JPS5626452A - Semiconductor case - Google Patents
Semiconductor caseInfo
- Publication number
- JPS5626452A JPS5626452A JP10172379A JP10172379A JPS5626452A JP S5626452 A JPS5626452 A JP S5626452A JP 10172379 A JP10172379 A JP 10172379A JP 10172379 A JP10172379 A JP 10172379A JP S5626452 A JPS5626452 A JP S5626452A
- Authority
- JP
- Japan
- Prior art keywords
- stem
- semiconductor case
- unnecessary
- constitution
- costs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4817—Conductive parts for containers, e.g. caps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
PURPOSE:To improve mass productivity by forming a cap and a a stem by plastic deformation from a material. CONSTITUTION:The side of a cylindrical product 5 with a metallic bottom such as steel or the like is compressed in a central axis direction 10 of the cylinder with uniform force. At this time, a stem is left without applying force to the bottom. In this composition, a connecting process is unnecessary and costs will be reduced and it is advantage for mass production. And no welding points make good airtightness.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10172379A JPS5626452A (en) | 1979-08-09 | 1979-08-09 | Semiconductor case |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10172379A JPS5626452A (en) | 1979-08-09 | 1979-08-09 | Semiconductor case |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5626452A true JPS5626452A (en) | 1981-03-14 |
Family
ID=14308211
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10172379A Pending JPS5626452A (en) | 1979-08-09 | 1979-08-09 | Semiconductor case |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5626452A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60232223A (en) * | 1984-04-28 | 1985-11-18 | Seibu Giken:Kk | Filter element |
JPS6186919A (en) * | 1984-10-02 | 1986-05-02 | Azumi Roshi Kk | Filter material and its preparation |
JPS61268327A (en) * | 1985-05-23 | 1986-11-27 | Toray Ind Inc | Filter material for organic polymer solution |
JPH05503182A (en) * | 1989-12-15 | 1993-05-27 | ベーリンガー マンハイム コーポレーション | Regulated branch power supply |
-
1979
- 1979-08-09 JP JP10172379A patent/JPS5626452A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60232223A (en) * | 1984-04-28 | 1985-11-18 | Seibu Giken:Kk | Filter element |
JPS6186919A (en) * | 1984-10-02 | 1986-05-02 | Azumi Roshi Kk | Filter material and its preparation |
JPH0470923B2 (en) * | 1984-10-02 | 1992-11-12 | Azumi Filter Paper | |
JPS61268327A (en) * | 1985-05-23 | 1986-11-27 | Toray Ind Inc | Filter material for organic polymer solution |
JPH05503182A (en) * | 1989-12-15 | 1993-05-27 | ベーリンガー マンハイム コーポレーション | Regulated branch power supply |
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