KR100811861B1 - Method for manufacturing of tactile sensor - Google Patents

Abstract

The present invention relates to a method for manufacturing a tactile sensor that can simplify a manufacturing process and accurately detect contact information. The present invention relates to a method for forming a coating layer and a metal layer in order on a polymer film having a predetermined thickness, and on a metal layer. By forming a resistor, a top plate of the tactile sensor is manufactured, a coating layer and a metal layer are sequentially formed on a polymer film having a predetermined thickness, a resistor is formed on the metal layer, and a spacer having a predetermined thickness is formed on the metal layer except for the resistor. After the lower plate is manufactured, the haptic sensor is manufactured by bonding the resistors of the manufactured upper plate and the resistors of the lower plate to face each other, thereby simplifying the manufacturing process of the tactile sensor.

Tactile sensor, manufacturing method, signal processing

Description

Method for manufacturing tactile sensor {Method for manufacturing of tactile sensor}

Figure 1a to 1c is a view for explaining the principle of the force sensor-based tactile sensor in the present invention, Figure 1a is a front and rear view of the tactile sensor, Figure 1b is a side view of the tactile sensor, Figure 1c of the tactile sensor Side view of the tactile sensor completed by bonding the upper and lower plates.

2a to 2j is a process chart showing a tactile sensor manufacturing method according to the present invention.

Figure 3 is a block diagram showing the configuration of a signal processing device of the tactile sensor manufactured in the present invention.

Figure 4 is a circuit diagram of one embodiment of the tactile sensor module in the present invention.

프로그램의 화면 표시 일 예도.5 is used in the information indicator

An example of the screen display of the program.

<Explanation of symbols for the main parts of the drawings>

101, 111... Kapton polyimide film

102, 112... Coating layer

103, 113... Metal layer

104, 114... Resistor (register)

115... Spacer

The present invention relates to a tactile sensor, and more particularly, to a manufacturing method of a tactile sensor capable of simplifying a manufacturing process and accurately detecting contact information.

At present, the tactile function of acquiring information on the surrounding environment through contact, such as contact force, vibration, surface roughness, and temperature change for thermal conductivity, is recognized as a next-generation information collection medium. The mimic tactile sensor is not only used for various medical diagnosis and procedures such as microsurgery and cancer diagnosis in blood vessels, but also because of its importance, it can be applied to tactile presentation techniques that are important in the virtual environment realization technology.

The biomimetic tactile sensor has been developed to detect contact pressure and instant slippage for the gripper of the robot and the six-way inductive force / torque sensor already used on the wrist of an industrial robot. Due to the relatively large size of wealth, it has a problem of low sensitivity.

Although the development of tactile sensors has been shown using micro electro mechanical systems (MEMS) manufacturing technology, they are only designed to obtain information on contact force, so they can be used to collect information about the external environment. It was limited.

In particular, the conventional tactile sensors as described above had a disadvantage that the manufacturing process is complicated.

Accordingly, the present invention has been proposed to solve various problems occurring in the tactile sensor as described above,

An object of the present invention is to provide a manufacturing method of a tactile sensor which can simplify a manufacturing process and accurately detect contact information.

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Method of manufacturing a tactile sensor according to the present invention for achieving the above object,

A first step of forming a coating layer and a metal layer in order on a polymer film (polyimide film, polyester film, etc.) having a predetermined thickness, and forming a resistor on the metal layer to manufacture a top plate of the tactile sensor;

A second process of forming a bottom plate of the tactile sensor by forming a coating layer and a metal layer on a polymer film having a predetermined thickness in order, forming a resistor on the metal layer, and then forming a spacer having a predetermined thickness on the metal layer except for the resistor; ;

And a third process of manufacturing the tactile sensor by bonding the resistors of the manufactured upper plate and the resistors of the lower plate to face each other.

Here, the first step is

Forming a coating layer by coating HD 4000 which is a polymer material on a polymer film having a predetermined thickness;

Depositing a metal on the coating layer to form a metal layer, and then forming a signal line using a lift-off process;

And forming a resistor on the metal layer.

In the above, the predetermined thickness is characterized in that 125㎛.

In addition, the coating layer is characterized in that it is formed using a spin coating equipment.

In addition, the metal layer is characterized in that the deposition using an E-beam (E-beam) or sputter (sputter) equipment.

In addition, the metal layer is characterized in that selected from the group of titanium, nickel, gold.

In addition, the step of forming the resistor is characterized in that the resistor is formed after applying a reduced pressure ink using a screen printing process (screen printing process).

In addition, the process of forming the resistor is characterized in that to form a pattern of the resistor through the etching after evaporation of the alloy used for nichrome and the resistor using an e-beam or sputtering equipment.

In the above, the second step,

Forming a coating layer by coating HD 4000 which is a polymer material on a polymer film having a predetermined thickness;

Depositing a metal on the coating layer to form a metal layer, and then forming a signal line using a lift-off process;

Forming a resistor on the metal layer;

Forming a spacer on the metal layer except for the resistor.

In the above, the predetermined thickness is characterized in that 50㎛.

In addition, the coating layer is characterized in that it is formed using a spin coating equipment.

In addition, the metal layer is characterized in that the deposition using an E-beam (E-beam) or sputter (sputter) equipment.

In addition, the metal layer is characterized in that selected from the group of titanium, nickel, gold.

In addition, the step of forming the resistor is characterized in that the resistor is formed after applying the reduced pressure ink using a screen printing method.

In addition, the process of forming the resistor is characterized in that to form a pattern of the resistor through the etching after evaporation of the alloy used for nichrome and the resistor using an e-beam or sputtering equipment.

In addition, the bonding method of the third step is characterized in that the adhesive by using a double-sided tape or a thermal adhesive tape for film bonding.

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Hereinafter, described in detail with reference to the accompanying drawings a preferred embodiment of the present invention. If it is determined that the detailed description of the known function or configuration related to the present invention may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

1A to 1C are diagrams for explaining a sensing principle of a force sensor-based tactile sensor according to the present invention.

FIG. 1A is a front and rear view of the tactile sensor, wherein reference numerals 10 and 20 preferably use a polymer film (polyimide film, polyester film, etc.) as a substrate for manufacturing the tactile sensor. The reason why the polyimide film, which is a polymer film, is used as a substrate is because it has flexibility and excellent electrical, thermal, mechanical, and physical / chemical properties. Reference numeral 21 denotes a coating layer formed using a polymer material, and reference numeral 22 denotes a resistor.

FIG. 1B is a side view of the tactile sensor, in which reference numeral 11 denotes a coating layer formed using a polymer material and reference numeral 12 denotes a resistor.

Figure 1c is a side view of the tactile sensor completed by bonding the upper and lower plates of the tactile sensor. Here, reference numeral 30 denotes a spacer.

2a to 2j is a process chart showing a tactile sensor manufacturing method according to the present invention.

In the tactile sensor manufactured by the present invention, first, a top plate is manufactured through a process as shown in FIGS. 2A to 2D, and a bottom plate is manufactured through a process as shown in FIGS. 2E to 2I. Bonding to produce a tactile sensor.

In more detail, it is as follows.

First, referring to the top plate manufacturing process, the coating layer 102 is formed by coating a polymer material HD 4000 on the Kapton polyimide film 101 having a thickness of 125 μm as shown in FIG. 2A as shown in FIG. 2B. Here, the coating layer 102 is preferably coated using a conventional spin coating equipment.

Next, as shown in FIG. 2C, the metal is deposited on the coating layer 102 to form the metal layer 103, and then a signal line is formed by using a lift-off process. The metal used herein is preferably one selected from the group consisting of titanium, nickel, and gold, and the metal layer 103 is preferably deposited using an E-beam or sputtering equipment.

Next, as shown in FIG. 2D, a resistor 104 is formed on the metal layer 103. Here, the resistor 104 preferably uses a reduced pressure ink or nichrome (Ni-Cr), and in the case of using a reduced pressure ink, after applying the reduced pressure ink using a screen printing method, the resistor 104 is formed, and the nichrome In this case, it is preferable to form a pattern of the resistor 104 through etching after nichrome is deposited using an e-beam or a sputtering equipment.

After the upper plate is manufactured by the same method as described above, the lower plate is manufactured by the same method as the upper plate.

Looking at the lower plate manufacturing process, the coating layer 112 is formed by coating a polymer material HD 4000 as shown in Figure 2f on the Kapton polyimide film 111 having a thickness of 50㎛ as shown in Figure 2e. Here, the coating layer 112 is also preferably coated using a conventional spin coating equipment.

Next, as illustrated in FIG. 2G, the metal is deposited on the coating layer 112 to form the metal layer 113, and then a signal line is formed by using a lift-off process. It is preferable to use a metal selected from the group of titanium, nickel, and gold, and the metal layer 113 is preferably deposited using an E-beam or a sputtering equipment.

Next, as shown in FIG. 2H, a resistor 114 is formed on the metal layer 113. Here, the resistor 114 preferably uses a reduced pressure ink or nichrome (Ni-Cr), and in the case of using a reduced pressure ink, after applying the reduced pressure ink using a screen printing method, a resistor 114 is formed, and the nichrome In this case, it is preferable to form a pattern of the resistor 114 through etching after nichrome is deposited using an e-beam or a sputtering equipment.

Next, the spacer 115 is formed on the metal layer 113 except for the resistor 114 with a predetermined thickness. In this case, the spacer 115 may preferably use an insulating material. The thickness of the spacer 115 may be 2.1 times higher than that of the resistor 114 so that an air gap is formed when the upper plate and the lower plate are bonded to each other. If it is formed too high, the minimum force magnitude to be measured becomes large, the measurement sensitivity may be lowered, and the accuracy of detection may be lowered. Therefore, it is preferable to set the air gap in consideration of this point.

When the top plate and the bottom plate are manufactured through the process as is well known, the upper plate and the bottom plate 104 are in contact with each other through a bonding process as shown in FIG. 2J. The bonded tactile sensor may indicate the sensitivity of the tactile sensor by measuring a change in resistivity according to the contact area of the nichrome resistor by an external force. In this case, the bonding method is preferably bonded using a double-sided tape or a thermal adhesive tape for film bonding, and thus it is not necessary to use a separate semiconductor process, thereby easily bonding at a low cost.

Figure 3 is a block diagram showing the configuration of the "signal processing device of the tactile sensor" processing the signal of the tactile sensor produced as described above.

Here, reference numeral 210 denotes a tactile sensor in which signal lines are formed in a matrix array type, and reference numeral 220 is connected to an input terminal and an output terminal of the tactile sensor 210 to sequentially detect signals at predetermined time intervals. Representing a relay multiplexer, reference numeral 230 denotes an analog amplifier for amplifying the signal output from the relay multiplexer 220 to a predetermined level, and reference numeral 240 denotes a detection signal amplified by the analog amplifier 230. Analyze the change of the force over time to identify the detection signal analysis and display that displays the real time on the screen.

FIG. 4 is a circuit diagram illustrating an example of the tactile sensor module of FIG. 3, in which a relay multiplexer is omitted.

The output of the output terminal is applied to the negative input terminal of the analog amplifier 230, and the positive input terminal of the analog amplifier 230 (OPAMP1) is input other than the main input line connected to the resistance (A) to be measured. A voltage of the same magnitude as that applied to the line is applied.

의 전압을 인가하고, 측정 대상인 저항(A)에 연결된 메인 입력라인 이외의 입력라인에는

의 전압을 인가하는 데,

와

는 모두 같은 전압을 나타낸다.Here, the negative input terminal of the analog amplifier OPAMP1 is

Is applied to input lines other than the main input line connected to the resistance (A) to be measured.

To apply a voltage of

Wow

All represent the same voltage.

The resistance value of the feedback resistor Rf connected between the output terminal of the analog amplifier OPAMP1 and the negative input terminal is preferably set to the same size as the resistance value of the resistance constituting the force sensor.

The output Vout value of the analog amplifier OPAMP is shown in Equation 1 below.

In

In

Referring to the operation of the signal processing device of the tactile sensor configured as described above are as follows.

In the manufactured tactile sensor, the signal lines are composed of a matrix array type, so that a total of 256 tactile detection elements can be measured using only 16 input terminals and 16 output terminals, respectively (in FIG. 4, only eight input terminals and output terminals are shown). In order to process the signals of the tactile sensor 210 coming out of a total of 256 tactile detection elements, the relay multiplexer 220 uses 16 relay multiplexers for input and output terminals, respectively, to sequentially detect signals at predetermined time intervals. Done. Here, the detection time interval of each tactile detection element is about 6 ms and 167 ms.

The detected signal is amplified to a predetermined level by the analog amplifier 230 (OPAMP1) and then provided to the detection signal analysis and display unit 240, and the detection signal analysis and display unit 240 displays the detected signal in real time on a program. The contact shape and the pressure distribution are image-processed and displayed on the screen using a signal processing algorithm.

를 이용하여 구성한 도 5와 같은 프로그램을 이용한다. 도시된 바와 같이 릴레이 멀티플렉서의 채널선택, 신호검출시간 컨트롤 및 확인, 오프셋(Offset)의 유무와 오프셋 폭의 조절이 용이하도록 프로그래밍 되었고, 검출된 힘의 분포와 동적인 변화를 2D와 3D그래프를 이용하여 디스플레이하게 된다.That is, the detection signal analysis and display unit 240 includes a signal separator, an integrator, and an information indicator. The signal separator separates the signal from the inputted detection signal in the order of the detected time, and since the separated detection signal represents the amount of change in the applied force over time, the integral of the integrator is taken to take the change in the force over time. Make it understandable. The integral signal is input to the information indicator, and the information indicator displays an image by processing the force distribution and dynamic change on the screen. Where the information indicator is

The program as shown in FIG. As shown, it is programmed to facilitate channel selection, signal detection time control and verification of the relay multiplexer, the presence and absence of offset, and the adjustment of the offset width. Display.

The present invention is not limited to the above-described specific preferred embodiments, and various modifications can be made by any person having ordinary skill in the art without departing from the gist of the present invention claimed in the claims. Of course, such changes will fall within the scope of the claims.

According to the present invention described above, it is possible to simplify the manufacturing process of the tactile sensor, and to omit the semiconductor process of the upper plate and the lower plate and to bond the upper plate and the lower plate using an adhesive tape, thereby reducing the manufacturing cost of the tactile sensor. There is an advantage.

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Claims (19)

In the manufacturing method of the tactile sensor, A first step of forming a coating layer and a metal layer in order on a polymer film having a predetermined thickness, and forming a resistor on the metal layer to manufacture a top plate of the tactile sensor; A second process of forming a bottom plate of the tactile sensor by forming a coating layer and a metal layer on a polymer film having a predetermined thickness in order, forming a resistor on the metal layer, and then forming a spacer having a predetermined thickness on the metal layer except for the resistor; ; And a third step of manufacturing the haptic sensor by bonding the resistors of the manufactured upper plate and the resistors of the lower plate to face each other. The method of claim 1, wherein the first step, Forming a coating layer by coating HD 4000 which is a polymer material on a polymer film having a predetermined thickness; Depositing a metal on the coating layer to form a metal layer, and then forming a signal line using a lift-off process; A method of manufacturing a tactile sensor comprising the step of forming a resistor on the metal layer. The method of claim 2, wherein the predetermined thickness is 125 μm. The method of claim 2, wherein the coating layer is formed using spin coating equipment. The method of claim 2, wherein the metal layer is deposited using an E-beam or a sputter device. A method according to claim 2 or 5, wherein the metal layer is selected from the group consisting of titanium, nickel and gold. The method of manufacturing a tactile sensor according to claim 2, wherein the resistor is formed by applying a reduced pressure ink using a screen printing method. The tactile sensor of claim 2, wherein the resistor is formed by etching Ni-Cr using an E-Beam or a sputtering device to form a pattern of the resistor through etching. Way. The method of claim 1, wherein the second step, Forming a coating layer by coating HD 4000 which is a polymer material on a polymer film having a predetermined thickness; Depositing a metal on the coating layer to form a metal layer, and then forming a signal line using a lift-off process; Forming a resistor on the metal layer; And forming a spacer on the metal layer except for the resistor. 10. The method of claim 9, wherein the predetermined thickness is 50 μm. 10. The method of claim 9, wherein the coating layer is formed using spin coating equipment. 10. The method of claim 9, wherein the metal layer is deposited using an E-beam or sputter device. The method of claim 9 or 12, wherein the metal layer is selected from the group consisting of titanium, nickel, and gold. 10. The method of claim 9, wherein the resistor is formed by applying a reduced pressure ink using a screen printing method to form a resistor. The tactile sensor of claim 9, wherein the resistor is formed by etching Ni-Cr using an E-Beam or a sputtering device to form a pattern of the resistor through etching. Way. 10. The method of claim 9, wherein the spacer is formed at least 2.1 times higher than the thickness of the resistor (resistor) to form an air gap when the upper plate and the lower plate are bonded to each other. The method of manufacturing a tactile sensor according to claim 1, wherein the bonding method of the third step is performed by using a double-sided tape or a thermal adhesive tape for film bonding. delete delete

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