US11058337B2 - Flexible silicon nanowire electrode - Google Patents
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- US11058337B2 US11058337B2 US15/424,265 US201715424265A US11058337B2 US 11058337 B2 US11058337 B2 US 11058337B2 US 201715424265 A US201715424265 A US 201715424265A US 11058337 B2 US11058337 B2 US 11058337B2
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
- A61B5/25—Bioelectric electrodes therefor
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
- A61B5/6846—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be brought in contact with an internal body part, i.e. invasive
- A61B5/6847—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be brought in contact with an internal body part, i.e. invasive mounted on an invasive device
- A61B5/685—Microneedles
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
- A61B5/25—Bioelectric electrodes therefor
- A61B5/279—Bioelectric electrodes therefor specially adapted for particular uses
- A61B5/291—Bioelectric electrodes therefor specially adapted for particular uses for electroencephalography [EEG]
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
- A61B5/25—Bioelectric electrodes therefor
- A61B5/279—Bioelectric electrodes therefor specially adapted for particular uses
- A61B5/296—Bioelectric electrodes therefor specially adapted for particular uses for electromyography [EMG]
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
- A61B5/316—Modalities, i.e. specific diagnostic methods
- A61B5/398—Electrooculography [EOG], e.g. detecting nystagmus; Electroretinography [ERG]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/02—Details of sensors specially adapted for in-vivo measurements
- A61B2562/0209—Special features of electrodes classified in A61B5/24, A61B5/25, A61B5/283, A61B5/291, A61B5/296, A61B5/053
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/02—Details of sensors specially adapted for in-vivo measurements
- A61B2562/0285—Nanoscale sensors
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/12—Manufacturing methods specially adapted for producing sensors for in-vivo measurements
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/12—Manufacturing methods specially adapted for producing sensors for in-vivo measurements
- A61B2562/125—Manufacturing methods specially adapted for producing sensors for in-vivo measurements characterised by the manufacture of electrodes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/762—Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less
Definitions
- the present invention relates generally to nanowire devices, and more specifically, to a flexible silicon nanowire electrode.
- Biopotential signals such as electrocardiogram (ECG), electroencephalogram (EEG), electrooculogram (EOG), and electromyogram (EMG) signals
- ECG electrocardiogram
- EEG electroencephalogram
- EOG electrooculogram
- EMG electromyogram
- Changes in these electrical biopotential signals can be used to record heart rate, assess muscle contraction, mechanics or inferring movement rates across the muscle, study brain activity, etc. All these measurements can be very useful in basic physiology, behavioral or pharmacological/toxicology studies.
- a method for forming a nanowire electrode.
- the method includes forming a plurality of nanowires over a first substrate, depositing a conducting layer over the plurality of nanowires, forming electrical interconnections and solder bumps over the second flexible substrate, and integrating nanowire electrode arrays to the flexible substrate.
- the plurality of nanowires are silicon (Si) nanowires, the Si nanowires used as probes to penetrate skin of a subject to achieve electrical biopotential signals.
- the plurality of nanowires are formed over the first substrate by metal-assisted chemical etching, and bio-compatible conductive coating and high-doped substrate are used to improve mechanical strength of electrodes and achieve low-impedance electrodes, respectively.
- FIG. 4 is a cross-sectional view of the semiconductor structure of FIG. 3 where a conducting layer is deposited over the plurality of Si nanowires, in accordance with an embodiment of the present invention
- FIG. 5 is a cross-sectional view of the semiconductor structure of FIG. 4 where the glass handler is removed, in accordance with an embodiment of the present invention
- FIG. 6 is a cross-sectional view of another semiconductor structure where a flexible polymer substrate is attached to another glass handler, in accordance with an embodiment of the present invention
- FIG. 7 is a cross-sectional view of the semiconductor structure of FIG. 6 where interconnection lines are formed within the flexible substrate and solder bumps are deposited adjacent the interconnection lines, the solder bumps used to join nanowire chips to the flexible substrate, in accordance with an embodiment of the present invention
- FIG. 9 is a cross-sectional view of the semiconductor structure of FIG. 8 where the glass handler is released, in accordance with an embodiment of the present invention.
- FIG. 10 is a top view of the semiconductor structure of FIG. 9 , in accordance with an embodiment of the present invention.
- FIG. 11 is a perspective view of the flexible silicon nanowire electrode of FIG. 9 in contact with skin of a subject, in accordance with an embodiment of the present invention.
- FIG. 12 is a block/flow diagram of an exemplary method for forming a flexible silicon nanowire electrode, in accordance with an embodiment of the present invention.
- a method for forming a nanowire electrode.
- the method includes forming a plurality of nanowires over a first substrate, depositing a conducting layer over the plurality of nanowires, forming solder bumps adjacent the first substrate, the solder bumps in opposed relation to the plurality of nanowires, and forming a second substrate adjacent the solder bumps, the second substrate including interconnection lines in electrical communication with the solder bumps.
- the plurality of nanowires are silicon (Si) nanowires, the Si nanowires used as probes to penetrate skin of a subject.
- the plurality of nanowires are formed over the first substrate by metal-assisted chemical etching.
- a nanowire electrode in one or more embodiments, includes a plurality of nanowires formed over a first substrate, a conducting layer deposited over the plurality of nanowires, solder bumps formed adjacent the first substrate and in opposed relation to the plurality of nanowires, and a second substrate formed adjacent the solder bumps, the second substrate including interconnection lines in electrical communication with the solder bumps.
- a nanowire electrode structure in one or more embodiments, includes a plurality of silicon (Si) nanowires formed by metal-assisted chemical etching on a first substrate, the plurality of Si nanowires coated with a conducting layer and a plurality of nanowire chips integrated within a second substrate, the second substrate being a flexible substrate contacting solder bumps formed adjacent the first substrate.
- the plurality of Si nanowires are used as probes to penetrate skin of a subject.
- the plurality of Si nanowires penetrate at least a stratum basale layer (or Stratum Germinativum (SG) layer) of the skin of the subject.
- stratum basale layer or Stratum Germinativum (SG) layer
- the silicon nanowires have a length of about 10-100 um and a diameter of about 10 nm to 1 um for use as electrodes/probes.
- the silicon nanowires are formed over a thin silicon substrate on top of a flexible polymer substrate to achieve flexible electrode patches. Additionally, the silicon nanowires include a bio-compatible metal over-coating to prevent, e.g., skin irritation.
- highly-doped silicon nanowires are integrated with a metal over-coating to construct low resistance nanowire electrodes/probes.
- solid silicon nanowire chips are integrated on a flexible polymer substrate to make flexible electrodes for clinical application.
- the bio-compatible low-temperature assembly methods use low-temperature wafer bonding, glass handler releasing, wafer transfer, and low-temperature solder bump bonding to achieve multi-layer integration.
- silicon nanowires are used as a probe. Fabrication of the silicon nanowires is accomplished by a wet etching method referred to as metal-assisted chemical etching, which results in a low-temperature assembly approach to integrate nanowire arrays on a flexible substrate.
- the silicon nanowires are of a sub-micro width to be used as probes to penetrate human skin.
- the silicon nanowires are directly etched on a silicon semiconductor layer and the nanowire structure is built by using a conductive silicon substrate, metal coating over the nanowires, and backside metal bump to achieve electrical connections to nanowire chips formed within or embedded within a flexible substrate.
- the silicon nanowires act as a penetrating probe to penetrate the skin of a subject for more accurate and sensitive signal measurement.
- the term “source” is a doped region in the semiconductor device, in which majority carriers are flowing into the channel.
- first element such as a first structure
- second element such as a second structure
- electrically connected means either directly electrically connected, or indirectly electrically connected, such that intervening elements are present; in an indirect electrical connection, the intervening elements can include inductors and/or transformers.
- crystalline material means any material that is single-crystalline, multi-crystalline, or polycrystalline.
- intrinsic material means a semiconductor material which is substantially free of doping atoms, or in which the concentration of dopant atoms is less than 10 15 atoms/cm 3 .
- p-type refers to the addition of impurities to an intrinsic semiconductor that creates deficiencies of valence electrons.
- examples of n-type dopants, i.e., impurities include but are not limited to: boron, aluminum, gallium and indium.
- an “anisotropic etch process” denotes a material removal process in which the etch rate in the direction normal to the surface to be etched is greater than in the direction parallel to the surface to be etched.
- the anisotropic etch can include reactive-ion etching (RIE).
- RIE reactive-ion etching
- Other examples of anisotropic etching that can be used include ion beam etching, plasma etching or laser ablation.
- processing includes deposition of material or photoresist, patterning, exposure, development, etching, cleaning, stripping, implanting, doping, stressing, layering, and/or removal of the material or photoresist as required in forming a described structure.
- nanowire implies, the one dimensional nature is often associated with an elongated shape.
- one dimensional refers to a width or diameter less than 1 micron and a length greater than 1 micron. Since nanowires can have various cross-sectional shapes, the diameter is intended to refer to the effective diameter. By effective diameter, it is meant the average of the major and minor axis of the cross-section of the structure.
- Nanowires made of silicon are especially attractive because of silicon's compatibility with existing integrated circuit (IC) processes. Moreover, the chemical and physical properties of silicon can be controlled to adjust the device sensitivity, and silicon nanowires can be selectively grown. Using silicon allows the vast knowledge of silicon technology to be applied to applications such as sensing.
- semiconductor nanowires researchers have demonstrated electrical sensors for biological and chemical species, and designed a range of nano-electronic and photonic devices in different material systems. In many of these demonstrations, nanowires were assembled after growth into parallel or crossed arrays by alignment aided by fluid flow or by applying electric fields. In other cases, electrical contacts were defined with electron-beam lithography on a few selected nanowires.
- Silicon (Si) nanowires with unique physio-chemical properties, have brought significant breakthroughs in fields such as electronic devices, biochemical sensors, thermoelectric devices, solar cells, and electrochemical energy conversion and storage devices.
- single crystalline silicon nanowires are preferred over polycrystalline (poly-Si) and amorphous silicon (a-Si) nanowires for use in the applications of electronic devices, biochemical sensors and thermoelectric devices, because they can have fewer defects and can be stronger and more conductive than polycrystalline and amorphous silicon nanowires of similar diameter.
- FIG. 1 is a cross-sectional view of a semiconductor structure having a substrate attached to a glass handler, in accordance with an embodiment of the present invention.
- high-doped silicon e.g., 0.001-0.005 Ohm-cm resistance
- the bonding layer 12 can be applied by a low temperature bonding method, such as adhesive bonding, which can be used to join the substrate 10 to the glass handler 20 .
- a glass wafer can be used as the handler 20 for process compatibility.
- the substrate 10 can also have multiple material layers, for example, a semiconductor-on-insulator substrate (SeOI), a silicon-on-insulator substrate (SOI), germanium-on-insulator substrate (GeOI), or silicon-germanium-on-insulator substrate (SGOI).
- the substrate 10 can also have other layers forming the substrate 10 , including high-k oxides and/or nitrides.
- the substrate 10 can be a silicon wafer.
- the substrate 10 is a single crystal silicon wafer.
- FIG. 2 is a cross-sectional view of the semiconductor structure of FIG. 1 where the substrate is thinned, in accordance with an embodiment of the present invention.
- the substrate 10 can be thinned to a desired thickness to form substrate 10 ′.
- the desired thickness can be about 10-100 ⁇ m, which is equivalent to the thickness of the stratum corneum layer of skin.
- mechanical grinding and chemical-mechanical polishing can be used to thin or etch the substrate 10 to form substrate 10 ′.
- the etch process can be an anisotropic etch process, such as reactive ion etch (RIE).
- RIE reactive ion etch
- the etching can include a dry etching process such as, for example, reactive ion etching, plasma etching, ion etching or laser ablation.
- the etching can further include a wet chemical etching process in which one or more chemical etchants are used to remove portions of the blanket layers that are not protected by the patterned photoresist.
- the patterned photoresist can be removed utilizing an ashing process.
- the height of the substrate can be selectively reduced or thinned by chemical-mechanical polishing (CMP) and/or etching. Therefore, the planarization process can be provided by CMP.
- CMP chemical-mechanical polishing
- Other planarization process can include grinding and polishing.
- a selective etch in reference to a material removal process denotes that the rate of material removal for a first material is greater than the rate of removal for at least another material of the structure to which the material removal process is being applied.
- a selective etch can include an etch chemistry that removes a first material selectively to a second material by a ratio of 10:1 or greater, e.g., 100:1 or greater, or 1000:1 or greater.
- silicon nanowires 16 are formed over the remaining substrate 14 by dipping the substrate 10 ′ into chemicals for several minutes to perform metal-assisted chemical etching.
- Metal-assisted chemical etching offers a method of etching silicon by patterning a silicon surface with a layer of metal.
- the metal acts as a catalyst for etching the silicon surface directly beneath it when exposed to an oxidizing agent (e.g., H 2 O 2 ) and an acid (e.g., HF).
- Metal-assisted chemical etching can produce nanowires of high aspect ratios in silicon. Since it is a wet etch, metal-assisted chemical etching can easily be done in large quantities for a low price compared to popular dry etch methods that can require a vacuum or plasma. Also, the ability to make structures that are undamaged in any shape capable of being patterned with metal (e.g., gold) has made metal-assisted chemical etching a viable method of silicon nanowire fabrication.
- Metal catalysts can include, but are not limited to, gold (Au), silver (Ag), platinum (Pt), tungsten (W), palladium (Pd), copper (Cu), and combinations and/or alloys thereof.
- Other metal catalysts can also include aluminum (Al), titanium (Ti), Nickel (Ni), iron (Fe), zinc (Zn), cadmium (Cd), indium (In), tin (Sn), antimony (Sb), tellurium (Te), lead (Pb), bismuth (Bi), vanadium (V), chromium (Cr), manganese (Mg), ruthenium (Ru), molybdenum (Mo), and other transition metals.
- Fluoride etchants also include, but are not limited to, buffered oxide etch (BOE), boron hydrogen fluoride (BHF), or other fluoride complex (e.g., BF 4 —, PF 6 —, CF 3 SO 3 —, AsF 6 —, and SbF 6 —).
- BOE buffered oxide etch
- BHF boron hydrogen fluoride
- Other fluoride complex e.g., BF 4 —, PF 6 —, CF 3 SO 3 —, AsF 6 —, and SbF 6 —.
- Other oxidizing agents that can be used include, but are not limited to, K 2 MnO 4 and FeNO 3 .
- the materials and layers can be deposited by physical vapor deposition (PVD), chemical vapor deposition (CVD), atomic layer deposition (ALD), molecular beam epitaxy (MBE), or any of the various modifications thereof, for example plasma-enhanced chemical vapor deposition (PECVD), metal-organic chemical vapor deposition (MOCVD), low pressure chemical vapor deposition (LPCVD), electron-beam physical vapor deposition (EB-PVD), and plasma-enhanced atomic layer deposition (PE-ALD).
- PECVD plasma-enhanced chemical vapor deposition
- MOCVD metal-organic chemical vapor deposition
- LPCVD low pressure chemical vapor deposition
- EB-PVD electron-beam physical vapor deposition
- PE-ALD plasma-enhanced atomic layer deposition
- the depositions can be epitaxial processes, and the deposited material can be crystalline.
- formation of a layer can be by one or more deposition processes, where, for example, a conformal layer can be formed by a first process (e.g., ALD, PE-ALD, etc.) and a fill can be formed by a second process (e.g., CVD, electrodeposition, PVD, etc.).
- a first process e.g., ALD, PE-ALD, etc.
- a second process e.g., CVD, electrodeposition, PVD, etc.
- FIG. 4 is a cross-sectional view of the semiconductor structure of FIG. 3 where a conducting layer is deposited over the plurality of Si nanowires, in accordance with an embodiment of the present invention.
- a metal layer 19 is deposited and the substrate 14 is broken into a plurality of substrates 18 , each substrate 18 configured to accommodate a plurality of nanowires 16 coated with metal layer 19 .
- the metal layer coating 19 enhances biocompatibility and improves the mechanical strength of the nanowires 16 .
- Metal deposition methods can include, e.g., PVD, plating, evaporation, etc.
- the metal layer 19 can be, e.g., a biocompatible metal, such as titanium nitride (TiN).
- a semiconductor structure 7 includes a polymer layer 34 attached to a glass handler 30 via a release layer 32 .
- the release layer assists the glass handler releasing process, and the polymer layer 34 can be used as a flexible substrate of the final nanowire electrode, as described further below.
- conducting lines 36 are fabricated within a polymer layer 37 deposited over the flexible polymer layer 34 .
- solder bumps 38 are deposited over the conducting lines 36 .
- the solder bumps 38 do not contact each other.
- the solder bumps 38 are separated from each other by a predetermined distance.
- the conducting lines 36 can be metal lines.
- the metal lines 36 can be used as electrical interconnections between nanowire chips.
- the solder bumps 38 can be used to join the nanowire chips to the flexible polymer substrate 34 .
- the solder bumps 38 can also be referred to as solder nanodots or solder films or solder ball bumps.
- the electrodes 25 of FIG. 5 are attached to the solder bumps 38 such that each electrode array 25 is associated with a single solder bump 38 .
- the electrodes 25 are attached such that respective solder bumps 38 contact the respective substrate 18 of each of the electrode arrays 25 .
- the solder bumps 38 separate the metal lines 36 from the electrode arrays 25 .
- FIG. 9 is a cross-sectional view of the semiconductor structure of FIG. 8 where the glass handler is released, in accordance with an embodiment of the present invention.
- the glass handler 30 and the release layer 32 are removed, thus leaving behind a plurality of nanowire electrodes 25 placed over the flexible substrate 34 .
- the nanowire structure 40 is ready to be applied to the skin of a subject, e.g., a patient.
- the silicon nanowires coated with a metal layer are configured to penetrate the skin of a patient.
- the silicon nanowires are designed to penetrate at least the stratum germinativum (SG) layer (or stratum basale layer) of the skin, as described further below with reference to FIG. 11 .
- SG stratum germinativum
- FIG. 10 is a top view of the semiconductor structure of FIG. 9 , in accordance with an embodiment of the present invention.
- the top view illustrates each electrode array.
- the top coated surface 19 of the nanowires 16 is showed surrounded by substrates 18 .
- Metal lines 36 are also shown connecting the electrode arrays 25 to each other.
- the nanowire structure 40 is used to penetrate the skin 50 of a subject.
- the skin 50 is composed of three basic layers or regions.
- the first layer 52 is the epidermis.
- the second layer 54 is the dermis.
- the third layer 56 is the hypodermis.
- the first layer 52 includes 5 different layers. These layers are the stratum corneum layer, the stratum lucidum layer, the stratum granulosum layer, the stratum spinosum layer, and the stratum basale layer (also referred to as the stratum germinativum layer).
- the stratum basale layer contacts the dermis region 54 .
- the dermis region can include two different layers, that is, the papillary region and the reticular region. Therefore, the stratum basale layer is adjacent the dermis region 54 or the farthest away from the outer surface of the skin of the subject, yet within the epidermis region 52 .
- the chip is then integrated with other chips, discrete circuit elements, and/or other signal processing devices as part of either (a) an intermediate product, such as a motherboard, or (b) an end product.
- the end product can be any product that includes photovoltaic devices, integrated circuit chips with solar cells, ranging from toys, calculators, solar collectors and other low-end applications to advanced products for medical applications, as described herein.
- the present embodiments can include a design for an integrated circuit chip, which can be created in a graphical computer programming language, and stored in a computer storage medium (such as a disk, tape, physical hard drive, or virtual hard drive such as in a storage access network). If the designer does not fabricate chips or the photolithographic masks used to fabricate chips, the designer can transmit the resulting design by physical mechanisms (e.g., by providing a copy of the storage medium storing the design) or electronically (e.g., through the Internet) to such entities, directly or indirectly.
- the stored design is then converted into the appropriate format (e.g., GDSII) for the fabrication of photolithographic masks, which typically include multiple copies of the chip design in question that are to be formed on a wafer.
- the photolithographic masks are utilized to define areas of the wafer (and/or the layers thereon) to be etched or otherwise processed.
- the resulting integrated circuit chips can be distributed by the fabricator in raw wafer form (that is, as a single wafer that has multiple unpackaged chips), as a bare die, or in a packaged form.
- the chip is mounted in a single chip package (such as a plastic carrier, with leads that are affixed to a motherboard or other higher level carrier) or in a multichip package (such as a ceramic carrier that has either or both surface interconnections or buried interconnections).
- the chip is then integrated with other chips, discrete circuit elements, and/or other signal processing devices as part of either (a) an intermediate product, such as a motherboard, or (b) an end product.
- the end product can be any product that includes integrated circuit chips, ranging from toys and other low-end applications to advanced computer products having a display, a keyboard or other input device, and a central processor.
- material compounds will be described in terms of listed elements, e.g., SiGe. These compounds include different proportions of the elements within the compound, e.g., SiGe includes Si x Ge 1-x where x is less than or equal to 1, etc.
- other elements can be included in the compound and still function in accordance with the present embodiments.
- the compounds with additional elements will be referred to herein as alloys.
- spatially relative terms such as “beneath,” “below,” “lower,” “above,” “upper,” and the like, can be used herein for ease of description to describe one element's or feature's relationship to another element(s) or feature(s) as illustrated in the FIGS. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the FIGS. For example, if the device in the FIGS. is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the term “below” can encompass both an orientation of above and below.
Abstract
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US20200146576A1 (en) | 2020-05-14 |
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