CN208256648U - A kind of current spread and radiator structure of GaALAs chip - Google Patents
A kind of current spread and radiator structure of GaALAs chip Download PDFInfo
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- CN208256648U CN208256648U CN201721646657.0U CN201721646657U CN208256648U CN 208256648 U CN208256648 U CN 208256648U CN 201721646657 U CN201721646657 U CN 201721646657U CN 208256648 U CN208256648 U CN 208256648U
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Abstract
The utility model discloses the current spreads and radiator structure of a kind of GaALAs chip, it is related to GaALAs chip technology field；Several substrate heat-dissipating pipes are provided on substrate, and several substrate heat-dissipating pipes in Z axis to setting, the upper end of several substrate heat-dissipating pipes is connected with several longitudinal heat-dissipating pipes, several longitudinal heat-dissipating pipes are connected to substrate heat-dissipating pipe, and several longitudinal heat-dissipating pipes are worn and are connect in the inside of substrate, the upper end of the substrate is equipped with radiating block, the upper end of the radiating block is equipped with GaALAs chip, the upper end of GaALAs chip is provided with electrically conducting transparent contact layer, transparency conducting layer is provided on the upside of the electrically conducting transparent contact layer, electrically conducting transparent diffusion layer is provided on the upside of the transparency conducting layer；The utility model is easy to implement rapid cooling and current spread, easy to use, easy to operate, and high-efficient, can save the time.
Description
Technical field:
The utility model relates to the current spreads and radiator structure of a kind of GaALAs chip, belong to GaALAs chip technology neck
Domain.
Background technique:
Existing GaALAs chip low efficiency in current spread and heat dissipation, and it is easy to appear high temperature, cause it to use the longevity
Order it is short, it is complicated for operation.
Utility model content:
In view of the above-mentioned problems, the technical problem to be solved by the present invention is to provide a kind of current spreads of GaALAs chip
And radiator structure.
The current spread and radiator structure of a kind of GaALAs chip of the utility model, it include substrate, substrate heat-dissipating pipe,
Longitudinal heat-dissipating pipe, radiating block, GaALAs chip, electrically conducting transparent contact layer, transparency conducting layer, electrically conducting transparent diffusion layer；On substrate
Several substrate heat-dissipating pipes are provided with, and several substrate heat-dissipating pipes are in Z axis to setting, the upper end of several substrate heat-dissipating pipes connects
There are several longitudinal heat-dissipating pipes, several longitudinal heat-dissipating pipes are connected to substrate heat-dissipating pipe, and several longitudinal heat-dissipating pipes are worn and connect in base
The inside of piece, the upper end of the substrate are equipped with radiating block, and the upper end of the radiating block is equipped with GaALAs chip, GaALAs core
The upper end of piece is provided with electrically conducting transparent contact layer, is provided with transparency conducting layer on the upside of the electrically conducting transparent contact layer, described
Electrically conducting transparent diffusion layer is provided on the upside of bright conductive layer.
Preferably, the radiating block is honeycomb-type heat radiation block.
Preferably, the substrate heat-dissipating pipe, longitudinal heat-dissipating pipe are screw type heat dissipating pipe.
Compared with prior art, the utility model has the following beneficial effects: being easy to implement rapid cooling and current spread, make
It is easy to operate and high-efficient with convenience, the time can be saved.
Detailed description of the invention:
The present invention is described in detail by the following detailed description and drawings for ease of explanation,.
Fig. 1 is the structural schematic diagram of the utility model.
In figure: 1- substrate；2- substrate heat-dissipating pipe；The longitudinal direction 3- heat-dissipating pipe；4- radiating block；5-GaALAs chip；6- is transparent to be led
Electric contacting layer；7- transparency conducting layer；8- electrically conducting transparent diffusion layer.
Specific embodiment:
To make the objectives, technical solutions and advantages of the present invention clearer, below by shown in the accompanying drawings
Specific embodiment describes the utility model.However, it should be understood that these descriptions are merely illustrative, and it is not intended to limit this reality
With novel range.In addition, in the following description, descriptions of well-known structures and technologies are omitted, to avoid unnecessarily mixing
Confuse the concept of the utility model.
As shown in Figure 1, present embodiment uses following technical scheme: it includes substrate 1, substrate heat-dissipating pipe 2, longitudinal direction
Heat-dissipating pipe 3, radiating block 4, GaALAs chip 5, electrically conducting transparent contact layer 6, transparency conducting layer 7, electrically conducting transparent diffusion layer 8；Substrate 1
On be provided with several substrate heat-dissipating pipes 2, and several substrate heat-dissipating pipes 2 in Z axis to setting, several substrate heat-dissipating pipes 2 it is upper
End is connected with several longitudinal heat-dissipating pipes 3, and several longitudinal heat-dissipating pipes 3 are connected to substrate heat-dissipating pipe 2, and several longitudinal heat-dissipating pipes
3 wear and connect in the inside of substrate 1, and the upper end of the substrate 1 is equipped with radiating block 4, and the upper end of the radiating block 4 is equipped with GaALAs
Chip 5, the upper end of GaALAs chip 5 are provided with electrically conducting transparent contact layer 6, and the upside of the electrically conducting transparent contact layer 6 is provided with
The upside of transparency conducting layer 7, the transparency conducting layer 7 is provided with electrically conducting transparent diffusion layer 8.
Further, the radiating block 4 is honeycomb-type heat radiation block.
Further, the substrate heat-dissipating pipe 2, longitudinal heat-dissipating pipe 3 are screw type heat dissipating pipe.
The working principle of the present embodiment is as follows: being expanded by electrically conducting transparent contact layer 6, transparency conducting layer 7, electrically conducting transparent
The diffusion of electric current is realized in the cooperation for dissipating layer 8, while in heat dissipation, realizes rapid cooling by radiating block, and cooperate substrate heat dissipation
Pipe 2, longitudinal heat-dissipating pipe 3 are able to achieve raising thermal diffusivity, and substrate heat-dissipating pipe 2 is able to achieve natural heat dissipation, so that radiating rate is faster.
In the description of the present invention, unless otherwise clearly defined and limited, term " installation ", " connected ", " company
Connect ", " fixation " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be
Mechanical connection, is also possible to be electrically connected；It can be directly connected, two can also be can be indirectly connected through an intermediary
The interaction relationship of connection or two elements inside element.It for the ordinary skill in the art, can be specific
Situation understands the concrete meaning of above-mentioned term in the present invention.
The standardized element that the utility model uses can commercially, shaped piece according to specification and attached drawing
Record can carry out customized, the specific connection type of each part is all made of in the prior art mature bolt, rivet, weldering
Equal conventional means are connect, mechanical, part and equipment are all made of in the prior art, conventional model, in addition circuit connection is using existing
Conventional connection type in technology, this will not be detailed here.
It is obvious to a person skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and
And without departing substantially from the spirit or essential attributes of the utility model, it can realize that this is practical new in other specific forms
Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this is practical new
The range of type is indicated by the appended claims rather than the foregoing description, it is intended that containing for the equivalent requirements of the claims will be fallen in
All changes in justice and range are embraced therein.It should not treat any reference in the claims as limiting
Related claim.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (3)
1. a kind of current spread and radiator structure of GaALAs chip, it is characterised in that: it includes substrate, substrate heat-dissipating pipe, indulges
To heat-dissipating pipe, radiating block, GaALAs chip, electrically conducting transparent contact layer, transparency conducting layer, electrically conducting transparent diffusion layer；It is set on substrate
Several substrate heat-dissipating pipes are equipped with, and several substrate heat-dissipating pipes are in Z axis to setting, the upper end of several substrate heat-dissipating pipes is connected with
Several longitudinal direction heat-dissipating pipes, several longitudinal heat-dissipating pipes are connected to substrate heat-dissipating pipe, and several longitudinal heat-dissipating pipes are worn and connect in substrate
Inside, the upper end of the substrate is equipped with radiating block, and the upper end of the radiating block is equipped with GaALAs chip, GaALAs chip
Upper end be provided with electrically conducting transparent contact layer, transparency conducting layer is provided on the upside of the electrically conducting transparent contact layer, it is described transparent
Electrically conducting transparent diffusion layer is provided on the upside of conductive layer.
2. the current spread and radiator structure of a kind of GaALAs chip according to claim 1, it is characterised in that: described to dissipate
Heat block is honeycomb-type heat radiation block.
3. the current spread and radiator structure of a kind of GaALAs chip according to claim 1, it is characterised in that: the base
Piece heat-dissipating pipe, longitudinal heat-dissipating pipe are screw type heat dissipating pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721646657.0U CN208256648U (en) | 2017-11-29 | 2017-11-29 | A kind of current spread and radiator structure of GaALAs chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721646657.0U CN208256648U (en) | 2017-11-29 | 2017-11-29 | A kind of current spread and radiator structure of GaALAs chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208256648U true CN208256648U (en) | 2018-12-18 |
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ID=64620188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721646657.0U Active CN208256648U (en) | 2017-11-29 | 2017-11-29 | A kind of current spread and radiator structure of GaALAs chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208256648U (en) |
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2017
- 2017-11-29 CN CN201721646657.0U patent/CN208256648U/en active Active
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