JP6492992B2 - Power converter - Google Patents

Description

  The present invention relates to a power conversion device that converts input power and supplies it to a load.

  2. Description of the Related Art Conventionally, as one of power conversion devices, a charging device that charges a storage battery using power supplied from an external power source is known (see, for example, Patent Document 1). The charging part which comprises this charging device has a primary coil and a secondary coil, converts the electric power supplied from the external power supply into charging electric power, and supplies charging electric power to a storage battery. Further, the noise removing unit removes a noise component included in the charging power supplied to the storage battery by the charging unit, thereby removing a noise component that wraps around the output side of the charging device, and stabilizes the output of the charging device.

JP 2014-60893 A

  However, the charging device of Patent Document 1 has the following problems. That is, by inserting a capacitor as a filter between the power supply line and the housing in the noise removing unit, the impedance of the capacitor is lowered in a low frequency region. Thereby, the noise between a power supply line and a housing | casing can be suppressed and the noise which propagates to the power supply side can be suppressed. However, when the frequency is high, the internal equivalent series inductance component and the lead wire inductance component enter the capacitor capacitance component in series. For this reason, there exists a problem that the impedance rises and the noise which propagates to the power supply side cannot be suppressed.

  The subject of this invention is providing the power converter device which can suppress the noise which propagates to the power supply side also in the area | region of a high frequency.

In order to solve the above problems, a power converter according to the present invention includes a power supply, a first power supply bus, a second power supply bus, a power module, a conductive member, and a load. One end of the first power supply bus and the second power supply bus is connected to the power source, and the other end is connected to the power module. The conductive member is disposed between the first power supply bus and the second power supply bus. The housing accommodates the power module. One end of the conductive member is connected to the housing, and the coupling capacity between the first power supply bus and the housing and the coupling capacity between the second power supply bus and the housing are the power supply and the housing at a desired frequency. It is smaller than the impedance between the body.

  According to the present invention, an inductance component that is in series with the coupling capacitance formed between the first power supply bus and the conductive member and a coupling capacitance that is formed between the second power supply bus and the conductive member are in series. The inductance component can be reduced. For this reason, it can suppress that the switching noise which generate | occur | produces between a 1st electric power feeding bus | bath and a 2nd electric power feeding bus | bath propagates to the power supply side also in a high frequency area | region.

It is a figure which shows the structure of the power converter device which concerns on Example 1 of this invention. It is the figure which represented the power converter device shown in FIG. 1 three-dimensionally. It is a side view which cuts and shows the power converter device which concerns on Example 1 of this invention by the surface A of FIG. 1 and FIG. It is a figure which shows the specific circuit example of the power converter of the power converter device which concerns on Example 1 of this invention. It is a figure which shows the other specific circuit example of the power converter part of the power converter device which concerns on Example 1 of this invention. It is a figure which shows the other specific circuit example of the power converter of the power converter device which concerns on Example 1 of this invention. It is the figure which showed the structure of the power converter (inverter) shown in FIG. 6 simply in two dimensions. It is a figure which shows the structure of the power converter device which concerns on Example 2 of this invention, and has shown the example by which the power converter part was comprised by the inverter. It is a side view which cuts and shows the power converter device which concerns on Example 2 shown in FIG. It is a figure which shows the relationship between the capacity | capacitance formed in the power converter device which concerns on Example 2 of this invention, and an inductance. It is the side view and perspective view which show the structure of the power converter device which concerns on Example 3 of this invention. It is a side view cut | disconnected and shown by the line B of Fig.11 (a). It is a figure for demonstrating the effect of the power converter device which concerns on Example 3 of this invention. It is a figure which shows the example by which the 2nd electric power feeding bus of the power converter device which concerns on Example 3 of this invention is arrange | positioned near the housing | casing. It is a side view cut | disconnected and shown by the line B of Fig.11 (a). It is a figure which shows the structure of the power converter device which concerns on Example 4 of this invention. It is a figure which shows the structure of the modification of the power converter device which concerns on Example 4 of this invention. It is a figure which shows the structure of the other modification of the power converter device which concerns on Example 4 of this invention. It is a figure which shows the relationship between the impedance and frequency in the power converter device which concerns on Example 4 of this invention. It is a figure which shows the structure of the power converter device which concerns on Example 5 of this invention. It is a figure which shows the structure of the modification of the power converter device which concerns on Example 5 of this invention. It is a figure which shows the relationship between the impedance and frequency in the power converter device which concerns on Example 5 of this invention. It is a figure which shows the structure of the power converter device which concerns on Example 6 of this invention. It is the perspective view which showed the power converter device shown in FIG. 23 in three dimensions.

  Hereinafter, a power converter according to an embodiment of the present invention will be described in detail with reference to the drawings.

Example 1
In general, a power conversion apparatus accommodates a semiconductor switch (hereinafter referred to as a power module) including a discrete package semiconductor element or a modularized power semiconductor element in a casing. The power conversion device performs power conversion by opening and closing the semiconductor switch in accordance with a signal from the control circuit.

  1 is a diagram illustrating a configuration of a power conversion device according to a first embodiment of the present invention, and FIG. 2 is a diagram three-dimensionally illustrating the power conversion device illustrated in FIG. 1. The power conversion device includes a power source 11, a power conversion unit 12, and a load 13. The power source 11 is composed of, for example, a home system power source or a DC power source, and generates DC power and sends it to the power converter 12. The load 13 is composed of an inverter, for example, and is driven by the power from the power conversion unit 12.

  The power conversion unit 12 includes a power module 20, a first power supply bus 21, a second power supply bus 22, and a conductive member 23. The first power supply bus 21 is made of a plate-like conductive member, one end of which is connected to the positive terminal of the power source 11 and the other end is connected to the power module 20. The second power supply bus 22 is made of a plate-like conductive member, one end of which is connected to the negative terminal of the power source 11 and the other end is connected to the power module 20. The power module 20 includes a semiconductor switch that switches DC power from the power source 11, converts the DC power from the power source 11 into predetermined power, and supplies the power to the load 13 through the output line 24. The conductive member 23 is disposed between the first power supply bus 21 and the second power supply bus 22 and functions as one electrode of a coupling capacitor formed between the first power supply bus 21 and the second power supply bus 22. .

  FIG. 3 is a side view showing the power conversion device according to the first embodiment shown in FIGS. 1 and 2 cut along a plane A indicated by a broken line in FIGS. 1 and 2, and a first power supply bus 21, An image of the coupling capacitance formed by the second power supply bus 22 and the conductive member 23 is shown. That is, the first power supply bus 21 and the conductive member 23 form a coupling capacitance C11, and the second power supply bus 22 and the conductive member 23 form a coupling capacitance C21.

  Each capacitance component C of the coupling capacitance C11 and the coupling capacitance C21 can be expressed by the following equation (1).

  FIG. 4 is a diagram illustrating a specific circuit example of the power conversion unit 12. The power conversion unit 12 constitutes a non-insulated converter that converts the voltage of the power supply 11 into another voltage. The power converter mainly converts low-voltage power into high-voltage power.

  The power conversion unit 12 includes a first smoothing capacitor C1, an inductor L, a semiconductor switch Q, a diode D, a second smoothing capacitor C2, and a control circuit 31. The first smoothing capacitor C <b> 1 is provided between the first power supply bus 21 and the second power supply bus 22. One end of the inductor L is connected to the first power supply bus 21. The semiconductor switch Q is provided between the other end of the inductor L and the second power supply bus 22. The diode D has an anode connected to the other end of the inductor L. The second smoothing capacitor C <b> 2 is provided between the cathode of the diode D and the second power supply bus 22. The control circuit 31 is connected to the control terminal of the semiconductor switch Q.

  In the power conversion device configured as described above, detailed description of the operation is omitted. The control circuit 31 boosts and converts the voltage output from the low-voltage power supply 11 to a desired voltage by turning on and off the semiconductor switch Q by a control signal to control the duty, and via the output line 24 Supply to load 13.

  FIG. 5 is a diagram illustrating another specific circuit example of the power conversion unit 12. The power conversion unit 12 constitutes an insulating converter that converts a DC voltage from the power supply 11 into another DC voltage.

  The power conversion unit 12 includes a first smoothing capacitor C1, a power module 20, a control circuit 31, a transformer T, a rectifier circuit 32, and a second smoothing capacitor C2. The power module 20 includes an inverter composed of four semiconductor switches Q1 to Q4. The first smoothing capacitor C1 and the power module 20 are provided between the first power supply bus 21 and the second power supply bus 22. The control circuit 31 is connected to the control terminals of the semiconductor switches Q1 to Q4 constituting the power module 20, and controls on / off of the semiconductor switches Q1 to Q4. The output of the power module 20 is connected to the primary winding of the transformer T.

  A rectifier circuit 32 in which a bridge full-wave rectifier circuit is formed by four diodes D1 to D4 is connected to the secondary winding of the transformer T. A second smoothing capacitor C <b> 2 that smoothes the pulsating voltage is connected to the output side of the rectifier circuit 32, and the output of the rectifier circuit 32 is supplied to the load 13 via the output line 24.

  In the power conversion device having the power conversion unit 12 configured as described above, detailed description of the operation is omitted. The power conversion device controls the duty by turning on / off the semiconductor switches Q1 to Q4 according to a control signal from the control circuit 31, and varies the output voltage by appropriately selecting the turn ratio of the transformer T. The voltage is converted and supplied to the load 13.

  FIG. 6 shows still another specific circuit example of the power conversion unit 12. The power converter 12 constitutes an inverter that converts a DC voltage from the power supply 11 into a three-phase AC voltage.

  The power converter 12 includes an inverter 33 including a first smoothing capacitor C1 provided between the first power supply bus 21 and the second power supply bus 22 and a power module 20 including six semiconductor switches Q1 to Q6. Have. The control circuit 31 that rectifies the on / off of the semiconductor switches Q1 to Q6 is not shown.

  In the power conversion device configured as described above, a detailed description of the operation is omitted. The power conversion device converts the DC voltage from the power supply 11 into a three-phase AC voltage by turning on / off the semiconductor switches Q1 to Q6 by a control signal from the control circuit 31 to control the duty, and three wires Is supplied to the load 13 through an output line 24 comprising:

  FIG. 7 is a two-dimensional simplified diagram showing the structure of the power conversion unit 12 (inverter 33) shown in FIG. The power conversion unit 12 accommodates the first power supply bus 21, the second power supply bus 22, the first smoothing capacitor C <b> 1, and the power module 20 in the housing 10.

  Generally, switching noise is generated between the first power supply bus 21 and the second power supply bus 22 by switching of the semiconductor switches constituting the power module 20. However, in the first embodiment, the conductive member 23 is provided, and an inductance component that enters in series with the coupling capacitance formed between the first power supply bus 21 and the conductive member 23, and the second power supply bus 22 and the conductive member 23 Inductance components entering in series with the coupling capacitance formed therebetween can be reduced. As a result, it is possible to suppress propagation of high-frequency switching noise generated between the first power supply bus 21 and the second power supply bus 22 to the power supply side.

  Further, from the equation (1), by adjusting the relative dielectric constant, opposing area or distance of the capacitor, the coupling capacitance formed between the first power supply bus 21 and the conductive member 23, and the second power supply bus 22 The coupling capacitance formed between the conductive member 23 and the conductive member 23 can be substantially matched. For this reason, the coupling capacitance formed between the first power supply bus 21 and the second power supply bus 22 can be increased, and the noise generated between the first power supply bus 21 and the second power supply bus 22 is reduced. be able to.

(Example 2)
FIG. 8 is a diagram illustrating the configuration of the power conversion device according to the second embodiment of the present invention, in which the power conversion unit 12 includes an inverter and the power source 11 includes a DC power source. The power supply 11 and the power conversion unit 12 are connected by a shield line, the positive electrode of the power supply 11 is connected to the first power supply bus 21 inside the power conversion unit 12, and the negative electrode is the second power supply inside the power conversion unit 12. Connected to the bus. The output line 24 that connects the output of the power conversion unit 12 and the load 13 is also a shield line.

  Moreover, the 1st electric power feeding bus line 21, the 2nd electric power feeding bus line 22, and the electrically-conductive member 23 consist of plate-shaped electrically-conductive members. The output of the power module 20 is connected to the output line 24 via a plate-like conductor 25 made of a plate-like conductive member.

  The case of the power conversion device according to the second embodiment is the same as that of the power conversion device according to the first embodiment. That is, an inductance component that is in series with the coupling capacitance formed between the first power supply bus 21 and the conductive member 23 and a coupling capacitance that is formed between the second power supply bus 22 and the conductive member 23 are serially connected. The inductance component that enters can be reduced.

  9 is a side view showing the power conversion device according to the first embodiment shown in FIG. 8 cut along a plane A indicated by a broken line in FIG. 8, and includes a first power supply bus 21, a second power supply bus 22, An image of the coupling capacitance formed by the conductive member 23 and the housing 10 is shown. That is, one end of the conductive member 23 is connected to the housing 10, and the coupling capacitor C <b> 11 is formed by the first power supply bus 21, the conductive member 23, and the housing 10, and the second power supply bus 22, the conductive member 23, and the housing are formed. The body 10 forms a coupling capacitor C21. Capacitance components C of the coupling capacitance C11 and the coupling capacitance C21 can be expressed by the above-described equation (1).

  With the above configuration, the common mode high-frequency current generated between the first power supply bus 21 and the second power supply bus 22 and the housing 10 can be suppressed by switching of the semiconductor switch in the power module 20.

  FIG. 10 shows the relationship between the inductance component “L (nH)” and the common mode high-frequency current CURRENT (dB). The inductance component “L (nH)” is a component that enters in series with the coupling capacitor C <b> 11 formed between the first power supply bus 21 and the conductive member 23, or between the second power supply bus 22 and the conductive member 23. It is a component that enters in series with the formed coupling capacitance C21. The common mode high-frequency current CURRENT (dB) is a current that flows between the first power supply bus 21 or the second power supply bus 22 and the housing 10 by switching of the semiconductor switch in the power module 20. It can be seen that the smaller the inductance component “L (nH)” is, the smaller the common mode high-frequency current CURRENT (dB) is.

(Example 3)
FIG. 11 is a diagram illustrating a configuration of a power conversion device according to a third embodiment of the present invention, in which FIG. 11 (a) is a side view and FIG. 11 (b) is a perspective view. In FIG. 11A, the first power supply bus 21 and the conductive member 23 are capacitively coupled by the coupling capacitor C11, and the second power supply bus 22 and the conductive member 23 are capacitively coupled by the coupling capacitor C21. 21 and the second power supply bus 22 are capacitively coupled to the housing 10 respectively. FIG. 11B shows a physical arrangement example of the first power supply bus 21, the second power supply bus 22, the conductive member 23, and the housing 10.

  In addition to the coupling capacitors C11 and C21, when there is a coupling capacitor C12 between the first feeding bus 21 and the housing 10 and a coupling capacitance C22 between the second feeding bus 22 and the housing 10, the coupling capacitance C11 + C12 The coupling capacitance C21 + C22 is substantially matched. With this configuration, the suppression effect can be further increased compared to the case shown in FIG.

  FIG. 12 is a side view taken along line B in FIG. The conductive member 23 is vertically attached to the housing 10, and the first power supply bus 21 and the second power supply bus 22 are respectively disposed on both sides of the conductive member 23 at substantially the same distance from the conductive member 23. With this configuration, the coupling capacitance C11 + C12 = C1 and the coupling capacitance C21 + C22 = C2 can be substantially matched.

  FIG. 13 is a diagram for explaining the effect of the third embodiment. FIG. 11 shows the relationship between the difference | C1-C2 | / | C1 + C2 | between the coupling capacitance C11 + C12 = C1 and the coupling capacitance C21 + C22 = C2 in FIG. 11 and the common mode high-frequency current Ipkpk (A). The common mode high frequency current Ipkpk (A) is a current generated between the first power supply bus 21 or the second power supply bus 22 and the housing 10 by switching of the semiconductor switch in the power module 20. It can be seen that the common-mode high-frequency current decreases as the coupling capacitance approaches the coincidence.

  FIG. 14 is a diagram illustrating an example in which the second power supply bus 22 in FIG. 11 is disposed near the housing 10. Also in this case, the first power supply bus 21 and the conductive member 23 are capacitively coupled by the coupling capacitance C11, and the second power supply bus 22 and the conductive member 23 are capacitively coupled by the coupling capacitance C21. The two power supply buses 22 are capacitively coupled to the housing 10 respectively. In addition to the coupling capacitors C11 and C21, a coupling capacitor C12 between the first power supply bus 21 and the housing 10 and a coupling capacitor C22 between the second power supply bus 22 and the housing 10 exist. In this case, the coupling capacitance C11 + C12 = C1 and the coupling capacitance C21 + C22 = C2 are configured to substantially match. With this configuration, the suppression effect can be further increased compared to the case shown in FIG.

  FIG. 15 is a side view taken along line B in FIG. In FIG. 15A, the second power supply bus 22 is arranged near the housing 10, and the area where the first power supply bus 21 faces the housing 10 is greater than the area where the second power supply bus 22 faces the housing 10. The coupling capacitance C11 + C12 = C1 and the coupling capacitance C21 + C22 = C2 are substantially matched. FIG. 15B is a diagram illustrating a coupling capacity by reducing the distance between a part of the first power supply bus 21 and the housing 10 by bending the first power supply bus 21 in the example illustrated in FIG. C11 + C12 = C1 and coupling capacitance C21 + C22 = C2 are substantially matched. In FIG. 15C, the coupling capacitance C11 + C12 = C1 and the coupling capacitance C21 + C22 = C2 are substantially matched by disposing the housing 10 also on the first power supply bus 21 side. By comprising in this way, the suppression effect shown in FIG. 13 is acquired.

Example 4
FIG. 16 is a diagram illustrating the configuration of the power conversion apparatus according to the fourth embodiment of the present invention. In this power conversion device, a dielectric 26 is filled between the first power supply bus 21 and the second power supply bus 22 of the power conversion device according to the third embodiment (see FIG. 12). With this configuration, the coupling capacity between the first power supply bus 21 and the conductive member 23 and the coupling capacity between the second power supply bus 22 and the conductive member 23 are increased according to the dielectric constant of the dielectric 26. Can do.

  FIG. 17 is a diagram illustrating a configuration of a modified example of the power conversion apparatus according to the fourth embodiment illustrated in FIG. 16. In the power converter according to this modification, the first power supply bus 21, the second power supply bus 22 and the conductive member 23 are entirely covered with a dielectric 26. With this configuration, it is possible to prevent a person from directly touching the first power supply bus 21, the second power supply bus 22, and the conductive member 23.

  FIG. 18 is a diagram illustrating a configuration of another modification of the power conversion device according to the fourth embodiment. The power conversion device according to another modification includes two types of dielectrics 26a between the first power supply bus 21 and the second power supply bus 22 of the power conversion device according to the fourth embodiment (see FIG. 16). 26b is filled. The dielectric 26 a is mainly filled between the first power supply bus 21 and the conductive member 23, and the dielectric 26 b is mainly filled between the second power supply bus 22 and the conductive member 23.

  With this configuration, even when the distance between the first power supply bus 21 and the conductive member 23 is different from the distance between the second power supply bus 22 and the conductive member 23, a dielectric constant that satisfies the equation (1) is selected. As a result, the coupling capacity between the first power supply bus 21 and the housing 10 and the coupling capacity between the second power feeding bus 22 and the housing 10 can be substantially matched.

  FIG. 19 is a diagram illustrating a relationship between impedance and frequency in the power conversion apparatus according to the fourth embodiment. (A1) in the figure is an impedance constituted by a coupling capacitance between the first power supply bus 21 and the housing 10 and a coupling capacitance between the second power feeding bus 22 and the housing 10. (A2) is an impedance constituted by an inductance component of the first power supply bus 21 or the second power supply bus 22. Further, (b1) is an impedance constituted by a coupling capacitance between the power supply line and the housing 10. (B2) is an impedance composed of an inductance component of the power supply line and the housing 10. The resonance frequency f at this time is expressed by the following equation (2).

  Here, the resonance frequency by (a1) and (a2) is fa, and the resonance frequency by (b1) and (b2) is fb. The coupling capacitance between the first feeding bus 21 and the housing 10 and the coupling capacitance between the second feeding bus 22 and the housing 10 are set so that the desired frequency f1 is in the range of fb <f1 <fa. To do. In other words, the coupling capacity between the first power supply bus 21 and the housing 10 and the coupling capacity between the second power feeding bus 22 and the housing 10 are between the power supply 11 and the housing 10 at a desired frequency. It is set to be smaller than the impedance of.

  Thereby, it can suppress that the common mode high frequency current which arises by switching of the semiconductor switch inside the power module 20 propagates to the power supply 11 side. Here, the desired frequency is the frequency of the noise component to be attenuated. When the noise component is large and a large amount of attenuation is required, the frequency can be set lower than the switching frequency of the power module 20.

(Example 5)
FIG. 20 is a diagram illustrating the configuration of the power conversion apparatus according to the fifth embodiment of the present invention. In this power conversion device, the first power supply bus 21 of the power conversion device according to the first embodiment shown in FIG. 3 is replaced with a series circuit including a first A power supply bus 21a, an inductor L1, and a first B power supply bus 21b. is there. That is, one end of the first A power supply bus 21a is connected to the positive terminal of the power supply 11 (not shown), and the other end is connected to one end of the inductor L1. The other end of the inductor L1 is connected to one end of the 1B power supply bus 21b. The other end of the 1B power supply bus 21b is connected to the power module 20 (not shown).

  With the above configuration, normal mode noise that occurs due to switching of the semiconductor switch inside the power module 20 and propagates between the first power supply bus 21 and the second power supply bus 22 can be suppressed by the inductance and the capacitance.

  FIG. 21 is a diagram illustrating a configuration of a modification of the power conversion device according to the fifth embodiment of the present invention. The power conversion device according to the modified example of the fifth embodiment includes the second power supply bus 22 of the power conversion device according to the fifth embodiment illustrated in FIG. 20 from the second A power supply bus 22a, the inductor L2, and the second B power supply bus 22b. Is replaced by a series circuit. That is, one end of the second A power supply bus 22a is connected to the negative terminal of the power supply 11 (not shown), and the other end is connected to one end of the inductor L2. The other end of the inductor L2 is connected to one end of the second B power supply bus 22b. The other end of the 2B power feeding bus 22b is connected to the power module 20 (not shown).

  With the above configuration, the coupling capacitance formed between the inductors L1 and L2, the power supply buses 21a, 21b, 22a and 22b, and the conductive member 23 functions as a filter. For this reason, the common mode high frequency current which arises by switching of the semiconductor switch inside the power module 20 can be suppressed more.

  FIG. 22 is a diagram illustrating a relationship between impedance and frequency in the power conversion apparatus according to the fifth embodiment. At the desired frequency f2, the impedance (b3) constituted by the inductor component is constituted by the coupling capacitance between the first power supply bus 21 and the housing 10 and the coupling capacitance between the second power supply bus 22 and the housing 10. The value of the inductor is set so as to be larger than the impedance (a1). In other words, the inductor is set so that the frequency fab obtained by substituting (a1) and (b3) into equation (2) and the desired frequency f2 satisfy fab <f2.

  With the above configuration, it is possible to further suppress the propagation of the common mode high frequency current generated by the switching of the semiconductor switch inside the power module 20 to the power supply 11 side. Here, the desired frequency is the frequency of the noise component to be attenuated. When a large amount of attenuation is required, it can be set to a frequency lower than the switching frequency of the power module 20.

(Example 6)
FIG. 23 is a diagram illustrating the configuration of the power conversion apparatus according to the sixth embodiment of the present invention. In this power conversion device, in the power conversion device according to the first embodiment shown in FIG. 3, a cooler 27 for cooling the power module 20 is added, and one end of the conductive member 23 is connected to the cooler 27. .

  FIG. 24 is a three-dimensional perspective view of the power conversion device shown in FIG. One end of the conductive member 23 is connected to the cooler 27. For this reason, the common mode high frequency current generated by the switching of the semiconductor switch in the power module 20 flows to the cooler 27 via the conductive member 23 and returns to the power module 20. Thereby, the path | route through which an electric current flows becomes short, and it can suppress the influence of the noise to other apparatuses.

DESCRIPTION OF SYMBOLS 10 Housing | casing 11 Power supply 12 Power conversion part 13 Load 20 Power module 21 1st electric power feeding bus line 22 2nd electric power feeding bus line 23 Conductive member 24 Output line 25 Plate-like conductor 26 Dielectric 27 Cooler 31 Control circuit Q, Q1-Q6 Semiconductor Switches C11, C21, C12, C22 Coupling capacitance C1 First smoothing capacitor C2 Second smoothing capacitor L Inductor

Claims (6)

A power supply and a first power supply bus connected at one end to the power supply;
A second power supply bus having one end connected to the power source;
A power module including a semiconductor switch that is connected to the other end of the first power supply bus and the other end of the second power supply bus and switches power from the power source;
A conductive member disposed between the first power supply bus and the second power supply bus;
A housing for housing the power module;
One end of the conductive member is connected to the housing,
The coupling capacitance between the first power supply bus and the housing and the coupling capacitance between the second power supply bus and the housing are determined by the impedance between the power source and the housing at a desired frequency. The power converter characterized by being small . Power and
A first power supply bus connected at one end to the power source;
A second power supply bus having one end connected to the power source;
A power module including a semiconductor switch that is connected to the other end of the first power supply bus and the other end of the second power supply bus and switches power from the power source;
A conductive member disposed between the first power supply bus and the second power supply bus;
A housing for housing the power module;
One end of the conductive member is connected to the housing,
The first power supply bus is
A first A feeder bus connected at one end to the power source;
An inductor having one terminal connected to the other end of the first A feeding bus;
One end is connected to the other terminal of the inductor, and the other end consists of a 1B power supply bus connected to the power module,
The inductor has a larger impedance at a desired frequency than a coupling capacitance between the first feeding bus and the housing and an impedance of a coupling capacitance between the second feeding bus and the housing. Power converter. Power and
A first power supply bus connected at one end to the power source;
A second power supply bus having one end connected to the power source;
A power module including a semiconductor switch that is connected to the other end of the first power supply bus and the other end of the second power supply bus and switches power from the power source;
A conductive member disposed between the first power supply bus and the second power supply bus;
A housing for housing the power module;
One end of the conductive member is connected to the housing,
The second power supply bus is
A second A feeder bus connected at one end to the power source;
An inductor having one terminal connected to the other end of the second A feeding bus;
One end is connected to the other terminal of the inductor, and the other end consists of a 2B power supply bus connected to the power module,
The inductor has a larger impedance at a desired frequency than a coupling capacitance between the first feeding bus and the housing and an impedance of a coupling capacitance between the second feeding bus and the housing. Power converter. The conductive member is disposed so that a coupling capacitance between the first power supply bus and the conductive member and a coupling capacitance between the second power supply bus and the conductive member are substantially matched. The power converter according to claim 1, claim 2, or claim 3 . The housing is formed so that the coupling capacity between the first power supply bus and the housing and the coupling capacity between the second power feeding bus and the housing are substantially matched. power converter according to claim 1 or claim 2 or claim 3 Symbol mounting features. The coupling capacitance between the first power supply bus and the housing and the coupling capacitance between the second power supply bus and the housing are determined by the impedance between the power source and the housing at a desired frequency. power converter according to claim 2 or claim 3 Symbol mounting, characterized in that smaller.

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