WO2020197334A1

WO2020197334A1 - Stand-alone active emi filter module

Info

Publication number: WO2020197334A1
Application number: PCT/KR2020/004247
Authority: WO
Inventors: 정상영; 김진국
Original assignee: 이엠코어텍 주식회사; 울산과학기술원
Priority date: 2019-03-28
Filing date: 2020-03-27
Publication date: 2020-10-01

Abstract

The present invention relates to a stand-alone active EMI filter module and a manufacturing method thereof, wherein the volume of each element constituting the EMI filter module can be reduced , thereby implementing a single module unit with a compact structure and improving EMI noise reduction performance.

Description

Isolated active EMI filter module

Embodiments relate to a separate active EMI filter module and a method of manufacturing the same.

In general, electric appliances such as home appliances, industrial electric appliances, and electric vehicles emit noise during operation. For example, noise may be generated due to the switching operation inside the electric device. Such noise is not only harmful to the human body, but also causes malfunction or failure of other connected electronic devices.

Electromagnetic interference from an electronic device to other devices is referred to as EMI (Electromagnetic Interference), and among them, noise transmitted through wires and board wiring is referred to as Conducted Emission (CE) noise.

In order to ensure that electronic devices operate without causing breakdowns in peripheral components and other devices, EMI noise emission levels are strictly regulated in all electronic products. Therefore, most electronic products essentially include an electromagnetic wave noise reduction device such as an EMI filter that reduces EMI noise in order to satisfy the regulation on the amount of noise emission.

For example, in white home appliances such as air conditioners, electric vehicles, aviation, energy storage systems (ESS), etc., a current compensation device is essentially included. A conventional current compensating device uses a common mode choke to reduce common mode (CM) noise among conductive emission (CE) noise.

However, the common mode (CM) choke has a problem in that the noise reduction performance is rapidly deteriorated due to self-saturation in a high power/high current system, and in order to maintain the noise reduction performance, the size or number of common mode chokes may be increased. In this case, there is a problem that the size and price of the EMI filter are greatly increased.

In addition, since the conventional EMI filter is bulky as a whole and has a structure in which devices are exposed to the external environment as it is, when used in a system placed in an external environment, devices can be easily deteriorated from external shocks or environmental influences. It can have a great influence on the characteristics of

An embodiment of the present invention is to solve the above problems and/or limitations, and an object thereof is to provide an independent active EMI filter module capable of reducing the volume and being independent from an external environment, and a method of manufacturing the same. However, these problems are exemplary, and the scope of the present invention is not limited thereby.

In order to achieve the above object, an embodiment is provided on a substrate including a first surface and a second surface facing each other, and installed on at least one surface of the first surface or the second surface, and detects electromagnetic noise. A first device group provided so as to be provided, a second device group provided on at least one of the first or second surfaces and provided to generate a compensation signal for the electromagnetic wave noise, the substrate, and the first device group And an encapsulation structure provided to separate the second device group from the outside, a first pin group exposed to the outside of the encapsulation structure and electrically connected to at least a portion of the first device group or the second device group, and the encapsulation It is possible to provide an independent active EMI filter module including a second pin group exposed to the outside of the structure and electrically connected to at least a portion of the first device group or the second device group.

The encapsulation structure includes a space part located therein and an opening connected to the space part, a support provided to receive at least one of the substrate, a first device group, and a second device group in the space part, and the space It may include a filling portion provided to fill at least a portion of the portion.

At least a portion of the first pin group or the second pin group may be provided to be exposed to the outside of the support through the opening.

The filling part may be provided to close the opening.

The filling unit may include a first filling portion facing the first surface and a second filling portion facing the second surface.

In order to achieve the above object, according to another embodiment, provided to detect electromagnetic wave noise on at least one of the first or second surfaces of the substrate including the first and second surfaces facing each other. Installing a first device group; installing a second device group provided to generate a compensation signal for the electromagnetic wave noise on at least one of the first surface or the second surface; and the substrate; The first device group and the second device group are separated from the outside, and a first pin group electrically connected to the first device group and a second pin group electrically connected to the second device group are exposed to the outside. It is possible to provide a method for manufacturing an independent active EMI filter module including forming a structure.

The forming of the encapsulation structure may include preparing a support including a space part located therein and an opening connected to the space part, and at least one of the substrate, a first device group, or a second device group in the space part. And forming a filling portion provided to fill at least a portion of the space portion.

The forming of the encapsulation structure may further include exposing at least a portion of the first fin group or the second fin group to the outside of the support through the opening.

The forming of the filling part may further include closing the opening using the filling part.

The forming of the filling portion may include forming a first filling portion opposite to the first surface, and forming a second filling portion facing the second surface.

In an embodiment, a substrate including a first surface and a second surface facing each other, a first device group installed on at least one of the first surface or the second surface and provided to detect electromagnetic noise, Separation of a second device group, the substrate, the first device group, and the second device group from the outside, provided on at least one of the first or second surfaces and provided to generate a compensation signal for the electromagnetic noise An encapsulation structure provided so as to be formed, and a connection part provided to connect with the first and second surfaces, and provided so as not to interfere with at least one of the first device group or the second device group, and located at the connection part, the An independent active EMI filter module including a connector connected to the encapsulation structure and a pin group exposed to the outside of the encapsulation structure and electrically connected to at least a portion of the first device group or the second device group may be provided.

The connector may be combined with at least a portion of the encapsulation structure.

The filling portion may include a first filling portion facing the first surface and a second filling portion facing the second surface, and the connector may be provided to connect the first filling portion and the second filling portion. have.

According to another embodiment, a first element group provided to detect electromagnetic wave noise is installed on at least one of the first or second surfaces of the substrate including the first and second surfaces opposite to each other And installing a second element group provided to generate a compensation signal for the electromagnetic wave noise on at least one of the first and second surfaces, and connecting the first and second surfaces Forming a connection part provided to prevent interference with at least one of the first device group or the second device group, and separating the substrate, the first device group, and the second device group from the outside, and Forming an encapsulation structure provided so that a pin group electrically connected to at least a portion of the first device group or the second device group is exposed to the outside, and forming a connector located at the connection portion and connected to the encapsulation structure It is possible to provide a method of manufacturing an independent active EMI filter module.

The step of forming the connector may include causing the connector to be coupled to at least a portion of the encapsulation structure.

The forming of the filling part includes forming a first filling part opposite to the first surface, and forming a second filling part opposite to the second surface, and forming the connector , The connector may include connecting the first filling part and the second filling part.

In an embodiment, a substrate including a first surface and a second surface facing each other, a first device group installed on at least one of the first surface or the second surface and provided to detect electromagnetic noise, A second element group installed on at least one of the first or second surfaces and provided to generate a compensation signal for the electromagnetic wave noise, a space located therein, and an opening connected to the space, Independent including a support provided to accommodate at least one of the substrate, a first device group, or a second device group in the space part, a filling part provided to fill at least a part of the space part, and a junction part connected to the support Active EMI filter module can be provided.

It may include a pin group exposed to the outside of the filling part and electrically connected to at least a portion of the first device group or the second device group.

A connection unit provided to connect to the first and second surfaces and provided so as not to interfere with at least one of the first device group or the second device group, and a connector located on the connection unit and connected to the filling unit. Can include.

A connection unit provided to connect to the first and second surfaces and provided so as not to interfere with at least one of the first device group or the second device group, and a connector located on the connection unit and connected to the filling unit. Including, and the connector may be provided to connect the first filling portion and the second filling portion.

According to another embodiment, a first element group provided to detect electromagnetic wave noise is installed on at least one of the first or second surfaces of the substrate including the first and second surfaces opposite to each other And installing a second element group provided to generate a compensation signal for the electromagnetic wave noise on at least one of the first and second surfaces, and connecting the first and second surfaces Forming a connection part provided to prevent interference with at least one of the first device group or the second device group, and preparing a support including a space part located inside and an opening connected to the space part And, accommodating at least one of the substrate, a first device group, or a second device group in the space part, forming a filling part provided to fill at least a part of the space part, and a junction part connected to the support It is possible to provide a method of manufacturing an independent active EMI filter module including forming.

And exposing a pin group electrically connected to at least a portion of the first device group or the second device group to the outside of the filling unit.

Forming a connection part provided to connect with the first and second surfaces and provided so as not to interfere with at least one of the first device group or the second device group, and located at the connection part and connected to the filling part. It may further include forming a connector.

Forming a connection part provided to connect with the first and second surfaces and provided so as not to interfere with at least one of the first device group or the second device group, and located at the connection part and connected to the filling part. The step of forming a connector may be further included, and the step of forming the connector may include connecting the first filling part and the second filling part to the connector.

An embodiment includes a first device group including a noise sensing unit configured to detect electromagnetic noise, and a second device group including a compensation unit configured to generate a compensation signal for the electromagnetic noise, and the first The group and the second group may provide a separate active EMI filter module provided to be mounted on different substrates, respectively.

A first substrate on which the first device group is mounted, a second substrate on which the second device group is mounted, and at least a portion of the first substrate and the second substrate are interposed between the first and second substrates. It may include a first electrical connection for electrically connecting at least a portion of the substrate.

It may include a second electrical connection portion coupled to the second substrate and provided to be coupled to the first electrical connection portion.

The second electrical connector may be provided in-line along an edge of the second substrate.

It may further include an encapsulation structure provided to separate the second substrate and the second device group from the outside.

According to the embodiments of the present invention as described above, it is possible to reduce the volume of each element constituting the EMI filter module, thereby implementing a single modularization of a compact structure, and improving the EMI noise reduction performance. .

In addition, it is possible to achieve an independent structure separated from the external environment by the encapsulation structure, thereby further improving the durability.

By implementing a single modularization, it can be easily assembled and disassembled even when installed in a system and/or other device, and can exhibit very excellent performance in maintenance.

It is possible to selectively add a heat dissipation function, it is possible to prevent the device characteristics from deteriorating and improve durability.

It is possible to reduce the cost by not using bulky CM chokes or reducing the number.

The sealing structure can be more firmly fixed, and the durability of the sealing structure can be improved.

The substrate can be more firmly fixed by the bonding portion, and thus the durability of the module can be further improved.

1 is a block diagram of an independent active EMI filter module according to an embodiment.

2 is a schematic cross-sectional view of the independent active EMI filter module of FIG. 1 according to an embodiment.

3 is a diagram showing a more detailed configuration of an independent active EMI filter module according to an embodiment.

4 is a diagram showing a more detailed configuration of an independent active EMI filter module according to another embodiment.

5 is a diagram showing a more detailed configuration of an independent active EMI filter module according to another embodiment.

6 is a cross-sectional view of an independent active EMI filter module according to another embodiment.

7 is a cross-sectional view of an independent active EMI filter module according to another embodiment.

8A and 8B are bottom views illustrating different embodiments of arrangement states of a first pin group and a second pin group.

9 is a diagram showing a more detailed configuration of an independent active EMI filter module according to another embodiment.

10 is a bottom view illustrating an example of an arrangement state of a first pin group and a second pin group according to the embodiment illustrated in FIG. 9.

11 is a diagram showing a more detailed configuration of an independent active EMI filter module according to another embodiment.

12 is a bottom view illustrating an example of an arrangement state of a first pin group and a second pin group according to the embodiment shown in FIG. 11.

13 to 17 are diagrams illustrating a manufacturing process of an independent active EMI filter module according to embodiments.

18 is a schematic cross-sectional view of the independent active EMI filter module of FIG. 1 according to another embodiment.

19 is a diagram showing a more detailed configuration of an independent active EMI filter module according to another embodiment.

20 is a cross-sectional view of an independent active EMI filter module according to another embodiment.

21 is a cross-sectional view illustrating an embodiment of the connection part and the connector of FIG. 20.

22 is a cross-sectional view of an independent active EMI filter module according to another embodiment.

23A and 23B are bottom views illustrating different embodiments of arrangement states of a first pin group and a second pin group.

FIG. 24 is a bottom view showing another example of the arrangement of pins according to the embodiment shown in FIG. 9.

FIG. 25 is a bottom view showing another example of the arrangement of pins according to the embodiment shown in FIG. 11.

26 to 27 are diagrams illustrating a manufacturing process of an independent active EMI filter module according to still other embodiments.

28 is a diagram illustrating a part of a manufacturing process of an independent active EMI filter module according to another embodiment.

29 is a cross-sectional view of an independent active EMI filter module according to another embodiment.

30 is a cross-sectional view of an independent active EMI filter module according to another embodiment.

31 is a bottom view of an independent active EMI filter module according to an embodiment.

32 is a bottom view of an independent active EMI filter module according to another embodiment.

33 is a cross-sectional view of an independent active EMI filter module according to another embodiment.

34 is a cross-sectional view of an independent active EMI filter module according to another embodiment.

35 is a configuration diagram of a separate active EMI filter module according to another embodiment.

36 is a view showing a more detailed configuration of a separate active EMI filter module according to another embodiment.

37 is a plan configuration diagram illustrating a first substrate of a separate active EMI filter module according to another embodiment.

38 is a side view illustrating a second substrate coupled to a first substrate in a separate active EMI filter module according to another exemplary embodiment.

39 is a plan configuration diagram illustrating a first substrate of a separate active EMI filter module according to another embodiment.

40 is a side view illustrating a second substrate coupled to a first substrate in a separate active EMI filter module according to another embodiment.

41 is a plan configuration diagram illustrating a first substrate of a separate active EMI filter module according to another embodiment.

42 is a side view illustrating a second substrate coupled to a first substrate according to another exemplary embodiment.

43 is a side view illustrating a second substrate coupled to a first substrate according to another embodiment.

44 shows a more specific example of a separate active EMI filter module according to another embodiment.

45 illustrates a more specific example of a separate active EMI filter module according to another embodiment.

46 illustrates a more specific example of a separate active EMI filter module according to another embodiment.

47 illustrates a more specific example of a separate active EMI filter module according to another embodiment.

48 is a partial cross-sectional view of a separate active EMI filter module according to an embodiment.

49 is a partial perspective view of a detachable active EMI filter module according to the embodiment shown in FIG. 48.

Since the present invention can apply various transformations and have various embodiments, specific embodiments will be illustrated in the drawings and described in detail in the detailed description. Effects and features of the present invention, and a method of achieving them will be apparent with reference to the embodiments described later in detail together with the drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various forms.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, and when describing with reference to the drawings, the same or corresponding components are assigned the same reference numerals, and redundant descriptions thereof will be omitted .

In the following examples, the singular expression includes the plural expression unless the context clearly indicates otherwise.

In the following embodiments, terms such as include or have means that the features or elements described in the specification are present, and do not preclude the possibility of adding one or more other features or elements in advance.

In the following embodiments, when a part such as a film, a region, or a component is on or on another part, not only the case directly above the other part, but also another film, region, component, etc. are interposed therebetween This includes cases where there is.

When a certain embodiment can be implemented differently, a specific process order may be performed differently from the described order. For example, two processes described in succession may be performed substantially simultaneously, or may be performed in an order opposite to the described order.

In the drawings, components may be exaggerated or reduced in size for convenience of description. For example, the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of description, and thus the following embodiments are not necessarily limited to those shown.

1 is a block diagram of an EMI filter module according to an embodiment.

The independent active EMI filter module 1 according to an embodiment may include a substrate 10, a first element group 11, a second element group 12, and a pin group installed on the substrate 10. .

The substrate 10 may be an insulating and/or conductive substrate having a conductive pattern formed on at least one surface thereof. According to an embodiment, the substrate 10 may be a printed circuit board provided in a flat plate shape. The substrate 10 may be a rigid or flexible printed circuit board.

A first through line 21 and a second through line 22 pass through the substrate 10. The first through line 21 and the second through line 22 may be electrically connected to a power line, and the first through line 21 is a live line (L) and a second through line 22 Silver may be electrically connected to a neutral line (N), respectively.

According to an embodiment, each of the first through line 21 and the second through line 22 may be a conductive pattern formed to electrically pass through the substrate 10 from one end to the other end. The conductive pattern is not necessarily limited to extending in a straight line, and may be extended in a complex path.

The first through line 21 and the second through line 22, which are power lines as described above, may be electrically connected to the pin group, and specifically, may be electrically connected to the first pin group 14. According to an embodiment, the first pin group 14 may include the 1-1th pins 141 to 1-4th pins 144.

The 1-1 pin 141 may be electrically connected to one end of the first through line 21, and the 1-2 pin 142 may be electrically connected to the other end of the first through line 21. .

The 1-3th pin 143 may be electrically connected to one end of the second through line 22, and the 1-4 pin 144 may be electrically connected to the other end of the second through line 22. .

According to an embodiment, the 1-1 pin 141 and the 1-3 pin 143 may be electrically connected to the first device 2 positioned outside the independent active EMI filter module 1. .

The first device 2 may be various types of devices for supplying power to the independent active EMI filter module 1 in the form of current and/or voltage. For example, the first device 2 may be a device that produces and supplies power, or may be a device that supplies power generated by another device (for example, an electric vehicle charging device). Of course, the first device 2 may be a device that supplies stored energy. However, this is exemplary, and the spirit of the present invention is not limited thereto.

According to an embodiment, the 1-2 pins 142 and 1-4 pins 144 may be electrically connected to the second device 3 located outside the independent active EMI filter module 1.

The second device 3 may be various types of devices and/or loads using power supplied by the first device 2. The second device 3 may be a load driven by using power supplied by the first device 2. The second device 3 may be a load (eg, at least one component of an electric vehicle) that stores energy using power supplied by the first device 2 and is driven using the stored energy. However, this is exemplary, and the spirit of the present invention is not limited thereto.

Each of the first through line 21 and the second through line 22 may be a path through which electromagnetic noise generated by the second device 3 is transmitted to the first device 2. In this case, the electromagnetic wave noise may be input to each of the first and second through

lines

21 and 22 in a common mode.

The first device group 11 may include at least one device electrically connected to the first through line 21 and the second through line 22. According to an embodiment, the first device group 11 may include a device provided to detect electromagnetic wave noise generated from the second device 3.

The second device group 12 may include at least one device electrically connected to the first device group 11, the first through line 21 and the second through line 22.

According to an embodiment, the second device group 12 may include an active circuit unit 121 and a compensation unit 122.

According to an embodiment, the active circuit unit 121 may serve as an amplifier, and may amplify a current corresponding to electromagnetic wave noise sensed through the first element group 11 at a predetermined ratio.

According to an embodiment, the active circuit unit 121 generates an amplified current having the same magnitude as the current corresponding to the electromagnetic wave noise and opposite to the phase, and this through the compensation unit 122, the first through line 141 and the / Or it may flow through the second through line 142 to compensate for noise.

That is, the current amplified through the active circuit unit 121 flows to the compensation unit 122, and the compensation current flows from the compensation unit 122 to the first through line 141 and/or the second through line 142. do.

More specific embodiments of configuring the active circuit unit 121 and the compensation unit 122 will be described later.

Meanwhile, the first device group 11 and/or the second device group 12 may be electrically connected to the third device 4.

The third device 4 may be electrically connected to a pin group protruding out of the substrate 10. Specifically, the third device 4 may be electrically connected to the first device group 11 and/or the second device group 12 through the second pin group 15.

According to one embodiment, this third device 4 may include a device that provides power to the active circuit unit 121. For example, the third device 4 may include a device that generates input power of the active circuit unit 121, and the input power may include DC power.

The second pin group 15 may include pins that are not directly connected to the first through line 141 and/or the second through line 142, which is a power line. As described above, the third device ( 4) and electrically connected to, and/or may include pins used for grounding purposes. A specific example will be described later.

2 schematically shows a cross-section according to an embodiment of the independent active EMI filter module 1 having the above configuration.

The independent active EMI filter module 1 according to the exemplary embodiment as shown in FIG. 2 may include a substrate 10 having a first surface 101 and a second surface 102 facing each other. The first surface 101 and the second surface 102 may include a conductive pattern, and at least some of the conductive patterns of the first surface 101 and the second surface 102 may be electrically connected to each other.

The third device group 103 may be installed on the first surface 101 of the substrate 10, and the fourth device group 104 may be installed on the opposite second surface 102. Each of the third device group 103 and the fourth device group 104 may include at least one device, and at least some of them may be electrically connected to each other.

According to an embodiment, at least some of the devices belonging to the third device group 103 may be bulkier than at least some of the devices belonging to the fourth device group 104. The third device group 103 may have a larger volume than the fourth device group 104 as a whole. Accordingly, it is possible to provide stability to the module design, and in particular, the insulating characteristics of the encapsulating structure 13 of the third device group 103 having a large volume can be further improved.

According to an embodiment, the third device group 103 may include the first device group 11 and/or the compensation unit 122 illustrated in FIG. 1.

According to another embodiment, the fourth device group 104 may include the active circuit unit 121 shown in FIG. 1.

The first pin group 14 and the second pin group 15 described above may be installed to protrude in a direction perpendicular to one surface of the substrate 10. According to an embodiment, the first pin group 14 and the second pin group 15 It may be installed protruding on the two sides (102). The first pin group 14 and the second pin group 15 are preferably installed on the surface on which the fourth element group 104 having a relatively small volume is installed, and accordingly, the protruding length of each pin can be reduced. have.

According to an embodiment, at least one of the substrate 10, the third device group 103, or the fourth device group 104 may be separated from the outside by the encapsulation structure 13. The encapsulation structure 13 may include various insulating encapsulation structures capable of separating at least one of the substrate 10, the third device group 103, or the fourth device group from the outside, and may be formed of an insulating material. I can.

In FIG. 2, the encapsulation structure 13 is provided to encapsulate all of the substrate 10, the third device group 103, and the fourth device group 104, but the present invention is not limited thereto, and the third A structure for encapsulating the device group 103 and a part of the substrate 10 or the fourth device group 104 and a part of the substrate 10 may be included, respectively.

The first fin group 14 and the second fin group 15 may be formed to protrude so that their ends are exposed to the outside of the encapsulation structure 13, respectively. As shown in FIG. 2, the first pin group 14 and the second pin group 15 may directly protrude, but are not limited thereto, and the first pin group 14 and the second pin group 15 Separate terminals electrically connected to and may be provided so as to be exposed.

3 illustrates a more specific example of the first device group 11 and the second device group 12 according to an embodiment.

According to an embodiment, the first through line 21 and the second through line 22 may be designed to pass through the substrate 10.

Both ends of the first through line 21 are connected to the 1-1 pin 141 and the 1-2 pin 142. In addition, both ends of the second through line 22 are connected to the 1-3th pins 143 and the 1-4th pins 144.

According to an embodiment, the first element group 11 may include a sensing transformer capable of sensing noise.

The sensing transformer includes a first reference winding 111 and a second reference winding 112 electrically connected to a first through line 21 and a second through line 22, which are power lines, respectively, and the first and second reference windings. It may include a sensing winding 110 formed on the same core as the

reference windings

111 and 112.

The first reference winding 111 and the second reference winding 112 may be a primary winding connected to a power line, and the sensing winding 110 may be a secondary winding.

The first reference winding 111 and the second reference winding 112 may each be in the form of a winding wound around a core, but are not necessarily limited thereto, and the first reference winding 111 or the second reference winding At least one of 112 may have a structure passing through the core.

The sensing winding 110 may have a structure in which the first and

second reference windings

111 and 112 are wound and/or wound around a core at least once or more.

The sensing winding 110 is electrically insulated from the primary winding, which is a power line, a noise current generated from the second device 3 is sensed, and a current converted from the noise current at a predetermined ratio may be induced.

The primary and secondary windings may be wound in consideration of the direction of generation of magnetic flux and/or magnetic flux density.

For example, as a first current, which is noise, is input to the first reference winding 111, a first magnetic flux density may be induced in the core. Similarly, as the first current is input to the second reference winding 112, a second magnetic flux density may be induced in the core.

A first induced current may be induced in the sensing winding 110 that is the second secondary side by the induced first and second magnetic flux densities.

At this time, the sensing transformer is configured so that the first magnetic flux density and the second magnetic flux density induced by the first current may overlap (or reinforce each other), and the first through line 21 and the second through line A first induced current corresponding to the first current may be generated in the second secondary side insulated from 22, that is, the sensing winding 110.

Meanwhile, the number of the first reference winding 111, the second reference winding 112, and the sensing winding 110 wound around the core may be appropriately determined according to the requirements of the system in which the independent active EMI filter module 1 is used. have.

For example, the first and

second reference windings

111 and 112 of the primary winding and the sensing winding 110 may have a winding ratio of 1:N _sen . In addition, if the self-inductance of the primary winding of the sensing transformer is L _sen , the secondary winding can have a self inductance of N _sen ² ·L _sen . The primary and secondary windings of the sensing transformer 120 may be combined with a coupling coefficient of k _sen .

Meanwhile, the above-described sensing transformer may be configured such that a magnetic flux density induced by a second current, which is a normal current flowing through each of the first through line 21 and the second through line 22, satisfies a predetermined magnetic flux density condition.

That is, the third magnetic flux density and the fourth magnetic flux density may be induced in the core by the second current flowing through the first and

second reference windings

111 and 112, respectively. In this case, the third magnetic flux density and the fourth magnetic flux density may be conditions that cancel each other.

In other words, the sensing transformer reduces the second induced current induced to the sensing winding 120, which is the secondary side, by a second current, which is a normal current flowing through each of the first through line 21 and the second through line 22. It may be set to be less than the threshold size, and accordingly, the sensing transformer may be configured such that the magnetic flux densities induced by the second current cancel each other, so that only the above-described first current may be sensed.

In the sensing transformer, the magnitude of the first and second magnetic flux density induced by the first current, which is a noise current in the first frequency band (for example, a band having a range of 150 KHz to 30 MHz), is in the second frequency band (for example, 50 Hz to 30 MHz). It may be configured to be larger than the magnitude of the third and fourth magnetic flux densities induced by the second current, which is a typical current of a band having a range of 60 Hz).

In the present invention, that the component A is configured to be B may mean that the design parameter of the component A is set to be appropriate for B. For example, the fact that the sensing transformer is configured to have a large magnetic flux induced by the current in a specific frequency band means that parameters such as the size of the sensing transformer, the diameter of the core, the number of turns, the size of the inductance, and the magnitude of the mutual inductance are It may mean that it is appropriately set so that the magnitude of the magnetic flux induced by the current in the band becomes strong.

The sensing winding 110, which is the secondary side of the sensing transformer, supplies the first induced current to the active circuit unit 121, as shown in FIG. 3, the input terminal of the active circuit unit 121 and the reference of the active circuit unit 121 It can be placed on the path connecting the electric potential.

According to an embodiment, the active circuit unit 121 may be a means for generating an amplified current by amplifying the first induced current generated by the sensing transformer.

According to an embodiment, the sensing winding 110 may be differentially connected to an input terminal of the active circuit unit 121.

In the present invention, the amplification by the active circuit unit 121 may mean adjusting the size and/or phase of the amplification target. For example, the active circuit unit 121 may generate an amplified current by changing the phase of the first induced current by 180 degrees and increasing the magnitude by k times (k>=1).

The active circuit unit 121 may be designed to generate an amplified current in consideration of the transformation ratio of the above-described sensing transformer and the transformation ratio of the compensation transformer 1221 to be described later. For example, the sensing transformer of the first element group 11 converts a first current, which is a noise current, into a first induced current whose magnitude is 1/F1 times, and the compensation transformer 1221 converts the magnitude of the amplified current to 1 When converting the compensation current to be multiplied by /F2, the active circuit unit 121 may generate an amplified current that is F1xF2 times the magnitude of the first induced current.

At this time, the active circuit unit 121 may generate the amplified current so that the phase of the amplified current is opposite to the phase of the first induced current.

The active circuit unit 121 may be implemented by various means. According to an embodiment, the active circuit unit 121 may include an OP AMP. According to another embodiment, the active circuit unit 121 may include a plurality of passive elements such as a resistor and a capacitor in addition to the OP AMP. According to another embodiment, the active circuit unit 121 may include a bipolar junction transistor (BJT) and/or a plurality of passive elements such as a resistor and a capacitor. However, it is not necessarily limited thereto, and the means for amplification described in the present invention may be used without limitation as the active circuit unit 121 of the present invention.

The active circuit unit 121 may generate an amplified current by amplifying the first induced current by receiving power from the third device 4 that is separate from the first device 2 and/or the second device 3. have. In this case, the third device 4 may be a device that receives power from a power source independent of the first device 2 and the second device 3 and generates input power to the active circuit unit 121. Also, the third device 4 may be a device that receives power from any one of the first device 2 and the second device 3 and generates input power to the active circuit unit 121. The active circuit unit 121 may be electrically connected to the third device 4 through the 2-1 pin 151 coupled to the substrate 10.

The amplified current flows through the compensation unit 122 to the first through line 141 and/or the second through line 142 to compensate for noise.

According to an embodiment, the compensation unit 122 may include a compensation transformer 1221 and a compensation capacitor unit 1222.

The compensation transformer 1221 may include a primary winding positioned at an output portion of the active circuit unit 121 and a secondary winding electrically connected to the compensation capacitor unit 1222. The secondary winding of the compensation transformer 1221 is electrically connected to the first through line 21 and the second through line 22 as power lines with the compensation capacitor unit 1222 interposed therebetween. Accordingly, the active circuit unit 121 may be electrically insulated from the power line, thereby protecting the active circuit unit 121.

The compensation transformer 1221 is insulated from the first through line 21 and the second through line 22 and/or is isolated from the above-described first through line 21 and the second through line 22 based on the amplified current. 2 It may be a means for generating a compensating current on the side of the through line 22 (or on the secondary side to be described later).

More specifically, the compensation transformer 1221 is on the primary side disposed on the path connecting the output terminal of the active circuit unit 121 and the reference potential of the active circuit unit 121 to the amplified current generated by the active circuit unit 121 It is possible to generate a compensating current on the secondary side based on the magnetic flux density induced by it. The reference potential (reference potential 2) of the active circuit unit 121 may be grounded through the 2-2 pin 152.

In this case, the secondary side may be disposed on a path connecting the compensation capacitor unit 1222 to be described later and the reference potential of the independent active EMI filter module 1. The reference potential (reference potential 1) of the independent active EMI filter module 1 may be grounded through the 2-3rd pins 153.

In this way, the compensation transformer 1221 transmits the amplified current generated by the active circuit unit 121 to the first through line 21 and the second through line 22 in an insulated and/or isolated state. It can be transmitted to the line 21 and the second through line 22 side.

On the other hand, according to another embodiment, the primary side of the compensation transformer 1221, the active circuit unit 121 and the sensing winding 110 are separated from the remaining components of the independent active EMI filter module 1 ( It can be connected to the reference potential 2). That is, the reference potential (reference potential 2) of the active circuit unit 121 and the reference potential (reference potential 1) of the independent active EMI filter module 1 may be different potentials.

As described above, according to an embodiment of the present invention, a component that generates a compensation current is operated in an insulated state by using a reference potential that is different from the other components, and by using a separate power source. In this way, the reliability of the independent active EMI filter module 1 can be improved.

As described above, the compensation transformer 1221 is amplified by the active circuit unit 121 and converts the current flowing through the primary side of the compensation transformer 1221 to a predetermined ratio and induces it to the secondary side of the compensation transformer 1221. have.

For example, in the compensation transformer 1221, a turns ratio of a primary side and a secondary side may be 1:N _inj . In addition, if the self-inductance of the primary side of the compensation transformer 1221 is L _inj , the secondary side of the compensation transformer can have a self inductance of N _inj ² ·L _inj . The primary side and the secondary side of the compensation transformer 1221 may be combined with a coupling coefficient of k _inj . The current converted through the compensation transformer 1221 may be injected as a compensation current I _comp into the first through line 21 and the second through line 22 which are power lines through the compensation capacitor unit 1222.

The compensation capacitor unit 1222 may be a means for providing a path through which the current generated by the compensation transformer 1221 flows to each of the first and second through

lines

21 and 22.

The compensation capacitor unit 1222 includes at least two compensation capacitors connecting each of the reference potential (reference potential 1) and the first through line 21 and the second through line 22 of the independent active EMI filter module 1 can do. Each of the compensation capacitors may include a Y-capacitor (Y-cap). One end of each compensation capacitor may share a node connected to the secondary side of the compensation transformer 1221, and the other end may have a node connected to the first through line 21 and the second through line 22, respectively.

The compensation capacitor unit 1222 may be configured such that a current flowing between the first through line 21 and the second through line 22 through at least two compensation capacitors satisfies a first predetermined condition. In this case, the first predetermined condition may be a condition in which the magnitude of the current is less than the predetermined first threshold magnitude.

In addition, the compensation capacitor unit 1222 is between each of the first through line 21 and the second through line 22 and the reference potential (reference potential 1) of the independent active EMI filter module 1 through at least two compensation capacitors. The flowing current may be configured to satisfy a second predetermined condition. In this case, the second predetermined condition may be a condition in which the magnitude of the current is less than the predetermined second threshold magnitude.

The compensation current flowing to each of the first through line 21 and the second through line 22 along the compensation capacitor part 1222 cancels out the first current on the first through line 21 and the second through line 22 Thus, it is possible to prevent the first current from being transmitted to the second device 2 described above. In this case, the first current and the compensation current may be currents having the same magnitude and opposite phases.

Accordingly, the independent active EMI filter module 1 according to an embodiment of the present invention is provided in each of the first through line 21 and the second through line 22, which are at least two high current paths connected to the first device 2. The first current, which is a noise current input in the common mode, is actively compensated to suppress the noise current emitted to the first device 2. This can prevent malfunction or damage of the second device 3 and/or other devices connected to the first device 2.

In the above structure, the second fin group 15 may include a 2-1 pin 151, a 2 -2 pin 152 and a 2-3 th pin 153. The 2-1 pin 151 may electrically connect the active circuit unit 121 to the third device 4. The 2-2 pin 152 may be electrically connected to the reference potential (reference potential 2) of the active circuit part 121, and the 2-3 pin 153 is the independent active EMI filter module (1) It can be electrically connected to the reference potential of (reference potential 1). According to an embodiment, the 2-2 pin 152 and the 2-3 pin 153 may be grounded.

The independent active EMI filter module 1 shown in FIG. 3 represents a current-sense current-compensation (CSCC) independent active EMI filter module that senses current to compensate for the current. In particular, the independent active EMI filter module 1 of FIG. 3 may be a feedforward type compensation filter that compensates noise input from the second device 3 at the front end, which is the power side. That is, in the independent active EMI filter module 1, the first element group 11, which is a sensing transformer, may be disposed on the EMI source side, and the compensation capacitor unit 1222 may be disposed on the power side. In addition, the independent active EMI filter module 1 uses the compensation transformer 1221 despite compensating with current using the compensation capacitor unit 1222, and/or the first element group 11 as a sensing transformer. By using it, an isolated structure can be realized. That is, the independent active EMI filter module 1 according to an embodiment of the present invention may have an insulated feedforward CSCC structure.

As described above, in the independent active EMI filter module 1, the compensation current I _comp may have the same magnitude as the noise current I _n and may have the opposite phase. That is, the active circuit unit 121, the first element group 11, so that the current gain ratio representing the compensation current I _comp to the noise current I _n input to the independent active EMI filter module 1 is -1, And a compensation transformer 1221 may be designed. Through this, it is possible to provide an independent active EMI filter module 1 capable of reducing EMI noise by canceling out the noise current I _n generated from the EMI source.

The independent active EMI filter module 1 according to another embodiment of the present invention may not include a common mode (CM) choke. Since the CM choke functions as a passive filter, it must have a very large inductance to prevent leakage of noise current. Accordingly, the CM choke has a large number of windings and a very large core size. Unlike such a CM choke, the first element group 11, which is a sensing transformer included in the independent active EMI filter module 1 according to an embodiment of the present invention, is for sensing a noise current, so it is necessary to have a large impedance. none. The sensing transformer may have an impedance of one thousandth to one hundredth of the impedance of the CM choke. Therefore, the size of the sensing transformer can be much smaller than that of the CM choke. The independent active EMI filter module 1 according to the embodiment of the present invention can operate independently without parasitic to the CM choke. Accordingly, it can be manufactured by reducing the size and weight in a module shape corresponding to the size of the substrate 10, and through this, the sealing by the sealing structure 13 can be made simply.

The present invention is not necessarily limited thereto, and it goes without saying that the independent active EMI filter module 1 may operate in combination with an independent external CM choke according to still other embodiments.

4 illustrates a more specific example of the first device group 11 and the second device group 12 according to another embodiment.

Referring to FIG. 4, in the independent active EMI filter module 1 according to another embodiment, a first through line 21 and a second through line 22 pass through a substrate 10, and The installed first device group 11 and the second device group 12 may be included.

In the embodiment shown in FIG. 4, unlike the embodiment shown in FIG. 3 described above, the first element group 11 is the first pin 141 and the first device 2 side of the power supply side. 3 is electrically connected to pin 143. In addition, the second element group 12 is electrically connected to the 1-2 pins 142 and the pins 1-4 144 on the side of the second device 3. Accordingly, the embodiment shown in FIG. 4 shows a CSCC active EMI filter of a feedback type, which senses a noise current going out to the first device 2 and compensates with the current at the second device 3 side.

The first element group 11, the active circuit unit 121, the compensation transformer 1221, and the compensation capacitor unit 1222, which are sensing transformers shown in FIG. 4, respectively perform the same functions as the elements shown in FIG. can do. In addition, the independent active EMI filter module 1 shown in FIG. 4 can also implement an isolated structure.

5 shows a more specific example of the first device group 11 and the second device group 12 according to another embodiment.

Referring to FIG. 5, in the independent active EMI filter module 1 according to another embodiment, a first through line 21 and a second through line 22 pass through a substrate 10, and The installed first device group 11 and the second device group 12 may be included.

According to the embodiment illustrated in FIG. 5, the first device group 11 may include a sensing capacitor unit 116. In addition, the second device group 12 may include an active circuit unit 121 and a compensation capacitor unit 1222. Accordingly, the independent active EMI filter module 1 according to the embodiment shown in FIG. 5 senses the noise voltage using the sensing capacitor unit 116 and compensates with current using the compensation capacitor unit 1222- Represents a voltage-sense current-compensation (VSCC) active EMI filter. In a VSCC structure such as the active EMI filter 1 according to this embodiment, a feedforward and a feedback may not be distinguished due to an operating principle. That is, in the independent active EMI filter module 1 shown in FIG. 5, there may be no distinction between input/output units. In addition, the independent active EMI filter module 1 according to the embodiment may also have an isolated structure by using the compensation transformer 1221 and the sensing transformer 115.

The sensing capacitor unit 116 may sense a noise voltage input to the first through line 21 and the second through line 22 which are power lines. The sensing capacitor unit 116 may include two sensing capacitors, and each sensing capacitor may include a Y-cap. One end of each of the two sensing capacitors may be electrically connected to the first through line 21 and the second through line 22, and the other end may share a node connected to the primary side of the sensing transformer 115. I can. The primary side of the sensing transformer 115 may be electrically connected to the first through line 21 and the second through line 22 which are power lines through the sensing capacitor unit 116. The primary winding of the sensing transformer 115 may be electrically connected to the 2-4 pins 154 of the second pin group 15 coupled to the substrate 10.

The sensing transformer 115 may include a primary side connected to the power line side and a secondary side connected to the active circuit unit 121 in order to sense noise flowing through the power line. The secondary side of the sensing transformer 115 may be differentially connected to the input terminal of the active circuit unit 121.

The sensing transformer 115, the active circuit unit 121, the compensation transformer 1221, and the compensation capacitor unit 1222 included in the independent active EMI filter module 1 according to the embodiment shown in FIG. 5 are each implemented as described above. An operation corresponding to the sensing transformer, the active circuit unit 121, the compensation transformer 1221, and the compensation capacitor unit 1222 of the examples may be performed.

Although not shown in the drawings, in the above-described embodiments, the active circuit unit 121 further includes a high-pass filter (not shown) between the compensation transformer 1221 and is less than or equal to the frequency band subject to noise reduction. It is possible to block the active circuit unit 121 from operating at a low frequency.

The independent active EMI filter module 1 of the embodiments shown in FIGS. 3 to 5 as described above has a sealing structure blocked from the outside through the sealing structure 13 as shown in FIG. can do.

According to the embodiment shown in FIG. 6, a third device group 103 is installed on the first side 101 of the substrate 10, and the fourth device group 103 is on the second side 102 of the substrate 10. 104 can be installed. According to an embodiment, the third device group 103 may include various transformers and capacitor units, such as Y-cap, of FIGS. 3 to 5 described above. More specifically, the third device group 103 may include a sensing transformer, a compensation transformer 1221, and a compensation capacitor unit 1222 as the first device group 11.

In the case of the embodiment shown in FIG. 5, the third element group 103 is a sensing capacitor unit 116 or a sensing transformer of the first element group 11 in addition to the compensation transformer 1221 and the compensation capacitor unit 1222. It may include at least one of (115). If the third device group 103 includes the sensing capacitor unit 116 of the first device group 11 or the sensing transformer 115, the other device may be included in the fourth device group 14. .

The fourth device group 104 may include an active circuit unit 121. Accordingly, the fourth device group 104 may have a smaller volume than the third device group 103.

According to an embodiment, the encapsulation structure 13 may include a support 131 and a filling part 132.

The support 131 is formed of an insulating material and includes a space part 1310 located therein. The space part 1310 of the support 131 may be defined by an opening 1311 and a bottom 1312. In some cases, the support 131 may be formed of a material capable of heat transfer. In this case, a heat dissipation mechanism such as a heat sink may be additionally installed on the support 131, and accordingly, heat dissipation by the support 131 may be smoothly performed.

The above-described substrate 10 is accommodated in the space part 1310 of the support 131. In this case, the edge of the substrate 10 is formed to correspond to the size of the side surface of the space part 1310, and accordingly, the edge of the substrate 10 may be in close contact with the side surface of the space part 1310. Accordingly, the space part 1310 may be divided into two spaces centering on the substrate 10.

The substrate 10 may be disposed such that the first surface 101 faces the bottom 1312 of the support 131, and the second surface 102 may face the opening 1311 of the support 131. . In this case, the first distance t1 between the bottom 1312 and the first surface 101 of the substrate 10 may be greater than half of the distance between the bottom 1312 and the opening 1311. According to an embodiment, the first distance t1 between the bottom 1312 and the first surface 101 of the substrate 10 is a first distance t1 between the opening 1311 and the second surface 102 of the substrate 10. It may be provided larger than 2 distance (t2). Accordingly, the length of the pin group exposed to the outside of the support 131 through the opening 1311 from the second surface 102 can be designed to be small, which is structural stability when the independent active EMI filter module 1 is installed. Can provide.

Meanwhile, according to an embodiment, the independent active EMI filter module 1 may include a filling unit 132 provided to fill at least a portion of the space 1310.

The filling part 132 may be filled at least between the substrate 10 and the bottom 1312, and the substrate 10 may be fixedly bonded to the inner wall of the support 131 by the filling part 132.

The filling part 132 may be provided with a heat-resistant and/or insulating resin material. According to an embodiment, the filling part 132 may include an epoxy resin, and may further include a curing agent.

In the independent active EMI filter module 1 having the above structure, the second surface 102 of the substrate 10 from which the pins 14 protrude may constitute the bottom surface 133 of the module.

Since the independent active EMI filter module 1 can be simply installed in various devices and has a structure independent from external devices, in particular, the third element group 103 can be protected from external stimuli and/or impact, The independent active EMI filter module 1 itself can be prevented from being damaged. This makes it possible to improve the durability of the entire equipment requiring the independent active EMI filter module 1. In addition, it is possible to protect the third device group 103 from contaminated environments such as external dust. In addition, when the support 131 and/or the filling part 132 includes a heat dissipating material, the third element group 103 is prevented from deteriorating because the heat emitted from the third element group 103 can be radiated to the outside. Can be prevented.

7 is an independent active EMI filter module 1 according to another embodiment, and unlike the embodiment shown in FIG. 6, the filling unit 132 includes a first filling unit 1321 and a second filling unit 1322 It may include.

The first filling portion 1321 may face the first surface 101 of the substrate 10, and the second filling portion 1322 may face the second surface 102 of the substrate 10. The opening 1311 may be closed by the second filling portion 1322 as described above, and the second filling portion 1322 may constitute the bottom surface 133 of the module. The second filling part 1322 is provided to completely cover the fourth element group 104, and thus the pins 14 may have a structure protruding outward of the module through the second filling part 1322.

Since the independent active EMI filter module 1 according to this embodiment has a structure independent from an external device, the third element group 103 and the fourth element group 104 are protected from external stimuli and/or impact. Can be, and the independent active EMI filter module 1 itself can be prevented from being damaged. This makes it possible to improve the durability of the entire equipment requiring the independent active EMI filter module 1. In addition, it is possible to protect the third device group 103 and the fourth device group 104 from contaminated environments such as external dust. In addition, when the support 131 and/or the filling part 132 includes a heat dissipating material, heat emitted from the third device group 103 and/or the fourth device group 104 can be radiated to the outside. It is possible to prevent the third device group 103 and/or the fourth device group 104 from deteriorating.

In the independent active EMI filter module 1 as described above, a plurality of pins are exposed through the bottom surface 133 as shown in FIG. 8A. At this time, the 1-1 pin 141, the 1-2 pin 142, the 1-3 pin 143, and the 1-4 pin of the first pin group 14 electrically connected to the power line 144 are respectively disposed at the corners of the bottom surface 133, the 2-1 pin 151, the 2-2 pin 152, and the 2-3 pin 153 of the second pin group 15 ) Is placed in the position between each corner. The fins of the first fin group 14 electrically connected to the power line may be formed to be relatively thicker than the fins of the second fin group 15, and the fins of the first fin group 14 may be formed on the bottom surface ( By placing it at the corner of 133), structural stability can be provided when the independent active EMI filter module 1 is mounted on another device. In addition, since the pins of the first pin group 14 are mainly electrically connected to a bulky transformer, the

transformers

11 and 1221 are connected to the edge of the third element group 103 as shown in FIGS. 6 and 7. It can be placed so that the weight of the entire module is distributed, and it can give stability when installed. Even in the structure of designing the third device group 103 in this way, a design margin can be obtained by arranging the pins of the first pin group 14 at the corners of the bottom surface 133. On the other hand, the pins of the second pin group 15 may be relatively freely disposed after the pins of the first pin group 14 are arranged, so the pins are not necessarily limited to the embodiment shown in FIG. 8A, and the first pin It may be variously installed in the area between the pins of the group 14.

Meanwhile, the pins of the first pin group 14 do not necessarily have to be installed at the corners of the bottom surface 133, and as shown in FIG. 8B, at least some of the pins of the first pin group 14 are It may be installed at a location spaced from the corner of 133 inward by a certain degree. However, even in this case, structural stability can be ensured by not exceeding about 1/4 of the side distance from the edge. According to the embodiment shown in FIG. 8B, the 1-1 pin 141 and the 1-2 pin 142 are installed at a position spaced apart from the edge of the bottom surface 133 by a predetermined distance. In this case, 2-3 pins 153 may be installed at one corner of the bottom surface 133. According to the embodiment shown in FIGS. 3 to 5, the 2-3 pins 153 are lines electrically connected to the reference potential of the compensation transformer 1221, and thus the thickness of the pins is also the first pin group ( It can be as thick as the pins in 14). By arranging the thick 2-3 pins 153 at the corners of the bottom surface 133, structural stability can be secured.

9 shows a configuration of an independent active EMI filter module 1 according to another embodiment.

The embodiment shown in FIG. 9 is an independent active EMI filter module 1 having a three-phase, three-wire structure unlike the single-phase embodiment shown in FIG. 3.

9, a first through line 21, a second through line 22, and a third through line 23 pass through the substrate 10, and both ends of the first through line 21, It may be electrically connected to the pins 141 to 1-6 146. According to an embodiment, the first through line 21 may be an R-phase, the second through line 22 may be an S-phase, and the third through line 23 may be a T-phase.

The first element group 11 may include a sensing transformer capable of sensing noise, wherein the sensing transformer includes a first reference winding connected to the first through line 21 to the third through line 23, respectively (111) to third reference windings 113, and a sensing winding 110 formed on the same core as the first to third reference windings 111 to 113.

The first reference winding 111 to the third reference winding 113 may be a primary winding connected to a power line, and the sensing winding 110 may be a secondary winding.

The first reference winding 111 to the third reference winding 113 may each be in the form of a winding wound around a core, but are not necessarily limited thereto, and the first reference winding 111 and the second reference winding At least one of 112 or the third reference winding 113 may have a structure passing through the core.

The sensing winding 110 may have a structure in which the first to third reference windings 111 to 113 are wound and/or wound around a core at least once or more.

The sensing winding 110 is insulated from the power line as in the above-described embodiment of FIG. 3, and may sense a noise current generated from the second device 3. Like the embodiment of FIG. 3, the primary and secondary windings may be wound in consideration of the direction in which the magnetic flux and/or magnetic flux density are generated.

The sensing winding 110 supplies the induced current to the active circuit unit 121, and the active circuit unit 121 amplifies it to generate an amplified current. The active circuit unit 121 may be designed to generate an amplified current in consideration of the transformation ratio of the above-described sensing transformer and the transformation ratio of the compensation transformer 1221 to be described later. The active circuit unit 121 may be implemented by various means. According to an embodiment, the active circuit unit 121 may include an OP AMP. According to another embodiment, the active circuit unit 121 may include a plurality of passive elements such as a resistor and a capacitor in addition to the OP AMP. According to another embodiment, the active circuit unit 121 may include a bipolar junction transistor (BJT) and/or a plurality of passive elements such as a resistor and a capacitor. However, it is not necessarily limited thereto, and the means for'amplification' described in the present invention may be used without limitation as the active circuit unit 121 of the present invention. The active circuit unit 121 is electrically connected to the third device 4 through the 2-1 pin 151 coupled to the substrate 10.

The amplified current flows to the first through line 21, the second through line 22, and/or the third through line 23 through the compensation unit 122, thereby compensating for noise.

The compensation unit 122 may include a compensation transformer 1221 and a compensation capacitor unit 1222, and specific configurations and functions may be applied in the same manner as in the embodiment illustrated in FIG. 3. Each capacitor of the compensation capacitor unit 1222 has one end connected to the compensation transformer 1221 and the other end connected to the first through line 21 to the third through line 23, respectively.

The embodiment shown in FIG. 9 is shown in a three-phase, three-wire structure based on the embodiment shown in FIG. 3, but the present invention is not necessarily limited thereto, and the embodiment shown in FIG. The same can be applied to the embodiment shown in 5.

In this embodiment, the arrangement of the pins may be implemented as shown in FIG. 10. That is, the 1-1 pins 141 to 1-6 pins 146 of the first pin group 14 are arranged on the edge including the edge of the bottom surface 133 as far as possible. In addition, the 2-1 pins 151 to 2-3 pins 153 of the second pin group 15 are disposed in the remaining area of the edge of the bottom surface 133. At this time, the thick pins 2-3 pins 153, which are thick pins connected to the compensation transformer 1221, and the 2-1 pins 151 and 2-2 pins, which are relatively thin pins, are positioned to face each other, The entire batch can be evenly distributed. According to this structure, the fins may be uniformly disposed around the edge of the bottom surface 133.

11 shows a configuration of an independent active EMI filter module 1 according to another embodiment.

The embodiment shown in FIG. 11 is an independent active EMI filter module 1 having a three-phase four-wire structure unlike the single-phase embodiment shown in FIG. 3 and the three-phase three-wire embodiment shown in FIG.

Referring to FIG. 11, a first through line 21, a second through line 22, a third through line 23, and a fourth through line 24 pass through the substrate 10, both ends of which May be electrically connected to the 1-1 pins 141 to 1-8 pins 148, respectively. According to an embodiment, the first through line 21 is an R phase, the second through line 22 is an S phase, the third through line 23 is a T phase, and the fourth through line 24 is an N-phase. It can be a power line.

The first element group 11 may include a sensing transformer capable of sensing noise, wherein the sensing transformer includes a first reference winding connected to the first through line 21 to the fourth through line 24, respectively It may include (111) to fourth reference windings 114, and a sensing winding 110 formed on the same core as the first to fourth reference windings 111 to 114.

The first to fourth reference windings 111 to 114 may be a primary winding connected to a power line, and the sensing winding 110 may be a secondary winding.

The first reference winding 111 to the fourth reference winding 114 may each be in the form of a winding wound around a core, but are not necessarily limited thereto, and the first reference winding 111 and the second reference winding At least one of 112, the third reference winding 113, and the fourth reference winding 114 may have a structure passing through the core.

The sensing winding 110 may have a structure in which the first to fourth reference windings 111 to 114 are wound and/or wound around a core at least once or more.

The sensing winding 110 is insulated from the power line as in the above-described embodiments of FIGS. 3 and 9, and may sense a noise current generated from the second device 3. Like the embodiments of FIGS. 3 and 9, the primary winding and the secondary winding may be wound in consideration of the direction in which the magnetic flux and/or the magnetic flux density are generated.

The amplified current flows to the first through line 21, the second through line 22, the third through line 23 and/or the fourth through line 24 through the compensation unit 122, thereby reducing noise. You can compensate.

The compensation unit 122 may include a compensation transformer 1221 and a compensation capacitor unit 1222, and specific configurations and functions can be applied in the same manner as the embodiments shown in FIGS. 3 and 9 described above. have. Each capacitor of the compensation capacitor unit 1222 has one end connected to the compensation transformer 1221 and the other end connected to the first through line 21 to the fourth through line 24, respectively.

The embodiment shown in FIG. 11 is shown in a three-phase, four-wire structure based on the embodiment shown in FIG. 3, but the present invention is not necessarily limited thereto, and the embodiment shown in FIG. The same can be applied to the embodiment shown in 5.

In this embodiment, the arrangement of the pins may be implemented as shown in FIG. 12. That is, the 1-1 pins 141 to 1-8 pins 148 of the first pin group 14 are arranged on the edge including the edge of the bottom surface 133 as far as possible. In addition, the 2-1 pins 151 to 2-3 pins 153 of the second pin group 15 are disposed in the remaining area of the edge of the bottom surface 133. At this time, the thick pins 2-3 pins 153, which are thick pins connected to the compensation transformer 1221, and the 2-1 pins 151 and 2-2 pins, which are relatively thin pins, are positioned to face each other, The entire batch can be evenly distributed. According to this structure, the fins may be uniformly disposed around the edge of the bottom surface 133.

The independent active EMI filter module 1 as described above may be manufactured by the following method.

First, as shown in FIG. 13, a substrate 10 including a first surface 101 and a second surface 102 facing each other is prepared, and the first element group 11 and the first element group 11 2 Install the element group 12. As described above, the first device group 11 is a device group provided to detect electromagnetic wave noise, and the second device group 12 is a device group provided to generate a compensation signal for electromagnetic wave noise.

The first device group 11 and the second device group 12 are installed on the first surface 101 and/or the second surface 102 of the substrate 10, and elements constituting each device group In consideration of the volume of the devices, the device is classified into a third device group 103 having a larger volume and a fourth device group 104 having a smaller volume.

According to an embodiment, the third element group 103 is composed of transformer elements and a capacitor unit, a sensing transformer of the first element group 11, a compensation transformer 1221 of the second element group 12, and It may include a compensation capacitor unit 1222. The fourth device group 104 may include an active circuit unit 121.

The classified third element group 103 and the fourth element group 104 are provided on the first side 101 and the second side 102 of the substrate 10, respectively. At this time, the transformers of the third element group 103, that is, the sensing transformer of the first element group 11 and the compensation transformer 1221 of the second element group 12 are on both sides of the first surface 101 By arranging at the edge and arranging the compensation capacitor unit 1222 between the sensing transformer and the compensation transformer 1221, the weight can be balanced.

Next, the substrate 10 on which the devices are mounted is sealed as described above.

According to one embodiment, for the encapsulation, as shown in FIG. 14, a support 131 is prepared.

The support 131 is formed of an insulating material and includes a space part 1310 located therein. The space part 1310 of the support 131 may be defined by an opening 1311 and a bottom 1312.

As can be seen in FIG. 15, the filling liquid 133 is put into the space 1310 through the opening 1311 of the support 131. The filling liquid 133 is preferably in a liquid state, and may include a liquid epoxy resin, and may further include a curing agent. The filling liquid 133 is sufficient if the amount is sufficient to submerge the third element group 103 installed on the substrate 10.

Next, as shown in FIG. 16, the above-described substrate 10 is accommodated in the space 1310 in which the filling liquid 133 is accommodated. At this time, by making the first surface 101 of the substrate 10 face the bottom 1312 of the space 1310, the third element group 103 mounted on the first surface 101 is (133) to be sufficiently immersed.

When the third device group 103 is submerged in the filling liquid 133, the upper portion of the third device group 103 may be spaced apart from the bottom 1312 of the space 1310 by a predetermined distance. And in this state, the second surface 102 of the substrate 10 is not sufficiently immersed in the filling liquid 133.

When the filling liquid 133 is cured in this state, the filling portion 132 of the independent active EMI filter module 1 as shown in FIG. 6 may be completed. In the independent active EMI filter module 1 of this structure, not all elements are sealed by the filling unit 132, but the active circuit unit 121 is exposed, but the third element group 103 is a filling unit ( 132) can be sufficiently protected. In addition, when the substrate 10 is a metal PCB, heat dissipation through the substrate 10 is also possible, and the independent active EMI filter module 1 according to the embodiment may further improve durability.

Next, as shown in FIG. 17, a filling liquid 133 is additionally filled between the opening 1311 of the support 131 and the second surface 102 of the substrate 10. The filling liquid 133 allows the fourth element group 104 to be completely immersed, and then, the filling liquid 133 is cured to form the filling part 132. In this case, the filling portion 132 includes a first filling portion 1321 positioned between the substrate 10 and the bottom 1312 and a second filling portion 1322 covering the fourth element group 104 of the substrate 10. ). In addition, the pins 14 have a structure that protrudes to the outside of the module through the second filling part 1322.

In this way, the present invention can simply implement the independent active EMI filter module 1 provided in a modular form, and by mixing various materials in the filling liquid 133 during the manufacturing process, the independent active EMI filter module 1 is more improved. You can have the function implemented. For example, an additional configuration related to cooling may be implemented by adding insulation, heat transfer, and/or heat dissipation material to the filling liquid 133.

In addition, by the support 131 provided in the form of a hard case, it is possible to provide physical protection for internal elements, and in some cases, a heat dissipation mechanism such as a heat sink can be additionally installed on the support 131. And, accordingly, heat dissipation by the support 131 can be made smoothly.

18 is a cross-sectional view of an EMI filter module according to another embodiment. Referring to FIG. 18, the independent active EMI filter module according to another embodiment may further include a connection part 105 and a connection body 106 in addition to the embodiment shown in FIG. 2.

The connection part 105 is connected to the first side 101 and the second side 102 of the substrate 10, and according to an embodiment, the first side 101 and the second side of the substrate 10 It may include a shape of a hole passing through the two sides 102. The shape of the hole may be a circular or polygonal plane, and may include a structure having a normal structure or a step difference in cross section.

The connection part 105 may be positioned so as not to interfere with at least one of the first device group 11 or the second device group 12, wherein the connection part 105 is formed in the form of a hole in the substrate 10 In the case of having a, the connection part 105 may be provided so as not to interfere with the third device group 103 and the fourth device group 104.

According to an embodiment, the connection part 105 may be located at a plurality of locations that do not interfere with the third device group 103 and the fourth device group 104.

The connector 106 is located on the connection part 105 and may be provided to be connected to the encapsulation structure 13.

The connection body 106 may be provided as a filler capable of filling at least a part of the hole of the connection part 105. The filler may be exposed to at least one of the first surface 101 or the second surface 102 to be connected to the encapsulation structure 13.

According to an embodiment, the connector 106 may be formed of the same material as some of the materials forming the encapsulation structure 13, and may be selectively formed integrally with the encapsulation structure 13.

The encapsulation structure 13 may communicate so as to traverse the substrate 10 through the connection part 105. According to an embodiment, at least a part of the encapsulation structure 13 communicating the connection part 105 may form the connection body 106.

However, the present invention is not necessarily limited thereto, and the connector 105 may be formed of a separate material, and thus may be connected to the sewing structure 13. Optionally, according to an embodiment, the connector 105 may include an adhesive material. Through this, it is bonded to the sealing structure 13 adjacent to the connector 105 to fix the sealing structure 13.

19 shows a structure in which the connection part 105 and the connection body 106 are provided as in the above-described embodiment with respect to the embodiment shown in FIG. 3.

As can be seen in FIG. 19, a plurality of connection parts 105 and a plurality of connectors 106 may be disposed on the substrate 10, and at least some of the connection parts 105 are formed on the substrate 10. It may be formed in a position that does not interfere with the elements and/or active elements. However, the present invention is not necessarily limited thereto, and at least some of the connection part 105 and the connection body 106 may function as a conductive line connecting the first and second surfaces of the substrate 10, and thus the first It may function to electrically connect some elements installed on the surface and the second surface.

It goes without saying that the embodiment of the connection part 105 and the connection body 106 may be equally applied to all the embodiments of the present specification described below. That is, although not shown in the drawings, the structure of the connecting portion 105 and the connecting body 106 having the same shape as in FIG. 19 may be applied to the embodiments shown in FIGS. 4, 5, 9, and 11, respectively.

20 is a view showing a cross-section of the independent active EMI filter module 1 according to another embodiment, and FIG. 21 is an enlarged cross-sectional view of the portion.

Referring to FIG. 20, a filling unit 132 of the independent active EMI filter module 1 according to another embodiment may include a first filling unit 1321 and a second filling unit 1322. The first filling portion 1321 may face the first surface 101 of the substrate 10, and the second filling portion 1322 may face the second surface 102 of the substrate 10. The opening 1311 may be closed by the second filling portion 1322 as described above, and the second filling portion 1322 may constitute the bottom surface 133 of the module. The second filling part 1322 is provided to completely cover the fourth element group 104, and thus the pins 14 may have a structure protruding outward of the module through the second filling part 1322.

The independent active EMI filter module 1 may include a connection part 105 and a connection body 106.

The connection part 105 is connected to the first surface 101 and the second surface 102 of the substrate 10, and according to an embodiment, as shown in FIG. 21, the first surface of the substrate 10 It may include a shape of a hole penetrating the first surface 101 and the second surface 102. The shape of the hole may be a circular or polygonal plane, and may include a structure having a normal structure or a step difference in cross section.

The connector 106 is located within the connection part 105 and may be provided to be connected to the encapsulation structure 13.

Specifically, as shown in FIG. 21, the connector 106 may be provided to connect the first filling portion 1321 and the second filling portion 1322 to each other. Since the first filling portion 1321 and the second filling portion 1322 can be connected to each other by the connector 106, the first filling portion 1321 and the second filling portion 1322 are prevented from being separated. And, it is possible to improve the structural stability and durability of the entire filling part 13. Accordingly, even when the filling portion 13 is deteriorated due to heat dissipation, the first filling portion 1321 and the second filling portion 1322 may be prevented from being separated from each other.

According to an embodiment, the connector 105 may further include a separate material different from the filling part 13, and thus may be connected to the sewing structure 13. Optionally, according to an embodiment, the connector 105 may include an adhesive material. Through this, it is bonded to the first filling portion 1321 and the second filling portion 1322 adjacent to the connector 105 to firmly fix the filling portion 132.

22 is an independent active EMI filter module 1 according to another embodiment, and unlike the embodiment shown in FIG. 20, the filling part 132 is at least filled between the substrate 10 and the bottom 1312. The substrate 10 may be fixedly bonded to the inner wall of the support 131 by the filling part 132. In the independent active EMI filter module 1 having the above structure, the second surface 102 of the substrate 10 from which the pins 14 protrude may constitute the bottom surface 133 of the module.

According to an embodiment, the second connector 107 in the form of a pin may be coupled to the connector 105. One end of the second connector 107 may be inserted into the filling part 132 and the other end may be exposed to the outside. The second connector 107 may be formed of a conductive material, and thus may be used as a path for discharging heat inside the filling part 132. Optionally, the second connector 107 is connected to a ground line to improve electrical stability of the independent active EMI filter module 1. Although not shown in the drawings, the second connector 107 may also be applied to the embodiment shown in FIG. 6.

23A and 23B are at least one of the connecting portion 105 and/or the connecting body 106 applied to FIGS. 8A and 8B, respectively. 23A to 23B, at least one of the connection part 105 and/or the connection body 106 is disposed so as not to interfere with passive elements and/or active elements formed on the substrate 10, and various It can be installed in a location where the wires are not formed. Specifically, the connection part 105 and/or the connection body 106 may be installed at a plurality of locations along an approximately central portion of the substrate 10 and an edge of the substrate 10.

Similarly, in the embodiment illustrated in FIG. 9, the arrangement of the pins may be implemented as illustrated in FIG. 24. That is, in addition to the embodiment shown in FIG. 10, at least one of the connecting portion 105 and/or the connecting body 106 is disposed so as not to interfere with passive elements and/or active elements formed on the substrate 10 , It can be installed in a location where various wires are not formed. Specifically, the connection part 105 and/or the connection body 106 may be installed at a plurality of locations along an approximately central portion of the substrate 10 and an edge of the substrate 10.

The embodiment shown in FIG. 25 shows the pin arrangement of the embodiment shown in FIG. 11, and in addition to the embodiment shown in FIG. 12, the connection part 105 and/or the connector 106 It may be installed at a plurality of locations approximately at the center and along the edge of the substrate 10.

First, as shown in FIG. 26, a substrate 10 including a first surface 101 and a second surface 102 facing each other is prepared, and the first element group 11 and the first element group 11 2 Install the element group 12. As described above, the first device group 11 is a device group provided to detect electromagnetic wave noise, and the second device group 12 is a device group provided to generate a compensation signal for electromagnetic wave noise. Hereinafter, descriptions overlapping with the embodiments illustrated in FIGS. 13 to 17 will be omitted.

At least one connection part 105 may be formed on the substrate 10. The connection part 105 may be formed in a shape of a hole penetrating the substrate 10, and is disposed so as not to interfere with passive elements and/or active elements formed on the substrate 10, and various wires are not formed. Can be installed on site. Specifically, the connection part 105 may be installed at a plurality of locations along an approximately central portion of the substrate 10 and/or an edge of the substrate 10.

Although not shown in the drawings, according to another embodiment, at least one of the connection parts 105 may have a connection body 106 formed in advance. The connector 106 may include a heat dissipation material, a heat transfer material, and/or an adhesive material, and may be selected according to a required function.

According to an embodiment, for the sealing, a support 131 as seen in FIG. 14 is prepared, and as shown in FIG. 15, the space part 1310 through the opening 1311 of the support 131 Put the filling liquid 133 in.

Next, as shown in FIG. 27, the above-described substrate 10 is accommodated in the space 1310 in which the filling liquid 133 is accommodated. At this time, by making the first surface 101 of the substrate 10 face the bottom 1312 of the space 1310, the third element group 103 mounted on the first surface 101 is (133) to be sufficiently immersed.

When the third device group 103 is submerged in the filling liquid 133, the upper portion of the third device group 103 may be spaced apart from the bottom 1312 of the space 1310 by a predetermined distance.

At this time, since the connection portion 105 is formed in at least one region of the substrate 10, the filling liquid 133 through the connection portion 105 is transferred from the first surface 101 to the second surface of the substrate 10. Can pass in the direction of (102). Accordingly, the filling liquid 133 penetrating the connection part 105 may completely immerse the fourth element group 104 installed on the second surface 102 of the substrate 10 in the filling liquid 133. Thereafter, the filling part 132 is formed by curing the filling liquid 133. According to an embodiment, the filling liquid 133 passing through the connection part 105 may form the connection body 106.

The filling portion 132 includes a first filling portion 1321 positioned between the substrate 10 and the bottom 1312 and a second filling portion 1322 covering the fourth element group 104 of the substrate 10 Is done. In addition, the pins 14 have a structure that protrudes to the outside of the module through the second filling part 1322.

In this structure, the first filling portion 1321 and the second filling portion 1322 may be connected to each other by the connecting body 106 positioned at the connecting portion 105, and thus the coupling structure of the filling portion 132 is It can be more solid.

FIG. 28 illustrates a manufacturing method according to another exemplary embodiment. In FIG. 15, the substrate 10 is immersed in the filling liquid 133 filled in the space 1310 of the support 131.

The substrate 10 is in a state in which the connection portions 105 are formed at a plurality of locations, and the second connector 107 may be coupled to at least some of them. The filling liquid 133 is sufficient if the amount is sufficient to submerge the third element group 103 installed on the substrate 10.

At this time, when the substrate 10 is immersed, the second surface 102 of the substrate 10 is not sufficiently immersed in the filling liquid 133. When the filling liquid 133 is cured in this state, the filling portion 132 of the independent active EMI filter module 1 as shown in FIG. 22 may be completed. In the independent active EMI filter module 1 of this structure, not all elements are sealed by the filling unit 132, but the active circuit unit 121 is exposed, but the third element group 103 is a filling unit ( 132) can be sufficiently protected. In addition, when the substrate 10 is a metal PCB, heat dissipation through the substrate 10 is also possible, and the independent active EMI filter module 1 according to the embodiment may further improve durability.

Although not shown in the drawings, the second connector 107 may not be coupled to a part of the connection portion 105 in the above structure, and thus the filling liquid is not coupled to the second connector 107 of the connection portion 105. The fourth device group 104 may be encapsulated by penetrating the substrate 10 therethrough.

29 shows an encapsulation structure 13 of the independent active EMI filter module 1 according to another embodiment.

According to the exemplary embodiment illustrated in FIG. 29, the independent active EMI filter module 1 may include a filling part 132 provided to fill at least a part of the space 1310. The filling part 132 may be filled at least between the substrate 10 and the bottom 1312, and the substrate 10 may be fixedly bonded to the inner wall of the support 131 by the filling part 132.

The independent active EMI filter module 1 may include at least one bonding portion 134 connected to at least a support 131. According to the embodiment shown in FIG. 31, the bonding portion 134 is a substrate 10 ) May be bonded to the second side 102 and the inner side of the support 131. The second distance t2 of the second surface 102 of the substrate 10 spaced apart from the opening 1311 may be a distance sufficient for the bonding portion 134 to be installed. The second distance t2 may be defined as a margin through which the junction 134 can be installed. By the bonding portion 134, the substrate 10 may be more firmly bonded to the support 131, and the bonding portion 134 may prevent the substrate 10 from being separated from the support 131. The bonding portion 134 may be provided so that other portions not in contact with the substrate 10 and the support 131 have an inclined surface, thereby minimizing the space in which the bonding portion 134 exists, and the bonding portion 134 It is possible to minimize interference with other members.

The bonding part 134 may be formed of the same material as the filling part 132. However, the present invention is not necessarily limited thereto, and the bonding portion 134 may include a material different from the filling portion 132.

According to an embodiment, the substrate 10 may have a gap spaced apart from the support 131 at at least a part of the edge, and by this gap, a part of the filling part 132 may be formed of the substrate 10. It may protrude in the direction of the two sides 102. A portion of the protruding filling part 132 may spread outwardly to form the junction part 134. In this case, the bonding part 134 may be connected to the filling part 132 as well, and thus the substrate 10 may be more firmly fixed.

FIG. 30 is an independent active EMI filter module 1 according to another embodiment, and unlike the embodiment shown in FIG. 31, a filling unit 132 includes a first filling unit 1321 and a second filling unit 1322 It may include. The first filling portion 1321 may face the first surface 101 of the substrate 10, and the second filling portion 1322 may face the second surface 102 of the substrate 10. The second filling portion 1322 is provided to completely cover the fourth element group 104, and thus the pins 14 may have a structure protruding outward of the module through the second filling portion 1322. . According to the exemplary embodiment illustrated in FIG. 32, the independent active EMI filter module 1 may include at least one junction 134 connected to the support 131. The bonding portion 134 may be bonded to the inner side of the second filling portion 1322 and the support 131.

The second distance t2 of the second surface 102 of the substrate 10 separated from the opening 1311 is the bottom surface of the second filling part 1322 from the second surface 102 of the substrate 10 It may be greater than the third distance t3 to (133). Accordingly, the second distance t2 may be a distance sufficient to secure the third distance t3 and to install the junction part 134. The second distance t2 may be defined as a margin through which the second filling part 1322 and the junction part 134 can be installed. Accordingly, it is possible to prevent the second filling part 1322 from protruding beyond the opening 1311.

The end of the junction 134 may be provided to contact the opening 1311 as shown in FIG. 30, but is not limited thereto, and is spaced apart from the opening 1311 in the direction of the substrate 10 Can be located. When the end of the junction 134 is positioned to be spaced apart from the opening 1311, the size of the junction 134 can be sufficiently formed, and when the junction 134 is integrally formed with the second filling part 1322 2 It is possible to sufficiently prevent the filling part 1322 from protruding beyond the opening 1311.

The substrate 10 may be more firmly bonded to the support 131 by the bonding portion 134 as described above, and the bonding portion 134 may prevent the substrate 10 from being separated from the support 131. . The bonding portion 134 may be provided so that the second filling portion 1322 and other portions not in contact with the support 131 have an inclined surface, thereby minimizing the space in which the bonding portion 134 exists, and the bonding portion ( 134) can minimize interference with other members.

The junction part 134 may be formed of at least the same material as the second filling part 1322. According to an embodiment, the bonding portion 134 may include a protruding portion extending from the second filling portion 1322 to the inner wall of the support 131 due to surface tension. The bonding portion 134 may be integrally formed with the bottom surface 133 without interference with a member forming the bottom surface 133.

31 is a view showing the bottom of the independent active EMI filter module 1 according to an embodiment. As can be seen in FIG. 31, the junction 134 is positioned opposite to the edge of the support 131, and the support ( 131) can be joined to each corner.

According to this structure, it is possible to secure a fixing force of the substrate 10 to the support 131 in a state in which positional interference with members exposed to the bottom surface 133 is minimized.

FIG. 32 shows the bottom of the independent active EMI filter module 1 according to another embodiment. The embodiment of the junction 134 shown in FIG. 34 is formed to form a closed loop, and the support 131 It is located opposite to the edge and each side, and can be bonded to the entire inner surface of the support 131.

According to this structure, the fixing force of the bonding portion 134 to the support 131 of the substrate 10 can be further increased. It goes without saying that the embodiments shown in FIGS. 31 and 32 may be equally applied to other embodiments of the present specification.

33 is a cross-sectional view illustrating an independent active EMI filter module 1 according to another embodiment. The independent active EMI filter module 1 according to the embodiment shown in FIG. 33 may further include a connector 105 and a connector 106 in addition to the embodiment shown in FIG. 30. Descriptions of parts that overlap with the embodiment shown in FIG. 30 will be omitted.

The connection part 105 is connected to the first side 101 and the second side 102 of the substrate 10, and connects the first side 101 and the second side 102 of the substrate 10 to each other. It may include a shape of a hole passing through. The shape of the hole may be a circular or polygonal plane, and may include a structure having a normal structure or a step difference in cross section.

FIG. 34 is an independent active EMI filter module 1 according to another embodiment, and the independent active EMI filter module 1 according to the embodiment shown in FIG. 34 is a connection part 105 in addition to the embodiment shown in FIG. 31. ) And a second connector 107 may be further included. Descriptions of parts that overlap with the embodiment shown in FIG. 29 will be omitted. In this embodiment, the junction part 134 may be formed so that there is no positional interference with the second connector 107.

According to an embodiment, for the encapsulation, as shown in FIG. 14, a support 131 is prepared, and as shown in FIG. 15, the space portion 1310 through the opening 1311 of the support 131 Put the filling solution 130 in ).

Next, the above-described substrate 10 is accommodated in the space portion 1310 in which the filling liquid 130 is accommodated. At this time, by making the first surface 101 of the substrate 10 face the bottom 1312 of the space 1310, the third element group 103 mounted on the first surface 101 is Make sure to be sufficiently immersed in (130).

When the filling liquid 130 is cured, the filling portion 132 of the independent active EMI filter module 1 as shown in FIG. 29 may be completed. According to an embodiment, the junction part 134 may be formed. The bonding portion 134 may be formed by applying the same material as the filling solution 130 between the second surface 102 of the substrate 10 and the inner wall of the support 131 and curing the same. According to an embodiment, the substrate 10 may have a gap spaced apart from the support 131 at at least a part of the edge, and by this gap, a part of the filling liquid 130 is It may protrude in the direction of the two sides 102. A portion of the protruding filling portion 132 may spread outside the gap, and the bonding portion 134 may be formed by curing the filling liquid 130. The curing of the bonding portion 134 is not necessarily performed simultaneously with the formation of the filling portion 132, but may be performed after the filling portion 132 is formed. In addition, the bonding portion 134 is not limited to being formed of the same material as the filling portion 132, and is formed between the second surface 102 of the substrate 10 and the inner wall of the support 131 as a separate material. Can be.

According to another embodiment, the filling liquid 130 may be additionally filled between the opening 1311 of the support 131 and the second surface 102 of the substrate 10 and then cured. The filling liquid 130 allows the fourth element group 104 to be completely immersed, and then, the filling portion 132 is formed by curing the filling liquid 130. Accordingly, as shown in FIG. 30, the filling portion 132 covers the first filling portion 1321 positioned between the substrate 10 and the bottom 1312 and the fourth element group 104 of the substrate 10. A second filling part 1322 is included. In addition, the pins 14 have a structure that protrudes to the outside of the module through the second filling part 1322. In addition, the bonding portion 134 may be bonded to the inner side of the second filling portion 1322 and the support 131.

When the bonding portion 134 is formed of the same material as the filling portion 132, the bonding portion 134 may be cured simultaneously when the second filling portion 1322 is cured.

In the case of the structure having the connection portion 105 as shown in FIG. 33, when the substrate 10 is immersed in the filling liquid 130, the connection portion 105 is formed in at least one area of the substrate 10, so that the connection portion ( The filling solution 130 may pass through 105 in the direction of the second surface 102 from the first surface 101 of the substrate 10. Accordingly, the filling liquid 130 passing through the connection part 105 may cause the fourth element group 104 installed on the second surface 102 of the substrate 10 to be completely immersed in the filling liquid 130. Thereafter, the filling liquid 130 is cured to form the filling portion 132 as shown in FIG. 33. According to an embodiment, the filling liquid 133 passing through the connection part 105 may form the connection body 106. In addition, the bonding portion 134 may be formed by the filling solution 130, and the bonding portion 134 may be cured when the filling solution 130 is cured.

This manufacturing method can be equally applied to a structure in which the second connector 107 is coupled to a part of the connector 105 as shown in FIG. 34.

35 is a configuration diagram of a separate EMI filter module according to another embodiment.

The detachable active EMI filter module 1000 according to an exemplary embodiment may be interposed between the first through line 21 and the second through line 22. The first through line 21 and the second through line 22 may be electrically connected to a power line, and the first through line 21 is a live line and the second through line 22 is a neutral line. (Neutral line) and each can be electrically connected.

According to an embodiment, each of the first through line 21 and the second through line 22 may be a conductive pattern formed to electrically pass through the PCB substrate of the separated active EMI filter module 1000 from one end to the other end. have. The conductive pattern is not necessarily limited to extending in a straight line, and may be extended in a complex path.

According to an embodiment, the detachable active EMI filter module 1000 may be electrically connected to the first device 2 and the second device 3 located outside.

The first device 2 may be various types of devices for supplying power to the separate active EMI filter module 1000 in the form of current and/or voltage. For example, the first device 2 may be a device that produces and supplies power, or may be a device that supplies power generated by another device (for example, an electric vehicle charging device). Of course, the first device 2 may be a device that supplies stored energy. However, this is exemplary, and the spirit of the present invention is not limited thereto.

lines

21 and 22 in a common mode.

The separate active EMI filter module 1000 according to an exemplary embodiment may include a noise sensing unit 11, an active circuit unit 12, a compensation unit 13, and a transmission unit 14.

The noise sensing unit 11 may include at least one element electrically connected to the first through line 21 and the second through line 22. According to an embodiment, the noise sensing unit 11 may include an element provided to detect electromagnetic noise generated from the second device 3.

The active circuit unit 12 may serve as an amplifier and may amplify a current corresponding to electromagnetic wave noise sensed through the noise sensing unit 11 at a predetermined ratio. According to an exemplary embodiment, the active circuit unit 121 may generate an amplified current having the same magnitude as a current corresponding to electromagnetic wave noise and opposite in phase.

The amplified current may flow through the compensation unit 13 and the transfer unit 14 to the first through line 21 and/or the second through line 22 to compensate for noise.

The compensation unit 13 may generate a compensation signal based on the amplified current.

The transmission unit 14 may provide a path through which the compensation signal flows through the first through line 21 and/or the second through line 22.

Meanwhile, at least a part of the detachable active EMI filter module 1000 may be electrically connected to the third device 4.

According to an embodiment, this third device 4 may include a device that provides power to the active circuit unit 12. For example, the third device 4 may include a DC power supply unit that generates input power from the active circuit unit 12.

36 shows a more specific example of a separate active EMI filter module 1000 according to another embodiment.

According to an embodiment, the first through line 21 and the second through line 22 may be designed to pass through the separate active EMI filter module 1000.

Both ends of the first through line 21 are connected to the 1-1 pin 241 and the 1-2 pin 242. In addition, both ends of the second through line 22 are connected to the 1-3th pin 243 and the 1-4th pin 244.

As described above, the separate active EMI filter module 1000 according to an exemplary embodiment may include a noise sensing unit 11, an active circuit unit 12, a compensation unit 13, and a transmission unit 14.

According to an embodiment, the noise sensing unit 11 may include a sensing transformer 110.

The sensing transformer 110 includes a first reference winding 1101 and a second reference winding 1102 electrically connected to the first through line 21 and the second through line 22, respectively, and the first and second power lines. A sensing winding 1100 formed on the same core as the

reference windings

1101 and 1102 may be included.

The first reference winding 1101 and the second reference winding 1102 may be a primary winding connected to a power line, and the sensing winding 1100 may be a secondary winding.

The first reference winding 1101 and the second reference winding 1102 may each be in the form of a winding wound around a core, but is not necessarily limited thereto, and the first reference winding 1101 or the second reference winding At least one of 1102 may have a structure passing through the core.

The sensing winding 1100 may have a structure in which the first reference winding 1101 and the second reference winding 1102 are wound and/or wound around a core at least once or more. However, the present invention is not necessarily limited thereto, and the sensing winding 1100 may be formed to penetrate the core.

The sensing winding 1100 is electrically insulated from the primary winding, a noise current generated from the second device 3 is sensed, and a current converted from the noise current at a predetermined ratio may be induced.

For example, as a first current, which is noise, is input to the first reference winding 1101, a first magnetic flux density may be induced in the core. Similarly, as the first current, which is noise, is input to the second reference winding 1102, a second magnetic flux density may be induced in the core.

A first induced current may be induced in the sensing winding 1100 that is the second secondary side by the induced first and second magnetic flux densities.

At this time, the sensing transformer is configured so that the first magnetic flux density and the second magnetic flux density induced by the first current may overlap (or reinforce each other), and the first through line 21 and the second through line A first induced current corresponding to the first current may be generated in the second secondary side insulated from 22, that is, the sensing winding 1100.

Meanwhile, the number of the first reference winding 1101, the second reference winding 1102, and the sensing winding 1100 wound around the core may be appropriately determined according to the requirements of the system in which the separate active EMI filter module 1000 is used. have.

For example, a turns ratio of a primary winding, which is the first reference winding 1101 and the second reference winding 1102, and a secondary winding of the sensing winding 1100, may be 1:N _sen . In addition, if the self-inductance of the primary winding of the sensing transformer is L _sen , the secondary winding can have a self inductance of N _sen ^2· L _sen . The primary and secondary windings of the sensing transformer 120 may be combined with a coupling coefficient of k _sen .

Meanwhile, the above-described sensing transformer 110 may be configured such that the magnetic flux density induced by the second current, which is a normal current flowing through each of the first through line 21 and the second through line 22, satisfies a predetermined magnetic flux density condition. I can.

second reference windings

1101 and 1102, respectively. In this case, the third magnetic flux density and the fourth magnetic flux density may be conditions that cancel each other.

In other words, the sensing transformer 110 is a second induced current induced in the secondary sensing winding 1100 by the second current, which is a normal current flowing through each of the first through line 21 and the second through line 22. May be less than a predetermined threshold size, and accordingly, the sensing transformer may be configured such that magnetic flux densities induced by the second current cancel each other, so that only the aforementioned first current may be sensed.

The sensing transformer 110 has the magnitude of the first and second magnetic flux density induced by the first current, which is a noise current in a first frequency band (for example, a band having a range of 150 KHz to 30 MHz), in a second frequency band (for example, For example, a band having a range of 50Hz to 60Hz) may be configured to be larger than the magnitude of the third and fourth magnetic flux densities induced by the second current, which is a typical current.

The sensing winding 1100, which is the secondary side of the sensing transformer 110, supplies the first induced current to the active circuit unit 12. As shown in FIG. 36, the input terminal of the active circuit unit 12 and the active circuit unit 12 ) Can be placed on the path connecting the reference potential.

According to an embodiment, the active circuit unit 12 may be a means for generating an amplified current by amplifying the first induced current generated by the sensing transformer.

According to an embodiment, the sensing winding 1100 may be differentially connected to the input terminal of the active circuit unit 12.

In the present invention, amplification by the active circuit unit 12 may mean adjusting the size and/or phase of the amplification target. For example, the active circuit unit 12 may generate an amplified current by changing the phase of the first induced current by 180 degrees and increasing the magnitude by k times (k>=1).

The active circuit unit 12 may be designed to generate an amplified current in consideration of the transformation ratio of the sensing transformer 110 described above and the transformation ratio of the compensation transformer 131 to be described later. For example, the sensing transformer 110 converts a first current, which is a noise current, into a first induced current whose magnitude is 1/F1 times, and the compensation transformer 131 compensates for the amplified current, so that the magnitude becomes 1/F2 times. In the case of converting to current, the active circuit unit 12 may generate an amplified current that is F1xF2 times the magnitude of the first induced current.

In this case, the active circuit unit 12 may generate the amplified current so that the phase of the amplified current is opposite to the phase of the first induced current.

The active circuit unit 12 may be implemented by various means. According to an embodiment, the active circuit unit 12 may include an OP AMP 121. According to another embodiment, the active circuit unit 12 may include a plurality of passive devices such as a resistor and a capacitor in addition to the OP AMP. According to another embodiment, the active circuit unit 12 may include a bipolar junction transistor (BJT) and/or a plurality of passive devices such as a resistor and a capacitor. However, it is not necessarily limited thereto, and the means for amplification described in the present invention may be used without limitation as the active circuit unit 12 of the present invention.

The active circuit unit 12 amplifies the first induced current by amplifying the first induced current by receiving power from a separate third device 4 (refer to FIG. 35) that is separated from the first device 2 and/or the second device 3 Can be created. In this case, the third device 4 may be a device that receives power from a power source independent of the first device 2 and the second device 3 and generates input power to the active circuit unit 12. In addition, the third device 4 may be a device that receives power from any one of the first device 2 and the second device 3 and generates input power to the active circuit unit 12.

The compensation unit 13 may generate a compensation signal based on the amplified output signal.

According to an embodiment, the compensation unit 13 may include a compensation transformer 131. In this case, the compensation transformer 131 is insulated from the first through line 21 and the second through line 22 and/or is isolated from the first through line 21 and the second through line based on the amplified current. It may be a means for generating a compensation current on the side of the through line 22 or on the second side 1312.

More specifically, the compensation transformer 131 is applied to the third magnetic flux density induced by the amplified current generated by the active circuit unit 12 on the primary side 1311 differentially connected to the output terminal of the active circuit unit 12. Based on the compensation current may be generated in the secondary side 1312. In this case, the secondary side 1312 may be grounded with a reference potential (reference potential 1) of the transmission unit 14 and the separate active EMI filter module 1000 to be described later.

The secondary side 1312 of the compensation transformer 131 is electrically connected to the first through line 21 and the second through line 22 as power lines with the transmission unit 14 interposed therebetween. Accordingly, the active circuit unit 12 may be insulated from the power line, thereby protecting the active circuit unit 12.

Meanwhile, according to another embodiment, the primary side 1311 of the compensation transformer 131, the active circuit unit 12, and the sensing winding 1100 are separated from the remaining components of the separate active EMI filter module 1000. It can be grounded with the reference potential (reference potential 2). That is, the reference potential (reference potential 2) of the above-described active circuit unit 12 and the reference potential (reference potential 1) of the separate active EMI filter module 1000 may be different potentials. However, it is not necessarily limited thereto, and the reference potential 1 and the reference potential 2 may be the same potential.

As described above, according to an embodiment of the present invention, a component that generates a compensation current is operated in an insulated state by using a reference potential that is different from the other components, and by using a separate power source. In this way, reliability of the separate active EMI filter module 1000 may be improved.

As described above, the compensation transformer 131 is amplified by the active circuit unit 12 and converts the current flowing through the primary side 1311 of the compensation transformer 131 to a predetermined ratio to the second compensation transformer 131. It can be guided to the vehicle side 1312.

For example, in the compensation transformer 131, a turn ratio of the first and second

secondary sides

1311 and 1312 may be 1:N _inj . In addition, if the self-inductance of the primary side 1311 of the compensation transformer 131 is L _inj , the secondary side 1312 of the compensation transformer 131 may have a self inductance of N _inj ² ·L _inj . The primary side and the secondary side of the compensation transformer 131 may be combined by a coupling coefficient of k _inj . The current converted through the compensation transformer 131 may be injected as a compensation current I _comp into the first through line 21 and the second through line 22 which are power lines through the compensation capacitor unit 141.

The transmission unit 14 may be a means for providing a path through which the current generated by the compensation transformer 131 flows to each of the first through line 21 and the second through line 22, according to an embodiment. , The transfer part 14 may include a compensation capacitor part 141.

The compensation capacitor unit 141 includes at least two compensation capacitors connecting each of the reference potential (reference potential 1) and the first through line 21 and the second through line 22 of the separate active EMI filter module 1000 can do. Each of the compensation capacitors may include a Y-capacitor (Y-cap). One end of each compensation capacitor shares a node connected to the secondary side 1312 of the compensation transformer 131, and the other end has a node connected to the first through line 21 and the second through line 22, respectively. I can.

The compensation capacitor unit 141 may be configured such that a current flowing between the first through line 21 and the second through line 22 through at least two or more compensation capacitors satisfies a first predetermined current condition. In this case, the first predetermined current condition may be a condition in which the magnitude of the current is less than the predetermined first threshold magnitude.

In addition, the compensation capacitor unit 141 is between each of the first through line 21 and the second through line 22 and the reference potential (reference potential 1) of the separate active EMI filter module 1000 through at least two compensation capacitors. The flowing current may be configured to satisfy a second predetermined condition. In this case, the second predetermined condition may be a condition in which the magnitude of the current is less than the predetermined second threshold magnitude.

The compensation current flowing to each of the first through line 21 and the second through line 22 along the compensation capacitor part 141 cancels the first current on the first through line 21 and the second through line 22 Thus, it is possible to prevent the first current from being transmitted to the second device 2 described above. In this case, the first current and the compensation current may be currents having the same magnitude and opposite phases.

Accordingly, the separated active EMI filter module 1000 according to an embodiment of the present invention is provided in each of the first through line 21 and the second through line 22, which are at least two or more high current paths connected to the first device 2. A first current, which is a noise current input in the common mode, is actively compensated to suppress a noise current emitted to the first device 2. This can prevent malfunction or damage of the second device 3 and/or other devices connected to the first device 2.

The separated active EMI filter module 1000 having the above structure may be implemented on a substrate, and includes a first element group G1 including a noise sensing unit 11 provided to detect electromagnetic noise, and electromagnetic noise. The second device group G2 including the compensation unit 13 provided to generate a compensation signal for is mounted on different substrates, respectively.

37 and 38 are diagrams illustrating a separate active EMI filter module 1000 according to an embodiment implemented on a substrate, and FIG. 37 is a plan configuration diagram illustrating a first substrate 1001, and FIG. 38 is a first substrate (A side view of the second substrate 1002 to 1001 is shown.

37 and 38, a first device group G1 is mounted on a first substrate 1001. A first through line 21 and a second through line 22 may be designed to pass through the first substrate 1001. The first through line 21 and the second through line 22 may be implemented as a thin wiring pattern patterned between the 1-1 pins 241 to 1-4 pins 244.

The noise sensing unit 11 of the first device group G1 is installed on the first substrate 1001. Specifically, the first reference winding 1101 and the second reference winding 1102 of the noise sensing unit 11 are electrically connected to the first through line 21 and the second through line 22, respectively. In addition, the sensing winding 1100 may be connected to the wiring thin film patterned on the first substrate 1001 and electrically connected to the first electrical connection part 151 to be described later.

A second device group G2 may be mounted on the second substrate 1002, which is an independent substrate separated from the first substrate 1001.

The second device group G2 may include an active circuit unit 12, a compensation unit 13, and a transmission unit 14 electrically connected to each other.

According to an embodiment, as shown in FIG. 38, the second substrate 1002 may be separated from the first substrate 1001 and coupled to the first substrate 1001 in a vertical state. In addition, the first device group G1 and the second device group G2 may be electrically connected.

In order to electrically connect the first device group G1 and the second device group G2, an electrical connection 15 is interposed between the first substrate 1001 and the second substrate 1002.

A first electrical connection unit 151 may be installed on the first substrate 1001. According to an embodiment, the first electrical connection part 151 may be a bar-shaped block structure provided in a straight line, and may include a plurality of electrical connection terminals arranged in-line along a straight line. .

Electrical connection terminals provided in the first electrical connection unit 151 may include a first connection terminal 1511, a second connection terminal 1512, a third connection terminal 1513, and a fourth connection terminal 1514. .

The first connection terminal 1511 may include a pair of connection terminals positioned at one end of the first electrical connection unit 151 and arranged in-line, and may be electrically connected to the external power supply 41. . The external power supply 41 may be a DC power supply that provides power to the active circuit unit 12 as shown in FIG. 2.

The second connection terminal 1512 may include a pair of connection terminals positioned in-line adjacent to the first connection terminal 1511 and arranged in-line. The second connection terminal 1512 may be electrically connected to the sensing winding 1100 of the sensing transformer 110 constituting the noise sensing unit 11.

The third connection terminal 1513 may include a connection terminal positioned at the other end of the first electrical connection part 151 and adjacent in-line to the fourth connection terminal 1514 to be described later. The third connection terminal 1513 is electrically connected to a ground line.

The fourth connection terminal 1514 may include a pair of connection terminals positioned adjacent in-line between the second connection terminal 1512 and the third connection terminal 1513 and arranged in-line. The fourth connection terminal 1514 is electrically connected to the first through line 21 and the second through line 22, and the number of connection terminals corresponds to the number of through lines.

On the other hand, since the fourth connection terminal 1514 is electrically connected to the first through line 21 and the second through line 22 serving as power lines, the fourth connection terminal 1514 and between the fourth connection terminals 1514 ( A first distance d1 should be maintained between the 1514) and other adjacent connection terminals (eg, the second connection terminal 1512 and the third connection terminal 1513). The first distance d1 becomes an insulation distance required for safety, and the distance between the first connection terminals 1511, the distance between the second connection terminals 1512, and/or the first connection terminal 1511 and the second connection It is preferable to make it larger than the distance between the terminals 1512. Therefore, the vertical length of the first electrical connection part 151 is set in consideration of the first distance d1.

This first gap d1 may also be applied between the first through line 21 and the second through line 22 patterned on the first substrate 1001.

The connection terminals as described above may be formed in a hole shape in the block structure constituting the first electrical connection part 151.

As can be seen in FIG. 38, the second substrate 1002 is coupled to the first substrate 1001 adjacent to the first electrical connection 151, and the second electrical connection 152 is provided on the second substrate 1002. It is formed by extending. The second electrical connection part 152 may include a plurality of connection pins, and the connection pins may be inserted into the connection terminals of the first electrical connection part 151. Accordingly, the first electrical connection part 151 It may be electrically connected to each of the connection terminals. According to an embodiment, the connection pins constituting the second electrical connection part 152 extend in a vertical direction from the surface of the second substrate 1002 and are bent horizontally to the surface of the second substrate 1002. Can have

According to a specific embodiment, the second electrical connection unit 152 may include two pairs of connection pins electrically connected to the active circuit unit 12. One pair may be inserted into the first connection terminals 1511, and the other pair may be inserted into the second connection terminals 1512.

The second electrical connection unit 152 may include a pair of connection pins electrically connected to the transmission unit 14. This pair of connection pins may be inserted into the fourth connection terminals 1514.

The second electrical connection part 152 may include a connection pin electrically connected to the compensation part 13. This connection pin can be inserted into the third connection terminal 1513.

As such, the second electrical connection part 152 includes a plurality of connection pins arranged inline to correspond to the number and arrangement of connection terminals of the first electrical connection part 151, and the connection pins are the first electrical connection part 151 By being inserted into each of the connection terminals of the first electrical connection portion 151 is electrically connected.

Meanwhile, in FIG. 38, the first electrical connection part 151 is illustrated as a block structure including a plurality of connection terminals, but the present invention is not limited thereto. Optionally, according to another embodiment, the first electrical connection part 151 may include a via hole formed in the first substrate 1101, and the connection terminals may be terminals conductively patterned in the via hole. Therefore, in this case, the second electrical connection part 152 may be directly inserted and fixed to the connection terminals formed in the via hole to form electrical coupling.

In this way, the first device group (G1) and the second device group (G2) are installed on separate and separated substrates and are coupled through a simple electrical connection unit 15 to install a separate active EMI filter module 1000. The total area of the substrate and/or the volume of the separated active EMI filter module 1000 can be significantly reduced. In addition, the first substrate 1001 and the second substrate 1002 can be easily connected and/or separated, and assembly and maintenance can be made simpler because the component elements are distributed and installed on separate substrates. have.

39 and 40 illustrate a separate active EMI filter module 1000 according to another embodiment implemented on a substrate, and FIG. 5 is a plan view showing a first substrate 1001, and FIG. 6 is 1 shows a side view of a second substrate 1002 bonded to a substrate 1001.

39 and 40, a first device group G1 is mounted on a first substrate 1001, and a second device group G2 is mounted on a second substrate 1002.

A first through line 21 and a second through line 22 may be designed to pass through the first substrate 1001. The first through line 21 and the second through line 22 may be implemented as a thin wiring pattern patterned between the 1-1 pins 241 to 1-4 pins 244.

39 and 40, the first device group G1 may include a noise sensing unit 11 and a transmission unit 14. The noise sensing unit 11 and the transmission unit 14 are connected to the first substrate 1001 to be electrically connected to the first and second through

lines

21 and 22 implemented on the first substrate 1001, respectively. Can be combined.

The second device group G2 may include an active circuit unit 12 and a compensation unit 13 electrically connected to each other.

According to an embodiment, as shown in FIG. 40, the second substrate 1002 may be separated from the first substrate 1001 and coupled to the first substrate 1001 in a vertical state. In addition, the first device group G1 and the second device group G2 may be electrically connected.

For the electrical connection between the first device group G1 and the second device group G2, an electrical connection 15 may be interposed between the first substrate 1001 and the second substrate 1002, as described above. As in one embodiment, the first electrical connection part 151 may be a bar-shaped block structure provided in a straight line, and may include a plurality of electrical connection terminals arranged in-line along a straight line.

Electrical connection terminals provided in the first electrical connection unit 151 may include a first connection terminal 1511, a second connection terminal 1512, a third connection terminal 1513 and a fifth connection terminal 1515. . In the case of the present embodiment, unlike the above-described embodiment, the fourth connection terminal electrically connected to the first through line 21 and the second through line 22 is not included. Since the first connection terminals 1511 to 1513 are the same as those in the above-described embodiment, the fifth connection terminal 1515 will be described below.

The fifth connection terminal 1515 may include a connection terminal positioned adjacent in-line between the second connection terminal 1512 and the third connection terminal 1513 and arranged in-line. The fifth connection terminal 1515 may be electrically connected to the transfer unit 14 installed on the first substrate 1001.

Optionally, a second distance d2 may be maintained between the fifth connection terminal 1515 and other adjacent connection terminals (eg, the second connection terminal 1512 and/or the third connection terminal 1513 ). The second distance d2 may be an insulation distance required for safety. The distance between the first connection terminals 1511, the distance between the second connection terminals 1512, and/or the first connection terminal 1511 The interval between the second connection terminals 1512 may be larger. Accordingly, it is possible to sufficiently secure an insulation distance from the ground line to the second connection terminal 1512, which is a signal line.

According to an embodiment, the second interval d2 may be less than or equal to the first interval d1 described above. The first gap d1 is an insulation distance between the first through line 21 and the second through line 22, which are power lines, and the second gap d2 is the power line through the transmission unit 14 And/or an insulation distance from the ground wire.

Meanwhile, as described above, between the first through line 21 and the second through line 22 patterned on the first substrate 1001 may be spaced equal to the first gap.

A second electrical connection part 152 is formed to extend on the second substrate 1002. The second electrical connection part 152 may include a plurality of connection pins, and the connection pins may be inserted into the connection terminals of the first electrical connection part 151. Accordingly, the first electrical connection part 151 It may be electrically connected to each of the connection terminals.

The second electrical connection part 152 may include a connection pin electrically connected to the compensation part 13. This connection pin may be inserted into the fifth connection terminal 1515.

Meanwhile, as described above, in FIG. 40, the first electrical connection part 151 is illustrated as a block structure including a plurality of connection terminals, but the present invention is not limited thereto. Optionally, according to another embodiment, the first electrical connection part 151 may include a via hole formed in the first substrate 1101, and the connection terminals may be terminals conductively patterned in the via hole. Therefore, in this case, the second electrical connection part 152 may be directly inserted and fixed to the connection terminals formed in the via hole to form electrical coupling.

According to the above embodiment, by installing the transmission unit 14 on the first substrate 1001, the length of the second substrate 1002 can be further reduced, and the first electric connection unit 151 is a power line. Since there is no need to install a connection terminal electrically connected to the through line 21 and the second through line 22, the need for securing an insulation distance due to the power line is reduced, so that the second substrate 1002 can be designed even smaller. . In addition, the arrangement and design of the elements can be freed, which can be more effective in minimizing the overall size.

41 is a plan configuration diagram illustrating a first substrate 1001 of a separate active EMI filter module 1000 according to another exemplary embodiment.

In the embodiment shown in FIG. 41, unlike the embodiment shown in FIG. 39, a sixth connection terminal 1516 may be further disposed between the fifth connection terminal 1515 and the second connection terminal 1512.

The sixth connection terminal 1516 may be a dummy connection terminal, that is, a connection terminal to which no elements are connected. By providing the sixth connection terminal 1516 in this way, the second connection terminal 1512 and/or the first connection terminal 1511 serving as a signal line can be sufficiently separated from the ground line to secure an insulation distance. Accordingly, the sixth connection terminal 1516 does not have to be provided as a pair of connection terminals as illustrated in FIG. 7, and one or more of the sixth connection terminals 1516 may be applied.

In FIG. 41, between the third connection terminal 1513 and the fifth connection terminal 1515, and between the fifth connection terminal 1515 and the sixth connection terminal 1516 have a second distance d2, the sixth A third distance d3 may be formed between the connection terminals 1516 and between the sixth connection terminal 1516 and the second connection terminal 1512. The description of the second interval d2 is the same as the description of the second interval d2 illustrated in FIG. 6 and thus will be omitted. The third interval d3 may be equal to or smaller than the second interval d2. The third distance d3 may be designed in consideration of the number of sixth connection terminals 1516 and the insulating distance to be secured. If the number of the sixth connection terminals 1516 increases, the third distance d3 ) Can also be smaller. Although not shown in the drawings, optionally according to another embodiment, at least a portion of the second interval d2, at least a portion of the third interval d3 is the interval between the first connection terminals 1511, and/or The spacing between the second connection terminals 1512 may be the same. Optionally, the spacing between all the connection terminals may be regularly arranged equal to the spacing between the first connection terminals 1511 and/or the spacing between the second connection terminals 1512. This is because, due to the sixth connection terminal 1516, which is a dummy connection terminal, the second connection terminal 1512 and/or the first connection terminal 1511 serving as a signal line can be sufficiently separated from the ground line to secure an insulation distance. Therefore, it is possible to selectively form the first electrical connection part 151 having the same horizontal length as the embodiment illustrated in FIG. 5.

According to the above-described embodiment, the second substrate 1002 having a minimized size while sufficiently securing an insulation distance between the ground line and the signal line can be implemented.

In the above-described embodiments, the first electrical connection part 151 has a plurality of connection terminals in the form of a hole, and the second electrical connection part 152 is provided in the form of a pin and is inserted into the first electrical connection part 151 to make electrical connection. Accomplished. However, the present invention is not necessarily limited to this form.

FIG. 42 is a side view illustrating a second substrate 1002 coupled to a first substrate 1001 according to another exemplary embodiment.

According to the embodiment illustrated in FIG. 42, the first electrical connection unit 151 may include a slot into which the second substrate 1002 may be fixedly inserted. The above-described connection terminals are installed inside this slot. In addition, the second substrate 1002 itself is inserted into the slot of the first electrical connection unit 151. In this case, a plurality of connection terminals are provided on the end side of the second substrate, so that when the second substrate 1002 is inserted into the slot of the first electrical connection unit 151, the connection terminals of the second substrate are connected terminals inside the slot. Are electrically connected to the field. A plurality of connection terminals formed on the end side of the second substrate may be the second electrical connection. In this case, the second substrate 1002 can be coupled to the first substrate 1001 by simply inserting the second substrate 1002 into the slot of the first electrical connector 151, and at the same time, the first element group G1 ) And the second device group G2 may be electrically connected. Accordingly, the bonding structure of the first substrate 1001 and the second substrate 1002 may be further simplified.

43 is a side view illustrating a second substrate 1002 coupled to a first substrate 1001 according to another exemplary embodiment.

According to the embodiment illustrated in FIG. 43, the first substrate 1101 may include a groove and/or a via hole into which the second substrate 1002 may be fixedly inserted. The above-described connection terminals are installed in the groove and/or the hole by conductive patterning, and the connection terminals become the first electrical connection part 151. Then, the second substrate 1002 itself is inserted into the groove and/or hole. At this time, a plurality of connection terminals are provided on the end side of the second substrate, so that when the second substrate 1002 is inserted into the groove and/or hole of the first substrate 1101, the connection terminals of the second substrate are grooved and /Or are electrically connected to the connection terminals inside the hole. A plurality of connection terminals formed on the end side of the second substrate may be the second electrical connection. In this case, the second substrate 1002 can be coupled to the first substrate 1001 by simply inserting the second substrate 1002 into the grooves and/or holes of the first substrate 1001, and at the same time, the first element Electrical connection between the group G1 and the second device group G2 may be possible. The end of the second substrate 1102 may have a protrusion to be inserted into the groove and/or hole, and connection terminals may be designed by conducting conductive patterning on the protrusion. Therefore, even in this embodiment, electrical connection between the first element group G1 and the second element group G2 can be made only by combining the first substrate 1001 and the second substrate 1002, so that the overall structure of the device Can be done simply.

In the case of the structures shown in FIGS. 37 to 43 described above, the embodiment shown in FIG. 36 is applied, and the structures shown in FIGS. 37 to 43 are applicable to various circuit configurations to be described below.

44 shows a more specific example of a separate active EMI filter module 1000 according to another embodiment.

In the embodiment shown in FIG. 44, unlike the embodiment shown in FIG. 36 described above, noise in the 1-1 pin 141 and the 1-3 pin 143 on the first device 2 side, which is the power side The sensing unit 11 is electrically connected. In addition, the compensation unit 13 and the transmission unit 14 are electrically connected to the 1-2 pins 142 and 1-4 pins 144 on the side of the second device 3. Accordingly, the embodiment shown in FIG. 10 shows a CSCC active EMI filter of a feedback type, which senses a noise current going out to the first device 2 and compensates with the current at the second device 3 side. The noise sensing unit 11, the active circuit unit 12, the compensation unit 13, and the transfer unit 14 shown in FIG. 44 may each perform the same functions as those of the devices shown in FIG. 2.

45 illustrates a more specific example of a separate active EMI filter module 1000 according to another embodiment.

Referring to FIG. 45, in the separate active EMI filter module 1000 according to another embodiment, the noise sensing unit 11 may include a sensing capacitor unit 112. The separated active EMI filter module 1000 according to the embodiment shown in FIG. 45 detects a noise voltage using the sensing capacitor unit 112 and converts the current into a current using the compensation capacitor unit 141 of the transmission unit 14. Represents a voltage-sense current-compensation (VSCC) active EMI filter that compensates. In a VSCC structure such as the active EMI filter 1 according to this embodiment, a feedforward and a feedback may not be distinguished due to an operating principle. That is, in the separate active EMI filter module 1000 illustrated in FIG. 45, there may be no distinction between input/output units. In addition, the separated active EMI filter module 1000 according to the embodiment may also have an isolated structure by using the compensation transformer 131 and the sensing transformer 113.

The sensing capacitor unit 112 may sense a noise voltage input to the first through line 21 and the second through line 22 which are power lines. The sensing capacitor unit 112 may include two sensing capacitors, and each sensing capacitor may include a Y-cap. One end of each of the two sensing capacitors may be electrically connected to the first through line 21 and the second through line 22, and the other end may share a node connected to the primary side of the sensing transformer 113. I can. The primary side of the sensing transformer 113 may be electrically connected to the first through line 21 and the second through line 22 which are power lines through the sensing capacitor unit 112.

The sensing transformer 113 may include a primary side connected to the power line side and a secondary side connected to the active circuit unit 12 in order to sense noise flowing through the power line. The secondary side of the sensing transformer 113 may be differentially connected to the input terminal of the active circuit unit 12.

The sensing transformer 113, the active circuit unit 12, the compensation transformer 131, and the compensation capacitor unit 141 included in the separated active EMI filter module 1000 according to the embodiment shown in FIG. 45 are each implemented as described above. An operation corresponding to the sensing transformer, the active circuit unit 121, the compensation transformer 131, and the compensation capacitor unit 141 may be performed.

Although not shown in the drawings, in the above-described embodiments, the active circuit unit 12 further includes a high-pass filter (not shown) between the compensation transformer 131 and is below a frequency band subject to noise reduction. It is possible to block the active circuit unit 12 from operating at a low frequency of.

46 illustrates a configuration of a separate active EMI filter module 1000 according to another embodiment.

The embodiment shown in FIG. 46 is a separate active EMI filter module 1000 having a three-phase three-wire structure unlike the single-phase embodiment shown in FIG. 2.

Referring to FIG. 46, a first through line 21, a second through line 22, and a third through line 23 pass through the substrate, and both ends of the first through line 21 to the first through line 241 to It may be electrically connected to the 1-6th pins 146. According to an embodiment, the first through line 21 may be an R-phase, the second through line 22 may be an S-phase, and the third through line 23 may be a T-phase.

The noise sensing unit 11 may include a sensing transformer capable of sensing noise, wherein the sensing transformer includes a first reference winding connected to the first through line 21 to the third through line 23, respectively. 1101) to the third reference winding 1103, and a sensing winding 1100 formed on the same core as the first reference winding 1101 to the third reference winding 113.

The first reference winding 1101 to the third reference winding 1103 may be a primary winding connected to a power line, and the sensing winding 1100 may be a secondary winding.

Each of the first to third reference windings 1101 to 1103 may be in the form of a winding wound around a core, but is not limited thereto, and a first reference winding 1101 and a second reference winding At least one of (1102) or the third reference winding 1103 may have a structure passing through the core.

The sensing winding 1100 may have a structure in which the first reference winding 1101 to the third reference winding 1103 is wound and/or wound at least one time around a core through which it passes, or a structure passing through the core.

The sensing winding 1100 is insulated from the power line as in the above-described embodiment of FIG. 36, and may sense a noise current generated from the second device 3. Like the embodiment of FIG. 2, the primary winding and the secondary winding may be wound in consideration of the direction in which the magnetic flux and/or the magnetic flux density are generated.

The sensing winding 1100 supplies the induced current to the active circuit unit 12, and the active circuit unit 12 amplifies it to generate an amplified current. The active circuit unit 12 may be designed to generate an amplified current in consideration of the transformation ratio of the above-described sensing transformer and the transformation ratio of the compensation transformer 131 to be described later. The active circuit unit 12 may be implemented by various means. According to an embodiment, the active circuit unit 12 may include an OP AMP 121. According to another embodiment, the active circuit unit 12 may include a plurality of passive devices such as a resistor and a capacitor in addition to the OP AMP. According to another embodiment, the active circuit unit 12 may include a bipolar junction transistor (BJT) and/or a plurality of passive devices such as a resistor and a capacitor. However, it is not necessarily limited thereto, and the means for amplification described in the present invention may be used without limitation as the active circuit unit 12 of the present invention.

The amplified current flows to the first through line 21, the second through line 22 and/or the third through line 23 through the compensation unit 13 and the transfer unit 14, and compensates for noise. I can.

The compensation unit 13 may include a compensation transformer 131, and a specific configuration and function may be applied in the same manner as the embodiment shown in FIG. 36.

The transfer unit 14 may include a compensation capacitor unit 141, wherein each capacitor of the compensation capacitor unit 141 has one end connected to the compensation transformer 131 and the other end of the first through line 21 to the first through line. It is connected to the 3 through line 23, respectively.

The embodiment shown in FIG. 46 is shown in a three-phase, three-wire structure based on the embodiment shown in FIG. 36, but the present invention is not necessarily limited thereto, and the embodiment shown in FIG. The same can be applied to the embodiment shown in 45.

47 illustrates a configuration of a separate active EMI filter module 1000 according to another embodiment.

The embodiment shown in FIG. 47 is a separate active EMI filter module 1000 having a three-phase four-wire structure unlike the single-phase embodiment shown in FIG. 36 and the three-phase three-wire embodiment shown in FIG. 12.

Referring to FIG. 47, a first through line 21, a second through line 22, a third through line 23, and a fourth through line 24 pass through the substrate, and both ends thereof are It may be electrically connected to the 1-1 pins 241 to 1-8 pins 148. According to an embodiment, the first through line 21 is an R phase, the second through line 22 is an S phase, the third through line 23 is a T phase, and the fourth through line 24 is an N-phase. It can be a power line.

The noise sensing unit 11 may include a sensing transformer 110 capable of sensing noise, wherein the sensing transformer includes first through lines 21 to 4 respectively connected to the first through lines 24 A reference winding 1101 to a fourth reference winding 1104 and a sensing winding 1100 formed on the same core as the first reference winding 1101 to the fourth reference winding 1104 may be included.

The first reference winding 1101 to the fourth reference winding 1104 may be a primary winding connected to a power line, and the sensing winding 1100 may be a secondary winding.

Each of the first to fourth reference windings 1101 to 1104 may be in the form of a winding wound around a core, but is not limited thereto, and a first reference winding 1101 and a second reference winding At least one of (1102), the third reference winding 1103, and the fourth reference winding 1104 may have a structure passing through the core.

The sensing winding 1100 may have a structure in which the first reference winding 1101 to the fourth reference winding 1104 is wound and/or wound at least one time around a core through which it passes, or a structure that penetrates the core once.

The sensing winding 1100 is insulated from the power line as in the above-described embodiments, and may sense a noise current generated from the second device 3. Like the embodiment of FIG. 36, the primary and secondary windings may be wound in consideration of the direction of generation of magnetic flux and/or magnetic flux density.

The amplified current is applied to the first through line 21, the second through line 22, the third through line 23 and/or the fourth through line 24 through the compensation part 13 and the transfer part 14. ), and can compensate for noise.

The compensation unit 13 may include a compensation transformer 131, and the transmission unit 14 may include a compensation capacitor unit 141, and specific configurations and functions are described in FIGS. 36 and 46 It can be applied in the same way as the embodiment shown in. One end of each capacitor of the compensation capacitor unit 141 is connected to the compensation transformer 131 and the other end is connected to the first through line 21 to the fourth through line 24, respectively.

The embodiment shown in FIG. 47 is shown in a three-phase, four-wire structure based on the embodiment shown in FIG. 36, but the present invention is not necessarily limited thereto, and the embodiment shown in FIG. The same can be applied to the embodiment shown in 45.

In the separated active EMI filter module 1000 of the embodiments as described above, the second device group G2 installed on the second substrate 1002 and the second substrate 1002 is as shown in FIGS. 48 and 49. It is implemented as a sealing structure that is blocked from the outside through the same sealing structure 6, and can be made into a single module.

48 and 49, the second device group G2 is installed on the second substrate 1002, and the active circuit unit 102 is installed on one surface of the second substrate 1002. Then, the compensation part 13 is installed on the other surface of the second substrate 1002.

According to an embodiment, the encapsulation structure 6 may include a support 61 and a filling part 63.

The support 61 is formed of an insulating material and includes a space located therein. The space portion of the support 61 may be defined by an opening 611 and a bottom 612. In some cases, the support 61 may be formed of a material capable of heat transfer. In this case, a heat dissipation mechanism such as a heat sink may be additionally installed on the support 61, and accordingly, heat dissipation by the support 61 may be smoothly performed.

The above-described second substrate 1002 is accommodated in the space portion of the support 61. The second substrate 1002 may be accommodated in the support 61 in a vertically erected form, and at this time, the connection pins of the second electrical connector 152 located at the edge of the second substrate 1002 are opened 611 It may have a structure protruding outward of. Accordingly, both surfaces of the second substrate 1002 may be disposed to face the sidewalls inside the support 61, respectively.

Meanwhile, according to an embodiment, the separate active EMI filter module 1000 may include a filling portion 63 provided to fill at least a part of the space portion of the support 61.

The second substrate 1002 may be fixed in the support 61 by the filling part 63.

The filling part 63 may be provided with a heat-resistant and/or insulating resin material. According to an embodiment, the filling part 63 may include an epoxy resin, and may further include a curing agent.

The detachable active EMI filter module 1000 having the above structure may have a box structure in which the second electrical connector 152 protrudes in-line.

Since the detachable active EMI filter module 1000 can be simply installed in various devices and has a structure independent from external devices, in particular, the second device group G2 can be protected from external stimuli and/or shock, The detachable active EMI filter module 1000 itself may be prevented from being damaged. This makes it possible to improve the durability of the entire equipment requiring the separate active EMI filter module 1000. In addition, it is possible to protect the second device group G2 from contaminated environments such as external dust. In addition, when the support 61 and/or the filling part 63 contains a heat dissipating material, the second element group G2 is prevented from deteriorating because the heat emitted from the second element group G2 can be radiated to the outside. Can be prevented.

The embodiments shown in FIGS. 48 and 49 represent the embodiment shown in FIG. 41, but the present invention is not limited thereto, and the second substrate 1002 and the second device group according to other embodiments ( It goes without saying that G2) can be sealed in the same way.

Meanwhile, in the above-described embodiment, it has been described that the second substrate 1002 is disposed perpendicularly to the first substrate 1001 and is coupled to the first substrate 1001, but the present invention is not limited thereto. .

That is, in a design structure in which the protrusion height from the first substrate 1001 is limited, the second substrate 1002 may be disposed in a horizontal state with respect to the first substrate 1001 to be coupled to the first substrate 1001. have. In this case, the second electrical connection part 152 installed on the second substrate 1002 may have a structure capable of horizontally coupling the second substrate 1002 to the first substrate 1001. For example, in the embodiment illustrated in FIG. 14, the second electrical connection part 152 may have a structure that is not bent and extends in a vertical direction from the surface of the second substrate 1002. In this case, the surface of the second substrate 1002 may be horizontally accommodated on the support of the flat box body, and may be molded with the filling portion 63.

In this way, the present invention can simply implement the detachable active EMI filter module 1000 provided in a modular form, and by mixing various materials into the filling part during the manufacturing process, the detachable active EMI filter module 1000 implements more improved functions. You can do it. For example, by adding insulation, heat transfer and/or heat dissipation material to the filling part, an additional configuration related to cooling may be implemented.

In addition, by the support provided in the form of a hard case, not only can it provide physical protection for internal devices, but in some cases, a heat sink or other heat dissipation mechanism can be additionally installed on the support. The heat dissipation can be made smoothly.

All embodiments described in the present specification may be applied in combination with each other.

The present invention has been described with reference to one embodiment shown in the accompanying drawings, but this is only illustrative, and those of ordinary skill in the art will understand that various modifications and other equivalent embodiments are possible therefrom. I will be able to. Therefore, the true scope of protection of the present invention should be determined only by the appended claims.

Claims

A first device group including a noise sensing unit provided to detect electromagnetic noise; And

Including; a second device group including a compensation unit provided to generate a compensation signal for the electromagnetic noise,

The first group and the second group are separate active EMI filter modules provided to be mounted on different substrates, respectively.
The method of claim 1,

A first substrate on which the first device group is mounted;

A second substrate on which the second device group is mounted; And

And a first electrical connection part interposed between the first substrate and the second substrate to electrically connect at least a portion of the first substrate and at least a portion of the second substrate.
The method of claim 2,

A detachable active EMI filter module comprising a second electrical connection coupled to the second substrate and provided to be coupled to the first electrical connection.
The method of claim 3,

The second electrical connection part is provided in-line along the edge of the second substrate, a separate active EMI filter module.
The method according to any one of claims 2 to 4,

Separate active EMI filter module further comprising an encapsulation structure provided to separate the second substrate and the second device group from the outside.