TWM444701U - Nano carbon ball heat dissipation patch structure - Google Patents

Description

Nano carbon ball heat sink structure

The present invention relates to a heat sink structure of a nano carbon sphere, and particularly relates to a heat sink patch structure of a nano carbon sphere used as an auxiliary electronic device for heat dissipation.

In order to make life more convenient, technology has been continuously developed to develop various tools, such as mobile phones, computers and other electronic products, so that people can not afford the use of electronic devices in their lives.

Among them, because the electronic device operates, a large amount of thermal energy is generated, and the thermal energy may make the electronic device operate poorly, or cause the electronic device to generate heat and cause a large amount of data to be lost; even worse, the electronic device may be damaged or permanently damage.

Therefore, in order to reduce the above situation, as shown in FIG. 6, the prior art provides a heat dissipation structure including a heat dissipation fin set 60 and a heat dissipation fan 70, which are configured to dispose the heat dissipation fin set 60 and the heat dissipation fan 70. The heat energy generated by the heat source 81 is transmitted to the heat sink fin group 60, and the heat energy band is dispersed by the heat sink fan 60 to reach the heat fin group 60 to reach the auxiliary electronic device. 80 heat dissipation purposes.

However, the heat dissipation fin set and the heat dissipation fan of the prior art occupy a large volume, and after being mounted on the electronic device, the volume of the electronic device is increased to occupy a space; on the other hand, the prior art is required for manufacturing. The raw materials and steps are more, and the manufacturing cost is higher.

Therefore, the prior art needs to be further improved.

In view of the above-mentioned shortcomings of the prior art, the present invention provides a heat-dissipating patch structure of a carbon sphere which does not occupy space, has a low manufacturing cost, and can assist heat dissipation of an electronic device.

In order to achieve the above-mentioned creative purposes, the technical means adopted by the present invention is to design a heat-dissipating patch structure of a nano-carbon ball, which comprises: a heat-conducting layer; a heat-dissipating layer, the heat-dissipating layer is disposed on the top surface of the heat-conducting layer, The heat dissipation layer comprises carbon nanocapsules (CNCs); an adhesive layer, the adhesive layer is attached to the bottom surface of the heat conductive layer, and the adhesive layer is made of a heat conductive material.

The advantage of the present invention is that since it is a patch structure, the overall thickness is thin and the volume is small, and the space is not occupied; at the same time, it is only required to be respectively disposed on the top surface and the bottom surface of the heat conductive layer. The heat dissipating layer and the adhesive layer are disposed to have the functions of heat conduction and heat dissipation in use, and the raw materials required for the production are less and the steps are relatively simple, thereby reducing the manufacturing cost and achieving economic benefits; Since the heat dissipation layer contains nano carbon spheres, and the carbon nanospheres (CNCs) have better thermal conductivity, the heat conduction and heat dissipation properties of the heat dissipation layer of the present invention can be improved; on the other hand, since the heat dissipation layer contains nanometers The carbon sphere and the nano carbon sphere have good electrical conductivity, so that the heat dissipation layer of the invention has the effect of electromagnetic shielding, and when the creation is set on the electronic device, the electromagnetic wave generated by the electronic device can be reduced to diverge outward.

Further, the adhesive layer comprises a substrate, a top adhesive layer and a The bottom adhesive layer, the top adhesive layer of the adhesive layer is applied between the substrate and the heat conductive layer, and the bottom adhesive layer is attached to the bottom surface of the substrate.

Further, the method further comprises a release layer disposed on the bottom surface of the adhesive layer.

Further, the method further comprises a release layer disposed on a bottom surface of the bottom adhesive layer of the adhesive layer.

Further, the thickness of the heat conductive layer is 50 ± 20 μm .

Further, the thickness of the heat dissipation layer is 50 ± 5 μm .

Further, the thickness of the adhesive layer is 50 ± 5 μm .

Further, wherein the heat conductive layer is made of copper foil.

The technical means adopted by the present invention for achieving the intended purpose are further explained below in conjunction with the drawings and the preferred embodiments of the present invention.

As shown in FIG. 1 , the heat dissipation patch structure of the nano carbon sphere of the present invention comprises a heat conductive layer 10 , a heat dissipation layer 20 , an adhesive layer 30 and a release layer 40 .

As shown in FIG. 1, the heat conducting layer 10 is made of a heat conductive material. In the preferred embodiment, the heat conducting layer 10 is made of copper foil, and the heat conducting layer 10 has a thickness of 50±20 μm .

As shown in FIG. 1, the heat dissipation layer 20 is disposed on the top surface of the heat conduction layer 10, and the heat dissipation layer 20 includes carbon nanocapsules (CNCs); further, the heat dissipation layer 20 is coated and formed on the heat conduction layer. On the top surface of layer 10; in the preferred embodiment, heat sink layer 20 has a thickness of 50 ± 5 μm .

As shown in FIG. 1, the adhesive layer 30 is attached to the bottom surface of the heat conductive layer 10. In the preferred embodiment, the thickness of the adhesive layer 30 is 50±5 μm . In another preferred embodiment, As shown in FIG. 2, the adhesive layer 30a includes a substrate 31a, a top adhesive layer 32a and a bottom adhesive layer 33a. The top adhesive layer 32a of the adhesive layer 30a is disposed between the substrate 31a and the heat conductive layer 10. The bottom adhesive layer 33a is attached to the bottom surface of the substrate 31a; further, the adhesive layer 30a is a double-sided tape.

As shown in FIG. 1, the release layer 40 is disposed on the bottom surface of the adhesive layer 30. Further, in another preferred embodiment, as shown in FIG. 2, the release layer 40 is disposed on the adhesive layer 30a. On the bottom surface of the bottom adhesive layer 33a.

As shown in FIG. 1 and FIG. 3, in the present invention, the release layer 40 is separated from the adhesive layer 30, and the present invention is integrally coated on the heat source 51 of the electronic device 50 by the adhesive layer 30. On the surface, since the adhesive layer 30 is made of a heat conductive material, when the heat source 51 of the electronic device 50 generates heat energy, the heat energy thereof can be conducted to the heat conductive layer 10 through the adhesive layer 30 and conducted to the heat dissipation layer 20 via the heat conductive layer 10. And the surface of the heat dissipation layer 20 is dissipated to achieve the heat dissipation effect of the auxiliary electronic device 50. Moreover, since the creation can be coated on the surface of the heat source 51 of the electronic device 50, the heat dissipation area can be large. Moreover, the heat dissipation effect can be improved; in particular, Table 1 is the result of physical testing of the heat dissipation fin set of the prior art;

The physical test described above uses a thermocouple to measure an electronic module under normal operation, which is a bare metal (ie, no heat dissipating component is provided on the main control chip), or a heat dissipating fin set is disposed on the main control chip, Or the surface temperature of the three different states of the created heat sink patch is attached to the main control chip, the relevant parameters are as follows: working time: 4 hours; the size of the heat dissipation fin group: thickness 15mm, width 22.5 mm, length 22.5mm; The dimensions of the heat sink patch of this creation are: thickness 0.15mm (150 μ m ), width 40 mm, length 50 mm: from Table 1, when the heat sink fin set is provided on the main control wafer, the surface temperature is 58 ° C. When the heat-dissipating patch of the present invention is attached, the surface temperature of the main control wafer is 57 ° C, and in the bare metal state, the surface temperature of the main control wafer is 65 ° C, so it is clear that the prior art is The heat sink fin group and the heat sink patch of the present invention can assist the heat dissipation of the main control chip to lower the surface temperature thereof, and the heat sink patch of the present invention can achieve the same heat dissipation or better function as the heat dissipation fin group of the prior art; Further, this creation The total thickness of the heat patch is 1.5mm, and the thickness of the heat sink fin group is 15mm. The thickness of the heat sink patch of the present invention is much smaller than the thickness of the heat sink fin group of the prior art, and it can be known that the creation can reach The heat sink fin group has the same heat dissipation effect, and the thickness of the creation is thinner than the heat sink fin, and does not occupy space.

In summary, the advantage of the present invention is that the overall thickness is thin and the volume is small, and the space is not occupied; at the same time, the heat dissipation layer 20 is disposed on the top surface and the bottom surface of the heat conductive layer 10 respectively. The adhesive layer 30 is formed, and the adhesive layer 30 is made of a heat conductive material, so that the present invention can have the functions of heat conduction and heat dissipation in use, and the raw materials required for the production are less and the steps are required. It is relatively simple, which reduces manufacturing costs and achieves economic benefits.

On the other hand, the heat dissipation layer 20 contains nano carbon spheres, which are polyhedral carbon clusters composed of a multi-layered graphite layer and a spherical ball structure, such a structure that enables nano carbon spheres (CNCs). It has better thermal conductivity, which in turn can improve the heat conduction and heat dissipation properties of the heat dissipation layer 20 of the present invention.

On the other hand, due to the structure of the nanocarbon sphere, the nano carbon sphere further has good electrical conductivity, and has better electromagnetic shielding characteristics, the heat dissipation layer 20 of the present invention also has the effect of electromagnetic shielding; When the present invention is disposed on the electronic device 50, the electromagnetic waves generated by the electronic device 50 can be reduced to be outwardly diverged.

On the other hand, the heat dissipation layer 20 containing the nano carbon spheres is formed by uniformly mixing the carbon spheres with a polymer material such as polymethylmethacrylate (PMMA) and forming a block. After the material is finished, the block is ground and sieved to form particles having relatively uniform particle diameter, and then formed by electrostatic coating.

In addition, since the overall thickness of the creation is thin, it can be easily cut and flexible, and can be cut to an appropriate size or bent after being used as needed.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way. Although the present invention has been disclosed above in the preferred embodiments, it is not intended to limit the present invention, and any technology that is familiar with the present technology. A person skilled in the art can make some modifications or modifications to the equivalent embodiments by using the technical content disclosed above without departing from the spirit and scope of the present invention. Technical simplifications Any simple modifications, equivalent changes and modifications made to the above embodiments are still within the scope of the present invention.

10‧‧‧thermal layer

20‧‧‧heat layer

30‧‧‧Adhesive layer

30a‧‧‧Adhesive layer

31a‧‧‧Substrate

32a‧‧‧Top adhesive layer

33a‧‧‧ bottom adhesive layer

40‧‧‧ release layer

50‧‧‧Electronic module

51‧‧‧heat source

60‧‧‧Fixing fin group

70‧‧‧ cooling fan

80‧‧‧Electronic devices

81‧‧‧heat source

1 is a schematic structural view of a preferred embodiment of the present invention.

2 is a schematic structural view of another preferred embodiment of the present invention.

Figure 3 is a schematic illustration of the use of the preferred embodiment of the present invention.

Figure 4 is a schematic cross-sectional view showing the use of a preferred embodiment of the present invention.

Figure 5 is a partially enlarged schematic view showing the use of the preferred embodiment of the present invention.

Figure 6 is a schematic view showing the use of the prior art.

10‧‧‧thermal layer

20‧‧‧heat layer

30‧‧‧Adhesive layer

40‧‧‧ release layer

Claims (10)

A heat sink structure of a nano carbon sphere, comprising: a heat conducting layer; a heat dissipating layer disposed on a top surface of the heat conducting layer, wherein the heat sink layer comprises carbon nanocapsules (CNCs); The layer is attached to the bottom surface of the heat conductive layer. The heat-dissipating patch structure of the nanocarbon ball according to claim 1, wherein the adhesive layer comprises a substrate, a top adhesive layer and a bottom adhesive layer, and the top adhesive layer of the adhesive layer is attached to the substrate Between the heat conducting layer and the heat conductive layer, the bottom adhesive layer is attached to the bottom surface of the substrate. The heat-dissipating patch structure of the nanocarbon ball according to claim 1, further comprising a release layer disposed on the bottom surface of the adhesive layer. The heat-dissipating patch structure of the nanocarbon ball according to claim 2, further comprising a release layer disposed on a bottom surface of the bottom adhesive layer of the adhesive layer. The heat-dissipating patch structure of the nanocarbon ball according to any one of claims 1 to 4, wherein the heat conductive layer has a thickness of 50 ± 20 μm . The heat-dissipating patch structure of the nanocarbon ball according to any one of claims 1 to 4, wherein the heat dissipation layer has a thickness of 50 ± 5 μm . The requested item 5 nm of said patch radiating structure of the carbon spheres, wherein a thickness of the heat dissipation layer is 50 ± 5 μ m. The heat-dissipating patch structure of the nanocarbon ball according to any one of claims 1 to 4, wherein the thickness of the adhesive layer is 50 ± 5 μm . The heat-dissipating patch structure of the nanocarbon ball according to claim 7, wherein the thickness of the adhesive layer is 50±5 μm . The heat-dissipating patch structure of the nanocarbon ball according to any one of claims 1 to 4, wherein the heat conductive layer is made of a copper foil.