WO2000059715A1

WO2000059715A1 - Multi functional electrically and thermally conductive adhesive tape

Info

Publication number: WO2000059715A1
Application number: PCT/US1999/014690
Authority: WO
Inventors: David Lin
Original assignee: Four Pillars Enterprise Corp.
Priority date: 1999-04-05
Filing date: 1999-06-29
Publication date: 2000-10-12
Also published as: CN1303329A; GB2353740A; CN1123440C; GB0028271D0; TW442554B; JP2002541268A

Abstract

A multi-functional electrically and thermally conductive adhesive tape is described. The adhesive tape (32) at least has the following structures: a complex structure or a single structure having a plurality of protuberant holes or concavities (210) extended from one side of the complex structure or the single structure. Adhesive material (204) is coated on both sides or a single side of the complex structure or the single structure, wherein the adhesive layer (204) is an electrically and thermally conductive layer or an electrically non-conductive layer. The electrically non-conductive adhesive layer, depending on the practical application, can be chosen from any kind of adhesive material. The electrically conductive adhesive layer can be chosen from any kind of adhesive material doped with electrically and thermally conductive dopants.

Description

-MULTI FUNCTIONAL ELECTRICALLY AND THERMALLY CONDUCTIVE

-ADHESIVE TAPE

BACKGROUND OF THE INVENTION Field of the Invention

The invention relates in general to adhesive tapes and the method of fabricating the adhesive tapes, and more particularly to adhesive tapes having preeminently electrical and thermal conductivities, and methods of manufacturing the adhesive tapes.

Description of the Related Art

When the size of electric devices is reduced, the circuits of the devices must be denser and more precise. It is increasingly important to solve the subsequently occurring problems of electromagnetic interference (EMI), destruction from electrostatic charges, and compatibility of different electric devices. The electrically and thermally conductive adhesive tapes of the present invention not only have electrical and thermal conductivities but also can be used to shield against electromagnetic wave. The adhesive tape is more convenient and inventive than the conventional connector utilizing the screw, rivet or solder. Most of the conventional electrically conductive adhesive tapes or thermally conductive adhesive tapes utilize organic polymer doped with electrically or thermally conductive dopants to form a one-sided adhesive tape or a two-sided adhesive tape. Referring to FIG. 1, the adhesive tape 10, for example, electrically or thermally conductive adhesive tape includes a layer of electrically or thermally conductive material formed on one side or both sides of an aluminum layer 11 for connecting thermal source and sink, such as an air blower. However, the adhesive material in the conventional electrically or thermally conductive material usually is a polymer layer, such as a silicon layer. The adhesive material has a continuous structural phase and thermostability during use. However, even after doping the adhesive material with electrically and thermally conductive dopants the inherent properties, for example, insulation and low thermal conductivity, make the electrical and thermal conductivities of the adhesive material poorer than those of the pure metal material.

SUMMARY OF THE INVENTION The present invention provides an electrically and thermally conductive adhesive tape, and includes the following structures: a complex structure or a single-layered substrate having a plurality of random protuberant structures or concavities. The protuberant structures or concavities either extend or recede from one side of the complex structure or the single-layered substrate. An adhesive layer is coated on one side or two sides of the complex structure or the single-layered substrate. A releasing paper, releasing film or releasing material, for example, releasing paper or releasing tape, is pasted on the outside surface of the adhesive layer for convenient operation. The protuberant structures or concavities are formed by a squeezer, for example, a diamond roller, a diamond planar roller or a spike-shaped roller, having protuberances. The depth and gauge of the protuberant structures or concavities depend on the squeezing process and can be controlled by, for example, adjusting the size of the protuberances and the pressure of the squeezing process.

The single-layered substrate can be a single-layered plastic film or metal foil, while the multilayer structure consist of, for example, plastic/metal layers, metal/plastic/metal layers, metal/metal/plastic layers or plastic/metal/plastic layers, wherein the metal layer can be composed of multilayer metal foils, or one kind of metal or alloy which depends on the desired physical property. The desired physical property is, for example, anti-friction, anti-oxygenation, good thermal conductivity or good electrical conductivity. The material of the metal layer is selected from copper foil, aluminum foil, alloy of copper and silver, or copper foil plated with silver, tin, tin and lead, chromium, nickel or gold. The combination of the materials used to form the metal layer is based on practical properties of electrical conductivity or/and thermal conductivity. An anti- oxygenate treatment is further performed by sputtering or vapor deposition on the outside surface of the metal layer to form an anti-oxygenation layer, for example, aluminum or copper foil plated with tin and lead, for preventing the oxygenation of the metal layer. The tin and lead-plated layer provides high thermal conductivity and low resistance. Moreover, an organic material, for example, epoxy, can be used to prevent the penetration of the oxygen in the periphery and the oxygenation reaction. The adhesive layer is, for example, a pure adhesive layer or an adhesive layer with electrical and thermal conductivities. The adhesive layer, according to practical application, can be made of any kind of adhesive material, for example, an acrylic layer, a silicon layer, rubber, a thermal-fused layer or epoxy. The adhesive layer can be applied in a wide temperature range. The adhesive layer with electrical and thermal conductivities can be formed by doping electrically conductive dopants into the adhesive material listed above. The electrically conductive dopants are, for example, conductive carbon powder, metal powder, metal oxide powder, inorganic or surface electrically conductive treated organic powder, carbon fiber powder or a combination thereof. In another aspect, the electrically conductive adhesive materials in general have both electrical conductivity and thermal conductivity. However, if the electrical conductivity of the adhesive material is not desired, then thermal conductive dopants, for example, powder of aluminum oxide and titanium dioxide, with low specific heat, can be used instead of using electrically conductive dopants. In summary, the advantages of the present invention are listed as follows:

(a) The electrically and thermally adhesive tape of the present invention simultaneously provides adhesion and electrical conductivity on the same surface of the adhesive tape. The protuberances of the adhesive tape are randomly arranged and are easily manufactured, whether the arrangement of the protuberances is compact or sparse. The adhesive tape is very suitable for application to an object with an irregular surface. The adhesive tape also provides good inosculation.

(b) The adhesive tape of the present invention provides the function of shielding against electromagnetic interference (EMI). The beehive-like protuberances provide the shield function in a direction perpendicular to the forward direction of an electromagnetic wave. Furthermore, the EMI shielding effect of the metal layer of the present invention is better than that of the conventional adhesive tape doped with electrically conductive dopants.

(c) The adhesive tape of the present invention avoids the accumulation of electrostatic charges in a place where electrostatic charges are easy produced. Therefore, the adhesive tape can be used when manufacturing the floor of a clean room or to conduct the electrostatic charges of a picture tube to a ground plate.

(d) The adhesive tape of the present invention can be applied to the glass window of a monitor or microwave for directly discharging electrostatic charges. (e) The adhesive tape of the present invention acts as a thermal conductive adhesive tape or an electrical conductor by utilizing the thermal conductivity of a suitable metal layer, for example, tin-plated copper foil, or utilizing the electrical conductivity of other suitable metal layer, for example, gold-plated or silver-plated copper foil having low resistance. The adhesive tape has protuberances; hence it is very suitable for application to an object with an irregular surface.

(f) The adhesive tape of the present invention is employed when the computer or devices or elements of various electronic equipment units need to eliminate electrostatic charges, ground, connect, or adhere and connect. If the electrically conductive adhesive tape, for example, an adhesive tape having tin-plated copper foil, needs to be fixed on an object, then a discharge soldering method is preferably used to connect the protuberances of the adhesive tape and the metal surface of the object.

(g) The metal phase of the adhesive tape of the present invention connects directly to the object, hence its thermal conductivity is better than that of the conventional adhesive tape coating thermally conductive adhesive layers on both sides of the aluminum foil. Moreover, the thermally conductive layer is composed of powders, for example, aluminum oxide or titanium oxide, with low specific heat and thermal conductivity. The conventional thermally conductive adhesive is formed by doping powders into an insulation polymer, for example, silicon. The thermal conductivity of the polymer is far lower than that of metal, such as copper, tin, gold or silver. The thermal

conductivity of the polymer is about 2xlO^"4(cal/cm²/cm/s/°C). The thermal conductivity

of metal is in the range of about 0.9-1.5 (cal/cnr/cm/s/°C). Therefore, the thermal

conductivity of metal is at least thousands times that of the polymer. (h) For a penetrating substrate, such as a single-layered plastic film or a metal/plastic complex film, electrically conductive adhesives are formed on both sides of the substrate; for example, the substrate is coated with an acrylic layer on one side and an epoxy layer on the other side. The acrylic layer is an adhesive layer with electrical conductivity and pressure sensitivity. The epoxy layer is an adhesive layer with electrical conductivity and a good bridging property. The surface resistance (Rs) of these adhesive

layers is in the range of about 10° ~ 10" (Ω/ ) . The volume resistance (Rv) of these

adhesive layers is in the range of about 10° ~ 10⁹ (Ωcm). The volume resistance in the TD

direction (R_V,TD) can be controlled by adjusting the thickness of the adhesive layer, thickness of the substrate and total penetrating area per unit area, and is in the range of

about 10° ~ 10⁹ (Ωcm). In general, the volume resistance is in inversely proportional to

the total penetrating area per unit area. If the aluminum-plated plastic film is penetrated, then the electrically conductive metal layer can shorten the overall conduct distance and significant reduce the surface resistance perpendicular or parallel to the surface of the substrate. The electrically conductive adhesive tape with the desired conductivity can be made without doping with a large amount of the conductive dopants.

(i) The electrically and thermally conductive adhesive tape has metal isolated islands on the outmost adhesive layer. Therefore, the adhesive tape provides anchoring and anti-slip when it is attached to the object. G) The electrically and thermally conductive adhesive tape has a cloth-like surface; hence it is not easily creased.

(k) The manufacturing method of the present invention is easier, more precise and better than the conventional method. The squeezer of the present invention consumes not material. Furthermore, the present invention has high throughput and low cost. BRIEF DESCRIPTION OF THE DRAWINGS Other objects, features, and advantages of the invention will become apparent from the following detailed description of the preferred but non-limiting embodiments. The description is made with reference to the accompanying drawings in which: FIG. 1 is a schematic, cross-sectional view showing a conventional adhesive tape with two silicon layers having thermal conductivity and an aluminum foil placed between these two silicon layers;

FIGs. 2A to 2C are schematic, cross-sectional views showing the process steps of a first preferred embodiment of the present invention for manufacturing the electrically and thermally conductive adhesive tape;

FIG. 3 is a schematic, cross-sectional view showing the formation of the concavities and metal isolated islands in the manufacturing process of the present invention;

FIGs. 4A to 4C are schematic, cross-sectional views showing the process steps of a second preferred embodiment of the present invention for manufacturing the electrically and thermally conductive adhesive tape;

FIG. 5 is a schematic, cross-sectional view showing the formation of the concavities and metal isolated islands in the manufacturing process of the present invention; FIG. 6 is a schematic, cross-sectional view showing the process step of a third preferred embodiment of the present invention for combining two conductive adhesive tapes to form the electrically and thermally conductive adhesive tape; FIG. 7 is a schematic, cross-sectional view showing the process step of the third preferred embodiment of the present invention for folding and combining one conductive adhesive tape to form the electrically and thermally conductive adhesive tape;

FIG. 8 is a schematic view showing the electrically conductive paster with a socket of a fourth preferred embodiment of the present invention; and

FIG. 9 is a schematic view showing the electrically conductive paster with a plug of the fourth preferred embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENT FIRST PREFERRED EMBODIMENT

FIGs. 2A to 2C are schematic, cross-sectional views showing the process steps of the first preferred embodiment of the present invention for manufacturing the electrically and thermally conductive adhesive tape.

Referring to 2A, a substrate 200 is provided. The substrate 200 is a plastic film, for example, Polypropylene (PP), Polyethylene Terephthalate (PET), Polyethylene (PE), Polyethylene Naphthalate (PEN), Polyimide (PI), Polyvinylchloride (PVC) or other films. In the present invention, the preferred substrate 200 can be a metal foil, for example, copper foil, aluminum foil, a silver plated copper foil on a single side or both sides of the copper foil, or tin, chromium, nickel or gold plated copper foil. The letters TD present a transverse direction, which is perpendicular to the surface of the substrate 200. The letters MD present a machine direction, which is parallel to the surface of the substrate 200.

Referring to 2B, an adhesive layer 204 is coated on one surface of the substrate 200. The preferred material of the adhesive layer 204 is chosen according to the application of the adhesive tape. The adhesive layer 204 can be a pure adhesive layer, an electrically conductive layer or a thermally conductive layer. A releasing layer 205, for example, a releasing paper or a releasing film, is pasted on the exposed surface of the adhesive layer 204. Thereafter, a squeezer, for example, a diamond roller, diamond planar roller or spike-shaped roller, having protuberances is used on the surface of the substrate 200 along the direction from the substrate toward the adhesive layer and to penetrate the substrate 200 so that a plurality of holes 202 are formed on the substrate 200. Meanwhile, several dishing regions and protuberant regions are formed on the opposite surfaces of the substrate 200, respectively. The dishing regions and the protuberant regions are connected, one by one, to form the holes 202. The holes 202 are randomly arranged due to the random arrangement of protuberances of the squeezer. The depth and gauge of the holes 202 depend on the squeezing process and can be controlled by, for example, adjusting the size of the protuberances and the pressure of the squeezing process. The squeezing process of the present invention is not limited to penetrate through the substrate 200. The squeezing process cannot penetrate through the substrate 200 so that several randomly arranged protuberant concavities 210 are formed (as shown in FIG.3). The protuberant concavities 210 have a dishing shape on one surface of the substrate 200 and have a protuberant shape on another surface of the substrate 200. The depth and gauge of the protuberant concavities 210 can be adjusted according to the practical condition. The subsequent steps are similar whether the substrate is penetrated or not, hence detailed description of the subsequent steps in which the substrate is penetrated are omitted here. If only a one-sided adhesive tape is desired then the product

can be applied after the steps described in FIG. 2B is finished. Referring to FIG. 2C, another adhesive layer can be applied on another surface of the substrate 200 to form a double-sided electrically and thermally conductive adhesive tape. An adhesive layer 206 is coated on the surface of the substrate 200 having the dishing regions. Thereafter, a releasing layer 208 is pasted on the adhesive layer 206 to complete the double-sided adhesive tape.

The volume resistances in the TD direction (R_VιTD) and in the MD direction (R_{v MD}) are different from each other due to the holes 202 or protuberant concavities 210 formed on the substrate 200, hence the adhesive tape has anisotropic electrical conductivity. For the substrate 200 having the holes 202 the adhesive layer of the adhesive tape is made of electrically conductive adhesive materials. The volume resistance in the TD and MD directions is inversely proportional to the total hole area per substrate unit area and to the solid percentage of the conductive dopants, but is directly proportional to the thickness of the electrically conductive adhesive layer.

If the substrate 200 is a metal substrate then the adhesive layer can be an electrically conductive layer or non-conductive layer. The adhesive layer 204 is penetrated by the substrate 200 after the first adhesive layer 204 is coated and squeezed so that several metal isolated islands 211 are formed. The adhesive layer 204 continuously surrounds the metal isolated islands 211. The outer surface of the adhesive layer 204 provides the metal phase and the adhesive phase, which are simultaneously used as a current conductor and an adhesion layer. The height and density of the metal isolated islands 21 1 can be adjusted according to the height and density of the protuberances and pressure of the squeezing process. After the squeezing process is performed on the substrate 200 to penetrate the adhesive layer 204, then the completed structure can be used as an electrically conductive adhesive tape. The electrically conductive adhesive tape not only provides the functions of adhesion and electrical conductivity, but also able is to shield against electromagnetic waves. If both sides of the substrate 200 are coated with adhesive layers then the adhesive layer on the second side of the substrate acts as an air-isolation layer to protect the metal substrate from oxygenation. If the substrate 200 is a single-layered insulation plastic film, the adhesive layers formed on both side of the substrate 200 have to be electrically conductive layers for forming the adhesive tape having an electrically conductive property on both sides.

The physical properties, for example, volume resistance in the machine direction (R,_,MD) and volume resistance in the traverse direction (R,_,TD), of the adhesive layer are

10^"'~10⁸ Ωcm and 10'~10⁸ Ωcm, respectively. The R _TD depends on the following

factors:

(a) The volume resistance (R of electrically conductive dopants.

(b) Pressure applied in traverse direction per unit area.

(c) The penetrating area per unit area. (d) The thickness of the adhesive layer and substrate.

(e) The solid proportion of the electrically conductive dopants in the adhesive materials.

(f) The type of the adhesive layer.

SECOND PREFERRED EMBODIMENT FIGs. 4A to 4C are schematic, cross-sectional views showing the process steps of the second preferred embodiment of the present invention for manufacturing the electrically and thermally conductive adhesive tape.

Referring to 4A, a substrate 300 is provided. The substrate 300 is a plastic film, for example, Polypropylene (PP), Polyethylene Terephthalate (PET), Polyethylene (PE), Polyethylene Naphthalate (PEN), Polyimide (PI), Polyvinylchloride (PVC) films or other films. A metal layer 301 is then formed on the substrate 300 to form a complex structure. The metal layer 301 can be a metal foil, for example, copper foil, aluminum foil, a copper foil on plated with sliver on a single side or on both sides, or tin, chromium, nickel or gold plated copper foil. The letters TD present a transverse direction, which is perpendicular to the surface of the substrate 300. The letters MD present a machine direction, which is parallel to the surface of the substrate 300.

Referring to 4B, an adhesive layer 304 is coated on one surface of the substrate 300. The preferred material of the adhesive layer 304 is chosen according to the use of the adhesive tape. The adhesive layer 304 can be a pure adhesive layer, an electrically conductive layer or a thermally conductive layer. A releasing layer 305, for example, a releasing paper or a releasing film, is pasted on the exposed surface of the adhesive layer 304. Thereafter, a squeezer, for example, a diamond roller, diamond planar roller or spike-shaped roller, having protuberances is applied to the surface of the substrate 300 along the direction from the substrate toward the adhesive layer and to penetrate the substrate 300 to form a plurality of protruding holes 302 on the substrate 300. Meanwhile, several dishing regions and protruding regions are formed on the opposite surfaces of the substrate 300. The dishing regions and the protruding regions are connected, one by one, to form the holes 302. The holes 302 are randomly arranged due to the random arrangement of protuberances of the squeezer. The depth and gauge of the holes 302 depend on the squeezing process and can be controlled by, for example, adjusting the size of the protuberances and the pressure of the squeezing process.

Nevertheless, the squeezing process of the present invention is not limited to penetration of the substrate 300. The squeezing process cannot penetrate the substrate 300 for forming several randomly arranged protuberant concavities 310 (as shown in FIG.5). The protuberant concavities 310 have a dishing shape on one side of the substrate 300 and have a protuberant shape on the other side of the substrate 300. The adhesive layer 304 is penetrated by the protuberant concavities 310 after the adhesive layer 304 is coated and squeezed for forming a plurality of metal isolated islands 31 1. The adhesive layer 304 continuously surrounds the metal isolated islands 311. The outer surface of the adhesive layer 304 simultaneously provides the metal phase and adhesive phase, which are used as a current conductor and an adhesion layer. The height and density of the metal isolated islands 311 can be adjusted according to the height and density of the protuberances and pressure of the squeezing process. After the squeezing process is performed on the substrate 300 to penetrate the adhesive layer 304, the completed structure can be used as an electrically conductive adhesive tape. The electrically conductive adhesive tape not only provides the functions of adhesion and electrical conductivity, but also is able to shield against electromagnetic waves. If both sides of the substrate 300 are coated with adhesive layers, the adhesive layer 306 on the second side of the substrate acts as an air-isolation layer to protect the metal substrate from oxygenation. Coating a PVC film on the adhesive layer 306, or replacing the adhesive layer 306 with a PVC film results in a good product. This product provides an isolation property on one side, and provides electrical conductivity and adhesion properties on the other side. The detailed description of the subsequent steps in which the substrate 300 is penetrated is omitted here.

THIRD PREFERRED EMBODIMENT Referring to FIG. 6, in a process similar to the first preferred embodiment, a substrate 200 composed of, for example, metal material, is provided. The preferred metal material is tin-pasted copper foil. An adhesive layer 204 is formed on one side of the substrate 200. The preferred material of the adhesive layer 204 depends on the application of the adhesive tape. The adhesive layer 204 can be a pure adhesive layer, an electrically conductive layer or a thermally conductive layer. The adhesive layer, according to the practical application, can be composed of any kind of adhesive material, for example, an acrylic layer, a silicon layer, rubber, a thermal-fused layer or epoxy. A releasing layer 205, for example, a releasing paper or a releasing film, is pasted on the exposed surface of the adhesive layer 204. Thereafter, a squeezer, for example, a diamond roller, diamond planar roller or spike-shaped roller, having protuberances is applied to the surface of the substrate 200 along the direction from the substrate toward the adhesive layer to form a plurality of protuberant concavities 210 on the substrate 200 (as shown in FIG. 3). The protuberant concavities 210 are randomly arranged due to the random arrangement of protuberances of the squeezer. The depth and gauge of the protuberant concavities 210 depend on the squeezing process and can be controlled by, for example, adjusting the size of the protuberances and the pressure of the squeezing process.

The protuberant concavities 210 have a dishing shape on one surface of the substrate 200 and have a protuberant shape on another surface of the substrate 200. The depth and gauge of the protuberant concavities 210 can be adjusted according to the practical conditions.

The adhesive layer 204 is penetrated by the protuberant concavities 210 to form a plurality of metal isolated islands 211. The adhesive layer 204 continuously surrounds the metal isolated islands 21 1. The outer surface of the adhesive layer 204 provides the metal phase and adhesive phase; hence the adhesive tape simultaneously acts as a current conductor and an adhesion layer. The height and density of the metal isolated islands 211 can be adjusted according to the height and density of the protuberances and pressure of the squeezing process.

An adhesive layer 206 is then formed on the exposed surface of the substrate 200. The adhesive layer 206 is, for example, a pure adhesive layer or an adhesive layer with electrical and thermal conductivities. The adhesive layer 206 can be composed of any kind of adhesive material, for example, an acrylic layer, a silicon layer, rubber, a thermal-fused layer or epoxy, and the material of the adhesive layer 206 is selected according to practical application. The preferred adhesive layer is an acrylic layer with good thermostabihty. The adhesive layer 206 with electrical and thermal conductivities can be formed by doping electrically conductive dopants into the adhesive material described above. The electrically conductive dopants are, for example, aluminum oxide and nickel powder.

The complex structure 30 is then fixed on another complex structure 31 by pasting the adhesive layer 206 on the exposed surface of the substrate of the complex structure 31 to form the adhesive tape 32. The adhesive tape 32 is a symmetrical structure and provides adhesion, electrical conductivity and thermal conductivity on opposite sides. The complex structure 30 has two adhesive layers 204 and 206, but the complex structure 31 only has one adhesive layer 204. Referring to FIG. 7, if better electrically conductivity is required, the adhesive layer 206 is fully or partially coated on the substrate 200. Thereafter, the adhesive tape is folded to form the adhesive tape 33 having the continuous metal phase on one edge, wherein the adhesive layer 206 is located at the midpoint of the adhesive tape 33. The adhesive tape 33 not only has good electrically and thermally conductive properties but also has a high mechanical rigidity to avoid deformation. The adhesive tape 33 can be used in the electronic industry when the electronic devices must adhere to and conduct with each other. The adhesive tape 33 can be applied to the central processing unit (CPU) of a computer for electrically conducting and dispensing heat. FOURTH PREFERRED EMBODIMENT

Similar to the first preferred embodiment, a substrate 200 composed of, for example, a metal material, is provided. The preferred metal material is tin-pasted copper foil. An adhesive layer 204 is formed on one side of the substrate 200. The preferred material of the adhesive layer 204 depends on the application of the adhesive tape. The adhesive layer 204 can be a pure adhesive layer, an electrically conductive layer or a thermally conductive layer. The adhesive layer, according to the practical application, can be composed of any kind of adhesive material, for example, an acrylic layer, a silicon layer, rubber, a thermal-fused layer or epoxy. A releasing layer 205, for example, a releasing paper or a releasing film, is pasted on the exposed surface of the adhesive layer 204. Thereafter, a squeezer, for example, a diamond roller, diamond planar roller or spike-shaped roller, having protuberances is applied to the surface of the substrate 200 along the direction from the substrate toward the adhesive layer to form a plurality of protuberant concavities 210 on the substrate 200 (as shown in FIG.3). The protuberant concavities 210 are randomly arranged due to the random arrangement of protuberances of the squeezer. The depth and gauge of the protuberant concavities 210 depend on the squeezing process and can be controlled by, for example, adjusting the size of the protuberances and the pressure of the squeezing process.

The protuberant concavities 210 have a dishing shape on one surface of the substrate 200 and have a protuberant shape on another surface of the substrate 200. The depth and gauge of the protuberant concavities 210 can be adjusted according to practical conditions.

The adhesive layer 204 is penetrated by the protuberant concavities 210 to form a plurality of metal isolated islands 21 1. The adhesive layer 204 continuously surrounds the metal isolated islands 211. The outer surface of the adhesive layer 204 provides the metal phase and adhesive phase, hence the adhesive tape simultaneously acts as a current conductor and an adhesion layer. The height and density of the metal isolated islands 211 can be controlled by adjusting the height and density of the protuberances and pressure of the squeezing process. Then, the adhesive tape is laminated to form the sheet electrically conductive paster 400. A connector 402 having a plug 404 (as shown in FIG. 9) or a socket 406 (as shown in FIG. 8) is fixed on the exposed metal surface of the plaster 400 by a discharge soldering method or using another electrically conductive adhesive tape (not shown). The plug 404 or socket 406 is in a position perpendicular (as shown in FIGs. 8 and 9) or parallel (not shown) to the surface of the paster 400. An isolation adhesive tape (not shown) or a layer of isolation paint is formed on the connector 402. In practical application, the connector 402 is fixed on the exposed metal surface of the paster 400 by using an isolation adhesive tape that is larger in area than the connector 402 instead of the discharge soldering method. The preferred method used to fix the connector 402 on the paster 400 is the discharge soldering method for assuring a high quality product. A wire is used for long-range connection of two connectors having plug and socket, respectively. The paster 400 can be used to ground an electric appliance, connect devices, eliminate the electrostatic charges, etc. Furthermore, the paster 400 can be applied to the electronic probes of the monitors of physics machines. In summary, the advantages of the present invention are listed as follows:

(a) The electrically and thermally adhesive tape of the present invention simultaneously provides adhesion and electrical conductivity on the same surface of the adhesive tape. The protuberances of the adhesive tape are randomly arranged and are easily manufactured whether the arrangement of the protuberances is compact or sparse. The adhesive tape is very suitable for application to an object with an irregular surface. The adhesive tape also provides good inosculation.

(b) The adhesive tape of the present invention provides the function of shielding against electromagnetic interference (EMI). The beehive-like protuberances provide the shield function in a direction peφendicular to the forward direction of electromagnetic wave. Furthermore, the EMI shielding effect of the metal layer of the present invention is better than the conventional adhesive tape doped with electrically conductive dopants.

(c) The adhesive tape of the present invention avoids the accumulation of electrostatic charges in places where electrostatic charges are easy produced. Therefore, the adhesive tape can be used when manufacturing the floor of a clean room or to conduct the electrostatic charges of a picture tube to a ground plate.

(d) The adhesive tape of the present invention can be applied to the glass window of a monitor or microwave for directly discharging electrostatic charges.

(e) The adhesive tape of the present invention acts as a thermally conductive adhesive tape or an electrical conductor by utilizing the thermal conductivity of a suitable metal layer, for example, tin-plated copper foil, or utilizing the electrical conductivity of other suitable metal layers, for example, gold-plated or silver-plated copper foil having low resistance. The adhesive tape has protuberances; hence it is very suitable for application to object with an irregular surface. (f) The adhesive tape of the present invention is used when the computer or devices or elements of various units of electronic equipment need to eliminate electrostatic charges, ground, connect, or adhere and connect. If the electrically conductive adhesive tape, for example, adhesive tape having tin-plated copper foil, needs to be applied to an object, then a discharge soldering method is preferably used to connect the protuberances of the adhesive tape and the metal surface of an object.

(g) The metal phase of the adhesive tape of the present invention connects the object directly, hence thermal conductivity is better than that of the conventional adhesive tape that has thermally conductive adhesive layers coated on both sides of the aluminum foil. Moreover, the thermally conductive layer is composed of powders, for example, aluminum oxide or titanium oxide, with low specific heat and thermally conductivity. The conventional thermally conductive adhesive is formed by doping powders into an insulation polymersilicon. The thermal conductivity of the polymer is far lower than that of a metal, such as copper, tin, gold or silver. The thermal conductivity of the polymer is

about 2xlO^"4(cal/cm /cm/s/°C). The thermal conductivity of metal is in the range of about

0.9-1.5 (cal/cm²/cm/s/°C). Therefore, the thermal conductivity of metal is at least one

thousand times that of the polymer.

(h) For a penetrating substrate, such as a single-layered plastic film or a metal/plastic complex film, having electrically conductive adhesives formed on both sides of the substrate, for example, an acrylic layer is coated on one side and an epoxy layer is coated on the other side. The acrylic layer is an adhesive layer with electrical conductivity and pressure sensitivity. The epoxy layer is an adhesive layer with electrical conductivity and a good bridging property. The surface resistance (Rs) of these adhesive

layers is in the range of about 10° - 10" (Ω/ ) . The volume resistance (Rv) of these adhesive layers is in the range of about 10° - 10⁹ (Ωcm). The volume resistance in the TD

about 10° - 10⁹ (Ωcm). In general, the volume resistance is inversely proportional to the

total penetrating area per unit area. If the aluminum-plated plastic film is penetrated, then the electrically conductive metal layer can shorten the overall conducting distance and significantly reduce the surface resistance peφendicular or parallel to the surface of the substrate. So, the electrically conductive adhesive tape with desired conductivity can be make without doping with a large amount of conductive dopants. (i) The electrically and thermally conductive adhesive tape has metal isolated islands on the outermost adhesive layer. Therefore, the adhesive tape provides anchoring and anti-slip when it is attached to the object.

(j) The electrically and thermally conductive adhesive tape has a cloth-like surface, hence it is not easily creased. (k) The manufacturing method of the present invention is easier, more precise and better than the conventional method. The squeezer of the present invention consumes no material. Furthermore, the present invention has a high throughput and a low cost.

While the invention has been described by way of example and in terms of a preferred embodiment, it is to be understood that the invention is not limited thereto. To the contrary, it is intended to cover various modifications and similar arrangements and procedures, and the scope of the appended claims therefore should be accorded the broadest inteφretation so as to encompass all such modifications and similar arrangements and procedures.

Claims

WHAT IS CLAIMED IS:

1. An electrically and thermally conductive adhesive tape (32), comprising: a substrate (200); and a first adhesive layer (204) located on a second side of the substrate (200), wherein the substrate (200) has a plurality of randomly arranged protuberant concavities (210) formed therein, the protuberant concavities (210) have a dishing shape on a first side of the substrate (200) and a protuberant shape on the second side, the protuberant concavities (210) penetrate the first adhesive layer to form a plurality of metal isolated islands, and the first adhesive layer (204) continuously surrounds the metal isolated islands to provide adhesion, electrical conductivity and thermal conductivity, simultaneously.

2. An electrically and thermally conductive adhesive tape according to claim 1, further comprising a first releasing layer located on the second side of the substrate and covering the first adhesive layer.

3. An electrically and thermally conductive adhesive tape according to claim 2, further comprising a second adhesive layer located on the first side of the substrate.

4. -An electrically and thermally conductive adhesive tape according to claim 3, further comprising a second releasing layer located on the first side of the substrate and covering the second adhesive layer.

5. An electrically and thermally conductive adhesive tape according to claim 1, wherein the substrate is an electrically conductive substrate.

6. An electrically and thermally conductive adhesive tape according to claim 5, wherein the first adhesive layer is an electrically conductive adhesive layer.

7. An electrically and thermally conductive adhesive tape according to claim 5, wherein the first adhesive layer is an electrically non-conductive adhesive layer.

8. An electrically and thermally conductive adhesive tape according to claim 1, wherein the substrate is an electrically non-conductive substrate.

9. An electrically and thermally conductive adhesive tape according to claim 8, wherein the first adhesive layer is an electrically conductive adhesive layer.

10. An electrically and thermally conductive adhesive tape (32), comprising: a substrate (200); and a first adhesive layer (204) located on a second side of the substrate (200), wherein the substrate (200) has a plurality of randomly arranged protuberant holes formed thereon, the protuberant holes have a dishing shape on a first side of the substrate and a protuberant shape on a second side, the protuberant holes penetrate the first adhesive layer (204) so as to form a plurality of metal isolated islands, and the first adhesive layer (204) continuously surrounds the metal isolated islands for providing adhesion, electrical conductivity and thermal conductivity, simultaneously.

1 1. An electrically and thermally conductive adhesive tape according to claim 10, further comprising a first releasing layer located on the second side of the substrate and covering the first adhesive layer.

12. An electrically and thermally conductive adhesive tape according to claim 11, further comprising a second adhesive layer located on the first side of the substrate.

13. An electrically and thermally conductive adhesive tape according to claim 12, further comprising a second releasing layer located on the first side of the substrate and covering the second adhesive layer.

14. An electrically, and thermally conductive adhesive tape according to claim 10, wherein the substrate is an electrically conductive substrate.

15. An electrically and thermally conductive adhesive tape according to claim 14, wherein the first adhesive layer is an electrically conductive adhesive layer.

16. -An electrically and thermally conductive adhesive tape according to claim 14, wherein the first adhesive layer is an electrically non-conductive adhesive layer.

17. An electrically and thermally conductive adhesive tape according to claim 10, wherein the substrate is an electrically non-conductive substrate.

18. An electrically and thermally conductive adhesive tape according to claim 17, wherein the first adhesive layer is an electrically conductive adhesive layer.

19. An electrically and thermally conductive adhesive tape, comprising: a substrate; a metal layer located on a second side of the substrate; and a first adhesive layer located on the metal layer and on the second side of the substrate, wherein the metal layer and the substrate have a plurality of randomly arranged protuberant concavities formed thereon, the protuberant concavities have a dishing shape on a first side of the substrate and a protuberant shape on the second side, the protuberant concavities penetrate the first adhesive layer to form a plurality of metal isolated islands, and the first adhesive layer continuously surrounds the metal isolated islands for providing adhesion, electrical conductivity and thermal conductivity, simultaneously.

20. An electrically and thermally conductive adhesive tape according to claim 19, further comprising a first releasing layer located on the second side of the substrate and covering the first adhesive layer.

21. An electrically and thermally conductive adhesive tape according to claim 20, further comprising a second adhesive layer located on the first side of the substrate.

22. An electrically and thermally conductive adhesive tape according to claim 21, further comprising a second leasing layer located on the first side of the substrate and covering the second adhesive layer.

23. An electrically and thermally conductive adhesive tape according to claim 19, wherein the first adhesive layer is an electrically conductive adhesive layer.

24. An electrically and thermally conductive adhesive tape according to claim 19, wherein the first adhesive layer is an electrically non-conductive adhesive layer.

25. An electrically and thermally conductive adhesive tape, comprising: a substrate; a metal layer located on a second side of the substrate; and a first adhesive layer located on the metal layer and on the second side of the substrate, wherein the metal layer and the substrate have a plurality of randomly arranged protuberant holes formed therein, the protuberant holes have a dishing shape on a first side of the substrate and a protuberant shape on the second side, the protuberant holes penetrate the first adhesive layer so as to form a plurality of metal isolated islands, and the first adhesive layer continuously surrounds the metal isolated islands to provide adhesion, electrical conductivity and thermal conductivity, simultaneously.

26. An electrically and thermally conductive adhesive tape according to claim 25, further comprising a second adhesive layer located on the first side of the substrate.

27. An electrically and thermally conductive adhesive tape according to claim 26, further comprising a second releasing layer located on the first side of the substrate and covering the second adhesive layer.

28. An electrically and thermally conductive adhesive tape according to claim 25, wherein the first adhesive layer is an electrically conductive adhesive layer.

29. An electrically and thermally conductive adhesive tape according to claim 25, wherein the first adhesive layer is an electrically non-conductive adhesive layer.

30. An electrically and thermally conductive adhesive tape, comprising: a first adhesive layer; a first substrate and a second adhesive layer located respectively on a first side and a second side of the first adhesive layer; the second adhesive layer located on the first side of the first adhesive layer and covering the first substrate; and a third adhesive layer located on the second side of the first adhesive layer and covering the second substrate, wherein the first substrate has a plurality of randomly arranged first protuberances, the first protuberances penetrate the second adhesive layer to form a plurality of first isolated island, and the second adhesive layer continuously surrounds the first isolated islands; and the second substrate has a plurality of randomly arranged second protuberances, the second protuberances penetrate the third adhesive layer to form a plurality of second isolated islands, and the third adhesive layer continuously surrounds the second isolated islands.

31. An electrically and thermally conductive adhesive tape according to claim 30, wherein the first substrate and second substrate are made of electrically conductive materials.

32. -An electrically and thermally conductive adhesive tape according to claim 31, wherein the first adhesive layer, second adhesive layer and third adhesive layer are made of electrically conductive adhesives.

33. An electrically and thermally conductive adhesive tape according to claim 31, wherein the first adhesive layer, second adhesive layer and third adhesive layer are made of electrically non-conductive adhesives.

34. An electrically and thermally conductive adhesive tape according to claim 31 , wherein the first adhesive layer, second adhesive layer and third adhesive layer are made of thermally conductive adhesives.

35. An electrically and thermally conductive adhesive tape according to claim 30, further comprising a first releasing layer and a second releasing layer located on the second adhesive layer and third adhesive layer, respectively.

36. An electrically and thermally conductive adhesive tape, composed of a first adhesive tape (31) and a second adhesive tape (32), wherein: the first adhesive tape (31) includes a first substrate (200), and a first adhesive layer (204) and a second adhesive layer (206) located on opposite side of the first substrate (200), the first substrate (200) has a plurality of randomly arranged first protuberances (31 1), the first protuberances penetrate the first adhesive layer (204) and the first adhesive layer (204) continuously surrounds the first protuberances; the second adhesive tape (32) includes a second substrate (200) and a third adhesive layer (204) located on one side of the second substrate (200), the second substrate (200) has a plurality of randomly arranged second protuberances, the second protuberances penetrate the third adhesive layer (204) and the third adhesive layer (204) continuously surrounds the second protuberances; and the second adhesive layer (206) of the first adhesive tape (31) is located on another side of the second substrate (200).

37. An electrically and thermally conductive adhesive tape according to claim 36, wherein the first substrate and second substrate are made of electrically conductive materials.

38. An electrically and thermally conductive adhesive tape according to claim 36, wherein the first adhesive layer, second adhesive layer and third adhesive layer are made of electrically conductive adhesives.

39. An electrically and thermally conductive adhesive tape according to claim 37, wherein the first adhesive layer, second adhesive layer and third adhesive layer are made of electrically non-conductive adhesives.

40. An electrically and thermally conductive adhesive tape according to claim 37, wherein the first adhesive layer and second adhesive layer are made of electrically non- conductive adhesives and the third adhesive layer is made of an electrically conductive layer.

41. An electrically and thermally conductive adhesive tape according to claim 37, wherein the first adhesive layer and second adhesive layer are made of electrically non- conductive adhesives and the third adhesive layer is made of a thermally conductive layer.

42. An electrically and thermally conductive adhesive tape according to claim 36, further comprising a first releasing layer and a second releasing layer covering the second adhesive layer and third adhesive layer, respectively.

43. -An electrically and thermally conductive adhesive tape which is formed by folding an adhesive tape and has a continuous phase on one edge, the adhesive tape including a substrate, and a first adhesive layer and a second adhesive layer located respectively on opposite sides of the substrate, wherein the substrate has a plurality of randomly arranged protuberances, the protuberances penetrate the first adhesive layer to form a plurality of isolated islands and the first adhesive layer continuously surrounds the isolated islands.

44. An electrically and thermally conductive adhesive tape according to claim 43, wherein the substrate is made of electrically conductive adhesive material.

45. An electrically and thermally conductive adhesive tape according to claim 44, wherein the first adhesive layer and second adhesive layer are made of electrically conductive adhesive materials.

46. An electrically and thermally conductive adhesive tape according to claim 44, wherein the first adhesive layer and second adhesive layer are made of electrically non- conductive adhesive materials.

47. An electrically and thermally conductive adhesive tape according to claim 44, further comprising a releasing layer located on the first adhesive layer.

48. An electrically conductive paster, comprising: a metal substrate; a connector fixed on a first side of the metal substrate, the connector having a connecting head which is electrically connected with the metal substrate; and a adhesive layer covering a second side of the metal substrate, wherein: the metal substrate has a plurality of randomly arranged protuberances penetrating the second side of the metal substrate and the adhesive layer to form a plurality of isolated islands, and the adhesive layer continuously surrounds the isolated islands for providing adhesion and electrically conductivity.

49. -An electrically conductive paster according to claim 48, wherein the adhesive layer is an electrically conductive layer.

50. An electrically conductive paster according to claim 48, wherein the adhesive layer is an electrically non-conductive layer.

51. An electrically conductive paster according to claim 48, wherein the connecting head is a plug.

52. An electrically conductive paster according to claim 48, wherein the connecting head is a socket.

53. A method of manufacturing an electrically and thermally conductive adhesive tape which is formed by folding an adhesive tape and has a continuous phase on one edge, the method comprising the steps of: providing a adhesive tape having a substrate and a first adhesive layer on one side of the substrate, wherein the substrate has a plurality of randomly arranged protuberances formed thereon, the protuberances penetrate the first adhesive layer to form a plurality of isolated islands, and the first adhesive layer continuously surrounds the protuberances; coating a second adhesive layer on another side of the substrate; and folding and combining the adhesive tape to form an electrically and thermally conductive adhesive tape by using an adhesive property of the second adhesive layer.

54. -An electrically conductive paster according to claim 53, wherein in the step of coating the second adhesive layer, further includes the step of coating the second adhesive layer over parts of the substrate, and after the adhesive tape is folded and combined the substrate surface coated with the second adhesive layer corresponds to the substrate surface not coated with the second adhesive layer.

55. -An electrically conductive paster according to claim 53, wherein in the step of coating the second adhesive layer, further includes the step of coating the second adhesive layer over the whole substrate surface.

AMENDED CLAIMS

[received by the International Bureau on 3 August 2000 (03.08.00); original claims 1-55 replaced by new claims 1-52 (10 pages)]

WHAT IS CLAIMED IS:

1. An electrically and thermally conductive adhesive tape (32), comprising: a substrate (200); and a first adhesive layer (204) located on a second side of the substrate (200), wherein the substrate (200) has a plurality of randomly arranged protuberant concavities (210) formed therein, the protuberant concavities (210) have a dishing shape on a first side of the substrate (200) and a protuberant shape on the second side, the protuberant concavities (210) penetrate the first adhesive layer to form a plurality of isolated islands, and the first adhesive layer (204) continuously surrounds the isolated islands to provide adhesion, electrical conductivity and thermal conductivity, simultaneously; and a first releasing layer (205) located on the second side of the substrate (200) and covering the first adhesive layer (204), wherein the concavities (210) are formed in presence of the first releasing layer (204) and the substrate (200) does not extend onto a side of the adhesive layer not in contact with the substrate (200).

2. An electrically and thermally conductive adhesive tape according to claim

1 , further comprising a second adhesive layer located on the first side of the substrate.

3. An electrically and thermally conductive adhesive tape according to claim

2, further comprising a second releasing layer located on the first side of the substrate and covering the second adhesive layer.

4. An electrically and thermally conductive adhesive tape according to claim 1, wherein the substrate is an electrically conductive substrate.

5. -An electrically and thermally conductive adhesive tape according to claim , wherein the first adhesive layer is an electrically conductive adhesive layer.

6. -An electrically and thermally conductive adhesive tape according to claim 4, wherein the first adhesive layer is an electrically non-conductive adhesive layer.

7. An electrically and thermally conductive adhesive tape according to claim 1, wherein the substrate is an electrically non-conductive substrate.

8. An electrically and thermally conductive adhesive tape according to claim 7, wherein the first adhesive layer is an electrically conductive adhesive layer.

9. An electrically and thermally conductive adhesive tape, comprising: a substrate (200); and a first adhesive layer (204) located on a second side of the substrate (200), wherein the substrate (200) has a plurality of randomly arranged protuberant holes formed thereon, the protuberant holes have a dishing shape on a first side of the substrate and a protuberant shape on a second side, the protuberant holes penetrate the first adhesive layer (204) so as to form a plurality of isolated islands, and the first adhesive layer (204) continuously surrounds the isolated islands for providing adhesion, electrical conductivity and thermal conductivity, simultaneously; and a first releasing layer (204) located on the second side of the substrate and covering the first adhesive layer, wherein the concavities are formed in presence of the first releasing layer and the substrate does not extend onto a side of the adhesive layer not in contact with the substrate.

10. An electrically and thermally conductive adhesive tape according to claim 9, further comprising a second adhesive layer located on the first side of the substrate.

11. An electrically and thermally conductive adhesive tape according to claim 10, further comprising a second releasing layer located on the first side of the substrate and covering the second adhesive layer.

12. An electrically and thermally conductive adhesive tape according to claim 9, wherein the substrate is an electrically conductive substrate.

13. An electrically and thermally conductive adhesive tape according to claim 12, wherein the first adhesive layer is an electrically conductive adhesive layer.

14. An electrically and thermally conductive adhesive tape according to claim 12, wherein the first adhesive layer is an electrically non-conductive adhesive layer.

15. An electrically and thermally conductive adhesive tape according to claim 9, wherein the substrate is an electrically non-conductive substrate.

16. An electrically and thermally conductive adhesive tape according to claim 15, wherein the first adhesive layer is an electrically conductive adhesive layer.

17. An electrically and thermally conductive adhesive tape, comprising: a substrate; a metal layer located on a second side of the substrate; and a first adhesive layer located on the metal layer and on the second side of the substrate, wherein the metal layer and the substrate have a plurality of randomly arranged protuberant concavities formed thereon, the protuberant concavities have a dishing shape on a first side of the substrate and a protuberant shape on the second side, the protuberant concavities penetrate the first adhesive layer to form a plurality of metal isolated islands, and the first adhesive layer continuously surrounds the metal isolated islands for providing adhesion, electrical conductivity and thermal conductivity, simultaneously; and a first releasing layer located on the second side of the substrate and covering the first adhesive layer, wherein the concavities are formed in presence of the first releasing layer and the substrate does not extend onto a side of the adhesive layer not in contact with the substrate.

18. -An electrically and thermally conductive adhesive tape according to claim

17, further comprising a second adhesive layer located on the first side of the substrate.

19. An electrically and thermally conductive adhesive tape according to claim

18, further comprising a second releasing layer located on the first side of the substrate and covering the second adhesive layer.

20. An electrically and thermally conductive adhesive tape according to claim 17, wherein the first adhesive layer is an electrically conductive adhesive layer.

21. An electrically and thermally conductive adhesive tape according to claim 17, wherein the first adhesive layer is an electrically non-conductive adhesive layer.

22. An electrically and thermally conductive adhesive tape, comprising: a substrate; a metal layer located on a second side of the substrate; and a first adhesive layer located on the metal layer and on the second side of the substrate, wherein the metal layer and the substrate have a plurality of randomly arranged protuberant holes formed therein, the protuberant holes have a dishing shape on a first side of the substrate and a protuberant shape on the second side, the protuberant holes penetrate the first adhesive layer so as to form a plurality of metal isolated islands, and the first adhesive layer continuously surrounds the metal isolated islands to provide adhesion, electrical conductivity and thermal conductivity, simultaneously; and a first releasing layer located on the second side of the substrate and covering the first adhesive layer, wherein the concavities are formed in presence of the first releasing layer and the substrate does not extend onto a side of the adhesive layer not in contact with the substrate.

23. An electrically and thermally conductive adhesive tape according to claim

22, further comprising a second adhesive layer located on the first side of the substrate.

24. -An electrically and thermally conductive adhesive tape according to claim

23, further comprising a second releasing layer located on the first side of the substrate and covering the second adhesive layer.

25. An electrically and thermally conductive adhesive tape according to claim 22, wherein the first adhesive layer is an electrically conductive adhesive layer.

26. An electrically and thermally conductive adhesive tape according to claim 22, wherein the first adhesive layer is an electrically non-conductive adhesive layer.

27. An electrically and thermally conductive adhesive tape, comprising: a first adhesive layer; a first substrate and a second substrate layer located respectively on a first side and a second side of the first adhesive layer; the second adhesive layer located on the first side of the first adhesive layer and covering the first substrate; and a third adhesive layer located on the second side of the first adhesive layer and covering the second substrate, wherein the first substrate has a plurality of randomly arranged first protuberances, the first protuberances penetrate the second adhesive layer to form a plurality of first isolated island, and the second adhesive layer continuously surrounds the first isolated islands; and the second substrate has a plurality of randomly arranged second protuberances, the second protuberances penetrate the third adhesive layer to form a plurality of second isolated islands, and the third adhesive layer continuously surrounds the second isolated islands.

28. -An electrically and thermally conductive adhesive tape according to claim

27, wherein the first substrate and second substrate are made of electrically conductive materials.

29. An electrically and thermally conductive adhesive tape according to claim

28, wherein the first adhesive layer, second adhesive layer and third adhesive layer are made of electrically conductive adhesives.

30. An electrically and thermally conductive adhesive tape according to claim 28, wherein the first adhesive layer, second adhesive layer and third adhesive layer are made of electrically non-conductive adhesives.

31. An electrically and thermally conductive adhesive tape according to claim 28, wherein the first adhesive layer, second adhesive layer and third adhesive layer are made of thermally conductive adhesives.

32. An electrically and thermally conductive adhesive tape according to claim 27, further comprising a first releasing layer and a second releasing layer located on the second adhesive layer and third adhesive layer, respectively.

33. An electrically and thermally conductive adhesive tape, composed of a first adhesive tape (31) and a second adhesive tape (32), wherein: the first adhesive tape (31) includes a first substrate (200), and a first adhesive layer (204) and a second adhesive layer (206) located on opposite side of the first substrate (200), the first substrate (200) has a plurality of randomly arranged first protuberances (311), the first protuberances penetrate the first adhesive layer (204) and the first adhesive layer (204) continuously surrounds the first protuberances; the second adhesive tape (32) includes a second substrate (200) and a third adhesive layer (204) located on one side of the second substrate (200), the second substrate (200) has a plurality of randomly arranged second protuberances, the second protuberances penetrate the third adhesive layer (204) and the third adhesive layer (204) continuously surrounds the second protuberances; and the second adhesive layer (206) of the first adhesive tape (31) is located on another side of the second substrate (200).

34. An electrically and thermally conductive adhesive tape according to claim 33, wherein the first substrate and second substrate are made of electrically conductive materials.

35. An electrically and thermally conductive adhesive tape according to claim

33, wherein the first adhesive layer, second adhesive layer and third adhesive layer are made of electrically conductive adhesives.

36. -An electrically and thermally conductive adhesive tape according to claim

34, wherein the first adhesive layer, second adhesive layer and third adhesive layer are made of electrically non-conductive adhesives.

37. An electrically and thermally conductive adhesive tape according to claim 34, wherein the first adhesive layer and second adhesive layer are made of electrically non-conductive adhesives and the third adhesive layer is made of an electrically conductive layer.

38. An electrically and thermally conductive adhesive tape according to claim 34, wherein the first adhesive layer and second adhesive layer are made of electrically non-conductive adhesives and the third adhesive layer is made of a thermally conductive layer.

39. An electrically and thermally conductive adhesive tape according to claim 33, further comprising a first releasing layer and a second releasing layer covering the second adhesive layer and third adhesive layer, respectively.

40. An electrically and thermally conductive adhesive tape which is formed by folding an adhesive tape and has a continuous phase on one edge, the adhesive tape including a substrate, and a first adhesive layer and a second adhesive layer located respectively on opposite sides of the substrate, wherein the substrate has a plurality of randomly arranged protuberances, the protuberances penetrate the first adhesive layer to form a plurality of isolated islands and the first adhesive layer continuously surrounds the isolated islands.

41. An electrically and thermally conductive adhesive tape according to claim

40, wherein the substrate is made of electrically conductive adhesive material.

42. An electrically and thermally conductive adhesive tape according to claim

41, wherein the first adhesive layer and second adhesive layer are made of electrically conductive adhesive materials.

43. An electrically and thermally conductive adhesive tape according to claim 41, wherein the first adhesive layer and second adhesive layer are made of electrically non-conductive adhesive materials.

44. An electrically and thermally conductive adhesive tape according to claim 41, further comprising a releasing layer located on the first adhesive layer.

45. An electrically conductive paster, composing: a metal substrate; a connector fixed on a first side of the metal substrate, the connector having a connecting head which is electrically connected with the metal substrate; and a adhesive layer covering a second side of the metal substrate, wherein: the metal substrate has a plurality of randomly arranged protuberances penetrating the second side of the metal substrate and the adhesive layer to form a plurality of isolated islands, and the adhesive layer continuously surrounds the isolated islands for providing adhesion and electrically conductivity.

46. An electrically conductive paster according to claim 45, wherein the adhesive layer is an electrically conductive layer.

47. An electrically conductive paster according to claim 45, wherein the adhesive layer is an electrically non-conductive layer.

48. An electrically conductive paster according to claim 45, wherein the connecting head is a plug.

49. An electrically conductive paster according to claim 45, wherein the connecting head is a socket.

50. A method of manufacturing an electrically and thermally conductive adhesive tape which is formed by folding an adhesive tape and has a continuous phase on one edge, the method comprising the steps of: providing a adhesive tape having a substrate and a first adhesive layer on one side of the substrate, wherein the substrate has a plurality of randomly arranged protuberances formed thereon, the protuberances penetrate the first adhesive layer to form a plurality of isolated islands, and the first adhesive layer continuously surrounds the protuberances; coating a second adhesive layer on another side of the substrate; and folding and combining the adhesive tape to form an electrically and thermally conductive adhesive tape by using an adhesive property of the second adhesive layer.

51. -An electrically conductive paster according to claim 50, wherein in the step of coating the second adhesive layer, further includes the step of coating the second adhesive layer over parts of the substrate, and after the adhesive tape is folded and combined the substrate surface coated with the second adhesive layer cooesponds to the substrate surface not coated with the second adhesive layer.

52. An electrically conductive paster according to claim 50, wherein in the step of coating the second adhesive layer, further includes the step of coating the second adhesive layer over the whole substrate surface.