US20230264414A1 - Forming three-dimensional (3d) printed electronics - Google Patents
Forming three-dimensional (3d) printed electronics Download PDFInfo
- Publication number
- US20230264414A1 US20230264414A1 US18/132,821 US202318132821A US2023264414A1 US 20230264414 A1 US20230264414 A1 US 20230264414A1 US 202318132821 A US202318132821 A US 202318132821A US 2023264414 A1 US2023264414 A1 US 2023264414A1
- Authority
- US
- United States
- Prior art keywords
- electronic
- build material
- agent
- fusing
- property
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 235
- 238000000034 method Methods 0.000 claims abstract description 49
- 230000005855 radiation Effects 0.000 claims abstract description 36
- 239000003795 chemical substances by application Substances 0.000 claims description 254
- 238000000137 annealing Methods 0.000 claims description 53
- 238000004519 manufacturing process Methods 0.000 claims description 34
- 239000013011 aqueous formulation Substances 0.000 claims description 26
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 22
- -1 poly(3,4-ethylendioxythiophene) Polymers 0.000 claims description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- 229920000299 Nylon 12 Polymers 0.000 claims description 16
- 238000007639 printing Methods 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 13
- 239000011810 insulating material Substances 0.000 claims description 9
- 229920000642 polymer Polymers 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 9
- 239000004952 Polyamide Substances 0.000 claims description 8
- 229920002647 polyamide Polymers 0.000 claims description 8
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 claims description 4
- 239000003086 colorant Substances 0.000 claims description 4
- 229920000571 Nylon 11 Polymers 0.000 claims description 3
- 229920002292 Nylon 6 Polymers 0.000 claims description 3
- 229920002302 Nylon 6,6 Polymers 0.000 claims description 3
- 229920000572 Nylon 6/12 Polymers 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 claims description 3
- 239000012815 thermoplastic material Substances 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 229920001467 poly(styrenesulfonates) Polymers 0.000 claims 1
- 229960002796 polystyrene sulfonate Drugs 0.000 claims 1
- 239000011970 polystyrene sulfonate Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 106
- 239000000976 ink Substances 0.000 description 45
- 239000002245 particle Substances 0.000 description 26
- 239000000126 substance Substances 0.000 description 22
- 239000004094 surface-active agent Substances 0.000 description 19
- 239000002105 nanoparticle Substances 0.000 description 17
- 239000010408 film Substances 0.000 description 15
- 229910021389 graphene Inorganic materials 0.000 description 15
- 230000008018 melting Effects 0.000 description 15
- 238000002844 melting Methods 0.000 description 15
- 238000002474 experimental method Methods 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 229920000144 PEDOT:PSS Polymers 0.000 description 10
- 239000003446 ligand Substances 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 238000005245 sintering Methods 0.000 description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 239000004332 silver Substances 0.000 description 9
- 229910052709 silver Inorganic materials 0.000 description 9
- 239000000654 additive Substances 0.000 description 8
- 239000006184 cosolvent Substances 0.000 description 8
- 239000000975 dye Substances 0.000 description 8
- 238000012545 processing Methods 0.000 description 8
- 239000011149 active material Substances 0.000 description 7
- 239000002082 metal nanoparticle Substances 0.000 description 7
- 239000002086 nanomaterial Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000010146 3D printing Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 230000004913 activation Effects 0.000 description 6
- 239000003139 biocide Substances 0.000 description 6
- 239000002041 carbon nanotube Substances 0.000 description 6
- 230000005670 electromagnetic radiation Effects 0.000 description 6
- 238000009472 formulation Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 229910044991 metal oxide Inorganic materials 0.000 description 6
- 150000004706 metal oxides Chemical class 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 5
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical class C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 230000003115 biocidal effect Effects 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 5
- 229910021393 carbon nanotube Inorganic materials 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 239000002322 conducting polymer Substances 0.000 description 5
- 229920001940 conductive polymer Polymers 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 5
- 230000008020 evaporation Effects 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 206010073306 Exposure to radiation Diseases 0.000 description 4
- 239000004677 Nylon Substances 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 229910003472 fullerene Inorganic materials 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229920001778 nylon Polymers 0.000 description 4
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 239000012798 spherical particle Substances 0.000 description 4
- 239000000080 wetting agent Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000002209 hydrophobic effect Effects 0.000 description 3
- 230000015654 memory Effects 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 239000002074 nanoribbon Substances 0.000 description 3
- 239000002073 nanorod Substances 0.000 description 3
- 239000002135 nanosheet Substances 0.000 description 3
- 239000002071 nanotube Substances 0.000 description 3
- 239000002070 nanowire Substances 0.000 description 3
- 239000003002 pH adjusting agent Substances 0.000 description 3
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000012703 sol-gel precursor Substances 0.000 description 3
- 230000007480 spreading Effects 0.000 description 3
- 238000003892 spreading Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 125000004209 (C1-C8) alkyl group Chemical group 0.000 description 2
- PWQNOLAKMCLNJI-KTKRTIGZSA-N 2-[2-[2-[(z)-octadec-9-enoxy]ethoxy]ethoxy]ethyl dihydrogen phosphate Chemical compound CCCCCCCC\C=C/CCCCCCCCOCCOCCOCCOP(O)(O)=O PWQNOLAKMCLNJI-KTKRTIGZSA-N 0.000 description 2
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical compound CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 2
- 239000004135 Bone phosphate Substances 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229920005692 JONCRYL® Polymers 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical class OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- PXIPVTKHYLBLMZ-UHFFFAOYSA-N Sodium azide Chemical compound [Na+].[N-]=[N+]=[N-] PXIPVTKHYLBLMZ-UHFFFAOYSA-N 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 229910003090 WSe2 Inorganic materials 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 229910000410 antimony oxide Inorganic materials 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000000440 bentonite Substances 0.000 description 2
- 235000012216 bentonite Nutrition 0.000 description 2
- DMSMPAJRVJJAGA-UHFFFAOYSA-N benzo[d]isothiazol-3-one Chemical compound C1=CC=C2C(=O)NSC2=C1 DMSMPAJRVJJAGA-UHFFFAOYSA-N 0.000 description 2
- 235000019347 bone phosphate Nutrition 0.000 description 2
- 235000012215 calcium aluminium silicate Nutrition 0.000 description 2
- 239000000404 calcium aluminium silicate Substances 0.000 description 2
- 235000012251 calcium ferrocyanide Nutrition 0.000 description 2
- 239000000279 calcium ferrocyanide Substances 0.000 description 2
- 239000001506 calcium phosphate Substances 0.000 description 2
- 239000000378 calcium silicate Substances 0.000 description 2
- 235000012241 calcium silicate Nutrition 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229920000547 conjugated polymer Polymers 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 230000001687 destabilization Effects 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 239000000391 magnesium silicate Substances 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229940093440 oleth-3-phosphate Drugs 0.000 description 2
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920000123 polythiophene Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 235000012219 potassium aluminium silicate Nutrition 0.000 description 2
- 239000000441 potassium aluminium silicate Substances 0.000 description 2
- 239000000276 potassium ferrocyanide Substances 0.000 description 2
- 235000012249 potassium ferrocyanide Nutrition 0.000 description 2
- 235000019814 powdered cellulose Nutrition 0.000 description 2
- 239000002096 quantum dot Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 230000003678 scratch resistant effect Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 150000003384 small molecules Chemical class 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 235000012217 sodium aluminium silicate Nutrition 0.000 description 2
- 239000000429 sodium aluminium silicate Substances 0.000 description 2
- 235000012247 sodium ferrocyanide Nutrition 0.000 description 2
- 239000000264 sodium ferrocyanide Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 125000000547 substituted alkyl group Chemical group 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 2
- WDQFELCEOPFLCZ-UHFFFAOYSA-N 1-(2-hydroxyethyl)pyrrolidin-2-one Chemical compound OCCN1CCCC1=O WDQFELCEOPFLCZ-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 1
- KQMCGGGTJKNIMC-UHFFFAOYSA-N 2-hydroxy-3-propyl-2h-furan-5-one Chemical compound CCCC1=CC(=O)OC1O KQMCGGGTJKNIMC-UHFFFAOYSA-N 0.000 description 1
- QWGRWMMWNDWRQN-UHFFFAOYSA-N 2-methylpropane-1,3-diol Chemical compound OCC(C)CO QWGRWMMWNDWRQN-UHFFFAOYSA-N 0.000 description 1
- KFGWEMFTDGCYSK-UHFFFAOYSA-N 3-methyl-1,2-thiazole 1-oxide Chemical compound CC=1C=CS(=O)N=1 KFGWEMFTDGCYSK-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- LUAZZOXZPVVGSO-UHFFFAOYSA-N Benzyl viologen Chemical compound C=1C=C(C=2C=C[N+](CC=3C=CC=CC=3)=CC=2)C=C[N+]=1CC1=CC=CC=C1 LUAZZOXZPVVGSO-UHFFFAOYSA-N 0.000 description 1
- 230000005457 Black-body radiation Effects 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 229910003202 NH4 Inorganic materials 0.000 description 1
- 229910000503 Na-aluminosilicate Inorganic materials 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Chemical class 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical group C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- 229920001486 SU-8 photoresist Polymers 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N Tetraethylene glycol, Natural products OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229920006397 acrylic thermoplastic Polymers 0.000 description 1
- 150000008431 aliphatic amides Chemical class 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- PZZYQPZGQPZBDN-UHFFFAOYSA-N aluminium silicate Chemical compound O=[Al]O[Si](=O)O[Al]=O PZZYQPZGQPZBDN-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 235000012213 anti-caking agent fatty acid Nutrition 0.000 description 1
- 230000000845 anti-microbial effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- YSJGOMATDFSEED-UHFFFAOYSA-M behentrimonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCCCCCC[N+](C)(C)C YSJGOMATDFSEED-UHFFFAOYSA-M 0.000 description 1
- 229940075506 behentrimonium chloride Drugs 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- WNCYAPRTYDMSFP-UHFFFAOYSA-N calcium aluminosilicate Chemical compound [Al+3].[Al+3].[Ca+2].[O-][Si]([O-])=O.[O-][Si]([O-])=O.[O-][Si]([O-])=O.[O-][Si]([O-])=O WNCYAPRTYDMSFP-UHFFFAOYSA-N 0.000 description 1
- 229940078583 calcium aluminosilicate Drugs 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000002238 carbon nanotube film Substances 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- MRUAUOIMASANKQ-UHFFFAOYSA-N cocamidopropyl betaine Chemical compound CCCCCCCCCCCC(=O)NCCC[N+](C)(C)CC([O-])=O MRUAUOIMASANKQ-UHFFFAOYSA-N 0.000 description 1
- 229940073507 cocamidopropyl betaine Drugs 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- GXGAKHNRMVGRPK-UHFFFAOYSA-N dimagnesium;dioxido-bis[[oxido(oxo)silyl]oxy]silane Chemical compound [Mg+2].[Mg+2].[O-][Si](=O)O[Si]([O-])([O-])O[Si]([O-])=O GXGAKHNRMVGRPK-UHFFFAOYSA-N 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 235000010933 magnesium salts of fatty acid Nutrition 0.000 description 1
- 239000001778 magnesium salts of fatty acids Substances 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- 229940099273 magnesium trisilicate Drugs 0.000 description 1
- 229910000386 magnesium trisilicate Inorganic materials 0.000 description 1
- 235000019793 magnesium trisilicate Nutrition 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910001510 metal chloride Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- SLIUAWYAILUBJU-UHFFFAOYSA-N pentacene Chemical compound C1=CC=CC2=CC3=CC4=CC5=CC=CC=C5C=C4C=C3C=C21 SLIUAWYAILUBJU-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000747 poly(lactic acid) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Chemical class 0.000 description 1
- 239000004626 polylactic acid Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229920003124 powdered cellulose Polymers 0.000 description 1
- 150000003856 quaternary ammonium compounds Chemical class 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- YYMBJDOZVAITBP-UHFFFAOYSA-N rubrene Chemical compound C1=CC=CC=C1C(C1=C(C=2C=CC=CC=2)C2=CC=CC=C2C(C=2C=CC=CC=2)=C11)=C(C=CC=C2)C2=C1C1=CC=CC=C1 YYMBJDOZVAITBP-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L sodium carbonate Substances [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 235000011182 sodium carbonates Nutrition 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- GTSHREYGKSITGK-UHFFFAOYSA-N sodium ferrocyanide Chemical compound [Na+].[Na+].[Na+].[Na+].[Fe+2].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-] GTSHREYGKSITGK-UHFFFAOYSA-N 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007784 solid electrolyte Substances 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- XOGGUFAVLNCTRS-UHFFFAOYSA-N tetrapotassium;iron(2+);hexacyanide Chemical compound [K+].[K+].[K+].[K+].[Fe+2].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-] XOGGUFAVLNCTRS-UHFFFAOYSA-N 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 235000019731 tricalcium phosphate Nutrition 0.000 description 1
- 229940078499 tricalcium phosphate Drugs 0.000 description 1
- 229910000391 tricalcium phosphate Inorganic materials 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- ITRNXVSDJBHYNJ-UHFFFAOYSA-N tungsten disulfide Chemical compound S=[W]=S ITRNXVSDJBHYNJ-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/165—Processes of additive manufacturing using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/50—Treatment of workpieces or articles during build-up, e.g. treatments applied to fused layers during build-up
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/171—Processes of additive manufacturing specially adapted for manufacturing multiple 3D objects
- B29C64/176—Sequentially
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/171—Processes of additive manufacturing specially adapted for manufacturing multiple 3D objects
- B29C64/182—Processes of additive manufacturing specially adapted for manufacturing multiple 3D objects in parallel batches
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/205—Means for applying layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/227—Driving means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/245—Platforms or substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/25—Housings, e.g. machine housings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/255—Enclosures for the building material, e.g. powder containers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/307—Handling of material to be used in additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
- B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/40—Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
- B33Y40/10—Pre-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
- B33Y40/20—Post-treatment, e.g. curing, coating or polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y99/00—Subject matter not provided for in other groups of this subclass
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B47/00—Porphines; Azaporphines
- C09B47/04—Phthalocyanines abbreviation: Pc
- C09B47/06—Preparation from carboxylic acids or derivatives thereof, e.g. anhydrides, amides, mononitriles, phthalimide, o-cyanobenzamide
- C09B47/065—Preparation from carboxylic acids or derivatives thereof, e.g. anhydrides, amides, mononitriles, phthalimide, o-cyanobenzamide having -COOH or -SO3H radicals or derivatives thereof, directly linked to the skeleton
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B47/00—Porphines; Azaporphines
- C09B47/04—Phthalocyanines abbreviation: Pc
- C09B47/06—Preparation from carboxylic acids or derivatives thereof, e.g. anhydrides, amides, mononitriles, phthalimide, o-cyanobenzamide
- C09B47/067—Preparation from carboxylic acids or derivatives thereof, e.g. anhydrides, amides, mononitriles, phthalimide, o-cyanobenzamide from phthalodinitriles naphthalenedinitriles, aromatic dinitriles prepared in situ, hydrogenated phthalodinitrile
- C09B47/0678—Preparation from carboxylic acids or derivatives thereof, e.g. anhydrides, amides, mononitriles, phthalimide, o-cyanobenzamide from phthalodinitriles naphthalenedinitriles, aromatic dinitriles prepared in situ, hydrogenated phthalodinitrile having-COOH or -SO3H radicals or derivatives thereof directly linked to the skeleton
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B47/00—Porphines; Azaporphines
- C09B47/04—Phthalocyanines abbreviation: Pc
- C09B47/08—Preparation from other phthalocyanine compounds, e.g. cobaltphthalocyanineamine complex
- C09B47/24—Obtaining compounds having —COOH or —SO3H radicals, or derivatives thereof, directly bound to the phthalocyanine radical
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G2215/00—Apparatus for electrophotographic processes
- G03G2215/20—Details of the fixing device or porcess
- G03G2215/2003—Structural features of the fixing device
- G03G2215/2048—Surface layer material
- G03G2215/2054—Inorganic filler, e.g. silica powder
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/49—Nc machine tool, till multiple
- G05B2219/49023—3-D printing, layer of powder, add drops of binder in layer, new powder
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/49—Nc machine tool, till multiple
- G05B2219/49246—3-D printing, layer of powder, add drops of binder in layer, new powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1712—Indefinite or running length work
- Y10T156/1722—Means applying fluent adhesive or adhesive activator material between layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1798—Surface bonding means and/or assemblymeans with work feeding or handling means with liquid adhesive or adhesive activator applying means
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
Abstract
In an example of a method for forming three-dimensional (3D) printed electronics, a build material is applied. A fusing agent is selectively applied on at least a portion of the build material. The build material is exposed to radiation and the portion of the build material in contact with the fusing agent fuses to form a layer. An electronic agent is selectively applied on at least a portion of the layer, which imparts an electronic property to the at least the portion of the layer.
Description
- This application is a divisional of U.S. Pat. Application No. 15/763,200, filed on Mar. 26, 2018, which claims priority to PCT/US2015/058094, filed on Oct. 29, 2015. U.S. Pat. Application 15/763,200 and PCT/US2015/058094 are incorporated in their entirety herein.
- Three-dimensional (3D) printing may be an additive printing process used to make three-dimensional solid parts from a digital model. 3D printing is often used in rapid product prototyping, mold generation, and mold master generation. 3D printing techniques are considered additive processes because they involve the application of successive layers of material. This is unlike traditional machining processes, which often rely upon the removal of material to create the final part. Materials used in 3D printing often require curing or fusing, which for some materials may be accomplished using heat-assisted sintering, and for other materials may be accomplished using digital light projection technology.
- Features of examples of the present disclosure will become apparent by reference to the following detailed description and drawings, in which like reference numerals correspond to similar, though perhaps not identical, components. For the sake of brevity, reference numerals or features having a previously described function may or may not be described in connection with other drawings in which they appear.
-
FIGS. 1A-1E are cross-sectional views depicting two examples of the method for forming three-dimensional (3D) printed electronics; -
FIG. 2 is a perspective view depicting an example of a device with 3D printed electronics formed by the method shown inFIGS. 1A-1C ; -
FIGS. 3A and 3B are perspective views depicting other examples of a device with 3D printed electronics formed by the method shown inFIGS. 1A-1E ; -
FIGS. 4A-4C are cross-sectional views depicting another example of the method for forming 3D printed electronics; -
FIGS. 4A, 4D and 4E are cross-sectional views depicting still another example of the method for forming 3D printed electronics; -
FIGS. 5A and 5B are perspective views depicting examples of devices with 3D printed electronics formed, respectively, by the method shown inFIGS. 4A-4C and the method shown inFIGS. 4A, 4D and 4E ; and -
FIGS. 6A through 6C are cross-sectional views depicting another example of the method for forming 3D printed electronics. - Building and/or embedding electronics on and/or within a dense part may require multiple steps to assemble several different components. For example, three-dimensional printing techniques, such as extrusion or additive manufacturing, have been used to create the dense part, and then other techniques, such as electroplating or the application of conducting materials, have been used to create the electronics. Many of the materials used to create the electronics require specific activation procedures, which may utilize specialized (e.g., proprietary, expensive, etc.) equipment, such as annealing equipment.
- Examples of the three-dimensional (3D) printing method disclosed herein utilize multi jet fusion (MJF) to impart an electronic property within, and/or upon the surface of a layer of a 3D objects/parts at a voxel level.
- During MJF, an entire layer or several layers of a build material (also referred to as build material particles) is/are exposed to electromagnetic radiation, but a selected region (in some instances less than the entire layer(s)) of the build material is fused and hardened to become a layer or several layers of a 3D object/part. A fusing agent is selectively deposited in contact with the selected region of the build material. The fusing agent(s) is/are capable of penetrating into the layer of the build material and spreading onto the exterior surface of the build material. This fusing agent is capable of absorbing electromagnetic radiation and converting the absorbed radiation to thermal energy, which in turn melts or sinters the build material that is in contact with the fusing agent. This causes the build material to fuse, bind, cure, etc. to form the layer of the 3D object/part.
- In the examples disclosed herein, an electronic agent is also selectively deposited on the build material and/or on the layer of the 3D object/part to impart the electronic property within, and/or upon the surface of the layer of the 3D objects/parts at the voxel level. To impart the electronic property/properties, the MJF platform may be used without modification. This is due, in part, to the electronic agents being jettable via thermal and/or piezoelectric inkjet printheads. As such, no specialized electroplating or other deposition equipment is needed. In some instances, this is also due, in part, to the fact that the heat and light provided by the MJF process is suitable to anneal any of the material(s) that may be used to impart the electronic property. As such, no specialized equipment (e.g., annealing equipment) is needed. However, it is to be understood that off-bed annealing may also be utilized.
- The method(s) disclosed herein also enable control over where the electronic property is introduced (e.g., at the voxel surface and/or through the voxel volume). By combining electronic voxels in a controlled fashion using MJF, a variety of devices with different electronic properties can be created. As examples, the methods disclosed herein may be used to form anti-static surface coatings (e.g., scratch-tolerant surface conductivity for static-related applications), capacitors, conductive traces, and more complex geometry electronic components.
- The electronic property that is imparted to/on the object/part may be electrical conductivity, semi-conductivity, and/or an electrically insulating property. The electronic property may be imparted upon the build material by selectively depositing a suitable electronic agent on the build material. The electronic property may also be the property of at least a portion of an electronic component or feature that is formed on the surface of the layer of the 3D object/part by selectively depositing a suitable electronic agent on the layer.
- It is to be understood that in the examples disclosed herein, a single electronic property or several electronic properties may be imparted to a single layer of build material and/or a single layer of the 3D object/part. As an example of the latter instance, to form a capacitor upon the surface of the layer of the 3D object/part, an electronic agent including a conductive material or a material whose electronic property is enhanced or activated when exposed to a treatment may be applied in a certain pattern on the layer, and then an electronic agent including an insulating material may be applied in a different area on the layer. As another example, to form a multi-layered structure (e.g., a capacitor, a via, etc.) in the build material or on the 3D object/part/layer, different electronic agents may be sequentially applied upon one another. In these types of structures, electrical continuity may be provided from one plane of electrically active material to another plane of electrically active material and then potentially on to subsequent planes. As an example, a first electronic agent may be selectively applied (on at least a portion of the build material or on an area of a 3D object/part/layer) to impart a first electronic property (e.g., conductivity) and then a second electronic agent may be selectively applied on the first electronic agent to impart a second electronic property (e.g., insulation) that is different than the first electronic property. It is to be understood that if the different electronic agents require different annealing conditions (e.g., no annealing and annealing, or annealing at different temperatures), then the electronic agents may be applied and annealed separately. If, however, the different electronic agents require similar annealing conditions, then the electronic agents can be selectively deposited and annealed together.
- Referring now to
FIGS. 1A through 1C , one example of the method for forming 3D printed electronics is depicted. As shown inFIG. 2 , in this example of the method, the electronic device 10 (3D object/part) that is formed includes an electronic component or feature 12 on the surface of a 3D printedlayer 14. - Referring now to
FIG. 1A , the method includes applying abuild material 16. As depicted, onelayer 18 of thebuild material 16 has been applied, as will be discussed in more detail below. - The
build material 16 may be a powder, a liquid, a paste, or a gel. Examples of thebuild material 16 include semi-crystalline thermoplastic materials with a wide processing window of greater than 5° C. (i.e., the temperature range between the melting point and the re-crystallization temperature). Some specific examples of thebuild material 16 include polyamides (PAs) (e.g., PA 11 / nylon 11,PA 12 /nylon 12, PA 6 / nylon 6, PA 8 / nylon 8, PA 9 / nylon 9, PA 66 / nylon 66, PA 612 / nylon 612, PA 812 / nylon 812, PA 912 / nylon 912, etc.). Other specific examples of thebuild material 16 include polyethylene, polyethylene terephthalate (PET), and an amorphous variation of these materials. Still other examples ofsuitable build materials 16 include polystyrene, polyacetals, polypropylene, polycarbonate, polyester, thermal polyurethanes, other engineering plastics, and blends of any two or more of the polymers listed herein. Core shell polymer particles of these materials may also be used. - Other examples of the
build material 16 include ceramic particles. Examples of suitable ceramic particles include oxides, carbides, and nitrides. Some specific examples include alumina (Al2O3), glass, silicon mononitride (SiN), silicon dioxide (SiO2), zirconia (ZrO2), titanium dioxide (TiO2), or combinations thereof. As an example, 30 wt% glass may be mixed with 70 wt% alumina. - The
build material 16 may have a melting point ranging from about 50° C. to about 2100° C. As examples, alumina particles having a melting point of 2072° C. may be used, glass having a melting point ranging from about 200° C. to about 1700° C. may be used, a polyamide having a melting point of 180° C. may be used, or thermal polyurethanes having a melting point ranging from about 100° C. to about 165° C. may be used. - The
build material 16 may be made up of similarly sized particles or differently sized particles. In the examples shown herein, thebuild material 16 includes particles of two different sizes. - The term “size” or “particle size” is used herein to describe at least the
build material 16. The size or particle size generally refers to the diameter or average diameter, which may vary, depending upon the morphology of the individual particle. In an example, the respective particle may have a morphology that is substantially spherical. A substantially spherical particle (i.e., spherical or near-spherical) has a sphericity of >0.84. Thus, any individual particles having a sphericity of <0.84 are considered non-spherical (irregularly shaped). The particle size of the substantially spherical particle may be provided by its largest diameter, and the particle size of a non-spherical particle may be provided by its average diameter (i.e., the average of multiple dimensions across the particle) or by an effective diameter, which is the diameter of a sphere with the same mass and density as the non-spherical particle. - In an example, the average size of the particles of the
build material 16 ranges from about 1 µm to about 500 µm. In another example, thebuild material 16 is a particle having a particle size ranging from about 5 µm to less than 200 µm. - It is to be understood that
build material 16 may include, in addition to the polymer or ceramic particles, a charging agent, a flow aid, or combinations thereof. Charging agent(s) may be added to suppress tribo-charging. Examples of suitable charging agent(s) include aliphatic amines (which may be ethoxylated), aliphatic amides, quaternary ammonium salts (e.g., behentrimonium chloride or cocamidopropyl betaine), esters of phosphoric acid, polyethylene glycol esters, or polyols. Some suitable commercially available charging agents include HOSTASTAT® FA 38 (natural based ethoxylated alkylamine), HOSTASTAT® FE2 (fatty acid ester), and HOSTASTAT® HS 1 (alkane sulfonate), each of which is available from Clariant Int. Ltd.). In an example, the charging agent is added in an amount ranging from greater than 0 wt% to less than 5 wt% based upon the total wt% of thebuild material 16. - Flow aid(s) may be added to improve the coating flowability of the
build material 16. Flow aid(s) may be particularly desirable when the particles of thebuild material 16 are less than 25 µm in size. The flow aid improves the flowability of thebuild material 16 by reducing the friction, the lateral drag, and the tribocharge buildup (by increasing the particle conductivity). Examples of suitable flow aids include tricalcium phosphate (E341), powdered cellulose (E460(ii)), magnesium stearate (E470b), sodium bicarbonate (E500), sodium ferrocyanide (E535), potassium ferrocyanide (E536), calcium ferrocyanide (E538), bone phosphate (E542), sodium silicate (E550), silicon dioxide (E551), calcium silicate (E552), magnesium trisilicate (E553a), talcum powder (E553b), sodium aluminosilicate (E554), potassium aluminium silicate (E555), calcium aluminosilicate (E556), bentonite (E558), aluminium silicate (E559), stearic acid (E570), or polydimethylsiloxane (E900). In an example, the flow aid is added in an amount ranging from greater than 0 wt% to less than 5 wt% based upon the total wt% of thebuild material 16. - In the example shown in
FIG. 1A , aprinting system 20 for forming thedevice 10 includes a supply bed 22 (including a supply of the build material 16), adelivery piston 26, a roller (not shown), afabrication bed 24, and afabrication piston 28. Each of these physical elements may be operatively connected to a central processing unit (not shown) of theprinting system 20 that controls the general operation of theadditive printing system 20. As an example, the central processing unit may be a microprocessor-based controller that is coupled to a memory, for example via a communications bus (not shown). The memory stores the computer readable instructions 48. The central processing unit may execute the instructions and thus may control operation of thesystem 20 in accordance with the instructions. The central processing unit (e.g., running the computer readable instructions stored on a non-transitory, tangible computer readable storage medium) manipulates and transforms data represented as physical (electronic) quantities within the printer’s registers and memories in order to control the physical elements to create thedevice 10. The data for the selective delivery of thebuild material 16, the fusingagent 30, theelectronic agent 38, etc. may be derived from a model of the device to be formed. For example, the instructions may cause the controller to utilize a build material distributor to dispense thebuild material 16, and to utilize applicators (e.g., an inkjet applicator) to respectively and selectively dispense the fusing agent and the electronic agent to form a three-dimensional part having an electronic property. - The
delivery piston 26 and thefabrication piston 28 may be the same type of piston, but are programmed to move in opposite directions. In an example, when a first layer of the 3D object is to be patterned or formed, thedelivery piston 26 may be programmed to push a predetermined amount of thebuild material 16 out of the opening in thesupply bed 22 and thefabrication piston 28 may be programmed to move in the opposite direction of thedelivery piston 26 in order to increase the depth of thefabrication bed 24. Thedelivery piston 26 will advance enough so that when the roller pushes thebuild material 16 into thefabrication bed 24, the depth of thefabrication bed 24 is sufficient so that alayer 18 of thebuild material 16 may be formed in thebed 24. The roller is capable of spreading thebuild material 16 into thefabrication bed 24 to form thelayer 18, which is relatively uniform in thickness. In an example, the thickness of thelayer 18 ranges from about 90 µm to about 110 µm, although thinner or thicker layers may also be used. For example, the thickness of thelayer 18 may range from about 50 µm to about 1 mm. In an example, thelayer 18 thickness ranges from about 100 µm to about 200 µm. - It is to be understood that the roller is a build material distributor that may be replaced by other tools, such as a blade that may be desirable for spreading different types of powders, or a combination of a roller and a blade.
- The
supply bed 22 that is shown is one example, and could be replaced with another suitable delivery system to supply thebuild material 16 to thefabrication bed 24. Examples of other suitable delivery systems include a hopper, an auger conveyer, or the like. - The
fabrication bed 22 that is shown is also one example, and could be replaced with another support member, such as a platen, a print bed, a glass plate, or another build surface. - After the
layer 18 of thebuild material 16 is applied in thefabrication bed 24, thelayer 18 may be exposed to heating (not shown). Heating may be performed to pre-heat thebuild material 16, and thus the heating temperature may be below the melting point of thebuild material 16. As such, the temperature selected will depend upon thebuild material 16 that is used. As examples, the heating temperature may be from about 5° C. to about 50° C. below the melting point of thebuild material 16. - Pre-heating the
layer 18 of thebuild material 16 may be accomplished using any suitable heat source that exposes all of thebuild material 16 in thefabrication bed 24 to the heat. Examples of the heat source include a thermal heat source or an electromagnetic radiation source (e.g., infrared (IR), microwave, ultraviolet, etc.). - As shown in
FIG. 1A , the method also includes selectively applying the fusingagent 30 on at least a portion of thebuild material 16. The fusingagent 30 may be dispensed from any suitable applicator. An example of the applicator is aninkjet printhead 32, such as a thermal inkjet printhead or a piezoelectric inkjet printhead. Theprinthead 32 may be a drop-on-demand printhead or a continuous drop printhead. Theprinthead 32 may be selected to deliver drops of the fusingagent 30 at a resolution ranging from about 300 dots per inch (DPI) to about 1200 DPI. In other examples, theprinthead 32 may be selected to be able to deliver drops of the fusingagent 30 at a higher or lower resolution. The drop velocity may range from about 5 m/s to about 24 m/s and the firing frequency may range from about 1 kHz to about 100 kHz. - The
printhead 32 may include an array of nozzles through which it is able to selectively eject drops of fluid. In one example, each drop may be in the order of about 10 pico liters (pl) per drop, although it is contemplated that a higher or lower drop size may be used. In some examples,printhead 32 is able to deliver variable size drops of the fusingagent 30. - The
printhead 32 may be attached to a moving XY stage or a translational carriage (neither of which is shown) that moves theprinthead 32 adjacent to thefabrication bed 24 in order to deposit the fusingagent 30 in desirable area(s). In other examples, theprinthead 32 may be fixed while a support member (similar to the fabrication bed 24) is configured to move relative thereto. Theprinthead 32 may be programmed to receive commands from a central processing unit and to deposit the fusingagent 30 according to a pattern of a cross-section for the layer of the 3D object/part that is to be formed. As used herein, the cross-section of the layer of the part to be formed refers to the cross-section that is parallel to a contact surface of thefabrication bed 24. - In an example, the
printhead 32 may have a length that enables it to span the whole width of thefabrication bed 24 in a page-wide array configuration. As used herein, the term ‘width’ generally denotes the shortest dimension in the plane parallel to the X and Y axes of the contact surface, and the term ‘length’ denotes the longest dimension in this plane. However, it is to be understood that in other examples, the term ‘width’ may be interchangeable with the term ‘length’. In an example, the page-wide array configuration is achieved through a suitable arrangement ofmultiple printheads 32. This configuration may be desirable for single pass printing. In still other examples of theprinting system 20, theprinthead 32 may have a shorter length that does not enable them to span the whole width of thefabrication bed 24. In these other examples, theprinthead 32 be movable bi-directionally across the width of thefabrication bed 24. This configuration enables selective delivery of the fusingagent 30 across the whole width and length of thefabrication bed 24 using multiple passes. - Examples of the fusing agent 30 are water-based dispersions including a radiation absorbing binding agent (i.e., an active material). The active material may be any infrared light absorbing colorant. In an example, the active material is a near infrared light absorber. Any near infrared colorants, e.g., those produced by Fabricolor, Eastman Kodak, or Yamamoto, may be used in the fusing agent 30. As one example, the fusing agent 30 may be an ink formulation including carbon black as the active material. Examples of this ink formulation are commercially known as CM997A, 516458, C18928, C93848, C93808, or the like, all of which are available from Hewlett-Packard Company. As another example, the fusing agent 30 may be an ink formulation including near infrared absorbing dyes as the active material. Examples of this ink formulation are described in U.S. Pat. No. 9,133,344, incorporated herein by reference in its entirety. Some examples of the near infrared absorbing dye are water soluble near infrared absorbing dyes selected from the group consisting of:
- and mixtures thereof. In the above formulations, M can be a divalent metal atom (e.g., copper, etc.) or can have OSO3Na axial groups filling any unfilled valencies if the metal is more than divalent (e.g., indium, etc.), R can be any C1-C8 alkyl group (including substituted alkyl and unsubstituted alkyl), and Z can be a counterion such that the overall charge of the near infrared absorbing dye is neutral. For example, the counterion can be sodium, lithium, potassium, NH4 +, etc.
- Some other examples of the near infrared absorbing dye are hydrophobic near infrared absorbing dyes selected from the group consisting of:
- and mixtures thereof. For the hydrophobic near infrared absorbing dyes, M can be a divalent metal atom (e.g., copper, etc.) or can include a metal that has Cl, Br, or OR′ (R′=H, CH3, COCH3, COCH2COOCH3, COCH2COCH3) axial groups filling any unfilled valencies if the metal is more than divalent, and R can be any C1-C8 alkyl group (including substituted alkyl and unsubstituted alkyl).
- The aqueous nature of the fusing
agent 30 enables the fusingagent 30 to penetrate, at least partially, into thelayer 18 of thebuild material 16. Thebuild material 16 may be hydrophobic, and the presence of a co-solvent and/or a surfactant in the fusingagent 30 may assist in obtaining a particular wetting behavior. - As shown in
FIG. 1B , after the fusingagent 30 is selectively applied in the specific portion(s) of thelayer 18, theentire layer 18 of thebuild material 16 is exposed to radiation R. - In an example, the electromagnetic radiation R may include wavelengths ranging from about 100 nm (UV) to about 10 µm. In yet another example, the electromagnetic radiation R wavelengths range from about 400 nm to about 3 µm or 4 µm (which includes near-infrared and mid-infrared radiation). As an example, the electromagnetic radiation 36 is blackbody radiation with a maximum intensity at a wavelength of about 1100 nm.
- The radiation R is emitted from a
radiation source 34, such as an IR (e.g., near-IR) curing lamp, a UV or UV-Vis curing lamp, IR (e.g., near-IR), UV, or visible light emitting diodes (LED), Vertical Cavity Surface Emitting Laser (VCSEL) arrays, or lasers with specific wavelengths. Anyradiation source 34 may be used that emits a suitable wavelength for the 3D printing process. Theradiation source 34 may be attached, for example, to a carriage that also holds the printhead(s) 32. The carriage may move theradiation source 34 into a position that is adjacent to thefabrication bed 24. Theradiation source 34 may be programmed to receive commands from the central processing unit and to expose thelayer 18, including the fusingagent 30 and buildmaterial 16, to radiation R. - The length of time the radiation R is applied for, or energy exposure time, may be dependent, for example, on one or more of: characteristics of the
radiation source 34; characteristics of thebuild material 16; and/or characteristics of the fusingagent 30. - The fusing
agent 30 enhances the absorption of the radiation R, converts the absorbed radiation to thermal energy, and promotes the transfer of the thermal heat to thebuild material 16 in contact therewith. In an example, the fusingagent 30 sufficiently elevates the temperature of thebuild material 16 above the melting point(s), allowing curing (e.g., sintering, binding, fusing, etc.) of the build material particles to take place. Exposure to radiation R forms alayer 14 of the 3D object/part. - While not shown in
FIG. 1B , it is to be understood that portions of thebuild material 16 that do not have the fusingagent 30 applied thereto do not absorb enough energy to fuse. Anyunfused build material 16 may be removed from thelayer 14 that is formed. - As shown in
FIG. 1C , the method also includes selectively applying theelectronic agent 38 on at least a portion of thebuild material 16. Theelectronic agent 38 may be used to impart an electronic property to the surface of thelayer 14. In the example shown inFIG. 1C , theelectronic agent 38 is selectively applied to form at least a portion of anelectronic component 12 on the surface of thelayer 14, where theelectronic component 12 has the electronic property. - The
electronic agent 38 may be an aqueous formulation that includes a conductive material, a material whose electronic property is enhanced or activated when exposed to a treatment, a semiconductive material, and/or an insulating material. The electronic agent may include one of the materials, or a combination of the materials in order to enhance the compatibility with a particular build material and/or to enhance the electronic property. For examples, theelectronic agent 38 may include a combination of conductive materials to enhance the conductive electronic property, or may include a combination of a semiconductive material and an insulating material to modify the electronic property. Some specific examples of material combinations include: a combination of carbon nanotubes, silver nanoparticles and a PEDOT:PSS polymer to enhance conductive properties; a combination of quantum dots and semi-conducting polymers to enhance semi-conducting properties; a combination of insulating polymer and insulating nanoparticles to enhance insulating properties; and a combination of silver nanoparticles and carbon black to create an electronic feature with a specific conductivity, for instance, a resistor of specific resistance. - In addition to the electronic material, the aqueous formulation of the
electronic agent 38 may also include water, a co-solvent, and/or a pH adjuster. As an example, conducting polymers may be incorporated into an aqueous formulation including water and a co-solvent. Other examples of the aqueous formulation may include a surfactant. As examples, carbonaceous nanomaterials and metal nanoparticles may be incorporated into an aqueous formulation including water, a co-solvent, and a surfactant. - Examples of the conductive materials include metallic (e.g., silver, copper, gold, platinum, palladium, tungsten, iron, etc.) nanomaterials (e.g., nanoparticles, nanorods, nanowires, nanotubes, nanosheets, etc.), conductive oxides (e.g., indium tin oxide, antimony oxide, zinc oxide, etc.), conducting polymers (e.g., poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS), polyacetylene, polythiophenes, any any other conjugated polymer, etc.), carbonaceous nanomaterials (e.g., graphene (single or multi-layer), carbon-nanotubes (CNTs, single or multi-walled), graphene nanoribbons, fullerenes, etc.), and reactive metal systems (e.g., metal oxide nanoparticles, which are reduced once deposited). Carbonaceous nanomaterials and metallic materials are stable at very high temperatures (i.e., at the sintering/processing temperatures for 3D printing polymers and ceramics, e.g., up to 3400° C.), and thus may be suitable for forming electronic component(s) 14 on and/or in
ceramic build materials 16. - Examples of the semiconductive material include semiconducting nanomaterials (nanoparticles, nanorods, nanowires, nanotubes, nanosheets, etc.), semiconducting metal oxides (e.g., tin oxide, antimony oxide, indium oxide, etc.), semiconducting polymers (e.g., PEDOT:PSS, polythiophenes, poly(p-phenylene sulfide), polyanilines, poly(pyrrole)s, poly(acetylene)s, poly(p-phenylene vinylene), polyparaphenylene, any any other conjugated polymer, etc.), and semiconducting small molecules (i.e., having a molecular mass less than 5,000 Daltons, e.g., rubrene, pentacene, anthracene, aromatic hydrocarbons, etc.). Some specific examples of the semiconducting nanomaterials include quantum dots, III-V or II-VI semiconductors, Si, Ge, transition metal dichalcogenides (WS2, WSe2, MoSes, etc.), graphene nanoribbons, semiconducting carbon nanotubes, and fullerenes and fullerene derivatives.
- The nanoparticles may have weakly bound ligands at their surface. Weakly bound ligands include molecules that attach to the nanoparticle surface through an amine, carboxylic acid, or pyridine functional group. Examples of such molecules include dodecanoic acid, triethylenetetramine, or 4-dimethylaminopyridine.
- The previously described fullerenes, conducting or semi-conducting metal oxides, and conducting or semi-conducting polymers may be semi-conductive, in that they have a finite conductivity. However, this conductivity may often be sufficient for conductive applications. The material may be considered conductive or semi-conductive depending upon the geometry and/or in what combination with other electronic components it is utilized.
- Some of the conductive or semiconductive materials are inherently electronically active or become electronically active after evaporation of the aqueous formulation. Others of the conductive or semiconductive materials have their electronic property enhanced or activated when exposed to a treatment. The treatment may be annealing or a chemical treatment (e.g., chemical interaction with another activating agent). In the examples disclosed herein, the activating agent may be contained in a separate fluid from electronic agent 38 (e.g., the fusing agent 30), and may be deposited before, after, or simultaneously with the
electronic agent 28 to activate the material in theelectronic agent 38. - Some examples of the material whose electronic property is enhanced or activated when exposed to a treatment may include conductive or semiconductive materials that become more electronically active following annealing (e.g., graphene, carbon nanotubes, WS2, WSe2, MoSe2, graphene nanoribbons, fullerenes, and semiconducting metal oxides). A surfactant may be used to incorporate these materials into the
electronic agent 38, and removal of the surfactant during annealing results in suitable electronic property/properties. Other examples of the material whose electronic property is enhanced or activated when exposed to a treatment may exhibit conductivity or semiconductivity after annealing or chemical treatment (e.g., metal nanoparticles, metal organic decomposition systems which become conductive following annealing or chemical treatment). Still other examples of the material whose electronic property is enhanced or activated when exposed to a treatment may include those materials that decompose into metallic features (e.g., metal salts). The decomposition may be initiated via heat, light, or chemical treatment (e.g., reduction). - Examples of the insulating (dielectric) material include insulating nanomaterials (nanoparticles, nanorods, nanowires, nanotubes, nanosheets, etc.), colloids, or sol-gel precursors, such as hexagonal boron nitride, metal and semiconducting oxides, metal and semiconducting nitrides, metal oxide sol-gel precursors (e.g., metal alkoxides, metal chlorides, etc.), silicon sol-gel precursors (silicates), or solid electrolytes. Other examples of the insulating material include insulating polymers (e.g., polylactic acid, fluoropolymers, polycarbonate, acrylics, polystyrene, SU-8, etc.) and insulating small molecules (i.e., having a molecular mass less than 5,000 Daltons, e.g., benzocyclobutane, paraffins, organic dyes, etc.).
- As mentioned above, the aqueous formulation of the
electronic agent 38 may include water, co-solvent(s), pH adjuster(s), and/or surfactant(s). The aqueous formulation may also include other additives, such as a biocide and/or an anti-kogation agent. - Examples of suitable co-solvents include 2-pyrrolidinone, N-methylpyrrolidone, 1-(2-hydroxyethyl)-2-pyrrolidinone, 1,6-hexanediol or other diols (e.g., 1,5-Pentanediol, 2-methyl-1,3-propanediol, etc.), triethylene glycol, tetraethylene glycol, tripropylene glycol methyl ether, or the like, or combinations thereof. Whether used alone or in combination, the total amount of the co-solvent(s) ranges from about 1 wt% to about 60 wt% of the total wt% of the
electronic agent 38. - Examples of suitable surfactants include a self-emulsifiable, nonionic wetting agent based on acetylenic diol chemistry (e.g., SURFYNOL® SEF from Air Products and Chemicals, Inc.), a nonionic fluorosurfactant (e.g., CAPSTONE® fluorosurfactants from DuPont, previously known as ZONYL FSO), and combinations thereof. In other examples, the surfactant is an ethoxylated low-foam wetting agent (e.g., SURFYNOL® 440 or SURFYNOL® CT-111 from Air Products and Chemical Inc.) or an ethoxylated wetting agent and molecular defoamer (e.g., SURFYNOL® 420 from Air Products and Chemical Inc.). Still other suitable surfactants include non-ionic wetting agents and molecular defoamers (e.g., SURFYNOL® 104E from Air Products and Chemical Inc.) or water-soluble, non-ionic surfactants (e.g., TERGITOL™ TMN-6 from The Dow Chemical Company). In some examples, it may be desirable to utilize a surfactant having a hydrophilic-lipophilic balance (HLB) less than 10.
- Whether a single surfactant is used or a combination of surfactants is used, the total amount of surfactant(s) in the
electronic agent 38 may range from about 0.5 wt.% to about 1.5 wt.% based on the total wt.% of theelectronic agent 38. - pH adjusters may be used to control the pH of the
electronic agent 38. From 0 wt% to about 2 wt% (of the total wt% of the electronic agent 38) of the pH adjuster, for example, can be used. - Examples of suitable biocides include an aqueous solution of 1,2-benzisothiazolin-3-one (e.g., PROXEL® GXL from Arch Chemicals, Inc.), quaternary ammonium compounds (e.g., BARDAC® 2250 and 2280, BARQUAT® 50-65B, and CARBOQUAT® 250-T, all from Lonza Ltd. Corp.), and an aqueous solution of methylisothiazolone (e.g., KORDEK® MLX from The Dow Chemical Co.). The biocide or antimicrobial may be added in any amount ranging from about 0.1 wt.% to about 5 wt.% with respect to the total wt.% of the
electronic agent 38. - An anti-kogation agent may be included in the
electronic agent 38. Kogation refers to the deposit of dried ink (e.g., electronic agent 38) on a heating element of a thermal inkjet printhead. Anti-kogation agent(s) is/are included to assist in preventing the buildup of kogation. Examples of suitable anti-kogation agents include oleth-3-phosphate (e.g., commercially available as CRODAFOS™ O3A or CRODAFOS™ N-3 acid from Croda), or a combination of oleth-3-phosphate and a low molecular weight (e.g., < 5,000) polyacrylic acid polymer (e.g., commercially available as CARBOSPERSE™ K-7028 Polyacrylate from Lubrizol). Whether a single anti-kogation agent is used or a combination of anti-kogation agents is used, the total amount of anti-kogation agent(s) in theelectronic agent 38 may range from about 0.1 wt.% to about 5 wt.% based on the total wt.% of theelectronic agent 38. - The
electronic agent 38 may also be dispensed from any suitable applicator, such as aninkjet printhead 32′, similar toinkjet printhead 32. As shown inFIG. 1C , theelectronic agent 38 may be applied on the surface of thelayer 14 to form anelectronic component 12, or a portion of theelectronic agent 12 on the surface of thelayer 14. - After the
electronic agent 38 is selectively applied, the appliedelectronic agent 38 may be exposed to a subsequent treatment, such as annealing (as shown in phantom inFIG. 1C ) or a chemical treatment (not shown). In other examples, the chemical treatment may be performed prior to theelectronic agent 38 being selectively applied or while theelectronic agent 38 is being selectively deposited. - Annealing may be used to accelerate evaporation of the aqueous formulation, to enhance the electronic property, and/or to activate the electronic property. It is to be understood that some
electronic agents 38 have an aqueous formulation that evaporates upon being dispensed or by the heat of thefabrication bed 24, and also do not require property enhancement or activation, and thus the treatment may not be performed with all of theelectronic agents 38. As an example,electronic agents 38 made with conducting polymers, such as PEDOT:PSS, involve solvent evaporation at a temperature of about 100° C. or less, but do not involve property enhancement or activation. Even in these instances, however, annealing may be performed in order to accelerate the evaporation process. - Annealing may be accomplished utilizing the
radiation source 34, another overhead annealing lamp, and/or a heater (not shown) of thefabrication bed 24 that is used to pre-heat thebuild material 16. The additional annealing lamp may be mounted toprinting system 20, for example, with theradiation source 34 and/or upon the printing carriage. The additional annealing lamp may be an arc-lamp, a flash lamp, or the like. Thelayer 14 and theelectronic agent 38 thereon may be exposed to annealing in thefabrication bed 24, or theprinting system 20 may include an additional bed or platform where annealing takes place. - Annealing takes place for a specified time and at a specified energy output determined, at least in part, by the surfactant(s), solvent system, and/or sintering conditions for the material used in the
electronic agent 38. When metal nanoparticles are used in theelectronic agent 38, annealing may also be dependent upon the particle size and/or a ligand system associated with then nanoparticles. Annealing may take place at a temperature below the melting temperature of thebuild material 16, but at a temperature that is suitable to evaporate the aqueous formulation (water, co-solvent, and in some instances surfactant), or to enhance or activate the material in theelectronic agent 38. Annealing may also take place at a temperature at or above the melting temperature of the build material 16 (which may range from 50° C. to 2000° C. depending upon the build material 12). At temperatures higher than the melting temperature of thebuild material 16, thebuild material 16 may melt, which is acceptable. Following this type of higher temperature anneal, a delay in the print process can be employed to allow for thepart 14 to cool beforeadditional build material 16 is supplied for the next layer. In other instances, the temperature rise may be quick, which is useful to cause annealing but leaves thebuild material 16 largely unaffected (in terms of exhibiting a similar temperature rise). - The following are a few examples of the annealing process. When annealing is utilized to drive off solvent (e.g., water and co-solvent) and/or surfactant(s), relatively low temperatures (about 350° C. or less) may be utilized. When the
electronic agent 38 includes graphene, the annealing temperature may be less than 150° C. When theelectronic agent 38 includes small metal nanoparticles (e.g., diameter ≤ 10 nm) or nanoparticles with weakly bound ligands, the annealing temperature may be about 200° C. or less. At these temperatures, the small metal nanoparticles or nanoparticles with weakly bound ligands are capable of sintering and becoming electronically active. When theelectronic agent 38 includes silver nanoparticles, the annealing temperature may be greater than 100° C. Larger metal nanoparticles may require higher temperatures and/or longer annealing times. - During annealing, the resistance of the
electronic component 12 may be monitored to determine the minimum time for obtaining the suitable electronic property. - Some examples of the
electronic agents 38 that are thermal inkjet jettable and the corresponding annealing utilized with the electronic agents are shown in Table 1. -
TABLE 1 Electronic Agent Formulation Annealing Conditions Silver Nanoparticle Ink 86 wt% METALON® Ink: Silver* and 14 wt% aqueous formulation** > 150° C. and/or light PEDOT:PSS Ink 86 wt% PEDOT:PSS (0.8 wt% in water) and 14 wt% aqueous formulation** pH adjusted to 9 50° C. - 110° C. Graphene Ink 3 wt% Nano99 powder***; 2.5 wt% JONCRYL® 683 resin****; 14 wt% aqueous formulation**; and 80.5 wt% additional water < 150° C. Carbon Nanotube Ink***** Aqueous based ink including ~0.1 wt% carbon nanotubes < 150° C. *Available from Novacentrix **Aqueous formulation includes: 1 wt% - 50 wt% 2-pyrrolidinone, 0.1 wt% - 5 wt% anti-kogation agent, 0.1 wt% - 5 wt% biocide, 0.01 wt% - 5 wt% other additives, balance of DI water ***Available from Asbury Online ****Available from BASF Corp. *****TUBALL™ Ink available from OCSiAI - As previously mentioned, chemical treatment may be used to enhance the electronic property and/or to activate the electronic property. An example of the chemical treatment involves ligand destabilization of nanoparticles having ligands weakly bound thereto. Ligand destabilization removes the ligands from the metal nanoparticles to enhance sintering. Examples of ligand destabilizers include sodium chloride and potassium iodide. Another example of the chemical treatment is doping. Doping may enhance the electronic property. Benzyl viologen and sodium azide may be suitable dopants for the carbonaceous materials. Another example of the chemical treatment is a reduction process. Reducing agent(s), such as hydrazine, sodium borohydride, formaldehyde, etc., may be used to reduce metal salts or metal oxide nanoparticles.
- The thickness of the electronic component 12 (or portion thereof) may be built up by applying more of the
electronic agent 38 on the previously appliedelectronic agent 38. In some instances, after each application of the electronic agent, 38, the electronic agent may be exposed to annealing. These processes may be repeated until a desirable thickness of theelectronic component 12 is achieved. If annealing is not desired or required, the depositedelectronic agent 38 may be allowed to dry before a subsequent layer of theelectronic agent 38 is selectively applied thereon. Theelectronic agent 38 may also be deposited layer by layer until a suitable thickness is achieved, and a single annealing step (if desired or required) may be performed. In an example, theelectronic agent 38 may be applied in an amount ranging from about 0.1 picoliters to about 36 picoliters per pixel at 600 dots per inch. - While
FIG. 1C illustrates the selective application of oneelectronic agent 38, it is to be understood that several (e.g., two, three, four, etc.) differentelectronic agents 38 may be selectively applied to different areas of thelayer 14 to form different portions of the electronic component 12 (e.g., a conducting portion and an insulating portion of a capacitor). Also, several differentelectronic agents 38 may also be selectively applied to the same area of thelayer 14 to form at least a portion of theelectronic component 12. The use of several differentelectronic agents 38 in the same area may enhance the electronic properties of theelectronic component 12. - Examples of the
electronic component 12 that may be formed include conductors, insulators, resistors, capacitors, inductors, memristors, diodes, transistors, rectifiers, transducers, relays, chemical or electronic sensors, transformers, antennas, radio frequency identifiers (RFID), batteries, switches, light emitting diodes (LED), thermoelectric devices, piezo-responsive devices, photovoltaics, or the like. - An example of the
device 10, including the 3D printedlayer 14 andelectronic component 12 formed thereon, is shown inFIG. 2 . Theelectronic component 12 shown inFIG. 2 may be referred to as a “horizontal feature,” in part because it is printed on the top most (or horizontal) surfaces of voxels of thelayer 14. - In some examples of the method, the
electronic component 12 may be at least partially embedded in another layer of the 3D object/part. An example of this is shown inFIGS. 1D and 1E . The example method shown inFIGS. 1D and 1E at least partially embeds theelectronic component 12 in the additional layer 40 (shown inFIG. 1E ). The resultingdevice 10′ is shown inFIG. 3A . - As shown in
FIG. 1D anadditional layer 18′ ofbuild material 16 is applied on thelayer 14 and on theelectronic component 12. Theadditional layer 18′ may be added in a similar manner as the layer 18 (described inFIG. 1A ). The fusingagent 30 may then be selectively applied to theadditional layer 18′ ofbuild material 16 anywhere that theadditional layer 18′ is to be fused. As shown inFIG. 1D , the fusingagent 30 is applied over all of thebuild material 16 in theadditional layer 18′. The fusingagent 30 could also be selectively applied so that a portion of thebuild material 16 does not fuse. - As shown in
FIG. 1E , theadditional layer 18′ and fusingagent 30 are exposed to the radiation R, which fuses the build material 16 (in theadditional layer 18′ and in contact with the fusing agent 30) to form thelayer 40. - It is to be understood that heat absorbed, during the application of energy, by the
build material 16 in theadditional layer 18′ on which fusingagent 30 has been delivered or has penetrated may propagate to a previously solidified layer, such aslayer 14, causing at least some of thatlayer 14 to heat up above its melting point. This effect helps create strong interlayer bonding betweenadjacent layers device 10′. - Rather than covering the
electronic component 12 and the exposed surfaces of thelayer 14 with additional build material 16 (as shown inFIG. 1D ), thebuild material 16 may be delivered to the exposed surface(s) of thelayer 14 and adjacent to the side(s) of theelectronic component 12, but not over theelectronic component 12. This forms anadditional layer 18′ of thebuild material 16 that does not completely cover the electronic component 12 (i.e., the top surface of the electronic component remains exposed). The fusingagent 30 may then be selectively applied to theadditional layer 18′ ofbuild material 16 anywhere that theadditional layer 18′ is to be fused. Theadditional layer 18′ and fusingagent 30 are exposed to the radiation R, which fuses the build material 16 (in theadditional layer 18′ and in contact with the fusing agent 30). An example of thelayer 40′ and thedevice 10″ formed via this example of the method is shown inFIG. 3B . Thelayer 40′ surrounds two sides of theelectronic component 12, but does not completely encapsulate the electronic component. - Referring now to
FIGS. 4A through 4C and 4A, 4D and 4E , two other examples of the method for forming 3D printed electronics are shown. As shown inFIG. 4A , the methods include applying thebuild material 16. As depicted, onelayer 18 of thebuild material 16 has been applied. Thebuild material 16 may be applied using theprinting system 20. Thebuild material 16 may also be pre-heated in thefabrication bed 24. - Also as shown in
FIG. 4A , theelectronic agent 38 is selectively applied on at least a portion of thebuild material 16. Any of theelectronic agents 38 previously described may be applied, depending upon the electronic property that is to be imparted and/or the electronic component(s) 12′ (seeFIGS. 4C and 4E ) that is/are to be formed. A singleelectronic agent 38 may be applied in a suitable pattern or two or moreelectronic agents 38 may be applied in different patterns to form different portions of the electronic component(s) 12′ that is/are to be formed. - The application of the electronic agent(s) 38 forms a build material portion 42 having the electronic property. The electronic agent(s) 38 may be applied in a single pass or in multiple passes using the
printhead 32′. The thickness of the build material portion 42 may be increased as more electronic agent(s) 38 is applied. In an example, theelectronic agent 38 may be applied in an amount up to about 200 picoliters per pixel at 600 dots per inch and with a build material thickness of up to about 100 µm. - After each pass, or after the desired amount of the
electronic agent 38 is applied to thebuild material 16, thebuild material 16 and theelectronic agent 38 may be exposed to a treatment (e.g., annealing, chemical treatment, etc.) to accelerate evaporation of the aqueous formulation, to enhance the electronic property, and/or to activate the electronic property. In other examples, before or during each pass, theelectronic agent 38 may be exposed to a chemical treatment to enhance the electronic property and/or to activate the electronic property. It is to be understood that someelectronic agents 38 have an aqueous formulation that evaporates upon being dispensed, and also do not require property enhancement or activation, and thus the treatment may not be performed with all of theelectronic agents 38. Annealing takes place at any suitable temperature, depending, at least in part, on the surfactant(s), solvent system, and/or sintering conditions for the material used in theelectronic agent 38. - In some examples, the
electronic agent 38 occupies such a small space that there islittle build material 16 within the volume of theelectronic agent 38. In other examples, theelectronic agent 38 occupies enough space that there is a significant amount ofbuild material 16 within the volume. The driedelectronic agent 38 is capable of holding thebuild material 16 in contact therewith together. In the example shown inFIG. 4A , the build material portion 42 is an electronic via (one example of theelectronic component 12′) that extends through the thickness of thebuild material layer 18. - As shown in both
FIGS. 4B and 4D , the fusingagent 30 is then selectively applied on other portion(s) 44, 46 of thebuild material 16. Any of the previously described fusingagents 30 may be used, and the fusingagent 30 may be selectively applied using theprinthead 32. In the example shown inFIG. 4B , the fusingagent 30 is selectively applied to all of the build material 16 (in bothportions 44 and 46), except on the build material portion 42. In other words, the fusingagent 30 is applied to all of thebuild material 16 around the build material portion 42. In the example shown inFIG. 4D , the fusingagent 30 is selectively applied to theportion 44 of thebuild material 16, while theportion 46 of thebuild material 16 remains untreated. It is to be understood thatportion 46 could have the fusingagent 30 applied thereto andportion 44 could remain untreated. Still further, the fusingagent 30 may be applied in any suitable pattern on the portion(s) 44, 46 around the build material portion 42. - As shown in both
FIGS. 4C and 4E , after the fusingagent 30 is selectively applied in the specific portion(s) 44 and/or 46, theentire layer 18 of thebuild material 16 is exposed to radiation R. The radiation R is emitted from theradiation source 34, which may be any of the example radiation sources described herein. The fusingagent 30 enhances the absorption of the radiation R, converts the absorbed radiation to thermal energy, and promotes the transfer of the thermal heat to thebuild material 16 in contact therewith. In an example, the fusingagent 30 sufficiently elevates the temperature of thebuild material 16 above the melting point(s), allowing curing (e.g., sintering, binding, fusing, etc.) of the build material particles to take place. - Exposure to radiation R forms a
layer 14′ of the 3D object/part. In the example shown inFIGS. 4C and 5A , thelayer 14′ surrounds the vertical surface(s) Vs of theelectronic component 12′ while the top surface remains exposed. Theelectronic component 12′ shown inFIG. 5A may be referred to as an “embedded vertical feature,” in part because it is printed within the volume of the voxels of thebuild material 16 and the vertical surface Vs of theelectronic component 12′ are not exposed in the final device. In the example shown inFIGS. 4E and 5B , thelayer 14′ surrounds some of the vertical surface(s) Vs of theelectronic component 12′ while some other of the vertical surface(s) Vs and the top surface remain exposed. Theelectronic component 12′ shown inFIG. 5B may be referred to as a “surface vertical feature,” in part because it is printed within the volume of the voxels of thebuild material 16 and a portion of the vertical surface Vs of theelectronic component 12′ is exposed in the final device. - Referring back briefly to
FIG. 4E , theportion 46 of thebuild material 16 that does not have the fusingagent 30 applied thereto does not absorb enough energy to fuse. Anyunfused build material 16 may be removed from thelayer 14′ and theelectronic component 12′ that are formed. It is to be understood that if anyunfused build material 16 remains in thefabrication bed 24 inFIG. 4C , it can also be removed from thelayer 14′ andelectronic component 12′ that are formed. - Referring now to
FIGS. 6A through 6C , still another example of the method for forming 3D printed electronics is shown. As shown inFIG. 6A , the method includes applying thebuild material 16. As depicted, onelayer 18 of thebuild material 16 has been applied. Thebuild material 16 may be applied using theprinting system 20. Thebuild material 16 may also be pre-heated in thefabrication bed 24. - Also as shown in
FIG. 6A , theelectronic agent 38 is selectively applied on at least a portion of thebuild material 16. In the example shown inFIG. 6A , theelectronic agent 38 is applied to all of thebuild material 16, although it could be applied to less than all of thebuild material 16. Any of theelectronic agents 38 previously described may be applied, depending upon the electronic property that is to be imparted. A singleelectronic agent 38 may be applied in a suitable pattern or two or moreelectronic agents 38 may be applied in different patterns. - The application of the electronic agent(s) 38 forms a build material portion 42 having the electronic property. The electronic agent(s) 38 may be applied in a single pass or in multiple passes using the
printhead 32′. The thickness of the build material portion 42 may be increased by adding additionalelectronic agent 38. - After each pass, or after the desired amount of the
electronic agent 38 is applied to thebuild material 16, thebuild material 16 and theelectronic agent 38 may be exposed to a treatment (e.g., annealing, chemical treatment, etc.) to accelerate evaporation of the aqueous formulation, to enhance the electronic property, and/or to activate the electronic property. In other examples, before or during each pass, theelectronic agent 38 may be exposed to a chemical treatment to enhance the electronic property and/or to activate the electronic property. It is to be understood that someelectronic agents 38 have an aqueous formulation that evaporates upon being dispensed, and also do not require property enhancement or activation, and thus the treatment may not be performed with all of theelectronic agents 38. Annealing takes place at any suitable temperature, depending, at least in part, on the surfactant(s), solvent system, and/or sintering conditions for the material used in theelectronic agent 38. - As shown in
FIG. 6B , the fusingagent 30 is then selectively applied on the same portion of thebuild material 16 to which theelectronic agent 38 is applied. Any of the previously described fusingagents 30 may be used, and the fusingagent 30 may be selectively applied using theprinthead 32. - As shown in
FIG. 6C , after the fusingagent 30 is selectively applied, theentire layer 18 of thebuild material 16 is exposed to radiation R. The radiation R is emitted from theradiation source 34, which may be any of the example radiation sources described herein. The fusingagent 30 enhances the absorption of the radiation R, converts the absorbed radiation to thermal energy, and promotes the transfer of the thermal heat to thebuild material 16 in contact therewith. In an example, the fusingagent 30 sufficiently elevates the temperature of thebuild material 16 above the melting point(s), allowing curing (e.g., sintering, binding, fusing, etc.) of the build material particles to take place. - Exposure to radiation R forms a
layer 44 of the 3D object/part having the electronic property of theelectronic agent 38 imparted thereto. Thelayer 44 may be referred to as a “volume feature,” in part because the electronic property is imparted throughout at least a portion of the volume of thelayer 44 that is formed. This volume approach is useful for creating scratch resistant static-dissipative or antistatic parts. - Any
unfused build material 16 may be removed from thelayer 44. - While all of the
build material 16 in thefabrication bed 24 is shown forming thelayer 44 inFIGS. 6A-6C , it is to be understood that theelectronic agent 38 and the fusingagent 30 may be applied to the same portion of thebuild material 16 which makes up less than all of thebuild material 16 in thelayer 18. The remaininguntreated build material 16 in the layer 18 (i.e., which doesn’t have either theelectronic agent 38 or the fusingagent 30 thereon) may be left untreated and may be removed after fusing. The remaininguntreated build material 16 in the layer 18 (i.e., which doesn’t have either theelectronic agent 38 or the fusingagent 30 thereon) may also be patterned with the fusingagent 30 alone in order to define alayer volume feature layer 44 after fusing. - Still further, in the example of the method shown in
FIGS. 6A-6C , annealing conditions that are separate from the fusing conditions may not be not required. For example, if theelectronic agent 38 requires no activation and the solvent(s) and/or surfactants of theelectronic agent 38 may be driven off under the fusing conditions, the annealing may be skipped. Theelectronic agent 38 and the fusingagent 30 may be selectively applied simultaneously, and then exposed to the radiation R. Radiation exposure (without additional annealing) will form thelayer 44 as well as drive off any solvent. - The
electronic agent 38 including the conductive material, the semiconductive material, or the material whose electronic property is enhanced or activated when exposed to treatment may function similar to the fusing agent or be used as (i.e., in place of) thefusing agent 30. When theelectronic agent 38 functions as a fusingagent 30 or is used in place of the fusingagent 30, the electronic property may be imparted to the bulk of the layer(s) (e.g.,layer electronic agent 38 may actually aid in fusing thebuild material 16 upon which it is applied. For example, inFIG. 4A , if theelectronic agent 38 functions as a fusing agent, the build material portion 42 may fuse during the annealing. As such, theelectronic agent 38 may be selected as the fusingagent 30 when it is desirable to impart a particular electronic property to the layer(s) that are being fused. As such, theelectronic agent 38 may also work as a fusingagent 30 and melt thebuild material 16; or theelectronic agent 38 may not work as a fusingagent 30 and either thermal bleed from the surrounding areas fuses thebuild material 16 withelectronic agent 38 thereon or thebuild material 16 havingelectronic agent 38 thereon simply becomes lightly fused, being held together by the driedelectronic agent 38. - To further illustrate the present disclosure, examples are given herein. It is to be understood that these examples are provided for illustrative purposes and are not to be construed as limiting the scope of the present disclosure.
- A layer (100 µm thick) of polyamide-12 (PA-12) build material was applied to a fabrication bed and was pre-heated 150° C. Silver nanoparticle ink (86 wt% METALON® Ink: Silver* and 14 wt% aqueous formulation) was used as the fusing agent. The aqueous formulation included 1 wt% - 50 wt% 2-pyrrolidinone, 0.1 wt% - 5 wt% anti-kogation agent, 0.1 wt% - 5 wt% biocide, 0.01 wt% - 5 wt% other additives, and a balance of DI water. The silver nanoparticle ink was thermal inkjet printed with a 9 ng printhead on the PA-12 layer. The PA-12 (with silver nanoparticle ink applied thereto) was subjected to selective fusion with a 300 W halogen light bulb using a prototype Multi jet Fusion™ Machine (Hewlett Packard). This process was repeated 4 more times to form a part with 5 fused layers (total thickness ~ 500 µm).
- 5 layers of silver nanoparticle ink was jetted directly onto the surface of the part, creating a surface horizontal feature. The thin film on the top of the part was not conductive when initially taken off the build bed, but became conductive when the entire part was annealed in an oven at 150° C. for 4 hours. For the thin film, the measured sheet resistance was ~120 Ohms/sq with a bulk conductivity of ~20,000 Siemens/m. The underlying part was not conductive.
- Four commercially available electronic inks were tested. Three of the four inks were mixed with an aqueous formulation, which included 1 wt% - 50 wt% 2-pyrrolidinone, 0.1 wt% - 5 wt% anti-kogation agent, 0.1 wt% - 5 wt% biocide, 0.01 wt% - 5 wt% other additives, and a balance of DI water to form the electronic agent. The fourth commercially available ink (i.e., the carbon nanotube ink shown in Table 2) was used as received (i.e., was not mixed with the aqueous formulation). A graphene based electronic agent was also prepared with 3 wt% Nano99 powder, 2.5 wt% JONCRYL® 683 resin, 14 wt% of the aqueous formulation, and 80.5 wt% additional water. Table 2 illustrates the commercially available inks that were used, the advertised conductivity, and the concentration in the aqueous thermal inkjet vehicle.
-
TABLE 2 Ink # Commercially Available Ink Concentration in TIJ Vehicle Advertised Conductivity 1 METALON® Ink: Silver 25 wt% (~ 2.5 vol%) 0.01 Ω/sq, 107 S/m 2 PEDOT:PSS (0.8 wt% in water) 1.0 wt% 50-120 Ω/sq, 1000 S/m 3 XG Sciences Graphene Ink Up to 8 wt% 10 Ω/sq, 100 S/m 4 TUBALL™ Ink (0.1 wt% Carbon Nanotube Ink) N/A 100 Ω/sq - Experiment 1: For this experiment, ~30 µL of each of
inks 1, 2, 3, 4, and the in-house graphene ink were spotted on one side of a silicon substrate (~15 mm in width and ~40 mm in length). A draw-down rod (#11 wire, ~30 µm liquid film) was used to spread the ink upon the silicon substrate. The substrates were annealed under different conditions, as shown in Table 3. Resistance measurements were taken of the films to obtain sheet resistance and resistivity. -
TABLE 3 Sample Ink # Annealing Conditions Advertised Resistance (σ or S/m) Measured Resistance (σ or S/m) Advertised Resistivity (Ω/sq) Measured Resistivity (Ω/sq) A 1 175° C., 7 hrs 107 S/m 106 S/m 0.1 Ω/sq 0.5 Ω/sq B 2 50° C., 10 min 1000 S/m 1000 S/m 50-120 Ω/sq 100 Ω/sq C1 in-house graphene 50° C., 10 min 100 S/m* 10 S/ m 10 Ω/sq* 100,000 Ω/sq C2 3 50° C., 10 min 100 S/m* No measurable resistance 10 Ω/sq* No measurable resistivity D 4 Air dried 10,000 S/m 10,000 S/m 100 Ω/sq 1000 Ω/sq *Advertised values of commercially available graphene ink - The films created on the silicon substrates were used to establish a baseline for films formed on other surfaces, as described in experiments 2-5. By using drying/annealing conditions similar to those recommended by the ink suppliers, films with sheet resistances and resistivities within an order of magnitude of the supplier spec were able to be created for
inks 1, 2, and 4. The films formed with the in-house graphene ink and ink 3 did not correspond with advertised values, however, this may be due to the fact that graphene in the ink is not in a fully crystallized form. The graphene structure may be deformed, which could degrade the electronic properties. The graphene ink may be suitable for forming a resistor or a heater. - Experiment 2: For this experiment, ~30 µL of each of
inks 1, 2, 3 and 4 was spotted on one side of aPA 12 surface. A draw-down rod (#11 wire, ~30 µm liquid film) was used to spread the ink upon thePA 12 surface. The substrates were annealed under different conditions, as shown in Table 4. Resistance measurements were taken of the films to obtain sheet resistivity. -
TABLE 4 Sample Ink # Annealing Conditions Advertised Resistivity (Ω/sq) Measured Resistivity (Ω/sq) E 1 175° C., 8 hrs followed by 145° C., 72 hrs 0.01 Ω/ sq 1 Ω/sq F 2 175° C., 5 min 50-120 Ω/sq 100 Ω/sq G 3 175° C., 5 min 10 Ω/sq 1,000,000 Ω/sq H 4 175° C., 5 min 100 Ω/sq 1000 Ω/sq - When applied to
PA 12, there was little change in the conductivity for the PEDOT:PSS film (Sample F) and CNT film (Sample H) (when comparing the results from experiment 1), but the Ag NP film (Sample E) lost around an order of magnitude of conductivity (when comparing the results from experiment 1). Even with this loss, the conductivity of Sample E is still the highest among the samples tested. - Experiment 3: For experiment 3, ~30 µL of ink 2 was spotted on one side of a
PA 12 surface. A draw-down rod (#11 wire, ~30 µm liquid film) was used to spread the ink upon thePA 12 surface. Asecond PA 12 surface was applied to sandwich the film. The substrate was annealed. Resistance measurements were taken of the films to obtain sheet resistivity (shown in Table 5). -
TABLE 5 Sample Ink # Annealing Conditions Advertised Resistivity (Ω/sq) Measured Resistivity (Ω/sq) I 2 210° C., 2 min 50-120 Ω/sq 1000 - 10,000 Ω/sq - When sandwiched between two
PA 12 substrates, the PEDOT:PSS film (Sample I) lost around an order of magnitude of conductivity (when comparing the results fromexperiments 1 and 2). Even with this loss, the conductivity of Sample I is reasonable. - Experiment 4: For
experiment 4, 20 wt% of inks 2 and 4 were mixed withbulk PA 12 powder. The ink/bulk mixture was annealed at 210° C. for 5 minutes. Resistance measurements were taken of the bulk polymer films to obtain bulk resistance (shown in Table 6). -
TABLE 6 Sample Ink # Advertised Resistance (σ or S/m) Measured Resistance (σ or S/m) J 2 1000 S/m 0.001 S/m K 4 10,000 S/m 0.01 S/m - With 20 wt% of inks 2 and 4 mixed with
bulk PA 12 powder, there was measurable conductivity of the bulk polymer film (~0.5 mm thick), although it was lower than the film measurements in other experiments. However, the volume-based conductivity measured in experiment 5 is sufficient for creating scratch-resistant part surfaces which are anti-static (109-1012 Ω/sq) or static dissipative (106-109 Ω/sq). - Reference throughout the specification to “one example”, “another example”, “an example”, and so forth, means that a particular element (e.g., feature, structure, and/or characteristic) described in connection with the example is included in at least one example described herein, and may or may not be present in other examples. In addition, it is to be understood that the described elements for any example may be combined in any suitable manner in the various examples unless the context clearly dictates otherwise.
- It is to be understood that the ranges provided herein include the stated range and any value or sub-range within the stated range. For example, a range from about 50° C. to about 2100° C. should be interpreted to include not only the explicitly recited limits of about 50° C. to about 2100° C., but also to include individual values, such as 57° C., 95° C., 225° C., 1350° C., etc., and sub-ranges, such as from about 75° C. to about 2025° C., from about 100° C. to about 1900° C., etc. Furthermore, when “about” is utilized to describe a value, this is meant to encompass minor variations (up to +/-10%) from the stated value.
- In describing and claiming the examples disclosed herein, the singular forms “a”, “an”, and “the” include plural referents unless the context clearly dictates otherwise.
- While several examples have been described in detail, it is to be understood that the disclosed examples may be modified. Therefore, the foregoing description is to be considered non-limiting.
Claims (20)
1. A method for forming three-dimensional (3D) printed electronics, the method comprising:
applying a polymeric powder build material;
selectively applying, via a thermal inkjet printhead or a piezoelectric inkjet printhead, an aqueous formulation including an electronic agent on at least a portion of the build material, thereby forming a build material portion with an electronic property;
selectively applying, via a thermal inkjet printhead or a piezoelectric inkjet printhead, a fusing agent i) on an other portion of the build material around the build material portion or ii) on the build material portion, wherein the fusing agent comprises a water-based dispersion including an infrared light absorbing colorant; and
exposing the build material to radiation, thereby fusing the other portion or the build material portion in contact with the fusing agent.
2. The method of claim 1 , further comprising annealing the build material portion prior to selectively applying the fusing agent.
3. The method of claim 1 , wherein the selectively applying of the electronic agent includes:
selectively applying a first electronic agent, thereby imparting a first electronic property to the build material portion; and
selectively applying a second electronic agent on the first electronic agent, thereby imparting a second electronic property to the build material portion;
wherein the first and second electronic properties are different.
4. The method of claim 1 , wherein one of:
the other portion of the build material includes all of the build material that surrounds the build material portion; or
the other portion of the build material includes less than all of the build material that surrounds the build material portion.
5. The method of claim 1 , wherein the electronic agent includes a conductive material, a material whose electronic property is enhanced or activated when exposed to a treatment, a semiconductive material, or an insulating material.
6. The method of claim 1 , wherein the electronic agent and the fusing agent are simultaneously selectively applied on the at least portion of the build material.
7. The method of claim 1 , wherein the fusing agent is applied on the at least the portion of the build material, and wherein the method further comprises defining an electronic feature by one of:
after fusing, removing unfused build material; or
before fusing, selectively applying the fusing agent on at least some of the build material around the build material portion.
8. A three-dimensional (3D) printing system, comprising:
a supply of build material;
a build material distributor;
a supply of an electronic agent including a conductive material, a material whose electronic property is enhanced or activated when exposed to a treatment, a semiconductive material, or an insulating material;
an applicator for selectively dispensing the electronic agent;
a supply of a fusing agent;
an inkjet applicator for selectively dispensing the fusing agent;
a controller; and
a non-transitory computer readable medium having stored thereon computer executable instructions to cause the controller to:
utilize the build material distributor to dispense the build material on a fabrication bed; and
utilize the applicator and the inkjet applicator to respectively and selectively dispense the electronic agent and the fusing agent to form a three-dimensional part having an electronic property.
9. The system of claim 8 , further comprising computer executable instructions to cause the controller to utilize annealing equipment to anneal a portion of the build material prior to selectively applying the fusing agent.
10. The system of claim 8 , wherein:
prior to the selectively dispensing the electronic agent, the system further comprising selectively dispensing, via another applicator, a first electronic agent on an area of the three-dimensional part on the fabrication bed, thereby imparting a first electronic property to the area, wherein the first electronic agent is a conductive material;
the electronic agent is the insulating material and the electronic agent is selectively dispensed on the first electronic agent, thereby imparting a second electronic property to the area; and
the first electronic property is conductivity and the second electronic property is the electrically insulating property.
11. The system of claim 8 , further comprising computer executable instructions to cause the controller to at least partially embed the three-dimensional part by:
dispensing additional build material on the three-dimensional part;
dispensing the fusing agent on at least a portion of the additional build material; and
exposing the additional build material to radiation, thereby fusing the at least the portion of the additional build material.
12. The system of claim 11 , wherein the selectively dispensing of the fusing agent is accomplished by applying the fusing agent on the at least the portion of the additional build material that does not cover the at least the portion of the 3D object layer having the electronic property.
the unfused polymeric powder build material is a semi-crystalline thermoplastic material.
13. The system of claim 8 , wherein:
prior to the selectively dispensing the electronic agent, the system further comprising selectively dispensing a first electronic agent on a first area of the three-dimensional part on the fabrication bed, thereby imparting a first electronic property to the first area, wherein the first electronic agent is a conductive material;
the electronic agent is the insulating material and the electronic agent is selectively dispensed on a second area of the three-dimensional part on the fabrication bed, thereby imparting a second electronic property to the second area; and
the first electronic property is conductivity and second electronic property is the electrically insulating property.
14. The system of claim 8 , wherein the build material is a semi-crystalline thermoplastic material.
15. The system of claim 8 , wherein the build material is a polyamide material selected from the group consisting of polyamide 11, polyamide 12, polyamide 6, polyamide 8, polyamide 9, polyamide 66, polyamide 612, polyamide 812, and polyamide 912.
16. The system of claim 8 , wherein the conductive material includes a combination of carbon nanotudes, silver nanoparticles and a poly(3,4-ethylendioxythiophene) polystyrene sulfonate polymer.
17. A non-transitory computer readable medium media having computer-executable instructions embodied thereon that, when executed, perform a method for forming three-dimensional (3D) printed electronics, the method comprising:
applying a polymeric powder build material onto a fabrication bed;
selectively applying, via a thermal inkjet printhead or a piezoelectric inkjet printhead, an aqueous formulation including an electronic agent on at least a portion of the build material, thereby forming a build material portion with an electronic property;
selectively applying, via a thermal inkjet printhead or a piezoelectric inkjet printhead, a fusing agent i) on an other portion of the build material around the build material portion or ii) on the build material portion, wherein the fusing agent comprises a water-based dispersion including an infrared light absorbing colorant; and
exposing the build material to radiation, thereby fusing the other portion or the build material portion in contact with the fusing agent.
18. The media of claim 17 , wherein the electronic agent and the fusing agent are simultaneously selectively applied on the at least portion of the build material to form the three-dimensional part.
19. The media of claim 17 , wherein the selectively applying of the electronic agent includes:
selectively applying a first electronic agent, thereby imparting a first electronic property to the build material portion; and
selectively applying a second electronic agent on the first electronic agent, thereby imparting a second electronic property to the build material portion;
wherein the first and second electronic properties are different.
20. The media of claim 17 , wherein the electronic agent includes a conductive material, a material whose electronic property is enhanced or activated when exposed to a treatment, a semiconductive material, or an insulating material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18/132,821 US20230264414A1 (en) | 2015-10-29 | 2023-04-10 | Forming three-dimensional (3d) printed electronics |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2015/058094 WO2017074397A1 (en) | 2015-10-29 | 2015-10-29 | Forming three-dimensional (3d) printed electronics |
US201815763200A | 2018-03-26 | 2018-03-26 | |
US18/132,821 US20230264414A1 (en) | 2015-10-29 | 2023-04-10 | Forming three-dimensional (3d) printed electronics |
Related Parent Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/763,200 Division US11648731B2 (en) | 2015-10-29 | 2015-10-29 | Forming three-dimensional (3D) printed electronics |
PCT/US2015/058094 Division WO2017074397A1 (en) | 2015-10-29 | 2015-10-29 | Forming three-dimensional (3d) printed electronics |
Publications (1)
Publication Number | Publication Date |
---|---|
US20230264414A1 true US20230264414A1 (en) | 2023-08-24 |
Family
ID=58631922
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/763,200 Active 2037-03-09 US11648731B2 (en) | 2015-10-29 | 2015-10-29 | Forming three-dimensional (3D) printed electronics |
US18/132,821 Pending US20230264414A1 (en) | 2015-10-29 | 2023-04-10 | Forming three-dimensional (3d) printed electronics |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/763,200 Active 2037-03-09 US11648731B2 (en) | 2015-10-29 | 2015-10-29 | Forming three-dimensional (3D) printed electronics |
Country Status (2)
Country | Link |
---|---|
US (2) | US11648731B2 (en) |
WO (1) | WO2017074397A1 (en) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015006363A1 (en) * | 2015-05-20 | 2016-12-15 | Voxeljet Ag | Phenolic resin method |
JP2017133055A (en) * | 2016-01-26 | 2017-08-03 | セイコーエプソン株式会社 | Three-dimensional manufacturing method for function element structure, and function element structure |
WO2018022034A1 (en) * | 2016-07-27 | 2018-02-01 | Hewlett-Packard Development Company, L.P. | Forming three-dimensional (3d) electronic parts |
EP3544788A4 (en) | 2017-04-18 | 2020-07-22 | Hewlett-Packard Development Company, L.P. | Increasing electrical conductivity at selected locations of a 3d object |
KR102190291B1 (en) * | 2017-04-28 | 2020-12-14 | 한국전기연구원 | Ag Ink For 3D Printing And 3D Printing Methods Using The Same |
CN111356738B (en) | 2017-11-30 | 2022-07-26 | 惠普发展公司,有限责任合伙企业 | Anti-coalescing agent for three-dimensional printing |
WO2019147263A1 (en) * | 2018-01-26 | 2019-08-01 | Hewlett-Packard Development Company, L.P. | Three-dimensional printed part |
US11911825B2 (en) | 2018-03-13 | 2024-02-27 | Hewlett-Packard Development Company, L.P. | Fusing electronic components into three-dimensional objects via additive manufacturing processes |
WO2019195473A2 (en) * | 2018-04-03 | 2019-10-10 | The Regents Of The University Of California | Methods for photo-induced metal printing |
WO2019199328A1 (en) * | 2018-04-13 | 2019-10-17 | Hewlett-Packard Development Company, L.P. | Three-dimensional printing |
WO2019212480A1 (en) * | 2018-04-30 | 2019-11-07 | Hewlett-Packard Development Company, L.P. | A 3d printing computer application 3d printing using the same |
US11534795B2 (en) * | 2018-10-23 | 2022-12-27 | Research & Business Foundation Sungkyunkwan University | Preparing method of monomolecular nano-thin film |
US20230271248A1 (en) * | 2018-11-07 | 2023-08-31 | James J. Myrick | Processes, Compositions and Systems for 2D and 3D Printing |
US11685114B2 (en) | 2019-01-15 | 2023-06-27 | Hewlett-Packard Development Company, L.P. | Additive manufacturing of three-dimensional object |
US11577463B2 (en) | 2019-03-15 | 2023-02-14 | Hewlett-Packard Development Company, L.P. | Patterns on objects in additive manufacturing |
WO2020190262A1 (en) | 2019-03-15 | 2020-09-24 | Hewlett-Packard Development Company, L.P. | Coloured object generation |
US20220250319A1 (en) * | 2019-08-05 | 2022-08-11 | Hewlett-Packard Development Company, L.P. | Additive manufacturing with laser arrays |
EP3869408A1 (en) * | 2020-02-20 | 2021-08-25 | Hewlett-Packard Development Company, L.P. | 3d-printed components with rfid connection detection |
WO2021171282A1 (en) * | 2020-02-27 | 2021-09-02 | Nanofabrica Ltd. | System, method and computer readable medium for three-dimensional (3d) printing |
US20210339488A1 (en) * | 2020-05-04 | 2021-11-04 | U.S. Army Combat Capabilities Development Command, Army Research Laboratory | Photonic annealing of electrically-conductive thermoplastics |
US20220297377A1 (en) * | 2021-03-19 | 2022-09-22 | Forcast Research & Development Corp. | Flexible Transparent Heater For Additive Manufacturing Device |
WO2024072415A1 (en) * | 2022-09-30 | 2024-04-04 | Hewlett-Packard Development Company, L.P. | Three-dimensional printing |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6713125B1 (en) | 2002-03-13 | 2004-03-30 | 3D Systems, Inc. | Infiltration of three-dimensional objects formed by solid freeform fabrication |
AU2003900180A0 (en) | 2003-01-16 | 2003-01-30 | Silverbrook Research Pty Ltd | Method and apparatus (dam001) |
EP1459871B1 (en) * | 2003-03-15 | 2011-04-06 | Evonik Degussa GmbH | Method and apparatus for manufacturing three dimensional objects using microwave radiation and shaped body produced according to this method |
WO2005090448A1 (en) | 2004-03-21 | 2005-09-29 | Toyota Motorsport Gmbh | Powders for rapid prototyping and methods for the production thereof |
DE102004020452A1 (en) * | 2004-04-27 | 2005-12-01 | Degussa Ag | Method for producing three-dimensional objects by means of electromagnetic radiation and applying an absorber by inkjet method |
EP2001656B1 (en) * | 2006-04-06 | 2014-10-15 | 3D Systems Incorporated | KiT FOR THE PRODUCTION OF THREE-DIMENSIONAL OBJECTS BY USE OF ELECTROMAGNETIC RADIATION |
KR100777662B1 (en) | 2006-06-14 | 2007-11-29 | 삼성전기주식회사 | Conductive ink composition for ink-jet |
US7898042B2 (en) * | 2006-11-07 | 2011-03-01 | Cbrite Inc. | Two-terminal switching devices and their methods of fabrication |
US8563348B2 (en) * | 2007-04-18 | 2013-10-22 | Nanoco Technologies Ltd. | Fabrication of electrically active films based on multiple layers |
US20100000441A1 (en) | 2008-07-01 | 2010-01-07 | Jang Bor Z | Nano graphene platelet-based conductive inks |
US7922939B2 (en) | 2008-10-03 | 2011-04-12 | The Board Of Trustees Of The University Of Illinois | Metal nanoparticle inks |
EP2182787A1 (en) | 2008-10-30 | 2010-05-05 | BAE Systems PLC | Improvements relating to additive manufacturing processes |
AU2009309436B2 (en) | 2008-10-30 | 2013-05-09 | Bae Systems Plc | Improvements relating to additive manufacturing processes |
US8158032B2 (en) | 2010-08-20 | 2012-04-17 | Xerox Corporation | Silver nanoparticle ink composition for highly conductive features with enhanced mechanical properties |
US9984785B2 (en) | 2010-11-05 | 2018-05-29 | The United States Of America As Represented By The Administrator Of Nasa | Inkjet printing of conductive carbon nanotubes |
KR101982887B1 (en) * | 2011-07-13 | 2019-05-27 | 누보트로닉스, 인크. | Methods of fabricating electronic and mechanical structures |
GB2493398B (en) * | 2011-08-05 | 2016-07-27 | Univ Loughborough | Methods and apparatus for selectively combining particulate material |
US9373923B2 (en) | 2011-11-22 | 2016-06-21 | Savannah River Nuclear Solutions, Llc | Rapid prototype extruded conductive pathways |
US10748867B2 (en) | 2012-01-04 | 2020-08-18 | Board Of Regents, The University Of Texas System | Extrusion-based additive manufacturing system for 3D structural electronic, electromagnetic and electromechanical components/devices |
US20150107877A1 (en) | 2012-04-27 | 2015-04-23 | Dsm Ip Assets B.V. | Electrically conductive polyamide substrate |
WO2014089708A1 (en) | 2012-12-14 | 2014-06-19 | S.A.P.P. Holdings Inc. | Conducting nanocomposite matrix and uses thereof |
US20150366073A1 (en) | 2013-01-31 | 2015-12-17 | Yissum Research Development Company Of The Hebrew University Of Jerusalem | Three-dimensional conductive patterns and inks for making same |
US20140252685A1 (en) * | 2013-03-06 | 2014-09-11 | University Of Louisville Research Foundation, Inc. | Powder Bed Fusion Systems, Apparatus, and Processes for Multi-Material Part Production |
WO2014209994A2 (en) | 2013-06-24 | 2014-12-31 | President And Fellows Of Harvard College | Printed three-dimensional (3d) functional part and method of making |
US20160276056A1 (en) | 2013-06-28 | 2016-09-22 | Graphene 3D Lab Inc. | Dispersions for nanoplatelets of graphene-like materials and methods for preparing and using same |
EP3116670B1 (en) | 2014-03-11 | 2021-09-22 | BAE Systems PLC | Forming a three dimensional object |
US9579829B2 (en) * | 2014-06-02 | 2017-02-28 | Vadient Optics, Llc | Method for manufacturing an optical element |
US10440829B2 (en) * | 2014-07-03 | 2019-10-08 | United Technologies Corporation | Heating circuit assembly and method of manufacture |
MX365712B (en) * | 2014-10-23 | 2019-06-10 | Facebook Inc | Fabrication of intra-structure conductive traces and interconnects for three-dimensional manufactured structures. |
JP6620919B2 (en) * | 2014-10-31 | 2019-12-18 | 国立大学法人山形大学 | Organic electroluminescence lighting device |
EP3247688A4 (en) * | 2015-01-23 | 2018-01-24 | Hewlett-Packard Development Company, L.P. | Susceptor materials for 3d printing using microwave processing |
CN107873141A (en) * | 2015-02-18 | 2018-04-03 | 奥普托美克公司 | The additional manufacture of individual layer and fo multi-layer electronic circuit |
-
2015
- 2015-10-29 WO PCT/US2015/058094 patent/WO2017074397A1/en active Application Filing
- 2015-10-29 US US15/763,200 patent/US11648731B2/en active Active
-
2023
- 2023-04-10 US US18/132,821 patent/US20230264414A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2017074397A1 (en) | 2017-05-04 |
US20180272601A1 (en) | 2018-09-27 |
US11648731B2 (en) | 2023-05-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20230264414A1 (en) | Forming three-dimensional (3d) printed electronics | |
US11760010B2 (en) | Forming three-dimensional (3D) electronic parts | |
EP3261820B1 (en) | Three-dimensional (3d) printing method | |
US10919217B2 (en) | Three-dimensional (3D) printing build material composition | |
US11064572B2 (en) | 3-dimensional printed heater | |
US20210229358A1 (en) | Three-dimensional (3d) printing | |
US10392521B2 (en) | Particle compositions for three-dimensional printing | |
US10538032B2 (en) | Thermally decomposing material for three-dimensional printing | |
CN106795291B (en) | Coalescents for three-dimensional (3D) printing | |
KR102258889B1 (en) | Three-dimensional (3d) printing system | |
US20160297143A1 (en) | Three-dimensional (3d) printing method | |
KR20130051024A (en) | Additives and modifiers for solvent- and water-based metallic conductive inks | |
US11795338B2 (en) | Three-dimensional printing | |
US11738508B2 (en) | Three-dimensional printing |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., TEXAS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ERICKSON, KRISTOPHER J.;ANTHONY, THOMAS;TOM, HOWARD S.;AND OTHERS;SIGNING DATES FROM 20151102 TO 20151104;REEL/FRAME:063285/0311 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |