KR20210031661A - Isolated active EMI filter module and manufacturing method thereof - Google Patents

Abstract

The present invention relates to an independent active EMI filter module capable of reducing the volume of each element constituting the EMI filter module, implementing single modularization of a compact structure, and improving EMI noise reduction performance, and a manufacturing method thereof. The independent active EMI filter module comprises: a substrate; first and second through lines; a first group of elements; a second group of elements; an encapsulation structure; a connection unit; a linkage; a pin group; and a first pin group.

Description

Independent active EMI filter module and manufacturing method thereof [Isolated active EMI filter module and manufacturing method thereof]

Embodiments relate to an independent active EMI filter module and a method of manufacturing the same.

In general, electrical devices such as home appliances, industrial electrical appliances, and electric vehicles emit noise during operation. For example, noise may be generated due to the switching operation inside the electric device. Such noise is not only harmful to the human body, but also causes malfunction or failure of other connected electronic devices.

Electromagnetic interference from an electronic device to other devices is referred to as EMI (Electromagnetic Interference), and among them, noise transmitted through wires and board wiring is referred to as Conducted Emission (CE) noise.

In order to ensure that electronic devices operate without causing breakdowns in peripheral components and other devices, the amount of EMI noise emission from all electronic products is strictly regulated. Therefore, most electronic products essentially include an electromagnetic wave noise reduction device such as an EMI filter that reduces EMI noise in order to satisfy the regulation on the amount of noise emission.

For example, in white home appliances such as air conditioners, electric vehicles, aviation, energy storage systems (ESS), etc., a current compensation device is essentially included. A conventional current compensation device uses a common mode choke (CM choke) to reduce common mode (CM) noise among conductive emission (CE) noise.

However, the common mode (CM) choke has a problem in that the noise reduction performance rapidly deteriorates due to self-saturation in a high power/high current system.In order to maintain the noise reduction performance, the size or number of common mode chokes may be increased. In this case, there is a problem that the size and price of the EMI filter are greatly increased.

In addition, since the conventional EMI filter has a structure in which the overall volume is large and the elements are exposed to the external environment as it is, when used in a system placed in the external environment, the elements can be easily deteriorated from external shocks or environmental influences. It can also have a great influence on the characteristics of.

An embodiment of the present invention is to solve the above problems and/or limitations, and an object thereof is to provide an independent active EMI filter module capable of reducing the volume and being independent from an external environment, and a method of manufacturing the same. However, these problems are exemplary, and the scope of the present invention is not limited thereby.

In order to achieve the above object, an embodiment is provided on a substrate including a first surface and a second surface facing each other, and installed on at least one surface of the first surface or the second surface, and detects electromagnetic noise. A first device group provided so as to be provided, a second device group installed on at least one of the first or second surfaces and provided to generate a compensation signal for the electromagnetic wave noise, the substrate, and the first device group And an encapsulation structure provided to separate the second device group from the outside, and provided to connect to the first and second surfaces, and provided so as not to interfere with at least one of the first device group or the second device group. Independent active EMI including a connector, a connector positioned at the connector, connected to the encapsulation structure, and a pin group exposed to the outside of the encapsulation structure and electrically connected to at least a portion of the first device group or the second device group A filter module can be provided.

The connector may be combined with at least a portion of the encapsulation structure.

The encapsulation structure includes a space part located therein and an opening connected to the space part, a support provided to receive at least one of the substrate, a first device group, and a second device group in the space part, and the space It may include a filling portion provided to fill at least a portion of the portion.

The filling portion may include a first filling portion facing the first surface and a second filling portion facing the second surface, and the connector may be provided to connect the first filling portion and the second filling portion. have.

According to another embodiment, a first element group is installed to detect electromagnetic noise on at least one of the first or second surfaces of a substrate including a first surface and a second surface facing each other. And installing a second element group provided to generate a compensation signal for the electromagnetic wave noise on at least one of the first and second surfaces, and connecting the first and second surfaces Forming a connection part provided to prevent interference with at least one of the first device group or the second device group, and separating the substrate, the first device group, and the second device group from the outside, and Forming an encapsulation structure provided so that a pin group electrically connected to at least a portion of the first device group or the second device group is exposed to the outside, and forming a connector located at the connection part and connected to the encapsulation structure It is possible to provide a method of manufacturing an independent active EMI filter module.

Forming the connector may include allowing the connector to be coupled to at least a portion of the encapsulation structure.

The forming of the encapsulation structure may include preparing a support including a space part located therein and an opening connected to the space part, and at least one of the substrate, a first device group, or a second device group in the space part. And forming a filling portion provided to fill at least a portion of the space portion.

The forming of the filling portion includes forming a first filling portion opposite to the first surface, and forming a second filling portion opposite to the second surface, and forming the connecting body , The connector may include connecting the first filling part and the second filling part.

According to the embodiments of the present invention as described above, it is possible to reduce the volume of each element constituting the EMI filter module, thereby implementing a single modularization of a compact structure, and improving the EMI noise reduction performance. .

In addition, it is possible to achieve an independent structure separated from the external environment by the encapsulation structure, thereby further improving the durability.

By implementing a single modularization, it can be easily assembled and disassembled even when installed in a system and/or other device, and can exhibit very excellent performance in maintenance.

It is possible to selectively add a heat dissipation function, it is possible to prevent the device characteristics from deteriorating and improve durability.

It is possible to reduce the cost by not using bulky CM chokes or reducing the number of them.

The encapsulation structure can be more firmly fixed, and the durability of the encapsulation structure can be improved.

1 is a block diagram of an independent active EMI filter module according to an embodiment.
2 is a schematic cross-sectional view of the independent active EMI filter module of FIG. 1 according to an embodiment.
3 is a diagram showing a more detailed configuration of an independent active EMI filter module according to an embodiment.
4 is a diagram showing a more detailed configuration of an independent active EMI filter module according to another embodiment.
5 is a diagram showing a more detailed configuration of an independent active EMI filter module according to another embodiment.
6 is a cross-sectional view of an independent active EMI filter module according to another embodiment.
7 is a cross-sectional view showing an embodiment of the connection part and the connector of FIG. 6.
8 is a cross-sectional view of an independent active EMI filter module according to another embodiment.
9A and 9B are bottom views illustrating different embodiments of arrangement states of a first pin group and a second pin group.
10 is a diagram showing a more detailed configuration of an independent active EMI filter module according to another embodiment.
11 is a bottom view illustrating an example of an arrangement state of a first pin group and a second pin group according to the embodiment shown in FIG. 10.
12 is a diagram showing a more detailed configuration of an independent active EMI filter module according to another embodiment.
13 is a bottom view illustrating an example of an arrangement state of a first pin group and a second pin group according to the embodiment shown in FIG. 12.
14 to 17 are diagrams illustrating a manufacturing process of an independent active EMI filter module according to embodiments.
18 is a diagram illustrating a part of a manufacturing process of an independent active EMI filter module according to another exemplary embodiment.

Since the present invention can apply various transformations and have various embodiments, specific embodiments are illustrated in the drawings and will be described in detail in the detailed description. Effects and features of the present invention, and a method of achieving them will become apparent with reference to the embodiments described below in detail together with the drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various forms.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, and when describing with reference to the drawings, the same or corresponding constituent elements are assigned the same reference numerals, and redundant descriptions thereof will be omitted. .

In the following examples, expressions in the singular include plural expressions unless the context clearly indicates otherwise.

In the following embodiments, terms such as include or have means that the features or elements described in the specification are present, and do not preclude the possibility of adding one or more other features or components in advance.

In the following embodiments, when a part such as a film, a region, or a component is on or on another part, not only the case directly above the other part, but also another film, region, component, etc. are interposed therebetween. Includes cases where there is.

When a certain embodiment can be implemented differently, a specific process order may be performed differently from the described order. For example, two processes described in succession may be performed substantially simultaneously, or may be performed in an order opposite to the described order.

In the drawings, components may be exaggerated or reduced in size for convenience of description. For example, the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of description, and thus the following embodiments are not necessarily limited to those shown.

1 is a block diagram of an EMI filter module according to an embodiment.

The independent active EMI filter module 1 according to an embodiment may include a substrate 10, a first element group 11, a second element group 12, and a pin group installed on the substrate 10. have.

The substrate 10 may be an insulating and/or conductive substrate having a conductive pattern formed on at least one surface thereof. According to an embodiment, the substrate 10 may be a printed circuit board provided in a flat plate shape. The substrate 10 may be a rigid or flexible printed circuit board.

A first through line 21 and a second through line 22 pass through the substrate 10. The first through line 21 and the second through line 22 may be electrically connected to a power line, and the first through line 21 is a live line (L) and a second through line 22 Silver may be electrically connected to a neutral line (N), respectively.

According to an embodiment, each of the first and second through lines 21 and 22 may be conductive patterns formed to electrically pass through the substrate 10 from one end to the other end. The conductive pattern is not necessarily limited to extending in a straight line, and may be extended in a complex path.

The first through line 21 and the second through line 22, which are power lines as described above, may be electrically connected to the pin group, and specifically, may be electrically connected to the first pin group 14. According to an embodiment, the first pin group 14 may include the 1-1th pins 141 to 1-4th pins 144.

The 1-1 pin 141 may be electrically connected to one end of the first through line 21, and the 1-2 pin 142 may be electrically connected to the other end of the first through line 21. .

The 1-3rd pin 143 may be electrically connected to one end of the second through line 22, and the 1-4 pin 144 may be electrically connected to the other end of the second through line 22. .

According to an embodiment, the 1-1 pin 141 and the 1-3 pin 143 may be electrically connected to the first device 2 located outside the independent active EMI filter module 1. .

The first device 2 may be various types of devices for supplying power to the independent active EMI filter module 1 in the form of current and/or voltage. For example, the first device 2 may be a device that produces and supplies power, or may be a device that supplies power generated by another device (eg, an electric vehicle charging device). Of course, the first device 2 may be a device that supplies stored energy. However, this is exemplary, and the spirit of the present invention is not limited thereto.

According to an embodiment, the 1-2 pins 142 and the pins 1-4 144 may be electrically connected to the second device 3 located outside the independent active EMI filter module 1.

The second device 3 may be various types of devices and/or loads using power supplied by the first device 2. The second device 3 may be a load driven using power supplied by the first device 2. The second device 3 may be a load (eg, at least one component of an electric vehicle) that stores energy using power supplied by the first device 2 and is driven using the stored energy. However, this is exemplary, and the spirit of the present invention is not limited thereto.

Each of the first through line 21 and the second through line 22 may be a path through which electromagnetic noise generated from the second device 3 is transmitted to the first device 2. In this case, the electromagnetic wave noise may be input to each of the first through line 21 and the second through line 22 in a common mode.

The first device group 11 may include at least one device electrically connected to the first through line 21 and the second through line 22. According to an embodiment, the first element group 11 may include elements provided to detect electromagnetic wave noise generated from the second device 3.

The second device group 12 may include at least one device electrically connected to the first device group 11, the first through line 21, and the second through line 22.

According to an embodiment, the second device group 12 may include an active circuit unit 121 and a compensation unit 122.

According to an embodiment, the active circuit unit 121 may serve as an amplifier, and may amplify a current corresponding to electromagnetic wave noise sensed through the first element group 11 at a predetermined ratio.

According to an embodiment, the active circuit unit 121 generates an amplified current having the same magnitude as the current corresponding to the electromagnetic wave noise and having the opposite phase, and the first through line 141 and the / Or the noise may be compensated by flowing through the second through line 142.

That is, the current amplified through the active circuit unit 121 flows to the compensation unit 122, and the compensation current flows from the compensation unit 122 to the first through line 141 and/or the second through line 142. do.

A more specific embodiment of configuring the active circuit unit 121 and the compensation unit 122 will be described later.

Meanwhile, the first device group 11 and/or the second device group 12 may be electrically connected to the third device 4.

The third device 4 may be electrically connected to a pin group protruding out of the substrate 10. Specifically, the third device 4 may be electrically connected to the first device group 11 and/or the second device group 12 through the second pin group 15.

According to an embodiment, such a third device 4 may include a device that provides power to the amplifying unit 121. For example, the third device 4 may include a device that generates input power of the amplifying unit 121, and the input power may include DC power.

The second pin group 15 may include pins that are not directly connected to the first through line 141 and/or the second through line 142 which are power lines. As described above, the third device ( 4) and electrically connected to, and/or may include pins used for grounding purposes. A specific example will be described later.

2 schematically shows a cross section according to an embodiment of the independent active EMI filter module 1 having the above configuration.

The independent active EMI filter module 1 according to the exemplary embodiment as illustrated in FIG. 2 may include a substrate 10 having a first surface 101 and a second surface 102 facing each other. The first and second surfaces 101 and 102 may include a conductive pattern, and at least some of the conductive patterns on the first and second surfaces 101 and 102 may be electrically connected to each other.

The third device group 103 may be installed on the first surface 101 of the substrate 10, and the fourth device group 104 may be installed on the opposite second surface 102. Each of the third device group 103 and the fourth device group 104 may include at least one device, and at least some of them may be electrically connected to each other.

According to an embodiment, at least some of the devices belonging to the third device group 103 may be bulkier than at least some of the devices belonging to the fourth device group 104. The third device group 103 may have a larger volume than the fourth device group 104 as a whole. Accordingly, it is possible to provide stability to the module design, and in particular, it is possible to further increase the insulation characteristics of the encapsulation structure 13 of the third device group 103 having a large volume.

According to an embodiment, the third device group 103 may include the first device group 11 and/or the compensation unit 122 shown in FIG. 1.

According to another embodiment, the fourth device group 104 may include the active circuit unit 121 shown in FIG. 1.

The first pin group 14 and the second pin group 15 described above may be installed to protrude in a direction perpendicular to one surface of the substrate 10. According to an embodiment, the first pin group 14 and the second pin group 15 It may be installed protruding on the two sides (102). The first pin group 14 and the second pin group 15 are preferably installed on the surface on which the fourth element group 104 having a relatively small volume is installed, and accordingly, the protruding length of each pin can be reduced. have.

According to an embodiment, at least one of the substrate 10, the third device group 103, or the fourth device group 104 may be separated from the outside by the encapsulation structure 13. The encapsulation structure 13 may include various insulating encapsulation structures capable of separating at least one of the substrate 10, the third device group 103, or the fourth device group from the outside, and may be formed of an insulating material. I can.

In FIG. 2, the encapsulation structure 13 is provided to encapsulate all of the substrate 10, the third device group 103, and the fourth device group 104, but the present invention is not limited thereto, and the third A structure for encapsulating the device group 103 and a part of the substrate 10 or the fourth device group 104 and a part of the substrate 10 may be included, respectively.

The first fin group 14 and the second fin group 15 may be formed to protrude so that their ends are respectively exposed to the outside of the encapsulation structure 13. As shown in FIG. 2, the first pin group 14 and the second pin group 15 may directly protrude, but are not limited thereto, and the first pin group 14 and the second pin group 15 It may be provided so that separate terminals electrically connected to each other are exposed.

According to an embodiment, the independent active EMI filter module may include a connection part 105 and a connection body 106.

*The connection part 105 is connected to the first surface 101 and the second surface 102 of the substrate 10, and according to an embodiment, the first surface 101 and the It may include a shape of a hole penetrating the second surface 102. The shape of the hole may have a circular plane or a polygonal plane, and may include a structure having a normal structure or a step difference in cross section.

The connection part 105 may be positioned so as not to interfere with at least one of the first device group 11 or the second device group 12, wherein the connection part 105 is formed in the form of a hole in the substrate 10 In the case of having a, the connection part 105 may be provided so as not to interfere with the third device group 103 and the fourth device group 104.

According to an embodiment, the connection part 105 may be located at a plurality of locations that do not interfere with the third device group 103 and the fourth device group 104.

The connector 106 is located on the connection part 105 and may be provided to be connected to the encapsulation structure 13.

The connector 106 may be provided as a filler capable of filling at least a part of the hole of the connector 105. The filler may be exposed to at least one of the first surface 101 or the second surface 102 to be connected to the encapsulation structure 13.

According to an embodiment, the connector 106 may be formed of the same material as some of the materials forming the encapsulation structure 13, and may be selectively formed integrally with the encapsulation structure 13.

The encapsulation structure 13 may communicate across the substrate 10 through the connection part 105. According to an embodiment, at least a part of the encapsulation structure 13 communicating the connection part 105 may form the connection body 106.

However, it is not necessarily limited thereto, and the connector 105 may be formed of a separate material, and thus may be connected to the sewing structure 13. Optionally, according to an embodiment, the connector 105 may include an adhesive material. Through this, it is bonded to the encapsulation structure 13 adjacent to the connector 105 to fix the encapsulation structure 13.

3 illustrates a more specific example of the first device group 11 and the second device group 12 according to an exemplary embodiment.

According to an embodiment, the first through line 21 and the second through line 22 may be designed to pass through the substrate 10.

Both ends of the first through line 21 are connected to the 1-1 pin 141 and the 1-2 pin 142. In addition, both ends of the second through line 22 are connected to the 1-3th pins 143 and the 1-4th pins 144.

According to an embodiment, the first element group 11 may include a sensing transformer capable of sensing noise.

The sensing transformer includes a first reference winding 111 and a second reference winding 112 connected to a first through line 21 and a second through line 22, which are power lines, respectively, and the first and second reference windings ( A sensing winding 110 formed on the same core as 111 and 112 may be included.

The first reference winding 111 and the second reference winding 112 may be a primary winding connected to a power line, and the sensing winding 110 may be a secondary winding.

The first reference winding 111 and the second reference winding 112 may each be in the form of a winding wound around a core, but are not necessarily limited thereto, and the first reference winding 111 or the second reference winding At least one of 112 may have a structure passing through the core.

The sensing winding 110 may have a structure wound around a core in which the first and second reference windings 111 and 112 are wound and/or passed through at least one or more times.

The sensing winding 110 is electrically insulated from the primary winding, which is a power line, a noise current generated from the second device 3 is sensed, and a current converted from the noise current at a predetermined ratio may be induced.

The primary winding and the secondary winding may be wound in consideration of the direction in which the magnetic flux and/or the magnetic flux density are generated.

For example, as a first current, which is noise, is input to the first reference winding 111, a first magnetic flux density may be induced in the core. Similarly, as the first current is input to the second reference winding 112, a second magnetic flux density may be induced in the core.

A first induced current may be induced in the sensing winding 110 that is the second secondary side by the induced first and second magnetic flux densities.

At this time, the sensing transformer is configured to allow the first magnetic flux density and the second magnetic flux density induced by the first current to overlap each other (or to reinforce each other), so that the first through line 21 and the second through line A first induced current corresponding to the first current may be generated in the second secondary side insulated from 22, that is, the sensing winding 110.

Meanwhile, the number of the first reference winding 111, the second reference winding 112, and the sensing winding 110 wound around the core may be appropriately determined according to the requirements of the system in which the independent active EMI filter module 1 is used. have.

For example, the first and second reference windings 111 and 112 of the primary winding and the sensing winding 110 of the secondary winding may have a turn ratio of 1:N _sen . In addition, if the self-inductance of the primary winding of the sensing transformer is L _sen , the secondary winding can have a self inductance of _{N sen} ² ·L _sen. The primary and secondary windings of the sensing transformer 120 may be combined with a coupling coefficient of _{k sen.}

Meanwhile, the above-described sensing transformer may be configured such that a magnetic flux density induced by a second current, which is a normal current flowing through each of the first through line 21 and the second through line 22, satisfies a predetermined magnetic flux density condition.

That is, the third magnetic flux density and the fourth magnetic flux density may be induced in the core by the second current flowing through the first and second reference windings 111 and 112, respectively. In this case, the third magnetic flux density and the fourth magnetic flux density may be conditions that cancel each other.

In other words, the sensing transformer reduces the second induced current induced to the sensing winding 120, which is the secondary side, by a second current, which is a normal current flowing through each of the first through line 21 and the second through line 22. It may be set to be less than the threshold size, and accordingly, the sensing transformer may be configured to cancel magnetic flux densities induced by the second current from each other, so that only the above-described first current may be sensed.

In the sensing transformer, the magnitude of the first and second magnetic flux density induced by the first current, which is a noise current in the first frequency band (for example, a band having a range of 150 KHz to 30 MHz), is in the second frequency band (for example, 50 Hz to 30 MHz). It may be configured to be larger than the magnitude of the third and fourth magnetic flux densities induced by the second current, which is a typical current of a band having a range of 60 Hz).

In the present invention, when component A is'configured' to be B, it may mean that the design parameter of component A is set to be appropriate for B. For example, the sensing transformer is configured so that the magnitude of magnetic flux induced by the current in a specific frequency band is large. It may mean that the magnetic flux induced by the current is properly set so that the magnitude of the magnetic flux is strong.

The sensing winding 110, which is the secondary side of the sensing transformer, supplies the first induced current to the active circuit unit 121, as shown in FIG. 3, the input terminal of the active circuit unit 121 and the reference of the active circuit unit 121 It can be placed on the path connecting the electric potential.

According to an embodiment, the active circuit unit 121 may be a means for generating an amplified current by amplifying the first induced current generated by the sensing transformer.

According to an embodiment, the sensing winding 110 may be differentially connected to an input terminal of the active circuit unit 121.

In the present invention, amplification by the active circuit unit 121 may mean adjusting the size and/or phase of the amplification target. For example, the active circuit unit 121 may generate an amplified current by changing the phase of the first induced current by 180 degrees and increasing the magnitude by k times (k>=1).

The active circuit unit 121 may be designed to generate an amplified current in consideration of the transformation ratio of the above-described sensing transformer and the transformation ratio of the compensation transformer 1221 to be described later. For example, the sensing transformer of the first element group 11 converts the first current, which is a noise current, into a first induced current that is 1/F1 times the magnitude, and the compensation transformer 1221 converts the magnitude to 1 for the amplified current. When converting the compensation current to be multiplied by /F2, the active circuit unit 121 may generate an amplified current that is F1xF2 times the magnitude of the first induced current.

In this case, the active circuit unit 121 may generate the amplified current so that the phase of the amplified current is opposite to the phase of the first induced current.

The active circuit unit 121 may be implemented by various means. According to an embodiment, the active circuit unit 121 may include an OP AMP. According to another embodiment, the active circuit unit 121 may include a plurality of passive elements such as a resistor and a capacitor in addition to the OP AMP. According to another embodiment, the active circuit unit 121 may include a bipolar junction transistor (BJT) and/or a plurality of passive elements such as a resistor and a capacitor. However, it is not necessarily limited thereto, and the means for'amplification' described in the present invention may be used without limitation as the active circuit unit 121 of the present invention.

The active circuit unit 121 may generate an amplified current by amplifying the first induced current by receiving power from a third device 4 that is separate from the first device 2 and/or the second device 3. have. In this case, the third device 4 may be a device that receives power from a power source independent of the first device 2 and the second device 3 and generates input power to the active circuit unit 121. In addition, the third device 4 may be a device that receives power from any one of the first device 2 and the second device 3 and generates input power to the active circuit unit 121. The active circuit unit 121 is electrically connected to the third device 4 through a 2-1 pin 151 coupled to the substrate 10.

The amplified current flows through the compensation unit 122 to the first through line 141 and/or the second through line 142 to compensate for noise.

According to an embodiment, the compensation unit 122 may include a compensation transformer 1221 and a compensation capacitor unit 1222.

The compensation transformer 1221 may include a primary winding positioned at an output portion of the active circuit unit 121 and a secondary winding connected to the compensation capacitor unit 1222. The secondary winding of the compensation transformer 1221 is connected to the first through line 21 and the second through line 22 which are power lines with the compensation capacitor unit 1222 interposed therebetween. Accordingly, the active circuit unit 121 may be electrically insulated from the power line.

The compensation transformer 1221 is insulated from the first through line 21 and the second through line 22 described above, and the side of the first through line 21 and the second through line 22 based on the amplified current. It may be a means for generating a compensating current at (or at a secondary side to be described later).

More specifically, the compensation transformer 1221 is applied to the amplified current generated by the active circuit unit 121 on the primary side disposed on the path connecting the output terminal of the active circuit unit 121 and the reference potential of the active circuit unit 121 It is possible to generate a compensating current in the secondary side based on the magnetic flux density induced by it. The reference potential (reference potential 2) of the active circuit unit 121 may be grounded through the 2-2 pin 152.

In this case, the secondary side may be disposed on a path connecting the compensation capacitor unit 1222 to be described later and the reference potential of the independent active EMI filter module 1. The reference potential (reference potential 1) of the independent active EMI filter module 1 may be grounded through the 2-3rd pins 153.

In this way, the compensation transformer 1221 is insulated from the first through line 21 and the second through line 22 and the amplified current generated by the active circuit unit 121 is insulated from the first through line 21 and the second through line. It can be transmitted to the through line 22 side.

On the other hand, according to another embodiment, the primary side of the compensation transformer 1221, the active circuit unit 121 and the sensing winding 110 are separated from the remaining components of the independent active EMI filter module 1 ( It can be connected to the reference potential 2). That is, the reference potential (reference potential 2) of the active circuit unit 121 and the reference potential (reference potential 1) of the independent active EMI filter module 1 may be different potentials.

As described above, according to an embodiment of the present invention, a component that generates a compensation current is operated in an insulated state by using a reference potential different from the other components, and by using a separate power source. In this way, the reliability of the independent active EMI filter module 1 can be improved.

As described above, the compensation transformer 1221 is amplified by the active circuit unit 121 and converts the current flowing through the primary side of the compensation transformer 1221 to a certain ratio and induces it to the secondary side of the compensation transformer 1221. have.

For example, in the compensation transformer 1221, a turns ratio of a primary side and a secondary side may be _{1:N inj.} In addition, if the self-inductance of the primary side of the compensation transformer 1221 is L _inj , the secondary side of the compensation transformer may have a self inductance of _{N inj} ² L _inj. The primary side and the secondary side of the compensation transformer 1221 may be combined with a coupling coefficient of _{k inj.} The current converted through the compensation transformer 1221 may be injected as a _{compensation current I comp} into the first through line 21 and the second through line 22 which are power lines through the compensation capacitor unit 1222.

The compensation capacitor unit 1222 may be a means for providing a path through which the current generated by the compensation transformer 1221 flows to each of the first and second through lines 21 and 22.

The compensation capacitor unit 1222 includes at least two compensation capacitors connecting each of the reference potential (reference potential 1) and the first through line 21 and the second through line 22 of the independent active EMI filter module 1 can do. Each of the compensation capacitors may be provided as a Y-capacitor (Y-cap), and one end of each compensation capacitor shares a node connected to the secondary side of the compensation transformer 1221, and the other ends are each a first It may have a node connected to the through line 21 and the second through line 22.

The compensation capacitor unit 1222 may be configured such that a current flowing between the first through line 21 and the second through line 22 through at least two compensation capacitors satisfies a predetermined first current condition. In this case, the predetermined first current condition may be a condition in which the magnitude of the current is less than the predetermined first threshold magnitude.

In addition, the compensation capacitor unit 1222 is between each of the first through line 21 and the second through line 22 and the reference potential (reference potential 1) of the independent active EMI filter module 1 through at least two compensation capacitors. The flowing current may be configured to satisfy a second predetermined condition. In this case, the second predetermined current condition may be a condition in which the magnitude of the current is less than the predetermined second threshold magnitude.

The compensation current flowing to each of the first through line 21 and the second through line 22 along the compensation capacitor part 1222 cancels out the first current on the first through line 21 and the second through line 22 Thus, it is possible to prevent the first current from being transmitted to the second device 2 described above. In this case, the first current and the compensation current may be currents having the same magnitude and opposite phases.

Accordingly, the independent active EMI filter module 1 according to an embodiment of the present invention is provided in each of the first through line 21 and the second through line 22, which are at least two or more high current paths connected to the first device 2. The first current, which is a noise current input in the common mode, is actively compensated to suppress the noise current emitted to the first device 2. This can prevent malfunction or damage of the second device 3 and/or other devices connected to the first device 2.

In the above structure, the second fin group 15 may include the 2-1 pin 151, the 2-2 pin 152, and the 2-3 pin 153. The 2-1 pin 151 may electrically connect the active circuit unit 121 to the third device 4. The 2-2 pin 152 may be electrically connected to the reference potential (reference potential 2) of the active circuit unit 121, and the 2-3 pin 153 is the independent active EMI filter module (1) It can be electrically connected to the reference potential of (reference potential 1). According to an embodiment, the 2-2 pin 152 and the 2-3 pin 153 may be grounded.

The independent active EMI filter module 1 shown in FIG. 3 represents a current-sense current-compensation (CSCC) independent active EMI filter module that senses current to compensate for the current. In particular, the independent active EMI filter module 1 of FIG. 3 may be a feedforward type compensation filter that compensates noise input from the second device 3 at the front end, which is the power supply side. That is, in the independent active EMI filter module 1, the first element group 11, which is a sensing transformer, may be disposed on the EMI source side, and the compensation capacitor 1222 may be disposed on the power side. In addition, the independent active EMI filter module 1 uses the compensation transformer 1221 despite compensating with current using the compensation capacitor unit 1222, and/or the first element group 11 which is a sensing transformer. By using it, an isolated structure can be realized. That is, the independent active EMI filter module 1 according to an embodiment of the present invention may have an insulated feedforward CSCC structure.

As described above, in the independent active EMI filter module 1, the compensation current I _comp may have the same magnitude as the noise current I _n and may have the opposite phase. That is, the active circuit unit 121, the first element group 11, so that the current gain ratio representing the compensation current I _{comp to the noise current I n} input to the independent active EMI filter module 1 is -1, And a compensation transformer 1221 may be designed. Through this, it is possible to provide an independent active EMI filter module 1 capable of reducing EMI noise by canceling out the _{noise current I n generated from the EMI source.}

The independent active EMI filter module 1 according to another embodiment of the present invention may not include a common mode (CM) choke. Since the CM choke functions as a passive filter, it must have a very large inductance to prevent leakage of noise current. Therefore, the number of windings of the CM choke increases, and the size of the core becomes very large. Unlike the CM choke, the first element group 11, which is a sensing transformer included in the independent active EMI filter module 1 according to an embodiment of the present invention, is intended to sense a noise current, so it is necessary to have a large impedance. none. The sensing transformer may have an impedance of one thousandth to one hundredth of the impedance of the CM choke. Therefore, the size of the sensing transformer can be much smaller than that of the CM choke. The independent active EMI filter module 1 according to the embodiment of the present invention can operate independently without parasitic to the CM choke. Accordingly, it can be manufactured by reducing the size and weight in a module shape corresponding to the size of the substrate 10, and through this, the sealing by the sealing structure 13 can be made simply.

The present invention is not necessarily limited thereto, and it goes without saying that the independent active EMI filter module 1 may operate in combination with an independent external CM choke according to still other embodiments.

As can be seen in FIG. 3, a plurality of connecting portions 105 and a plurality of connecting bodies 106 may be disposed on the substrate 10, and at least some of the connecting portions 105 are formed on the substrate 10. It may be formed in a position that does not interfere with elements and/or active elements. However, the present invention is not necessarily limited thereto, and at least some of the connection part 105 and the connection body 106 may function as a conductive line connecting the first and second surfaces of the substrate 10, and thus the first It may function to electrically connect some elements installed on the surface and the second surface.

It goes without saying that the embodiment of the connector 105 and the connector 106 can be equally applied to all the embodiments of the present specification described below.

4 illustrates a more specific example of the first device group 11 and the second device group 12 according to another embodiment.

Referring to FIG. 4, in the independent active EMI filter module 1 according to another embodiment, a first through line 21 and a second through line 22 pass through a substrate 10, and The installed first device group 11 and the second device group 12 may be included.

The embodiment shown in FIG. 4 is different from the embodiment shown in FIG. 3 described above, in which the first element group 11 is the first pin 141 and the first device 2 on the power supply side. 3 is electrically connected to pin 143. And the second element group 12 is electrically connected to the 1-2 pins 142 and the pin 1-4 144 on the side of the second device 3. Accordingly, the embodiment shown in FIG. 4 shows a CSCC active EMI filter of a feedback type, which senses a noise current going out to the first device 2 and compensates with the current at the second device 3 side.

The first element group 11, the active circuit unit 121, the compensation transformer 1221, and the compensation capacitor unit 1222, which are sensing transformers shown in FIG. 4, respectively perform the same functions as the elements shown in FIG. can do. In addition, the independent active EMI filter module 1 shown in FIG. 4 can also implement an isolated structure.

5 illustrates a more specific example of the first device group 11 and the second device group 12 according to another embodiment.

Referring to FIG. 5, in the independent active EMI filter module 1 according to another embodiment, a first through line 21 and a second through line 22 pass through a substrate 10, and The installed first device group 11 and the second device group 12 may be included.

According to the embodiment shown in FIG. 5, the first device group 11 may include a sensing capacitor unit 116. In addition, the second device group 12 may include an active circuit unit 121 and a compensation capacitor unit 1222. Accordingly, the independent active EMI filter module 1 according to the embodiment shown in FIG. 5 senses a noise voltage using the sensing capacitor unit 116 and compensates with a current using the compensation capacitor unit 1222- Represents a voltage-sense current-compensation (VSCC) active EMI filter. In the VSCC structure such as the active EMI filter 1 according to this embodiment, feedforward and feedback may not be distinguished from each other due to the principle of operation. That is, in the independent active EMI filter module 1 shown in FIG. 5, there may be no distinction between input/output units. In addition, the independent active EMI filter module 1 according to the embodiment may also have an isolated structure by using the compensation transformer 1221 and the sensing transformer 115.

The sensing capacitor unit 116 may sense a noise voltage input to the first through line 21 and the second through line 22 which are power lines. The sensing capacitor unit 116 may include two sensing capacitors, and each sensing capacitor may be provided as a Y-cap. One end of each of the two sensing capacitors may be connected to the first through line 21 and the second through line 22, and the other end may share a node connected to the primary side of the sensing transformer 115. . The primary side of the sensing transformer 115 may be connected to the first through line 21 and the second through line 22 which are power lines through the sensing capacitor unit 116. The primary winding of the sensing transformer 115 may be electrically connected to the 2-4 pins 154 of the second pin group 15 coupled to the substrate 10.

The sensing transformer 115 may include a primary side connected to the power line side and a secondary side connected to the active circuit unit 121 in order to sense noise flowing through the power line. The secondary side of the sensing transformer 115 may be differentially connected to the input terminal of the active circuit unit 121.

The sensing transformer 115, the active circuit unit 121, the compensation transformer 1221, and the compensation capacitor unit 1222 included in the independent active EMI filter module 1 according to the embodiment shown in FIG. 5 are each implemented as described above. An operation corresponding to the sensing transformer, the active circuit unit 121, the compensation transformer 1221, and the compensation capacitor unit 1222 of the examples may be performed.

In the above-described embodiments, the active circuit unit 121 further includes a high-pass filter (not shown) between the compensation transformer 1221 and the active circuit unit 121 at a low frequency below the frequency band targeted for noise reduction. Can be blocked from working.

The independent active EMI filter module 1 of the embodiments shown in FIGS. 3 to 5 as described above has a sealing structure blocked from the outside through the encapsulation structure 13 as shown in FIG. can do.

According to the exemplary embodiment illustrated in FIG. 6, a third device group 103 is installed on the first surface 101 of the substrate 10, and the fourth device group 103 is provided on the second surface 102 of the substrate 10. 104 can be installed. According to an embodiment, the third device group 103 may include various transformers and capacitor units, such as Y-cap, of FIGS. 3 to 5 described above. More specifically, the third device group 103 may include a sensing transformer, a compensation transformer 1221, and a compensation capacitor unit 1222, which are the first device group 11.

In the case of the embodiment shown in FIG. 5, the third element group 103 is a sensing capacitor unit 116 or a sensing transformer of the first element group 11 in addition to the compensation transformer 1221 and the compensation capacitor unit 1222. It may include at least one of (115). If the third device group 103 includes the sensing capacitor unit 116 or the sensing transformer 115 of the first device group 11, the other device may be included in the fourth device group 14. .

The fourth device group 104 may include an active circuit unit 121. Accordingly, the fourth device group 104 may have a smaller volume than the third device group 103.

According to an embodiment, the encapsulation structure 13 may include a support 131 and a filling part 132.

The support 131 is formed of an insulating material and includes a space portion 1310 located therein. The space 1310 of the support 131 may be defined by an opening 1311 and a bottom 1312. In some cases, the support 131 may be formed of a material capable of heat transfer. In this case, a heat dissipation mechanism such as a heat sink may be additionally installed on the support 131, and accordingly, heat dissipation by the support 131 may be smoothly performed.

The above-described substrate 10 is accommodated in the space 1310 of the support 131. In this case, the edge of the substrate 10 is formed to correspond to the size of the side surface of the space part 1310, and accordingly, the edge of the substrate 10 may be in close contact with the side surface of the space part 1310. Accordingly, the space part 1310 may be divided into two spaces centering on the substrate 10.

The substrate 10 may be disposed such that the first surface 101 faces the bottom 1312 of the support 131, and the second surface 102 may face the opening 1311 of the support 131. . In this case, the first distance t1 between the bottom 1312 and the first surface 101 of the substrate 10 may be greater than half of the distance between the bottom 1312 and the opening 1311. According to an embodiment, the first distance t1 between the bottom 1312 and the first surface 101 of the substrate 10 is a first distance t1 between the opening 1311 and the second surface 102 of the substrate 10. It may be provided larger than the 2 distance (t2). Accordingly, the length of the pin group exposed to the outside of the support 131 through the opening 1311 from the second surface 102 can be designed to be small, which is structural stability when the independent active EMI filter module 1 is installed. Can provide.

Meanwhile, according to an embodiment, the independent active EMI filter module 1 may include a filling part 132 provided to fill at least a part of the space part 1310.

The filling portion 132 may include a first filling portion 1321 and a second filling portion 1322. The first filling portion 1321 may face the first surface 101 of the substrate 10, and the second filling portion 1322 may face the second surface 102 of the substrate 10. The opening 1311 may be closed by the second filling portion 1322 as described above, and the second filling portion 1322 may constitute the bottom surface 133 of the module. The second filling part 1322 is provided to completely cover the fourth device group 104, and thus the pins 14 may have a structure protruding outward of the module through the second filling part 1322.

The filling part 132 may be provided with a heat-resistant and/or insulating resin material. According to an embodiment, the filling part 132 may include an epoxy resin, and may further include a curing agent.

The independent active EMI filter module 1 may include a connector 105 and a connector 106.

The connection part 105 is connected to the first surface 101 and the second surface 102 of the substrate 10, and according to an embodiment, as shown in FIG. 7, the first surface of the substrate 10 It may include a shape of a hole penetrating through the first surface 101 and the second surface 102. The shape of the hole may have a circular plane or a polygonal plane, and may include a structure having a normal structure or a step difference in cross section.

The connection part 105 may be positioned so as not to interfere with at least one of the first device group 11 or the second device group 12, wherein the connection part 105 is formed in the form of a hole in the substrate 10 In the case of having a, the connection part 105 may be provided so as not to interfere with the third device group 103 and the fourth device group 104.

According to an embodiment, the connection part 105 may be located at a plurality of locations that do not interfere with the third device group 103 and the fourth device group 104.

The connector 106 is located within the connection part 105 and may be provided to be connected to the encapsulation structure 13.

The connector 106 may be provided as a filler capable of filling at least a part of the hole of the connector 105. The filler may be exposed to at least one of the first surface 101 or the second surface 102 to be connected to the encapsulation structure 13.

According to an embodiment, the connector 106 may be formed of the same material as some of the materials forming the encapsulation structure 13, and may be selectively formed integrally with the encapsulation structure 13.

The encapsulation structure 13 may communicate across the substrate 10 through the connection part 105. According to an embodiment, at least a part of the encapsulation structure 13 communicating the connection part 105 may form the connection body 106.

Specifically, as shown in FIG. 7, the connector 106 may be provided to connect the first filling portion 1321 and the second filling portion 1322 to each other. Since the first filling portion 1321 and the second filling portion 1322 can be connected to each other by the connector 106, the first filling portion 1321 and the second filling portion 1322 are prevented from being separated. And, it is possible to improve the structural stability and durability of the entire filling part 13. Accordingly, even when the filling portion 13 is deteriorated due to heat radiation, the first filling portion 1321 and the second filling portion 1322 can be prevented from being separated from each other.

According to an embodiment, the connector 105 may further include a separate material different from the filling part 13, and thus may be connected to the sewing structure 13. Optionally, according to an embodiment, the connector 105 may include an adhesive material. Through this, it is bonded to the first filling portion 1321 and the second filling portion 1322 adjacent to the connector 105 to firmly fix the filling portion 132.

Since the independent active EMI filter module 1 can be simply installed in various devices and has a structure independent from external devices, in particular, the third element group 103 can be protected from external stimuli and/or shock, The independent active EMI filter module 1 itself can be prevented from being damaged. This makes it possible to improve the durability of the entire equipment requiring the independent active EMI filter module 1. In addition, it is possible to protect the third device group 103 from contaminated environments such as external dust. In addition, when the support 131 and/or the filling part 132 includes a heat dissipating material, the third element group 103 is prevented from deteriorating because the heat emitted from the third element group 103 can be radiated to the outside. Can be prevented.

FIG. 8 is an independent active EMI filter module 1 according to another embodiment. Unlike the embodiment shown in FIG. 6, the filling part 132 is at least filled between the substrate 10 and the bottom 1312. The substrate 10 may be fixedly bonded to the inner wall of the support 131 by the filling part 132. In the independent active EMI filter module 1 having the above structure, the second surface 102 of the substrate 10 from which the pins 14 protrude may constitute the bottom surface 133 of the module.

According to an embodiment, the second connector 107 in the form of a pin may be coupled to the connector 105. One end of the second connector 107 may be inserted into the filling part 132 and the other end may be exposed to the outside. The second connector 107 may be formed of a conductive material, and thus may be used as a path for discharging heat inside the filling part 132. Optionally, the second connector 107 is connected to a ground line to improve electrical stability of the independent active EMI filter module 1. Although not shown in the drawings, the second connector 107 may also be applied to the embodiment shown in FIG. 6.

Since the independent active EMI filter module 1 according to this embodiment has a structure independent from an external device, the third element group 103 and the fourth element group 104 are protected from external stimuli and/or impact. Can be, and the independent active EMI filter module 1 itself can be prevented from being damaged. This makes it possible to improve the durability of the entire equipment requiring the independent active EMI filter module 1. In addition, it is possible to protect the third device group 103 and the fourth device group 104 from contaminated environments such as external dust. In addition, when the support 131 and/or the filling part 132 contains a heat dissipating material, heat emitted from the third device group 103 and/or the fourth device group 104 can be radiated to the outside. It is possible to prevent the third device group 103 and/or the fourth device group 104 from being deteriorated.

In the independent active EMI filter module 1 as described above, as can be seen in FIG. 9A, a plurality of pins are exposed through the bottom surface 133. At this time, the 1-1 pin 141, the 1-2 pin 142, the 1-3 pin 143, and the 1-4 pin of the first pin group 14 electrically connected to the power line 144 are respectively disposed at the corners of the bottom surface 133, and the 2-1 pin 151, the 2-2 pin 152, and the 2-3 pin 153 of the second pin group 15 ) Is placed in the position between each corner. The fins of the first fin group 14 electrically connected to the power line may be formed to have a relatively thicker thickness than the fins of the second fin group 15, and the fins of the first fin group 14 may be formed on the bottom surface ( By arranging at the corner of 133), structural stability can be provided when the independent active EMI filter module 1 is mounted on another device. In addition, since the pins of the first pin group 14 are mainly electrically connected to a bulky transformer, the transformers 11 and 1221 are connected to the edge of the third element group 103 as shown in FIGS. 6 and 8. It can be placed so that the weight of the entire module is distributed, and when installed, it can give stability. Even in the structure of designing the third device group 103 in this way, a design margin can be obtained by arranging the pins of the first pin group 14 at the corners of the bottom surface 133. On the other hand, the pins of the second pin group 15 may be relatively freely disposed after the pins of the first pin group 14 are disposed, and thus the pins of the second pin group 15 are not necessarily limited to the embodiment shown in FIG. 9A, and the first pin It may be variously installed in the area between the pins of the group 14.

Meanwhile, the pins of the first pin group 14 do not necessarily have to be installed at the corners of the bottom surface 133, and as shown in FIG. 9B, at least some of the pins of the first pin group 14 are on the bottom surface. It may be installed at a location spaced from the edge of (133) to the inside by a certain degree. However, even in this case, it is possible to secure structural stability by not exceeding about 1/4 of the side distance from the edge. According to the embodiment shown in FIG. 9B, the 1-1 pin 141 and the 1-2 pin 142 are installed at a position spaced apart from the edge of the bottom surface 133 by a predetermined distance. In this case, 2-3 pins 153 may be installed at one corner of the bottom surface 133. According to the embodiment shown in FIGS. 3 to 5, the 2-3 pins 153 are lines electrically connected to the reference potential of the compensation transformer 1221, and thus the thickness of the pins is also the first pin group ( It can be as thick as the pins in 14). By arranging the thick 2-3 pins 153 at the corners of the bottom surface 133, structural stability can be secured.

9A to 9B, at least one of the connection part 105 and/or the connection body 106 is disposed so as not to interfere with passive elements and/or active elements formed on the substrate 10, and various It can be installed in a location where the wires are not formed. Specifically, the connection part 105 and/or the connection body 106 may be installed at a plurality of locations along an approximately central portion of the substrate 10 and an edge of the substrate 10.

10 shows a configuration of an independent active EMI filter module 1 according to another embodiment.

The embodiment shown in FIG. 10 is an independent active EMI filter module 1 having a three-phase three-wire structure unlike the single-phase embodiment shown in FIG. 3.

Referring to FIG. 10, a first through line 21, a second through line 22, and a third through line 23 pass through the substrate 10, and both ends of the first through line (21), the second through line (22), and the third through line (23) pass. It may be electrically connected to the pins 141 to 1-6 146. According to an embodiment, the first through line 21 may be an R-phase, the second through line 22 may be an S-phase, and the third through line 23 may be a T-phase.

The first element group 11 may include a sensing transformer capable of sensing noise, wherein the sensing transformer includes a first reference winding connected to the first through line 21 to the third through line 23, respectively It may include (111) to third reference windings 113, and a sensing winding 110 formed on the same core as the first to third reference windings 111 to 113.

The first reference winding 111 to the third reference winding 113 may be a primary winding connected to a power line, and the sensing winding 110 may be a secondary winding.

The first reference winding 111 to the third reference winding 113 may each be in the form of a winding wound around a core, but are not necessarily limited thereto, and the first reference winding 111 and the second reference winding At least one of 112 or the third reference winding 113 may have a structure passing through the core.

The sensing winding 110 may have a structure in which the first to third reference windings 111 to 113 are wound and/or wound around a core at least once or more.

The sensing winding 110 is insulated from the power line as in the above-described embodiment of FIG. 3, and may sense a noise current generated from the second device 3. Like the embodiment of FIG. 3, the primary and secondary windings may be wound in consideration of the direction in which the magnetic flux and/or the magnetic flux density are generated.

The sensing winding 110 supplies the induced current to the active circuit unit 121, and the active circuit unit 121 amplifies it to generate an amplified current. The active circuit unit 121 may be designed to generate an amplified current in consideration of the transformation ratio of the above-described sensing transformer and the transformation ratio of the compensation transformer 1221 to be described later. The active circuit unit 121 may be implemented by various means. According to an embodiment, the active circuit unit 121 may include an OP AMP. According to another embodiment, the active circuit unit 121 may include a plurality of passive elements such as a resistor and a capacitor in addition to the OP AMP. According to another embodiment, the active circuit unit 121 may include a bipolar junction transistor (BJT) and/or a plurality of passive elements such as a resistor and a capacitor. However, it is not necessarily limited thereto, and the means for'amplification' described in the present invention may be used without limitation as the active circuit unit 121 of the present invention. The active circuit unit 121 is electrically connected to the third device 4 through a 2-1 pin 151 coupled to the substrate 10.

The amplified current flows through the compensation unit 122 to the first through line 21, the second through line 22 and/or the third through line 23 to compensate for noise.

The compensation unit 122 may include a compensation transformer 1221 and a compensation capacitor unit 1222, and specific configurations and functions may be applied in the same manner as in the embodiment illustrated in FIG. 3. Each capacitor of the compensation capacitor unit 1222 has one end connected to the compensation transformer 1221 and the other end connected to the first through line 21 to the third through line 23, respectively.

The embodiment shown in FIG. 10 is shown in a three-phase, three-wire structure based on the embodiment shown in FIG. 3, but the present invention is not necessarily limited thereto, and the embodiment shown in FIG. The same can be applied to the embodiment shown in 5.

In this embodiment, the arrangement of the pins may be implemented as shown in FIG. 11. That is, the 1-1 pins 141 to 1-6 pins 146 of the first pin group 14 are arranged on the edge including the edge of the bottom surface 133 as much as possible. In addition, the 2-1 pins 151 to 2-3 pins 153 of the second pin group 15 are disposed in the remaining area of the edge of the bottom surface 133. At this time, the thick pins 2-3 pins 153, which are thick pins connected to the compensation transformer 1221, and the 2-1 pins 151 and 2-2 pins 152, which are relatively thin pins are positioned to face each other, The whole batch can be evenly distributed. According to this structure, the fins may be uniformly disposed around the edge of the bottom surface 133.

At least one of the connection part 105 and/or the connection body 106 is disposed so as not to interfere with the passive elements and/or active elements formed on the substrate 10, and may be installed in a position where various wires are not formed. have. Specifically, the connection part 105 and/or the connection body 106 may be installed at a plurality of locations along an approximately central portion of the substrate 10 and an edge of the substrate 10.

12 shows a configuration of an independent active EMI filter module 1 according to another embodiment.

The embodiment shown in FIG. 12 is an independent active EMI filter module 1 having a 3-phase 4-wire structure unlike the single-phase embodiment shown in FIG. 3 and the 3-phase 3-wire embodiment shown in FIG. 10.

Referring to FIG. 12, a first through line 21, a second through line 22, a third through line 23, and a fourth through line 24 pass through the substrate 10, both ends of which May be electrically connected to the 1-1 pins 141 to 1-8 pins 148, respectively. According to an embodiment, the first through line 21 is an R-phase, the second through-line 22 is an S-phase, the third through-line 23 is a T-phase, and the fourth through-line 24 is an N-phase. It can be a power line.

The first element group 11 may include a sensing transformer capable of sensing noise, wherein the sensing transformer includes a first reference winding connected to the first through line 21 to the fourth through line 24, respectively. It may include (111) to fourth reference windings 114, and a sensing winding 110 formed on the same core as the first to fourth reference windings 111 to 114.

The first reference winding 111 to the fourth reference winding 114 may be a primary winding connected to a power line, and the sensing winding 110 may be a secondary winding.

The first reference winding 111 to the fourth reference winding 114 may be in the form of a winding wound around a core, but are not necessarily limited thereto, and the first reference winding 111 and the second reference winding At least one of 112, the third reference winding 113, and the fourth reference winding 114 may have a structure passing through the core.

The sensing winding 110 may have a structure in which the first to fourth reference windings 111 to 114 are wound and/or wound around a core at least once or more.

The sensing winding 110 is insulated from the power line as in the above-described embodiments of FIGS. 3 and 10, and may sense a noise current generated from the second device 3. Like the embodiments of FIGS. 3 and 10, the primary and secondary windings may be wound in consideration of the direction in which the magnetic flux and/or the magnetic flux density are generated.

The sensing winding 110 supplies the induced current to the active circuit unit 121, and the active circuit unit 121 amplifies it to generate an amplified current. The active circuit unit 121 may be designed to generate an amplified current in consideration of the transformation ratio of the above-described sensing transformer and the transformation ratio of the compensation transformer 1221 to be described later. The active circuit unit 121 may be implemented by various means. According to an embodiment, the active circuit unit 121 may include an OP AMP. According to another embodiment, the active circuit unit 121 may include a plurality of passive elements such as a resistor and a capacitor in addition to the OP AMP. According to another embodiment, the active circuit unit 121 may include a bipolar junction transistor (BJT) and/or a plurality of passive elements such as a resistor and a capacitor. However, it is not necessarily limited thereto, and the means for'amplification' described in the present invention may be used without limitation as the active circuit unit 121 of the present invention. The active circuit unit 121 is electrically connected to the third device 4 through a 2-1 pin 151 coupled to the substrate 10.

The amplified current flows to the first through line 21, the second through line 22, the third through line 23 and/or the fourth through line 24 through the compensation unit 122, thereby reducing noise. You can compensate.

The compensation unit 122 may include a compensation transformer 1221 and a compensation capacitor unit 1222, and specific configurations and functions can be applied in the same manner as the embodiments shown in FIGS. 3 and 10 described above. have. Each of the capacitors of the compensation capacitor unit 1222 has one end connected to the compensation transformer 1221 and the other end connected to the first through line 21 to the fourth through line 24, respectively.

The embodiment shown in FIG. 12 is shown in a three-phase, four-wire structure based on the embodiment shown in FIG. 3, but the present invention is not necessarily limited thereto, and the embodiment shown in FIG. The same can be applied to the embodiment shown in 5.

In this embodiment, the arrangement of the pins may be implemented as shown in FIG. 13. That is, the 1-1 pins 141 to 1-8 pins 148 of the first pin group 14 are disposed on the edge including the edge of the bottom surface 133 as much as possible. In addition, the 2-1 pins 151 to 2-3 pins 153 of the second pin group 15 are disposed in the remaining area of the edge of the bottom surface 133. At this time, the thick pins 2-3 pins 153, which are thick pins connected to the compensation transformer 1221, and the 2-1 pins 151 and 2-2 pins 152, which are relatively thin pins are positioned to face each other, The whole batch can be evenly distributed. According to this structure, the fins may be uniformly disposed around the edge of the bottom surface 133.

At least one of the connection part 105 and/or the connection body 106 is disposed so as not to interfere with the passive elements and/or active elements formed on the substrate 10, and may be installed in a position where various wires are not formed. have. Specifically, the connection part 105 and/or the connection body 106 may be installed at a plurality of locations along an approximately central portion of the substrate 10 and an edge of the substrate 10.

The independent active EMI filter module 1 as described above may be manufactured by the following method.

First, as shown in FIG. 14, a substrate 10 including a first surface 101 and a second surface 102 facing each other is prepared, and the first element group 11 and the first element group 11 2 Install the element group 12. As described above, the first device group 11 is a device group provided to detect electromagnetic wave noise, and the second device group 12 is a device group provided to generate a compensation signal for electromagnetic wave noise.

The first device group 11 and the second device group 12 are installed on the first side 101 and/or the second side 102 of the substrate 10, and elements constituting each device group In consideration of the volume of the devices, the device is classified into a third device group 103 having a larger volume and a fourth device group 104 having a smaller volume.

According to an embodiment, the third element group 103 is composed of transformer elements and a capacitor unit, a sensing transformer of the first element group 11, a compensation transformer 1221 of the second element group 12, and A compensation capacitor unit 1222 may be included. The fourth device group 104 may include an active circuit unit 121.

The classified third element group 103 and the fourth element group 104 are provided on the first side 101 and the second side 102 of the substrate 10, respectively. In this case, the transformers of the third element group 103, that is, the sensing transformer of the first element group 11 and the compensation transformer 1221 of the second element group 12 are on both sides of the first surface 101 By arranging at the edge and arranging the compensation capacitor unit 1222 between the sensing transformer and the compensation transformer 1221, the weight can be balanced.

At least one connection part 105 may be formed on the substrate 10 as described above. The connection part 105 may be formed in a shape of a hole penetrating the substrate 10, and is disposed so as not to interfere with passive elements and/or active elements formed on the substrate 10, and various wires are not formed. Can be installed on site. Specifically, the connection part 105 may be installed at a plurality of locations along an approximately central portion of the substrate 10 and/or an edge of the substrate 10.

Although not shown in the drawings, according to another embodiment, at least one of the connection parts 105 may have a connection body 106 formed in advance. The connector 106 may include a heat dissipation material, a heat transfer material, and/or an adhesive material, and may be selected according to a required function.

Next, the substrate 10 on which the devices are mounted is sealed as described above.

According to an embodiment, for the encapsulation, as shown in FIG. 15, a support 131 is prepared.

The support 131 is formed of an insulating material and includes a space portion 1310 located therein. The space 1310 of the support 131 may be defined by an opening 1311 and a bottom 1312.

As can be seen in FIG. 16, the filling liquid 133 is put in the space 1310 through the opening 1311 of the support 131. The filling liquid 133 is preferably in a liquid state, and may include a liquid epoxy resin, and may further include a curing agent. It is sufficient that the filling liquid 133 is an amount such that the third element group 103 installed on the substrate 10 is immersed.

Next, as shown in FIG. 17, the above-described substrate 10 is accommodated in the space 1310 in which the filling liquid 133 is accommodated. At this time, the first surface 101 of the substrate 10 faces the bottom 1312 of the space part 1310, so that the third element group 103 mounted on the first surface 101 is Make sure that you are sufficiently immersed in (133).

When the third device group 103 is immersed in the filling liquid 133, the upper portion of the third device group 103 may be spaced apart from the bottom 1312 of the space 1310 by a predetermined distance.

At this time, since the connection portion 105 is formed in at least one region of the substrate 10, the filling liquid 133 through the connection portion 105 is transferred from the first surface 101 to the second surface of the substrate 10. Can pass in the direction of (102). Accordingly, the filling liquid 133 penetrating the connection part 105 may completely immerse the fourth element group 104 installed on the second surface 102 of the substrate 10 in the filling liquid 133. After that, the filling part 132 is formed by curing the filling liquid 133. According to an embodiment, the filling liquid 133 penetrating the connection part 105 may form the connection body 106.

The filling portion 132 includes a first filling portion 1321 positioned between the substrate 10 and the bottom 1312 and a second filling portion 1322 covering the fourth element group 104 of the substrate 10 It is done. In addition, the pins 14 have a structure that protrudes to the outside of the module through the second filling part 1322.

In this structure, the first filling portion 1321 and the second filling portion 1322 may be connected to each other by the connecting body 106 positioned at the connecting portion 105, and thus the coupling structure of the filling portion 132 is It can be more solid.

FIG. 18 illustrates a manufacturing method according to another exemplary embodiment. In FIG. 16, the substrate 10 is immersed in the filling liquid 133 filled in the space 1310 of the support 131.

The substrate 10 is in a state in which the connection portions 105 are formed in a plurality of locations, and the second connector 107 may be coupled to at least some of them. It is sufficient that the filling liquid 133 is an amount such that the third element group 103 installed on the substrate 10 is immersed.

At this time, when the substrate 10 is immersed, the second surface 102 of the substrate 10 is not sufficiently immersed in the filling liquid 133. When the filling liquid 133 is cured in this state, the filling portion 132 of the independent active EMI filter module 1 as shown in FIG. 8 may be completed. In the independent active EMI filter module 1 of this structure, not all elements are sealed by the filling unit 132, but the active circuit unit 121 is exposed, but the third element group 103 is a filling unit ( 132) can be sufficiently protected. In addition, when the substrate 10 is a metal PCB, heat dissipation through the substrate 10 is also possible, so that the independent active EMI filter module 1 according to the embodiment may further improve durability.

Although not shown in the drawing, the second connector 107 may not be coupled to a part of the connection portion 105 in the above structure, and thus the filling liquid is not coupled to the second connector 107 of the connection portion 105. The fourth device group 104 may be encapsulated by penetrating the substrate 10 through the location.

In this way, the present invention can simply implement the independent active EMI filter module 1 provided in a modular form, and by mixing various materials in the filling liquid 133 during the manufacturing process, the independent active EMI filter module 1 is more improved. You can make it implement the function. For example, an additional configuration related to cooling may be implemented by adding insulation, heat transfer, and/or heat dissipation material to the filling liquid 133.

In addition, by the support 131 provided in the form of a hard case, it is possible to provide physical protection for internal elements, and in some cases, a heat dissipation mechanism such as a heat sink can be additionally installed on the support 131. In this way, heat dissipation by the support 131 may be smoothly performed.

All the embodiments described in the present specification may be applied in combination with each other.

The present invention has been described with reference to an embodiment shown in the accompanying drawings, but this is only illustrative, and those of ordinary skill in the art will understand that various modifications and other equivalent embodiments are possible therefrom. I will be able to. Therefore, the true scope of protection of the present invention should be determined only by the appended claims.

Claims (8)

A substrate including a first surface and a second surface opposite to each other;
A first through line and a second through line formed on the substrate in a conductive pattern;
A first device group installed on at least one of the first and second surfaces, electrically connected to the first and second through lines, and configured to detect electromagnetic noise;
A second device group installed on at least one of the first and second surfaces, electrically connected to the first and second through lines, and configured to generate a compensation signal for the electromagnetic noise;
An encapsulation structure provided to separate the substrate, the first device group, and the second device group from the outside;
A connection part provided to connect to the first and second surfaces and not interfering with at least one of the first device group or the second device group;
A connection body located at the connection part and connected to the encapsulation structure;
A pin group exposed to the outside of the encapsulation structure and electrically connected to at least a portion of the first device group or the second device group; And
One end is located inside the encapsulation structure, the other end is exposed to the outside of the encapsulation structure, and the end is a first pin group provided to be connected to the ends of the first and second through lines; Including,
The connection part is an independent active EMI filter module located outside a region on the substrate in which the first device group and the second device group are formed. The method of claim 1,
The connection body is coupled to at least a portion of the encapsulation structure, independent active EMI filter module. The method according to claim 1 or 2,
The sealing structure,
A support including a space part located inside and an opening connected to the space part, and provided to receive at least one of the substrate, a first device group, and a second device group in the space part; And
Independent active EMI filter module comprising a; filling portion provided to fill at least a portion of the space portion. The method of claim 3,
The filling part,
A first filling part facing the first surface; And
Including a second filling portion facing the second surface,
The connector is provided to connect the first filling portion and the second filling portion, independent active EMI filter module. Including a first surface and a second surface facing each other, the first through line and the second through line on at least one of the first surface or the second surface of the substrate formed in a conductive pattern, the first through line and Installing a first element group electrically connected to the second through line and provided to detect electromagnetic wave noise;
Installing a second device group on at least one of the first and second surfaces, electrically connected to the first and second through lines, and configured to generate a compensation signal for the electromagnetic wave noise;
Forming a connection part provided to connect to the first and second surfaces and provided so as not to interfere with at least one of the first device group or the second device group;
Separating the substrate, the first device group, and the second device group from the outside, and forming an encapsulation structure provided so that a pin group electrically connected to at least a portion of the first device group or the second device group is exposed to the outside ; And
Including the step of forming a connection body located at the connection portion and connected to the encapsulation structure,
Forming a first pin group having one end located inside the encapsulation structure and the other end exposed to the outside of the encapsulation structure, and the one end being connected to the ends of the first and second through lines and,
The method of manufacturing an independent active EMI filter module, wherein the connection part is located outside a region on the substrate in which the first device group and the second device group are formed. The method of claim 5,
The step of forming the connection body, comprising the step of allowing the connection body to be coupled with at least a portion of the encapsulation structure, a method of manufacturing an independent active EMI filter module. The method according to claim 5 or 6,
The step of forming the encapsulation structure,
Preparing a support including a space part located inside and an opening connected to the space part;
Accommodating at least one of the substrate, a first device group, and a second device group in the space portion; And
The method of manufacturing an independent active EMI filter module comprising; forming a filling portion provided to fill at least a portion of the space portion. The method of claim 7,
The step of forming the filling part,
Forming a first filling portion facing the first surface; And
Including the step of forming a second filling portion facing the second surface,
The step of forming the connector, the connector comprises the step of connecting the first filling portion and the second filling portion, a method of manufacturing an independent active EMI filter module.

Images