WO2018108140A1

WO2018108140A1 - Modular power supply system

Info

Publication number: WO2018108140A1
Application number: PCT/CN2017/116351
Authority: WO
Inventors: 应建平; 王明; 黄宵驳; 刘军; 胡志明
Original assignee: 台达电子企业管理（上海）有限公司
Priority date: 2016-12-16
Filing date: 2017-12-15
Publication date: 2018-06-21

Abstract

A modular power supply system, comprising: a main controller (90) configured to output a main control signal; N local controllers (91), wherein each local controller is configured to receive the main control signal so as to output at least one local control signal (702); and N power units (70) which are in one-to-one correspondence with the N local controllers. Each power unit comprises a first terminal (X₁) and a second terminal (X₂), the second terminal of each power unit being connected to a first terminal of an adjacent power unit. Each power unit is configured to comprise M power converters (701), and each power converter is configured to operate according to a local control signal which is outputted by a corresponding local controller. Each power unit further comprises M sampling circuits configured to sample a positive direct current bus voltage and a negative direct current bus voltage of the M power converters respectively. M and N are natural numbers greater than 1.

Description

Modular power system

Technical field

The present invention relates to the field of power electronics, and in particular to a modular power system.

Background technique

Currently, at some higher voltage levels (such as above 10kV) applications, such as Static Var Generator (SVG), Medium Variable-frequency Drive (MVD), and Light HVDC Transmission System ( High Voltage Direct Current Transmission Light (HVDC-Light), etc., due to the high system voltage level, limited by the withstand voltage level and cost of the semiconductor device, the circuit topology of the power unit cascade is usually adopted.

The traditional power unit cascaded topology requires a set of optical fibers, auxiliary power supplies, and local controllers for each power unit, ie, the power converter. This power unit cascaded topology increases with the increase of the voltage level, and the number of power units that need to be cascaded increases, resulting in an increase in the number of optical fibers, auxiliary power supplies, and local controllers. The design is complex, costly, and reduces its reliability.

1 is a schematic structural view of a three-phase SVG system in the prior art. 2 is a schematic diagram of a more specific three-phase SVG system in the prior art. The SVG system of Figures 1 and 2 includes three phase circuits in which the power cells in each phase are connected in cascade.

As shown in FIG. 1, each phase circuit of the SVG system is formed by cascading a plurality of power units 1. The term "cascade" is a common knowledge in the art, that each power cell comprises a first end and the second end T ₁ T _2, wherein two adjacent power cell a second terminal T ₂ and the other The first end T _{1 of one is} connected. Each phase circuit of the first power units through a first end of the filter L T ₁ are respectively connected to three-phase network U _A, U _B and U _C on the three-phase line, the last one power unit for each phase circuit The second ends are connected to each other.

As shown in FIG. 2, each phase circuit of the SVG system is formed by cascading eight power units P ₁ to P ₈ . Each power unit includes a first end and a second end as shown in Figure 1, wherein a second end of one of the adjacent two power units is coupled to the first end of the other. For example, the second end of the power unit P ₁ and P power unit ₂ is connected to a first end, a second end of the power unit P and the power unit P is connected to a first end of the ₂ _3, and so on, a second power unit P ₇ The terminal is connected to the first end of the power unit P ₈ . The first end of the three power units P ₁ in the three-phase circuit is connected to the U _A , U _B and U _C phases of the three-phase power grid G through a filter circuit (composed of the inductor L, the resistor R and the capacitor C), wherein the three phases The U _A , U _B and U _C of the grid G are connected to the load R _load . The second ends of the three power units P ₈ in the three-phase circuit are connected to each other. Four power switching devices 2 are included in each power unit. Each power switching device 2 consists of a power semiconductor switch S and an anti-parallel body diode or external diode D. The collector of the power semiconductor switch S is connected to the cathode of the diode D, and the emitter of the power semiconductor switch S is connected to the anode of the diode D. Since the power semiconductor switch S and an anti-parallel body diode or external diode D are generally used as a whole, for the sake of brevity, the anti-parallel body diode or external diode D will not be separately mentioned in the following description. .

The power unit 1 shown in FIG. 1 may be a full bridge (H bridge) circuit, or may be other circuit topologies such as a half bridge circuit, a rectification-inverter circuit, and the like. 3 is a schematic diagram of an H-bridge circuit (topology) in the prior art. For example, a power unit circuit, for example an H-bridge, H-bridge circuit shown in Figure 3, comprises a power semiconductor switch S ₁ is to S ₄ and the DC bus capacitor C _B. The first end of the power semiconductor switch S ₁ is connected to the positive terminal of the DC bus capacitor C _B and the first terminal of the power semiconductor switch S ₃ . A second end of the power semiconductor switch S ₁ is coupled to the first end of the power semiconductor switch S ₄ . The second end of the power semiconductor switch S ₄ is connected to the negative terminal of the DC bus capacitor C _B and the second terminal of the power semiconductor switch S ₂ . A second terminal of the power semiconductor switch _{S. 3} is connected to a first terminal of the power semiconductor switch S _2. The second end of the power semiconductor switch S ₁ serves as a first output of the H-bridge circuit, that is, the first end T _{1 of the} power unit 1, and the second end of the power semiconductor switch S ₃ serves as a second output of the H-bridge circuit. That is, the second end T _{2 of the} power unit 1.

4 is a schematic diagram of a single phase SVG in the prior art. As shown in FIG. 4, the single-phase SVG includes a charging portion 3, a power portion 4, and a control portion 5. The single phase SVG also includes a plurality of power units 40, each of which includes a first end and a second end as shown in FIG. 1, a first end of one of the adjacent two power units 40 and another The second end is connected. Figure 4 is a conventional cascaded solution for a 25kV single phase SVG. The SVG is cascaded by a plurality of power units to form a phase that is connected to the grid via filters and contactors. Each power unit 40 of the SVG typically employs an H-bridge circuit. The topology of the H-bridge circuit is shown in Figure 3 and will not be described here. Each power unit 40 of the SVG system further includes a DC bus capacitor C _B whose connection relationship is as shown in FIG. 4 , wherein the charging portion 3 is used to precharge the DC bus capacitor C _B , and the control portion 5 is used to control the power. Part 4 runs.

As can be seen from FIG. 4, in the conventional cascaded topology, each power unit 40, as a power converter, such as an H-bridge circuit, needs to be separately provided with a set of locals in addition to a main controller 50. The controller 51, the driving circuit 52, the auxiliary power source 53 and the optical fiber 54 are connected in a relationship as shown in FIG. 4. The main controller 50 outputs a main control signal to the local main controller 51, and the local main controller 51 generates a main control signal according to the main control signal. The local control signal of the corresponding power unit is sent to the driving circuit 52. The driving circuit 52 outputs a driving signal according to the local control signal to drive the corresponding power unit to operate. For example, a 25kV single-phase SVG can usually be implemented in the following two schemes. The first solution: the power switching devices in the H-bridge circuit use the commonly used 1700V Insulated Gate Bipolar Transistor (IGBT), then the DC bus voltage of the single power unit 40 is 1000V, considering redundancy, a total of A 55-level power unit cascade is required, so a total of 55 sets of local control boards 51, 55 sets of fibers 54 and 55 auxiliary power sources 53 are required. Such a large number of local controllers 51, optical fibers 54, and auxiliary power sources 53 will result in extremely complicated structural design of the SVG, and the cost is also relatively high, while reducing its reliability.

The second scheme: the power switching device in the H-bridge circuit uses a high-voltage IGBT, such as a 3300V IGBT or even a 6500V IGBT, to increase the voltage level of the single power unit 40. In order to reduce the number of cascades of power units 40 and reduce the number of local controllers 51, fibers 54, and auxiliary power sources 53, a second scheme can generally be employed. In the second scheme, if the 3300V IGBT is selected, the voltage level of each power unit 40 is doubled compared to the 1700V IGBT scheme, and the number of cascades can be reduced from 55 to 28, local controller 51, fiber 54 and auxiliary power supply. The number and cost of 53 can also be reduced by half. However, due to the current level of semiconductor technology development, the cost of 3300V IGBT is still high. Under the same current specification, the cost is far more than twice the cost of 1700V IGBT. Therefore, the cost of the second option will far exceed the first option. If a 6500V IGBT is chosen, the cost pressure is even higher.

Therefore, the current cascading scheme using low voltage IGBT power units or the cascading scheme using high voltage IGBT power units has its significant disadvantages.

Figure 5 is a schematic illustration of an HVDC-Light system in the prior art. As shown in FIG. 5, the HVDC-Light includes a three-phase circuit, and each phase circuit includes an upper half arm and a lower half arm, and the upper half arm and the lower half arm of each phase circuit include a plurality of stages. Connected power unit 40 and inductor L, each power unit 40 also includes a first end and a second end as shown in FIG. 1, a first end of one of the adjacent two power units 40 and a second of the other The terminals are connected, the inductance L of each upper arm is connected to the inductance L of the corresponding lower arm, and the connection points between the two inductors L are respectively connected to the power grid, and the connection relationship is as shown in FIG. 5. Each of the HVDC-Light power units 40 employs a half bridge converter. Each power unit 40 of the HVDC-Light further includes a DC bus capacitor. Each power unit 40 of the HVDC-Light also needs to be connected to a driving circuit 52. The power unit 40 operates according to a driving signal output by the driving circuit 52. In addition to the main controller 50, each power unit 40 also needs to be provided with a local controller 51, an optical fiber 54 and an auxiliary power supply 53, the connection relationship of which is shown in FIG.

Since the DC voltage of HVDC-Light is as high as hundreds of kilovolts, and the number of power units 40 to be cascaded is extremely large, the above-mentioned problems are more remarkable, that is, the overall structure of HVDC-Light in the prior art is complicated, costly and reliable. Low sex.

At the same time, the sampling circuit for the DC bus voltage needs further consideration and improvement.

In addition, the power supply mode of the local controller and auxiliary power supply needs further consideration and improvement.

Summary of the invention

It is an object of the present invention to provide a modular power supply system that simplifies the structure of a power electronic system, reduces cost, and improves reliability.

According to a first aspect of the present invention, a modular power supply system is provided, comprising: a main controller configured to output a main control signal; N local controllers, wherein each of the local controllers is Configuring to receive the main control signal to output at least one local control signal; and N power units in one-to-one correspondence with the N local controllers, wherein each of the power units includes a first end and a second end The second end of each of the power units is coupled to the first end of an adjacent one of the power units, each of the power units being configured to include M power converters, each of which is The power converter includes a third end and a fourth end, the fourth end of each of the power converters being coupled to the third end of an adjacent one of the power converters, and the first one The third end of the power converter is the first end of the power unit, and the fourth end of the Mth power converter is the second end of the power unit, each Power converter is configured And operating according to the local control signal output by the corresponding local controller, where N and M are both natural numbers greater than 1, wherein each of the power units further includes: M sampling circuits configured to separately collect the The positive DC bus voltage and the negative DC bus voltage of the M power converters, and the local controller corresponding to the power unit are configured to include: M sampling conditioning circuits configured to acquire the M The positive DC bus voltage of the power converters and the negative DC bus voltage are converted to digital signals.

In some exemplary embodiments of the present invention, the sampling circuit includes: M DC bus positive terminal samplers, one-to-one correspondence with the M power converters and the M sampling conditioning circuits, wherein the M The DC bus positive-end samplers are respectively configured to be connected at one end to the positive terminal of the corresponding DC bus capacitor of the power converter, and the M DC bus positive-end samplers are respectively configured to connect the corresponding sampling at the other end a first end of the conditioning circuit, the first end of the sampling conditioning circuit receiving a positive DC bus voltage of the power converter; and M DC bus negative terminal samplers, and the M power converters and The M sampling and conditioning circuits are in one-to-one correspondence, wherein the M DC bus negative terminal samplers are respectively configured to connect one end of the corresponding negative terminal of the DC bus capacitor of the power converter, and the M DC bus negative terminals The sampler is configured to connect the other end to the second end of the corresponding sampling conditioning circuit, and the second end of the sampling conditioning circuit receives the negative DC bus voltage of the power converter.

In some exemplary embodiments of the invention, the DC bus positive end sampler and the DC bus negative end sampler comprise resistors.

In some exemplary embodiments of the invention, the sampling conditioning circuit comprises a single operational amplifier.

According to a second aspect of the present invention, a modular power supply system is provided, comprising: a main controller configured to output a main control signal; N local controllers, wherein each of the local controllers is Configuring to receive the main control signal to output at least one local control signal; and N power units in one-to-one correspondence with the N local controllers, wherein each of the power units includes a first end and a second end The second end of each of the power units is coupled to the first end of an adjacent one of the power units, each of the power units being configured to include M power converters, each of which is The power converter includes a third end and a fourth end, the fourth end of each of the power converters being coupled to the third end of an adjacent one of the power converters, and the first one The third end of the power converter is the first end of the power unit, and the fourth end of the Mth power converter is the second end of the power unit, each Power converter is configured And operating according to the local control signal outputted by the corresponding local controller, wherein N and M are both natural numbers greater than 1, wherein at least one of the M power converters is a main power converter, and at least one is a slave power a converter that controls the local control signals that are turned on and off from a power semiconductor switch at the same position of the power converter, each of the power units further comprising: a main sampling circuit configured to separately acquire the a sum of a positive DC bus voltage and a negative DC bus voltage of the main power converter, or a sum of a positive DC bus voltage of the main power converter and a negative bus voltage; and a slave sampling circuit configured to separately acquire the slave power a sum of a positive DC bus voltage of the converter and a negative DC bus voltage, and wherein the local controller corresponding to the power unit is configured to include: a sampling conditioning circuit configured to acquire the master The positive DC bus voltage of the power converter and the negative DC bus voltage, or the sum of the positive DC voltage and the negative DC voltage And the power converter from a positive DC voltage and a negative DC voltage and converted into a digital signal.

In some exemplary embodiments of the present invention, when the number of the main power converters is one and the number of the slave power converters is M-1, the slave power converters are distributed at the main power. Both sides of the converter.

In some exemplary embodiments of the invention, the sampling conditioning circuit further includes a sampling reference point, the sampling reference point being disposed at the main power converter.

In some exemplary embodiments of the present invention, the sampling reference point is disposed at a positive terminal of a DC bus capacitor of the main power converter, or a negative terminal of a DC bus capacitor of the main power converter, or The midpoint of the DC bus capacitance of the main power converter.

In some exemplary embodiments of the present invention, when the number of the main power converters is one and the number of the slave power converters is M-1, the main sampling circuit includes: a main DC bus positive terminal a sampler configured to be connected at one end to a positive terminal of the DC bus capacitor of the main power converter, and at the other end to a first end of the sampling conditioning circuit, the first end of the sampling conditioning circuit receiving the main a positive DC bus voltage of the power converter; and a main DC bus negative terminal sampler configured to have one end connected to the negative terminal of the DC bus capacitor of the main power converter, and the other end connected to the second end of the sampling conditioning circuit The second terminal of the sampling conditioning circuit receives a negative DC bus voltage of the main power converter, and the slave sampling circuit includes: M-1 slave DC bus positive terminal samplers, and the M-1 One-to-one correspondence from the power converters, wherein the M-1 slave DC bus positive terminal samplers are respectively configured to be connected at one end to the positive terminal of the corresponding DC bus capacitor of the slave power converter, and the other end is connected together And connected to the third end of the sampling conditioning circuit, the third end of the sampling conditioning circuit receives the sum of the positive DC bus voltages of the M-1 slave power converters; and M-1 slave DCs a busbar negative-end sampler, in one-to-one correspondence with the M-1 slave power converters, wherein the M-1 slave DC bus negative-end samplers are respectively configured to be connected at one end to the corresponding slave power converter a negative terminal of the DC bus capacitor, the other end being connected together and connected to the fourth end of the sampling conditioning circuit, the fourth end of the sampling conditioning circuit receiving the M-1 slave power converters The sum of the negative DC bus voltages.

In some exemplary embodiments of the present invention, when the number of the main power converters is two or more, and the number of the slave power converters is two or more, controlling the main power converter at the same position The local control signals are simultaneously turned on and simultaneously turned off by the power semiconductor switches.

In some exemplary embodiments of the present invention, the main sampling circuit includes: a plurality of main DC bus positive terminal samplers, one-to-one corresponding to the two or more main power converters, wherein the plurality of main DC bus bars The positive end samplers are respectively configured to connect one end of the corresponding positive end of the DC bus capacitor of the main power converter, and the other end is connected together and connected to the first end of the sampling conditioning circuit, the sampling conditioning circuit The first end receives a sum of positive DC bus voltages of the two or more main power converters; and a plurality of main DC bus negative end samplers, one-to-one corresponding to the two or more main power converters, wherein The plurality of main DC bus negative end samplers are respectively configured to be connected at one end to the negative end of the corresponding DC bus capacitor of the main power converter, and the other end is connected together and connected to the second end of the sampling conditioning circuit. The second end of the sampling conditioning circuit receives a sum of negative DC bus voltages of the main power converter, and the slave sampling circuit includes: a plurality of stream bus positive terminal samplers, and the Two or more slave power converters are in one-to-one correspondence, wherein the plurality of slave DC bus positive-end samplers are respectively configured to connect one end of the corresponding positive terminal of the DC bus capacitor of the slave power converter, and the other ends are connected together And connected to the third end of the sampling conditioning circuit, the third end of the sampling conditioning circuit receives the sum of the positive DC bus voltages of the two upper slave power converters; and the plurality of slave DC bus negative terminals a sampler, in one-to-one correspondence with the two or more slave power converters, wherein the plurality of slave DC bus negative terminal samplers are respectively configured to be connected at one end to a corresponding negative terminal of the DC bus capacitor of the slave power converter The other end is connected together and connected to the fourth end of the sampling conditioning circuit, and the fourth end of the sampling conditioning circuit receives the sum of the negative DC bus voltages of the two or more slave power converters.

In some exemplary embodiments of the invention, the sampling conditioning circuit includes a dual operational amplifier.

According to a third aspect of the present invention, a modular power supply system is provided, comprising: a main controller configured to output a main control signal; N local controllers, wherein each of the local controllers is Configuring to receive the main control signal to output at least one local control signal; and N power units in one-to-one correspondence with the N local controllers, wherein each of the power units includes a first end and a second end The second end of each of the power units is coupled to the first end of an adjacent one of the power units, each of the power units being configured to include M power converters, each of which is The power converter includes a third end and a fourth end, the fourth end of each of the power converters being coupled to the third end of an adjacent one of the power converters, and the first one The third end of the power converter is the first end of the power unit, and the fourth end of the Mth power converter is the second end of the power unit, each Power converter is configured Running according to the corresponding local control signal output by the local controller, wherein N and M are both natural numbers greater than 1, wherein the power semiconductor switches at the same position of the M power converters are controlled to be turned on and off. The local control signals are the same, each of the power units further includes: M sampling circuits configured to separately acquire a sum of a positive DC bus voltage and a negative DC bus voltage of the power converter, and the power The local controller corresponding to the unit is configured to include a sampling conditioning circuit configured to convert the sum of the sum of the positive DC voltages of the power converter and the negative DC voltage into a digital signal.

In some exemplary embodiments of the present invention, the sampling conditioning circuit further includes a sampling reference point, and when M is an odd number, the sampling reference point is set at (M+1)/2th of the power converters Or, when M is an even number, the sampling reference point is set at the M/2th or M/2+1th power converter.

In some exemplary embodiments of the present invention, when M is an odd number, the sampling reference point is set at a positive terminal of a DC bus capacitor of the (M+1)/2th power converter, or a DC bus capacitor The negative terminal, or the midpoint of the DC bus capacitor.

In some exemplary embodiments of the present invention, when M is an even number, the sampling reference point is set at a positive terminal of a DC bus capacitor of the M/2th power converter, or a negative terminal of the DC bus capacitor, Or the midpoint of the DC bus capacitor, or the sampling reference point is set at the positive terminal of the DC bus capacitor of the M/2+1th power converter, or the negative terminal of the DC bus capacitor, or the DC bus capacitor point.

In some exemplary embodiments of the present invention, two mutually connected resistors are connected in parallel across the DC bus capacitor of each of the power converters. When M is an odd number, the sampling reference point is set at the (M+) 1) / 2 connection points of the resistors at the power converter.

In some exemplary embodiments of the present invention, when M is an even number, two mutually connected resistors are connected in parallel across the DC bus capacitor of each of the power converters, and when M is an even number, the sampling reference point a connection point of two of the resistors at the M/2th power converter, or the sampling reference point is set at two (M/2+1)th of the power converters The connection point of the resistor.

In some exemplary embodiments of the present invention, the sampling circuit includes: M DC bus positive-end samplers, one-to-one corresponding to the M power converters, wherein the M DC bus positive-end samplers respectively a first end of the DC bus capacitor connected to the corresponding power converter, and the other end is connected together and connected to the first end of the sampling conditioning circuit, and the first end of the sampling conditioning circuit receives a sum of positive DC bus voltages of the M power converters; and M DC bus negative terminal samplers, one-to-one corresponding to the M power converters, wherein the M DC bus negative terminal samplers are respectively Configuring one end to connect the negative end of the corresponding DC bus capacitor of the power converter, the other end is connected together and connected to the second end of the sampling conditioning circuit, and the second end receiving end of the sampling conditioning circuit The sum of the negative DC bus voltages of the M power converters.

In some exemplary embodiments of the present invention, the modular power supply system is configured to further include: N auxiliary power sources in one-to-one correspondence with the N local controllers, wherein each of the auxiliary power sources is configured To provide power to the corresponding local controller.

In some exemplary embodiments of the present invention, the auxiliary power source is powered from an external power source, or the N auxiliary power sources are in one-to-one correspondence with the N power units, and each of the auxiliary power sources is configured to correspond The power unit is powered.

In some exemplary embodiments of the invention, the power converter is any one of an AC/DC converter, a DC/AC converter, and a DC/DC converter.

In some exemplary embodiments of the invention, the DC bus voltages of the M power converters are all the same, partially identical, or all different.

In some exemplary embodiments of the invention, the topologies of the M power converters are all identical, or partially identical.

In some exemplary embodiments of the present invention, the topology of the M power converters in each of the power units is a full bridge converter, a half bridge converter, and a neutral point controllable three-level conversion. One of a diode, a diode clamped three-level converter, a flying capacitor three-level converter, a full-bridge resonant converter, and a half-bridge resonant converter.

The invention can reduce the number of local controllers, optical fibers and auxiliary power sources by simplifying the structure by forming a plurality of power converters into one power unit and using a local controller, an optical fiber, and an auxiliary power source to control multiple power converters. Design, reduce costs and improve reliability.

The present invention simplifies the control circuit by sharing a local control signal at the same location of the power semiconductor switches at the same location of the power converters in the power unit.

The invention also improves the sampling accuracy of the DC bus voltage.

The invention is applicable to the topology of all AC/DC, DC/AC, DC/DC power converter connections and is widely used.

DRAWINGS

The above and other objects, features and advantages of the present invention will become more apparent from the embodiments of the invention.

1 is a schematic structural view of a three-phase SVG system in the prior art;

2 is a schematic diagram of a more specific three-phase SVG system in the prior art;

3 is a schematic diagram of an H-bridge circuit (topology) in the prior art;

4 is a schematic diagram of a single phase SVG in the prior art;

Figure 5 is a schematic diagram of an HVDC-Light system in the prior art;

Figure 6 is a block diagram of a modular power supply system in accordance with one embodiment of the present invention;

Figure 7 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 8 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 9 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 10 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 11 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 12 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 13 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 14 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 15 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 16 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 17 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 18 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 19 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 20 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

21 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 22 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

23 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 24 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 25 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 26 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 27 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

28 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 29 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 30 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 31 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

32 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 33 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 34 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 35 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 36 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

37 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 38 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 39 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Figure 40 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention;

Specific embodiment

Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments can be embodied in a variety of forms and should not be construed as being limited to the examples set forth herein; rather, these embodiments are provided to make the present invention more comprehensive and complete, and fully convey the concept of the example embodiments. To those skilled in the art. The drawings are only schematic representations of the invention and are not necessarily to scale. The same reference numerals in the drawings denote the same or similar parts, and the repeated description thereof will be omitted.

Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are set forth However, one skilled in the art will appreciate that the technical solution of the present invention may be practiced, and one or more of the specific details may be omitted, or other methods, components, devices, steps, etc. may be employed. In other instances, well-known structures, methods, apparatus, implementations, or operations are not shown or described in detail to avoid obscuring aspects of the invention.

Figure 6 is a block diagram of a modular power system in accordance with one embodiment of the present invention. As shown in FIG. 6, the power electronic converter of the present invention is configured to include: a main controller 90, N local controllers 91, N auxiliary power sources 93, and N power units 70, where N is greater than one. Natural number.

The main controller 90 is configured to output a main control signal. The primary control signal is, for example, one or more parameters that are set to control the overall operational state of the modular power system.

Each local controller 91 is configured to receive the aforementioned primary control signal to output at least one local control signal. The local control signal is, for example, one or more parameters that are set to control the overall operational state of the corresponding power unit 70, or a local control signal is used to control the operational state of a portion of the power converters in the corresponding power unit 70.

N auxiliary power sources 93 are in one-to-one correspondence with N local controllers 91, each of which is configured to provide power to a corresponding local controller 91.

N power unit 70 and local controllers 91 of the N-one correspondence, each of the power unit 70 includes a first end and a second end X ₁ X _2, each of the second end of the power unit 70 is connected to the adjacent X ₂ The first end X _{1 of} one power unit 70, that is, the second end X ₂ of one of the adjacent two power units 70 is coupled to the first end X _{1 of the} other.

Each power unit 70 is configured to include M power converters 701, each of which includes a third end X ₃ and a fourth end X ₄ , each of which is coupled to a fourth end X ₄ o a third terminal 701 of power converter X _3. That is, the fourth end X ₄ of one of the adjacent two power converters 701 is connected to the third end X _{3 of the} other. M is a natural number greater than one. Thus, the third end X _{3 of} the first power converter 701 is the first end X _{1 of} the power unit 70, and the fourth end X _{4 of} the Mth power converter 701 is the second end of the power unit 70. X _2. Each power converter 701 is configured to operate in accordance with a local control signal output by a corresponding local controller 91.

As an embodiment of the present invention, the aforementioned main control signal can be transmitted between the main controller 90 and each of the local controllers 91 via an optical isolation device, such as an optical fiber 94. In other embodiments, the main controller 90 and each local controller 91 can be connected by a magnetic isolation device, such as an isolation transformer, and the connection between the main controller 90 and each local controller 91 is not only Limited to the above connection method.

The power electronic device of the present invention can be applied to fields such as SVG, MVD, HVDC-Light, and wind power generation systems.

As shown in FIG. 6, the present invention proposes to synthesize M power converters 701 into one power unit 70. One power unit 70 is provided with a local controller 91, an optical fiber 94 and an auxiliary power source 93, that is, a set of local controllers 91. The fiber 94 and the auxiliary power source 93 control the M power converters 701. In the conventional solution, each power unit 40, that is, the power converter, needs to be configured with a local controller 51, an optical fiber 54 and an auxiliary power supply 53. Compared with the conventional solution, the modular power supply system proposed by the present invention needs to be configured. The number of local controllers 91, fibers 94, and auxiliary power supplies 93 will be reduced to 1/M of the conventional solution. The invention greatly simplifies the structural design of the modular power supply system, and the cost is also significantly reduced, and the reliability is greatly improved.

The present invention does not limit the DC bus voltage of each power converter 701. The DC bus voltages of the M power converters 701 in the modular power supply system of the present invention may all be the same, partially identical, or all different. Based on Figure 6, Figure 7 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 7, the DC bus voltages of the M power converters 701 in the power unit 70 may be V ₁ , V ₂ . . . , and V _M , respectively, where V ₁ , V ₂ . . . , and V _M may all be the same. That is, V ₁ =V ₂ =...=V _M , which may also be partially the same V ₁ =V ₂ , V ₁ ≠V _M , or all different, that is, V ₁ ≠V ₂ ≠...≠V _M .

The present invention also does not limit the topology used in each power converter 701. The M power converters 701 in the modular power system of the present invention may be in an AC/DC converter, a DC/AC converter, and a DC/DC converter. Either of these, the power converter 701 in Figure 7 represents any of all applicable AC/DC, DC/AC, and DC/DC topologies. The present invention does not limit the topology used in the M power converters 701. The topology of the M power converters may be all the same, or partially identical. For example, the topology of the M power converters 701 in each power unit 70 of the modular power supply system of the present invention may all be a full bridge converter, a half bridge converter, and a neutral point controllable three level converter. One of a diode clamped three-level converter, a flying capacitor three-level converter, a full-bridge resonant converter, and a half-bridge resonant converter. Or for example, the topology of the M power converters 701 in each power unit 70 in the modular power system of the present invention may be a full bridge converter, a half bridge converter, a neutral point controllable three level converter A combination of two or more of a diode clamped three-level converter, a flying capacitor three-level converter, a full-bridge resonant converter, and a half-bridge resonant converter.

As shown in FIG. 6 and FIG. 7, each power unit 70 in the modular power supply system of the present embodiment may include: M driving circuits 702, which are in one-to-one correspondence with M power converters 701, wherein each driving circuit 702 is configured to be connected to a power semiconductor switch in the corresponding power converter 701, receive and according to at least one local control signal output by the corresponding local controller 91, to output at least one driving signal to drive the corresponding M power converters The power semiconductor switch in 701 is turned on and off.

In other embodiments, each power unit in the modular power system can include: a plurality of drive circuits, the number of the plurality of drive circuits being equal to the number of power semiconductor switches in the power unit, each drive circuit being configured to be a sexual connection And corresponding to the power semiconductor switch, receiving and outputting a driving signal according to the corresponding local control signal to drive the corresponding power semiconductor switch to be turned on and off.

Figure 8 is a block diagram of a modular power system in accordance with another embodiment of the present invention. As shown in FIG. 8, the topology of the M power converters 701 of each power unit 70 in the modular power supply system of the present embodiment employs a full bridge converter, such as an H bridge circuit. Each H-bridge circuit 701 includes four power semiconductor switches and a DC bus capacitor, and four power semiconductor switches form two bridge arms. For convenience of explanation, four power semiconductor switches are respectively defined as an upper power semiconductor switch of a bridge arm, a lower power semiconductor switch, an upper power semiconductor switch of the other bridge arm, and a lower power semiconductor switch, wherein one end of the upper power semiconductor switch of one of the bridge arms is connected to one end of the upper power semiconductor switch of the other bridge arm and one end of the DC bus capacitor, The other end of the lower power semiconductor switch of one bridge arm is connected to the other end of the lower power semiconductor switch of the other bridge arm and the other end of the DC bus capacitor, and the upper power semiconductor switch of one bridge arm and the lower power semiconductor switch are connected to the third end X ₃ , the upper power semiconductor switch of the other bridge arm and the lower power semiconductor switch are connected to the fourth end X ₄ . Taking the Mth power converter 70 as an example, the power converter 701 includes two bridge arms and a DC bus capacitor, and one end of the upper power semiconductor switch Q _M1 of one bridge arm is connected to the upper power semiconductor switch Q _{M3 of the} other bridge arm. One end and one end of the DC bus capacitor C _B , the other end of the lower power semiconductor switch Q _M2 of one bridge arm is connected to the other end of the lower power semiconductor switch Q _M4 of the other bridge arm and the other end of the DC bus capacitor C _B , one The connection point between the upper power semiconductor switch Q _{M1 of the} bridge arm and the lower power semiconductor switch Q _M2 is the third end X ₃ , and the connection point of the upper power semiconductor switch Q _{M3 of the} other bridge arm and the lower power semiconductor switch Q _M4 is the fourth End X ₄ .

In the present embodiment, each of the power unit 70 of an H-bridge circuit 701 of the third terminal X ₃ for the power unit of the first end 70 of the X _1, the first H-bridge circuit 701 a fourth terminal X _{4 is} connected to the third end X _{3 of the} second H-bridge circuit 701, and so on, the fourth end X _{4 of} the M-1th H-bridge circuit 701 is connected to the third end X _{3 of} the M-th H-bridge circuit 701, The fourth end X _{4 of} the Mth power converter is the second end X _{2 of} the power unit 70.

The local controller 91 corresponding to each power unit 70 outputs at least one local control signal for controlling the turning on and off of the power semiconductor switches in the corresponding H-bridge circuit 701. In this embodiment, each H-bridge circuit 701 requires four local control signals to respectively control the corresponding power semiconductor switches to be turned on and off, and each power unit 70 requires 4×M local control signals, that is, local control. The device needs to output 4×M local control signals for controlling the on and off of the corresponding power semiconductor switches, that is, the power semiconductor switches Q ₁₁ -Q _M4 all need a corresponding local control signal.

As shown in FIG. 8, each power unit 70 further includes M driving circuits 702. The driving circuit 702 is in one-to-one correspondence with M H-bridge circuits 701. Each driving circuit 702 receives a corresponding local control signal and outputs at least one driving. The signals respectively drive the on and off of the corresponding power semiconductor switches. Specifically, each of the driving circuits 702 receives the corresponding four local control signals, and outputs four driving signals to respectively drive the corresponding power semiconductor switches. The driving circuit 702 corresponding to the first H-bridge circuit 701 is taken as an example, and the driving circuit outputs four driving signals for driving the power semiconductor switches Q ₁₁ -Q ₁₄ to be turned on and off, respectively.

In other embodiments, each power unit 70 further includes a plurality of driving circuits, the number of driving circuits is equal to 4×M, each driving circuit is connected to a corresponding one of the power semiconductor switches, and receives a corresponding local control signal for output. A driving signal drives the turn-on and turn-off of the corresponding power semiconductor switch. Taking the four driving circuits corresponding to the first H-bridge circuit 701 as an example, the four driving circuits are respectively connected to the power semiconductor switches Q ₁₁ -Q ₁₄ and Each of the drive circuits outputs a drive signal to drive the corresponding power semiconductor switches Q _{M1 -} Q _M4 to be turned on and off.

9 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 9, the topology of the M power converters 701 of each power unit 70 in the modular power supply system of the present embodiment employs a half bridge converter. Each of the half bridge converters 701 includes two power semiconductor switches and a DC bus capacitor, the connection relationship of which is as shown in FIG. One end of a power semiconductor is connected to one end of the DC bus capacitor, the other end is connected to one end of another power semiconductor switch, and the other end of the other power semiconductor switch is connected to the other end of the DC bus capacitor C _B . The connection point at which the two power semiconductor switches are connected to each other is the third end X ₃ , and the other end of the other power semiconductor switch is the fourth end X ₄ . Taking the first power converter 70 as an example, the power converter 701 includes two power semiconductor switches Q ₁₁ , Q ₁₂ and a DC bus capacitor C _B . The power semiconductor switch end Q at one end ₁₁ is connected to the DC bus capacitor C _B, the power semiconductor switch and the other end Q ₁₁ is connected to the power semiconductor switch end Q _{12 is,} the power semiconductor switch and the other end Q _{12 is} connected to the DC bus capacitor C _B At the other end, the connection point of the power semiconductor switch Q ₁₁ and the power semiconductor switch Q ₁₂ is the third end X ₃ of the first power converter 701, and the other end of the power semiconductor switch Q ₁₂ is the first power converter 701. Fourth end X ₄ .

In this embodiment, the third end X ₃ of the first half bridge converter in each power unit 70 is the first end X ₁ of the power unit 70, and the fourth end X _{4 of the} first half bridge converter is connected. The third end X _{3 of the} second half bridge converter, and so on, the fourth end X _{4 of} the M-1 half bridge converter is connected to the third end X ₃ of the Mth half bridge converter, the Mth The fourth end X ₄ of the half bridge converter is the second end X ₂ of the power unit 70.

In this embodiment, the local controller corresponding to each power unit 70 can output 2×M local control signals for controlling the turning on and off of the power semiconductor switches Q ₁₁ -Q _M2 in the half bridge converter 701. That is, both the power semiconductor switches Q ₁₁ -Q _M2 require a local control signal.

As shown in FIG. 9, each power unit 70 further includes M driving circuits 702. The driving circuit 702 is in one-to-one correspondence with M half-bridge converters 701. Each driving circuit 702 receives a corresponding local control signal and outputs at least one. The driving signals respectively drive the turning on and off of the corresponding power semiconductor switches. Specifically, each driving circuit 702 receives the corresponding two local control signals, and outputs two driving signals to respectively drive the corresponding power semiconductor switches. Turning on and off, taking the driving circuit 702 corresponding to the first half-bridge converter 701 as an example, the driving circuit outputs two driving signals to drive the power semiconductor switches Q ₁₁ -Q ₁₂ to be turned on and off, respectively.

In other embodiments, each power unit 70 further includes a plurality of driving circuits, the number of driving circuits being equal to 2×M, each driving circuit is electrically connected to a corresponding one of the power semiconductor switches, and receiving a corresponding local control signal to A driving signal is output to drive the corresponding power semiconductor switch to be turned on and off. Taking two driving circuits corresponding to the first half-bridge converter 701 as an example, the two driving circuits are respectively connected to the power semiconductor switch Q ₁₁ -Q ₁₂ and each of the drive circuits outputs a drive signal to drive the on and off of the corresponding power semiconductor switches Q ₁₁ -Q ₁₂ .

Figure 10 is a block diagram of a modular power system in accordance with another embodiment of the present invention. As shown in FIG. 10, the topology of the M power converters 701 of each power unit 70 in the modular power supply system of the present embodiment employs a neutral point controllable three-level converter. Each of the neutral point controllable three-level converters 701 includes eight power semiconductor switches and two DC bus capacitors, the connection relationship of which is shown in FIG. Taking the first power converter 701 as an example, one end of the power semiconductor switch Q ₁₁ is connected to one end of the DC bus capacitor C ₁ and one end of the power semiconductor switch Q ₁₅ , and the other end of the DC bus capacitor C ₁ is connected to the DC bus . one end of the capacitor C, the power semiconductor switches ₂ Q ₁₁ and the other end is connected to one end of the power semiconductor switch Q _12, Q ₁₁ and the power semiconductor switch of the power semiconductor switch Q is connected to a first point ₁₂ to a third terminal 701 of the power converter X ₃ , the other end of the power semiconductor switch Q ₁₂ is connected to the other end of the DC bus capacitor C _{2 and} the other end of the power semiconductor switch Q ₁₆ , and the other end of the power semiconductor switch Q ₁₅ is connected to one end of the power semiconductor switch Q ₁₆ , the power Q semiconductor switch ₁₅ and the power semiconductor switch ₁₆ is connected to the point Q 1 a first terminal 701 of the power converter of the fourth X _4, Q _{13 is} an end of the power semiconductor switch is connected to the other end of the DC bus capacitor C _1, the power semiconductor switches Q the other end ₁₃ is connected to one end of the power semiconductor switch Q _14, the other end of the power semiconductor switch Q ₁₄ connected to the other end of the power semiconductor switch Q _11, the work Of the semiconductor switch end _{Q. 17} is connected to the other end of the DC bus capacitor C _1, the power semiconductor switch and the other end _{Q. 17} is connected to the power semiconductor switch end Q _{18 is,} the power semiconductor switch and the other end Q _{18 is} connected to the power semiconductor switches Q the other end _15.

In this embodiment, the third end X ₃ of the first neutral point controllable three-level converter in each power unit 70 is the first end X ₁ of the power unit 70, and the first neutral point is controllable. three-level converter is connected to a fourth end of the second X ₄ controllable neutral point of three-level converter to the third terminal X _3, and so on, the M-1 first controllable three-level neutral point inverter The fourth end X _{4 is} connected to the third end X ₃ of the Mth neutral point controllable three-level converter, and the fourth end X ₄ of the Mth neutral point controllable three-level converter is the power unit 70 The second end of X ₂ .

In this embodiment, the local controller corresponding to each power unit can output 8×M local control signals for controlling the power semiconductor switches Q ₁₁ -Q _M8 in the neutral point controllable three-level converter 701. Turning on and off, that is, both power semiconductor switches Q ₁₁ -Q _M8 require a local control signal.

As shown in FIG. 10, each power unit 70 further includes M driving circuits 702. The driving circuit 702 is in one-to-one correspondence with M neutral point controllable three-level converters 701, and each driving circuit 702 receives corresponding local control. And outputting at least one driving signal to respectively drive on and off of the corresponding power semiconductor switch. Specifically, each driving circuit 702 receives corresponding 8 local control signals, and outputs 8 driving signals to respectively drive The driving circuit 702 corresponding to the first neutral point controllable three-level converter 701 is taken as an example, and the driving circuit outputs eight driving signals to respectively drive the power semiconductor switch Q. _{11 -} Q ₁₈ is turned on and off.

In other embodiments, each power unit 70 further includes a plurality of driving circuits, the number of driving circuits is equal to 8×M, each driving circuit is connected to a corresponding one of the power semiconductor switches, and receives a corresponding local control signal to output one. The driving signal drives the corresponding power semiconductor switch to be turned on and off. The eight driving circuits corresponding to the first neutral point controllable three-level converter 701 are taken as an example, and the eight driving circuits are respectively connected to the power semiconductor switch. Q _{11 -} Q ₁₈ and each drive circuit outputs a drive signal to drive the corresponding power semiconductor switches Q _{11 -} Q ₁₈ on and off.

11 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 11, the topology of the M power converters 701 of each power unit 70 in the modular power supply system of the present embodiment employs a diode clamped three-level converter. Each of the diode clamped three-level converters 701 includes eight power semiconductor switches, four clamp diodes, and two DC bus capacitors, the connection relationship of which is shown in FIG. Taking the first power converter 701 as an example, one end of the power semiconductor switch Q ₁₁ is connected to one end of the DC bus capacitor C ₁ and one end of the power semiconductor switch Q ₁₅ , and the other end of the power semiconductor switch Q ₁₁ is connected to the power semiconductor switch Q one end of the cathode ₁₂ and the clamp diode D _1, the other end of the power semiconductor switch Q ₁₂ connected to one end of the power semiconductor switch _{13 is} Q, and the other end of the power semiconductor switch Q _{13 is} connected to the power semiconductor switch Q and one end of the clamp ₁₄ The anode of the diode D ₂ , the other end of the DC bus capacitor C ₁ is connected to one end of the DC bus capacitor C ₂ , and the other end of the power semiconductor switch Q ₁₄ is connected to the other end of the DC bus capacitor C ₂ , and the anode of the clamp diode D ₁ Connected to the cathode of the clamp diode D ₂ and the other end of the DC bus capacitor C ₁ , the connection point of the power semiconductor switch Q ₁₂ and the power semiconductor switch Q ₁₃ is the third end X ₃ of the first power converter 701, the power semiconductor the other terminal of the switch Q ₁₅ connected to the cathode of the power semiconductor switch Q and one end of the clamp diode D ₁₆ _3, the other end of the power semiconductor switch ₁₆ is connected to the power Q half One end Q of the switch _{body. 17,} the other end of the power semiconductor _{switch. 17} Q is connected to the power semiconductor switch Q and one end of the clamp diode D ₁₈ of the anode _4, the other end of the power semiconductor switch Q _{18 is} connected to the DC bus capacitor C another ₂ At one end, the anode of the clamp diode D ₃ is connected to the cathode of the clamp diode D ₄ and the other end of the DC bus capacitor C ₁ , and the connection point of the power semiconductor switch Q ₁₆ and the power semiconductor switch Q ₁₇ is the first power converter 701 The fourth end of the X ₄ .

In this embodiment, the third end X ₃ of the first diode clamped three-level converter in each power unit 70 is the first end X ₁ of the power unit 70, and the first diode clamps three-level conversion. The fourth end X _{4 of the device is} connected to the third end X _{3 of the} second diode clamp three-level converter, and so on, and the fourth end of the M-1 diode clamp three-level converter is connected by X ₄ The third end X ₃ of the M diode clamped three-level converter, the fourth end X ₄ of the Mth diode clamped three level converter is the second end X ₂ of the power unit 70.

As shown in FIG. 11, each power unit 70 further includes M driving circuits 702. The driving circuit 702 is in one-to-one correspondence with M diode-clamped three-level converters 701, and each driving circuit 702 receives a corresponding local control signal. And outputting at least one driving signal to respectively drive on and off of the corresponding power semiconductor switch. Specifically, each driving circuit 702 receives corresponding eight local control signals, and outputs eight driving signals to respectively drive corresponding ones. For example, the driving circuit 702 corresponding to the first diode clamped three-level converter 701 is used as an example. The driving circuit outputs eight driving signals to respectively drive the power semiconductor switches Q ₁₁ -Q _{18 .} Turn on and off.

In other embodiments, each power unit 70 further includes a plurality of driving circuits, the number of driving circuits is equal to 8×M, each driving circuit is connected to a corresponding one of the power semiconductor switches, and receives a corresponding local control signal to output one. The driving signal drives the corresponding power semiconductor switch to be turned on and off. The eight driving circuits corresponding to the first diode clamped three-level converter 701 are taken as an example, and the eight driving circuits are respectively connected to the power semiconductor switch Q _{11 .} -Q ₁₈ and each of the drive circuits outputs a drive signal to drive the on and off of the corresponding power semiconductor switches Q ₁₁ -Q ₁₈ .

Figure 12 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 12, the topology of the M power converters 701 of each power unit 70 in the modular power supply system of the present embodiment employs a flying capacitor three-level converter. Each of the flying capacitor three-level converters 701 includes eight power semiconductor switches, two DC bus capacitors, and two flying capacitors, the connection relationship of which is shown in FIG. Taking the first power converter 701 as an example, one end of the power semiconductor switch Q ₁₁ is connected to one end of the DC bus capacitor C ₁ and one end of the power semiconductor switch Q ₁₅ , and the other end of the power semiconductor switch Q ₁₁ is connected to the power semiconductor switch Q and one end of the flying capacitor C ₁₂ at one end, the power semiconductor ₃ switches the other end Q _{12 is} connected to the power semiconductor switch end Q _{13 is,} the power semiconductor switch and the other end Q _{13 is} connected to the power semiconductor switch Q and one end of the fly ₁₄ cross the other end of capacitor C _3, the other end of the DC bus capacitor _{C. 1} is connected to the DC bus capacitor C one end of the power semiconductor ₂ switch and the other end Q ₁₄ is connected to the other end of the DC bus capacitor C _2, the power semiconductor switch Q ₁₂ and The connection point of the power semiconductor switch Q ₁₃ is the third end X ₃ of the first power converter 701, and the other end of the power semiconductor switch Q ₁₅ is connected to one end of the power semiconductor switch Q ₁₆ and one end of the flying capacitor C ₄ , the power the other end of the semiconductor switch Q ₁₆ connected to one end of the power semiconductor switch Q _17, the other end of the power semiconductor switch Q ₁₇ is connected to one end of the power semiconductor switch Q ₁₈ of The other end of the flying capacitor C4, the other end of the power semiconductor switch Q _{18 is} connected to the other end of the DC bus capacitor C _2, the power semiconductor switch Q ₁₆ Q is connected to the power semiconductor switch ₁₇ as a first point of a power converter 701 Fourth end X ₄ .

In this embodiment, the third end X ₃ of the first flying capacitor three-level converter in each power unit 70 is the first end X ₁ of the power unit 70, and the first flying capacitor three-level conversion The fourth end X _{4 of the device is} connected to the third end X _{3 of the} second flying capacitor three-level converter, and so on, and the fourth end X _{4 of} the M-1 flying capacitor three-level converter is connected. M flying capacitor a three-level converter to the third terminal of X _3, M-th three-level flying capacitor inverter X ₄ is a fourth end of the power unit of the second end 70 of X _2.

In this embodiment, the local controller corresponding to each power unit can output 8×M local control signals for controlling the power semiconductor switches Q ₁₁ -Q _M8 in the neutral point controllable three-level converter 701. turned on and off, i.e., the power semiconductor switch Q ₁₁ -Q _M8 require a local control signal.

As shown in FIG. 12, each power unit 70 further includes M driving circuits 702. The driving circuit 702 is in one-to-one correspondence with M flying capacitor three-level converters 701, and each driving circuit 702 receives a corresponding local control signal. And outputting at least one driving signal to respectively drive on and off of the corresponding power semiconductor switch. Specifically, each driving circuit 702 receives corresponding eight local control signals, and outputs eight driving signals to respectively drive corresponding ones. For example, the driving circuit 702 corresponding to the first flying capacitor three-level converter 701 is used to drive the power semiconductor switch Q ₁₁ -Q _{18 respectively.} Turn on and off.

In other embodiments, each power unit 70 further includes a plurality of driving circuits. The number of driving circuits is equal to 8×M. Each driving circuit receives a corresponding local control signal and outputs a driving signal to drive the corresponding power semiconductor switch. For example, eight driving circuits corresponding to the first flying capacitor three-level converter 701 are connected, and eight driving circuits are respectively connected to the power semiconductor switches Q _{11 -} Q ₁₈ and each driving circuit outputs a corresponding drive signal to the power semiconductor switch Q ₁₁ -Q ₁₈ is turned on and off.

The M power converters 701 in the modular power supply system of FIGS. 8-12 may be an AC/DC converter or a DC/AC converter, but not limited thereto. It can be a converter of other topology.

Figure 13 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 13, the topology of the M power converters 701 of each power unit 70 in the modular power supply system of the present embodiment employs a full bridge resonant converter. Each of the full-bridge resonant converters 701 includes a full-bridge circuit, a resonant circuit, a transformer, and a rectifier bridge, the connection relationship of which is as shown in FIG. In the first full-bridge resonant converter 701 as an example, the full bridge circuit comprising four power semiconductor switch and a DC bus capacitor, one end of the power semiconductor switch Q ₁₁ connected to the DC bus capacitor C _B 'and one end of the power semiconductor switches Q One end ₁₃ of the power semiconductor switch and the other end Q ₁₁ is connected to the power semiconductor switch end Q ₁₂ of the power semiconductor switch and the other end Q ₁₂ is connected to the DC bus capacitor C _B 'and the other end of the power semiconductor switch and the other end Q ₁₄ of The connection point of the power semiconductor switch Q ₁₁ and the power semiconductor switch Q ₁₂ is connected to one end of the resonant circuit formed by the capacitor C' and the inductor L', and the other end of the resonant circuit is connected to one end of the primary coil of the transformer T', and the transformer T The other end of the primary coil is connected to the connection point of the power semiconductor switch Q ₁₃ and the power semiconductor switch Q ₁₄ , and the aforementioned end of the DC bus capacitor C _B ' is the third end X _{3 of the} first power converter, the DC bus capacitance C _B 'to the other end of the power converter of a fourth end X _4, the rectifier bridge comprising four rectifier diode, the rectifying diode D _1' is connected to one end of the rectifier diodes The other end of the other end of the other end of the D ₃ 'end, a rectifying diode D _1' is connected to a rectifier diode D ₂ 'end, a rectifying diode D _3' connected to a rectifying diode D ₄ 'end, a rectifying diode D _2' is connected to a rectifier The other end of the diode D ₄ ', the first end of the rectifier diode D ₁ ' is the fifth end X ₅ of the converter, the other end of the rectifier diode D ₂ ' is the sixth end X ₆ of the converter, and the output ends of the transformer T' are respectively Connected to the connection point of the rectifier diode D ₁ ' and the rectifier diode D ₂ ' and the connection point of the rectifier diode D ₃ ' and the rectifier diode D ₄ ', wherein the transformer T' can be a center tap transformer with two secondary coils, two The secondary windings are connected in parallel, and the transformer T' may also have a single secondary winding.

In an embodiment, the third end X ₃ of the first full bridge resonant converter in each power unit 70 is the first end X ₁ of the power unit 70 and the fourth end X _{4 of the} first full bridge resonant converter Connecting the third end X _{3 of the} second full-bridge resonant converter, and so on, the fourth end X _{4 of} the M-1 full-bridge resonant converter is connected to the third end X _{3 of} the M-th full-bridge resonant converter The fourth end X ₄ of the Mth full-bridge resonant converter is the second end X ₂ of the power unit 70. The fifth end X ₅ of all of the full bridge resonant converters in each power unit 70 are connected together, and the sixth end X _{6 is} connected together.

In this embodiment, the local controller corresponding to each power unit can output 4×M local control signals for controlling the turn-on and turn-off of the power semiconductor switches Q ₁₁ -Q _M4 in the full-bridge resonant converter 701. That is, the power semiconductor switches Q ₁₁ -Q _M4 each require a local control signal.

As shown in FIG. 13, each power unit 70 further includes M driving circuits 702. The driving circuit 702 is in one-to-one correspondence with M full-bridge resonant converters 701. Each driving circuit 702 receives a corresponding local control signal and outputs at least a driving signal respectively driving the corresponding power semiconductor switches to be turned on and off. Specifically, each driving circuit 702 receives corresponding four local control signals, and outputs four driving signals to respectively drive corresponding power semiconductor switches. the turned on and off, the drive circuit 702 to a first full-bridge resonant converter 701 corresponding to an example, the driving circuit 4 outputs the driving signals driving the power semiconductor switch Q ₁₁ -Q ₁₄ is turned on and off .

In other embodiments, each power unit 70 further includes a plurality of driving circuits, the number of driving circuits is equal to 4×M, each driving circuit is connected to a corresponding one of the power semiconductor switches, and receives a corresponding local control signal to output one. The driving signal drives the corresponding power semiconductor switch to be turned on and off. Taking the four driving circuits corresponding to the first full-bridge resonant converter 701 as an example, the four driving circuits are respectively connected to the power semiconductor switch Q ₁₁ -Q _{14 .} And each of the driving circuits outputs a driving signal to drive the on and off of the corresponding power semiconductor switches Q ₁₁ -Q ₁₄ .

Figure 14 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 14, the topology of the M power converters 701 of each power unit 70 in the modular power supply system of the present embodiment employs a half bridge resonant converter. Each of the half-bridge resonant converters 701 includes a half bridge circuit, a resonant circuit, a transformer, and a rectifier bridge, the connection relationship of which is as shown in FIG. Taking the first half-bridge resonant converter 701 as an example, the half-bridge circuit includes two power semiconductor switches and one DC bus capacitor. One end of the power semiconductor switch Q ₁₁ is connected to one end of the DC bus capacitor C _B ', and the power semiconductor switch Q the other end ₁₁ is connected to the power semiconductor switch end Q _12, the power semiconductor switch other ends Q ₁₂ is connected to the DC bus capacitor C _B ', the power semiconductor switch Q ₁₁ of the power semiconductor switch Q is connected to the point ₁₂ is connected to the 'One end of the primary coil of the transformer T''L and the inductance' end of the resonance circuit composed of the other end of the resonance circuit of the capacitor C is connected to the transformer T, the other end of the primary coil is connected to the power semiconductor switch of another Q ₁₂ of At one end, one end of the DC bus capacitor C _B ' is the third end X ₃ of the first power converter, and the other end of the DC bus capacitor C _B ' is the fourth end X _{4 of the} first power converter, and the rectifier bridge includes four rectifying diodes, the rectifying diode D ₁ 'is connected to one end of the rectifying diode D _3' end, a rectifying diode D ₁ 'and the other end is connected to a rectifier diode D _2' end, a rectifying diode D ₃ 'of the other One end is connected to one end of the rectifier diode D ₄ ', the other end of the rectifier diode D ₂ ' is connected to the other end of the rectifier diode D ₄ ', and one end of the rectifier diode D ₁ ' is the fifth end X ₅ of the converter, and the rectifier diode D ₂ ' The other end is the sixth end X ₆ of the converter, and the output of the transformer T' is respectively connected to the connection point of the rectifier diode D ₁ ' and the rectifier diode D ₂ ' and the connection of the rectifier diode D ₃ ' and the rectifier diode D ₄ ' Point, wherein the transformer T' may be a center tapped transformer having two secondary windings, the two secondary windings being connected in parallel, and the transformer T' may also have a single secondary winding.

In this embodiment, the third end X ₃ of the first half-bridge resonant converter in each power unit 70 is the first end X ₁ of the power unit 70, and the fourth end X of the first half-bridge resonant converter ₄ half-bridge resonant converter connected to the second terminal of the third X _3, and so on, the fourth terminal ₄ is connected to the M-X half-bridge resonant converter of a third terminal of the first X M-1 half-bridge resonant converter _3. The fourth end X ₄ of the Mth half-bridge resonant converter is the second end X ₂ of the power unit 70. The fifth ends X ₅ of all of the half-bridge resonant converters in each power unit 70 are connected together, and the sixth ends X _{6 are} connected together.

In this embodiment, the local controller corresponding to each power unit can output 2×M local control signals for controlling the turn-on and turn-off of the power semiconductor switches Q ₁₁ -Q _M2 in the half-bridge resonant converter 701. That is, both the power semiconductor switches Q ₁₁ -Q _M2 require a local control signal.

As shown in FIG. 14, each power unit 70 further includes M driving circuits 702. The driving circuit 702 is in one-to-one correspondence with M half-bridge resonant converters 701. Each driving circuit 702 receives a corresponding local control signal and outputs at least a driving signal respectively driving on and off of the corresponding power semiconductor switch, specifically, each driving circuit 702 receives corresponding two local control signals, and outputs two driving signals to respectively drive corresponding power semiconductor switches For example, the driving circuit 702 corresponding to the first half-bridge resonant converter 701 outputs two driving signals for driving the power semiconductor switches Q ₁₁ -Q ₁₂ to be turned on and off. .

In other embodiments, each power unit 70 further includes a plurality of driving circuits, the number of driving circuits is equal to 2×M, each driving circuit is connected to a corresponding one of the power semiconductor switches, and receives a corresponding local control signal and outputs one. The driving signal drives the turn-on and turn-off of the corresponding power semiconductor switch. Taking two driving circuits corresponding to the first half-bridge resonant converter 701 as an example, the two driving circuits are respectively connected to the power semiconductor switch Q ₁₁ -Q ₁₂ And each of the driving circuits outputs a driving signal to drive the on and off of the corresponding power semiconductor switches Q ₁₁ -Q ₁₂ .

The M power converters 701 in the modular power supply system of FIG. 13 and FIG. 14 may be DC/DC converters, but not limited thereto, and may be converters of other topologies.

Figure 15 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 15, the topology of the M power converters 701 of each power unit 70 in the modular power supply system of the present embodiment employs a combination of a full bridge converter and a half bridge converter. Each of the full bridge converter power converters 7011' includes four power semiconductor switches, each of which includes two power semiconductor switches, the connection relationship of which is shown in FIG. In this embodiment, the specific connection relationship of the full bridge converter is as shown in FIG. 8 , and the specific connection relationship of the half bridge converter is shown in FIG. 9 , and details are not described herein again. Similarly, the two adjacent power converter wherein a fourth end X ₃ X ₄ of the third terminal 701 is connected with another, wherein M is a natural number greater than 1. Thus, the third end X _{3 of} the first power converter 701 is the first end X _{1 of} the power unit 70, and the fourth end X _{4 of the} first power converter 701 is connected to the second power converter 701. The third end X ₃ , and so on, the fourth end X _{4 of} the M-1th power converter 701 is connected to the third end X ₃ of the Mth power converter 701, and the fourth end of the Mth power converter 701 X _{4 is} the second end X _{2 of} the power unit 70.

In this embodiment, the number of local control signals output by the local controller corresponding to each power unit 70 is equal to the number of power semiconductor switches in the power unit 70. These local control signals respectively control the full bridge converter and the half bridge converter 701. The power semiconductor switches are turned on and off, that is, each power semiconductor switch requires a local control signal.

As shown in FIG. 15, each power unit 70 further includes M driving circuits 702. The driving circuit 702 is in one-to-one correspondence with M power converters 7011' and 7012', and each driving circuit 702 receives a corresponding local control signal, and And outputting at least one driving signal to respectively drive on and off of the corresponding power semiconductor switch. Specifically, the driving circuit 702 corresponding to the power converter 7011 ′ receives the corresponding four local control signals, and outputs four driving signals. Driving the corresponding power semiconductor switch to turn on and off respectively, the corresponding driving circuit 702 of the power converter 7012' receives the corresponding two local control signals, and outputs two driving signals to respectively drive the corresponding power semiconductor switches to be turned on. And disconnected.

In other embodiments, each power unit 70 further includes a plurality of driving circuits. The number of driving circuits in the power unit is equal to the number of power semiconductor switches in the corresponding power unit, and each driving circuit is connected to a corresponding one of the power semiconductor switches. And receiving a corresponding local control signal to output a driving signal to drive the corresponding power semiconductor switch to turn on and off, taking the four driving circuits corresponding to the power converter 7011' as an example, the four driving circuits are respectively connected to correspond The power semiconductor switches and each of the driving circuits output a driving signal to drive the corresponding power semiconductor switches to be turned on and off, and the two driving circuits corresponding to the power converter 7012' are taken as an example, and the two driving circuits are respectively connected. Corresponding power semiconductor switches and each drive circuit outputs a drive signal to drive the corresponding power semiconductor switches on and off.

Although FIG. 15 only shows the topology of the M power converters 701 of each power unit 70 in the modular power supply system of the present embodiment, a combination of a full bridge converter and a half bridge converter is employed. However, the present invention is not limited thereto. As described above, the topology of the M power converters 701 in each of the power units 70 in the modular power supply system of the present invention may be a full bridge converter, a half bridge converter, or the like. A combination of two or more of a point-controllable three-level converter, a diode-clamped three-level converter, a flying capacitor three-level converter, a full-bridge resonant converter, and a half-bridge resonant converter.

In each of the power units 70 of the present embodiment, the power converter 701 employing the same topology may employ a "common drive." By "shared drive" is meant that the power semiconductor switches at the same location of each power converter 701 (or 7011' or 7012') employing the same topology can be controlled using the same local control signal. By "same position" is meant the position of the logically corresponding power semiconductor switch in the respective power converters 701 of the same topology (or 7011' or 7012') in the circuit diagram. For example, the power semiconductor switches Q ₁₁ , Q ₂₁ ... Q _M1 in the power converters 701 of the same topology in FIGS. 6-15 have the same position, and Q ₁₂ , Q ₂₂ ... Q _M2 have the same position, Q ₁₈ , Q ₂₈ ... Q _M8 have the same position, so the M power converters 701 in each of the power units 70 in FIGS. 8 to 14 can adopt "common drive". Based on the same principle, the power converters 7011' in each of the power cells 70 in FIG. 15 have the same topology, and thus these power converters 7011 can employ "common drive" with power conversion in each power unit 70. The switches 7012' have the same topology, and thus these power converters 7012' can employ "common drives."

By adopting the "common drive" driving method of the invention, the number of local control signals can be greatly reduced, and the circuit design of the local control can be simplified. 16 to 23 will further describe the driving mode of the "common drive" of the present invention of the present invention.

Figure 16 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. Figure 16 is an illustration of a power unit 70 based on Figure 8 and corresponding to Figure 8. As shown in FIG. 16, the topology of each power converter 701 of the same power unit 70 is a full bridge converter, such as an H bridge circuit. Taking the Mth H-bridge circuit as an example, the H-bridge circuit includes two bridge arms. For example, one bridge arm of the M-th H-bridge circuit includes an upper power semiconductor switch Q _M1 and a lower power semiconductor switch Q _M2 , and the other bridge arm The upper power semiconductor switch Q _M3 and the lower power semiconductor switch Q _{M4 are included} . The connection point of the upper power semiconductor switch Q _M1 and the lower power semiconductor switch Q _M2 is the third output terminal X ₃ of the Mth power converter 401. The connection point of the upper power semiconductor switch Q _M3 and the lower power semiconductor switch Q _M4 is the fourth output terminal X ₄ of the Mth power converter 401.

In the present embodiment, the third output terminal X _{3 of} one of the adjacent two power converters 701 is sequentially connected to the fourth output terminal X _{4 of the} other one. Specifically, the third output terminal X ₃ of the first H-bridge circuit is the first terminal X ₁ of the power unit 70, and the fourth output terminal X ₄ of the first H-bridge circuit and the second H-bridge circuit The three output terminals X _{3 are} connected in turn, and the fourth output terminal X ₄ of the M-1th H-bridge circuit is connected to the third output terminal X ₃ of the M-th H-bridge circuit, and the M-th H-bridge circuit is connected. The four output terminal X ₄ is the second terminal X ₂ of the power unit 70.

In the present embodiment, the local controller 91 outputs four local control signals. Each H-bridge circuit corresponds to a drive circuit 702. Each of the driving circuits 702 is coupled to the local controller 91, and is connected to the control terminals of the corresponding upper power semiconductor switch and the lower power semiconductor switch for receiving the above four local control signals output by the local controller 91, and is localized. The control signals are processed to produce respective four drive signals. For example, the generated four drive signals Y _M1 , Y _M2 , Y _{M3 ,} and Y _{M4 are} output to the control terminals of the upper power semiconductor switches Q _M1 and Q _M3 and the lower power semiconductor switches Q _M2 and Q _M4 in the Mth H-bridge circuit, It is used to drive the on and off of the upper power semiconductor switches Q _M1 and Q _M3 and the lower power semiconductor switches Q _M2 and Q _M4 .

In this embodiment, the local control signals corresponding to the power semiconductor switches of the same position of each H-bridge circuit are the same, for example, the upper power semiconductor switch Q ₁₁ and the second H-bridge circuit of the first H-bridge circuit. The upper power semiconductor switch Q ₂₁ , and so on, until the local control signal corresponding to the upper power semiconductor switch Q _M1 of the Mth H-bridge circuit is the same, that is, the same local control signal, that is, the driving circuit 702 outputs the corresponding driving signal Y ₁₁ , Y ₂₁ ... same Y _M1, so that the power semiconductor switches Q _11, Q ₂₁ ... Q _M1 simultaneously turned on and turned off simultaneously. Since the topology of each power converter 701 in the power unit 70 in this embodiment uses an H-bridge circuit, one power unit 70 requires only a local controller 91, an optical fiber 94, and an auxiliary power source 93. In this embodiment, the power semiconductor switches at the same position of the respective H-bridge circuits use the same local control signal, so that only one local control signal is required in one power unit 70.

Figure 17 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. 17 is an embodiment based on FIG. 9 and corresponding to one power unit 70 of FIG. As shown in FIG. 17, the topology of each of the power converters 70 in the same power unit 70 is a half bridge converter. Taking the Mth half-bridge converter as an example, the half-bridge converter includes one bridge arm 111. For example, the bridge arm 111 of the M-th half-bridge circuit includes an upper power semiconductor switch Q _M1 and a lower power semiconductor switch Q _M2 . A connection point of one end of the upper power semiconductor switch Q _M1 and the lower power semiconductor switch Q _M2 is a third output terminal X ₃ of the Mth power converter 701. The other end of the lower power semiconductor switch Q _M2 is the fourth output terminal X ₄ of the Mth power converter 701.

In the present embodiment, the third output terminal X _{3 of} one of the adjacent two power converters 701 is sequentially connected to the fourth output terminal X _{4 of the} other one. Specifically, the third output terminal X ₃ of the first half bridge converter is the first end X ₁ of the power unit 70, and the fourth output terminal X ₄ and the second half bridge of the first half bridge converter are transformed. The third output terminal X _{3 of the device is} connected and connected in turn, and the fourth output terminal X _{4 of} the M-1 half bridge converter is connected with the third output terminal X _{3 of} the Mth half bridge converter, the Mth the fourth output X ₄ is a half-bridge converter power unit 70 of the second end of X _2.

In the present embodiment, the local controller 91 outputs two local control signals. Each half bridge converter corresponds to a drive circuit 702. Each of the driving circuits 702 is coupled to the local controller 91 and is connected to the control terminals of the corresponding upper power semiconductor switch and the lower power semiconductor switch for receiving the two local control signals output by the local controller 91 and local The control signals are processed to produce respective two drive signals. For example, the generated two drive signals Y _M1 and Y _{M2 are} output to the control terminals of the upper power semiconductor switch Q _M1 and the lower power semiconductor switch Q _M2 in the Mth half-bridge converter for driving the upper power semiconductor switch Q _M1 and the lower The power semiconductor switch Q _M2 is turned on and off.

In this embodiment, the local control signals corresponding to the power semiconductor switches of the same position of each half-bridge converter are the same, that is, the local control signals are the same, for example, the upper power semiconductor switch Q of the first half-bridge converter. _11. The upper power semiconductor switch Q _{21 of the} second H-bridge circuit, and so on, until the local control signal corresponding to the upper power semiconductor switch Q _M1 of the M-th half-bridge converter is the same, that is, the output of the drive circuit 702 is corresponding. The drive signals Y ₁₁ , Y ₂₁ ... Y _{M1 are} identical, such that the upper power semiconductor switches Q ₁₁ , Q ₂₁ ... Q _{M1 are} simultaneously turned on and simultaneously turned off. Since the topology of each power converter 701 in the power unit 70 in this embodiment uses a half bridge converter, one power unit 70 requires only a local controller 91, an optical fiber 94, and an auxiliary power source 93. In this embodiment, the power semiconductor switches at the same position of each half-bridge converter use the same local control signal, so that only one local control signal is required in one power unit 70.

Figure 18 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. 18 is an embodiment based on FIG. 10 and corresponding to one power unit 70 of FIG. As shown in FIG. 18, the topology of each of the power converters 701 in the same power unit 70 is a neutral point controllable three-level converter. Taking the first neutral point controllable three-level converter as an example, the neutral point controllable three-level converter includes a first bridge arm 111a and a second bridge arm 111b. The first bridge arm 111a and the second bridge arm 111b each include an upper power semiconductor switch (such as Q ₁₁ , Q ₁₅ ) and a lower power semiconductor switch (such as Q ₁₂ , Q ₁₆ ). The neutral point controllable three-level converter further includes a first DC bus capacitor C ₁ , a second DC bus capacitor C ₂ , a first switch group (such as Q ₁₃ , Q ₁₄ ) and a second switch group (such as Q ₁₇₎ , Q ₁₈ ). The first DC bus capacitor C ₁ and the second DC bus capacitor C _{2 are} connected in series and connected in parallel with the first bridge arm 111a and the second bridge arm 111b. The connection point of the upper power semiconductor switch Q ₁₁ and the lower power semiconductor switch Q ₁₂ of the first bridge arm 111a is the third output terminal X _{3 of the} first power converter 701. The connection point of the upper power semiconductor switch Q ₁₅ and the lower power semiconductor switch Q ₁₆ of the second bridge arm 111b is the fourth output terminal X _{4 of the} first power converter 701. A first switch group (e.g. Q _13, Q ₁₄₎ connected to the first arm 111a of the power semiconductor switches Q ₁₁ and Q at the connection point of the power semiconductor switch ₁₂ and the first DC bus capacitor C ₁ and the second DC bus Capacitor C ₂ is connected between the points. The second switch group (such as Q ₁₇ , Q ₁₈ ) is connected to the connection point of the upper power semiconductor switch Q ₁₅ and the lower power semiconductor switch Q ₁₆ of the second bridge arm 111b with the first DC bus capacitor C ₁ and the second DC bus Capacitor C ₂ is connected between the points. In this embodiment, the first switch group is formed by connecting two power semiconductor switches in series. For example, the two power semiconductor switches may be bidirectional controllable switches.

In the present embodiment, the third output terminal X _{3 of} one of the adjacent two power converters 701 is sequentially connected to the fourth output terminal X _{4 of the} other one. Specifically, the third output terminal X ₃ of the first neutral point controllable three-level converter is the first end X ₁ of the power unit 70, and the first neutral point controllable three-level converter The four output terminals X _{4 are} connected to the third output terminal X _{3 of the} second neutral point controllable three-level converter, and are sequentially connected, and the fourth M-1 neutral point controllable three-level converter The output terminal X _{4 is} connected to the third output terminal X ₃ of the Mth neutral point controllable three-level converter, and the fourth output terminal X ₄ of the Mth neutral point controllable three-level converter is a power unit the second end 70 of X _2.

In this embodiment, the local controller 91 outputs eight local control signals, each of which is used to control a corresponding upper power semiconductor switch (such as Q ₁₁ , Q ₁₅ ) and a lower power semiconductor switch (such as Q ₁₂ , Q). ₁₆ ), one of the first switch group (such as Q ₁₃ , Q ₁₄ ) and the second switch group (such as Q ₁₇ , Q ₁₈ ). The local control signals corresponding to the power semiconductor switches of the same position of each neutral point controllable three-level converter are the same, that is, the local control signals are the same, and the neutral point controllable three-level converter in the power unit For example, the first power semiconductor switch of the first neutral point controllable three-level converter, the first power semiconductor switch Q ₁₁ of the first neutral point controllable three-level converter, and the first power semiconductor switch of the second neutral point controllable three-level converter Q ₂₁ , and so on until the first power semiconductor switch Q _M1 of the Mth neutral point controllable three-level converter corresponds to the same local control signal, that is, the local control signal is the same, that is, the output of the driving circuit 702 is corresponding. The drive signals Y ₁₁ , Y ₂₁ ... Y _{M1 are} identical such that the first power semiconductor switches Q ₁₁ , Q ₂₁ up to Q _{M1 are} simultaneously turned on and off at the same time. Since the topology of each power converter 701 in the power unit 70 in this embodiment uses a neutral point controllable three-level converter, one power unit 70 requires only a local controller 91, an optical fiber 94, and an auxiliary power source 93. The power semiconductor switches at the same position of each neutral point controllable three-level converter in this embodiment use the same local control signal, so that one power unit 70 requires only a total of eight local control signals.

19 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. 19 is an embodiment based on FIG. 11 and corresponding to one power unit 70 of FIG. As shown in FIG. 19, the topology of each of the power converters 70 in the same power unit 70 is a diode clamped three-level converter. Taking the first diode clamped three-level converter as an example, the diode clamped three-level converter includes a first bridge arm 111a and a second bridge arm 111b. The first bridge arm 111a and the second bridge arm 111b each include a first power semiconductor switch (such as Q ₁₁ , Q ₁₅ ), a second power semiconductor switch (such as Q ₁₂ , Q ₁₆ ), and a third power semiconductor switch (such as Q ₁₃ , Q ₁₇ ) and a fourth power semiconductor switch (such as Q ₁₄ , Q ₁₈ ). The diode clamped three-level converter further includes a first DC bus capacitor C ₁ , a second DC bus capacitor C ₂ , a first diode D ₁ , a second diode D ₂ , and a third diode D ₃ And a fourth diode D ₄ . The first DC bus capacitor C ₁ and the second DC bus capacitor C _{2 are} connected in series and connected in parallel with the first bridge arm 111a and the second bridge arm 111b. The first leg 111a of the first power semiconductor switch Q _11, a second power semiconductor switch Q _12, Q _{13 is} the third power semiconductor switch and the fourth power semiconductor switch Q ₁₄ connected in series. The connection point of the second power semiconductor switch Q ₁₂ and the third power semiconductor switch Q ₁₃ is the third output terminal X _{3 of} the power converter 401. The first power semiconductor switch Q ₁₅ , the second power semiconductor switch Q ₁₆ , the third power semiconductor switch Q ₁₇ and the fourth power semiconductor switch Q _{18 of the} second bridge arm 111b are connected in series. The junction point of the second power semiconductor switch Q ₁₆ and the third power semiconductor switch Q ₁₇ is the fourth output terminal X _{4 of} the power converter 401. The first diode D ₁ and the second diode D _{2 are} connected in series and connected to the connection point of the first power semiconductor switch Q ₁₁ and the second power semiconductor switch Q ₁₂ of the first bridge arm 111a and the third power semiconductor switch Q and the fourth power semiconductor switch ₁₃ between the connection point Q _14. The third diode D ₃ and the fourth diode D _{4 are} connected in series and connected to the connection point of the first power semiconductor switch Q ₁₆ and the second power semiconductor switch Q ₁₇ of the second bridge arm 111b and the third power semiconductor switch Q and the fourth power semiconductor switch ₁₇ between the connection point Q _18. A connection point of the first diode D ₁ and the second diode D ₂ is connected to a connection point of the first DC bus capacitor C ₁ and the second DC bus capacitor C ₂ . The junction of the third diode D ₃ and the fourth diode D ₄ is also connected to the junction of the first DC bus capacitor C ₁ and the second DC bus capacitor C ₂ . In the present embodiment, the role of the first diode D ₁ and diode D ₂ is a second clamping diode, a first power semiconductor switch, the second power semiconductor switch, a third power semiconductor switch and the fourth power semiconductor The switch is an IGBT or an IGCT.

In the present embodiment, the third output terminal X _{3 of} one of the adjacent two power converters 701 is sequentially connected to the fourth output terminal X _{4 of the} other one. Specifically, the third output terminal X ₃ of the first diode clamped three-level converter is the first terminal X ₁ of the power unit 70, and the fourth output terminal X of the first diode clamped three-level converter _{4 is} connected to the third output terminal X _{3 of the} second diode clamped three-level converter, and sequentially connected, the fourth output terminal X ₄ and the Mth of the M-1th diode clamped three-level converter The third output terminal X ₃ of the diode clamped three-level converter is connected, and the fourth output terminal X ₄ of the Mth diode clamped three-level converter is the second terminal X ₂ of the power unit 70.

In this embodiment, the local controller 91 outputs eight local control signals, each of which is used to control a corresponding first power semiconductor switch (such as Q ₁₁ , Q ₁₅ ) and a second power semiconductor switch (such as Q _12). , Q ₁₆ ), one of a third power semiconductor switch (such as Q ₁₃ , Q ₁₇ ) and a fourth power semiconductor switch (such as Q ₁₄ , Q ₁₈ ). The local control signal corresponding to the power semiconductor switch of the same position of each diode clamped three-level converter is the same, for example, the first power semiconductor switch of the diode clamped three-level converter in the power unit is taken as an example, the first a first power semiconductor switch Q _{11 of} a diode clamped three-level converter, a first power semiconductor switch Q _{21 of} a second diode clamped three-level converter, and so on until the Mth diode clamps three levels The local control signals corresponding to the first power semiconductor switch Q _{M1 of} the converter are the same, that is, the local control signals are the same, that is, the driving circuit 702 outputs the corresponding driving signals Y ₁₁ , Y ₂₁ ... Y _M1 , so that the first A power semiconductor switch Q ₁₁ , Q ₂₁ until Q _{M1 is} simultaneously turned on and off at the same time. Since each of the power converters 701 in the power unit 70 in this embodiment employs a diode clamped three-level converter, one power unit 70 requires only a local controller 91, an optical fiber 94, and an auxiliary power source 93. In this embodiment, the power semiconductor switches at the same position of the diode clamped three-level converters use the same local control signal, so that only one local control signal is required for one power unit.

20 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. 20 is an embodiment based on FIG. 12 and corresponding to one power unit 70 of FIG. As shown in FIG. 20, the topology of each of the power converters 70 in the same power unit 70 is a flying capacitor three-level converter. Taking the first flying capacitor three-level converter as an example, the flying capacitor three-level converter includes a first bridge arm 111a and a second bridge arm 111b. The first bridge arm 111a and the second bridge arm 111b each include a first power semiconductor switch (Q ₁₁ , Q ₁₅ ), a second power semiconductor switch (Q ₁₂ , Q ₁₆ ), and a third power semiconductor switch (Q ₁₃ , Q _{17 )} And a fourth power semiconductor switch (Q ₁₄ , Q ₁₈ ). The flying capacitor three-level converter further includes a first DC bus capacitor C ₁ , a first DC bus capacitor C ₂ , a first capacitor C _{3 ,} and a second capacitor C ₄ . The first DC bus capacitor C ₁ and the first DC bus capacitor C _{2 are} connected in series and connected in parallel with the first bridge arm 111a and the second bridge arm 111b. The first leg 111a of the first power semiconductor switch Q _11, a second power semiconductor switch Q _12, Q _{13 is} the third power semiconductor switch and the fourth power semiconductor switch Q ₁₄ connected in series. The connection point of the second power semiconductor switch Q ₁₂ and the third power semiconductor switch Q ₁₃ is the third output terminal X _{3 of} the power converter 401. The first power semiconductor switch Q ₁₅ , the second power semiconductor switch Q ₁₆ , the third power semiconductor switch Q ₁₇ and the fourth power semiconductor switch Q _{18 of the} second bridge arm 111b are connected in series. The junction point of the second power semiconductor switch Q ₁₆ and the third power semiconductor switch Q ₁₇ is the fourth output terminal X _{4 of} the power converter 401. The first capacitor C _{3 is} connected to the connection point of the first power semiconductor switch Q ₁₁ and the second power semiconductor switch Q ₁₂ of the first bridge arm 111a and the third power semiconductor switch Q ₁₃ and the fourth power semiconductor of the first bridge arm 111a Q switch ₁₄ between the connection point. The second capacitor C _{4 is} connected to the connection point of the first power semiconductor switch Q ₁₅ and the second power semiconductor switch Q ₁₆ of the second bridge arm 111b and the third power semiconductor switch Q ₁₇ and the fourth power semiconductor of the second bridge arm 111b Between the connection points of switch Q ₁₈ .

In the present embodiment, the third output terminal X _{3 of} one of the adjacent two power converters 701 is sequentially connected to the fourth output terminal X _{4 of the} other one. Specifically, the third output terminal X ₃ of the first flying capacitor three-level converter is the first end X ₁ of the power unit 70, and the fourth output terminal X of the first flying capacitor three-level converter _{4 is} connected to the third output terminal X _{3 of the} second flying capacitor three-level converter, and sequentially connected, the fourth output terminal X ₄ and the Mth of the M-1 flying capacitor three-level converter flying capacitor to the third three-level inverter connected to the output terminal X _3, M-th output terminal of the flying capacitor a fourth three-level converter for the power unit of the X ₄ of the second end 70 of X _2.

In this embodiment, the local controller 91 outputs eight local control signals, each of which is used to control a corresponding first power semiconductor switch (such as Q ₁₁ , Q ₁₅ ) and a second power semiconductor switch (such as Q _12). , Q ₁₆ ), one of a third power semiconductor switch (such as Q ₁₃ , Q ₁₇ ) and a fourth power semiconductor switch (such as Q ₁₄ , Q ₁₈ ). The local control signal corresponding to the power semiconductor switch of the same position of each flying capacitor three-level converter is the same, for example, the first power semiconductor switch of the flying capacitor three-level converter in the power unit is taken as an example, the first a flying capacitor a first three-level converter power semiconductor switch Q _11, the second flying capacitor a first three-level converter power semiconductor switch Q _21, and so on until the M-th three-level flying capacitor The local control signal corresponding to the first power semiconductor switch Q _{M1 of} the converter is the same, that is, the driving circuit 702 outputs the corresponding driving signals Y ₁₁ , Y ₂₁ ... Y _{M1 to be the} same, so that the first power semiconductor switches Q ₁₁ , Q ₂₁ until Q _M1 is turned on and off at the same time. Since each power converter 701 in the power unit 70 in this embodiment employs a flying capacitor three-level converter, one power unit 70 requires only one local controller 91, an optical fiber 94, and an auxiliary power source 93. In this embodiment, the power semiconductor switches at the same position of each of the flying capacitor three-level converters use the same local control signal, so that only one local control signal is required for one power unit.

21 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. 21 is an embodiment based on FIG. 13 and corresponding to one power unit 70 of FIG. As shown in FIG. 21, the topology of each of the power converters 701 in the same power unit 70 is a full bridge resonant converter. The full bridge resonant converter 701 includes a full bridge circuit, a resonant circuit, a transformer, and a rectifier bridge, the connection relationship of which is as shown in FIG. Taking the first full-bridge resonant converter 701 as an example, the full-bridge circuit includes four power semiconductor switches and one DC bus capacitor. One end of the power semiconductor switch Q ₁₁ is connected to one end of the DC bus capacitor C _B ' and the power semiconductor switch Q. One end ₁₃ of the power semiconductor switch and the other end Q ₁₁ is connected to the power semiconductor switch end Q ₁₂ of the power semiconductor switch and the other end Q ₁₂ is connected to the DC bus capacitor C _B 'and the other end of the power semiconductor switch and the other end Q ₁₄ of The connection point of the power semiconductor switch Q ₁₁ and the power semiconductor switch Q ₁₂ is connected to one end of the resonant circuit formed by the capacitor C' and the inductor L', and the other end of the resonant circuit is connected to one end of the primary coil of the transformer T', and the transformer T 'the other end of the primary coil is connected to a connection point of the power semiconductor switch Q ₁₃ and Q ₁₄ of the power semiconductor switches, the DC bus capacitor C _B' end to a first end of the third power converter X _3, the DC bus capacitor The other end of C _B ' is the fourth end X ₄ of the first power converter, the rectifier bridge includes four rectifier diodes, and one end of the rectifier diode D ₁ ' is connected to the rectifier diode D ₃ ' The other end of the one end of the rectifying diode D ₁ 'and the other end is connected to a rectifier diode D _2' end, a rectifying diode D ₃ 'and the other end is connected to a rectifying diode D _4' end, a rectifying diode D ₂ 'is connected to a rectifying diode D ₄ 'At the other end, one end of the rectifier diode D ₁ ' is the fifth end X ₅ of the converter T', the other end of the rectifier diode D ₂ ' is the sixth end X ₆ of the converter, and the output ends of the transformer are respectively connected to the rectifier diode The connection point of D ₁ ' with the rectifier diode D ₂ ' and the connection point of the rectifier diode D ₃ ' and the rectifier diode D ₄ ', wherein the transformer T' may be a center tap transformer having two secondary coils and two secondary coils Connected in parallel, the transformer T' can also have a single secondary winding.

In the present embodiment, each of the power unit 70 of a third terminal of the full bridge resonant converter power unit X ₃ is a first end 70 of the X _1, a first full-bridge resonant converter fourth terminal X _{4 is} connected to the third end X _{3 of the} second full-bridge resonant converter, and so on, the fourth end X _{4 of} the M-1 full-bridge resonant converter is connected to the third end X of the M-th full-bridge resonant converter _3. The fourth end X ₄ of the Mth full bridge resonant converter is the second end X ₂ of the power unit 70. The fifth end X ₅ of each of the full bridge resonant converters in each of the power units 70 is connected together, and the sixth end X _{6 is} connected together.

In this embodiment, the local control signals corresponding to the power semiconductor switches of the same position of the full bridge circuit in each full bridge resonant converter are the same, that is, the local control signals are the same, for example, the power of the first full bridge circuit. the semiconductor switch Q _11, the power semiconductor of the second full-bridge circuit, the switch Q _21, and so on until the M-th power semiconductor switches Q _M1 full bridge circuit of the local control signals corresponding to the same, i.e., with a local control signal, i.e., drive The circuit 702 outputs the corresponding drive signals Y ₁₁ , Y ₂₁ ... Y _{M1 to be the} same, so that the upper power semiconductor switches Q ₁₁ , Q ₂₁ ... Q _{M1 are} simultaneously turned on and simultaneously turned off. Since the topology of each power converter 701 in the power unit 70 in this embodiment uses a full bridge resonant converter, one power unit 70 requires only a local controller 91, an optical fiber 94, and an auxiliary power source 93. In this embodiment, the power semiconductor switches at the same position of the full bridge resonant converters use the same local control signal, so that only one local control signal is required in one power unit 70.

Figure 22 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. 22 is an embodiment based on FIG. 14 and corresponding to one power unit 70 of FIG. As shown in FIG. 22, the topology of each of the power converters 701 in the same power unit 70 is a half bridge resonant converter. The half bridge resonant converter 701 includes a half bridge circuit, a resonant circuit, a transformer, and a rectifier bridge, the connection relationship of which is as shown in FIG. Taking the first half-bridge resonant converter 701 as an example, the half-bridge circuit includes two power semiconductor switches and one DC bus capacitor. One end of the power semiconductor switch Q ₁₁ is connected to one end of the DC bus capacitor C _B ', and the power semiconductor switch Q the other end ₁₁ is connected to the power semiconductor switch end Q _12, the power semiconductor switch other ends Q ₁₂ is connected to the DC bus capacitor C _B ', the power semiconductor switch Q ₁₁ of the power semiconductor switch Q is connected to the point ₁₂ is connected to the 'One end of the primary coil of the transformer T''L and the inductance' end of the resonance circuit composed of the other end of the resonance circuit of the capacitor C is connected to the transformer T, the other end of the primary coil is connected to the power semiconductor switch of another Q ₁₂ of At one end, one end of the DC bus capacitor C _B ' is the third end X ₃ of the first power converter, and the other end of the DC bus capacitor C _B ' is the fourth end X _{4 of the} first power converter, and the rectifier bridge includes four rectifying diodes, the rectifying diode D ₁ 'is connected to one end of the rectifying diode D _3' end, a rectifying diode D ₁ 'and the other end is connected to a rectifier diode D _2' end, a rectifying diode D ₃ 'of the other One end connected to the other end of the rectifying diode D ₄ 'end, a rectifying diode D _2' is connected to one end of the rectifying diode D ₄ 'and the other end, the rectifying diode D _1' of the fifth inverter end X _5, a rectifying diode D ₂ ' The other end of the converter is the sixth end X ₆ of the converter, and the output end of the transformer is respectively connected to the connection point of the rectifier diode D ₁ ' and the rectifier diode D ₂ ' and the connection point of the rectifier diode D ₃ ' and the rectifier diode D ₄ ', The transformer may be a center tapped transformer having two secondary windings, two secondary windings being connected in parallel, and the transformer may also have a single secondary winding.

In this embodiment, the third end X ₃ of the first half-bridge resonant converter in each power unit 70 is the first end X ₁ of the power unit 70, and the fourth end X of the first half-bridge resonant converter _{4 is} connected to the third end X _{3 of the} second half-bridge resonant converter, and so on, and the fourth end X _{4 of} the M-1 half-bridge resonant converter is connected to the third end X of the M-th half-bridge resonant converter _3. The fourth end X ₄ of the Mth half-bridge resonant converter is the second end X ₂ of the power unit 70. The fifth ends X ₄ of all of the half-bridge resonant converters in each power unit 70 are connected together, and the sixth ends X _{6 are} connected together.

In this embodiment, the power semiconductor switches of the same position of the half bridge circuit in each half-bridge resonant converter have the same local control signal, that is, the local control signals are the same, for example, the power of the first half bridge circuit. The semiconductor switch Q ₁₁ , the power semiconductor switch Q _{21 of the} second half bridge circuit, and so on, until the local control signal corresponding to the power semiconductor switch Q _M1 of the Mth half bridge circuit is the same, that is, the output of the drive circuit 702 is corresponding. The drive signals Y ₁₁ , Y ₂₁ ... Y _{M1 are} identical, such that the power semiconductor switches Q ₁₁ , Q ₂₁ ... Q _{M1 are} simultaneously turned on and off at the same time. Since the topology of each power converter 701 in the power unit 70 in this embodiment uses a half bridge resonant converter, one power unit 70 requires only a local controller 91, an optical fiber 94, and an auxiliary power source 93. In this embodiment, the power semiconductor switches at the same position of each half-bridge converter use the same local control signal, so that only one local control signal is required in one power unit 70.

23 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. FIG. 23 is an embodiment based on FIG. 15 and corresponding to one power unit 70 of FIG. As shown in FIG. 23, the topology of the M power converters 701 in the same power unit 70 employs a combination of a full bridge converter and a half bridge converter. The power converter 7011' of the full bridge converter includes four power semiconductor switches, and the half bridge converter 7012' includes two power semiconductor switches. In this embodiment, the specific connection relationship of the full bridge converter is as shown in FIG. 8 , and the specific connection relationship of the half bridge converter is shown in FIG. 9 , and details are not described herein again. Similarly, the fourth end X ₄ of one of the adjacent two power converters 701 is coupled to the third end X _{3 of the} other, where M is a natural number greater than one. Thus, the third end X _{3 of} the first power converter 701 is the first end X _{1 of} the power unit 70, and the fourth end X _{4 of the} first power converter 701 is connected to the second power converter 701. The third end X ₃ , and so on, the fourth end X _{4 of} the M-1th power converter 701 is connected to the third end X ₃ of the Mth power converter 701, and the fourth end of the Mth power converter 701 X _{4 is} the second end X _{2 of} the power unit 70.

In this embodiment, the local control signals corresponding to the power semiconductor switches of the same position of each full-bridge converter are the same, that is, the driving signals output by the driving circuit are the same, so that the power semiconductor switches of the same position are simultaneously turned on and off simultaneously. open. The local control signals corresponding to the power semiconductor switches of the same position of each half-bridge converter are the same, that is, the local control signals are the same, that is, the driving signals output corresponding to the driving signals are the same, so that the power semiconductor switches of the same position are simultaneously turned on and Disconnect at the same time Since the topology of the M power converters in the power unit 70 in this embodiment simultaneously uses a combination of a full bridge converter and a half bridge converter, one power unit 70 requires only one local controller 91, fiber 94, and auxiliary power source 93. . In this embodiment, the power semiconductor switches at the same position of the respective full-bridge converters use the same local control signal, and the power semiconductor switches at the same position of the respective half-bridge converters use the same local control signal, so that only one power unit 70 6 local control signals are required.

In other embodiments, the topology of the M power converters 701 of each power unit 70 in the modular power system uses both a full bridge converter, a half bridge converter, a neutral point controllable three level converter, and a diode. A combination of two or more of a clamp three-level converter, a flying capacitor three-level converter, a full-bridge resonant converter, and a half-bridge resonant converter. The local control signals corresponding to the same position of the power semiconductor switches of the same topology in the M power converters 701 are the same, that is, the driving circuit outputs corresponding driving signals are the same, so that the power semiconductor switches of the same position are simultaneously turned on and simultaneously turned off.

As shown in FIGS. 6-23, each power unit 70 in the modular power supply system of the present embodiment may include: a plurality of driving circuits 702, the number of driving circuits in the power unit being equal to the power semiconductor switches in the power unit A quantity, wherein each of the driving circuits 702 is configured to be connected to a power semiconductor switch of the corresponding power converter 701, receive a local control signal output by the corresponding local controller 91, to output a driving signal to drive the corresponding power semiconductor switch Pass and disconnect.

Figure 24 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. Figure 24 is a partial schematic view of Figure 10 based on Figure 10. As shown in FIG. 24, the M power converters 701 in the same power unit 70 are all neutral point controllable three-level converters. The power unit 70 can include 8 x M drive circuits, each of which is configured to be electrically coupled to power semiconductor switches Q ₁₁ , Q ₁₂ ... Q ₁₈ ... Q _M1 , Q _{M2 of} power converter 701. A corresponding one of .Q _M8 , each driving circuit receives a local control signal output by the corresponding local controller 91 to output driving signals Y ₁₁ , Y ₁₂ ... Y ₁₈ ... Y _M1 , Y _M2 . .. A corresponding one of Y _M8 to drive the on and off of the corresponding power semiconductor switch.

It should be noted that the number of driving circuits included in one power unit in FIG. 6 to FIG. 24 is equal to the number of power semiconductor switches in the power unit, and each driving circuit is configured to be connected to a corresponding one of the power semiconductor switches of the power converter. One, each driving circuit receives a corresponding local control signal outputted by the corresponding local controller 91 to output a driving signal to drive the corresponding power semiconductor switch to be turned on and off.

Each of the drive circuits 702 of the modular power supply system of the present invention can be directly electrically connected to the corresponding local controller 91, or connected by magnetic isolation devices, or connected by optical isolation devices.

Each of the drive circuits 702 in the modular power supply system of the present invention may be identical to each other or different from each other.

As shown in FIGS. 6 to 24, the respective driving circuits 702 in the modular power supply system of the present embodiment are identical to each other.

Figure 25 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 25, at least one of the M power converters 701 in each of the power units 70 in the modular power supply system of the present embodiment is a master power converter 7012, at least one of which is a slave power converter 7011, wherein The main power converter 7012 and the slave power converter 7011 have the same topology, and one of the power converters described in FIGS. 15 to 22, or the topology of the main power converter 7012 and the slave power converter 7011, may be employed. Alternatively, the main power converter can employ one of the power converters described in Figures 15-22, and the slave power converter can employ another of the power converters described in Figures 15-22. Correspondingly, at least one of the M driving circuits is a main driving circuit 722, at least one of which is a slave driving circuit 721, and the main driving circuit 722 is configured to drive the power semiconductor switches in the corresponding main power converter 7012 to be turned on and off. Each of the slave drive circuits 721 is configured to drive the turn-on and turn-off of the power semiconductor switches in the corresponding slave power converter 7011.

As an embodiment, in the modular power supply system as shown in Fig. 25, the main drive circuit 722 is different from the slave drive circuit 721.

In the present embodiment, when the topologies of the main power converter 7012 and the slave power converter 7011 are the same, the main driving circuit 722 and the slave driving circuit 721 may be different, and each of the slave driving circuits 721 is the same, the main power converter 7012. The local control signals corresponding to each of the power semiconductor switches at the same location from power converter 7011 may be the same, for example, the same local control signal. In other embodiments, the main drive circuit 722 and the slave drive circuit 721 may be different, and the local control signals corresponding to the power semiconductor switches at the same position as the main power converter 7012 and the power converter 7011 may be different; The local control signals corresponding to the power semiconductor switches at the same location of power converter 7011 may be the same.

Figure 26 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 26, each power unit 70 in the modular power supply system of the present embodiment includes a main power converter 7012 and M-1 slave power converters 7011, M-1 slave power converters 7011. The topology of the main power converter 7012 may be one of FIG. 15 to FIG. 22, and the topology of the slave power converter 7011 may also be FIG. 15-22. One of them. The main power converter 7012 in FIG. 26 and the slave power converter 7011 can be driven differently. Each of the slave power converters can take the aforementioned "common drive", while the main power converter 7012 takes an independent control mode.

Figure 27 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 28, each of the auxiliary power sources 93 in the modular power supply system of the present embodiment can be configured to draw power from an external power source, such as from a commercial power source, or from another circuit, each of the auxiliary power sources 93. Connect the external power supply E _C .

28 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 28, the N auxiliary power sources 93 in the modular power supply system of the present embodiment are in one-to-one correspondence with the N power units 70, and each of the auxiliary power sources 93 can be configured to be taken from the corresponding power unit 70. The power is taken, for example, from the DC bus capacitance of one or more power converters in the corresponding power unit 70.

29 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. Based on FIGS. 8-22, as shown in FIG. 29, each of the power units 70 in the modular power supply system of any of FIGS. 8-22 further includes: M sampling circuits 704, and the M The power converters are configured to collect the positive DC bus voltage and the negative DC bus voltage of the corresponding power converter 701; the corresponding local controller 91 is configured to include M sampling conditioning circuits 913, and the sampling conditioning circuit 913 and The sampling circuit 704 is in one-to-one correspondence and is configured to convert the positive DC bus voltage and the negative DC bus voltage of the collected power converter 701 into digital signals.

The M sampling circuits 704 include: M DC bus positive terminal samplers, that is, resistors R, which are in one-to-one correspondence with M power converters 701 and M sampling and conditioning circuits 913, wherein M DC bus positive terminal samplers are respectively configured. one end connected to the positive terminal of the power converter corresponding to the DC bus capacitor C _B 701 (e.g., _{_{V 1 +, V x +,}} V M +), M a positive terminal of the DC bus are samplers is configured to connect the other end of the corresponding At the first end of the sampling conditioning circuit 913, the first end of the sampling conditioning circuit 913 receives the positive DC bus voltage of the power converter 701.

The M DC bus negative end samplers, that is, the corresponding resistors R, are in one-to-one correspondence with the M power converters 701 and the M sampling and conditioning circuits 913, wherein the M DC bus negative end samplers are respectively configured to be connected at one end. the negative terminal of the DC bus capacitor C _B to the power converter 701 (e.g., _{_{V 1 -, V x -,}} V M -), M a negative DC bus terminals are sampler configured to sample the corresponding conditioning circuit 913 is connected to the other end At the second end, the second end of the sampling conditioning circuit 913 receives the negative DC bus voltage of the power converter. In this embodiment, the DC bus positive terminal sampler and the DC bus negative terminal sampler are described by taking a resistor as an example, but the present invention is not limited thereto, and the DC bus positive terminal sampler and the DC bus negative terminal sampler may also be multiple. The resistors are connected in series, or a plurality of resistors are connected in parallel, or a combination of resistors and other electronic components.

Sampling conditioning circuit 913 can include a single operational amplifier.

The sampling conditioning circuit 913 also includes a sampling reference point or a sampling reference ground GND.

Figure 30 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. Figure 30 is a specific embodiment of Figure 29. As shown in FIG. 30, each of the power converters 701 of FIG. 30 is not only independently sampled, but also employs the aforementioned independent driving method.

As shown in FIG. 30, the power unit 70 corresponds to a local controller 91, and the number of local control signals and power semiconductor switches of the power semiconductor switches of the M power converters 701 in the corresponding power unit 70 controlled by the local controller 91 are output. The number is the same, that is, each power semiconductor switch needs to be controlled by a separate local control signal. The relevant contents of the sampling circuit and the sampling conditioning circuit 913 have been described in Fig. 29 and will not be described again.

31 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. Figure 31 is a specific embodiment of Figure 29. As shown in FIG. 31, each of the power converters 701 in FIG. 31 is not only independently sampled, but also employs the aforementioned common driving method.

As shown in FIG. 31, the power unit 70 corresponds to a local controller 91, and the local controller 91 outputs a control corresponding power unit 70 in which the power semiconductor switches are turned on and off at the same position of the M power converters 701. The control signals are the same. The relevant content of the sampling circuit and the sampling conditioning circuit 913 has been described in FIG. 29 and will not be described herein.

32 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. Figure 32 is a specific embodiment of Figure 29. As shown in FIG. 32, each of the power converters 701 of FIG. 32 is independently sampled, but a part of the power converters 701 adopts the aforementioned independent driving mode, and a part of the power converters 701 adopts the aforementioned common driving mode.

Figure 33 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 33, based on FIGS. 15-22, as shown in FIG. 33, each of the power units 70 in the modular power supply system of any of FIGS. 15-22 further includes: a sampling circuit 704, The local controller 91 is configured to include a sum of the positive DC bus voltages of the M power converters 701 and the negative DC bus voltages, and the corresponding local controller 91 is configured to include a sampling conditioning circuit 913 configured to acquire the acquired M The sum of the positive DC bus voltages of the power converters 701 and the negative DC bus voltages are converted into digital signals.

As shown in FIG. 33, the sampling circuit 704 in the modular power supply system of the present embodiment is configured to include: M DC bus positive-end samplers, that is, resistors R, which are in one-to-one correspondence with the aforementioned M power converters 701. The M DC bus positive terminal samplers are respectively configured to be connected to the DC bus positive terminal of the corresponding power converter 701 at one end, for example, V ₁ + to V _M + , and the other ends are connected together and connected to the sampling conditioning circuit 913. One end, the first end of the sampling conditioning circuit receives the sum of the positive DC bus voltages of the M power converters 701; and the M DC bus negative end samplers, that is, the resistor R, and the M power converters 701 Correspondingly, wherein the M DC bus negative end samplers are respectively configured to connect one end of the corresponding DC bus negative terminal of the power converter 701, for example, V ₁ - to V _M -, and the other ends are connected together and connected to the sampling. The second end of the conditioning circuit receives the sum of the negative DC bus voltages of the M power converters 701.

In an embodiment, the sampling circuit is not limited to include a resistor, but may be other circuits.

As shown in FIG. 33, in order to reduce the common mode voltage in the sampling circuit for the DC bus, the sampling circuit in the modular power supply system of the present embodiment passes the M power through the DC bus positive end sampler and the DC bus negative end sampler. The positive DC bus voltage and the negative bus voltage of the converter 701 are summed and summed, respectively, and input to the sampling conditioning circuit 913, wherein the sampling conditioning circuit 913 includes an operational amplifier. In an embodiment, the DC bus positive terminal sampler and the DC bus negative terminal sampler may be a single resistor or a combination of series, parallel or series-parallel connections of multiple resistors.

Figure 34 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 34, the present invention sets the sampling reference point GND of the sampling conditioning circuit 913 and the local controller 91 as much as possible at the most centrally located power converter 701 among the M power converters 701, for example, sampling reference points. The GND is set at the positive terminal of the DC bus capacitor C _B of the power converter 701 at the most center position, or the negative terminal of the DC bus capacitor C _B , so that the common mode voltage of the sampling voltage can be minimized, thereby improving the sampling accuracy and reducing the total Mode interference.

As shown in FIG. 34, the sampling circuit 704 in the modular power supply system of the present embodiment is configured to separately acquire the sum of the positive DC bus voltages of the aforementioned M power converters and the sum of the negative DC bus voltages, wherein M is An odd number, the sampling reference point GND is set at the (M+1)/2th power converter, so that the sampling reference point GND is set at the most centrally located power converter 701 among the aforementioned M power converters 701, for example, sampling reference point GND disposed negative (M + 1) / 2 th of the power converter 701 DC bus capacitor C _B terminal _{V (M + 1) / 2-} . In other embodiments, the sampling reference point GND may be set at the positive terminal V _(M+1)/2 + of the DC bus capacitance C _B of the (M+1)/2th power converter 701.

Figure 35 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 35, the sampling circuit 704 in the modular power supply system of the present embodiment is configured to separately acquire the sum of the positive DC bus voltages of the aforementioned M power converters and the sum of the negative DC bus voltages, wherein M is Even, the sampling reference point is set at the M/2th of the power converters such that the sampling reference point GND is disposed at the power converter 701 at the most centered position among the M power converters 701, for example, the sampling reference point The negative terminal V _M/2 - of the DC bus C _B of the _M/ 2th power converter is provided. In other embodiments, the sampling reference point GND may be disposed at the positive terminal V _M/2 + of the DC bus C _B of the _M/ 2th power converter.

As shown in FIG. 36, the sampling circuit 704 in the modular power supply system of the present embodiment is configured to separately acquire the sum of the positive DC bus voltages of the aforementioned M power converters and the sum of the negative DC bus voltages, wherein M is Evenly, the sampling reference point is set at the M/2+1th of the power converters such that the sampling reference point GND is disposed at the power converter 701 where the position is relatively the most centered among the M power converters 701, for example, The sampling reference point GND is set at the positive terminal V _M/2+1 + of the DC bus C _B of the _M/2+ 1th power converter. In other embodiments, the sample may be provided at the reference point GND negative terminal V _M of the DC bus capacitor C _B of (M / 2 + 1) th power converter _{701/2 + 1} -

Figure 37 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 37, the DC bus capacitor C _{B of} each power converter 701 is formed by connecting two capacitors in series, and the connection point of the two capacitors in series is the midpoint of the DC bus capacitor C _B , where M is an odd number. when the sampling GND reference point may be disposed at the midpoint of the DC bus capacitor C _B of (M + 1) / 2 of said power converter.

As an embodiment, when M is an even number, the sampling reference point GND may be set at a midpoint of the DC bus capacitor C _B of the M/2th power converter, or the (M/2+1)th The midpoint of the DC link capacitor C _B of the power converter.

38 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 38, the DC bus capacitor C _{B of} each power converter 701 contains only one capacitor, and there is no capacitor midpoint. It is necessary to parallel two mutual ends of the DC bus capacitor C _B of each power converter 701. A resistor connected in series, wherein when M is an odd number, the sampling reference point GND is set at a connection point of two of the resistors at (M+1)/2th of the power converters.

As an embodiment, when M is an even number, the sampling reference point GND is set at a connection point of two of the resistors at the M/2th power converter, or the sampling reference point GND is set at (M/2+1) connection points of the two resistors at the power converter.

As shown in FIG. 38, in each of the power converters 70 in the power unit 70 in the modular power supply system of the present embodiment, the DC bus capacitor C _B is single, and it can be determined that the DC bus capacitor C _B has no midpoint. Then, parallel voltage equalizing resistor is connected across the DC bus capacitor C _B , wherein the voltage equalizing resistor is composed of two equivalent resistors in series, and the connection point between the two equivalent resistors is set to the midpoint, then The sampling reference point GND is set to the midpoint at the most centrally located power converter 701 of the M power converters 701.

The sample conditioning circuit 913 shown in Figures 33-38 can include a single operational amplifier.

Figure 39 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 39, each power unit 70 in the modular power supply system of the present embodiment further includes: a main sampling circuit 7042 configured to collect the positive DC bus voltage and the negative DC bus voltage of the main power converter 7012. And the sampling reference point GND is set at the capacitance midpoint of the main power converter; and the M-1 slave sampling circuits 7041 are configured to acquire the sum of the positive DC bus voltages of the M-1 slave power converters 7011 and the negative DC bus. The sum of the voltages, wherein M-1 are equally distributed on both sides of the main power converter 7012 from the power converter 7011 centered on the main power converter 7012; and the corresponding local controller 91 is configured to include: a sampling conditioning circuit 913, The positive DC bus voltage V _S2 + , the negative DC bus voltage V _S2- , the positive DC bus voltage V _S1 + of the slave power converter 7011, and the slave power converter 7011 are configured. The sum of the negative DC bus voltages V _S1 - is converted to a digital signal.

As shown in FIG. 39, in the modular power supply system of this embodiment, the main sampling circuit 7042 includes: a main DC bus positive end sampler, that is, a resistor, corresponding to the main power converter 7012, wherein the main DC bus positive end sampler One end is connected to the positive end of the DC bus of the main power converter, and the other end is connected to the first end of the sampling conditioning circuit 913, and the first end of the sampling conditioning circuit 913 receives the positive DC bus voltage V _S2 + of the main power converter 7012; One end of the main DC bus negative end sampler is connected to the negative end of the DC bus of the main power converter 7012, the other end is connected to the second end of the sampling conditioning circuit 913, and the second end of the sampling conditioning circuit 913 receives the main power converter 7012. Negative DC bus voltage V _S2 -. The slave sampling circuit 7041 includes: M-1 slave DC bus positive terminal samplers, that is, resistors, one-to-one corresponding to the M-1 slave power converters 7011, wherein M-1 slave DC bus positive terminal samplers One end is respectively configured to connect one end of the corresponding DC bus positive terminal of the power converter 7011, the other end is connected together and is connected to the third end of the sampling conditioning circuit 913, and the third end of the sampling conditioning circuit 913 receives M-1 The sum of the positive DC bus voltages from the power converter 7011, V _S1+ ; and the M-1 slave DC bus negative samples, that is, the resistors, are in one-to-one correspondence with the M-1 slave power converters 7011, where M- One slave DC bus negative sampler is configured to be connected at one end to the DC bus negative terminal of the corresponding slave power converter 7011, and the other end is connected together and connected to the fourth terminal of the sampling conditioning circuit 913, and the sampling conditioning circuit 913 The fourth terminal receives the sum V _S1 - of the negative DC bus voltages of the M-1 slave power converters 7011.

As an embodiment, the number M of power converters in FIG. 39 is 5, but the invention is not limited thereto, and is applicable, for example, to the embodiment in which the power unit includes a master-slave power converter in the foregoing figures.

As shown in FIG. 39, there are five H-bridge circuits in the power unit 70, wherein the most central H-bridge circuit is the main power converter, and the four H-bridge circuits distributed on both sides are slave power converters, and each H The DC bus voltage of the bridge circuit is V _bus . If the sampling reference point GND is not set properly, if the sampling reference point GND is set at the DC bus negative terminal of the H-bridge circuit shown at the bottom, the DC bus voltages of the five H-bridge circuits shown from top to bottom are positive and DC. The bus voltages are negative (5V _bus , 4V _bus ), (4V _bus , 3V _bus ), (3V _bus , 2V _bus ), (2V _bus , V _bus ), (V _bus , 0). Suppose the sampling ratio of the sampling circuit is k. At this time, the sampling voltage Vs ₂ +=15*k*V _bus , Vs ₂ -=10*k*V _bus , the differential mode component V _DM =5kV in the sampling voltage, the common mode component V _CM = 12.5 kV. However, the present invention sets the sampling reference point GND of the sampling conditioning circuit 913 and the local controller 91 after the midpoint of the DC bus capacitance of the most intermediate H-bridge circuit, and then the DC of the five H-bridge circuits shown from top to bottom. The bus voltage is positive and the DC bus voltage is negative (2.5V _bus , 1.5V _bus ), (1.5V _bus , 0.5V _bus ), (0.5V _bus , -0.5V _bus ), (-0.5V _bus , -1.5V _Bus ), (-1.5V _bus , -2.5V _bus ), at this time, the sampling voltage Vs ₂ +=2.5*k*Vbus, Vs ₂ -=-2.5*k*Vbus, differential mode component V _DM =5kV, common mode The component V _CM =0, the common mode component is significantly reduced, and the sampling accuracy and anti-interference ability are greatly improved.

Figure 40 is a block diagram of a modular power supply system in accordance with another embodiment of the present invention. As shown in FIG. 40, each power unit 70 in the modular power supply system of the present embodiment further includes: a plurality (eg, two or more) of main sampling circuits 7042 configured to acquire a plurality of main power converters 7012, respectively. The sum of the positive DC bus voltages and the negative DC bus voltages; and a plurality (for example, two or more) from the sampling circuit 7041, respectively configured to acquire the sum of the positive DC bus voltages of the plurality of slave power converters 7011 and the negative DC The sum of the bus voltages, wherein the plurality of slave power converters 7011 and the plurality of master power converters 7012 are divided into two groups; and the corresponding local controller 91 is configured to include: sampling conditioning circuits 913' and 913, and sampling conditioning circuit 913 Configuring to convert the sum of the positive DC bus voltages of the collected main power converter 7012 and the negative DC bus voltage to a digital signal; the sampling conditioning circuit 913' is configured to normalize the acquired slave power converter 7011 The sum of the stream bus voltages and the sum of the negative DC bus voltages from the power converter 7011 are converted to digital signals.

As shown in FIG. 40, in the modular power supply system of this embodiment, the main sampling circuit 7042 includes: a plurality of main DC bus positive-end samplers, one-to-one corresponding to the main power converter 7012, wherein the main DC bus positive-end sampler One end of the main power converter is connected to the positive end of the main DC converter, the other end is connected together and connected to the first end of the sampling conditioning circuit 913', and the first end of the sampling conditioning circuit 913' receives the main power converter 7012. The sum of the positive DC bus voltages; and one end of the main DC bus negative end sampler is connected to the main DC bus negative terminal of the main power converter 7012, and the other end is connected together and connected to the second end of the sampling conditioning circuit 913'. The second end of the sampling conditioning circuit 913' receives the sum of the negative DC bus voltages of the main power converter 7012. The slave sampling circuit 7041 includes: a plurality of slave DC bus positive-end samplers, one-to-one corresponding to the plurality of slave power converters 7011, wherein one ends of the plurality of slave DC bus positive-end samplers are respectively configured to be connected at one end From the positive end of the DC converter from the power converter 7011, the other end is connected together and connected to the first end of the sampling conditioning circuit 913, the first end of the sampling conditioning circuit 913 receives the positive DC bus voltage of the plurality of slave power converters 7011. And a plurality of slave DC bus negative end samplers, one-to-one correspondence with the plurality of slave power converters 7011, wherein the plurality of slave DC bus negative terminal samplers are respectively configured to be connected to the corresponding slave power converters at one end The negative end of the DC bus from 7011 is connected together and connected to the second end of the sampling conditioning circuit 913. The second end of the sampling conditioning circuit 913 receives the sum of the negative DC bus voltages of the plurality of slave power converters 7011.

As an embodiment, the number M of power converters in FIG. 40 is four, but the present invention is not limited thereto, and is applicable, for example, to the embodiment in which the master-slave power converter is included in the power unit in the foregoing figures.

The sampling conditioning circuit as shown in Figures 39 and 40 can include a dual operational amplifier.

The invention can collect the bus voltage of the power converter through the sampling circuit and the sampling conditioning circuit, and improve the sampling precision of the DC bus voltage.

The exemplary embodiments of the present invention have been particularly shown and described above. It is to be understood that the invention is not limited to the details of the details of the embodiments of the invention. Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, and are not intended to be limiting; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that The technical solutions described in the foregoing embodiments may be modified, or some or all of the technical features may be equivalently replaced; and the modifications or substitutions do not deviate from the technical solutions of the embodiments of the present invention. range.

Claims

A modular power system configured to include:

a main controller configured to output a main control signal;

N local controllers, wherein each of the local controllers is configured to receive the main control signal to output at least one local control signal;

N power units, one-to-one corresponding to the N local controllers, wherein each of the power units includes a first end and a second end, and the second end of each of the power units is connected to an adjacent one The first end of one of the power units, each of the power units being configured to include M power converters, wherein each of the power converters includes a third end and a fourth end, each of the power The fourth end of the converter is coupled to the third end of an adjacent one of the power converters, and the third end of the first one of the power converters is the first of the power units And at one end, the fourth end of the Mth power converter is the second end of the power unit, and each of the power converters is configured to be output according to a corresponding local controller The local control signal operates, wherein N and M are both natural numbers greater than 1, wherein each of the power units further comprises: M sampling circuits configured to separately acquire positive DC bus voltages of the M power converters and Negative DC bus voltage, and

The local controller corresponding to the power unit is configured to include: M sampling conditioning circuits configured to collect the positive DC bus voltage of the M power converters and the negative DC bus The voltage is converted to a digital signal.
The modular power supply system of claim 1 wherein said sampling circuit comprises:

M DC bus positive-end samplers are in one-to-one correspondence with the M power converters and the M sampling and conditioning circuits, wherein the M DC bus positive-end samplers are respectively configured to connect one end to the corresponding one a positive terminal of the DC bus capacitor of the power converter, wherein the M DC bus positive terminal samplers are respectively configured to be connected to the first end of the corresponding sampling conditioning circuit, and the first end of the sampling conditioning circuit Receiving a positive DC bus voltage of the power converter;

M DC bus negative-end samplers are in one-to-one correspondence with the M power converters and the M sampling and conditioning circuits, wherein the M DC bus negative-end samplers are respectively configured to connect one end to the corresponding one a negative end of the DC bus capacitor of the power converter, wherein the M DC bus negative samplers are respectively configured to be connected to the second end of the corresponding sampling conditioning circuit, and the second end of the sampling conditioning circuit The terminal receives the negative DC bus voltage of the power converter.
The modular power supply system of claim 2 wherein said DC bus positive end sampler and said DC bus negative end sampler comprise resistors.
The modular power system of claim 1 wherein said sampling conditioning circuit comprises a single operational amplifier.
A modular power system configured to include:

a main controller configured to output a main control signal;

N local controllers, wherein each of the local controllers is configured to receive the main control signal to output at least one local control signal;

N power units, one-to-one corresponding to the N local controllers, wherein each of the power units includes a first end and a second end, and the second end of each of the power units is connected to an adjacent one The first end of one of the power units, each of the power units being configured to include M power converters, wherein each of the power converters includes a third end and a fourth end, each of the power The fourth end of the converter is coupled to the third end of an adjacent one of the power converters, and the third end of the first one of the power converters is the first of the power units And at one end, the fourth end of the Mth power converter is the second end of the power unit, and each of the power converters is configured to be output according to a corresponding local controller The local control signal operates, wherein N and M are both natural numbers greater than 1, wherein at least one of the M power converters is a master power converter, and at least one is a slave power converter, and the slave power converter is controlled to be the same Power semiconductor switch at the location And said local control signal off the same,

Each of the power units further includes:

a main sampling circuit configured to separately acquire a positive DC bus voltage and a negative DC bus voltage of the main power converter, or a sum of a positive DC bus voltage of the main power converter and a negative bus voltage;

From the sampling circuit, configured to separately acquire a sum of a positive DC bus voltage and a negative DC bus voltage of the slave power converter, and

The local controller corresponding to the power unit is configured to include: a sampling conditioning circuit configured to collect the positive DC bus voltage and the negative DC bus voltage of the main power converter, Or the sum of the sum of the positive DC voltage and the negative DC voltage, and the sum of the positive DC voltage of the slave power converter and the negative DC voltage are converted into digital signals.
The modular power supply system according to claim 5, wherein said slave power converter is distributed in said number when said number of said main power converters is one and said number of said slave power converters is M-1 Both sides of the main power converter.
The modular power supply system of claim 6 wherein said sampling conditioning circuit further comprises a sampling reference point, said sampling reference point being disposed at said main power converter.
The modular power supply system of claim 7 wherein said sampling reference point is disposed at a positive terminal of a DC bus capacitor of said main power converter or a negative terminal of a DC bus capacitor of said main power converter, or The midpoint of the DC bus capacitance of the main power converter.
The modular power supply system according to claim 5, wherein when the number of said main power converters is one and said number of said slave power converters is M-1

The main sampling circuit includes:

a main DC bus positive terminal sampler configured to be connected at one end to a positive terminal of the DC bus capacitor of the main power converter, and at the other end to a first end of the sampling conditioning circuit, the first of the sampling conditioning circuit Receiving a positive DC bus voltage of the main power converter;

The main DC bus negative terminal sampler is configured to be connected at one end to the negative terminal of the DC bus capacitor of the main power converter, and at the other end to the second end of the sampling conditioning circuit, the second end of the sampling conditioning circuit Receiving a negative DC bus voltage of the main power converter, and

The slave sampling circuit includes:

M-1 slave DC bus positive-end samplers are in one-to-one correspondence with the M-1 slave power converters, wherein the M-1 slave DC bus positive-end samplers are respectively configured to connect one end to a corresponding one. Referring to the positive terminal of the DC bus capacitor of the power converter, the other end is connected together and connected to the third end of the sampling conditioning circuit, and the third end of the sampling conditioning circuit receives the M-1 slaves The sum of the positive DC bus voltages of the power converter;

M-1 slave DC bus negative end samplers are in one-to-one correspondence with the M-1 slave power converters, wherein the M-1 slave DC bus negative terminal samplers are respectively configured to be connected at one end to corresponding ones. Referring to the negative terminal of the DC bus capacitor of the power converter, the other end is connected together and connected to the fourth end of the sampling conditioning circuit, and the fourth end of the sampling conditioning circuit receives the M-1 slaves The sum of the negative DC bus voltages of the power converter.
The modular power supply system according to claim 5, wherein when the number of the main power converters is two or more and the number of the slave power converters is two or more, the same position of the main power converter is controlled The local semiconductor control switch at the same time is turned on and the same as the local control signal that is simultaneously turned off.
The modular power system of claim 10 wherein

The main sampling circuit includes:

a plurality of main DC bus positive-end samplers, one-to-one corresponding to the two or more main power converters, wherein the plurality of main DC bus positive-end samplers are respectively configured to connect one end of the corresponding main power converter a positive terminal of the DC bus capacitor, the other end being connected together and connected to the first end of the sampling conditioning circuit, the first end of the sampling conditioning circuit receiving the positive DC of the two or more main power converters The sum of the bus voltages;

a plurality of main DC bus negative-end samplers, one-to-one corresponding to the two or more main power converters, wherein the plurality of main DC bus negative-end samplers are respectively configured to connect one end of the corresponding main power converter a negative terminal of the DC bus capacitor, the other end being connected together and connected to the second end of the sampling conditioning circuit, the second end of the sampling conditioning circuit receiving the negative DC bus voltage of the main power converter And, and

The slave sampling circuit includes:

a plurality of slave DC bus positive-end samplers are in one-to-one correspondence with the two or more slave power converters, wherein the plurality of slave DC bus positive-end samplers are respectively configured to be connected to the corresponding slave power converters at one end a positive terminal of the DC bus capacitor, the other end being connected together and connected to the third end of the sampling conditioning circuit, the third end of the sampling conditioning circuit receiving the positive DC of the two or more slave power converters The sum of the bus voltages;

a plurality of slave DC bus negative end samplers are in one-to-one correspondence with the two or more slave power converters, wherein the plurality of slave DC bus negative terminal samplers are respectively configured to be connected to the corresponding slave power converters at one end a negative terminal of the DC bus capacitor, the other end being connected together and connected to the fourth end of the sampling conditioning circuit, the fourth end of the sampling conditioning circuit receiving the two or more slave power converters The sum of the negative DC bus voltages.
A modular power supply system according to claim 9 or claim 11, wherein said DC bus positive end sampler and said DC bus negative end sampler comprise resistors.
The modular power supply system of claim 5 wherein said sampling conditioning circuit comprises a dual operational amplifier.
A modular power system configured to include:

a main controller configured to output a main control signal;

N local controllers, wherein each of the local controllers is configured to receive the main control signal to output at least one local control signal;

N power units, one-to-one corresponding to the N local controllers, wherein each of the power units includes a first end and a second end, and the second end of each of the power units is connected to an adjacent one The first end of one of the power units, each of the power units being configured to include M power converters, wherein each of the power converters includes a third end and a fourth end, each of the power The fourth end of the converter is coupled to the third end of an adjacent one of the power converters, and the third end of the first one of the power converters is the first of the power units And at one end, the fourth end of the Mth power converter is the second end of the power unit, and each of the power converters is configured to be output according to a corresponding local controller Said local control signal operation, wherein N and M are both natural numbers greater than one,

Wherein the local control signals for controlling the power semiconductor switches at the same position of the M power converters to be turned on and off are the same,

Each of the power units further includes: M sampling circuits configured to separately acquire a sum of a positive DC bus voltage of the power converter and a negative DC bus voltage, and

The local controller corresponding to the power unit is configured to include: a sampling conditioning circuit configured to convert the sum of the positive DC voltage and the negative DC voltage of the collected power converter into a digital signal.
The modular power supply system of claim 14 wherein said sampling conditioning circuit further comprises a sampling reference point, said sampling reference point being set at (M+1)/2 said power conversion when M is odd At the device, or when M is even, the sampling reference point is set at the M/2th or M/2+1th power converter.
The modular power supply system according to claim 15, wherein said sampling reference point is set at a positive terminal of a DC bus capacitor of said (M+1)/2 said power converters when said M is an odd number, or a DC The negative terminal of the bus capacitor or the midpoint of the DC bus capacitor.
The modular power supply system according to claim 15, wherein said sampling reference point is set at a positive terminal of a DC bus capacitor of said M/2 said power converter or a negative DC bus capacitor when M is an even number The midpoint of the terminal, or the DC bus capacitor, or the sampling reference point is set at the positive terminal of the DC bus capacitor of the M/2+1th power converter, or the negative terminal of the DC bus capacitor, or the DC bus capacitor The midpoint.
A modular power supply system according to claim 15, wherein two mutually connected resistors are connected in parallel across the DC bus capacitor of each of said power converters, and when M is an odd number, said sampling reference point is set at ( M+1)/2 connection points of the two resistors at the power converter.
The modular power supply system according to claim 15, wherein two resistors connected in series are connected in parallel across the DC bus capacitor of each of said power converters, and when M is an even number, said sampling reference point is set at M /2 connection points of the two resistors at the power converter, or the sampling reference point is set at the (M/2+1)th of the power converters point.
The modular power supply system of claim 15 wherein said sampling circuit comprises:

M DC bus positive-end samplers are in one-to-one correspondence with the M power converters, wherein the M DC bus positive-end samplers are respectively configured to connect one end of the corresponding DC bus capacitor of the power converter a positive end, the other end being coupled together and coupled to the first end of the sampling conditioning circuit, the first end of the sampling conditioning circuit receiving a sum of positive DC bus voltages of the M power converters;

M DC bus negative-end samplers are in one-to-one correspondence with the M power converters, wherein the M DC bus negative-end samplers are respectively configured to connect one end of the corresponding DC bus capacitor of the power converter a negative terminal coupled to the second end of the sampling conditioning circuit, the second end of the sampling conditioning circuit receiving a sum of the negative DC bus voltages of the M power converters.
The modular power supply system of claim 20 wherein said DC bus positive end sampler and said DC bus negative end sampler comprise resistors.
The modular power supply system of claim 14 wherein said sampling conditioning circuit comprises a single operational amplifier.
A modular power supply system according to claim 1 or 9 or 14, configured to further comprise:

N auxiliary power sources are in one-to-one correspondence with the N local controllers, wherein each of the auxiliary power sources is configured to provide power to a corresponding local controller.
The modular power supply system according to claim 1 or 9 or 14, wherein said auxiliary power source is powered from an external power source, or said N auxiliary power sources are in one-to-one correspondence with said N power units, each of said auxiliary The power source is configured to draw power from the corresponding power unit.
A modular power supply system according to claim 1 or 9 or 14, wherein said power converter is any one of an AC/DC converter, a DC/AC converter and a DC/DC converter.
A modular power supply system as claimed in claim 1 or claim 9 or claim 14, wherein the DC bus voltages of said M power converters are all identical, partially identical, or all different.
A modular power supply system as claimed in claim 1 or claim 9 or claim 14, wherein the topologies of said M power converters are all identical or partially identical.
A modular power supply system according to claim 1 or 9 or 14, wherein the topology of said M power converters in each of said power units is a full bridge converter, a half bridge converter, a neutral point One of a controllable three-level converter, a diode clamped three-level converter, a flying capacitor three-level converter, a full-bridge resonant converter, and a half-bridge resonant converter.