WO2001018567A9 - Optoelectronic connector system - Google Patents
Optoelectronic connector systemInfo
- Publication number
- WO2001018567A9 WO2001018567A9 PCT/US2000/024134 US0024134W WO0118567A9 WO 2001018567 A9 WO2001018567 A9 WO 2001018567A9 US 0024134 W US0024134 W US 0024134W WO 0118567 A9 WO0118567 A9 WO 0118567A9
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- focal plane
- detectors
- emitters
- optical
- light
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68359—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
Definitions
- This invention relates to optical communication systems and more particularly to a fiber optic cable and transceiver connector system utilizing a coherent bundle of optical fibers, or image guide.
- Optical couplers are now used to communicate optical signals over short and long distances between, for example, two computers, two circuit boards in one
- Increasing the data transfer rate can be done in any of several ways. Originally, the scheme used was to increase the number of data transfer lines, i.e., transfer the data in parallel. The historical progression according to this scheme has been in powers of
- processor speeds in excess of 400 MHz are common and processors with speeds in excess of 1GHz are in the offing.
- An optical transmitter-receiver module typically includes both light emitting devices such as vertical cavity surface emitting lasers (NCSELS) and light
- Such a module may include separate chips, or more typically, the VCSELS and the photodiodes are grown on the same substrate. See U.S. Patent No. 5,978,401 incorporated herein by this reference.
- Driver-receiver circuitry modules typically in the form of ASIC chips, include driver circuitry which receives electrical signals from one electronic device and which, in response, drives the VCSELS accordingly.
- the ASIC also include receiver circuitry for receiving signals from the photodiodes and, in response, which processes those electrical signals providing an appropriate output to the associated electronic device.
- optical transceiver typically called an optical transceiver.
- One way to hybridize the VCSELS and the photodiodes and the ASIC receiver circuitry is by flip-chip bonding. See U.S. Patent No. 5,858,814, incorporated herein by this reference.
- a fiber optic cable then has one end connected to one transceiver and the other end connected to another transceiver via optical connectors.
- optical fiber bundle to the arrays, accommodating for the circuitry and wiring electrically connecting the arrays to other circuitry, keeping the arrays clean, manufacturing studies to insure that the cost of such couplers is not prohibitive and that they are not unduly complex, and insuring that when the coupler is removed from its transceiver, laser light emitted by the arrays of the transceiver does not harm the eyes of personnel in close proximity to the transceiver.
- One of the problems with transmission of optical data signals from an array of sources through fiber-optic strands is that it requires a time consuming and costly coupling of both the sources and the detectors to the ends of the fiber-optic strands. That is, it requires a precise physical alignment of the ends of the fiber-optic strands with both the sources and the detectors. With multiple parallel paths, the alignment of the emitter and the fiber optic strands can become both time consuming and costly.
- the method and apparatus described in this disclosure enables many more bits per channel compared to a traditional system, and the system can operate at far lower power due to lower capacitance.
- an apparatus is described that allows more than 1000 bits per channel.
- the current invention has the advantage of providing a fully integrated, bidirectional, low loss, and very wide optoelectronic bus architecture utilizing a single
- Another advantage of the present invention is the ability to simultaneously connect millions of parallel channels of data.
- Traditional interconnect techniques are generally limited to hundreds of simultaneous connections, at most.
- the present invention represents an order of magnitude increase in connection density.
- microlenses to pre-focus the emitter output reduces dispersion and therefore losses through the interconnect and helps ensure coherent optical transmission from emitter to detector.
- This invention features an optical transceiver system including a plurality of transceiver nodes each including at least one two-dimensional, integrated circuit array of optical emitters and detectors mounted on an ASIC drive circuit and forming an optical focal plane.
- a lens or light collimator is mounted adjacent each focal plane for directing light to and from the individual emitters and detectors of the respective focal
- At least one fiber optic bundle is
- the fiber optic bundle has two distal ends each of which is positioned to convey light through a lens or collimator of a separate array focal plane.
- the emitters and detectors are integrated devices fabricated by different processes and have different device heights.
- the emitters and detectors are integrated devices fabricated by different processes and have different device heights.
- detectors are mounted adjacently on each ASIC drive circuit to have a common height
- Fig. 1 is a side elevational view of an integrated circuit with emitters and
- Figs. 2 A and 2B are representative of the uncollimated output of an emitter and the collimated output of an emitter, respectively;
- Fig. 3 is a side view of an array of emitters and detectors on a substrate, used in bidirectional connections;
- Fig. 4 is a schematic side view of an optoelectronic connector system according to the present invention.
- Figs. 5 A and 5B are side and top views, respectively, of a portion of a connector system according to the present invention showing an epoxy standoff;
- Fig. 6 is a side view of a CMOS substrate with face plate attached to a ceramic electrical package
- Fig. 7 is the assembly of Fig 6 with an optical connector base attached
- Fig. 8 is a side view of the image guides, mounted in a mating connector, in proximity of, but not connected to, the optical connector base;
- Fig. 9 is a side view of Fig. 8 with the mating connectors mated to the optical connectors;
- Fig. 10 is a side view of the mated assembly of Fig. 9 with a snap connector to
- FIGS. 11 A and 1 IB are side views of a simplified connector according to the present invention in unconnected and connected positions, respectively.
- an optoelectronic device 10 consisting of a silicon substrate 12. On the upper surface of substrate 12, alternating detectors 16 and laser emitters 18 are attached with epoxy filler 20 therebetween. Each emitter has a means for electrical connectivity embedded in the chip and connected to the chip
- Typical emitters may be 10 ⁇ m in size, constructed on 125 ⁇ m
- a detector array is constructed using detectors 50 ⁇ m in size, spaced
- an array of emitters 32 and detectors 34 are attached to substrate 30.
- Fig. 2A where emitter 22 produces uncollimated light 24.
- lens 26 can be used to produce collimated light 28. This is useful for transmission both through free space through fiber optic media.
- the present invention also utilizes a coherent bundle of optical fibers, called an image guide 40, as a transmission medium for digital optical
- the present invention utilizes an image guide to transmit digital data from an array of emitters 42 on one chip to a corresponding geometrically similar array of detectors 44
- the image guide can be arranged so that the number of fibers is equal to the number of emitters and detectors or can be such that the number of fibers
- this plate can consist of a coherent bundle of fibers, a very short image guide, which does not collimate the light,
- Plate 46 can contain a mixture of microlenses and fiber guides. For simplicity, the examples
- plate 46 is interposed between the CMOS substrate containing the devices and the image guide that transmits the optical signals from emitters 42 to detectors 44.
- plate 46 is attached to an epoxy standoff 52 surrounding the periphery of the array of devices (not shown) on substrate 50.
- standoff 52 maintains plate 46 at a height of 50 ⁇ m, and surrounds and
- the 50 ⁇ m distance is chosen to provide adequate protection for the wafer during the
- connection process In practice the smallest distance that would still protect the arrays
- wafer 60 is mounted in a conventional ceramic electrical package 64, as shown in Fig. 6. Note that this ceramic electrical package can also consist of a flexible
- optical connectors 66 The base of optical connectors 66 is then attached to ceramic electrical package 64, Fig. 7.
- the image guides 68, mounted in mating connectors 70, are plugged into optical connectors 66 mounted on ceramic electrical package 64, as shown in Figs. 8 and 9.
- snap connector 72 is utilized to hold the entire assembly together, as shown in Fig. 10.
- the two optical pieces depicted in Figs. 7, 8, and 9 could include all of the hardware that is required to 'snap' the pieces together, as is
- connector 80 includes the functionality of mating connectors 70 and snap connector 72 as shown in Fig. 10.
- the embodiment of the preceding example provides for a "daisy chain" arrangement of connections such as one might find in a ring network topology.
- a single bi-directional array would be connected to another single array.
- An arbitrary number of devices can be connected together similarly.
- more than two fiber bundles could be attached to a single array via the same approach allowing star networks and other more complex topologies.
- the image guide can be directly, permanently attached to the emitter/detector array. In this case, only electrical connections must be made.
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU22467/01A AU2246701A (en) | 1999-09-03 | 2000-09-01 | Optoelectronic connector system |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15221399P | 1999-09-03 | 1999-09-03 | |
US15224499P | 1999-09-03 | 1999-09-03 | |
US60/152,213 | 1999-09-03 | ||
US60/152,244 | 1999-09-03 | ||
US15916599P | 1999-10-13 | 1999-10-13 | |
US60/159,165 | 1999-10-13 | ||
US22907300P | 2000-08-30 | 2000-08-30 | |
US60/229,073 | 2000-08-30 |
Publications (4)
Publication Number | Publication Date |
---|---|
WO2001018567A2 WO2001018567A2 (en) | 2001-03-15 |
WO2001018567A3 WO2001018567A3 (en) | 2002-01-24 |
WO2001018567A8 WO2001018567A8 (en) | 2002-05-30 |
WO2001018567A9 true WO2001018567A9 (en) | 2002-09-12 |
Family
ID=27496008
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/024134 WO2001018567A2 (en) | 1999-09-03 | 2000-09-01 | Optoelectronic connector system |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU2246701A (en) |
WO (1) | WO2001018567A2 (en) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4862231A (en) * | 1983-11-18 | 1989-08-29 | Harris Corporation | Non-contact I/O signal transmission in integrated circuit packaging |
DE3910710A1 (en) * | 1989-04-03 | 1990-10-04 | Standard Elektrik Lorenz Ag | OPTICAL-ELECTRICAL MULTIPLE CONNECTION |
US5119451A (en) * | 1990-12-31 | 1992-06-02 | Texas Instruments Incorporated | Optical waveguides as interconnects from integrated circuit to integrated circuit and packaging method using same |
JPH0588028A (en) * | 1991-09-27 | 1993-04-09 | Fujikura Ltd | Surface mount type optical integrated circuit and its manufacture |
US5605856A (en) * | 1995-03-14 | 1997-02-25 | University Of North Carolina | Method for designing an electronic integrated circuit with optical inputs and outputs |
US6052498A (en) * | 1997-12-19 | 2000-04-18 | Intel Corporation | Method and apparatus providing an optical input/output bus through the back side of an integrated circuit die |
-
2000
- 2000-09-01 WO PCT/US2000/024134 patent/WO2001018567A2/en active Application Filing
- 2000-09-01 AU AU22467/01A patent/AU2246701A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2001018567A2 (en) | 2001-03-15 |
WO2001018567A8 (en) | 2002-05-30 |
WO2001018567A3 (en) | 2002-01-24 |
AU2246701A (en) | 2001-04-10 |
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