KR102193870B1 - Integral inverter and solar cell module including the same - Google Patents

Abstract

An integrated inverter according to an embodiment of the present invention is an integrated inverter used in a solar cell module including a solar panel, comprising: a terminal connected to the solar panel; An inverter member including a DC-AC inverter electrically connected to the terminal; A circuit board on which the terminal and the inverter member are located; And a case accommodating the circuit board, and grounding is achieved by the case.

Description

Integrated inverter and solar cell module including the same {INTEGRAL INVERTER AND SOLAR CELL MODULE INCLUDING THE SAME}

The present invention relates to an integrated inverter and a solar cell module including the same, and more particularly, to an integrated inverter with improved structure and a solar cell module including the same.

Recently, as existing energy resources such as oil and coal are expected to be depleted, interest in alternative energy to replace them is increasing. Among them, solar cells are in the spotlight as next-generation cells that convert solar energy into electric energy.

A solar panel including solar cells is connected to a junction box, and the junction box is connected to a DC-AC inverter through a DC output cable drawn from the junction box. More specifically, the DC voltage or DC current delivered by the output cable of the (+) terminal and the output cable of the (-) terminal drawn from the junction box is converted into AC voltage or AC current by the DC-AC inverter. The AC voltage or AC current generated by the DC-AC inverter is again connected to another solar cell module by an AC output cable, or is connected to a power grid or a power system.

At this time, since the junction box and the DC-AC inverter must be manufactured and installed separately from each other (for example, because they are manufactured separately and installed in separate cases), installation space increases and installation time when applied to a solar cell module. Increases. Moreover, since a DC output cable (ie, two output cables) must be positioned between the junction box and the DC-AC inverter and connected to them, additional installation space and installation time are required. In particular, the output cable has a large volume, weight, etc., so it is difficult to install. Accordingly, the productivity of the installation process of the junction box and the DC-AC inverter is very low. In addition, the two output cables connecting the junction box and the DC-AC inverter may be shaken or separated from them during transportation and use, thereby causing various problems such as colliding with the solar panel and damaging the solar panel. Can occur.

An object of the present invention is to provide an integrated inverter capable of improving the productivity of the solar cell module assembly process and improving the electrical stability of the solar cell module with a simple structure, and a solar cell module including the same.

An integrated inverter according to an embodiment of the present invention is an integrated inverter used in a solar cell module including a solar panel, comprising: a terminal connected to the solar panel; An inverter member including a DC-AC inverter electrically connected to the terminal; A circuit board on which the terminal and the inverter member are located; And a case accommodating the circuit board, and grounding is achieved by the case.

The case may include a conductive material layer.

A first grounding structure for grounding the case and the circuit board may be included.

The first grounding structure may include a press-fitting nut positioned in the case; A fastening hole formed in the circuit board formed at a position corresponding to the press-fit nut; And a first fastening member through the fastening hole and fastened to the press-fit nut.

The press-fit nut may be made of a conductive material.

The press-fit nut may be formed to protrude from the bottom surface of the case.

The solar cell module may further include a frame for fixing the solar cell panel, and may include a second ground structure for grounding the case and the frame.

The case may include a fastening part coupled to the frame. The second grounding structure may be configured by fastening the fastening part and the frame by a second fastening member.

The fastening portion may include a fastening portion contacting an inner surface of the frame, and may configure the second ground structure by fastening the fastening portion and the frame by the second fastening member.

The case may include a first case portion and a second case portion coupled to the first case portion. A third grounding structure for grounding the first case portion and the second case portion may be included.

The first case portion may include a fastening portion, and the second case portion may include a fixing portion extending to contact at least a portion of the fastening portion. The third ground structure may be formed by fastening the fastening part and the fixing part by a third fastening member.

The fastening part may include a fastening part and an extension part connected from the fastening part to an inner space part of the first case part. The fixing part may contact the extension part. The third ground structure may be formed by fastening the extension portion and the fixing portion by the third fastening member.

The solar cell module may further include a frame fixing the solar cell panel. The case may include a first case portion having an inner space portion and a fastening portion in close contact with the frame, and a second case portion having a fixing portion in close contact with the fixing portion and coupled to the first case portion. have. And a first grounding structure for grounding the internal space portion and the circuit board. A second grounding structure for grounding the fastening portion and the frame; And a third grounding structure for grounding the fastening part and the fixing part.

Grounding by the case may be achieved by fastening a fastening member. The case may include a conductive material layer and a surface treatment layer formed on the surface of the conductive material layer. In a portion where the fastening member is located, at least a portion of the surface treatment layer is removed to form a contact portion exposing the conductive material layer, and the fastening member and the conductive material layer may contact each other through the contact portion.

The fastening member may include a screw portion fastened to the case, and a head portion connected to the screw portion and having an inner surface adjacent to the case. In a portion where the screw portion is located, the contact portion may have a shape corresponding to the shape of the screw portion.

A protrusion may be formed on an inner surface of the head portion adjacent to the case, and the contact portion may have a shape corresponding to the protrusion at a portion where the head portion is located.

A washer member positioned between the head portion and the case and having a protrusion may further be included, and the contact portion may have a shape corresponding to the protrusion at a portion where the head portion is located.

The fastening member may include a screw portion and a head portion connected to the screw portion. The contact portion may be entirely formed on a portion corresponding to at least one of the screw portion and the head portion.

A bypass diode electrically connected to the terminal and the inverter member between the terminal and the inverter member may be further included, and the bypass diode may be positioned on the circuit board.

Solar cell module according to an embodiment of the present invention, the above-described integrated inverter; And a solar panel to which the integrated inverter is connected.

In the integrated inverter of the solar cell module according to the present embodiment, a terminal connected to a ribbon and/or a bypass diode providing a bypass path, and an inverter member for converting direct current into alternating current are integrated or integrated. By integrally forming them, the installation process can be simplified and the structure can be simplified. In addition, by connecting the terminal and/or bypass diode and the inverter member in a circuit pattern, it is not necessary to use an output cable (i.e., a DC output cable) or the like to connect them, thereby simplifying the structure and generating the output cable. It can prevent damage to the solar panel.

In addition, in the present embodiment, since the first grounding structure of the integrated inverter is configured by using the case constituting the integrated inverter, the reliability of the circuit board can be secured and the stability of the integrated inverter can be improved while simplifying the grounding structure. In this case, if the case and the frame are grounded by the second grounding structure, a grounding path can be sufficiently formed to simplify the grounding structure with the ground (for example, the ground) as much as possible. In addition, when the case includes two case parts so that the circuit board part can be easily located therein, the electrical stability of the integrated inverter may be further improved by grounding the two case parts by a third grounding structure. Accordingly, it is possible to minimize safety accidents such as electric leakage or electric shock.

1 is a front perspective view showing a solar cell module including an integrated inverter according to an embodiment of the present invention.
2 is a rear perspective view illustrating the solar cell module of FIG. 1.
3 is a cross-sectional view taken along line III-III of FIG. 1.
4 is an exploded perspective view showing an enlarged portion A of FIG. 2.
5 is an exploded perspective view showing an enlarged portion A of FIG. 2 to separate the integrated inverter from the solar panel so that the surface of the integrated inverter adjacent to the solar panel is visible.
6 is a perspective view showing a part of the integrated inverter shown in FIG. 1.
7 is a cross-sectional view taken along line VII-VII of FIG. 5.
FIG. 8 is a perspective view illustrating various modified examples applicable to the integrated inverter of the solar cell module of FIG. 1.
9 is a perspective view showing a terminal applicable to the integrated inverter of the solar cell module shown in FIG. 1 and a ribbon connected thereto.
10A is a cross-sectional view taken along line AA of FIG. 4.
10B is a cross-sectional view taken along line BB of FIG. 4.
10C is a cross-sectional view taken along line CC of FIG. 4.
11A to 11D are views showing various examples of a contact portion by the third fastening member shown in FIG. 10C.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, it goes without saying that the present invention is not limited to these embodiments and may be modified in various forms.

In the drawings, in order to clearly and briefly describe the present invention, portions not related to the description are omitted, and the same reference numerals are used for identical or extremely similar portions throughout the specification. In addition, in the drawings, the thickness and width are enlarged or reduced in order to clarify the description. However, the thickness and width of the present invention are not limited to those shown in the drawings.

In addition, when a certain part "includes" another part throughout the specification, the other part is not excluded, and other parts may be further included unless specifically stated to the contrary. In addition, when a part such as a layer, film, region, plate, etc. is said to be "on" another part, this includes not only the case where the other part is "directly above", but also the case where the other part is located in the middle. When a part such as a layer, a film, a region, or a plate is "directly over" another part, it means that no other part is located in the middle.

Hereinafter, an integrated inverter according to an embodiment of the present invention and a solar cell module including the same will be described in detail with reference to the accompanying drawings.

1 is a front perspective view showing a solar cell module including an integrated inverter according to an embodiment of the present invention, and FIG. 2 is a rear perspective view illustrating the solar cell module of FIG. 1. And FIG. 3 is a cross-sectional view taken along line III-III of FIG. 1.

1 to 3, the solar cell module 100 according to the present embodiment includes a solar cell panel 10 including a solar cell 12, and a solar cell panel to be connected to the solar cell panel 10. It includes an integrated inverter 30 mounted on (10). The solar cell module 100 may include a frame 20 that fixes an outer portion of the solar cell panel 10. A sealing member (not shown) for sealing and bonding them may be positioned between the solar panel 10 and the frame 20. This will be described in more detail.

The solar panel 10 includes at least one solar cell 12. In addition, the solar panel 10 includes a sealing layer 14 that encloses and seals the solar cell 12, a front substrate 16 positioned on the front surface of the solar cell 12 on one surface of the sealing layer 14, and , It may include a rear substrate 18 positioned on the rear surface of the solar cell 12 on the other surface of the sealing layer 14.

For example, a solar cell 12, a semiconductor substrate (for example, a single crystal semiconductor substrate, more specifically, a single crystal silicon wafer), and a first and a second having a conductivity type opposite to each other formed on or on the semiconductor substrate It may include a two-conductivity type region and first and second electrodes respectively connected thereto. Here, the semiconductor substrate may have a p-type or n-type with a low doping concentration, one of the first and second conductivity-type regions may have a p-type and the other may have an n-type. In addition, the first or second conductivity-type region may be formed of a doped region formed by doping a dopant on a portion of the semiconductor substrate, or may be formed separately on the semiconductor substrate and formed of a dopant-doped semiconductor layer. In addition, a plurality of solar cells 12 are provided, and the first electrode of the solar cell 12 and the second electrode of the solar cell 12 adjacent thereto are connected by a ribbon 122 or the like, and the plurality of solar cells 12 ) May form a solar cell string forming one row. Various known structures may be applied to the structure of the solar cell 12 and the connection structure of the plurality of solar cells 12.

As described above, in this embodiment, the use of a silicon single crystal semiconductor solar cell as the solar cell 12 is illustrated. However, the present invention is not limited thereto, and solar cells of various structures, such as a thin film solar cell, a dye-sensitized solar cell, a tandem solar cell, and a compound semiconductor solar cell, may be used as the solar cell 12. In addition, although it has been illustrated that a plurality of solar cells 12 are provided, it is also possible to provide only one solar cell 12.

The sealing layer 14 is a first sealing layer 14a positioned between the solar cell 12 and the front substrate 16, and a first sealing layer positioned between the solar cell 12 and the rear substrate 18. It may include a second sealing layer (14b) bonded to (14b). The sealing layer 14 encloses and seals the solar cell 12 to block moisture or oxygen that may adversely affect the solar cell 12. And the parts constituting the solar cell module 100 (ie, the front substrate 16, the solar cell 12, and the rear substrate 18) are chemically bonded. The rear substrate 18, the second sealing layer 14b, the solar cell 12 or the solar cell string, the first sealing layer 14a, and the front substrate 16 are sequentially stacked, and then heat and/or pressure are applied thereto. They can be integrated by performing a lamination process or the like for bonding.

As the first sealing layer 14a and the second sealing layer 14b, ethylene vinyl acetate copolymer resin (EVA), polyvinyl butyral, silicon resin, ester resin, olefin resin, or the like may be used. In this case, the first sealing layer 14a and the second sealing layer 14b may be made of the same material or different materials. However, the present invention is not limited thereto. Accordingly, the first and second sealing layers 14a and 14b may be formed by a method other than lamination using various other materials.

The front substrate 16 is positioned on the first sealing layer 14a and constitutes the front surface of the solar panel 10. The front substrate 16 may be made of a material having an intensity capable of protecting the solar cell 12 from external impacts and a light transmittance capable of transmitting light such as sunlight. For example, the front substrate 16 may be formed of a glass substrate or the like. In this case, the front substrate 16 may be formed of a tempered glass substrate to improve strength, and various modifications may be made, such as additionally including various materials capable of improving other various properties. Alternatively, the front substrate 16 may be a sheet or film made of resin or the like. That is, the present invention is not limited to the material of the front substrate 16, and the front substrate 16 may be formed of various materials.

The rear substrate 18 is a layer positioned on the second sealing layer 14b to protect the solar cell 12 from the rear surface of the solar cell 12, and may perform waterproof, insulating, and UV-blocking functions.

The rear substrate 18 may have an intensity capable of protecting the solar cell 12 from external impact, and may transmit or reflect light according to a desired structure of the solar panel 10. For example, in a structure in which light is incident through the rear substrate 18, the rear substrate 18 may have a light-transmitting material, and in a structure in which light is reflected through the rear substrate 18, the rear substrate 18 is It may be made of a non-transmissive material or a reflective material. For example, the rear substrate 18 may be configured in the form of a substrate such as glass, or may be configured in the form of a film or sheet. For example, the rear substrate 18 may be a TPT (Tedlar/PET/Tedlar) type, or may be made of a polyvinylidene fluoride (PVDF) resin formed on at least one surface of polyethylene terephthalate (PET). . Polyvinylidene fluoride is a polymer with a structure of (CH ₂ CF ₂ )n. Since it has a double fluorine molecular structure, it has excellent mechanical properties, weather resistance, and UV resistance. The present invention is not limited to the material of the rear substrate 18 or the like.

As described above, in order to stably fix the solar panel 10 composed of a plurality of layers, the frame 20 to which the outer portion of the solar panel 10 is fixed may be positioned. In the drawings, the entire outer portion of the solar panel 10 is shown to be fixed to the frame 20, but the present invention is not limited thereto. Accordingly, various modifications are possible, such as the frame 20 fixing only some edges of the solar panel 10.

In this embodiment, the frame 20 includes a panel insertion portion 22 into which at least a portion of the solar panel 10 is inserted, and an extension portion 24 extending outward from the panel insertion portion 22. I can.

More specifically, the panel insertion part 22 includes a front portion 222 positioned in front of the solar panel 10, a side portion 224 positioned on the side of the solar panel 10, and the solar panel 10 The rear portions 226 located at the rear are connected to each other, so that the outer portion of the solar panel 10 is located inside the rear portion 226. As an example, the first frame 141 may have a "C" cross-sectional shape or a "U" shape such that the edge of the solar panel 10 is positioned therein by being bent twice. However, the present invention is not limited thereto, and any one or part of the front portion 222, the side portion 224, and the rear portion 226 may not be located. Other variations are possible.

The extension portion 24 extending rearward from the panel insertion portion 22 extends rearward from the panel insertion portion 22 and is formed parallel to the side portion 224 (or is flush with the side portion 224). It includes a first portion 242 formed on the top, and a second portion 244 bent and extended from the first portion 242 to be spaced apart from the rear or rear portion 226 of the solar panel 12 can do. The second portion 244 may be formed parallel to or inclined with the rear or rear portion 226 of the solar panel 12. Accordingly, the extension part 24 may be bent once to have a "b" shape or an "L" cross-sectional shape to form a space between the rear part 226.

Such an extension part 24 increases the strength of the frame 20 and is fixed to the mount, support, or floor, and the extension 24 includes a fastening member for fastening to the mount, support, or floor ( A hole 24a to which (not shown) is fastened may be formed. In this way, since the fastening member is fastened to the second part 244 spaced apart from the solar panel 10, it is possible to prevent the solar panel 10 from being damaged when the solar cell module 100 is installed using the fastening member. I can.

The second portion 244 may be formed to have an area equal to or larger than that of the rear portion 226 (ie, to have the same or larger width) to stably fix the fastening member and the like. In addition, various known structures may be used as the structure of the fastening member. The present invention is not limited thereto, and the extension part 24 may have various other shapes.

The frame 20 may be fixed to the solar panel 10 in various ways. As an example, by forming the outer part of the solar panel 10 with an elastic part (for example, a tape having elasticity), and using the elastic part, the solar panel in the panel insertion part 22 (10) can be inserted. However, the present invention is not limited thereto, and various modifications such as assembling and combining parts constituting the frame 20 at the outer portion of the solar panel 10 are possible.

Further, in the present embodiment, an integrated inverter 30 connected to the solar cell 12 of the solar panel 10 may be provided. For example, the integrated inverter 30 may be located at the rear of the solar panel 10 and may be located adjacent to the upper end of the solar panel 10. In this case, the thickness T1 of the integrated inverter 30 may be equal to or smaller than the height H1 (more specifically, the height of the first portion 242) of the extension portion 24 of the frame 20. Here, the height H1 of the extension part 24 may be defined as a distance from the rear surface of the solar panel 10 to the outer surface of the second part 24 of the extension part 24. Accordingly, the integrated inverter 30 may have a thickness that does not protrude from the outer surface of the second portion 244. That is, the rear surface of the integrated inverter 30 (a surface located farther from the solar panel 10) may be located on the same plane as the outer surface of the second portion 244 or may be located closer to the solar panel 10 than this. . And the rear surface of the part located inside the extension part 24 of the integrated inverter 30 (the surface located farther from the solar panel 10) is the same as or higher than the inner surface of the second part 244. ) To be located close to, so that the extension part 24 can be easily located inside. Accordingly, the volume of the solar cell module 100 can be minimized and the space at the rear side of the solar cell panel 10 can be efficiently utilized. And in this embodiment, the integrated inverter 30 is coupled to the extension 24 of the frame 20 adjacent to the upper portion of the solar panel 10, and / or attached to the rear of the solar panel 10 Can be. This will be described in more detail later.

The integrated inverter 30 according to the present embodiment is a combination of at least a portion of a conventional junction box and at least a portion of the inverter, and is named as a junction box integrated inverter, a bypass diode integrated inverter, an integrated junction box, an inverter integrated junction box, etc. It could be. This integrated inverter 30 will be described in more detail with reference to FIGS. 4 to 9 along with FIGS. 1 to 3.

FIG. 4 is an exploded perspective view showing an enlarged portion A of FIG. 2, and FIG. 5 is an enlarged view of a portion A of FIG. 2 to separate the integrated inverter 30 from the solar panel 10 and attach it to the solar panel 10. It is an exploded perspective view showing the surface of the adjacent integrated inverter 30 to be seen. 6 is a perspective view showing a part of the integrated inverter 30 shown in FIG. 1. For a simple and clear view, illustration of the potting member 372 is omitted in FIG. 4, and the potting member 372 will be described in detail with reference to FIG. 6.

4 and 5, the integrated inverter 30 according to the present embodiment is a terminal connected to a solar cell (reference numeral 12 in FIG. 3, hereinafter the same) (or solar panel 10, hereinafter the same) ( 31), an inverter member 35 including a DC-AC inverter 352, a circuit board 37 on which the terminals 31 and the inverter member 35 are located, and a case accommodating the circuit board 37 It includes (39). In addition, the bypass diode 33 positioned between the terminal 31 and the inverter member 35 may be connected to the terminal 31 and the inverter member 36 by a circuit pattern.

In this embodiment, the case 39 (more specifically, the first case 49) includes a conductive material layer (reference numeral 47 in FIGS. 10A to 10C, hereinafter the same), and the first case 49 Grounding is achieved. More specifically, the integrated inverter 30 according to the present embodiment includes a first ground structure 72 for grounding the first case 49 and the circuit board 37, and the first case 49 and the frame A second grounding structure 74 for grounding 20 may be included. If the first case 49 includes the first case portion 491 and the second case portion 492 coupled to each other, a third ground grounding the first case portion 491 and the second case portion 492 It may further include structure 76. For example, the first to third ground structures 72, 74, and 66 may be implemented by the first to third fastening members 62, 64, and 66. The first to third ground structures 72, 74, and 76 will be described in more detail with reference to FIGS. 10A to 10C and FIGS. 11A to 11D after the entire structure of the integrated inverter 30 is first formed.

In this embodiment, the terminal 31 and/or the bypass diode 33 and the inverter member 35 are integrally formed.

Here, the term “integrated” may include all states recognized as one part, article, object, or member when fixed to the solar panel 10 and/or frame 20 during the installation process or after the installation process. . For example, "integrated" may mean that it is located together inside the same case and is integrated by the same case, or it may mean that it is fixed by being inserted into or attached to the same member and integrated by the same member. , It may mean that it is formed together on the same member so as to form part of the same member, or it may mean that it is wrapped or fixed together by the same member. On the contrary, it may be difficult to say that what is connected by a separate output cable or the like is integrated. At this time, the terminal 31, the bypass diode 33, and the inverter member 35 may be integrated so as not to be detachable from each other, or may be detachably integrated with each other so as to be easily detached during repair or replacement.

In the integrated inverter 30 according to the present embodiment, a terminal 31, a bypass diode 33, and an inverter member 35 are formed together on a circuit board 37 having a circuit pattern (or circuit or wiring). Accordingly, it can be seen that the terminal 31, the bypass diode 33 and the inverter member 35 are integrated by the circuit board 37. In addition, as shown in FIG. 6, the potting member 372 may be positioned while covering or surrounding the circuit board 37. Accordingly, the bypass diode 33 and the inverter member ( 35) can be viewed as being integrated. Further, the circuit board 37 on which the terminal 31, the bypass diode 33, and the inverter member 35 are formed may be located inside the same case 39. Accordingly, the terminal 31, the bypass diode 33, and the inverter member 35 may be considered to be integrated by the same case 39.

In this embodiment, it is illustrated that the terminal 31, the bypass diode 33, and the inverter member 35 are integrated by the same circuit board 37, the same potting member 372, and the same case 39. In more detail, the terminal 31, the bypass diode 33 and the inverter member 35 are located on the same circuit board 37, and the potting member 372 is the bypass diode 33, the inverter member ( It is formed while covering 35) and the circuit board 37, and the terminal 31, the inverter member 33, the circuit board 37, and the potting member 372 are integrated to form the circuit board part 300. The circuit board part 300 may be fixed inside the case 39 by the case 39. Accordingly, the terminal 31, the bypass diode 33, and the inverter member 35 can be more rigidly integrated. However, the present invention is not limited thereto, and it is also possible to integrate them in a simple structure by using at least one of various methods capable of integrating them. Further, in the present embodiment, the terminal 31, the bypass diode 33, and the inverter member 35 are integrated together, but the present invention is not limited thereto. Therefore, only the bypass diode 33 and the inverter member 35 may be integrated, and other various modifications are possible.

In this embodiment, the case 39 provides a space in which the integrated terminal 31, the bypass diode 33 and the inverter member 35 are located, and is stable to the solar panel 10 and/or the frame 20. It may have various structures and shapes that can be fixed as.

For example, in this embodiment, the case 39 forms an outer shape or an outer surface and includes a first case 49 fixed to the solar panel 10 and/or the frame 20, and the first case It may include a second case 59 located inside the circuit board portion (49) to accommodate the 300. At this time, the second case 59 is detachably fixed to the first case 49, so that the circuit board portion 300 accommodated in the second case 59 can be easily fixed within the first case 49. Or to be easily separated from the first case 49. This will be described in more detail.

The first case 49 will be described in more detail with reference to FIG. 7 along with FIGS. 4 and 5. 7 is a cross-sectional view taken along line VII-VII of FIG. 5.

In this embodiment, the first case 49 includes a first case portion 491 and a second case portion 492 that are bonded to each other to form an integral case. Accordingly, in a state in which the first case portion 491 and the second case portion 492 are separated, it is easy to insert or remove the circuit board portion 300 and/or the second case 49, and the first case portion In a state in which the 491 and the second case portion 492 are coupled, the circuit board portion 300 and the second case 49 located therein may be stably accommodated.

Here, the first case portion 491 includes an inner space portion 494 in which the inner space is located by having a bottom surface 4934 and a side surface 4944, and a bottom surface 4924 from the upper end of the inner space portion 494 ) May include a joint flange 496 extending in parallel or obliquely. In this case, side surfaces 4944 may be formed on all edges of the bottom surface 494 so that the inner space 494 may be formed so that only one surface of the inner space is opened. For example, when the bottom surface 4934 is a square, it may have a shape in which only one surface is not formed in the rectangular parallelepiped by having four side surfaces 4944 extending from four edges constituting the square. For example, the inner space 494 may have at least five surfaces and only one surface may have an open structure.

In the drawing, the bottom surface 4934 may have four straight lines, and may have a shape having a rounded edge at a portion where two adjacent straight lines meet each other. For example, the bottom surface 4934 may have an approximate square shape, but portions corresponding to four corners of the square shape may have a rounded shape. The side surface 4944 is formed entirely from the edge of the bottom surface 4924 and may extend to intersect (eg, orthogonal to) the bottom surface 4924. Accordingly, the side surface 4944 may be formed to include four planes corresponding to four straight lines and four rounded curved surfaces respectively positioned between two planes adjacent to each other. Accordingly, sufficient internal space can be secured, and injuries to the user due to sharp edges can be prevented. However, the present invention is not limited thereto, and the shapes of the bottom surface 4942 and the side surface 4944 may be variously modified.

The joint flange 496 may be formed in a shape that is bent and extended from the side surface 4944. The bonding flange 496 provides an area to which the bonding member 493 is applied so that the first case portion 491 and the second case portion 492 can be bonded to each other by the bonding member 493. At this time, the bonding flange 496 is bent from the side surface 4944 and extends toward the outside to open all the inner spaces of the inner space 494 to open the terminal 31, the bypass diode 33, and the inverter member 35. ) Does not get caught in the joint flange 496 and is easily mounted and removed. The joining flange 496 may be configured as a flat surface parallel to the bottom surface 494 2 and/or may be configured as a flat surface orthogonal to the side surface 4944. Then, the bonding member 493 may be stably applied on the bonding flange 496. However, the present invention is not limited thereto.

In this embodiment, the joining flange 496 extends entirely from the end of the side surface 4944 and is continuously formed to close the interior of the inner space 494 when viewed in plan. Here, the joint flange 496 may be formed to have a flat surface to be positioned on the same plane. Then, the first case portion 491 and the second case portion 492 are entirely joined by the bonding member 493 applied to the bonding flange 496, thereby increasing the airtightness of the inside of the first case 49 Can be maintained. At this time, the width of the bonding flange 496 is made uniform as a whole so that the bonding member 493 is uniformly applied, thereby stably bonding the first case portion 491 and the second case portion 492 to each other. In addition, when repair or replacement is required, a cutting tool (for example, a knife, etc.) is inserted between the joining flange 496 and the second case portion 492 and moves one round along the joining flange 496. By cutting 493, the first case portion 491 and the second case portion 492 can be easily separated. That is, since the cutting mechanism can be moved along the flat surface of the joint flange 496, the first case portion 491 and the second case portion 492 can be easily separated.

In this embodiment, the second case portion 492 may have a plate shape covering an open surface of the inner space portion 494 while having an edge shape that matches the outer edge of the bonding flange 496.

At this time, the second case portion 492 is an inner portion 497 that is formed flat from the inside to be parallel to the bottom surface 494 and is away from the first case portion 491 while facing the outside from the inner portion 497. It may include an outer portion 499 that is inclined to fall. A portion of the outer portion 499 overlapping with the joining flange 496 is joined by the joining flange 496 and the joining member 493.

When the outer portion 499 that is inclined while facing the outside is formed in this way, a boundary line (or boundary portion) that can be visually recognized or recognized by equipment is formed between the inner portion 497 and the outer portion 499. Is formed. The approximate positions of the first case part 491 and the second case part 492 can be matched by positioning the inner part 497 on the joint flange 496 or so that it does not deviate from the joint flange 496. have. In this case, the inner portion 497 may have an area smaller than that of the bottom surface 4934. For example, the width W2 of the outer portion 499 may be larger than the width W1 of the joint flange 496. Then, by positioning the boundary line between the inner portion 497 and the outer portion 499 inside the joint flange 496 (that is, on the inner space), the first case portion 491 and the second case portion 492 You can more easily set the approximate location of. In this way, the boundary line between the inner portion 497 and the outer portion 499 may be used as a kind of guide or alignment mark.

And when the outer portion 499 is inclined away from the inner portion 497 while facing the outside, as shown in FIG. 7, the distance between the joining flange 496 and the outer portion 499 (that is, between them) The thickness of the bonding member 493 located) becomes larger at the outer edge than at the inner edge. Then, since the distance between the first case portion 491 and the second case portion 492 at the outer edge portion of the joint flange 496 is large, the first case portion 491 and the second case portion are When separating the (492), it is easier to cut by putting a cutting mechanism between the joining flange 496 and the outer part 499.

The joining member 493 positioned between the joining flange 496 of the first case portion 491 overlapping each other and the outer portion 499 of the second case portion 492 is the first case portion 491 and the second By bonding and sealing the case portion 492, impurities, contaminants, and the like are prevented from entering from the outside, and sealing properties and waterproof properties can be improved. Various materials having bonding and/or sealing properties may be used for the bonding member 493, for example, a sealant or the like may be used. However, the present invention is not limited thereto.

However, the present invention is not limited thereto, and the first case 49 may be formed without entirely covering the inner space. In addition, a side surface is formed only in a part of the first case portion 491, or a side surface is not formed, and a side surface is formed in at least a portion of the second case portion 492. In addition, the first case 49 may include three or more portions that are coupled to each other, and various other modifications are possible.

When the first case portion 491 and the second case portion 492 are provided together in this way, the parts, etc., located inside can be easily inserted and removed, and by joining them by the joining member 493, the inside is stably It is sealed to prevent problems that may occur due to external moisture, etc., and can reliably protect internal parts from external shocks. However, the present invention is not limited thereto, and the first case 49 may include only at least one of the first case portion 491 and the second case portion 492. For example, when the second case portion 492 is not formed and the bonding flange 496 of the first case portion 491 is in close contact with the solar panel 10, the solar panel 10 is moved to the second case. Various modifications are possible, such as to serve as the part 492.

The first case 49 may include a structure for connection to the solar cell 12, the outside (for example, another solar cell module 100 or a power grid). That is, the first case 49 includes a first through hole 49a through which the ribbon 122 for connection with the solar cell 12 passes, and one for transmitting the AC voltage generated by the integrated inverter 30. A second through hole 49b through which the AC output cable 38 passes may be provided.

That is, the first through hole 49a for connection with the solar cell 12 and the second through hole 49b for the AC output cable 38 are formed in the same first case 49. This is because the terminal 31 and/or the bypass diode 33 and the inverter member 35 are integrated. Conventionally, the first through hole for connection with the solar cell is formed in the case of the junction box, and the second through hole for the AC output cable is formed in the case of the inverter in which the inverter member is located, and the first through hole and the second through hole are formed. Holes cannot be formed in the same case. That is, in the present embodiment, a structure for connection with the solar panel 10 and an output cable 38 for providing an AC voltage to the outside may be integrally formed by the circuit board 37.

For example, the first through hole 49a may be formed on a surface adjacent to the solar panel 10 in the first case 49 (ie, the bottom surface 4942 of the first case portion 491 ). Then, the ribbon 122 drawn out from the solar cell 12 and passed through a hole (not shown) formed in the second sealing layer 14b and the rear substrate 18 is transferred to the terminal 31 in a shorter path. I can connect. The first through-hole 49a may be a hole through which a plurality of (n) ribbons 122 corresponding to each of a solar cell string, etc. are penetrated together, or a plurality of holes corresponding to a plurality of ribbons 122 and spaced apart from each other. It may also contain dog holes. In the drawing, a structure in which the first case portion 491 can be processed more easily is shown, including one first through hole 49a through which the plurality of ribbons 122 penetrate together.

The second through hole 49b may be formed at a position where external circuit connection can be easily made. For example, in this embodiment, a second through hole 49b is located in a side surface 4944 far from the terminal 31 so that the voltage provided from the solar panel 10 to the terminal 31 is applied to the bypass diode 33 And after passing through the inverter member 35 in sequence, it may be drawn out to the outside through the AC output cable 38. Accordingly, the terminal 31, the bypass diode 33, and the inverter member 35 can be arranged efficiently.

In this embodiment, the output cable of the integrated converter 30 in which the terminal 31 connected to the ribbon 122 and/or the bypass diode 33 is located is composed of an AC output cable 38. Accordingly, one AC output cable 38 may be drawn out through the second through hole 49b. In general, the AC output cable 38 may have three conductors having a three-phase voltage (current), and one AC output cable 38 includes three conductors. The three conductive wires constituting one AC output cable 38 may be combined into one and pass through one second through hole 49b. This can simplify the structure. However, the present invention is not limited thereto, and various modifications may be made, such as drawing out three conductive wires through different second through holes 49b.

In this embodiment, the output cable output from the integrated inverter 30 in which the terminal 31 connected to the ribbon 122 and/or the bypass diode 33 is located is composed of an AC output cable 38, and a DC output No cables are provided. This is because the terminal 31 and/or the bypass diode 33 and the inverter member 35 are integrated. Conventionally, since a DC voltage or DC current is drawn from a junction box in which a terminal and a bypass are located, two DC output cables of a (+) output cable and a (-) output cable exist.

In addition, a fastening portion 49c for fixing to the frame 20 may be formed in the first case 49. The fastening part 49c is a part that is coupled to the frame 20 by the fastening member 62. In this embodiment, the fastening portion 49c may be integrally formed with the first case portion 491 or the second case portion 492 and may extend therefrom. Then, the first case 49 including the fastening portion 49c may be formed together by the same process, thereby improving productivity.

The fastening portion 49c extends from a portion adjacent to the frame 20 in the first case 49 (the upper end portion in the drawing) and extends to the frame 20 and at least one side (in particular, the second portion 244 of the frame 20 ). ) Can be contacted. Then, the fastening holes 490c and 244c are formed in the fastening part 49c and the second part 244, and the second fastening member 64 (for example, a screw or a screw) is formed in the fastening holes 490c and 244c. Etc.), the first case 49 can be fixed to the frame 20. Accordingly, the first case 49 and the frame 20 can be firmly fixed by a simple structure. In addition, the second grounding structure 74 may be configured by fastening the second fastening member 64 to the fastening holes 490c and 244c formed in the fastening part 49c and the first part 244. The second ground structure 74 will be described in more detail later.

For example, in this embodiment, the fastening portion 49c includes a fastening portion 491c fastened to the frame 20. In addition, the fastening portion 49c may include extended portions 492c, 493c, and 494c that are connected from the fastening portion 491c to the inner space 494. The extended portions 492c, 493c, 494c are bent from the fastening portion 491c to extend toward the solar panel 10 and the first extended portion 492c and the first extended portion 492c are bent from the solar panel ( 10) may include a second extension portion 493c extending to have a plane parallel to the second extension portion 493c, and a third extension portion 494c extending to the joint flange 496 by being bent from the second extension portion 493c. .

The fastening portion 491c may be positioned to be in contact with (or in close contact with) the second portion 244 of the frame 20. For example, the fastening portion 491c is positioned so as to be in close contact with the inner surface of the second portion 244 (that is, the surface facing the rear portion 226 or the solar panel 10), and the inner space of the extension portion 24 The fastening part 49c may be positioned at. At this time, the fastening holes 224c and 490c are positioned at positions corresponding to each other of the second part 244 and the fastening part 491c that is in close contact with the inner surface of the second part 244. In addition, a locking portion 490d penetrating the locking groove 244d of the second portion 244 may be positioned at a side edge of the fastening portion 491c. Then, by fitting the locking portion 490d of the fastening portion 491c into the locking groove 244d of the second portion 244, the position of the fastening portion 49c is adjusted to the desired position, and then fastened with the fastening member 62. The portion 49c and the second portion 244 may be fixed to each other. In this embodiment, the locking portion 490d is composed of a protruding portion protruding in a direction away from the solar panel 10 so as to pass through the second portion 244, and the locking groove 244d is located at the locking portion 490d. It may be composed of a groove formed corresponding to the portion. Accordingly, the position of the fastening portion 49c and the second portion 244 can be easily aligned using a simple structure. In addition, the locking portion 490d is positioned at each side edge of the fastening portion 491c, and two locking grooves 244d are positioned to correspond thereto, so that alignment characteristics may be further improved. However, the present invention is not limited thereto. Therefore, the structure, shape, position, number, etc. of the fastening portion 49c and the frame 20, the locking portion 490d and the locking groove 244d can be variously modified.

The first extension portion 492c may contact (or closely adhere) to the frame 20 (more precisely, the first portion 242). More specifically, the first extended portions 492c may contact (or closely adhere) to the inner surface of the first portion 242. Then, the fastening part 49c and the frame 20 may be more firmly fixed to each other.

The second extension part 493c may be positioned to be spaced apart from the solar panel 10 or the frame 20. In this embodiment, the first case portion 491 and the second case portion 492 may be fastened to each other by the third fastening member 66 by using the second extended portion 493c. The second extended portion ( This is to make it easier to fasten the first case part 491 and the second case part 492 by making the 493c spaced apart from the solar panel 10. However, the present invention is not limited thereto, and the first case portion 491 and the second case portion 492 are joined only by the bonding member 93 and may not be separately fastened, or may be fastened to each other at different positions. In this case, fixing stability may be improved by making the first extension portion 493c in close contact with the rear surface of the solar panel 10 or the rear portion 226 of the frame 20. Other variations are possible.

A through hole 490f is formed across the first and second extended portions 492c and 493c, so that the fastening portion 49c, which is bent a plurality of times, may be more easily processed. A plurality of through-holes 490f may be formed to improve the ease of processing, but the present invention is not limited thereto. In addition, the shape, size, etc. of the through hole 490f are not largely limited.

As described above, when the fastening part 49c is formed by bending several times including the first to third extension parts 492c, 493c, and 494c in addition to the fastening part 491c, the fastening part 49c is formed like a reinforcing member. It can act and have high strength. Accordingly, it is possible to have sufficient strength in a portion fastened to the frame 20.

In addition, a bracket portion (not shown) that serves to improve the appearance by covering the front surface of the fastening portion 49c (that is, at least between the fastening portion 491c and the third extension portion 494c) may be further positioned. have. The bracket portion may be detachably fixed to the fastening portion 49c by a latch structure or the like. However, the present invention is not limited thereto, and the bracket part may be fixed by various methods.

A fixing part 49d fixed to the fastening part 49c may be further formed at a portion of the second case part 492 corresponding to the fastening part 49c. The fixing part 49d is bent from the first fixing part 491d in contact with (or in close contact with) the second extended part 493c, and the first fixing part 491c is bent to extend to the external part 499 to extend to the external part ( A second fixing portion 492d connected to the 499 may be included. Fastening holes 490e and 490g may be located at positions corresponding to each other in the second extension part 493c and the first fixing part 491d, and a third fastening member 66 in the fastening holes 490e and 490g. By fastening the first case portion 491 and the second case portion 492 may be more firmly fastened. Accordingly, the airtight structure and the fixing structure of the first case 49 can be improved. In addition, in this embodiment, the third grounding structure 76 may be formed by fastening the fastening part 49c and the fixing part 49d with the third fastening member 66. This will be described in more detail later.

In this embodiment, the first case 49 is fixed or attached to the solar panel 10. That is, in this embodiment, the adhesive member 69 is attached to the bottom surface of the first case 49 adjacent to the solar panel 10 (for example, the bottom surface 4934 of the first case portion 491). It is positioned to stably fix the solar panel 10 and the first case 49 (or the integrated inverter 30), and has excellent airtightness, sealing properties, and waterproof properties.

In more detail, the adhesive member 69 may be formed to have a closed space therein while surrounding the first through hole 49a of the first case 49 in a plan view. Thereby, the ribbon 122 is positioned inside the first case 49 by the first through hole 49a formed in the first case 49, while the solar panel located inside the adhesive member 69 It divides and separates the space between the space 10 and the first case 49 and the external space. Accordingly, the first case 49 having the first through hole 49a may be sealed.

As described above, the first case 49 has a first through hole 49a and a second through hole 49b together, and the second through hole 49b has an AC output cable 38 located therein, so that it is sealed or While it is possible to maintain the airtight property, the first through hole 49a must be opened so that the ribbon 122 can pass smoothly. Accordingly, if a separate adhesive member 69 is not formed, foreign substances, moisture, impurities, etc. may flow into the first case 49 through the first through hole 49a. Accordingly, in the present embodiment, an adhesive member 69 surrounding the space opened by the first through hole 49a is formed so that the outside and the inside of the first case 49 communicate with each other through the first through hole 49a. Can be prevented. Accordingly, the airtight, sealing, and waterproof properties of the first case 49 may be improved. In addition, by fixing the first case 49 to the solar panel 10 by the adhesive member 69, it is possible to improve fixing stability.

For example, when viewed in a plan view, the adhesive member 69 may have a shape such as a circle or a polygon. In the drawing, the first through hole 49a may be formed in a square shape, and the adhesive member 69 may be formed in a square shape. However, the present invention is not limited thereto, and the adhesive member 69 may have various structures and shapes that prevent communication between the first through hole 49a and the inside of the first case 49.

In the present embodiment, since the integrated inverter 30 is provided with a first through hole 49a for connecting the ribbon 122 and the terminal 31, the adhesive member 69 is formed to improve airtightness. On the other hand, the conventional inverter does not have a first through hole for connection to the solar cell 12.

As the adhesive member 69, various materials having excellent adhesive properties and sealing properties may be used. For example, a sealant or the like may be used as the adhesive member 69. However, the present invention is not limited thereto. Accordingly, the adhesive member 69 is composed of a structure formed of resin, metal, etc., and various modifications are possible, such as bonding the first case 49 and the solar panel 10 by heat or the like.

The above-described first case 49 may contain various materials capable of maintaining an outer shape or an outer surface and protecting various parts, articles, members, etc. located therein. For example, the first case 49 may include a conductive material layer 47 to increase structural stability, and the first case 49 may be used for grounding. For example, the conductive material layer 47 of the first case 49 may be made of metal. At this time, when the first case 49 is made of a surface-treated metal (or a coated metal), a conductive material layer 47 is located inside, and a surface treatment layer having insulating properties while surrounding it is located outside (FIGS. Reference numeral 48 in FIG. 10C, hereinafter the same) may be located. Accordingly, corrosion resistance can be improved and the appearance can be improved by the surface treatment layer 48 including an insulating material, and the conductive material layer 47 located therein can be applied to grounding or the like. The grounding structure will be described in more detail later.

As an example, the first case 49 may be made of an anodized metal (eg, anodized aluminum). Then, the first case 49 is provided with a conductive material layer 47 including aluminum and a surface treatment layer 48 including aluminum oxide. In addition, the appearance of the first case 49 may be further improved by adjusting the color of the first case 49 at the time of surface treatment (eg, anodizing treatment). For example, the color of the first case 49 may be adjusted so that the first case 49 may have a color such as black, brown, or silver.

In this embodiment, the second case 59 may be located inside the first case 49. The second case 59 will be described in more detail with reference to FIGS. 4 to 6. In FIG. 6, the first case portion 491 of the first case 49 and the inner space portion 594 of the second case 59 and the circuit board portion 300 disposed therein are illustrated.

The second case 59 serves to support or accommodate the circuit board unit 300 together so that it can be easily separated from the first case 49. Therefore, when repair or replacement is required, the first case 49 is opened, and then the second case 59 is separated from the first case 49 to separate the circuit board part 300 at a time to the first case 49 ) Can be separated from. In addition, when replacement is necessary, the second case 59 in which the terminal 31 to be replaced, the bypass diode 33, and the inverter member 35 are supported or accommodated is inserted into the first case 49. You can simply make the replacement happen.

The second case 59 may also serve as an accommodating portion that holds the potting member 372 that surrounds the terminal 31, the bypass diode 33, and the inverter member 35 together. That is, after injecting or pouring the potting member 372 in a state of fluidity in a state in which the terminal 31, the bypass diode 33, and the inverter member 35 are placed inside the second case 59, The second case 59, the terminal 31, the bypass diode 33, the inverter member 35, and the like may be integrated together by solidifying by drying or heat treatment. Then, the process of applying the potting member 372 may be simplified, and the integrated structure of the bypass diode 33 and the inverter member 35 may be made more robust.

The second case 59 may have various structures capable of supporting or accommodating the terminal 31, the bypass diode 33, the inverter member 35, and the like.

For example, in the present embodiment, the second case 59 includes a bottom surface 5942 located at a portion of the first case 49 excluding the first through hole 49a, and extending from the bottom surface 594 It may include an inner space portion 594 having a side surface (5944). When the side surface 5944 is formed as a whole to correspond to all edges of the bottom surface 594, it can more effectively perform the role of a receiving portion for containing the potting member 372. However, the present invention is not limited thereto, and the inner space portion 594 may not have an inner space and may be formed only with the bottom surface 5942. In addition, the second case 59 may include a cover portion 592 covering an upper surface of the inner space portion 594. The cover part 592 is formed so as not to cover the first through hole 49a and the terminal 31, that is, to expose the first through hole 49a and the terminal 31, so that the ribbon 122 and the terminal 31 The connection process can be made easier. However, the present invention is not limited thereto, and the cover part 592 may not be separately provided.

In addition, the second case 59 may play a role of maintaining an insulation distance such as a circuit pattern of the circuit board 37 in some cases (when the first case 49 has conductivity). In this case, the second case 59 may be formed of an insulating material to maintain an insulating distance between the first case 49 and the circuit board 37. However, the present invention is not limited thereto. That is, even when the first case 49 has conductivity, the second case 59 may be made of a conductive material to have conductivity. Alternatively, the second case 59 may not be provided. When the second case 59 does not play a role of satisfying the insulation distance or the second case 59 is not provided, another configuration for satisfying the insulation distance may be further included. This will be described in more detail with reference to FIG. 8.

FIG. 8 is a perspective view showing various modifications that can be applied to the integrated inverter 30 of the solar cell module 100 of FIG. 1. For clear and simple description, in FIG. 8, only the components necessary for the description are displayed, and other components are omitted.

For example, as shown in (a) of FIG. 8, the terminal 31, the bypass diode 33, the inverter member 35, the circuit board 37, and the like are a potting member 372 or a separate insulation It can be entirely wrapped by material. In addition, the potting member 372 or the circuit board portion 300 wrapped by a separate insulating material may be positioned inside the first case 49 without the second case 59. Then, the insulating distance may be satisfied by the potting member 372 or a separate insulating material.

As another example, as shown in (b) of FIG. 8, the first case 49 and the second case (eg, the inner surface of the first case portion 492) of the first case 49 59) or between the first case 49 and the circuit board 37, and a spacer 82 including an insulating material may be positioned therebetween. Then, the insulating distance may be satisfied by the spacer 82. The shape and arrangement of the spacers 82 may be variously modified.

As another example, as shown in (c) of FIG. 8, an insulating pad partially including an insulating material on the inner surface of the first case 49 (for example, the inner surface of the first case portion 492) ( 84) can be attached. Alternatively, as shown in (d) of FIG. 8, an insulating sheet 86 between the first case 49 and the second case 59 or between the first case 49 and the circuit board 37 You can also place your back. Alternatively, the first case 49 may be coated with an insulating material or surface treated to satisfy the insulating distance. In addition, various methods, structures, etc. can be applied.

Referring back to FIGS. 4 to 6, in the drawings, for example, the second case 59 is not formed in the portion where the first through hole 49a is formed, but the present invention is not limited thereto, and the second case 59 ) May be formed with an opening corresponding to the first through hole 49a. In addition, various structures in which the ribbon 122 passing through the first through hole 49a can pass through the second case 59 and be connected to the ribbon 122 may be applied to the second case 59.

The first case 49 and the second case 59 may be detachably fixed by various structures. For example, in this embodiment, a first press-fitting nut (fem nut) 490h is located in the first case 49, and a fastening hole in a portion corresponding to the first press-fitting nut 490h in the second case 59 590f) can be formed.

More specifically, the first press-fitting nut 490h and the fastening hole 590f are respectively positioned on both sides of the terminal 31 (or the first through hole 49a) to which the ribbon 122 is connected, so that the first through hole ( The first case 49 and the second case 59 are fastened at the portion where the terminal 31 to which the ribbon 122 passing through 49a) is connected is located, thereby minimizing gaps in this portion. Accordingly, the ribbon 122 can be stably fastened. At this time, the fastening part 590h in which the fastening hole 590f is formed is the inner space part 594 of the second case 59 at a position protruding from the bottom surface 594 by a height corresponding to the first press-fitting nut 490h. ) May be formed to extend to the outside from the side (5944).

The first press-fit nut 490h may be fixed to the first case 49 by a caulking process or the like. The second case 59 is removed by fastening the fastening member 68 to the first press-fitting nut 490h while the fastening hole 590f of the second case 59 is positioned above the first press-fitting nut 490h. 1 It can be fixed to the case 49. While firmly fixing the second case 59 and the first case 49 by the fastening member 68, the second case 59 can be easily separated from the first case 49 by loosening the fastening member 68. I can.

In addition, the second press-fitting nut 490i may be positioned on an edge of the first case 49 opposite to the edge where the first press-fitting nut 490h is positioned. In addition, a fastening hole 590i is formed in the second case 59 in correspondence with the second press-fitting nut 490i, and a fastening hole 37i is formed in the circuit board 37 (or the circuit board part 300). I can.

The second press-fit nut 490i may be fixed to the first case 49 by a caulking process or the like. It may have a shape protruding from the bottom surface 4944 toward the circuit board 37. Then, the fixing stability of the circuit board 37 may be further improved by performing the same role as a spacer supporting the circuit board 37 spaced apart from the first case 49 by a predetermined distance. With the fastening hole 590i of the second case 59 and the fastening hole 37i of the circuit board 37 positioned above the second press-fitting nut 590i, the first fastening member 62 is inserted into the second press-fitting nut 490i. ), it is possible to fix the second case 59 and the circuit board 37 to the first case 49. While firmly fixing the second case 59 and the circuit board 37 and the first case 49 by the first fastening member 62, the first fastening member 62 is loosened and the second case 59 and The circuit board 37 can be easily separated from the first case 49. In addition, the first grounding structure 72 may be formed by fastening the first fastening member 62 to the second press-fitting nut 490i and the fastening hole 37i. This will be described in more detail later.

Inside the case 39, a terminal 31, a bypass diode 33, an inverter member 35, and the like are positioned. In this embodiment, the terminal 31, the bypass diode 33, and the inverter member 35 are located together on the circuit board 37 and are integrated by the circuit board 37. Accordingly, in this embodiment, unlike in the related art, the terminal 31 to which the ribbon 122 is connected and the bypass diode 33 are positioned on the circuit board 37.

The circuit board 37 may be a board on which various circuit patterns (wiring, terminals, various components for connection to each other in the circuit board 37, etc.) are formed. Various structures may be used as the circuit board 37, for example, a printed circuit board may be used. In the drawings, it is illustrated that the terminal 31, the bypass diode 33, the inverter member 35, and the like are all formed on one circuit board 37 to simplify the structure. However, the present invention is not limited thereto, and a plurality of circuit boards 37 are provided, and the plurality of circuit boards 37 are different from each other (for example, a flexible printed circuit board (FPCB), It is also possible to be connected by a connector, etc. Other various modifications are possible.

In this embodiment, the terminal 31 and/or the bypass diode 33 are positioned on the circuit board 37. Accordingly, there is a difference from the prior art in which the terminal and bypass diode are located in the junction box and are not formed on the circuit board. In this way, when the terminal 31 and/or the bypass diode 33 is formed on the circuit board 37, the terminal 31 and the bypass diode 33 are connected by a circuit pattern of the circuit board 37, The bypass diode 33 and the inverter member 35 are connected by a circuit pattern of the circuit board 37 to simplify the connection structure. Further, heat dissipation characteristics can be improved by using a metal plate (for example, a copper plate) constituting the circuit board 37. In particular, the bypass diode 33 generates a lot of heat during driving. By forming the bypass diode 33 on the circuit board 37, heat dissipation characteristics can be greatly improved.

The terminal 31 is connected to the ribbon 122 drawn from the solar cell 12 and is electrically connected to the solar panel 10 to receive the DC voltage or DC current generated by the solar panel 10 It is transmitted to the pass diode 33 and the inverter member 35.

The terminal 31 to which the ribbon 122 is connected is located close to one side of the circuit board 37 (especially, one edge of the circuit board 37 adjacent to the first through hole 49a). If the terminal 31 to which the ribbon 122 is connected is located adjacent to the first through hole 49a, the path of the ribbon 122 is reduced so that the ribbon 122 can be easily fixed to the terminal 31. The fixing structure of the ribbon 122 and the terminal 31 will be described in more detail with reference to FIG. 9. 9 is a perspective view showing a terminal 31 applicable to the integrated inverter 30 of the solar cell module 100 shown in FIG. 1 and a ribbon 122 connected thereto.

Referring to FIG. 9, a plurality of terminals 31 may be formed to correspond to the ribbon 122 one-to-one corresponding to the number of ribbons 122. In this embodiment, the terminal 31 may have a structure in which the ribbon 122 is detachable. For example, the terminal 31 of the present exemplary embodiment may include an upper portion 312 positioned above the ribbon 122 and a lower portion 314 positioned below the ribbon 122. The upper portion 312 is fixed to the circuit board 37 at a position on one side of the ribbon 122 and extends from the first upper portion 312a to the upper portion of the one side of the ribbon 122, and the ribbon 122 It may include a second upper portion 312b that is fixed to the circuit board 37 at the other side and extends from the upper portion of the other side of the ribbon 122 to be spaced apart from the first upper portion 312a. And the lower part 314 positioned below the first upper part 312a and the second upper part 312b is located farther from the first through hole 49a than the first and second upper parts 312a and 312b. After being fixed to the circuit board 37 at a portion and extending upward therefrom, it may extend in parallel with the ribbon 122 so as to cross the first and second upper portions 312a and 312b. In addition, a portion of the lower portion 314 that crosses the first and second upper portions 312a and 312b may be formed such that the center portion protrudes above the end portion. Then, the center portion of the lower portion 314 is positioned closer to the first and second upper portions 312a and 312b than the end portions.

The upper part 312 and the lower part (with the lower part 314 of the terminal 31) pressed downward to increase the gap between the upper part 312 and the lower part 314 After inserting the ribbon 122 between the 314 and removing the force pressing the lower part 314 of the terminal 31, the lower part 314 moves toward the upper part 312 and the upper part 312 (particularly, The ribbon 122 is fixed between the middle portion of the upper portion 312) and the lower portion 314. When removing the ribbon 122, by pressing down the portion fixed to the circuit board 37 from the lower portion 314, and extending the gap between the upper portion 312 and the lower portion 314, the ribbon 122 is removed. do.

The upper portion 312 and the lower portion 314 of the terminal 31 may be fixed to the circuit board 37 by various methods. For example, latch structures (or locking portions) 312c and 314c are formed in portions fixed to the circuit board 37 in the upper portion 312 and the lower portion 314, and positions corresponding to the circuit board 37 A locking hole 37c may be formed in the. Accordingly, the terminal 31 can be easily detached by inserting or disassembling the latch structures 312c and 314c of the upper part 312 and the lower part 314 into the locking hole 37c of the circuit board 37. . However, the present invention is not limited thereto, and the terminal 31 may be fixed on the circuit board 37 in a detachable manner, and various modifications are possible.

As the terminal 31 has a structure in which the ribbon 122 can be detached, the ribbon 122 is easily separated from the terminal 31 when repair, replacement, etc., and the ribbon 122 is removed again when necessary. Can be easily connected. However, the present invention is not limited thereto, and the terminal 122 may have various structures. In addition, the terminal 31 may be formed of a metal pad or a soldering pad, so that the ribbon 122 may be bonded to the terminal 31 by welding or soldering. Accordingly, the ribbon 122 may be fixed to the terminal 31 so as not to be detachable. Then, the structure of the terminal 31 can be simplified and cost can be reduced.

Referring back to FIGS. 4 to 6, a bypass diode 33 connected to the terminal 31 by a circuit pattern extending from the terminal 31 is positioned on the circuit board 37. The bypass diodes 33 are provided in one less number (n-1) than the number of terminals 31 (n). Each bypass diode 33 may be connected to the two terminals 31 between the two terminals 31 by a circuit pattern. When an area where power generation does not occur due to occurrence of a portion covered by the solar panel 10 or a breakdown occurs, the bypass diode 33 bypasses the corresponding portion to allow current to flow to protect the corresponding area. do. Various known structures may be applied as the structure of the bypass diode 33.

In addition, an inverter member 35 connected to the bypass diode 33 by a circuit pattern extending from the bypass diode 33 is positioned on the circuit board 37. The inverter member 35 serves to convert the direct current (or direct voltage) provided from the bypass diode 33 into an alternating current (or alternating voltage). The inverter member 35 includes a DC-AC inverter 352 for converting DC current into AC current, and in addition, a current sensor 354 for stably converting DC current to AC current, capacitor 356, DC -It may include a DC converter 358 and the like. The current sensor 354, the capacitor 356, the DC-DC converter 358, the DC-AC inverter 352 and the like constituting the inverter member 352 are a terminal 31 and/or a bypass diode 33. And the circuit board 37 or a circuit pattern formed thereon may be integrated.

The current sensor 354 is connected to a circuit pattern extending from the bypass diode 33, and is connected to a capacitor 356, a DC-DC converter 358, a DC-AC inverter 352, and the like by a circuit pattern. The current sensor 354 detects an abnormality in the current provided by the bypass diode 33, a problem, etc., and stops the operation of the capacitor 356, the DC-DC converter 358, the DC-AC inverter 352, and the like. Plays a role. In this embodiment, the bypass diode 33 and the current sensor 354 may be connected by a circuit pattern formed on the circuit board 37 inside the same case 39. By connecting the bypass diode 33 and the current sensor 354 in this way, since a separate output cable or the like is not required, the structure can be simplified.

In addition, a capacitor 356 that stores a DC current that has passed through the current sensor 354 and transfers a constant voltage current to the DC-DC converter 358 is connected to the current sensor 354. The current sensor 354 and the capacitor 356 may also be connected by a circuit pattern formed on the circuit board 37 in the same case 39.

The current of the voltage uniformized in the capacitor 356 may be transferred to the DC-DC converter 358 and converted into another DC voltage of a certain level. In this embodiment, a plurality of DC-DC converters 358 may be provided. When a plurality of DC-DC converters 358 are provided as described above, the thickness of each DC-DC converter 358 can be reduced compared to that provided with one DC-DC converter 358, whereby the integrated inverter 30 The thickness of the can be made smaller than the height of the extension (24). However, the present invention is not limited thereto, and it is also possible to include one DC-DC converter 358.

The DC current or DC voltage passing through the DC-DC converter 358 may be transferred to the DC-AC inverter 352 and converted into an AC current or an AC voltage. The generated AC current or AC voltage is connected to the DC-AC inverter 352 and transmitted to the outside by the AC output cable 38 passing through the second through hole 49b of the case 39. For example, it is connected to another solar cell module 100 by an AC output cable 38, or transmitted to a power grid or a power system.

Various structures known as the DC-AC inverter 352, the current sensor 354, the capacitor 356, and the DC-DC converter 358 may be applied. In addition, various components such as a control member and a communication member may be positioned on the circuit board 37.

As shown in FIG. 6, the circuit board 37, the bypass diode 33, the inverter member 35, and the like positioned on the circuit board 37 may be integrally wrapped by the potting member 372. . In this embodiment, the potting member 372 may be formed to fill the interior of the inner space 594 of the second case portion 590.

In this embodiment, the potting member 372 may be formed to cover the bypass diode 33, the inverter member 35, the circuit board 37, etc. while exposing the terminal 31 to which the ribbon 122 is connected. . Since the terminal 31 is a part to which the ribbon 122 is connected, if the terminal 31 is covered by the potting member 372, the terminal 31 is due to the potting member 372 when replacement of the circuit board part 300 is required. The ribbon 122 connected to the terminal 31 cannot be separated from the terminal 31. Accordingly, the ribbon 122 can be cut in the middle to use only the portion exposed to the outside of the potting member 372, so that the length of the ribbon 122 is shortened and the terminal 31 of the circuit board portion 300 to be replaced newly ) Can be difficult to reach. In addition, if the potting member 372 is also present in the terminal 31 of the circuit board 300 to be replaced, it may be impossible to connect the ribbon 122 to the terminal 31 itself.

Considering this, in the present embodiment, the potting member 372 is formed to expose the terminal 31. Accordingly, when the circuit board part 300 needs to be replaced, when the terminal 31 and the ribbon 122 are detachably fixed, the ribbon 122 is separated from the terminal 31, and the terminal 31 and the ribbon When (122) is fixed by welding or the like, the ribbon 122 can be easily separated from the terminal 31 by removing the ribbon 122 from the terminal 31. Accordingly, it is possible to maintain the original length of the ribbon 122. In addition, the ribbon 122 can be easily fixed or connected to the exposed terminal 31 of the newly replaced circuit board part 300.

At this time, in this embodiment, a partition wall member that separates and divides the first region A1 where the terminal 31 is located and the second region A2 where the bypass diode 33, the inverter member 35, and the like are located. 60 can be formed. In addition, the potting member 372 may be positioned in the second area A2 (or while covering the second area A2 or surrounding the second area A2). When the partition member 60 is formed in this way, even if the potting member 372 having fluidity is used during the process, the potting member 372 flows toward the terminal 31 and is physically prevented from being formed on a part of the terminal 31 Thus, the terminal 31 can be completely exposed.

The partition member 60 is formed so that the first area A1 and the second area A2 can be separated and partitioned, while the ribbon 122 is easily formed as the first area A1 where the terminal 31 is located. It may have a shape that allows it to flow in. For example, the partition member 60 may have an opening through which the ribbon 122 may pass, corresponding to a path through which the ribbon 122 passes. Alternatively, the partition member 60 may have a shape in which a portion or a surface corresponding to a path through which the ribbon 122 passes is opened. When the part or the surface is removed in this way, the part may be viewed as an opening.

As described above, the terminal 31 of the present embodiment may be positioned adjacent to one side of the circuit board 37 adjacent to the first through hole 49a. In this case, the partition member 60 has an opening on one side of the circuit board 37 adjacent to the first through hole 49a, or the corresponding portion is not formed so that the portion adjacent to the first through hole 49a is opened. I can. Accordingly, the connection with the ribbon 122 can be made easily. In addition, the partition member 60 may be formed to surround the edge of the terminal 31 except for one side described above. Accordingly, inflow of the potting member 372 can be effectively prevented in portions other than the portion connected to the ribbon 122.

The partition member 60 may be fixed to the circuit board 37. Accordingly, it can be stably fixed between the terminal 31 and the bypass diode 33 and the inverter member 35 by a simple structure. The partition member 60 may be located detachably from the circuit board 37. For example, a locking groove 37a is formed in the circuit board 37, and a locking portion 60a that is caught in the locking groove 37a may be formed at an end of the partition member 60 adjacent to the circuit board 37. have. The locking part 60a may have a kind of latch structure. That is, the locking portion 60a includes a latch portion 60b that gradually increases in width from an end portion having a narrow width and then decreases with a step difference. Accordingly, when pressure is applied to insert the end of the latch portion 60b into the locking groove 37a, the width of the latch portion 60b gradually increasing when passing through the locking groove 37a passes the wide width of the latch portion 60b. It serves as a locking jaw preventing passage through the locking groove 37a in the opposite direction. Accordingly, the locking portion 60a remains fixed to the locking groove 37a without additional pressure. When separation is required, if pressure is applied to the latch portion 60b in the opposite direction, the latch portion 60b may be separated from the locking groove 37a. With this structure, the partition member 60 can be fixed to the circuit board 37 through an easy and simple structure. Further, the partition member 60 can be easily applied by forming the engaging groove 37a without significantly changing the design of the circuit board 37 used in the prior art. In addition, when a defect of the circuit board 37 or the partition member 60 is found, it can be easily separated or replaced.

The partition member 60 is located at an end of the partition wall portion 610 extending perpendicular to the circuit board 37 and the partition wall portion 610 adjacent to the circuit board 37 and has a larger width than the partition wall portion 610. The branches may include a bottom portion 620. The partition wall portion 610 is not formed on the first side (upper side of the drawing) adjacent to the first through hole 49a of the terminal 31, but is opposite to the first through hole 49a. It may be formed to be connected to the lower side) and the third side and the fourth side positioned on both sides (left and right side of the drawing) of the terminal 31. Accordingly, it may be formed to surround at least three edges of the terminal 31. The bottom portion 620 may have a substantially the same or similar shape as the partition wall portion 610, but may be formed to have a larger width than the partition wall portion 610. Accordingly, the potting member 372 between the partition member 60 and the circuit board 37 is maximized by maximizing the contact area between the partition member 60 and the circuit board 37 in a portion adjacent to the circuit board 37. You can prevent it from flowing as much as possible. In addition, the locking portion 60a that is caught in the locking groove 37a of the circuit board 37 is formed to extend from the bottom portion 620 to improve structural stability of the locking portion 60a.

Portions constituting the third side and the fourth side of the partition member 60 may be fixed to the side surface 5944 of the second case 59. Accordingly, a path through which the potting member 372 can be introduced can be effectively blocked.

An end portion of the partition wall member 60 adjacent to the first through hole 49a may have a protrusion 60c fitted into the side surface 5944 of the second case 59. In addition, a side surface of the second case 59 may include an insertion groove 590c into which the protrusion 60c is inserted. The protrusion 60c and the insertion groove 590c may be fixed to each other by fitting. Accordingly, the end of the partition member 60 adjacent to the circuit board 37 is fixed to the circuit board 37 by the locking portion 60a, and the end of the partition member 50 adjacent to the first through hole 49a is It is fixed to the side surface 5944 of the second case 59. Alternatively, it is possible to place a separate adhesive or the like between the protrusion 60c and the insertion groove 590c. Alternatively, the potting member 372 may prevent further potting members 372 from passing through and inflow between the protrusions 60c and the insertion groove 590c by filling and bonding them. Other variations are possible.

Such protrusions 60c are formed to protrude more than one side of the circuit board 37 adjacent to the first through hole 49a, that is, cross all the circuit board 37 adjacent to the first through hole 49a. Since it is formed to protrude, a path through which the potting member 372 may be introduced can be effectively prevented.

In this way, while the circuit board part 300 and the partition member 60 are located inside the second case 59, a potting member 372 having fluidity such as a liquid state or a gel state is poured into the second region A2. Later, while the potting member 372 is hardened by drying and/or heat treatment, the potting member 372 may cover the second region A2. The potting member 372 that easily covers the circuit board part 300 without having a separate mold by inserting the potting member 372 in the state where the circuit board part 300 is located in the second case 59 as described above. Can be formed. At this time, by using the partition member 60, the potting member 372 is not formed in the first region A1 where the terminal 31 is located, and the potting member 372 is entirely provided in the other second region A2. Can be formed. As a result, the potting member 372 may be formed while covering the bypass diode 33, the inverter member 35, and the circuit board 37 positioned in the second region A2 excluding the first region A1. .

In the above description, the first region into which the potting member 372 flows into the upper portion of the circuit board 37 (that is, the portion opposite to the bottom surface 5944 of the second case 59) by the partition member 60 It has been described that (A1) and the second area (A2) are divided. However, the present invention is not limited thereto, and it is possible to divide it into a part of the second case 59 rather than a separate configuration such as the partition member 60.

For example, a structure that prevents the inflow of the potting member 372 by forming a partition wall portion 5960 that is formed of a protrusion protruding from the bottom surface 5944 of the second case 59 to separate and partition the area. Can be formed. In this case, the shape of the first region A1 located above the circuit board 37 and partitioned by the partition member 60 and the bottom surface of the second case 59 located below the circuit board 37 ( The planar shape of the area partitioned by the partition wall portion 610 formed in 5944 may be different from each other. For example, in the present embodiment, the partition wall portion 5960 may have a shape in which the portion where the terminal 31 is formed and the portion where the capacitor 356 is formed are separated from other portions, unlike the partition member 60. have. This is because the shape of the portion where the potting member 372 does not flow can be freely designed according to the arrangement of components, etc. located above and below the circuit board 37. Other variations are possible.

In the above description, that the potting member 372 covers an object such as the bypass diode 33 and the inverter member 35 includes covering the entire object, but also covering only a part of the object. That is, when there is a portion processed to have an insulating characteristic in the bypass diode 33, the inverter member 35, or the like, only portions other than the portion may be covered. For example, only a portion corresponding to a circuit pattern such as a wiring exposed to the outside from the bypass diode 33 and the inverter member 35 may be partially covered. Accordingly, it can be considered that the bypass diode 33, the inverter member 35, etc. covering the circuit pattern, etc. are also potted by the potting member 372. In addition, at least one of the DC-AC inverter 352, the current sensor 354, the capacitor 356, and the DC-DC converter 358 constituting the inverter member 35 is covered by the potting member 372. It can be considered that the inverter member 35 is ported by the potting member 372 even though it is ported and other components are not covered by the potting member 372. For example, according to an embodiment, the capacitor 356 may not be potted by the potting member 372.

As described above, according to the present embodiment, the first case portion 491 may be opened while the first case portion 491 is fixed to the solar panel 10 to repair or replace the circuit board portion 300. Accordingly, it is possible to easily repair and replace the circuit board unit 300. In addition, even when the circuit board part 300 needs to be replaced, only the circuit board part 300 needs to be replaced, so that the first case 49 can be used as it is. Accordingly, even in the event of a failure of the integrated inverter 30, the first case 49 can be used as it is, thereby reducing repair costs. In particular, when the first case 49 is made of metal in order to improve durability, etc., the repair cost can be greatly reduced.

Hereinafter, the grounding structure of the integrated inverter 30 according to the present embodiment will be described in detail with reference to FIGS. 10A, 10B and 10C. 10A, 10B, and 10C are cross-sectional views respectively showing first to third ground structures 72, 74, and 76 applied to the integrated inverter 30 shown in FIG. 4. Here, FIG. 10A is a cross-sectional view taken along line A-A of FIG. 4, FIG. 10B is a cross-sectional view taken along line B-B of FIG. 4, and FIG. 10C is a cross-sectional view taken along line C-C of FIG. 4. In FIGS. 10A to 10C, a simplified diagram mainly focuses on parts necessary for explanation.

Referring to FIGS. 10A to 10C, in this embodiment, grounding by the first case 49 may be achieved by fastening the first to third fastening members 62, 64, and 66. In this case, the first to third fastening members 62, 64, and 66 may include a conductive material (eg, metal). In addition, the first case 49 may include a conductive material layer 47 and a surface treatment layer 48 formed on the surface of the conductive material layer 47. In addition, in the portion where the second and third fastening members 64 and 66 fastened to the first case 49 are located, at least a portion of the surface treatment layer 48 is removed to expose the conductive material layer 47 A grounding structure may be implemented by forming 48a and electrically connecting the second and third fastening members 64 and 66 and the conductive material layer 47 to each other through the contact portion 48a. This will be described in more detail.

Referring to FIG. 10A, the first ground structure 72 is formed on the circuit board 37 at a position corresponding to the second press-fit nut 490i and the second press-fit nut 490i located in the first case 49 It may be composed of a fastening hole (37i) and a first fastening member 62 that is fastened to the press-fit nut (490i) through the fastening hole (37i). That is, the fastening hole 37i of the circuit board 37 on the second press-fitting nut 490i protruding toward the circuit board 37 from the bottom surface 494 of the inner space 494 of the first case 49 When the first fastening member 62 is fastened in a state in which is positioned, the inner surface of the second press-fitting nut 490i and the screw portion 62a of the first fastening member 62 are in contact with each other, thereby grounding may be achieved.

The second press-fit nut 490i is made of a conductive material, and can be easily electrically connected by the screw portion 62a of the first fastening member 62 in contact with the inner surface of the second press-fit nut 490i. In addition, the inner surface of the head portion 62b of the first fastening member 62 may be connected to the circuit board 37, a metal plate constituting the circuit board 37, or a circuit pattern of the circuit board 37.

However, the present invention is not limited thereto, and the second press-fit nut 490i is formed of an insulating material on the surface, such as the first case portion 491 or the second case portion 492 of the first case 49. It is also possible to provide a surface treatment layer 48. When the surface treatment layer 48 is provided as described above, the surface of the inner surface of the second press-fit nut 490i by the screw portion 62a when the first fastening member 62 is fastened to the second press-fit nut 490i. The treatment layer 48 is removed so that the screw portion 62a and the conductive material may contact. Alternatively, prior to fastening of the first fastening member 62, a separate process of removing the surface treatment layer 48 from the inner surface of the second press-fitting nut 490i is performed, so that the first fastening member 62 and the second press-fitting nut ( It is also possible to stably contact the conductive material of 490i). Other variations are possible.

When the second press-fitting nut 490i and the circuit board 37 are connected by the first fastening portion 62 as described above, the circuit board 37 can be stably grounded to the first case 49. Accordingly, a circuit board 37 including various circuit patterns, bypass diodes 33, inverter members 35, etc. is connected to the first case 49 (more precisely, the first case portion 491). A ground passage is formed to maintain the potential of the circuit board 37 to ground.

In this way, the first ground structure 72 is fastened to the second press-fitting nut 490i located in the first case 49 and the fastening hole 37i formed in the circuit board 37. If formed by the method, the first ground structure 72 can be formed by a simple structure and process. In addition, by physically fixing the first case 49 and the circuit board 37 by the first fastening member 62, the fixing stability of the first case 49 and the circuit board 37 may be improved.

Referring to FIG. 10B, the second grounding structure 74 may be configured by fastening the fastening portion 49c of the first case 49 and the frame 20 by the second fastening member 64. That is, the fastening hole 490c of the fastening part 49c in a state in which the fastening part 491c of the fastening part 49c of the first case 49 is in contact with the inner surface of the second part 244 of the frame 20 And fastening the second fastening member 64 to the fastening hole 244c of the second part 244 to form a second grounding structure 74. In this case, the frame 20 may be made of a conductive material and may have excellent durability capable of withstanding external impact. For example, the frame 20 may be made of metal or the like.

At this time, the surface treatment layer 48 of the first case 49 is removed from the inner surface of the fastening hole 490c where the second fastening member 64 is located, and the contact portion 48a to which the conductive material layer 47 is exposed. ) Is formed. The shape of the contact portion 48a will be described in more detail later with reference to FIGS. 11A to 11D.

In this way, when the fastening part 491c and the second part 244 are fastened by the second fastening member 64, the first case 49 (more precisely, the first case part 491) and the frame ( 20) can be connected to form a grounding path. In this way, the circuit board 37 and the first case 49 are grounded by the first grounding structure 72, and the first case 49 and the frame 20 are grounded by the second grounding structure 74. Thus, a ground path to the circuit board 37, the first case 49, and the frame 20 may be formed. Accordingly, the first case 49, the frame 20, and the like constituting the solar cell module 100 may form a ground path, so that a grounding structure with a ground (for example, the ground) can be simply implemented. In addition, the frame 20 may be connected to the frame 20 of the adjacent solar cell module 100 to form a continuous ground structure. In addition, a ground line or a ground structure connected to the ground (for example, the ground) may be positioned on the frame 20.

When the second ground structure 74 is formed by fastening the fastening portion 491c and the second portion 244 by the second fastening member 64, the second grounding structure ( 74) can be formed. In addition, by physically fixing the first case 49 and the frame 20 by the second fastening member 64, the first case 49 may be firmly fixed to the solar cell module 100.

However, the present invention is not limited thereto, and it is also possible not to include the second ground structure 74. For example, when the frame 20 does not contain a conductive material, the second ground structure 74 is not provided. Then, it is possible to separately position a ground wire for grounding with a ground (eg, the ground) in the first case 49. Other variations are possible.

Referring to FIG. 10C, the third grounding structure 76 includes extended portions 492c, 493c, and 494c (in particular, the second extended portion 493c) and the second case portion 492 of the first case portion 491. It may be configured by fastening the fixing portion (49d) of the third fastening member (66). That is, in a state in which the second extension part 493c of the fastening part 49c of the first case 49 and the first fixing part 491d of the fixing part 49d are in contact with each other, the second extension part 493c is The third grounding structure 76 is formed by fastening the third fastening member 66 to the fastening hole 490e and the fastening hole 490g of the first fixing part 491d.

At this time, the surface treatment layer 48 of the first case 49 is removed from the inner surfaces of the fastening holes 490e and 490g in which the third fastening member 66 is located, and the contact portion where the conductive material layer 48 is exposed. (48a) is formed. The shape of the contact portion 48a will be described in more detail later with reference to FIGS. 11A to 11D.

In this way, when the fastening part 49c and the fixing part 49d are fastened by the third fastening member 66, the first case part 491 and the second case part 492 are connected to form a ground path. I can. In this way, the circuit board 37 and the first case portion 491 are grounded by the first ground structure 72, and the first case portion 491 is connected to the second case portion 492 and the third ground structure 76 When the first case portion 492 and the frame 20 are grounded by the second grounding structure 74, the circuit board 37 and the first and second case portions of the first case 49 ( 491, 492, and a ground path to the frame 20 may be formed. Accordingly, the first and second case portions 491 and 492 of the first case 49 constituting the solar cell module 100, the frame 20, and the like are configured to form a ground path, without the addition of additional components, etc. A grounding structure with ground (for example, the ground) can be simply implemented.

When the third grounding structure 76 is formed by fastening the third fastening member 66 to the fastening portion 49c and the fixing portion 49d, the third grounding structure 76 is formed by a simple structure and process. Can be formed. In addition, by physically fixing the first case part 491 and the second case part 492 by the third fastening member 66, the first and second case parts 491 and 492 can be more firmly fixed. have.

In this embodiment, it is illustrated that the second case portion 492 includes the conductive material layer 47 and the surface treatment layer 48, like the first case portion 491. In this way, when the second case portion 492 includes the conductive material layer 47 and the surface treatment layer 48, the strength, corrosion resistance, and appearance of the first case 49 may be improved. However, the present invention is not limited thereto, and the second case portion 492 may be formed of a material different from that of the first case portion 491. For example, the second case portion 492 may be made of an insulating material to have insulating properties. As described above, when the second case portion 492 is made of an insulating material, the third ground structure 76 may not be formed.

In the present embodiment, the surface treatment layer 48 of the first case 49 is removed from the portion where the second and third fastening members 64 and 66 are positioned to form the contact portion 48a, various examples of which With reference to FIGS. 11A to 11D will be described in detail. 11A to 11D are views showing various examples of the contact portion 48a by the third fastening member 66 shown in FIG. 10C. The description of the contact portion 48a by the third fastening member 66 described with reference to FIG. 11 is the contact portion 48a by the second fastening member 64 and the second ground structure 74 formed thereby. It can also be applied to the description of Accordingly, a description of the second fastening member 64 is replaced with a description of the third fastening member 66, and a detailed description thereof will be omitted. In FIGS. 11A to 11D, a portion corresponding to portion B of FIG. 10C is shown.

As shown in FIG. 11A, the contact portion 48a is entirely removed from the portion corresponding to the head portion 66b and the screw portion 66a of the third fastening member 66, and is adjacent to the third fastening member 66. The conductive material layer 47 may be exposed at the portion. That is, the contact portion 48a is entirely formed on the inner surfaces of the fastening holes 490e and 490f contacting the screw portion 66a, and is entirely on the surface of the first case 49 contacting the inner surface of the head portion 66b. Can be formed. These contact portions 48a are laser-processed or mechanically processed (for example, on a portion corresponding to the head portion 66b and the screw portion 66a of the third fastening member 66) before fastening the third fastening member 66. For example, it may be formed by performing an end mill processing) or the like. If the contact portion 48a is entirely formed through laser processing or mechanical processing as described above, the ground structure can be formed more stably in the third ground structure 76.

Alternatively, as shown in FIG. 11B, the contact portion 48a may be formed to partially expose portions corresponding to the head portion 66b and the screw portion 66a of the third fastening member 66. When the third fastening member 66 is fastened to the fastening holes 490e and 490g, the contact part 48a is a surface treatment of the first case 49 at the portion where the third fastening member 66 is in contact or in close contact with it. It can be formed by cutting off the layer 48. At this time, a protrusion P protruding toward the first case 49 may be formed on the head portion 66b to effectively remove the surface treatment layer 48. The protrusion P may have various shapes, for example, when viewed in a plan view, it may have various shapes such as a comb pattern, a square pattern, a circle pattern, and a star pattern.

For example, a contact portion 48a may be formed in a shape corresponding to the screw portion 66b on inner surfaces of the fastening holes 490e and 490g that are in close contact with the screw portion 66b of the third fastening member 66. That is, the surface treatment layer 48 is removed in a shape corresponding to the protruding thread portion of the screw portion 66b passing through the inner surfaces of the fastening holes 490e and 490g, and the contact portion 48a also has a thread shape. Can be formed to In addition, a portion corresponding to the protrusion P of the head 66b is removed from the surface of the first case 49 in close contact with the head 66b of the third fastening member 66 to form a contact portion 48a. can do.

When the contact portion 48a is formed when the third fastening member 66 is fastened as described above, productivity may be improved because a separate process for forming the contact portion 48a is not required.

11B illustrates that the protrusion P is formed on the inner surface of the head 66b. However, the present invention is not limited thereto. As another example, as shown in FIG. 11C, a washer member 67 having a protrusion P is further positioned between the first case 49 and the head 66b to form the head of the third fastening member 66. It may be formed to partially expose a portion corresponding to (66b). The washer member 67 may have a shape such as a ring shape or an annular shape having a fastening hole through which the third fastening member 66 can pass, and a protrusion (P) on a surface in close contact with the first case 49 ) Can be provided. The protrusion P may have various shapes, for example, when viewed in a plan view, it may have various shapes such as a comb pattern, a square pattern, a circle pattern, and a star pattern.

When the washer member 67 is used as described above, pressure can be more effectively applied to the surface treatment layer 48 of the first case 49 corresponding to the head portion 66b, thereby forming the contact portion 48a more easily. can do. In addition, it can be easily applied to the process by additionally using a washer member 67 having a desired shape.

Alternatively, as shown in FIG. 11D, the surface treatment layer 48 is partially removed from the portion of the first case 49 in contact with the threaded portion 66a of the third fastening member 66 to form the contact portion 48a. ) Is partially formed and the surface treatment layer 48 is entirely removed from the portion in contact with the head portion 66b, so that the contact portion 48a may be formed entirely. This improves the stability of the grounding structure by forming the contact portion 48a in advance in the portion corresponding to the head portion 66b, and has a generally small size, so that the surface treatment layer 48 on the inner surfaces of the fastening holes 490e and 490g is removed. It is to improve productivity by forming the contact portion 48a when the screw portion 66a is fastened to the inner surface of the contact portion 48a, which is difficult to perform. As another example, the contact portion 48a may be partially formed at the portion corresponding to the head portion 66b, and the contact portion 48a may be formed entirely at the portion corresponding to the screw portion 66a. Other variations are possible.

In the present embodiment, it is illustrated that the first ground structure 72 is formed by connecting the circuit board 37 and the first case portion 491, but the present invention is not limited thereto. Accordingly, the circuit board 37 may be connected to the second case portion 492 to form the first ground structure 72. Other variations are possible.

The integrated inverter 30 of the solar cell module 100 having the above-described structure includes a terminal 31 connected to the ribbon 122 and/or a bypass diode 33 providing a bypass path, and a direct current into an alternating current. The switching inverter member 35 is integrally formed or integrated. By being formed by integrating them, the installation process can be simplified and the structure can be simplified. In addition, by connecting the bypass diode 33 and the inverter member 35 in a circuit pattern, it is not necessary to use an output cable (ie, a DC output cable) or the like for connecting them, thereby simplifying the structure and providing the output cable. Damage to the solar panel 10 that may occur may be prevented.

On the other hand, conventionally, the junction box and the inverter are manufactured separately and fixed to a solar panel or frame, respectively, and then the (+) output cable and the (-) output cable of the junction box must be connected to the inverter. And the AC output cable of the inverter will also exist. Then, the installation space is increased, the installation time is lengthened, and the solar panel 10 is impacted during transportation or use by the three output cables, so that damage or failure of the solar panel 10 may occur.

In addition, by separating the circuit board part 300 from the first case 49, it is possible to repair, replace, etc., thus improving the workability of repairing and replacing the integrated inverter 30 and minimizing the cost required for replacement. . In this embodiment, since the first ground structure 72 of the integrated inverter 30 is configured using the first case 49 constituting the integrated inverter 30, the reliability of the circuit board 37 while simplifying the ground structure It is possible to secure and improve the stability of the integrated inverter 30. In this case, if the first case 49 and the frame 20 are grounded by the second grounding structure 74, a grounding path can be sufficiently formed to simplify the grounding structure with the ground (for example, the ground) as much as possible. And when the first case 49 includes the first and second case parts 491 and 492 so that the circuit board part 300 can be easily positioned therein, the third grounding structure 74 By grounding, electrical stability of the integrated inverter 30 may be further improved. Accordingly, it is possible to minimize safety accidents such as electric leakage or electric shock.

Features, structures, effects, etc. according to the above are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in each embodiment may be combined or modified for other embodiments by a person having ordinary knowledge in the field to which the embodiments belong. Accordingly, contents related to such combinations and modifications should be interpreted as being included in the scope of the present invention.

100: solar cell module
10: solar panel
20: frame
30: integrated inverter
31: terminal
33: bypass diode
35: Inverter absence
37: circuit board
39: case
62: first fastening member
64: second fastening member
66: third fastening member
72: first ground structure
74: second ground structure
76: third ground structure

Claims (20)

Solar panels;
A frame fixing the solar panel; And
An inverter member including a terminal connected to the solar panel, a DC-AC inverter electrically connected to the terminal, a circuit board on which the terminal and the inverter member are located, and a case accommodating the circuit board Integrated inverter
Including,
The case includes a first case portion and a second case portion coupled to the first case portion,
An aspect including a first grounding structure for grounding the case and the circuit board, a second grounding structure for grounding the case and the frame, and a third grounding structure for grounding the first case portion and the second case portion Battery module. The method of claim 1,
The solar cell module in which the case includes a conductive material layer. delete The method of claim 1,
The first ground structure,
A press-fit nut located in the case;
A fastening hole formed in the circuit board formed at a position corresponding to the press-fit nut; And
A first fastening member through the fastening hole and fastened to the press-fit nut
A solar cell module comprising a. The method of claim 4,
The solar cell module in which the press-fit nut is made of a conductive material. The method of claim 4,
The press-fit nut is formed to protrude from the bottom surface of the case. delete The method of claim 1,
The case includes a fastening portion coupled to the frame,
A solar cell module configured to configure the second ground structure by fastening the fastening portion and the frame by a second fastening member. The method of claim 8,
The fastening part includes a fastening part contacting the inner surface of the frame,
A solar cell module configured to configure the second ground structure by fastening the fastening portion and the frame by the second fastening member. delete The method of claim 1,
The first case portion includes a fastening portion,
The second case portion includes a fixing portion extending to contact at least a portion of the fastening portion,
A solar cell module configured to form the third ground structure by fastening the fastening part and the fixing part by a third fastening member. The method of claim 11,
The fastening part includes a fastening part and an extension part connected from the fastening part to an inner space part of the first case part,
The fixing part is in contact with the extension part,
A solar cell module configured to form the third ground structure by fastening the extension portion and the fixing portion by the third fastening member. The method of claim 1,
The first case portion has an inner space portion and a fastening portion in close contact with the frame,
The second case portion has a fixing portion in close contact with the fastening portion and is coupled to the first case portion,
The first ground structure grounds the internal space portion and the circuit board,
The second grounding structure grounds the fastening portion and the frame,
The solar cell module in which the third grounding structure grounds the fastening portion and the fixing portion. The method of claim 1,
At least one of the first to third ground structures is formed by fastening of a fastening member,
The case includes a conductive material layer and a surface treatment layer formed on the surface of the conductive material layer,
In a portion where the fastening member is located, at least a portion of the surface treatment layer is removed to form a contact portion exposing the conductive material layer, and the fastening member and the conductive material layer contact each other through the contact portion. The method of claim 14,
The fastening member includes a screw portion fastened to the case, and a head portion connected to the screw portion and having an inner surface adjacent to the case,
A solar cell module in which the contact portion has a shape corresponding to the shape of the screw portion in the portion where the screw portion is located. The method of claim 15,
A protrusion is formed on the inner surface of the head portion adjacent to the case,
A solar cell module in which the contact portion has a shape corresponding to the protrusion in a portion where the head portion is located. The method of claim 15,
Further comprising a washer member positioned between the head and the case and having a protrusion,
A solar cell module in which the contact portion has a shape corresponding to the protrusion in a portion where the head portion is located. The method of claim 14,
The fastening member includes a screw portion and a head portion connected to the screw portion,
The solar cell module wherein the contact portion is entirely formed in a portion corresponding to at least one of the screw portion and the head portion. The method of claim 1,
Further comprising a bypass diode electrically connected to the terminal and the inverter member between the terminal and the inverter member,
The solar cell module in which the bypass diode is located on the circuit board. delete

Images