between the two right heat pipes 8 which are arranged at intervals
The left radiating fin group 1 and the right radiating fin group 2 are composed of a plurality of radiating fins 10, a plurality of first through holes 11 are formed on the surface of the radiating fins 10, a second through hole 12 is formed above the first through holes 11, and the first through holes 11 are communicated with the second through holes 12; the left heat pipe 7 and the right heat pipe 8 are filled with heat conducting paste, the heat conducting paste is solder paste, the second through holes are used for injecting the solder paste, and the solder paste can flow in along the first through holes when melted, so that the left heat pipe, the right heat pipe and the inner walls of the first through holes are filled.
A flange 13 is provided on one side of the first through hole 11 along the circumferential direction thereof, and the flange 13 between two adjacent heat dissipation tabs 10 is tightly connected to the first through hole 11.
The left heat pipe 7 and the right heat pipe 8 are round pipes.
The first heat-conducting plate 3 and the second heat-conducting plate 4 are copper plates.
The left heat pipe 7 and the right heat pipe 8 are copper pipes.
The working principle of the utility model is as follows:
when the heat source heat dissipation device works, the first heat conducting plate is in contact with the heat source, the left heat pipe and the right heat pipe arranged between the first heat conducting plate and the second heat conducting plate and arranged on the upper surface of the second heat conducting plate fully absorb heat transferred from the heat source to the first heat conducting plate and the second heat conducting plate, and the left heat pipe and the right heat pipe arranged between the first groove and the second groove and in the third groove transfer the heat to the left heat dissipation fin group and the right heat dissipation fin group at two ends, so that heat dissipation is realized.
When the radiator for the electronic equipment is adopted, the uniformity of heat distribution is improved through the first heat conducting plate and the second heat conducting plate, the contact area between the left heat pipe and the right heat pipe and the first heat conducting plate and the contact area between the right heat pipe and the second heat conducting plate are also increased, the heat transfer efficiency is improved, the heat transfer stability is also ensured, and therefore the overall heat dissipation efficiency is improved.
The above embodiments are provided to illustrate the technical concept and features of the present utility model and are intended to enable those skilled in the art to understand the content of the present utility model and implement the same, and are not intended to limit the scope of the present utility model. All equivalent changes or modifications made in accordance with the spirit of the present utility model should be construed to be included in the scope of the present utility model.
Claims (9)
1. An electronic device heat sink, comprising: left heat radiation fin group (1), right heat radiation fin group (2), its characterized in that: a first heat conducting plate (3) and a second heat conducting plate (4) which are overlapped up and down are arranged between the left heat radiating fin group (1) and the right heat radiating fin group (2), and the first heat conducting plate (3) connected with a heat source is positioned below the second heat conducting plate (4); the upper surface of the first heat-conducting plate (3) is provided with a plurality of first grooves (5), the lower surface of the second heat-conducting plate (4) is provided with a second groove (6) corresponding to the first grooves (5), and the upper surface of the second heat-conducting plate is provided with a third groove (9); one end of a left heat pipe (7) and one end of a right heat pipe (8) are respectively embedded and installed in the left radiating fin group (1) and the right radiating fin group (2), and the other ends of the left heat pipe (7) and the right heat pipe (8) are respectively coated between the inner walls of the first groove (5) and the second groove (6) and embedded and installed in the third groove (9).
2. The electronic device heat sink of claim 1, wherein: the left heat pipe (7) and the right heat pipe (8) are respectively provided with two groups from top to bottom, the left heat pipe (7) and the right heat pipe (8) which are positioned at the lower layer are correspondingly embedded between the inner walls of the first groove (5) and the second groove (6), and the left heat pipe (7) and the right heat pipe (8) which are positioned at the upper layer are correspondingly embedded and installed in the third groove (9).
3. The electronic device heat sink according to claim 1 or 2, characterized in that: the left heat pipes (7) and the right heat pipes (8) are arranged in a staggered mode.
4. The electronic device heat sink according to claim 1 or 2, characterized in that: the left heat pipes (7) and the right heat pipes (8) which are positioned at the lower layer are all provided with four, the left heat pipes (7) are positioned between the right heat pipes (8), and the two left heat pipes (7) at the middle part are positioned between the two right heat pipes (8) which are arranged at intervals.
5. The electronic device heat sink of claim 4, wherein: the two left heat pipes (7) and the two right heat pipes (8) which are positioned on the upper layer are respectively arranged, and the two left heat pipes (7) are positioned between the two right heat pipes (8) which are arranged at intervals.
6. The electronic device heat sink of claim 1, wherein: the left radiating fin group (1) and the right radiating fin group (2) are composed of a plurality of radiating fins (10), a plurality of first through holes (11) are formed in the surface of each radiating fin (10), a second through hole (12) is formed above each first through hole (11), and the first through holes (11) are communicated with the second through holes (12).
7. The electronic device heat sink of claim 6, wherein: a flange (13) is arranged on one side of the first through hole (11) along the circumferential direction of the first through hole, and the flange (13) between two adjacent radiating fins (10) is tightly connected with the first through hole (11).
8. The electronic device heat sink of claim 1, wherein: the left heat pipe (7) and the right heat pipe (8) are round pipes.
9. The electronic device heat sink of claim 1, wherein: the second grooves (6) and the third grooves (9) are distributed in a staggered mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320363804.2U CN219938795U (en) | 2023-03-02 | 2023-03-02 | Radiator for electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320363804.2U CN219938795U (en) | 2023-03-02 | 2023-03-02 | Radiator for electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219938795U true CN219938795U (en) | 2023-10-31 |
Family
ID=88491083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320363804.2U Active CN219938795U (en) | 2023-03-02 | 2023-03-02 | Radiator for electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219938795U (en) |
-
2023
- 2023-03-02 CN CN202320363804.2U patent/CN219938795U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240207 Address after: No. 258, Dongping Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province, 215311 Patentee after: KUNSHAN PING TAI ELECTRONIC CO.,LTD. Country or region after: China Address before: No. 388, Sanjia Road, Zhangpu Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Suzhou pindai Electronic Technology Co.,Ltd. Country or region before: China |