TWI326297B - Conductive ink composition and preparing method thereof - Google Patents

Conductive ink composition and preparing method thereof Download PDF

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TWI326297B
TWI326297B TW95109413A TW95109413A TWI326297B TW I326297 B TWI326297 B TW I326297B TW 95109413 A TW95109413 A TW 95109413A TW 95109413 A TW95109413 A TW 95109413A TW I326297 B TWI326297 B TW I326297B
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Taiwan
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silver
ink composition
metal
ammonium
film
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TW95109413A
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Chinese (zh)
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TW200643126A (en
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Kwang Choon Chung
Hyun Nam Cho
Myoung Seon Gong
Yi Sup Han
Jeong Bin Park
Dong Hun Nam
Seong Yong Uhm
Young Kwan Seo
Nam Bu Cho
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Inktec Co Ltd
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Priority claimed from KR1020050023013A external-priority patent/KR100658492B1/en
Priority claimed from KR1020050031090A external-priority patent/KR100667958B1/en
Priority claimed from KR1020050034371A external-priority patent/KR100727451B1/en
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1326297 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種導電性墨水組合物,其包含一具有一特殊結 構之金屬錯合物化合物及一添加劑,以及一種製備該等組合物之 方法。 【先前技術】 最近,由於導電性墨水可用於無鉛導電/電路(lead-free electric/electronic circuits )、低電阻金屬線、印刷電路板(PCB )、 軟性印刷電路板(FPC)、無線射頻辨識(rfID)標籤的天線、電 磁干擾(EMI )屏蔽、電漿顯示器(PDP )、薄膜液晶顯示器 (TFT-LCD)、有機發光二極體(OLED)、軟性顯示器以及有機薄 膜電晶體(OTFT)等領域中之金屬膜或圖樣的形成以及電極印刷 而引起注意。 曰本專利公開第2004-221006號( 2004年8月5日)以及曰本 專利公開第2004-273205號(2004年9月30曰)揭露導電性墨水 糊,其係由金屬或金屬合金之奈米顆粒、粉末或薄片使用一黏著 劑樹脂或溶劑而製得。CTzem. Maier.,15, 2208 (2003)、日本專利公 開第Hei 11-319538號(1999年11月24曰)、曰本專利公開第Hei 2004-256757號(2004年9月10日)以及美國專利第4 762 56〇 號(1988年8月9曰)揭露於一含水溶液或有機溶劑中,將例如 硝酸銀、四氣金酸(hydrogen tetrachloroaurate)及琉酸銅之金屬 化合物與其他化合物反應,以形成膠狀體或奈米顆粒之方法。然 而,這些方法不具經濟效益且較不穩定,並且需要一複雜的製程。 1326297 此外,高的烘乾溫度使得它們不適合應用於各種不同的基材。 羧酸鹽係一已知的配位基,其可形成錯合物,尤其是有機金屬 錯合物(Prog· /«org. C/iem·, 10, p. 233 (1968))。一般而言,由於 - 金屬叛酸鹽錯合物較不溶於有機溶劑中(·/· CT^w. Soc·,(〇.,ρ· 514 t (1971),美國專利第5,534,312號(1996年7月9日))且會在高 溫下分解,儘管它們的製備較為容易但在應用上會受到限制。於1326297 IX. Description of the Invention: [Technical Field] The present invention relates to a conductive ink composition comprising a metal complex compound having a specific structure and an additive, and a method of preparing the same . [Prior Art] Recently, conductive inks can be used for lead-free electric/electronic circuits, low-resistance metal lines, printed circuit boards (PCBs), flexible printed circuit boards (FPCs), and radio frequency identification ( rfID) tag antenna, electromagnetic interference (EMI) shielding, plasma display (PDP), thin film liquid crystal display (TFT-LCD), organic light emitting diode (OLED), flexible display, and organic thin film transistor (OTFT) Attention is drawn to the formation of metal films or patterns and electrode printing. A conductive ink paste is disclosed in Japanese Patent Publication No. 2004-221006 (August 5, 2004) and Japanese Patent Publication No. 2004-273205 (September 30, 2004), which is a metal or metal alloy. Rice granules, powders or flakes are prepared using an adhesive resin or solvent. CTzem. Maier., 15, 2208 (2003), Japanese Patent Publication No. Hei 11-319538 (November 24, 1999), Japanese Patent Publication No. Hei 2004-256757 (September 10, 2004), and the United States Patent No. 4 762 56 ( (August 9, 1988) is disclosed in an aqueous solution or an organic solvent, and a metal compound such as silver nitrate, hydrogen tetrachloroaurate and copper ruthenate is reacted with other compounds to A method of forming a gel or nanoparticle. However, these methods are not economical and unstable, and require a complicated process. 1326297 In addition, the high drying temperatures make them unsuitable for use on a variety of different substrates. Carboxylates are a known ligand which forms complexes, especially organometallic complexes (Prog· / «org. C/iem·, 10, p. 233 (1968)). In general, since - the metal tetrate complex is less soluble in organic solvents (·/· CT^w. Soc·, (〇., ρ· 514 t (1971), US Patent No. 5,534,312 (1996) July 9)) and will decompose at high temperatures, although their preparation is easier but limited in application.

J. Inorg. Nucl. Chem., 40, p. 1599 (197^)^Ang. Chem., Int. Ed. Engl., 31, p. 770 (1992) ' Eur. J. Solid State Inorg. Chem., 32, p. 25 (1995) ' J. Chem. Cryst., 26, p. 99 (1996) ' Chem. Vapor Deposition, • 7, 111 (2001)、C/zem_ Maier·, 16,2021 (2004)、美國專利第 5,705,661 號(1998年1月6日)、日本專利公開第2002-329419號(2002 年11月I5曰)以及韓國專利公開第2003-0085357號(2003年9 月5日)中已提出幾種方法以解決此問題。這些方法係使用一羧 酸鹽化合物與一長烷基鏈或使用一胺化合物或一膦化合物。 本案發明人已於韓國專利申請第2005-11475號以及第 ^ 2005·11478號中提出穩定且具高溶解度之錯合物化合物及其製備 方法。特定而言’於韓國專利申請第2005-18364號以及第 2005-23013號中,它們已提出具有優異溶解度及良好導電性之穩 定且透明的導電性墨水組合物,其之金屬含量及膜厚度係易於控 制,且使用該等組合物,即便在低溫下亦係易於形成金屬圖樣之 方法。然而,需要多種導電性墨水以產生高品質特性產品或者以 符合需要特殊性質的情況。 根辕 UUmann's Encyclopedia of ind. chem·, VcA. A24, 107 7 1326297 (1993),銀為一貴金屬,其不易氧化且具有良好的導電性及熱傳導 性和催化能力及抗菌能力,因此銀及銀化合物係廣泛應用於工業 中、於銀合金、電鍍、醫學、照片、導電及電子產品、纖維、洗 潔劑、家庭用品等。此外,銀化合物可用於合成有機化合物及聚 合物之催化劑。特定而言,銀最近係用於需要金屬圖樣或電極的 新領域中,包含無鉛導電/電路、低電阻金屬線、PCBs、FPCs、RFID 標籤的天線、EMI屏蔽、PDPs、TFT-LCDs、OLEDs、軟性顯示器 以及OTFTs。 最近,在反射型或半穿透型之液晶螢幕之反射膜中使用銀來取 代鋁的研究正在進行中(銀具有較佳的反射與導電特性),如曰本 公開專利第2002-129259號(2002年5月9日)、日本專利公開第 2004-176115號(2004年6月 24曰)以及曰本專利公開第 2004-231982 號(2004 年 8 月 19 日)。 然而,衍生自銀的化合物有限且缺乏穩定性以及溶解度。此外, 它們具一 200°C或更高之分解溫度,由於該溫度太高以致於無法 獲得具有良好導電性之金屬圖樣且它們分解速度很慢。 本案發明人已持續研究以解決這些問題進而完成本發明。本發 明提供一種具非常優異穩定性及溶解度之導電性墨水組合物,其 係易於形成膜且即便在低溫下亦係易於煅燒,因此可形成均勻且 精確之膜或具有良好導電性的圖樣而毋須使用特殊基材,以及一 種製備該組合物之方法。 【發明内容】 本發明之一目的係在於提供一種導電性墨水組合物,包含一具 1326297 有一特殊結構之金屬錯合物化合物及一添加劑,以及一種製備該 組合物之方法。J. Inorg. Nucl. Chem., 40, p. 1599 (197^)^Ang. Chem., Int. Ed. Engl., 31, p. 770 (1992) ' Eur. J. Solid State Inorg. Chem. , 32, p. 25 (1995) 'J. Chem. Cryst., 26, p. 99 (1996) 'Chem. Vapor Deposition, • 7, 111 (2001), C/zem_ Maier·, 16, 2021 (2004) , U.S. Patent No. 5,705,661 (January 6, 1998), Japanese Patent Publication No. 2002-329419 (Il. No. 2002), and Korean Patent Publication No. 2003-0085357 (September 5, 2003) Several methods have been proposed to solve this problem. These methods use a monocarboxylate compound with a long alkyl chain or a monoamine compound or a phosphine compound. The inventors of the present invention have proposed a stable and highly soluble complex compound and a preparation method thereof in Korean Patent Application No. 2005-11475 and No. 2005/11478. In particular, in the Korean Patent Application No. 2005-18364 and No. 2005-23013, they have proposed a stable and transparent conductive ink composition having excellent solubility and good electrical conductivity, the metal content and film thickness thereof. It is easy to control, and the use of these compositions is a method of easily forming a metal pattern even at low temperatures. However, a variety of conductive inks are required to produce high quality specialty products or to meet the special properties required. According to UUmann's Encyclopedia of ind. chem., VcA. A24, 107 7 1326297 (1993), silver is a precious metal, which is not easily oxidized and has good electrical and thermal conductivity and catalytic ability and antibacterial ability, so silver and silver compounds It is widely used in industry, in silver alloys, electroplating, medicine, photo, conductive and electronic products, fiber, detergent, household products, etc. Further, a silver compound can be used as a catalyst for synthesizing an organic compound and a polymer. In particular, silver has recently been used in new areas requiring metal patterns or electrodes, including lead-free conductive/circuits, low-resistance metal lines, PCBs, FPCs, RFID tag antennas, EMI shielding, PDPs, TFT-LCDs, OLEDs, Soft displays and OTFTs. Recently, research on the use of silver in place of aluminum in a reflective film of a reflective or semi-transmissive liquid crystal screen is underway (silver has better reflection and conductivity characteristics), as disclosed in Japanese Laid-Open Patent Publication No. 2002-129259 ( May 9, 2002), Japanese Patent Publication No. 2004-176115 (June 24, 2004) and Japanese Patent Publication No. 2004-231982 (August 19, 2004). However, compounds derived from silver are limited and lack stability and solubility. Further, they have a decomposition temperature of 200 ° C or higher, since the temperature is too high to obtain a metal pattern having good conductivity and their decomposition speed is slow. The inventors of the present invention have continued to study to solve these problems and complete the present invention. The present invention provides a conductive ink composition having excellent stability and solubility, which is easy to form a film and is easily calcined even at a low temperature, so that a uniform and precise film or a pattern having good conductivity can be formed without A special substrate is used, as well as a method of preparing the composition. SUMMARY OF THE INVENTION An object of the present invention is to provide a conductive ink composition comprising a metal complex compound having a specific structure of 1326297 and an additive, and a method of preparing the composition.

本發明之另一目的係在於提供一種導電性墨水組合物,其係易 於控制金屬含量及膜厚度,以及一種製備該組合物之方法。 本發明之又一目的係在於提供一種導電性墨水組合物,其即便 在200°C或更低的低溫下亦可煅燒,並且係易於形成均勻且精確 的膜或具有良好導電性的微圖樣,以及一種製備該組合物之方法。 本發明之更一目的係在於提供一種導電性墨水組合物,其具有 優異穩定性及溶解度且係易於形成膜而毋需考慮使用特殊的基 材,以及一種製備該組合物之方法。 為達到上述目的,本案發明人發明一種導電性墨水組合物,包 含一金屬錯合物化合物以及一添加劑,該金屬錯合物化合物係藉 由將至少一由以下化學式1所代表之金屬或金屬化合物與至少一 由以下化學式2、化學式3或化學式4所代表之以胺基甲酸銨或碳 酸銨為基質之化合物反應而獲得,以及一種製備該組合物之方法:Another object of the present invention is to provide a conductive ink composition which is easy to control metal content and film thickness, and a method of preparing the composition. Still another object of the present invention is to provide a conductive ink composition which can be calcined even at a low temperature of 200 ° C or lower, and which is easy to form a uniform and precise film or a micropattern having good conductivity. And a method of preparing the composition. A further object of the present invention is to provide a conductive ink composition which has excellent stability and solubility and which is easy to form a film without considering the use of a special substrate, and a method of preparing the composition. In order to achieve the above object, the inventors of the present invention have invented a conductive ink composition comprising a metal complex compound and an additive which is obtained by at least one metal or metal compound represented by the following Chemical Formula 1. It is obtained by reacting at least one compound represented by the following chemical formula 2, chemical formula 3 or chemical formula 4 with ammonium urinate or ammonium carbonate as a substrate, and a method for preparing the composition:

ΜηΧ Rl 戶3 NCONH-R4 R2 R5 (l) (2) ©Θ ηθ© r2-hnoconh-r5 R3 Rg (3) R1 r2-hnocohR;ΜηΧ Rl household 3 NCONH-R4 R2 R5 (l) (2) ©Θ ηθ© r2-hnoconh-r5 R3 Rg (3) R1 r2-hnocohR;

在化學式1,M為一金屬或金屬合金;n為1至10之整數;且 9 1326297 x為不存在或為至少一選自以下群組之取代基:氫、銨、氧、硫、 鹵素、氰基、氰酸根、碳酸根、硝酸根、亞硝酸根、硫酸根、磷 酸根、硫氰酸根、氣酸根、過氣酸根、四氟硼酸根、乙醯丙酮根、 毓基、醯胺、醇鹽、羧酸根及其衍生物。 於化學式2至化學式4中,R丨、R2、R3、R4、R5以及R6係各自 獨立選自氫;經取代或未經取代之CrCso脂肪族烷基、環脂肪族 烷基、芳基或芳烷基;聚合化合物;雜環化合物;以及其衍生物; 其中,心與R2或R4與R5可彼此連接以形成一具有或不具有雜原 子之伸烧基環(alkylene ring )。雖然並非用以限制本發明,較佳 的是,R1與R4為Ci_Ci4脂肪族炫> 基且Κ·3、尺4、Κ·5和尺6係各自分 別為鼠或C 1-C14脂肪族炫基。 由化學式1所代表之化合物的非限制特別例子為金屬(當η為1 且X不存在時),例如銀、金、銅、鋅、鎳、銘、纪、翻、鈦、飢、 猛、鐵、絡、錯、銳、紹、鶴、釕、錫、组、鍊、鐵、銀、I呂、 嫁、錯、姻、錫、錄、船、叙、釤、銪、網和灶或前述之合金; 以及金屬化合物,例如氧化銅、氧化鋅、氧化鈒、硫化錄、氯化 把、碳酸銅、氣化鐵、氣化金、氣化錄、氣化銘、确酸叙、乙醯 丙酮釩、醋酸鈷、乳酸錫、草酸錳、醋酸金、草酸鈀、2-乙基已 酸銅、硬脂酸鐵、甲酸鎳、鉬酸銨、擰檬酸鋅、醋酸鉍、氰化銅、 碳酸钻、氣化鈾、四氣金酸(hydrogentetrachloroaurate)、四丁氧 基鈦、二氣化二甲氧基锆、異丙醇鋁、四氟硼酸錫、甲醇钽、十 二基疏基金酸鹽(dodecylmercaptoaurate)、乙醯丙酮銦或其衍生 物。 1326297 較佳地,由化學式1所代表之金屬或金屬化合物為銀(Ag)或In Chemical Formula 1, M is a metal or metal alloy; n is an integer from 1 to 10; and 9 1326297 x is a substituent which is absent or is at least one selected from the group consisting of hydrogen, ammonium, oxygen, sulfur, halogen, Cyano, cyanate, carbonate, nitrate, nitrite, sulfate, phosphate, thiocyanate, oleate, percarbonate, tetrafluoroborate, acetoacetate, sulfhydryl, decylamine, alcohol Salts, carboxylates and their derivatives. In Chemical Formula 2 to Chemical Formula 4, R丨, R2, R3, R4, R5 and R6 are each independently selected from hydrogen; substituted or unsubstituted CrCso aliphatic alkyl, cycloaliphatic alkyl, aryl or aromatic An alkyl group; a polymeric compound; a heterocyclic compound; and a derivative thereof; wherein the core and R2 or R4 and R5 may be bonded to each other to form an alkylene ring with or without a hetero atom. Although not intended to limit the present invention, it is preferred that R1 and R4 are Ci_Ci4 aliphatic Hyun> base and Κ·3, 尺4, Κ·5 and 尺6 series are each a mouse or a C 1-C14 aliphatic group. Hyunji. A non-limiting specific example of the compound represented by Chemical Formula 1 is a metal (when η is 1 and X is absent), such as silver, gold, copper, zinc, nickel, Ming, Ji, Turn, Titanium, Hunger, Meng, Iron , 络, 错, 锐, 绍, 鹤, 钌, tin, group, chain, iron, silver, Ilu, marry, wrong, marriage, tin, record, ship, Syria, 钐, 铕, net and stove or the aforementioned Alloys; and metal compounds such as copper oxide, zinc oxide, antimony oxide, sulphide, chlorination, copper carbonate, gasified iron, gasification gold, gasification, gasification, acid, acetonitrile, vanadium , cobalt acetate, tin lactate, manganese oxalate, gold acetate, palladium oxalate, copper 2-ethylhexanoate, iron stearate, nickel formate, ammonium molybdate, zinc citrate, barium acetate, copper cyanide, carbonic acid drill , gasified uranium, hydrogen tetrachloroaurate, titanium tetrabutoxide, zirconium dimethoxide, aluminum isopropoxide, tin tetrafluoroborate, methanol hydrazine, dodecylmercaptoaurate ), indoleacetone or its derivatives. 1326297 Preferably, the metal or metal compound represented by Chemical Formula 1 is silver (Ag) or

銀化合物,其中n為1至4之整數且X係選自以下族群之至少一 者:氧、硫、画素、氰基、氰酸根、碳酸根、£肖酸根、亞頌酸根、 硫酸根、磷酸根、硫氰酸根、氣酸根、過氣酸根、四氟硼酸根、 乙醯丙酮根、羧酸根及其衍生物。此類銀化合物之非限制性例子 為氧化銀、硫氰酸銀、氰化銀、氰酸銀、碳酸銀、確酸銀、亞確 酸銀、硫酸銀、構酸銀、過氣酸銀、四氟棚酸銀、乙醯丙酮銀、 醋酸銀、乳酸銀、草酸銀及其衍生物。銀合金可自至少一選自以 下之金屬形成:金、銅、錄、銘、纪、始、鈦、飢、猛、鐵、鉻、 錯、銳、鉬、鶴、釕、鑛、組、鍊、鐵、錶、銘、嫁、錯、铜、 錫、錄 '錯、錢、碎、坤、采、彭、销、灶、鎮、#5、錄以及鎖, 但並非限於此。 化學式2至化學式4中之&、R2、R3 ' R4、R5和R6的非限制特 別例子為氫、曱基、乙基、丙基、異丙基、丁基、異丁基、戊基、 己基、乙基己基、庚基、辛基、異辛基、壬基、癸基、十二基、 十六基、十八基、二十二基、環丙基、環戍基、環己基、稀丙基、 羥基、甲氧基、曱氧基乙基、甲氧基丙基、氰乙基、乙氧基、丁 氧基、己氧基、甲氧基乙氧基乙基、甲氡基乙氧基乙氧基乙基、 六亞甲基亞胺(hexamethylene imine )、嗎淋、0底咬、11辰嘻、乙二 胺、丙二胺、己二胺、三伸乙二胺、吡咯、咪唑、吡啶、羧曱基、 三曱氧基矽丙基、三乙氧基矽丙基、苯基、甲氧基苯基、氰基苯 基、苯氧基、甲苯基、苯甲基、前述之衍生物、例如聚烯丙胺和 聚乙烯胺(polyethyleneimine)及其衍生物之聚合化合物。 11 1326297a silver compound, wherein n is an integer from 1 to 4 and X is selected from at least one of the group consisting of oxygen, sulfur, pixels, cyano, cyanate, carbonate, sulphate, sulphate, sulfate, phosphoric acid Root, thiocyanate, oleate, peroxylate, tetrafluoroborate, acetoacetate, carboxylate and derivatives thereof. Non-limiting examples of such silver compounds are silver oxide, silver thiocyanate, silver cyanide, silver cyanate, silver carbonate, silver sulphate, silver sulphate, silver sulphate, silver sulphate, silver sulphate, Silver PTFE, silver acetate, silver acetate, silver lactate, silver oxalate and its derivatives. The silver alloy may be formed from at least one metal selected from the group consisting of gold, copper, mud, Ming, Ji, Shi, Ti, Hung, Meng, Iron, Chromium, Wrong, Sharp, Molybdenum, Crane, Strontium, Mine, Group, Chain , iron, watch, Ming, marry, wrong, copper, tin, recorded 'wrong, money, broken, Kun, mining, Peng, pin, stove, town, #5, record and lock, but not limited to this. Non-limiting specific examples of &, R2, R3' R4, R5 and R6 in Chemical Formula 2 to Chemical Formula 4 are hydrogen, mercapto, ethyl, propyl, isopropyl, butyl, isobutyl, pentyl, Hexyl, ethylhexyl, heptyl, octyl, isooctyl, decyl, decyl, dodecyl, hexadecyl, octadecyl, docosa, cyclopropyl, cyclodecyl, cyclohexyl, Dilyl, hydroxy, methoxy, decyloxyethyl, methoxypropyl, cyanoethyl, ethoxy, butoxy, hexyloxy, methoxyethoxyethyl, formazan Ethoxyethoxyethyl, hexamethylene imine, chlorin, 0 bottom bit, 11 chen, ethylenediamine, propylenediamine, hexamethylenediamine, triethylenediamine, pyrrole , imidazole, pyridine, carboxymethyl, tridecyl propyl, triethoxy propyl, phenyl, methoxyphenyl, cyanophenyl, phenoxy, tolyl, benzyl, A derivative of the foregoing, such as polyallylamine and a polymeric compound of polyethyleneimine and its derivatives. 11 1326297

由化學式2所代表之以胺基甲酸銨為基質之化合物的特定例子 為胺基甲酸銨、乙胺基甲酸乙銨、異丙胺基甲酸異丙銨、正丁胺 基甲酸正丁銨、異丁胺基曱酸異丁銨、第三丁胺基甲酸第三丁銨、 2-乙基己基胺基甲酸2-乙基己基銨、十八胺基甲酸十八銨、2-甲氧 基乙基胺基甲酸2-曱氧基乙基銨、2-氰乙基胺基甲酸2-氰乙基銨、 二丁胺基曱酸二丁銨、二-十八胺基甲酸二-十八銨 (dioctadecylammonium dioctadecylcarbamate)、曱基癸基胺基甲 酸甲基癸基銨、六亞曱基亞胺胺基甲酸六亞甲基亞銨、嗎啉胺基 曱酸嗎啉鏽、乙基己基胺基甲酸鹽吡啶鑌、異丙基胺基曱酸三伸 乙二銨、苯甲基胺基甲酸苯甲基銨、三乙氧基矽丙基胺基甲酸三 乙氧基矽丙基銨等。由化學式3所代表之以碳酸銨為基質之化合 物的特定例子為碳酸銨、乙基碳酸乙基銨、異丙基碳酸異丙基銨、 正丁基碳酸正丁基銨、異丁基碳酸異丁基銨、第三丁基碳酸第三 丁基銨、2-乙基己基碳酸2-乙基己基銨、2-曱氧基乙基碳酸2-甲 氧基乙基銨、2-氰乙基碳酸2-氰乙基銨、十八基碳酸十八基銨、 一 丁基碳酸二丁基錄、二-十八基碳酸二-十八基錢 (dioctadecylammonium dioctadecylcarbonate)、甲基勞基碳酸甲基 癸基銨、六亞甲基亞胺碳酸六亞甲基亞銨銨、嗎啉碳酸嗎啉鑌、 苯甲基碳酸苯甲基銨、三乙氧基矽丙基碳酸三乙氧基矽丙基銨、 異丙基碳酸三伸乙二銨等。由化學式4所代表之以碳酸鹽為基質 之化合物的特定例子為碳酸氫銨、碳酸氫異丙基銨、碳酸氫第三 丁基銨、碳酸氫2-乙基己基銨、碳酸氫2-甲氧基乙基銨、碳酸氫 2-亂乙基錄、碳酸氫二-十八基敍(dioctadecylammonium 12 1326297 bicarbonate)、碳酸氫吡啶鑌、碳酸氫三伸乙二銨及前述之衍生物。 用以製備由化學式2至化學式4所代表之以胺基甲酸銨或碳酸 敍為基質之化合物並無特殊限制。舉例言之,如美國專利第 4,542,214 號(1985 年 9 月 17 日)、《/· Jw. Soc.,123, p. 10393 fSpecific examples of the compound represented by the chemical formula 2, which is based on ammonium urinate, are ammonium amide, ethyl ammonium ethinate, isopropyl ammonium isopropyl methoxide, n-butyl ammonium n-butyl carbamate, and isobutyl amide. Isobutylammonium decanoate, tert-butylammonium tert-butylcarbamate, 2-ethylhexylammonium 2-ethylhexylcarbamate, octaammonium octadecylcarboxylate, 2-methoxyethyl 2-methoxyethylammonium carbazate, 2-cyanoethylammonium 2-cyanoethylaminecarboxylate, dibutylammonium dibutylammonium decanoate, di-octadecyl ammonium bis-octadecylcarbamate Dioctadecylammonium dioctadecylcarbamate), methyl decyl ammonium decyl carbazate, hexamethylene imide hexamethylene imide, morpholinium ruthenium ruthenate, ethyl hexyl amide Salt pyridinium, isopropylamino decanoic acid triamethylene glycol, benzyl benzyl ammonium benzyl ammonium, triethoxy propyl propyl methic acid triethoxy propyl propyl ammonium. Specific examples of the ammonium carbonate-based compound represented by Chemical Formula 3 are ammonium carbonate, ethyl ammonium ethyl carbonate, isopropyl ammonium isopropyl carbonate, n-butyl ammonium n-butyl carbonate, and isobutyl carbonate. Butyl ammonium, tert-butylammonium carbonate, 2-ethylhexyl ammonium 2-ethylhexyl carbonate, 2-methoxyethyl ammonium 2-methoxyethyl carbonate, 2-cyanoethyl 2-cyanoethylammonium carbonate, octadecyl ammonium octadecyl carbonate, dibutyl butyl carbonate, dioctadecylammonium dioctadecylcarbonate, methyl hydroxymethyl carbonate Mercaptoammonium, hexamethyleneimine carbonate hexamethyleneimine ammonium, morpholine carbonate morpholinium, benzyl benzyl ammonium carbonate, triethoxy propyl propyl carbonate Ammonium, isopropyl carbonate, triethylene glycol diammonium, and the like. Specific examples of the carbonate-based compound represented by Chemical Formula 4 are ammonium hydrogencarbonate, isopropylammonium hydrogencarbonate, tert-butylammonium hydrogencarbonate, 2-ethylhexylammonium hydrogencarbonate, hydrogencarbonate 2-A Oxyethylammonium, hydrogencarbonate 2-disethyl, dioctadecylammonium 12 1326297 bicarbonate, hydrogen pyridinium bicarbonate, triamethylenediamine hydrogencarbonate and derivatives thereof. The compound to be used as the base represented by the chemical formula 2 to the chemical formula 4, which is represented by ammonium amide or carbonic acid, is not particularly limited. For example, U.S. Patent No. 4,542,214 (September 17, 1985), "/· Jw. Soc., 123, p. 10393 f

(2001) ' Ια«尽m«z>,18, p. 71247 (2002)所揭露,可由一級胺、二級 胺、三級胺或其混合物與二氧化碳來製備該以胺基甲酸銨為基質 之化合物。若每1莫耳胺使用〇 5莫耳的水,則可獲得到一以胺基 甲酸銨為基質之化合物;若每1莫耳胺使用1莫耳或更多的水, 則可獲得一以碳酸氫銨為基質之化合物。可於正常大氣壓下或加 壓下、於不存在溶劑或存在以下溶劑的情況下進行該製備:醇類, 例如甲醇、乙醇、異丙醇或丁醇;乙二醇類,例如乙二醇或甘油; 醋酸酯類,例如醋酸乙酯、醋酸丁酯或二乙二醇乙醚醋酸酿 (carbitol acetate );趟類,例如二乙喊、四氫吱鳴或二氧雜環已 院(dioxane );嗣類,例如甲基乙基網或丙_;炫類,例如己炫 或庚烷;芳族溶劑,例如苯以及曱苯;以及經齒素取代之溶劑, 例如二氯甲烧、一乳甲统及四氯化碳。二氧化碳f在氣相中發泡 或以乾冰的形式使用。可選擇地,可於超臨界狀態τ進行該製備。 於本發明中,可使用任何其他已知的方法來製備該胺基甲酸銨衍 生物及該以碳酸銨為基質之衍生物,只要最後的詰構相同即可。 換言之,該製備之溶劑、反應溫度、濃度、催化劑等並無特殊限 制。製備產率亦無特殊限制。 藉由將一胺化合物與三原子分子反應所得之一複合銨化合物可 與二氧化碳一起使用。舉例言之,一加合物(adduct)可與本發明 13 1326297 之銨化合物一起使用,該加合物可藉由將一胺化合物(例如丙胺、 癸胺及十八胺)與二氧化氮、二氧化硫或二硫化碳反應而獲得, 請參考 La«容WM,>, 19,p, 1017 (2003)及 19,p. 8168 (2003)。或者,在與胺反應的期間’可使用三原子分子及二氧化碳 來直接製備一複合之以胺基甲酸銨或碳酸銨為基質之化合物。除 此之外’可使用藉由將胺化合物與一硼化合物(例如硼酸(b〇ric acid)及蝴酸(boron acid))反應所得之化合物’且可使用例如胺 續酸錢(ammonium sulfamate)、硫酸敍、硫酸氫敍、亞硫酸錄及 其混合物之銨化合物。 以胺基甲酸銨或碳酸銨為基質之化合物係與金屬或金屬化合物 反應,以製備一金屬錯合物化合物。舉例言之,至少一由化學式1 所代表之金屬或金屬化合物係與至少一由化學式2、化學式3或化 學式4所代表之以胺基甲酸銨或碳酸銨為基質之化合物於氮氛圍 下、在正常大氣壓力下或加壓下、於不存在溶劑或存在以下溶劑 的情況下進行反應:水;醇類,例如甲醇、乙酵、異丙醇及丁醇; 乙二醇類’例如乙二醇及甘油;醋酸酯類,例如醋酸乙酯、醋酸 丁能及二乙二醇乙醚醋酸酯;醚類,例如二乙醚、四氫呋喃及二 氧雜環已烷;酮類,例如曱基乙基酮及丙酮;烴類’例如己烷及 庚挽;芳族溶劑,例如苯及甲苯;經齒素取代之溶劑,例如三氣 甲燒、二氯甲烷及四氣化碳;或前述之混合物。可選擇地,可藉 由氣備一溶液’其包含由化學式1所代表之金屬或金屬化合物及 至小一 夕一胺化合物’並將該溶液與二氧化碳反應來製得一金屬錯合 物化合物。此反應亦可於正常壓力下或加壓下、於不存在溶劑或 1326297 存在溶劑下進行。然而,該金屬錯合物化合物之製備方法並無特 殊限制且可應用任何已知的方法,只要最後的結構相同即可。換 言之,溶劑、反應溫度、濃度、催化劑等並無特殊限制。製備產 率亦無特殊限制。(2001) 'Ια«尽 m«z>, 18, p. 71247 (2002), which can be prepared from a primary amine, a secondary amine, a tertiary amine or a mixture thereof and carbon dioxide. Compound. If 〇5 moles of water is used per 1 mole of amine, a compound based on ammonium amide ammonium amide can be obtained; if 1 mole or more of water per 1 mole of amine is used, one can be obtained. Ammonium bicarbonate is a matrix compound. The preparation can be carried out under normal atmospheric pressure or under pressure in the absence of a solvent or in the presence of an alcohol such as methanol, ethanol, isopropanol or butanol; an ethylene glycol such as ethylene glycol or Glycerin; acetates such as ethyl acetate, butyl acetate or carbitol acetate; terpenoids such as diethyl sulfonate, tetrahydrogen oxime or dioxane; Terpenoids, such as methyl ethyl net or C-; genus, such as hexane or heptane; aromatic solvents, such as benzene and toluene; and dentate-substituted solvents, such as dichlorocarbyl, a milk And carbon tetrachloride. Carbon dioxide f is foamed in the gas phase or used in the form of dry ice. Alternatively, the preparation can be carried out in a supercritical state τ. In the present invention, the ammonium amide derivative and the ammonium carbonate-based derivative may be prepared by any other known method as long as the final oxime is the same. In other words, the solvent, reaction temperature, concentration, catalyst and the like of the preparation are not particularly limited. The preparation yield is also not particularly limited. A composite ammonium compound obtained by reacting an amine compound with a triatomic molecule can be used together with carbon dioxide. For example, an adduct can be used with the ammonium compound of the invention 13 1326297, which can be obtained by combining an amine compound (such as propylamine, decylamine and octadecylamine) with nitrogen dioxide. Obtained by the reaction of sulfur dioxide or carbon disulfide, please refer to La « Rong WM, >, 19, p, 1017 (2003) and 19, p. 8168 (2003). Alternatively, a compound of ammonium ammine or ammonium carbonate can be directly prepared by using a triatomic molecule and carbon dioxide during the reaction with the amine. In addition, 'a compound obtained by reacting an amine compound with a boron compound (for example, boric acid and boron acid) may be used, and for example, an ammonium sulfamate may be used. Ammonium compounds, sulfuric acid, hydrogen sulfate, sulfurous acid and mixtures thereof. A compound based on ammonium amide or ammonium carbonate is reacted with a metal or a metal compound to prepare a metal complex compound. For example, at least one metal or metal compound represented by Chemical Formula 1 and at least one compound represented by Chemical Formula 2, Chemical Formula 3 or Chemical Formula 4, which are based on ammonium amide or ammonium carbonate, are under a nitrogen atmosphere. The reaction is carried out under normal atmospheric pressure or under pressure in the absence of a solvent or in the presence of the following solvents: water; alcohols such as methanol, ethyl yeast, isopropanol and butanol; glycols such as ethylene glycol And glycerol; acetates such as ethyl acetate, butyl acetate and diethylene glycol diethyl ether acetate; ethers such as diethyl ether, tetrahydrofuran and dioxane; ketones such as mercaptoethyl ketone and Acetone; hydrocarbons such as hexane and heptane; aromatic solvents such as benzene and toluene; solvents substituted with dentate, such as trimethyl, methylene chloride and tetra-carbonated carbon; or a mixture of the foregoing. Alternatively, a metal complex compound can be obtained by preparing a solution containing a metal or a metal compound represented by Chemical Formula 1 and a small amine compound to react with carbon dioxide. This reaction can also be carried out under normal pressure or under pressure in the absence of solvent or in the presence of 1326297 solvent. However, the preparation method of the metal complex compound is not particularly limited and any known method can be applied as long as the final structure is the same. In other words, the solvent, the reaction temperature, the concentration, the catalyst, and the like are not particularly limited. There are no special restrictions on the production yield.

本發明之導電性墨水組合物包含該金屬錯合物化合物及一添加 劑。本發明墨水組合物所含有之添加劑可為以下已知的化合物: 導體、金屬前驅物、氧化劑、穩定劑、溶劑、分散劑、黏著劑樹 脂、還原劑、界面活性劑、潤濕劑、觸變劑(thixotropic agent) 及流平劑。於本發明目的範圍内,添加劑並無特殊限制且可使用 任何已知的添加劑。 若本發明中使用添加劑時,導體或金屬前驅物之種類、大小或 形狀並無特殊限制。對於導體而言,係使用至少一選自以下群組 之金屬:過渡金屬,例如銀、金、銅、鋅、錄 '銘 '纪、始、鈦、 鈒、猛、鐵、鉻、錯、銳、鈿、鶴、釕、錫、组、銖、鐵及銥; 金屬,例如紹、鎵、緒、銦、錫、錄、船及叙;鑛系元素,例如 彭及銪;釣系元素,例如荆和鈇;前述之合金或前述之合金氧化 物。此外,亦可使用導電性碳黑、石墨、奈米碳管及例如聚乙炔、 聚吡咯、聚苯胺、聚噻吩及其衍生物之導電性聚合物。 金屬前驅物亦無特殊限制。換言之,於本發明目的範圍内,可 使用任何金屬前驅物,且經由熱處理、氧化或還原處理、IR、UV、 電子束或雷射處理等而賦予導電性者較佳。舉例言之,金屬前驅 物可為一有機金屬化合物或金屬鹽且通常可由化學式1所代表, 其中Μ係至少一選自以下群組之金屬:銀、金、銅、辞、鎳、鈷、 15 1326297 叙、銘、欽、飢、锰、鐵、鉻、銘'銳、翻、鶴、釕、錫、组、 鍊、鐵、銀、is、鎵、鍺、銦、錫、録、錯、絲、衫、銪、荆和 钍或前述之合金;η為1至10之整數;且X係至少一選自以下之 取代基:氫、銨、氧、硫、鹵素、氰基、氰酸根、碳酸根、硝酸 根、亞硝酸根、硫酸根、磷酸根、硫氰酸酸、氣酸根、過氯酸根、 四氟硼酸根、乙醯丙酮根、巯基、醯胺、醇鹽、羧酸根及其衍生 物。 更精確的說,可使用以下之至少一者:金屬羰酸鹽,例如醋酸 金、醋酸銀、草酸鈀、2-乙基已酸銀、2-乙基已酸銅、硬脂酸鐵、 甲酸鎳及檸檬酸鋅;金屬化合物,例如璃酸銀、氰化銅、碳酸钻、 氣化鉑、四氯金酸、四丁氧基鈦、二氣化二甲氧基锆、異丙醇鋁、 四氟硼酸錫、氧化釩、氧化銦錫、曱醇钽、醋酸鉍、十二基巯基 金酸鹽以及乙醯丙酮銦。 導體或金屬前驅物可為球面、直線或平面或其組合。它們可為 顆粒(包括奈米顆粒)、粉末、薄片、膠狀、混成物(hybrid)、糊 狀、溶膠、溶液或其組合之形式。導體或金屬前驅物之尺寸或含 量並無特殊限制,只要它們不會對墨水的特性產生不利的影響即 可。較佳地,導體或金屬前驅物之尺寸係等於或小於50微米,考 慮到煅燒之後的膜厚度,更佳為1奈米至25微米之間。它們較佳 係不以過量來使用,以使煅燒溫度不會過度升高或不會對塗層或 圖樣形成有不利的影響。一般而言,對每100重量%之墨水組合物 而言,它們係以1重量%至90重量%,較佳為10重量%至70重 量%之量來使用。 16 1326297 於金屬錯合物化合物之製備中,可使用氧化劑作為添加劑。該 氧化劑可為氧化性氣體,例如空氣、氧和臭氧;過氧化物,例如 過氧化氫(H202)、Na202、K02、NaB03、K2S208、(Nh4)2s2〇8、 • Na2S208、H2S05、KHS05、(CH3)3c〇2H 及⑹邮灿;過氧酸, • 例如 HC03H、CH3C03H、CF3C03H、C6H5C03H、m-ClC6H5C03H ; 一通常已知之氧化無機酸,例如硝酸、硫酸、、FeCl3、The conductive ink composition of the present invention comprises the metal complex compound and an additive. The additive contained in the ink composition of the present invention may be a known compound: a conductor, a metal precursor, an oxidizing agent, a stabilizer, a solvent, a dispersing agent, an adhesive resin, a reducing agent, a surfactant, a wetting agent, a thixotropic Thixotropic agent and leveling agent. The additives are not particularly limited and any known additives may be used within the scope of the object of the present invention. When the additive is used in the present invention, the kind, size or shape of the conductor or the metal precursor is not particularly limited. For the conductor, at least one metal selected from the group consisting of transition metals such as silver, gold, copper, zinc, recorded 'Ming', Shi, Titanium, Tantalum, Meng, Iron, Chromium, Wrong, Sharp , 钿, crane, 钌, tin, group, 铢, iron and 铱; metals, such as Shao, gallium, Xu, indium, tin, recorded, ship and Syria; mineral elements, such as Peng and 铕; fishing elements, such as Jing and 鈇; the aforementioned alloy or the aforementioned alloy oxide. Further, conductive carbon black, graphite, carbon nanotubes, and conductive polymers such as polyacetylene, polypyrrole, polyaniline, polythiophene, and derivatives thereof can also be used. There are also no special restrictions on the metal precursor. In other words, any metal precursor can be used within the scope of the object of the present invention, and conductivity is preferably imparted by heat treatment, oxidation or reduction treatment, IR, UV, electron beam or laser treatment. For example, the metal precursor may be an organometallic compound or a metal salt and is generally represented by Chemical Formula 1, wherein the lanthanide is at least one metal selected from the group consisting of silver, gold, copper, rhodium, nickel, cobalt, 15 1326297 Syria, Ming, Qin, hunger, manganese, iron, chrome, Ming 'sharp, turn, crane, sputum, tin, group, chain, iron, silver, is, gallium, germanium, indium, tin, recorded, wrong, silk , 衫, 铕, 钍 and 钍 or an alloy of the foregoing; η is an integer from 1 to 10; and X is at least one substituent selected from the group consisting of hydrogen, ammonium, oxygen, sulfur, halogen, cyano, cyanate, carbonic acid Root, nitrate, nitrite, sulfate, phosphate, thiocyanate, oleate, perchlorate, tetrafluoroborate, acetoacetate, sulfhydryl, decylamine, alkoxide, carboxylate and their derivatives Things. More precisely, at least one of the following may be used: metal carboxylates such as gold acetate, silver acetate, palladium oxalate, silver 2-ethylhexanoate, copper 2-ethylhexanoate, iron stearate, formic acid Nickel and zinc citrate; metal compounds such as silver silicate, copper cyanide, carbonic acid drill, vaporized platinum, tetrachloroauric acid, titanium tetrabutoxide, dimethoxyzirconium dimethoxide, aluminum isopropoxide, Tin tetrafluoroborate, vanadium oxide, indium tin oxide, bismuth decoxide, cesium acetate, dodecyl hydrazine, and indium acetonate. The conductor or metal precursor can be spherical, linear or planar or a combination thereof. They may be in the form of granules (including nanoparticles), powders, flakes, gels, hybrids, pastes, sols, solutions or combinations thereof. The size or content of the conductor or the metal precursor is not particularly limited as long as they do not adversely affect the characteristics of the ink. Preferably, the conductor or metal precursor has a size of 50 μm or less, more preferably between 1 nm and 25 μm in consideration of the film thickness after calcination. They are preferably not used in excess so that the calcination temperature does not rise excessively or does not adversely affect the coating or pattern formation. In general, they are used in an amount of from 1% by weight to 90% by weight, preferably from 10% by weight to 70% by weight, per 100% by weight of the ink composition. 16 1326297 In the preparation of metal complex compounds, an oxidizing agent can be used as an additive. The oxidizing agent may be an oxidizing gas such as air, oxygen and ozone; a peroxide such as hydrogen peroxide (H202), Na202, K02, NaB03, K2S208, (Nh4)2s2〇8, Na2S208, H2S05, KHS05, ( CH3)3c〇2H and (6) postal; peroxyacid, • such as HC03H, CH3C03H, CF3C03H, C6H5C03H, m-ClC6H5C03H; a commonly known oxidized inorganic acid such as nitric acid, sulfuric acid, FeCl3,

Fe2(S04)3、K3Fe(CN)6、(NH4)2Fe(S04)2、Ce(NH4)4(S04)4、NaI〇4、 • KM11O4及KfrO4 ; —金屬或非金屬化合物。氧化劑可單獨使用或 以組合形式使用。可於製備期間内,進行加熱、冷卻、電解、超 音波、微波處理、高頻率處理、電漿處理、iR處理*uv處理。 舉例言之,穩定劑可包含至少一胺化合物,例如一級胺 '二級 胺以及三級胺;上述之以胺基甲酸銨、碳酸銨或碳酸氫銨為基質 之化合物;磷化合物,例如膦和亞磷酸鹽;或硫化合物,例如硫 醇和硫化物。具體而言,胺化合物可為甲胺、乙胺、正丙胺、異 丙胺、正丁胺、異丁銨、異戊胺、正己胺、2_乙基己胺、正庚胺、 • 正辛胺、異辛胺、壬胺、癸胺、十二胺、十六胺、十八胺、二十 二胺、環丙胺、環戊胺、環己胺、烯丙胺、羥基胺、氫氧化銨、 曱氧胺、2-乙醇胺 '甲氧基乙胺、2_羥基丙胺、曱氧基丙胺、氰基 乙胺、乙氧胺 '正丁氧胺、2-己氧胺、曱氧基乙氧基乙胺、甲氧 基乙氧基乙氧基乙胺、二乙胺、二丙胺、二乙醇胺、六亞甲基亞 胺、嗎啉、哌啶、哌嗪、乙二胺、丙二胺、己二胺、三伸乙二胺、 2,2-(乙二氧基)二乙胺、三乙胺、三乙醇胺、吡咯、咪唑、吡啶、 氨基乙路縮二曱醇(amm〇acetaldehyde di〇lethyl acetal)、3_胺基丙 17 1326297Fe2(S04)3, K3Fe(CN)6, (NH4)2Fe(S04)2, Ce(NH4)4(S04)4, NaI〇4, • KM11O4 and KfrO4; - metal or non-metal compound. The oxidizing agents may be used singly or in combination. Heating, cooling, electrolysis, ultrasonic, microwave treatment, high frequency treatment, plasma treatment, iR treatment*uv treatment can be performed during the preparation period. For example, the stabilizer may comprise at least one amine compound, such as a primary amine 'secondary amine and a tertiary amine; a compound based on the ammonium ammonium carbamate, ammonium carbonate or ammonium hydrogencarbonate; a phosphorus compound such as a phosphine and Phosphite; or sulfur compounds such as mercaptans and sulfides. Specifically, the amine compound may be methylamine, ethylamine, n-propylamine, isopropylamine, n-butylamine, isobutylammonium, isoamylamine, n-hexylamine, 2-ethylhexylamine, n-heptylamine, • n-octylamine. , isooctylamine, decylamine, decylamine, dodecylamine, hexadecylamine, octadecylamine, dodecaamine, cyclopropylamine, cyclopentylamine, cyclohexylamine, allylamine, hydroxylamine, ammonium hydroxide, hydrazine Oxyamine, 2-ethanolamine 'methoxyethylamine, 2-hydroxypropylamine, decyloxypropylamine, cyanoethylamine, ethoxyamine 'n-butoxyamine, 2-hexyloxyamine, decyloxyethoxy B Amine, methoxyethoxyethoxyethylamine, diethylamine, dipropylamine, diethanolamine, hexamethyleneimine, morpholine, piperidine, piperazine, ethylenediamine, propylenediamine, hexane Amine, triamethylenediamine, 2,2-(ethylenedioxy)diethylamine, triethylamine, triethanolamine, pyrrole, imidazole, pyridine, aminoethane acetal (amm〇acetaldehyde di〇lethyl acetal) ), 3_Aminopropyl 17 1326297

基二甲氧基矽烷、3-胺基丙基三乙氧基矽烷、苯胺、甲氧苯胺、 胺基苯甲腈、苯甲胺、前述之衍生物或例如聚烯丙胺和聚乙亞胺 或其衍生物之聚合物化合物。銨化合物之特定例子為以胺基甲酸 錢為基質之化合物,例如胺基甲酸銨、乙胺基甲酸乙銨、異丙胺 基甲酸丙銨、正丁胺基T酸正丁銨' 異丁胺基甲酸異丁銨、第三 丁胺基甲酸第三丁銨、2-乙基己基胺基曱酸2-乙基己基銨、十八 胺基甲酸十八銨、2-甲氧基乙基胺基曱酸2-甲氧基乙基銨、2-氰乙 基胺基甲酸2-氰乙基銨、二丁胺基曱酸二丁銨、二-十八胺基甲酸 一_十八錢(dioctadecylammonium dioctadecylcarbamate )、甲基癸 基胺基甲酸甲基癸基銨、六亞甲基亞胺胺基甲酸六亞甲基亞銨、 嗎淋胺基曱酸嗎啉鑌、乙基己基胺基甲酸吡啶鑌、異丙基胺基甲 酸三伸乙二銨、苯甲基胺基甲酸苯曱基銨、三乙氧基矽丙基胺基 甲酸三乙氧基矽丙基銨或前述之衍生物;以碳酸銨為基質之化合 物’例如碳酸銨、乙基碳酸乙基銨、異丙基碳酸異丙基銨、正丁 基碳酸正丁基銨、異丁基碳酸異丁基銨、第三丁基碳酸第三丁基 銨、2-乙基己基碳酸2-乙基己基銨、2-甲氧基乙基碳酸2_甲氧基 乙基銨、2-氰乙基碳酸2-氰乙基銨、十八基碳酸十八基錄、二丁 基碳酸二丁基銨、二-十八基碳酸二-十八基銨 (dioctadecylammonium dioctadecylcarbonate )、甲基癸基破酸甲基 癸基銨、六亞曱基亞胺碳酸六亞甲基亞銨、嗎啉碳酸嗎淋鑌、苯 甲基碳酸苯甲基銨、三乙氧基矽丙基碳酸三乙氧基石夕丙基敍、異 丙基石厌S文二伸乙—按及剛述之衍生物,以及以碳酸氫錄為基質之 化合物’例如碳酸氫銨、碳酸氫異丙基銨、碳酸氫第三丁基敍、 1326297 碳酸氫2-乙基己基銨、碳酸氫2-甲氧基乙基銨、碳酸氫2-氰乙基 敍、碳酸氫二-十八基敍(dioctadecylammonium bicarbonate)、碳 酸氫吡啶鑌、碳酸氫三伸乙二銨及前述之衍生物。磷化合物可由 通式R3P或(ROhP代表,其中R為C^-Cso烷基或芳基。此類磷化 合物之典型例子為三丁基膦、三苯基膦、三乙基膦和亞磷酸三苯 酯。此外,硫化合物可為丁硫醇、正己硫醇、二乙基疏化物、四Dimethoxy decane, 3-aminopropyl triethoxy decane, aniline, methoxyaniline, aminobenzonitrile, benzylamine, derivatives of the foregoing or, for example, polyallylamine and polyethyleneimine or a polymer compound of its derivatives. A specific example of the ammonium compound is a compound based on amino formic acid, such as ammonium urethane, ethyl ammonium ethane hydride, propyl ammonium isopropyl methoxide, n-butyl ammonium butyl butyl hydride Isobutylammonium formate, tert-butylammonium tert-butylcarbamate, 2-ethylhexylammonium 2-ethylhexylamine decanoate, octaammonium octadecylcarboxylate, 2-methoxyethylamine 2-methoxyethylammonium citrate, 2-cyanoethylammonium 2-cyanoethylaminocarbamate, dibutylammonium dibutylammonium decanoate, di-octadecylamine formic acid-dioctadecylammonium Dioctadecylcarbamate ), methyl mercaptomethyl carbamate, hexamethyleneimine hexamethylene imide, morpholinium morpholine, pyridinium ethylhexylaminocarbamate , isopropylammonium methacrylate, benzyl ammonium benzyl carbazate, triethoxy propyl propyl ammonium triethoxy propyl propyl methacrylate or the foregoing derivatives; Ammonium-based compound 'eg ammonium carbonate, ethyl ammonium ethyl carbonate, isopropyl ammonium isopropyl carbonate, n-butyl ammonium n-butyl carbonate, isobutyl carbon Isobutylammonium, tert-butylammonium carbonate, 2-ethylhexylammonium 2-ethylhexyl carbonate, 2-methoxyethylammonium 2-methoxyethyl carbonate, 2-cyanoethyl 2-cyanoethylammonium carbonate, octadecyl carbonate 18-base, dibutylammonium dibutylammonium carbonate, dioctadecylammonium dioctadecylcarbonate, methyl thiol acid Methyl decyl ammonium, hexamethyleneimine carbonate hexamethyleneimine, morpholine carbonate, benzyl benzyl ammonium carbonate, triethoxy propyl propyl triethoxy oxalate Kesu, isopropyl sulphate, S-Shen Di-B--- and derivatives as described below, and compounds recorded with hydrogencarbonate as 'substrate, such as ammonium bicarbonate, isopropylammonium hydrogencarbonate, dibutyl bromide , 1326297 2-ethylhexylammonium hydrogencarbonate, 2-methoxyethylammonium hydrogencarbonate, 2-cyanoethyl hydrogencarbonate, dioctadecylammonium bicarbonate, pyridinium bicarbonate, carbonic acid Hydrogen triethylene diammonium and the aforementioned derivatives. The phosphorus compound may be represented by the formula R3P or (ROhP, wherein R is C^-Cso alkyl or aryl. Typical examples of such phosphorus compounds are tributylphosphine, triphenylphosphine, triethylphosphine and phosphorous triphosphate Phenyl ester. In addition, the sulfur compound may be butyl mercaptan, n-hexyl mercaptan, diethyl dilute, four

氫噻吩等。穩定劑之含量並無限制,只要其不會對墨水特性產生 不利的影響即可。然而,它的含量,對每100%之金屬或金屬化合 物而言,較佳為0.1%至90%,更佳為1°/。至50%,最佳為5%至30%, 以莫耳比計。在此範圍之外,膜的導電性可能會減少並使儲存穩 定性下降。儲存穩定性下降會使膜的品質產生問題《此外,若穩 定劑之含量係在前述範圍之外,則藉由塗覆墨水組合物並锻燒所 獲得之膜可能為不均勻或不精確且可能會有破裂發生。 可能需要一溶劑來控制墨水的黏度或促進膜的形成。為了達到 此目的,可使用水;醇類,例如甲醇、乙醇、異丙醇、曱氧基 丙醇、丁醇、乙基己醇及松油醇;乙二醇類,例如乙二醇及甘油; 醋酸酯類,例如醋酸乙酯、醋酸丁酯、醋酸甲氧基丙醋、二乙二 醇乙醚醋酸S旨、乙基二乙二醇乙醚醋酸S旨;醚類,例如甲基溶纖 維劑(methylcellosolve)、丁基溶纖維劑(butylcellosolve)、二乙 醚、四氫呋喃及二氧雜環己烷;酮類,例如甲基乙基酮、丙網' 二甲基甲酿胺及1-甲基-2-°比洛烧闕;煙類,例如己院、庚烧、十 二烷、石蠟油及礦油精(mineral spirit);芳族溶劑,例如苯、甲 苯及二曱苯(xylene );經鹵素取代之溶劑,例如三氣甲烧、二氣 1326297 曱烷及四氯化碳;乙腈;二甲基亞砜;或前述之混合物。 分散劑係用以有效地分散顆粒狀或薄片狀之導體。為達成此目 的,可使用EFKA的4000系列、BYK的Disperbyk系列、Avecia 的 Solsperse 系列、Degussa 的 TEGO Dispers 系列、Elementis 的 Disperse-AYD 系列、Johnson Polymer 的 JONCRYL 系列等。 黏著劑樹脂可為以下之至少一者:丙稀酸樹脂,例如聚丙稀酸 及聚丙稀酸醋,纖維素樹脂’例如乙基纖維素、纖維素醋及硝酸Hydrothiophene and the like. The content of the stabilizer is not limited as long as it does not adversely affect the characteristics of the ink. However, its content is preferably from 0.1% to 90%, more preferably 1% per 100% of the metal or metal compound. Up to 50%, optimally 5% to 30%, in molar ratio. Outside this range, the conductivity of the film may be reduced and storage stability may be degraded. A decrease in storage stability may cause problems in the quality of the film. Further, if the content of the stabilizer is outside the foregoing range, the film obtained by coating the ink composition and calcining may be uneven or inaccurate and may There will be a break. A solvent may be required to control the viscosity of the ink or to promote film formation. For this purpose, water can be used; alcohols such as methanol, ethanol, isopropanol, decyloxypropanol, butanol, ethylhexanol and terpineol; glycols such as ethylene glycol and glycerol Acetate, such as ethyl acetate, butyl acetate, methoxyacetic acid acetate, diethylene glycol ethyl ether acetate, ethyl diethylene glycol ethyl ether acetate; ether, such as methyl fibrin (methylcellosolve), butyl cellosolve, diethyl ether, tetrahydrofuran and dioxane; ketones such as methyl ethyl ketone, propyl dimethyl ketone and 1-methyl-2- °Billow; smog, such as hexagram, gargane, dodecane, paraffin oil and mineral spirit; aromatic solvents such as benzene, toluene and xylene; replaced by halogen Solvents such as trimethyl ketone, digas 1326297 decane and carbon tetrachloride; acetonitrile; dimethyl sulfoxide; or a mixture of the foregoing. Dispersants are used to effectively disperse the conductors in the form of granules or flakes. To achieve this, use EFKA's 4000 series, BYK's Disperbyk series, Avecia's Solsperse series, Degussa's TEGO Dispers series, Elementis' Disperse-AYD series, and Johnson Polymer's JONCRYL series. The adhesive resin may be at least one of: an acrylic resin such as polyacrylic acid and polyacrylic acid vinegar, a cellulose resin such as ethyl cellulose, cellulose vinegar, and nitric acid

纖維素;脂肪族或共聚物聚酯樹脂;乙烯樹脂,例如聚乙烯醇縮 丁醛(polyvinylbutyral)、聚醋酸乙烯酯和聚乙烯吡咯烷酮;聚醯 胺樹Jia ’ t胺Sa柄月曰’ t鍵树脂,腺樹脂;酵酸樹脂(alkyd resin ); 聚矽氧樹脂;氟化樹脂;烯烴樹脂,例如聚乙烯或聚苯乙烯;熱 塑性樹脂,例如石油及松香;環氧樹脂;不飽和或乙烯基聚酯樹 脂,二稀丙基醜酸g旨樹脂(diallylphthalate resin);酌·樹脂;氧丁 環樹脂(oxetane resin);噁嗪樹脂(oxazine resin);雙馬來亞醯 胺樹脂(bismaleimide resin);經改質之聚矽氧樹脂,例如聚矽氧 環氧化物或聚矽氧聚酯;熱固性樹脂,例如三聚氰胺;經uv或 電子束硬化之丙烯酸樹脂;乙烯-丙烯橡膠(EPR);苯乙烯_丁二 烯橡膠(SBR);或天然聚合物,例如澱粉及明膠。除了這些有機 勒著劑树月曰之外,亦可使用無機黏著劑,例如玻璃樹脂或玻璃質 (glass frit);矽烷偶合劑,例如三甲氧基丙基矽烷及乙烯基三乙 氣基石夕烧;或以鈦、锆或銘為基質之偶合劑。 界面活性劑可為陰離子界面活性劑’例如十二烷基硫酸鈉 (sodium lauryl sulfate);非陰離子界面活性劑,例如壬基苯氧基 20 1326297 聚乙氧基乙醇或杜邦的fsn ;陽離子界面活性劑,例如氣化十二 基笨基銨;或兩性界面活性劑’例如十二基甜菜鹼〇aurylbetaine) 及挪子甜菜驗(coco betaine ) 〇 潤濕劑或湖濕分散劑可為聚乙二醇、Air pr〇duct的Surfynol系 列或Degussa的TEGO Wet系列。此外,觸變劑或流平劑可以是 BYK 的 BYK 系列、Degussa 的 Glide 系列、EFKA 的 EFKA 3000 系列、Cognis的DSX系列等。Cellulose; aliphatic or copolymer polyester resin; vinyl resin, such as polyvinyl butyral, polyvinyl acetate and polyvinylpyrrolidone; polyamine tree Jia't amine Sa stalk Resin, gland resin; alkyd resin; polyoxyn resin; fluorinated resin; olefin resin, such as polyethylene or polystyrene; thermoplastic resin, such as petroleum and rosin; epoxy resin; unsaturated or vinyl Polyester resin, diallylphthalate resin; discrete resin; oxetane resin; oxazine resin; bismaleimide resin Modified polyoxynene resin, such as polyoxyn epoxide or polyoxyethylene polyester; thermosetting resin such as melamine; uv or electron beam hardened acrylic resin; ethylene-propylene rubber (EPR); styrene _ Butadiene rubber (SBR); or natural polymers such as starch and gelatin. In addition to these organic binders, inorganic binders such as glass resins or glass frit; decane coupling agents such as trimethoxypropyl decane and vinyl triethylene ketone can be used. Or a coupling agent based on titanium, zirconium or imprint. The surfactant may be an anionic surfactant such as sodium lauryl sulfate; a non-anionic surfactant such as nonylphenoxy 20 1326297 polyethoxyethanol or DuPont fsn; cationic interfacial activity Agents such as gasified dodecyl ammonium; or amphoteric surfactants such as guanaurylbetaine and coco betaine 〇 wetting agent or lake wet dispersing agent can be polyethylene Alcohol, Air pr〇duct's Surfynol series or Degussa's TEGO Wet series. In addition, the thixotropic agent or leveling agent can be BYK's BYK series, Degussa's Glide series, EFKA's EFKA 3000 series, and Cognis' DSX series.

可添加一還原劑以促進锻燒。舉例言之,可使用聯胺;醋酸醯 肼(acetic hydrazide);硼氫化鈉或硼氫化鉀;檸檬酸三鈉;胺化 合物,例如曱基二乙醇胺和二曱基胺硼烷;金屬鹽,例如氯化亞 鐵及硫酸鐵;氫;峨化氫;一氧化碳;路化合物,例如〒酸及乙 醛;有機化合物,例如葡萄糖、抗壞血酸、水楊酸、單寧酸、鄰 苯三酚(pyrogallol)及對苯二酚(hydroquinone)等。 選擇性地’本發明之導電性墨水組合物可藉由以下方法而製 得:製備一由化學式1中所代表之金屬或金屬化合物與過量的胺 ^ 化合物、以胺基甲酸錄或碳酸錄為基質之化合物中之至少一者的 混合物溶液;視需要,添加一導體、金屬前驅物、分散劑、黏著 劑或一添加劑;並隨後將該溶液與二氧化碳反應。可於正常壓力 下或加壓下、於不存在溶劑或存在溶劑的情況下進行該反應。 本發明之金屬錯合物化合物可由以下化學式5所代表: MAm (5) A為化學式2至化學式4所代表之化合物,且〇.5^nS5.5。 根據本發明所製備之墨水組合物具優異穩定性,因而可使用各 21 1326297 式各樣的基材並透過塗覆或印刷的方式來輕易地形成膜或圖樣。 舉例言之,它可塗覆或直接印刷於以下基材上:金屬、玻璃、矽 晶圓、陶瓷、例如聚酯或聚亞醯胺之塑膠膜、橡膠片、纖維、木 頭及紙。可於用水清洗、脂肪移除或經特殊前處理之後使用該基 材。該前處理之方式有電槳、離子束或電暈處理、氧化或還原、 加熱、蝕刻、uv處理、使用上述之黏著劑或添加劑的底漆處理等。 考慮到墨水的物理特性’可藉由旋轉塗覆、滾筒塗覆、喷灌塗覆、 浸潰塗覆、淋流塗覆、刮刀塗覆、點膠(dispensing)、喷墨印刷、. 平版印刷、網版印刷、移轉印刷、柔版印刷、膠版印刷、刻板印 ® 刷、印模法、靜電印刷、微影印刷等來進行膜製備或印刷。 本發明墨水之黏度並無特殊限制’只要不會對膜的形成或印刷 產生不利的影響即可。僅管端視製備方法和特殊種類的墨水而 定’黏度是隨之改變的,黏度較佳為0.1厘泊至1,〇〇〇,〇〇〇厘泊且 更佳為1厘泊至500,000厘泊。當膜或圖樣的形成係藉由喷墨印刷 來完成時,墨水的黏度成為一重要的因素。在此情況下,黏度為 0.1厘泊至50厘泊’較佳為1厘泊至20厘泊,更佳為2厘泊至15 φ 厘泊係有利的。若黏度過小,可能因膜厚度不足而使導電度不夠。 反之’右黏度過大’墨水可能不易流動。 對於金屬或金屬氧化物圖樣的形成而言,可藉由氧化或還原、 熱處理、IR、UV、電子束或雷射等對如此所製得之膜或圖樣進行 後處理。端視需求而定,可於惰性氣體氛圍下、或於空氣、氮氣 或一氧化碳、或含有氫和空氣或其他'惰性氣體的混合物下進行該 熱處理。為得到膜之更佳物理特性,該熱處理通常係於8〇〇c至 22 500oc 下造 >- 為了犋的:仃較佳為9〇<3C至3〇〇°C,更佳為100°C至25〇〇C。A reducing agent may be added to promote calcination. For example, hydrazine; acetic hydrazide; sodium borohydride or potassium borohydride; trisodium citrate; amine compounds such as decyldiethanolamine and dinonylamine borane; metal salts, for example, may be used. Ferrous chloride and ferric sulfate; hydrogen; hydrogen halide; carbon monoxide; road compounds such as citric acid and acetaldehyde; organic compounds such as glucose, ascorbic acid, salicylic acid, tannic acid, pyrogallol and Hydroquinone and the like. Alternatively, the conductive ink composition of the present invention can be obtained by preparing a metal or metal compound represented by Chemical Formula 1 and an excess of an amine compound, recording with an aminocarboxylic acid or carbonic acid. a mixture solution of at least one of the compounds of the matrix; if necessary, a conductor, a metal precursor, a dispersant, an adhesive or an additive; and then reacting the solution with carbon dioxide. The reaction can be carried out under normal pressure or under pressure in the absence of a solvent or in the presence of a solvent. The metal complex compound of the present invention can be represented by the following Chemical Formula 5: MAm (5) A is a compound represented by Chemical Formula 2 to Chemical Formula 4, and 〇.5^nS5.5. The ink composition prepared according to the present invention has excellent stability, and thus various substrates of 21 1326297 can be used and a film or pattern can be easily formed by coating or printing. For example, it can be applied or printed directly onto the following substrates: metal, glass, germanium wafers, ceramics, plastic films such as polyester or polyimide, rubber sheets, fibers, wood and paper. The substrate can be used after washing with water, fat removal or after special pretreatment. The pretreatment method includes electric paddle, ion beam or corona treatment, oxidation or reduction, heating, etching, uv treatment, primer treatment using the above-mentioned adhesive or additive, and the like. Considering the physical properties of the ink 'can be applied by spin coating, roller coating, spray coating, dip coating, leaching coating, blade coating, dispensing, inkjet printing, lithography, Screen printing, transfer printing, flexographic printing, offset printing, stenciling, brushing, stamping, xerographic, lithography, etc. for film preparation or printing. The viscosity of the ink of the present invention is not particularly limited as long as it does not adversely affect the formation or printing of the film. The viscosity is changed depending on the preparation method and the particular type of ink. The viscosity is preferably from 0.1 cps to 1, 〇〇〇, 〇〇〇 centipoise and more preferably from 1 cps to 500,000 PCT. Parking. When the formation of a film or pattern is accomplished by ink jet printing, the viscosity of the ink becomes an important factor. In this case, it is advantageous that the viscosity is from 0.1 cps to 50 cps, preferably from 1 cps to 20 cps, more preferably from 2 cps to 15 φ centipoise. If the viscosity is too small, the conductivity may be insufficient due to insufficient film thickness. Conversely, 'right viscosity is too large' ink may not flow easily. For the formation of a metal or metal oxide pattern, the film or pattern thus obtained can be post-treated by oxidation or reduction, heat treatment, IR, UV, electron beam or laser. Depending on the requirements, the heat treatment can be carried out under an inert gas atmosphere, or with air, nitrogen or carbon monoxide, or a mixture containing hydrogen and air or other 'inert gas. In order to obtain better physical properties of the film, the heat treatment is usually carried out at 8 ° C to 22 500 cc. - For 犋: 仃 is preferably 9 〇 < 3C to 3 〇〇 ° C, more preferably 100 °C to 25〇〇C.

至15〇。匸均句性可於不同溫度下進行該熱處理 。例如,可於80°C i八 處理1为鐘至30分鐘,接著於l5〇°C至3〇0。(:下處理 77至30分鐘來進行該熱處理。 本發明可提供多種導電性墨水組合物包含—金屬錯合物化合 I -係藉由將至少—由化學式1所代表之金屬或金屬化合物與 由化予式2化學式3或化學式4所代表之以胺基甲酸敍或 碳酸銨為基質之化合物以及一添加劑反應而獲得。 本發月墨水組s物具優異穩定性與溶解度,可輕易形成膜且即 便在低於2GG°C或以下之溫度下亦係易於锻燒以形成具良好導 電性之膜或圖樣。本發明墨水組合物可塗覆蓋或直接印刷於多種 基材上’包含金屬、玻璃、梦晶圓、喊、例如㈣或聚亞醯胺 之塑膠膜、橡膠片、纖維、木頭及紙。端視墨水的物理特性而定, 可貫施多種膜形成或印刷方法,例如旋轉塗覆、滾筒塗覆、喷灑 塗覆、浸潰塗覆、淋流塗覆、刮刀塗覆、點膠、噴墨印刷、平版 印刷、網版印刷、移轉印刷、柔版印刷、膠版印刷、刻板印刷、 印模法、靜電印刷、微影印刷等。 使用本發明墨水組合物可形成具優異導電性及黏著性之均勻 膜。此外,該膜係不易破裂的。 此外’本發明墨水組合物可用於EMI屏蔽材料、導電性黏著劑、 低電阻金屬線、PCBs、FPCs、RFID標籤的天線、pdps、TFT-LCDS、 OLEDs、軟性顯不益及OTFTs之太1%能電池、二次電池或燃料電 池以及電極或接線。 23 1326297 【實施方式】 於下文中,將藉助於實施例來進一步詳細說明本發明。然而, 應瞭解熟知本發明技術領域者在考慮本揭露内容之後,可在本發 明精神及範圍内進行修改及改良。 實施例1To 15 baht. The uniformity of the sentence can be carried out at different temperatures. For example, it can be treated at 80 ° C i8 for 1 to 30 minutes, followed by 1 to 5 ° C to 3 〇 0. (The lower treatment is carried out for 77 to 30 minutes to carry out the heat treatment. The present invention can provide a plurality of conductive ink compositions comprising - a metal complex compound I - by at least - a metal or a metal compound represented by Chemical Formula 1 It is obtained by reacting a compound represented by the formula 3 or the chemical formula 4 with an aminocarboxylic acid or ammonium carbonate as a matrix and an additive. The ink set of the present invention has excellent stability and solubility, and can be easily formed into a film. Even at temperatures below 2 GG ° C or below, it is easy to calcination to form a film or pattern with good electrical conductivity. The ink composition of the present invention can be coated or directly printed on a variety of substrates - including metal, glass, Dream wafers, shouting, plastic films such as (iv) or polyamido, rubber sheets, fibers, wood and paper. Depending on the physical properties of the ink, a variety of film formation or printing methods can be applied, such as spin coating, Roller coating, spray coating, dip coating, leaching coating, knife coating, dispensing, inkjet printing, lithography, screen printing, transfer printing, flexographic printing, offset printing, engraving Printing, stamping, xerographic printing, lithography, etc. The use of the ink composition of the present invention can form a uniform film having excellent electrical conductivity and adhesion. Further, the film is not easily broken. Further, the ink composition of the present invention can be used. EMI shielding materials, conductive adhesives, low-resistance metal wires, PCBs, FPCs, RFID tag antennas, pdps, TFT-LCDS, OLEDs, softness and OTFTs, 1% energy battery, secondary battery or fuel The invention will be further described in detail below with the aid of the embodiments. However, it should be understood that those skilled in the art of the present invention may be in the spirit of the invention after considering the disclosure. Modifications and improvements are made within the scope and scope.

於一裝設有一攪拌器之50毫升Schlenk燒瓶中,將9.52克(31.48 毫莫耳)2-乙基己基胺基甲酸2-乙基己基銨(一黏稠液體)溶於 一包含10.00毫升甲醇及3.00毫升含水溶液之混合溶液中。接著, 添加1.00克(15.74毫莫耳)銅粉末(Aldrich,顆粒尺寸=1微米 至5微米)並於室溫氧氣發泡下反應30分鐘》當反應進行時,該 反應混合物變成一深咖啡色漿料並且最終變成一藍色、透明的溶 液。於真空中將溶劑自該反應溶液中移除,以獲得7.15克藍色銅 錯合物化合物。經熱重量分析法(thermogravimetric analysis,TGA ) 確認銅含量為11.28重量%。於3·00克銅錯合物化合物中添加5.00 克銅薄片(TSC-20F ’ Chang Sung)、溶解於1.80克丁基二乙二醇 乙謎(butylcarbitol )之 0.20 克聚乙烯醇縮丁搭(BS-18,Wacker ) · (一黏著劑)。在擾拌10分鐘後,將該混合物移至一三滾輪研磨 機(three-roll mil卜 Drais Mannheim )五次,以獲得一黏度為 72,600 厘泊之導電性墨水組合物。經熱重量分析法確認金屬含量為53.33 重量% (請參第1圖)。於氮氛圍下,使用一具325網孔圖樣化之 絲網印刷機將該墨水組合物塗覆於PET膜上,以獲得一均勻且精 確的膜’於表1之溫度下煅燒該膜,以獲得第2圖之圖樣。該膜 之導電性(平面電阻率(planar resistivity))及黏著性係如表1所 24 1326297 示。 實施例2In a 50 ml Schlenk flask equipped with a stirrer, 9.52 g (31.48 mmol) of 2-ethylhexylaminocarbamate 2-ethylhexylammonium (a viscous liquid) was dissolved in a solution containing 10.00 ml of methanol and 3.00 ml of a mixed solution of an aqueous solution. Next, 1.00 g (15.74 mmol) of copper powder (Aldrich, particle size = 1 μm to 5 μm) was added and reacted for 30 minutes under oxygen foaming at room temperature. When the reaction proceeded, the reaction mixture became a dark brown paste. And finally turned into a blue, clear solution. The solvent was removed from the reaction solution in vacuo to obtain 7.15 g of a blue copper complex compound. The copper content was confirmed to be 11.28% by weight by thermogravimetric analysis (TGA). 5.00 g of copper flakes (TSC-20F ' Chang Sung), 0.20 g of polyvinyl condensate dissolved in 1.80 g of butylcarbitol were added to the 3.00 g copper complex compound. BS-18, Wacker) · (an adhesive). After 10 minutes of scramble, the mixture was transferred to a three-roll mil drais Mannheim five times to obtain a conductive ink composition having a viscosity of 72,600 centipoise. The metal content was confirmed by thermogravimetric analysis to be 53.33 wt% (refer to Fig. 1). The ink composition was applied to a PET film using a 325 mesh patterned screen printer under a nitrogen atmosphere to obtain a uniform and precise film 'calcined at the temperature of Table 1 to Obtain the pattern of Figure 2. The conductivity (planar resistivity) and adhesion of the film are shown in Table 1 of 24 1326297. Example 2

於一裝設有一攪拌器之50毫升Schlenk燒瓶中,將6.99克(3 1.48 毫莫耳)3-甲氧基丙基胺基甲酸3-甲氧基丙基銨(一黏稠液體) 溶於一包含5.00毫升曱醇及50重量%的含水過氧化氫(H2〇2)溶 液之2.00克混合溶液中。接著,添加1.00克(15.74毫莫耳)金 屬銅並於室溫下反應2小時。當反應進行時,該反應混合物變成 一深咖啡色漿料並且最終變成一藍色、透明的溶液。於真空中將 溶劑自該反應溶液中移除,以獲得5.58克藍色銅錯合物化合物。 經熱重量分析法(TGA)確認銅含量為16.26重量%。藉由添加1.00 克曱醇將1.00克銅錯合物化合物溶解。接著,藉由將一 1:1 (莫耳 比)之2-乙基己基胺基曱酸2-乙基己基銨和2-甲氧基乙基胺基甲 酸2-甲氧基乙基銨的混合物與氧化銀(銀含量=22.00重量%)反 應而獲得之8.00克錯合物化合物,以獲得到一黏度為50.7厘泊之 透明墨水組合物。於氮氛圍下塗覆該墨水組合物,以獲得一均勻 且精確的膜,於表1之溫度下煅燒該膜。該膜之導電性(平面電 阻(planar resistance))及黏著性係如表1所示。 實施例3 於一裝設有一攪拌器之50毫升Schlenk燒瓶中,將7.53克(41.88 毫莫耳)異丙基胺基曱酸異丙基銨溶於一包含有20.00毫升甲醇及 50重量%的含水過氧化氫(H202)溶液之1.89克混合溶液中。接 著,添加1.00克(6.98毫莫耳)氧化銅(I)並於室溫下反應2小時。 當反應進行時,該反應混合物變成一深咖啡色漿料並且最終變成 25 1326297In a 50 ml Schlenk flask equipped with a stirrer, 6.99 g (3 1.48 mmol) of 3-methoxypropylammonium 3-methoxypropylammonium (a viscous liquid) was dissolved in one. A 2.00 g mixed solution containing 5.00 ml of sterol and 50% by weight of an aqueous hydrogen peroxide (H 2 〇 2) solution. Next, 1.00 g (15.74 mmol) of metallic copper was added and reacted at room temperature for 2 hours. As the reaction proceeded, the reaction mixture turned into a dark brown slurry and eventually turned into a blue, clear solution. The solvent was removed from the reaction solution in vacuo to obtain 5.58 g of a blue copper complex compound. The copper content was confirmed by thermogravimetric analysis (TGA) to be 16.26% by weight. 1.00 g of the copper complex compound was dissolved by adding 1.00 g of sterol. Next, by using a 1:1 (mole ratio) of 2-ethylhexylamino phthalic acid 2-ethylhexyl ammonium and 2-methoxyethyl carbamic acid 2-methoxyethyl ammonium The mixture was reacted with silver oxide (silver content = 22.00% by weight) to obtain 8.00 g of the complex compound to obtain a clear ink composition having a viscosity of 50.7 centipoise. The ink composition was applied under a nitrogen atmosphere to obtain a uniform and precise film, and the film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 3 In a 50 ml Schlenk flask equipped with a stirrer, 7.53 g (41.88 mmol) of isopropylammonium isopropyl amide was dissolved in a solution containing 20.00 ml of methanol and 50% by weight. 1.89 g of a mixed solution of an aqueous hydrogen peroxide (H202) solution. Next, 1.00 g (6.98 mmol) of copper (I) oxide was added and reacted at room temperature for 2 hours. As the reaction proceeded, the reaction mixture turned into a dark brown slurry and eventually became 25 1326297

一藍色、透明的溶液。於真空中將溶劑自該反應溶液中移除,以 獲得6.28克藍色銅錯合物化合物。經熱重量分析法(TGA)確認 銅含量為14.17重量%。添加3.00克銅錯合物化合物至2.80克透 明丁基溶纖維劑中,其溶有4.00克銀薄片(EA0295,Chemet)及 0.20克聚乙烯醇縮丁醛(Wacker)(—黏著劑)。在攪拌10分鐘後, 將該溶液移至一三滾輪研磨機五次,以獲得一黏度為350.4厘泊之 導電性墨水組合物。於氮氛圍下塗覆該墨水組合物,以獲得一均 勻且精確的膜,於表1之溫度下煅燒該膜。該膜之導電性(平面 電阻)及黏著性係如表1所示。 實施例4 於一裝設有一攪拌器之50毫升Schlenk燒瓶中,將6.79克(41·88 毫莫耳)異丙基胺基甲酸異丙基銨溶於一包含20.00毫升甲醇及 50重量%的含水過氧化氫溶液之1.89克混合溶液中。接著,添加 1.00克(6.98毫莫耳)氧化銅(I)並於室溫下反應2小時。當反應 進行時,該反應混合物變成一深咖啡色漿料並且最終變成一藍 色、透明的溶液。於真空中將溶劑自該反應溶液中移除,以獲得 φ 6.35克藍色銅錯合物化合物。經熱重量分析法(TGA)確認銅含 量為14.61重量%。添加2.00克銅錯合物化合物至一溶液中,其 中係將1.00克甲醇及1.00克2-乙基己胺溶於6.00克醋酸銀中。 在攪拌10分鐘後,可獲得一黏度為26.7厘泊之透明墨水組合物。 於氮氛圍下塗覆該墨水組合物,以獲得一均勻且精確的膜,於表1 之溫度下煅燒該膜。該膜之導電性(平面電阻)及黏著性係如表1 所示。 26 1326297 實施例5 於一裝設有一攪拌器之50毫升Sch丨enk燒瓶中,將u %克 ( 38.22毫莫耳)2·乙基己基胺基甲酸2_乙基己基錢(__黏稠液體) • 溶於5毫升乙腈及lo.oo亳升甲醇中。接著,添加i 00克(1529 " 毫莫耳)辞粉末(Aldrich ,顆粒尺寸= ι〇〇網孔或更小)並於室溫 下反應10小時。當反應進行時,該反應混合物變成一灰色紫料並 且最終變成一無色、透明的溶液。於真空中將溶劑自該反應溶液 中移除,以獲知丨1.87克白色辞錯合物化合物。經熱重量分析法 (TGA)確認辞含量為14.78重量%。添加2 〇〇克鋅錯合物化合物 至2.80克透明甲基溶纖維劑中,其溶有5〇〇克銀薄片(cheme〇 及0.20克聚乙烯基丁醛(Wacker)(—黏著劑)β在攪拌1〇分鐘後, 將該溶液移至-三滾輪研磨機五次,以獲得—黏度為i 26G厘泊之 導電性墨水組合物。於氮氛圍下塗覆該墨水組合物,以獲得一均 勻且精球的膜’於表i之溫度下炮燒該膜。該膜之導電性(平面 電阻)及黏著性係如表1所示。 % 實施例6 於-裝設有-授拌器之50毫升Schlenk燒瓶中,將6 63克(36 84 毫莫耳)異丙基碳酸氫異丙基銨溶於7⑼毫升之14重量%的敍含 水溶液中。接著’添加〖.㈨克(12 28毫莫耳)氧化鋅(π)並於室 溫下反應2小時。當反應進行時,該反應混合物變成—白色浆料 並且最終變成-無色、透明的溶液。於真空中將溶劑自該反應溶 液中移除,以獲得5,52克白色鋅錯合物化合物。經熱重量分析法 (TGA)確認鋅含量為15.2G重量%。添加L⑻克鋅錯合物化合物 27 1326297 至一溶液中,其中係將藉由將異丙基碳酸異丙基銨與氧化銀(銀 含量=36.45重量% )反應而製得之7.00克銀錯合物化合物溶於2.00 克甲醇中。在攪拌10分鐘後,可獲得一黏度為27.4厘泊之透明墨 水組合物。於氮氛圍下塗覆該墨水組合物,以獲得到一均勻且精 確的膜,於表1之溫度下煅燒該膜。該膜之導電性(平面電阻) 及黏著性係如表1所示。 實施例7A blue, transparent solution. The solvent was removed from the reaction solution in vacuo to obtain 6.28 g of a blue copper complex compound. The copper content was confirmed by thermogravimetric analysis (TGA) to be 14.17% by weight. 3.00 g of the copper complex compound was added to 2.80 g of a transparent butyl-solvent containing 4.00 g of silver flakes (EA0295, Chemet) and 0.20 g of polyvinyl butyral (Wacker) (-adhesive). After stirring for 10 minutes, the solution was transferred to a three-roll mill for five times to obtain a conductive ink composition having a viscosity of 350.4 centipoise. The ink composition was applied under a nitrogen atmosphere to obtain a uniform and precise film, and the film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 4 In a 50 ml Schlenk flask equipped with a stirrer, 6.79 g (41.88 mmol) of isopropylammonium isopropylcarbamate was dissolved in a solution containing 20.00 ml of methanol and 50% by weight. 1.89 g of the mixed solution of the aqueous hydrogen peroxide solution. Next, 1.00 g (6.98 mmol) of copper (I) oxide was added and reacted at room temperature for 2 hours. As the reaction proceeded, the reaction mixture turned into a dark brown slurry and eventually turned into a blue, clear solution. The solvent was removed from the reaction solution in vacuo to obtain 6.35 g of a blue copper complex compound. The copper content was confirmed to be 14.61% by weight by thermogravimetric analysis (TGA). 2.00 g of the copper complex compound was added to a solution in which 1.00 g of methanol and 1.00 g of 2-ethylhexylamine were dissolved in 6.00 g of silver acetate. After stirring for 10 minutes, a clear ink composition having a viscosity of 26.7 centipoise was obtained. The ink composition was applied under a nitrogen atmosphere to obtain a uniform and precise film, and the film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. 26 1326297 Example 5 In a 50 ml Sch丨enk flask equipped with a stirrer, u% g (38.22 mmol) of 2-ethylhexylaminocarbamic acid 2-ethylhexyl (__ viscous liquid) • Dissolved in 5 ml of acetonitrile and lo.oo in methanol. Next, i 00 g (1529 " millimolar) powder (Aldrich, particle size = ι mesh or smaller) was added and reacted at room temperature for 10 hours. As the reaction proceeded, the reaction mixture turned into a grayish purple material and eventually turned into a colorless, clear solution. The solvent was removed from the reaction solution in vacuo to give a solution of 1.87 g of a white compound. The content of the confirmed content by thermogravimetric analysis (TGA) was 14.78% by weight. Add 2 g of zinc complex compound to 2.80 g of clear methyl fibrin, which is dissolved in 5 g of silver flakes (cheme〇 and 0.20 g of polyvinyl butyral (Wacker) (-adhesive) β After stirring for 1 minute, the solution was transferred to a three-roll mill for five times to obtain a conductive ink composition having a viscosity of i 26 G centipoise. The ink composition was applied under a nitrogen atmosphere to obtain a uniformity. And the film of the fine ball was fired at the temperature of Table i. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. % Example 6 - equipped with - agitator In a 50 ml Schlenk flask, 6 63 g (36 84 mmol) of isopropyl ammonium isopropyl carbonate was dissolved in 7 (9) ml of a 14% by weight aqueous solution, followed by 'addition 〖. (9) g (12 28 mM zinc oxide (π) and reacted at room temperature for 2 hours. As the reaction proceeds, the reaction mixture becomes a white slurry and eventually becomes a colorless, transparent solution. The solvent is added to the reaction solution in vacuo. Removed to obtain 5,52 grams of white zinc complex compound. Thermogravimetric analysis (TGA) The zinc content is 15.2 Gg %. L (8) g of zinc complex compound 27 1326297 is added to a solution by reacting isopropyl ammonium isopropyl carbonate with silver oxide (silver content = 36.45% by weight) The obtained 7.00 g of the silver complex compound was dissolved in 2.00 g of methanol. After stirring for 10 minutes, a clear ink composition having a viscosity of 27.4 cps was obtained. The ink composition was applied under a nitrogen atmosphere to obtain To a uniform and precise film, the film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 7

於一裝設有一攪拌器之50毫升Schlenk燒瓶中,將1.00克(7·71 毫莫耳)水合氯化鎳(11)-6溶於一 5.00毫升的含水溶液中。接著, 添加一溶液,其中係將5.83克(19.27毫莫耳)2·乙基己基胺基曱 酸2-乙基己基銨(一黏稠液體)溶於10.00毫升苯中,並於室溫 下反應2小時且於反應期間強而有力地攪拌該溶液。當反應進行 時,該反應混合物變成一綠色漿料並且最終變成白色。自該綠色、 透明有機相態分離該無色、透明含水相態。於真空中將溶劑自該 有機相態移除,以獲得4.73克翠綠色綠鎳錯合物化合物。經熱重 量分析法(TGA)確認鎳含量為14.51重量%。添加1.00克鎳錯合 物化合物至一溶液中,其中係將藉由將2-乙基己基胺基甲酸2-乙 基己基銨與氧化銀(銀含量=22.00重量%)反應而製得之6.00克 銀錯合物化合物溶於3.00克曱醇中。在攪拌10分鐘後,可獲得一 黏度為127.2厘泊之透明墨水組合物。於氮氛圍下塗覆該墨水組合 物,以獲得一均勻且精確的膜,於表1之溫度下煅燒該膜。該膜 之導電性(平面電阻)及黏著性係如表1所示。 實施例8 28 1326297In a 50 ml Schlenk flask equipped with a stirrer, 1.00 g (7·71 mmol) of hydrated nickel chloride (11)-6 was dissolved in a 5.00 ml aqueous solution. Next, a solution was added in which 5.83 g (19.27 mmol) of 2-ethylhexylamine decanoic acid 2-ethylhexyl ammonium (a viscous liquid) was dissolved in 10.00 ml of benzene and reacted at room temperature. The solution was vigorously and vigorously stirred for 2 hours during the reaction. As the reaction proceeded, the reaction mixture turned into a green slurry and eventually turned white. The colorless, transparent aqueous phase is separated from the green, transparent organic phase. The solvent was removed from the organic phase in vacuo to give 4.73 g of emerald green nickel complex compound. The nickel content was confirmed to be 14.51% by weight by thermogravimetric analysis (TGA). 1.00 g of the nickel complex compound was added to a solution obtained by reacting 2-ethylhexyl ammonium 2-ethylhexyl ammonium with silver oxide (silver content = 22.00% by weight). The gram silver complex compound was dissolved in 3.00 g of sterol. After stirring for 10 minutes, a clear ink composition having a viscosity of 127.2 centipoise was obtained. The ink composition was applied under a nitrogen atmosphere to obtain a uniform and precise film, and the film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 8 28 1326297

於一裝設有一攪拌器之50毫升Schlenk燒瓶中,將1.00克(7.70 毫莫耳)水合氣化鈷(Π)-6溶於一 5.00毫升的含水溶液中。接著, 添加一溶液,其中係將5.82克(19.25毫莫耳)2-乙基己基胺基甲 酸2-乙基己基銨(一黏稠液體)溶於10.00毫升甲苯,並於室溫 下反應2小時且於反應期間強而有力地攪拌該溶液。當反應進行 時,該反應混合物變成一紅色漿料並且最終變成紫色。自該紫色、 透明有機相態分離該無色、透明含水相態。於真空中將溶劑自該 有機相態移除,以獲得5.36克紫色鈷錯合物化合物。經熱重量分 析法(TGA)確認鈷含量為14.51重量%。添加1.00克鈷錯合物化 合物至一溶液中,其中係將藉由將2-乙基己基胺基甲酸2-乙基己 基銨與氧化銀(銀含量=22.00重量%)反應而製得之6.00克銀錯 合物化合物溶於3.00克曱醇中。在攪拌10分鐘後,可獲得一黏度 為347.2厘泊之透明墨水組合物。於氮氛圍下塗覆該墨水組合物, 以獲得一均勻且精確的膜,於表1之溫度下煅燒該膜。該膜之導 電性(平面電阻)及黏著性係如表1所示。 實施例9 於一裝設有一攪拌器之50毫升Schlenk燒瓶中,將2.62克(16.18 毫莫耳)異丙基胺基甲酸異丙基銨溶於5.00毫升甲醇中。接著, 添加 1.00 克(0.81 毫莫耳)水合鉬酸銨(VI)-4((NH4)6Mo7 0 24-4 H20) 並於室溫下反應10小時。當反應進行時,該反應混合物變成一綠 色漿料並且最終變成一無色、透明溶液。於真空中將溶劑自該反 應溶液移除,以獲得3.02克白色鉬錯合物化合物。經熱重量分析 法(TGA)確認鉬含量為16_62重量%。添加2.00克鉬錯合物化合 29 1326297 物至2.80克透明丁基溶纖維劑溶液中,其溶有5.00克銀薄片及 0.20克聚乙烯基丁醛(一黏著劑)。在攪拌10分鐘後,將該溶液 移至一三滾輪研磨機五次,以獲得一黏度為940.8厘泊之導電性墨 水組合物。於氮氛圍下塗覆該墨水組合物,以獲得一均勻且精確 的膜,於表1之溫度下煅燒該膜。該膜之導電性(平面電阻)及 黏著性係如表1所示。 實施例10In a 50 ml Schlenk flask equipped with a stirrer, 1.00 g (7.70 mmol) of hydrated cobalt (ruthenium)-6 was dissolved in a 5.00 ml aqueous solution. Next, a solution was added in which 5.82 g (19.25 mmol) of 2-ethylhexylaminocarbamate 2-ethylhexylammonium (a viscous liquid) was dissolved in 10.00 ml of toluene and reacted at room temperature for 2 hours. The solution was vigorously stirred during the reaction. As the reaction proceeded, the reaction mixture turned into a red slurry and eventually turned purple. The colorless, transparent aqueous phase is separated from the purple, transparent organic phase. The solvent was removed from the organic phase in vacuo to give 5.36 g of a purple cobalt complex compound. The cobalt content was confirmed by thermogravimetric analysis (TGA) to be 14.51% by weight. 1.00 g of the cobalt complex compound was added to a solution obtained by reacting 2-ethylhexyl ammonium 2-ethylhexyl ammonium with silver oxide (silver content = 22.00% by weight). The gram silver complex compound was dissolved in 3.00 g of sterol. After stirring for 10 minutes, a clear ink composition having a viscosity of 347.2 centipoise was obtained. The ink composition was applied under a nitrogen atmosphere to obtain a uniform and precise film, and the film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 9 In a 50 ml Schlenk flask equipped with a stirrer, 2.62 g (16.18 mmol) of isopropylammonium isopropylcarbamate was dissolved in 5.00 ml of methanol. Next, 1.00 g (0.81 mmol) of hydrated ammonium molybdate (VI)-4 ((NH4)6Mo7 0 24-4 H20) was added and reacted at room temperature for 10 hours. As the reaction proceeded, the reaction mixture turned into a green paste and eventually turned into a colorless, clear solution. The solvent was removed from the reaction solution in vacuo to obtain 3.02 g of a white molybdenum compound. The molybdenum content was confirmed to be 16 to 62% by weight by thermogravimetric analysis (TGA). 2.00 g of a molybdenum complex 29 1326297 was added to 2.80 g of a transparent butyl cellosolve solution, which was dissolved in 5.00 g of silver flakes and 0.20 g of polyvinyl butyral (an adhesive). After stirring for 10 minutes, the solution was transferred to a three-roll mill for five times to obtain a conductive ink composition having a viscosity of 940.8 cps. The ink composition was applied under a nitrogen atmosphere to obtain a uniform and precise film, and the film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 10

於一裝設有一攪拌器之50毫升Schlenk燒瓶中,將8.92克(55.5 毫莫耳)異丙基胺基甲酸異丙基銨溶於5.00毫升甲醇中。接著, 添加1.00克(5.50毫莫耳)氧化釩(V)並於室溫下反應10小時。 當反應進行時,該反應混合物變成一黃色漿料並且最終變成一無 色、透明溶液。於真空中將溶劑自該反應溶液移除,以獲得9.35 克白色釩錯合物化合物。經熱重量分析法(TGA)確認釩含量為 12.37重量%。添加2.00克釩錯合物化合物至2.80克透明丁基溶 纖維劑中,其溶有5.00克銀薄片中及0.20克聚乙烯基丁醛(一黏 著劑)。在攪拌1〇分鐘後,將該溶液移至一三滾輪研磨機五次, 以獲得一黏度為1,5 4 0厘泊之導電性墨水組合物。於氮氛圍下塗覆 該墨水組合物,以獲得一均勻且精確的膜,於表1之溫度下煅燒 該膜。該膜之導電性(平面電阻)及黏著性係如表1所示。 實施例11 於一裝設有一攪拌器之50毫升Schlenk燒瓶中,將7·65克(25.31 毫莫耳)乙基己基胺基曱酸乙基己基銨(一黏稠液體)溶於5.00 毫升醋酸乙酯中。接著,添加1.00克(2.53毫莫耳)硝酸鉍(III) 30 1326297In a 50 ml Schlenk flask equipped with a stirrer, 8.92 g (55.5 mmol) of isopropylammonium isopropylcarbamate was dissolved in 5.00 ml of methanol. Next, 1.00 g (5.50 mmol) of vanadium oxide (V) was added and reacted at room temperature for 10 hours. As the reaction proceeded, the reaction mixture turned into a yellow slurry and eventually turned into a colorless, clear solution. The solvent was removed from the reaction solution in vacuo to obtain 9.35 g of a white vanadium complex compound. The vanadium content was confirmed by thermogravimetric analysis (TGA) to be 12.37% by weight. 2.00 g of the vanadium complex compound was added to 2.80 g of a transparent butyl-solvent, which was dissolved in 5.00 g of silver flakes and 0.20 g of polyvinyl butyral (an adhesive). After stirring for 1 minute, the solution was transferred to a three-roll mill for five times to obtain a conductive ink composition having a viscosity of 1,540 ° centipoise. The ink composition was applied under a nitrogen atmosphere to obtain a uniform and precise film, and the film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 11 In a 50 ml Schlenk flask equipped with a stirrer, 7.65 g (25.31 mmol) of ethylhexylamine decanoic acid ethylhexylammonium (a viscous liquid) was dissolved in 5.00 ml of acetic acid. In the ester. Next, add 1.00 g (2.53 mmol) of cerium (III) nitrate 30 1326297

並於室溫下反應2小時。當反應進行時,該反應混合物變成一白 色漿料並且最終變成一無色、透明溶液。於真空中將溶劑自該反 應溶液移除,以獲得5.16克白色絲錯合物化合物。經熱重量分析 法(TGA)確認鉍含量為11.35重量%。添加2.00克鉍錯合物化合 物至2.80克透明丁基溶纖維劑中,其溶有5.00克銀薄片及0.20 聚乙烯基丁醛(一黏著劑)。在攪拌10分鐘後,將該溶液移至一 三滚輪研磨機五次,以獲得一黏度為1,620厘泊之導電性墨水組合 物。於氮氛圍下塗覆該墨水組合物,以獲得一均勻且精確的膜, 於表1之溫度下煅燒該膜。該膜之導電性(平面電阻)及黏著性 係如表1所示。 實施例12 於一裝設有一攪拌器之50毫升Schlenk燒瓶中,將1.00克(5.64 毫莫耳)氯化鈀(II)溶於一 5.00毫升的含水溶液中。接著,添加一 溶液,其中係將1.71克(16.92毫莫耳)2-乙基己基胺基曱酸2-乙基己基銨(一黏稠液體)溶於5.00毫升醋酸乙酯中,並於室溫 % 下反應2小時且於反應期間強而有力地攪拌該溶液。當反應進行 時,該反應混合物變成一紅色漿料並且最終變成無色。自該無色、 透明有機相態分離該無色、透明含水相態。於真空中將溶劑自該 有機相態移除,以獲得2.22克黃色、透明鈀錯合物化合物。經熱 重量分析法(TGA)確認鈀含量為10.80重量%。添加2.00克鈀錯 合物化合物至0.50克曱醇中。在攪拌10分鐘後,可獲得一黏度為 25.6厘泊之透明墨水組合物。於氮氛圍下塗覆該墨水組合物,以 獲得一均勻且精確的膜,於表1之溫度下煅燒該膜。該膜之導電 31 1326297 性(平面電阻)及黏著性係如表1所示。 實施例13And reacted at room temperature for 2 hours. As the reaction proceeded, the reaction mixture turned into a white slurry and eventually turned into a colorless, clear solution. The solvent was removed from the reaction solution in vacuo to obtain 5.16 g of a white silk compound. The cerium content was confirmed to be 11.35 wt% by thermogravimetric analysis (TGA). 2.00 g of the ruthenium complex compound was added to 2.80 g of a transparent butyl-solvent containing 5.00 g of silver flakes and 0.20 of polyvinyl butyral (an adhesive). After stirring for 10 minutes, the solution was transferred to a three-roll mill for five times to obtain a conductive ink composition having a viscosity of 1,620 cps. The ink composition was applied under a nitrogen atmosphere to obtain a uniform and precise film, and the film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 12 In a 50 ml Schlenk flask equipped with a stirrer, 1.00 g (5.64 mmol) of palladium(II) chloride was dissolved in a 5.00 ml aqueous solution. Next, a solution was added in which 1.71 g (16.92 mmol) of 2-ethylhexylamine decanoic acid 2-ethylhexyl ammonium (a viscous liquid) was dissolved in 5.00 ml of ethyl acetate at room temperature. The reaction was carried out for 2 hours at % and the solution was vigorously stirred during the reaction. As the reaction proceeded, the reaction mixture turned into a red paste and eventually became colorless. The colorless, transparent aqueous phase is separated from the colorless, transparent organic phase. The solvent was removed from the organic phase in vacuo to yield 2.22 g of a yellow, transparent palladium complex compound. The palladium content was confirmed to be 10.80% by weight by thermogravimetric analysis (TGA). 2.00 g of a palladium complex compound was added to 0.50 g of sterol. After stirring for 10 minutes, a clear ink composition having a viscosity of 25.6 centipoise was obtained. The ink composition was applied under a nitrogen atmosphere to obtain a uniform and precise film, and the film was calcined at the temperature of Table 1. The conductivity of the film 31 1326297 (planar resistance) and adhesion are shown in Table 1. Example 13

於一裝設有一攪拌器之50毫升Schlenk燒瓶中,將藉由將2-乙 基己基胺基曱酸2-乙基己基銨與氧化銀(銀含量=22.00重量%) 反應而製得之2.00克銀錯合物化合物溶於10.00毫升醋酸乙酯 中。接著,添加一溶液,其含有1.71克(16.92毫莫耳)2-乙基己 基銨、1.38克(4.08毫莫耳)氯金酸氫,並於室溫下反應1小時 且於反應期間攪拌該溶液。當反應進行時,形成白色沉澱物並獲 得一黃色、透明溶液之上澄液(supernatant)。於真空中將溶劑自 該上澄液移除,以獲得3.56克黃色金錯合物化合物。經熱重量分 析法(TGA)確認金含量為31.26重量%。添加3·30克金錯合物化 合物至一溶液中,其係將藉由將異丙基碳酸異丙基銨與氧化銀(銀 含量=36.45重量% )反應而製得之2.70克銀錯合物化合物溶於2.50 克甲醇及1.50克2-乙基己基胺中。在攪拌10分鐘後,可獲得一 黏度為97.4厘泊之透明墨水組合物。於氮氛圍下塗覆該墨水組合 物,以獲得一均勻且精確的膜,於表1之溫度下煅燒該膜。該膜 φ 之導電性(平面電阻)及黏著性係如表1所示。 實施例14 添加1.50克由實施例12所製得之2-乙基己基銨鈀錯合物化合 物至一溶液中,其中係將藉由將2-乙基己基胺基甲酸銨與氧化銀 (銀含量=22.00重量%)反應而製得之6.20克銀錯合物化合物溶 於2.30克甲醇中。在攪拌10分鐘後,可獲得一黏度為83.2厘泊 之透明墨水組合物。於氮氛圍下塗覆該墨水組合物,以獲得一均 32 1326297 勻且精確的膜,於表1之溫度下煅燒該膜。該膜之導電性(平面 電阻)及黏著性係如表1所示。 實施例15In a 50 ml Schlenk flask equipped with a stirrer, 2.00 obtained by reacting 2-ethylhexylamino phthalic acid 2-ethylhexyl ammonium with silver oxide (silver content = 22.00% by weight) The gram silver complex compound was dissolved in 10.00 ml of ethyl acetate. Next, a solution containing 1.71 g (16.92 mmol) of 2-ethylhexylammonium, 1.38 g (4.08 mmol) of hydrogen chloroaurate was added and reacted at room temperature for 1 hour and stirred during the reaction. Solution. As the reaction proceeded, a white precipitate formed and a yellow, clear solution was obtained. The solvent was removed from the supernatant in vacuo to give 3.56 g of a yellow gold compound. The gold content was confirmed by thermogravimetric analysis (TGA) to be 31.26% by weight. Adding 3.30 g of the gold complex compound to a solution which is obtained by reacting isopropylammonium isopropyl carbonate with silver oxide (silver content = 36.45% by weight) to obtain 2.70 g of silver The compound was dissolved in 2.50 g of methanol and 1.50 g of 2-ethylhexylamine. After stirring for 10 minutes, a clear ink composition having a viscosity of 97.4 centipoise was obtained. The ink composition was applied under a nitrogen atmosphere to obtain a uniform and precise film, and the film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film φ are shown in Table 1. Example 14 1.50 g of the 2-ethylhexylammonium palladium complex compound obtained in Example 12 was added to a solution by using ammonium 2-ethylhexylcarbamate and silver oxide (silver) Content = 22.00% by weight) 6.20 g of the silver complex compound obtained by the reaction was dissolved in 2.30 g of methanol. After stirring for 10 minutes, a clear ink composition having a viscosity of 83.2 centipoise was obtained. The ink composition was applied under a nitrogen atmosphere to obtain a uniform and precise film of 32 1326297, which was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 15

將33.7克(141.9毫莫耳)之2-乙基己基胺基甲酸2-乙基己基 銨和2-曱氧基乙基胺基甲酸2-甲氧基乙基銨(莫耳比=4:6)的黏 稠液體混合物置於一裝設有一攪拌器之250毫升Schlen燒瓶中。 接著,添加10.0克(43.1毫莫耳)氧化銀,並於室溫下反應2小 時且於反應期間攪拌該溶液。一開始得到一黑色漿料,但當錯合 物形成時,顏色漸漸褪去。最後,可獲得一黏度為0.31帕·秒之 43.7克液態之黃色、透明銀錯合物化合物。經熱重量分析法(TGA) 確認銀含量為22.0重量%。添加40.9克銀錯合物化合物至12.9克 透明丁基二乙二醇乙醚溶液中,其溶有41.2克銀薄片(EA0295, Chemet)及5.0克聚乙浠醇縮丁搭(BS-18,Wacker )(—黏著劑)。 在攪拌10分鐘後,將該溶液移至一三滾輪研磨機(Drais Mannheim)五次。如第3圖所示,可獲得一銀含量為50.2重量°/〇 且黏度為3.94帕·秒之導電性墨水組合物。使用一絲網印刷機將 該墨水組合物塗覆於PET上(請參第4圖)。於表1之溫度下煅燒 該所得之均勻且精確的膜。該膜之導電性(平面電阻)及黏著性 係如表1所示。 實施例16 使用以與實施例15相同之方法所製得之40.0克銀錯合物化合物 及使用41.2克銀粉末(SNG-PSN-100-99,SOLNANOGY,平均顆 粒尺寸= 150奈米)取代41.2克銀薄片,以與實施例15相同之方 33 1326297 法製得—黏度為5.74帕.秒之墨水組合物。以與實施例15相同之 方法塗覆該墨水組合物並煅燒該所得之均勻且精確的膜。該膜之 導電性(平面電阻)及黏著性係如表1所示。 實施例17 使用以與實施例15相同之方法所製得之40.0克銀錯合物化合物 及使用41.2克銅薄片(TSC_20F,chang Sung)取代41.2克銀薄 片,以與實施例15相同之方法製得一黏度為14813帕·秒之墨水 組合物。以與實施例15相同之方法塗覆該墨水組合物並煅燒該所. 件之均勻且精確的膜。該膜之導電性(平面電阻)及黏著性係如.霉 表1所示。 實施例18 使用以與實施例15相同之方法所製得之40.0克之銀錯合物化合 物及使用41.2克銅粉末(Aldrich,平均顆粒尺寸=3微米)取代 41.2克銀薄片,以與實施例15相同之方法製得一黏度為14 55帕. 秒之墨水組合物。以與實施例15相同之方法塗覆該墨水組合物並 炮燒該所得之均勻且精確的膜。該膜之導電性(平面電阻)及黏 著性係如表1所示。 實施例19 使用以與實施例15相同之方法所製得之御纽錯合物化合物 及使用41.2克鎳粉末(Aldrich,平均顆粒尺寸=3微米)取代41 2 克銀薄片’以與實施例15相同之方法製得一黏度為u 74帕秒 之墨水組合物。以與實施例15相同之方法塗覆該墨水組合物並锻 燒該所得之均勻且精確的膜。該膜之導電性(平面電阻)及黏著Λ 1326297 性係如表1所示。 實施例2033.7 g (141.9 mmol) of 2-ethylhexylamino-2-ethylhexyl ammonium and 2-methoxyethylaminocarbamate 2-methoxyethylammonium (Mo Erbi = 4: The viscous liquid mixture of 6) was placed in a 250 ml Schlen flask equipped with a stirrer. Next, 10.0 g (43.1 mmol) of silver oxide was added, and the mixture was reacted at room temperature for 2 hours and the solution was stirred during the reaction. A black paste was initially obtained, but as the complex formed, the color gradually faded. Finally, 43.7 g of a liquid yellow, clear silver complex compound having a viscosity of 0.31 Pa·s was obtained. The silver content was confirmed by thermogravimetric analysis (TGA) to be 22.0% by weight. 40.9 g of the silver complex compound was added to 12.9 g of a transparent butyl diethylene glycol diethyl ether solution, which was dissolved in 41.2 g of silver flakes (EA0295, Chemet) and 5.0 g of polyacetone condensed (BS-18, Wacker). ) (-adhesive). After stirring for 10 minutes, the solution was transferred to a three-roll mill (Drais Mannheim) five times. As shown in Fig. 3, a conductive ink composition having a silver content of 50.2 wt./? and a viscosity of 3.94 Pa·s was obtained. The ink composition was applied to PET using a screen printer (see Figure 4). The resulting uniform and precise film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 16 40.0 g of a silver complex compound prepared in the same manner as in Example 15 was used, and 41.2 g of silver powder (SNG-PSN-100-99, SONALOHYY, average particle size = 150 nm) was used instead of 41.2. A silver foil was prepared in the same manner as in Example 15 by the method of 33 1326297, an ink composition having a viscosity of 5.74 Pa.s. The ink composition was applied in the same manner as in Example 15 and the resulting uniform and precise film was calcined. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 17 Using the same method as in Example 15 except that 40.0 g of the silver complex compound obtained in the same manner as in Example 15 and 41.2 g of copper flakes (TSC_20F, chang Sung) were used instead of 41.2 g of the silver flakes. An ink composition having a viscosity of 14813 Pa·s was obtained. The ink composition was applied in the same manner as in Example 15 and the uniform and precise film of the article was calcined. The conductivity (planar resistance) and adhesion of the film are as shown in Table 1. Example 18 Using 40.0 g of the silver complex compound prepared in the same manner as in Example 15 and using 41.2 g of copper powder (Aldrich, average particle size = 3 μm) instead of 41.2 g of silver flakes, and Example 15 were used. In the same manner, an ink composition having a viscosity of 14 55 Pa.s. was obtained. The ink composition was applied in the same manner as in Example 15 and the resulting uniform and precise film was fired. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 19 Using a ruthenium complex compound prepared in the same manner as in Example 15 and using 41.2 g of nickel powder (Aldrich, average particle size = 3 μm) in place of 41 2 g of silver flakes ' with Example 15 In the same manner, an ink composition having a viscosity of u 74 Pascal was obtained. The ink composition was applied in the same manner as in Example 15 and the resulting uniform and precise film was calcined. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 20

使用以與實施例15相同之方法所製得之40.0克銀錯合物化合物 及使用41.2克之30重量%的經銀塗覆之銅粉末(SNG-SN100-30, SOLNANOGY,平均顆粒尺寸= 100奈米)取代41.2克銀薄片,以 與實施例15相同之方法製得一黏度為10.65帕·秒之墨水組合物。 以與實施例15相同之方法塗覆該墨水組合物並煅燒該所得之均勻 且精確的膜。該膜之導電性(平面電阻)及黏著性係如表1所示。 實施例21 添加以與實施例15相同之方法所製得之40.0克銀錯合物化合物 及41.2克銀薄片至一透明混合溶液中,其中係將2.0克乙基纖維 素(Aldrich)(—黏著劑)溶於6.8克甲基溶纖維劑和5_0克苯曱 胺中。在攪拌10分鐘後,進一步添加5.0克碳粉末(Vulcan-XC72, Cabot)。在攪拌5分鐘後,將該溶液移至一三滾輪研磨機七次, 以獲得一黏度為3·75帕.秒之墨水組合物。以與實施例15相同之 方法塗覆該墨水組合物並煅燒該所得之均句且精確的膜。該膜之 導電性(平面電阻)及黏著性係如表1所示。 實施例22 使用5.0克石墨粉末(CGF-t2N5,Alfaproducts)取代5克碳粉 末,以與實施例21相同之方法製得一黏度為2.64帕.秒之墨水組 合物。以與實施例15相同之方法塗覆該墨水組合物並煅燒該所得 之均勻且精確的膜。該膜之導電性(平面電阻)及黏著性係如表1 所示。 35 1326297 實施例23 使用5.0克鎳粉末(Aldrich,平均顆粒尺寸=3微米)取代5.0 克碳粉末,以與實施例21相同之方法製得一黏度為4.32帕·秒之 墨水組合物。以與實施例15相同之方法塗覆該墨水組合物並煅燒 該所得之均勻且精確的膜。該膜之導電性(平面電阻)及黏著性 係如表1所示。 實施例2440.0 g of the silver complex compound prepared in the same manner as in Example 15 and 41.2 g of a 30% by weight silver-coated copper powder (SNG-SN100-30, SOLNANOGY, average particle size = 100 奈) were used. In the same manner as in Example 15, an ink composition having a viscosity of 10.65 Pa·s was produced in place of 41.2 g of silver flakes. The ink composition was applied in the same manner as in Example 15 and the resulting uniform and precise film was calcined. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 21 40.0 g of a silver complex compound and 41.2 g of a silver flake prepared in the same manner as in Example 15 were added to a clear mixed solution in which 2.0 g of ethyl cellulose (Aldrich) was adhered. The agent is dissolved in 6.8 g of methyl fibrin and 5_0 g of benzoguanamine. After stirring for 10 minutes, 5.0 g of carbon powder (Vulcan-XC72, Cabot) was further added. After stirring for 5 minutes, the solution was transferred to a three-roll mill for seven times to obtain an ink composition having a viscosity of 3.75 Pa.s. The ink composition was applied in the same manner as in Example 15 and the resulting uniform and precise film was calcined. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 22 An ink composition having a viscosity of 2.64 Pa·s was obtained in the same manner as in Example 21 except that 5.0 g of graphite powder (CGF-t2N5, Alfaproducts) was used instead of 5 g of the powder. The ink composition was applied in the same manner as in Example 15 and the resulting uniform and precise film was calcined. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. 35 1326297 Example 23 An ink composition having a viscosity of 4.32 Pa·s was obtained in the same manner as in Example 21 except that 5.0 g of nickel powder (Aldrich, average particle size = 3 μm) was used instead of 5.0 g of carbon powder. The ink composition was applied in the same manner as in Example 15 and the resulting uniform and precise film was calcined. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 24

使用5.0克銅粉末(Aldrich,平均顆粒尺寸=3微米)取代5.0 克碳粉末,以與實施例21相同之方法製得一黏度為4.54帕·秒之 墨水組合物。以與實施例15相同之方法塗覆該墨水組合物並锻燒 該所得之均勻且精確的膜。該膜之導電性(平面電阻)及黏著性 係如表1所示。 實施例25 1An ink composition having a viscosity of 4.54 Pa·s was obtained in the same manner as in Example 21 except that 5.0 g of copper powder (Aldrich, average particle size = 3 μm) was used instead of 5.0 g of the carbon powder. The ink composition was applied in the same manner as in Example 15 and the resulting uniform and precise film was calcined. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 25 1

添加以與實施例15相同之方法所製得之40.0克銀錯合物化合 物、20.6克銀薄片(EA0295,Chemet )與20.6克銀粉末 (SNG-PSN-100-99,SOLNANOGY,平均顆粒尺寸= 150 奈米)至 一透明混合溶液中,其中係將3.0克聚乙烯醇縮丁醛(BS-18, Wacker)(—黏著劑)溶於15.8克丁基溶纖維劑。在攪拌10分鐘 後,將該溶液移至一三滾輪研磨機五次,以獲得一黏度為3.56帕· 秒之墨水組合物。以與實施例15相同之方法塗覆該墨水組合物並 煅燒該所得之均勻且精確的膜。該膜之導電性(平面電阻)及黏 著性係如表1所示。 實施例26 36 132629740.0 g of a silver complex compound, 20.6 g of a silver flake (EA0295, Chenet) and 20.6 g of a silver powder (SNG-PSN-100-99, SOLNANOGY, average particle size = 2) obtained in the same manner as in Example 15 were added. 150 nm) to a clear mixed solution in which 3.0 g of polyvinyl butyral (BS-18, Wacker) (-adhesive) was dissolved in 15.8 g of butyl cellosolve. After stirring for 10 minutes, the solution was transferred to a three-roll mill for five times to obtain an ink composition having a viscosity of 3.56 Pa·s. The ink composition was applied in the same manner as in Example 15 and the resulting uniform and precise film was calcined. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 26 36 1326297

添加以與實施例I5相同之方法所製得之40.0克銀錯合物化合 物、20.6克鋼薄片(TSC-20F,Chang Sung)與20.6克銅粉末 (Aldrich ’平均顆粒尺寸=3微米)至一透明混合溶液中,其中係 將3.0克的聚乙烯醇縮丁醛(BS-18,Wacker)(—黏著劑)溶於 15.8克丁基溶纖維劑。在攪拌1〇分鐘後,將該溶液移至一三滾輪 研磨機五次’以獲得一黏度為227·87帕.秒之墨水組合物。以與 實施例15相同之方法塗覆該墨水組合物並煅燒該所得之均勻且精 確的膜。該膜之導電性(平面電阻)及黏著性係如表1所示。 實施例27 添加以與實施例15相同之方法所製得之40.0克銀錯合物化合 物、20.6 克銀薄片(EA0295,Chemet)與 20.6 克鋼薄片(TSC-20F, Chang Sung )至一透明混合溶液中,其中係將3.0克的聚乙烯醇縮 丁醛(BS-18,Wacker)(—黏著劑)溶於15.8克丁基溶纖維劑。 在攪拌10分鐘後,將該溶液移至一三滾輪研磨機五次,以獲得一 黏度為4.15帕.秒之墨水組合物。以與實施例15相同之方法塗覆 • 該墨水組合物並煅燒該所得之均勻且精確的膜。該膜之導電性(平 面電阻)及黏著性係如表1所示。 實施例28 添加以與實施例15相同之方法所製得之40.0克銀錯合物化合 物、41.2克銀薄片(EA0295,Chemet)至一溶液中,其中係將1.2 克二異戊四醇六丙稀酸醋(dipentaerythritol hexacrylate )(—單 體)、3.5 克 EB657 (UCB,分子量= 1500)( — 寡聚物)、0.1 克 819 (Ciba Specialty Chemicals )與 0.2 克 1173 ( Ciba Specialty 37 132629740.0 g of silver complex compound, 20.6 g of steel flakes (TSC-20F, Chang Sung) and 20.6 g of copper powder (Aldrich 'average particle size = 3 μm) prepared in the same manner as in Example I5 were added to one. In the transparent mixed solution, 3.0 g of polyvinyl butyral (BS-18, Wacker) (-adhesive) was dissolved in 15.8 g of butyl cellosolve. After stirring for 1 minute, the solution was transferred to a three-roll mill five times to obtain an ink composition having a viscosity of 227.87 Pa.s. The ink composition was applied in the same manner as in Example 15 and the resulting uniform and precise film was calcined. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 27 40.0 g of a silver complex compound, 20.6 g of a silver flake (EA0295, Chemet) and 20.6 g of a steel flake (TSC-20F, Chang Sung) prepared in the same manner as in Example 15 were added to a transparent mixture. In the solution, 3.0 g of polyvinyl butyral (BS-18, Wacker) (-adhesive) was dissolved in 15.8 g of butyl cellosolve. After stirring for 10 minutes, the solution was transferred to a three-roll mill for five times to obtain an ink composition having a viscosity of 4.15 Pa.s. The ink composition was applied in the same manner as in Example 15 and the resulting uniform and precise film was calcined. The conductivity (flat resistance) and adhesion of the film are shown in Table 1. Example 28 40.0 g of a silver complex compound, 41.2 g of a silver flake (EA0295, Chemet) prepared in the same manner as in Example 15 was added to a solution in which 1.2 g of diisopentaerythritol was used. Dipentaerythritol hexacrylate (-monomer), 3.5 g EB657 (UCB, molecular weight = 1500) (- oligomer), 0.1 g 819 (Ciba Specialty Chemicals) and 0.2 g 1173 (Ciba Specialty 37 1326297

Chemicals)(光起始劑)與 0.5 克 Solsperse20000 ( Avecia)(—分 散劑)溶於13.8克乙基溶纖維劑中。在攪拌1〇分鐘後,將該溶液 移至一三滾輪研磨機五次,以獲得一黏度為10.67帕.秒之墨水組 合物。將該墨水組合物塗覆於一玻璃板上並藉由UV於600毫焦 耳/平方公分下固化以獲得一膜。於表1之溫度下煅燒該所得之 膜。該膜之導電性(平面電阻)及黏著性係如表1所示。 實施例29Chemicals) (photoinitiator) and 0.5 g of Solsperse 20000 (Aercia) (-dispersion) were dissolved in 13.8 g of ethylcellulose. After stirring for 1 minute, the solution was transferred to a three-roll mill for five times to obtain an ink composition having a viscosity of 10.67 Pa.s. The ink composition was applied to a glass plate and cured by UV at 600 mJ/cm 2 to obtain a film. The resulting film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 29

添加以與實施例15相同之方法所製得之40.0克銀錯合物化合 物、41.2克銀薄片(EA0295,Chemet)至一溶液中,其中係將4.5 克不飽和聚醋(Polycoat,Aekyung Chemical )、0.5克過氧化苯與 0.5克EFKA4510 (EFKA)( —分散劑)溶於3.0克2-吡咯烷酮與 10.3克乙基溶纖維劑中。在攪拌1〇分鐘後,將該溶液移至一三滾 輪研磨機五次’以獲得一黏度為3.17帕.秒之墨水組合物。將該 墨水組合物塗覆於一玻璃板上並藉由UV於600毫焦耳/平方公分 下固化以獲得一膜。於表1之溫度下煅燒該所得之膜。該膜之導 電性(平面電阻)及黏著性係如表1所示。 實施例30 添加以與實施例15相同之方法所製得之40.0克銀錯合物化合物 及41.2克銀薄片(EA0295,Chemet)至一溶液中,其中係將2.0 克曱階盼搭樹脂(resol )( TD-2207,Kangnam Chemical )溶於 16.8 克乙基溶纖維劑中。在攪拌1〇分鐘後,將該溶液移至一三滾輪研 磨機五次’以獲得一黏度為3.05帕.秒之墨水組合物。將該墨水 組合物塗覆於一玻璃板上並於表1之溫度下煅燒該所得之膜。該 38 1326297 膜之導電性(平面電阻)及黏著性係如表1所示。 實施例3140.0 g of the silver complex compound prepared in the same manner as in Example 15 and 41.2 g of a silver flake (EA0295, Chemet) were added to a solution in which 4.5 g of unsaturated polyacetate (Polycoat, Aekyung Chemical) was added. 0.5 g of benzoyl peroxide and 0.5 g of EFKA 4510 (EFKA) (-dispersant) were dissolved in 3.0 g of 2-pyrrolidone and 10.3 g of ethylcellulose. After stirring for 1 minute, the solution was transferred to a three-roll mill for five times to obtain an ink composition having a viscosity of 3.17 Pa.s. The ink composition was applied to a glass plate and cured by UV at 600 mJ/cm 2 to obtain a film. The resulting film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 30 40.0 g of a silver complex compound and 41.2 g of a silver flake (EA0295, Chemet) prepared in the same manner as in Example 15 were added to a solution in which 2.0 g of ruthenium resin (resol) was added. (TD-2207, Kangnam Chemical) was dissolved in 16.8 grams of ethylcellulose. After stirring for 1 minute, the solution was transferred to a three-wheel mill five times to obtain an ink composition having a viscosity of 3.05 Pa.s. The ink composition was applied to a glass plate and the resulting film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film of 38 1326297 are shown in Table 1. Example 31

添加40.0克銀薄片(EA0295,Chemet)至一透明溶液中,其中 係將1.0克聚乙烯醇縮丁醛(BS-18,Wacker)溶於9.0克丁基二 乙二醇乙醚中。藉由攪拌該溶液10分鐘以製得一糊狀物。添加以 與實施例15相同之方法所製得之50_0克液態之銀錯合物化合物。 在攪拌10分鐘後,將該溶液移至一三滾輪研磨機五次,以獲得到 一黏度為3.88帕.秒之墨水組合物。將該墨水組合物塗覆於PET 膜上並於表1之溫度下煅燒該所得之膜。該膜之導電性(平面電 阻)及黏著性係如表1所示。 實施例32 添加以與實施例15相同之方法所製得之40.0克銀錯合物化合物 與41.2克銀薄片至一透明溶液中,其中係將5.0克聚乙烯醇丁醛 (BS-18,Wacker)(—黏著劑)與 1.0 克 EFKA4330 (EFKA)( — 分散劑)溶於12.8克甲氧基醋酸丙酯中。在攪拌10分鐘後,將該 # 溶液移至一三滾輪研磨機五次,以獲得一黏度為1.18帕·秒之墨 水組合物。將該墨水組合物塗覆於PET膜上並於表1之溫度下煅 燒該所得之膜。該膜之導電性(平面電阻)及黏著性係如表1所 示。 實施例33 添加以與實施例15相同之方法所製得之40.0克銀錯合物化合物 與41.2克銀薄片(EA0295,Chemet)至一溶液中,其中係將5.0 克聚乙烯醇丁醛(BS-18, Wacker)(—黏著劑)溶於13.8克四氫 39 1326297 呋喃中。在攪拌ίο分鐘後,將該溶液移至一三滚輪研磨機五次, 以獲得一黏度為1.45帕·秒之墨水組合物。將該墨水組合物塗覆 於PET膜上並於表1之溫度下煅燒該所得之膜。該膜之導電性(平 面電阻)及黏著性係如表1所示。 實施例34 添加以與實施例15相同之方法所製得之40.0克之銀錯合物化合 物與41.2克銀薄片(EA0295,Chemet)至一透明溶液中,其中係 將 5.0 克丙烯(HPD671,Johnson Polymer)(—黏著劑)溶於 13.8 克聚乙烯醇丁醛中。在攪拌10分鐘後,將該溶液移至一三滚輪研 磨機五次,以獲得到一黏度為0.75帕.秒之墨水組合物。將該墨 水組合物塗覆於PET膜上並於表1之溫度下煅燒該所得之膜。該 膜之導電性(平面電阻)及黏著性係如表1所示。 實施例35 添加以與實施例15相同之方法所製得之40.0克銀錯合物化合物 與51.2克銀薄片(EA0295,Chemet)至一溶液中,其中係將3.0 克聚乙烯醇丁醛(BS-18,Wacker)(—黏著劑)溶於5.8克丁基 二乙二醇乙醚中。在攪拌10分鐘後,將該溶液移至一三滚輪研磨 機五次,以獲得一黏度為4.35帕.秒之墨水組合物。將該墨水組 合物塗覆於PET膜上並於表1之溫度下煅燒該所得之膜。該膜之 導電性(平面電阻)及黏著性係如表1所示。 實施例36 添加以與實施例15相同之方法所製得之35.0克銀錯合物化合物 與58.3克的銀薄片(EA0295,Chemet)至一溶液中,其中係將 1326297 3.0克聚乙烯醇丁醛(BS-18,Wacker)(—黏著劑)溶於3.7克丁 基二乙二醇乙醚中。在攪拌10分鐘後,將該溶液移至一三滚輪研 磨機五次,以獲得到一黏度為6.24帕.秒之墨水組合物。將該墨 水組合物塗覆於PET膜上並於表1之溫度下煅燒該所得之膜。該 膜之導電性(平面電阻)及黏著性係如表1所示。 實施例3740.0 g of silver flakes (EA0295, Chemet) was added to a clear solution in which 1.0 g of polyvinyl butyral (BS-18, Wacker) was dissolved in 9.0 g of butyl diethylene glycol diethyl ether. The paste was prepared by stirring the solution for 10 minutes. A 50-_0 gram liquid silver complex compound prepared in the same manner as in Example 15 was added. After stirring for 10 minutes, the solution was transferred to a three-roll mill for five times to obtain an ink composition having a viscosity of 3.88 Pa.s. The ink composition was applied to a PET film and the resulting film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 32 40.0 g of a silver complex compound and 41.2 g of a silver flake prepared in the same manner as in Example 15 were added to a clear solution, wherein 5.0 g of polyvinyl butyral (BS-18, Wacker) was added. (-Adhesive) and 1.0 g of EFKA4330 (EFKA) (-dispersant) were dissolved in 12.8 g of propyl methoxyacetate. After stirring for 10 minutes, the # solution was transferred to a three-roll mill for five times to obtain an ink composition having a viscosity of 1.18 Pa·s. The ink composition was applied to a PET film and the resulting film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 33 40.0 g of a silver complex compound and 41.2 g of a silver flake (EA0295, Chemet) prepared in the same manner as in Example 15 were added to a solution in which 5.0 g of polyvinyl butyral (BS) was added. -18, Wacker) (-adhesive) was dissolved in 13.8 g of tetrahydro 39 1326297 furan. After stirring for a few minutes, the solution was transferred to a three-roll mill for five times to obtain an ink composition having a viscosity of 1.45 Pa·s. The ink composition was coated on a PET film and the resulting film was calcined at the temperature of Table 1. The conductivity (flat resistance) and adhesion of the film are shown in Table 1. Example 34 40.0 g of a silver complex compound prepared in the same manner as in Example 15 and 41.2 g of a silver flake (EA0295, Chemet) were added to a clear solution, wherein 5.0 g of propylene (HPD671, Johnson Polymer) was added. (--Adhesive) is dissolved in 13.8 g of polyvinyl butyral. After stirring for 10 minutes, the solution was transferred to a three-roll mill for five times to obtain an ink composition having a viscosity of 0.75 Pa.s. The ink composition was applied to a PET film and the resulting film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 35 40.0 g of a silver complex compound and 51.2 g of a silver flake (EA0295, Chemet) prepared in the same manner as in Example 15 were added to a solution in which 3.0 g of polyvinyl butyral (BS) was added. -18, Wacker) (-adhesive) was dissolved in 5.8 g of butyl diethylene glycol ether. After stirring for 10 minutes, the solution was transferred to a three-roll mill for five times to obtain an ink composition having a viscosity of 4.35 Pa.s. The ink composition was coated on a PET film and the resulting film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 36 35.0 g of a silver complex compound and 58.3 g of a silver flake (EA0295, Chemet) prepared in the same manner as in Example 15 were added to a solution in which 1326297 3.0 g of polyvinyl butyraldehyde was added. (BS-18, Wacker) (-adhesive) was dissolved in 3.7 g of butyl diethylene glycol ether. After stirring for 10 minutes, the solution was transferred to a three-roll mill for five times to obtain an ink composition having a viscosity of 6.24 Pa.s. The ink composition was applied to a PET film and the resulting film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 37

於一裝設有一攪拌器之250毫升Schlenk燒瓶中,將31.00克 (163.4毫莫耳)之莫耳比為7:3的異丙基胺基甲酸異丙基銨和2-甲氧基乙基胺基甲酸2-甲氧基乙基銨之混合物溶於一 40.0克甲醇 和20.5克(158·6毫莫耳)2-乙基己胺之混合溶液中。接著,添加 10.0克(43,1毫莫耳)氧化銀,並於室溫下反應4小時且於反應 期間攪拌該溶液。一開始得到一黑色漿料,但當錯合物形成時, 顏色漸漸褪去。最後,可獲得一無色、透明溶液。將甲醇和未反 應物質自該反應溶液移除,以獲得61.4克無色、透明銀錯合物溶 液。經熱重量分析法(TGA )確認銀含量為15.1重量%。 將5.0克聚乙烯醇縮丁醛(BS-18,Wacker)(—黏著劑)溶於 55.0克銀錯合物化合物中。接著,添加40.0克銀薄片(EA0295, Chemet),以獲得一黏度為1 · 12帕.秒之墨水組合物。將該墨水 組合物塗覆於PET膜上並於表1之溫度下煅燒該所得之膜。該膜 之導電性(平面電阻)及黏著性係如表1所示。 實施例38 於一裝設有一攪拌器之250毫升Schlenk燒瓶中,將39.1克 ( 365.5毫莫耳)乙胺碳酸氫乙基銨溶於一 10.0克甲醇和10.0克 1326297 甲基溶纖維劑之混合溶液中。接著,添加10 0克(431毫莫耳) 氧化銀,並於室溫下反應2小時且於反應期間攪拌該溶液。一開 始得到一黑色漿料,但當錯合物形成時,顏色漸漸褪去。最後, 可獲得一無色、透明溶液。將曱醇和未反應物質自該反應溶液移 除,以獲得55.1克無色、透明銀錯合物溶液。經熱重量分析法 (TGA)確認銀含量為16.9重量%。 將5.0克聚乙稀醇縮丁酿(Bug,Wacker)(—黏著劑)溶於 50,0克銀錯合物化合物中。接著,添加4〇 〇克銀薄片(EA〇295, Chemet)。在攪拌1〇分鐘後,將該溶液移至一三滾輪研磨機五次,β 以獲得一黏度為0.32帕·秒之墨水組合物》將該墨水組合物塗覆 於PET膜上並於表丨之溫度下煅燒該所得之膜。該膜之導電性(平 面電阻)及黏著性係如表1所示。 實施例39 於裝°又有一搜拌器之250毫升Schlenk燒瓶中,將50.0克 ( 258.0毫莫耳)2-甲氧基乙基胺基甲酸2_甲氧基乙基録溶於8〇 〇 克甲醇中。接著’添加2〇.〇克(86 2毫莫耳)氧化銀,並於室溫參 下反應2小時且於反應期間攪拌該溶液。一開始得到一黑色漿料, 但當錯合物形成時’顏色漸漸魏去。最後,可獲得—無色、透明 浴液。將甲醇和未反應物質自該反應溶液移除,以獲得59 2克黃 色、透明銀錯合物化合物。經熱重量分析法(TGA)確認銀含量 為31.4重量°/p 添加40.0克銀錯合物化合物與〇克銀薄片(EA〇295,chemet) 至一透明浴液中’其中係將5.0克聚乙烯醇縮丁醛(BS-18, 42 1326297In a 250 ml Schlenk flask equipped with a stirrer, 31.00 g (163.4 mmol) molar ratio of 7:3 isopropylammonium isopropylammonium and 2-methoxyethyl A mixture of 2-methoxyethylammonium carbamate was dissolved in a mixed solution of 40.0 g of methanol and 20.5 g (158·6 mmol) of 2-ethylhexylamine. Next, 10.0 g (43,1 mmol) of silver oxide was added, and the mixture was reacted at room temperature for 4 hours and the solution was stirred during the reaction. A black slurry was initially obtained, but as the complex formed, the color gradually faded. Finally, a colorless, clear solution is obtained. Methanol and unreacted materials were removed from the reaction solution to obtain 61.4 g of a colorless, transparent silver complex solution. The silver content was confirmed by thermogravimetric analysis (TGA) to be 15.1% by weight. 5.0 g of polyvinyl butyral (BS-18, Wacker) (-adhesive) was dissolved in 55.0 g of the silver complex compound. Next, 40.0 g of silver flakes (EA0295, Chemet) was added to obtain an ink composition having a viscosity of 1 · 12 Pa.s. The ink composition was applied to a PET film and the resulting film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 38 In a 250 ml Schlenk flask equipped with a stirrer, 39.1 g (365.5 mmol) of ethylamine hydrogencarbonate was dissolved in a mixture of 10.0 g of methanol and 10.0 g of 1326297 of methyl fibrin. In solution. Next, 100 g (431 mmol) of silver oxide was added and reacted at room temperature for 2 hours and the solution was stirred during the reaction. A black slurry was obtained at the beginning, but when the complex was formed, the color gradually faded. Finally, a colorless, clear solution is obtained. The decyl alcohol and unreacted materials were removed from the reaction solution to obtain 55.1 g of a colorless, transparent silver complex solution. The silver content was confirmed to be 16.9% by weight by thermogravimetric analysis (TGA). 5.0 g of a polyvinyl alcohol (Bug, Wacker) (-adhesive) was dissolved in 50,0 g of the silver complex compound. Next, 4 〇 gram silver flakes (EA 〇 295, Chemet) were added. After stirring for 1 minute, the solution was transferred to a three-roll mill for five times, and β was obtained to obtain an ink composition having a viscosity of 0.32 Pa·s. The ink composition was applied to a PET film and expressed on the surface. The resulting film was calcined at a temperature. The conductivity (flat resistance) and adhesion of the film are shown in Table 1. Example 39 In a 250 ml Schlenk flask equipped with a stirrer, 50.0 g (258.0 mmol) of 2-methoxyethylaminocarbamic acid 2-methoxyethyl group was dissolved in 8 Torr. In grams of methanol. Next, 2 Å. gram (86 2 mmol) of silver oxide was added, and the reaction was carried out at room temperature for 2 hours and the solution was stirred during the reaction. A black paste was initially obtained, but as the complex formed, the color gradually faded away. Finally, a colorless, transparent bath is available. Methanol and unreacted materials were removed from the reaction solution to obtain 59 2 g of a yellow, transparent silver complex compound. The content of silver was confirmed by thermogravimetric analysis (TGA) to be 31.4 wt./p. Add 40.0 g of silver complex compound and silver silver flakes (EA〇295, chemet) to a transparent bath. Vinyl butyral (BS-18, 42 1326297

WaCker)(―黏著劑)溶於10.0克甲基溶纖維劑和5.0克2-乙基 己胺中。錢拌1G分鐘後,將該溶液移至一三滾輪研磨機五次, 以獲得一點度為M4帕·秒之墨水組合物。將該墨水組合物塗覆 ' ET膜上並於表丨之溫度下煅燒該所得之膜。該膜之導電性(平 •面電阻)及黏著性係如表1所示。 實施例40 於裝叹有一攪拌器之250毫升Schlenk燒瓶中,將57.8克 β (240.8毫莫耳)3_甲氧基丙基碳酸3-甲氧基丙基錄溶於80.0克甲 醇中。接著,添加2〇.0克(86.2毫莫耳)氧化銀,並於室溫下反 應2小時且於反應期間授拌該溶液。一開始得到一黑色漿料,但 §錯δ物形成時,顏色漸漸视去。最後,可獲得一無色、透明溶 液°將甲醇和未反應物質自該反應溶液移除,以獲得67 8克液態 之黃色、透明銀錯合物化合物。經熱重量分析法(TGA )確認銀 含量為27.4重量%。 添加40.0克銀錯合物化合物與40·0克銀薄片(EA0295,Chemet) % 至一透明溶液中,其中係將5.0克聚乙烯醇縮丁醛(BS-18, Wacker) (一黏著劑)溶於10.0克甲基溶纖維劑和5.0克2-乙基己胺中。 在攪拌10分鐘後,將該溶液移至一三滾輪研磨機五次,以獲得一 黏度為1.79帕.秒之墨水組合物。將該墨水組合物塗覆於PET膜 上並於表1之溫度下煅燒該所得之膜。該膜之導電性(平面電阻) 及黏著性係如表1所示。 實施例41 於一裝設有一攪拌器之250毫升Schlenk燒瓶中,將65.6克 43 1326297 ( 258.0毫莫耳)二曱氧基乙基胺基甲酸二甲氧基乙基銨溶於8〇 〇 克甲醇中。接著’添加20.0克(86.2毫莫耳)氧化銀,並於室溫 下反應2小時且於反應期間攪拌該溶液。一開始得到一黑色漿料, 但當錯合物形成時,顏色漸漸褪去❶最後,可獲得一無色、透明 溶液。將曱醇和未反應物質自該反應溶液移除’以獲得80.4克液 態之黃色、透明銀錯合物化合物。經熱重量分析法(TGA)確認 銀含量為23·1重量0/〇。WaCker) ("adhesive") was dissolved in 10.0 g of methyl fibrin and 5.0 g of 2-ethylhexylamine. After mixing for 1 G minutes, the solution was transferred to a three-roll mill for five times to obtain an ink composition having a degree of M4 Pa·s. The ink composition was coated on an 'ET film and the resulting film was calcined at a temperature of the surface. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 40 In a 250 ml Schlenk flask with a stirrer, 57.8 g of β (240.8 mmol) 3-methoxypropyl carbonate 3-methoxypropyl was dissolved in 80.0 g of methanol. Next, 2 〇.0 g (86.2 mmol) of silver oxide was added and reacted at room temperature for 2 hours and the solution was stirred during the reaction. A black paste was initially obtained, but when the δ error was formed, the color gradually looked away. Finally, a colorless, clear solution was obtained. The methanol and unreacted materials were removed from the reaction solution to obtain 67 8 g of a liquid yellow, clear silver complex compound. The silver content was confirmed by thermogravimetric analysis (TGA) to be 27.4% by weight. Add 40.0 grams of silver complex compound to 40. 0 grams of silver flakes (EA0295, Chemet) % to a clear solution, which will be 5.0 grams of polyvinyl butyral (BS-18, Wacker) (an adhesive) Dissolved in 10.0 g of methyl solvolysis and 5.0 g of 2-ethylhexylamine. After stirring for 10 minutes, the solution was transferred to a three-roll mill for five times to obtain an ink composition having a viscosity of 1.79 Pa.s. The ink composition was applied to a PET film and the resulting film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 41 In a 250 ml Schlenk flask equipped with a stirrer, 65.6 g of 43 1326297 (258.0 mmol) of dimethoxyethylaminoformate dimethoxyethylammonium was dissolved in 8 g. In methanol. Next, 20.0 g (86.2 mmol) of silver oxide was added and reacted at room temperature for 2 hours and the solution was stirred during the reaction. A black paste was initially obtained, but when the complex was formed, the color gradually faded and finally a colorless, clear solution was obtained. The decyl alcohol and unreacted materials were removed from the reaction solution to obtain 80.4 g of a liquid yellow, transparent silver complex compound. The silver content was confirmed by thermogravimetric analysis (TGA) to be 23·1 by weight of 0/〇.

添加40.0克銀錯合物化合物與40.0克銀薄片(EA0295,Chemet) 至--透明溶液中,其中係將5 〇克聚乙烯醇縮丁醛(BS-18,Wacker) (一黏著劑)溶於10.0克丁基二乙二醇乙醚和5.0克2-乙基己胺 中。在授拌10分鐘後,將該溶液移至一三滾輪研磨機五次,以獲 得一黏度為3.02帕.秒之墨水組合物。將該墨水組合物塗覆於pET 膜上龙於表1之溫度下煅燒該所得之膜。該膜之導電性(平面電 阻)及黏著性係如表1所示。 實施例42Add 40.0 grams of silver complex compound and 40.0 grams of silver flakes (EA0295, Chemet) to a clear solution, in which 5 grams of polyvinyl butyral (BS-18, Wacker) (an adhesive) is dissolved. In 10.0 g of butyl diethylene glycol ether and 5.0 g of 2-ethylhexylamine. After 10 minutes of mixing, the solution was transferred to a three-roll mill for five times to obtain an ink composition having a viscosity of 3.02 Pa.s. The ink composition was applied to a pET film and the resulting film was calcined at a temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 42

於一裝設有一攪拌器之25〇毫升Schlenk燒瓶中,將34.8克 (215.〇毫莫耳)異丙基胺基甲酸異丙基銨溶於40.0克甲醇和40.0 克甲基'合纖維劑中。接著,添加2G.0克(86.2毫莫耳)氧化銀, 於至'里下反應2小時且於反應期間攪拌該溶液。一開始得到一 色漿料,但當錯合物形成時,顏色漸漸褪去。最後,可獲得一 f色透明溶液。將甲醇和未反應物質自該反應溶液移除,以獲 得92·〇态益名 ^ …、色、透明銀錯合物溶液。經熱重量分析法(TGA)確 認銀含量為20.2重量%。 44 1326297 將5.0克聚乙烯醇縮丁醛(BS-18,Wacker)(—黏著劑)溶於 50.0克銀錯合物溶液中。接著,添加2-乙基己胺和40.0克銀薄片 (EA0295,Chemet)。在攪拌10分鐘後,將該溶液移至一三滾輪 研磨機五次,以獲得一黏度為0.89帕·秒之墨水組合物。將該墨 水組合物塗覆於PET膜上並於表1之溫度下煅燒該所得之膜。該 膜之導電性(平面電阻)及黏著性係如表1所示。 實施例43In a 25 liter Schlenk flask equipped with a stirrer, 34.8 g (215. Torr) of isopropylammonium isopropylamide was dissolved in 40.0 g of methanol and 40.0 g of methyl 'fibril. in. Next, 2 G.0 g (86.2 mmol) of silver oxide was added, and the reaction was carried out for 2 hours while stirring, and the solution was stirred during the reaction. A color paste was initially obtained, but as the complex formed, the color gradually faded. Finally, a f-color clear solution is obtained. Methanol and unreacted materials were removed from the reaction solution to obtain a solution of 92. 益 益 、, color, transparent silver complex. The silver content was confirmed by thermogravimetric analysis (TGA) to be 20.2% by weight. 44 1326297 5.0 g of polyvinyl butyral (BS-18, Wacker) (-adhesive) was dissolved in 50.0 g of a silver complex solution. Next, 2-ethylhexylamine and 40.0 g of silver flakes (EA0295, Chemet) were added. After stirring for 10 minutes, the solution was transferred to a three-roll mill for five times to obtain an ink composition having a viscosity of 0.89 Pa·s. The ink composition was applied to a PET film and the resulting film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 43

添加以與實施例38相同之方法所製得之40.0克銀錯合物溶液與 40.0克銀薄片(EA0295,Chemet)至一溶液中,其中係將5.0克 丙稀(HPD62,Johnson Polymer )(—黏著劑)和0.5克的椰子甜 菜鹼(一界面活性劑)溶於14·5克水中。在攪拌10分鐘後,將該 溶液移至一三滾輪研磨機五次,以獲得一黏度為0.18帕·秒之墨 水組合物。將該墨水組合物塗覆於PET膜上並於表1之溫度下煅 燒該所得之膜。該膜之導電性(平面電阻)及黏著性係如表1所 示。 實施例44 添加以與實施例15相同之方法所製得之40.0克銀錯合物溶液、 41.2克銀薄片(EA0295,Chemet)和1.0克四丁氧基鈦(一金屬 前驅物)至一透明溶液中,其中係將5.0克聚乙烯醇縮丁(BS-18, Wacker)(—黏著劑)溶於12_8克丁基二乙二醇乙醚中。在攪拌 10分鐘後,將該溶液移至一三滾輪研磨機五次,以獲得一黏度為 4.74帕.秒之墨水組合物。將該墨水組合物塗覆於PET膜上並於 表1之溫度下鍛燒該所得之膜。該膜之導電性(平面電阻)及黏 45 1326297 著性係如表1所示。 實施例4540.0 g of a silver complex solution prepared in the same manner as in Example 38 and 40.0 g of a silver flake (EA0295, Chemet) were added to a solution in which 5.0 g of propylene (HPD62, Johnson Polymer) (- Adhesive) and 0.5 g of coconut betaine (a surfactant) were dissolved in 14.5 g of water. After stirring for 10 minutes, the solution was transferred to a three-roll mill for five times to obtain an ink composition having a viscosity of 0.18 Pa·s. The ink composition was applied to a PET film and the resulting film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 44 40.0 g of a silver complex solution, 41.2 g of a silver flake (EA0295, Chemet) and 1.0 g of tetrabutoxytitanium (a metal precursor) prepared in the same manner as in Example 15 were added to a transparent In the solution, 5.0 g of polyvinyl condensate (BS-18, Wacker) (-adhesive) was dissolved in 12-8 g of butyl diethylene glycol diethyl ether. After stirring for 10 minutes, the solution was transferred to a three-roll mill for five times to obtain an ink composition having a viscosity of 4.74 Pa.s. The ink composition was applied to a PET film and the resulting film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 45

添加以與實施例15相同之方法所製得之40.0克銀錯合物溶液、 41.2克銀薄片(EA0295,Chemet)和1.0克醋酸鉍(一金屬前驅 物)至一透明溶液中,其中係將5.0克聚乙烯醇縮丁醛(BS-18, Wacker)(—黏著劑)溶於12.8克丁基二乙二醇乙醚中。在攪拌 10分鐘後,將該溶液移至一三滾輪研磨機五次,以獲得一黏度為 2.26帕.秒之墨水組合物。將該墨水組合物塗覆於PET膜上並於 表1之溫度下煅燒該所得之膜。該膜之導電性(平面電阻)及黏 著性係如表1所示。 實施例46 添加以與實施例39相同之方法所製得之50.0克銀錯合物溶液、 30.0克銀薄片(EA0295,Chemet)和1.0克氧化釩至14.0克丁基 二乙二醇乙醚中,其溶有5.0克聚乙烯醇縮丁醛(BS-18,Wacker) (一黏著劑)。在攪拌10分鐘後,將該溶液移至一三滚輪研磨機 五次,以獲得一黏度為M0帕.秒之墨水組合物。將該墨水組合 0 物塗覆於PET膜上並於表1之溫度下煅燒該所得之膜。該膜之導 電性(平面電阻)及黏著性係如表1所示。 實施例47 添加以與實施例15相同之方法所製得之20.0克銀錯合物溶液、 比較例2所用之10.5克銀2-已酸乙酯和41.2克銀薄片(EA0295, Chemet )至一透明溶液中,其中係將5.0克聚乙烯醇縮丁酸· (BS-18, Wacker)(—黏著劑)溶於23.3克丁基二乙二醇乙醚中。 46 1326297 在攪拌ίο分鐘後,將該溶液移至一三滾輪研磨機五次,以獲得一 黏度為3.98帕.秒之墨水組合物。將該墨水組合物塗覆於PET膜 上並於表1之溫度下緞燒該所得之膜。該膜之導電性(平面電阻) 及黏著性係如表1所示。 實施例4840.0 g of silver complex solution, 41.2 g of silver flakes (EA0295, Chemet) and 1.0 g of lanthanum acetate (a metal precursor) prepared in the same manner as in Example 15 were added to a transparent solution, wherein 5.0 g of polyvinyl butyral (BS-18, Wacker) (-adhesive) was dissolved in 12.8 g of butyl diethylene glycol diethyl ether. After stirring for 10 minutes, the solution was transferred to a three-roll mill for five times to obtain an ink composition having a viscosity of 2.26 Pa.s. The ink composition was applied to a PET film and the resulting film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 46 50.0 g of a silver complex solution, 30.0 g of a silver flake (EA0295, Chemet) and 1.0 g of vanadium oxide were added in the same manner as in Example 39 to 14.0 g of butyl diethylene glycol diethyl ether. It was dissolved in 5.0 g of polyvinyl butyral (BS-18, Wacker) (an adhesive). After stirring for 10 minutes, the solution was transferred to a three-roll mill for five times to obtain an ink composition having a viscosity of M0 Pa.s. The ink composition was applied to a PET film and the resulting film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 47 20.0 g of a silver complex solution prepared in the same manner as in Example 15, 10.5 g of silver 2-hexanoic acid ester used in Comparative Example 2, and 41.2 g of a silver flake (EA0295, Chemet) were added thereto. In the clear solution, 5.0 g of polyvinyl butyric acid (BS-18, Wacker) (-adhesive) was dissolved in 23.3 g of butyl diethylene glycol diethyl ether. 46 1326297 After stirring for ίο minutes, the solution was transferred to a three-roll mill for five times to obtain an ink composition having a viscosity of 3.98 Pa.s. The ink composition was applied to a PET film and the resulting film was satted at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 48

添加以與實施例15相同之方法所製得之60.0克銀錯合物溶液與 比較例2所用之31.5克銀2-已酸乙酯至一 4.0克2-乙基己胺和4.5 克丁基二乙二醇乙醚之混合溶液中。在攪拌10分鐘後,可獲得一 黏度為0.06帕.秒之墨水組合物。將該墨水組合物塗覆於PET膜 上並於表1之溫度下煅燒該所得之膜。該膜之導電性(平面電阻) 及黏著性係如表1所示。 實施例49 添加70.0克銀薄片(EA0295,Chemet)至一以與實施例39相 同之方法所製得之30.0克液態之銀錯合物化合物中。在攪拌10 分鐘後,將該溶液移至一三滚輪研磨機五次,以獲得一黏度為1.06 帕·秒之墨水組合物。將該墨水組合物網印於PET膜上並於100°C 下進行熱處理5分鐘,接著於130°C下進行熱處理10分鐘。該膜 之導電性(平面電阻)及黏著性係如表1所示。 實施例50 於一裝設有一攪拌器之500毫升Schlenk燒瓶中,將84.9克(0.5 莫耳)硝酸銀溶於100毫升之含水溶液中。接著,添加一作為保 護膠體之溶液,其中係將20.0克Solsperse28000 ( Avecia)溶於醋 酸乙酯中。在攪拌10分鐘後,添加149.8克二乙基乙醇胺至該溶 47 132629760.0 g of the silver complex solution prepared in the same manner as in Example 15 and 31.5 g of silver 2-hexanoate used in Comparative Example 2 to 4.0 g of 2-ethylhexylamine and 4.5 g of butyl were added. A mixed solution of diethylene glycol ether. After stirring for 10 minutes, an ink composition having a viscosity of 0.06 Pa.s. was obtained. The ink composition was applied to a PET film and the resulting film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 49 70.0 g of a silver flake (EA0295, Chemet) was added to a solution of 30.0 g of a liquid silver complex compound prepared in the same manner as in Example 39. After stirring for 10 minutes, the solution was transferred to a three-roll mill for five times to obtain an ink composition having a viscosity of 1.06 Pa·s. The ink composition was screen printed on a PET film and heat-treated at 100 ° C for 5 minutes, followed by heat treatment at 130 ° C for 10 minutes. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 50 In a 500 ml Schlenk flask equipped with a stirrer, 84.9 g (0.5 mol) of silver nitrate was dissolved in 100 ml of an aqueous solution. Next, a solution as a protective colloid was added, in which 20.0 g of Solsperse 28000 (Aviacia) was dissolved in ethyl acetate. After stirring for 10 minutes, 149.8 g of diethylethanolamine was added to the solution 47 1326297

液中。經過5小時的攪拌反應後,自暗棕色有機相態分離該無色、 透明含水相態。藉由萃取該有機相態而獲得一暗棕色銀膠體溶 液。將醋酸乙酯自此溶液移除,以獲得32.5克之平均顆粒尺寸為 10奈米的棕色銀奈米顆粒。將30.0克奈米顆粒重新分散於20.0 醋酸乙酯中並添加以與實施例25相同之方法所製得之50.0克銀錯 合物化合物。在攪拌10分鐘後,可獲得一黏度為0.03帕·秒之墨 水組合物。將該墨水組合物塗覆於聚亞醯胺膜上並於表1之溫度 下煅燒該所得之均勻且精確的膜。該膜之導電性(平面電阻)及 黏著性係如表1所示。 實施例51 於一裝設有一攪拌器之250毫升Schlenk燒瓶中,將32·5克 (107.5毫莫耳)2-乙基己基胺基甲酸2-乙基己基銨(一黏稠液體) 溶於100.0毫升曱醇中。接著,添加10.0克(43.1毫莫耳)氧化 銀並於室溫下進行反應。當反應進行時,該反應混合物變成一黑 色漿料並且最終變成一無色、透明溶液。於真空中將溶劑自該反 應溶液移除,以獲得42.0克白色銀錯合物化合物。添加5.3克2- φ 乙基己胺(一穩定劑)和8·47克甲醇(一溶劑)至20.0克銀錯合 物化合物中,以獲得一黏度為5.7厘泊之墨水組合物。塗覆該墨水 組合物並於表1之溫度下煅燒該所得之均勻且精確的膜。該膜之 導電性(平面電阻)及黏著性係如表1所示。 實施例52 於一裝設有一攪拌器之250毫升Schlenk燒瓶中,混合溶於100 毫升甲醇之8.2克(86毫莫耳)碳酸銨和15·0克( 250毫莫耳) 48 1326297 異丙胺。接著,添加10.0克(43〗毫莫耳)氧化銀並於室溫下進 仃反應。當反應進行時,該反應混合物變成一黑色漿料並且最終 變成一無色、透明溶液。於真空中將溶劑自該溶液移除,以獲得 28.4克白色銀錯合物化合物。添加5 3克2_乙基己胺(一穩定劑) 47克甲醇(;谷劑)至20.0克銀錯合物化合物中,以獲得一 黏度為3.8厘泊之墨水組合物。塗覆該墨水組合物並於表丨之溫度 下煅燒該所得之均勻且精確的膜。該膜之導電性(平面電阻)及 ^ 黏著性係如表1所示。 實施例53 使用37.2克2-乙基己基碳酸2·乙基己基錄取代2·乙基己基胺基 甲酸2-乙基己絲’以與實補51相狀方法製得__黏度為56 厘泊之透明銀墨水組合物。塗覆該墨水組合物並於表丨之溫度下 煅燒該所得之均勻且精確的膜。該膜之導電性(平面電阻)及黏 著性係如表1所示。 實施例54 • 使用48.6克2-乙基己基碳酸2-乙基己基錢取代2_乙基己基胺基 甲酸2-乙基己基錄,以與實施51相同之方法製得一黏度為。厘 泊之透明銀墨水組合物。塗覆該墨水組合物並於表i之溫度下烺 燒該所得之均句且精確的膜。該膜之導電性(平面電阻)及黏著 性係如表1所示。 實施例55 使用32.0克正丁基碳酸正丁基銨取代2•乙基己基胺基甲酸2_乙 基己基銨並使用12.〇克碳酸銀取代氧化銀,以與實施例5丨相同之 49 1326297 方法製得一黏度為8.5厘泊之透明銀墨水組合物。塗覆該墨水組合 物並於表1之溫度下煅燒該所得之均勻且精確的膜。該膜之導電 性(平面電阻)及黏著性係如表1所示。 實施例56 使用28·2克環己基胺基甲酸環己基銨取代2_乙基己基胺基甲酸 2-乙基己基銨,以與實施例51相同之方法製得一黏度為4 3厘泊 之透明銀墨水組合物。塗覆該墨水組合物並於表i之溫度下煅燒In the liquid. After a 5 hour stirring reaction, the colorless, transparent aqueous phase was separated from the dark brown organic phase. A dark brown silver colloid solution is obtained by extracting the organic phase. Ethyl acetate was removed from this solution to obtain 32.5 g of brown silver nanoparticles having an average particle size of 10 nm. 30.0 g of the nanoparticle was redispersed in 20.0 ethyl acetate and 50.0 g of a silver compound compound obtained in the same manner as in Example 25 was added. After stirring for 10 minutes, an ink composition having a viscosity of 0.03 Pa·s was obtained. The ink composition was coated on a polyimide film and the resulting uniform and precise film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 51 In a 250 ml Schlenk flask equipped with a stirrer, 32. 5 g (107.5 mmol) of 2-ethylhexylaminocarbamate 2-ethylhexyl ammonium (a viscous liquid) was dissolved in 100.0. In milliliters of sterols. Next, 10.0 g (43.1 mmol) of silver oxide was added and the reaction was carried out at room temperature. As the reaction proceeded, the reaction mixture turned into a black slurry and eventually turned into a colorless, clear solution. The solvent was removed from the reaction solution in vacuo to obtain 42.0 g of a white silver compound. 5.3 g of 2-φ ethylhexylamine (a stabilizer) and 8.47 g of methanol (a solvent) were added to 20.0 g of the silver compound to obtain an ink composition having a viscosity of 5.7 cps. The ink composition was applied and the resulting uniform and precise film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 52 In a 250 ml Schlenk flask equipped with a stirrer, 8.2 g (86 mmol) of ammonium carbonate and 15.0 g (250 mmol) of 48 1326297 isopropylamine dissolved in 100 ml of methanol were mixed. Next, 10.0 g (43 μm) of silver oxide was added and the reaction was carried out at room temperature. As the reaction proceeded, the reaction mixture turned into a black slurry and eventually turned into a colorless, clear solution. The solvent was removed from the solution in vacuo to obtain 28.4 g of a white silver complex compound. 53 g of 2-ethylhexylamine (a stabilizer) 47 g of methanol (a granule) was added to 20.0 g of the silver complex compound to obtain an ink composition having a viscosity of 3.8 cps. The ink composition was applied and the resulting uniform and precise film was calcined at the temperature of the watch. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 53 Using 37.2 g of 2-ethylhexyl carbonic acid 2·ethylhexyl-substituted 2-ethylhexylaminocarbamic acid 2-ethylhexyl' to obtain a __ viscosity of 56 PCT. A transparent silver ink composition. The ink composition was applied and the resulting uniform and precise film was calcined at the temperature of the watch. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 54: A viscosity of 2 was obtained in the same manner as in Example 51 except that 48.6 g of 2-ethylhexyl carbonate 2-ethylhexylm was used instead of 2-ethylhexylaminocarbamate 2-ethylhexyl. Transparent silver ink composition at centipoise. The ink composition was applied and the resulting uniform and precise film was calcined at the temperature of Table i. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 55 Substituting 32.0 g of n-butylammonium n-butylammonium chloride for 2-ethylhexylaminocarbamic acid 2-ethylhexylammonium and replacing silver oxide with 12. g of silver carbonate, the same as in Example 5 1326297 A clear silver ink composition having a viscosity of 8.5 centipoise was prepared. The ink composition was applied and the resulting uniform and precise film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 56 A viscosity of 4 3 cps was obtained in the same manner as in Example 51, using 28.2 g of cyclohexyl ammonium cyclohexylammonium in place of 2-ethylhexyl ammonium 2-ethylhexylaminocarbamate. Transparent silver ink composition. Coating the ink composition and calcining at the temperature of Table i

該所得之均勻且精確的膜。該膜之導電性(平面電阻)及黏著性 係如表1所示。 實施例57 使用31.2克苯甲基胺基甲酸苯甲基銨取代2_乙基己基胺基甲酸 2-乙基己基銨,以與實施例51相同之方法製得一黏度為5 3厘泊 之透明銀墨水組合物。塗覆該墨水組合物並於表丨之溫度下煅燒 該所得之均勻且精確的膜。該膜之導電性(平面電阻)及黏著性 係如表1所示。 實施例58 使用30.8克2-甲氧基乙基碳酸氫2_甲氧基乙基銨取代2乙基己 基胺基甲酸2-乙基己基敍’以與實施例51相同之方法製得一黏度 為2.8厘泊之透明銀墨水組合物。塗覆該墨水組合物並於表1之溫 度下并X燒該所得之均勻且精確的膜。該膜之導電性(平面電阻) 及黏著性係如表1所示。 實施例59 使用18.8克異丙基碳酸氫異丙基㈣25克辛基碳酸氫辛基敍取 50 1326297 代2·乙基己基胺基甲酸2·乙基己基錄,以與實施w 5ι才目同之方法 製得-黏度為2.8厘泊之透明銀墨水組合物。塗覆該墨水組合物並 於表1之溫度下煅燒該所得之均勻且精確的膜。該膜之導電性(平 面電阻)及黏著性係如表1所示。 實施例60 使用19.7克2-乙基己基胺基甲酸2_乙基己基銨和12 7克2·甲 氧基乙基胺基甲酸2·甲氧基乙基錄取代2_乙基己基胺基?酸2乙 基己基銨,以與實施例51相同之方法製得一黏度為22 6厘泊之透 明銀墨水組合物4覆該墨水組合物並於表丨之溫度下锻燒該所 得之均勻且精確的膜。該膜之導電性(平面電阻)及黏著性係如 表1所示。 實施例61 添加1.2克碳酸銨(一穩定劑 和25.0克甲氧基醋酸丙酯(一溶劑)至以與實施例55相同之方法 所製得之20.0克銀錯合物化合物中,以製備一黏度為3 6厘泊之 透明銀墨水組合物。塗覆該墨水組合物並於表丨之溫度下煅燒該 所得之均勻且精確的膜。該膜之導電性(平面電阻)及黏著性係 如表1所示。 實施例62 添加 1.2 克 2,2-乙稀二氧二乙胺(2,2_ethy丨 enedi〇xybisethy 丨邮) (一穩定劑)、0.05克EFKA 365〇 ( EFKA)和25 〇克甲氧基醋酸 丙酯(一溶劑)至以與實施例55相同之方法所製得之2〇〇克銀錯 合物化合物中,以製備一黏度為3.2厘泊之透明銀墨水組合物。塗 51 覆該墨水組合物並於表1之溫度T職該所得之均勾且精確的 膜。該膜之導電性(平面電阻)及黏著性係如表1所示。 實施例63 添加0.2克三丙胺(一穩定劑)、〇 〇3克ΒγΚ 373(Βγκ)和加〇 克甲氧基丙醇(溶劑)至以與實施例58相同之方法所製得之 12.0克銀錯合物化合物中,以製備—黏度為3 3厘泊之透明銀墨水 、且。物。塗覆該墨水組合物並於表i之溫度下锻燒該所得之均勾 且精確的膜。該膜之導電性(平面電阻)及黏著性係如表i所示。 實施例64 添加0.2克二異丙胺(一穩定劑)、0.03克BYK 373 (BYK)和 2〇.〇克1-曱氧基丙醇(一溶劑)至以與實施例58相同之方法所製 得之12.0克銀錯合物化合物中,以製備一黏度為4 2厘泊之透明 銀墨水組合物。塗覆該墨水組合物並於表丨之溫度下煅燒該所得 之均勻且精確的膜。該膜之導電性(平面電阻)及黏著性係如表i 所示。The resulting uniform and precise film. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 57 Using a solution of 31.2 g of benzylammonium benzyl ammonium methoxide in place of 2-ethylhexylammonium 2-ethylhexylaminocarbamate, a viscosity of 5 3 cps was obtained in the same manner as in Example 51. Transparent silver ink composition. The ink composition was applied and the resulting uniform and precise film was calcined at the temperature of the watch. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 58 A viscosity was obtained in the same manner as in Example 51 except that 30.8 g of 2-methoxyethyl hydrogencarbonate 2-methoxyethylammonium was substituted for 2-ethylhexylaminocarbamic acid 2-ethylhexyl. A transparent silver ink composition of 2.8 centipoise. The ink composition was applied and the resulting uniform and precise film was fired at the temperature of Table 1 and X. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 59 Using 18.8 g of isopropyl isopropyl hydrogencarbonate (tetra) 25 g of octyl hydrogencarbonate, 50 1326297 generation of 2·ethylhexylaminocarbamic acid 2·ethylhexyl was used to achieve the same as the implementation of w 5 . A transparent silver ink composition having a viscosity of 2.8 centipoise was obtained by the method. The ink composition was applied and the resulting uniform and precise film was calcined at the temperature of Table 1. The conductivity (flat resistance) and adhesion of the film are shown in Table 1. Example 60 Using 19.7 g of 2-ethylhexylaminocarbamic acid 2-ethylhexylammonium and 12 7 g of 2·methoxyethylaminocarbamic acid 2·methoxyethyl-substituted 2-ethylhexylamino group ? A clear silver ink composition having a viscosity of 22 6 centipoise was prepared in the same manner as in Example 51, and the ink composition was coated and calcined at a temperature of the surface to obtain a uniform Precise membrane. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 61 1.2 g of ammonium carbonate (a stabilizer and 25.0 g of propyl methoxyacetate (a solvent) was added to 20.0 g of the silver complex compound prepared in the same manner as in Example 55 to prepare a A transparent silver ink composition having a viscosity of 36 centipoise. The ink composition is coated and the resulting uniform and precise film is calcined at a temperature of the surface. The conductivity (planar resistance) and adhesion of the film are as follows. Table 1. Example 62 Add 1.2 grams of 2,2-ethylenedioxydiethylamine (2,2_ethy丨enedi〇xybisethy) (a stabilizer), 0.05 grams of EFKA 365〇 (EFKA) and 25 〇 The propyl methoxyacetate (a solvent) was added to a 2 gram silver complex compound prepared in the same manner as in Example 55 to prepare a transparent silver ink composition having a viscosity of 3.2 centipoise. The film was coated with the ink composition and the resulting film was obtained at the temperature T of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 63 Add 0.2 g Tripropylamine (a stabilizer), 〇〇3 g ΒγΚ 373 (Βγκ) and gamma methoxypropanol Solvent) to 12.0 g of a silver complex compound prepared in the same manner as in Example 58 to prepare a transparent silver ink having a viscosity of 33 cps, and coating the ink composition. The resulting film was calcined at the temperature of Table i. The conductivity (planar resistance) and adhesion of the film are shown in Table i. Example 64 Add 0.2 g of diisopropylamine (a stabilizer) 0.03 g of BYK 373 (BYK) and 2 gram of 1-methoxypropanol (a solvent) to 12.0 g of a silver complex compound prepared in the same manner as in Example 58 to prepare a A transparent silver ink composition having a viscosity of 42 centipoise. The ink composition is coated and the resulting uniform and precise film is calcined at a temperature of the surface. The conductivity (planar resistance) and adhesion of the film are as follows. Table i shows.

實施例65 添加0·2克3-甲氧基丙胺(一穩定劑)、〇 〇3克teGO Wet 505 (Degussa)和20.0克乙醇(一溶劑)至以與實施例53相同之方 法所製得之12·〇克銀錯合物化合物中,以製備一黏度為4 2厘泊 之透明銀墨水組合物。塗覆該墨水組合物並於表1之溫度下煅燒 該所得之均勻且精確的膜。該膜之導電性(平面電阻)及黏著性 係如表1所示。 實施例66 52 1326297 添加3·4克2-乙基己基胺(一穩定劑)、0.03克TEGO Wet 505 (Degussa)和20.0克乙醇(一溶劑)至以與實施例53相同之方 法所製得之12.0克銀錯合物化合物中,以製備一黏度為4.4厘泊 之透明銀墨水組合物。塗覆該墨水組合物並於表1之溫度下煅燒 該所得之均勻且精確的膜。該膜之導電性(平面電阻)及黏著性 係如表1所示。 實施例67Example 65 0. 2 g of 3-methoxypropylamine (a stabilizer), 3 g of teGO Wet 505 (Degussa) and 20.0 g of ethanol (a solvent) were added to the same method as in Example 53. In the 12 gram silver complex compound, a transparent silver ink composition having a viscosity of 42 cps was prepared. The ink composition was applied and the resulting uniform and precise film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 66 52 1326297 3,4 g of 2-ethylhexylamine (a stabilizer), 0.03 g of TEGO Wet 505 (Degussa) and 20.0 g of ethanol (a solvent) were added to prepare in the same manner as in Example 53. A 12.0 gram silver complex compound was prepared to prepare a transparent silver ink composition having a viscosity of 4.4 centipoise. The ink composition was applied and the resulting uniform and precise film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 67

添加3.4克2-乙基己基胺(一穩定劑)、0.03克TEGO Wet 505 (Degussa)和20.0克1-丙醇(一溶劑)至以與實施例53相同之 方法所製得之12.0克銀錯合物化合物中,以製備一黏度為4.6厘 泊之透明銀墨水組合物。塗覆該墨水組合物並於表1之溫度下煅 燒該所得之均勻且精確的膜。該膜之導電性(平面電阻)及黏著 性係如表1所示。 實施例68 添加3.4克2-乙基己胺(一穩定劑)、0.02克Rilanit HT-Extra (Cognis)和12.7克甲基溶纖維劑(一溶劑)至以與實施例53相 同之方法所製得之12.0克銀錯合物化合物中,以製備一黏度為4.1 厘泊之透明銀墨水組合物。塗覆該墨水組合物並於表1之溫度下 煅燒該所得之均勻且精確的膜。該膜之導電性(平面電阻)及黏 著性係如表1所示。 實施例69 添加3.4克2-乙基己胺(一穩定劑)、0.03克EFKA 3835(EFKA) 和12.7克醋酸乙酯(一溶劑)至以與實施例53相同之方法所製得 53 1326297 之20.0克銀錯合物化合物中,以製備一黏度為6 5厘泊之透明銀 墨水組合物<•塗覆該墨水組合物並於表i之溫度下锻燒該所得之 均勻且精確的^該膜之導電性(平面電阻)及黏著性係如表! 所示。 實施例70 添加3.4克2-乙基己胺(一穩定劑)、〇.〇5克EFKA 3777(efka) 和12.7克甲苯(一溶劑)至以與實施例53相同之方法所製得之 2〇,〇克銀錯合物化合物中,以製備一黏度為6 3厘泊之透明銀墨水 組合物。塗覆該墨水組合物並於表丨之溫度下煅燒該所得之均勻 且精確的膜。該膜之導電性(平面電阻)及黏著性係如表丨所示。 實施例71 添加3.4克2-乙基己胺(一穩定劑)、〇 〇3克GHde41〇(Degussa) 和12,7克之重量比為2:1的1-丙醇和乙基二乙二醇乙趟醋酸酯之 混合物(一溶劑)至以與實施例53相同之方法所製得之2〇 〇克銀 錯合物化合物,以製備一黏度為6.2厘泊之透明銀墨水組合物。塗 覆該墨水組合物並於表丨之溫度下烺燒該所得之均勻且精確的 膜。該膜之導電性(平面電阻)及黏著性係如表丨所示。 實施例72 添加3.4克2-乙基己胺(一穩定劑)、〇 〇3克DSX 1514(c〇gnis) 和12.7克之重量比為3:1:ι的nn-二甲基甲醯胺、N,N二甲基亞 颯和甲醇(一溶劑)之混合物至以與實施例5;3相同之方法所製得 之20_0克銀錯合物化合物中,以製備一黏度為入8厘泊之透明銀 墨水組合物。塗覆該墨水組合物並於表丨之溫度下煅燒該所得之 54 ^26297 均勻且精麵膜。該膜之導電性(平面電阻)及黏著性係如表1 所示。 實施例73 添加3.4克2-乙基己胺(一穩定劑)、〇丨克efka4i〇 (efkA) 和12.7克之重量比為4:1的【·甲基_2吼洛烧酮和2 丁醇(一溶劑) 之混合物纽與實_53㈣之方法所製得之20.0克銀錯合物化 。物中’以製備度為67厘泊之透明銀墨水組合物。塗覆該墨 •水組合物並絲丨之溫度下崎該所得之㈣域確的膜。該膜 之導電性(平面電阻)及黏著性係如表丨所示。 實施例74 添加3.4克2_乙基己胺(一穩定劑)、〇.〇5克Surfynol 465 ( Air oduct)和I2·7克之重量比為2:1:1的水聚乙二醇(pEG) 2〇〇 和曱醇(-溶劑)之混合物至以與實施例53相同之方法所製得之 2〇.〇克銀錯合物化合物中,以製備一黏度為8 9厘泊之透明銀墨水 組合物。塗覆該墨核合物並料丨之溫度下職該所得之均句 _且精確的膜。該膜之導電性(平面電阻)及黏著性係如表i所示。 實施例75 於一裝设有一攪拌器之250毫升Schlenk燒瓶中,將26克(0.20 莫耳)2-乙基己胺和15克(0.20莫耳)正丁胺溶於1〇克甲醇中。 在攪拌之後,添加9.3克(0.04莫耳)氧化銀,並於室溫下進行反 應且同時二氧化碳氣體緩慢變成氣泡。當反應進行時,該反應混 δ物變成一黑色漿料並且最終變成一無色 '透明溶液。以〇 45微 米之過滤器過滤該溶劑,以獲得一液態之乾淨、透明銀錯合物化 55 1326297 合物。添加3.5克2-乙基己胺和0.05克EFKA 3650 (EFKA)至 20.0克銀錯合物化合物中,以獲得一黏度為15.4厘泊之透明銀墨 水組合物。塗覆該墨水組合物並於表1之溫度下煅燒該所得之均 勻且精確的膜。該膜之導電性(平面電阻)及黏著性係如表1所 示。 實施例763.4 g of 2-ethylhexylamine (a stabilizer), 0.03 g of TEGO Wet 505 (Degussa) and 20.0 g of 1-propanol (a solvent) were added to 12.0 g of silver obtained in the same manner as in Example 53 In the complex compound, a transparent silver ink composition having a viscosity of 4.6 centipoise was prepared. The ink composition was applied and the resulting uniform and precise film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 68 3.4 g of 2-ethylhexylamine (a stabilizer), 0.02 g of Rilanit HT-Extra (Cognis) and 12.7 g of a methylcellulose-soluble fiber (a solvent) were added to prepare in the same manner as in Example 53. A 12.0 gram silver complex compound was obtained to prepare a transparent silver ink composition having a viscosity of 4.1 centipoise. The ink composition was applied and the resulting uniform and precise film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 69 3.4 g of 2-ethylhexylamine (a stabilizer), 0.03 g of EFKA 3835 (EFKA), and 12.7 g of ethyl acetate (a solvent) were added to give a ratio of 53 1326297 in the same manner as in Example 53. In 20.0 g of the silver complex compound, a transparent silver ink composition having a viscosity of 65 cps was prepared to be coated with the ink composition and calcined at the temperature of Table i to obtain a uniform and precise ^ The conductivity (plane resistance) and adhesion of the film are as follows! Shown. Example 70 3.4 g of 2-ethylhexylamine (a stabilizer), 〇.〇5 g of EFKA 3777 (efka) and 12.7 g of toluene (one solvent) were added to the same method as in Example 53 In the case of a ruthenium silver complex compound, a transparent silver ink composition having a viscosity of 6 3 centipoise is prepared. The ink composition was applied and the resulting uniform and precise film was calcined at the temperature of the watch. The conductivity (planar resistance) and adhesion of the film are shown in Table 。. Example 71 3.4 g of 2-ethylhexylamine (a stabilizer), 3 g of GHde 41 〇 (Degussa) and 12,7 g of 2-propanol and ethyl diethylene glycol B in a weight ratio of 2:1 were added. A mixture of hydrazine acetate (a solvent) was added to a 2 gram silver complex compound prepared in the same manner as in Example 53 to prepare a transparent silver ink composition having a viscosity of 6.2 centipoise. The ink composition was applied and the resulting uniform and precise film was calcined at the temperature of the watch. The conductivity (planar resistance) and adhesion of the film are shown in Table 。. Example 72 3.4 g of 2-ethylhexylamine (a stabilizer), 3 g of DSX 1514 (c〇gnis) and 12.7 g of nn-dimethylformamide in a weight ratio of 3:1:1 were added, a mixture of N,N dimethyl hydrazine and methanol (a solvent) to a 20-0 gram silver complex compound prepared in the same manner as in Example 5; 3 to prepare a viscosity of 8 cps. Transparent silver ink composition. The ink composition was applied and the resulting 54^26297 uniform and fine mask was calcined at a temperature of the surface. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 73 Adding 3.4 g of 2-ethylhexylamine (a stabilizer), keke efka4i(e) (efkA) and 12.7 g of a weight ratio of 4:1 [·methyl 2 oxazeone and 2 butanol The mixture of (a solvent) was complexed with 20.0 g of silver prepared by the method of _53 (d). A transparent silver ink composition having a degree of preparation of 67 centipoise. The film of the ink/water composition is applied and the temperature of the wire is applied to the film of the (four) domain. The conductivity (planar resistance) and adhesion of the film are shown in Table 。. Example 74 Adding 3.4 g of 2-ethylhexylamine (a stabilizer), 〇.〇5 g of Surfynol 465 (Air oduct) and I2·7 g of water polyethylene glycol (pEG) in a weight ratio of 2:1:1 a mixture of 2 hydrazine and decyl alcohol (-solvent) to a 2 gram silver complex compound prepared in the same manner as in Example 53 to prepare a transparent silver having a viscosity of 8 9 centipoise Ink composition. Applying the ink nucleus at the temperature of the mash and the uniformity of the film obtained. The conductivity (planar resistance) and adhesion of the film are shown in Table i. Example 75 In a 250 ml Schlenk flask equipped with a stirrer, 26 g (0.20 mol) of 2-ethylhexylamine and 15 g (0.20 mol) of n-butylamine were dissolved in 1 g of methanol. After the stirring, 9.3 g (0.04 mol) of silver oxide was added, and the reaction was carried out at room temperature while the carbon dioxide gas slowly became a bubble. As the reaction proceeds, the reaction mixture becomes a black slurry and eventually becomes a colorless 'transparent solution. The solvent was filtered through a 45 micron filter to obtain a liquid clean, transparent silver complex compound 55 1326297. 3.5 g of 2-ethylhexylamine and 0.05 g of EFKA 3650 (EFKA) were added to 20.0 g of the silver complex compound to obtain a transparent silver ink composition having a viscosity of 15.4 cps. The ink composition was applied and the resulting uniform and precise film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 76

添加26克(0.20莫耳)2-乙基己胺、15克(0.20莫耳)正丁胺 和0.24克十二胺至一裝設有一攪拌器之250毫升加壓容器中。接 著,添加0.03克Rilanit HT-Extra ( Cognis)和10.0克曱醇並藉由 攪拌來溶解該混合溶液。添加9.3克(0.04莫耳)氧化銀,並進行 反應且同時緩慢注入二氧化碳氣體,以獲得一黏度為135.0厘泊之 透明銀墨水組合物。塗覆該墨水組合物並於表1之溫度下缎燒該 所得之均勻且精確的膜。該膜之導電性(平面電阻)及黏著性係 如表1所示。 實施例77 藉由添加4.8克乙基纖維素至以與實施例60相同之方法所製得 f 之20.0克銀錯合物化合物中,以製備一黏度為2,300厘泊之透明 銀墨水組合物。塗覆該墨水組合物並於表1之溫度下煅燒該所得 之均勻且精確的膜。該膜之導電性(平面電阻)及黏著性係如表1 所示。 實施例78 藉由添加2.0克2-乙基己基胺基曱酸2-乙基己基銨至以與實施 例60相同之方法所製得之20.0克銀錯合物化合物中,以製備一黏 56 1326297 度為19.2厘泊之透明銀墨水組合物。塗覆該墨水組合物並於表1 之溫度下煅燒該所得之均勻且精確的膜。該膜之導電性(平面電 阻)及黏著性係如表1所示。 實施例7926 g (0.20 mol) of 2-ethylhexylamine, 15 g (0.20 mol) of n-butylamine and 0.24 g of dodecylamine were added to a 250 ml pressurized vessel equipped with a stirrer. Next, 0.03 g of Rilanit HT-Extra (Cognis) and 10.0 g of decyl alcohol were added and the mixed solution was dissolved by stirring. 9.3 g (0.04 mol) of silver oxide was added and reacted while slowly injecting carbon dioxide gas to obtain a transparent silver ink composition having a viscosity of 135.0 cps. The ink composition was applied and satisfactorily obtained at a temperature of Table 1 to obtain a uniform and precise film. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 77 A transparent silver ink composition having a viscosity of 2,300 cps was prepared by adding 4.8 g of ethyl cellulose to 20.0 g of a silver complex compound of f obtained in the same manner as in Example 60. The ink composition was applied and the resulting uniform and precise film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 78 To prepare a viscous 56 by adding 2.0 g of 2-ethylhexylamino phthalic acid 2-ethylhexyl ammonium to 20.0 g of a silver complex compound prepared in the same manner as in Example 60. 1326297 A transparent silver ink composition having a degree of 19.2 centipoise. The ink composition was applied and the resulting uniform and precise film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 79

藉由添加3.4克2-乙基己胺(一穩定劑)、0.8克聚乙烯醇縮丁 醛(BL-18,Wacker)和4.0克丁基溶纖維劑至以與實施例60相 同之方法所製得之20.0克銀錯合物化合物中,以製備一黏度為 8,000厘泊之透明銀墨水組合物。塗覆該墨水組合物並於表1之溫 度下煅燒該所得之均勻且精確的膜。該膜之導電性(平面電阻) 及黏著性係如表1所示。 實施例80 使用20.1克異丙基碳酸異丙基銨取代2-乙基己基胺基曱酸2-乙 基己基銨、3.4克2-乙基己胺(作為穩定劑)及12.7克水和0.03 克椰子甜菜鹼取代曱醇(作為溶劑),以與實施例51相同之方法 製得一黏度為3.5厘泊之透明銀墨水組合物。塗覆該墨水組合物並 % 於表1之溫度下煅燒該所得之均勻且精確的膜。該膜之導電性(平 面電阻)及黏著性係如表1所示。 實施例81 添加20.1克異丙基碳酸異丙基銨和13.0克水至一 250毫升裝設 有一攪拌器之250毫升Schlenk燒瓶中。在攪拌後,添加10.0克 (43.1毫莫耳)氧化銀並於室溫下進行反應,以製備一銀錯合物 化合物之含水溶液。添加3.4克2-乙基己胺(一穩定劑)與0.03 克椰子甜菜鹼至43.1克液態之銀錯合物化合物中,以獲得一黏度 57 1326297 為3.5厘泊之透明銀墨水組合物。塗覆該墨水組合物並於表1之溫 度下煅燒該所得之均勻且精確的膜。該膜之導電性(平面電阻) 及黏著性係如表1所示。 實施例82Prepared by the same method as in Example 60 by adding 3.4 g of 2-ethylhexylamine (a stabilizer), 0.8 g of polyvinyl butyral (BL-18, Wacker) and 4.0 g of butyl cellosolve. A 20.0 gram silver complex compound was prepared to prepare a transparent silver ink composition having a viscosity of 8,000 centipoise. The ink composition was applied and the resulting uniform and precise film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 80 Using 20.1 g of isopropylammonium isopropyl carbonate in place of 2-ethylhexylamine decanoic acid 2-ethylhexylammonium, 3.4 g of 2-ethylhexylamine (as a stabilizer) and 12.7 g of water and 0.03 A transparent silver ink composition having a viscosity of 3.5 centipoise was prepared in the same manner as in Example 51 except that ketobetaine was substituted for decyl alcohol (as a solvent). The ink composition was applied and % of the resulting uniform and precise film was calcined at the temperature of Table 1. The conductivity (flat resistance) and adhesion of the film are shown in Table 1. Example 81 20.1 g of isopropylammonium isopropyl carbonate and 13.0 g of water were added to a 250 ml Schlenk flask equipped with a stirrer in a 250 ml. After stirring, 10.0 g (43.1 mmol) of silver oxide was added and the reaction was carried out at room temperature to prepare an aqueous solution of a silver complex compound. 3.4 g of 2-ethylhexylamine (a stabilizer) and 0.03 g of coconut betaine were added to 43.1 g of the liquid silver complex compound to obtain a transparent silver ink composition having a viscosity of 57 1326297 of 3.5 cps. The ink composition was applied and the resulting uniform and precise film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 82

將實施例52所製得之黏度為3.8厘泊的透明銀墨水組合物填入 一聚乙烯容器中。使用一裝設有壓電式喷墨印刷頭F083000 (Epson)之平面印刷機於PET膜、亞醯胺膜和玻璃板上形成圖 樣。將該經圖樣化之試樣於80°C下熱處理5分鐘,接著於130°C 下熱處理10分鐘。 實施例83 使用一具320網孔圖樣化之絲網印刷機,將實施例76所製得之 黏度為2,300厘泊的透明銀墨水組合物於PET膜上形成圖樣。將 該經圖樣化之試樣於80°C下熱處理3分鐘,接著於130°C下熱處 理10分鐘(請參第7圖)。 實施例84 使用一柔版印刷機將實施例77所製得之黏度為19.2厘泊的透明 f 銀墨水組合物於PET膜上形成圖樣,該PET膜係經聚乙烯醇縮丁 醛樹脂前處理的。將該經圖樣化之試樣於80°C下熱處理2分鐘、 於100°C下熱處理3分鐘,接著於130°C下熱處理10分鐘(請參 第8圖)。 實施例85 於一裝設有一攪拌器之1,000毫升Schlenk燒瓶中,將90.22克 ( 556.16毫莫耳)異丙基胺基甲酸異丙基銨溶於400毫升曱醇中。 58 1326297A transparent silver ink composition having a viscosity of 3.8 cps prepared in Example 52 was filled in a polyethylene container. A pattern was formed on a PET film, a melamine film, and a glass plate using a flat printing machine equipped with a piezoelectric inkjet print head F083000 (Epson). The patterned sample was heat-treated at 80 ° C for 5 minutes, followed by heat treatment at 130 ° C for 10 minutes. Example 83 A transparent silver ink composition having a viscosity of 2,300 cps prepared in Example 76 was patterned on a PET film using a screen printing machine having a 320 mesh pattern. The patterned sample was heat treated at 80 ° C for 3 minutes and then heat treated at 130 ° C for 10 minutes (see Figure 7). Example 84 A transparent f silver ink composition having a viscosity of 19.2 centipoise prepared in Example 77 was formed on a PET film by a flexographic printing machine, and the PET film was pretreated with polyvinyl butyral resin. of. The patterned sample was heat-treated at 80 ° C for 2 minutes, heat-treated at 100 ° C for 3 minutes, and then heat-treated at 130 ° C for 10 minutes (see Fig. 8). Example 85 In a 1,000 ml Schlenk flask equipped with a stirrer, 90.22 g (556.16 mmol) of isopropylammonium isopropylcarbamate was dissolved in 400 ml of decyl alcohol. 58 1326297

接著,緩慢添加63.06克(927·08毫莫耳)之50重量%的過氧化 氫含水溶液,以獲得一無色、透明溶液。於室溫下進行反應,且 同時緩慢加入銀粉末(SNGPSN-100-99, SOLNANOGY,平均顆 粒尺寸= 100奈米)直至其不再溶解為止。當反應進行時,該反應 溶液變成一灰色漿料並且最終變成一無色、透明溶液。所消耗之 銀的量為20.00克(185_41毫莫耳)。以0.45微米之膜過濾器過濾 該反應溶液並於真空中將溶劑移除,以獲得54.70克白色銀錯合物 化合物。經熱重量分析法(TGA)確認銀含量為36.50重量%。添 加5_30克2-乙基己胺(一穩定劑)以及12.49克甲醇(一溶劑) 至20.00克銀錯合物化合物中,以獲得一黏度為3.3厘泊之透明銀 墨水組合物。經熱重量分析法(TGA)確認該墨水組合物之銀含 量為19.47重量% (請參第9圖)。將該墨水組合物塗覆於PET膜 上並於表1之溫度下烺燒該所得之均勻且精確的膜。該膜之導電 性(平面電阻)及黏著性係如表1所示。 實施例86 添加實施例85所製得之40.00克透明銀墨水組合物與41.00克 銀薄片(EA0295,Chemet)至一透明溶液中,其中係將5.00克聚 乙烯醇縮丁醛(BS-18,Wacker)(—黏著劑)溶於14.00克丁基 二乙二醇乙醚中。在攪拌10分鐘後,將該溶液移至一三滾輪研磨 機(Drais Mannheim)五次,以獲得一銀含量為49.64重量%且黏 度為2,500厘泊之導電性墨水組合物。將該墨水組合物塗覆於PET 膜上並於表1之溫度下煅燒該所得之均勻且精確的膜。該膜之導 電性(平面電阻)及黏著性係如表1所示。 59 1326297 實施例87 添加實施例85所製得之40.00克透明銀墨水組合物與22.60克 醋酸銀至一 5.00克異丙胺和32.40克丁基二乙二醇乙醚之混合溶 液中。之後,可獲得一黏度為11.5厘泊之透明銀墨水組合物。將 該墨水組合物塗覆於PET膜上並於表1之溫度下煅燒該所得之均 勻且精確的膜。該膜之導電性(平面電阻)及黏著性係如表1所 示。Next, 63.06 g (927.08 mmol) of a 50% by weight aqueous hydrogen peroxide solution was slowly added to obtain a colorless, transparent solution. The reaction was carried out at room temperature, while silver powder (SNGPSN-100-99, SOLNANOGY, average particle size = 100 nm) was slowly added until it was no longer dissolved. As the reaction proceeded, the reaction solution turned into a gray paste and eventually turned into a colorless, clear solution. The amount of silver consumed was 20.00 grams (185_41 millimoles). The reaction solution was filtered through a 0.45 μm membrane filter and the solvent was removed in vacuo to obtain 54.70 g of a white silver compound. The silver content was confirmed by thermogravimetric analysis (TGA) to be 36.50% by weight. 5-30 g of 2-ethylhexylamine (a stabilizer) and 12.49 g of methanol (a solvent) were added to 20.00 g of the silver complex compound to obtain a transparent silver ink composition having a viscosity of 3.3 cps. The silver content of the ink composition was confirmed by thermogravimetric analysis (TGA) to be 19.47% by weight (see Fig. 9). The ink composition was applied to a PET film and the resulting uniform and precise film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 86 40.00 g of a clear silver ink composition prepared in Example 85 and 41.00 g of a silver flake (EA0295, Chemet) were added to a clear solution, wherein 5.00 g of polyvinyl butyral (BS-18, Wacker) (-adhesive) was dissolved in 14.00 g of butyl diethylene glycol ether. After stirring for 10 minutes, the solution was transferred to a three-roll mill (Drais Mannheim) five times to obtain a conductive ink composition having a silver content of 49.64% by weight and a viscosity of 2,500 centipoise. The ink composition was applied to a PET film and the resulting uniform and precise film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. 59 1326297 Example 87 40.00 g of a clear silver ink composition obtained in Example 85 was added to a mixed solution of 22.60 g of silver acetate to 5.00 g of isopropylamine and 32.40 g of butyl diethylene glycol diethyl ether. Thereafter, a transparent silver ink composition having a viscosity of 11.5 centipoise is obtained. The ink composition was applied to a PET film and the resulting uniform and precise film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1.

實施例88Example 88

使用67.36克( 556.16毫莫耳)碳酸氫異丙基銨取代異丙基胺基 甲酸異丙基銨,以與實施例85相同之方法製得一無色、透明溶液。 所消耗之銀的量為12.80克(118.66毫莫耳)。以0.45微米之膜過 濾器過濾該反應溶液並於真空中將溶劑移除,以獲得33.62克白色 銀錯合物化合物。經熱重量分析法(TGA)確認銀含量為37.50 重量%。添加5.30克2-乙基己胺(一穩定劑)以及8.47克曱醇(一 溶劑)至20.00克銀錯合物化合物中,以獲得一黏度為3.5厘泊之 透明銀墨水組合物。將該墨水組合物塗覆於PET膜上並於表1之 溫度下煅燒該所得之均勻且精確的膜。該膜之導電性(平面電阻) 及黏著性係如表1所示。 實施例89 使用50.12克( 278.08毫莫耳)異丙基碳酸異丙基銨取代異丙基 胺基甲酸異丙基銨及使用等量之水取代曱醇,以與實施例85相同 之方法製得一無色、透明溶液。所消耗之銀的量為3.60克(33.37 毫莫耳)。以0.45微米之膜過濾器過濾該反應溶液並於真空中將溶 60 1326297 劑移除,以獲得11.31克白色銀錯合物化合物。經熱重量分析法 (TGA)確認銀含量為31.50重量%。添加2.65克2-乙基己胺(一 穩定劑)以及4.24克甲醇(一溶劑)至10.00克銀錯合物化合物 中,以獲得一黏度為3.6厘泊之透明銀墨水組合物。將該墨水組合 物塗覆於PET膜上並於表1之溫度下煅燒該所得之均勻且精確的 膜。該膜之導電性(平面電阻)及黏著性係如表1所示。 實施例90A colorless, clear solution was obtained in the same manner as in Example 85, using 67.36 g ( 556.16 mmol) of isopropyl ammonium hydrogencarbonate in place of isopropyl ammonium isopropylamine. The amount of silver consumed was 12.80 grams (118.66 millimoles). The reaction solution was filtered through a 0.45 μm membrane filter and the solvent was removed in vacuo to obtain 33.62 g of a white silver complex compound. The silver content was confirmed by thermogravimetric analysis (TGA) to be 37.50% by weight. 5.30 g of 2-ethylhexylamine (a stabilizer) and 8.47 g of decyl alcohol (a solvent) were added to 20.00 g of the silver complex compound to obtain a transparent silver ink composition having a viscosity of 3.5 cps. The ink composition was applied to a PET film and the resulting uniform and precise film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 89 The same procedure as in Example 85 was carried out using 50.12 g (278.08 mmol) of isopropylammonium isopropyl carbonate in place of isopropylammonium isopropylaminocarbamate and replacing the decyl alcohol with an equivalent amount of water. Get a colorless, transparent solution. The amount of silver consumed was 3.60 grams (33.37 millimoles). The reaction solution was filtered through a 0.45 μm membrane filter and the solvent 60 1326297 was removed in vacuo to obtain 11.31 g of a white silver complex compound. The silver content was confirmed by thermogravimetric analysis (TGA) to be 31.50% by weight. 2.65 g of 2-ethylhexylamine (a stabilizer) and 4.24 g of methanol (a solvent) were added to 10.00 g of the silver complex compound to obtain a transparent silver ink composition having a viscosity of 3.6 cps. The ink composition was applied to a PET film and the resulting uniform and precise film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 90

使用108.20克( 556.16毫莫耳)2-曱氧基乙基胺基甲酸2-曱氧 基乙基銨取代異丙基胺基甲酸異丙基銨,以與實施例85相同之方 法製得一黃色、透明溶液。所消耗之銀的量為11.20克(103.83 毫莫耳)。以0.45微米之膜過濾器過濾該反應溶液並於真空中將溶 劑移除,以獲得35.40克液態之棕色銀錯合物化合物。經熱重量分 析法(TGA)確認銀含量為31.42重量%。添加8.48克銀薄片、8.48 克銀粉末以及一透明溶液(其中係將1.50克聚乙烯醇縮丁醛(一 黏著劑)溶於11τ54克丁基溶纖維劑中)至20.00克銀錯合物化合 物中。在攪拌10分鐘後,將該溶液移至一三滾輪研磨機(Drais Mannheim)五次,以獲得一銀含量為46.49重量%且黏度為1,120 厘泊之導電性墨水組合物。將該墨水組合物塗覆於PET膜上並於 表1之溫度下煅燒該所得之均勻且精確的膜。該膜之導電性(平 面電阻)及黏著性係如表1所示。 實施例91 添加實施例90所製得之20.00克銀錯合物化合物、16·96克銀薄 片和1.00克醋酸鉍(一金屬前驅物)至一透明溶液中,其中係將 61 1326297 1.50克聚乙烯醇縮丁醛(一黏著劑)溶於10.54克丁基溶纖維劑 中。在攪拌10分鐘後,將該溶液移至一三滾輪研磨機(Drais Mannheim )五次,以獲得一黏度為1,560厘泊之導電性墨水組合 物。將該墨水組合物塗覆於PET膜上並於表1之溫度下煅燒該所 得之均勻且精確的膜。該膜之導電性(平面電阻)及黏著性係如 表1所示。 實施例92A solution was prepared in the same manner as in Example 85 except that 108.20 g (556.16 mmol) of 2-decyloxyethylaminocarbamate 2-methoxyethylammonium chloride was substituted for isopropylammonium isopropylaminocarbamate. Yellow, clear solution. The amount of silver consumed was 11.20 grams (103.83 millimoles). The reaction solution was filtered through a 0.45 μm membrane filter and the solvent was removed in vacuo to obtain 35.40 g of a liquid brown silver complex compound. The silver content was confirmed by thermogravimetric analysis (TGA) to be 31.42% by weight. 8.48 g of silver flakes, 8.48 g of silver powder and a clear solution (in which 1.50 g of polyvinyl butyral (an adhesive) was dissolved in 11τ of 54 g of butylcellulose) were added to 20.00 g of the silver complex compound. After stirring for 10 minutes, the solution was transferred to a three-roll mill (Drais Mannheim) five times to obtain a conductive ink composition having a silver content of 46.49% by weight and a viscosity of 1,120 centipoise. The ink composition was applied to a PET film and the resulting uniform and precise film was calcined at the temperature of Table 1. The conductivity (flat resistance) and adhesion of the film are shown in Table 1. Example 91 20.00 g of silver complex compound, 16.96 g of silver flakes and 1.00 g of cerium acetate (a metal precursor) obtained in Example 90 were added to a clear solution, wherein 61 1326297 1.50 g was charged. Vinyl butyral (an adhesive) was dissolved in 10.54 g of butylcellulose. After stirring for 10 minutes, the solution was transferred to a three-roll mill (Drais Mannheim) five times to obtain a conductive ink composition having a viscosity of 1,560 centipoise. The ink composition was applied to a PET film and the resulting uniform and precise film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 92

使用43.42克( 556.16毫莫耳)胺基甲酸銨取代異丙基胺基甲酸 異丙基銨,以與實施例85相同之方法製得一無色、透明溶液。所 消耗之銀的量為8.80克(81.58毫莫耳)。以0.45微米之膜過濾器 過濾該反應溶液並於真空中將溶劑移除,以獲得20.80克液態之白 色銀錯合物化合物。經熱重量分析法(TGA)確認銀含量為42.00 重量%。添加1.20克碳酸銨(一穩定劑)、0.05克EFKA3650(EFKA) 和25.00克甲氧基醋酸丙酯(一溶劑)至20.00克銀錯合物化合物 中,以獲得一黏度為3.5厘泊之透明銀墨水組合物。將該墨水組合 物塗覆於PET膜上並於表1之溫度下煅燒該所得之均勻且精確的 膜。該膜之導電性(平面電阻)及黏著性係如表1所示。 實施例93 於一裝設有一攪拌器之1,〇〇〇毫升燒瓶中,將66.02克( 370.77 毫莫耳)之莫耳比為2:1的異丙胺和硼酸之混合物溶於400毫升曱 醇中。添加30·07克(185.39毫莫耳)異丙基胺基曱酸異丙基銨並 緩慢添加63.06克(927.08毫莫耳)之50重量%的過氧化氫含水 溶液,以獲得一無色、透明溶液。接著,於室溫下進行反應且同 62 1326297A colorless, clear solution was obtained in the same manner as in Example 85, using 43.42 g ( 556.16 mmol) of ammonium amide. The amount of silver consumed was 8.80 grams (81.58 millimoles). The reaction solution was filtered through a 0.45 μm membrane filter and the solvent was removed in vacuo to obtain 20.80 g of a liquid white silver complex compound. The silver content was confirmed by thermogravimetric analysis (TGA) to be 42.00% by weight. Add 1.20 g of ammonium carbonate (a stabilizer), 0.05 g of EFKA 3650 (EFKA) and 25.00 g of propyl methoxyacetate (a solvent) to 20.00 g of the silver complex compound to obtain a transparency of 3.5 cps. Silver ink composition. The ink composition was applied to a PET film and the resulting uniform and precise film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 93 In a 〇〇〇 ml flask equipped with a stirrer, 66.02 g (370.77 mmol) of a mixture of isopropylamine and boric acid having a molar ratio of 2:1 was dissolved in 400 ml of sterol. in. Add 30.07 g (185.39 mmol) of isopropylammonium isopropyl citrate and slowly add 63.06 g (927.08 mmol) of a 50% by weight aqueous solution of hydrogen peroxide to obtain a colorless, transparent Solution. Then, the reaction is carried out at room temperature and the same as 62 1326297

時緩慢添加入金屬銀直至其不再溶解為止。當反應進行時,該反 應溶液變成一灰色漿料並且最終變成一無色透明溶液。所消耗之 銀的量為9.10克( 84.36毫莫耳)。以0.45微米之膜過濾器過濾該 反應溶液並於真空中將溶劑移除,以獲得29.72克白色銀錯合物化 合物。經熱重量分析法(TGA )確認銀含量為30.3 1重量%。添加 0.20克三丙胺(一穩定劑)、0.03克BYK 373 (BYK)和20.00克 1-甲氧基丙醇(一溶劑)至12.00克銀錯合物化合物中,以獲得一 黏度為3.6厘泊之透明銀墨水組合物。將該墨水組合物塗覆於醯亞 胺膜上並於表1之溫度下煅燒該所得之均勻且精確的膜。該膜之 導電性(平面電阻)及黏著性係如表1所示。 實施例94 於一裝設有一攪拌器之1,〇〇〇毫升燒瓶中,將90.22克( 556.16 毫莫耳)異丙基胺基甲酸異丙基銨溶於400毫升甲醇中。使用一 冰浴將該反應混合物冷卻至-40°C並使用一臭氧生成器(Ozone Generator-LAB2,OzoneTech)產生臭氧的氣泡(6.21 克/小時)。Slowly add metallic silver until it no longer dissolves. As the reaction proceeded, the reaction solution turned into a gray paste and eventually turned into a colorless, transparent solution. The amount of silver consumed was 9.10 grams (84.36 millimoles). The reaction solution was filtered through a 0.45 μm membrane filter and the solvent was removed in vacuo to obtain 29.72 g of a white silver compound. The silver content was confirmed by thermogravimetric analysis (TGA) to be 30.3 1% by weight. 0.20 g of tripropylamine (a stabilizer), 0.03 g of BYK 373 (BYK) and 20.00 g of 1-methoxypropanol (a solvent) were added to 12.00 g of the silver complex compound to obtain a viscosity of 3.6 cps. Transparent silver ink composition. The ink composition was coated on a quinone film and the resulting uniform and precise film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 94 In a 〇〇〇 ml flask equipped with a stirrer, 90.22 g (556.16 mmol) of isopropylammonium isopropylcarbamate was dissolved in 400 ml of methanol. The reaction mixture was cooled to -40 ° C using an ice bath and an ozone bubble (6.21 g/hr) was produced using an ozone generator (Ozone Generator-LAB 2, Ozone Tech).

% 接著,於室溫下進行反應且同時緩慢添加金屬銀直至其不再溶解 為止。當反應進行時,該反應溶液變成一灰色漿料並且最終變成 一無色透明溶液。所消耗之銀的量為5.20克(48.21毫莫耳)。以 0.45微米之膜過濾器過濾該反應溶液並於真空下將溶劑移除,以 獲得14.68克白色銀錯合物化合物。經熱重量分析法(TGA)確認 銀含量為35.00重量%。添加2.65克2-乙基己胺(一穩定劑)和 4.24克甲醇(一溶劑)至10.00克銀錯合物化合物中,以獲得一黏 度為3.7厘泊之透明銀墨水組合物。將該墨水組合物塗覆於PET 63 1326297 膜上並於表1之溫度下锻燒該所得之均勻且精雄的膜。該膜之導 電性(平面電阻)及黏著性係如表1所示。 實施例95 於一裝設有一攪拌器之1,〇〇〇毫升燒瓶中,將90.22克( 556.16 毫莫耳)異丙基胺基曱酸異丙基敍溶於400亳升甲醇中。使用一 冰浴將該反應混合物冷卻至-40〇C並使用一臭氧生成器(〇z〇ne Generator-LAB2,Ozone Tech )產生臭氧的氣泡(6 2丨克/小時)。 接著,進行反應且同時使用一銀箔作為電極以提供交流電(8〇伏 特,60赫茲)至該溶液直至銀電極不再溶解為止。當反應進行時,· 該反應溶液變成一灰色漿料並且最終變成一無色透明溶液。所消 耗之銀的量為12.20克(113.10毫莫耳)。以〇 45微米之膜過濾器 過濾該反應溶液並於真空中將溶劑移除,以獲得3416克白色銀錯 合物化合物《經熱重量分析法(TGA)確認銀含量為35 5〇重量0/〇。 添加0·20克一異丙胺(一穩定劑)、〇 〇3克Βγκ 373 ( BYK)和 20.00克1-甲氧基丙醇(一溶劑)至12 〇〇克銀錯合物化合物中, 以獲得一黏度為3.8厘泊之透明銀墨水組合物。將該墨水組合物塗 # 覆於PET膜_L並於表丨之溫度下炮燒該所得之均勾且精碟的膜。 該膜之導電性(平面電阻)及黏著性係如表i所示。 實施例96 於裝°又有一攪拌器之1,000毫升燒瓶中,將90 22克(556 16 毫莫耳)異丙基胺基甲酸異丙基敍和1⑼t如咖。1465 (Ak Product)溶於_ $升甲醇中。使用_冰浴將該反應混合物冷卻 至-40 C並產生臭氧的氣泡。接著,進行反應且同時使用一銀结作 64 1326297% Next, the reaction was carried out at room temperature while metal silver was slowly added until it was no longer dissolved. As the reaction proceeded, the reaction solution turned into a gray paste and eventually became a colorless, transparent solution. The amount of silver consumed was 5.20 grams (48.21 millimoles). The reaction solution was filtered through a 0.45 μm membrane filter and the solvent was removed under vacuum to obtain 14.68 g of a white silver compound. The silver content was confirmed by thermogravimetric analysis (TGA) to be 35.00% by weight. 2.65 g of 2-ethylhexylamine (a stabilizer) and 4.24 g of methanol (a solvent) were added to 10.00 g of the silver complex compound to obtain a transparent silver ink composition having a viscosity of 3.7 cps. The ink composition was coated on a PET 63 1326297 film and the resulting uniform and fine film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 95 In a 〇〇〇 ml flask equipped with a stirrer, 90.22 g (556.16 mmol) of isopropylamino decanoic acid isopropyl was dissolved in 400 liters of methanol. The reaction mixture was cooled to -40 ° C using an ice bath and a bubble of ozone (6 2 g/hr) was produced using an ozone generator (〇z〇ne Generator-LAB 2, Ozone Tech). Next, the reaction was carried out while using a silver foil as an electrode to supply alternating current (8 volts, 60 Hz) to the solution until the silver electrode was no longer dissolved. As the reaction proceeds, the reaction solution turns into a gray paste and eventually becomes a colorless, transparent solution. The amount of silver consumed was 12.20 grams (113.10 millimoles). The reaction solution was filtered through a membrane filter of 45 μm and the solvent was removed in vacuo to obtain 3416 g of a white silver complex compound. The mass of the silver was confirmed by thermogravimetric analysis (TGA) to be 35 〇 weight 0/ Hey. Add 0.20 g of monoisopropylamine (a stabilizer), 3 g of Βγκ 373 (BYK) and 20.00 g of 1-methoxypropanol (a solvent) to 12 g of the silver complex compound to A clear silver ink composition having a viscosity of 3.8 centipoise was obtained. The ink composition was coated with a film of PET film _L and fired at the temperature of the watch to obtain a film of the obtained smear and fine disk. The conductivity (planar resistance) and adhesion of the film are shown in Table i. Example 96 In a 1,000 ml flask equipped with a stirrer, 90 22 g (556 16 mmol) of isopropylamino isopropyl isopropyl and 1 (9) t were added. 1465 (Ak Product) is dissolved in _ liter of methanol. The reaction mixture was cooled to -40 C using an ice bath and a bubble of ozone was produced. Next, the reaction is carried out while using a silver knot 64 1326297

為電極以提供交流電(80伏特,60赫茲)至該溶液直到銀電極不 再溶解為止。當反應進行時,該反應溶液變成一灰色漿料並且最 終變成一無色透明溶液。所消耗之銀的量為9.40克(87.14毫莫 耳)。以0.45微米之膜過濾器過濾該反應溶液並於真空中將溶劑移 除,以獲得27.73克白色銀錯合物化合物。經熱重量分析法(TGA) 確認銀含量為33.80重量%。添加0.20克3-甲氧基丙胺(一穩定 劑)、0.03 克 TEGO Wet 505 ( Degussa )和 20.00 克乙醇(一溶劑) 至12.00克銀錯合物化合物中,以獲得一黏度為3.3厘泊之透明銀 墨水組合物。將該墨水組合物塗覆於PET膜上並於表1之溫度下 煅燒該所得之均勻且精確的膜。該膜之導電性(平面電阻)及黏 著性係如表1所示。 實施例97 使用一具320網孔圖樣化之絲網印刷機,將實施例86所製得之 黏度為2,500厘泊的導電性墨水於PET膜上形成圖樣。將該經圖 樣化之試樣於l〇〇°C下熱處理3分鐘,接著於130°C下熱處理10 % 分鐘(請參第10圖)。 比較例1 添加50.2克銀薄片(EA0295,Chemet)至一透明溶液中,其中 係將5.0克聚乙烯醇縮丁醛(BS-18,Wacker)(—黏著劑)溶於 44.8克丁基二乙二醇乙醚中。在攪拌10分鐘後,將該溶液移至一 三滾輪研磨機五次,以獲得一銀含量為50.2重量%且黏度為3.21 帕·秒之墨水組合物。以與實施例15相同之方法塗覆該墨水組合 物並於表1之溫度下煅燒該所得之膜。該膜之導電性(平面電阻) 65 #著险係如表i所不。導電性與黏著性係比實施例K要來的差 且可觀察到裂痕。 比較例2 添加21.0克銀2_己酸乙酿和41 2克銀薄片(ea〇295,chemet) 透月冷液中’其中係將5 G克聚乙稀醇縮丁搭⑽魯偏 著劑)/合於32.8克丁基二乙二醇乙越中。在授拌1〇分鐘後, 。將該溶液移至—三滾輪研磨機五次,叫得-銀含量為50.2重量 。黏度為3.57帕.秒之墨水組合物。以與實施例15相同之方法 覆=墨Jc,.a σ物並锻燒該所得之膜。該膜之導電性(平面電阻) 及黏著性係如表1所示。導電性與黏著性係明顯比實施例15要來 的差0 比較例3 以與實施例15相同之方法製得—銀含量為Μ重量%且黏度為 帕&之液態之銀錯合物化合物,將其以與實施例Μ相同之 方法塗覆並锻燒該所得之膜。該膜之導電性(平面電阻)及黏著 性係如表1所示。該膜係薄的且導電性係比實施例15要來的差。 該膜之均勻性亦較不佳。 比較例4 人添加13’8克甲醇(―溶劑)至實施例51所製得之20·〇克銀錯 。物化合物且不使用2·乙基己胺(一穩定劑),以獲得-黏度為 /厘泊之透明銀墨水組合物。以與實施例51相同之方法塗覆該 ^組合物並锻燒該所得之膜。該膜之導電性(平面電阻)及黏 者表1所示。導電性與黏著性係比實施例51要來的差且可 1326297 觀察到裂痕。 比較例5 藉由使用5.0克己酸銀以及添加5 3克2_乙基己胺(一穩定劑) 和5.54克甲醇(一溶劑),以製備一黏度為56厘泊之透明銀墨水 組合物。以與實施例51相同之方法塗覆該墨水組合物並煅燒該所 得之膜。該膜之導電性(平面電阻)及黏著性係如表i所示。導The electrode was supplied with alternating current (80 volts, 60 Hz) to the solution until the silver electrode was no longer dissolved. As the reaction proceeded, the reaction solution turned into a gray paste and eventually became a colorless, transparent solution. The amount of silver consumed was 9.40 grams (87.14 millimoles). The reaction solution was filtered through a 0.45 μm membrane filter and the solvent was removed in vacuo to give 27.73 g of a white silver compound. The silver content was confirmed by thermogravimetric analysis (TGA) to be 33.80% by weight. 0.20 g of 3-methoxypropylamine (a stabilizer), 0.03 g of TEGO Wet 505 (Degussa) and 20.00 g of ethanol (one solvent) were added to 12.00 g of the silver complex compound to obtain a viscosity of 3.3 cps. Transparent silver ink composition. The ink composition was applied to a PET film and the resulting uniform and precise film was calcined at the temperature of Table 1. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. Example 97 A conductive ink having a viscosity of 2,500 cps prepared in Example 86 was patterned on a PET film using a screen printing machine having a 320 mesh pattern. The patterned sample was heat treated at 1 ° C for 3 minutes and then heat treated at 130 ° C for 10 minutes (see Figure 10). Comparative Example 1 50.2 g of silver flakes (EA0295, Chemet) was added to a clear solution in which 5.0 g of polyvinyl butyral (BS-18, Wacker) (-adhesive) was dissolved in 44.8 g of butyl di In diol ether. After stirring for 10 minutes, the solution was transferred to a three-roll mill for five times to obtain an ink composition having a silver content of 50.2% by weight and a viscosity of 3.21 Pa·s. The ink composition was applied in the same manner as in Example 15 and the resulting film was calcined at the temperature of Table 1. The conductivity of the film (planar resistance) 65 # danger is as shown in Table i. The conductivity and adhesion were inferior to those of Example K and cracks were observed. Comparative Example 2 Add 21.0 g of silver 2-hexanoic acid and 41 2 g of silver flakes (ea 295, chemet) in the liquid-cold liquid, which is a 5 G gram of polyvinyl condensate (10) ruthenium agent ) / combined with 32.8 grams of butyl diethylene glycol. After mixing for 1 minute, The solution was transferred to a three-roll mill five times, and the silver content was 50.2 weight. An ink composition having a viscosity of 3.57 Pa.s. The resulting film was overcoated with the ink Jc, .a σ in the same manner as in Example 15. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. The conductivity and adhesion were significantly lower than those of Example 15. Comparative Example 3 In the same manner as in Example 15, a liquid silver complex compound having a silver content of Μ% by weight and a viscosity of Pa & This was coated and calcined in the same manner as in Example 锻. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. The film was thin and the conductivity was inferior to that of Example 15. The uniformity of the film is also less than good. Comparative Example 4 A person was added 13'8 g of methanol ("solvent" to 20% gram silver obtained in Example 51. The compound was used without using diethylhexylamine (a stabilizer) to obtain a transparent silver ink composition having a viscosity of / centipoise. The composition was applied in the same manner as in Example 51 and the resulting film was calcined. The conductivity (planar resistance) and adhesion of the film are shown in Table 1. The conductivity and adhesion were inferior to those of Example 51 and cracks were observed in 1326297. Comparative Example 5 A transparent silver ink composition having a viscosity of 56 cps was prepared by using 5.0 g of silver hexanoate and adding 53 g of 2-ethylhexylamine (a stabilizer) and 5.54 g of methanol (a solvent). The ink composition was applied in the same manner as in Example 51 and the obtained film was calcined. The conductivity (planar resistance) and adhesion of the film are shown in Table i. guide

電性與黏著性係明顯比實施例51要來的差。 表1:實施例和比較例所製得之膜的物理特性 煅燒溫度(°C) 導電性(Ω/) 黏著性 實施例1 150 0.472 〇 實施例2 150 0.089 〇 實施例3 150 0.210 0 實施例4 180 0.924 △ 實施例5 200 0.528 0 實施例6 150 0,162 〇 實施例7 180 0.956 0 實施例8 180 0.742 〇 實施例9 200 0.174 〇 實施例10 200 0.152 0 實施例11 200 0.193 0 實施例12 180 1.831 0 實施例13 150 0.470 〇 實施例14 150 0.098 〇 67 1326297The electrical and adhesive lines were significantly worse than those of Example 51. Table 1: Physical properties of the films obtained in the examples and comparative examples Calcination temperature (° C.) Conductivity (Ω/) Adhesion Example 1 150 0.472 〇 Example 2 150 0.089 〇 Example 3 150 0.210 0 Example 4 180 0.924 △ Example 5 200 0.528 0 Example 6 150 0,162 〇 Example 7 180 0.956 0 Example 8 180 0.742 〇 Example 9 200 0.174 〇 Example 10 200 0.152 0 Example 11 200 0.193 0 Example 12 180 1.831 0 Example 13 150 0.470 〇 Example 14 150 0.098 〇67 1326297

實施例15 130 0.115 〇 實施例16 130 0.477 0 實施例17 130 0.320 〇 實施例18 130 0.779 0 實施例19 130 0.954 〇 實施例20 130 0.789 〇 實施例21 130 0.368 〇 實施例22 130 0.377 〇 實施例23 130 0.340 0 實施例24 130 0.865 Δ 實施例25 130 0.405 0 實施例26 130 0.724 Δ 實施例27 130 0.534 〇 實施例28 250 0.120 0 實施例29 250 0.456 〇 實施例30 250 0.389 〇 實施例31 130 0.128 〇 實施例32 130 0.456 0 實施例33 130 0.132 0 實施例34 130 0.497 〇 實施例35 130 0.048 0 實施例36 130 0.024 〇 實施例37 130 0.241 0 68 1326297Example 15 130 0.115 〇Example 16 130 0.477 0 Example 17 130 0.320 〇Example 18 130 0.779 0 Example 19 130 0.954 〇Example 20 130 0.789 〇Example 21 130 0.368 〇Example 22 130 0.377 〇Example 23 130 0.340 0 Example 24 130 0.865 Δ Example 25 130 0.405 0 Example 26 130 0.724 Δ Example 27 130 0.534 〇 Example 28 250 0.120 0 Example 29 250 0.456 〇 Example 30 250 0.389 〇 Example 31 130 0.128 〇Example 32 130 0.456 0 Example 33 130 0.132 0 Example 34 130 0.497 〇Example 35 130 0.048 0 Example 36 130 0.024 〇Example 37 130 0.241 0 68 1326297

實施例38 100 0.133 Δ 實施例39 130 0.537 〇 實施例40 130 0.134 〇 實施例41 150 0.346 0 實施例42 130 0.351 〇 實施例43 130 0.545 Δ 實施例44 130 0.349 0 實施例45 130 0.641 〇 實施例46 130 0.389 0 實施例47 130 0.237 0 實施例48 130 0.596 0 實施例49 130 0.014 〇 實施例50 200 0.458 0 實施例51 130 0.22 0 實施例52 130 0.30 〇 實施例53 130 0.25 〇 實施例54 130 0.25 〇 實施例55 130 0.48 Δ 實施例56 120 0.58 Δ 實施例57 130 0.44 Δ 實施例58 130 0.38 0 實施例59 250 0.37 0 實施例60 130 0.29 0 69 1326297 實施例61 250 0.50 0 實施例62 250 0.56 0 實施例63 100 0.25 Δ 實施例64 100 0.28 Δ 實施例65 120 0.41 Δ 實施例66 130 0.38 Δ 實施例67 130 0.35 0 實施例68 130 0.45 0 實施例69 130 0.35 Δ 實施例70 250 0.51 Δ 實施例71 130 0.55 0 實施例72 130 0.58 Δ 實施例73 250 0.90 0 實施例74 130 1.00 Δ 實施例75 130 0.24 Δ 實施例76 130 0.39 0 實施例77 130 0.51 0 實施例78 130 0.32 〇 實施例79 130 0.42 0 實施例80 130 0.65 Δ 實施例81 130 0.61 Δ 實施例82 130 0.38 0 實施例83 250 0.32 〇Example 38 100 0.133 Δ Example 39 130 0.537 〇 Example 40 130 0.134 〇 Example 41 150 0.346 0 Example 42 130 0.351 〇 Example 43 130 0.545 Δ Example 44 130 0.349 0 Example 45 130 0.641 〇Example 46 130 0.389 0 Example 47 130 0.237 0 Example 48 130 0.596 0 Example 49 130 0.014 〇 Example 50 200 0.458 0 Example 51 130 0.22 0 Example 52 130 0.30 〇 Example 53 130 0.25 〇 Example 54 130 0.25 〇 Example 55 130 0.48 Δ Example 56 120 0.58 Δ Example 57 130 0.44 Δ Example 58 130 0.38 0 Example 59 250 0.37 0 Example 60 130 0.29 0 69 1326297 Example 61 250 0.50 0 Example 62 250 0.56 0 Example 63 100 0.25 Δ Example 64 100 0.28 Δ Example 65 120 0.41 Δ Example 66 130 0.38 Δ Example 67 130 0.35 0 Example 68 130 0.45 0 Example 69 130 0.35 Δ Example 70 250 0.51 Δ Example 71 130 0.55 0 Example 72 130 0.58 Δ Example 73 250 0.90 0 Example 74 130 1.00 Δ Example 75 130 0.24 Δ Example 76 130 0.39 0 Example 77 130 0.51 0 Example 78 130 0.32 实施 Example 79 130 0.42 0 Example 80 130 0.65 Δ Example 81 130 0.61 Δ Example 82 130 0.38 0 Example 83 250 0.32 〇

70 132629770 1326297

實施例‘84 130 0.58 〇 實施例85 130 0.25 〇 實施例86 130 0.11 〇 實施例87 130 0.35 0 實施例8 8 130 0.28 0 實施例89 150 0.71 Δ 實施例90 150 0.23 0 實施例91 130 0.64 0 實施例92 130 0.45 〇 實施例93 200 0.53 〇 實施例94 130 0.28 0 實施例95 130 0.33 〇 實施例96 100 0.31 〇 實施例97 130 0.12 0 比較例1 130 1.106 Δ 比較例2 130 3.425 X 比較例3 130 0.455 Δ 比較例4 130 0.35 Δ 比較例5 130 5000 X (1)黏著性測試:藉由於膜之經印刷表面貼上和撕下Scotch膠帶 (3M)來評估。 0:膜表面無剝落。 △:部分膜表面剝落。 71 1326297 x:大部分膜表面剝落。. (2)導電性測試:使用CMT-SR1000N (AIT)對一 1公分xl公分 之正方形試樣測量平面電阻。 產業應用EXAMPLES '84 130 0.58 〇Example 85 130 0.25 〇Example 86 130 0.11 〇Example 87 130 0.35 0 Example 8 8 130 0.28 0 Example 89 150 0.71 Δ Example 90 150 0.23 0 Example 91 130 0.64 0 Example 92 130 0.45 〇 Example 93 200 0.53 〇 Example 94 130 0.28 0 Example 95 130 0.33 〇 Example 96 100 0.31 〇 Example 97 130 0.12 0 Comparative Example 1 130 1.106 Δ Comparative Example 2 130 3.425 X Comparative Example 3 130 0.455 Δ Comparative Example 4 130 0.35 Δ Comparative Example 5 130 5000 X (1) Adhesion test: evaluated by attaching and peeling Scotch tape (3M) to the printed surface of the film. 0: The surface of the film was not peeled off. △: Part of the film surface peeled off. 71 1326297 x: Most of the film surface peeled off. (2) Conductivity test: The plane resistance was measured for a square specimen of 1 cm x 1 cm using CMT-SR1000N (AIT). Industrial application

本發明係關於多種導電性墨水組合物,包含一具特殊結構之金 屬錯合物化合物和一添加劑’以及一種製備該等組合物之方法。 本發明之墨水組合物具有優異穩定性及溶解度,其係易於形成膜 且即便在200°C或更低之低溫下亦係易於煅燒,以形成具良好導 電性之膜或圖樣。該組合物可塗覆或直接印刷於多種基材上,包 含金屬、玻璃、矽晶圓、陶瓷、例如聚酯或聚醯亞胺之塑膠膜、 橡膠片、纖維、木頭、紙等。 本發明之組合物可使膜均勻形成並提供一具良好導電性和黏著 性之膜。此外,膜具一優異品質且沒有裂痕。 本發明墨水組合物可廣泛用於EMI屏蔽材料、導電性黏著劑、 低電阻金屬線、PCBs、FPCs、RFID標籤的天線、pdps、TFT-LCDS、 OLEDs、軟性顯示器及OTFTs之太陽能電池、二次電池或燃料電 · 池以及電極或接線等。 應瞭解熟習本技術領域者可基於前述所揭露之概念及特定實施 態樣,修改或設計其它實施態樣以達成與本發明相同之目的。熟 習本技術領域者亦應瞭解此類相同實施態樣並不背離本發明之精 神及範園’其係如後附申請專利範圍所界定。 【圖式簡單說明】 第1圖所示為實施例1之金屬墨水組合物的熱重量分析圖 72 1326297 (thermaogram,TGA); 第2圖所示為使用實施例1之金屬墨水組合物絲網印刷於PET 膜上之圖樣; 第3圖所示為實施例15之導電性墨水組合物的TGA ; 第4圖所示為使用實施例15之墨水組合物絲網印刷於PET膜上 之圖樣, 第5圖所示為實施例52之墨水組合物的TGA ;The present invention is directed to a plurality of electrically conductive ink compositions comprising a metal complex compound of a particular structure and an additive' and a method of making such compositions. The ink composition of the present invention has excellent stability and solubility, is easy to form a film, and is easily calcined even at a low temperature of 200 ° C or lower to form a film or pattern having good electrical conductivity. The composition can be applied or printed directly onto a variety of substrates, including metal, glass, tantalum wafers, ceramics, plastic films such as polyester or polyimide, rubber sheets, fibers, wood, paper, and the like. The composition of the present invention allows the film to be uniformly formed and provides a film of good electrical conductivity and adhesion. In addition, the film has an excellent quality and no cracks. The ink composition of the invention can be widely used for EMI shielding materials, conductive adhesives, low-resistance metal wires, PCBs, FPCs, antennas for RFID tags, solar cells of pdps, TFT-LCDS, OLEDs, flexible displays and OTFTs, and secondary Battery or fuel cell, cell and electrode or wiring. It will be appreciated that those skilled in the art will be able to modify or design other embodiments to achieve the same objectives as the present invention. It is to be understood by those skilled in the art that the same embodiments are not to be construed as a BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a thermogravimetric analysis chart 72 1326297 (thermaogram, TGA) of the metal ink composition of Example 1, and Fig. 2 is a metal ink composition screen using the embodiment 1. The pattern printed on the PET film; the third figure shows the TGA of the conductive ink composition of Example 15, and the fourth figure shows the pattern printed on the PET film using the ink composition of Example 15, Figure 5 is a graph showing the TGA of the ink composition of Example 52;

第6圖所示為使用實施例82之墨水組合物喷墨印刷的圖樣; 第7圖所示為使用實施例83之墨水組合物絲網印刷於PET膜上 之圖樣, 第8圖所示為使用實施例84之墨水組合物柔版印刷的圖樣;; 第9圖所示為實施例85之墨水組合物的TGA ;以及 第10圖所示為使用實施例97之墨水組合物絲網印刷於PET膜 上的圖樣。 【主要元件符號說明】Fig. 6 is a view showing ink jet printing using the ink composition of Example 82; Fig. 7 is a view showing a pattern printed on the PET film using the ink composition of Example 83, and Fig. 8 is a view A pattern of flexographic printing using the ink composition of Example 84; Fig. 9 is a TGA of the ink composition of Example 85; and Fig. 10 is a screen printing using the ink composition of Example 97. The pattern on the PET film. [Main component symbol description]

7373

Claims (1)

1326297 ,, 丨公 ' ' 第09510分4丨3號專利申請案 中文申請專利範圍替換本(99年3月) 十、申請專利範圍: 1. 一種導電性墨水組合物,包含一金屬錯合物化合物以及一添 加劑,該金屬錯合物化合物係藉由將至少一由以下化學式1 . 所代表之金屬或金屬化合物與至少一由以下化學式2、化學式 . 3或化學式4所代表之以胺基甲酸銨或碳酸銨為基質之化合 物反應而獲得: ΜηΧ (1)1326297 ,, 丨公' '第09510分4丨3 Patent Application Replacement of Chinese Patent Application (March 99) X. Patent Application Range: 1. A conductive ink composition comprising a metal complex a compound and an additive, wherein the metal complex compound is represented by at least one metal or metal compound represented by the following Chemical Formula 1 and at least one amino acid represented by the following Chemical Formula 2, Chemical Formula 3. or Chemical Formula 4 Obtained by ammonium or ammonium carbonate as a matrix compound: ΜηΧ (1) Μ為一金屬或金屬合金;η為1至10之整數;且X為不 存在或為至少一選自以下群組之取代基:氫、銨、氧、硫、 鹵素、氰基、氰酸根、碳酸根、硝酸根、亞硝酸根、硫酸根、 磷酸根、硫氰酸根、氣酸根、過氣酸根、四氟硼酸根、乙醯 丙酮根、巯基、醯胺、醇鹽、羧酸根及其衍生物;以及 R1 9θ© ,r3 nconh-r4 (2) (3) (4) R2 R5 ^ ©θ^?β© R2-HNOCONH-R5 R3 Re r2-hnocoh R3 於化學式2至化學式4中,R丨、R2、R3、R4、R5以及R6 係各自獨立選自氫;經取代或未經取代之Ci-C3G脂肪族烷 基、環脂肪族烷基、芳基或芳烷基;聚合化合物;雜環化合 物、及其衍生物;其中,1與R2或R4與R5可彼此連接以形 成一具有或不具有雜原子之伸院基環(alkylene ring);其條 74 ^^6297 件為非所有的Β·ι至I皆為氫。 2. 如請求们㈣之導電性墨水組合物,其中該金屬錯合物化 合物係由以卞化學式5所代表: m (5) A為化學式2裏化學式4所代表之紅—人 之任—化合物,且0.7SmS5.5。 如請求項1戶斤述之導電性墨水έ且人妝甘 ^ 、,且。物,其中該由化學式1所 代表之金屬或金屬化合物係選自以下群組之至少一者:銀、 金、鋼、辞、鎳、鈷、鈀、鉑、鈦、釩、錳、鐵、鉻、锆、 鈮、鉬、鎢、釘、鎘、鈕、銖、餓、銥、鋁 '鎵鍺、銦、 錫、銻、鉛、鉍、釤、銪、锕、鉦、氧化銅、氧化鋅、氧化 釩、硫化鎳、氯化鈀' 碳酸銅、氯化鐵、氣化金、氣化鎳、 氣化鈷、硝酸鉍、乙醯丙酮釩、醋酸鈷、乳酸錫、草酸錳、 醋酸金、草酸钯、2-乙基已酸銅、硬脂酸鐵、甲酸鎳、鉬酸 錢、#檬酸鋅、醋酸叙、氰化銅、碳酸銘、氣化鉑、四氯金 酸(hydrogen tetrachloroaurate)、四丁氧基鈦、二氯化二甲 氧基錯、異丙醇鋁、四氟蝴酸錫、甲醇钽、十二基疏基金酸 鹽(dodecylmercaptoaurate )以及乙醯丙剩銦。 4· 如請求項丨所述之導電性墨水組合物,其中該由化學式1所 代表之金屬或金屬化合物為銀(Ag)、銀化合物或銀合金;η 為1至4之整數;且X係選自以下族群之至少一者:氧、硫、 鹵素、氰基、氰酸根、碳酸根、硝酸根、亞硝酸根、硫酸根、 磷酸根、硫氰酸根、氣酸根、過氯酸根、四氟硼酸根、乙醯 丙_根、羧酸根及其衍生物。 75 1326297Μ is a metal or metal alloy; η is an integer from 1 to 10; and X is a substituent which is absent or at least one selected from the group consisting of hydrogen, ammonium, oxygen, sulfur, halogen, cyano, cyanate, Carbonate, nitrate, nitrite, sulfate, phosphate, thiocyanate, oleate, peroxyacid, tetrafluoroborate, acetoacetate, sulfhydryl, decylamine, alkoxide, carboxylate and derivatives thereof And R1 9θ© , r3 nconh-r4 (2) (3) (4) R2 R5 ^ ©θ^ββ R2-HNOCONH-R5 R3 Re r2-hnocoh R3 In Chemical Formula 2 to Chemical Formula 4, R丨, R 2 , R 3 , R 4 , R 5 and R 6 are each independently selected from hydrogen; substituted or unsubstituted Ci-C 3 G aliphatic alkyl, cycloaliphatic alkyl, aryl or aralkyl; polymeric compound; heterocyclic ring a compound, and a derivative thereof; wherein, 1 and R2 or R4 and R5 may be bonded to each other to form an alkylene ring having or without a hetero atom; and the strip 74 ^^6297 is not all Β · ι to I are all hydrogen. 2. The conductive ink composition according to claim 4, wherein the metal complex compound is represented by the chemical formula 5: m (5) A is a red-human-represented compound represented by Chemical Formula 4 in Chemical Formula 2 And 0.7SmS5.5. As for the conductive ink of the request item 1 household, and the makeup is good, and. And the metal or metal compound represented by the chemical formula 1 is selected from at least one of the group consisting of silver, gold, steel, rhodium, nickel, cobalt, palladium, platinum, titanium, vanadium, manganese, iron, chromium , zirconium, hafnium, molybdenum, tungsten, nail, cadmium, button, bismuth, hungry, antimony, aluminum 'gallium, indium, tin, antimony, lead, antimony, bismuth, antimony, bismuth, antimony, copper oxide, zinc oxide, Vanadium oxide, nickel sulfide, palladium chloride 'copper carbonate, ferric chloride, gasification gold, vaporized nickel, cobalt vapor, barium nitrate, vanadyl acetone, cobalt acetate, tin lactate, manganese oxalate, gold acetate, oxalic acid Palladium, copper 2-ethylhexanoate, iron stearate, nickel formate, molybdate, zinc citrate, acetic acid, copper cyanide, carbonic acid, gasified platinum, hydrogen tetrachloroaurate, Titanium tetrabutoxide, dimethoxy chloroformate, aluminum isopropoxide, tin tetrafluorophosphate, hydrazine, dodecylmercaptoaurate, and acetonitrile. 4. The conductive ink composition according to claim 1, wherein the metal or metal compound represented by Chemical Formula 1 is silver (Ag), a silver compound or a silver alloy; η is an integer of 1 to 4; Select from at least one of the following groups: oxygen, sulfur, halogen, cyano, cyanate, carbonate, nitrate, nitrite, sulfate, phosphate, thiocyanate, oleate, perchlorate, tetrafluoro Borate, acetophenone, root, carboxylate and derivatives thereof. 75 1326297 5. 如請求項4所述之導電性墨水組合物,其中該銀化合物係選 自以下群組之至少一者:氧化銀、硫氰酸銀、氰化銀、氰酸 銀、碳酸銀、硝酸銀、亞硝酸銀、硫酸銀、磷酸銀、過氣酸 銀、四氟硼酸銀、乙醯丙酮銀、醋酸銀、乳酸銀、草酸銀及 前述之衍生物;以及該銀合金係一含有至少一選自以下群組 之金屬成分的合金:金、銅、錄、钻、纪、始、鈦、鈒、锰、 鐵、銘、錯、銳、、鶴、釘、錫、组、鍊、餓、銥、铭、 錄、鍺、銦、錫、録、錯、叙、石夕、珅、汞、彭、銪、I土、 鎂、鈣、锶以及鋇。 6. 如請求項1所述之導電性墨水組合物,其中各個取代基尺丨、 R2、R3、R4、R5和R6係獨立選自以下群組:氫、甲基、乙基、 丙基、異丙基、丁基、異丁基、戊基、己基、乙基己基、庚 基、辛基、異辛基、壬基、癸基、十二基、、十六基、十八基、 二十二基、環丙基、環戊基、環己基、烯丙基、羥基、曱氧 基、甲氧基乙基、甲氧基丙基、氰乙基、乙氧基、丁氧基、 己氧基、曱氧基乙氧基乙基、甲氧基乙氧基乙氧基乙基、六 亞曱基亞胺、嗎啉、哌啶、哌嗪、乙二胺、丙二胺、己二胺、 三伸乙二胺、吡咯、咪唑、吡啶、羧甲基、三甲氧基矽丙基、 三乙氧基矽丙基、苯基、甲氧基苯基、氰苯基、苯氧基、甲 苯基' 苯曱基、聚烯丙胺以及聚乙烯胺(polyethyleneamine ); 其條件為非所有的R,至R3皆為氫。 7. 如請求項1所述之導電性墨水組合物,其中該以胺基曱酸銨 為基質之化合物係選自以下群組之至少一者:乙胺基曱酸乙 76 1326297 銨、異丙胺基甲酸異丙銨、正丁胺基甲酸正丁銨、異丁胺基 曱酸異丁銨、第三丁胺基甲酸第三丁銨、2·乙基己基胺基甲 酸2-乙基己基録、十八胺基曱酸十八錄、2-甲氧基乙基胺基 甲酸2-甲氧基乙基銨、2-氰乙基胺基甲酸2-氰乙基銨、二丁 胺基甲酸二丁銨、二-十八胺基甲酸二-十八銨 (dioctadecylammonium dioctadecylcarbamate )、甲基癸基胺 基甲酸曱基癸基銨、六亞曱基亞胺胺基甲酸六亞曱基亞銨、 嗎啉胺基曱酸嗎啉鑌、乙基己基胺基甲酸吡啶鑌、異丙基胺 基甲酸三伸乙二銨、苯甲基胺基甲酸苯甲基銨、及三乙氧基 矽丙基胺基曱酸三乙氧基矽丙基銨;以及該以碳酸銨為基質 之化合物係選自以下群組之至少一者:乙基碳酸乙基銨、異 丙基碳酸異丙基錢、正丁基碳酸正丁基敍、異丁基碳酸異丁 基銨、第三丁基碳酸第三丁基銨、2-乙基己基碳酸2-乙基己 基銨、2-甲氧基乙基碳酸2-甲氧基乙基銨、2-氰乙基碳酸2-氰乙基錄、十八基碳酸十八基錄、二丁基碳酸二丁基敍、二_ 十八基碳酸二-十八基敍 (dioctadecylammonium dioctadecylcarbonate)、曱基癸基碳酸甲基癸基銨、六亞甲基 亞胺碳酸六亞曱基亞銨銨、嗎啉碳酸嗎啉鑌、苯甲基碳酸苯 甲基銨、三乙氧基矽丙基碳酸三乙氧基矽丙基銨、異丙基碳 酸三伸乙二銨、碳酸氫異丙基銨、碳酸氫第三丁基銨、碳酸 氫2-乙基己基銨、碳酸氫2-曱氧基乙基銨、碳酸氫2-氰乙基 錄、碳酸氫二-十八基敍(dioctadecylammonium bicarbonate)、 碳酸氫吡啶鏽、碳酸氫三伸乙二銨及前述之衍生物。 77 13262975. The conductive ink composition of claim 4, wherein the silver compound is selected from at least one of the group consisting of silver oxide, silver thiocyanate, silver cyanide, silver cyanate, silver carbonate, silver nitrate , silver nitrite, silver sulfate, silver phosphate, silver peroxyacid, silver borofluoride, silver acetonitrile, silver acetate, silver lactic acid, silver oxalate and the foregoing derivatives; and the silver alloy system contains at least one selected Alloys from the following group of metals: gold, copper, mud, diamond, Ji, Shi, Titanium, Niobium, Manganese, Iron, Ming, Wrong, Sharp, Crane, Nail, Tin, Group, Chain, Hungry, 铱, Ming, recorded, 锗, indium, tin, recorded, wrong, Syrian, Shixi, 珅, mercury, Peng, 铕, I soil, magnesium, calcium, strontium and strontium. 6. The conductive ink composition according to claim 1, wherein each of the substituents 丨, R2, R3, R4, R5 and R6 are independently selected from the group consisting of hydrogen, methyl, ethyl, propyl, Isopropyl, butyl, isobutyl, pentyl, hexyl, ethylhexyl, heptyl, octyl, isooctyl, decyl, decyl, dodecyl, hexadecyl, octadecyl, di Dodecyl, cyclopropyl, cyclopentyl, cyclohexyl, allyl, hydroxy, decyloxy, methoxyethyl, methoxypropyl, cyanoethyl, ethoxy, butoxy, hexyl Oxyl, decyloxyethoxyethyl, methoxyethoxyethoxyethyl, hexamethyleneimine, morpholine, piperidine, piperazine, ethylenediamine, propylenediamine, hexane Amine, triethylenediamine, pyrrole, imidazole, pyridine, carboxymethyl, trimethoxysulfonylpropyl, triethoxyphosphonium propyl, phenyl, methoxyphenyl, cyanophenyl, phenoxy, Tolyl' phenyl fluorenyl, polyallylamine, and polyethyleneamine; the conditions are not all of R, and R3 is hydrogen. 7. The conductive ink composition according to claim 1, wherein the compound based on ammonium ammonium citrate is selected from at least one of the group consisting of ethylamine sulfonate 76 1326297 ammonium, isopropylamine Isopropylammonium formate, n-butylammonium n-butylammonate, isobutylammonium isobutylamine decanoate, tert-butylammonium tributylammoniumcarboxylate, 2-ethylhexylamine 2-ethylhexylaminocarbamate , octadecyl decanoic acid 18-record, 2-methoxyethyl carbamic acid 2-methoxyethyl ammonium, 2-cyanoethyl carbamic acid 2-cyanoethyl ammonium, dibutylamino carboxylic acid Dibutyladecylammonium dioctadecylcarbamate, methyl mercaptocarbamic acid decyl decyl ammonium, hexamethylene sulfoxide hexamethylene sulfoxide Morpholinamide morpholinium decanoate, pyridinium ethylhexylaminocarbamate, triamethylene methionine isopropylaminocarbamate, benzyl ammonium benzyl carbazate, and triethoxy propyl propyl Amino ruthenium decyl ammonium amide; and the ammonium carbonate-based compound is selected from at least one of the group consisting of ethyl ammonium ethyl carbonate and different Isopropyl propyl carbonate, n-butyl butyl butyl carbonate, isobutyl ammonium isobutyl hydride, tert-butyl ammonium tert-butyl carbonate, 2-ethylhexylammonium 2-ethylhexyl carbonate, 2-methoxyethylammonium 2-methoxyethylammonium, 2-cyanoethyl carbonate 2-cyanoethyl carbonate, octadecyl carbonate 18-base, dibutyl carbonate dibutyl, two Dioctadecylammonium dioctadecylcarbonate, methyl decyl ammonium decyl sulfonate, hexamethylene imide ammonium hexamethylene imide, morpholinium carbonate morpholine, benzene Benzoyl ammonium carbonate, triethoxy propyl propyl triethoxy propyl propyl ammonium, isopropyl ethylene diamethylene diammonium, hydrogen isopropyl ammonium carbonate, hydrogen carbonate third butyl ammonium, carbonic acid 2-ethylhexylammonium hydrogenate, 2-methoxyethylammonium hydrogencarbonate, 2-cyanoethyl carbonate hydrogencarbonate, dioctadecylammonium bicarbonate, hydrogencarbonate pyridine, hydrogencarbonate Ethylene diammonium and the aforementioned derivatives. 77 1326297 8. 如請求項1所述之導電性墨水組合物,其中該添加劑係選自 以下群組之至少一者:導體、金屬前驅物、氧化劑、穩定劑、 溶劑、分散劑、黏著劑樹脂、還原劑、界面活性劑、潤濕劑、 觸變劑(thixotropic agent)以及流平劑。8. The conductive ink composition according to claim 1, wherein the additive is selected from at least one of the group consisting of a conductor, a metal precursor, an oxidizing agent, a stabilizer, a solvent, a dispersing agent, an adhesive resin, and a reduction. Agents, surfactants, wetting agents, thixotropic agents, and leveling agents. 9. 如請求項8所述之導電性墨水組合物,其中該導體係選自由 至少一選自以下群組之金屬所組成之群組的至少一者:銀、 金、銅、鋅、錄、钻、纪、轴、鈦、飢、猛、鐵、鉻、錯、 銳、錮、鎢、釕、編、组、鍊、鐵、錶、銘、鎵、鍺、銦、 錫、録、錯、叙、彭、銪、奶及钍、前述之合金或合金氧化 物、導電性碳黑、石墨、奈米碳管以及導電性聚合物。 10. 如請求項8所述之導電性墨水組合物,其中該金屬前驅物係 至少一由以下化學式1所代表之金屬化合物: ΜηΧ (1) Μ係至少一選自以下群組之金屬:銀、金、銅、鋅、鎳、鈷、 纪、翻、欽、叙、猛、鐵、絡、錯、銳、錮、鎢、釕、錢、 组、鍊、鐵、銀、铭、嫁、錯、銦、錫、録、錯、祕、彭、 銪、婀及钍或前述之合金;η為1至10之整數;且X係至少 一選自以下群組之取代基:氫、銨、氧、硫、鹵素、氰基、 氰酸根、碳酸根、硝酸根、亞硝酸根、硫酸根、磷酸根、硫 氰酸根、氣酸根、過氯酸根、四氟硼酸根、乙醯丙酮根、巯 基、醯胺、醇鹽、羧酸根及其衍生物。 11.如請求項10所述之導電性墨水組合物,其中該金屬前驅物係 選自以下群組之至少一者:醋酸金、醋酸銀、草酸鈀、2-乙 78 1326297 基已酸銀、2-乙基已酸銅、硬脂酸鐵、甲酸鎳、檸檬酸鋅、 确酸銀、氰化銅、碳酸鈷、氣化鉑、四氣金酸、四丁氧基鈦、 二氯化二甲氧基鍅、異丙醇鋁、四氟硼酸錫、氧化釩、氧化 銦錫、甲醇鈕、醋酸鉍、十二基毓基金酸鹽以及乙醯丙酮銦。 12_如請求項8所述之導電性墨水組合物,其中每1〇〇重量%之該 墨水組合物係含有1重量%至90重量%之該導體、該金屬前 驅物或其混合物。 13. 如清求項8所述之導電性墨水組合物,其中該導艘或該金屬 前驅物為選自以下群組之形式:顆粒、粉末、薄片、膠狀、 混成物(hybrid)、糊狀、溶膠、溶液及其組合。 14. 如請求項8所述之導電性墨水組合物,其中該導艏或該金屬 前驅物為一球面、直線或平面或其組合。 15. 如明求項8所述之導電性.墨水組合物,其中該氧化劑係選自 以下群組之至少一者:氧化性氣體、過氧化物、過氧酸、氧 化性無機酸、氧化性金屬化合物以及氧化非金屬化合物。 16. 如請求項15所述之導電性墨水組合物,其中該氧化劑係選自 以下群組之至少一者:空氣、氧、臭氧、過氧化氫(h2〇2)、 Na202、k〇2、NaB〇3、K2S208、(NH4)2S2〇8、Na2S208、H2S05、 khso5、(ch3)3co2h、(c6h5co2)2 ' HC03H、CH3C03H、 CF3C〇3H、C6H5C03H、m-ClC6H5C03H、硝酸、硫酸、I2、FeCl3、 Fe(N〇3)3 . Fe2(S04)3 ' K3Fe(CN)6 . (NH4)2Fe(S04)2 ' Ce(NH4)4(s〇4)4、NaI04、KMn04 以及 K2Cr〇4。 17·如請求項8所述之導電性墨水組合物,其中該穩定劑係選自 79 1326297 以下群組之至少一者:胺化合物、銨化合物、磷化合物、硫 化合物及其混合物。 18. 如請求項17所述之導電性墨水組合物,其中該胺化合物係選 自以下群組之至少一者:一級胺、二級胺以及三級胺。9. The conductive ink composition of claim 8, wherein the conductive system is selected from at least one of the group consisting of at least one metal selected from the group consisting of silver, gold, copper, zinc, recorded, Drill, Ji, Shaft, Titanium, Hunger, Meng, Iron, Chromium, Wrong, Sharp, Tantalum, Tungsten, Tantalum, Braid, Group, Chain, Iron, Watch, Ming, Gallium, Germanium, Indium, Tin, Record, Wrong, Syrian, Peng, 铕, milk and 钍, the aforementioned alloy or alloy oxide, conductive carbon black, graphite, carbon nanotubes and conductive polymers. 10. The conductive ink composition according to claim 8, wherein the metal precursor is at least one metal compound represented by the following Chemical Formula 1: ΜηΧ (1) Μ is at least one metal selected from the group consisting of silver , gold, copper, zinc, nickel, cobalt, Ji, turn, Qin, Syria, Meng, iron, collateral, wrong, sharp, 锢, tungsten, 钌, money, group, chain, iron, silver, Ming, marry, wrong , indium, tin, ruthenium, smect, smear, smear, samarium, ytterbium and ytterbium or alloys of the foregoing; η is an integer from 1 to 10; and X is at least one substituent selected from the group consisting of hydrogen, ammonium, oxygen , sulfur, halogen, cyano, cyanate, carbonate, nitrate, nitrite, sulfate, phosphate, thiocyanate, oleate, perchlorate, tetrafluoroborate, acetoacetate, sulfhydryl, Indoleamines, alkoxides, carboxylates and derivatives thereof. The conductive ink composition according to claim 10, wherein the metal precursor is selected from at least one of the group consisting of gold acetate, silver acetate, palladium oxalate, 2-ethyl 78 1326297-based silver citrate, Copper 2-ethylhexanoate, iron stearate, nickel formate, zinc citrate, silver acetate, copper cyanide, cobalt carbonate, platinum gasification, tetra-gas gold acid, titanium tetrabutoxide, dichloride Methoxyquinone, aluminum isopropoxide, tin tetrafluoroborate, vanadium oxide, indium tin oxide, methanol button, barium acetate, dodecylphosphonate, and indium acetonate. The conductive ink composition according to claim 8, wherein the ink composition contains 1% by weight to 90% by weight of the conductor, the metal precursor or a mixture thereof per 1% by weight of the ink composition. 13. The conductive ink composition according to claim 8, wherein the guide vessel or the metal precursor is in a form selected from the group consisting of granules, powders, flakes, gels, hybrids, pastes. Form, sol, solution and combinations thereof. 14. The conductive ink composition of claim 8, wherein the guide or the metal precursor is a sphere, a straight line or a plane or a combination thereof. 15. The electroconductive ink composition according to claim 8, wherein the oxidizing agent is selected from at least one of the group consisting of an oxidizing gas, a peroxide, a peroxyacid, an oxidizing inorganic acid, and an oxidizing property. Metal compounds and oxidized non-metal compounds. 16. The conductive ink composition of claim 15, wherein the oxidizing agent is selected from at least one of the group consisting of: air, oxygen, ozone, hydrogen peroxide (h2〇2), Na202, k〇2 NaB〇3, K2S208, (NH4)2S2〇8, Na2S208, H2S05, khso5, (ch3)3co2h, (c6h5co2)2 'HC03H, CH3C03H, CF3C〇3H, C6H5C03H, m-ClC6H5C03H, nitric acid, sulfuric acid, I2, FeCl3 Fe(N〇3)3. Fe2(S04)3' K3Fe(CN)6. (NH4)2Fe(S04)2' Ce(NH4)4(s〇4)4, NaI04, KMn04 and K2Cr〇4. The conductive ink composition of claim 8, wherein the stabilizer is selected from at least one of the group consisting of: an amine compound, an ammonium compound, a phosphorus compound, a sulfur compound, and a mixture thereof. 18. The conductive ink composition of claim 17, wherein the amine compound is selected from at least one of the group consisting of a primary amine, a secondary amine, and a tertiary amine. 19. 如請求項18所述之導電性墨水組合物,其中該胺化合物係選 自以下群組之至少一者:甲胺、乙胺、正丙胺、異丙胺、正 丁胺、異丁銨、異戊胺、正己胺、2-乙己胺、正庚胺、正辛 胺、異辛胺、壬胺、癸胺、十二胺、十六胺、十八胺、二十 二胺、環丙胺、環戊胺、環己胺、烯丙胺、羥基胺、氫氧化 銨、甲氧胺、2-乙醇胺、甲氧基乙胺、2-羥基丙胺、甲氧基丙 胺、氰基乙胺、乙氧胺、正丁氧胺、2-己氧胺、甲氧基乙氧 基乙胺、曱氧基乙氧基乙氧基乙胺、二乙胺、二丙胺、二乙 醇胺、六亞甲基亞胺、嗎琳、11 底咬、派唤、乙二胺、丙二胺、 己二胺、三伸乙二胺、2,2-(乙二氧基)二乙胺、三乙胺、三 乙醇胺、吡咯、咪唑、吡啶、胺基乙醛縮二甲醇 (aminoacetaldehyde dimethyl acetal )、3-胺基丙基三甲氧基 矽烷、3-胺基丙基三乙氧基矽烷、苯胺、甲氧苯胺、胺基苯 甲腈、苯曱胺、聚烯丙胺、聚乙亞胺及前述之衍生物。 20. 如請求項17所述之導電性墨水組合物,其中該磷化合物係選 自以下群組之至少一者:膦及亞磷酸鹽。 21. 如請求項8所述之導電性墨水組合物,其中該黏著劑樹脂係 選自以下群組之至少一者:丙烯酸樹脂、纖維素樹脂、聚酯 樹脂、聚醯胺樹脂、聚醚樹脂、乙烯樹脂、聚胺酯樹脂、脲 80 1326297 樹脂、醇酸樹脂(alkyd resin)、聚矽氧樹脂、氟化樹脂、烯 烴樹酯、石油樹脂、松香樹脂、環氧樹脂、不飽和聚酯樹脂、 乙烯基聚酯樹脂、二烯丙基酞酸酯樹脂(diallylphthalate resin )、酚樹脂、氧丁環樹脂(oxetane resin )、噁嗪樹脂(oxazine resin)、雙馬來亞醯胺樹脂(bismaleimide resin)、經改質之 聚矽氧樹脂、三聚氰胺樹脂、丙烯酸樹脂、橡膠、天然聚合 物、破璃樹脂以及玻璃質(glass frit)。19. The conductive ink composition of claim 18, wherein the amine compound is selected from at least one of the group consisting of methylamine, ethylamine, n-propylamine, isopropylamine, n-butylamine, isobutylammonium, Isopentanamine, n-hexylamine, 2-ethylhexylamine, n-heptylamine, n-octylamine, isooctylamine, decylamine, decylamine, dodecylamine, hexadecylamine, octadecylamine, dodecaamine, cyclopropylamine, Cyclopentylamine, cyclohexylamine, allylamine, hydroxylamine, ammonium hydroxide, methoxyamine, 2-ethanolamine, methoxyethylamine, 2-hydroxypropylamine, methoxypropylamine, cyanoethylamine, ethoxyamine , n-butoxyamine, 2-hexyloxyamine, methoxyethoxyethylamine, decyloxyethoxyethoxyethylamine, diethylamine, dipropylamine, diethanolamine, hexamethyleneimine, 】, 底琳, 派, ethylenediamine, propylenediamine, hexamethylenediamine, triethylenediamine, 2,2-(ethylenedioxy)diethylamine, triethylamine, triethanolamine, pyrrole , imidazole, pyridine, aminoacetaldehyde dimethyl acetal, 3-aminopropyltrimethoxydecane, 3-aminopropyltriethoxydecane, aniline, methoxyaniline, amine Carbonitrile benzene, benzene Yue, polyallylamine, polyethyleneimine, and derivatives of the foregoing. 20. The conductive ink composition of claim 17, wherein the phosphorus compound is selected from at least one of the group consisting of phosphines and phosphites. The conductive ink composition according to claim 8, wherein the adhesive resin is selected from at least one of the group consisting of acrylic resin, cellulose resin, polyester resin, polyamide resin, and polyether resin. , vinyl resin, polyurethane resin, urea 80 1326297 resin, alkyd resin, polyoxyn resin, fluorinated resin, olefin resin, petroleum resin, rosin resin, epoxy resin, unsaturated polyester resin, ethylene Base polyester resin, diallylphthalate resin, phenol resin, oxetane resin, oxazine resin, bismaleimide resin, Modified polyoxynized resin, melamine resin, acrylic resin, rubber, natural polymer, glass resin and glass frit. 22.如請求項8所述之導電性墨水組合物,其中該還原劑係選自 以下群組之至少一者:還原性胺化合物、金屬鹽以及有機化 合物。 23. 如請求項22所述之導電性墨水組合物’其中該還原性胺化合 物係選自以下群組之至少一者:聯胺、醋酸醯肼(acetic hydrazide)、硼氫化鈉或硼氫化鉀、擰檬酸三鈉、甲基二乙 醇胺以及二甲基胺硼烷;以及該有機化合物係選自以下群組 之至少一者:氫、碘化氫、一氧化碳、甲醛、乙醛、葡萄糖、 抗壞血酸、水楊酸、單寧酸、鄰苯三酚(pyrogallol)以及對 馨 .本一齡 ( hydroquinone )。 24. 如請求項8所述之導電性墨水組合物,其中該溶劑係選自以 下群組之至少一者:水、醇類、乙二醇類、醋酸酯類、醚類、 酿1類、芳族溶劑以及齒化烴類。 25. 如請求項24所述之導電性墨水組合物,其中該溶劑係選自以 下群叙<至少一者:水、甲醇、乙醇、異丙醇、1-甲氧基丙 醇、丁醇、乙基己醇、松油醇、乙二醇、甘油、醋酸乙酯、 81 V / 1326297 ,The conductive ink composition according to claim 8, wherein the reducing agent is at least one selected from the group consisting of a reducing amine compound, a metal salt, and an organic compound. 23. The conductive ink composition of claim 22, wherein the reducing amine compound is selected from at least one of the group consisting of hydrazine, acetate hydrazide, sodium borohydride or potassium borohydride , trisodium citrate, methyl diethanolamine, and dimethylamine borane; and the organic compound is selected from at least one of the group consisting of hydrogen, hydrogen iodide, carbon monoxide, formaldehyde, acetaldehyde, glucose, ascorbic acid , salicylic acid, tannic acid, pyrogallol and chlorinated. 24. The conductive ink composition according to claim 8, wherein the solvent is selected from at least one of the group consisting of water, alcohols, glycols, acetates, ethers, and brews, Aromatic solvents and toothed hydrocarbons. 25. The conductive ink composition of claim 24, wherein the solvent is selected from the group consisting of: at least one of: water, methanol, ethanol, isopropanol, 1-methoxypropanol, butanol , ethylhexanol, terpineol, ethylene glycol, glycerol, ethyl acetate, 81 V / 1326297, 醋酸丁酯、醋酸甲氧基丙酯、二乙二醇乙醚醋酸酯(carbit〇l acetate)、乙基二乙二醇乙醚醋酸酯(ethylcarbitol acetate)、 甲基溶纖維劑(methylcellosolve ) 、丁基溶纖維劍 (butylcellosolve )、二乙醚、四氳吱0南、二氧雜環己境 (dioxane)、甲基乙基酮、丙酮、二甲基甲酿胺、1-甲基-2-Butyl acetate, methoxypropyl acetate, carbit〇l acetate, ethylcarbitol acetate, methylcellosolve, butyl soluble fiber Sword (butylcellosolve), diethyl ether, tetrahydrofuran, dioxane, methyl ethyl ketone, acetone, dimethylamylamine, 1-methyl-2- 0比洛燒鋼、己燒、庚烧、十二烧、石堪油、礦油精(mineral spirit )、苯、甲苯、二甲苯、三氣甲烷、二氣甲烷、四氣化 碳、乙腈以及二甲基亞砜。 26. 如請求項1所述之導電性墨水組合物,其係藉由至少一選自 以下群組之方法而製得:加熱、冷卻、電解、超音波、微波 處理、高頻率處理、電漿處理、IR處理以及UV處理。0 洛洛烧钢, 烧烧, 庚烧,十二烧, 石堪油, mineral spirit, benzene, toluene, xylene, tri-gas methane, di-halogen methane, tetra-carbonized carbon, acetonitrile and Dimethyl sulfoxide. 26. The conductive ink composition according to claim 1, which is obtained by at least one selected from the group consisting of heating, cooling, electrolysis, ultrasonic, microwave treatment, high frequency treatment, plasma Processing, IR processing, and UV processing. 27. 如請求項1至26中任一項所述之導電性墨水組合物,其係籍 由於製備至少一由化學式2、化學式3或化學式4所代表之化 合物期間,添加至少一選自以下群組之成分與二氧化碳至〜 胺化合物而製得.一氧化氮、二氧化硫、二氧化碳、蝴酸( acid)以及硼酸(boron acid)。 28. 一種製備含金屬之膜之方法,包含以下步驟:塗覆如請求項夏 至27中任一頊所述之導電性墨水組合物,並對其進行氧化、 還原、熱處理、111處理、UV處理 '電子束處理或雷射處理。 29. 如请求項28所述之製備含金屬之膜之方法,其中該骐係萨由 塗覆於〜基讨上而形成。 3〇.如請求項29所述之製備含金屬之膜之方法,其中該基材係選 自以下鮮組之裘少—者:金屬、玻璃、矽晶圓、陶瓷、聚酯、 82 1326297 聚醯亞胺、橡膠片、纖維、木頭以及紙。 31. 如請求項29所述之製備含金屬之膜之方法,其中係於使用之 前對該基材進行前處理。 32. 如請求項31所述之製備含金屬之膜之方法,其中係藉由至少 一選自以下群組之方法來進行該前處理:電漿處理、離子束 處理、電暈處理、氧化或還原、加熱、蝕刻、UV處理以及底 漆處理。27. The conductive ink composition according to any one of claims 1 to 26, wherein at least one selected from the group consisting of the following is prepared by preparing at least one compound represented by Chemical Formula 2, Chemical Formula 3 or Chemical Formula 4 The components are prepared by combining carbon dioxide with an amine compound. Nitric oxide, sulfur dioxide, carbon dioxide, acid, and boron acid. 28. A method of preparing a metal-containing film, comprising the steps of: coating a conductive ink composition according to any one of claims 27 to 27, and subjecting it to oxidation, reduction, heat treatment, 111 treatment, UV treatment 'Electron beam processing or laser processing. 29. A method of preparing a metal-containing film according to claim 28, wherein the oxime is formed by coating on a ruthenium. 3. The method of preparing a metal-containing film according to claim 29, wherein the substrate is selected from the group consisting of: metal, glass, germanium wafer, ceramic, polyester, 82 1326297. Imine, rubber sheet, fiber, wood and paper. 31. A method of making a metal-containing film according to claim 29, wherein the substrate is pretreated prior to use. 32. The method of preparing a metal-containing film according to claim 31, wherein the pretreatment is performed by at least one selected from the group consisting of: plasma treatment, ion beam treatment, corona treatment, oxidation, or Reduction, heating, etching, UV treatment, and primer treatment. 33. 如請求項28或32所述之製備含金屬之膜之方法,其中該熱 處理係於空氣、氮、氬、一氧化碳、氫或其混合氣體下進行。 34. 如請求項28所述之製備含金屬之膜之方法,其中該熱處理係 於80°C至300°C之溫度範圍下進行。 35. 如請求項28所述之製備含金屬之膜之方法,其中該熱處理係 於80°C至150°C下處理1分鐘至30分鐘,接著於150°C至 300°C下處理1分鐘至30分鐘而進行。33. A method of preparing a metal-containing film according to claim 28 or 32, wherein the heat treatment is carried out under air, nitrogen, argon, carbon monoxide, hydrogen or a mixture thereof. The method of producing a metal-containing film according to claim 28, wherein the heat treatment is carried out at a temperature ranging from 80 °C to 300 °C. 35. The method of preparing a metal-containing film according to claim 28, wherein the heat treatment is performed at 80 ° C to 150 ° C for 1 minute to 30 minutes, followed by treatment at 150 ° C to 300 ° C for 1 minute. It takes 30 minutes to proceed. 36. 如請求項28所述之製備含金屬之膜之方法,其中係藉由旋轉 塗覆、滾筒塗覆、喷灑塗覆、浸潰塗覆、淋流塗覆或刮刀塗 覆來進行該塗覆。 37. 如請求項28所述之製備含金屬之膜之方法,其中係藉由點膠 (dispensing )、喷墨印刷、平版印刷、網版印刷、移轉印刷、 柔版印刷、膠版印刷、刻板印刷、印模法、靜電印刷或微影 印刷來進行該塗覆。 38. 如請求項28所述之製備含金屬之膜之方法,其中係藉由將該 導電性墨水組合物溶於至少一選自以下群組之溶劑中來進行 83 1326297 39. t 該塗覆:水、醇類、乙二醇類、醋酸酯類、醚類、鲷類、脂 肪族烴類、芳族烴類以及鹵化烴類。 如請求項38所述之製備含金屬之膜之方法,其中該溶劑係選 自以下群組之至少一者:水、甲醇、乙醇、異丙醇、丨·曱氧 基丙醇、丁醇、乙基己醇、松油醇、乙二醇、甘油、醋酸乙 酯、醋酸丁酯、醋酸甲氧基丙酯、二乙二醇乙醚醋酸酯、乙 基二乙二醇乙醚醋酸酯、甲基溶纖維劑、丁基溶纖維劑、二 乙醚、四氫呋喃、二氧雜環己烷、甲基乙基酮、丙酮、二甲 基曱醯胺、1_甲基-2-吡咯烷酮、己烷、庚烷、十二烷、石蠟 油、礦油精、苯、甲苯、二甲苯、三氣甲烷、二氯甲烷、四 氣化碳、乙腈以及二甲基亞砜。 8436. The method of preparing a metal-containing film according to claim 28, wherein the method is performed by spin coating, roller coating, spray coating, dip coating, leaching coating or doctor blade coating. Coating. 37. A method of preparing a metal-containing film according to claim 28, wherein by dispensing, ink jet printing, lithography, screen printing, transfer printing, flexographic printing, offset printing, stereotyping This coating is carried out by printing, stamping, xerographic or lithographic printing. 38. The method of preparing a metal-containing film according to claim 28, wherein the coating is performed by dissolving the conductive ink composition in at least one solvent selected from the group consisting of 83 1326297 39. : water, alcohols, glycols, acetates, ethers, anthraquinones, aliphatic hydrocarbons, aromatic hydrocarbons, and halogenated hydrocarbons. The method of preparing a metal-containing film according to claim 38, wherein the solvent is selected from at least one of the group consisting of water, methanol, ethanol, isopropanol, decyloxypropanol, butanol, Ethylhexanol, terpineol, ethylene glycol, glycerin, ethyl acetate, butyl acetate, methoxypropyl acetate, diethylene glycol diethyl ether acetate, ethyl diethylene glycol diethyl ether acetate, methyl Solvent, butyl cellosolve, diethyl ether, tetrahydrofuran, dioxane, methyl ethyl ketone, acetone, dimethyl decylamine, 1-methyl-2-pyrrolidone, hexane, heptane, Dodecane, paraffin oil, mineral spirits, benzene, toluene, xylene, tri-gas methane, dichloromethane, tetra-carbonized carbon, acetonitrile and dimethyl sulfoxide. 84
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