JP2017183148A - Conductive member and laminate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a conductive member having a metal including layer and an adhesive layer, capable of preventing migration from occurring.SOLUTION: A conductive member includes: a metal-including layer in which metal particles are dispersed in a resin material; and an adhesive layer on one side of the metal-including layer. The adhesive layer includes ammonia and amine of 10 ng/g or less in total. The conductive member includes a removal substrate on a side opposite to the metal-including layer of the adhesive layer. A laminate includes a conductive member having a metal-including layer in which metal particles are dispersed in a resin material and an adhesive layer on one side of the metal-including layer, and a functional layer on a side closer to the adhesive layer of the conductive member. The adhesive layer includes ammonia and amine of 10 ng/g or less in total.SELECTED DRAWING: Figure 1

Description

  An embodiment of the present disclosure relates to a conductive member having a metal-containing layer in which metal particles are dispersed in a resin material.

  In recent years, metal particles have attracted attention as conductive materials used for conductive members. The conductive member using metal particles has, for example, a metal-containing layer in which metal particles are dispersed in a resin material.

  By the way, conventionally, the occurrence of migration of the conductive member has been a problem. Migration is a phenomenon in which, when a voltage is applied to the conductive member, metal particles contained in the metal-containing layer move as metal ions and, for example, metal is deposited in the insulating region. When migration occurs, for example, when a conductive member is used as a wiring base material for a touch panel, problems such as a short circuit may occur.

JP 2014-29671 A

  By the way, when using an electroconductive member as a wiring base material of a touch panel, an electroconductive member, ie, a metal containing layer, is usually bonded to a transparent base material by the adhesion layer. However, in the configuration in which the adhesive layer is disposed on the surface of the metal-containing layer, there is a problem that the occurrence of migration becomes significant.

  The present disclosure has been made in view of the above problems, and a main object thereof is to provide a conductive member that has a metal-containing layer and an adhesive layer and can suppress the occurrence of migration.

  One embodiment of the present disclosure has a metal-containing layer in which metal particles are dispersed in a resin material, and an adhesive layer on one surface of the metal-containing layer, and includes ammonia and Provided is a conductive member having a total amount of amines of 10 ng / g or less.

  In one embodiment of the present disclosure, a conductive member having a release substrate on a surface of the adhesive layer opposite to the metal-containing layer is provided.

  One embodiment of the present disclosure includes a metal-containing layer in which metal particles are dispersed in a resin material, a conductive member having an adhesive layer on one surface of the metal-containing layer, and the adhesive layer of the conductive member And a functional layer on the side surface, wherein the total amount of ammonia and amines contained in the adhesive layer is 10 ng / g or less.

  In one embodiment of the present disclosure, even if the adhesive layer is provided on one surface of the metal-containing layer, there is an effect that a conductive member that can suppress the occurrence of migration can be obtained.

It is a schematic sectional drawing which shows an example of the electroconductive member of this indication. It is a schematic sectional drawing which shows the other example of the electroconductive member of this indication. It is a schematic sectional drawing which shows the other example of the electroconductive member of this indication. It is a schematic sectional view showing an example of a layered product of this indication. It is explanatory drawing for demonstrating the evaluation method of wiring alteration width.

  In this specification, when a certain configuration such as a certain member or a certain region is “above (or below)” another configuration such as another member or another region, unless otherwise limited, This includes not only when directly above (or directly below) another configuration, but also when above (or below) another configuration, i.e., another configuration above (or below) another configuration. This includes cases where elements are included.

  Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. However, the present disclosure can be implemented in many different modes, and should not be construed as being limited to the description of the embodiments described below. Further, in order to clarify the description, the drawings may be schematically represented with respect to the width, thickness, shape, etc. of each part as compared with the embodiment, but are merely examples, and the interpretation of the present disclosure may be interpreted. It is not limited. In addition, in the present specification and each drawing, elements similar to those described above with reference to the previous drawings are denoted by the same reference numerals, and detailed description may be omitted as appropriate. Further, for convenience of explanation, the description may be made using the terms “upper” or “lower”, but the vertical direction may be reversed.

  Hereinafter, the conductive member and the laminate in one embodiment of the present disclosure will be described.

A. Conductive Member The conductive member of one embodiment of the present disclosure includes a metal-containing layer in which metal particles are dispersed in a resin material, and an adhesive layer on one surface of the metal-containing layer, and the adhesive A member in which the total amount of ammonia and amines contained in the layer is 10 ng / g or less.

A conductive member according to an embodiment of the present disclosure will be described with reference to the drawings.
FIG. 1 is a schematic cross-sectional view illustrating an example of a conductive member in one embodiment of the present disclosure. As shown in FIG. 1, the conductive member 10 of the present disclosure includes a metal-containing layer 1 in which metal particles are dispersed in a resin material, and an adhesive layer 2 on one surface of the metal-containing layer. In one embodiment of the present disclosure, the total amount of ammonia and amines contained in the adhesive layer is 10 ng / g or less.

According to the conductive member of one embodiment of the present disclosure, it is possible to provide a conductive member that can suppress the occurrence of migration even if the adhesive layer is provided on one surface of the metal-containing layer.
The specific reason why such an effect can be obtained is as follows.

  Conventionally, the occurrence of migration has been one of the problems in conductive members. Migration is a phenomenon in which, when a voltage is applied to the conductive member, metal particles contained in the metal-containing layer move as metal ions and, for example, metal is deposited in the insulating region. Therefore, when a conductive member is used for a sensor electrode or the like of a touch panel, there is a problem that a malfunction such as a short circuit occurs due to the occurrence of migration. Therefore, the present inventors have repeatedly examined the occurrence of migration, and in the case of a conductive member having a configuration in which an adhesive layer is disposed on the surface of the metal-containing layer, the problem that the occurrence of migration is particularly noticeable. Newly discovered.

  The present inventors have repeatedly studied the reason why the occurrence of migration becomes significant when using a conductive member having a configuration in which an adhesive layer is disposed on the surface of a metal-containing layer. As a result, a new finding was obtained that ammonia and amines contained in the adhesive layer had an effect. Specifically, it is as follows. First, ammonia and amines are considered to have a lone pair and react with silver oxide as shown in the following formula, other silver halides, and the like to form a complex. Since the complex is ionized and has a charge, it is considered that the complex is easily moved by applying a voltage to form a gradient. For these reasons, when the adhesive layer is arranged on the surface of the metal-containing layer, the metal ions easily move due to ammonia and amines contained in the adhesive layer, and the occurrence of migration is remarkable. It is thought that it becomes.

  Therefore, according to one embodiment of the present disclosure, the total amount of ammonia and amines contained in the adhesive layer is within a predetermined range even if the adhesive layer is provided on one surface of the metal-containing layer. Thus, it is considered that the above-described reaction can be suppressed and the occurrence of migration can be suppressed. In addition, although the case where the metal particle contained in a metal content layer is a silver particle was demonstrated as a specific example here, it is the same also in other metal particles, such as a copper particle.

  Hereinafter, each structure of the electroconductive member in one embodiment of this indication is explained.

1. Adhesion layer The adhesion layer in one embodiment of this indication is a member arranged on one side of a metal content layer. In one embodiment of the present disclosure, the total amount of ammonia and amines contained in the adhesive layer is 10 ng / g or less.

  In one embodiment of the present disclosure, the total amount of ammonia and amines contained in the adhesive layer may be 10 ng / g or less, preferably 7 ng / g or less, particularly 1 ng / g or less. Is preferred. When the total amount of ammonia and amines contained in the adhesive layer is within the above range, ammonia or amines contained in the adhesive layer reacts with metal particles contained in the metal-containing layer to become metal ions. Can be suppressed. Therefore, when a voltage is applied to the conductive member, the metal ions move, and the occurrence of defects such as metal deposition in an insulating region having no conductivity can be suppressed.

  The “amines” used herein refer to primary amines, secondary amines, tertiary amines, and the like, and specifically include monomethylamine, dimethylamine, triethylamine, and the like.

The total amount of ammonia and amines contained in the adhesive layer can be measured by the following method. For example, the adhesive layer is put in a polypropylene bag, 60 ml of ultrapure water is further added, and the adhesive layer is immersed in the ultrapure water in the bag. Next, the bag is sealed with a heat sealer, placed in a 100 ° C. water bath, and allowed to stand for 1 hour. Thereby, the component contained in the adhesion layer is eluted in ultrapure water. Finally, the total amount of ammonia and amines contained in the adhesive layer can be measured by measuring the ion concentration of the obtained eluate using an ion chromatograph ICS-3000.
When a liquid adhesive layer forming composition is used as the adhesive layer, a liquid adhesive layer forming composition is applied on a substrate and dried, in the same manner as described above. The total amount of ammonia and amines can be measured.

  The pressure-sensitive adhesive layer in one embodiment of the present disclosure may be in the form of a sheet, or may be a liquid pressure-sensitive adhesive layer forming composition applied and dried. When the pressure-sensitive adhesive layer is in the form of a sheet, it can be arranged by bonding a sheet-like pressure-sensitive adhesive layer on one surface of the metal-containing layer. Moreover, when an adhesion layer is a liquid, it can arrange | position by apply | coating and drying the liquid material which comprises an adhesion layer on one surface of a metal containing layer.

  The adhesive layer forming composition constituting the adhesive layer is not particularly limited as long as it can be used for the conductive member and the total amount of ammonia and amines is 10 ng / g or less. As the adhesive layer forming composition constituting such an adhesive layer, for example, an acrylic adhesive composition, a urethane adhesive composition, a silicone adhesive composition, or the like can be used. Among these, it is preferable to use an acrylic pressure-sensitive adhesive composition. When an acrylic pressure-sensitive adhesive composition is used, superior adhesive strength, heat resistance, and weather resistance can be obtained compared to a urethane-based pressure-sensitive adhesive composition. Moreover, the adhesive force outstanding compared with the silicone type adhesive composition can be obtained, and it is excellent also in terms of cost.

  When an acrylic pressure-sensitive adhesive composition is used as the material for the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer-forming composition may be a thermosetting pressure-sensitive adhesive composition containing a main resin and a curing agent, or the main resin and ionizing radiation polymerization. It may be an electron beam curable pressure-sensitive adhesive composition containing a polymerizable monomer or oligomer. Here, “ionizing radiation” means an electromagnetic wave or charged particle beam having an energy quantum capable of polymerizing or cross-linking molecules, and usually an ultraviolet ray or an electron beam is used. Electromagnetic waves such as γ rays, and charged particle beams such as α rays and ion rays can also be used.

  Examples of the main resin used in the acrylic pressure-sensitive adhesive composition include an acrylate copolymer obtained by copolymerizing an acrylate ester with another monomer. Examples of the acrylic ester include ethyl acrylate, acrylic acid-n-butyl, acrylic acid-2-ethylhexyl, isooctyl acrylate, hydroxylethyl acrylate, acrylamide, and the like. These can be used alone or in combination of two or more.

  As the curing agent used in the acrylic pressure-sensitive adhesive composition, for example, an isocyanate curing agent and an epoxy curing agent are widely used. As an isocyanate curing agent, for example, a polyisocyanate compound, a trimer of a polyisocyanate compound, a urethane prepolymer having a terminal isocyanate group obtained by reacting a polyisocyanate compound and a polyol compound, and 3 amounts of the urethane prepolymer Examples include the body. Examples of the polyisocyanate compound include 2,4-tolylene diisocyanate, 2,5-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylylene diisocyanate, hexamethylene diisocyanate, and the like. Examples of epoxy curing agents include bisphenol A, epichlorohydrin type epoxy resins; ethylene glycol glycidyl ether, polyethylene glycol diglycidyl ether, glycerin diglycidyl ether, 1,6-hexanediol diglycidyl ether, N, N, N ′ , N′-tetraglycidyl-m-xylenediamine and 1,3-bis (N, N′-diglycidylaminomethyl) cyclohexane. These can be used alone or in combination.

  Examples of the ionizing radiation polymerizable monomer or oligomer used in the acrylic pressure-sensitive adhesive composition include oligomers such as photo radical polymerizable, photo cationic polymerizable, and photo anionic polymerizable. Among these, a photo-radically polymerizable monomer or oligomer is preferable. This is because the curing speed is high and a wide variety of compounds can be selected.

  When an ionizing radiation polymerizable monomer or oligomer is used in the acrylic adhesive composition, the purpose is to increase the sensitivity of the ionizing radiation polymerizable monomer or oligomer, and to reduce the polymerization curing time by ionizing radiation and the irradiation dose of ionizing radiation. It is preferable to add a polymerization initiator.

  In addition to the materials described above, the pressure-sensitive adhesive layer according to one embodiment of the present disclosure includes a plasticizer, a metal chelating agent, a silane coupling agent, a dispersant, an antifoaming agent, a light stabilizer, and an ultraviolet absorber as necessary. An agent, a heat stabilizer, an antioxidant and the like can be added. These can use a well-known thing without a restriction | limiting in particular, According to the performance calculated | required by the adhesion layer, it can select suitably.

  The thickness of the pressure-sensitive adhesive layer can be appropriately adjusted according to the use of the conductive member in one embodiment of the present disclosure. For example, the thickness of the adhesive layer is preferably 25 μm or more, more preferably 50 μm or more, and particularly preferably 100 μm or more. The thickness of the pressure-sensitive adhesive layer is, for example, preferably 500 μm or less, more preferably 300 μm or less, and particularly preferably 200 μm or less. When the thickness of the adhesive layer is within the above range, predetermined adhesiveness can be obtained, and flexibility can be imparted to the conductive member.

  Examples of the method for forming the pressure-sensitive adhesive layer in one embodiment of the present disclosure include a method of bonding a sheet-like pressure-sensitive adhesive layer on one surface of the metal-containing layer when the pressure-sensitive adhesive layer is in the form of a sheet. . On the other hand, in the case of using a liquid pressure-sensitive adhesive layer forming composition, a method of applying the liquid pressure-sensitive adhesive layer forming composition on one surface of the metal-containing layer and drying it can be mentioned. Examples of the coating method used at this time include known methods such as spin coating, roll coating, die coating, spray coating, and bead coating.

2. Metal-containing layer The metal-containing layer in one embodiment of the present disclosure is a member in which metal particles are dispersed in a resin material.

  Here, the “resin material” is a concept including monomers, oligomers, polymers and the like unless otherwise specified.

The “particles” mean, for example, those having an average primary particle diameter of 0.1 nm or more and 100 μm or less and having a shape such as a fiber shape, a spherical shape, and a scale shape.
In addition, an average primary particle diameter can be calculated | required by the method of measuring the magnitude | size of a primary particle directly from an electron micrograph. Specifically, when the “particles” are fibrous, a particle image was measured with a transmission electron micrograph (TEM) (for example, H-7650 manufactured by Hitachi High-Tech), and 100 randomly selected primary particles. The average length of the short axis, that is, the average value of the fiber diameters can be used as the average primary particle diameter. In addition, when the “particles” have other shapes such as a spherical shape or a scale shape, the particle image is measured by TEM, and the average length of the longest part of 100 randomly selected primary particles is determined as the average primary particle size. It can be a diameter.

  For example, as shown in FIG. 1, the metal-containing layer according to one embodiment of the present disclosure is a conductive material in which metal particles are uniformly dispersed throughout the metal-containing layer 1 and the entire region of the metal-containing layer 1 has predetermined conductivity. The part 1a may be sufficient, or as shown in FIGS. 2 (a) and 2 (b), metal particles may be dispersed non-uniformly in the metal-containing layer. Specifically, as shown in FIG. 2 (a), metal particles concentrate on the surface layer on the adhesive layer 2 side of the metal-containing layer 1, and the surface layer on the adhesive layer 2 side of the metal-containing layer 1 has a predetermined conductivity. The conductive portion 1a having the metal layer 1 and the surface layer opposite to the adhesive layer 2 may be the non-conductive portion 1b. Moreover, as shown in FIG.2 (b), metal particles concentrate on the surface layer on the opposite side to the adhesion layer 2 of the metal containing layer 1, and the surface layer on the opposite side to the adhesion layer 2 of the metal containing layer 1 is predetermined | prescribed. It is the electroconductive part 1a which has electroconductivity, and the surface layer by the side of the adhesion layer 2 of the metal containing layer 1 may be the nonelectroconductive part 1b.

Here, the “surface layer” refers to a region near the surface of the metal-containing layer. In addition, “conductive portion” refers to a region having conductivity by metal particles, and “non-conductive portion” refers to a region other than the conductive portion in the metal-containing layer. Note that “having conductivity” means that the surface resistance value is, for example, 1 × 10 ⁶ Ω / □ or less.

  Since the thickness of the metal-containing layer in one embodiment of the present disclosure can be appropriately adjusted according to the use of the conductive member, the size of the metal particles contained in the metal-containing layer, and the like, description thereof is omitted here. .

  Hereinafter, the metal-containing layer in one embodiment of the present disclosure will be described separately for a conductive portion and a non-conductive portion.

(1) Conductive portion The metal-containing layer in one embodiment of the present disclosure may be, for example, as shown in FIG. 1, the entire region of the metal-containing layer 1 may be the conductive portion 1a, or FIG. As shown in FIG. 5, any one surface layer of the metal-containing layer 1 may be the conductive portion 1 a.

In one embodiment of the present disclosure, the conductive part in the metal-containing layer can have a predetermined amount or more of metal particles, whereby a conductive member having desired conductivity can be obtained. The conductivity of the conductive part can be adjusted as appropriate according to the use of the conductive member in one embodiment of the present disclosure. For example, the surface resistance value of the conductive part may be 1000Ω / □ or less. Among them, 500Ω / □ or less is preferable, and 100Ω / □ or less is particularly preferable. When the surface resistance value of the conductive portion in the metal-containing layer is within the above range, a conductive member having desired conductivity can be obtained. In one embodiment of the present disclosure, the surface resistance value of the conductive part can be 1 × 10 ⁶ Ω / □ or more.

  The surface resistance value of the conductive part can be measured, for example, by bringing Loresta-AX MCP-T370 (Mitsubishi Chemical Analytec) into contact with the surface of the conductive part.

  In the metal-containing layer in one embodiment of the present disclosure, metal particles are dispersed in a resin material. In other words, the metal material is embedded in the resin material. The content of the metal particles contained in the metal-containing layer in one embodiment of the present disclosure is preferably such that the metal-containing layer can achieve desired conductivity, for example. Specifically, the metal particles are preferably 20 parts by weight or more with respect to 100 parts by weight of the resin material, and more preferably 50 parts by weight or more. Further, the metal particles are preferably 3000 parts by weight or less with respect to 100 parts by weight of the resin material, and the content of the metal particles contained in the resin material preferably 1000 parts by weight or less is within the above range. Therefore, a conductive member having sufficient conductivity can be obtained.

In the conductive part according to one embodiment of the present disclosure, for example, the ratio of the element of the metal particles is preferably 0.05 at% or more, more preferably 0.10 at% or more, particularly in terms of atomic composition percentage. It is preferable that it is 0.15 at% or more. Further, the ratio of the elements of the metal particles is preferably 10 at% or less in terms of atomic composition percentage, more preferably 7 at% or less, and particularly preferably 5 at% or less. When the ratio of the elements of the metal particles in the conductive portion is within the above range, predetermined conductivity can be imparted to the conductive portion.
In addition, the ratio of the element of the metal particle which exists in an electroconductive part can be measured on condition of the following using X-ray photoelectron spectroscopy, for example.
・ Acceleration voltage: 15 kV
・ Emission current: 10mA
・ X-ray source: A1 dual anode ・ Measurement area: 300 × 700 μmφ
・ Measured depth of 10nm from the surface ・ Average of n = 3 times

  The thickness of the conductive part in one embodiment of the present disclosure can be appropriately adjusted according to the use of the conductive base material, the size of the metal particles contained in the conductive part, and the like, and is not particularly limited. For example, when the metal particles contained in the conductive part are fibrous, the thickness of the conductive part is preferably less than the fiber diameter. In addition, since the fiber diameter of a metal particle is mentioned later, description here is abbreviate | omitted.

(A) Metal particle The metal particle in one embodiment of this indication is a material contained in an electroconductive part, and is a material disperse | distributed in a resin material.

  Examples of the metal particles in one embodiment of the present disclosure include particles made of gold, silver, copper, palladium, platinum, or the like. In one embodiment of the present disclosure, silver particles or copper particles are particularly preferable, and silver particles are particularly preferable. It is because the effect that generation | occurrence | production of migration can be suppressed becomes remarkable by using the electroconductive member in one embodiment of this indication. The metal particles contained in the conductive part may have one kind or two or more kinds.

Here, “silver” refers to silver or a silver alloy, and “copper” refers to copper or a copper alloy.
In addition, “silver alloy” refers to an alloy containing silver as a main component and containing silver to such an extent that migration occurs when used in a conductive member. Specifically, the proportion of silver element is the atomic composition percentage. It means 90 at% or more.
Furthermore, “copper alloy” refers to an alloy containing copper as a main component and containing copper to such an extent that migration occurs when used in a conductive member. Specifically, the ratio of the element of copper is the atomic composition percentage. It means 90 at% or more.
In addition, the ratio of the element of silver or copper in a silver alloy or a copper alloy can be measured by quantifying the element using X-ray photoelectron spectroscopy, for example.

  The shape of the metal particles in one embodiment of the present disclosure is preferably a shape that can be dispersed in the resin material and can constitute a conductive part having conductivity. For example, shapes such as a fiber shape, a spherical shape, and a scale shape are exemplified. In one embodiment of the present disclosure, it is particularly preferable to use fibrous metal particles.

Here, “fibrous” means, for example, a shape in which the ratio of the length of the long axis to the length of the short axis, that is, the aspect ratio (length of the long axis / length of the short axis) is greater than 10. Say.
Further, the “metal particles having a fibrous shape” may be linear or curved, and may have a linear portion or a curved portion in a part thereof. Furthermore, the “metal particles having a fibrous shape” includes, for example, a case where a plurality of metallic particles having a fibrous shape are connected.

  In one embodiment of the present disclosure, when the metal particles are fibrous, for example, it is preferable that the fiber diameter serving as the length of the short axis is 200 nm or less and the fiber length serving as the length of the long axis is 1 μm or more. When the fiber diameter is within the above range, it is possible to suppress an increase in haze value of the conductive member and a decrease in light transmittance.

  When the metal particles are fibrous, for example, the fiber diameter is preferably 10 nm or more. In this case, a conductive part having sufficient conductivity can be formed. Furthermore, when the fiber length is within the above range, it is possible to form a conductive portion having sufficient conductivity.

  Furthermore, when the metal particles are fibrous, for example, the fiber length is preferably 500 μm or less. In this case, it is possible to suppress an increase in haze value due to aggregation and a decrease in light transmittance. Is possible.

Considering the above-described matters when the metal particles are fibrous, in one embodiment of the present disclosure, the fiber diameter of the metal particles is preferably 15 nm or more, and preferably 180 nm or less.
Moreover, it is preferable that the fiber length of a metal particle is 3 micrometers or more, and it is preferable that it is 10 micrometers or more especially. Moreover, it is preferable that the fiber length of a metal particle is 300 micrometers or less, and it is preferable that it is 30 micrometers or less especially.

  The fiber diameter and fiber length of the metal particles are 1000 to 500,000 times using an electron microscope such as a scanning electron microscope called SEM, a transmission electron microscope called TEM, and a scanning transmission electron microscope called STEM. Can be obtained as an average value of 10 places where the fiber diameter and fiber length of the fibrous metal particles are measured.

  When the metal particles in one embodiment of the present disclosure are silver particles or copper particles and are fibrous, the silver particles and copper particles may be metal fibers such as so-called silver nanowires and copper nanowires, or Further, it may be a metal-coated synthetic fiber obtained by coating acrylic fiber with silver or copper. In one embodiment of the present disclosure, one type of metal fiber or metal-coated synthetic fiber may be used, or a combination of metal fiber and metal-coated synthetic fiber may be used.

  When the metal particles in one embodiment of the present disclosure are metal fibers, examples of the method for forming the metal particles include a wire drawing method for extending a metal such as silver or copper, a cutting method, or the like. Moreover, when a metal particle is a metal covering synthetic fiber, as a formation method of a metal particle, the method of coating metals, such as silver and copper, on an acrylic fiber is mentioned, for example.

(B) Resin material The resin material in one embodiment of this indication is a material contained in an electroconductive part, and is a material in which the metal particle mentioned above is disperse | distributed.

  The resin material in one embodiment of the present disclosure is preferably a resin material in which the above-described metal particles can be dispersed, for example, a material having transparency. Here, “transparent” means, unless otherwise specified, for example, when the conductive member according to one embodiment of the present disclosure is used for a touch panel display device or the like, it is transparent to the extent that visual recognition from the operator is not hindered. It means that. Therefore, “transparent” includes colorless and transparent, and colored transparency that does not hinder visibility, is not defined by strict transmittance, and is transparent according to the use of the conductive member in one embodiment of the present disclosure. The degree of sex can be determined.

  Such a resin material in one embodiment of the present disclosure is preferably, for example, an ionizing radiation curable resin that is cured by ionizing radiation. Here, “ionizing radiation” means an electromagnetic wave or charged particle beam having an energy quantum capable of polymerizing or cross-linking molecules, and usually an ultraviolet ray or an electron beam is used. Electromagnetic waves such as γ rays, and charged particle beams such as α rays and ion rays can also be used.

  Examples of the ionizing radiation curable resin include compounds having one or more unsaturated bonds such as compounds having a functional group such as acrylate. Examples of the compound having one unsaturated bond include ethyl (meth) acrylate, ethylhexyl (meth) acrylate, styrene, methylstyrene, N-vinylpyrrolidone and the like. Examples of the compound having two or more unsaturated bonds include trimethylolpropane tri (meth) acrylate, tripropylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, dipropylene glycol di (meth) acrylate, and pentaerythritol. Tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,6-hexanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, trimethylolpropane tri (meth) ) Acrylate, ditrimethylolpropane tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, tripentaerythritol octa (meth) acrylate Rate, tetrapentaerythritol deca (meth) acrylate, isocyanuric acid tri (meth) acrylate, isocyanuric acid di (meth) acrylate, polyester tri (meth) acrylate, polyester di (meth) acrylate, bisphenol di (meth) acrylate, diglycerin Polyfunctional compounds such as tetra (meth) acrylate, adamantyl di (meth) acrylate, isoboronyl di (meth) acrylate, dicyclopentane di (meth) acrylate, tricyclodecane di (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate Etc. Among these, pentaerythritol triacrylate (PETA), dipentaerythritol hexaacrylate (DPHA), and pentaerythritol tetraacrylate (PETTA) are preferably used. The “(meth) acrylate” mentioned above refers to methacrylate and acrylate. In one embodiment of the present disclosure, as the ionizing radiation curable resin, the above-described compound modified with PO, EO, or the like can be used.

  In one embodiment of the present disclosure, in addition to the above-described compounds, relatively low molecular weight polyester resins having unsaturated double bonds, polyether resins, acrylic resins, epoxy resins, urethane resins, alkyd resins, spiroacetals. Resins, polybutadiene resins, polythiol polyene resins and the like can also be used as ionizing radiation curable resins.

  The ionizing radiation curable resin can also be used in combination with a solvent-drying resin. Here, the “solvent-drying resin” refers to a resin that forms a film only by drying a solvent added to adjust the solid content during coating, such as a thermoplastic resin. By using the solvent-drying resin in combination, it is possible to effectively suppress the occurrence of film defects or the like on the coating surface of the coating liquid when the conductive portion is formed using the resin material.

  Such a solvent-drying resin is not particularly limited, and generally a thermoplastic resin can be used. Examples of thermoplastic resins include styrene resins, (meth) acrylic resins, vinyl acetate resins, vinyl ether resins, halogen-containing resins, alicyclic olefin resins, polycarbonate resins, polyester resins, polyamide resins. , Cellulose derivatives, silicone resins and rubbers or elastomers.

  The thermoplastic resin is preferably non-crystalline and soluble in an organic solvent such as a common solvent that can dissolve a plurality of polymers and curable compounds. In particular, from the viewpoint of transparency and weather resistance, styrene resins, (meth) acrylic resins, alicyclic olefin resins, polyester resins, cellulose derivatives (cellulose esters, etc.) and the like are preferable.

  Furthermore, the resin material may contain a thermosetting resin. Examples of the thermosetting resin include phenol resin, urea resin, diallyl phthalate resin, melamine resin, guanamine resin, unsaturated polyester resin, polyurethane resin, epoxy resin, aminoalkyd resin, melamine-urea cocondensation resin, silicon resin, Examples thereof include polysiloxane resins.

(2) Non-conductive part As for the metal content layer in one embodiment of this indication, for example, as shown in Drawing 2 (a) and (b), any one surface layer of metal content layer 1 is conductive part 1a, The other region may be the non-conductive portion 1b.

  In one embodiment of the present disclosure, the non-conductive portion is a region made of a resin material and having non-conductivity.

  Here, “having non-conductivity” means having no conductivity.

  Since the resin material included in the non-conductive portion in one embodiment of the present disclosure can be the same as the resin material used in the conductive portion described above, description thereof is omitted here.

  Moreover, the non-conductive part in one embodiment of this indication may have other materials other than the resin material as needed. Examples of other materials include a migration inhibitor for suppressing migration. When the non-conductive portion has the migration inhibitor, the migration resistance of the conductive substrate of one embodiment of the present disclosure can be effectively improved. In addition, about a migration inhibitor, since it can be the same as that described in Unexamined-Japanese-Patent No. 2014-32792, description here is abbreviate | omitted.

  The thickness of the non-conductive part in the present invention can be appropriately adjusted according to the use of the conductive substrate of the present invention, and is not particularly limited. For example, it can be in the range of 50 nm to 3000 nm.

3. Peeling substrate In one embodiment of the present disclosure, for example, as shown in FIG. 3, the peeling substrate 3 may be provided on the surface of the adhesive layer 2 opposite to the metal-containing layer 1. A peeling base material is a member peeled when bonding a metal content layer to a desired member through an adhesion layer. Therefore, in the case of having a release substrate, there is a problem that the surface of the adhesive layer is contaminated before the metal-containing layer is bonded to a predetermined member via the adhesive layer, or the surface of the adhesive layer. Problems such as scratches can be suppressed, and a high-quality conductive member can be obtained.

  The material of the release substrate is preferably a material that can be disposed on the surface of the adhesive layer and can be released from the adhesive layer. The release substrate in one embodiment of the present disclosure may have transparency, or may not have transparency, but preferably has transparency. Examples of such a release substrate include a layer composed of a silicone resin, an organic resin-modified silicone resin, a fluororesin, an aminoalkyd resin, a melamine resin, an acrylic resin, a polyester resin, and the like.

  The thickness of the release substrate is preferably such that it can be disposed on the surface of the adhesive layer and then peeled off from the surface of the adhesive layer. For example, it is preferably 15 μm or more, and more preferably 25 μm or more. Further, the thickness of the peeling substrate is preferably 100 μm or less, and more preferably 50 μm or less. When the thickness of the release substrate is within the above range, the release substrate disposed on the surface of the adhesive layer can be easily released.

  It is preferable that the peeling base material in 1 embodiment of this indication has a predetermined peeling force with respect to the adhesion layer. As a specific peeling force, for example, it is preferably 10 mN / 25 mm or more, and more preferably 25 mN / 25 mm or more. Moreover, it is preferable that the peeling force with respect to the adhesion layer of a peeling base material is 1000 mN / 25mm or less, and it is preferable that it is 500 mN / 25mm or less especially. When the peeling force of the peeling base material with respect to the pressure-sensitive adhesive layer is within the above range, the peeling base material disposed on the surface of the pressure-sensitive adhesive layer can be easily peeled off.

  In one embodiment of the present disclosure, in order to improve the peelability of the release substrate, a release treatment may be performed on the surface of the release substrate on the adhesive layer side. A generally known process can be used for the mold release process.

4). Base material The base material in 1 embodiment of this indication is a member which is arrange | positioned on the surface at the side of the metal containing layer 1 of a metal containing layer, for example, as shown in FIG. 3, and supports a metal containing layer.

  The substrate in one embodiment of the present disclosure may have transparency, or may not have transparency, but preferably has transparency. Here, “transparent” means that, unless otherwise specified, for example, when the conductive member of the present invention is used for a touch panel display device or the like, it is transparent to the extent that it does not interfere with visual recognition from the operator. Say. Therefore, “transparent” includes colorless and transparent, and colored transparency that does not hinder visibility, is not defined by strict transmittance, and is transparent according to the use of the conductive member in one embodiment of the present disclosure. The degree of sex can be determined.

  Examples of the material constituting the base material include polyester resins, acetate resins, polyethersulfone resins, polycarbonate resins, polyamide resins, polyimide resins, polyolefin resins, (meth) acrylic resins, polychlorinated resins. Examples thereof include vinyl resins, polyvinylidene chloride resins, polystyrene resins, polyvinyl alcohol resins, polyarylate resins, polyphenylene sulfide resins, and the like. Among these, it is preferable to use a polyester resin, a polycarbonate resin, or a polyolefin resin.

  The substrate in the present invention may be an amorphous olefin polymer (Cyclo-Olefin-Polymer: COP) film having an alicyclic structure. This is a base material in which a norbornene polymer, a monocyclic olefin polymer, a cyclic conjugated diene polymer, a vinyl alicyclic hydrocarbon polymer, and the like are used. Zeonoa (norbornene-based resin), Sumitrite FS-1700 manufactured by Sumitomo Bakelite, Arton (modified norbornene-based resin) manufactured by JSR, Appel (cyclic olefin copolymer) manufactured by Mitsui Chemicals, Topas (cyclic) manufactured by Ticona Olefin copolymer), Optretz OZ-1000 series (alicyclic acrylic resin) manufactured by Hitachi Chemical Co., Ltd., and the like. In addition, FV series (low birefringence, low photoelastic modulus film) manufactured by Asahi Kasei Chemicals Co., Ltd. can be used as an alternative base material for triacetylcellulose.

  The thickness of the substrate can be appropriately adjusted according to the use of the conductive member in one embodiment of the present disclosure, and is not particularly limited. For example, the thickness is preferably 1 μm or more, and more preferably 20 μm or more. It is preferable that it is 40 micrometers or more especially. The thickness of the substrate is preferably 100 μm or less, more preferably 80 μm or less, and particularly preferably 60 μm or less. When the thickness of the base material is within the above range, mechanical strength can be imparted to the base material and desired flexibility can be realized.

5. Other Configurations The conductive member in one embodiment of the present disclosure may have other configurations as necessary in addition to the configurations described above. In addition, about another structure, since it can select suitably according to the use etc. of an electroconductive member, description here is abbreviate | omitted.

6). Applications The conductive member in one embodiment of the present disclosure can be used as a transparent electrode such as a display such as a liquid crystal display (LCD) or a plasma display (PDP), a touch panel, or a solar cell.

B. Laminate The laminate in one embodiment of the present disclosure includes a conductive member having a metal-containing layer in which metal particles are dispersed in a resin material, and an adhesive layer on one surface of the metal-containing layer, and a conductive member. And a functional layer on the surface on the pressure-sensitive adhesive layer side, wherein the total amount of ammonia and amines contained in the pressure-sensitive adhesive layer is 10 ng / g or less.

The laminate of one embodiment of the present disclosure will be described with reference to the drawings.
FIG. 4 is a schematic cross-sectional view illustrating an example of a laminated body according to one embodiment of the present disclosure. As illustrated in FIG. 4, the stacked body 20 of the present disclosure includes a conductive member 10 and a functional layer 6. In addition, the conductive member 10 includes a metal-containing layer 1 in which metal particles are dispersed in a resin material, and an adhesive layer 2 on one surface of the metal-containing layer, and ammonia contained in the adhesive layer And the total amount of amines is 10 ng / g or less.

  According to the laminate of one embodiment of the present disclosure, even if the conductive member has a configuration having an adhesive layer on one surface of the metal-containing layer, a laminate that can suppress the occurrence of migration can be obtained. In addition, about a specific effect, since it can be made to be the same as that of the content described in the term of "A. electroconductive member" mentioned above, description here is abbreviate | omitted.

  Hereinafter, each structure of the laminated body in one embodiment of this indication is demonstrated.

1. Conductive Member The conductive member in one embodiment of the present disclosure is a member having a metal-containing layer in which metal particles are dispersed in a resin material, and an adhesive layer on one surface of the metal-containing layer. Moreover, it is a member whose total amount of ammonia and amines contained in an adhesion layer is 10 ng / g or less.

  Note that the adhesive layer, metal-containing layer, and other components constituting the conductive member can be the same as the contents described in the above-mentioned section “A. Conductive member”. Omitted.

2. Functional layer The functional layer in 1 embodiment of this indication is a member arrange | positioned on the surface at the side of the adhesion layer of an electroconductive member.

  The functional layer in one embodiment of the present disclosure is normally a functional member that constitutes a touch panel display device, and can be appropriately selected as necessary. Examples of the functional layer include a color filter, a touch panel, a decorative member, a protective layer, a liquid crystal layer, and the like. Moreover, the functional layers such as the color filter, the touch panel, and the decorating member may have a transparent base material or may not have a transparent base material. Furthermore, in one embodiment of the present disclosure, the functional layer described above may be used as a single layer, or two or more layers may be used in combination.

  In addition, since a functional layer is mentioned as a functional layer used in one embodiment of this indication, description here is abbreviate | omitted.

(Metal-containing layer formation process)
On a base material (material: PET, thickness: 50 μm), silver nanowires (short axis length: 35 ± 15 nm, long axis length: 15 μm, SLV-NW-35 manufactured by Blueano Co., Ltd.) are about 0. Contains 01 wt%, tetrakisepoxysiloxane 0.01 wt%, (n-pyrrolidonepropyl) methylsiloxane-dimethylsiloxane copolymer 0.2 wt%, isopropyl alcohol 39.78%, 1-butanol 30%, cyclohexane 30% The metal particle composition was applied using a die coating method to form a wet coating (thickness: 10 μm). Thereafter, the coating film formed on the substrate was oven-heated at 70 ° C. for 1 minute to form a conductive part.

  Next, a resin composition containing 20% of UV-curable material BS-1200W (Arakawa Chemical Industry Co., Ltd.), 15% of cyclohexanone, and 65% of methyl ethyl ketone is die coated on the obtained conductive part. The wet coating film (thickness: 1 μm) was formed using the method. Then, the non-conductive part was formed by oven-heating at 70 degreeC for 1 minute.

(Adhesive layer placement process)
A commercially available adhesive layer (thickness: 50 μm or 100 μm) was placed on one surface of the obtained metal-containing layer. The amounts of ammonia and amines contained in each adhesive layer are shown in Table 1 below.
The amounts of ammonia and amines contained in the adhesive layer were measured by the following method. That is, the adhesive layer was put in a polypropylene bag, and further 60 ml of ultrapure water was added, and the adhesive layer was immersed in ultrapure water in the bag. Next, the bag is sealed with a heat sealer, placed in a 100 ° C. water bath, and allowed to stand for 1 hour. Thereby, the component contained in the adhesion layer was eluted in ultrapure water. Finally, the amount of ammonia and amines contained in the adhesive layer was measured by measuring the ion concentration of the obtained eluate using an ion chromatograph ICS-3000.
Here, the amounts of monomethylamine (MMA), dimethylamine (DMA), and triethylamine (TMA) were measured as amines.

[Evaluation]
(Rate increase rate)
The resistance increase rate of the obtained conductive member was evaluated. A method for evaluating the rate of increase in resistance will be described with reference to the drawings.

  FIGS. 5A to 5D are explanatory diagrams for explaining a method of evaluating the rate of increase in resistance. As shown in FIG. 5A, a conductive member 10 is prepared, and then the central portion of the surface of the conductive member 10 is masked with a polyethylene terephthalate film. In this state, APC (Furuya Metal Co., Ltd.) is used. As shown in FIG. 5B, the patterned metal layer 5 is formed on the surface of the conductive member 10 by sputtering film formation (apparatus: E400, manufactured by Canon Anelva Co., Ltd.). Thereafter, as shown in FIG. 5C, the conductive member 10 was patterned by a laser (λ = 1064 nm) to produce wirings 5a and 5b. The lengths T of the wirings 5a and 5b were 40 mm, the wiring width w was 3 mm, and the gap G between the wirings was 30 μm.

  As shown in FIG. 5 (d), the resistance increase rate is evaluated by applying a voltage of 6V to one wiring 5b and keeping it in an environment of 60 ° C. and 95% Rh for a maximum of 100 hours. The terminals of the resistance meter were brought into contact with the patterned metal layers at both ends of the wiring 5b, and the resistance values were measured before and after voltage application and evaluated.

(Wiring alteration width)
As shown in FIG. 5 (d), the wiring alteration width is evaluated by applying a voltage of 6V to one of the wirings 5b and storing it for up to 100 hours in an environment of 60 ° C. and 95% Rh. The wiring alteration width of the wiring 5b, that is, the reduction amount of the wiring width of the wiring 5b was evaluated.

  From the results of Table 2, in Examples 1 and 2 where the total amount of ammonia and amines contained in the adhesive layer is 10 ng / g or less, a comparative example in which the total amount of ammonia and amines contained in the adhesive layer is 10 ng / g or more It was found that the increase in resistance increase rate can be suppressed compared to 1 and 2. Also, in Examples 1 and 2, it was found that the wiring alteration width was smaller than in Comparative Examples 1 and 2, and the occurrence of migration could be suppressed.

DESCRIPTION OF SYMBOLS 1 ... Metal-containing layer 2 ... Adhesive layer 3 ... Peeling base material 4 ... Base material 5 ... Metal layer, wiring 6 ... Functional layer 10 ... Conductive member

Claims (3)

A metal-containing layer in which metal particles are dispersed in a resin material;
An adhesive layer on one side of the metal-containing layer,
The electroconductive member whose total amount of ammonia and amines contained in the said adhesion layer is 10 ng / g or less.   The conductive member according to claim 1, further comprising a release substrate on a surface of the adhesive layer opposite to the metal-containing layer. A conductive member having a metal-containing layer in which metal particles are dispersed in a resin material, and an adhesive layer on one surface of the metal-containing layer;
A functional layer on the adhesive layer side surface of the conductive member,
A laminate in which the total amount of ammonia and amines contained in the adhesive layer is 10 ng / g or less.

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