WO2006043559A1

WO2006043559A1 - Power supply device for vehicle

Info

Publication number: WO2006043559A1
Application number: PCT/JP2005/019133
Authority: WO
Inventors: Yasuyuki Inada; Masaki Miyairi
Original assignee: Kabushiki Kaisha Toshiba
Priority date: 2004-10-22
Filing date: 2005-10-18
Publication date: 2006-04-27

Abstract

A power supply device for vehicle is provided for preventing an underfloor structure from being complicated even when two power converters are provided and for increasing mounting density of a semiconductor element. On a heat receiving block (21), semiconductor elements (1A, 1B) of the power converters are provided on first and second component attaching planes. Three heat conducting stacks (12A) are integrally provided with a straight heat pipe (8) and a radiating film (9) on the heat receiving block (21). The heat conducting stacks are mounted on a frame.

Description

Specification

Power supply for vehicle

Technical field

TECHNICAL FIELD [0001] The present invention relates to a vehicle power supply device that is installed under a floor of a railway vehicle and supplies electric power for driving the vehicle, and more particularly to a cooling device that cools a semiconductor element group used in the power supply device.

Background art

A power conversion device shown in FIG. 26 is used as a power supply device for a vehicle installed under the floor of a railway vehicle. This power converter includes a three-phase bridge-connected semiconductor switching element (hereinafter abbreviated as a semiconductor element) 1, a phase capacitor 2 connected between each phase AK (anode's power sword), and a DC terminal A circuit having a filter capacitor 3 connected between the PNs converts the DC power input from the railway overhead line to the DC terminal PN into AC power by switching of the semiconductor element 1, and this AC power is converted to the AC terminal UVW. To supply to each device (light, air conditioning, etc.) not shown. The circuit is provided in the semiconductor element cooling unit 4 in order to efficiently remove the heat generated from the semiconductor element 1.

FIG. 27 is a side view partially showing in cross section the configuration of a conventional semiconductor element cooling unit 4 (see, for example, Japanese Patent Laid-Open No. 2003-235112). In FIG. 27, the semiconductor element cooling unit 4 is attached to the box 6 suspended under the floor of the vehicle body 5, and the semiconductor element 1, phase capacitor 2, filter capacitor 3, gate amplifier 7, etc. are in the box 6. The electrical connection between the semiconductor element cooling unit 4 and the box 6 side is also made by connecting both terminals or conductors (not shown) with bolts or the like.

[0004] As shown in FIG. 28A and a front view thereof in FIG. 28A, the semiconductor element 1 has a straight heat pipe 8, a heat radiating fin 9, and a boundary plate 16 through a heat receiving block 21, The heat transfer stack 12 is assembled integrally. That is, the semiconductor element 1 for one phase is mounted on, for example, the front surface of the heat receiving block 21, and the phase capacitor 2 is mounted on the back surface thereof. Each end of the heat receiving block 21 is joined so that a plurality of straight pipe heat pipes 8 protrude substantially in parallel. The straight heat pipe 8 has a predetermined interval in its longitudinal direction. The radiating fins 9 are fitted at. A boundary plate 16 having a packing 17 attached to a circumferentially formed packing guide 19 is fixed to the radiating fin 9a closest to the heat receiving block 21 by waterproofing. Among them, the semiconductor element 1 constitutes the heat generating part 10, the straight pipe heat pipe 8 and the heat radiation fin 9 constitute the heat radiating part 11, and the heat conducting part 10 and the heat radiating part 11 constitute the heat conduction stack 12. .

[0005] As shown in FIG. 29, the semiconductor element cooling unit frame 15 is formed with three mounting windows 18 with the inner edge 15a protruding outward. The heat generating portion 10 of the heat conductive stack 12 is inserted into each of these mounting windows 18 from the vehicle side, and the boundary plate 16 is attached to the semiconductor element cooling unit frame 15 using the mounting holes 20 formed in the boundary plate 16. As a result of the bolting, the packing 17 attached to the boundary plate 16 is pressed by the inner edge portion 15a, and the heat conduction stack 12 is made of semiconductor so as to maintain the water tightness of the boundary with the semiconductor element cooling unit frame 15. While being fixed to the element cooling unit frame 15, the radiating fins 9 are arranged in an open portion outside the box body 6. FIG. 30 is a cross-sectional view taken along the line Y—Y showing this state.

Here, the mounting surface of the semiconductor element cooling unit frame 15 is formed to be inclined as shown in the figure. As a result, the heat generating part 10 side of the straight pipe heat pipe 8 is directed downward, and the refrigerant sealed inside the straight pipe heat pipe 8 evaporates due to the heat generated from the semiconductor element 1 on the heat generating part 10 side, thereby radiating fins. It condenses on the 9th side and dissipates heat to the atmosphere. The condensed refrigerant repeats a cycle of returning to the heating unit 10 side by gravity inside the straight pipe 8. Since the heat dissipating fins 9 dissipate heat to the atmosphere by natural cooling, they are installed almost perpendicularly to the ground, and it is easy for upward airflow to pass through between the heat dissipating fins 9.

[0007] FIGS. 31 to 33 show an example of a semiconductor power conversion device that is installed under the floor of a railway vehicle and performs conversion from direct current alternating current or alternating current to direct current. FIG. 31 shows a power conversion circuit. FIG. 22 is a side sectional view of the semiconductor power converter, and FIG. 33 is a sectional view taken along line AA in FIG.

[0008] This semiconductor power conversion device includes two inverter circuits (power conversion circuits) independent of each other, and each inverter circuit includes six semiconductors connected in a three-phase bridge as shown in FIG. Filter capacitor connected between element 201 and the positive and negative terminals. Have 202 and!

[0009] In this power conversion device, when DC power is input between a DC overhead side terminal P and N from a railway overhead line (not shown), the semiconductor element 201 is converted into AC power by ON / OFF control in a predetermined order. And output from the terminals U, V, W on the AC side and supplied to the motor 203.

In this power conversion device, a semiconductor cooling device for efficiently removing heat generated from the semiconductor element 201 is provided.

[0011] As shown in Figs. 32 and 33, this semiconductor cooling device 204 is partially housed in a box 206 attached to the side edge of the bottom of the vehicle body 205, and has a frame-like boundary. It is fixed to an opening (not shown) formed in the plate 207.

The semiconductor cooling device 204 is provided on one side of the boundary plate 207, accommodates the semiconductor element 201 and the gate amplifier 209 therein, and seals the opening, and the other of the boundary plate 207 And an open portion 211 for dissipating heat.

[0013] In the sealed portion 210, for example, a plate is attached to the bottom of a frame formed of angle steel, and two groups of filter capacitors 202 are respectively mounted on the plate, and are introduced into the box 206. The conductor is connected to the filter capacitor 202!

The semiconductor element 201 is attached to three plate-shaped heat receiving blocks 212 provided for each phase in the sealed portion 10. A semiconductor element 201 constituting one inverter circuit is attached to one surface of each heat receiving block 212, and a semiconductor element 201 constituting the other inverter circuit is attached to the other surface of each heat receiving block 212. The mounting of the semiconductor element 201 is the same for the three phases. In such a structure, the semiconductor element 201 on the central heat receiving block 212 is in a state of facing and close to the semiconductor elements 201 on the heat receiving blocks 212 on both sides.

Each heat receiving block 212 is attached with a heat pipe radiator 213. The heat noise radiator 213 has one end connected to one side of the heat receiving block 212 and a heat pipe 214 protruding toward the opening 211, and a plurality of heat pipes 214 mounted on the heat pipe 214 at intervals in the longitudinal direction. The sheet-like heat radiation fins 215 are provided. The heat pipe 214 passes through the heat radiating fins 215, and each heat radiating fin 215 is fixed in a state of being fitted on the outer peripheral surface of the heat pipe 214! Speak. [0016] The heat pipe radiator 213 is attached so as to be inclined so that the heat receiving block 212 side is downward, and the refrigerant enclosed in the heat pipe 214 is generated in the semiconductor element 201 and is conducted to the heat receiving block 212. It evaporates due to the heat generated and dissipates heat to the atmosphere on the radiating fin 215 side to condense. The condensed refrigerant flows downward in the heat pipe 214 due to gravity and returns to the heat receiving block 212 side. The heat radiation fins 215 dissipate heat to the atmosphere by natural cooling, so that they are installed almost perpendicular to the ground, and an upward airflow is generated between the heat radiation fins 215.

Disclosure of the invention

Problems to be solved by the invention

[0017] Since the above-described conventional vehicle power supply device is provided with one heat conduction stack for each phase of the three-phase bridge-connected semiconductor elements, the vehicle power supply device including a plurality of power conversion devices In this case, a semiconductor element cooling unit has to be installed for each power converter, and there is a problem that the under-floor structure of the vehicle is complicated.

[0018] Further, in a conventional vehicle power supply device, a semiconductor element is mounted on one surface of the heat receiving block, and a phase capacitor is mounted on the other surface. However, recent advances in packaging technology that reduces the inductance component by shortening the wiring or using reciprocating wiring eliminates the need for a phase capacitor connected close to the semiconductor element. Since one side of the lock becomes an empty space and the mounting density is reduced, another semiconductor element of the power conversion device can be configured on the empty space surface to increase the mounting density. At the time of destruction, there is a problem of adversely affecting the other semiconductor element that is not destroyed.

In the semiconductor cooling device provided in such a power supply device, when the semiconductor element 201 constituting one inverter circuit is physically damaged, the debris of the damaged semiconductor element 201 is removed. There is a possibility that the other inverter circuit may be adversely affected by contacting the semiconductor element 201 constituting the other inverter circuit.

[0020] The present invention has been made in consideration of the above points, and an object of the present invention is to provide a vehicle in which destruction of one semiconductor element does not adversely affect the other semiconductor element when two power conversion devices are provided. It is to provide a power supply apparatus. Means for solving the problem

In order to achieve the above object, the present application provides the following first to fifth inventions.

The first invention is

In a power supply device for a vehicle having two power conversion devices, the first and second component mounting surfaces that are in a front-back relationship, and the first and second component mounting surfaces that correspond to the side end surfaces of the first and second component mounting surfaces. 3 component mounting surfaces, the first component mounting surface is equipped with one of the two power conversion devices, and the two component power conversion devices are mounted on the second component mounting surface. The heat receiving block on which one of the other semiconductor elements is mounted and the base end of the heat receiving block are joined so that the third component mounting surface force of the heat receiving block protrudes, and the heat of the heat receiving block is transferred to the tip. Three heat conduction stacks in which the straight heat pipes transported to the heat pipe and the heat radiation fins fitted to the straight pipe heat pipes are integrally assembled, and one heat conduction stack is arranged in the center and the rest A heat transfer stack with one of the heat transfer stacks in the center The first component mounting surfaces face each other with a predetermined spacing, and the second component mounting surfaces are spaced by a predetermined spacing with respect to the heat conductive stack in which the other heat conduction stack is placed in the center. And a frame for mounting three heat conductive stacks so as to face each other.

[0022] The second invention is:

One heat receiving block having first and second element mounting surfaces to which the first and second semiconductor element groups constituting two power conversion circuits independent from each other are mounted; and a heat radiating section connected to the heat receiving block; The first and second element mounting surfaces are provided in the same plane.

[0023] Further, the third invention provides

One heat receiving block having first and second element mounting surfaces to which the first and second semiconductor element groups constituting two power conversion circuits independent from each other are mounted; and a heat radiating section connected to the heat receiving block; The first and second element mounting surfaces are provided so as to have a front-back relationship.

[0024] Further, the fourth invention provides

The first and second semiconductor element groups constituting two power conversion circuits independent of each other are A semiconductor cooling device comprising a plurality of heat receiving blocks having first and second element mounting surfaces to be attached, and a heat radiating portion connected to each of the heat receiving blocks, wherein the plurality of heat receiving blocks are the first heat receiving blocks. These element mounting surfaces or the second element mounting surfaces are arranged so as to face each other.

[0025] Further, the fifth invention provides:

A plurality of heat receiving blocks having first and second element mounting surfaces to which the first and second semiconductor element groups constituting two power conversion circuits independent of each other are mounted, and a heat radiating portion connected to each of the heat receiving blocks The plurality of heat receiving blocks are provided so that the first and second element mounting surfaces are in a front-back relationship, and the first element mounting surface and the first The semiconductor element on the first element mounting surface and the semiconductor element on the second element mounting surface are disposed between the two adjacent heat receiving blocks. It is characterized by the provision of a collision prevention member that prevents collision!

The invention's effect

[0026] With the configuration described above, when two power conversion devices are provided, a vehicle power supply device is provided in which destruction of one semiconductor element does not adversely affect the other semiconductor element.

[0027] According to the present invention, when a semiconductor element constituting one power conversion circuit is physically damaged, the debris of the damaged semiconductor element may come into contact with the semiconductor element constituting another power conversion circuit. Therefore, other power conversion circuits are not adversely affected.

Brief Description of Drawings

FIG. 1 is an electric circuit diagram of Embodiment 1 of the present invention.

FIG. 2 is a side view partially showing a storage state of the power conversion device constituting Embodiment 1 in cross section.

FIG. 3A is a side view of a heat conductive stack constituting Embodiment 1.

FIG. 3B is a front view of a heat conductive stack constituting Embodiment 1.

FIG. 4 is a cross-sectional view showing a mounted state of three heat conductive stacks constituting Embodiment 1.

FIG. 5 is a partial cross-sectional view showing a specific mounting structure of a heat conductive stack constituting Embodiment 1. FIG. 6 is a front view of the semiconductor cooling device according to the second embodiment of the present invention.

_7] a plan view of a semiconductor cooling device of Figure _6.

FIG. 8] Right side of the semiconductor cooling device in FIG.

FIG. 9 is a front view of the semiconductor cooling device according to the third embodiment of the present invention.

FIG. 10 is a plan view of the semiconductor cooling device of FIG.

[11] Right side view of the semiconductor cooling device of FIG.

FIG. 12 is a front view of a semiconductor cooling device according to Embodiment 4 of the present invention.

FIG. 13 is a left side view of the semiconductor cooling device of FIG.

FIG. 14 is a front view of a semiconductor cooling device according to Embodiment 5 of the present invention.

FIG. 15 is a left side view of the semiconductor cooling device of FIG.

FIG. 16 is a front view of a semiconductor cooling device according to Embodiment 6 of the present invention.

圆 17] Right side view of the semiconductor cooling device of FIG.

FIG. 18 is a front view of a semiconductor cooling device according to Embodiment 7 of the present invention.

圆 19] Right side view of the semiconductor cooling device of FIG.

FIG. 20 is a front view of a semiconductor cooling device according to an eighth embodiment of the present invention.

FIG. 21 is a right side view of the semiconductor cooling device of FIG.

FIG. 22 is a plan view of the semiconductor cooling device of FIG.

圆 23] A front view of the semiconductor cooling device of Embodiment 9 of the present invention.

FIG. 24 is a right side view of the semiconductor cooling device of FIG.

FIG. 25 is a plan view of the semiconductor cooling device of FIG.

FIG. 26 is an electric circuit diagram showing a configuration of a power conversion device in a conventional device.

FIG. 27 is a side view partially showing a storage state of a power conversion device constituting a conventional device.

| ¾ |

FIG. 28A] A side view of a heat conductive stack in a conventional apparatus.

FIG. 28B] Front view of a heat conduction stack in a conventional apparatus.

FIG. 29 is a side view showing a configuration of a semiconductor element cooling unit frame in a conventional apparatus. FIG. 30 is a cross-sectional view showing a mounted state of three heat conductive stacks in a conventional device.

FIG. 31 is a configuration diagram of a power conversion circuit of a conventional semiconductor cooling device. FIG. 32 is a side sectional view of a conventional semiconductor power conversion device.

FIG. 33 is a sectional view taken along line AA in FIG.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, the present invention will be described in detail based on a preferred embodiment shown in the drawings.

FIG. 1 is an electric circuit diagram of Embodiment 1 of the present invention, in which DC power input to DC terminals PI and N1 is converted into three-phase AC power and supplied to devices (not shown) such as air conditioners. The power conversion device 30A and the power conversion device 30B that converts the DC power input to the DC terminals P2 and N2 into three-phase AC power and supplies it to each device (not shown) (air conditioning etc.) are the semiconductor element cooling unit 4 is provided.

[0030] Of these, the power conversion device 30A is connected to the DC capacitors PI and N1, and the filter capacitor 3A is connected to a three-phase bridge, the DC side is connected to the DC terminals PI and N1, and the AC side is shown in the figure. It consists of six semiconductor elements 1A connected to each omitted device (air conditioner, etc.). Similarly, the power conversion device 30B includes a filter capacitor 3B connected to the DC terminals P2 and N2, a three-phase bridge connection, and its DC side is connected to the DC terminals P2 and N2, and the AC side is not shown. It consists of six semiconductor elements 1B connected to equipment (air conditioning, etc.).

FIG. 2 is a side view partially showing a cross-sectional view of a configuration example of the semiconductor element cooling unit 4 in which the power conversion devices 30A and 30B are provided. In this embodiment, instead of the heat conduction stack 12 of the conventional device, a heat conduction stack 12A in which semiconductor elements are mounted on both sides of the front and back are incorporated and fixed in the semiconductor element cooling unit frame 15, and the conventional device. In this embodiment, only the filter capacitor 3 is mounted, but in this embodiment, both the filter capacitors 3A and 3B are mounted in the semiconductor element cooling unit 4.

Are configured identically.

[0032] FIG. 3A is a side view of the heat conductive stack 12A, and FIG. 3B is a front view thereof. In this heat transfer stack 12A, the semiconductor component 1A for one phase of the power conversion device 30A is mounted on the first component mounting surface of the heat receiving block 21 that has a front / back relationship, and the power conversion is performed on the second component mounting surface. The semiconductor element 1B for one phase of the device 30B is mounted. The first and second parts are removed. A point at which each end is joined so that a plurality of straight pipe heat pipes 8 protrude substantially parallel to the third component mounting surface, which is a side end face with respect to the attached surface, and a predetermined interval in the longitudinal direction of the straight pipe heat pipe 8 The point where the heat sink fins 9 are fitted and the boundary plate 16 with the packing 17 attached to the circumferentially formed packing guide 19 is fixed to the heat sink fins 9a closest to the heat receiving block 21 with waterproofing. Is configured identically to the conventional heat conduction stack 12.

[0033] A total of three heat conduction stacks 12A described above are assembled corresponding to the U, V, and W phases, and each heat generating portion 10 is attached to the mounting window 18 (see FIG. 29) of the semiconductor element cooling unit frame 15. Although it is fixed to the boundary plate 16 in the inserted state, the state is different from the conventional device.

FIG. 4 is a cross-sectional view taken along arrows Y—Y showing a state in which the three heat conductive stacks 12A are fixed. Here, the three heat conduction stacks 12A are configured so that the component mounting surfaces of the heat receiving block 21 are parallel to each other, and are arranged and fixed so as to maintain a predetermined fixed interval. The remaining heat conduction stack 12A is fixed so that the first component mounting surfaces face each other, and the other heat conduction stack 12A is fixed so that the second component mounting surfaces face each other. Has been. As a result, the two-phase semiconductor elements 1A constituting the power conversion device 30A face each other, the remaining one-phase semiconductor elements 1A face outward, and similarly, the two-phase semiconductors constituting the power conversion device 30B The elements 1B face each other and the remaining one-phase semiconductor element 1B faces outward, and the semiconductor element 1A and the semiconductor element 1B are separated from each other by the heat receiving block 21.

As a result, even when the semiconductor element 1A constituting the power conversion device 30A is physically damaged, the influence on the semiconductor element 1B can be reduced. Similarly, the semiconductor constituting the power conversion device 30B can be reduced. Even if the element 1B is physically damaged, the influence on the semiconductor element 1A can be reduced.Therefore, even if one of the power converters 30A and 30B is damaged, the other element is adversely affected. Almost no effect.

FIG. 5 is a partial cross-sectional view showing a specific mounting structure in which the semiconductor elements 1 A and 1 B are attached to the heat receiving block 21 in the heat conducting stack 12 A, and a through-hole formed in the heat receiving block 21. Using the holes, the semiconductor elements 1A and 1B are fastened together with bolts 23 and fixed. As a result, the number of bolts for mounting the semiconductor elements 1A and 1B can be reduced, and the number of bolt mounting steps can be reduced. [0037] According to the first embodiment, even when two power conversion devices are provided, the semiconductor elements for one phase of either one of the power conversion devices are mounted on the first component mounting surface of the heat receiving block, Since the semiconductor element for one phase of the other power converter is mounted on the second component mounting surface of the heat receiving block, it is possible to suppress the complexity of the underfloor structure and increase the mounting density of the semiconductor elements.

[0038] Of the three heat conduction stacks arranged side by side, the remaining one of the heat conduction stacks is opposed to the first component mounting surface with respect to the heat conduction stack arranged at the center. Since the other heat conduction stack is fixed so that the mounting surfaces of the second parts face each other, even if element destruction occurs in one of the two power converters, it will adversely affect the other Therefore, reliability can be improved.

[0039] Furthermore, by fixing the semiconductor elements respectively arranged on the front and back using the through holes formed in the heat receiving block with a common fastener, it is possible to reduce the materials used and the number of man-hours. The effect is also obtained.

6 is a front view of the semiconductor cooling device according to the second embodiment of the present invention, FIG. 7 is a plan view of the semiconductor cooling device of FIG. 1, and FIG. 8 is a right side view of the semiconductor cooling device of FIG. It is.

[0041] As shown in FIG. 6, in the second embodiment, one surface of one heat receiving block 62 that is formed in a plate shape and arranged substantially perpendicular to the ground is an element mounting surface of two inverter circuits. It is said that. That is, the first element mounting surface 62a is on the left side and the second element mounting surface 62b is on the right side with a center line C.L that vertically cuts one surface of the heat receiving block.

[0042] A first semiconductor element group G1 composed of six semiconductor elements 51 corresponding to the U, V, and W phases of one inverter circuit is attached to the first element mounting surface 62a, and the second element A second semiconductor element group G2 having six semiconductor elements 51 corresponding to the U, V, and W phases of the other inverter circuit is attached to the attachment surface 62b.

In addition, a large number of plate-like heat radiating fins 65 are vertically attached to the other surface of the heat receiving block 62 at regular intervals in the lateral direction.

[0044] Thus, by mounting all the semiconductor elements 51 constituting the two inverter circuits on the same plane, even if the semiconductor element 51 of one inverter circuit is physically damaged, the other The semiconductor element 51 of the inverter circuit is not affected. Next, Embodiment 3 of the present invention will be described. 9 is a front view of the semiconductor cooling device according to the third embodiment of the present invention, FIG. 10 is a plan view of the semiconductor cooling device of FIG. 9, and FIG. 11 is a right side view of the semiconductor cooling device of FIG.

As shown in FIG. 9, in the third embodiment, one surface of one heat receiving block 62 that is formed in a plate shape and arranged substantially perpendicular to the ground is an element mounting surface of two inverter circuits. It is said that. That is, the upper side is the first element mounting surface 62a and the lower side is the second element mounting surface 62b, with a center line C.L crossing one surface of the heat receiving block 62 as a boundary.

[0047] A first semiconductor element group G1 composed of six semiconductor elements 51 corresponding to the U, V, and W phases of one inverter circuit is attached to the first element mounting surface 62a, and the second element A second semiconductor element group G2 having six semiconductor elements 51 corresponding to the U, V, and W phases of the other inverter circuit is attached to the attachment surface 62b.

[0048] On the other surface of the heat receiving block 62, a large number of plate-like radiating fins 65 are vertically attached at regular intervals in the lateral direction.

[0049] Thus, by mounting all the semiconductor elements 51 constituting the two inverter circuits in the same plane, even if the semiconductor element 51 of one inverter circuit is physically damaged, the other The semiconductor element 51 of the inverter circuit is not affected.

[0050] Next, Embodiment 4 of the present invention will be described. FIG. 12 is a front view of the semiconductor cooling device according to the fourth embodiment of the present invention, and FIG. 13 is a left side view of the semiconductor cooling device of FIG.

As shown in FIG. 12, in the fourth embodiment, one surface of one heat receiving block 62 that is formed in a plate shape and is arranged substantially perpendicular to the ground is the first element mounting surface 62a. The six semiconductor elements 51 constituting the first semiconductor element group G1 are attached, and the other surface of the heat receiving block 62 is used as the second element attachment surface 62b. Six semiconductor elements 51 to be configured are attached.

[0052] Further, one end of a heat pipe 64 formed in a substantially L-shape is attached to one side surface of the heat receiving block 62, and a plurality of plate-like radiating fins 65 are axially disposed on the other end side of the heat pipe 64. Are attached at intervals.

[0053] In this way, all the semiconductor elements 51 constituting one inverter circuit are attached to one surface of the heat receiving block 62, and the other inverter circuit is constructed on the other surface on the back side. Since all the semiconductor elements 51 to be attached are attached, even if the semiconductor element 51 of one inverter circuit is physically damaged, the semiconductor element 51 of the other inverter circuit is not affected.

Next, Embodiment 5 of the present invention will be described. FIG. 14 is a front view of the semiconductor cooling device of Embodiment 5 of the present invention, and FIG. 15 is a left side view of the semiconductor cooling device of FIG.

As shown in FIG. 14, in the fifth embodiment, the outer surface of one side wall of one heat receiving block 62 formed in the shape of a rectangular tube is defined as a first element mounting surface 62a, and the first semiconductor element group Six semiconductor elements 51 constituting G1 are attached, and the outer surface of the other side wall on the back side is set as a second element attachment face 62b, and the six semiconductor elements 51 constituting the second semiconductor element group G2 Is attached.

In addition, a plurality of plate-like radiating fins 65 extending in the longitudinal direction are provided horizontally and vertically spaced inside the heat receiving block 62, and each radiating fin 65 is provided on both side walls of the heat receiving block 62. Connected between the inner surfaces of. Reference numeral 66 denotes a cooling fan that blows cooling air toward the inside of the heat receiving block 62 and promotes heat radiation by the heat radiation fins 65.

In this way, all the semiconductor elements 51 constituting one inverter circuit are attached to the outer surface of one side wall of the heat receiving block 62, and the other inverter circuit is constituted on the outer surface of the other side wall on the back side. By attaching all the semiconductor elements 51, even if the semiconductor element 51 of one inverter circuit is physically damaged, the semiconductor element 51 of the other inverter circuit is not affected. In addition, heat is also transmitted to both sides of the heat dissipating fin 65, so that heat can be dissipated efficiently.

Next, Embodiment 6 of the present invention will be described. FIG. 16 is a front view of the semiconductor cooling device according to the sixth embodiment of the present invention, and FIG. 17 is a right side view of the semiconductor cooling device of FIG.

[0059] As shown in FIGS. 16 and 17, the sixth embodiment includes a pair of upper and lower heat receiving blocks 62 that are formed in a plate shape and are inclined with respect to the ground. The lower surface of the block 62 and the upper surface of the lower heat receiving block 62 serve as the first element mounting surface 62a, and the first semiconductor element group G1 is mounted and arranged so as to face each other. . In addition, the upper surface of the upper heat receiving block 62 and the lower surface of the lower heat receiving block 62 are used as the second element mounting surface 62b to mount the second semiconductor element group G2. It is

[0060] One end of the straight-shaft heat pipe 64 is attached to one side surface of the heat receiving block 62 and protrudes obliquely upward, and a plurality of plate-like heat radiating fins 6 5 are provided on the heat pipe 64. Are attached at intervals in the axial direction.

In this way, all the semiconductor elements 51 constituting one inverter circuit are attached to the mutually opposing surfaces of the pair of heat receiving blocks 62, and all the semiconductor elements 51 constituting the other inverter circuit are provided on the back surface thereof. As a result, the semiconductor element 51 of one inverter circuit is not affected even if the semiconductor element 51 of one inverter circuit is physically damaged.

[0062] A cooler composed of the heat receiving block 62 and the radiation fin 65 may be provided separately for each of the U, V, and W phases. There is an advantage that assembly workability is improved.

[0063] Next, Embodiment 7 of the present invention will be described. 18 is a front view of the semiconductor cooling device according to the seventh embodiment of the present invention, and FIG. 19 is a right side view of the semiconductor cooling device of FIG.

As shown in FIGS. 18 and 19, in Embodiment 7, the upper surface of one heat receiving block 62 that is formed in a plate shape and is inclined with respect to the ground is the first element. The first semiconductor element group G1 is attached as the mounting surface 62a, and the lower surface of the heat receiving block 62 is used as the second element attachment surface 62b, and the second semiconductor element group G2 is attached.

In addition, one end of the straight-axis heat pipe 64 is attached to one side surface of the heat receiving block 62 and protrudes obliquely upward, and a plurality of plate-like heat radiation fins 6 5 are projected on the heat pipe 64. Are attached at intervals in the axial direction.

[0066] In this way, all the semiconductor elements 51 constituting one inverter circuit are attached to one surface of one heat receiving block 62, and all the semiconductor elements 51 constituting the other inverter circuit are arranged on the back surface thereof. As a result of mounting, even if the semiconductor element 51 of one inverter circuit is physically damaged, the semiconductor element 51 of the other inverter circuit is not affected.

Next, Embodiment 8 of the present invention will be described. 20 is a front view of the semiconductor cooling device according to the eighth embodiment of the present invention, FIG. 21 is a right side view of the semiconductor cooling device of FIG. 20, and FIG. 22 is a semiconductor of FIG. It is a top view of a body cooling device.

[0068] As shown in these drawings, the eighth embodiment includes a plurality of heat receiving blocks 62 that are formed in a plate shape and are arranged perpendicular to the ground. Each heat receiving block 62 has one surface serving as the first element mounting surface 62a and two semiconductor elements 51 constituting the first semiconductor element group G1 are mounted, and the other surface is the second element mounting surface. Two semiconductor elements 51, which are 62b and constitute the second semiconductor element group G2, are attached.

[0069] Each heat receiving block 62 is arranged in parallel with a distance so that the first element mounting surface 62a and the second element mounting surface 62b face each other. A metal conductor 67 having a U-shaped cross section is fixed to the surface of each semiconductor element 51 by bonding or the like, and the surfaces of the two adjacent semiconductor elements 51 straddle between them. Thus, a U-shaped conductor 68 having a U-shaped cross section is fixed by bonding or the like. These conductors 67 and 68 are for supplying voltage to the power conversion circuit, and the rigidity is increased by bending the metal plate or increasing the thickness.

[0070] Further, one end of the straight-axis heat pipe 64 is attached to one side surface of the heat receiving block 62 and protrudes obliquely upward, and a plurality of plate-like heat radiation fins 6 5 are projected on the heat pipe 64. Are attached at intervals in the axial direction.

[0071] Thus, by attaching the conductors 67 and 68 on the two semiconductor elements 51 on both surfaces of each heat receiving block 62, the semiconductor element 51 and the second element on the first element mounting surface 62a Since it is possible to prevent the semiconductor element 51 on the mounting surface 62b from colliding, even if the semiconductor element 51 of one inverter circuit is physically damaged, the semiconductor element 51 of the other inverter circuit may be affected. Wow!

Next, Embodiment 9 of the present invention will be described. 23 is a front view of the semiconductor cooling device according to the ninth embodiment of the present invention, FIG. 24 is a right side view of the semiconductor cooling device of FIG. 23, and FIG. 25 is a plan view of the semiconductor cooling device of FIG.

[0073] As shown in these drawings, the ninth embodiment includes a plurality of heat receiving blocks 62 that are formed in a plate shape and are arranged perpendicular to the ground. Each heat receiving block 62 has one surface serving as the first element mounting surface 62a and two semiconductor elements 51 constituting the first semiconductor element group G1 are mounted, and the other surface is the second element mounting surface. 62b and second semiconductor Two semiconductor elements 51 constituting the element group G2 are attached.

[0074] Each heat receiving block 62 is arranged in parallel with a distance so that the first element mounting surface 62a and the second element mounting surface 62b face each other. A partition wall 69 is installed between two adjacent heat receiving blocks 62.

[0075] Further, one end of the straight-axis heat pipe 64 is attached to one side surface of the heat receiving block 62 and protrudes obliquely upward, and a plurality of plate-like heat radiating fins 6 are provided on the heat pipe 64.

5 are attached at intervals in the axial direction.

Thus, by providing the partition wall 19 between two adjacent heat receiving blocks 62, the semiconductor element 51 on the first element mounting surface 62a and the semiconductor element 51 on the second element mounting surface 62b Since collision can be prevented, even when the semiconductor element 51 of one inverter circuit is physically damaged, the semiconductor element 51 of the other inverter circuit is not affected.

Claims

The scope of the claims

[1] In a vehicle power supply device equipped with two power conversion devices,

There are first and second component mounting surfaces that are front and back, and a third component mounting surface that is a side end surface with respect to the first and second component mounting surfaces. A semiconductor switching element for one phase of either one of the two power converters is mounted, and a semiconductor switching element for one phase of the other of the two power converters is mounted on the second component mounting surface. And a straight pipe heat that transports the heat of the heat receiving block to the distal end portion with the base end joined to the heat receiving block so as to protrude from the third component mounting surface force of the heat receiving block. The pipe and the heat radiating fins fitted to the straight pipe heat pipe are assembled together.

Three heat conduction stacks created,

One of the heat conductive stacks is disposed in the center, and the first component mounting surfaces face each other with a predetermined distance from the heat conductive stack in which one of the remaining heat conductive stacks is disposed in the center, and the remaining A frame for mounting the three heat conductive stacks so that the second component mounting surfaces face each other with a predetermined distance from the heat conductive stack in which the other one of the heat conductive stacks is disposed in the center;

A power supply device for a vehicle, comprising:

[2] In the vehicle power supply device according to claim 1,

The semiconductor switching element mounted on the first component mounting surface of the heat receiving block and the semiconductor switching element mounted on the second component mounting surface have through holes formed in the heat receiving block. A power supply device for a vehicle characterized by being shared and fixed.

[3] One heat receiving block having first and second element mounting surfaces to which the first and second semiconductor element groups constituting two power conversion circuits independent from each other are mounted, and connected to the heat receiving block A semiconductor cooling device comprising a heat dissipating part, wherein the first and second element mounting surfaces are provided in the same plane.

[4] One heat receiving block having first and second element mounting surfaces to which the first and second semiconductor element groups constituting two power conversion circuits independent from each other are mounted; and the heat receiving block A semiconductor cooling device comprising a heat radiating portion connected to a block, wherein the first and second element mounting surfaces are provided in a front-back relationship.

[5] The semiconductor cooling device according to claim 4,

The heat receiving block is formed in a rectangular tube shape, and the outer surface of one side wall thereof is the first element mounting surface, and the outer surface of the side wall opposite to the side wall is the second element mounting surface. Is a semiconductor cooling device characterized in that a fin force connected between the inner surfaces of both side walls is formed.

[6] A plurality of heat receiving blocks having first and second element mounting surfaces to which the first and second semiconductor element groups constituting two power conversion circuits independent from each other are mounted, and connected to each of the heat receiving blocks The plurality of heat receiving blocks are arranged such that the first element mounting surfaces or the second element mounting surfaces are opposed to each other. A semiconductor cooling device.

[7] The semiconductor cooling device according to claim 6,

A semiconductor cooling device characterized in that a cooler comprising the heat receiving block and the heat radiating portion is provided for each phase.

[8] A plurality of heat receiving blocks having first and second element mounting surfaces to which the first and second semiconductor element groups constituting two power conversion circuits independent of each other are mounted, and connected to each of the heat receiving blocks The plurality of heat receiving blocks are provided so that the first and second element mounting surfaces are in a front-back relationship and the first element mounting surface And the second element mounting surface are arranged so as to be opposed to each other, and between the two adjacent heat receiving blocks, the semiconductor element on the first element mounting surface and the semiconductor on the second element mounting surface A semiconductor cooling device comprising a collision prevention member for preventing collision with an element.

[9] The semiconductor cooling device according to claim 8,

The semiconductor cooling device, wherein the collision preventing member also serves as a conductor for supplying a voltage to the power conversion circuit.