WO2019237836A1

WO2019237836A1 - Highly integrated controller and electrical appliance

Info

Publication number: WO2019237836A1
Application number: PCT/CN2019/084121
Authority: WO
Inventors: 甘弟; 冯宇翔
Original assignee: 广东美的制冷设备有限公司; 美的集团股份有限公司
Priority date: 2018-06-13
Filing date: 2019-04-24
Publication date: 2019-12-19

Abstract

Disclosed are a highly integrated controller and an electrical appliance. The highly integrated controller comprises: a substrate, wherein a binding wire pad and a pin pad are disposed on the substrate; and a rectification bridge, a power factor correction device, and an intelligent power module, wherein the rectification bridge, the power factor correction device, and the intelligent power module are disposed on the substrate. The rectification bridge and the power factor correction device are electrically connected by means of a metal binding wire, the binding wire pad, a copper wire; the power factor correction device and the intelligent power module are electrically connected by means of the metal binding wire, the binding wire pad, and the copper wire; the binding wire pad and the pin pad are disposed adjacent to each other. In the highly integrated controller of the present invention, the rectification bridge, the power factor correction device, and the intelligent power module are integrated in the same heat dissipation substrate, and the present invention has a wider applicability range and lower production costs by further optimizing a wiring manner and the position of the pads, and reducing the area of the power module and that of an electronic control board.

Description

Highly integrated controllers and appliances

Technical field

The present invention relates to the field of electric appliance manufacturing, and in particular, the present invention relates to a highly integrated controller and an electric appliance.

Background technique

Intelligent Power Module (IPM, Intelligent Power Module) is an advanced power switching device, which is essentially a module that integrates power devices and their driving circuit chips; intelligent power modules can play a role in the field of energy management that other integrated circuits cannot reach. Important role, device performance directly affects the utilization efficiency of energy systems. The intelligent power module uses an insulated gate bipolar transistor (IGBT) as its core, and is composed of a high-speed low-power die, an optimized gate drive circuit, and a fast protection circuit. The die of the insulated gate bipolar transistor in the power module is generally high-speed, and the driving circuit is close to the insulated gate bipolar transistor. The driving delay is small, so the switching speed of the power module is fast and the loss is small.

However, current power modules and appliances still need to be improved.

Summary of the Invention

The present invention is based on the inventor's discovery of the following facts and problems:

The power consumption of air conditioners accounts for about 60% of the total power consumption of common household appliances. If all fixed frequency air conditioners are replaced with variable frequency air conditioners, the overall efficiency will be increased by 30%, and IPM is the core component of variable frequency air conditioners. The outdoor electric control board of variable frequency air conditioner includes four power devices: rectifier bridge, power factor correction device (PFC switch), compressor IPM, and fan IPM.

In the prior art, these four types of power devices for outdoor electrical control of inverter air conditioners are each pin-mounted on a PCB board, and then the same heat sink (fin) is used for centralized heat dissipation. This discrete rectifier bridge, PFC switch, compressor IPM and fan IPM design make the outdoor electrical control larger in volume and higher in cost.

The present invention aims to alleviate or solve at least one of the above mentioned problems to at least some extent.

In one aspect of the invention, the invention proposes a highly integrated controller. According to an embodiment of the present invention, the highly integrated controller includes: a substrate having wire bonding pads and pin pads on the substrate; a rectifier bridge, a power factor correction device, and an intelligent power module, the rectifier bridge, the A power factor correction device and the intelligent power module are disposed on the substrate; a metal tie wire is used between the rectifier bridge and the power factor correction device, between the power factor correction device and the intelligent power module, The bonding wire pad is electrically connected to the copper wiring; wherein the bonding wire pad is disposed adjacent to the pin pad.

Therefore, the highly integrated controller according to the embodiment of the present invention effectively reduces the area of the electric control board by integrating the rectifier bridge, the power factor correction device and the intelligent power module on the same heat dissipation substrate, and purchases the rectifier bridge and the power factor respectively. Correction devices and smart power module bare chips for power module packaging production are cheaper than purchasing discrete finished devices. At the same time, the highly integrated controller of the present invention arranges the bonding wire pads and the pin pads adjacently by optimizing the wiring method and the pad position, making full use of the characteristics that the bonding wires do not occupy the size of the substrate, and forming a metal bonding wire and The copper circuit's three-dimensional circuit topology further reduces the size of highly integrated controllers. Therefore, the highly integrated controller of the present invention integrates a rectifier bridge, a power factor correction device, and an intelligent power module on the same heat dissipation substrate, and further reduces the power module and the electric control board by optimizing the wiring method and the pad position. Area, wider scope of application, lower production cost.

In addition, the highly integrated controller according to the above embodiments of the present invention may also have the following additional technical features:

In some embodiments of the invention, the rectifier bridge includes a plurality of diodes.

In some embodiments of the present invention, the power factor correction device includes a switch tube, a diode, and a power factor correction switch driver.

In some embodiments of the present invention, the switch of the power factor correction device is a SiC MOSFET, SiC, IGBT, or GaN HEMT, and the diode of the power factor correction device is a device made of Si material.

In some embodiments of the present invention, the intelligent power module includes a compressor intelligent power module and a fan intelligent power module.

In some embodiments of the present invention, the compressor intelligent power module includes a plurality of switch tubes, a plurality of fast recovery diodes, and a compressor intelligent power module driver.

In some embodiments of the present invention, the switch of the compressor intelligent power module is SiC MOSFET, SiC, IGBT or GaN HEMT, and the fast recovery diode of the compressor intelligent power module is a device made of Si material.

In some embodiments of the present invention, the fan intelligent power module includes a plurality of reverse conducting insulated gate bipolar transistors and a fan intelligent power module drive.

In some embodiments of the present invention, the reverse conducting insulated gate bipolar transistor of the wind turbine intelligent power module is a device made of Si material.

In some embodiments of the present invention, the highly integrated controller further includes:

A microcontroller, which is disposed on the substrate, and the microcontroller is connected to the intelligent power module;

An external inductor, which is disposed between the rectifier bridge and the power factor correction device;

An external capacitor, which is disposed between the power factor correction device and the intelligent power module.

In some embodiments of the present invention, the highly integrated controller is a DIP package.

In some embodiments of the invention, the bottom of the substrate is exposed outside the DIP package.

In some embodiments of the present invention, the rectifier bridge, the power factor correction device, and the smart power module are all bare chips, and the smart power module is driven by a die.

In some embodiments of the present invention, the highly integrated controller further includes: a filling layer covering and surrounding the device layer 40; a first heat dissipation plate formed on the filling layer; A heat dissipation plate has heat dissipation folds.

In some embodiments of the present invention, the highly integrated controller further includes: a second heat dissipation plate formed under the substrate.

In another aspect of the invention, the invention provides an electrical appliance. According to an embodiment of the present invention, the appliance includes the highly integrated controller of the above embodiment. The appliance according to the embodiment of the present invention can effectively reduce the space occupation of the power module by using the highly integrated controller of the above embodiment.

In some embodiments of the present invention, the electrical appliance may be an air conditioner, a washing machine, a refrigerator, or an induction cooker. In the air conditioner, washing machine, refrigerator, or induction cooker, by adopting the highly integrated controller of the above embodiments, the space occupation of the power module can be effectively reduced, and the reliability and the service life of the power module can be longer.

Additional aspects and advantages of the present invention will be given in part in the following description, part of which will become apparent from the following description, or be learned through the practice of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

1 is a schematic structural diagram of a highly integrated controller according to a first embodiment of the present invention;

2 is a schematic structural diagram of a highly integrated controller according to a first specific embodiment of the present invention;

3 is a schematic diagram of a PCB substrate wiring in the prior art;

4 is a schematic diagram of wiring of a substrate in a highly integrated controller according to a first embodiment of the present invention;

FIG. 5 is a diagram of the electrical connection relationship of each device in the highly integrated controller according to the first specific embodiment of the present invention; FIG.

6 is a block diagram of a highly integrated controller according to a second embodiment of the present invention;

7 is a block diagram of a power module according to a second embodiment of the present invention;

8 is a schematic cross-sectional structure diagram of a power module according to a specific embodiment of the present invention.

9 is a schematic block diagram of an electrical appliance according to an embodiment of the present invention;

10 is a block diagram of a highly integrated controller according to a third embodiment of the present invention;

11 is a block diagram of a highly integrated controller according to a third embodiment of the present invention;

12 is a schematic structural diagram of a highly integrated controller according to a third specific embodiment of the present invention;

13 is a block diagram of a highly integrated controller according to a fourth embodiment of the present invention;

14 is a block diagram of a highly integrated controller according to a fourth embodiment of the present invention;

15 is a block diagram of a highly integrated controller according to a fifth embodiment of the present invention;

FIG. 16 is a block diagram of a highly integrated controller according to a fifth embodiment of the present invention.

Reference signs:

1000: highly integrated controller; 2000: electrical appliances.

100: substrate; 10: rectifier bridge; 20: power factor correction device (PFC switch); 30: intelligent power module (IPM); 40: device layer; 50: filling layer; 51: high thermal conductivity packaging material; 60: first Radiating plate; 61: Radiating fold; 70: Second cooling plate; 80: Microcontroller;

5: metal bonding wire; 6: bonding wire pad; 7: copper wiring; 8: pin pad;

11: diode; 12: diode; 13: diode; 14: diode;

21: switch tube; 22: diode; 23: power factor correction switch driver (PFC switch driver);

300: compressor intelligent power module (compressor IPM); 311: switch tube; 312: switch tube; 313: switch tube; 314: switch tube; 315: switch tube; 316: switch tube; 321: diode; 322: diode 323: diode; 324: diode; 325: diode; 326: diode; 33: compressor intelligent power module drive (compressor IPM drive);

400: fan intelligent power module (fan IPM); 411: reverse conducting insulated gate bipolar transistor (reverse conducting IGBT); 412: reverse conducting IGBT; 413: reverse conducting IGBT; 414: reverse conducting IGBT; 415: reverse conducting IGBT; 416: reverse conducting IGBT; 43: fan intelligent power module drive (fan IPM drive).

detailed description

Hereinafter, embodiments of the present invention will be described in detail. Examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals indicate the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the drawings are exemplary and are intended to explain the present invention, but should not be construed as limiting the present invention.

The inventor found in the study of the electrical appliance IPM that the outdoor electric control board of the inverter air conditioner includes four power devices: a rectifier bridge, a power factor correction device (PFC switch), a compressor IPM, and a fan IPM. In the prior art, these four types of power devices for outdoor electrical control of inverter air conditioners are each pin-mounted on a PCB board, and then the same heat sink (fin) is used for centralized heat dissipation. This discrete rectifier bridge, PFC switch, compressor IPM and fan IPM design make the outdoor electrical control larger in volume and higher in cost.

Specific embodiment one

In view of this, in one aspect of the present invention, the present invention proposes a highly integrated controller. According to an embodiment of the present invention, referring to FIG. 1, the highly integrated controller includes: a substrate 100, a rectifier bridge 10, a power factor correction device 20, and an intelligent power module 30. Among them, the substrate has wire bonding pads and pin pads; the rectifier bridge 10, the power factor correction device 20, and the intelligent power module 30 are disposed on the substrate, and between the rectifier bridge 10 and the power factor correction device 20, the power factor correction device 20 and the intelligent power module 30 are electrically connected through a metal bonding wire, a bonding wire pad, and a copper wiring, and the bonding wire pad is disposed adjacent to the pin pad.

The highly integrated controller according to the embodiment of the present invention is further described in detail below with reference to FIGS. 1 to 5:

At present, the conventional PCB wiring in the field is shown in Figure 3. In the conventional PCB wiring scheme, the bonding pads 6 and the pin pads 8 are located far away. The copper wiring 7 occupies a certain PCB area, resulting in power The size of the module is larger. The basic wiring of the highly integrated controller according to the embodiment of the present invention is shown in FIG. 4. The bonding wire pad 6 and the pin pad 8 are arranged adjacent to each other, thereby greatly reducing the connection between the bonding wire pad 6 and the pin pad. 8 copper wiring occupies area. In addition, the highly integrated controller of the present invention makes full use of the feature that the metal bonding wire 5 does not occupy the PCB size, and connects part of the metal bonding wire across the IGBT to electrically connect the bonding wire pad to the IPM driver to form a metal bonding wire and copper wiring. The stereo circuit topology further reduces the size of highly integrated controllers.

According to the embodiment of the present invention, the specific material of the substrate 100 is not particularly limited, and those skilled in the art may select according to actual needs. According to a specific example of the present invention, in order to further improve the heat dissipation performance of the substrate 100, the substrate 100 may be a ceramic substrate or a metal substrate (such as an aluminum substrate or a copper substrate) with an insulating layer, wherein the insulating layer may be 70 to 150 μm thick. Of common high thermal conductivity materials, which can further facilitate the heat dissipation of various devices on the substrate, thereby ensuring the overall stability and service life of the module. At the same time, each device on the substrate can be a bare chip, and can be electrically connected through copper wiring and external metal bonding wires adapted on the substrate, thereby further facilitating the heat dissipation of each device on the substrate, thereby ensuring the overall module Stability and service life. In some embodiments, the cross-sectional structure of the highly integrated controller is a heat dissipation substrate, an insulation layer, a copper wiring, a chip, and a metal bonding wire in this order. Therefore, the structure and wiring method of the power module are more concise and reasonable, and the stability is better.

According to an embodiment of the present invention, the rectifier bridge 10 includes a plurality of diodes. As shown in FIG. 5, the rectifier bridge 10 includes a diode 11, a diode 12, a diode 13, and a diode 14. In some embodiments, the diode 11, the diode 12, the diode 13, and the diode 14 may be disposed separately from each other. Therefore, the arrangement positions of the diodes in the rectifier bridge 10 are dispersed, which is more conducive to heat dissipation, and the stability of each element in the rectifier bridge is better, thereby improving the reliability and stability of the highly integrated controller as a whole.

According to an embodiment of the present invention, the power factor correction device 20 includes a switch tube and a plurality of diodes. As shown in FIG. 5, the power factor correction device 20 includes a switching tube 21, a diode 22, and a power factor correction switch driver 23. In some embodiments, the positive switch 21 may be disposed between the diode 22 and the power factor correction switch driver 23. Therefore, the heat dissipation of the power factor correction switch tube in the power factor correction device can be further facilitated, and its temperature impact on other devices on the heat dissipation substrate can be reduced, thereby improving the reliability and stability of the highly integrated controller as a whole. In some embodiments, the switching tube 21 is an insulated gate bipolar transistor (IGBT tube).

According to the embodiment of the present invention, the switching tube 21 of the power factor correction device 20 may be a SiC MOSFET, a SiC IGBT, or a GaN HEMT. The advantages of fast switching speed of devices made of SiC and GaN materials can reduce the switching loss of the module, which is conducive to saving power and reducing module heating, thereby further improving the reliability of the highly integrated controller. In addition, the inventor also found that after the switching tube 21 uses SiC MOSFET, SiC IGBT, or GaN HEMT, the diode 22 is set as a SiC MOSFET, SiC IGBT, or GaN HEMT device, which cannot bring significant energy saving and power saving effects. Therefore, the diode 22 can be set as a device made of Si material, which can further reduce the module cost.

According to an embodiment of the present invention, referring to FIG. 2, the intelligent power module 30 includes a compressor intelligent power module 300 and a fan intelligent power module 400. The highly integrated intelligent power module of the present invention effectively reduces the volume of the electric control board by integrating the compressor intelligent power module 300 and the fan intelligent power module 400 on the same heat dissipation substrate.

According to the embodiment of the present invention, the compressor intelligent power module 300 includes a plurality of switch tubes, a plurality of diodes, and a compressor intelligent power module driver. As shown in FIG. 5, the compressor intelligent power module 300 includes a switch 311, a switch 312, a switch 313, a switch 314, a switch 315, a switch 316, a diode 321, a diode 322, a diode 323, a diode 324, and a diode 325, diode 326 and compressor intelligent power module drive 33. In some embodiments, the switching tubes 311 to 316 are IGBT tubes, and the diodes 321 to 326 are fast recovery diodes.

According to the embodiment of the present invention, the switching tubes 311 to 316 of the power factor correction device 300 may be a SiC MOSFET, a SiC IGBT, or a GaN HEMT. The advantages of fast switching speed of devices made of SiC and GaN materials can reduce the switching loss of the module, which is conducive to saving power and reducing module heating, thereby further improving the reliability of highly integrated controllers. In addition, the inventors also found that after switching transistors 311 to 316 use SiC, SiC, IGBT, or GaN HEMT, diodes 321 to 326 are set as SiC MOSFET, SiC, IGBT, or GaN HEMT devices, which cannot bring significant energy saving and power saving effects Therefore, the diodes 321 to 326 can be provided as devices made of Si material, thereby further reducing the module cost.

According to an embodiment of the present invention, the fan intelligent power module 400 includes a plurality of reverse conducting insulated gate bipolar transistors (reverse conducting IGBTs) and a fan intelligent power module drive (fan IPM drive). As shown in Fig. 5, the wind turbine intelligent power module includes reverse conduction IGBT 411, reverse conduction IGBT 412, reverse conduction IGBT 413, reverse conduction IGBT 414, reverse conduction IGBT 415, reverse conduction IGBT 416, and wind turbine IPM drive 43. In some embodiments of the present invention, the fan IPM drive 43 and the compressor IPM drive 33 may be disposed adjacent to each other. Because the fan IPM and compressor IPM are connected to the high-voltage input terminal, placing them close together is conducive to the high-integration controller's simple power wiring and reduced interference, thereby improving the stability and life of the module.

According to the embodiment of the present invention, the electrical connection of the highly integrated controller of the present invention is shown in FIG. 5. As shown in FIG. 5, the highly integrated controller of the present invention may include an external inductor 500 and an external capacitor 600. The external inductor 500 is disposed between the rectifier bridge and the power factor correction device; the external capacitor 600 is disposed between the power factor correction device 20 and the intelligent power module 30. As a result, the volume of the highly integrated controller can be further reduced.

It should be noted that the features and advantages described in the foregoing for the highly integrated controller are also applicable to the above-mentioned electrical appliances, and are not repeated here one by one.

The present invention is described below with reference to specific embodiments. It should be noted that these embodiments are merely descriptive and do not limit the present invention in any way.

The wiring mode of the highly integrated controller substrate is shown in FIG. 4, and the air connection relationship between the devices is shown in FIG. 5. The highly integrated controller includes a rectifier bridge, a PFC switch, a compressor IPM, and a fan IPM fabricated on the same heat dissipation substrate. By integrating the rectifier bridge, PFC switch, compressor IPM and fan IPM on the same substrate, the area of the electronic control board can be reduced by about 30%.

The rectifier bridge includes four diodes 11, a diode 12, a diode 13, and a diode 14 made of Si material. The AC power of the input power module is converted into DC power after passing through the rectifier bridge, and flows to the external inductor 500 of the module (the inductor 500 is large and cannot be integrated into the module).

The PFC switch includes a switch 21, a diode 22, and a PFC switch driver 23. The switching tube 21 is a SiC MOSFET, SiC IGBT or GaN HEMT device, and the diode 22 is made of Si material.

The compressor IPM includes switching tubes 311 to 316, fast recovery diodes 321 to 326, and a compressor IPM drive 33. The switches 311 to 316 are SiC MOSFET, SiC, IGBT, or GaN HEMT devices, and the fast recovery diodes 321 to 326 are made of Si material.

The fan IPM includes reverse-conducting IGBTs 411 to 416, and the fan IPM drives 43. The reverse conducting IGBTs 411 to 416 are made of Si material.

The components used in the power module of this embodiment are all bare chips, and they are mounted on the same heat dissipation substrate. The electrical connection of the internal circuit of the power module realizes the electrical connection relationship through the metal binding wire 5, the binding wire coil 6, and the copper wiring 7. The power module of this embodiment adjusts the setting position of the bonding wire pads 6 and places the bonding wire pads 6 near the pin pads 8, thereby effectively reducing the copper wiring 7 on the PCB and reducing the PCB size. Compared with the conventional wiring (Figure 3), the wiring method of Figure 4 in this embodiment adjusts the position of the bonding wire pads, making full use of the characteristics that the bonding wire does not occupy the PCB size, and forming the three-dimensional of the metal bonding wire 5 and the copper wiring 6 Circuit topology, which further reduces the size of the power module.

Specific embodiment two

The highly integrated controller and electrical appliances according to the embodiments of the present invention will be described below with reference to the drawings.

FIG. 6 is a block diagram of a highly integrated controller according to a second embodiment of the present invention.

As shown in FIG. 6, the highly integrated controller includes: a substrate 100, a rectifier bridge 10, a power factor correction device 20, a compressor intelligent power module 300, a fan intelligent power module 400, and a compressor intelligent power driving the compressor intelligent power module 300. The module driver 33 and the fan intelligent power module driver 43 driving the fan intelligent power module 400.

In the embodiment of the present invention, the mains power rectified by the rectifier bridge 10 becomes direct current, which can provide working voltages to the power factor correction device 20, the compressor intelligent power module 300, and the fan intelligent power module 400, so that the highly integrated controller can function normally. Work; the power factor correction device 20 can perform power factor correction according to the rectified current, that is, by compensating for the switching power loss caused by the phase difference between the current and the voltage, and improving the power factor of the electrical equipment, that is, improving the high integrated controller Effective use of electricity.

Further, the compressor intelligent power module 300 is connected to the compressor in the electrical appliance 1000 and can drive the compressor to work. The fan intelligent power module 400 is connected to the fan in the electrical appliance 1000 and can drive the fan to work. Specifically, the compressor intelligent power module driver 33 may control the compressor intelligent power module 300 to output a driving signal and drive the compressor to work through the driving signal; the fan intelligent power module driver 43 may control the fan intelligent power module 400 to output a driving signal through the driving signal. Drive the fan.

Optionally, the rectifier bridge 10, the power factor correction device 20, the compressor intelligent power module 300, the fan intelligent power module 400, the compressor intelligent power module driver 33, and the fan intelligent power module driver 43 may be connected by copper wiring 7 and metal. The tie wires 5 are connected.

Specifically, the rectifier bridge 10 is disposed on the substrate 100; the power factor correction device 20 is disposed on the substrate 100 and connected to the rectifier bridge 10, wherein the power factor correction device 20 includes a switching tube 21 and a diode 22; a compressor intelligent power The module 300 is disposed on the substrate 100 to drive the compressor. The compressor intelligent power module 300 includes switching tubes 311 to 316 and fast recovery diodes 321 to 326 respectively connected in parallel with the switching tubes 311 to 316. The fan intelligent power module 400 is provided. The fan is driven on the substrate 100. The fan intelligent power module 400 includes reverse-conducting IGBTs 411 to 416; the compressor intelligent power module driver 33 is provided on the substrate 100 and connected to the compressor intelligent power module 300; the fan intelligent power module driver 43 is provided It is above the base plate 100 and connected to the fan intelligent power module 400.

FIG. 7 is a circuit schematic diagram of a power module according to a specific embodiment of the present invention.

As shown in FIG. 7, the power module includes a rectifier bridge 10, a power factor correction device 20, a compressor intelligent power module 300, and a fan intelligent power module 400. The rectifier bridge 10 includes a diode 11, a diode 12, a diode 13, and a diode 14. The power factor correction device 20 includes a switching tube 21, a diode 22, and a PFC switch driver 23. The compressor intelligent power module 300 includes switching tubes 311 to 316, fast recovery diodes 321 to 326, and a compressor IPM drive 33. The fan intelligent power module 400 includes Reverse conducting IGBTs 411 to 416 and fan IPM drive 43.

It can be understood that by integrating the rectifier bridge 10, the power factor correction device 20, the compressor intelligent power module 300, and the fan intelligent power module 400 on the same heat dissipation substrate 100, the power module can reduce the outdoor electrical control board of the electrical appliance 1000. Area, and can also purchase corresponding chips for power module packaging production, further reducing manufacturing costs.

Further, as shown in FIG. 8, according to an embodiment of the present invention, the highly integrated controller further includes: a microcontroller 80, the microcontroller 80 is disposed on the substrate 100, and the microcontroller 80 and the compressor intelligent power The module driver 33 is connected to the fan intelligent power module driver 43.

Specifically, the highly integrated controller sends a control instruction to the compressor intelligent power module driver 33 and the fan intelligent power module driver 43 through the microcontroller 80. When the compressor intelligent power module driver 33 and the fan intelligent power module driver 43 receive control, When instructed, the compressor intelligent power module 300 and the fan intelligent power module 400 are controlled to work. The compressor intelligent power module 300 drives the compressor and the fan intelligent power module 400 drives the fan.

Further, according to an embodiment of the present invention, the switching tube 21 may include a SiC, MOSFET, SiC, IGBT, or HEMT (High Electron Mobility Transistor) device, and the diode 22 may be a device made of Si material.

Further, according to an embodiment of the present invention, the switching transistors 311 to 316 may include SiC, MOSFET, SiC, or GaN HEMT devices, and the fast recovery diodes 321 to 326 may be devices made of Si materials.

It can be understood that, by setting the switching tube 21 and the switching tubes 211 to 316 as SiC, MOSFET, SiC, IGBT, or GaN material HEMT devices, the advantages of using SiC and GaN materials for fast switching speed can be reduced. The switching loss of the small power module is conducive to saving power and effectively reducing the heating of the power module.

In addition, by setting the diode 22 and the fast recovery diodes 321 to 326 as devices made of Si material, the manufacturing cost of the power module can be reduced.

Further, according to an embodiment of the present invention, the reverse conducting IGBTs 411 to 416 may be devices made of Si material.

In other words, the size of the power module can be reduced by designing the reverse-conducting IGBTs 411 to 416 in the fan intelligent power module 400 as Si materials, and based on the characteristics of small fan output current and low power consumption, reducing the size of the power module can further Ground to solve the problem of poor heat dissipation and high heat generation of the power module.

Further, the rectifier bridge 10, the power factor correction device 20, the compressor intelligent power module 300, the fan intelligent power module 400, the compressor intelligent power module driver 33, and the fan intelligent power module driver 43 may be connected through copper wiring 7 and metal. Line 5 is connected.

Specifically, as shown in FIG. 5 and FIG. 8, the power module includes a heat dissipation substrate 100, an insulating layer, a copper wiring 7, a chip (ie, a switching tube 21, switching tubes 211 to 316, a diode 22, a fast recovery diode 321 to 326, an inverse IGBTs 411 to 416, compressor intelligent power module driver 33, fan intelligent power module driver 43, etc.) and metal bonding wires 5, among which the electrical connection of the internal circuit of the power module can be realized through copper wiring 7 and metal bonding wires 5.

Further, according to an embodiment of the present invention, the highly integrated controller is a DIP (Dual In-line Package) package.

Specifically, the rectifier bridge 10, the power factor correction device 20, the compressor intelligent power module 300, the fan intelligent power module 400, and the compressor intelligent power module can be driven in the internal circuit by using a DIP packaging form (e.g., plastic sealing, potting). 33 and fan intelligent power module drive 43 and other components to fill the package to protect the internal circuit of the highly integrated controller.

Further, according to an embodiment of the present invention, the bottom of the substrate is exposed outside the DIP package.

It can be understood that the bottom of the substrate 100 is exposed outside the DIP package, and there can be a larger contact area with the outside world to facilitate heat dissipation of the highly integrated controller.

Further, according to an embodiment of the present invention, the components in the rectifier bridge 10, the power factor correction device 20, the compressor intelligent power module 300 and the fan intelligent power module 400 are bare chips, and the compressor intelligent power module drives 33 and the fan The intelligent power module drivers 43 are all die.

It can be understood that the components selected for the power module (rectifier bridge 10, power factor correction device 20, compressor intelligent power module 300, and fan intelligent power module 400) are all bare chips and are mounted on the same heat dissipation substrate 100. In order to dissipate the power module and improve the performance and reliability of the highly integrated controller.

For example, the highly integrated controller of the present invention sends a control instruction to the compressor intelligent power module driver 33 and the fan intelligent power module driver 43 through the microcontroller 80. When the compressor intelligent power module driver 33 and the fan intelligent power module driver are driven, 43. When the control instruction is received, the compressor intelligent power module 300 and the fan intelligent power module 400 are controlled to work. The compressor intelligent power module 300 drives the compressor and the fan intelligent power module 400 drives the fan.

In summary, according to the highly integrated controller of the embodiment of the present invention, the rectifier bridge, the power factor correction PFC circuit, the compressor intelligent power module 300, the fan intelligent power module 400, the compressor intelligent power module driver, and the fan intelligent power module driver are adjusted. Integrated on the same substrate to achieve highly integrated electrical control, reduce the size of the 1000 electrical appliances controller, and reduce costs.

FIG. 9 is a block diagram of an electrical appliance 1000 according to an embodiment of the invention. As shown in FIG. 9, the electrical appliance 1000 includes the highly integrated controller of the above embodiment.

According to the electrical appliance 1000 provided in the embodiment of the present invention, the highly integrated controller of the foregoing embodiment is adopted to drive the rectifier bridge, the power factor correction PFC circuit, the compressor intelligent power module 300, the fan intelligent power module 400, and the compressor intelligent power module. The driver and fan intelligent power module are integrated on the same substrate to achieve highly integrated electrical control, reduce the size of the 1000 controller of the appliance, and reduce costs.

Specific embodiment three

FIG. 10 is a block diagram of a highly integrated controller according to an embodiment of the present invention.

As shown in FIG. 10, the highly integrated controller 1000 includes a substrate 100, a device layer 40, and a filling layer 50.

Specifically, the device layer 40 is formed on the substrate 100. The device layer 40 includes: a rectifier bridge 10 disposed on the substrate 100; and a power factor correction device 20 disposed on the substrate 100 and connected to the rectifier bridge 10, wherein: The power factor correction device 20 includes a switching tube 21 and a diode 22; and a compressor intelligent power module 300 disposed on a substrate 100 to drive a compressor, wherein the compressor intelligent power module 300 includes switching tubes 311 to 316 and a switching tube 311 to 311 to 316. 316 parallel fast recovery diodes 321 to 326; a fan intelligent power module 400 provided on the substrate 100 to drive the fan, the fan intelligent power module 400 includes reverse-conducting IGBTs 411 to 416; a compressor intelligent power module driving the compressor intelligent power module 300 Drive 33, the compressor intelligent power module drive 33 is disposed on the substrate 100 and is connected to the compressor intelligent power module 300; and the fan intelligent power module driver 43, which drives the fan intelligent power module 400, is provided on the substrate 100 and connected to the fan intelligent power module 400; a filling layer 50 covering and surrounding the device layer 40; formed on The first heat radiating plate 60 above the layer 40; the second heat radiating plate 100 is formed under the substrate 70.

In the embodiment of the present invention, the mains power rectified by the rectifier bridge 10 becomes DC power, which can provide working voltages to the power factor correction device 20, the compressor intelligent power module 300, and the fan intelligent power module 400, so that the highly integrated controller 1000 can Normal operation; the power factor correction device 20 can perform power factor correction according to the rectified current, that is, by compensating for the switching power loss caused by the phase difference between the current and the voltage, and improving the power factor of the electrical equipment, that is, improving the highly integrated controller 1,000 effective use of electricity.

Optionally, the first heat dissipation plate 60 formed on the device layer 40 and the second heat dissipation plate 70 formed under the substrate 100 may be an aluminum substrate with high thermal conductivity. Among them, the The surface of the first heat dissipation plate 60 is provided with heat dissipation folds 61 to facilitate heat exchange with the outside world. The surface of the second heat dissipation plate 70 formed under the substrate 100 is flat and easy to install an additional heat sink. The material filled in the filling layer 50 has high thermal conductivity On the one hand, the filling layer 50 provides an insulating environment for the circuit, and on the other hand, the heat emitted by the device layer 40 is quickly passed through the filled material to the second heat sink 70 under the substrate 100.

Optionally, the rectifier bridge 10, the power factor correction device 20, the compressor intelligent power module 300, and the fan intelligent power module 400 may be disposed on one side of the device layer 40 to form a power device area, that is, a power module, which is driven by the compressor intelligent power module. 33 and the fan intelligent power module driver 43 may be provided on the other side of the device layer 40 to form a control device area, that is, a control module.

Further, as shown in FIG. 5 and FIG. 10, the power module includes a rectifier bridge 10, a power factor correction device 20, a compressor intelligent power module 300, and a fan intelligent power module 400, wherein the rectifier bridge 10 includes a diode 11, a diode 12, Diode 13, diode 14; power factor correction device 20 includes switch 21, diode 22, and PFC switch driver 223; compressor intelligent power module 300 includes switch 311 to 316, fast recovery diodes 321 to 326, and compressor IPM drive 33; The fan intelligent power module 400 includes reverse-conducting IGBTs 411 to 416 and a fan IPM drive 43.

It can be understood that by integrating the rectifier bridge 10, the power factor correction device 20, the compressor intelligent power module 300, and the fan intelligent power module 400 on the same heat dissipation substrate 100, the power module can reduce the outdoor electrical control board of the electrical appliance 1000. Area, can also purchase power modules (rectifier bridge 10, power factor correction device 20, compressor intelligent power module 300 and fan intelligent power module 400) for packaging production, further reducing manufacturing costs.

Further, as shown in FIG. 11, according to an embodiment of the present invention, the device layer 40 further includes: a microcontroller 80, the microcontroller 80 is disposed on the substrate 100, and the microcontroller 80 and the compressor intelligent power module The drive 33 is connected to the fan intelligent power module drive 43.

In the embodiment of the present invention, the electric appliance 1000 can further control the compressor and the fan according to the difference between the actual cooling effect and the target temperature, that is, the highly integrated controller 1000 can drive the intelligent power module of the compressor through the microcontroller 80 respectively. And the fan intelligent power module driver 43 sends a control instruction, and when the compressor intelligent power module driver 33 and the fan intelligent power module driver 43 receive the control instruction, the compressor intelligent power module 300 and the fan intelligent power module 400 are controlled to work, in which the compression The machine intelligent power module 300 outputs a driving signal, and drives the compressor and the fan through the driving signal. The intelligent power module 400 outputs a driving signal, and drives the fan through the driving signal. Therefore, the microcontroller 80 can quickly respond to and control the output adjustment of the compressor and the fan, thereby improving the user experience.

Further, according to an embodiment of the present invention, the switching tube 21 includes a SiC MOSFET, a SiC IGBT, or a GaN HEMT device, and the diode 22 is a device made of Si material.

Further, according to an embodiment of the present invention, the switching tubes 311 to 316 include SiC, MOSFET, SiC, or GaN HEMT devices, and the fast recovery diodes 321 to 326 are devices made of Si materials.

It can be understood that, by setting the switching tube 21 and the switching tubes 311 to 316 as a SiC, MOSFET, SiC, IGBT, or GaN material HEMT device, a device made of SiC and GaN material has the advantage of fast switching speed, which can reduce the The switching loss of the small power module is conducive to saving power and effectively reducing the heating of the power module.

Further, according to an embodiment of the present invention, the reverse conducting IGBTs 411 to 416 are devices made of Si material.

Further, according to an embodiment of the present invention, between the rectifier bridge 10, the power factor correction device 20, the compressor intelligent power module 300, the fan intelligent power module 400, the compressor intelligent power module driver 33, and the fan intelligent power module driver 43 Connected by metal wires and metal jumpers.

Specifically, as shown in FIG. 12, the power module may include a rectifier bridge 10, a power factor correction device 20, a compressor intelligent power module 300 and a fan intelligent power module 400 fabricated on the same heat dissipation substrate 100. Among them, the power module structure It includes a second heat sink 70 below the substrate 100, a device layer 40, an insulation layer, copper wiring 7, a bare wafer, a metal tie wire 5, a high thermal conductive packaging material 51, and a first heat sink formed on the device layer 40. The plate 60 and the heat radiation fold 51 of the first heat radiation plate 60 formed on the device layer 40. The insulation layer is closely attached to the surface of the second heat sink 70 formed below the substrate 100, the copper wiring 7 is located on the surface of the insulation layer, and the bare chip is connected to the rectifier bridge 10, the power factor correction device 20, the compressor intelligent power module 300, and the fan. For the chip related to the intelligent power module 400, a bare chip is affixed to the surface of the copper wiring 7, a metal bonding wire 5 electrically connects the bare chip and the copper wiring 7, and a high thermal conductive packaging material 51 is filled in the filling layer 50 and formed on the device layer 40. The first heat radiating plate 60 is connected to the highly thermally conductive packaging material 51.

It should be noted that the metal tying wire 5 can form a small radian, so that the thickness of the highly thermally conductive plastic sealing material 51 is reduced, thereby increasing the heat dissipation speed on the front of the module.

Further, according to an embodiment of the present invention, the highly integrated controller 1000 is a DIP package.

Specifically, the rectifier bridge 10, the power factor correction device 20, the compressor intelligent power module 300, the fan intelligent power module 400, and the compressor intelligent power module can be driven in the internal circuit by using a DIP packaging form (e.g., plastic sealing, potting). 33 and fan intelligent power module drive 43 and other components to fill the package to protect the internal circuit of the highly integrated controller 1000.

Further, according to an embodiment of the present invention, the bottom of the substrate 100 is exposed outside the DIP package.

It can be understood that the bottom of the substrate 100 is exposed outside the DIP package, and there can be a larger contact area with the outside, so as to facilitate heat dissipation of the highly integrated controller 1000.

It can be understood that the components selected for the power module (rectifier bridge 10, power factor correction device 20, compressor intelligent power module 300, and fan intelligent power module 400) are all bare chips and are mounted on the same heat dissipation substrate 100. In order to dissipate the power module and improve the performance and reliability of the highly integrated controller 1000.

Further, as shown in FIG. 12, according to an embodiment of the present invention, the first heat dissipation plate 60 has a heat dissipation fold 61.

That is, the surface of the first heat dissipation plate 60 formed on the device layer 40 has heat dissipation folds 61, which can increase the surface area of the first heat dissipation plate 60, thereby speeding up heat exchange with the outside world, thereby accelerating the heat dissipation of the device layer 40.

Further, according to an embodiment of the present invention, the filling layer 50 includes a highly thermally conductive packaging material 51.

Optionally, the filling layer 50 may be a 70-150um thick highly thermally conductive packaging material 51.

Specifically, the highly thermally conductive packaging material 51 is used to protect the copper wiring 7, the bare chip, and the metal bonding wire 5 of the power module from mechanical, moisture, and the like on the one hand, and on the other hand, to rapidly heat the device layer 40 Passed to the first heat sink 60.

In summary, according to the highly integrated controller 1000 according to the embodiment of the present invention, two layers of heat sinks are provided for double-sided heat dissipation, so as to solve the problem of high heat generation of the power module caused by the high integration of the highly integrated controller 1000, thereby increasing The reliability of the integrated controller 1000.

FIG. 9 is a block diagram of an electrical appliance 1000 according to an embodiment of the invention. As shown in FIG. 9, the electric appliance 1000 includes the highly integrated controller 1000 of the above embodiment.

According to the electrical appliance 1000 provided in the embodiment of the present invention, the highly integrated controller 1000 of the foregoing embodiment is adopted, and two-layer heat dissipation plates are provided for double-sided heat dissipation, so as to solve the large heat generation of the power module caused by the high integration of the highly integrated controller 1000. Problems, thereby improving the reliability of the highly integrated controller 1000.

Specific embodiment four

FIG. 13 is a block diagram of a highly integrated controller according to an embodiment of the present invention.

As shown in FIG. 13, the highly integrated controller 1000 includes a substrate 100, a device layer 40, and a filling layer 50.

Specifically, the device layer 40 is formed on the substrate 100. The device layer 40 includes: a rectifier bridge 10 disposed on the substrate 100; and a power factor correction device 20 disposed on the substrate 100 and connected to the rectifier bridge 10, wherein: The power factor correction device 20 includes a switching tube 21 and a diode 22; a compressor intelligent driving module 300 disposed on the substrate 100 to drive a compressor, wherein the compressor intelligent driving module 300 includes switching tubes 311 to 316 and a switching tube 311 to 311 to 316; 316 fast-recovery diodes 321 to 326 connected in parallel; a fan intelligent driving module 400 provided on the substrate 100 to drive the fan, the fan intelligent driving module 400 includes reverse conduction IGBTs 411 to 416; and a compressor intelligent module driving the compressor intelligent driving module 300 33. The compressor intelligent module driver 33 is provided on the substrate 100 and is connected to the compressor intelligent drive module 300; and the fan intelligent module driver 43 that drives the fan intelligent drive module 400 is disposed on the substrate 100 and Connected to the fan intelligent drive module 400; a filling layer 50 covering and surrounding the device layer 40; a first layer formed on the filling layer 50 Heat radiating plate 60.

In the embodiment of the present invention, the mains power rectified by the rectifier bridge 10 becomes DC power, which can provide working voltage to the power factor correction device 20, the compressor intelligent drive module 300, and the fan intelligent drive module 400, so that the highly integrated controller 1000 can Normal operation; the power factor correction device 20 can perform power factor correction according to the rectified current, that is, by compensating for the switching power loss caused by the phase difference between the current and the voltage, and improving the power factor of the electrical equipment, that is, improving the highly integrated controller 1,000 effective use of electricity.

Further, the compressor intelligent driving module 300 is connected to the compressor in the electrical appliance 1000 and can drive the compressor to work. The fan intelligent driving module 400 is connected to the fan in the electrical appliance 1000 and can drive the fan to work. Specifically, the compressor intelligent module driver 33 may control the compressor intelligent driving module 300 to output a driving signal to drive the compressor to work; the fan intelligent module driver 43 may control the fan intelligent driving module 400 to output a driving signal to drive the fan through the driving signal. .

Optionally, the first heat dissipation plate 60 formed on the filling layer 50 may be an aluminum substrate with high thermal conductivity and divided into a back heat dissipation substrate and a front heat dissipation substrate, wherein the first heat dissipation substrate formed on the fill layer 50 The back surface of the heat dissipation plate 60 in the heat dissipation plate 60 is flat to facilitate the installation of additional heat sinks. The filling layer 50 is a material with high thermal conductivity, which provides an insulating environment for the circuit on the one hand, and quickly transfers the heat generated by the device layer 40 to the filling layer. The back heat radiation substrate in the first heat radiation plate 60 above the layer 50.

Further, as shown in FIG. 14, according to an embodiment of the present invention, the device layer 40 further includes a microcontroller 80, the microcontroller 80 is disposed on the substrate 100, and the microcontroller 80 and the compressor intelligent module drive 33 is connected to the fan intelligent module driver 43.

In the embodiment of the present invention, the electric appliance 1000 can further control the compressor and the fan according to the difference between the actual cooling effect and the target temperature, that is, the highly integrated controller 1000 can drive the compressor intelligent module 33 through the microcontroller 80 respectively. The fan intelligent module driver 43 and the fan intelligent module driver 43 send control instructions. When the compressor intelligent module driver 33 and the fan intelligent module driver 43 receive the control instruction, the compressor intelligent driving module 300 and the fan intelligent driving module 400 are controlled to work. Among them, the compressor intelligent driver The module 300 outputs a driving signal, and drives the compressor and the fan through the driving signal. The intelligent driving module 400 outputs a driving signal and drives the fan through the driving signal. Therefore, the microcontroller 80 can quickly respond to and control the output adjustment of the compressor and the fan, thereby improving the user experience.

Optionally, the rectifier bridge 10, the power factor correction device 20, the compressor intelligent driving module 300, and the fan intelligent driving module 400 on the device layer 40 may be disposed on one side of the device layer 40 to form a power device area, that is, a power module and a compressor. The intelligent module driver 24 and the fan control chip 25 may be disposed on the other side of the device layer 40 to form a control device area, that is, a control module.

Further, as shown in FIG. 5 and FIG. 13, the power module includes a rectifier bridge 10, a power factor correction device 20, a compressor intelligent drive module 300, and a fan intelligent drive module 400, wherein the rectifier bridge 10 includes a diode 11, a diode 12, The diode 13 and the diode 14; the compressor intelligent driving module 300 includes the switching tubes 311 to 316, the fast recovery diodes 221 to 226, and the compressor IPM drive 23; the fan intelligent driving module 400 includes the reverse conducting IGBTs 311 to 316 and the fan IPM drive 33.

It can be understood that by integrating the rectifier bridge 10, the compressor intelligent driving module 300, and the fan intelligent driving module 400 on the same heat dissipation substrate 100, the above power module can reduce the area of the outdoor electrical control board of the electrical appliance 1000 and also purchase power. Modules (rectifier bridge 10, compressor intelligent drive module 300, and fan intelligent drive module 400) are selected for package production, which further reduces manufacturing costs.

Further, according to an embodiment of the present invention, the switching transistors 311 to 316 include a SiC MOSFET, a SiC IGBT, or a GaN HEMT device, and the fast recovery diode is a device made of Si material.

It should be noted that if the switching tubes 311 to 316 are designed as IGBTs made of Si material, the output voltage of the compressor IPM drive 23 is set to 14-16V to drive the switching tubes 311 to 316 respectively; Designed as MOS or IGBT made of SiC material, the output voltage of the compressor IPM drive 23 is set to 17 ~ 22V to drive the switching tubes 311 ~ 316 respectively.

In other words, when the switching transistors 311 to 316 are made of SiC or IGBT, and the driving voltage is increased to 17 to 22V, the low power consumption characteristics of the SiC device can be fully utilized, and the heat generation can be reduced.

It can be understood that designing the reverse-conduction IGBTs 411 to 416 of the intelligent drive module of the fan as a Si material device can reduce the size of the power module, and based on the characteristics of small output current and low power consumption of the fan, reducing the size of the power module can further solve the problem. Poor heat dissipation and high heat generation of power modules.

Further, according to an embodiment of the present invention, copper is passed between the rectifier bridge 10, the power factor correction device 20, the compressor intelligent driving module 300, the fan intelligent driving module 400, the compressor intelligent module driving 33, and the fan intelligent module driving 43. The wiring 7 is connected to the metal binding wire 5.

FIG. 12 is a schematic cross-sectional structure diagram of a power module according to a specific embodiment of the present invention.

As shown in FIG. 12, the insulation layer is adhered to the surface of the second heat sink 70, the copper wiring 7 is located on the surface of the insulation layer, and bare chip stickers related to the power factor correction device 20, the compressor intelligent driving module 300, and the fan intelligent driving module 400 are attached. The copper wiring 7 is electrically connected to the surface of the copper wiring 7. The metal bonding wire 45 is electrically connected to the bare chip and the copper wiring 7, the high thermal conductive packaging material 51 is filled on the front of the module, and the first heat dissipation plate 60 is connected to the high thermal conductive packaging material 51.

It should be noted that the metal tie wire 5 can form a small arc, so that the thickness of the highly thermally conductive packaging material 51 is reduced, thereby increasing the heat dissipation speed of the first heat dissipation plate 60 of the module.

Further, according to an embodiment of the present invention, the components in the rectifier bridge 10, the power factor correction device 20, the compressor intelligent driving module 300 and the fan intelligent driving module 400 are all bare chips, and the compressor intelligent module driving 33 and the fan intelligent The module drivers 43 are all die.

Further, according to an embodiment of the present invention, the first heat dissipation plate 60 has a heat dissipation fold 61.

That is, the surface of the first heat dissipation plate 60 has heat dissipation folds 61, which can increase the surface area of the first heat dissipation plate 60, thereby speeding up heat exchange with the outside world, thereby accelerating the heat dissipation of the device layer 40.

In summary, according to the integrated air-lift controller of the embodiment of the present invention, heat is dissipated through the double-sided heat dissipation plate formed on the filling layer, so as to solve the power module generation caused by the high integration of the highly integrated controller 1000. The problem of large heat increases the reliability of the highly integrated controller 1000.

According to the electrical appliance 1000 provided by the embodiment of the present invention, the highly integrated controller 1000 of the foregoing embodiment is used to dissipate heat through the double-sided heat dissipation plate formed on the filling layer, so as to solve the power caused by the high integration of the highly integrated controller 1000. The problem of high heat generation of the module further improves the reliability of the highly integrated controller 1000.

Specific embodiment five

FIG. 15 is a block diagram of a highly integrated controller according to an embodiment of the present invention.

As shown in FIG. 15, the highly integrated controller 1000 includes a substrate 100 and a device layer 40.

Specifically, the device layer 40 is formed on the substrate 100. The device layer 40 includes: a rectifier bridge 10 disposed on the substrate 100; and a power factor correction device 20 disposed on the substrate 100 and connected to the rectifier bridge 10, wherein: The power factor correction device 20 includes a switching tube 21 and a diode 22; and a compressor intelligent power module 300 disposed on a substrate 100 to drive a compressor, wherein the compressor intelligent power module 300 includes switching tubes 311 to 316 and a switching tube 311 to 311 to 316. 316 parallel fast recovery diodes 321 to 326; a fan intelligent power module 400 provided on the substrate 100 to drive the fan, the fan intelligent power module 400 includes reverse-conducting IGBTs 411 to 416; a compressor intelligent power module driving the compressor intelligent power module 300 Drive 33, the compressor intelligent power module drive 33 is disposed on the substrate 100 and is connected to the compressor intelligent power module 300; and the fan intelligent power module driver 43, which drives the fan intelligent power module 400, is provided on the substrate Above 100 and connected to the fan intelligent power module 400; among them, rectifier bridge 10, power factor correction device 20, Compressor

intelligent power module

300, 400 under the fan device 7 is provided with an intelligent power module, 5 are connected by a metal wire binding between the copper wiring and copper wiring 7 is connected to the device.

Specifically, as shown in FIG. 12, the insulating layer is adhered to the surface of the second heat sink 70, the copper wiring 43 is located on the surface of the insulating layer, and the power factor correction device 20, the compressor intelligent power module 300, and the fan intelligent power module 400 are related. The bare chip 44 is attached to the surface of the copper wiring 43 and is electrically connected to the copper wiring 43. The metal bonding wire 5 is electrically connected to the bare chip 44 and the copper wiring 43, a high thermal conductive packaging material 51 is filled on the front of the module, and a first heat dissipation plate 60 is connected to the high thermal conductive packaging material 51.

It should be noted that, because the copper wiring 7 is very large relative to the connection pins of the device, the distance between the two copper wirings 7 to be connected can be made larger, so that the metal tie wire 5 forms a small arc.

Further, according to an embodiment of the present invention, as shown in FIG. 3, the device layer 40 further includes a microcontroller 80, the microcontroller 80 is disposed on the substrate 100, and the microcontroller 80 and the compressor intelligent power module The drive 33 is connected to the fan intelligent power module drive 43.

Optionally, the rectifier bridge 10, the power factor correction device 20, the compressor intelligent power module 300, and the fan intelligent power module 400 on the device layer 40 may be disposed on one side of the device layer 40 to form a power device area, that is, a power module, and a compressor. The intelligent power module driver 33 and the fan intelligent power module driver 43 may be disposed on the other side of the device layer 40 to form a control device area, that is, a control module.

Further, as shown in FIG. 5 and FIG. 15, the power module includes a rectifier bridge 10, a PFC switch 22, a compressor intelligent power module 300, and a fan intelligent power module 400. The rectifier bridge 10 includes a diode 11, a diode 12, and a diode 13. Diode 14; PFC switch 22 includes switching tube 21, diode 221, diode 22, and PFC switch driver 223; compressor intelligent power module 300 includes switching tubes 311 to 316, fast recovery diodes 321 to 326, and compressor IPM drive 33; intelligent power for fans The module 400 includes reverse conducting IGBTs 411 to 416 and a fan IPM drive 43.

It can be understood that by integrating the rectifier bridge 10, the power factor correction device 20, the compressor intelligent power module 300, and the fan intelligent power module 400 on the same heat dissipation substrate 100, the power module can reduce the outdoor electrical control board of the electrical appliance 1000. Area, you can also purchase power modules (rectifier bridge 10, power factor correction device 20, compressor intelligent power module 300 and fan intelligent power module 400) for the power module packaging production, further reducing manufacturing costs.

It can be understood that by setting the switching tube 21 and the switching tubes 311 to 316 as a SiC, MOSFET, SiC, IGBT, or GaN HEMT device, the advantages of using a device made of SiC and GaN materials with high switching speed can be reduced. The switching loss of the small power module is conducive to saving power and effectively reducing the heating of the power module.

Further, as shown in FIG. 16, according to an embodiment of the present invention, the highly integrated controller 1000 further includes: a filling layer 50 covering and surrounding the device layer; and a first heat dissipation formed on the filling layer 50.板 60。 Plate 60.

Optionally, the first heat dissipation plate 60 formed on the filling layer 50 may be an aluminum substrate with high thermal conductivity and divided into a back heat dissipation substrate and a front heat dissipation substrate, wherein the first heat dissipation substrate formed on the fill layer 50 The back surface of the heat dissipation plate 60 in the heat dissipation plate 60 is flat to facilitate the installation of additional heat sinks. The filling layer 50 is a material with high thermal conductivity, which provides an insulating environment for the circuit on the one hand, and quickly transfers the heat generated by the device layer 40 to the filling layer. The first heat sink 60 above the layer 50.

That is, the surface of the first heat dissipation plate 60 has heat dissipation folds 61, which can increase the surface area of the first heat dissipation plate 60, thereby speeding up heat exchange with the outside world, and thereby speeding up the heat dissipation of the device layer 40.

Specifically, the highly thermally conductive packaging material 51 is used to protect the copper wiring 7, the bare chip, and the metal bonding wire 5 of the power module from mechanical, moisture, and the like on the one hand, and on the other hand, to rapidly heat the device layer 40 Passed to the first first heat sink 60.

In summary, according to the integrated air-lift controller of the embodiment of the present invention, the copper wiring 7 connected to the device is provided, and the metal wiring 5 is connected to save the device layer occupation volume, thereby reducing the volume of the controller of the electrical appliance 1000. And reduce manufacturing costs.

According to the electrical appliance provided by the embodiment of the present invention, the highly integrated controller of the foregoing embodiment is adopted. The copper wiring connected to the device is provided, and the metal wiring is connected to the device to save the volume occupied by the device layer, thereby reducing the volume of the controller. Reduce manufacturing costs.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Rear "," left "," right "," vertical "," horizontal "," top "," bottom "," inside "," outside "," clockwise "," counterclockwise "," axial " The azimuth or position relationship indicated by ", radial", "circumferential", etc. is based on the azimuth or position relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or suggesting the device or The element must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless specifically defined otherwise.

In the present invention, the terms "installation", "connected", "connected", "fixed" and other terms shall be understood in a broad sense unless otherwise specified and limited, for example, they may be fixed connections or detachable connections Or integrated; it can be mechanical or electrical; it can be directly connected or indirectly connected through an intermediate medium; it can be the internal connection of two elements or the interaction between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

In the present invention, unless explicitly stated and defined otherwise, the first feature "on" or "down" of the second feature may be the first and second features in direct contact, or the first and second features indirectly through an intermediate medium. contact. Moreover, the first feature is "above", "above", and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. The first feature is “below”, “below”, and “below” of the second feature. The first feature may be directly below or obliquely below the second feature, or it may simply indicate that the first feature is less horizontal than the second feature.

In the description of this specification, the description with reference to the terms “one embodiment”, “some embodiments”, “examples”, “specific examples”, or “some examples” and the like means specific features described in conjunction with the embodiments or examples , Structures, materials, or features are included in at least one embodiment or example of the invention. In this specification, the schematic expressions of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. In addition, without any contradiction, those skilled in the art may combine and combine different embodiments or examples and features of the different embodiments or examples described in this specification.

Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limitations on the present invention. Those skilled in the art can interpret the above within the scope of the present invention. Embodiments are subject to change, modification, substitution, and modification.

Claims

A highly integrated controller, comprising:

A substrate having a bonding wire pad and a pin pad thereon;

A rectifier bridge, a power factor correction device, and an intelligent power module, the rectifier bridge, the power factor correction device, and the intelligent power module are disposed on the substrate; between the rectifier bridge and the power factor correction device, The power factor correction device and the intelligent power module are electrically connected through a metal bonding wire, a bonding wire pad, and a copper wiring; wherein the bonding wire pad is disposed adjacent to the pin pad.
The highly integrated controller according to claim 1, wherein the rectifier bridge comprises a plurality of diodes.
The highly integrated controller according to claim 1, wherein the power factor correction device comprises a switch tube, a diode, and a power factor correction switch driver.
The highly integrated controller according to claim 3, wherein the switch of the power factor correction device is SiC MOSFET, SiC IGBT, or GaN HEMT, and the diode of the power factor correction device is a device made of Si material.
The highly integrated controller according to claim 1, wherein the intelligent power module comprises a compressor intelligent power module and a fan intelligent power module.
The highly integrated controller according to claim 5, wherein the compressor intelligent power module comprises a plurality of switch tubes, a plurality of fast recovery diodes and a compressor intelligent power module driver.
The highly integrated controller according to claim 5, wherein the switch of the compressor intelligent power module is SiC, MOSFET, SiC, IGBT, or GaN HEMT, and the fast recovery diode of the compressor intelligent power module is made of Si material.制装置。 Control devices.
The highly integrated controller according to claim 5, wherein the fan intelligent power module comprises a plurality of reverse conducting insulated gate bipolar transistors and a fan intelligent power module drive.
The highly integrated controller according to claim 5, wherein the reverse conducting insulated gate bipolar transistor of the wind turbine intelligent power module is a device made of Si material.
The highly integrated controller according to any one of claims 1 to 9, further comprising:

A microcontroller, which is disposed on the substrate, and the microcontroller is connected to the intelligent power module;

An external inductor, which is disposed between the rectifier bridge and the power factor correction device;

An external capacitor, which is disposed between the power factor correction device and the intelligent power module.
The highly integrated controller according to claim 1, wherein the highly integrated controller is a DIP package.
The highly integrated controller of claim 1, wherein a bottom of the substrate is exposed outside the DIP package.
The highly integrated controller according to claim 1, wherein the rectifier bridge, the power factor correction device, and the intelligent power module are all bare chips, and the driving of the intelligent power module is a die. .
The highly integrated controller according to claim 1, further comprising:

A filling layer covering and surrounding the device layer 40;

A first heat dissipation plate formed on the filling layer;

The first heat dissipation plate above the filling layer has heat dissipation folds.
The highly integrated controller according to claim 15, further comprising:

A second heat sink formed under the substrate.
An electric appliance, comprising the highly integrated controller according to any one of claims 1-15.