JPH0279386A - Pipe heating apparatus and semiconductor manufacturing apparatus using same - Google Patents

Abstract

PURPOSE:To make it possible to control temperature of a pipe uniformly by installing heating rings electrically connected to an electric power supplying cord on the pipe while keeping a prescribed distance between a ring and another one along to the longitudinal direction of the pipe. CONSTITUTION:A heating apparatus is composed with heating rings which are able to be installed on a pipe 2 and electric power supplying cords 4a, 4b to apply electric voltage to the heating rings 3 where the heating rings are made of a heat generating body of a metal or a rubber containing conductive powder such as carbon and can generate heat to a prescribed temperature by supply of electric power. The heating rings connected electrically with electric power by the electric power supplying cords are installed on the pipe while keeping a prescribed distance between a ring and another along the longitudinal direction of the pipe. As a result, the temperature of the pipe is controlled uniformly.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a pipe heating device, and in particular to a technique that is effective when applied to uniform pipe temperature and prevention of dew condensation of reaction gas in semiconductor manufacturing equipment. .

[Conventional technology]

For piping to vacuum equipment in semiconductor manufacturing equipment, piping materials such as stainless steel, iron, or copper alloys that can withstand the fluid pressure of the reaction gas flowing inside the piping and are resistant to heat and mechanical shock are used. There is.

These piping materials are susceptible to corrosion caused by reactive gases flowing inside the piping.
The material must also be resistant to contamination.

In addition, many of the reactive gases used in recent semiconductor manufacturing equipment are liquefied due to high-pressure filling, and the liquefied reactive gas is introduced into the reaction chamber from a gas cylinder through a long pipe.

For example, NH3, N20. S 12H6, S
Examples include iN2C12, and these reactive gases are highly corrosive and liquefiable.

Therefore, if these reactive gases condense in the piping and adhere to the interior of the piping, it not only becomes difficult to control the flow rate of the reactive gas sent to the reaction chamber, but also reduces the corrosion resistance of the piping and may react with reactive gases to form deposits. There is a risk that the deposits will adhere to the inside of the pipes and cause pipe clogging.

For this reason, heating devices such as band-shaped tape heaters with heating elements embedded in rubber or cloth were wrapped around the pipes to raise the temperature of the pipes, preventing condensation of the reactant gas and preventing clogging of the pipes due to deposits. .

[Problem to be solved by the invention]

However, in the conventional technology as described above, there is a problem in that the tape heater is wound unevenly, making it impossible to make the pipe temperature uniform. In particular, it is difficult to wrap a tape heater around curved pipes, making it more difficult to increase the heat retention effect over the entire length of the pipe.

Further, with regard to thin pipes, there is a problem in that the outer shape after wrapping the tape heater becomes abnormally large compared to the outer shape of the pipe, and the pipe space is taken up more than necessary.

Furthermore, it is undesirable from a safety point of view to expand, contract, or curve the heating element incorporated in the tape heater.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a pipe heating device that enhances the heat retention effect and allows safe temperature control.

Another object of the present invention is to provide a semiconductor manufacturing apparatus that can improve the flow controllability of a reactive gas.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means to solve the problem]

A brief overview of typical inventions disclosed in this application is as follows.

That is, the pipe heating device of the present invention has heating rings connected to power supply by power supply cords installed at predetermined intervals along the length of the pipe.

Further, in the pipe heating device of the present invention, the power supply cord of the heating ring is provided with a connecting terminal at least one end of a predetermined length that can be inserted into and removed from the terminal portion of the heating ring.

Further, in the pipe heating device of the present invention, the heating rings are integrally connected to each other for power supply using a power supply cord in advance.

Furthermore, a semiconductor manufacturing apparatus using the pipe heating device of the present invention is equipped with the above-mentioned pipe heating device.

[Effect]

According to the above-mentioned pipe heating device, the temperature of the pipe can be uniformly controlled by installing heat-generating rings connected to the power supply by the power supply cord at predetermined intervals along the length of the pipe. .

Further, according to the pipe heating device of the present invention, the power supply cord of the heat generating ring is provided with a connecting terminal that can be inserted into and removed from the terminal portion of the heat generating ring at at least one end of the predetermined length, so that the power supply cord of the heat generating ring can be connected to the pipe. Can be installed and removed from piping freely.

Further, according to the semiconductor manufacturing apparatus of the present invention, by using a pipe heating device in which a heat generating ring can be attached along the length of the pipe, dew condensation can be prevented in the pipe for feeding the reaction gas.

〔Example〕

FIG. 1(a) is a perspective view showing a pipe heating device according to an embodiment of the present invention, FIG. 1(b) is an exploded perspective view of the pipe heating device of this embodiment, and FIG. FIG. 2(b) is a perspective view of another heating ring used in the piping heating device of the invention, FIG. 2(C) is a perspective view of another heating ring, and FIG. 2(C) is another embodiment of the piping heating device of the invention. FIG. 3 is a configuration diagram of a reduced pressure CVD apparatus in which the pipe heating apparatus of the present invention is used.

First, the configuration of an embodiment of a pipe heating device will be described with reference to FIGS. 1(a) and 1(b).

As shown in FIG. 1(a), the pipe heating device 1 of this embodiment
are a heat generating ring 3 that can be attached to the pipe 2, and a heat generating ring 3 that can be attached to the pipe 2.
It is comprised of power supply cords 4a and 4b that supply voltage to.

The heating link 3 is formed of a heating element such as rubber containing metal or conductive powder such as carbon, and can be heated to a predetermined temperature by supplying voltage.

In addition, as shown in FIG. 1, etc., the heating ring 3 is provided with a terminal portion 5 to which the power supply cords 4a and 4b are connected, and a slit 6 on the opposite side surface of the terminal portion 5, and has an elastic force made of the above material. Since it is formed, it can be freely attached to and detached from the piping 2.

The power supply cords 4a and 4b are a power supply cord 4a that connects a voltage supply source (not shown) and the heat generation link 3, and a heat generation ring 3.
There are two types of power supply cords 4b that connect between the two, and both are used to supply voltage to the heat generating ring 3.

Further, the power supply cord 4a includes a power supply terminal 7a connected to a voltage supply source at one end, and a connection terminal 7b connected to the heating ring 3 at the other end.
b are connected to each other by a heat-resistant cord 8 coated with a conductive material and made to have a predetermined length.

On the other hand, the power supply cord 4b has connecting terminals 9a and 9b at both ends to be connected to the heat generating ring 3.The connecting terminals 9a and 9b at both ends are connected with a heat resistant cord 10 coated with a conductive material, and the heat generating ring 3 They are made to the length that fits the distance between them.

Next, the operation of the pipe heating device 1 shown in FIGS. 1(a) and 1(b) will be explained.

By applying force to open the slits 6 of the heat generating ring 3 formed with elastic force, the heat generating ring 3 is attached to the piping 2 at a predetermined interval.

Therefore, if the outer diameter of the pipe 2 is known in advance, the heating ring 3 having an outer diameter that matches the diameter can be used and attached to any position on the long pipe 2, and can be freely attached and detached as necessary.

Of the heat generating rings 3 attached to the piping 2, the connection terminal 7b of the power supply cord 4a is connected to one end of the terminal portion 5 of the first heat generating ring 3 near the voltage supply source, and the other end is connected to a power supply of a different type. The connecting terminal 9a of the cord 4b is connected.

Further, the power supply cord 4a whose one end is connected to the terminal portion 5 of the first heating ring 3 is connected to a voltage supply source through a power supply terminal 7a at the other end.

On the other hand, the power supply cord 4b, which has one end connected to the terminal portion 5 of the first heat generating ring 3, is connected to the terminal portion 5 of the second heat generating ring 3 by a connecting terminal 9b provided at the other end.

In this way, all the heat generating rings 3 attached to the pipe 2 are connected by the power supply cords 4a, 4b, and voltage can be supplied to all the heat generating rings 3 attached.

Furthermore, the temperature of the heating ring 3 to which voltage is supplied increases, and the pipe 2 can be kept at a constant temperature.

Furthermore, the temperature of the pipe 2 is determined by the spacing and number of heat generating rings 3 attached to the pipe 2, and is not affected by the shape of the pipe 2, such as its length or bending.

Therefore, the temperature of the pipe 2 can be made uniform by the number of heat generating rings 3 and the interval L between the heat generating rings 3 and the interval L between the heat generating rings 3 and the heat generating ring 3, and at the same time, the heat retention effect of the fluid flowing inside the pipe 2 can be enhanced.

In addition, by changing the material of the heat generating ring 3 and changing the amount of heat generated, it is possible, for example, to gradually increase the temperature of the pipe 2 or to gradually cool it, so that the temperature of the fluid flowing inside the pipe 2 can be increased. Easier to control.

Next, an application example of the heating ring 3 is shown in Fig. 2 (a) and 2).
This is explained by:

The heating ring 3a in FIG. 2(a) is similar to the heating ring 3a in FIG.
) is made of the same material as the heat generating ring 3 shown in FIG.

This heating ring 3a may be supplied with voltage by connecting power supply cords 4a, 4b provided with connection terminals 7a, 7b or 9a, 9b as shown in FIGS. 1(a) and 1(b), or As shown in FIG. 2(C), a voltage may be supplied by integrally connecting the power supply cords 4c and 4d without connection terminals to each other in advance.

The heat generating ring 3b in FIG. 2(b) has the same external structure as the heat generating ring 3a in FIG. 2(a), but is made of a plastically deformable material and can be attached to the pipe 2 It is fixed in a ring shape, and voltage is supplied in the same manner as in FIG. 2(a).

Next, a case where the pipe heating device 1 of this embodiment is used in a low pressure CVD device 11 which is a semiconductor manufacturing device will be explained with reference to FIG.

The low pressure CVD apparatus 11 includes a reaction chamber 13 in which film formation is mainly performed on a semiconductor wafer 12, and equipment such as a gas cylinder 14, a valve 15, and a uniflow meter 16 that supply and control a reaction gas into the reaction chamber 13. It is comprised of equipment such as a low-pressure pump 17 and a mechanical booster pump 18 that reduce the pressure inside the reaction chamber 13.

The pipe heating device 1 of this embodiment is, for example, a gas cylinder 1.
Connect each device from 4 to reaction chamber 13, and connect gas cylinder 1
It is used as a pipe 19 for sending the reaction gas supplied from 4 into the reaction chamber 13.

First, when a reaction gas is supplied from the gas cylinder 14 filled with reaction gas, the valve 15 is opened based on the measurement by the uniflow meter 16, and the gas cylinder 14 is filled with the reaction gas.
The reaction gas supplied from 4 is sent to the reaction chamber 13 through a pipe 19 to which a pipe heating device 1 is attached.

At the same time, the reaction gas in the reaction chamber 13 is sucked by the low-pressure pump 17 and the mechanical booster pump 18, and the pressure in the reaction chamber 13 is reduced to a pressure lower than atmospheric pressure.

At this time, processing is performed within the reaction chamber 13, and film formation is performed simultaneously on a large number of semiconductor wafers 12 housed therein.

Therefore, the temperature of the reaction gas flowing inside the pipe is controlled by the pipe heating device 1, so that dew condensation due to the pressure difference with the inside of the gas cylinder 14 does not occur, and the long pipe 1
9 and the curved piping 19, the pipes are not clogged with deposits, so the controllability of the flow rate of the reaction gas can be improved.

As above, the invention made by the present inventor has been specifically explained based on Examples, but it should be noted that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Not even.

For example, for the heating ring, see Figure 1 (a), et al.
The external shape is not limited to those shown in FIGS. 2(a) and 2(b), and any structure may be used as long as it can be attached to and detached from the piping.

Also, regarding the terminal part of the heating ring and the connection terminal of the power supply cord, see Figure 1 (b) and Figures 2 (a) and (b).
Structures that can be connected to each other for power supply, including but not limited to those shown in
For example, a structure may be used in which the terminal portion is convex and the connection terminal is concave. Of course, for example, as shown in FIG. 2(C), the heating ring and the power supply cord may be integrally connected to each other for power supply in advance.

Furthermore, the semiconductor manufacturing equipment is not limited to the low pressure CVD equipment shown in FIG. 3, but is applicable to all semiconductor manufacturing equipment using other CVD equipment.

In the above explanation, the invention made by the present inventor is mainly applied to a pipe heating device used in semiconductor manufacturing equipment, which is its field of application, but is not limited to this. The present invention is also widely applicable to control devices that control flow rate using pipes made of metal or plastic such as vinyl.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

(1) By installing heat-generating rings that are connected to the power supply cord at predetermined intervals along the length of the pipe, the temperature of the pipe can be controlled uniformly and the heat retention effect can be improved. This makes it easier to control the temperature of the fluid flowing inside the pipe.

(2) The power supply cord of the heating ring has a connecting terminal at least one end of the predetermined length that can be inserted into and removed from the terminal of the heating ring, so it can be easily attached to and removed from the piping. It is easy to handle because it can be
The safety of the pipe heating device can be improved.

(3) By using a pipe heating device in semiconductor manufacturing equipment that can attach a heating ring along the length of the pipe,
Since dew condensation can be prevented in the piping for feeding the reaction gas, the controllability of the flow rate of the reaction gas can be improved without the formation of deposits in the piping.

[Brief explanation of the drawing]

FIG. 1(a) is a perspective view showing a pipe heating device according to an embodiment of the present invention, FIG. 1(1)) is an exploded perspective view of the pipe heating device of this embodiment, and FIG. 2(a) is FIG. 2(b) is a perspective view of another heat generating ring used in the pipe heating device of the present invention. FIG. 2(C) is a perspective view of another heat generating ring used in the pipe heating device of the present invention. A perspective view showing an example, FIG. 3 is a low pressure CVD in which the pipe heating device of the present invention is used.
It is a block diagram of a device. 1.1a... Piping heating device, 2, 2a... Piping, 3
．． 3a, 3b--Heating ring, 4a. 4b, 4c, 4d-・Power supply cord, 5.5a. 5b...Terminal part, 6.6a, 6b...Slit, 7
a...Power supply terminal, 7b, 9a, 9b...Connection terminal,
8.10...Heat-resistant cord, 11...Low pressure CVD equipment (semiconductor manufacturing equipment), 12...Semiconductor wafer, 13.
...Reaction chamber, 14...Gas cylinder, 15...Valve, 16...Uniflow meter, 17...Rotary ribbon valve, 18...Mechanical booster pump, 19...
・Piping, L... spacing.

Claims (1)

[Scope of Claims] 1. A pipe heating device characterized in that heating rings connected to power supply by a power supply cord are attached at predetermined intervals along the length of the pipe. 2. The piping heating device according to claim 1, wherein the power supply cord of the heating ring is provided with a connecting terminal at least one end of a predetermined length that can be inserted into and removed from a terminal portion of the heating ring. 3. The piping heating device according to claim 1, wherein the heating rings are integrally connected to each other for power supply through a power supply cord in advance. 4. A semiconductor manufacturing device using the pipe heating device according to claim 1, 2 or 3.