TWI816975B - Firing jig - Google Patents

Firing jig Download PDF

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TWI816975B
TWI816975B TW109104493A TW109104493A TWI816975B TW I816975 B TWI816975 B TW I816975B TW 109104493 A TW109104493 A TW 109104493A TW 109104493 A TW109104493 A TW 109104493A TW I816975 B TWI816975 B TW I816975B
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layer
base material
materials
main component
firing jig
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TW202043176A (en
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古宮山常夫
松葉浩臣
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日商日本碍子股份有限公司
日商Ngk阿德列克股份有限公司
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27DDETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D3/00Charging; Discharging; Manipulation of charge
    • F27D3/12Travelling or movable supports or containers for the charge
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/64Burning or sintering processes
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81Coating or impregnation
    • C04B41/89Coating or impregnation for obtaining at least two superposed coatings having different compositions
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27DDETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D5/00Supports, screens, or the like for the charge within the furnace
    • F27D5/0006Composite supporting structures
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Furnace Charging Or Discharging (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

本發明的課題係提供一種燒成夾具,其與電子元件材料、鋰電池的活性物質材料之反應性低。本發明的解決手段係一種燒成夾具,其具備SiC質或Si-SiC質之基材、與被覆基材的表面之覆蓋層。覆蓋層具備:第一層,其被設置在基材表面且將Al2 O3 -SiO2 質作為主成分;與第二層,其在覆蓋層的表層露出。第二層在電子元件材料用中係將選自Y2 O3 、HfO2 、CeO2 、NiO、WC、Ni、Mo之至少一種作為主成分,而在鋰電池的活性物質材料用中係將選自Y2 O3 、HfO2 、CeO2 、NiO之至少一種作為主成分。An object of the present invention is to provide a firing jig that has low reactivity with electronic component materials and active material materials of lithium batteries. The solution of the present invention is a firing jig, which has a SiC or Si-SiC base material and a coating layer covering the surface of the base material. The coating layer includes a first layer that is provided on the surface of the base material and contains Al 2 O 3 —SiO 2 as a main component, and a second layer that is exposed on the surface of the coating layer. When used as an electronic component material, the second layer contains at least one selected from Y 2 O 3 , HfO 2 , CeO 2 , NiO, WC, Ni, and Mo as the main component. When used as an active material material for lithium batteries, the second layer contains At least one selected from Y 2 O 3 , HfO 2 , CeO 2 and NiO is used as the main component.

Description

燒成夾具Firing jig

本說明書揭示關於燒成夾具的技術。尤其,揭示關於在電子元件材料的燒成、或能用於鋰電池的活性物質材料的燒成所使用之燒成夾具的技術。This specification discloses techniques for firing jigs. In particular, a technology related to a firing jig used for firing electronic component materials or firing active material materials that can be used in lithium batteries is disclosed.

專利文獻1中揭示一種燒成夾具,其作為電子元件用陶瓷的燒成夾具,在SiC質基板(第一層)的表面形成Al2 O3 -SiO2 質的第二層,在第二層的表面形成8Y-ZrO2 (8wt%Y2 O3 -ZrO2 )的第三層。第三層係被設置用於防止被燒成物(電子元件用陶瓷)與燒成夾具進行反應。又,第二層係被設置用於防止第三層從SiC質基板(第一層)剝離。更具體而言,第二層係防止通過第三層的氧到達SiC質基板,而抑制SiC質基板的表面氧化。此外,若SiC質基板的表面氧化,則第三層會從燒成夾具剝離。又,專利文獻1中,作為第二層所能使用的材料,除了Al2 O3 -SiO2 質以外,更列舉出Al2 O3 、Al2 O3 -SiO2 -MgO質、MgO-Al2 O3 -ZrO2 質。又,作為第三層所能使用的材料,除了8Y-ZrO2 質以外,更列舉出Al2 O3 、富鋁紅柱石、ZrO2 、Y2 O。 [先前技術文獻] [專利文獻]Patent Document 1 discloses a firing jig as a firing jig for ceramics for electronic components. A second layer of Al 2 O 3 -SiO 2 is formed on the surface of a SiC substrate (first layer). The third layer of 8Y-ZrO 2 (8wt%Y 2 O 3 -ZrO 2 ) is formed on the surface. The third layer is provided to prevent the object to be fired (ceramics for electronic components) from reacting with the firing jig. Furthermore, the second layer is provided to prevent the third layer from peeling off from the SiC substrate (first layer). More specifically, the second layer prevents oxygen passing through the third layer from reaching the SiC substrate, thereby suppressing surface oxidation of the SiC substrate. In addition, if the surface of the SiC substrate is oxidized, the third layer will be peeled off from the firing jig. Furthermore, Patent Document 1 lists Al 2 O 3 , Al 2 O 3 -SiO 2 -MgO, and MgO - Al as materials that can be used for the second layer in addition to Al 2 O 3 -SiO 2. 2 O 3 -ZrO 2 quality. In addition, in addition to 8Y-ZrO 2 , materials that can be used for the third layer include Al 2 O 3 , mullite, ZrO 2 , and Y 2 O. [Prior art documents] [Patent documents]

[專利文獻1]日本特開2003-306392號公報[Patent Document 1] Japanese Patent Application Publication No. 2003-306392

[發明所欲解決的課題][Problem to be solved by the invention]

一般而言,ZrO2 已知為反應性低的材料(難反應性材料)。因此,只要將ZrO2 形成在燒成夾具的最表層(頂塗層),則可一定程度地抑制電子元件(或電子元件的原料)與燒成夾具的構成材料進行反應。專利文獻1亦以ZrO2 為首,使用上述的第三層(頂塗層)的材料,藉此抑制電子元件與燒成夾具的反應,並在此前提之下,針對第三層從燒成夾具剝離一事思考對策。然而,即使將上述的材料使用作為頂塗層,亦無法完全地防止電子元件材料(電子元件及其原料)與燒成夾具進行反應。因此,為了提高電子元件材料的製造產率,而正要求進一步使與電子元件等的反應性降低之燒成夾具。本說明書之目的在於提供一種新穎的燒成夾具,其與電子元件等(電子元件材料、鋰電池的活性物質材料)的反應性更低。 [用於解決課題的手段]In general, ZrO2 is known as a material with low reactivity (hardly reactive material). Therefore, as long as ZrO 2 is formed on the outermost surface layer (top coat layer) of the firing jig, the reaction between electronic components (or raw materials for electronic components) and the constituent materials of the firing jig can be suppressed to a certain extent. Patent Document 1 also uses ZrO 2 and other materials for the third layer (top coating) to suppress the reaction between the electronic components and the firing jig. On this premise, the third layer is removed from the firing jig. Think about countermeasures when it comes to stripping. However, even if the above-mentioned materials are used as the top coating, it is not possible to completely prevent the electronic component materials (electronic components and their raw materials) from reacting with the firing jig. Therefore, in order to improve the manufacturing yield of electronic component materials, there is a demand for a firing jig that further reduces reactivity with electronic components and the like. The purpose of this specification is to provide a novel firing jig that has lower reactivity with electronic components (electronic component materials, active material materials of lithium batteries). [Means used to solve problems]

本說明書所開示之燒成夾具的一形態係用於電子元件材料的燒成。此燒成夾具可具備SiC質或Si-SiC質之基材、與被覆基材的表面之覆蓋層。又,覆蓋層可具備:第一層,其被設置在基材表面且將Al2 O3 -SiO2 質作為主成分;與第二層,其在覆蓋層的表層露出,且將選自Y2 O3 、HfO2 、CeO2 、NiO、WC、Ni、Mo之至少一種作為主成分。One form of the firing jig disclosed in this specification is used for firing electronic component materials. The firing jig may have a SiC or Si-SiC base material and a covering layer covering the surface of the base material. Moreover, the coating layer may include: a first layer provided on the surface of the base material and containing Al 2 O 3 -SiO 2 as a main component; and a second layer exposed on the surface of the coating layer and selected from Y At least one of 2 O 3 , HfO 2 , CeO 2 , NiO, WC, Ni, and Mo serves as the main component.

本說明書所開示之燒成夾具的另一形態係用於鋰電池的活性物質材料的燒成。此燒成夾具可具備SiC質或Si-SiC質之基材、與被覆基材的表面之覆蓋層。又,覆蓋層可具備:第一層,其被設置在基材表面且將Al2 O3 -SiO2 質作為主成分;與第二層,其在覆蓋層的表層露出,且將選自Y2 O3 、HfO2 、CeO2 、NiO之至少一種作為主成分。Another form of the firing jig disclosed in this specification is used for firing active materials of lithium batteries. The firing jig may have a SiC or Si-SiC base material and a covering layer covering the surface of the base material. Moreover, the coating layer may include: a first layer provided on the surface of the base material and containing Al 2 O 3 -SiO 2 as a main component; and a second layer exposed on the surface of the coating layer and selected from Y At least one of 2 O 3 , HfO 2 , CeO 2 and NiO serves as the main component.

(燒成夾具) 本說明書中開示一種燒成夾具,其係用於燒成例如將鈦酸鋇(BaTiO3 )作為主成分的陶瓷電容器、及該陶瓷電容器的原料等電子元件材料。又,在本說明書中,亦開示一種燒成夾具,其係用於燒成例如將鈷酸鋰(LiCoO2 )作為主成分的鋰電池的活性材料、及該活性材料的原料等活性物質材料。兩者的燒成夾具可具有共通特徵,該共通特徵係所謂具備SiC質或Si-SiC質之基材、與被覆基材的表面之覆蓋層。作為基材的厚度,可為0.4~5mm。若為此範圍,則控制基材的熱容量,而可效率佳地燒成電子元件材料或鋰電池的活性物質材料。又,在兩者的燒成夾具中,覆蓋層可具有共通特徵,該共通特徵係所謂具備:第一層,其被設置在基材表面,且將Al2 O3 -SiO2 質作為主成分;與第二層,其在覆蓋層的表層露出。在電子元件材料中,第二層可將選自Y2 O3 、HfO2 、CeO2 、NiO、WC、Ni、Mo之至少一種作為主成分。又,在活性物質材料中,第二層可將選自Y2 O3 、HfO2 、CeO2 、NiO之至少一種作為主成分。(Firing Jig) This specification discloses a firing jig used for firing electronic component materials such as ceramic capacitors containing barium titanate (BaTiO 3 ) as a main component and raw materials of the ceramic capacitors. Furthermore, this specification also discloses a firing jig for firing active material materials such as active materials of lithium batteries containing lithium cobalt oxide (LiCoO 2 ) as a main component and raw materials of the active materials. Both firing jigs may have a common feature, which is a so-called base material made of SiC or Si-SiC, and a coating layer covering the surface of the base material. The thickness of the base material can be 0.4 to 5 mm. If it is within this range, the heat capacity of the base material can be controlled, and electronic component materials or active material materials of lithium batteries can be fired efficiently. In addition, in both firing jigs, the coating layer may have a common feature, which is that it includes a first layer that is provided on the surface of the base material and contains Al 2 O 3 -SiO 2 as a main component. ; and a second layer, which is exposed on the surface of the covering layer. In the electronic component material, the second layer may have at least one selected from the group consisting of Y 2 O 3 , HfO 2 , CeO 2 , NiO, WC, Ni, and Mo as a main component. Furthermore, among the active material materials, the second layer may contain at least one selected from the group consisting of Y 2 O 3 , HfO 2 , CeO 2 and NiO as a main component.

此外,所謂「電子元件材料」,例如,不僅包含陶瓷電容器等電子元件成形體,亦包含用於形成該成形體的原料(中間體)。同樣地,所謂活性物質材料」,不僅包含鋰電池的活性材料本身,亦包含用於形成活性材料的原料(中間體)。又,所謂第一層係「將Al2 O3 -SiO2 質作為主成分」,意指Al2 O3 -SiO2 質佔構成第一層的原料(化合物)的50質量%以上。例如,第一層除了Al2 O3 -SiO2 質以外,有時包含小於50質量%的Al2 O3 質。此外,第一層可將Al2 O3 -SiO2 質包含70質量%以上,亦可包含80質量%以上,亦可包含90質量%以上,亦可僅由Al2 O3 -SiO2 質(有時包含不可避免的不純物)所構成。In addition, "electronic component materials" include, for example, not only electronic component molded bodies such as ceramic capacitors, but also raw materials (intermediates) used to form the molded bodies. Similarly, the so-called "active material" includes not only the active material of the lithium battery itself, but also the raw materials (intermediates) used to form the active material. Furthermore, the term "the first layer contains Al 2 O 3 -SiO 2 as a main component" means that the Al 2 O 3 -SiO 2 substance accounts for more than 50% by mass of the raw materials (compounds) constituting the first layer. For example, the first layer may contain less than 50% by mass of Al 2 O 3 material in addition to Al 2 O 3 -SiO 2 material. In addition, the first layer may contain 70% by mass or more of Al 2 O 3 -SiO 2 , may contain 80% by mass or more, may contain 90% by mass or more, or may contain only Al 2 O 3 -SiO 2 ( sometimes contain unavoidable impurities).

同樣地,所謂第二層的「主成分」,意指佔構成第二層的原料(化合物)的50質量%以上的原料(成分)。例如,在第二層係將Y2 O3 作為主成分之情形,Y2 O3 的質量為第二層的全部質量的50%以上。又,在第二層係將Y2 O3 與HfO2 作為主成分之情形,Y2 O3 與HfO2 的合計質量為第二層的全部質量的50%以上。此外,較佳為,第二層在電子元件材料中係將Y2 O3 、HfO2 、CeO2 、NiO、WC、Ni、Mo之任一者作為主成分,而在活性物質材料中係將Y2 O3 、HfO2 、CeO2 、NiO之任一者作為主成分。第二層可將上述原料(化合物)單獨或組合地包含60質量%以上,亦可包含70質量%以上,亦可包含80質量%以上,亦可包含90質量%以上,亦可實質上僅由上述原料(有時包含不可避免的不純物)所構成。Similarly, the "main component" of the second layer means a raw material (component) accounting for more than 50% by mass of the raw material (compound) constituting the second layer. For example, when the second layer contains Y 2 O 3 as the main component, the mass of Y 2 O 3 is 50% or more of the total mass of the second layer. Furthermore, when the second layer contains Y 2 O 3 and HfO 2 as main components, the total mass of Y 2 O 3 and HfO 2 is 50% or more of the total mass of the second layer. In addition, it is preferable that the second layer contains any one of Y 2 O 3 , HfO 2 , CeO 2 , NiO, WC, Ni, and Mo as a main component in the electronic component material, and the active material material preferably contains Any one of Y 2 O 3 , HfO 2 , CeO 2 and NiO serves as the main component. The second layer may contain the above-mentioned raw materials (compounds) individually or in combination at 60 mass% or more, 70 mass% or more, 80 mass% or more, 90 mass% or more, or it may consist essentially of only It is composed of the above raw materials (sometimes including unavoidable impurities).

上述的燒成夾具,其第二層(頂塗層)的材料係不同於以往所使用者。作為電子元件材料用的第二層而舉出的材料,係對於一般的電子元件材料所使用的鈦酸鋇(BaTiO3 ),計算在高溫環境中之多成分系統的熱力學平衡狀態(模擬)而獲得反應性低的結果之材料。此外,以往被使用作為頂塗層的Al2 O3 ,ZrO2 等,對於BaTiO3 ,在多成分系統的熱力學平衡狀態的計算中,獲得在高溫環境下容易生成反應生成物的結果。又,作為活性物質材料用的第二層而舉出的材料,係在作為電子元件材料用的第二層而舉出的材料(Y2 O3 、HfO2 、CeO2 、NiO、WC、Ni、Mo)之中,針對氧化物(Y2 O3 、HfO2 、CeO2 、NiO)實際地製作樣本並進行實驗,而對於一般的活性物質材料所使用的鈷酸鋰(LiCoO2 )獲得良好結果的材料。The material of the second layer (top coating) of the above-mentioned firing jig is different from those used in the past. The material cited as the second layer for electronic component materials is calculated by calculating the thermodynamic equilibrium state (simulation) of a multi-component system in a high-temperature environment for barium titanate (BaTiO 3 ), which is commonly used as a material for electronic components. Materials for obtaining low reactivity results. In addition, while Al 2 O 3 , ZrO 2 , etc., which have been conventionally used as top coats, BaTiO 3 has been found to easily generate reaction products in a high-temperature environment when calculating the thermodynamic equilibrium state of a multi-component system. In addition, the materials cited as the second layer for active material materials are the materials cited as the second layer for electronic component materials (Y 2 O 3 , HfO 2 , CeO 2 , NiO, WC, Ni , Mo), we actually made samples and conducted experiments on oxides (Y 2 O 3 , HfO 2 , CeO 2 , NiO), and obtained good results for lithium cobalt oxide (LiCoO 2 ) used as general active material materials. Result material.

作為第二層而舉出的材料,相較於以往被使用作為頂塗層的材料,其材料本身對於BaTiO3 及LiCoO2 的反應性低。如上述,以往的燒成夾具若使用Al2 O3 、ZrO2 等作為頂塗層,則可抑制被燒成物與燒成夾具的反應,並在此前提之下,發展覆蓋層的耐久性的改善。然而,即使改善覆蓋層的耐久性,若被燒成物與覆蓋層(頂塗層)進行反應,則被燒成物的製造產率亦不會提升。在著重於降低頂塗層本身對於被燒成物(電子元件材料)的反應性的點而言,上述的燒成夾具係利用與以往完全不同的技術思想而實現。The material cited as the second layer has lower reactivity with BaTiO 3 and LiCoO 2 than the materials used as the top coat in the past. As mentioned above, if Al 2 O 3 , ZrO 2 , etc. are used as the top coating of conventional firing jigs, the reaction between the object to be fired and the firing jigs can be suppressed, and on this premise, the durability of the covering layer can be improved. improvement. However, even if the durability of the coating layer is improved, if the object to be fired reacts with the covering layer (top coat), the production yield of the object to be fired will not be improved. In order to focus on reducing the reactivity of the top coating itself with respect to the object to be fired (electronic component material), the above-mentioned firing jig is realized using a completely different technical idea from the conventional ones.

在電子元件材料用的燒成夾具中,第二層可將選自Y2 O3 、HfO2 、CeO2 、NiO之至少一種作為主成分。此等材料因係氧化物故化學性穩定,且容易處理。又,如上述,此等材料在實驗中確認到對於LiCoO2 獲得良好結果(反應性低)。可將電子元件材料用的燒成夾具直接兼用作為電子元件用的燒成夾具。In the firing jig for electronic component materials, the second layer may have at least one selected from the group consisting of Y 2 O 3 , HfO 2 , CeO 2 and NiO as a main component. Because these materials are oxides, they are chemically stable and easy to handle. In addition, as mentioned above, these materials have been experimentally confirmed to obtain good results (low reactivity) with LiCoO 2 . The firing jig for electronic component materials can be directly used as a firing jig for electronic components.

在上述燒成夾具中,可以第一層的熱膨脹係數為基材的熱膨脹係數以上且第二層的熱膨脹係數成為第一層的熱膨脹係數以上之方式,選擇基材、第一層及第二層的材料。上述燒成夾具所使用的基材(SiC質、Si-SiC質),其熱膨脹係數為約4(ppm/k)。相對於此,上述作為第二層而舉出的材料,其熱膨脹係數皆為4(ppm/k)以上。藉由將第一層的熱膨脹係數設為基材的熱膨脹係數以上且將第二層的熱膨脹係數設為第一層的熱膨脹係數以上,而緩和基材與第二層的熱膨脹係數差,可抑制覆蓋層從基材剝離。In the above-mentioned firing jig, the base material, the first layer, and the second layer may be selected so that the thermal expansion coefficient of the first layer is equal to or greater than the thermal expansion coefficient of the base material, and the thermal expansion coefficient of the second layer is equal to or greater than the thermal expansion coefficient of the first layer. s material. The thermal expansion coefficient of the base material (SiC or Si-SiC) used in the above-mentioned firing jig is approximately 4 (ppm/k). On the other hand, the thermal expansion coefficients of the materials cited as the second layer are all 4 (ppm/k) or more. By setting the thermal expansion coefficient of the first layer to be equal to or greater than the thermal expansion coefficient of the base material, and setting the thermal expansion coefficient of the second layer to be equal to or greater than the thermal expansion coefficient of the first layer, the difference in thermal expansion coefficient between the base material and the second layer can be alleviated, thereby suppressing The cover layer peels off the substrate.

在上述燒成夾具中,在第一層與第二層之間,可設置有將Al2 O3 質作為主成分的第三層。此外,所謂「第三層係將Al2 O3 質作為主成分」,意指第三層包含50質量%以上的Al2 O3 質。藉由設置第三層,可更堅強穩固地接合第一層與第二層,且可抑制第一層與第二層的剝離。又,亦可抑制第一層(或基材)的構成元素與第二層的構成元素互相地擴散。第三層的厚度可為10~200μm,亦可為覆蓋層整體厚度的50%以下。此外,第三層可將Al2 O3 質包含60質量%以上,亦可包含70質量%以上,亦可包含80質量%以上,亦可包含90質量%以上,亦可實質上僅由Al2 O3 質所構成。又,在第一層與第二層直接相接之情形(亦即,未設置有第三層之情形),在第一層與第二層之間亦可設置有兩者的組成逐漸變化的傾斜層。同樣地,在第一層與第二層之間設置有第三層之情形,在第一層與第三層、及/或、第三層與第二層之間亦可設置有傾斜層。又,在第一層與第二層之間亦可設置有複數的層。In the above-mentioned firing jig, a third layer containing Al 2 O 3 as a main component may be provided between the first layer and the second layer. In addition, "the third layer contains Al 2 O 3 as a main component" means that the third layer contains 50 mass % or more of Al 2 O 3 . By providing the third layer, the first layer and the second layer can be joined more strongly and firmly, and peeling of the first layer and the second layer can be suppressed. In addition, mutual diffusion of the constituent elements of the first layer (or base material) and the second layer can also be suppressed. The thickness of the third layer can be 10 to 200 μm, or less than 50% of the overall thickness of the covering layer. In addition, the third layer may contain Al 2 O 3 in an amount of 60 mass % or more, 70 mass % or more, 80 mass % or more, 90 mass % or more, or it may consist essentially of only Al 2 O 3 . Made of O 3 matter. In addition, when the first layer and the second layer are directly connected (that is, when the third layer is not provided), a structure whose composition gradually changes between the first layer and the second layer can also be provided. Inclined layer. Similarly, when a third layer is provided between the first layer and the second layer, an inclined layer may also be provided between the first layer and the third layer, and/or between the third layer and the second layer. Furthermore, a plurality of layers may be provided between the first layer and the second layer.

在上述燒成夾具中,在第二層內可存在複數個扁平粒,該複數個扁平粒係構成第二層的粒子經熔融凝固而成。扁平粒可為構成第二層的粒子在燒成(燒結)第二層之際經熔融凝固而成者。扁平粒可積層在基材、第一層及第二層積層的方向。亦即,扁平粒可積層在覆蓋層的厚度方向。此外,扁平粒的積層數只要為2以上,則無特別限制。藉由在第二層內存在扁平粒,而緩和基材與第二層的熱膨脹差,可抑制第二層的剝離。如上述,構成第二層的材料的熱膨脹係數有時為基材(SiC質、Si-SiC質)的熱膨脹係數以上。該情形,若加熱燒成夾具,則基材會對第二層施加壓縮力,或者第二層會對基材施加拉伸力。只要在第二層內積層扁平粒,則在加熱之際緩和施加在第二層(第二層所施加)的力,進而抑制起因於熱膨脹係數差之覆蓋層的剝離。In the above-mentioned firing jig, a plurality of flat particles may be present in the second layer, and the plurality of flat particles are formed by melting and solidifying the particles constituting the second layer. The flat particles may be obtained by melting and solidifying the particles constituting the second layer when the second layer is fired (sintered). The flat particles can be laminated in the direction in which the base material, the first layer and the second layer are laminated. That is, the flat particles can be stacked in the thickness direction of the covering layer. In addition, the number of laminates of flat particles is not particularly limited as long as it is 2 or more. By the presence of flat particles in the second layer, the difference in thermal expansion between the base material and the second layer is alleviated, thereby suppressing peeling of the second layer. As described above, the thermal expansion coefficient of the material constituting the second layer may be greater than or equal to the thermal expansion coefficient of the base material (SiC or Si-SiC). In this case, when the jig is heated and fired, the base material exerts a compressive force on the second layer, or the second layer exerts a tensile force on the base material. If the flat particles are laminated in the second layer, the force exerted on the second layer (applied by the second layer) during heating is relaxed, thereby suppressing the peeling of the coating layer due to the difference in thermal expansion coefficient.

此外,扁平粒的扁平率((短邊方向長度/長邊方向長度)×100)可為95%以下。又,只要扁平粒的扁平率為95%以下,則確保扁平粒本身的強度,結果確保第二層的強度。此外,扁平粒可為平坦形狀,亦可為彎曲形狀。尤其,在扁平粒為彎曲形狀之情形,容易獲得緩和基材與第二層的熱膨脹差之效果。扁平粒可全面存在於第二層,亦可部分地存在。即使在扁平粒部分地存在於第二層內之情形,亦可獲得上述的熱膨脹差的緩和效果。此外,扁平粒的扁平率可由覆蓋層的剖面的SEM影像(例如1000倍)而測定粒子的縱(長邊方向)橫(短邊方向)的長度,並藉由上述計算式而算出。In addition, the flattening ratio ((short side direction length/long side direction length)×100) of the flat particles may be 95% or less. Furthermore, as long as the flatness ratio of the flat particles is 95% or less, the strength of the flat particles themselves is ensured, and as a result, the strength of the second layer is ensured. In addition, the flat particles may have a flat shape or a curved shape. In particular, when the flat particles have a curved shape, the effect of alleviating the difference in thermal expansion between the base material and the second layer can be easily obtained. Flat grains can exist entirely in the second layer or partially. Even in the case where the flat particles are partially present in the second layer, the above-mentioned alleviation effect of the thermal expansion difference can be obtained. In addition, the flatness ratio of the flat particles can be calculated by measuring the longitudinal (long side direction) and transverse (short side direction) lengths of the particles from an SEM image of the cross section of the coating layer (for example, 1000 times), and using the above calculation formula.

在上述燒成夾具中,覆蓋層的厚度可為20~600μm。又,第一層的厚度可比第二層的厚度厚。具體而言,第一層的厚度可為50~500μm,第二層的厚度可為5~500μm。只要第一層的厚度為50μm以上,則可抑制與被燒成物的反應,且同時維持覆蓋層的強度,可更加地抑制覆蓋層的剝離。只要第一層的厚度為500μm以下,則可抑制與被燒成物的反應,且同時覆蓋層的強度更穩定,可進一步抑制覆蓋層的剝離。只要第二層的厚度為5μm以上,則在基板的整面確實地形成第二層,可充分地抑制被燒成物與燒成夾具進行反應。只要第二層的厚度為500μm以下,則抑制第二層本身進行層間剝離,結果可抑制第二層從基材(第一層)剝離。此外,第二層的厚度可為10μm以上,亦可為50μm以上。又,第二層的厚度可為200μm以下,亦可為150μm以下,亦可為100μm以下。此外,第二層係在覆蓋層的表層露出的層,亦可為所謂的頂塗層。In the above-mentioned firing jig, the thickness of the covering layer may be 20 to 600 μm. Also, the first layer may be thicker than the second layer. Specifically, the thickness of the first layer may be 50-500 μm, and the thickness of the second layer may be 5-500 μm. As long as the thickness of the first layer is 50 μm or more, the reaction with the object to be fired can be suppressed, and the strength of the coating layer can be maintained, thereby further suppressing peeling of the coating layer. As long as the thickness of the first layer is 500 μm or less, the reaction with the object to be fired can be suppressed, and at the same time, the strength of the coating layer is more stable, and the peeling of the coating layer can be further suppressed. As long as the thickness of the second layer is 5 μm or more, the second layer is reliably formed on the entire surface of the substrate, and the reaction between the object to be fired and the firing jig can be sufficiently suppressed. As long as the thickness of the second layer is 500 μm or less, the second layer itself is suppressed from delaminating, and as a result, the second layer is suppressed from being delaminated from the base material (first layer). In addition, the thickness of the second layer may be 10 μm or more, or may be 50 μm or more. Moreover, the thickness of the second layer may be 200 μm or less, 150 μm or less, or 100 μm or less. In addition, the second layer is a layer exposed on the surface of the covering layer, and may also be a so-called top coat layer.

在上述燒成夾具中,覆蓋層(第一層、第二層)的空隙率(氣孔率)可為10~60體積%。只要空隙率為10體積%以上,則可抑制與被燒成物的反應,且同時覆蓋層的強度更穩定,可進一步抑制覆蓋層的剝離。只要空隙率為60體積%以下,則可抑制與被燒成物的反應,且同時維持覆蓋層的強度,可更加地抑制覆蓋層的剝離。又,覆蓋層的導熱率可為2~250W/(m・k)。只要覆蓋層的導熱率為2~250W/(m・k),則在燒成被燒成物之際,可使被燒成物的面內溫度均勻。更佳為,覆蓋層的導熱率為3~30W/(m・k)。此外,空隙率(氣孔率)可將覆蓋層的剖面的SEM影像(例如1000倍)進行修整(trimming)而製作各層(第一層、第二層等)獨自的影像,使用影像處理軟體(ImageNos version 1.04:免費軟體),藉由二值化而區別空隙與其以外的部分,並藉由計算空隙相對於整體的面積比而算出。In the above-mentioned firing jig, the void ratio (porosity) of the covering layer (first layer, second layer) may be 10 to 60 volume %. As long as the void ratio is 10% by volume or more, the reaction with the object to be fired can be suppressed, and at the same time, the strength of the coating layer is more stable, and the peeling of the coating layer can be further suppressed. As long as the void ratio is 60 volume % or less, the reaction with the object to be fired can be suppressed, and the strength of the coating layer can be maintained, thereby further suppressing the peeling of the coating layer. In addition, the thermal conductivity of the covering layer may be 2 to 250W/(m·k). As long as the thermal conductivity of the coating layer is 2 to 250W/(m·k), when the object is fired, the temperature within the surface of the object can be made uniform. More preferably, the thermal conductivity of the covering layer is 3 to 30 W/(m·k). In addition, the porosity (porosity) can be used to trim the SEM image of the cross-section of the covering layer (for example, 1000 times) to create a unique image of each layer (first layer, second layer, etc.), using image processing software (ImageNos version 1.04: free software), which distinguishes gaps from other parts by binarization, and calculates the area ratio of the gaps relative to the whole.

(電子元件材料用的燒成夾具) 如上述,在用於燒成電子元件材料的燒成夾具中,第二層可將選自Y2 O3 、HfO2 、CeO2 、NiO、WC、Ni、Mo之至少一種作為主成分。如圖1所示,Y2 O3 、HfO2 、CeO2 、NiO、WC、Ni、Mo在利用熱力學平衡計算軟體(FactSage:GTT-Technologies,Thermfact Ltd.製)之對於BaTiO3 的熱力學平衡狀態的計算中,確認到不與BaTiO3 進行反應(不形成反應生成物)。相對於此,以往被認為作為第二層(頂塗層)是有用的ZrO2 、Al2 O3 、TiO2 ,被確認到會與BaTiO3 進行反應而生成反應生成物(Ba化合物)。此外,如圖1所示,HfO2 雖不與BaTiO3 進行反應,但Hf被確認到會與BaTiO3 進行反應並生成反應生成物(BaHfO3 )。亦即,確認到並非是包含Y、Hf、Ce、Ni等元素的化合物(或者單體)不與BaTiO3 進行反應,而是因係上述的氧化物的形態(HfO2 、Y2 O3 、CeO2 、NiO)才不會與BaTiO3 進行反應。(Firing jig for electronic component materials) As mentioned above, in the sintering jig for firing electronic component materials, the second layer can be selected from the group consisting of Y 2 O 3 , HfO 2 , CeO 2 , NiO, WC, Ni , at least one of them is used as the main component. As shown in Figure 1, the thermodynamic equilibrium state of Y 2 O 3 , HfO 2 , CeO 2 , NiO, WC, Ni, and Mo for BaTiO 3 using thermodynamic equilibrium calculation software (FactSage: GTT-Technologies, manufactured by Thermfact Ltd.) In the calculation, it was confirmed that it does not react with BaTiO 3 (no reaction product is formed). On the other hand, ZrO 2 , Al 2 O 3 , and TiO 2 , which have been conventionally considered useful as the second layer (top coat layer), have been confirmed to react with BaTiO 3 to produce a reaction product (Ba compound). In addition, as shown in Figure 1, although HfO 2 does not react with BaTiO 3 , it was confirmed that Hf reacts with BaTiO 3 to produce a reaction product (BaHfO 3 ). In other words, it was confirmed that it is not that compounds (or monomers) containing elements such as Y, Hf, Ce, Ni, etc. do not react with BaTiO 3 but that it is due to the form of the above-mentioned oxides (HfO 2 , Y 2 O 3 , CeO 2 , NiO) will not react with BaTiO 3 .

圖1中,針對為基板材料的一例之SiC、為第一層的材料的一例之Al2 O3 ・SiO2 ,亦一併顯示對於BaTiO3 的熱力學平衡狀態的計算結果。SiC、Al2 O3 ・SiO2 被確認到與BaTiO3 進行反應而形成反應生成物。此外,圖1中,亦一併顯示上述的第二層的各材料、SiC、Al2 O3 ・SiO2 的熱膨脹係數。以依照從基材朝向覆蓋層的表面而各層的熱膨脹係數不會變小之方式,亦即,以第一層的熱膨脹係數為基材的熱膨脹係數以上且第二層的熱膨脹係數成為第一層的熱膨脹係數以上之方式,選擇基材、第一層及第二層的材料,藉此可進一步抑制覆蓋層的剝離。 [實施例]Figure 1 also shows the calculation results of the thermodynamic equilibrium state of BaTiO 3 for SiC, which is an example of the substrate material, and Al 2 O 3 ·SiO 2 , which is an example of the first layer material. It was confirmed that SiC, Al 2 O 3 and SiO 2 reacted with BaTiO 3 to form a reaction product. In addition, FIG. 1 also shows the thermal expansion coefficients of each material of the second layer, SiC, and Al 2 O 3 ·SiO 2 . In such a manner that the thermal expansion coefficient of each layer does not become smaller from the base material toward the surface of the covering layer, that is, the thermal expansion coefficient of the first layer is equal to or greater than the thermal expansion coefficient of the base material and the thermal expansion coefficient of the second layer is equal to or greater than the thermal expansion coefficient of the first layer By selecting the materials of the base material, the first layer and the second layer in such a way that the coefficient of thermal expansion is above [Example]

如上述,在電子元件材料用的燒成夾具中,若使用Y2 O3 、HfO2 、CeO2 、NiO、WC、Ni、Mo作為第二層,則可抑制電子元件材料與燒成夾具(第二層)進行反應。以下,製作使用上述材料中之Y2 O3 、HfO2 、CeO2 、NiO而形成第二層(頂塗層)的樣本,評價各樣本對於BaTiO3 及LiCoO2 的特性(樣本1~20)。又,用於比較,亦製作使用ZrO2 形成第二層的樣本(樣本21~24),並一併評價特性。將評價結果揭示於圖2。As mentioned above, in the firing jig for electronic component materials, if Y 2 O 3 , HfO 2 , CeO 2 , NiO, WC, Ni, and Mo are used as the second layer, the electronic component material and the sintering jig ( second layer) to react. Next, samples were prepared to form the second layer (top coat) using Y 2 O 3 , HfO 2 , CeO 2 , and NiO among the above materials, and the characteristics of each sample with respect to BaTiO 3 and LiCoO 2 were evaluated (samples 1 to 20). . For comparison, samples in which the second layer was formed using ZrO 2 (samples 21 to 24) were also produced, and the characteristics were evaluated together. The evaluation results are shown in Figure 2.

首先,說明樣本的製作方法。準備縱橫150×150mm、厚度2mm的Si-SiC板及SiC燒結體板(基板),使用噴霧法在基板表面形成富鋁紅柱石(Al2 O3 -SiO2 質)的第一層。在樣本3、6、13、22、24中,使用SiC燒結體板作為基板,其他樣本係使用Si-SiC板作為基板。又,第一層的厚度,樣本2、3、10、21、22係設為50μm,其他樣本係設為100μm。接著,將各樣本在大氣氣體環境下以1350℃燒成2小時。之後,使用熱噴塗法,在第一層的表面以圖2所示之材料及厚度形成第二層。針對所得的樣本1~24,進行反應試驗與剝離試驗。此外,反應試驗與剝離試驗係使用別的樣本。又,針對樣本5,使用SEM(掃描式電子顯微鏡:日本電子(股)製JSM-5600),以300倍觀察覆蓋層。圖3中顯示SEM照片。First, the preparation method of the sample will be explained. A Si-SiC plate and a SiC sintered body plate (substrate) with a length and width of 150 mm x 150 mm and a thickness of 2 mm are prepared, and the first layer of mullite (Al 2 O 3 -SiO 2 material) is formed on the surface of the substrate using the spray method. In samples 3, 6, 13, 22, and 24, SiC sintered body plates were used as substrates, and other samples used Si-SiC plates as substrates. In addition, the thickness of the first layer was set to 50 μm for samples 2, 3, 10, 21, and 22, and was set to 100 μm for the other samples. Next, each sample was fired at 1350° C. for 2 hours in an atmospheric gas environment. After that, a thermal spraying method is used to form a second layer on the surface of the first layer with the material and thickness shown in Figure 2. A reaction test and a peeling test were performed on the obtained samples 1 to 24. In addition, separate samples were used for the reaction test and peeling test. In addition, regarding sample 5, a SEM (scanning electron microscope: JSM-5600 manufactured by JEOL Ltd.) was used to observe the coating layer at a magnification of 300 times. The SEM photo is shown in Figure 3.

(SEM觀察) 如圖3所示,第二層係由複數個扁平粒所構成,各扁平粒被確認到積層在厚度方向。各扁平粒亦被確認到並非平板狀,而是不規則的彎曲形狀,且在扁平粒間設有間隙。此間隙被認為是緩和第二層(構成第二層的扁平粒)的熱膨脹者。(SEM observation) As shown in FIG. 3 , the second layer is composed of a plurality of flat grains, and it is confirmed that each flat grain is laminated in the thickness direction. It was also confirmed that each flat grain was not flat, but had an irregular curved shape, and gaps were provided between the flat grains. This gap is thought to moderate the thermal expansion of the second layer (the flat grains that make up the second layer).

(反應試驗) 針對各樣本進行反應試驗。反應試驗係針對在樣本表面的中央部分載置10g的被燒成物(BaTiO3 、LiCoO2 )且載置BaTiO3 的樣本,進行35循環的試驗,該試驗係將在大氣氣體環境下以1200℃燒成1小時後冷卻至室溫為止的處理作為1循環。又,針對載置LiCoO2 的樣本,進行35循環的試驗,該試驗係將在大氣氣體環境下以1000℃燒成1小時後冷卻至室溫為止的處理作為1循環。此外,在開始各循環時,將被燒成物(BaTiO3 、LiCoO2 )換新。因此,在反應試驗中,燒成合計350g的被燒成物。(Reaction test) A reaction test is performed on each sample. The reaction test is a 35-cycle test on a sample in which 10 g of the object to be burned (BaTiO 3 , LiCoO 2 ) and BaTiO 3 are placed in the center part of the sample surface. The test is carried out at 1200 in an atmospheric gas environment. The process of baking at ℃ for 1 hour and then cooling to room temperature is regarded as one cycle. In addition, a 35-cycle test was performed on the sample on which LiCoO 2 was mounted. In this test, one cycle was defined as a process of firing at 1000° C. for 1 hour in an atmospheric gas environment and then cooling to room temperature. In addition, at the start of each cycle, the materials to be burned (BaTiO 3 , LiCoO 2 ) are replaced with new ones. Therefore, in the reaction test, a total of 350 g of the burned material was fired.

關於反應試驗後的各樣本,針對被燒成物的構成元素(Ba、Ti、Li、Co)對於樣本的浸透性、覆蓋層的附著性進行評價。浸透性係使用安裝於SEM的EDS(能量分散型X射線分光器),將Ba、Ti、Li、Co元素進行映射(mapping),測定被燒成物的構成元素從覆蓋層的表層浸透的深度並進行評價。顯示從表層的浸透深度愈深,被燒成物愈與樣本(相當於燒成夾具)進行反應。將上述構成元素的浸透深度距離表層10μm以下的樣本設為「A」,將浸透深度距離表層大於10μm且20μm以下的樣本設為「B」,將浸透深度距離表層大於20μm且30μm以下的樣本設為「C」,將浸透深度距離表層大於30μm的樣本設為「D」。評價「A」及「B」表示被燒成物與樣本之反應抑制效果高(尤其,「A」為良好),評價「C」表示反應抑制效果稍差,評價「D」表示反應抑制效果低。將評價結果揭示於圖2。For each sample after the reaction test, the permeability of the sample and the adhesion of the coating layer to the constituent elements (Ba, Ti, Li, Co) of the fired object were evaluated. The permeability system uses an EDS (energy dispersive X-ray spectrometer) installed in the SEM to map Ba, Ti, Li, and Co elements to measure the penetration depth of the constituent elements of the fired object from the surface layer of the coating layer. and evaluate. It shows that the deeper the penetration depth from the surface layer is, the more the fired object reacts with the sample (equivalent to the firing jig). Samples with a penetration depth of 10 μm or less from the surface layer of the above-mentioned constituent elements are designated as "A", samples with a penetration depth of greater than 10 μm and less than 20 μm from the surface layer are designated as "B", and samples with a penetration depth of greater than 20 μm and less than 30 μm from the surface layer are designated as "B". is "C", and samples with a penetration depth greater than 30 μm from the surface layer are set as "D". Evaluations "A" and "B" indicate that the reaction-inhibiting effect between the fired object and the sample is high (especially "A" is good), evaluation "C" indicates that the reaction-inhibiting effect is slightly poor, and evaluation "D" indicates that the reaction-inhibiting effect is low . The evaluation results are shown in Figure 2.

關於附著性,在被燒成物的交換時(1循環結束後),以目視確認覆蓋層有無剝離並進行評價。將在30循環結束後未確認到剝離的樣本設為「A」,將在21~30循環之間確認到剝離的樣本設為「B」,將在11~20循環之間確認到剝離的樣本設為「C」,將在1~10循環之間確認到剝離的樣本設為「D」。將評價結果揭示於圖2。Regarding the adhesion, when the fired objects are exchanged (after completion of one cycle), the peeling of the coating layer is visually confirmed and evaluated. The sample in which peeling was not confirmed after 30 cycles was designated as "A", the sample in which peeling was confirmed between 21 and 30 cycles was designated as "B", and the sample in which peeling was confirmed between 11 and 20 cycles was designated as "B". is "C", and the sample in which peeling was confirmed between 1 to 10 cycles is "D". The evaluation results are shown in Figure 2.

(剝離試驗) 針對各樣本進行剝離試驗。剝離試驗係製作與反應試驗不同的別的樣本而進行。剝離試驗係針對各樣本,進行6循環的試驗,該試驗係將在大氣氣體環境下以1350℃燒成2小時後冷卻至室溫為止的處理作為1循環。各循環結束後,在各樣本的表面貼附10mm×15mm的膠帶(gum tape)(KIKUSUI TAPE(股)製,布膠帶 No.212 50毫米 25M)後,剝離該膠帶,以目視確認覆蓋層有無剝離並進行評價。此外,膠帶係貼附在樣本的中央部分。又,為了使膠帶附著樣本(覆蓋層),而在將膠帶貼附在樣本後,在膠帶上負載2kg的重量10秒鐘。將在6循環結束後未確認到剝離的樣本設為「A」,將在4或5循環結束後確認到剝離的樣本設為「B」,將在2或3循環結束後確認到剝離的樣本設為「C」,將在1循環結束後確認到剝離的樣本設為「D」。將評價結果揭示於圖2。(Peel test) A peel test was performed on each sample. The peeling test is performed by preparing a different sample from the reaction test. The peeling test was a 6-cycle test performed on each sample. In this test, one cycle consisted of firing at 1350° C. for 2 hours and then cooling to room temperature in an atmospheric gas environment. After each cycle, a 10 mm × 15 mm gum tape (manufactured by KIKUSUI TAPE Co., Ltd., cloth tape No. 212; 50 mm 25M) was attached to the surface of each sample, and the tape was peeled off to visually confirm whether there was a covering layer. Peel and evaluate. In addition, tape is attached to the central part of the specimen. In order to attach the tape to the sample (covering layer), after the tape was attached to the sample, a weight of 2 kg was placed on the tape for 10 seconds. The sample in which peeling was not confirmed after 6 cycles was designated as "A", the sample in which peeling was confirmed after 4 or 5 cycles was designated as "B", and the sample in which peeling was confirmed after 2 or 3 cycles was designated as "B". is "C", and the sample in which peeling was confirmed after completion of one cycle is "D". The evaluation results are shown in Figure 2.

(有用性的判定) 上述反應試驗及剝離試驗的結果,將評價「A」為3個以上的樣本設為判定「A」,將評價「A」為1或2個且無評價「C」及評價「D」的樣本設為判定「B」,將沒有一個評價「A」的樣本設為判定「C」。判定「A」及「B」的樣本(燒成夾具)係與電子元件材料及鋰電池所使用的活性物質材料之反應性低,表示作為燒成夾具是有用的。尤其,判定「A」的樣本(燒成夾具)可稱為具有作為電子元件材料及鋰電池所使用的活性物質材料用之燒成夾具的優異特性。(Judgment of usefulness) Based on the results of the above reaction test and peeling test, samples with 3 or more evaluations "A" will be judged as "A", samples with 1 or 2 evaluations "A" and no evaluation "C" and samples with evaluation "D" will be considered as judgment "A". Let it be judged "B", and let the sample without any evaluation "A" be judged "C". The samples (baking jigs) judged as "A" and "B" have low reactivity with electronic component materials and active material materials used in lithium batteries, indicating that they are useful as baking jigs. In particular, the sample (firing jig) rated "A" can be said to have excellent characteristics as a sintering jig for electronic component materials and active material materials used in lithium batteries.

如圖2所示,相較於使用ZrO2 而形成第二層的樣本(樣本21~24),使用Y2 O3 、HfO2 、CeO2 、NiO、WC、Ni、Mo而形成第二層的樣本(樣本1~20)被確認到顯示優異的特性(例如,比較樣本5、12、18、19、20、23)。又,在Si-SiC板與SiC燒結體板兩者中,亦被確認到同樣的效果(比較樣本2、3,樣本5、6,樣本12、13,樣本21、22,樣本23、24)。又,在使用Y2 O3 、HfO2 而形成第二層的樣本(樣本1~15)中,使第二層的厚度變化至10μm~200μm的結果,確認到皆獲得良好結果。尤其,厚度50~150μm的樣本(樣本2~7、樣本10~14)顯示良好結果。此外,與使用Y2 O3 、HfO2 而形成第二層的樣本(樣本5、12)同樣地,使用CeO2 、NiO、WC、Ni、Mo而形成第二層的樣本(樣本16―21)被確認到顯示優異的特性。As shown in Figure 2, compared to the samples (samples 21 to 24) in which the second layer was formed using ZrO 2 , the second layer was formed using Y 2 O 3 , HfO 2 , CeO 2 , NiO, WC, Ni, and Mo. samples (samples 1 to 20) were confirmed to exhibit excellent characteristics (for example, comparative samples 5, 12, 18, 19, 20, and 23). In addition, the same effect was confirmed for both the Si-SiC plate and the SiC sintered body plate (compare samples 2 and 3, samples 5 and 6, samples 12 and 13, samples 21 and 22, and samples 23 and 24) . In addition, in the samples (samples 1 to 15) in which the second layer was formed using Y 2 O 3 and HfO 2 , it was confirmed that good results were obtained when the thickness of the second layer was changed to 10 μm to 200 μm. In particular, the samples with a thickness of 50 to 150 μm (samples 2 to 7, and samples 10 to 14) showed good results. In addition, similarly to the samples in which the second layer was formed using Y 2 O 3 and HfO 2 (samples 5 and 12), the samples in which the second layer was formed using CeO 2 , NiO, WC, Ni, and Mo (samples 16 to 21 ) was confirmed to exhibit excellent characteristics.

以上,雖詳細地說明本發明的具體例,但此等僅為例示,並非限定申請專利範圍者。在申請專利範圍所記載之技術中,包含將以上所例示之具體例進行各種變形、變更者。又,本發明書或圖式所說明之技術要素係藉由單獨或各種組合而發揮技術的有用性者,並非受限於申請時請求項記載的組合者。又,本發明書或圖式所例示之技術係能同時達成複數目的者,係藉由達成其中之一個目的本身而具有技術的有用性者。Although specific examples of the present invention have been described in detail above, these are only examples and do not limit the scope of the patent application. The technology described in the claimed scope includes various modifications and changes to the specific examples illustrated above. In addition, the technical elements described in the present invention or the drawings exert technical usefulness individually or in various combinations, and are not limited to the combinations described in the claims at the time of application. In addition, the technology illustrated in the present invention or the drawings can achieve a plurality of objects at the same time, and has technical usefulness by achieving one of the objectives itself.

無。without.

[圖1]顯示在多成分系統對於BaTiO3 的熱力學平衡狀態中之反應生成物的計算結果。 [圖2]顯示實驗例的結果。 [圖3]顯示覆蓋層的SEM照片。[Figure 1] shows the calculation results of reaction products in the thermodynamic equilibrium state of BaTiO 3 in a multi-component system. [Fig. 2] shows the results of the experimental example. [Fig. 3] SEM photograph showing the coating layer.

Claims (6)

一種燒成夾具,其係用於將鈦酸鋇作為主成分的陶瓷電容器、及該陶瓷電容器的原料之電子元件材料的燒成之燒成夾具,並具備SiC質或Si-SiC質之基材、與被覆基材的表面之覆蓋層,覆蓋層具備:第一層,其被設置在基材表面且將Al2O3-SiO2質作為主成分;與第二層,其在覆蓋層的表層露出,且將選自Y2O3、HfO2、CeO2、NiO、WC、Ni、Mo之至少一種作為主成分。 A firing jig used for firing ceramic capacitors containing barium titanate as a main component and electronic component materials that are raw materials of the ceramic capacitors, and having a base material of SiC or Si-SiC. , and a covering layer covering the surface of the base material, the covering layer includes: a first layer, which is provided on the surface of the base material and has Al 2 O 3 -SiO 2 as the main component; and a second layer, which is on the surface of the covering layer The surface layer is exposed, and has at least one selected from Y 2 O 3 , HfO 2 , CeO 2 , NiO, WC, Ni, and Mo as the main component. 一種燒成夾具,其係用於將鈷酸鋰作為主成分的鋰電池的活性材料、及該活性材料的原料等的活性物質材料的燒成之燒成夾具,並具備SiC質或Si-SiC質之基材、與被覆基材的表面之覆蓋層,覆蓋層具備:第一層,其被設置在基材表面且將Al2O3-SiO2質作為主成分;與第二層,其在覆蓋層的表層露出,且將選自Y2O3、HfO2、CeO2、NiO之至少一種作為主成分。 A firing jig used for firing active material materials such as active materials of lithium batteries containing lithium cobalt oxide as a main component and raw materials of the active materials, and is provided with SiC or Si-SiC The base material is a base material, and the covering layer covers the surface of the base material. The covering layer includes: a first layer, which is provided on the surface of the base material and has Al 2 O 3 -SiO 2 as a main component; and a second layer, which is The surface layer of the covering layer is exposed, and at least one selected from Y 2 O 3 , HfO 2 , CeO 2 and NiO is used as the main component. 如請求項1之燒成夾具,其中,第二層係將選自Y2O3、HfO2、CeO2、NiO之至少一種作為主成分。 Such as the firing jig of claim 1, wherein the second layer has at least one selected from the group consisting of Y 2 O 3 , HfO 2 , CeO 2 and NiO as the main component. 如請求項1至3中任一項之燒成夾具,其中,以第一層的熱膨脹係數為基材的熱膨脹係數以上且第二層的熱膨脹係數成為第一層的熱膨脹係數以上之方式,選擇基材、第一層及第二層的材料。 The firing jig according to any one of claims 1 to 3, wherein the thermal expansion coefficient of the first layer is equal to or greater than the thermal expansion coefficient of the base material, and the thermal expansion coefficient of the second layer is equal to or greater than the thermal expansion coefficient of the first layer. Base material, first layer and second layer materials. 如請求項1至3中任一項之燒成夾具,其中,在第一層與第二層之間,設置有將Al2O3質作為主成分之第三層。 The firing jig according to any one of claims 1 to 3, wherein a third layer containing Al 2 O 3 as a main component is provided between the first layer and the second layer. 如請求項1至3中任一項之燒成夾具,其中,在第二層內存在複數個扁平粒,該複數個扁平粒係構成第二層的粒子經熔融凝固而成, 扁平粒積層在基材、第一層及第二層積層的方向。 The firing jig according to any one of claims 1 to 3, wherein there are a plurality of flat particles in the second layer, and the plurality of flat particles are formed by melting and solidifying the particles constituting the second layer, The flat grains are laminated in the direction in which the base material, the first layer and the second layer are laminated.
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