US11423686B2 - Integrated fingerprint and force sensor - Google Patents
Integrated fingerprint and force sensor Download PDFInfo
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- US11423686B2 US11423686B2 US16/634,495 US201816634495A US11423686B2 US 11423686 B2 US11423686 B2 US 11423686B2 US 201816634495 A US201816634495 A US 201816634495A US 11423686 B2 US11423686 B2 US 11423686B2
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Classifications
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- G—PHYSICS
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- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
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- G—PHYSICS
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- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/205—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using distributed sensing elements
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- G—PHYSICS
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- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
- G01L1/2293—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges of the semi-conductor type
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- G—PHYSICS
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
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Definitions
- MEMS microelectromechanical
- CMOS complementary metal-oxide-semiconductor
- the home button is integrated with fingerprint sensor and a mechanical switch for user's convenience to simultaneously authenticate the user and turn on the device.
- the mechanical button must be removed and replaced with other sensing mechanisms to turn on the device. It is therefore desired to have force integrated into such solution, but this requires extra space and elaborate mechanical design to support an extra sensor using conventional force sensing technology inside the already crowded mobile device chassis.
- the present disclosure pertains to a MEMS sensor including both fingerprint and force sensing on the same chip.
- the MEMS sensor can also include integrated circuits on the same chip.
- Such an integrated sensor can be created using complementary metal-oxide-semiconductor (“CMOS”) process, where the force sensing elements can be formed through existing layers from CMOS process such as doped junction or poly-silicon layers.
- CMOS complementary metal-oxide-semiconductor
- the force sensing elements can be formed through existing layers from CMOS process such as doped junction or poly-silicon layers.
- the force sensing elements can be formed by disposing piezoelectric layers after the CMOS process is completed and forming electrical connections to CMOS layers.
- the fingerprint sensing can be implemented through capacitive sensing where the top metal layers can be used for such purpose.
- the same piezoelectric layer which is used for force sensing can be reconfigured to launch ultrasonic waves for fingerprint sensing purpose. Combinations of the different force and fingerprint sensing integration are contemplated and exemplified but not limited to such embodiments.
- the integrated MEMS force sensor can include a sensor die, a plurality of fingerprint sensing elements arranged on the sensor die, a force sensing element arranged on the sensor die, and digital circuitry arranged on the sensor die.
- the fingerprint sensing elements can be configured to sense a fingerprint pattern.
- the force sensing element can be configured to convert a strain to an analog electrical signal that is proportional to the strain.
- the digital circuitry can be configured to convert the analog electrical signal to a digital electrical output signal.
- the force sensing element can be a piezoresistive element.
- the piezoresistive element can be formed by diffusion or implantation.
- the piezoresistive element can be formed by polysilicon processes during an integrated circuit process used to form the digital circuitry.
- the force sensing element can be a piezoelectric element.
- the sensor die can further include an inter-metal dielectric (IMD) layer, and the piezoelectric element can be arranged on the IMD layer.
- IMD inter-metal dielectric
- the plurality of fingerprint sensing elements can form a matrix of pixels on a surface of the sensor die.
- the digital circuitry can be further configured to reconstruct the fingerprint pattern.
- the fingerprint sensing elements can be operably coupled to the digital circuitry such that a signal (e.g., capacitance, ultrasonic wave, etc.) sensed by the fingerprint sensing element can be transferred to the digital circuitry for further processing.
- the fingerprint sensing elements can form a matrix of conductive plates.
- the sensor die can further include an inter-metal dielectric (IMD) layer, and the matrix of conductive plates can be arranged on the IMD layer.
- IMD inter-metal dielectric
- the fingerprint sensing elements can be operably coupled to the digital circuitry. Additionally, the digital circuitry can be further configured to measure capacitance at each of the fingerprint sensing elements, and reconstruct the fingerprint pattern using the capacitance measured at each of the fingerprint sensing elements.
- the fingerprint sensing elements can form a matrix of ultrasonic transducer pixels.
- the sensor die can further include an inter-metal dielectric (IMD) layer, and the matrix of ultrasonic transducer pixels can be arranged on the IMD layer.
- IMD inter-metal dielectric
- Each of the ultrasonic transducer pixels can include a piezoelectric element such that the ultrasonic transducer pixels can be configured to emit and sense ultrasonic waves.
- the fingerprint sensing elements can be operably coupled to the digital circuitry. Additionally, the digital circuitry can be further configured to reconstruct the fingerprint pattern using the ultrasonic waves.
- the digital circuitry can be formed by complementary metal-oxide-semiconductor (“CMOS”) process.
- CMOS complementary metal-oxide-semiconductor
- FIG. 1 is a cross-sectional view of an example integrated MEMS sensor attached to the sensing plate with CMOS side facing down.
- FIG. 2 is a cross-sectional view of another example integrated MEMS sensor attached to the sensing plate with CMOS side facing up.
- FIG. 3 is a cross-sectional view of an example capacitive fingerprint and piezoresistive force sensing integration according to one implementation described herein.
- FIG. 4 is a cross-sectional view of an example capacitive fingerprint and piezoelectric force sensing integration according to one implementation described herein.
- FIG. 5 is a cross-sectional view of an example ultrasonic fingerprint and piezoresistive force sensing integration according to one implementation described herein.
- FIG. 6 is a cross-sectional view of an example ultrasonic fingerprint and piezoelectric force sensing integration according to one implementation described herein.
- Ranges can be expressed herein as from “about” one particular value, and/or to “about” another particular value. When such a range is expressed, another aspect includes from the one particular value and/or to the other particular value. Similarly, when values are expressed as approximations, by use of the antecedent “about,” it will be understood that the particular value forms another aspect. It will be further understood that the endpoints of each of the ranges are significant both in relation to the other endpoint, and independently of the other endpoint.
- the terms “optional” or “optionally” mean that the subsequently described event or circumstance may or may not occur, and that the description includes instances where said event or circumstance occurs and instances where it does not.
- This disclosure contemplates that the assembly of such solution can be represented in the face-down or face-up configuration as depicted in FIG. 1 and FIG. 2 , respectively.
- a chip 105 i.e., a sensor die
- FIGS. 1 and 2 a chip 105 that includes both fingerprint sensing elements and force sensing elements is shown. Integration of both fingerprint and force sensing elements is described below with regard to FIGS. 3-6 .
- the chip 105 is placed in contact with a sensing surface 104 .
- the sensing surface 104 can be the part of a force-sensitive device (such as a mobile device) to which a force “F” is applied.
- the sensing surface 104 has opposing surfaces (e.g., top and bottom sides).
- the chip 105 is attached to the bottom side 103 of the sensing surface 104 in FIGS. 1 and 2 .
- the chip 105 is attached to a flexible circuit board 101 through a solder joint 102 .
- the solder joint 102 can serve as both electrical and mechanical connections. It should be understood that the number of solder joints 102 (i.e., two) shown in FIG. 1 is only provided as an example. This disclosure contemplates using more or less than two solder joints to attach the chip 105 to the flexible circuit board 101 .
- the CMOS circuitry side 106 of the chip 105 is facing away from (or down relative to) the sensing surface 104 with the chip 105 attached to the bottom side 103 of the sensing surface 104 .
- the chip is mechanically mounted to the flexible circuit board 101 with an electrical connection using a wire bond 207 .
- the number of wire bonds (i.e., one) shown in FIG. 2 is only provided as an example. This disclosure contemplates using more or less than one wire bond to electrically couple the chip 105 to the flexible circuit board 101 .
- the CMOS circuitry side 106 of the chip 105 is facing toward (or up relative to) the sensing surface 104 with the CMOS circuitry side 106 of the chip 105 attached to the bottom surface 103 of the sensing plate 104 .
- a recess 208 can be provided on the chip 105 .
- the flexible circuit board 101 can also be mechanically supported, i.e., the disclosure is not intended to be limited to the floating configuration shown in FIGS. 1 and 2 .
- a MEMS force sensor including an integrated sensor die with a combination of capacitive fingerprint sensing elements, piezoresistive sensing elements, and digital circuitry (e.g., CMOS circuitry) is shown.
- CMOS circuitry e.g., CMOS circuitry
- FIG. 3 a cross-section of the MEMS force sensor using an integrated p-type MEMS-CMOS force sensor with a piezoresistive sensing element is shown.
- the chip i.e., sensor die
- IMD inter-metal dielectric
- Both an n-type metal-oxide-semiconductor (nMOS) transistor 310 and a p-type metal-oxide-semiconductor (pMOS) transistor 311 are fabricated on p-type silicon substrate 301 .
- the p-type silicon substrate 301 can be a single continuous piece of material, i.e., the substrate can be monolithic.
- the nMOS source/drain 305 and pMOS source/drain 307 are formed through diffusion or implantation. As shown in FIG.
- the pMOS source/drain 307 are heavily-doped p-type regions residing in a lightly-doped n-well region 306 , which receives a voltage bias through a heavily-doped n-type implant 315 .
- the nMOS source/drain 305 are heavily-doped n-type regions formed directly on the p-type silicon substrate 301 .
- a gate contact 308 e.g., poly silicon gate
- the gate 308 can be formed with poly silicon with a thin oxide layer above the channel between each of the transistors.
- CMOS processes can be adapted to other starting materials, such as an n-type silicon substrate.
- a silicon substrate is provided as an example, this disclosure contemplates that the substrate can be made from a material other than silicon.
- the MEMS force sensor can include a plurality of nMOS and pMOS devices.
- the nMOS and pMOS devices can form various components of the digital circuitry (e.g., CMOS circuitry).
- the digital circuitry can optionally include other components, which are not depicted in FIG.
- the digital circuitry can include, but is not limited to, one or more of a differential amplifier or buffer, an analog-to-digital converter, a clock generator, non-volatile memory, and a communication bus.
- the digital circuitry can include an on-chip buffer for storing the respective digital electrical output signals.
- a lightly doped n-type piezoresistive sensing element 303 (sometimes referred to herein as a “force sensing element”) and a heavily doped n-type contact region 304 are formed on the same p-type silicon substrate 301 .
- the piezoresistive sensing element and digital circuitry can be disposed on the same monolithic substrate. Accordingly, the process used to form the piezoresistive sensing element can be compatible with the process used to form the digital circuitry (e.g., the CMOS process).
- the lightly doped n-type piezoresistive sensing element 303 and heavily doped n-type contact region 304 can be formed by way of either diffusion, deposition, or implant patterned with a lithographic exposure process.
- This disclosure contemplates that the MEMS force sensor can include a plurality of piezoresistive sensing elements.
- metal layers 312 and contact layers 313 can be provided to create electrical connections between the nMOS and pMOS transistors 310 and 311 and the piezoresistive sensing element 303 .
- the piezoresistive sensing elements 303 can change resistance in response to deflection of a portion of the sensor die. For example, as strain is induced in the sensor die proportional to the force applied to the MEMS force sensor, a localized strain is produced on a piezoresistive sensing element such that the piezoresistive sensing element experiences compression or tension, depending on its specific orientation. As the piezoresistive sensing element compresses and tenses, its resistivity changes in opposite fashion. Accordingly, a Wheatstone bridge circuit including a plurality (e.g., four) piezoresistive sensing elements (e.g., two of each orientation relative to strain) becomes unbalanced and produces a differential voltage.
- a plurality e.g., four
- This differential voltage is directly proportional to the force applied to the MEMS force sensor.
- This disclosure contemplates that this differential voltage can be received at and processed by the digital circuitry.
- the digital circuitry can be configured to, among other functions, convert an analog electrical signal to a digital electrical output signal.
- Example MEMS force sensors using piezoresistive sensing elements are described in U.S. Pat. No. 9,487,388, issued Nov. 8, 2016 and entitled “Ruggedized MEMS Force Die;” U.S. Pat. No. 9,493,342, issued Nov. 15, 2016 and entitled “Wafer Level MEMS Force Dies;” U.S. Pat. No. 9,902,611, issued Feb. 27, 2018 and entitled “Miniaturized and ruggedized wafer level mems force sensors;” and U.S. Patent Application Publication No. 2016/0363490 to Campbell et al., filed Jun. 10, 2016 and entitled “Ruggedized wafer level mems force sensor with a tolerance trench,” the disclosures of which are incorporated by reference in their entireties.
- the MEMS force sensor shown in FIG. 3 can include a capacitive fingerprint sensor.
- the MEMS force sensor can include a plurality of fingerprint sensing elements 302 (e.g., conductive plates) arranged at a surface of the IMD layer 350 .
- the fingerprint sensing elements 302 can form a matrix of conductive plates.
- the conductive plates can optionally be made of copper or an aluminum-silicon-copper (Al—Si—Cu) alloy, which are conductive materials used in conventional CMOS processes.
- Each of the fingerprint sensing elements 302 is a pixel in the matrix.
- the matrix can be an n ⁇ m matrix of conductive plates, where n and m are integers. In some implementations, n can equal m.
- n does not equal m. It should be understood that the number of conductive plates in the matrix effects the resolution of the fingerprint sensor. Using more conductive plates increases the resolution of the fingerprint sensor, while using less conductive plates decreases the resolution of the fingerprint sensor.
- each of the fingerprint sensing elements 302 can be connected to a respective capacitor circuit (not shown), which stores an electrical charge.
- a fingerprint is a pattern of ridges and valleys in the skin at the surface of finger. The distance from the ridge/valley to fingerprint sensing element 302 modulates the capacitance or charges stored in the capacitor circuit thus making it possible to process and re-construct the fingerprint pattern with the digital circuitry.
- the fingerprint sensor e.g., the fingerprint sensing elements 302 and respective capacitors
- the digital circuitry e.g., the CMOS circuitry described above
- the MEMS force sensor shown in FIG. 3 includes a piezoresistive sensing element 303 , fingerprint sensing elements 302 , and digital circuitry (e.g., nMOS and pMOS devices) all on the same chip.
- FIG. 4 another example MEMS force sensor including an integrated sensor die with a combination of capacitive fingerprint sensing elements, piezoelectric sensing elements, and digital circuitry (e.g., CMOS circuitry) is shown.
- CMOS circuitry e.g., CMOS circuitry
- FIG. 4 a cross-section of the MEMS force sensor using an integrated p-type MEMS-CMOS force sensor with a piezoelectric sensing element is shown.
- the chip i.e., sensor die
- IMD inter-metal dielectric
- Both an n-type metal-oxide-semiconductor (nMOS) transistor 310 and a p-type metal-oxide-semiconductor (pMOS) transistor 311 are fabricated on p-type silicon substrate 301 .
- the p-type silicon substrate 301 can be a single continuous piece of material, i.e., the substrate can be monolithic.
- the nMOS source/drain 305 and pMOS source/drain 307 are formed through diffusion or implantation. As shown in FIG.
- the pMOS source/drain 307 are heavily-doped p-type regions residing in a lightly-doped n-well region 306 , which receives a voltage bias through a heavily-doped n-type implant 315 .
- the nMOS source/drain 305 are heavily-doped n-type regions formed directly on the p-type silicon substrate 301 .
- a gate contact 308 e.g., poly silicon gate
- the gate 308 can be formed with poly silicon with a thin oxide layer above the channel between each of the transistors.
- CMOS processes can be adapted to other starting materials, such as an n-type silicon substrate.
- a silicon substrate is provided as an example, this disclosure contemplates that the substrate can be made from a material other than silicon.
- the MEMS force sensor can include a plurality of nMOS and pMOS devices, and the nMOS and pMOS devices can form various components of the digital circuitry (e.g., CMOS circuitry).
- the digital circuitry can optionally include other components, which are not depicted in FIG.
- the digital circuitry can include, but is not limited to, one or more of a differential amplifier or buffer, an analog-to-digital converter, a clock generator, non-volatile memory, and a communication bus.
- the digital circuitry can include an on-chip buffer for storing the respective digital electrical output signals.
- the MEMS force sensor shown in FIG. 4 can also include a piezoelectric element 409 (sometimes referred to herein as a “force sensing element”), which is arranged between opposing electrodes 410 , 411 . As shown in FIG. 4 , the piezoelectric element 409 and opposing electrodes 410 , 411 are arranged on the IMD layer 350 .
- the piezoelectric element 409 can be formed after completion of the integrated circuit process used to form the digital circuitry (e.g., the CMOS process). It should be understood that a single piezoelectric element is shown in FIG. 4 only as an example. This disclosure contemplates that the MEMS force sensor can include a plurality of piezoelectric elements.
- the piezoelectric element 409 When a force is applied to the MEMS force sensor, the strain is transferred to piezoelectric element 409 , which converts the strain into charge.
- the piezoelectric element 409 can change an electrical characteristic (i.e., charge) in response to deflection of a portion of the MEMS force sensor.
- the change in electrical characteristic can be detected as an analog electrical signal (e.g., change in voltage) at the opposing electrodes 410 , 411 .
- the analog electrical signal can be transferred to the digital circuitry (e.g., the CMOS circuitry described above) for further processing.
- the change in voltage can be correlated with the amount of “F” applied to the MEMS force sensor.
- metal layers and contact layers 313 can be provided to create electrical connections between the nMOS and pMOS transistors 310 and 311 and the piezoelectric element 409 .
- the MEMS force sensor shown in FIG. 4 can also include a capacitive fingerprint sensor.
- the MEMS force sensor can include a plurality of fingerprint sensing elements 302 (e.g., conductive plates) arranged on the IMD layer 350 .
- the capacitive fingerprint sensor is described above with regard to FIG. 3 and is therefore not described in further detail below.
- the MEMS force sensor shown in FIG. 4 includes a piezoelectric element 409 , fingerprint sensing elements 302 , and digital circuitry (e.g., nMOS and pMOS devices) all on the same chip.
- FIG. 5 another example MEMS force sensor including an integrated sensor die with a combination of ultrasonic fingerprint sensing elements, piezoresistive sensing elements, and digital circuitry (e.g., CMOS circuitry) is shown.
- CMOS circuitry e.g., CMOS circuitry
- FIG. 5 a cross-section of the MEMS force sensor using an integrated p-type MEMS-CMOS force sensor with a piezoresistive sensing element is shown.
- the chip i.e., sensor die
- IMD inter-metal dielectric
- Both an n-type metal-oxide-semiconductor (nMOS) transistor 310 and a p-type metal-oxide-semiconductor (pMOS) transistor 311 are fabricated on p-type silicon substrate 301 .
- the nMOS source/drain 305 and pMOS source/drain 307 are formed through diffusion or implantation.
- the pMOS source/drain 307 are heavily-doped p-type regions residing in a lightly-doped n-well region 306 , which receives a voltage bias through a heavily-doped n-type implant 315 .
- the nMOS source/drain 305 are heavily-doped n-type regions formed directly on the p-type silicon substrate 301 .
- a gate contact 308 e.g., poly silicon gate
- a lightly doped n-type piezoresistive sensing element 303 and a heavily doped n-type contact region 304 are formed on the same p-type silicon substrate 301 .
- the piezoresistive sensing element and digital circuitry can be disposed on the same monolithic substrate.
- the process used to form the piezoresistive sensing element can be compatible with the process used to form the digital circuitry (e.g., the CMOS process).
- metal layers 312 and contact layers 313 can be provided to create electrical connections between the nMOS and pMOS transistors 310 and 311 and the piezoresistive sensing element 303 .
- the piezoresistive sensing elements and digital circuitry e.g., CMOS circuitry
- the MEMS force sensor shown in FIG. 5 can include an ultrasonic fingerprint sensor.
- the MEMS force sensor can include a plurality of ultrasonic transducer pixels 512 arranged on the IMD layer 350 .
- Each ultrasonic transducer pixel 512 can include a piezoelectric element 409 , which is arranged between opposing electrodes 410 , 411 .
- the ultrasonic transducer pixels 512 can be formed after completion of the integrated circuit process used to form the digital circuitry (e.g., the CMOS process).
- the ultrasonic transducer pixels 512 can form a matrix.
- the matrix can be an n ⁇ m matrix of pixels, where n and m are integers. In some implementations, n can equal m. In other implementations, n does not equal m.
- Each ultrasonic transducer pixel 512 can emit ultrasonic waves and can also sense the reflected signal in a scan pattern. In other words, each ultrasonic transducer pixel 512 can act as a transmitter and a receiver.
- a fingerprint is a pattern of ridges and valleys in the skin at the surface of finger. When an ultrasonic wave is transmitted against the finger, portions of the wave are absorbed by the finger and portions of the wave are reflected back towards the fingerprint sensor. This depends on the pattern of ridges and valleys.
- the fingerprint sensor e.g., the ultrasonic transducer pixels 512
- the digital circuitry e.g., the CMOS circuitry described above
- the ultrasonic waves sensed at the ultrasonic transducer pixels 512 can be transferred to the digital circuitry for processing, and the digital circuitry can be configured to reconstruct the fingerprint pattern from such data.
- the MEMS force sensor shown in FIG. 5 includes a piezoresistive sensing element 303 , ultrasonic transducer pixels 512 , and digital circuitry (e.g., nMOS and pMOS devices) all on the same chip.
- FIG. 6 another example MEMS force sensor including an integrated sensor die with a combination of ultrasonic fingerprint sensing elements, piezoelectric sensing elements, and digital circuitry (e.g., CMOS circuitry) is shown.
- CMOS circuitry e.g., CMOS circuitry
- FIG. 6 a cross-section of the MEMS force sensor using an integrated p-type MEMS-CMOS force sensor with a piezoresistive sensing element is shown.
- the chip i.e., sensor die
- IMD inter-metal dielectric
- Both an n-type metal-oxide-semiconductor (nMOS) transistor 310 and a p-type metal-oxide-semiconductor (pMOS) transistor 311 are fabricated on p-type silicon substrate 301 .
- the nMOS source/drain 305 and pMOS source/drain 307 are formed through diffusion or implantation.
- the pMOS source/drain 307 are heavily-doped p-type regions residing in a lightly-doped n-well region 306 , which receives a voltage bias through a heavily-doped n-type implant 315 .
- the nMOS source/drain 305 are heavily-doped n-type regions formed directly on the p-type silicon substrate 301 .
- a gate contact 308 e.g., poly silicon gate
- the digital circuitry e.g., CMOS circuitry
- the MEMS force sensor shown in FIG. 6 can also include a force sensing element 613 and an ultrasonic fingerprint sensor.
- the MEMS force sensor can include a piezoelectric force sensing element 613 and a plurality of ultrasonic transducer pixels 512 arranged on the IMD layer 350 .
- a single piezoelectric force sensing element 613 is shown in FIG. 6 only as an example.
- This disclosure contemplates that the MEMS force sensor can include a plurality of piezoelectric force sensing elements.
- Each piezoelectric force sensing element 613 and each ultrasonic transducer pixel 512 can include a piezoelectric element 409 , which is arranged between opposing electrodes 410 , 411 .
- the piezoelectric force sensing element 613 and the ultrasonic transducer pixels 512 can be formed after completion of the integrated circuit process used to form the digital circuitry (e.g., the CMOS process). Additionally, metal layers and contact layers 313 can be provided to create electrical connections between the nMOS and pMOS transistors 310 and 311 and the piezoelectric force sensing element 613 . Piezoelectric force sensing elements are described above with regard to FIG. 4 and ultrasonic transducer pixels are described above with regard to FIG. 6 and therefore these elements are not described in further detail below. Accordingly, the MEMS force sensor shown in FIG. 6 includes a piezoelectric force sensing element 613 , ultrasonic transducer pixels 512 , and digital circuitry (e.g., nMOS and pMOS devices) all on the same chip.
- digital circuitry e.g., nMOS and pMOS devices
Abstract
Description
Claims (20)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US16/634,495 US11423686B2 (en) | 2017-07-25 | 2018-07-25 | Integrated fingerprint and force sensor |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US201762536645P | 2017-07-25 | 2017-07-25 | |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220299391A1 (en) * | 2021-03-16 | 2022-09-22 | Minebea Mitsumi Inc. | Sensor chip and force sensor apparatus |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018148510A1 (en) | 2017-02-09 | 2018-08-16 | Nextinput, Inc. | Integrated piezoresistive and piezoelectric fusion force sensor |
CN116907693A (en) | 2017-02-09 | 2023-10-20 | 触控解决方案股份有限公司 | Integrated digital force sensor and related manufacturing method |
CN111448446B (en) | 2017-07-19 | 2022-08-30 | 触控解决方案股份有限公司 | Strain transferring stack in MEMS force sensor |
US11243126B2 (en) | 2017-07-27 | 2022-02-08 | Nextinput, Inc. | Wafer bonded piezoresistive and piezoelectric force sensor and related methods of manufacture |
WO2019079420A1 (en) | 2017-10-17 | 2019-04-25 | Nextinput, Inc. | Temperature coefficient of offset compensation for force sensor and strain gauge |
US11874185B2 (en) | 2017-11-16 | 2024-01-16 | Nextinput, Inc. | Force attenuator for force sensor |
US11042721B2 (en) * | 2018-10-29 | 2021-06-22 | Fingerprint Cards Ab | Ultrasonic fingerprint sensor |
KR20220024831A (en) * | 2019-06-24 | 2022-03-03 | 알베르트-루드비히스-우니베르시테트 프라이부르크 | Tactile sensors and how tactile sensors work |
US10812639B1 (en) | 2019-12-17 | 2020-10-20 | Robert Bosch Gmbh | Pressure chamber and associated pressure sensors for a mobile communication device |
CN114582904A (en) * | 2021-05-18 | 2022-06-03 | 友达光电股份有限公司 | Dual sensing device |
WO2024055160A1 (en) * | 2022-09-13 | 2024-03-21 | 深圳市汇顶科技股份有限公司 | Ultrasonic fingerprint apparatus and electronic device |
Citations (362)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4594639A (en) | 1984-02-21 | 1986-06-10 | Vaisala Oy | Capacitive pressure detector |
US4658651A (en) | 1985-05-13 | 1987-04-21 | Transamerica Delaval Inc. | Wheatstone bridge-type transducers with reduced thermal shift |
US4814856A (en) | 1986-05-07 | 1989-03-21 | Kulite Semiconductor Products, Inc. | Integral transducer structures employing high conductivity surface features |
US4849730A (en) | 1986-02-14 | 1989-07-18 | Ricoh Company, Ltd. | Force detecting device |
US4914624A (en) | 1988-05-06 | 1990-04-03 | Dunthorn David I | Virtual button for touch screen |
US4918262A (en) | 1989-03-14 | 1990-04-17 | Ibm Corporation | Touch sensing display screen signal processing apparatus and method |
US4933660A (en) | 1989-10-27 | 1990-06-12 | Elographics, Inc. | Touch sensor with touch pressure capability |
US4983786A (en) | 1990-01-17 | 1991-01-08 | The University Of British Columbia | XY velocity controller |
US5095401A (en) | 1989-01-13 | 1992-03-10 | Kopin Corporation | SOI diaphragm sensor |
US5159159A (en) | 1990-12-07 | 1992-10-27 | Asher David J | Touch sensor and controller |
US5166612A (en) | 1990-11-13 | 1992-11-24 | Tektronix, Inc. | Micromechanical sensor employing a squid to detect movement |
WO1993010430A1 (en) | 1991-11-15 | 1993-05-27 | Robert Bosch Gmbh | Silicon chip for use in a force-detection sensor |
US5237879A (en) | 1991-10-11 | 1993-08-24 | At&T Bell Laboratories | Apparatus for dynamically varying the resolution of a tactile sensor array |
US5320705A (en) | 1988-06-08 | 1994-06-14 | Nippondenso Co., Ltd. | Method of manufacturing a semiconductor pressure sensor |
US5333505A (en) | 1992-01-13 | 1994-08-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor pressure sensor for use at high temperature and pressure and method of manufacturing same |
US5343220A (en) | 1990-04-20 | 1994-08-30 | Crosfield Electronics Limited | Force monitor of an electronic paint brush apparatus |
US5349746A (en) | 1990-05-07 | 1994-09-27 | Robert Bosch Gmbh | Process for the manufacture of a force sensor |
US5351550A (en) | 1992-10-16 | 1994-10-04 | Honeywell Inc. | Pressure sensor adapted for use with a component carrier |
US5483994A (en) | 1995-02-01 | 1996-01-16 | Honeywell, Inc. | Pressure transducer with media isolation and negative pressure measuring capability |
US5510812A (en) | 1994-04-22 | 1996-04-23 | Hasbro, Inc. | Piezoresistive input device |
US5541372A (en) | 1992-06-15 | 1996-07-30 | U.S. Philips Corporation | Force activated touch screen measuring deformation of the front panel |
US5543591A (en) | 1992-06-08 | 1996-08-06 | Synaptics, Incorporated | Object position detector with edge motion feature and gesture recognition |
US5565657A (en) | 1993-11-01 | 1996-10-15 | Xerox Corporation | Multidimensional user interface input device |
US5673066A (en) | 1992-04-21 | 1997-09-30 | Alps Electric Co., Ltd. | Coordinate input device |
US5773728A (en) | 1995-03-31 | 1998-06-30 | Kabushiki Kaisha Toyota Chuo Kenkyusho | Force transducer and method of fabrication thereof |
US5889236A (en) | 1992-06-08 | 1999-03-30 | Synaptics Incorporated | Pressure sensitive scrollbar feature |
US5921896A (en) | 1998-09-04 | 1999-07-13 | Boland; Kevin O. | Exercise device |
US5969591A (en) | 1991-03-28 | 1999-10-19 | The Foxboro Company | Single-sided differential pressure sensor |
US6012336A (en) | 1995-09-06 | 2000-01-11 | Sandia Corporation | Capacitance pressure sensor |
US6028271A (en) | 1992-06-08 | 2000-02-22 | Synaptics, Inc. | Object position detector with edge motion feature and gesture recognition |
US6159166A (en) | 1998-03-20 | 2000-12-12 | Hypertension Diagnostics, Inc. | Sensor and method for sensing arterial pulse pressure |
US6243075B1 (en) | 1997-08-29 | 2001-06-05 | Xerox Corporation | Graspable device manipulation for controlling a computer display |
US20010009112A1 (en) | 1997-04-17 | 2001-07-26 | Commissariat A L'energie Atomique | Microsystem with a flexible membrane for a pressure sensor and manufacturing process |
US6348663B1 (en) | 1996-10-03 | 2002-02-19 | I.E.E. International Electronics & Engineering S.A.R.L. | Method and device for determining several parameters of a seated person |
US6351205B1 (en) | 1996-07-05 | 2002-02-26 | Brad A. Armstrong | Variable-conductance sensor |
US6360598B1 (en) | 1999-09-14 | 2002-03-26 | K.K. Holding Ag | Biomechanical measuring arrangement |
US6437682B1 (en) | 2000-04-20 | 2002-08-20 | Ericsson Inc. | Pressure sensitive direction switches |
US20030067448A1 (en) | 2001-10-10 | 2003-04-10 | Samsung Sdi Co., Ltd. | Touch panel |
US6556189B1 (en) | 1998-04-24 | 2003-04-29 | Nissha Printing Co., Ltd. | Touch panel device |
US6555235B1 (en) | 2000-07-06 | 2003-04-29 | 3M Innovative Properties Co. | Touch screen system |
US6569108B2 (en) | 2001-03-28 | 2003-05-27 | Profile, Llc | Real time mechanical imaging of the prostate |
US20030128181A1 (en) | 2001-07-24 | 2003-07-10 | David L. Poole | Low profile cursor control device |
US6610936B2 (en) | 1992-06-08 | 2003-08-26 | Synaptics, Inc. | Object position detector with edge motion feature and gesture recognition |
US6620115B2 (en) | 2000-04-28 | 2003-09-16 | Armed L.L.C. | Apparatus and method for mechanical imaging of breast |
US6629343B1 (en) | 1999-09-10 | 2003-10-07 | Hypertension Diagnostics, Inc. | Method for fabricating a pressure-wave sensor with a leveling support element |
US20030189552A1 (en) | 2002-04-03 | 2003-10-09 | Hsun-Hsin Chuang | Touch panel threshold pressure setup method and apparatus |
US6668230B2 (en) | 1998-12-11 | 2003-12-23 | Symyx Technologies, Inc. | Computer readable medium for performing sensor array based materials characterization |
US20040012572A1 (en) | 2002-03-16 | 2004-01-22 | Anthony Sowden | Display and touch screen method and apparatus |
US6720712B2 (en) | 2000-03-23 | 2004-04-13 | Cross Match Technologies, Inc. | Piezoelectric identification device and applications thereof |
JP2004156937A (en) | 2002-11-05 | 2004-06-03 | Tanita Corp | Diaphragm type load detection sensor and load detection unit, and electronic balance utilizing the same |
US20040140966A1 (en) | 2001-06-20 | 2004-07-22 | Leapfrog Enterprises, Inc. | Interactive apparatus using print media |
US6788297B2 (en) | 2001-02-21 | 2004-09-07 | International Business Machines Corporation | Pressure sensitive writing tablet, control method and control program therefor |
US6801191B2 (en) | 2001-04-27 | 2004-10-05 | Matsushita Electric Industrial Co., Ltd. | Input device and inputting method with input device |
US6809280B2 (en) | 2002-05-02 | 2004-10-26 | 3M Innovative Properties Company | Pressure activated switch and touch panel |
US6822640B2 (en) | 2001-04-10 | 2004-11-23 | Hewlett-Packard Development Company, L.P. | Illuminated touch pad |
WO2004113859A1 (en) | 2003-06-18 | 2004-12-29 | Honeywell International Inc. | Pressure sensor apparatus and method |
US6868731B1 (en) | 2003-11-20 | 2005-03-22 | Honeywell International, Inc. | Digital output MEMS pressure sensor and method |
US6879318B1 (en) | 2000-10-06 | 2005-04-12 | Industrial Technology Research Institute | Touch screen mounting assembly for LCD panel and method for fabrication |
US20050083310A1 (en) | 2003-10-20 | 2005-04-21 | Max Safai | Navigation and fingerprint sensor |
US6888537B2 (en) | 2002-02-13 | 2005-05-03 | Siemens Technology-To-Business Center, Llc | Configurable industrial input devices that use electrically conductive elastomer |
US6915702B2 (en) | 2001-11-22 | 2005-07-12 | Kabushiki Kaisha Toyota Chuo Kenkyusho | Piezoresistive transducers |
US6931938B2 (en) | 2002-12-16 | 2005-08-23 | Jeffrey G. Knirck | Measuring pressure exerted by a rigid surface |
US20050190152A1 (en) | 2003-12-29 | 2005-09-01 | Vladimir Vaganov | Three-dimensional analog input control device |
US6995752B2 (en) | 2001-11-08 | 2006-02-07 | Koninklijke Philips Electronics N.V. | Multi-point touch pad |
US20060028441A1 (en) | 1992-03-05 | 2006-02-09 | Armstrong Brad A | Image controller |
US20060244733A1 (en) | 2005-04-28 | 2006-11-02 | Geaghan Bernard O | Touch sensitive device and method using pre-touch information |
US7138984B1 (en) | 2001-06-05 | 2006-11-21 | Idc, Llc | Directly laminated touch sensitive screen |
US20060272413A1 (en) | 2005-06-04 | 2006-12-07 | Vladimir Vaganov | Three-axis integrated mems accelerometer |
US20060284856A1 (en) | 2005-06-10 | 2006-12-21 | Soss David A | Sensor signal conditioning in a force-based touch device |
US7173607B2 (en) | 2001-02-09 | 2007-02-06 | Sanyo Electric Co., Ltd. | Signal detector |
US20070035525A1 (en) | 2005-08-11 | 2007-02-15 | Via Technologies, Inc. | Integrated touch screen control system for automobiles |
US20070046649A1 (en) | 2005-08-30 | 2007-03-01 | Bruce Reiner | Multi-functional navigational device and method |
US7190350B2 (en) | 2001-04-13 | 2007-03-13 | 3M Innovative Properties Company | Touch screen with rotationally isolated force sensor |
US20070070046A1 (en) | 2005-09-21 | 2007-03-29 | Leonid Sheynblat | Sensor-based touchscreen assembly, handheld portable electronic device having assembly, and method of determining touch location on a display panel |
US20070070053A1 (en) | 2005-08-19 | 2007-03-29 | Silverbrook Research Pty Ltd | Force sensor with dilatant fluid stop |
US20070097095A1 (en) | 2005-10-31 | 2007-05-03 | Samsung Electronics Co., Ltd. | Apparatus and method for recognizing and transmitting handwritten data in a mobile communication terminal |
US7215329B2 (en) | 2001-10-10 | 2007-05-08 | Smk Corporation | Touch panel input device |
US20070103449A1 (en) | 2005-11-08 | 2007-05-10 | Nokia Corporation | Cost efficient element for combined piezo sensor and actuator in robust and small touch screen realization and method for operation thereof |
US20070103452A1 (en) | 2000-01-31 | 2007-05-10 | Canon Kabushiki Kaisha | Method and apparatus for detecting and interpreting path of designated position |
US7218313B2 (en) | 2003-10-31 | 2007-05-15 | Zeetoo, Inc. | Human interface system |
US20070115265A1 (en) | 2005-11-21 | 2007-05-24 | Nokia Corporation | Mobile device and method |
US7224257B2 (en) | 2003-12-25 | 2007-05-29 | Denso Corporation | Physical quantity sensing element having improved structure suitable for electrical connection and method of fabricating same |
US20070132717A1 (en) | 2005-12-10 | 2007-06-14 | Hon Hai Precision Industry Co., Ltd. | Input device and method of locking a computer system |
US20070139391A1 (en) | 2005-11-18 | 2007-06-21 | Siemens Aktiengesellschaft | Input device |
US20070137901A1 (en) | 2005-12-16 | 2007-06-21 | E-Lead Electronic Co., Ltd. | Micro-keyboard simulator |
US20070156723A1 (en) | 2004-05-07 | 2007-07-05 | Myorigo,S.A.R.L. | Method and arrangement for reinterpreting user input in a mobile device |
US20070152959A1 (en) | 2005-12-29 | 2007-07-05 | Sap Ag | Pressure-sensitive button |
US7245293B2 (en) | 2002-08-02 | 2007-07-17 | Hitachi, Ltd. | Display unit with touch panel and information processing method |
US20070182864A1 (en) | 2003-04-04 | 2007-08-09 | Evolution Broadcastpty Limited | Broadcast control |
US7273979B2 (en) | 2004-12-15 | 2007-09-25 | Edward Lee Christensen | Wearable sensor matrix system for machine control |
US20070229478A1 (en) | 1998-06-23 | 2007-10-04 | Immersion Corporation | Haptic feedback for touchpads and other touch controls |
US7280097B2 (en) | 2005-10-11 | 2007-10-09 | Zeetoo, Inc. | Human interface input acceleration system |
US20070235231A1 (en) | 2006-03-29 | 2007-10-11 | Tekscan, Inc. | Control circuit for sensor array and related methods |
US20070245836A1 (en) | 2004-12-28 | 2007-10-25 | Vladimir Vaganov | Three-dimensional force input control device and fabrication |
US20070262965A1 (en) | 2004-09-03 | 2007-11-15 | Takuya Hirai | Input Device |
US20070277616A1 (en) | 2006-06-05 | 2007-12-06 | Nikkel Eric L | Micro Electrical Mechanical Systems Pressure Sensor |
WO2007139695A2 (en) | 2006-05-24 | 2007-12-06 | Vladimir Vaganov | Force input control device and method of fabrication |
US20070298883A1 (en) | 2002-12-04 | 2007-12-27 | Philip Feldman | Method and Apparatus for Operatively Controlling a Virtual Reality Scenario in Accordance With Physical Activity of a User |
US20080001923A1 (en) | 2006-06-28 | 2008-01-03 | Microsoft Corporation | Input Simulation System For Touch Based Devices |
US20080007532A1 (en) | 2006-07-05 | 2008-01-10 | E-Lead Electronic Co., Ltd. | Touch-sensitive pad capable of detecting depressing pressure |
US20080010616A1 (en) | 2006-07-06 | 2008-01-10 | Cherif Atia Algreatly | Spherical coordinates cursor, mouse, and method |
US7324095B2 (en) | 2004-11-01 | 2008-01-29 | Hewlett-Packard Development Company, L.P. | Pressure-sensitive input device for data processing systems |
US7324094B2 (en) | 2001-11-12 | 2008-01-29 | Myorigo, S.A.R.L. | Method and device for generating multi-functional feedback |
US20080024454A1 (en) | 2006-07-31 | 2008-01-31 | Paul Everest | Three-dimensional touch pad input device |
US20080030482A1 (en) | 2006-07-31 | 2008-02-07 | Elwell James K | Force-based input device having an elevated contacting surface |
US20080036743A1 (en) | 1998-01-26 | 2008-02-14 | Apple Computer, Inc. | Gesturing with a multipoint sensing device |
US7337085B2 (en) | 2005-06-10 | 2008-02-26 | Qsi Corporation | Sensor baseline compensation in a force-based touch device |
US7336260B2 (en) | 2001-11-01 | 2008-02-26 | Immersion Corporation | Method and apparatus for providing tactile sensations |
US7345680B2 (en) | 2002-06-25 | 2008-03-18 | David Albert M | Laminated touch screen |
US20080088602A1 (en) | 2005-03-04 | 2008-04-17 | Apple Inc. | Multi-functional hand-held device |
US20080088600A1 (en) | 2006-10-11 | 2008-04-17 | Apple Inc. | Method and apparatus for implementing multiple push buttons in a user input device |
US20080094367A1 (en) | 2004-08-02 | 2008-04-24 | Koninklijke Philips Electronics, N.V. | Pressure-Controlled Navigating in a Touch Screen |
US7367232B2 (en) | 2004-01-24 | 2008-05-06 | Vladimir Vaganov | System and method for a three-axis MEMS accelerometer |
US20080106523A1 (en) | 2006-11-07 | 2008-05-08 | Conrad Richard H | Ergonomic lift-clicking method and apparatus for actuating home switches on computer input devices |
US20080105470A1 (en) | 2004-08-02 | 2008-05-08 | Koninklijke Philips Electronics, N.V. | Touch Screen Slider for Setting Floating Point Value |
US20080105057A1 (en) | 2006-11-08 | 2008-05-08 | Honeywell International Inc. | Dual span absolute pressure sense die |
US20080174852A1 (en) | 2007-01-22 | 2008-07-24 | Seiko Epson Corporation | Display device, method for manufacturing display device, and electronic paper |
US7406661B2 (en) | 2002-04-23 | 2008-07-29 | Myorigo L.L.C. | Graphical user interface and method and electronic device for navigating in the graphical user interface |
US20080180402A1 (en) | 2007-01-25 | 2008-07-31 | Samsung Electronics Co., Ltd. | Apparatus and method for improvement of usability of touch screen |
US20080180406A1 (en) | 2007-01-31 | 2008-07-31 | Han Jefferson Y | Methods of interfacing with multi-point input devices and multi-point input systems employing interfacing techniques |
US20080204427A1 (en) | 2004-08-02 | 2008-08-28 | Koninklijke Philips Electronics, N.V. | Touch Screen with Pressure-Dependent Visual Feedback |
US20080202249A1 (en) | 2007-01-30 | 2008-08-28 | Denso Corporation | Semiconductor sensor and method of manufacturing the same |
US20080211766A1 (en) | 2007-01-07 | 2008-09-04 | Apple Inc. | Multitouch data fusion |
US7425749B2 (en) | 2002-04-23 | 2008-09-16 | Sharp Laboratories Of America, Inc. | MEMS pixel sensor |
US7426873B1 (en) | 2006-05-04 | 2008-09-23 | Sandia Corporation | Micro electro-mechanical system (MEMS) pressure sensor for footwear |
US20080238446A1 (en) | 2005-09-08 | 2008-10-02 | Teledyne Licensing, Llc | High temperature microelectromechanical (MEM) devices |
US20080238884A1 (en) | 2007-03-29 | 2008-10-02 | Divyasimha Harish | Edge sensors forming a touchscreen |
US20080259046A1 (en) | 2007-04-05 | 2008-10-23 | Joseph Carsanaro | Pressure sensitive touch pad with virtual programmable buttons for launching utility applications |
US7449758B2 (en) | 2004-08-17 | 2008-11-11 | California Institute Of Technology | Polymeric piezoresistive sensors |
US20080303799A1 (en) | 2007-06-07 | 2008-12-11 | Carsten Schwesig | Information Processing Apparatus, Information Processing Method, and Computer Program |
CN101341459A (en) | 2006-01-05 | 2009-01-07 | 弗拉多米尔·瓦格诺夫 | Three-dimensional force input control device and fabrication |
US7476952B2 (en) | 2004-12-28 | 2009-01-13 | Vladimir Vaganov | Semiconductor input control device |
US20090027353A1 (en) | 2007-07-27 | 2009-01-29 | June-Hyeok Im | Pressure sensor array apparatus and method for tactile sensing |
US20090027352A1 (en) | 2007-07-12 | 2009-01-29 | Stmicroelectronics Sa | Microelectronic pressure sensor |
US20090046110A1 (en) | 2007-08-16 | 2009-02-19 | Motorola, Inc. | Method and apparatus for manipulating a displayed image |
US20090102805A1 (en) | 2007-10-18 | 2009-04-23 | Microsoft Corporation | Three-dimensional object simulation using audio, visual, and tactile feedback |
US20090140985A1 (en) | 2007-11-30 | 2009-06-04 | Eric Liu | Computing device that determines and uses applied pressure from user interaction with an input interface |
CN101458134A (en) | 2007-12-10 | 2009-06-17 | 精工爱普生株式会社 | Semiconductor pressure sensor, method for producing the same, semiconductor device, and electronic apparatus |
US20090184936A1 (en) | 2008-01-22 | 2009-07-23 | Mathematical Inventing - Slicon Valley | 3D touchpad |
US20090184921A1 (en) | 2008-01-18 | 2009-07-23 | Microsoft Corporation | Input Through Sensing of User-Applied Forces |
US20090213066A1 (en) | 2008-02-21 | 2009-08-27 | Sony Corporation | One button remote control with haptic feedback |
US20090237374A1 (en) | 2008-03-20 | 2009-09-24 | Motorola, Inc. | Transparent pressure sensor and method for using |
US20090243998A1 (en) | 2008-03-28 | 2009-10-01 | Nokia Corporation | Apparatus, method and computer program product for providing an input gesture indicator |
US20090243817A1 (en) | 2008-03-30 | 2009-10-01 | Pressure Profile Systems Corporation | Tactile Device with Force Sensitive Touch Input Surface |
US20090242282A1 (en) | 2008-04-01 | 2009-10-01 | Korea Research Institute Of Standards And Science | Apparatus and Method for Providing Interface Depending on Action Force, and Recording Medium Thereof |
US20090256807A1 (en) | 2008-04-14 | 2009-10-15 | Nokia Corporation | User interface |
US20090256817A1 (en) | 2008-02-28 | 2009-10-15 | New York University | Method and apparatus for providing input to a processor, and a sensor pad |
US7607111B2 (en) | 2001-05-16 | 2009-10-20 | Motionip Llc | Method and device for browsing information on a display |
US7620521B2 (en) | 1995-06-07 | 2009-11-17 | Automotive Technologies International, Inc. | Dynamic weight sensing and classification of vehicular occupants |
US20090282930A1 (en) | 2008-05-19 | 2009-11-19 | Ching-Hsiang Cheng | Flexible piezoresistive interfacial shear and normal force sensor and sensor array |
US7629969B2 (en) | 1996-08-12 | 2009-12-08 | Tyco Electronics Corporation | Acoustic condition sensor employing a plurality of mutually non-orthogonal waves |
US20090303400A1 (en) | 2008-06-10 | 2009-12-10 | Industrial Technology Research Institute | Functional device array with self-aligned electrode structures and fabrication methods thereof |
US20090309852A1 (en) | 2008-06-13 | 2009-12-17 | Asustek Computer Inc. | Touch panel input device and control method thereof |
US20090314551A1 (en) | 2008-06-24 | 2009-12-24 | Fujitsu Component Limited | Touch panel |
US7649522B2 (en) | 2005-10-11 | 2010-01-19 | Fish & Richardson P.C. | Human interface input acceleration system |
US20100013785A1 (en) | 2007-03-01 | 2010-01-21 | Atsuhito Murai | Display panel substrate, display panel, display appratus, and method for manufacturing display panel substrate |
US20100020039A1 (en) | 2005-10-17 | 2010-01-28 | Industrial Technology Research Institute | Touch input device with display front |
US20100020030A1 (en) | 2008-07-22 | 2010-01-28 | Samsung Electronics Co., Ltd | Method of managing content and electronic apparatus using the same |
US7663612B2 (en) | 2003-02-27 | 2010-02-16 | Bang & Olufsen A/S | Metal display panel having one or more translucent regions |
US20100039396A1 (en) | 2008-08-15 | 2010-02-18 | Chen-Hsiang Ho | Touch sensing apparatus and sensing signal processing method thereof |
US20100053116A1 (en) | 2008-08-26 | 2010-03-04 | Dodge Daverman | Multi-touch force sensing touch-screen devices and methods |
US20100053087A1 (en) | 2008-08-26 | 2010-03-04 | Motorola, Inc. | Touch sensors with tactile feedback |
US20100066686A1 (en) | 2006-06-28 | 2010-03-18 | Stantum | Multipoint touch sensor with active matrix |
US20100066697A1 (en) | 2007-03-14 | 2010-03-18 | Axsionics Ag | Pressure measurement device and corresponding method |
US7685538B2 (en) | 2003-01-31 | 2010-03-23 | Wacom Co., Ltd. | Method of triggering functions in a computer application using a digitizer having a stylus and a digitizer system |
US20100079395A1 (en) | 2008-09-26 | 2010-04-01 | Lg Electronics Inc. | Mobile terminal and control method thereof |
US20100079391A1 (en) | 2008-09-30 | 2010-04-01 | Samsung Electro-Mechanics Co., Ltd. | Touch panel apparatus using tactile sensor |
US20100079398A1 (en) | 2008-09-26 | 2010-04-01 | Innolux Display Corp. | Liquid crystal display panel with touch panel function |
US7701445B2 (en) | 2002-10-30 | 2010-04-20 | Sony Corporation | Input device and process for manufacturing the same, portable electronic apparatus comprising input device |
US20100097347A1 (en) | 2008-10-21 | 2010-04-22 | Tzu-Chih Lin | Pressure Detection Module, and Touch Panel with Pressure Detection Module |
US20100102403A1 (en) | 2008-08-14 | 2010-04-29 | Board Of Regents, The University Of Texas System | Method and apparatus for fabricating piezoresistive polysilicon by low-temperature metal induced crystallization |
US20100117978A1 (en) | 2008-11-10 | 2010-05-13 | Shirado Hirokazu | Apparatus and method for touching behavior recognition, information processing apparatus, and computer program |
US20100123686A1 (en) | 2008-11-19 | 2010-05-20 | Sony Ericsson Mobile Communications Ab | Piezoresistive force sensor integrated in a display |
US20100123671A1 (en) | 2008-11-18 | 2010-05-20 | Chi Mei Communication Systems, Inc. | Touch panel and method for making the same |
US20100127140A1 (en) | 2008-01-23 | 2010-05-27 | Gary Smith | Suspension for a pressure sensitive touch display or panel |
US20100128002A1 (en) | 2008-11-26 | 2010-05-27 | William Stacy | Touch-sensitive display method and apparatus |
US7746327B2 (en) | 2004-11-08 | 2010-06-29 | Honda Access Corporation | Remote-control switch |
US20100164959A1 (en) | 2008-12-26 | 2010-07-01 | Brown Craig T | Rendering a virtual input device upon detection of a finger movement across a touch-sensitive display |
JP2010147268A (en) | 2008-12-19 | 2010-07-01 | Yamaha Corp | Mems sensor, and method of manufacturing mems sensor |
CN101801837A (en) | 2007-07-06 | 2010-08-11 | 因文森斯公司 | Integrated motion processing unit (MPU) with MEMS inertia sensing and embedded digital electronic component |
US20100220065A1 (en) | 2009-02-27 | 2010-09-02 | Research In Motion Limited | Touch-sensitive display including a force-sensor and portable electronic device including same |
US20100271325A1 (en) | 2009-04-27 | 2010-10-28 | Thomas Martin Conte | Direction and force sensing input device |
US7825911B2 (en) | 2006-03-27 | 2010-11-02 | Sanyo Electric Co., Ltd. | Touch sensor, touch pad and input device |
US20100289807A1 (en) | 2009-05-18 | 2010-11-18 | Nokia Corporation | Method, apparatus and computer program product for creating graphical objects with desired physical features for usage in animation |
CN201653605U (en) | 2010-04-09 | 2010-11-24 | 无锡芯感智半导体有限公司 | Silicon-bonding based pressure sensor |
US20100295807A1 (en) | 2009-05-19 | 2010-11-25 | Beijing Boe Optoelectronics Technology Co., Ltd. | Touch screen, color filter substrate and manufacturing methods thereof |
US20100308844A1 (en) | 2009-06-03 | 2010-12-09 | Synaptics Incorporated | Input device and method with pressure-sensitive layer |
US20100309714A1 (en) | 2009-06-08 | 2010-12-09 | Micron Technology, Inc. | Methods, structures, and devices for reducing operational energy in phase change memory |
US20100315373A1 (en) | 2007-10-26 | 2010-12-16 | Andreas Steinhauser | Single or multitouch-capable touchscreens or touchpads comprising an array of pressure sensors and the production of such sensors |
US20100321310A1 (en) | 2009-06-23 | 2010-12-23 | Korea Research Institute Of Standards And Science | Brightness controllable electroluminescence device with tactile sensor sensing intensity of force or intensity of pressure, flat panel display having the same, mobile terminal keypad having the same and method of operating the same |
US20100321319A1 (en) | 2009-06-17 | 2010-12-23 | Hefti Thierry | Method for displaying and updating a view of a graphical scene in response to commands via a touch-sensitive device |
CN101929898A (en) | 2009-12-01 | 2010-12-29 | 苏州扩达微电子有限公司 | Pressure sensing device |
US20100328230A1 (en) | 2009-06-30 | 2010-12-30 | Research In Motion Limited | Portable electronic device including tactile touch-sensitive input device and method of protecting same |
US20100328229A1 (en) | 2009-06-30 | 2010-12-30 | Research In Motion Limited | Method and apparatus for providing tactile feedback |
US20110001723A1 (en) | 2009-07-01 | 2011-01-06 | Hsiang-Pin Fan | Touch panel and sensing method thereof |
US20110006980A1 (en) | 2008-01-31 | 2011-01-13 | Appside Co., Ltd. | Data input device, data input method, data input program, and recording medium containing the program |
US20110007008A1 (en) | 2009-07-13 | 2011-01-13 | Cherif Atia Algreatly | Virtual touch screen system |
US20110012848A1 (en) | 2008-04-03 | 2011-01-20 | Dong Li | Methods and apparatus for operating a multi-object touch handheld device with touch sensitive display |
US20110018820A1 (en) | 2007-11-23 | 2011-01-27 | Polymer Vision Limited | Electronic apparatus with improved functionality |
US20110032211A1 (en) | 2008-03-27 | 2011-02-10 | Bbs Denmark A/S | secure keypad system |
US20110039602A1 (en) | 2009-08-13 | 2011-02-17 | Mcnamara Justin | Methods And Systems For Interacting With Content On A Mobile Device |
US20110050630A1 (en) | 2009-08-28 | 2011-03-03 | Tetsuo Ikeda | Information Processing Apparatus, Information Processing Method, and Program |
US20110050628A1 (en) | 2009-09-02 | 2011-03-03 | Fuminori Homma | Operation control device, operation control method and computer program |
US7903090B2 (en) | 2005-06-10 | 2011-03-08 | Qsi Corporation | Force-based input device |
US20110057899A1 (en) | 2009-09-04 | 2011-03-10 | Peter Sleeman | Capacitive control panel |
US20110063248A1 (en) | 2009-09-14 | 2011-03-17 | Samsung Electronics Co. Ltd. | Pressure-sensitive degree control method and system for touchscreen-enabled mobile terminal |
US7921725B2 (en) | 2004-10-18 | 2011-04-12 | Silverbrook Research Pty Ltd | Pressure sensor with dual chamber cover and corrugated membrane |
CN102062662A (en) | 2010-11-05 | 2011-05-18 | 北京大学 | Monolithic integrated SiC MEMS (Micro-Electro-Mechanical Systems) pressure sensor and production method thereof |
US20110113881A1 (en) | 2009-11-17 | 2011-05-19 | Oki Semiconductor Co., Ltd. | Acceleration sensor and method of fabricating acceleration sensor |
US7952566B2 (en) | 2006-07-31 | 2011-05-31 | Sony Corporation | Apparatus and method for touch screen interaction based on tactile feedback and pressure measurement |
US20110128250A1 (en) | 2009-12-02 | 2011-06-02 | Murphy Mark J | Method and device for detecting user input |
WO2011065250A1 (en) | 2009-11-25 | 2011-06-03 | アルプス電気株式会社 | Force sensor |
US20110141053A1 (en) | 2009-12-14 | 2011-06-16 | Synaptics Incorporated | System and method for measuring individual force in multi-object sensing |
US20110141052A1 (en) | 2009-12-10 | 2011-06-16 | Jeffrey Traer Bernstein | Touch pad with force sensors and actuator feedback |
US7973772B2 (en) | 2001-01-30 | 2011-07-05 | Hewlett-Packard Development Company, L.P. | Single piece top surface display layer and integrated front cover for an electronic device |
US7973778B2 (en) | 2007-04-16 | 2011-07-05 | Microsoft Corporation | Visual simulation of touch pressure |
US20110187674A1 (en) | 2010-02-03 | 2011-08-04 | Interlink Electronics, Inc. | Sensor system |
US8004501B2 (en) | 2008-01-21 | 2011-08-23 | Sony Computer Entertainment America Llc | Hand-held device with touchscreen and digital tactile pixels |
US20110209555A1 (en) | 2010-03-01 | 2011-09-01 | Marcus Ahles | Micromechanical pressure-sensor element and method for its production |
US8013843B2 (en) | 1995-06-29 | 2011-09-06 | Pryor Timothy R | Method for providing human input to a computer |
US20110227836A1 (en) | 2008-03-20 | 2011-09-22 | Motorola, Inc. | Transparent force sensor and method of fabrication |
US8026906B2 (en) | 2007-09-07 | 2011-09-27 | F-Origin, Inc. | Integrated force sensitive lens and software |
DE102010012441A1 (en) | 2010-03-23 | 2011-09-29 | Bundesrepublik Deutschland, vertreten durch den Bundesminister für Wirtschaft, dieser vertreten durch den Präsidenten der Physikalisch-Technischen Bundesanstalt | Milli-Newton micro force measuring device for measuring forces in micro-electro-mechanical system, has micro sensor whose end is fastened to retaining unit and another end is designed as free end that moves relative to retaining unit |
US20110242014A1 (en) | 2010-04-02 | 2011-10-06 | E Ink Holdings Inc. | Display panel |
US8044929B2 (en) | 2005-03-31 | 2011-10-25 | Stmicroelectronics S.R.L. | Analog data-input device provided with a pressure sensor of a microelectromechanical type |
US20110267181A1 (en) | 2010-04-29 | 2011-11-03 | Nokia Corporation | Apparatus and method for providing tactile feedback for user |
US20110267294A1 (en) | 2010-04-29 | 2011-11-03 | Nokia Corporation | Apparatus and method for providing tactile feedback for user |
US20110273396A1 (en) | 2010-05-06 | 2011-11-10 | Samsung Electro-Mechanics Co., Ltd. | Touch screen device |
US20110291951A1 (en) | 2010-05-28 | 2011-12-01 | Research In Motion Limited | Electronic device including touch-sensitive display and method of controlling same |
US8072437B2 (en) | 2009-08-26 | 2011-12-06 | Global Oled Technology Llc | Flexible multitouch electroluminescent display |
US20110298705A1 (en) | 2003-12-29 | 2011-12-08 | Vladimir Vaganov | Three-dimensional input control device |
US20110308324A1 (en) | 2010-06-18 | 2011-12-22 | Sisira Kankanam Gamage | A sensor and method for fabricating the same |
US8096188B2 (en) | 2006-10-05 | 2012-01-17 | Meggitt (San Juan Capistrano), Inc. | Highly sensitive piezoresistive element |
US20120032907A1 (en) | 2009-04-22 | 2012-02-09 | Yoshiaki Koizumi | Position input apparatus |
US20120032915A1 (en) | 2010-08-05 | 2012-02-09 | GM Global Technology Operations LLC | Operating element for actuation by a user and operating element module |
US8113065B2 (en) | 2006-08-24 | 2012-02-14 | Honda Motor Co., Ltd. | Force sensor |
US20120038579A1 (en) | 2009-04-24 | 2012-02-16 | Kyocera Corporation | Input appratus |
US8120586B2 (en) | 2007-05-15 | 2012-02-21 | Htc Corporation | Electronic devices with touch-sensitive navigational mechanisms, and associated methods |
US8120588B2 (en) | 2009-07-15 | 2012-02-21 | Sony Ericsson Mobile Communications Ab | Sensor assembly and display including a sensor assembly |
US20120044169A1 (en) | 2010-08-19 | 2012-02-23 | Ricoh Company, Limited | Operation display device and operation display method |
US20120044172A1 (en) | 2010-08-20 | 2012-02-23 | Sony Corporation | Information processing apparatus, program, and operation control method |
US20120050208A1 (en) | 2010-08-30 | 2012-03-01 | Microsoft Corporation | Resistive matrix with optimized input scanning |
US20120050159A1 (en) | 2010-08-31 | 2012-03-01 | International Business Machines Corporation | Computer device with touch screen and method for operating the same |
US8130207B2 (en) | 2008-06-18 | 2012-03-06 | Nokia Corporation | Apparatus, method and computer program product for manipulating a device using dual side input devices |
US20120056837A1 (en) | 2010-09-08 | 2012-03-08 | Samsung Electronics Co., Ltd. | Motion control touch screen method and apparatus |
US8134535B2 (en) | 2007-03-02 | 2012-03-13 | Samsung Electronics Co., Ltd. | Display device including integrated touch sensors |
US20120062603A1 (en) | 2010-01-12 | 2012-03-15 | Hiroyuki Mizunuma | Information Processing Apparatus, Information Processing Method, and Program Therefor |
US20120061823A1 (en) | 2010-09-10 | 2012-03-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device having pad structure with stress buffer layer |
US20120060605A1 (en) | 2010-09-09 | 2012-03-15 | Ming-Ching Wu | Mems sensor capable of sensing acceleration and pressure |
US8139038B2 (en) | 2007-09-29 | 2012-03-20 | Htc Corporation | Method for determining pressed location of touch screen |
US20120068946A1 (en) | 2010-09-16 | 2012-03-22 | Sheng-Kai Tang | Touch display device and control method thereof |
US20120068969A1 (en) | 2009-05-29 | 2012-03-22 | Matteo Paolo Bogana | Method for determining multiple touch inputs on a resistive touch screen and a multiple touch controller |
US8144133B2 (en) | 2008-12-24 | 2012-03-27 | E Ink Holdings Inc. | Display device with touch panel and fabricating method thereof |
US8149211B2 (en) | 2007-06-13 | 2012-04-03 | Tokai Rubber Industries, Ltd. | Deformable sensor system |
US20120081327A1 (en) | 2007-09-28 | 2012-04-05 | Immersion Corporation | Multi-touch device having dynamic haptic effects |
US8154528B2 (en) | 2008-08-21 | 2012-04-10 | Au Optronics Corp. | Matrix sensing apparatus |
US20120086659A1 (en) | 2010-10-12 | 2012-04-12 | New York University & Tactonic Technologies, LLC | Method and apparatus for sensing utilizing tiles |
US8159473B2 (en) | 2008-11-13 | 2012-04-17 | Orise Technology Co., Ltd. | Method for detecting touch point and touch panel using the same |
US20120092294A1 (en) | 2010-10-18 | 2012-04-19 | Qualcomm Mems Technologies, Inc. | Combination touch, handwriting and fingerprint sensor |
US20120092250A1 (en) | 2009-06-14 | 2012-04-19 | Micropointing Ltd. | Finger-operated input device |
US20120092299A1 (en) | 2010-05-20 | 2012-04-19 | Kumi Harada | Operating apparatus, operating method, program, recording medium, and integrated circuit |
US8164573B2 (en) | 2003-11-26 | 2012-04-24 | Immersion Corporation | Systems and methods for adaptive interpretation of input from a touch-sensitive input device |
US20120105358A1 (en) | 2010-11-03 | 2012-05-03 | Qualcomm Incorporated | Force sensing touch screen |
US20120105367A1 (en) | 2010-11-01 | 2012-05-03 | Impress Inc. | Methods of using tactile force sensing for intuitive user interface |
US20120113061A1 (en) | 2009-08-27 | 2012-05-10 | Tetsuo Ikeda | Information processing apparatus, information processing method, and program |
US8184093B2 (en) | 2008-06-27 | 2012-05-22 | Kyocera Corporation | Mobile terminal device |
US20120127088A1 (en) | 2010-11-19 | 2012-05-24 | Apple Inc. | Haptic input device |
US20120127107A1 (en) | 2009-07-28 | 2012-05-24 | Ken Miyashita | Display control device, display control method, and computer program |
US8188985B2 (en) | 2004-08-06 | 2012-05-29 | Touchtable, Inc. | Method and apparatus continuing action of user gestures performed upon a touch sensitive interactive display in simulation of inertia |
US20120139864A1 (en) | 2010-12-02 | 2012-06-07 | Atmel Corporation | Position-sensing and force detection panel |
US8199116B2 (en) | 2005-09-26 | 2012-06-12 | Samsung Electronics Co., Ltd. | Display panel, display device having the same and method of detecting touch position |
US20120144921A1 (en) | 2010-12-10 | 2012-06-14 | Honeywell International Inc. | Increased sensor die adhesion |
US20120147052A1 (en) | 2009-09-02 | 2012-06-14 | Fuminori Homma | Operation control device, operation control method and computer program |
US20120146945A1 (en) | 2009-08-31 | 2012-06-14 | Miyazawa Yusuke | Information processing apparatus, information processing method, and program |
US20120154328A1 (en) | 2009-08-27 | 2012-06-21 | Kyocera Corporation | Input apparatus |
US20120154329A1 (en) | 2009-08-27 | 2012-06-21 | Kyocera Corporation | Input apparatus |
US20120154316A1 (en) | 2009-08-27 | 2012-06-21 | Kyocera Corporation | Input apparatus |
US20120154315A1 (en) | 2009-08-27 | 2012-06-21 | Kyocera Corporation | Input apparatus |
US20120154318A1 (en) | 2009-08-27 | 2012-06-21 | Kyocera Corporation | Input apparatus |
US20120154317A1 (en) | 2009-08-27 | 2012-06-21 | Kyocera Corporation | Input apparatus and control method for input apparatus |
US20120154330A1 (en) | 2009-08-27 | 2012-06-21 | Kyocera Corporation | Input apparatus and control method for input apparatus |
US20120162122A1 (en) | 2010-12-27 | 2012-06-28 | 3M Innovative Properties Company | Force sensitive device with force sensitive resistors |
US8212790B2 (en) | 2004-12-21 | 2012-07-03 | Microsoft Corporation | Pressure sensitive controls |
US20120169609A1 (en) | 2010-12-29 | 2012-07-05 | Nokia Corporation | Methods and apparatuses for facilitating content navigation |
US20120169617A1 (en) | 2011-01-04 | 2012-07-05 | Nokia Corporation | Controlling of user input device |
US20120169635A1 (en) | 2010-12-31 | 2012-07-05 | Liu Hung-Ta | Touchable sensing matrix unit, a co-constructed active array substrate having the touchable sensing matrix unit and a display having the co-constructed active array substrate |
US20120188181A1 (en) | 2011-01-25 | 2012-07-26 | Samsung Electromechanics Co., Ltd. | Touch screen apparatus detecting touch pressure and electronic apparatus having the same |
US20120194460A1 (en) | 2009-08-27 | 2012-08-02 | Kyocera Corporation | Tactile sensation providing apparatus and control method for tactile sensation providing apparatus |
US20120194466A1 (en) | 2011-01-31 | 2012-08-02 | National Semiconductor Corporation | Haptic interface for touch screen in mobile device or other device |
US8237537B2 (en) | 2006-06-15 | 2012-08-07 | Kulite Semiconductor Products, Inc. | Corrosion-resistant high temperature pressure transducer employing a metal diaphragm |
US20120200526A1 (en) | 2011-02-09 | 2012-08-09 | Mark Lackey | Snap domes as sensor protection |
US8243035B2 (en) | 2008-07-30 | 2012-08-14 | Canon Kabushiki Kaisha | Information processing method and apparatus |
US20120205165A1 (en) | 2011-02-11 | 2012-08-16 | Research In Motion Limited | Input detecting apparatus, and associated method, for electronic device |
US20120204653A1 (en) | 2011-02-16 | 2012-08-16 | Silicon Microstructures, Inc. | Compensation of stress effects on pressure sensor components |
US8253699B2 (en) | 2007-06-28 | 2012-08-28 | Samsung Electronics Co., Ltd. | Display apparatus, method of driving the same, and sensing driver of display apparatus |
US8260337B2 (en) | 2004-04-02 | 2012-09-04 | Apple Inc. | System and method for peer-to-peer communication in cellular systems |
US8269731B2 (en) | 2006-09-09 | 2012-09-18 | F-Origin, Inc. | Integrated pressure sensitive lens assembly |
US20120234112A1 (en) | 2009-12-25 | 2012-09-20 | Alps Electric Co., Ltd. | Force sensor and method of manufacturing the same |
US20120256237A1 (en) | 2009-01-27 | 2012-10-11 | State University | Embedded mems sensors and related methods |
US8289288B2 (en) | 2009-01-15 | 2012-10-16 | Microsoft Corporation | Virtual object adjustment via physical object detection |
US8289290B2 (en) | 2009-07-20 | 2012-10-16 | Sony Ericsson Mobile Communications Ab | Touch sensing apparatus for a mobile device, mobile device and method for touch operation sensing |
US8297127B2 (en) | 2011-01-07 | 2012-10-30 | Honeywell International Inc. | Pressure sensor with low cost packaging |
US20120286379A1 (en) | 2011-05-09 | 2012-11-15 | Mitsubishi Electric Corporation | Sensor element |
US8319739B2 (en) | 2008-12-23 | 2012-11-27 | Integrated Digital Technologies, Inc. | Force-sensing modules for light sensitive screens |
US8325143B2 (en) | 2003-07-21 | 2012-12-04 | Creator Technology B.V. | Touch sensitive display for a portable device |
US20120319987A1 (en) | 2011-06-15 | 2012-12-20 | Synaptics Incorporated | System and method for calibrating an input device |
US20120327025A1 (en) | 2010-05-24 | 2012-12-27 | Synaptics Incorporated | Touchpad with Capacitive Force Sensing |
CN102853950A (en) | 2012-09-10 | 2013-01-02 | 厦门海合达汽车电器有限公司 | Piezoresistive pressure sensor chip adopting face down bonding and preparing method thereof |
US20130008263A1 (en) | 2010-03-30 | 2013-01-10 | Kikuchi Seisakusho Co., Ltd. | Flowrate sensor and flowrate detection device |
US8363020B2 (en) | 2009-08-27 | 2013-01-29 | Symbol Technologies, Inc. | Methods and apparatus for pressure-based manipulation of content on a touch screen |
US8363022B2 (en) | 2009-02-06 | 2013-01-29 | Lg Electronics Inc. | Mobile terminal and operating method of the mobile terminal |
US20130038541A1 (en) | 2011-08-12 | 2013-02-14 | Research In Motion | Portable Electronic Device and Method of Controlling Same |
US8378798B2 (en) | 2009-07-24 | 2013-02-19 | Research In Motion Limited | Method and apparatus for a touch-sensitive display |
US8378991B2 (en) | 2007-08-21 | 2013-02-19 | Samsung Display Co., Ltd. | Method of detecting a touch position and touch panel for performing the same |
US8384677B2 (en) | 2008-04-25 | 2013-02-26 | Research In Motion Limited | Electronic device including touch-sensitive input surface and method of determining user-selected input |
US8387464B2 (en) | 2009-11-30 | 2013-03-05 | Freescale Semiconductor, Inc. | Laterally integrated MEMS sensor device with multi-stimulus sensing |
CN102998037A (en) | 2012-09-15 | 2013-03-27 | 华东光电集成器件研究所 | Dielectric isolation piezoresistive pressure sensor and method for manufacturing same |
US8421609B2 (en) | 2010-08-13 | 2013-04-16 | Samsung Electro-Mechanics Co., Ltd. | Haptic feedback device and electronic device having the same |
US20130093685A1 (en) | 2011-10-14 | 2013-04-18 | Research In Motion Limited | System and Method for Controlling an Electronic Device Having a Touch-Sensitive Non-Display Area |
US20130096849A1 (en) | 2011-10-14 | 2013-04-18 | Nextinput Inc. | Force Sensitive Interface Device and Methods of Using Same |
US8427441B2 (en) | 2008-12-23 | 2013-04-23 | Research In Motion Limited | Portable electronic device and method of control |
US8436806B2 (en) | 2009-10-02 | 2013-05-07 | Research In Motion Limited | Method of synchronizing data acquisition and a portable electronic device configured to perform the same |
US8436827B1 (en) | 2011-11-29 | 2013-05-07 | Google Inc. | Disambiguating touch-input based on variation in characteristic such as speed or pressure along a touch-trail |
WO2013067548A1 (en) | 2011-11-06 | 2013-05-10 | Khandani Mehdi Kalantari | System and method for strain and acoustic emission monitoring |
US20130140944A1 (en) | 2008-04-29 | 2013-06-06 | Sand 9, Inc. | Microelectromechanical systems (mems) resonators and related apparatus and methods |
US8466889B2 (en) | 2010-05-14 | 2013-06-18 | Research In Motion Limited | Method of providing tactile feedback and electronic device |
US8477115B2 (en) | 2005-06-08 | 2013-07-02 | Sony Corporation | Input device, information processing apparatus, information processing method, and program |
US8482372B2 (en) | 2006-04-26 | 2013-07-09 | Kulite Semiconductor Products, Inc. | Pressure transducer utilizing non-lead containing frit |
US8493189B2 (en) | 2006-12-25 | 2013-07-23 | Fukoku Co., Ltd. | Haptic feedback controller |
US20130187201A1 (en) | 2012-01-25 | 2013-07-25 | Infineon Technologies Ag | Sensor Device and Method |
CN103308239A (en) | 2012-03-08 | 2013-09-18 | Nxp股份有限公司 | Mems capacitive pressure sensor |
US20130239700A1 (en) | 2011-02-07 | 2013-09-19 | The Governors Of The University Of Alberta | Piezoresistive load sensor |
US20130255393A1 (en) | 2012-03-29 | 2013-10-03 | Hideaki Fukuzawa | Pressure sensor and microphone |
US20130341741A1 (en) | 2012-06-21 | 2013-12-26 | Nextlnput, Inc. | Ruggedized mems force die |
US20140007705A1 (en) | 2012-07-05 | 2014-01-09 | Nextinput, Inc. | Microelectromechanical load sensor and methods of manufacturing the same |
US20140028575A1 (en) | 2012-07-26 | 2014-01-30 | Apple Inc. | Gesture and Touch Input Detection Through Force Sensing |
US20140055407A1 (en) | 2012-08-24 | 2014-02-27 | Samsung Display Co., Ltd. | Touch display apparatus sensing touch force |
US20140090488A1 (en) | 2012-09-29 | 2014-04-03 | Stryker Corporation | Flexible Piezocapacitive And Piezoresistive Force And Pressure Sensors |
US20140283604A1 (en) | 2012-10-26 | 2014-09-25 | The Regents Of The University Of Michigan | Three-dimensional microelectromechanical systems structure |
US20140367811A1 (en) | 2012-02-15 | 2014-12-18 | Omron Corporation | Capacitance type sensor and method of manufacturing the same |
US8931347B2 (en) | 2011-12-09 | 2015-01-13 | Openfield Sas | Fluid pressure sensor and measurement probe |
US8984951B2 (en) | 2012-09-18 | 2015-03-24 | Kulite Semiconductor Products, Inc. | Self-heated pressure sensor assemblies |
CN104535229A (en) | 2014-12-04 | 2015-04-22 | 广东省自动化研究所 | Pressure detection device and method based on piezoresistive and piezoelectric flexible sensor combination |
US20150110295A1 (en) | 2013-10-22 | 2015-04-23 | Infineon Technologies Ag | System and Method for Automatic Calibration of a Transducer |
WO2015106246A1 (en) | 2014-01-13 | 2015-07-16 | Nextinput, Inc. | Miniaturized and ruggedized wafer level mems force sensors |
US9097600B2 (en) | 2011-11-06 | 2015-08-04 | Mehdi Kalantari Khandani | System and method for strain and acoustic emission monitoring |
US20150241465A1 (en) | 2012-12-06 | 2015-08-27 | Murata Manufacturing Co., Ltd. | Piezoresistive mems sensor |
US20160069927A1 (en) | 2013-06-04 | 2016-03-10 | Murata Manufacturing Co., Ltd. | Acceleration sensor |
US20160245667A1 (en) | 2015-02-24 | 2016-08-25 | The Regents Of The University Of Michigan | Actuation And Sensing Platform For Sensor Calibration And Vibration Isolation |
US20160258825A1 (en) * | 2015-03-02 | 2016-09-08 | Invensense, Inc. | Mems sensor offset compensation with strain gauge |
US20160320426A1 (en) * | 2014-01-09 | 2016-11-03 | Motion Engine, Inc. | Integrated mems system |
US20160363490A1 (en) | 2015-06-10 | 2016-12-15 | Nextinput, Inc. | Ruggedized wafer level mems force sensor with a tolerance trench |
US20170066014A1 (en) * | 2015-09-03 | 2017-03-09 | Qualcomm Incorporated | Release hole plus contact via for fine pitch ultrasound transducer integration |
US20170103246A1 (en) * | 2014-10-06 | 2017-04-13 | Shenzhen Huiding Technology Co., Ltd. | Self-capacitive fingerprint sensor with active amplified pixels |
US9709509B1 (en) | 2009-11-13 | 2017-07-18 | MCube Inc. | System configured for integrated communication, MEMS, Processor, and applications using a foundry compatible semiconductor process |
US20170234744A1 (en) | 2016-02-16 | 2017-08-17 | GlobalMEMS Co., Ltd. | Mems force sensor and force sensing apparatus |
US20180238753A1 (en) * | 2017-02-21 | 2018-08-23 | Stmicroelectronics S.R.L. | Microelectromechanical scalable bulk-type piezoresistive force/pressure sensor |
WO2019023552A1 (en) | 2017-07-27 | 2019-01-31 | Nextinput, Inc. | A wafer bonded piezoresistive and piezoelectric force sensor and related methods of manufacture |
US20190383675A1 (en) | 2017-02-09 | 2019-12-19 | Nextinput, Inc. | Integrated piezoresistive and piezoelectric fusion force sensor |
US20190383676A1 (en) | 2017-02-09 | 2019-12-19 | Nextinput, Inc. | Integrated digital force sensors and related methods of manufacture |
US20200149983A1 (en) | 2017-07-19 | 2020-05-14 | Nextinput, Inc. | Strain transfer stacking in a mems force sensor |
US10962427B2 (en) | 2019-01-10 | 2021-03-30 | Nextinput, Inc. | Slotted MEMS force sensor |
-
2018
- 2018-07-25 WO PCT/US2018/043616 patent/WO2019023309A1/en active Application Filing
- 2018-07-25 US US16/634,495 patent/US11423686B2/en active Active
Patent Citations (405)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4594639A (en) | 1984-02-21 | 1986-06-10 | Vaisala Oy | Capacitive pressure detector |
US4658651A (en) | 1985-05-13 | 1987-04-21 | Transamerica Delaval Inc. | Wheatstone bridge-type transducers with reduced thermal shift |
US4849730A (en) | 1986-02-14 | 1989-07-18 | Ricoh Company, Ltd. | Force detecting device |
US4814856A (en) | 1986-05-07 | 1989-03-21 | Kulite Semiconductor Products, Inc. | Integral transducer structures employing high conductivity surface features |
US4914624A (en) | 1988-05-06 | 1990-04-03 | Dunthorn David I | Virtual button for touch screen |
US5320705A (en) | 1988-06-08 | 1994-06-14 | Nippondenso Co., Ltd. | Method of manufacturing a semiconductor pressure sensor |
US5095401A (en) | 1989-01-13 | 1992-03-10 | Kopin Corporation | SOI diaphragm sensor |
US4918262A (en) | 1989-03-14 | 1990-04-17 | Ibm Corporation | Touch sensing display screen signal processing apparatus and method |
US4933660A (en) | 1989-10-27 | 1990-06-12 | Elographics, Inc. | Touch sensor with touch pressure capability |
US4983786A (en) | 1990-01-17 | 1991-01-08 | The University Of British Columbia | XY velocity controller |
US5343220A (en) | 1990-04-20 | 1994-08-30 | Crosfield Electronics Limited | Force monitor of an electronic paint brush apparatus |
US5349746A (en) | 1990-05-07 | 1994-09-27 | Robert Bosch Gmbh | Process for the manufacture of a force sensor |
US5166612A (en) | 1990-11-13 | 1992-11-24 | Tektronix, Inc. | Micromechanical sensor employing a squid to detect movement |
US5159159A (en) | 1990-12-07 | 1992-10-27 | Asher David J | Touch sensor and controller |
US5969591A (en) | 1991-03-28 | 1999-10-19 | The Foxboro Company | Single-sided differential pressure sensor |
US5237879A (en) | 1991-10-11 | 1993-08-24 | At&T Bell Laboratories | Apparatus for dynamically varying the resolution of a tactile sensor array |
WO1993010430A1 (en) | 1991-11-15 | 1993-05-27 | Robert Bosch Gmbh | Silicon chip for use in a force-detection sensor |
US5600074A (en) | 1991-11-15 | 1997-02-04 | Robert Bosch Gmbh | Silicon chip for use in a force-detection sensor |
US5333505A (en) | 1992-01-13 | 1994-08-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor pressure sensor for use at high temperature and pressure and method of manufacturing same |
US20060028441A1 (en) | 1992-03-05 | 2006-02-09 | Armstrong Brad A | Image controller |
US5673066A (en) | 1992-04-21 | 1997-09-30 | Alps Electric Co., Ltd. | Coordinate input device |
US6028271A (en) | 1992-06-08 | 2000-02-22 | Synaptics, Inc. | Object position detector with edge motion feature and gesture recognition |
US6610936B2 (en) | 1992-06-08 | 2003-08-26 | Synaptics, Inc. | Object position detector with edge motion feature and gesture recognition |
US5543591A (en) | 1992-06-08 | 1996-08-06 | Synaptics, Incorporated | Object position detector with edge motion feature and gesture recognition |
US5889236A (en) | 1992-06-08 | 1999-03-30 | Synaptics Incorporated | Pressure sensitive scrollbar feature |
US5541372A (en) | 1992-06-15 | 1996-07-30 | U.S. Philips Corporation | Force activated touch screen measuring deformation of the front panel |
US5351550A (en) | 1992-10-16 | 1994-10-04 | Honeywell Inc. | Pressure sensor adapted for use with a component carrier |
US5565657A (en) | 1993-11-01 | 1996-10-15 | Xerox Corporation | Multidimensional user interface input device |
US5510812A (en) | 1994-04-22 | 1996-04-23 | Hasbro, Inc. | Piezoresistive input device |
US5483994A (en) | 1995-02-01 | 1996-01-16 | Honeywell, Inc. | Pressure transducer with media isolation and negative pressure measuring capability |
US5773728A (en) | 1995-03-31 | 1998-06-30 | Kabushiki Kaisha Toyota Chuo Kenkyusho | Force transducer and method of fabrication thereof |
US7620521B2 (en) | 1995-06-07 | 2009-11-17 | Automotive Technologies International, Inc. | Dynamic weight sensing and classification of vehicular occupants |
US8068100B2 (en) | 1995-06-29 | 2011-11-29 | Pryor Timothy R | Method for providing human input to a computer |
US8013843B2 (en) | 1995-06-29 | 2011-09-06 | Pryor Timothy R | Method for providing human input to a computer |
US8072440B2 (en) | 1995-06-29 | 2011-12-06 | Pryor Timothy R | Method for providing human input to a computer |
US6012336A (en) | 1995-09-06 | 2000-01-11 | Sandia Corporation | Capacitance pressure sensor |
US6351205B1 (en) | 1996-07-05 | 2002-02-26 | Brad A. Armstrong | Variable-conductance sensor |
US7629969B2 (en) | 1996-08-12 | 2009-12-08 | Tyco Electronics Corporation | Acoustic condition sensor employing a plurality of mutually non-orthogonal waves |
US6348663B1 (en) | 1996-10-03 | 2002-02-19 | I.E.E. International Electronics & Engineering S.A.R.L. | Method and device for determining several parameters of a seated person |
US20010009112A1 (en) | 1997-04-17 | 2001-07-26 | Commissariat A L'energie Atomique | Microsystem with a flexible membrane for a pressure sensor and manufacturing process |
US6243075B1 (en) | 1997-08-29 | 2001-06-05 | Xerox Corporation | Graspable device manipulation for controlling a computer display |
US20080036743A1 (en) | 1998-01-26 | 2008-02-14 | Apple Computer, Inc. | Gesturing with a multipoint sensing device |
US6159166A (en) | 1998-03-20 | 2000-12-12 | Hypertension Diagnostics, Inc. | Sensor and method for sensing arterial pulse pressure |
US6556189B1 (en) | 1998-04-24 | 2003-04-29 | Nissha Printing Co., Ltd. | Touch panel device |
US20070229478A1 (en) | 1998-06-23 | 2007-10-04 | Immersion Corporation | Haptic feedback for touchpads and other touch controls |
US5921896A (en) | 1998-09-04 | 1999-07-13 | Boland; Kevin O. | Exercise device |
US6668230B2 (en) | 1998-12-11 | 2003-12-23 | Symyx Technologies, Inc. | Computer readable medium for performing sensor array based materials characterization |
US6629343B1 (en) | 1999-09-10 | 2003-10-07 | Hypertension Diagnostics, Inc. | Method for fabricating a pressure-wave sensor with a leveling support element |
US6360598B1 (en) | 1999-09-14 | 2002-03-26 | K.K. Holding Ag | Biomechanical measuring arrangement |
US20070103452A1 (en) | 2000-01-31 | 2007-05-10 | Canon Kabushiki Kaisha | Method and apparatus for detecting and interpreting path of designated position |
US6720712B2 (en) | 2000-03-23 | 2004-04-13 | Cross Match Technologies, Inc. | Piezoelectric identification device and applications thereof |
US6812621B2 (en) | 2000-03-23 | 2004-11-02 | Cross Match Technologies, Inc. | Multiplexer for a piezo ceramic identification device |
US6437682B1 (en) | 2000-04-20 | 2002-08-20 | Ericsson Inc. | Pressure sensitive direction switches |
US6620115B2 (en) | 2000-04-28 | 2003-09-16 | Armed L.L.C. | Apparatus and method for mechanical imaging of breast |
US6555235B1 (en) | 2000-07-06 | 2003-04-29 | 3M Innovative Properties Co. | Touch screen system |
US6879318B1 (en) | 2000-10-06 | 2005-04-12 | Industrial Technology Research Institute | Touch screen mounting assembly for LCD panel and method for fabrication |
US7973772B2 (en) | 2001-01-30 | 2011-07-05 | Hewlett-Packard Development Company, L.P. | Single piece top surface display layer and integrated front cover for an electronic device |
US7173607B2 (en) | 2001-02-09 | 2007-02-06 | Sanyo Electric Co., Ltd. | Signal detector |
US6788297B2 (en) | 2001-02-21 | 2004-09-07 | International Business Machines Corporation | Pressure sensitive writing tablet, control method and control program therefor |
US6569108B2 (en) | 2001-03-28 | 2003-05-27 | Profile, Llc | Real time mechanical imaging of the prostate |
US6822640B2 (en) | 2001-04-10 | 2004-11-23 | Hewlett-Packard Development Company, L.P. | Illuminated touch pad |
US7190350B2 (en) | 2001-04-13 | 2007-03-13 | 3M Innovative Properties Company | Touch screen with rotationally isolated force sensor |
US6801191B2 (en) | 2001-04-27 | 2004-10-05 | Matsushita Electric Industrial Co., Ltd. | Input device and inputting method with input device |
US20100153891A1 (en) | 2001-05-16 | 2010-06-17 | Motionip, Llc | Method, device and program for browsing information on a display |
US7607111B2 (en) | 2001-05-16 | 2009-10-20 | Motionip Llc | Method and device for browsing information on a display |
US7138984B1 (en) | 2001-06-05 | 2006-11-21 | Idc, Llc | Directly laminated touch sensitive screen |
US20040140966A1 (en) | 2001-06-20 | 2004-07-22 | Leapfrog Enterprises, Inc. | Interactive apparatus using print media |
US20030128181A1 (en) | 2001-07-24 | 2003-07-10 | David L. Poole | Low profile cursor control device |
US7215329B2 (en) | 2001-10-10 | 2007-05-08 | Smk Corporation | Touch panel input device |
US20030067448A1 (en) | 2001-10-10 | 2003-04-10 | Samsung Sdi Co., Ltd. | Touch panel |
US7336260B2 (en) | 2001-11-01 | 2008-02-26 | Immersion Corporation | Method and apparatus for providing tactile sensations |
US6995752B2 (en) | 2001-11-08 | 2006-02-07 | Koninklijke Philips Electronics N.V. | Multi-point touch pad |
US7324094B2 (en) | 2001-11-12 | 2008-01-29 | Myorigo, S.A.R.L. | Method and device for generating multi-functional feedback |
US6915702B2 (en) | 2001-11-22 | 2005-07-12 | Kabushiki Kaisha Toyota Chuo Kenkyusho | Piezoresistive transducers |
US6888537B2 (en) | 2002-02-13 | 2005-05-03 | Siemens Technology-To-Business Center, Llc | Configurable industrial input devices that use electrically conductive elastomer |
US20040012572A1 (en) | 2002-03-16 | 2004-01-22 | Anthony Sowden | Display and touch screen method and apparatus |
US20030189552A1 (en) | 2002-04-03 | 2003-10-09 | Hsun-Hsin Chuang | Touch panel threshold pressure setup method and apparatus |
US7406661B2 (en) | 2002-04-23 | 2008-07-29 | Myorigo L.L.C. | Graphical user interface and method and electronic device for navigating in the graphical user interface |
US7425749B2 (en) | 2002-04-23 | 2008-09-16 | Sharp Laboratories Of America, Inc. | MEMS pixel sensor |
US6809280B2 (en) | 2002-05-02 | 2004-10-26 | 3M Innovative Properties Company | Pressure activated switch and touch panel |
US7345680B2 (en) | 2002-06-25 | 2008-03-18 | David Albert M | Laminated touch screen |
US7819998B2 (en) | 2002-06-25 | 2010-10-26 | David Albert M | Method of forming a touch screen laminate |
US7245293B2 (en) | 2002-08-02 | 2007-07-17 | Hitachi, Ltd. | Display unit with touch panel and information processing method |
US7701445B2 (en) | 2002-10-30 | 2010-04-20 | Sony Corporation | Input device and process for manufacturing the same, portable electronic apparatus comprising input device |
JP2004156937A (en) | 2002-11-05 | 2004-06-03 | Tanita Corp | Diaphragm type load detection sensor and load detection unit, and electronic balance utilizing the same |
US20070298883A1 (en) | 2002-12-04 | 2007-12-27 | Philip Feldman | Method and Apparatus for Operatively Controlling a Virtual Reality Scenario in Accordance With Physical Activity of a User |
US6931938B2 (en) | 2002-12-16 | 2005-08-23 | Jeffrey G. Knirck | Measuring pressure exerted by a rigid surface |
US7685538B2 (en) | 2003-01-31 | 2010-03-23 | Wacom Co., Ltd. | Method of triggering functions in a computer application using a digitizer having a stylus and a digitizer system |
US7663612B2 (en) | 2003-02-27 | 2010-02-16 | Bang & Olufsen A/S | Metal display panel having one or more translucent regions |
US20070182864A1 (en) | 2003-04-04 | 2007-08-09 | Evolution Broadcastpty Limited | Broadcast control |
WO2004113859A1 (en) | 2003-06-18 | 2004-12-29 | Honeywell International Inc. | Pressure sensor apparatus and method |
US8325143B2 (en) | 2003-07-21 | 2012-12-04 | Creator Technology B.V. | Touch sensitive display for a portable device |
US20050083310A1 (en) | 2003-10-20 | 2005-04-21 | Max Safai | Navigation and fingerprint sensor |
US7460109B2 (en) | 2003-10-20 | 2008-12-02 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Navigation and fingerprint sensor |
US7218313B2 (en) | 2003-10-31 | 2007-05-15 | Zeetoo, Inc. | Human interface system |
US6868731B1 (en) | 2003-11-20 | 2005-03-22 | Honeywell International, Inc. | Digital output MEMS pressure sensor and method |
US8164573B2 (en) | 2003-11-26 | 2012-04-24 | Immersion Corporation | Systems and methods for adaptive interpretation of input from a touch-sensitive input device |
US7224257B2 (en) | 2003-12-25 | 2007-05-29 | Denso Corporation | Physical quantity sensing element having improved structure suitable for electrical connection and method of fabricating same |
US7554167B2 (en) | 2003-12-29 | 2009-06-30 | Vladimir Vaganov | Three-dimensional analog input control device |
US20110298705A1 (en) | 2003-12-29 | 2011-12-08 | Vladimir Vaganov | Three-dimensional input control device |
US8350345B2 (en) | 2003-12-29 | 2013-01-08 | Vladimir Vaganov | Three-dimensional input control device |
US20090237275A1 (en) | 2003-12-29 | 2009-09-24 | Vladimir Vaganov | Three-dimensional analog input control device |
US20050190152A1 (en) | 2003-12-29 | 2005-09-01 | Vladimir Vaganov | Three-dimensional analog input control device |
US8004052B2 (en) | 2003-12-29 | 2011-08-23 | Vladimir Vaganov | Three-dimensional analog input control device |
US7367232B2 (en) | 2004-01-24 | 2008-05-06 | Vladimir Vaganov | System and method for a three-axis MEMS accelerometer |
US8260337B2 (en) | 2004-04-02 | 2012-09-04 | Apple Inc. | System and method for peer-to-peer communication in cellular systems |
US20070156723A1 (en) | 2004-05-07 | 2007-07-05 | Myorigo,S.A.R.L. | Method and arrangement for reinterpreting user input in a mobile device |
US20080094367A1 (en) | 2004-08-02 | 2008-04-24 | Koninklijke Philips Electronics, N.V. | Pressure-Controlled Navigating in a Touch Screen |
US20080105470A1 (en) | 2004-08-02 | 2008-05-08 | Koninklijke Philips Electronics, N.V. | Touch Screen Slider for Setting Floating Point Value |
US20080204427A1 (en) | 2004-08-02 | 2008-08-28 | Koninklijke Philips Electronics, N.V. | Touch Screen with Pressure-Dependent Visual Feedback |
US8188985B2 (en) | 2004-08-06 | 2012-05-29 | Touchtable, Inc. | Method and apparatus continuing action of user gestures performed upon a touch sensitive interactive display in simulation of inertia |
US7449758B2 (en) | 2004-08-17 | 2008-11-11 | California Institute Of Technology | Polymeric piezoresistive sensors |
US20070262965A1 (en) | 2004-09-03 | 2007-11-15 | Takuya Hirai | Input Device |
US7921725B2 (en) | 2004-10-18 | 2011-04-12 | Silverbrook Research Pty Ltd | Pressure sensor with dual chamber cover and corrugated membrane |
US7324095B2 (en) | 2004-11-01 | 2008-01-29 | Hewlett-Packard Development Company, L.P. | Pressure-sensitive input device for data processing systems |
US7746327B2 (en) | 2004-11-08 | 2010-06-29 | Honda Access Corporation | Remote-control switch |
US7273979B2 (en) | 2004-12-15 | 2007-09-25 | Edward Lee Christensen | Wearable sensor matrix system for machine control |
US8212790B2 (en) | 2004-12-21 | 2012-07-03 | Microsoft Corporation | Pressure sensitive controls |
US7476952B2 (en) | 2004-12-28 | 2009-01-13 | Vladimir Vaganov | Semiconductor input control device |
US20070245836A1 (en) | 2004-12-28 | 2007-10-25 | Vladimir Vaganov | Three-dimensional force input control device and fabrication |
US20080088602A1 (en) | 2005-03-04 | 2008-04-17 | Apple Inc. | Multi-functional hand-held device |
US8044929B2 (en) | 2005-03-31 | 2011-10-25 | Stmicroelectronics S.R.L. | Analog data-input device provided with a pressure sensor of a microelectromechanical type |
US20060244733A1 (en) | 2005-04-28 | 2006-11-02 | Geaghan Bernard O | Touch sensitive device and method using pre-touch information |
US20060272413A1 (en) | 2005-06-04 | 2006-12-07 | Vladimir Vaganov | Three-axis integrated mems accelerometer |
US7318349B2 (en) | 2005-06-04 | 2008-01-15 | Vladimir Vaganov | Three-axis integrated MEMS accelerometer |
US8477115B2 (en) | 2005-06-08 | 2013-07-02 | Sony Corporation | Input device, information processing apparatus, information processing method, and program |
US7903090B2 (en) | 2005-06-10 | 2011-03-08 | Qsi Corporation | Force-based input device |
US7337085B2 (en) | 2005-06-10 | 2008-02-26 | Qsi Corporation | Sensor baseline compensation in a force-based touch device |
US7698084B2 (en) | 2005-06-10 | 2010-04-13 | Qsi Corporation | Method for determining when a force sensor signal baseline in a force-based input device can be updated |
US20060284856A1 (en) | 2005-06-10 | 2006-12-21 | Soss David A | Sensor signal conditioning in a force-based touch device |
US20070035525A1 (en) | 2005-08-11 | 2007-02-15 | Via Technologies, Inc. | Integrated touch screen control system for automobiles |
US20070070053A1 (en) | 2005-08-19 | 2007-03-29 | Silverbrook Research Pty Ltd | Force sensor with dilatant fluid stop |
US20070046649A1 (en) | 2005-08-30 | 2007-03-01 | Bruce Reiner | Multi-functional navigational device and method |
US20080238446A1 (en) | 2005-09-08 | 2008-10-02 | Teledyne Licensing, Llc | High temperature microelectromechanical (MEM) devices |
US20070070046A1 (en) | 2005-09-21 | 2007-03-29 | Leonid Sheynblat | Sensor-based touchscreen assembly, handheld portable electronic device having assembly, and method of determining touch location on a display panel |
US8199116B2 (en) | 2005-09-26 | 2012-06-12 | Samsung Electronics Co., Ltd. | Display panel, display device having the same and method of detecting touch position |
US7649522B2 (en) | 2005-10-11 | 2010-01-19 | Fish & Richardson P.C. | Human interface input acceleration system |
US7280097B2 (en) | 2005-10-11 | 2007-10-09 | Zeetoo, Inc. | Human interface input acceleration system |
US20100020039A1 (en) | 2005-10-17 | 2010-01-28 | Industrial Technology Research Institute | Touch input device with display front |
US20070097095A1 (en) | 2005-10-31 | 2007-05-03 | Samsung Electronics Co., Ltd. | Apparatus and method for recognizing and transmitting handwritten data in a mobile communication terminal |
US20070103449A1 (en) | 2005-11-08 | 2007-05-10 | Nokia Corporation | Cost efficient element for combined piezo sensor and actuator in robust and small touch screen realization and method for operation thereof |
US20070139391A1 (en) | 2005-11-18 | 2007-06-21 | Siemens Aktiengesellschaft | Input device |
US20070115265A1 (en) | 2005-11-21 | 2007-05-24 | Nokia Corporation | Mobile device and method |
US20070132717A1 (en) | 2005-12-10 | 2007-06-14 | Hon Hai Precision Industry Co., Ltd. | Input device and method of locking a computer system |
US20070137901A1 (en) | 2005-12-16 | 2007-06-21 | E-Lead Electronic Co., Ltd. | Micro-keyboard simulator |
US20070152959A1 (en) | 2005-12-29 | 2007-07-05 | Sap Ag | Pressure-sensitive button |
CN101341459A (en) | 2006-01-05 | 2009-01-07 | 弗拉多米尔·瓦格诺夫 | Three-dimensional force input control device and fabrication |
US7825911B2 (en) | 2006-03-27 | 2010-11-02 | Sanyo Electric Co., Ltd. | Touch sensor, touch pad and input device |
US20070235231A1 (en) | 2006-03-29 | 2007-10-11 | Tekscan, Inc. | Control circuit for sensor array and related methods |
US8497757B2 (en) | 2006-04-26 | 2013-07-30 | Kulite Semiconductor Products, Inc. | Method and apparatus for preventing catastrophic contact failure in ultra high temperature piezoresistive sensors and transducers |
US8482372B2 (en) | 2006-04-26 | 2013-07-09 | Kulite Semiconductor Products, Inc. | Pressure transducer utilizing non-lead containing frit |
US7426873B1 (en) | 2006-05-04 | 2008-09-23 | Sandia Corporation | Micro electro-mechanical system (MEMS) pressure sensor for footwear |
US20080083962A1 (en) | 2006-05-24 | 2008-04-10 | Vladimir Vaganov | Force input control device and method of fabrication |
US20100323467A1 (en) | 2006-05-24 | 2010-12-23 | Vladimir Vaganov | Force input control device and method of fabrication |
WO2007139695A2 (en) | 2006-05-24 | 2007-12-06 | Vladimir Vaganov | Force input control device and method of fabrication |
US7791151B2 (en) | 2006-05-24 | 2010-09-07 | Vladimir Vaganov | Force input control device and method of fabrication |
US8183077B2 (en) | 2006-05-24 | 2012-05-22 | Vladimir Vaganov | Force input control device and method of fabrication |
US20070277616A1 (en) | 2006-06-05 | 2007-12-06 | Nikkel Eric L | Micro Electrical Mechanical Systems Pressure Sensor |
US7508040B2 (en) | 2006-06-05 | 2009-03-24 | Hewlett-Packard Development Company, L.P. | Micro electrical mechanical systems pressure sensor |
US8237537B2 (en) | 2006-06-15 | 2012-08-07 | Kulite Semiconductor Products, Inc. | Corrosion-resistant high temperature pressure transducer employing a metal diaphragm |
US20100066686A1 (en) | 2006-06-28 | 2010-03-18 | Stantum | Multipoint touch sensor with active matrix |
US20080001923A1 (en) | 2006-06-28 | 2008-01-03 | Microsoft Corporation | Input Simulation System For Touch Based Devices |
US20080007532A1 (en) | 2006-07-05 | 2008-01-10 | E-Lead Electronic Co., Ltd. | Touch-sensitive pad capable of detecting depressing pressure |
US20080010616A1 (en) | 2006-07-06 | 2008-01-10 | Cherif Atia Algreatly | Spherical coordinates cursor, mouse, and method |
US20080030482A1 (en) | 2006-07-31 | 2008-02-07 | Elwell James K | Force-based input device having an elevated contacting surface |
US7952566B2 (en) | 2006-07-31 | 2011-05-31 | Sony Corporation | Apparatus and method for touch screen interaction based on tactile feedback and pressure measurement |
US20080024454A1 (en) | 2006-07-31 | 2008-01-31 | Paul Everest | Three-dimensional touch pad input device |
US8113065B2 (en) | 2006-08-24 | 2012-02-14 | Honda Motor Co., Ltd. | Force sensor |
US8269731B2 (en) | 2006-09-09 | 2012-09-18 | F-Origin, Inc. | Integrated pressure sensitive lens assembly |
US8096188B2 (en) | 2006-10-05 | 2012-01-17 | Meggitt (San Juan Capistrano), Inc. | Highly sensitive piezoresistive element |
US20080088600A1 (en) | 2006-10-11 | 2008-04-17 | Apple Inc. | Method and apparatus for implementing multiple push buttons in a user input device |
US20080284742A1 (en) | 2006-10-11 | 2008-11-20 | Prest Christopher D | Method and apparatus for implementing multiple push buttons in a user input device |
US20080106523A1 (en) | 2006-11-07 | 2008-05-08 | Conrad Richard H | Ergonomic lift-clicking method and apparatus for actuating home switches on computer input devices |
US20080105057A1 (en) | 2006-11-08 | 2008-05-08 | Honeywell International Inc. | Dual span absolute pressure sense die |
US8493189B2 (en) | 2006-12-25 | 2013-07-23 | Fukoku Co., Ltd. | Haptic feedback controller |
US20080211766A1 (en) | 2007-01-07 | 2008-09-04 | Apple Inc. | Multitouch data fusion |
US20080174852A1 (en) | 2007-01-22 | 2008-07-24 | Seiko Epson Corporation | Display device, method for manufacturing display device, and electronic paper |
US20080180402A1 (en) | 2007-01-25 | 2008-07-31 | Samsung Electronics Co., Ltd. | Apparatus and method for improvement of usability of touch screen |
US20080202249A1 (en) | 2007-01-30 | 2008-08-28 | Denso Corporation | Semiconductor sensor and method of manufacturing the same |
US20080180405A1 (en) | 2007-01-31 | 2008-07-31 | Han Jefferson Y | Methods of interfacing with multi-point input devices and multi-point input systems employing interfacing techniques |
US20080180406A1 (en) | 2007-01-31 | 2008-07-31 | Han Jefferson Y | Methods of interfacing with multi-point input devices and multi-point input systems employing interfacing techniques |
US20100013785A1 (en) | 2007-03-01 | 2010-01-21 | Atsuhito Murai | Display panel substrate, display panel, display appratus, and method for manufacturing display panel substrate |
US8134535B2 (en) | 2007-03-02 | 2012-03-13 | Samsung Electronics Co., Ltd. | Display device including integrated touch sensors |
US20100066697A1 (en) | 2007-03-14 | 2010-03-18 | Axsionics Ag | Pressure measurement device and corresponding method |
US20080238884A1 (en) | 2007-03-29 | 2008-10-02 | Divyasimha Harish | Edge sensors forming a touchscreen |
US20080259046A1 (en) | 2007-04-05 | 2008-10-23 | Joseph Carsanaro | Pressure sensitive touch pad with virtual programmable buttons for launching utility applications |
US7973778B2 (en) | 2007-04-16 | 2011-07-05 | Microsoft Corporation | Visual simulation of touch pressure |
US8120586B2 (en) | 2007-05-15 | 2012-02-21 | Htc Corporation | Electronic devices with touch-sensitive navigational mechanisms, and associated methods |
US20080303799A1 (en) | 2007-06-07 | 2008-12-11 | Carsten Schwesig | Information Processing Apparatus, Information Processing Method, and Computer Program |
US8149211B2 (en) | 2007-06-13 | 2012-04-03 | Tokai Rubber Industries, Ltd. | Deformable sensor system |
US8253699B2 (en) | 2007-06-28 | 2012-08-28 | Samsung Electronics Co., Ltd. | Display apparatus, method of driving the same, and sensing driver of display apparatus |
CN101801837A (en) | 2007-07-06 | 2010-08-11 | 因文森斯公司 | Integrated motion processing unit (MPU) with MEMS inertia sensing and embedded digital electronic component |
US8250921B2 (en) | 2007-07-06 | 2012-08-28 | Invensense, Inc. | Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics |
US20090027352A1 (en) | 2007-07-12 | 2009-01-29 | Stmicroelectronics Sa | Microelectronic pressure sensor |
US20090027353A1 (en) | 2007-07-27 | 2009-01-29 | June-Hyeok Im | Pressure sensor array apparatus and method for tactile sensing |
US20090046110A1 (en) | 2007-08-16 | 2009-02-19 | Motorola, Inc. | Method and apparatus for manipulating a displayed image |
US8378991B2 (en) | 2007-08-21 | 2013-02-19 | Samsung Display Co., Ltd. | Method of detecting a touch position and touch panel for performing the same |
US8026906B2 (en) | 2007-09-07 | 2011-09-27 | F-Origin, Inc. | Integrated force sensitive lens and software |
US8451245B2 (en) | 2007-09-28 | 2013-05-28 | Immersion Corporation | Multi-touch device having dynamic haptic effects |
US20120081327A1 (en) | 2007-09-28 | 2012-04-05 | Immersion Corporation | Multi-touch device having dynamic haptic effects |
US8139038B2 (en) | 2007-09-29 | 2012-03-20 | Htc Corporation | Method for determining pressed location of touch screen |
US20090102805A1 (en) | 2007-10-18 | 2009-04-23 | Microsoft Corporation | Three-dimensional object simulation using audio, visual, and tactile feedback |
US20100315373A1 (en) | 2007-10-26 | 2010-12-16 | Andreas Steinhauser | Single or multitouch-capable touchscreens or touchpads comprising an array of pressure sensors and the production of such sensors |
US20110018820A1 (en) | 2007-11-23 | 2011-01-27 | Polymer Vision Limited | Electronic apparatus with improved functionality |
US20090140985A1 (en) | 2007-11-30 | 2009-06-04 | Eric Liu | Computing device that determines and uses applied pressure from user interaction with an input interface |
US7829960B2 (en) | 2007-12-10 | 2010-11-09 | Seiko Epson Corporation | Semiconductor pressure sensor, method for producing the same, semiconductor device, and electronic apparatus |
CN101458134A (en) | 2007-12-10 | 2009-06-17 | 精工爱普生株式会社 | Semiconductor pressure sensor, method for producing the same, semiconductor device, and electronic apparatus |
US20090184921A1 (en) | 2008-01-18 | 2009-07-23 | Microsoft Corporation | Input Through Sensing of User-Applied Forces |
US8004501B2 (en) | 2008-01-21 | 2011-08-23 | Sony Computer Entertainment America Llc | Hand-held device with touchscreen and digital tactile pixels |
US20090184936A1 (en) | 2008-01-22 | 2009-07-23 | Mathematical Inventing - Slicon Valley | 3D touchpad |
US20100127140A1 (en) | 2008-01-23 | 2010-05-27 | Gary Smith | Suspension for a pressure sensitive touch display or panel |
US20110006980A1 (en) | 2008-01-31 | 2011-01-13 | Appside Co., Ltd. | Data input device, data input method, data input program, and recording medium containing the program |
US20090213066A1 (en) | 2008-02-21 | 2009-08-27 | Sony Corporation | One button remote control with haptic feedback |
US20090256817A1 (en) | 2008-02-28 | 2009-10-15 | New York University | Method and apparatus for providing input to a processor, and a sensor pad |
US20110227836A1 (en) | 2008-03-20 | 2011-09-22 | Motorola, Inc. | Transparent force sensor and method of fabrication |
US20090237374A1 (en) | 2008-03-20 | 2009-09-24 | Motorola, Inc. | Transparent pressure sensor and method for using |
US20110032211A1 (en) | 2008-03-27 | 2011-02-10 | Bbs Denmark A/S | secure keypad system |
US20090243998A1 (en) | 2008-03-28 | 2009-10-01 | Nokia Corporation | Apparatus, method and computer program product for providing an input gesture indicator |
US20090243817A1 (en) | 2008-03-30 | 2009-10-01 | Pressure Profile Systems Corporation | Tactile Device with Force Sensitive Touch Input Surface |
US20090242282A1 (en) | 2008-04-01 | 2009-10-01 | Korea Research Institute Of Standards And Science | Apparatus and Method for Providing Interface Depending on Action Force, and Recording Medium Thereof |
US20110012848A1 (en) | 2008-04-03 | 2011-01-20 | Dong Li | Methods and apparatus for operating a multi-object touch handheld device with touch sensitive display |
US20090256807A1 (en) | 2008-04-14 | 2009-10-15 | Nokia Corporation | User interface |
US8384677B2 (en) | 2008-04-25 | 2013-02-26 | Research In Motion Limited | Electronic device including touch-sensitive input surface and method of determining user-selected input |
US20130140944A1 (en) | 2008-04-29 | 2013-06-06 | Sand 9, Inc. | Microelectromechanical systems (mems) resonators and related apparatus and methods |
US20090282930A1 (en) | 2008-05-19 | 2009-11-19 | Ching-Hsiang Cheng | Flexible piezoresistive interfacial shear and normal force sensor and sensor array |
US20090303400A1 (en) | 2008-06-10 | 2009-12-10 | Industrial Technology Research Institute | Functional device array with self-aligned electrode structures and fabrication methods thereof |
US20090309852A1 (en) | 2008-06-13 | 2009-12-17 | Asustek Computer Inc. | Touch panel input device and control method thereof |
US8130207B2 (en) | 2008-06-18 | 2012-03-06 | Nokia Corporation | Apparatus, method and computer program product for manipulating a device using dual side input devices |
US20090314551A1 (en) | 2008-06-24 | 2009-12-24 | Fujitsu Component Limited | Touch panel |
US8184093B2 (en) | 2008-06-27 | 2012-05-22 | Kyocera Corporation | Mobile terminal device |
US20100020030A1 (en) | 2008-07-22 | 2010-01-28 | Samsung Electronics Co., Ltd | Method of managing content and electronic apparatus using the same |
US8456440B2 (en) | 2008-07-30 | 2013-06-04 | Canon Kabushiki Kaisha | Information processing method and apparatus |
US8243035B2 (en) | 2008-07-30 | 2012-08-14 | Canon Kabushiki Kaisha | Information processing method and apparatus |
US20100102403A1 (en) | 2008-08-14 | 2010-04-29 | Board Of Regents, The University Of Texas System | Method and apparatus for fabricating piezoresistive polysilicon by low-temperature metal induced crystallization |
US20100039396A1 (en) | 2008-08-15 | 2010-02-18 | Chen-Hsiang Ho | Touch sensing apparatus and sensing signal processing method thereof |
US8154528B2 (en) | 2008-08-21 | 2012-04-10 | Au Optronics Corp. | Matrix sensing apparatus |
US20100053087A1 (en) | 2008-08-26 | 2010-03-04 | Motorola, Inc. | Touch sensors with tactile feedback |
US20100053116A1 (en) | 2008-08-26 | 2010-03-04 | Dodge Daverman | Multi-touch force sensing touch-screen devices and methods |
US20100079398A1 (en) | 2008-09-26 | 2010-04-01 | Innolux Display Corp. | Liquid crystal display panel with touch panel function |
US20100079395A1 (en) | 2008-09-26 | 2010-04-01 | Lg Electronics Inc. | Mobile terminal and control method thereof |
US20100079391A1 (en) | 2008-09-30 | 2010-04-01 | Samsung Electro-Mechanics Co., Ltd. | Touch panel apparatus using tactile sensor |
US20100097347A1 (en) | 2008-10-21 | 2010-04-22 | Tzu-Chih Lin | Pressure Detection Module, and Touch Panel with Pressure Detection Module |
US20100117978A1 (en) | 2008-11-10 | 2010-05-13 | Shirado Hirokazu | Apparatus and method for touching behavior recognition, information processing apparatus, and computer program |
US8159473B2 (en) | 2008-11-13 | 2012-04-17 | Orise Technology Co., Ltd. | Method for detecting touch point and touch panel using the same |
US20100123671A1 (en) | 2008-11-18 | 2010-05-20 | Chi Mei Communication Systems, Inc. | Touch panel and method for making the same |
US20100123686A1 (en) | 2008-11-19 | 2010-05-20 | Sony Ericsson Mobile Communications Ab | Piezoresistive force sensor integrated in a display |
US20100128002A1 (en) | 2008-11-26 | 2010-05-27 | William Stacy | Touch-sensitive display method and apparatus |
JP2010147268A (en) | 2008-12-19 | 2010-07-01 | Yamaha Corp | Mems sensor, and method of manufacturing mems sensor |
US8427441B2 (en) | 2008-12-23 | 2013-04-23 | Research In Motion Limited | Portable electronic device and method of control |
US8319739B2 (en) | 2008-12-23 | 2012-11-27 | Integrated Digital Technologies, Inc. | Force-sensing modules for light sensitive screens |
US8405632B2 (en) | 2008-12-23 | 2013-03-26 | Integrated Digital Technologies, Inc. | Force-sensing modules for light sensitive screens |
US8405631B2 (en) | 2008-12-23 | 2013-03-26 | Integrated Digital Technologies, Inc. | Force-sensing modules for light sensitive screens |
US20120146946A1 (en) | 2008-12-24 | 2012-06-14 | E Ink Holdings Inc. | Display device with touch panel and fabricating method thereof |
US8144133B2 (en) | 2008-12-24 | 2012-03-27 | E Ink Holdings Inc. | Display device with touch panel and fabricating method thereof |
US20100164959A1 (en) | 2008-12-26 | 2010-07-01 | Brown Craig T | Rendering a virtual input device upon detection of a finger movement across a touch-sensitive display |
US8289288B2 (en) | 2009-01-15 | 2012-10-16 | Microsoft Corporation | Virtual object adjustment via physical object detection |
US20120256237A1 (en) | 2009-01-27 | 2012-10-11 | State University | Embedded mems sensors and related methods |
US8363022B2 (en) | 2009-02-06 | 2013-01-29 | Lg Electronics Inc. | Mobile terminal and operating method of the mobile terminal |
US20100220065A1 (en) | 2009-02-27 | 2010-09-02 | Research In Motion Limited | Touch-sensitive display including a force-sensor and portable electronic device including same |
US20120032907A1 (en) | 2009-04-22 | 2012-02-09 | Yoshiaki Koizumi | Position input apparatus |
US20120038579A1 (en) | 2009-04-24 | 2012-02-16 | Kyocera Corporation | Input appratus |
US20100271325A1 (en) | 2009-04-27 | 2010-10-28 | Thomas Martin Conte | Direction and force sensing input device |
US20100289807A1 (en) | 2009-05-18 | 2010-11-18 | Nokia Corporation | Method, apparatus and computer program product for creating graphical objects with desired physical features for usage in animation |
US20100295807A1 (en) | 2009-05-19 | 2010-11-25 | Beijing Boe Optoelectronics Technology Co., Ltd. | Touch screen, color filter substrate and manufacturing methods thereof |
US20120068969A1 (en) | 2009-05-29 | 2012-03-22 | Matteo Paolo Bogana | Method for determining multiple touch inputs on a resistive touch screen and a multiple touch controller |
US20100308844A1 (en) | 2009-06-03 | 2010-12-09 | Synaptics Incorporated | Input device and method with pressure-sensitive layer |
US20100309714A1 (en) | 2009-06-08 | 2010-12-09 | Micron Technology, Inc. | Methods, structures, and devices for reducing operational energy in phase change memory |
US20120092250A1 (en) | 2009-06-14 | 2012-04-19 | Micropointing Ltd. | Finger-operated input device |
US20100321319A1 (en) | 2009-06-17 | 2010-12-23 | Hefti Thierry | Method for displaying and updating a view of a graphical scene in response to commands via a touch-sensitive device |
US20100321310A1 (en) | 2009-06-23 | 2010-12-23 | Korea Research Institute Of Standards And Science | Brightness controllable electroluminescence device with tactile sensor sensing intensity of force or intensity of pressure, flat panel display having the same, mobile terminal keypad having the same and method of operating the same |
US20100328229A1 (en) | 2009-06-30 | 2010-12-30 | Research In Motion Limited | Method and apparatus for providing tactile feedback |
US20100328230A1 (en) | 2009-06-30 | 2010-12-30 | Research In Motion Limited | Portable electronic device including tactile touch-sensitive input device and method of protecting same |
US20110001723A1 (en) | 2009-07-01 | 2011-01-06 | Hsiang-Pin Fan | Touch panel and sensing method thereof |
US20110007008A1 (en) | 2009-07-13 | 2011-01-13 | Cherif Atia Algreatly | Virtual touch screen system |
US8120588B2 (en) | 2009-07-15 | 2012-02-21 | Sony Ericsson Mobile Communications Ab | Sensor assembly and display including a sensor assembly |
US8289290B2 (en) | 2009-07-20 | 2012-10-16 | Sony Ericsson Mobile Communications Ab | Touch sensing apparatus for a mobile device, mobile device and method for touch operation sensing |
US8378798B2 (en) | 2009-07-24 | 2013-02-19 | Research In Motion Limited | Method and apparatus for a touch-sensitive display |
US20120127107A1 (en) | 2009-07-28 | 2012-05-24 | Ken Miyashita | Display control device, display control method, and computer program |
US20110039602A1 (en) | 2009-08-13 | 2011-02-17 | Mcnamara Justin | Methods And Systems For Interacting With Content On A Mobile Device |
US8072437B2 (en) | 2009-08-26 | 2011-12-06 | Global Oled Technology Llc | Flexible multitouch electroluminescent display |
US20120154317A1 (en) | 2009-08-27 | 2012-06-21 | Kyocera Corporation | Input apparatus and control method for input apparatus |
US20120194460A1 (en) | 2009-08-27 | 2012-08-02 | Kyocera Corporation | Tactile sensation providing apparatus and control method for tactile sensation providing apparatus |
US20120154329A1 (en) | 2009-08-27 | 2012-06-21 | Kyocera Corporation | Input apparatus |
US20120154330A1 (en) | 2009-08-27 | 2012-06-21 | Kyocera Corporation | Input apparatus and control method for input apparatus |
US20120154328A1 (en) | 2009-08-27 | 2012-06-21 | Kyocera Corporation | Input apparatus |
US20120113061A1 (en) | 2009-08-27 | 2012-05-10 | Tetsuo Ikeda | Information processing apparatus, information processing method, and program |
US20120154315A1 (en) | 2009-08-27 | 2012-06-21 | Kyocera Corporation | Input apparatus |
US20120154318A1 (en) | 2009-08-27 | 2012-06-21 | Kyocera Corporation | Input apparatus |
US8363020B2 (en) | 2009-08-27 | 2013-01-29 | Symbol Technologies, Inc. | Methods and apparatus for pressure-based manipulation of content on a touch screen |
US20120154316A1 (en) | 2009-08-27 | 2012-06-21 | Kyocera Corporation | Input apparatus |
US20110050630A1 (en) | 2009-08-28 | 2011-03-03 | Tetsuo Ikeda | Information Processing Apparatus, Information Processing Method, and Program |
US20120146945A1 (en) | 2009-08-31 | 2012-06-14 | Miyazawa Yusuke | Information processing apparatus, information processing method, and program |
US20120147052A1 (en) | 2009-09-02 | 2012-06-14 | Fuminori Homma | Operation control device, operation control method and computer program |
US20110050628A1 (en) | 2009-09-02 | 2011-03-03 | Fuminori Homma | Operation control device, operation control method and computer program |
US20110057899A1 (en) | 2009-09-04 | 2011-03-10 | Peter Sleeman | Capacitive control panel |
US20110063248A1 (en) | 2009-09-14 | 2011-03-17 | Samsung Electronics Co. Ltd. | Pressure-sensitive degree control method and system for touchscreen-enabled mobile terminal |
US8436806B2 (en) | 2009-10-02 | 2013-05-07 | Research In Motion Limited | Method of synchronizing data acquisition and a portable electronic device configured to perform the same |
US9709509B1 (en) | 2009-11-13 | 2017-07-18 | MCube Inc. | System configured for integrated communication, MEMS, Processor, and applications using a foundry compatible semiconductor process |
US20110113881A1 (en) | 2009-11-17 | 2011-05-19 | Oki Semiconductor Co., Ltd. | Acceleration sensor and method of fabricating acceleration sensor |
WO2011065250A1 (en) | 2009-11-25 | 2011-06-03 | アルプス電気株式会社 | Force sensor |
US8387464B2 (en) | 2009-11-30 | 2013-03-05 | Freescale Semiconductor, Inc. | Laterally integrated MEMS sensor device with multi-stimulus sensing |
CN101929898A (en) | 2009-12-01 | 2010-12-29 | 苏州扩达微电子有限公司 | Pressure sensing device |
US20110128250A1 (en) | 2009-12-02 | 2011-06-02 | Murphy Mark J | Method and device for detecting user input |
US20110141052A1 (en) | 2009-12-10 | 2011-06-16 | Jeffrey Traer Bernstein | Touch pad with force sensors and actuator feedback |
US20110141053A1 (en) | 2009-12-14 | 2011-06-16 | Synaptics Incorporated | System and method for measuring individual force in multi-object sensing |
US20120234112A1 (en) | 2009-12-25 | 2012-09-20 | Alps Electric Co., Ltd. | Force sensor and method of manufacturing the same |
US8516906B2 (en) | 2009-12-25 | 2013-08-27 | Alps Electric Co., Ltd. | Force sensor and method of manufacturing the same |
US20120062603A1 (en) | 2010-01-12 | 2012-03-15 | Hiroyuki Mizunuma | Information Processing Apparatus, Information Processing Method, and Program Therefor |
US20110187674A1 (en) | 2010-02-03 | 2011-08-04 | Interlink Electronics, Inc. | Sensor system |
US20110209555A1 (en) | 2010-03-01 | 2011-09-01 | Marcus Ahles | Micromechanical pressure-sensor element and method for its production |
DE102010012441A1 (en) | 2010-03-23 | 2011-09-29 | Bundesrepublik Deutschland, vertreten durch den Bundesminister für Wirtschaft, dieser vertreten durch den Präsidenten der Physikalisch-Technischen Bundesanstalt | Milli-Newton micro force measuring device for measuring forces in micro-electro-mechanical system, has micro sensor whose end is fastened to retaining unit and another end is designed as free end that moves relative to retaining unit |
US20130008263A1 (en) | 2010-03-30 | 2013-01-10 | Kikuchi Seisakusho Co., Ltd. | Flowrate sensor and flowrate detection device |
US20110242014A1 (en) | 2010-04-02 | 2011-10-06 | E Ink Holdings Inc. | Display panel |
CN201653605U (en) | 2010-04-09 | 2010-11-24 | 无锡芯感智半导体有限公司 | Silicon-bonding based pressure sensor |
US20110267294A1 (en) | 2010-04-29 | 2011-11-03 | Nokia Corporation | Apparatus and method for providing tactile feedback for user |
US20110267181A1 (en) | 2010-04-29 | 2011-11-03 | Nokia Corporation | Apparatus and method for providing tactile feedback for user |
US20110273396A1 (en) | 2010-05-06 | 2011-11-10 | Samsung Electro-Mechanics Co., Ltd. | Touch screen device |
US8466889B2 (en) | 2010-05-14 | 2013-06-18 | Research In Motion Limited | Method of providing tactile feedback and electronic device |
US20120092299A1 (en) | 2010-05-20 | 2012-04-19 | Kumi Harada | Operating apparatus, operating method, program, recording medium, and integrated circuit |
US20120327025A1 (en) | 2010-05-24 | 2012-12-27 | Synaptics Incorporated | Touchpad with Capacitive Force Sensing |
US20110291951A1 (en) | 2010-05-28 | 2011-12-01 | Research In Motion Limited | Electronic device including touch-sensitive display and method of controlling same |
US20110308324A1 (en) | 2010-06-18 | 2011-12-22 | Sisira Kankanam Gamage | A sensor and method for fabricating the same |
US20120032915A1 (en) | 2010-08-05 | 2012-02-09 | GM Global Technology Operations LLC | Operating element for actuation by a user and operating element module |
US8421609B2 (en) | 2010-08-13 | 2013-04-16 | Samsung Electro-Mechanics Co., Ltd. | Haptic feedback device and electronic device having the same |
US20120044169A1 (en) | 2010-08-19 | 2012-02-23 | Ricoh Company, Limited | Operation display device and operation display method |
US20120044172A1 (en) | 2010-08-20 | 2012-02-23 | Sony Corporation | Information processing apparatus, program, and operation control method |
US20120050208A1 (en) | 2010-08-30 | 2012-03-01 | Microsoft Corporation | Resistive matrix with optimized input scanning |
US20120218212A1 (en) | 2010-08-31 | 2012-08-30 | International Business Machines Corporation | Computer device with touch screen and method for operating the same |
US20120050159A1 (en) | 2010-08-31 | 2012-03-01 | International Business Machines Corporation | Computer device with touch screen and method for operating the same |
US20120056837A1 (en) | 2010-09-08 | 2012-03-08 | Samsung Electronics Co., Ltd. | Motion control touch screen method and apparatus |
US20120060605A1 (en) | 2010-09-09 | 2012-03-15 | Ming-Ching Wu | Mems sensor capable of sensing acceleration and pressure |
US20120061823A1 (en) | 2010-09-10 | 2012-03-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device having pad structure with stress buffer layer |
US20120068946A1 (en) | 2010-09-16 | 2012-03-22 | Sheng-Kai Tang | Touch display device and control method thereof |
US20120086659A1 (en) | 2010-10-12 | 2012-04-12 | New York University & Tactonic Technologies, LLC | Method and apparatus for sensing utilizing tiles |
US20120092294A1 (en) | 2010-10-18 | 2012-04-19 | Qualcomm Mems Technologies, Inc. | Combination touch, handwriting and fingerprint sensor |
US20120092279A1 (en) | 2010-10-18 | 2012-04-19 | Qualcomm Mems Technologies, Inc. | Touch sensor with force-actuated switched capacitor |
US20120092324A1 (en) | 2010-10-18 | 2012-04-19 | Qualcomm Mems Technologies, Inc. | Touch, handwriting and fingerprint sensor with elastomeric spacer layer |
US20120105367A1 (en) | 2010-11-01 | 2012-05-03 | Impress Inc. | Methods of using tactile force sensing for intuitive user interface |
US20120105358A1 (en) | 2010-11-03 | 2012-05-03 | Qualcomm Incorporated | Force sensing touch screen |
CN102062662A (en) | 2010-11-05 | 2011-05-18 | 北京大学 | Monolithic integrated SiC MEMS (Micro-Electro-Mechanical Systems) pressure sensor and production method thereof |
US20120127088A1 (en) | 2010-11-19 | 2012-05-24 | Apple Inc. | Haptic input device |
US20120139864A1 (en) | 2010-12-02 | 2012-06-07 | Atmel Corporation | Position-sensing and force detection panel |
US20120144921A1 (en) | 2010-12-10 | 2012-06-14 | Honeywell International Inc. | Increased sensor die adhesion |
US20120162122A1 (en) | 2010-12-27 | 2012-06-28 | 3M Innovative Properties Company | Force sensitive device with force sensitive resistors |
US20120169609A1 (en) | 2010-12-29 | 2012-07-05 | Nokia Corporation | Methods and apparatuses for facilitating content navigation |
US20120169635A1 (en) | 2010-12-31 | 2012-07-05 | Liu Hung-Ta | Touchable sensing matrix unit, a co-constructed active array substrate having the touchable sensing matrix unit and a display having the co-constructed active array substrate |
US20120169636A1 (en) | 2010-12-31 | 2012-07-05 | Liu Hung-Ta | Touchable sensing matrix unit, a co-constructed active array substrate having the touchable sensing matrix unit and a display having the co-constructed active array substrate |
US20120169617A1 (en) | 2011-01-04 | 2012-07-05 | Nokia Corporation | Controlling of user input device |
US8297127B2 (en) | 2011-01-07 | 2012-10-30 | Honeywell International Inc. | Pressure sensor with low cost packaging |
US20120188181A1 (en) | 2011-01-25 | 2012-07-26 | Samsung Electromechanics Co., Ltd. | Touch screen apparatus detecting touch pressure and electronic apparatus having the same |
US20120194466A1 (en) | 2011-01-31 | 2012-08-02 | National Semiconductor Corporation | Haptic interface for touch screen in mobile device or other device |
US20130239700A1 (en) | 2011-02-07 | 2013-09-19 | The Governors Of The University Of Alberta | Piezoresistive load sensor |
US20120200526A1 (en) | 2011-02-09 | 2012-08-09 | Mark Lackey | Snap domes as sensor protection |
US20120205165A1 (en) | 2011-02-11 | 2012-08-16 | Research In Motion Limited | Input detecting apparatus, and associated method, for electronic device |
US20120204653A1 (en) | 2011-02-16 | 2012-08-16 | Silicon Microstructures, Inc. | Compensation of stress effects on pressure sensor components |
US20120286379A1 (en) | 2011-05-09 | 2012-11-15 | Mitsubishi Electric Corporation | Sensor element |
US20120319987A1 (en) | 2011-06-15 | 2012-12-20 | Synaptics Incorporated | System and method for calibrating an input device |
US20130038541A1 (en) | 2011-08-12 | 2013-02-14 | Research In Motion | Portable Electronic Device and Method of Controlling Same |
US20130093685A1 (en) | 2011-10-14 | 2013-04-18 | Research In Motion Limited | System and Method for Controlling an Electronic Device Having a Touch-Sensitive Non-Display Area |
US20130096849A1 (en) | 2011-10-14 | 2013-04-18 | Nextinput Inc. | Force Sensitive Interface Device and Methods of Using Same |
WO2013067548A1 (en) | 2011-11-06 | 2013-05-10 | Khandani Mehdi Kalantari | System and method for strain and acoustic emission monitoring |
US9097600B2 (en) | 2011-11-06 | 2015-08-04 | Mehdi Kalantari Khandani | System and method for strain and acoustic emission monitoring |
US8436827B1 (en) | 2011-11-29 | 2013-05-07 | Google Inc. | Disambiguating touch-input based on variation in characteristic such as speed or pressure along a touch-trail |
US8931347B2 (en) | 2011-12-09 | 2015-01-13 | Openfield Sas | Fluid pressure sensor and measurement probe |
US20130187201A1 (en) | 2012-01-25 | 2013-07-25 | Infineon Technologies Ag | Sensor Device and Method |
US20140367811A1 (en) | 2012-02-15 | 2014-12-18 | Omron Corporation | Capacitance type sensor and method of manufacturing the same |
US9772245B2 (en) | 2012-03-08 | 2017-09-26 | Ams International Ag | MEMS capacitive pressure sensor |
CN103308239A (en) | 2012-03-08 | 2013-09-18 | Nxp股份有限公司 | Mems capacitive pressure sensor |
US20130255393A1 (en) | 2012-03-29 | 2013-10-03 | Hideaki Fukuzawa | Pressure sensor and microphone |
US8973446B2 (en) | 2012-03-29 | 2015-03-10 | Kabushiki Kaisha Toshiba | Pressure sensor and microphone |
US20130341742A1 (en) | 2012-06-21 | 2013-12-26 | Nextinput, Inc. | Wafer level mems force dies |
US20130341741A1 (en) | 2012-06-21 | 2013-12-26 | Nextlnput, Inc. | Ruggedized mems force die |
US9493342B2 (en) | 2012-06-21 | 2016-11-15 | Nextinput, Inc. | Wafer level MEMS force dies |
US9487388B2 (en) | 2012-06-21 | 2016-11-08 | Nextinput, Inc. | Ruggedized MEMS force die |
US20140007705A1 (en) | 2012-07-05 | 2014-01-09 | Nextinput, Inc. | Microelectromechanical load sensor and methods of manufacturing the same |
US9032818B2 (en) | 2012-07-05 | 2015-05-19 | Nextinput, Inc. | Microelectromechanical load sensor and methods of manufacturing the same |
US20140028575A1 (en) | 2012-07-26 | 2014-01-30 | Apple Inc. | Gesture and Touch Input Detection Through Force Sensing |
US20140055407A1 (en) | 2012-08-24 | 2014-02-27 | Samsung Display Co., Ltd. | Touch display apparatus sensing touch force |
CN102853950A (en) | 2012-09-10 | 2013-01-02 | 厦门海合达汽车电器有限公司 | Piezoresistive pressure sensor chip adopting face down bonding and preparing method thereof |
CN102998037A (en) | 2012-09-15 | 2013-03-27 | 华东光电集成器件研究所 | Dielectric isolation piezoresistive pressure sensor and method for manufacturing same |
US8984951B2 (en) | 2012-09-18 | 2015-03-24 | Kulite Semiconductor Products, Inc. | Self-heated pressure sensor assemblies |
US20140090488A1 (en) | 2012-09-29 | 2014-04-03 | Stryker Corporation | Flexible Piezocapacitive And Piezoresistive Force And Pressure Sensors |
US20140283604A1 (en) | 2012-10-26 | 2014-09-25 | The Regents Of The University Of Michigan | Three-dimensional microelectromechanical systems structure |
US20150241465A1 (en) | 2012-12-06 | 2015-08-27 | Murata Manufacturing Co., Ltd. | Piezoresistive mems sensor |
CN104919293A (en) | 2012-12-06 | 2015-09-16 | 株式会社村田制作所 | Piezoresistive mems sensor |
US20160069927A1 (en) | 2013-06-04 | 2016-03-10 | Murata Manufacturing Co., Ltd. | Acceleration sensor |
US20150110295A1 (en) | 2013-10-22 | 2015-04-23 | Infineon Technologies Ag | System and Method for Automatic Calibration of a Transducer |
CN104581605A (en) | 2013-10-22 | 2015-04-29 | 英飞凌科技股份有限公司 | System and Method for Automatic Calibration of Transducer |
US20160320426A1 (en) * | 2014-01-09 | 2016-11-03 | Motion Engine, Inc. | Integrated mems system |
US20160332866A1 (en) | 2014-01-13 | 2016-11-17 | Nextinput, Inc. | Miniaturized and ruggedized wafer level mems force sensors |
CN105934661A (en) | 2014-01-13 | 2016-09-07 | 触控解决方案股份有限公司 | Miniaturized and ruggedized wafer level MEMS force sensors |
WO2015106246A1 (en) | 2014-01-13 | 2015-07-16 | Nextinput, Inc. | Miniaturized and ruggedized wafer level mems force sensors |
US20170103246A1 (en) * | 2014-10-06 | 2017-04-13 | Shenzhen Huiding Technology Co., Ltd. | Self-capacitive fingerprint sensor with active amplified pixels |
CN104535229A (en) | 2014-12-04 | 2015-04-22 | 广东省自动化研究所 | Pressure detection device and method based on piezoresistive and piezoelectric flexible sensor combination |
US20160245667A1 (en) | 2015-02-24 | 2016-08-25 | The Regents Of The University Of Michigan | Actuation And Sensing Platform For Sensor Calibration And Vibration Isolation |
US20160258825A1 (en) * | 2015-03-02 | 2016-09-08 | Invensense, Inc. | Mems sensor offset compensation with strain gauge |
US20160363490A1 (en) | 2015-06-10 | 2016-12-15 | Nextinput, Inc. | Ruggedized wafer level mems force sensor with a tolerance trench |
US20170066014A1 (en) * | 2015-09-03 | 2017-03-09 | Qualcomm Incorporated | Release hole plus contact via for fine pitch ultrasound transducer integration |
US20170234744A1 (en) | 2016-02-16 | 2017-08-17 | GlobalMEMS Co., Ltd. | Mems force sensor and force sensing apparatus |
US20190383675A1 (en) | 2017-02-09 | 2019-12-19 | Nextinput, Inc. | Integrated piezoresistive and piezoelectric fusion force sensor |
US20190383676A1 (en) | 2017-02-09 | 2019-12-19 | Nextinput, Inc. | Integrated digital force sensors and related methods of manufacture |
US20180238753A1 (en) * | 2017-02-21 | 2018-08-23 | Stmicroelectronics S.R.L. | Microelectromechanical scalable bulk-type piezoresistive force/pressure sensor |
US20200149983A1 (en) | 2017-07-19 | 2020-05-14 | Nextinput, Inc. | Strain transfer stacking in a mems force sensor |
WO2019023552A1 (en) | 2017-07-27 | 2019-01-31 | Nextinput, Inc. | A wafer bonded piezoresistive and piezoelectric force sensor and related methods of manufacture |
US10962427B2 (en) | 2019-01-10 | 2021-03-30 | Nextinput, Inc. | Slotted MEMS force sensor |
Non-Patent Citations (3)
Title |
---|
International Search Report and Written Opinion issued in PCT/US2018/043616, dated Oct. 15, 2018. |
Mei, T., et al., "Design and Fabrication of an Integrated Three-Dimensional Tactile Sensor for Space Robotic Applications," Micro Electro Mechanical Systems, MEMS '99, Twelfth IEEE International Conference, Orlando Florida, Jan. 21, 1999, pp. 112-117. |
Nesterov, V., et al., "Modelling and investigation of the silicon twin design 3D micro probe," Journal of Micromechanics and Microengineering, vol. 15, 2005, pp. 514-520. |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220299391A1 (en) * | 2021-03-16 | 2022-09-22 | Minebea Mitsumi Inc. | Sensor chip and force sensor apparatus |
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