TWM613391U - Flexible heating film for electronic products - Google Patents

Abstract

A flexible heating film for electronic products, comprising a first high temperature resistant insulating and waterproof layer; a high temperature resistant heating layer coated on the first high temperature resistant insulating and waterproof layer, which has heating material particles, and makes the heating material particles exposed on the first A high temperature resistant insulating and waterproof layer is stacked closely without being wrapped, so that the heating material particles are stably combined on the first high temperature resistant insulating and waterproof layer; an electrode layer is arranged on the high temperature resistant heating layer; a second resistant layer The high-temperature insulating and waterproof layer covers the electrode layer; and a wire is electrically connected to the electrode layer to form a flexible heating film with a thickness of less than 0.6mm. This creation maximizes the function of heat-resistant heating materials and reduces the cost of using heat-resistant heating materials and the limitations of the manufacturing process. Through the use of low-cost methods, the products that can be used with high-temperature heating materials are widely improved, and mass production of the industry is carried out to the greatest extent.

Description

Flexible heating film for electronic products

The new type relates to a flexible heating film for electronic products, especially a flexible heating film prepared into a high radiant heat efficiency.

According to 3C electronic products such as electric stoves, electric coffee pots, and water dispensers, electric heating elements are used as heating sources. The electric heating elements of traditional 3C electronic products are shown in Figure 1A and Figure 1B. An electric furnace 60 has its base 61 is provided with an electric heating plate 62, and the electric heating plate 62 is provided with a heat source by the electric heating copper tube 63 in the base 61, so that not only power consumption, but also the electric heating tube 63 must be equipped with a cooling fan 64 and a control circuit 65 and other equipment, so it takes up more space, resulting in disadvantages such as the height (thickness) of the base 61 cannot be reduced.

In recent years, based on the evolution of technology, electronic components have developed in the direction of miniaturization, and the resulting thermal management issues have also received certain attention. Many high thermal conductivity materials such as silver, copper, and graphite sheets have been extensively studied by scientists. Among them, the thermal conductivity of graphite sheets has attracted great attention. Due to the special two-dimensional honeycomb lattice carbon atom structure of graphite sheets, its thermal conductivity is better than that of metals, so it is widely used in electronic components.

In the traditional graphite flake production process, firstly, chemicals are used to improve the purity and density of the graphite flakes, and then a pressure greater than 30Mpa is applied to press the graphite flakes to make the graphite flakes tightly combined with each other, and finally 1800- At a high temperature of 3000 degrees C, a graphite thermally conductive substrate can only be obtained after several hours. Therefore, it not only consumes a lot of energy but also takes a long time to manufacture. Therefore, how to develop a simple process without using high-pressure and high-temperature process steps to prepare a graphite thermally conductive material is a difficult problem to be overcome by the relevant technicians in this technical field.

However, in the traditional graphene film transfer process, the following three problems generally exist: First: before the transfer, the graphene film is exposed to the air for a long time, causing the air-contacting surface to be polluted by suspended particles in the air. The traditional transfer method uses this contaminated surface to make devices. Second: In the traditional transfer method, the graphene film is transferred to a hard substrate. The bonding force between the graphene and the substrate is only Van der Waals force, which causes the graphene film to fall off easily. Third: The traditional transfer method requires complicated steps. In the process of transferring from the metal substrate to the required substrate, too many types of materials are used, which is easy to cause pollution on the graphene surface during the transfer process. And it is easy to cause damage to the crystal structure of the graphene film. The above three defects limit the large-scale production and utilization of graphene films.

Therefore, the Chinese Patent Application Publication No. CN102807208A discloses a graphene film transfer method to improve the above-mentioned problems in the graphene film transfer process. It is characterized in that the graphene film is directly adhered to the polymer substrate to form a covalent bond between the graphene film and the polymer substrate, and the side of the graphene film in contact with the growth substrate is exposed, as a functional device Effective surface. The implementation steps of the technical solution are as follows: step 1), melt or dissolve the polymer to make it in a fluid state; step 2), coat the polymer in a fluid state on the substrate on which graphene is grown, and solidify the polymer Step 3), use ferric chloride or ferric nitrate solution to corrode the metal flakes, and clean, dry or dry the polymer film adhered to the graphene film to obtain the graphene film transferred to the polymer material .

The second press, the Chinese Patent Application Publication No. CN105898907A, discloses a graphene heating film and its preparation method, which is characterized in that it includes a first insulating and waterproof layer, an electrode layer, a heating film and a second insulating and waterproof layer. The waterproof layer, the electrode layer, the heating film layer and the second insulating waterproof layer are pasted into an integrated structure, and the heating film layer is a graphene film. The implementation steps of the technical solution are as follows: 1). Fabrication of the graphene film; 2). Cover the second insulating and waterproof layer with adhesive glue; 3). Bond the second insulating and waterproof layer and the graphene film into one body; 4) Remove the metal matrix on the graphene film; 5) Paste the electrode layer on the graphene film; 6) Paste the first insulating and waterproof layer on the electrode layer; 7) Connect the electrode layer and the wire.

However, the traditional graphene preparation method has many defects on the surface of the graphene, and the graphene sheets are prone to folding and curling, which affects the performance of the graphene, and there are almost no oxidized groups on the surface of the graphene obtained after reduction. Therefore, its surface is hydrophobic, which makes it easy to agglomerate in water and some common organic solvents and cause sedimentation. There are many methods for preparing graphene heating films, but it is still difficult to prepare graphene films with excellent electrical properties and pollution-free. The main difficulty lies in how the graphene film can be better transferred to the target substrate to prepare a complete , No damage, stable process, reliable graphene heating (heat conduction) film.

Furthermore, the problems of heat dissipation and spraying in the graphene industry include: the problem that the high-purity graphene cannot be closely arranged after spraying; and the problem that the graphene is wrapped by the general resin coating by stirring and mixing, which affects the radiation emission.

In addition, the thickness of the graphene heat-generating (heat-conducting) film is not easy to decrease, and most of it is not flexible. As a result, the subsequent use in 3C products will cause many problems and be difficult to implement, which is very troublesome for the industry.

Therefore, how to solve the above-mentioned problems of the traditional graphene heat-generating (heat-conducting) film is the main subject of the new type.

The main purpose of the present invention is to provide a flexible heating film for electronic products, which maximizes the function of heating material particles (such as graphene) and achieves the effect of high heat generation.

Another purpose of the present invention is to provide a flexible heating film for electronic products, which has the advantages of reducing the limitation of using heating material particles, and extensively increasing the usable products of heating material particles through the use of coating methods, so as to achieve the largest industrial mass production.

In order to achieve the above-mentioned effects, the method adopted by the new system includes the following steps: a) Provide a first high temperature resistant insulating and waterproof layer, the first high temperature resistant insulating and waterproof layer is a flexible body with a thickness between 0.015 and 0.2mm; b) On the first high temperature resistant insulating and waterproof layer, a layer of high temperature resistant heating material slurry is arranged, the thickness of the high temperature resistant heating material slurry is between 0.015 ~ 0.2mm, and the high temperature resistant heating material slurry contains selected from: carbon Balls, carbon fibers, graphite or its particles, graphene, carbon nanotubes, boron nitride, man-made diamonds, alumina, zirconia, rare earths, thermal conductive metal particles, any of them or a combination thereof constitutes heating material particles, Its weight ratio is 15～70%, and it is composed of 25～60% by weight nano resin and 5～25% by weight solvent medium; c). Purification operation: drying the high-temperature heat-resistant material slurry at a heat temperature of 120°C～150°C for 30 to 50 minutes, and volatilize the medium and solvent at high temperature to improve the purity, and the high-temperature heat-resistant material The slurry and the first heat-resistant insulating and waterproof layer are physically or mixed chemically bonded or bridged through nanoresin, so that the heating material particles are exposed to the first high-temperature insulating and waterproof layer to the greatest extent and are tight. Arranged and stacked without being wrapped, and the nano-resin generates silicic acid ions through the shrinkage polymerization reaction, so that the heating material particles are stably combined on the first high-temperature-resistant insulating and waterproof layer to form a high-purity high-temperature heating layer; d) An electrode layer is provided on the heating layer, and the thickness of the electrode layer is between 0.015 and 0.2mm; e) covering the electrode layer with a second high temperature resistant insulating and waterproof layer, the second high temperature resistant insulating and waterproof layer is a flexible body with a thickness between 0.015 and 0.2mm; and f). Provide a wire to be electrically connected to the electrode layer to prepare a flexible heating film with a thickness of less than 0.6mm.

According to the aforementioned features, the first high-temperature resistant insulating and waterproof layer and the second high-temperature resistant insulating and waterproof layer can be selected from: a PE film, a PVC film, a PET film, glass fiber or ceramic fiber paper or any combination thereof constitute.

According to the aforementioned features, the nano-resin may be water-based or oil-based. Wherein, the water-based nano-resin is selected from: water-based nano-epoxy modified acrylic or water-based nano-silicone modified polyurethane. Wherein, the oily nano-resin is selected from: solvent-based nano-epoxy modified acrylic or solvent-based nano-silicone modified polyurethane.

According to the features disclosed above, the high-temperature heat-resistant thermal conductive layer may include a pattern covering the entire surface or a line pattern matching the shape of the electrode layer.

According to the features disclosed above, the electrode layer may include a conductive metal material.

According to the features disclosed above, the flexible thermal conductive film for electronic products made by the present invention includes: a first high temperature resistant insulating and waterproof layer, the thickness of the first high temperature resistant insulating and waterproof layer being flexible with a thickness between 0.015 and 0.2 mm Body; a high temperature resistant heating layer, coated on the first high temperature resistant insulating and waterproof layer, the thickness of the high temperature resistant heating layer is between 0.015 ~ 0.2mm, it has heating material particles, and the heating material particles are exposed The first high-temperature-resistant insulating and waterproof layer is stacked closely without being wrapped, so that the heating material particles are stably combined on the first high-temperature-resistant insulating and waterproof layer; an electrode layer is arranged on the high-temperature heating layer, The thickness of the electrode layer is between 0.015 and 0.2mm; a second high temperature resistant insulating and waterproof layer covering the electrode layer, the thickness of the second high temperature resistant insulating and waterproof layer is between 0.015 and 0.2mm flexible body ; And a wire electrically connected to the electrode layer to form a flexible heating film with a thickness of 0.6 mm or less.

With the help of the technical characteristics of the disclosure, the flexible heating film prepared by the present invention has a stable structure by physical or mixed chemical bonding or bonding between the heating material particles and the nanoresin. High-purity heating material particles, the solvent volatilizes after spraying, the heating material particles are exposed on the surface of the material, the molecules carry out effective radiation emission, radiation transfer, achieve uniform heat, conduct heat exchange, quickly achieve the heating effect, and its working temperature (heating range) can reach 600 degrees Celsius. Furthermore, this new model uses "purification" technology to solve the problems of thermal spraying in the industry, including: solving the problem that high-purity heat-generating material particles cannot be closely arranged after spraying; and solving the problem of general resin coatings that use stirring and mixing to wrap the heat-generating material particles, which affects radiation The issue of launch.

The following is a specific embodiment to illustrate the implementation of the present invention. Those who are familiar with this technique can easily understand the other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied by other different specific embodiments. Various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the spirit of the present invention.

First of all, please refer to Figures 1-14. The method for preparing a flexible heating film for electronic products of the present invention includes the following steps:

a) Provide a first high temperature resistant insulating and waterproof layer 10, the first high temperature resistant insulating and waterproof layer 10 is a flexible body with a thickness between 0.015 and 0.2mm; in this embodiment, the first high temperature resistant insulating and waterproof layer 10. It is selected from the group consisting of: a PE film, PVC film, PET film, glass fiber or ceramic fiber paper or a combination thereof, but it is not limited to this. In this embodiment, the glass fiber (Fibreglass) is an inorganic non-metallic material with excellent performance, and the advantages are good insulation, strong heat resistance, good corrosion resistance, and high mechanical strength. Its softening point is 500~750℃, boiling point is 1000℃, density is 2.4~2.76g/cm3, tensile strength is 6.3~6.9 g/d in standard state, wet state is 5.4~5.8 g/d, density is 2.54g/ cm3, good heat resistance, no effect on strength when the temperature reaches 300℃, excellent electrical insulation, it is a high-level electrical insulating material, and also used as a thermal insulation material. Therefore, using glass fiber as the first high temperature resistant insulating and waterproof layer 10 is an excellent choice.

b). As shown in Figures 3A to 3C, on the first high-temperature-resistant insulating and waterproof layer 10, a layer of high-temperature-resistant heating material slurry 20a is provided. The following "setting" methods of the present model include: spraying, brushing , Roll coating, pad printing, transfer printing, etc. methods are not repeated here, and are not limited to this.

The thickness of the heat-resistant heating material slurry 20a is between 0.015 and 0.2mm, and the heat-resistant heating material slurry 20a contains selected from: carbon balls, carbon fibers, graphite or its particles, graphene, carbon nanotubes, nitriding The heating material particles 22 composed of boron, synthetic diamond, alumina, zirconia, rare earth, and thermally conductive metal particles, any of them or a combination thereof, have a weight ratio of 15 to 70%, and are mixed with a weight ratio of 25 to 60% The nano-resin 21 is composed of a solvent medium with a weight ratio of 5-25%; in this embodiment, the nano-resin 21 can be water-based or oil-based; wherein the water-based nano-resin 21 is selected from: water-based nano-epoxy modified Acrylic acid or water-based nano-silicone modified polyurethane...etc. The oil-based nano-resin is selected from the group consisting of: solvent-based nano-epoxy modified acrylic or solvent-based nano-silicone modified polyurethane. The solvent is selected from esters, ketones, alcohols, and the ingredients are adjusted according to the method of preparation.

c). Purification operation: drying the high temperature heat-resistant material slurry 20a at a heat temperature of 120°C～150°C for 30 to 50 minutes, and volatilize the solvent and other media at a high temperature to improve the purity, and the heat-resistant heat-resistance The material slurry 20a and the first high temperature resistant insulating and waterproof layer 10 are physically or mixed chemically bonded or bridged through the nanoresin 21, so that the heating material particles 22 are exposed to the first high temperature resistant insulating and waterproof layer to the greatest extent 10, and are stacked in close arrangement without being wrapped, and the nanoresin 21 generates silicate ions through shrinkage polymerization reaction (shown in the following chemical reaction formula):

Accordingly, the thermal material particles 22 are stably combined on the first heat-resistant insulating and waterproof layer 10, as shown in FIG. 3B, to form a high-purity high-temperature heat-resistant layer 20; in this embodiment, the high-temperature heat-resistant layer 20 is It is formed by drying and purifying the high-temperature heat-resistant material slurry 20a.

The "purification" operation is the most important technical feature of the new model. The so-called "purify" refers to the separation of impurities in the mixture to improve its purity. Figure 9 is a schematic diagram of the temperature and time of the purification operation of the new high-temperature heat-resistant heating layer; since the original purity of the heat-generating material particles 22 is 100%, but because they need to be attached to the first high-temperature resistant insulating and waterproof layer 10, nano-resin must be added 21. Solvents, auxiliaries... and other media can be attached by spraying or printing. After attachment, the high-temperature heating material slurry 20a is dried at a high temperature of 120°C to 150°C for 30 to 50 minutes, so this new type of purification operation In order to volatilize the medium and solvent, the purity of the heating material particles 22 can reach more than 95%. If the temperature and time are not properly controlled, the effect of the purification operation will be affected, and the heat-generating material particles 22 and the nanoresin 21 cannot be bridged through a chemical reaction to achieve the effect of structural stability.

Furthermore, as shown in FIG. 8, after the high-purity graphene 22 is sprayed, the solvent and other media evaporate, and the graphene 22 is exposed and adhered to the surface of the first high-temperature-resistant insulating and waterproof layer 10 (material) by the nanoresin 21. The 22 molecules of the heating material particles carry out effective radiation emission and radiation transfer, so as to achieve uniform heat, conduct heat exchange, and quickly achieve the heating effect. Therefore, the most important "purification" technical means of the present invention can solve the problems of heat dissipation spraying in the industry, including: first, solving the problem that the particles 22 of high-purity heat-generating material cannot be closely arranged after spraying. Secondly, it solves the problem that the general resin coating uses a stirring and mixing method to wrap the heating material particles 22, which affects the radiation emission.

d) Paste or print an electrode layer 30 on the high temperature heating layer 20, the thickness of the electrode layer is between 0.015 ~ 0.2mm; in this embodiment, the electrode layer 30 is composed of conductive metal material, which can It can be achieved by means of pasting copper foil or printing silver paste, but it is not limited to this.

In the first embodiment, as shown in FIGS. 3A to 3C, the high-temperature heat-resistant heating layer 20 is in the form of covering the entire surface, but it is not limited to this. As in the second embodiment, as shown in FIGS. 4A to 4C, the high-temperature heat-resistant heating layer 20 can be in a line shape that matches the shape of the electrode layer 30. This is because the high-temperature heat-resistant layer 20 has excellent thermal conductivity and can radiate heat energy, so the line pattern can also perform effective radiation emission.

e) covering the electrode layer 30 with a second high temperature resistant insulating and waterproof layer 40, the second high temperature resistant insulating and waterproof layer 40 is a flexible body with a thickness between 0.015 and 0.2mm; in this embodiment, the first The second high-temperature resistant insulating and waterproof layer 40 is selected from the group consisting of a PE film, a PVC film, a PET film, glass fiber or ceramic fiber paper or a combination thereof, but is not limited thereto.

f). Provide a wire 31 electrically connected to the electrode layer 30, the wire 31 connects the anode and the cathode, conducts electricity and then short-circuits to generate heat, and prepares a flexible thermally conductive film 50 with a thickness of less than 0.6 mm.

As shown in FIG. 6, the flexible heating film 50 for electronic products made according to the features of the present invention includes: a first high temperature resistant insulating and waterproof layer 10, the thickness of the first high temperature resistant insulating and waterproof layer 10 is 0.015 A flexible body between ～0.2mm; a high temperature resistant heating layer 20 is coated on the first high temperature resistant insulating and waterproof layer 10, the thickness of the high temperature resistant heating layer 20 is between 0.015～0.2mm, and the heat is generated The material particles 22 are exposed on the first high-temperature-resistant insulating and waterproof layer 10, and are stacked closely without being wrapped, so that the heating material particles 22 are stably combined on the first high-temperature-resistant insulating and waterproof layer 10; an electrode layer 30 is pasted Or printed on the high temperature resistant heating layer 20, the thickness of the electrode layer is between 0.015 ~ 0.2mm; a second high temperature resistant insulating and waterproof layer 40 covering the electrode layer 30, the second high temperature resistant insulating and waterproof layer 40 is a flexible body with a thickness of 0.015～0.2mm; and a wire 31 is electrically connected to the electrode layer 30 to form a flexible heating film 50 with a thickness of less than 0.6mm. Its working temperature (heating Range) can reach 600 degrees Celsius, so it is an excellent heating material.

Based on the above-mentioned preparation method, the flexible heating film 50 prepared by the present invention has the following functions and needs to be clarified: 1. The flexible heating film 50 of the present invention is physically or chemically bonded or bridged by the heating material particles 22 and the nanoresin 21, so the structure is stable; high-purity graphene, the solvent volatilizes after spraying, and generates heat The material particles 22 are exposed on the surface of the material, and the molecules carry out effective radiation emission and radiation transfer to achieve uniform heat and heat exchange to achieve an excellent heating effect. Its working temperature (heating range) can reach 600 degrees Celsius. Therefore, the new model uses "purification" technical means to solve the problems of thermal spraying in the industry, including: solving the problem that the traditional high-purity heat-generating material particles 22 cannot be closely arranged after coating; and solving the problem of mixing the heat-generating material particles 22 Package, and affect the issue of radiation emission. 2. The thickness of the flexible thermally conductive film 50 of the present invention can be within 0.6 mm, which is thin and flexible. Therefore, it can be bent as shown in Figure 5A, or can be rolled into a circular tube as shown in Figure 5B. In this way, the product applicability of the new flexible thermally conductive film 50 can be broadly expanded. . For example: as shown in FIG. 11, the flexible heating film 50 is used in the electric furnace 51 as a reference diagram; or as shown in FIG. 12, the flexible heating film 50 is used in the insulation pad 52 as a reference diagram; or As shown in FIG. 13, the flexible heating film 50 is used in the floor heating 53 as a reference diagram; of course, as shown in FIG. 14, the flexible thermal conductive film 50 is used in the heating tube 54 as a reference diagram; due to the flexibility The heating film 50 can be rolled into a circular tube, so that the heating tube 54 of the water heater can be heated. Therefore, the flexible heating film 50 of the present invention can replace the traditional copper tube or olefin heating method, which is more convenient to use and lower in cost.

In summary, the structure disclosed in this new model is unprecedented, and can indeed achieve enhanced efficacy, and is available for industrial use, and fully meets the requirements of a new patent. I pray that the Jun Bureau will grant the patent to encourage innovation. , No sense of morality.

However, the drawings and descriptions disclosed above are only the preferred embodiments of the present invention. For those familiar with the art, modifications or equivalent changes made in accordance with the spirit of the case should still be included in the scope of the patent application in this case.

10: The first high temperature resistant insulation and waterproof layer 20: High temperature resistant heating layer 20a: High temperature resistant heating material slurry 21: Nano resin 22: Heating material particles 30: Electrode layer 31: Wire 40: The second high temperature resistant insulation and waterproof layer 50: Flexible heating film 51: electric furnace 52: Insulation pad 53: Floor heating 54: heating tube

Figure 1A is a schematic diagram of the appearance of a conventional electric heating furnace. Fig. 1B is an internal schematic diagram of a conventional electric heating furnace. Figure 2 is a flow chart of the new preparation method. Fig. 3A is an exploded perspective view (1) of the first feasible embodiment of the present invention. Fig. 3B is an exploded perspective view (2) of the first feasible embodiment of the present invention. Fig. 3C is a combined perspective view of the first feasible embodiment of the present invention. Fig. 4A is an exploded perspective view (1) of the second feasible embodiment of the present invention. Fig. 4B is an exploded perspective view (2) of the second feasible embodiment of the present invention. Fig. 4C is a combined perspective view of the second feasible embodiment of the present invention. Fig. 5A is a reference diagram (1) of the use state of the new flexible heating film. Fig. 5B is a reference diagram (2) of the use state of the new flexible heating film. Figure 6 is a cross-sectional view of the structure of the new flexible heating film. Fig. 7A is a cross-sectional view of section 7A-7A in Fig. 6; Fig. 7B is an enlarged schematic diagram of a part of the structure in Fig. 7A. Figure 8 is a cross-sectional view of the new high-temperature heat-resistant layer of the invention. Fig. 9 is a schematic diagram of the temperature and time of the purification operation of the high-temperature resistant heating layer of the present invention. Figure 10 is an electron microscope image of the new high-temperature heat-resistant layer of the present invention. Figure 11 is a reference diagram of the new flexible heating film used in an electric furnace. Figure 12 is a reference diagram of the new flexible heating film used in the thermal insulation pad. Figure 13 is a reference diagram of the new flexible heating film used in floor heating. Figure 14 is a reference diagram of the new flexible heating film used in the heating tube.

10: The first high temperature resistant insulation and waterproof layer

20: High temperature resistant heating layer

30: Electrode layer

31: Wire

40: The second high temperature resistant insulation and waterproof layer

50: Flexible heating film

Claims (3)

A flexible heating film for electronic products, including: A first high-temperature-resistant insulating and waterproof layer, a flexible body with a thickness of the first high-temperature-resistant insulating and waterproof layer between 0.015 and 0.2 mm; A high temperature resistant heating layer is coated on the first high temperature resistant insulating and waterproof layer. The high temperature resistant heating layer has a thickness of 0.015 to 0.2 mm, which has heating material particles, and exposes the heating material particles on the first A high-temperature-resistant insulating and waterproof layer is closely arranged and stacked without being wrapped, so that the heating material particles are stably combined on the first high-temperature-resistant insulating and waterproof layer; An electrode layer is arranged on the high temperature resistant heating layer, the thickness of the electrode layer is between 0.015 and 0.2 mm; A second high-temperature-resistant insulating and waterproof layer covering the electrode layer, a flexible body with a thickness of the second high-temperature-resistant insulating and waterproof layer between 0.015 and 0.2 mm; and A wire is electrically connected to the electrode layer to form a flexible heating film with a thickness of less than 0.6 mm. The flexible heating film for electronic products according to claim 1, wherein the high-temperature heat-resistant thermal conductive layer includes a pattern that is covered on the entire surface or a line pattern that matches the shape of the electrode layer. The flexible heating film for electronic products according to claim 1, wherein the electrode layer includes a conductive metal material.

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