US20180061743A1 - Flexible Circuit Substrate With Temporary Supports and Equalized Lateral Expansion - Google Patents
Flexible Circuit Substrate With Temporary Supports and Equalized Lateral Expansion Download PDFInfo
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- US20180061743A1 US20180061743A1 US15/415,496 US201715415496A US2018061743A1 US 20180061743 A1 US20180061743 A1 US 20180061743A1 US 201715415496 A US201715415496 A US 201715415496A US 2018061743 A1 US2018061743 A1 US 2018061743A1
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- flexible circuit
- circuit substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/053—Tails
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09127—PCB or component having an integral separable or breakable part
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
Definitions
- FIG. 12 is a diagram of an illustrative pair of component mounting regions formed from flexible circuit substrate material that have been coupled by temporary support structures that are separate from the flexible circuit substrate material in accordance with an embodiment.
- Flexible circuit substrate 22 may be formed from a flexible polymer such as polyimide or other flexible dielectric.
- Substrate 22 may, for example, include one or more, two or more, or three or more sheets of laminated polyimide (as examples).
- Metal traces may be formed on one or both sides of substrate 22 and/or may be embedded between polyimide sublayers in substrate layer 22 .
- Substrate 22 may be patterned using laser cutting, die cutting, etching, photoimaging (e.g., using a mask to expose and develop a photoimageable to form polymer substrate 22 ), printing and/or other suitable patterning techniques.
- tethers 34 may be left in place in substrate 22 at locations that bridge gaps 36 between component mounting regions 22 CM and interconnect paths 22 I or at other suitable locations that help provide temporary support to substrate 22 (e.g., temporary coupling between component mounting regions 22 M).
- component 16 Once component 16 has been mounted in structure 12 , component 16 may be flexed or otherwise manipulated to break tethers 34 and thereby release serpentine interconnect paths 22 I. This ensures that flexible circuit substrate 22 and component 16 will achieve its desired maximum flexibility during normal use of item 10 .
Abstract
An item may have a flexible support structure and may include a flexible component. The flexible component may have electrical components mounted on component mounting regions in a flexible circuit substrate. The component mounting regions may be interconnected by serpentine interconnect paths or other flexible interconnect paths. The flexible circuit substrate and component mounting regions may extend along a longitudinal axis of the flexible component or may form a two-dimensional array. Two-dimensional mesh-shaped flexible circuit substrates may be used in forming displays. The mesh-shaped flexible circuit substrates may be auxetic substrates that widen when stretched (e.g., structures with a negative Poisson's ratio that become thicker perpendicular to applied force when stretched) and that therefore reduce image distortion. Temporary tethers may help hold flexible circuit substrates together until intentionally broken following assembly of a flexible component into the flexible support structure.
Description
- This application claims the benefit of provisional patent application No. 62/381,382, filed Aug. 30, 2016, which is hereby incorporated by reference herein in its entirety.
- This relates generally to components formed from flexible circuit substrates, and, more particularly, to items formed from components with flexible circuit substrates having regions interconnected by elongated interconnect paths.
- Electrical components such as integrated circuits can be mounted on dielectric substrates. Signals may be routed between electrical components using metal traces on a dielectric substrate. Some substrates such as rigid printed circuit boards are inflexible. Other substrates such as flexible printed circuit substrates may bend, thereby allowing these substrates to be used in applications were the inflexible nature of rigid printed circuit boards would not be acceptable.
- It can be challenging to form flexible circuit substrates with desired attributes. If care is not taken, a flexible circuit substrate may be insufficiently flexible or may be insufficiently robust. Flexible circuit substrates may also distort undesirably when stressed.
- An item may have a flexible support structure. The flexible support structure may be formed from a stretchable material such as fabric, elastomeric polymer, or other stretchable structures. The item may include a flexible component that is supported by the flexible support structure. For example, the item may have a flexible component that is embedded within a fabric structure or that is attached to an elastomeric plastic support. The flexible component may have a flexible circuit substrate. The flexible component may also have electrical components mounted on component mounting regions in the flexible circuit substrate. The component mounting regions may be interconnected by serpentine interconnect paths or other flexible interconnect paths in the flexible circuit substrate.
- The flexible circuit substrate may have an elongated shape that extends along a longitudinal flexible component axis or may have a two-dimensional shape. The electrical components mounted on the component mounting regions of the flexible circuit substrate may include touch sensors and other sensors, light-based components such as light-emitting diodes, communications and control circuit, and other circuitry. Two-dimensional mesh-shaped flexible circuit substrates may be used in forming displays. The mesh-shaped flexible circuit substrates may be auxetic substrates that widen when stretched (e.g., structures with a negative Poisson's ratio that become thicker perpendicular to applied force when stretched). A flexible component such as a flexible display that uses an auxetic substrate may exhibit reduced image distortion.
- Temporary tethers may help hold flexible circuit substrates together until intentionally broken following assembly of a flexible component and flexible support structure to form an item. The temporary tethers may be formed from integral portions of a flexible circuit substrate or separate structures and may have selectively narrowed portions to facilitate splitting the tethers in known locations.
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FIG. 1 is a diagram of an illustrative item of the type that may include circuitry mounted on a flexible circuit substrate in accordance with an embodiment. -
FIG. 2 is a perspective view of circuitry on a flexible circuit substrate having component mounting regions interconnected by stretchable elongated serpentine interconnect paths in accordance with an embodiment. -
FIG. 3 is a top view of a pair of component mounting regions, an interposed serpentine interconnect path, and temporary support structures in accordance with an embodiment. -
FIGS. 4, 5, 6, 7, 8, 9, 10, and 11 are illustrative temporary support structures in accordance with embodiments. -
FIG. 12 is a diagram of an illustrative pair of component mounting regions formed from flexible circuit substrate material that have been coupled by temporary support structures that are separate from the flexible circuit substrate material in accordance with an embodiment. -
FIG. 13 is a diagram of an illustrative pair of component mounting regions formed from flexible circuit substrate material that have been coupled by temporary support structures that extend outwardly from the component mounting regions in accordance with an embodiment. -
FIG. 14 is a perspective view of an illustrative stretchable item showing how the item may be formed from a flexible circuit substrate material that expands laterally in a direction that is perpendicular to a stretching direction in accordance with an embodiment. -
FIG. 15 is a diagram of an illustrative auxetic mesh flexible circuit substrate in an unstretched configuration in accordance with an embodiment. -
FIG. 16 is a diagram of the auxetic mesh flexible circuit substrate ofFIG. 15 when stretched in accordance with an embodiment. -
FIGS. 17, 18, and 19 are diagrams of additional illustrative patterns that may be used for forming auxetic mesh flexible printed circuit substrates in accordance with embodiments. - An illustrative item that may include a component formed from a flexible circuit substrate is shown in
FIG. 1 . As shown inFIG. 1 ,item 10 may be formed fromsupport structure 12.Support structure 12 may include one or more layers of fabric or other material that includes strands of material such as strands 14 (e.g., insulating and/or conductive yarn), may be formed from sheets of plastic, molded or machined plastic structures, metal structures, structures formed from fiber-composite material, and/or structures formed from other materials.Structure 12 may form a wearable item (e.g., a band to be worn on a user's wrist), may form an electronic device housing (e.g., a housing for a cellular telephone, laptop computer, tablet computer, or other electronic device), may form a case or cover for an electronic device, and/or may form other suitable items. If desired,item 10 may be flexible. For example,structure 12 may be flexed indirections 20 aboutbend axis 18.Structures 12 may also be deformed in other directions (e.g., by stretching). - One or more components such as
illustrative component 16 may be supported bysupport structure 12. For example,component 16 may be embedded within structure 12 (e.g.,component 16 may be received within a pocket between adjacent fabric layers, may be mounted in a recess in a plastic or metal structure, may be attached to an interior and/or exterior portion ofstructure 12 using adhesive, or may otherwise be incorporated into structure 12). To accommodate deformation ofstructure 12,component 16 may be formed from a flexible circuit substrate. - An illustrative flexible electronic component formed from a flexible circuit substrate is shown in
FIG. 2 . As shown in the perspective view ofFIG. 2 , flexibleelectronic component 16 may be formed fromflexible circuit substrate 22.Flexible circuit substrate 22 may be formed from a flexible dielectric material such as polyimide or other flexible polymer that allowscomponent 16 to flex.Component 16 may, for example, stretch longitudinally outward in directions 30 (e.g., along a longitudinal axis associated with an elongated component such asillustrative component 16 ofFIG. 2 ) and/or may bend aboutbend axis 18. -
Electrical components 24 may include packaged and/or unpackaged integrated circuits or other semiconductor dies. Unpackaged circuits may be formed from bare silicon dies or other crystalline semiconductor dies. Packaged integrated circuits may be encapsulated within plastic packages. If desired, packaged circuits and/or unpackaged circuits may be mounted on interposer structures. Integrated circuit packages, interposers, and other structures for packaging and mounting circuitry associated withelectrical components 24 may be formed from plastic, ceramic, and/or other dielectric materials. -
Electrical components 24 may include devices for gathering input and/or supplying output. With one illustrative configuration,components 24 may include light-emitting diodes such as light-emitting diodes 26 and associated control and communications circuitry such ascircuitry 28. Light-emitting diodes 26 may be formed from organic light-emitting diode structures or may be formed from crystalline semiconductor dies (e.g., light-emitting diodes 26 may be micro-LEDs). There may be any suitable number of light-emittingdiodes 26 in each components 24 (e.g., one or more, two or more, three or more, etc.). The light-emitting diodes in eachcomponent 24 may be light-emittingdiodes 26 of different colors such as red, green, and blue light-emitting diodes. In general,components 24 may be any suitable electrical components (e.g., integrated circuits, discrete components, light-emitting components, light sensors, touch sensor components such as capacitive touch sensor components, light-emitting and light-detecting touch sensor components, force sensors, temperature sensors, pressure sensors, moisture sensors, other sensors, haptic output devices, audio components, etc.). Illustrative configurations in whichcomponents 24 include at least some light-emitting components such as light-emitting diodes 26 and that optionally include touch sensor components may sometimes be described herein as an example. This is, however, merely illustrative.Components 24 may be any suitable electrical components mounted toflexible circuit substrate 22. -
Flexible circuit substrate 22 may have component mounting regions such as component mounting regions 22CM that are interconnected by flexible interconnect paths (sometimes referred to as branches, arms, elongated segments, interconnects, etc.) such as flexible interconnect paths 22I.Signal routing lines 32 may be formed from metal traces in component mounting regions 22CM and interconnect paths 22I. Interconnect paths 22I may have serpentine shapes or other suitable elongated shapes (e.g., meandering elongated shapes, etc.) to promote stretching and bending without damaging signal routing lines 32.Components 24 may be soldered to signal path solder pads formed from metal traces in component mounting regions 22CM or may be coupled to signallines 32 using other suitable conductive connections (e.g., conductive connections formed from welds, conductive adhesive, etc.). Component mounting regions 22CM may be rectangular, circular, oval, may have shapes with combinations of curved and straight edges, or may have other suitable shapes. -
Flexible circuit substrate 22 may be formed from a flexible polymer such as polyimide or other flexible dielectric.Substrate 22 may, for example, include one or more, two or more, or three or more sheets of laminated polyimide (as examples). Metal traces may be formed on one or both sides ofsubstrate 22 and/or may be embedded between polyimide sublayers insubstrate layer 22. - Component mounting regions 22CM may be arranged in a line (e.g., to form a one-dimensional array), may be tiled in two dimensions (e.g., to form a two-dimensional array having rows and columns), and/or may be organized in other suitable patterns. Light-emitting
diodes 26 and other electrical devices associated withelectrical components 24 may be used to createcomponents 16 that serve as status indicator lights, displays that display images for a user, and/orother components 16.Components 24 that include sensors (e.g., capacitive touch sensing circuitry, force sensors, light-based touch sensors, etc.) can be formed in one-dimensional arrays (e.g., to serve as buttons or one-dimensional touch sensitive input devices) or may be formed in two-dimensional arrays (e.g., to form two-dimensional touch sensors). If desired, a two-dimensional mesh-shaped configuration may be used forsubstrate 22,components 24 may be mounted on a two-dimensional array of regions 22CM, andcomponent 16 may form a two-dimensional touch sensitive display (as an example). Haptic devices may be incorporated intoelectrical components 24 to providecomponent 16 with haptic output capabilities. - Whether arranged to form a one-dimensional or two-dimensional array or other suitable flexible circuit configuration,
flexible circuit substrate 22 may be delicate due to the presence of thin elongated structures such as interconnect paths 22I. To ensure thatflexible circuit substrate 22 is sufficiently robust to withstand handling during assembly such as when being attached to supportstructure 12 of item 10 (FIG. 1 ),flexible circuit substrate 22 may be provided with temporary support structures such asbreakable tethers 34 ofFIG. 3 .Tethers 34 may be formed from the same material as substrate 22 (e.g., polyimide) or may be formed from a different material (e.g., an organic or inorganic material that is coupled between opposing portions of substrate 22).Substrate 22 may be patterned using laser cutting, die cutting, etching, photoimaging (e.g., using a mask to expose and develop a photoimageable to form polymer substrate 22), printing and/or other suitable patterning techniques. During patterning, tethers 34 may be left in place insubstrate 22 at locations thatbridge gaps 36 between component mounting regions 22CM and interconnect paths 22I or at other suitable locations that help provide temporary support to substrate 22 (e.g., temporary coupling between component mounting regions 22M). Oncecomponent 16 has been mounted instructure 12,component 16 may be flexed or otherwise manipulated to breaktethers 34 and thereby release serpentine interconnect paths 22I. This ensures thatflexible circuit substrate 22 andcomponent 16 will achieve its desired maximum flexibility during normal use ofitem 10. - If desired, tethers 34 may have narrowed
portions 34′ or other selectively weakened portions.Narrowed portions 34′ serve as stress concentrators that ensure thattethers 34 break in a controllable fashion at known locations during manufacturing.Tethers 34 may all have the same strength or different tethers within the set of tethers coupling together adjacent pairs of component mounting regions 22CM may have different strengths. Tethers of different strengths can be broken by applying progressively increasing amounts of force. In the example ofFIG. 3 , the widths of narrowedportions 34′ increase progressively for tethers 34-1, 34-2, and 34-3. With this arrangement, tether 34-1 breaks relatively easily, tether 34-2 breaks with more difficulty than tether 34-2 and therefore breaks only after more force is applied than was applied to break tether 34-1, and tether 34-3 breaks when even more force is applied than was used to break tether 34-2. Different amounts of breaking force may be applied at different manufacturing stages so thatcomponent 16 has different amounts of flexibility at different stages. - In the illustrative configuration of
FIG. 3 , tethers 34 have a bowtie shape with a narrowedcentral portion 34′.FIG. 4 shows howtether 34 may be narrowed from one side.Tether 34 ofFIG. 5 has an edge with curved portions.FIG. 6 shows howtether 34 may have a sawtooth shape. In the example ofFIG. 7 ,tether 34 hasrectangular slot 38 that facilitates breakage. In the example ofFIG. 8 ,tether 34 has an oval or teardrop shapedopening 40 that facilitates breakage.Tether 34 ofFIG. 9 is selectively weakened by the presence of comb-shaped narrowing edge recesses 42.FIG. 10 shows howtether 34 may be narrowed using rectangular notches.Tether 34 ofFIG. 11 has pointed notches. - As shown in
FIG. 12 , tethers 34 may be formed from material that is separate from the material offlexible circuit substrate 22.Tethers 34 may, in general, be formed from plastic, metal, ceramic, printed material, material attached tosubstrate 22 by adhesive or other attachment mechanisms, or other suitable materials. If desired, tethers 34 may extend outwardly from component mounting regions 22CM, as shown inFIG. 13 . The configurations ofFIGS. 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, and 13 are merely illustrative. In general, tethers 34 may have any suitable shapes or sizes and may be formed from integral portions ofsubstrate 22 and/or one or more additional materials.Tethers 34 serve as temporary attachment structures that help hold component mounting regions 22CM together during assembly so that interconnect paths 22I are not damaged and may therefore sometimes be referred to as being sacrificial, breakable, temporary, etc. -
FIG. 14 shows howitem 10 may be stretchable. In the example ofFIG. 14 ,structure 12 ofitem 10 is being stretched around acylindrical object 40 indirections 42.Object 40 may be, for example, a wrist of a person, may be another human body part, may be an inanimate object, or may be any other suitable structure. In configurations such as those in whichcomponents 24 contain light-emitting diodes in a two-dimensional array to form a display that displays images for a user, distortion of displayed images may be undesirable. To preventflexible circuit substrate 22 ofitem 10 from deforming in a way that distorts displayed images asitem 10 is stretched along a first dimension (parallel to directions 42) flexible circuit substrate 22 (and, if desired, structure 12) may contain structures that expand outwardly in a perpendicular second dimension (parallel to directions 44) asflexible circuit substrate 22 is stretched indirections 42. Becausecircuit substrate 22 stretches outwardly indirections 44 asstructure 12 andcircuit substrate 22 are stretched indirections 42,substrate 22 and thecomponents 24 onsubstrate 22 will expend outwardly by equal amounts. The pitch (center-to-center spacing) ofcomponents 24 may increase, but pitch expansion will occur equally in the dimension parallel todirections 42 and in the orthogonal dimension parallel todirections 44 so the array ofcomponents 24 onsubstrate 22 will not become distorted and will not produce distorted images. - Materials that exhibit equal expansion in orthogonal directions when stretched (e.g., structures that become thicker/wider perpendicular to applied force when stretched) are characterized by a negative Poisson's ratio and may sometimes be referred to as auxetics. Distortion of the array of
components 24 incomponent 16 can therefore be minimized by formingcomponent 16 from an auxetic flexible circuit substrate. In general,substrate 22 may be provided with any suitable patterns of component mounting regions and interconnect paths 22I that form an auxetic flexible circuit substrate. For example,substrate 22 may be formed from an auxetic mesh-shaped patterned polyimide layer or other substrate shape in which paths 22I help laterally press apartsubstrate 22 when stretched. -
FIGS. 15 and 16 are top views of an illustrativeflexible circuit substrate 22 that has an auxetic configuration. Initially,substrate 22 may have an unexpanded configuration of the type shown inFIG. 15 . Whensubstrate 22 ofFIG. 15 is stretched outwardly indirections 42, each component mounting region 22CM will rotate, as shown byarrows 46 ofFIG. 15 . This causes elongated interconnect paths 22I to move into the configuration ofFIG. 16 so that component mounting regions 22CM andcomponents 24 on regions 22CM are moved outwardly indirection 44 and so thatsubstrate 22 expands equally in bothdirections 42 anddirections 44. Interconnect paths 22I may be elongated straight segments (as shown inFIG. 16 ) or may have elongated serpentine shapes as shown inFIG. 2 . Substrates such assubstrates 22 ofFIGS. 15 and 16 may sometimes be referred to as auxetic mesh substrates because interconnect paths 22I form a two-dimensional lattice interconnecting a two-dimensional array of component mounting regions 22CM andcomponents 24. - Additional illustrative mesh-shaped
flexible circuit substrates 22 forcomponent 16 are shown inFIGS. 17, 18, and 19 . As shown inFIGS. 17, 18, and 19 ,substrate 22 may have various different auxetic mesh patterns that expand equally indirections direction 42. The flexible circuit substrate may, if desired, include optional non-auxetic portions 22NA (i.e., flexible substrate regions with positive Poisson's ratio) formed from serpentine interconnect paths 22I′ or other suitable substrate material. As shown inFIGS. 17, 18, and 19 ,temporary tethers 34 may, if desired, be used in holding paths 22I and/or 22I′ of the flexible circuit substrates ofFIGS. 17, 18, and 19 together ascomponents 16 are assembled withstructures 12 to formitem 10. - The foregoing is merely illustrative and various modifications can be made to the described embodiments. The foregoing embodiments may be implemented individually or in any combination.
Claims (20)
1. A flexible component, comprising:
a flexible circuit substrate having a plurality of component mounting regions interconnected by flexible interconnect paths;
temporary tethers that are configured to temporarily couple the component mounting regions together and strengthen the flexible circuit substrate until the temporary tethers are broken during assembly of the flexible component into an item;
metal lines in the flexible circuit substrate; and
electrical components that are mounted to the component mounting regions and that are interconnected by the metal lines.
2. The flexible component defined in claim 1 wherein each of the temporary tethers has a narrowed region that facilitates breaking of the temporary tethers.
3. The flexible component defined in claim 2 wherein the electrical components each include at least one light-emitting diode.
4. The flexible circuit substrate defined in claim 3 wherein the flexible circuit substrate comprises a polyimide layer, wherein the flexible interconnect paths comprise serpentine portions of the polyimide layer that extend from the component mounting regions, and wherein the temporary tethers are formed from integral portions of the polyimide layer.
5. The flexible component defined in claim 1 wherein the flexible circuit substrate is an elongated flexible circuit substrate having a longitudinal axis, wherein the component mounting regions extend along the longitudinal axis, wherein the component mounting regions include adjacent pairs of component mounting regions, wherein each pair of adjacent component mounting regions is coupled by a respective set of the temporary tethers, and wherein each set of temporary tethers includes at least first and second tethers of different strengths.
6. A flexible component, comprising:
an auxetic mesh-shaped flexible circuit substrate having a plurality of component mounting regions interconnected by flexible interconnect paths;
metal lines in the flexible circuit substrate; and
electrical components mounted to each of the component mounting regions and interconnected by the metal lines.
7. The flexible component defined in claim 6 wherein the electrical components each include at least one light-emitting diode.
8. The flexible component defined in claim 6 wherein the auxetic mesh-shaped flexible circuit substrate comprises a layer of polyimide and wherein the electrical components each include at least three light-emitting diodes of different colors.
9. The flexible component defined in claim 6 further comprising a non-auxetic flexible substrate coupled to the auxetic mesh-shaped flexible substrate.
10. An item, comprising:
a flexible support structure;
an auxetic mesh-shaped flexible circuit substrate having a two-dimensional array of component mounting regions coupled by interconnect paths; and
an array of electrical components, wherein each electrical component is mounted to a respective one of the component mounting regions and is interconnected to at least one other of the electrical components with metal traces in the auxetic mesh-shaped flexible circuit substrate.
11. The item defined in claim 10 wherein the auxetic mesh-shaped flexible circuit substrate comprises polyimide and wherein each electrical component includes at least one crystalline semiconductor die.
12. The item defined in claim 11 wherein each crystalline semiconductor die comprises a light-emitting diode.
13. The item defined in claim 10 wherein the flexible support structure comprises fabric and wherein each electrical component comprises a light-emitting diode.
14. The item defined in claim 10 wherein the flexible circuit substrate comprises a polymer and wherein portions of the flexible circuit substrate form broken temporary tethers.
15. The item defined in claim 14 wherein each broken temporary tether has a portion coupled to one of the interconnect paths.
16. The item defined in claim 10 wherein each electrical component comprises a communications circuit and at least three light-emitting diodes.
17. The item defined in claim 16 wherein each of the light-emitting diodes has a different color and is formed from a respective crystalline semiconductor die.
18. The item defined in claim 17 wherein the support structure comprises strands of material and is configured to stretch.
19. The item defined in claim 10 wherein the electrical components include sensors.
20. The item defined in claim 10 further comprising a non-auxetic flexible circuit substrate structure coupled to the auxetic flexible circuit substrate.
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PCT/US2017/047198 WO2018044574A1 (en) | 2016-08-30 | 2017-08-16 | Flexible circuit substrate with temporary supports and equalized lateral expansion |
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US201662381382P | 2016-08-30 | 2016-08-30 | |
US15/415,496 US10199323B2 (en) | 2016-08-30 | 2017-01-25 | Flexible circuit substrate with temporary supports and equalized lateral expansion |
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