CN100585352C - Array type ultra-thin submissive force sensor and preparation method thereof - Google Patents
Array type ultra-thin submissive force sensor and preparation method thereof Download PDFInfo
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- CN100585352C CN100585352C CN200710177993A CN200710177993A CN100585352C CN 100585352 C CN100585352 C CN 100585352C CN 200710177993 A CN200710177993 A CN 200710177993A CN 200710177993 A CN200710177993 A CN 200710177993A CN 100585352 C CN100585352 C CN 100585352C
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Abstract
The invention relates to an array-type compliant force sensor and a method of preparation thereof, and belongs to the technical field of a force sensor. The sensor comprises upper and lower poles which are enclosed into one piece, and a conduction macromolecule sensitive film compressed between the poles, and a front end circuit connected with the upper and lower poles through signal lines. The conduction macromolecule sensitive film primarily adopts the conduction macromolecule sensitive film having the compressive resistance effect consisting of graphitized carbon black as the conduction phase, single-component silastic as the insulation phase, and nanometer SiO2 dispersant. The upper and lower poles are a plurality of poles made on the substrate of the film by making use of flexible printed circuit board process and signal lines connected with each strip-shaped pole. The upper and lower strip-shaped poles are crossed and constitute an N*N sensitive cell array with the conduction macromolecule sensitive film. The signal lines are gathered to form led-out closely spaced cables. The invention has the characteristics of fine and thin structure, good flexibility, large range, high precision and high resolution.
Description
Technical field
The invention belongs to the force sensor technologies field, specially refer to the structural design of array type ultra-thin submissive force sensor.
Background technology
The proposition of " submissive sensor " notion can be traced back to the phase at the end of the eighties in last century, and the many special constructions in the aerospace vehicle have brought very big difficulty for the installation of conventional rigid sensor.People wish that sensor has good submissive performance, not limited by the testee shape, can be attached at various rules or irregular curved surface is realized normal sensing function.Enter after the nineties in last century, the scientist of countries such as the U.S., France, Japan, Switzerland and Portugal begins to carry out the research work of submissive sensor, and many novel sensor materials and structure are applied among this research field.
The Compliant Force sensor is a kind of of submissive sensor, is mainly used in extruding force and sense of touch force measurement.In the research of submissive sensor, the Compliant Force sensor occupies an important position always, according to the difference of sensitive element, the Compliant Force sensor can be divided three classes: piezoelectric membrane Compliant Force sensor, semiconductor material Compliant Force sensor and conductive polymer composite Compliant Force sensor.
(1) piezoelectric membrane Compliant Force sensor
Kistler company product with Switzerland is taken as the leading factor, is applied in the fields such as sports medical science, dentistry and automobile engineering.This sensor utilization has the polyvinylidene difluoride film (PVDF) of direct piezo electric effect as sensitive material, measures the electric charge accumulation that the sensitive material upper and lower surface produces under the dynamic force effect, thus the size of reflection power.At present, comparatively ripe for the research of PVDF piezoelectric membrane, but piezoelectric membrane Compliant Force dependent sensor only can be applied to dynamic force measurement.
Since the electric charge that sensitive element produces a little less than, this sensor all has higher requirement to the cross-sectional area and the length of extension line, can't use the solid matter cable of ultra-thin complaisant.
(2) semiconductor material Compliant Force sensor
Along with the maturation of MEMS process technology, semiconductor material flexible force dependent sensor has appearred.The research work of this type sensor mainly concentrates on design, processing and the flexible package structure Design of semiconductor sensing unit.2000, Duisburg, Germany university utilized rubber to manufacture the boss on the diaphragm on the basis of traditional circular silicon cup formula pressure transducer, has developed a kind of extruding force sensor.(Michael Leineweber, Georg Pelz, Michael Schmidt, the novel touch sensor chip that et al.Newtactile sensor chip with silicone rubber cover. encapsulates with silicon rubber.Sensors AndActuators A, sensor and actuator A, 2000,84 (3): 236～245) the same year, Chinese University of Science and Technology has developed a kind of silicon piezoresistance type touch sensor, and this sensor encapsulates with elastic silicone rubber, and utilizes hard boss post that haptic force is passed to sensing unit.(Tao Mei, Wen J.Li, Yu Ge, the three-dimensional touch sensor of the integrated form MEMS of an et al.An integrated MEMS three-dimensional tactile sensorwith large force range. wide range.Sensors And Actuators A, sensor and actuator A, 2000,80 (2): 155～162)
These two kinds of sensors all are the structure of silicon cup based on conventional pressure sensor, and quick boss of additional force and simple flexible package structure form again, and they can realize contact extruding force measurement, but do not have good compliance.
Adopted that the semiconductor material flexible force dependent sensor of MEMS technology has that precision height, resolution height, the linearity are good, advantage such as good stability, response speed are fast.Along with the progress of body structure design and process technology, it also can realize pliability preferably.But semiconductor material flexible force dependent sensor still belongs to the category of microsensor, and tens～hundreds of sensing units usually distribute in less area.Though this has improved spatial resolution, can't give full play to the advantage of flexible sensor, can not measure the power that large tracts of land distributes effectively.Deficiencies such as in addition, the dynamometry range is less, processing technology more complicated, processing charges costliness, yield rate is lower, device is damaged have easily all limited its application.At present, semiconductor material flexible force dependent sensor is only applicable to force measurement in the microsystem, for example moonlet, flivver, miniature brake switch, microrobot etc.
(3) conductive polymer composite Compliant Force sensor
Conductive polymer composite refers to common in recent years conductive rubber, conductive plastics, electrically-conducting paint, electro-conductive adhesive and conductive film etc.Conductive polymer composite is divided into two kinds on filled-type and chemical combination type, and the former is mixed into conductive particle to form conductive channel in the polymeric matrix, is the mixture of two or more materials; And the latter is a homogenous material, and self has electric conductivity.Discovering of field of functional materials, the filled-type conductive polymer composite has piezoresistive effect, so some research institutions utilize it as the sensitive element material, has developed the Compliant Force sensor.
1993, Japanese industry Products Institute utilizes silver powder to fill the piezoresistive effect of nitrile rubber compound substance, develop a kind of touch sensor (Makoto Shimojo, Masatoshi Ishikawa, Kikuo Kankaya.A flexible high resolutiontactile imager with video signal output. submissive high resolving power sense of touch imager with video output.Proceedings of The 1993 IEEE International Conference On Robotics And AutomationSacramento, international robots of IEEE in 1993 and control proceeding Califorria automatically, 1993:384～391), this sensor has submissive preferably performance.But because the problems such as conduction rule instability of silver powder, sensor is energy measurement 0MPa, 5MPa, three grades of threshold quantities of 20MPa only, compare with most of application requirements to also have no small gap.
Calendar year 2001, the researchist of Osaka, Japan university has developed a kind of filled-type polymer composite (Manwar Hussain with piezoresistive effect, Yong-Ho Choa, the preparation process and the electricity behavior of the novel pressure sensitive composite material of Koichi Niihara.Fabrication process and electrical behavior ofnovel pressure-sensitive composites..Composites A, composite A, 2001,32 (4): 1689～1696).This preparation methods is: the conductive black of 10～100 μ m diameters is packed in the double component room temperature vulcanization silicon rubber, adopt normal hexane as organic solvent, conductive black is 1 with the filling ratio of two component sulphurated siliastics: (20%～50%), and adopted 0.6%～1.0% Al of total amount
2O
3Particle carries out sulfidization molding again as the spreading agent composition, and the time is following 3 days of 5 ℃ of following 7 days or 10 ℃, and the sensitive material thickness after the moulding is 0.5mm.In the literature, only provide a series of empirical curves, and do not provided indexs such as quantitative precision, resolution, and do not carried out sensitive element structure design and encapsulation, can't practical application.
2002, Tokyo Univ Japan utilizes has the quick rubber of power of piezoresistive effect as sensitive element, developed a kind of extruding force sensor (Makoto Shinmojo, Ryota Makino, Akio Namiki, et al.A sheet type tactile sensor usingpressure conductive rubber with electrical-wires stitches method. sheet touch sensor of making traverse method with conductive rubber.2002,2002 years IEEE sensors of Proceedings of IEEE Sensors international conference collection of thesis, Orlando, USA, 2002:1637～1642), thickness is 0.5mm, area is 5cm * 10cm.This sensor can be attached on the robot finger, has shown compliance preferably.Yet, sensor thickness is excessive, has influenced the transmission of extruding force, and the pressure drag performance of this sensitive material is not high, cause that sensor dynamometry range is less (only to be 0～0.5MPa) and error big (reaching 20%FS), therefore only can be used for the observational measurement of distributed force.In addition, the Copper Foil lead-in wire intensity of sewing up usefulness is not high, is easier to fracture.The conductive rubber of un-encapsulated also wears out than being easier to, thus the quick performance of forfeiture power.
U.S. Tekscan company just carries out the research work of submissive sensor since the nineties in last century always.2003, the said firm has released a kind of conductive polymer composite Compliant Force sensor (Thomas V.Papakostas, Julian Lima, Mark Lowe.A large area force sensor for smart skin applications. is the large tracts of land force transducer of intelligent dermal application for one kind.Proceedings of IEEE Sensors 2002 Orlando, the international sensor meeting of IEEE in 2002, USA, 2002:1620～1624), this sensor area does not wait to one square metre by tens square centimeters, and thickness is 0.15mm.The sensor sensing unit is made of up and down two-layer electrode and one deck conductive polymer composite, and wire length can reach 700mm.Adopt polyimide film up and down two-layer electrode and one deck conductive polymer composite be packaged into a sensor integral body, guaranteed pliability and reliability, the minimum bending radius that allows reaches 100mm.But this sensor does not utilize the piezoresistive effect of conductive polymer composite yet, measures extruding force but utilize contact resistance between this conductive polymer composite and the electrode to change.Therefore, this sensor is more paid close attention to the electric conductivity of material in preparation process, has directly added conductive particle as much as possible.And the conductive particle in this sensor material is based on silver powder.At present, the sensor error of Tekscan company is bigger, is 10%～15%, and response is slow, hysteresis phenomenon is obvious.
Generally speaking, conductive polymer composite Compliant Force sensor has that submissive performance is good, dynamometry range and useful area are big, advantage such as processing technology is fairly simple, processing charges is lower.The on-line monitoring that can be used for contact force and extruding force between commercial production and medical-therapeutic treatment of human body rehabilitation course mean camber, but, for satisfying practical application, performance index such as this sensor thickness, precision, resolution, the linearity, stability and response speed all need further raising.
Summary of the invention
The objective of the invention is to propose a kind of array type ultra-thin submissive force sensor for overcoming the weak point of prior art.Have the advantages that structure is slim, compliance good, range is big, precision is high, resolution is high, be particularly suitable for the online detection of contact force between commercial production and medical-therapeutic treatment of human body rehabilitation course mean camber.
The extruding force sensor that the present invention proposes based on the ultra-thin complaisant sensitive element, comprise encapsulation all-in-one-piece levels electrode and be pressed on therebetween conductive macromolecule sensitive film, also comprise by signal wire and the front end circuit that this levels electrode links to each other, it is characterized in that: described conductive macromolecule sensitive film adopts mainly with as the conductive black of conductive phase, with one-component silicon rubber and nanometer SiO as the phase that insulate
2The conductive macromolecule sensitive film that spreading agent constitutes with piezoresistive effect, described levels electrode is the many strip electrodes that utilize flexible printed circuit board technology to make and reaches a signal line that links to each other with each electrode strip on film substrate, described upper and lower layer electrode strip intersects and described conductive macromolecule sensitive film formation M * N sensing unit array mutually, M, N are respectively the bar number of upper and lower layer or upper and lower layer electrode, and M, N are positive integer and M 〉=N; Described each signal wire pools together, and forms to draw the solid matter cable.
The method for preparing the sensor that the present invention proposes, it is characterized in that, this method comprises the preparation of ultra-thin complaisant conductive macromolecule sensitive film and adopts preparation two parts of the array Compliant Force sensor of this sensitive membrane, the preparation of described ultra-thin complaisant conductive macromolecule sensitive film may further comprise the steps:
11) with mean diameter less than the conductive black powder of 1 μ m, the SiO of 10-50nm
2Spreading agent powder and liquid one-component silicon rubber are to mix in the 95% above acetone organic solvent in concentration; Wherein, the volumetric concentration number percent of each composition is: one-component silicon rubber: conductive black powder: nanometer SiO
2Spreading agent powder: acetone organic solvent=100: 10～15: 1～3: 300～500;
12) carry out mechanical raking under sonic oscillation, stirring environment temperature is 40-60 ℃, and mixing time is 2-4 hour, reaches the gel state mixture;
13) continue mechanical raking 20-30 minute again, make the acetone volatilization;
14) mixture after will volatilizing splashes into rotation platform, the spin coating moulding, and thickness is the conducting polymer film of 70-100 μ m;
15) with the dibutyltin dilaurate catalyst of the tetraethoxysilance crosslinking chemical of this conducting polymer film cumulative volume 1% and 2% to vulcanizing on this conducting polymer film, the time is more than 24 hours, to form the better elastic film;
Above-mentioned steps 13) also can be after the butadiene rubber particle of 20～30 μ m joins in this mixture, to continue again mechanical raking 20-30 minute the particle diameter of the 3-5% of mixture cumulative volume amount in, make the acetone volatilization;
Adopt described sensitive membrane to prepare the method for array type ultra-thin submissive force sensor, may further comprise the steps:
21) Kapton covers copper: be laminated with one deck Copper Foil on Kapton;
22) photoetching electrode and lead-in wire: Copper Foil is carried out photoetching form upper strata column electrode bar, following stratose electrode strip, solid matter lead-in wire and external plug; The orthogonal formation array of row, column electrode strip, row, column lead-in wire and plug stagger mutually;
23) apply location glue: between electrode, apply one deck location glue, with the fixing position of high molecule sensitivity membrane on electrode;
24) attach conductive macromolecule sensitive film: the ultra-thin conductive macromolecule sensitive film that will prepare is cut into and the corresponding size of electrode layer, is attached to down on the stratose electrode;
25) apply packaging plastic: have heat cured packaging plastic in the coating of the Kapton edge of lower electrode;
26) packaging by hot pressing: the upper strata column electrode is attached ultra-thin conductive macromolecule sensitive film, utilize the flexible material packaging machine to carry out packaging by hot pressing and become a submissive sensor probe of array;
27) plug of drawing the solid matter cable with packaged submissive sensor probe links to each other with front end circuit, forms array type ultra-thin submissive force sensor.
Characteristics of the present invention:
1, the sensitive element among the present invention has big range, and quick precision of high power and resolution.
2, among the present invention, the base material of sensitive element array and outgoing cable thereof has good compliance.Therefore, sensor can be attached between the surface of arbitrary shape and measure.And traditional force transducer can't be installed on the curved surface and measures.
3, can carry out the interior quick measurement of large tracts of land scope.Owing to adopted FPCB technology, sensor array can be distributed in the very big areal extent (400mm * 700mm even bigger), thereby realized the measurement of large tracts of land scope.And other technology as fine processes such as MEMS, just can't be made the flexible sensor array of large tracts of land scope, therefore also is difficult to the measurement that realizes that the large tracts of land scope is interior.If utilize single-sensor to carry out the measurement of large tracts of land scope, then need to utilize mechanical hook-up control sensor or measured target to move by rule, this must influence the speed and the precision of measurement.And in the present invention, utilize multi-channel gating switch, sensor array is realized quick scan round.Scan a passage and only need 20 milliseconds.
4, ultra-thin.The I of the thickness of sensor array and outgoing cable thereof is accomplished 0.13mm, is fit to be installed in the narrow space and measures.
5, solid matter cable.The lead-in wire of sensor array pools together, and forms the long cable of solid matter, makes structure compact more.Owing to adopt the measuring method of scan round, any time, having only in the cable has the signal transmission in a pair of line, and therefore, cable institute transmission signals does not disturb mutually.
6, the front end circuit of the present invention's employing has negative feedback adjusting resistance, and adopts the digital-to-analog conversion mode, and adopts ranks intersection gating mode, can reduce gating switch quantity, and the output of realization linearity.
7, the relative conventional force sensors of the present invention can be applicable to more measurement occasions, as measure fast in measurement of curved surface, the large tracts of land scope, measurement in the small space etc.Base material is as adopting the polymeric material polyimide, and then this sensor array can also be applied in high temperature (300-400 ℃), radiation etc. and measure occasion.
The present invention can reach excellent performance index.
1, sensor thickness is little, only is 0.13mm;
2, submissive performance is good, and minimum bending radius can reach 200mm;
3, the sensor array area can be had made to order, and scope is 400～700mm
2
4, the dynamometry range is 0～2MPa;
5, the dynamometry precision reaches 1%FS;
6, dynamometry resolution reaches 0.2%FS.
Description of drawings
Fig. 1 is the schematic cross-section of column electrode after the photoetching of sensor of the present invention.
Fig. 2 is the schematic cross-section of the photoetching rank rear electrode of sensor of the present invention.
Fig. 3 is the row, column electrode of sensor array of the present invention and the planar structure synoptic diagram of lead-in wire.
Fig. 4 is the structural representation after sensor of the present invention applies the location adhesive process.
Fig. 5 is the structural representation after sensor of the present invention attaches conductive macromolecule sensitive film technology.
Fig. 6 is the structural representation after sensor of the present invention applies packaging plastic technology.
Fig. 7 is the structural representation after the sensor packaging by hot pressing technology of the present invention.
Fig. 8 forms synoptic diagram for the front end circuit embodiment of sensor of the present invention.
Fig. 9 is the synoptic diagram of a kind of real work of employing sensor of the present invention.
Embodiment
Array type ultra-thin submissive force sensor that the present invention proposes and preparation method thereof reaches embodiment in conjunction with the accompanying drawings and is described in detail as follows:
The extruding force sensor that the present invention proposes based on the ultra-thin complaisant sensitive element, comprise encapsulation all-in-one-piece levels electrode and be pressed on therebetween conductive macromolecule sensitive film, also comprise by signal wire and the front end circuit that this levels electrode links to each other, it is characterized in that: described conductive macromolecule sensitive film adopts mainly with as the conductive black of conductive phase, with one-component silicon rubber and nanometer SiO as the phase that insulate
2The conductive macromolecule sensitive film that spreading agent constitutes with piezoresistive effect, described levels electrode is the many strip electrodes that utilize flexible printed circuit board technology to make and reaches a signal line that links to each other with each electrode strip on film substrate, described upper and lower layer electrode strip intersects and described conductive macromolecule sensitive film formation M * N sensing unit array mutually, M, N are respectively the bar number of upper and lower layer or upper and lower layer electrode, and M, N are positive integer and M 〉=N; Described each signal wire pools together, and forms to draw the solid matter cable.
Said sensitive membrane can be made into individual layer or bilayer even multilayer, and electrode shape can be circular, square or other shape.
Described front end circuit comprises that a M road row selects electronic analog swtich and a N road column selection electronic analog swtich, by M * N preposition resistance, M * N sensing unit and M the resistive feedback circuit that operational amplifier is formed; The annexation of each components and parts of this circuit is: each sensing unit forms feedback resistance by output terminal and the negative input that signal wire is connected across operational amplifier; The negative input of each preposition resistance one termination operational amplifier, the other end connects reference voltage Vref by the column selection switch; The output signal Vout that the output terminal of operational amplifier selects switch output to be directly proportional with extruding force by row, positive input ground connection.
The preparation method of the array type ultra-thin submissive force sensor that the present invention proposes comprises the preparation of ultra-thin complaisant conductive macromolecule sensitive film and adopts preparation two parts of the array Compliant Force sensor of this sensitive membrane, the preparation of described ultra-thin complaisant conductive macromolecule sensitive film may further comprise the steps:
11) with mean diameter less than the conductive black powder of 1 μ m, the SiO of 10-50nm
2Spreading agent powder and liquid one-component silicon rubber are to mix in the 95% above acetone organic solvent in concentration; Wherein, the volumetric concentration number percent of each composition is: one-component silicon rubber: conductive black powder: nanometer SiO
2Spreading agent powder: acetone organic solvent=100: 10～15: 1～3: 300～500;
12) carry out mechanical raking under sonic oscillation, stirring environment temperature is 40-60 ℃, and mixing time is 2-4 hour, reaches the gel state mixture;
13) again the butadiene rubber particle (20～30 μ m) of the 3-5% of mixture cumulative volume amount is joined (adding the butadiene rubber particle can increase elasticity, also can not add the butadiene rubber particle) in this mixture, continued mechanical raking 20-30 minute, make the acetone volatilization;
14) mixture after will volatilizing splashes into rotation platform, the spin coating moulding, and thickness is the conducting polymer film of 70-100 μ m;
15) with the dibutyltin dilaurate catalyst of the tetraethoxysilance crosslinking chemical of this conducting polymer film cumulative volume 1% and 2% to vulcanizing on this conducting polymer film, the time is more than 24 hours, to form the better elastic film;
Adopt described sensitive membrane to prepare the method for array type ultra-thin submissive force sensor, as Fig. 1～shown in Figure 7 may further comprise the steps:
21) Kapton covers copper: be laminated with one deck Copper Foil on Kapton 11;
22) photoetching electrode and lead-in wire: Copper Foil is carried out photoetching form upper strata column electrode bar 12, following stratose electrode strip 13, solid matter lead-in wire 14 and external plug 15; The orthogonal formation array of row, column electrode strip, row, column lead-in wire and plug stagger mutually.Illustrated in figures 1 and 2 is the sectional view of row, column electrode, Figure 3 shows that the plane structure chart of row, column electrode and lead-in wire;
23) apply location glue: apply one deck location glue 16 between electrode, purpose is for the fixing position of high molecule sensitivity membrane on electrode, as shown in Figure 4;
24) attach conductive macromolecule sensitive film: the ultra-thin conductive macromolecule sensitive film 17 that will prepare is cut into and the corresponding size of electrode layer, is attached to down on the stratose electrode, as shown in Figure 5;
25) apply packaging plastic: have heat cured packaging plastic 18 (utilize hot pressing function to adhere to the two layers of polyimide of bottom electrode, can reach good sealing and waterproof effect) in the coating of the Kapton edge of lower electrode, as shown in Figure 6;
26) packaging by hot pressing: the upper strata column electrode is attached ultra-thin conductive macromolecule sensitive film 17, utilize the flexible material packaging machine to carry out packaging by hot pressing and become a submissive sensor probe of array, as shown in Figure 7;
27) plug of drawing the solid matter cable with packaged submissive sensor probe links to each other with the multi-channel gating switch of front end circuit, forms array type ultra-thin submissive force sensor.
The invention provides three kinds of embodiment of the preparation method of ultra-thin complaisant conductive macromolecule sensitive film:
Embodiment 1
11) with mean diameter less than the conductive black powder of 1 μ m, the SiO of 10nm
2Spreading agent powder and liquid one-component silicon rubber are to mix in the 95% above acetone organic solvent in concentration; Wherein, the volumetric concentration number percent of each composition is: one-component silicon rubber: conductive black powder: nanometer SiO
2Spreading agent powder: acetone organic solvent=100: 10: 1: 300;
12) carry out mechanical raking under sonic oscillation, stirring environment temperature is 40 ℃, and mixing time is 2 hours, reaches the gel state mixture;
13) again 3% butadiene rubber particle (10 μ m) of mixture cumulative volume amount is joined in this mixture, continued mechanical raking 20 minutes, make the acetone volatilization;
14) mixture after will volatilizing splashes into rotation platform, the spin coating moulding, and thickness is the conducting polymer film of 70 μ m;
15) with the dibutyltin dilaurate catalyst of the tetraethoxysilance crosslinking chemical of this conducting polymer film cumulative volume 1% and 2% to vulcanizing on this conducting polymer film, the time is more than 24 hours, to form the better elastic film.
Embodiment 2
11) with mean diameter less than the conductive black powder of 1 μ m, the SiO of 50nm
2Spreading agent powder and liquid one-component silicon rubber are to mix in the 95% above acetone organic solvent in concentration; Wherein, the volumetric concentration number percent of each composition is: one-component silicon rubber: conductive black powder: nanometer SiO
2Spreading agent powder: acetone organic solvent=100: 15: 3: 500;
12) carry out mechanical raking under sonic oscillation, stirring environment temperature is 60 ℃, and mixing time is 4 hours, reaches the gel state mixture;
13) again 5% butadiene rubber particle (30 μ m) of mixture cumulative volume amount is joined in this mixture, continued mechanical raking 30 minutes, make the acetone volatilization;
14) mixture after will volatilizing splashes into rotation platform, the spin coating moulding, and thickness is the conducting polymer film of 100 μ m;
15) with the dibutyltin dilaurate catalyst of the tetraethoxysilance crosslinking chemical of this conducting polymer film cumulative volume 1% and 2% to vulcanizing on this conducting polymer film, the time is more than 24 hours, to form the better elastic film.
Embodiment 3
11) with mean diameter less than the conductive black powder of 1 μ m, the SiO of 30nm
2Spreading agent powder and liquid one-component silicon rubber are to mix in the 95% above acetone organic solvent in concentration; Wherein, the volumetric concentration number percent of each composition is: one-component silicon rubber: conductive black powder: nanometer SiO
2Spreading agent powder: acetone organic solvent=100: 12: 2: 400;
12), under sonic oscillation, carry out mechanical raking, stirring environment temperature is 50 ℃, mixing time is 3 hours, reaches the gel state mixture;
13) continued mechanical raking again 25 minutes, make the acetone volatilization;
14) mixture after will volatilizing splashes into rotation platform, the spin coating moulding, and thickness is the conducting polymer film of 85 μ m;
15) with the dibutyltin dilaurate catalyst of the tetraethoxysilance crosslinking chemical of this conducting polymer film cumulative volume 1% and 2% to vulcanizing on this conducting polymer film, the time is more than 24 hours, to form the better elastic film.
The preparation embodiment of the array Compliant Force sensor of this sensitive membrane of employing of the present invention is described as follows:
21) Kapton covers copper: adopt conventional FPCB technology in Kapton (the Upilex-R type that present embodiment adopts Ube company to produce, thickness is 12.5 μ m) on be laminated with one deck Copper Foil (present embodiment adopts the preferred circuit plate with covering Copper Foil, and thickness is 10 μ m);
22) photoetching electrode and lead-in wire: adopt conventional FPCB technology Copper Foil to be carried out photoetching forms 3 column electrode bars, 3 row electrode strips respectively on Kapton, the solid matter that links to each other with each electrode strip goes between and external plug; When upper and lower electrode layer was superimposed, the row, column electrode was orthogonal, formed 3 * 3 array, and row, column lead-in wire and plug stagger mutually.The structure row, column electrode width that present embodiment only shows a kind of instance model is 3mm, and electrode separation is 8mm, and wire widths is 0.5mm., can on bigger area, prepare more electrode and the bigger array of lead-in wire formation as required;
23) apply location glue: adopt conventional FPCB technology to apply the thin glue PX T4 viscose glue of company (German Dusseldorf) of locating of one deck between electrode, thickness is slightly larger than 10 μ m, and purpose is for the fixing position of high molecule sensitivity membrane on electrode;
24) attach conductive macromolecule sensitive film: ultra-thin conductive macromolecule sensitive film is cut into and the corresponding size of electrode layer, is attached to down on the stratose electrode;
25) apply packaging plastic: adopt conventional FPCB technology to apply and have heat cured packaging plastic (adopting and the identical product of above-mentioned location glue) at the Kapton edge of lower electrode, utilize hot pressing function to adhere to the two layers of polyimide film of bottom electrode, can reach good sealing and waterproof effect.
26) packaging by hot pressing: adopt conventional FPCB technology that the upper strata column electrode is attached on the conductive macromolecule sensitive film, utilize the flexible material packaging machine to carry out packaging by hot pressing and become one 3 * 3 submissive sensor probe of array, the submissive sensor probe of present embodiment, thickness is 130 μ m, lead portion length is 110mm, and 3 * 3 sensing units that distribute on the area of 35mm * 40mm (adopt the array type ultra-thin submissive force sensor area that is useful for the measurement of interlayer extruding force of same process preparation of the present invention can reach 400 * 700mm
2, to form the bigger sensing unit array of number).
27) plug of drawing the solid matter cable with packaged submissive sensor probe links to each other with front end circuit (multi-channel gating switch), forms array type ultra-thin submissive force sensor.
Front end circuit embodiment of the present invention as shown in Figure 8, front end circuit mainly comprises row choosing, column selection multichannel electronic analog swtich Kr and Kc, the resistive feedback circuit of being made up of preposition resistance R d11～Rd33, sensing unit Rf11～Rf33 and operational amplifier A 1～A3; The annexation of each parts is (is example with first sensing unit): output terminal and negative input that sensing unit Rf11 is connected across operational amplifier A 1 form feedback resistance; The negative input of preposition resistance R d11 one termination operational amplifier A 1, the other end connects reference voltage Vref by column selection K switch c1; The output signal Vout that the output terminal of operational amplifier A 1 selects K switch r1 output to be directly proportional with extruding force by row, positive input ground connection.The connection of other sensing unit is identical therewith.
The principle of work of this front end circuit is: Rf11～Rf33 is the single sensing unit in the sensor probe, and negative feedback end and output terminal that two end electrodes is connected on amplifier respectively form feedback resistance.Control circuit inserts each row by each row of column address signal polling respectively with reference voltage Vref, respectively exercise multiway analog switch each row of gating respectively by the row address polling simultaneously, guaranteed the output signal of each sensing unit of time sharing sampling like this, and do not crosstalked mutually between each unit.
Front end circuit of the present invention improves on the basis of traditional " voltage mirror method ", is used for the ultra-thin complaisant sensor based on conducting polymer composite.Because the surface resistivity of conducting polymer composite is 1.51 * 10
5Surface resistance between Ω mm, two adjacent sensitive elements reaches 1.2 * 10
6So Ω is the quick rubber surface transmission current of obstructed substantially exertin between adjacent sensing unit.Address signal input analog switch Kc, selected row insert reference voltage Vref, and each row of sensor array all insert by operational amplifier and form negative feedback.Wherein, the operational amplifier positive input terminal inserts reference voltage ground, and the negative feedback output of selected row inserts the voltage input end mouth of the A/D converter of subsequent conditioning circuit.In A/D converter, high reference voltage level is+5V (certain limit is adjustable) that low reference voltage level is 0V.Like this, except selected sensing unit, all the other each ranks form equipotentials in the array resistors network, make with selected sensing unit parallel resistor network and can't form interference current.
Adopt this circuit, original m * n electronic switch passage can be reduced to m+n electronic switch passage (m is that line number, n are columns, and m and n can be identical or different integer), and realize linear output.
The principle of sensing element of array type ultra-thin submissive force sensor of the present invention is described as follows:
From the angle analysis of conductive microstructure mechanism as can be known, the reason that carbon black filled silicon rubber composite material produces piezoresistive effect can be summed up as the variation that carbon black pellet distributes in the silicon rubber matrix, more precisely, be the variation of conductive black grain spacing.Ambient pressure can compressed composite material volume because the compressibility of conductive black particle is much smaller than the silicon rubber matrix, so the spacing of conductive particle reduces, and improved contact conduction and tunnel effect odds.Along with pressure increases, the spacing of conductive black particle reduces gradually, because the effect of contact conduction and tunnel effect mechanism has formed conductive channel in the inside of material.And the generation of contact conduction and tunnel effect mechanism is subjected to the particle diameter of conductive particle and the influence of shape again, so the piezoresistive effect of material shows the substantial connection with the pattern parameter.The pattern parameter value of material is big more, and the probability that contact conduction and tunnel effect produce is just high more, and the piezoresistive effect of material is also just obvious more.
From the angle analysis of conduction seepage flow phenomenon, the resistivity of material is fairly obvious with the variation of conductive filler volumetric concentration in the conduction vadose region.This is because when ambient pressure had reduced the volume of polymeric matrix, the corresponding increase of the volumetric concentration of conductive particle caused the significant change of resistivity of material.Material deformation has caused that conduction seepage flow changes, and the resistivity of material reduces thereupon.The soot body volume concentrations is more near the seepage flow threshold value, and the piezoresistive effect of material is just obvious more.In effective medium generalized equation, the pattern parameter of the volumetric concentration of carbon black, seepage flow threshold value and material has characterized conduction seepage flow phenomenon together, and the piezoresistive effect that carbon black filled silicon rubber composite material also is described is a concrete manifestation of its conduction seepage flow phenomenon.In addition, distortion of materials not only causes the variation of resistivity, has also changed its resistance geometrical factor (promptly along the length of material on the direction of current and the ratio of cross-sectional area).In sum, the stress deformation of carbon black filled silicon rubber composite material is its immediate cause that produces piezoresistive effect.
On macroscopical presentation, because the effect of pressure, the conducting polymer composite that constitutes sensitive element has produced resistance variations, and this variation presents the linear ratio relation with pressure within the specific limits.
The working method of array type ultra-thin submissive force sensor of the present invention in conjunction with shown in Figure 9, is described as follows:
During real work, sensor 92 is attached between curved surface 91 and 94, in some assemblings are used, need between curved surface, adds foam carpet 93, as shown in Figure 9, by every pair of interelectrode resistance variations of survey sensor,, obtain corresponding contact pressure value according to calibration curve.By follow-up signal sampling and array scanning circuit and multi-channel gating switch, sensitive element is carried out quick scan round, can measure the extruding force that each sensitive element bears.Because the distribution mode of these sensitive elements is known, therefore, measurement result is carried out data processing, just can obtain the distribution of contact force between curved surface.
To the sensor array of the present invention test that experimentizes, its thickness is 0.12mm, and minimum bending radius can reach 200mm, and the dynamometry range is 0～2MPa, and the dynamometry precision reaches 1%FS, and dynamometry resolution reaches 0.2%FS.
Claims (2)
1, a kind of array extruding force sensor based on the ultra-thin complaisant sensitive element, comprise encapsulation all-in-one-piece levels electrode and be pressed on therebetween ultra-thin complaisant conductive macromolecule sensitive film, also comprise by signal wire and the front end circuit that this levels electrode links to each other, it is characterized in that: described ultra-thin complaisant conductive macromolecule sensitive film adopts mainly with as the conductive black of conductive phase, with one-component silicon rubber and nanometer SiO as the phase that insulate
2The ultra-thin complaisant conductive macromolecule sensitive film that spreading agent constitutes with piezoresistive effect, described levels electrode is the many strip electrodes that utilize flexible printed circuit board technology to make and reaches a signal line that links to each other with each electrode strip on film substrate, the described electrode strip of upper and lower layer intersects and described ultra-thin complaisant conductive macromolecule sensitive film formation M * N sensing unit array mutually, M, N are respectively the bar number of upper and lower layer or upper and lower layer electrode, and M, N are positive integer and M 〉=N; Each described signal wire pools together, and forms to draw the solid matter cable; Described front end circuit comprises that a M road row selects electronic analog swtich and a N road column selection electronic analog swtich, by M * N preposition resistance and M the resistive feedback circuit that operational amplifier is formed; The annexation of each components and parts is: each sensing unit forms feedback resistance by output terminal and the negative input that signal wire is connected across operational amplifier; The negative input of each preposition resistance one termination operational amplifier, the other end connects reference voltage Vref by the column selection electronic analog swtich; The output signal Vout that the output terminal of operational amplifier selects electronic analog swtich output to be directly proportional with extruding force by row, positive input ground connection.
2, prepare the method for sensor according to claim 1, it is characterized in that, this method comprises the preparation of ultra-thin complaisant conductive macromolecule sensitive film and adopts preparation two parts of the array extruding force sensor of this sensitive membrane, the preparation of described ultra-thin complaisant conductive macromolecule sensitive film may further comprise the steps:
11) with mean diameter less than the conductive black powder of 1 μ m, the SiO of 10-50nm
2Spreading agent powder and liquid one-component silicon rubber are to mix in the 95% above acetone organic solvent in concentration; Wherein, the volumetric concentration number percent of each composition is: one-component silicon rubber: conductive black powder: nanometer SiO
2Spreading agent powder: acetone organic solvent=100: 10～15: 1～3: 300～500;
12) carry out mechanical raking under sonic oscillation, stirring environment temperature is 40-60 ℃, and mixing time is 2-4 hour, reaches the gel state mixture;
13) continue mechanical raking 20-30 minute again, make the acetone volatilization;
14) mixture after will volatilizing splashes into rotation platform, and it is the ultra-thin complaisant conductive macromolecule sensitive film of 70-100 μ m that spin coating becomes thickness;
15) with the dibutyltin dilaurate catalyst of the tetraethoxysilance crosslinking chemical of ultra-thin complaisant conductive macromolecule sensitive film cumulative volume 1% and 2% to vulcanizing on the ultra-thin complaisant conductive macromolecule sensitive film, the time is more than 24 hours, to form the better elastic film;
Above-mentioned steps 13) also is after the butadiene rubber particle of 20～30 μ m joins in this mixture, to continue again mechanical raking 20-30 minute in, makes the acetone volatilization the particle diameter of the 3-5% of mixture cumulative volume amount;
Adopt described ultra-thin complaisant conductive macromolecule sensitive film to prepare the method for array extruding force sensor, may further comprise the steps:
21) Kapton covers copper: be laminated with one deck Copper Foil on Kapton;
22) photoetching electrode and lead-in wire: Copper Foil is carried out photoetching form upper strata column electrode bar, following stratose electrode strip, solid matter lead-in wire and external plug; The orthogonal formation array of row, column electrode strip, row, column lead-in wire and plug stagger mutually;
23) apply location glue: between electrode, apply one deck location glue, with the fixing position of ultra-thin complaisant conductive macromolecule sensitive film on electrode;
24) attach ultra-thin complaisant conductive macromolecule sensitive film: the ultra-thin complaisant conductive macromolecule sensitive film for preparing is cut into and the corresponding size of electrode layer, is attached to down on the stratose electrode;
25) apply packaging plastic: have heat cured packaging plastic in the coating of the Kapton edge of lower electrode;
26) packaging by hot pressing: the upper strata column electrode is attached ultra-thin complaisant conductive macromolecule sensitive film, utilize the flexible material packaging machine to carry out packaging by hot pressing and become a submissive sensor probe of array;
27) plug of drawing the solid matter cable with the packaged submissive sensor probe of array links to each other with front end circuit, forms array extruding force sensor.
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