TWI672582B - Thermal buffered conductive composite forming structure of mobile electronic device (3) - Google Patents

Abstract

A heat dissipating buffer conductive composite forming structure of a mobile electronic device comprises: a heat dissipating buffer conductive composite forming structure integrated therein, comprising a transparent substrate and a back cover connected by a middle shell bracket, wherein: a composite The diaphragm is composed of a buffer layer, a heat insulating film and a conductive heat dissipating film, and the composite film is integrally molded by insert molding to form the composite film. The integral molding is fixed on the middle shell bracket to reduce the thickness in the Z-axis direction, thereby reducing an assembly station, saving assembly manpower, shortening assembly time, reducing assembly cost, and reducing diaphragm waste caused by poor assembly. Improve the assembly yield; and combine the four functions of heat dissipation, buffering, conduction and heat insulation, which can maintain the reliability of the mobile electronic device and save cost.

Description

Thermal buffered conductive composite forming structure of mobile electronic device (3)

The invention relates to a heat dissipating buffer conductive composite forming structure of a mobile electronic device, in particular to a composite forming structure combining four functions of heat dissipation, buffering, electric conduction and heat insulation.

According to mobile electronic devices such as smart phones and tablet PCs, which have evolved from dual-core, quad-core, and eight-core... to increasingly higher processing clock processing chips; and the development of mobile electronic devices is designed to be short and light. Trends, so in order to achieve high computing efficiency and short and light requirements, the heat dissipation efficiency of mobile electronic devices is important.

Sub-press, the current heat dissipation method of mobile electronic devices mainly uses simple opening, heat conduction, heat convection, etc., but these heat dissipation methods can not load the heat energy generated by high-performance wafers today, so there is a problem of heat accumulation. The thermal energy cannot be evenly distributed, resulting in lowering the heat dissipation efficiency inside the mobile electronic device.

In addition, usually, the chip of the electronic device is the main heat source during operation, and the heat dissipation is not only to lower the temperature of the chip itself to ensure that it can work normally within the required temperature range, but also to prevent partial overheating of the casing when the heat is dissipated. Consumers experience a bad experience.

The invention discloses a heat dissipation structure of a mobile electronic device, which comprises a front housing bracket 11, a liquid crystal display module 12, a rear cover 16 and a heat conducting component 15, and the liquid crystal display module 12 A substrate 14 is disposed on the side of the substrate 14 , and the substrate 14 is provided with at least one electronic component 141 . The back cover 16 has a receiving space 161 , and a middle frame 13 is attached to the liquid crystal display module 12 . In the middle frame 13, the heat conducting component 15 is disposed between the electronic component 141 and the back cover 16, and the side of the heat conducting component 15 corresponds to the electronic component. The other side corresponds to the back cover 16; the thermal energy of the electronic component 121 is evenly distributed without generating heat. However, it is found that the heat-dissipating heat-dissipating component 15 and the rear cover 16 are separately fabricated, and then the heat-conductive component 15 is bonded to the inner edge of the back cover 16, so that the heat dissipation efficiency or the electronic shielding function is still insufficient, and The buffer structure for protecting the liquid crystal display module 12 is disclosed, so that there is still room for improvement.

In addition, in the current mobile phone design, in order to protect the LCD from being damaged during use, and to solve the problem of excessive heat generation in the LCD, the conventional design is to put foam under the LCD to buffer the impact force, and mount it. The conductive film is used for heat dissipation. However, it is necessary to provide a special assembly station, which has a high assembly cost and increases the thickness in the Z-axis direction.

Therefore, solving the above problems of the conventional mobile electronic device is a main subject of the present invention.

The main purpose of the present invention is to provide a heat-dissipating and buffering conductive composite structure of a mobile electronic device, which combines four functions of heat dissipation, buffering, conducting, and heat-insulation, and is integrally embedded and fixed on the front shell bracket. It has the advantages of saving assembly manpower, shortening assembly time, reducing assembly cost, improving assembly yield, and reducing thickness in the Z-axis direction.

Another object of the present invention is to provide a heat dissipating buffer conductive composite forming structure of a mobile electronic device, which combines three functions of heat dissipation, buffering and conducting, and has the capability of maintaining the reliability of the mobile electronic device and saving cost.

In order to achieve the above object, the technical means adopted by the present invention comprises: a transparent substrate; a liquid crystal display module is disposed under the transparent substrate; and a middle case bracket is disposed under the liquid crystal display module; a circuit board disposed under the middle case bracket, at least one electronic chip is disposed thereon; a battery is disposed under the middle case bracket; and a back cover is oppositely coupled to the bottom edge of the middle case bracket The utility model has an accommodating space for accommodating the aforementioned components; The composite film is composed of a buffer layer, a heat insulating film and a conductive heat dissipating film, and the composite film is integrally molded with the middle shell bracket (insert molding). Forming the composite film embedded on the middle shell bracket, and the surface of the lower conductive film of the lower layer exposes at least a conductive heat dissipating surface at the surface of the middle shell bracket.

According to the foregoing feature, in a possible embodiment, the composite film is located between the middle shell bracket and the liquid crystal display module, and the composite film is embedded and fixed on the upper surface of the middle shell bracket, and the middle shell bracket The surface of the surface is provided with an opening, the conductive heat dissipation surface of the conductive heat dissipation film is exposed for heat dissipation, and the buffer layer is buffered by the liquid crystal display module and the last between the middle case support and the electronic chip A heat barrier layer.

In another possible embodiment, the composite film is located between the middle shell bracket and the liquid crystal display mold, and the surface of the middle shell bracket is an open-cell structure, and the composite film is formed and fixed on the middle shell bracket. Under the surface.

According to the foregoing feature, the middle shell bracket is formed by a plastic component, and the liquid crystal display module is fixed upwardly, and the circuit board is fixed downward; the circuit board is provided with a shield cover by surface adhesion technology (SMT). The cover of the shield can contact the conductive heat dissipation surface of the conductive heat dissipation film; the electronic chip of the circuit board is provided with an insulating heat sink for providing heat dissipation of the electronic chip while blocking the shield and The electronic chip contacts the insulating film; and the electronic chip contacts the insulating heat sink to transfer the heat of the electronic chip upward in a vertical direction, and the heat generated by the electronic chip is transmitted, so that the shielding cover is transmitted. The heat is distributed horizontally horizontally, and the heat-insulating film prevents the conductive heat-dissipating film from radiating heat outward.

According to the foregoing feature, the insulating heat sink may be composed of alumina added with silica gel; the conductive heat dissipating film is composed of one of copper foil, aluminum foil or graphite sheet; the buffer layer is foam One of the layer, the rubber layer or the elastic film layer; the heat insulating film may be a flat film having a microporous structure or a perforated film having a plurality of pores and pore structures formed on the flat film.

By means of the above-mentioned technical means, the invention replaces the traditional single-shot cover body into a mold-integrated molding, that is, the three layers of the buffer layer, the heat-insulating film and the conductive heat-dissipating film are first formed into a composite film, and placed in the mold. It is integrally formed with the middle shell bracket, thereby reducing an assembly station, saving assembly manpower, shortening assembly time, reducing assembly cost, and reducing thickness in the Z-axis direction; and reducing diaphragm waste caused by poor assembly and improving assembly. The efficiency of the rate is improved. And it combines four functions of heat dissipation, buffering, conduction and heat insulation, and has the effect of maintaining the reliability of the mobile electronic device and saving cost.

20‧‧‧Transparent substrate

21‧‧‧Printing area

22, 22a, 22b, 22c, 22d‧‧‧ middle shell bracket

221‧‧‧Opening

222‧‧‧ inside frame

223‧‧‧outer perimeter

30‧‧‧LCD module

40‧‧‧ boards

41‧‧‧Electronic chip

50‧‧‧Battery

60‧‧‧ Back cover

61‧‧‧ accommodating space

70‧‧‧Composite diaphragm

71‧‧‧buffer layer

72‧‧‧Insulation film

721‧‧‧ stomata and pore structure

73‧‧‧Electrical heat dissipation film

80‧‧‧Shield

81‧‧‧ Cover

90‧‧‧Insulated heat sink

1A is an exploded perspective view of a heat dissipation structure of a mobile electronic device.

FIG. 1B is a perspective view showing a combination of a heat dissipation structure of a mobile electronic device.

1C is a cross-sectional view of a heat dissipation structure of a mobile electronic device.

Figure 1D is an enlarged view of 1D in Figure 1C.

Figure 2 is an exploded perspective view of a first possible embodiment of the present invention.

Figure 3 is a combined perspective view of a first possible embodiment of the present invention.

Figure 4 is a cross-sectional view of a first possible embodiment of the present invention.

Figure 5 is an exploded perspective view of a second possible embodiment of the present invention.

Figure 6 is a combined perspective view of a second possible embodiment of the present invention.

Figure 7 is a cross-sectional view showing a second possible embodiment of the present invention.

Figure 8 is an enlarged view of 8 in Figure 7.

Figure 9 is an exploded perspective view of a third possible embodiment of the present invention.

Figure 10 is a perspective view of the combination of a third possible embodiment of the present invention.

Figure 11 is a cross-sectional view showing a third possible embodiment of the present invention.

Figure 12 is an exploded perspective view of a fourth possible embodiment of the present invention.

Figure 13 is a combined perspective view of a fourth possible embodiment of the present invention.

Figure 14 is a cross-sectional view showing a fourth possible embodiment of the present invention.

Figure 15 is an enlarged view of 15 in Figure 14.

First, referring to FIG. 2 to FIG. 4, the heat dissipation buffer conductive composite molding structure of the mobile electronic device disclosed in the present invention, the first feasible embodiment includes: a transparent substrate 20, and a non-transparent layer can be disposed on the outer periphery thereof. The printing area 21 is not limited thereto; a liquid crystal display module 30 is disposed under the transparent substrate 20; a middle case holder 22 is disposed under the liquid crystal display module 30; and a circuit board 40 Provided below the middle casing bracket 22, at least one electronic chip 41 is disposed thereon; a battery 50 is disposed below the middle casing bracket 22; and a rear cover 60 is opposite to the middle casing bracket 22a. In the bottom edge of the transparent substrate 20, it has an accommodating space 61 for accommodating the aforementioned components. However, the above-mentioned components are prior art (Prior Art), and the patents of the present invention are not described herein.

The main feature of the present invention is that a composite film 70 is composed of a buffer layer 71, a heat insulating film 72 and a conductive heat dissipating film 73 which are stacked from top to bottom. The composite film 70 and the middle shell bracket are formed. 22 integrally insert molding, the composite film 70 is embedded and fixed on the middle shell bracket 22, and at least a conductive heat dissipating surface 731 is exposed on the surface of the inner shell bracket 22 on the surface of the conductive heat dissipating film 73. Reservations. In this embodiment, the middle casing bracket 22 is a single-shaped middle casing bracket 22a integrally formed and having an inner frame surface 222.

4 is a cross-sectional view of a first possible embodiment of the present invention, the transparent substrate 20 is disposed on the inner frame surface 222 of the middle case holder 22a, and the composite film piece 70 is located at the middle case holder 22a and the liquid crystal Between the display modules 30, the composite film 70 is formed and fixed on the upper surface of the middle casing bracket 22a, and an opening 221 is defined in the surface of the middle casing bracket 22a. The opening 221 exposes the conductive heat dissipation. The conductive heat dissipating surface 731 of the film 73 is used for heat dissipation, and the buffer layer 71 is buffered by the liquid crystal display module 30 and the last heat blocking layer between the middle case holder 22a and the electronic chip 41.

5 to 8 are second feasible embodiments of the present invention, and the configurations of the first feasible embodiment are denoted by the same reference numerals, except that the middle case bracket 22b includes a separate molding formed at the periphery thereof. The frame 23 is constructed. That is, in the first possible embodiment, the middle case bracket 22a is an inner frame surface 222 which is integrally formed and has a frame function. In the embodiment, the frame body 23 is separately formed and then sleeved in the middle case. The inner casing bracket 22 is formed on the outer periphery 223 of the bracket 22b as shown in FIG.

Referring to FIG. 9 to FIG. 11 , a third possible embodiment of the present invention is disclosed. The structure of the same as the first possible embodiment is represented by the same figure, and the difference is only that the composite diaphragm 70 is located therein. Between the case holder 22 and the circuit board 40, in the embodiment, the middle case holder 22 is a surface-free opening structure, and the case holder 22 is formed to be fixedly mounted on the lower surface of the middle case holder 22c. .

12 to FIG. 15 show a fourth possible embodiment of the present invention, and the same structure as the third feasible embodiment is denoted by the same figure, except that the middle case bracket 22d is included in the periphery thereof. In combination with a separately formed frame 23, the frame 23 is independently molded and then sleeved on the outer periphery 223 of the middle casing bracket 22d, as shown in FIG.

In the above embodiment, the middle case bracket 22 can be composed of a plastic component, and the liquid crystal display module 30 is fixed upwardly, and the circuit board 40 is fixed downward; the surface of the circuit board 40 is surface-adhesive (SMT) A shield can 80 is provided. The cover 81 of the shield can contact the conductive heat dissipation surface 731 of the conductive heat dissipation film 73. The circuit board 40 is provided with an insulating heat sink 90 for providing the shield. The electronic chip 41 dissipates heat while blocking the shield The cover 80 is in contact with the electronic chip 41 for insulation; and the electronic chip 41 contacts the insulating heat sink 90 for transferring the heat of the electronic chip 41 upward in a vertical direction, and the heat generated by the electronic chip 41 is generated. The heat is transmitted from the shield cover 80 to the horizontal direction, and the heat-dissipating film 73 is prevented from radiating heat to the outside. In this embodiment, the insulating heat sink 90 can be added with silica gel. The alumina is composed of, but is not limited to.

The conductive heat dissipating film 73 is configured to transmit heat in a lateral direction to achieve uniform heat dissipation. In the embodiment, the conductive heat dissipating film 73 is formed by one of copper foil, aluminum foil or graphite sheet, but is not limited thereto. this.

In addition, a heat insulating film 72 is disposed on the conductive heat dissipating film 73 to prevent the conductive heat dissipating film 73 from radiating heat outward to prevent the user from overheating. In this embodiment, the heat insulating film 72 is A heat-insulating film having a microporous structure obtained by foaming hollow glass beads with PET material, or a film processed by other materials or processes and having heat insulating function, which may be flat or flat. On the basis of the film, a film having a plurality of pores and a hole structure 721 is mainly used to condense air by using an air layer in the inner micropores and an air layer in the post-added holes, using air. The characteristic of high thermal conductivity forms a thermal resistance layer, which can affect the heat transfer direction, so that the heat can be uniformly dispersed and controlled in the thermal resistance layer to prevent heat from further diffusing outside the casing, but is not limited thereto.

Further, a buffer layer 71 (the material may be an elastic buffer material such as rubber or foam) is disposed on the outer side of the heat insulating film 72 to protect the liquid crystal display module 30 to buffer and prevent heat from being transmitted to the outside of the casing. In this embodiment, the buffer layer 721 is composed of one of a foam layer, a rubber layer or an elastic film layer, but is not limited thereto.

Please refer to the enlarged view shown in FIG. 8 and FIG. 15 at the same time. The composite diaphragm 70 is fixedly fixed to the middle casing bracket 20 as a longitudinal heat transfer and electromagnetic shielding medium, thereby improving the problem of poor heat conduction of the middle casing bracket 20, and The heat emitted by the electronic chip 41 continues to be transmitted in the longitudinal direction, and The heat transferred from the electronic chip 41 is longitudinally transmitted to the conductive heat dissipation film 73 of the composite film 70 through the insulating heat sink 90 and the shield cover 80, and then spread laterally and parallelly through the conductive heat dissipation film 73 to achieve uniform heat dissipation. Furthermore, in the heat insulating film 72, it may be either a flat surface or a film having a plurality of pores and a hole structure 721 which is punched on the basis of the flat film, and the film prevents the heat from continuing to the shell. Dispersing in vitro to avoid a bad user experience of overheating, and providing a buffering effect to the buffer layer 71 to protect the liquid crystal display module 30; thereby, the present invention has a combination of heat dissipation, buffering, and conduction. Insulation is used to integrate the four functions, which can maintain the reliability of the mobile electronic device and save cost.

By means of the above-mentioned technical means, the present invention adopts the middle shell bracket 22 to change the conventional single-shot cover body into a mold-integrated molding, that is, the buffer layer 71, the heat-insulating film 72 and the conductive heat-dissipating film 73 are firstly formed. The composite film 70 is formed in a mold and integrated with the middle shell bracket 22, thereby reducing an assembly station, saving assembly manpower, shortening assembly time, reducing assembly cost, and reducing thickness in the Z-axis direction; The assembly is poor (the diaphragm is displaced or deformed, and it needs to be removed and reassembled) to waste the diaphragm and improve the assembly yield.

To sum up, the technical means disclosed in the present invention have the invention patents such as "novelty", "progressiveness" and "available for industrial use", and pray for the patent to be invented by the bureau. German sense.

The drawings and the descriptions of the present invention are merely preferred embodiments of the present invention, and those skilled in the art, which are subject to the spirit of the present invention, should be included in the scope of the patent application.

Claims (9)

A heat dissipation buffer conductive composite molding structure of a mobile electronic device includes: a transparent substrate on which a printing area can be disposed; a liquid crystal display module disposed under the transparent substrate; and a middle case bracket disposed at a circuit board disposed below the middle housing bracket, at least one electronic chip is disposed thereon; a battery is disposed under the middle housing bracket; and a rear cover is opposite The utility model is characterized in that: a composite space is formed by a buffer layer, a thermal insulation film and a conductive heat dissipation film. And the lower laminated body is formed, the composite film is integrally molded with the middle shell bracket, and the composite film is formed and fixed on the middle shell bracket, and the surface of the lower layer of the conductive heat dissipating film is at least bare. A conductive heat dissipating surface is disposed at a surface of the middle shell bracket; the composite diaphragm is located between the middle shell bracket and the liquid crystal display module, and the composite diaphragm is embedded and fixed on the upper surface of the middle shell bracket, and the Middle shell bracket The surface of the surface is provided with an opening, the conductive heat dissipation surface of the conductive heat dissipation film is exposed for heat dissipation, and the buffer layer is buffered by the liquid crystal display module and the last between the middle case support and the electronic chip A heat barrier layer. The heat-dissipating-buffered conductive composite structure of the mobile electronic device of claim 1, wherein the middle-shell bracket further comprises a frame at a periphery thereof. The heat-dissipating-buffered conductive composite structure of the mobile electronic device of claim 1, wherein the composite film is located between the middle-shell bracket and the circuit board, and the surface of the middle-shell bracket is not open. The pore structure is formed to be embedded and fixed on the lower surface of the middle shell support. The heat dissipation buffer conductive composite molding structure of the mobile electronic device of claim 3, wherein the middle housing bracket further comprises a frame at a periphery thereof. The heat-dissipating and buffering conductive composite structure of the mobile electronic device according to any one of the preceding claims, wherein the middle-shell support is formed of a plastic component, and the liquid crystal display module is fixed upward. Fixing the circuit board downward; the circuit board is provided with a shielding can, the cover of the shielding can contacts the conductive heat dissipation surface of the conductive heat dissipation film; the circuit board is provided with an insulating heat sink Providing heat dissipation of the electronic chip, and blocking the shielding cover from contacting the electronic chip to perform insulation; and the electronic chip contacting the insulating heat sink for transferring the heat of the electronic chip upward in a vertical direction, The heat generated by the electronic chip is transmitted, so that the heat transmitted from the shield is horizontally dispersed, and the heat-dissipating film prevents the conductive heat-dissipating film from radiating heat outward. The heat dissipation buffer conductive composite molding structure of the mobile electronic device according to claim 5, wherein the insulating heat sink is made of alumina added with silica gel. The heat dissipation buffer conductive composite molding structure of the mobile electronic device according to claim 1, wherein the conductive heat dissipation film is composed of one of copper foil, aluminum foil or graphite sheet. The heat dissipation buffer conductive composite molding structure of the mobile electronic device according to claim 1, wherein the buffer layer is composed of one of a foam layer, a rubber layer or an elastic film layer. The heat-dissipating-buffered conductive composite structure of the mobile electronic device of claim 1, wherein the heat-insulating film comprises a planar film having a microporous structure or a plurality of pores and holes are formed on the planar film. Structured perforated film.