JPWO2014203862A1 - Current sensor - Google Patents

Current sensor Download PDF

Info

Publication number
JPWO2014203862A1
JPWO2014203862A1 JP2015522913A JP2015522913A JPWO2014203862A1 JP WO2014203862 A1 JPWO2014203862 A1 JP WO2014203862A1 JP 2015522913 A JP2015522913 A JP 2015522913A JP 2015522913 A JP2015522913 A JP 2015522913A JP WO2014203862 A1 JPWO2014203862 A1 JP WO2014203862A1
Authority
JP
Japan
Prior art keywords
magnetic
magnetic body
current sensor
magnetosensitive element
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015522913A
Other languages
Japanese (ja)
Other versions
JP6384677B2 (en
Inventor
高明 宮腰
高明 宮腰
柏木 孝夫
孝夫 柏木
岡 禎一郎
禎一郎 岡
一太 許
一太 許
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Publication of JPWO2014203862A1 publication Critical patent/JPWO2014203862A1/en
Application granted granted Critical
Publication of JP6384677B2 publication Critical patent/JP6384677B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G01R15/20Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
    • G01R15/207Constructional details independent of the type of device used

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)

Abstract

従来と比較して電流導体非通電時の測定精度を高めることの可能な電流センサを提供する。第1の磁性体4及び第2の磁性体5は、先端面(両端縁)同士が空隙7を有して相互に対向し、全体として外周面に2箇所のスリット(空隙7)が入った角筒状を成す。第1の磁性体4及び第2の磁性体5は、全体として基板1及び感磁素子2、並びにバスバー10のうち第1の磁性体4及び第2の磁性体5の間を通る部分を内側に取り囲む。感磁素子2は、空隙7の中心同士を結ぶ第1の仮想直線L1より第1の磁性体4側にある。一方、バスバー10のうち第1の磁性体4及び第2の磁性体5の間を通る部分は、第1の仮想直線L1より第2の磁性体5側にある。Provided is a current sensor capable of improving the measurement accuracy when a current conductor is not energized as compared with a conventional case. As for the 1st magnetic body 4 and the 2nd magnetic body 5, the front end surfaces (both ends edge) mutually have the space | gap 7, and mutually opposed, and the slit (space | gap 7) of two places entered into the outer peripheral surface as a whole. Forms a rectangular tube. As for the 1st magnetic body 4 and the 2nd magnetic body 5, the part which passes between between the 1st magnetic body 4 and the 2nd magnetic body 5 among the board | substrate 1, the magnetic sensitive element 2, and the bus-bar 10 is set inside. Surround with. The magnetosensitive element 2 is closer to the first magnetic body 4 than the first virtual straight line L1 that connects the centers of the air gaps 7. On the other hand, a portion of the bus bar 10 that passes between the first magnetic body 4 and the second magnetic body 5 is closer to the second magnetic body 5 than the first virtual straight line L1.

Description

本発明は、例えばハイブリッドカーや電気自動車のバッテリー電流、モータ駆動電流の測定やコンバータ、インバータ等の電力制御機器内に設けられる電流センサに関し、特に、ホール素子やMR素子等の感磁素子を用いてバスバー等の電流導体に流れる電流を測定する電流センサに関する。   The present invention relates to a current sensor provided in a power control device such as a hybrid car or an electric vehicle for measuring battery current and motor drive current, converters, inverters, and the like, and in particular, using a magnetosensitive element such as a Hall element or MR element. The present invention relates to a current sensor for measuring a current flowing in a current conductor such as a bus bar.

バスバーに流れる電流(被測定電流)を非接触状態で検出する電流センサとして、空隙を有するリング状の磁気コアと、空隙に配置された感磁素子とを有する磁気比例式のものが従来から知られている。また、リング状の磁気コアを用いないコアレス電流センサも知られている。コアレス電流センサの場合、隣接するバスバー又は外部からの磁界に干渉されて電流検出精度が悪化しやすいため、感磁素子とバスバーの周囲を囲む磁気シールドが設けられる。下記特許文献1は、磁気シールドの空隙に生じる磁界が感磁素子に斜めに印加されて電流検出精度が悪化することを防止するために、空隙の高さ位置と、感磁素子の形成されたセンサ基板の高さ位置とを同一にしている。   As a current sensor for detecting a current flowing through a bus bar (current to be measured) in a non-contact state, a magnetic proportional type sensor having a ring-shaped magnetic core having a gap and a magneto-sensitive element arranged in the gap has been conventionally known. It has been. A coreless current sensor that does not use a ring-shaped magnetic core is also known. In the case of the coreless current sensor, since the current detection accuracy is likely to be deteriorated due to interference with an adjacent bus bar or an external magnetic field, a magnetic shield surrounding the periphery of the magnetosensitive element and the bus bar is provided. In Patent Document 1 below, in order to prevent a magnetic field generated in the gap of the magnetic shield from being applied obliquely to the magnetosensitive element and deteriorating current detection accuracy, the height position of the gap and the magnetosensitive element are formed. The height position of the sensor substrate is the same.

特開2013−11469号公報JP 2013-11469 A

磁気シールド用の磁性体はヒステリシス特性を有するため、バスバーに被測定電流が流れた後、バスバーの電流が0アンペアになっても、磁性体には磁化が残留する。この残留磁化によって発生する磁界は、バスバー非通電時(0アンペア時)の測定精度悪化の原因となる。特許文献1の構成では、磁気シールド内でバスバーが空隙の高さ位置より下側にあるため、下側の磁性体には上側の磁性体より大きな磁化が残留する。このため、磁気シールド内で空隙と同じ高さの位置(感磁素子の位置)では、バスバー非通電時、下側の磁性体の残留磁化によって発生する磁界のほうが、上側の磁性体の残留磁化によって発生する磁界より大きくなる。このため、感磁素子はバスバー非通電時にも磁界を検出することになり、バスバー非通電時の測定精度が悪化する。   Since the magnetic material for magnetic shielding has a hysteresis characteristic, magnetization remains in the magnetic material even if the current of the bus bar becomes 0 ampere after the current to be measured flows through the bus bar. The magnetic field generated by this residual magnetization causes measurement accuracy to deteriorate when the bus bar is not energized (at 0 amperes). In the configuration of Patent Document 1, since the bus bar is located below the height position of the air gap in the magnetic shield, a larger magnetization remains in the lower magnetic body than in the upper magnetic body. For this reason, when the bus bar is not energized, the magnetic field generated by the remanent magnetization of the lower magnetic body is higher than the remanent magnetization of the upper magnetic body at the position of the same height as the air gap in the magnetic shield. Is larger than the magnetic field generated by. For this reason, the magnetic sensitive element detects a magnetic field even when the bus bar is not energized, and the measurement accuracy when the bus bar is not energized deteriorates.

本発明はこうした状況を認識してなされたものであり、その目的は、従来と比較してバスバー非通電時の測定精度を高めることの可能な電流センサを提供することにある。   The present invention has been made in view of such a situation, and an object of the present invention is to provide a current sensor capable of improving the measurement accuracy when the bus bar is not energized as compared with the prior art.

本発明のある態様は、電流センサである。この電流センサは、
相互に対向する磁気遮蔽用の第1及び第2の磁性体と、
前記第1及び第2の磁性体間に配置される感磁素子と、
前記第1及び第2の磁性体間を通る電流導体とを備え、
前記感磁素子が、前記第1及び第2の磁性体間の空隙の中心同士を結ぶ第1の仮想直線より前記第1の磁性体側にあり、かつ、前記電流導体のうち前記第1及び第2の磁性体間を通る部分が前記第1の仮想直線より前記第2の磁性体側にある。
One embodiment of the present invention is a current sensor. This current sensor
First and second magnetic bodies for magnetic shielding opposed to each other;
A magnetosensitive element disposed between the first and second magnetic bodies;
A current conductor passing between the first and second magnetic bodies,
The magnetosensitive element is closer to the first magnetic body than a first imaginary straight line connecting the centers of the gaps between the first and second magnetic bodies, and the first and second of the current conductors. A portion passing between the two magnetic bodies is on the second magnetic body side from the first virtual straight line.

前記感磁素子の位置では、前記第1の仮想直線上かつ前記第1及び第2の磁性体の空隙間の中央位置と比較して、前記第1及び第2の磁性体の残留磁化により発生する磁界の感磁方向成分の和の絶対値が小さくてもよい。   At the position of the magnetosensitive element, it is generated by the remanent magnetization of the first and second magnetic bodies on the first imaginary straight line and compared to the center position between the gaps of the first and second magnetic bodies. The absolute value of the sum of the magnetically sensitive direction components of the magnetic field may be small.

前記感磁素子が、前記第1の磁性体の両端縁同士を結ぶ第2の仮想直線上、あるいは前記第2の仮想直線を挟んで前記電流導体のうち前記第1及び第2の磁性体間を通る部分の反対側となる位置にあってもよい。   The magnetosensitive element is on a second imaginary straight line connecting both end edges of the first magnetic body, or between the first and second magnetic bodies of the current conductor across the second imaginary straight line. It may be in a position on the opposite side of the portion passing through.

前記第1及び第2の磁性体に挟まれた基板を備え、前記感磁素子と、前記電流導体のうち前記第1及び第2の磁性体間を通る部分とが、前記基板を挟んで相互に反対側にあってもよい。   A substrate sandwiched between the first and second magnetic bodies, wherein the magnetosensitive element and a portion of the current conductor that passes between the first and second magnetic bodies sandwich the substrate; May be on the opposite side.

前記感磁素子を含む磁気検出部が出力にヒステリシスを有してもよい。   The magnetic detection unit including the magnetosensitive element may have hysteresis in the output.

前記第1の磁性体の両端縁が、前記第2の磁性体の両端縁と空隙を介してそれぞれ対向し、かつ、前記第1及び第2の磁性体は全体として前記電流導体のうち前記第1及び第2の磁性体間を通る部分と前記感磁素子とを内側に取り囲んでいてもよい。   Both end edges of the first magnetic body are opposed to both end edges of the second magnetic body through gaps, respectively, and the first and second magnetic bodies are the first of the current conductors as a whole. A portion passing between the first and second magnetic bodies and the magnetosensitive element may be surrounded on the inner side.

前記第1及び第2の磁性体の保磁力が互いに等しい又は近似してもよい。   The coercive forces of the first and second magnetic bodies may be equal or close to each other.

なお、以上の構成要素の任意の組合せ、本発明の表現を方法やシステムなどの間で変換したものもまた、本発明の態様として有効である。   It should be noted that any combination of the above-described constituent elements, and those obtained by converting the expression of the present invention between methods and systems are also effective as aspects of the present invention.

本発明によれば、従来と比較してバスバー非通電時の測定精度を高めることの可能な電流センサを提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, the current sensor which can raise the measurement precision at the time of a bus-bar non-energization compared with the past can be provided.

本発明の実施の形態1に係る電流センサの断面図。Sectional drawing of the current sensor which concerns on Embodiment 1 of this invention. 図1に示す電流センサの感磁素子2及びバイアス磁石9の拡大図。FIG. 2 is an enlarged view of a magnetosensitive element 2 and a bias magnet 9 of the current sensor shown in FIG. 1. 感磁素子2の各層の磁化方向とバイアス磁石9の極性の説明図。FIG. 3 is an explanatory diagram of the magnetization direction of each layer of the magnetosensitive element 2 and the polarity of the bias magnet 9. 感磁素子2の抵抗変化率の特性図。FIG. 6 is a characteristic diagram of the rate of change in resistance of the magnetosensitive element 2. 本発明の実施の形態2に係る電流センサの断面図。Sectional drawing of the current sensor which concerns on Embodiment 2 of this invention. 本発明の実施の形態3に係る電流センサの分解斜視図。The disassembled perspective view of the current sensor which concerns on Embodiment 3 of this invention. 図6に示す電流センサのスペーサー3の斜視図。The perspective view of the spacer 3 of the current sensor shown in FIG. 図6に示す電流センサの断面図。Sectional drawing of the current sensor shown in FIG. 本発明の実施の形態4に係る電流センサの斜視図。The perspective view of the current sensor which concerns on Embodiment 4 of this invention. 図9においてモールド樹脂16を透過した斜視図。The perspective view which permeate | transmitted the mold resin 16 in FIG. 図9に示す電流センサの断面図。Sectional drawing of the current sensor shown in FIG. 本発明の実施の形態5に係る電流センサ(磁気平衡式)の斜視図。The perspective view of the current sensor (magnetic balance type) which concerns on Embodiment 5 of this invention. 図12の感磁素子2(フィードバックコイル付きMR素子ブリッジ)の内部構造を示す概略平面図。The schematic plan view which shows the internal structure of the magnetosensitive element 2 (MR element bridge with a feedback coil) of FIG. 図13のa−a’断面図。FIG. 14 is a cross-sectional view taken along the line a-a ′ of FIG. 13. 図12に示す電流センサの回路図。FIG. 13 is a circuit diagram of the current sensor shown in FIG. 12. 本発明の実施の形態6に係る電流センサの斜視図。The perspective view of the current sensor which concerns on Embodiment 6 of this invention. 図16aにおいてモールド樹脂16を除いた(透過した)斜視図。FIG. 16A is a perspective view excluding (transmitting) the mold resin 16. 図16aに示す電流センサのバスバーのみの形状を示す斜視図。The perspective view which shows the shape of only the bus-bar of the current sensor shown to FIG. 16a.

以下、図面を参照しながら本発明の好適な実施の形態を詳述する。なお、各図面に示される同一または同等の構成要素、部材等には同一の符号を付し、適宜重複した説明は省略する。また、実施の形態は発明を限定するものではなく例示であり、実施の形態に記述されるすべての特徴やその組み合わせは必ずしも発明の本質的なものであるとは限らない。   Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same code | symbol is attached | subjected to the same or equivalent component, member, etc. which are shown by each drawing, and the overlapping description is abbreviate | omitted suitably. In addition, the embodiments do not limit the invention but are exemplifications, and all features and combinations thereof described in the embodiments are not necessarily essential to the invention.

実施の形態1
図1は、本発明の実施の形態1に係る電流センサの断面図である。図1により、直交する3方向であるx方向、y方向、及びz方向をそれぞれ定義する。図2は、図1に示す電流センサの感磁素子2及びバイアス磁石9の拡大図である。図3は、感磁素子2の各層の磁化方向とバイアス磁石9の極性の説明図である。図4は、感磁素子2の抵抗変化率の特性図である。
Embodiment 1
FIG. 1 is a sectional view of a current sensor according to Embodiment 1 of the present invention. According to FIG. 1, the x direction, the y direction, and the z direction, which are three orthogonal directions, are respectively defined. FIG. 2 is an enlarged view of the magnetosensitive element 2 and the bias magnet 9 of the current sensor shown in FIG. FIG. 3 is an explanatory diagram of the magnetization direction of each layer of the magnetosensitive element 2 and the polarity of the bias magnet 9. FIG. 4 is a characteristic diagram of the rate of change in resistance of the magnetosensitive element 2.

本実施の形態の電流センサは、基板1と、感磁素子2と、磁気遮蔽用の第1の磁性体4及び第2の磁性体5と、被測定電流の経路を成す銅板等のバスバー10(電流導体の一例)とを備える。感磁素子2は、基板1に搭載される。基板1には、必要に応じて各種の電子部品が搭載され、それに応じて所要の配線パターン(不図示)が形成される。基板1及び感磁素子2は、第1の磁性体4及び第2の磁性体5の間に配置される。感磁素子2は、第1の磁性体4及び第2の磁性体5の間において、好ましくは磁性体の幅方向であるx方向の中央位置に配置される。バスバー10は、第1の磁性体4及び第2の磁性体5の間を通る。バスバー10の幅方向中央部は、第1の磁性体4及び第2の磁性体5の間において、好ましくはx方向の中央位置を通る。   The current sensor according to the present embodiment includes a substrate 1, a magnetosensitive element 2, a first magnetic body 4 and a second magnetic body 5 for magnetic shielding, and a bus bar 10 such as a copper plate that forms a path of a current to be measured. (An example of a current conductor). The magnetosensitive element 2 is mounted on the substrate 1. Various electronic components are mounted on the substrate 1 as necessary, and a required wiring pattern (not shown) is formed accordingly. The substrate 1 and the magnetic sensitive element 2 are disposed between the first magnetic body 4 and the second magnetic body 5. The magnetosensitive element 2 is disposed between the first magnetic body 4 and the second magnetic body 5, preferably at the center position in the x direction, which is the width direction of the magnetic body. The bus bar 10 passes between the first magnetic body 4 and the second magnetic body 5. The central portion in the width direction of the bus bar 10 preferably passes through the central position in the x direction between the first magnetic body 4 and the second magnetic body 5.

第1の磁性体4及び第2の磁性体5は、高透磁率磁性材(例えば珪素鋼板)を断面コの字型に折曲げ加工したものであり、先端面(両端縁)同士が空隙7(磁気ギャップ)を有して相互に対向し、全体として外周面に2箇所のスリット(空隙7)が入った角筒状を成す。第1の磁性体4及び第2の磁性体5は、全体として基板1及び感磁素子2、並びにバスバー10のうち第1の磁性体4及び第2の磁性体5の間を通る部分(図1に断面として現れる部分)を内側に取り囲む。第1の磁性体4及び第2の磁性体5の保磁力は互いに等しい又は近似する。   The first magnetic body 4 and the second magnetic body 5 are formed by bending a high permeability magnetic material (for example, a silicon steel plate) into a U-shaped cross section, and the end faces (both edges) are gaps 7. It has a (magnetic gap) and is opposed to each other, and forms a rectangular tube shape having two slits (gap 7) on the outer peripheral surface as a whole. The first magnetic body 4 and the second magnetic body 5 as a whole pass between the first magnetic body 4 and the second magnetic body 5 of the substrate 1 and the magnetic sensitive element 2 and the bus bar 10 (see FIG. The portion that appears as a cross section in 1) is surrounded on the inside. The coercive forces of the first magnetic body 4 and the second magnetic body 5 are equal or close to each other.

バスバー10に流れる被測定電流によって発生する磁界が感磁素子2に印加され、感磁素子2の出力信号によって被測定電流が測定される。なお、図1には、バスバー10に−y方向の電流を流した後バスバー10の電流を0アンペアにした場合の第1の磁性体4及び第2の磁性体5の残留磁化により発生する磁界(残留磁界)を矢印で示している。   A magnetic field generated by the measured current flowing in the bus bar 10 is applied to the magnetosensitive element 2, and the measured current is measured by the output signal of the magnetosensitive element 2. FIG. 1 shows a magnetic field generated by residual magnetization of the first magnetic body 4 and the second magnetic body 5 when a current in the -y direction is applied to the bus bar 10 and then the current of the bus bar 10 is set to 0 amperes. (Residual magnetic field) is indicated by an arrow.

感磁素子2は、SV−GMR素子(スピンバルブ型磁気抵抗効果素子)であり、モールド樹脂15によってモールドされている。感磁素子2の近傍にはバイアス磁石9が設けられる。バイアス磁石9は、感磁素子2がSV−GMR素子である場合に、感磁素子2から測定磁場に応じた出力を得るために必要となる。図2に示す磁気検出部20は、感磁素子2及びバイアス磁石9を含む概念として定義される。なお、感磁素子2がホール素子である場合には、バイアス磁石9に替えて集磁ヨークを設け、当該ホール素子及び集磁ヨークを合わせて磁気検出部20としてもよい。磁気検出部20は、一体にパッケージ化されていてもよい。図3に示すように、バイアス磁石9は、y方向(被測定電流の方向)の両端面が磁極面であり、具体的には、−y方向側の端面がN極で、+y方向側の端面がS極である。感磁素子2のピン層磁化方向は−x方向に固定されている。感磁素子2のフリー層磁化方向は、被測定電流が0アンペアであればバイアス磁石9の磁界により+y方向となり、被測定電流が流れると被測定電流の発生する磁界により+y方向から±x方向のいずれかに傾く。被測定電流が大きいほどフリー層磁化方向の+y方向に対する傾きは大きくなる。このように、被測定電流により感磁素子2のフリー層磁化方向とピン層磁化方向との成す角度を90°を基準にして変化させ、感磁素子2の抵抗値を変化(図4)させることで、被測定電流に応じた出力信号を得ることができる。なお、感磁素子2は複数設けられてブリッジ接続されてもよく、抵抗値が変化する感磁素子2から出力信号を得る回路は任意である。   The magnetosensitive element 2 is an SV-GMR element (spin valve type magnetoresistive effect element) and is molded with a mold resin 15. A bias magnet 9 is provided in the vicinity of the magnetosensitive element 2. The bias magnet 9 is necessary to obtain an output corresponding to the measured magnetic field from the magnetosensitive element 2 when the magnetosensitive element 2 is an SV-GMR element. The magnetic detection unit 20 shown in FIG. 2 is defined as a concept including the magnetosensitive element 2 and the bias magnet 9. When the magnetic sensing element 2 is a Hall element, a magnetism collecting yoke may be provided instead of the bias magnet 9, and the Hall element and the magnetism collecting yoke may be combined to form the magnetic detection unit 20. The magnetic detection unit 20 may be packaged integrally. As shown in FIG. 3, in the bias magnet 9, both end surfaces in the y direction (direction of the current to be measured) are magnetic pole surfaces, specifically, the end surface on the −y direction side is the N pole, and the + y direction side end surface. The end face is the south pole. The pinned layer magnetization direction of the magnetosensitive element 2 is fixed in the −x direction. The magnetization direction of the free layer of the magnetosensitive element 2 becomes + y direction due to the magnetic field of the bias magnet 9 if the measured current is 0 ampere, and ± x direction from the + y direction due to the magnetic field generated by the measured current when the measured current flows. Lean on either. The larger the current to be measured, the greater the inclination of the free layer magnetization direction with respect to the + y direction. In this way, the angle formed by the free layer magnetization direction and the pinned layer magnetization direction of the magnetosensitive element 2 is changed with reference to 90 ° by the measured current, and the resistance value of the magnetosensitive element 2 is changed (FIG. 4). As a result, an output signal corresponding to the current to be measured can be obtained. A plurality of magnetosensitive elements 2 may be provided and bridge-connected, and a circuit for obtaining an output signal from the magnetosensitive element 2 whose resistance value changes is arbitrary.

図1に示すように、感磁素子2は、空隙7の中心同士を結ぶ第1の仮想直線L1より第1の磁性体4側にある。一方、バスバー10のうち第1の磁性体4及び第2の磁性体5の間を通る部分は、第1の仮想直線L1より第2の磁性体5側にある。感磁素子2の位置では、第1の仮想直線L1上かつ第1の磁性体4及び第2の磁性体5の空隙7間の中央位置(x方向中央位置)と比較して、第1の磁性体4及び第2の磁性体5の残留磁化により発生する磁界の感磁方向成分の和の絶対値が小さい。なお、図1の例では感磁素子2が第1の磁性体4の先端面(両端縁)同士を結ぶ第2の仮想直線L2上にあるが、感磁素子2は第1の仮想直線L1と第2の仮想直線L2との間にあってもよい。こうした配置とする理由について以下に説明する。   As shown in FIG. 1, the magnetosensitive element 2 is closer to the first magnetic body 4 than the first virtual straight line L <b> 1 that connects the centers of the air gaps 7. On the other hand, a portion of the bus bar 10 that passes between the first magnetic body 4 and the second magnetic body 5 is closer to the second magnetic body 5 than the first virtual straight line L1. In the position of the magnetosensitive element 2, the first position on the first virtual straight line L1 and the center position between the gaps 7 of the first magnetic body 4 and the second magnetic body 5 (the center position in the x direction) The absolute value of the sum of the magnetosensitive direction components of the magnetic field generated by the residual magnetization of the magnetic body 4 and the second magnetic body 5 is small. In the example of FIG. 1, the magnetosensitive element 2 is on the second imaginary straight line L2 that connects the tip surfaces (both edges) of the first magnetic body 4, but the magnetosensitive element 2 is the first imaginary straight line L1. And the second virtual straight line L2. The reason for this arrangement will be described below.

図1に示すようにバスバー10のうち第1の磁性体4及び第2の磁性体5の間を通る部分を第1の仮想直線L1より第2の磁性体5側に配置すると、第1の磁性体4より第2の磁性体5のほうが残留磁化が大きくなる。このため、第1の仮想直線L1上では、第1の磁性体4の残留磁化により発生する磁界より、第2の磁性体5の残留磁化により発生する磁界のほうが大きい。すなわち、第1の磁性体4の残留磁化により発生する磁界と第2の磁性体5の残留磁化により発生する磁界とが相互に打ち消しあってゼロになる位置は、第1の仮想直線L1より第1の磁性体4側になる。このため、本実施の形態では、感磁素子2を第1の仮想直線L1より第1の磁性体4側に配置することで(感磁素子2の位置を第1の仮想直線L1上より+z方向にシフトすることで)、感磁素子2を第1の仮想直線L1上に配置した場合と比較して0アンペア時に感磁素子2が検出する残留磁界(すなわち第1の磁性体4及び第2の磁性体5の残留磁化により発生する磁界の感磁方向成分の和の絶対値)を低減し(好ましくは0にし)、0アンペア時の測定精度の悪化を防止している。感磁素子2の最適配置は、シミュレーションにより求めることができる。なお、感磁素子2を+z方向に過剰にシフトすると、第1の磁性体4の残留磁化により発生する磁界が相対的に強くなり、感磁素子2の位置において、第1の磁性体4及び第2の磁性体5の残留磁化により発生する磁界の感磁方向成分の和の絶対値が第1の仮想直線L1上と比較して却って大きくなることもある。そのため、感磁素子2は、第1の磁性体4及び第2の磁性体5の残留磁化により発生する磁界の感磁方向成分の和の絶対値が第1の仮想直線L1上と比較して小さくなる位置に配置する。   As shown in FIG. 1, when the portion of the bus bar 10 that passes between the first magnetic body 4 and the second magnetic body 5 is arranged closer to the second magnetic body 5 than the first virtual straight line L1, The remanent magnetization is larger in the second magnetic body 5 than in the magnetic body 4. For this reason, the magnetic field generated by the residual magnetization of the second magnetic body 5 is larger on the first virtual line L1 than the magnetic field generated by the residual magnetization of the first magnetic body 4. That is, the position where the magnetic field generated by the remanent magnetization of the first magnetic body 4 and the magnetic field generated by the remanent magnetization of the second magnetic body 5 cancel each other and becomes zero is determined by the first imaginary straight line L1. 1 on the magnetic body 4 side. For this reason, in the present embodiment, the magnetosensitive element 2 is arranged closer to the first magnetic body 4 than the first virtual line L1 (the position of the magnetosensitive element 2 is + z from the first virtual line L1. The residual magnetic field detected by the magnetosensitive element 2 at 0 amperes compared to the case where the magnetosensitive element 2 is arranged on the first virtual straight line L1 (ie, the first magnetic body 4 and the first magnetic body 4) 2 (absolute value of the sum of the magnetosensitive direction components of the magnetic field generated by the residual magnetization of the magnetic body 5) is reduced (preferably set to 0), and deterioration of measurement accuracy at 0 ampere is prevented. The optimal arrangement of the magnetosensitive element 2 can be obtained by simulation. If the magnetosensitive element 2 is excessively shifted in the + z direction, the magnetic field generated by the residual magnetization of the first magnetic body 4 becomes relatively strong, and at the position of the magnetosensitive element 2, the first magnetic body 4 and The absolute value of the sum of the magnetosensitive direction components of the magnetic field generated by the residual magnetization of the second magnetic body 5 may be larger than that on the first virtual straight line L1. Therefore, the magnetosensitive element 2 has an absolute value of the sum of the magnetosensitive direction components of the magnetic field generated by the residual magnetization of the first magnetic body 4 and the second magnetic body 5 as compared with the first virtual straight line L1. Place it at a smaller position.

このように本実施の形態によれば、感磁素子2を第1の仮想直線L1より第1の磁性体4側に配置し、かつバスバー10のうち第1の磁性体4及び第2の磁性体5の間を通る部分を第1の仮想直線L1より第2の磁性体5側に配置しているので、感磁素子2を第1の仮想直線L1上に配置した場合と比較して、0アンペア時に感磁素子2が検出する残留磁界を低減し、0アンペア時(バスバー非通電時)の測定精度を向上させることができる。   As described above, according to the present embodiment, the magnetosensitive element 2 is arranged on the first magnetic body 4 side from the first virtual straight line L1, and the first magnetic body 4 and the second magnetic body in the bus bar 10 are disposed. Since the portion passing between the bodies 5 is arranged closer to the second magnetic body 5 than the first virtual straight line L1, compared with the case where the magnetosensitive element 2 is arranged on the first virtual straight line L1, The residual magnetic field detected by the magnetosensitive element 2 at 0 ampere can be reduced, and the measurement accuracy at 0 ampere hour (when the bus bar is not energized) can be improved.

実施の形態2
図5は、本発明の実施の形態2に係る電流センサの断面図である。本図において、バスバー10に−y方向の電流を流した後バスバー10の電流を0アンペアにした場合の第1の磁性体4及び第2の磁性体5の残留磁化により発生する磁界(残留磁界)を矢印で示している。本実施の形態の電流センサは、図1等に示した実施の形態1のものと比較して、感磁素子2が+z方向にシフトしている点で相違し、その他の点で一致する。具体的には、感磁素子2は、第2の仮想直線L2を挟んでバスバー10のうち第1の磁性体4及び第2の磁性体5の間を通る部分の反対側となる位置(第2の仮想直線L2より第1の磁性体4の内側となる位置)にある。こうした配置とする理由について以下に説明する。
Embodiment 2
FIG. 5 is a cross-sectional view of a current sensor according to Embodiment 2 of the present invention. In this figure, a magnetic field (residual magnetic field) generated by residual magnetization of the first magnetic body 4 and the second magnetic body 5 when a current in the -y direction is applied to the bus bar 10 and then the current of the bus bar 10 is set to 0 amperes. ) Is indicated by an arrow. The current sensor of the present embodiment is different from that of the first embodiment shown in FIG. 1 and the like in that the magnetosensitive element 2 is shifted in the + z direction, and is the same in other points. Specifically, the magnetosensitive element 2 is positioned on the opposite side of the portion passing between the first magnetic body 4 and the second magnetic body 5 of the bus bar 10 across the second virtual straight line L2 (first The position is located inside the first magnetic body 4 from the second virtual straight line L2. The reason for this arrangement will be described below.

実施の形態1では、感磁素子2が検出する残留磁界を0にすることを目標として感磁素子2とバスバー10の相対配置を定めた。感磁素子2を含む磁気検出部20が出力にヒステリシスを有さない、又はヒステリシスが無視できる程度に小さい場合には、磁気検出部20が検出する残留磁界を0にすれば0アンペア時(バスバー非通電時)の測定精度を最良とすることができる。一方、磁気検出部20が出力にヒステリシスを有する場合には、磁気検出部20が検出する残留磁界を0にしても、磁気検出部20のヒステリシス特性により、依然として0アンペア時(バスバー非通電時)の測定精度に改善の余地が残る。磁気検出部20のヒステリシスは、感磁素子2がSV−GMR素子である場合には、被測定電流をゼロに戻しても感磁素子2のフリー層磁化方向が完全には元に戻らないこと(感磁素子2自体のヒステリシス)に起因する。なお、磁気検出部20のヒステリシスは、感磁素子2自体のヒステリシスに限定されない。例えば感磁素子2がホール素子であってバイアス磁石9に替えて集磁ヨークを設ける場合には、当該集磁ヨークのヒステリシスが磁気検出部20のヒステリシスとなる。そこで本実施の形態では、磁気検出部20が出力にヒステリシスを有する場合を想定し、第1の磁性体4及び第2の磁性体5の残留磁化によって発生する磁界(残留磁界)により磁気検出部20のヒステリシスを打ち消す配置とする。   In the first embodiment, the relative arrangement of the magnetosensitive element 2 and the bus bar 10 is determined with the goal of setting the residual magnetic field detected by the magnetosensitive element 2 to zero. If the magnetic detection unit 20 including the magnetosensitive element 2 has no hysteresis in the output or is small enough to be ignored, the residual magnetic field detected by the magnetic detection unit 20 can be reduced to 0 ampere hours (bus bar The measurement accuracy during non-energization can be made the best. On the other hand, when the magnetic detection unit 20 has hysteresis in the output, even if the residual magnetic field detected by the magnetic detection unit 20 is zero, the hysteresis characteristic of the magnetic detection unit 20 still causes 0 ampere hours (when the bus bar is not energized). There remains room for improvement in measurement accuracy. When the magnetosensitive element 2 is an SV-GMR element, the hysteresis of the magnetic detection unit 20 is such that the free layer magnetization direction of the magnetosensitive element 2 is not completely restored even if the measured current is reset to zero. This is due to the hysteresis of the magnetosensitive element 2 itself. The hysteresis of the magnetic detection unit 20 is not limited to the hysteresis of the magnetosensitive element 2 itself. For example, when the magnetic sensing element 2 is a Hall element and a magnetic collecting yoke is provided instead of the bias magnet 9, the hysteresis of the magnetic collecting yoke becomes the hysteresis of the magnetic detection unit 20. Therefore, in the present embodiment, assuming that the magnetic detection unit 20 has hysteresis in the output, the magnetic detection unit is caused by the magnetic field (residual magnetic field) generated by the residual magnetization of the first magnetic body 4 and the second magnetic body 5. The arrangement is to cancel 20 hysteresis.

図5に示す感磁素子2の配置において、外部磁界がゼロであれば、感磁素子2には、磁気検出部20のヒステリシス特性により、−y方向の電流が流れていたとき(−x方向の磁界が印加されていたとき)の影響が残り、フリー層磁化方向は+y方向から若干−x方向に傾くことになる。一方、図5に示す感磁素子2の位置では、第1の磁性体4の残留磁化によって発生する磁界のほうが、第2の磁性体5の残留磁化によって発生する磁界より大きい。このため、感磁素子2には、トータルで+x方向の残留磁界が印加される。この残留磁界は、フリー層磁化方向を+x方向に傾けるように作用する。したがって、感磁素子2のフリー層磁化方向は、磁気検出部20のヒステリシス特性による影響と、第1の磁性体4及び第2の磁性体5の残留磁化によって発生する磁界(残留磁界)による影響とが打ち消しあって、+y方向に近づく(好ましくは+y方向に一致する)。   In the arrangement of the magnetic sensing element 2 shown in FIG. 5, if the external magnetic field is zero, a current in the −y direction flows through the magnetic sensing element 2 due to the hysteresis characteristic of the magnetic detection unit 20 (−x direction). And the free layer magnetization direction slightly tilts from the + y direction to the −x direction. On the other hand, at the position of the magnetosensitive element 2 shown in FIG. 5, the magnetic field generated by the residual magnetization of the first magnetic body 4 is larger than the magnetic field generated by the residual magnetization of the second magnetic body 5. For this reason, a total residual magnetic field in the + x direction is applied to the magnetosensitive element 2. This residual magnetic field acts to tilt the free layer magnetization direction in the + x direction. Therefore, the free layer magnetization direction of the magnetosensitive element 2 is influenced by the hysteresis characteristic of the magnetic detection unit 20 and the magnetic field (residual magnetic field) generated by the residual magnetization of the first magnetic body 4 and the second magnetic body 5. Cancel each other and approach the + y direction (preferably matches the + y direction).

このように、本実施の形態によれば、第1の磁性体4及び第2の磁性体5からの残留磁界により磁気検出部20のヒステリシスを相殺することで、0アンペア時(バスバー非通電時)の測定精度を向上させることができる。更に、感磁素子2が第2の仮想直線L2より第1の磁性体4の内側となる位置に配置されていることにより、外部の磁界に対する耐性をより強くすることができる。なお、本実施の形態は、磁気検出部20が出力にヒステリシスを有さなくても、第1の磁性体4及び第2の磁性体5からの残留磁界の相殺位置(残留磁界が0となる位置)が第2の仮想直線L2より+z方向側にある場合に有効である。   As described above, according to the present embodiment, the hysteresis of the magnetic detection unit 20 is canceled by the residual magnetic field from the first magnetic body 4 and the second magnetic body 5, so that 0 ampere hours (when the bus bar is not energized) ) Measurement accuracy can be improved. Furthermore, since the magnetosensitive element 2 is arranged at a position inside the first magnetic body 4 with respect to the second virtual straight line L2, resistance to an external magnetic field can be further increased. In the present embodiment, even if the magnetic detection unit 20 does not have hysteresis in the output, the offset position of the residual magnetic field from the first magnetic body 4 and the second magnetic body 5 (the residual magnetic field becomes 0). This is effective when the position) is on the + z direction side from the second virtual straight line L2.

実施の形態3
図6は、本発明の実施の形態3に係る電流センサの分解斜視図である。図7は、図6に示す電流センサのスペーサー3の斜視図である。図8は、図6に示す電流センサの断面図である。この電流センサでは、第1の磁性体4及び第2の磁性体5は、基板1とスペーサー3とを挟み込んだ状態でリベット等の固定部品6により相互に固定される。すなわち、一対の固定部品6は、第1の磁性体4の一対の締結孔11、基板1の一対の締結孔12、スペーサー3の一対の締結孔13、及び第2の磁性体5の一対の締結孔14を貫通して先端がかしめられ、第1の磁性体4、基板1、スペーサー3、及び第2の磁性体5を締結し一体化する。固定部品6(締結部品)は、リベットの他に例えばボルトとナットの組合せを用いてもよい。なお、リベット、ボルト、ナット等の固定部品6は、磁気回路系の個体差を不安定にさせないためにステンレス等の非磁性材料であることが望ましい。
Embodiment 3
FIG. 6 is an exploded perspective view of a current sensor according to Embodiment 3 of the present invention. FIG. 7 is a perspective view of the spacer 3 of the current sensor shown in FIG. FIG. 8 is a cross-sectional view of the current sensor shown in FIG. In this current sensor, the first magnetic body 4 and the second magnetic body 5 are fixed to each other by a fixing component 6 such as a rivet in a state where the substrate 1 and the spacer 3 are sandwiched. That is, the pair of fixing parts 6 includes a pair of fastening holes 11 of the first magnetic body 4, a pair of fastening holes 12 of the substrate 1, a pair of fastening holes 13 of the spacer 3, and a pair of second magnetic bodies 5. The tip is caulked through the fastening hole 14, and the first magnetic body 4, the substrate 1, the spacer 3, and the second magnetic body 5 are fastened and integrated. As the fixing part 6 (fastening part), for example, a combination of a bolt and a nut may be used in addition to the rivet. The fixing parts 6 such as rivets, bolts and nuts are preferably made of a non-magnetic material such as stainless steel so as not to make individual differences in the magnetic circuit system unstable.

バスバー10は、コの字型に折り曲げられた状態でスペーサー3にインサート成型される。なお、バスバー10は平板状でインサート成型によらずスペーサー3に保持されてもよい。また、バスバーは平板状に限らず、例えば可撓性を有する電線であってもよい。スペーサー3は、側面角部を丸めた直方体形状であって、基板1との対向面に素子収容凹部17が設けられる。基板1に搭載された感磁素子2は、素子収容凹部17内に位置する(図8)。複数の端子18は、基板1にスルーホールはんだ付けや圧入によって固定され、それぞれ電源、センサ出力、GND、他の端子として機能する。また基板1には感磁素子2の他に図示しない電子部品が、基板1のその他の空きスペースに実装され、感磁素子2を含んだ電気回路を形成し、基板1上の配線パターンを介して端子18と接続される。第1の磁性体4及び第2の磁性体5の先端面(両端縁)の一方同士は基板1の外側で対向し、他方同士は基板1の磁性体挿通孔8の近傍で対向する。本実施の形態のその他の点は実施の形態1と同様である。本実施の形態も、実施の形態1と同様の効果を奏することができる。なお、本実施の形態において、実施の形態2(図5)のように感磁素子2を更に+z方向にシフトし、第1の磁性体4及び第2の磁性体5の残留磁界により感磁素子2のヒステリシスを相殺する構成としてもよい。   The bus bar 10 is insert-molded into the spacer 3 in a state of being folded into a U-shape. The bus bar 10 may be flat and may be held by the spacer 3 without using insert molding. The bus bar is not limited to a flat plate shape, and may be a flexible electric wire, for example. The spacer 3 has a rectangular parallelepiped shape with rounded side corners, and an element housing recess 17 is provided on the surface facing the substrate 1. The magnetosensitive element 2 mounted on the substrate 1 is located in the element accommodating recess 17 (FIG. 8). The plurality of terminals 18 are fixed to the substrate 1 by through-hole soldering or press-fitting, and function as a power source, sensor output, GND, and other terminals, respectively. In addition to the magnetic sensitive element 2, an electronic component (not shown) is mounted on the substrate 1 in another empty space of the substrate 1 to form an electric circuit including the magnetic sensitive element 2, via a wiring pattern on the substrate 1. To the terminal 18. One of the front end surfaces (both edges) of the first magnetic body 4 and the second magnetic body 5 is opposed to the outside of the substrate 1, and the other is opposed in the vicinity of the magnetic material insertion hole 8 of the substrate 1. Other points of the present embodiment are the same as those of the first embodiment. The present embodiment can achieve the same effects as those of the first embodiment. In the present embodiment, the magnetosensitive element 2 is further shifted in the + z direction as in the second embodiment (FIG. 5), and the magnetosensitive element is caused by the residual magnetic fields of the first magnetic body 4 and the second magnetic body 5. It may be configured to cancel the hysteresis of the element 2.

実施の形態4
図9は、本発明の実施の形態4に係る電流センサの斜視図である。図10は、図9においてモールド樹脂16を透過した斜視図である。図11は、図9に示す電流センサの断面図である。この電流センサは、基板1、感磁素子2、第1の磁性体4及び第2の磁性体5、並びにバスバー10をモールド樹脂16で一体化している。基板1は、第1の磁性体4及び第2の磁性体5によって挟まれる。すなわち、基板1は、第1の磁性体4及び第2の磁性体5の先端面(両端縁)同士の空隙を規定する。なお、基板1はその表面近傍もしくは内部に銅等で形成される電気回路の配線を有した回路基板としても良い。その場合、回路基板上にはオペアンプICや抵抗、キャパシタ等の電気回路部品を配することができる。さらに、基板1はバスバー(1次側)と感磁素子(2次側)との電気絶縁性を高める絶縁基板であっても良く、例えばセラミック製の回路基板として一方にバスバー、他方に感磁素子を含む2次側電気回路を有したものとしてもよい。バスバー10は、平板状であってインサート成型によりモールド樹脂16に一体化される。また、バスバー10は、インサート成型によらず、モールド樹脂16の貫通穴に後から挿入されてもよい。本実施の形態のその他の点は実施の形態2と同様である。本実施の形態も、実施の形態2と同様の効果を奏することができる。
Embodiment 4
FIG. 9 is a perspective view of a current sensor according to Embodiment 4 of the present invention. FIG. 10 is a perspective view through which the mold resin 16 is transmitted in FIG. 9. 11 is a cross-sectional view of the current sensor shown in FIG. In this current sensor, the substrate 1, the magnetic sensing element 2, the first magnetic body 4 and the second magnetic body 5, and the bus bar 10 are integrated with a mold resin 16. The substrate 1 is sandwiched between the first magnetic body 4 and the second magnetic body 5. That is, the substrate 1 defines a gap between the tip surfaces (both edges) of the first magnetic body 4 and the second magnetic body 5. The substrate 1 may be a circuit substrate having electric circuit wiring formed of copper or the like in the vicinity of or inside the surface. In that case, electric circuit components such as an operational amplifier IC, a resistor, and a capacitor can be arranged on the circuit board. Further, the substrate 1 may be an insulating substrate that enhances electrical insulation between the bus bar (primary side) and the magnetic sensing element (secondary side). For example, a ceramic circuit board is provided with a bus bar on one side and a magnetic sensing side on the other side. A secondary side electric circuit including an element may be included. The bus bar 10 has a flat plate shape and is integrated with the mold resin 16 by insert molding. Further, the bus bar 10 may be inserted into the through hole of the mold resin 16 later without using insert molding. Other points of the present embodiment are the same as those of the second embodiment. The present embodiment can achieve the same effects as those of the second embodiment.

実施の形態5
図12は、本発明の実施の形態5に係る電流センサ(磁気平衡式)の斜視図である。実施の形態1〜4の電流センサが磁気比例式であったのに対し、本実施の形態の電流センサは磁気平衡式である。感磁素子2は、図13に示すような、フィードバックコイル付きMR素子ブリッジ(MRパッケージ)である。第1の磁性体4及び第2の磁性体5に対するバスバー10、基板1及び感磁素子2の位置関係は、実施の形態1又は2と同様でよい。
Embodiment 5
FIG. 12 is a perspective view of a current sensor (magnetic balance type) according to Embodiment 5 of the present invention. While the current sensors of the first to fourth embodiments are magnetic proportional, the current sensor of the present embodiment is a magnetic balance type. The magnetosensitive element 2 is an MR element bridge (MR package) with a feedback coil as shown in FIG. The positional relationship of the bus bar 10, the substrate 1, and the magnetosensitive element 2 with respect to the first magnetic body 4 and the second magnetic body 5 may be the same as in the first or second embodiment.

図13は、図12における感磁素子2の内部構造を示す概略平面図である。感磁素子2は、平行配置の4個のSV−GMR素子2A,2B,2C,2Dと、フィードバックコイル2Eとを備える。SV−GMR素子2A,2B,2C,2Dのフリー(Free)及びピン(Pined)のベクトル方向(フリー層磁化方向及びピン層磁化方向)は図示のとおりである。フィードバックコイル2Eは、平行配置の4個のSV−GMR素子2A,2B,2C,2Dと重なるように配置されている。すなわち、各SV−GMR素子2A,2B,2C,2Dのフリー(Free)方向に沿ってフィードバックコイル2Eは配置される。図14のように、フィードバックコイル2Eによる発生磁界はSV−GMR素子2A,2B,2C,2Dのピン(Pined)方向(フリー方向と直交)であり、SV−GMR素子2A,2Bには順方向に、SV−GMR素子2C,2Dには逆方向に加わる。   FIG. 13 is a schematic plan view showing the internal structure of the magnetosensitive element 2 in FIG. The magnetosensitive element 2 includes four SV-GMR elements 2A, 2B, 2C, and 2D arranged in parallel, and a feedback coil 2E. The vector directions (free layer magnetization direction and pinned layer magnetization direction) of the SV-GMR elements 2A, 2B, 2C, and 2D Free and Pined are as illustrated. The feedback coil 2E is arranged so as to overlap the four SV-GMR elements 2A, 2B, 2C, and 2D arranged in parallel. That is, the feedback coil 2E is arranged along the free direction of each SV-GMR element 2A, 2B, 2C, 2D. As shown in FIG. 14, the magnetic field generated by the feedback coil 2E is in the pin (pinned) direction of the SV-GMR elements 2A, 2B, 2C, and 2D (perpendicular to the free direction), and is forward in the SV-GMR elements 2A and 2B. Furthermore, the SV-GMR elements 2C and 2D are applied in the reverse direction.

図15は、図12に示す電流センサの回路図であり、磁気平衡式の原理でセンサ検出出力を得るための回路構成を示す。この図に示すように、電源61の高電圧側と低電圧側の間に4つのSV−GMR素子2A〜2Dがフルブリッジ接続される。SV−GMR素子2A,2Cの相互接続点と、SV−GMR素子2D,2Bの相互接続点とが、負帰還用差動増幅器62の入力端子にそれぞれ接続される。負帰還用差動増幅器62の出力端子にはフィードバックコイル2Eと検出抵抗66が直列接続される。演算増幅器67及び電源電圧を分圧する分圧抵抗68,69は、電源電圧を分圧した中間電圧を安定化するためのバッファを構成しており、演算増幅器67の出力端の中間電圧が出力用差動増幅器64の一方の入力端子に印加される。検出抵抗66の両端子は出力用差動増幅器64の両入力端子にそれぞれ接続される。フィードバックコイル2Eは図13及び図14に示したようにSV−GMR素子2A,2B,2C,2Dの近傍に例えば素子基板上の導体パターンとして形成される。   FIG. 15 is a circuit diagram of the current sensor shown in FIG. 12, and shows a circuit configuration for obtaining a sensor detection output based on the principle of a magnetic balance type. As shown in this figure, four SV-GMR elements 2A to 2D are connected by a full bridge between the high voltage side and the low voltage side of the power supply 61. The interconnection point between the SV-GMR elements 2A and 2C and the interconnection point between the SV-GMR elements 2D and 2B are connected to the input terminal of the negative feedback differential amplifier 62, respectively. A feedback coil 2E and a detection resistor 66 are connected in series to the output terminal of the negative feedback differential amplifier 62. The operational amplifier 67 and the voltage dividing resistors 68 and 69 that divide the power supply voltage constitute a buffer for stabilizing the intermediate voltage obtained by dividing the power supply voltage, and the intermediate voltage at the output terminal of the operational amplifier 67 is used for output. This is applied to one input terminal of the differential amplifier 64. Both terminals of the detection resistor 66 are connected to both input terminals of the output differential amplifier 64, respectively. As shown in FIGS. 13 and 14, the feedback coil 2E is formed, for example, as a conductor pattern on the element substrate in the vicinity of the SV-GMR elements 2A, 2B, 2C, 2D.

バスバー10に通電するとSV−GMR素子2A,2B,2C,2Dに磁界が印加される。負帰還用差動増幅器62の作用により、フィードバックコイル2Eには、SV−GMR素子2A,2Cの相互接続点と、SV−GMR素子2D,2Bの相互接続点との電位差がゼロになるように、すなわちフィードバックコイル2Eによる発生磁界がバスバー10による発生磁界を打ち消してSV−GMR素子2A,2B,2C,2Dに印加される磁界がゼロになるように、フィードバック電流が流れる。フィードバック電流は被測定電流に比例するから、フィードバック電流を検出抵抗66で電圧に変換して出力用差動増幅器64で増幅したセンサ出力電圧から被測定電流の大きさを特定できる。本実施の形態も、実施の形態1又は2と同様の効果を奏することができる。   When the bus bar 10 is energized, a magnetic field is applied to the SV-GMR elements 2A, 2B, 2C, 2D. By the action of the negative feedback differential amplifier 62, the feedback coil 2E has a potential difference between the interconnection point of the SV-GMR elements 2A and 2C and the interconnection point of the SV-GMR elements 2D and 2B becomes zero. That is, the feedback current flows such that the magnetic field generated by the feedback coil 2E cancels the magnetic field generated by the bus bar 10 and the magnetic field applied to the SV-GMR elements 2A, 2B, 2C, 2D becomes zero. Since the feedback current is proportional to the current to be measured, the magnitude of the current to be measured can be specified from the sensor output voltage obtained by converting the feedback current into a voltage by the detection resistor 66 and amplifying by the output differential amplifier 64. This embodiment can also provide the same effects as those of the first or second embodiment.

実施の形態6
図16aは、本発明の実施の形態6に係る電流センサの斜視図である。図16bは、図16aにおいてモールド樹脂16を除いた(透過した)斜視図である。図16cは、図16aに示す電流センサのバスバーのみの形状を示す斜視図である。
Embodiment 6
FIG. 16a is a perspective view of a current sensor according to Embodiment 6 of the present invention. FIG. 16B is a perspective view in which the mold resin 16 is removed (transmitted) in FIG. 16A. FIG. 16c is a perspective view showing the shape of only the bus bar of the current sensor shown in FIG. 16a.

感磁素子21は、実施の形態5までの電流センサで用いた感磁素子2と基本的に同じものであるが、図2に示したようにモールド樹脂15によってモールドしバイアス磁石9を設けて磁気検出部20とするのではなく、バイアス磁石を感磁素子自体の内部あるいは表面に集積したものとした。勿論磁気検出部20を用いても構わない。実施の形態1〜5で図示を省略した電子部品はここでは集積回路22とした。   The magnetosensitive element 21 is basically the same as the magnetosensitive element 2 used in the current sensor up to the fifth embodiment, but is molded with a mold resin 15 as shown in FIG. Instead of the magnetic detection unit 20, the bias magnet is integrated inside or on the surface of the magnetosensitive element itself. Of course, the magnetic detection unit 20 may be used. The electronic component not shown in the first to fifth embodiments is the integrated circuit 22 here.

感磁素子21、集積回路22、複数の端子18は、クリームはんだ、Ag等の導電性ペースト、もしくはワイヤボンディングで基板1に接続される。バスバー10、第1の磁性体4、第2の磁性体5は基板1に対して接着される。そして図16bで示したこれら全ての構成部品はモールド樹脂16により一体化される。バスバー10は、基板1と平行な平面内でコの字型に折り曲げられた形状であり、コの字の基部が第1の磁性体4及び第2の磁性体5の間を通る。また、コの字の両先端は下方に折り曲げられている。本実施の形態のその他の点は、実施の形態4と同様である。   The magnetic sensitive element 21, the integrated circuit 22, and the plurality of terminals 18 are connected to the substrate 1 by a conductive paste such as cream solder, Ag, or wire bonding. The bus bar 10, the first magnetic body 4, and the second magnetic body 5 are bonded to the substrate 1. All these components shown in FIG. 16 b are integrated by the mold resin 16. The bus bar 10 has a U-shaped shape in a plane parallel to the substrate 1, and the base of the U-shape passes between the first magnetic body 4 and the second magnetic body 5. Both ends of the U-shape are bent downward. Other points of the present embodiment are the same as those of the fourth embodiment.

以上のように基板1は、他の全ての構成部品を一旦支える役目を持っているが、これに加えて、実施の形態4で示したことと同じく、第1の磁性体4及び第2の磁性体5の先端面(両端縁)同士の空隙を規定するとともに、バスバー10(1次側)と、感磁素子21及び集積回路22(2次側)との電気絶縁の役割も担っている。   As described above, the substrate 1 has a role of temporarily supporting all the other components. In addition to this, as shown in the fourth embodiment, the first magnetic body 4 and the second magnetic body 4 are also provided. A gap between the front end surfaces (both edges) of the magnetic body 5 is defined, and also plays a role of electrical insulation between the bus bar 10 (primary side), the magnetosensitive element 21 and the integrated circuit 22 (secondary side). .

以上、実施の形態を例に本発明を説明したが、実施の形態の各構成要素や各処理プロセスには請求項に記載の範囲で種々の変形が可能であることは当業者に理解されるところである。以下、変形例について触れる。   The present invention has been described above by taking the embodiment as an example. However, it is understood by those skilled in the art that various modifications can be made to each component and each processing process of the embodiment within the scope of the claims. By the way. Hereinafter, modifications will be described.

感磁素子2は、SV−GMR素子等のMR素子に限定されず、例えばホール素子やホールICであってもよい。この場合、バイアス磁石9は不要である一方、集磁ヨークを設けてもよい。また、電流導体は、電流路であれば平板状のバスバーに限らず、電線など、様々な形態のものが適用可能である。   The magnetosensitive element 2 is not limited to an MR element such as an SV-GMR element, and may be, for example, a Hall element or a Hall IC. In this case, the bias magnet 9 is not necessary, but a magnetic collecting yoke may be provided. In addition, the current conductor is not limited to a flat bus bar as long as it is a current path, and various forms such as an electric wire can be applied.

1 基板、2 感磁素子、3 スペーサー、4 第1の磁性体、5 第2の磁性体、6 固定部品、7 空隙、8 磁性体挿通孔、9 バイアス磁石、10 バスバー、11〜14 締結穴、15,16 モールド樹脂、17 素子収容凹部、18 端子、20 磁気検出部、21 感磁素子、22 集積回路 DESCRIPTION OF SYMBOLS 1 Board | substrate, 2 Magnetosensitive element, 3 Spacer, 4 1st magnetic body, 5 2nd magnetic body, 6 Fixed component, 7 Space | gap, 8 Magnetic body insertion hole, 9 Bias magnet, 10 Bus bar, 11-14 Fastening hole 15, 16 Mold resin, 17 Element receiving recess, 18 terminals, 20 Magnetic detector, 21 Magnetosensitive element, 22 Integrated circuit

Claims (7)

相互に対向する磁気遮蔽用の第1及び第2の磁性体と、
前記第1及び第2の磁性体間に配置される感磁素子と、
前記第1及び第2の磁性体間を通る電流導体とを備え、
前記感磁素子が、前記第1及び第2の磁性体間の空隙の中心同士を結ぶ第1の仮想直線より前記第1の磁性体側にあり、かつ、前記電流導体のうち前記第1及び第2の磁性体間を通る部分が前記第1の仮想直線より前記第2の磁性体側にある、電流センサ。
First and second magnetic bodies for magnetic shielding opposed to each other;
A magnetosensitive element disposed between the first and second magnetic bodies;
A current conductor passing between the first and second magnetic bodies,
The magnetosensitive element is closer to the first magnetic body than a first imaginary straight line connecting the centers of the gaps between the first and second magnetic bodies, and the first and second of the current conductors. A current sensor in which a portion passing between the two magnetic bodies is on the second magnetic body side with respect to the first virtual straight line.
前記感磁素子の位置では、前記第1の仮想直線上かつ前記第1及び第2の磁性体の空隙間の中央位置と比較して、前記第1及び第2の磁性体の残留磁化により発生する磁界の感磁方向成分の和の絶対値が小さい、請求項1に記載の電流センサ。   At the position of the magnetosensitive element, it is generated by the remanent magnetization of the first and second magnetic bodies on the first imaginary straight line and compared to the center position between the gaps of the first and second magnetic bodies. The current sensor according to claim 1, wherein an absolute value of a sum of magnetosensitive direction components of a magnetic field to be performed is small. 前記感磁素子が、前記第1の磁性体の両端縁同士を結ぶ第2の仮想直線上、あるいは前記第2の仮想直線を挟んで前記電流導体のうち前記第1及び第2の磁性体間を通る部分の反対側となる位置にある、請求項1又は2に記載の電流センサ。   The magnetosensitive element is on a second imaginary straight line connecting both end edges of the first magnetic body, or between the first and second magnetic bodies of the current conductor across the second imaginary straight line. The current sensor according to claim 1, wherein the current sensor is located at a position opposite to a portion passing through. 前記第1及び第2の磁性体に挟まれた基板を備え、前記感磁素子と、前記電流導体のうち前記第1及び第2の磁性体間を通る部分とが、前記基板を挟んで相互に反対側にある、請求項1から3のいずれか一項に記載の電流センサ。   A substrate sandwiched between the first and second magnetic bodies, wherein the magnetosensitive element and a portion of the current conductor that passes between the first and second magnetic bodies sandwich the substrate; The current sensor according to claim 1, which is on the opposite side of the current sensor. 前記感磁素子を含む磁気検出部が出力にヒステリシスを有する請求項1から4のいずれか一項に記載の電流センサ。   5. The current sensor according to claim 1, wherein the magnetic detection unit including the magnetosensitive element has hysteresis in output. 前記第1の磁性体の両端縁が、前記第2の磁性体の両端縁と空隙を介してそれぞれ対向し、かつ、前記第1及び第2の磁性体は全体として前記電流導体のうち前記第1及び第2の磁性体間を通る部分と前記感磁素子とを内側に取り囲んでいる、請求項1から5のいずれか一項に記載の電流センサ。   Both end edges of the first magnetic body are opposed to both end edges of the second magnetic body through gaps, respectively, and the first and second magnetic bodies are the first of the current conductors as a whole. 6. The current sensor according to claim 1, wherein a portion passing between the first and second magnetic bodies and the magnetosensitive element are surrounded on the inside. 前記第1及び第2の磁性体の保磁力が互いに等しい又は近似する請求項1から6のいずれか一項に記載の電流センサ。   The current sensor according to any one of claims 1 to 6, wherein the coercive forces of the first and second magnetic bodies are equal to or close to each other.
JP2015522913A 2013-06-21 2014-06-16 Current sensor Active JP6384677B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013130595 2013-06-21
JP2013130595 2013-06-21
PCT/JP2014/065924 WO2014203862A2 (en) 2013-06-21 2014-06-16 Current sensor

Publications (2)

Publication Number Publication Date
JPWO2014203862A1 true JPWO2014203862A1 (en) 2017-02-23
JP6384677B2 JP6384677B2 (en) 2018-09-05

Family

ID=52105436

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015522913A Active JP6384677B2 (en) 2013-06-21 2014-06-16 Current sensor

Country Status (2)

Country Link
JP (1) JP6384677B2 (en)
WO (1) WO2014203862A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6278909B2 (en) * 2015-02-03 2018-02-14 アルプス電気株式会社 Current sensor
JP7203490B2 (en) * 2017-09-29 2023-01-13 昭和電工株式会社 Magnetic sensor assembly and magnetic sensor assembly manufacturing method
WO2023188293A1 (en) * 2022-03-31 2023-10-05 Tdk株式会社 Fixation structure, and electronic unit
JP7329118B1 (en) 2022-10-24 2023-08-17 旭化成エレクトロニクス株式会社 current sensor
CN117949710A (en) * 2022-10-28 2024-04-30 苏州力特奥维斯保险丝有限公司 Current sensor with reverse shielding element
KR102560318B1 (en) * 2023-04-25 2023-07-27 주식회사 이지코리아 Noise shield type current sensor

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008275321A (en) * 2007-04-25 2008-11-13 Tdk Corp Current sensor
JP2010008050A (en) * 2008-06-24 2010-01-14 Tdk Corp Current sensor
US20100231198A1 (en) * 2009-03-12 2010-09-16 Consolidated Edison Company Of New York, Inc. Current measuring device
US20100264905A1 (en) * 2007-12-22 2010-10-21 Sensitec Gmbh Arrangement for the potential-free measurement of currents
JP2011149827A (en) * 2010-01-21 2011-08-04 Panasonic Electric Works Co Ltd Energization information measuring device
JP2011185870A (en) * 2010-03-10 2011-09-22 Tdk Corp Magnetic sensor
JP2013011469A (en) * 2011-06-28 2013-01-17 Denso Corp Current sensor

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008275321A (en) * 2007-04-25 2008-11-13 Tdk Corp Current sensor
US20100264905A1 (en) * 2007-12-22 2010-10-21 Sensitec Gmbh Arrangement for the potential-free measurement of currents
JP2010008050A (en) * 2008-06-24 2010-01-14 Tdk Corp Current sensor
US20100231198A1 (en) * 2009-03-12 2010-09-16 Consolidated Edison Company Of New York, Inc. Current measuring device
JP2011149827A (en) * 2010-01-21 2011-08-04 Panasonic Electric Works Co Ltd Energization information measuring device
JP2011185870A (en) * 2010-03-10 2011-09-22 Tdk Corp Magnetic sensor
JP2013011469A (en) * 2011-06-28 2013-01-17 Denso Corp Current sensor

Also Published As

Publication number Publication date
WO2014203862A2 (en) 2014-12-24
JP6384677B2 (en) 2018-09-05
WO2014203862A3 (en) 2015-03-12

Similar Documents

Publication Publication Date Title
JP6350785B2 (en) Inverter device
JP6384677B2 (en) Current sensor
US10114044B2 (en) Current sensor
JP5489145B1 (en) Current sensor
US7626376B2 (en) Electric current detector having magnetic detector
US7642768B1 (en) Current sensor having field screening arrangement including electrical conductors sandwiching magnetic permeability layer
JP6107942B2 (en) Magnetic current sensor and current measuring method
JP2013238580A (en) Current sensor
CN113203885B (en) Current sensor, magnetic sensor and circuit
CN113376422B (en) Current sensor for improving functional safety
WO2014192625A1 (en) Current sensor
US10498198B2 (en) Magnetic sensor
TW202009511A (en) Current sensing module
WO2012046547A1 (en) Current sensor
WO2014123007A1 (en) Electric current sensor
JP5704347B2 (en) Current sensor
JP5487403B2 (en) Current sensor
WO2017010210A1 (en) Electric current sensor
JP6413317B2 (en) Current sensor
JP5704352B2 (en) Current sensor
CN109328307B (en) Magnetic sensor and current sensor provided with same
JP2010101635A (en) Magnetic balance type current sensor
WO2012060069A1 (en) Current sensor
JP2013047610A (en) Magnetic balance type current sensor
JP2018044788A (en) Current sensor

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170207

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180110

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180306

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180711

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180724

R150 Certificate of patent or registration of utility model

Ref document number: 6384677

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150