JP5820762B2 - Surface protective film for transparent conductive film and transparent conductive film using the same - Google Patents

Surface protective film for transparent conductive film and transparent conductive film using the same Download PDF

Info

Publication number
JP5820762B2
JP5820762B2 JP2012099176A JP2012099176A JP5820762B2 JP 5820762 B2 JP5820762 B2 JP 5820762B2 JP 2012099176 A JP2012099176 A JP 2012099176A JP 2012099176 A JP2012099176 A JP 2012099176A JP 5820762 B2 JP5820762 B2 JP 5820762B2
Authority
JP
Japan
Prior art keywords
film
transparent conductive
conductive film
release
surface protective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012099176A
Other languages
Japanese (ja)
Other versions
JP2013226676A (en
JP2013226676A5 (en
Inventor
真人 客野
真人 客野
千恵 鈴木
千恵 鈴木
理恵 岡本
理恵 岡本
林　益史
益史 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimori Kogyo Co Ltd
Original Assignee
Fujimori Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimori Kogyo Co Ltd filed Critical Fujimori Kogyo Co Ltd
Priority to JP2012099176A priority Critical patent/JP5820762B2/en
Priority to KR1020130035054A priority patent/KR101471921B1/en
Priority to TW102112646A priority patent/TWI479513B/en
Priority to CN201310140779.2A priority patent/CN103374308B/en
Publication of JP2013226676A publication Critical patent/JP2013226676A/en
Priority to KR1020140155981A priority patent/KR101549475B1/en
Publication of JP2013226676A5 publication Critical patent/JP2013226676A5/ja
Application granted granted Critical
Publication of JP5820762B2 publication Critical patent/JP5820762B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Description

本発明は、基材の一方の面に透明導電膜が形成された透明導電性フィルムの、他方の面に貼合して使用される透明導電性フィルム用表面保護フィルム、及びそれを用いた透明導電性フィルムに関する。さらに詳細には、本発明は、形成されている粘着剤層の被着面に貼合される表面が平滑であり、透明導電性フィルムに貼合しても優れたハンドリング性を有し、透明導電性フィルムの製造・加工工程において、表面保護フィルムに起因する外観の欠点不良が改善された、透明導電性フィルム用表面保護フィルム及びそれを用いた透明導電性フィルムを提供する。   The present invention is a transparent conductive film having a transparent conductive film formed on one surface of a base material, a surface protective film for a transparent conductive film used by being bonded to the other surface, and a transparent film using the same The present invention relates to a conductive film. More specifically, the present invention has a smooth surface that is bonded to the adherend surface of the pressure-sensitive adhesive layer that is formed, and has excellent handling properties even when bonded to a transparent conductive film. Provided are a surface protective film for a transparent conductive film and a transparent conductive film using the same, in which defects in appearance due to the surface protective film are improved in the manufacturing and processing steps of the conductive film.

従来から、タッチパネル、電子ペーパー、電磁波シールド材、各種センサ、液晶パネル、有機ＥＬ、太陽電池などの技術分野において、基材の一方の面に、例えば、ＩＴＯ（インジウム・錫酸化物化合物）透明導電膜、ＺｎＯ系透明導電膜、あるいは導電性高分子の透明導電膜などが形成された透明導電性フィルム（以下、単に「導電性フィルム」と呼ぶこともある。）が、透明電極などの形成用として広く利用されている。
また、タッチパネル用の透明電極の製造工程では、ＩＴＯ透明導電膜、あるいはＺｎＯ系透明導電膜が形成された金属酸化物化合物からなる透明導電性フィルムを、アニール処理する金属酸化膜の結晶化工程や、レジストの印刷工程、エッチング処理工程、銀ペーストによる配線回路の形成工程、絶縁層の印刷工程、打抜き工程など、多くの加熱工程や薬液処理の工程を経る。そのような透明電極の製造工程において、透明導電性フィルムの透明導電膜が形成された面の反対側面が、汚損、損傷が生じるのを防止するために、透明導電性フィルム用表面保護フィルムが貼合されて使用される。 Conventionally, in a technical field such as a touch panel, electronic paper, an electromagnetic shielding material, various sensors, a liquid crystal panel, an organic EL, and a solar cell, on one surface of a base material, for example, ITO (indium tin oxide compound) transparent conductive A transparent conductive film (hereinafter also referred to simply as “conductive film”) on which a film, a ZnO-based transparent conductive film or a conductive polymer transparent conductive film is formed is used for forming a transparent electrode or the like. As widely used.
In addition, in the process of manufacturing a transparent electrode for a touch panel, a transparent conductive film made of a metal oxide compound on which an ITO transparent conductive film or a ZnO-based transparent conductive film is formed is annealed with a metal oxide film crystallization process or It undergoes many heating processes and chemical treatment processes, such as a resist printing process, an etching process, a wiring circuit formation process using silver paste, an insulating layer printing process, and a punching process. In the manufacturing process of such a transparent electrode, in order to prevent the opposite side surface of the transparent conductive film from the surface on which the transparent conductive film is formed, a surface protective film for transparent conductive film is applied. Used together.

このように、透明電極の製造工程中において、アニール処理や銀ペーストによる配線回路の形成などが、約１５０℃程度の温度にて加熱処理されることから、透明導電性フィルム用保護フィルムには耐熱性が求められる。
また、タッチパネル用などの、透明電極の製造工程に使用される透明導電性フィルム用保護フィルムについて、各種の提案がされている。例えば、特許文献１には、融点が２００℃以上である熱可塑性樹脂フィルムからなる基材の片面に、粘着剤層を設けた、透明導電性フィルム用表面保護フィルムが提案されている。ポリエチレンやポリプロピレンなどの、ポリオレフィン樹脂を基材に用いた透明導電性フィルム用表面保護フィルムに比べて、耐熱性が良好であるとしている。 In this way, during the transparent electrode manufacturing process, annealing treatment and formation of a wiring circuit using silver paste are heat-treated at a temperature of about 150 ° C., so that the protective film for transparent conductive film is heat resistant. Sex is required.
Moreover, various proposals are made about the protective film for transparent conductive films used for the manufacturing process of transparent electrodes, such as for touch panels. For example, Patent Document 1 proposes a surface protective film for a transparent conductive film in which a pressure-sensitive adhesive layer is provided on one side of a base material made of a thermoplastic resin film having a melting point of 200 ° C. or higher. It is said that heat resistance is good compared with the surface protection film for transparent conductive films using polyolefin resin as a base material, such as polyethylene and polypropylene.

また、特許文献２には、ポリエチレンテレフタレート樹脂及び／又はポリエチレンナフタレート樹脂を含有した基材フィルムの片面に、粘着剤を塗布した後に、所定の温度・滞留時間・引張張力にて乾燥する、透明導電性フィルム用表面保護フィルムの製造方法が提案されている。当該製造方法で得られた透明導電性フィルム用表面保護フィルムは、透明導電性フィルムに貼合した後、加熱工程を経ても大きなカールが発生しないとしている。   Patent Document 2 discloses that a transparent film is coated with a pressure-sensitive adhesive on one side of a base film containing polyethylene terephthalate resin and / or polyethylene naphthalate resin, and then dried at a predetermined temperature, residence time, and tensile tension. A method for producing a surface protective film for a conductive film has been proposed. The surface protective film for a transparent conductive film obtained by the production method is said to cause no large curl even after passing through a heating step after being bonded to the transparent conductive film.

特許文献３には、樹脂フィルムの片面に透明導電膜を設け、該透明導電膜を設けた面とは反対の樹脂フィルム面に保護フィルムを設けた透明導電膜及び保護フィルム付き樹脂フィルムにおいて、前記保護フィルムが、１５０℃、３０分間加熱後の熱収縮率がＭＤ及びＴＤ方向ともに０．５％以下である第一のフィルムと前記透明導電膜及び保護フィルム付き樹脂フィルムの線膨張係数との差が４０ｐｐｍ／℃以下である線膨張係数を有する第二のフィルムからなり、かつ上記第一フィルムと第二フィルムを前記樹脂フィルムからこの順に設けることが提案されている。この発明を適用すれば、タッチパネル化等の加工工程中の熱処理による寸法変化及びカールがない透明導電フィルムが得られるとしている。   In Patent Document 3, a transparent conductive film is provided on one side of a resin film, and a protective film is provided on a resin film surface opposite to the surface on which the transparent conductive film is provided. The difference between the linear expansion coefficient of the first film having a thermal shrinkage after heating for 30 minutes at 150 ° C. in the MD and TD directions, and the transparent conductive film and the resin film with the protective film. It is proposed to comprise a second film having a linear expansion coefficient of 40 ppm / ° C. or less, and to provide the first film and the second film in this order from the resin film. If this invention is applied, it is said that a transparent conductive film free from dimensional change and curl due to heat treatment during a processing step such as touch paneling can be obtained.

特開２００３−１７０５３５号公報JP 2003-170535 A 特許第４３４２７７５号公報Japanese Patent No. 4342775 特開平１１−２６８１６８号公報JP-A-11-268168

特許文献１に記載の透明導電性フィルム用保護フィルムでは、融点が２００℃以上の樹脂フィルムの耐熱性を有する基材に使用しているが、加熱工程を経た後では、カールが発生する。
また、特許文献２及び特許文献３に記載の透明導電性フィルム用保護フィルムでは、加熱工程を経ても大きなカールが発生しないが、生産性が大きく低下する。近年では、透明導電性フィルムの市場が拡大するに伴い価格が低下しており、この製造方法による透明導電性フィルム用保護フィルムでは、コスト競争力に乏しい。
このように、従来技術では、透明導電性フィルムに貼合して使用し、加熱処理を経てもカールが発生せず、且つ、安価に製造された透明導電性フィルム用保護フィルムが得られていない。 The protective film for transparent conductive film described in Patent Document 1 is used as a base material having a heat resistance of a resin film having a melting point of 200 ° C. or higher. However, after the heating step, curling occurs.
Moreover, in the protective film for transparent conductive films described in Patent Document 2 and Patent Document 3, large curl does not occur even after the heating step, but productivity is greatly reduced. In recent years, the price has decreased as the market for transparent conductive films has expanded, and the protective film for transparent conductive films produced by this production method is poor in cost competitiveness.
Thus, in the prior art, it is used by being bonded to a transparent conductive film, no curling occurs even after heat treatment, and a protective film for transparent conductive film produced at low cost is not obtained. .

また、透明導電性フィルムを用いて透明電極を製造する工程の最後には、透明導電性フィルム用保護フィルムを剥離除去するため、アニール処理などにおいての加熱処理した後でも、剥離し易いように粘着力の急上昇がないことが必要とされる。粘着剤の粘着力が、加熱処理した後にも、急上昇しないように抑える方法としては、粘着剤層の樹脂組成物を高密度に架橋させることが知られている。一般的な、架橋密度を高めた粘着剤層を製造する方法は、次のとおりである。例えば、長さが５〜１０，０００ｍの長尺の基材フィルムの片面に、粘着剤組成物を一定の厚みに塗布して積層し、粘着剤層を積層する。積層された粘着剤層を加熱乾燥させて粘着剤組成物を架橋反応させた後、粘着剤層に剥離処理された剥離フィルムを積層する。その後、ロール状に巻き取り透明導電性フィルム用表面保護フィルムのロール体を得る。その後、得られた透明導電性フィルム用表面保護フィルムのロール体を、一定の温度に維持された恒温倉庫にて、一定の期間に渡り保管し、硬化反応を促進させるための養生処理を行う。   In addition, at the end of the process of manufacturing a transparent electrode using a transparent conductive film, the protective film for transparent conductive film is peeled and removed, so that it is easy to peel even after heat treatment in annealing treatment etc. There is no need for power surges. As a method for suppressing the adhesive force of the pressure-sensitive adhesive from rapidly increasing even after heat treatment, it is known that the resin composition of the pressure-sensitive adhesive layer is crosslinked with high density. A general method for producing a pressure-sensitive adhesive layer having an increased crosslinking density is as follows. For example, the pressure-sensitive adhesive composition is applied and laminated on one side of a long base film having a length of 5 to 10,000 m, and a pressure-sensitive adhesive layer is laminated. After the laminated pressure-sensitive adhesive layer is dried by heating to cause a crosslinking reaction of the pressure-sensitive adhesive composition, a release film subjected to a release treatment is laminated on the pressure-sensitive adhesive layer. Then, it rolls up in roll shape and the roll body of the surface protection film for transparent conductive films is obtained. Thereafter, the obtained roll body of the surface protective film for transparent conductive film is stored for a certain period in a constant temperature warehouse maintained at a certain temperature, and a curing treatment for promoting the curing reaction is performed.

本発明者は、基材フィルムの片面に粘着剤層を積層し、該粘着剤層の上に、剥離処理された剥離フィルムを積層した透明導電性フィルム用保護フィルムのロール体に行う養生処理が、これまでは知られていなかった新たな問題を有することを見出し、本発明を完成するに至った。
透明導電性フィルム用保護フィルムが有する新たな問題は、基材の一方の面に透明導電膜が形成された透明導電性フィルムの他方の面に、ロール体から巻き戻した透明導電性フィルム用表面保護フィルムを貼合して、透明導電性フィルムの製造・加工工程を経ると、透明導電性フィルムの外観が著しく悪くなることである。
本発明者が、鋭意究明した結果、透明導電性フィルム用表面保護フィルムの粘着剤層の表面に生じている凹凸の形状が、透明導電性フィルムの透明導電性フィルム用表面保護フィルムが貼合された面に、転写されることが原因であることが分かった。 The present inventor performs a curing treatment on a roll body of a protective film for a transparent conductive film in which a pressure-sensitive adhesive layer is laminated on one side of a base film, and a release film subjected to a release treatment is laminated on the pressure-sensitive adhesive layer. The present invention has been completed by finding out that it has a new problem that has not been known so far.
The new problem of the protective film for transparent conductive film is that the surface for transparent conductive film is unwound from the roll body on the other side of the transparent conductive film with the transparent conductive film formed on one side of the substrate. When a protective film is bonded and the transparent conductive film is manufactured and processed, the appearance of the transparent conductive film is remarkably deteriorated.
As a result of the inventor's earnest investigation, the surface of the pressure-sensitive adhesive layer of the surface protective film for a transparent conductive film is bonded to the surface protective film for the transparent conductive film of the transparent conductive film. It was found that the cause was that it was transferred to the surface.

本発明は、上記事情に鑑みてなされたものであって、ロール体から巻き戻された状態において、透明導電性フィルム用表面保護フィルムの粘着剤層の被着面に貼合される表面が平滑であり、透明導電性フィルムに貼合しても優れたハンドリング性を有し、透明導電性フィルムの製造・加工工程において、透明導電性フィルム用表面保護フィルムに起因する外観の欠点不良が改善された、透明導電性フィルム用表面保護フィルム及びそれを用いた透明導電性フィルムを提供することを課題とする。   The present invention has been made in view of the above circumstances, and in the state of being rewound from a roll body, the surface to be bonded to the adherend surface of the surface protective film for a transparent conductive film is smooth. It has excellent handling properties even when bonded to a transparent conductive film, and defects in appearance due to the surface protective film for transparent conductive film are improved in the manufacturing and processing steps of transparent conductive film. Another object of the present invention is to provide a surface protective film for a transparent conductive film and a transparent conductive film using the same.

上記課題を解決するため、本発明の透明導電性フィルム用表面保護フィルムは、基材フィルムの片面に粘着剤層が積層され、該粘着剤層の上に、剥離処理された剥離フィルムが積層されており、前記剥離フィルムに一定の剛性を持たせることにより、前記粘着剤層の被着面に貼合される表面に凹凸の変形が生じるのを抑制することを技術思想としている。
すなわち、本発明に係わる透明導電性フィルム用表面保護フィルムの粘着剤層の養生期間において、ロール状に巻かれた透明導電性フィルム用表面保護フィルムの、剥離フィルムが貼合された粘着剤層が、剥離フィルムの変形に引きずられて変形し、粘着剤層の被着面に貼合される表面に凹凸が生じるのを防ぐものである。 In order to solve the above problems, the surface protective film for a transparent conductive film of the present invention has a pressure-sensitive adhesive layer laminated on one side of a base film, and a release film subjected to a release treatment is laminated on the pressure-sensitive adhesive layer. The technical idea is to prevent the surface of the pressure-sensitive adhesive layer from being unevenly deformed by imparting a certain rigidity to the release film.
That is, in the curing period of the pressure-sensitive adhesive layer of the surface protective film for transparent conductive film according to the present invention, the pressure-sensitive adhesive layer to which the release film of the surface protective film for transparent conductive film wound in a roll shape is bonded is provided. The film is pulled and deformed by the deformation of the release film to prevent the surface of the pressure-sensitive adhesive layer from being unevenly formed.

上記課題を解決するため、本発明は、基材の一方の面に透明導電膜が形成された透明導電性フィルムの、他方の面に貼合して使用される透明導電性フィルム用表面保護フィルムであって、ロール体から巻き戻されてなり、可撓性を有する基材フィルムの片面に粘着剤層が積層され、前記粘着剤層の被着面に貼合される表面上に、剥離処理された剥離フィルムが、前記剥離処理された面を介して積層され、前記剥離フィルムの厚みが５０μｍ〜２５０μｍであり、且つ、前記剥離フィルムの４０℃における剛軟度が０．３０ｍＮ〜４０ｍＮであり、前記透明導電性フィルム用表面保護フィルムの前記基材フィルムが、ポリエチレンテレフタレート樹脂フィルムであり、前記基材フィルムの厚みが１００μｍ〜２５０μｍであり、前記粘着剤層の厚みが、前記基材フィルムの厚みの１／２０〜１／５の厚みであり、被着体である前記他方の面に対する剥離強度が０．０３〜０．３Ｎ／２５ｍｍであることを特徴とする透明導電性フィルム用表面保護フィルムを提供する。 In order to solve the above problems, the present invention provides a surface protective film for a transparent conductive film that is used by being bonded to the other surface of a transparent conductive film having a transparent conductive film formed on one surface of a substrate. It is unrolled from the roll body, a pressure-sensitive adhesive layer is laminated on one side of a flexible base film, and a release treatment is performed on the surface bonded to the adherent surface of the pressure-sensitive adhesive layer The release film is laminated through the release-treated surface, the release film has a thickness of 50 μm to 250 μm, and the release film has a bending resistance at 40 ° C. of 0.30 mN to 40 mN. The base film of the surface protective film for transparent conductive film is a polyethylene terephthalate resin film, the thickness of the base film is 100 μm to 250 μm, and the thickness of the pressure-sensitive adhesive layer But a thickness of 1/20 to 1/5 of the thickness of the substrate film peel strength to the other surface as an adherend and the said 0.03～0.3N / 25 mm der Rukoto Provided is a surface protective film for a transparent conductive film.

また、前記粘着剤層の厚みが、前記基材フィルムの厚みの１／２０〜１／５の厚みであり、前記粘着剤層の２０℃での貯蔵弾性率が、１．０×１０５〜８．０×１０６ＭＰａであることが好ましい。 Further, the thickness of the pressure-sensitive adhesive layer is 1/20 to 1/5 of the thickness of the base film, and the storage elastic modulus at 20 ° C. of the pressure-sensitive adhesive layer is 1.0 × 10 5 to It is preferably 8.0 × 10 6 MPa.

また、前記透明導電性フィルム用表面保護フィルムの前記基材フィルムが、ポリエチレンテレフタレート樹脂フィルムであり、且つ、前記基材フィルムの厚みが１００μｍ〜２５０μｍであることが好ましい。   Moreover, it is preferable that the said base film of the surface protection film for transparent conductive films is a polyethylene terephthalate resin film, and the thickness of the said base film is 100 micrometers-250 micrometers.

また、本発明は、前記透明導電性フィルム用表面保護フィルムが、ロール状に巻かれた透明導電性フィルム用表面保護フィルムのロール体を提供する。   Moreover, this invention provides the roll body of the surface protection film for transparent conductive films by which the said surface protection film for transparent conductive films was wound by roll shape.

また、本発明は、前記剥離フィルムが剥離されてなる前記透明導電性フィルム用表面保護フィルムが、基材の一方の面に透明導電膜が形成された透明導電性フィルムの、他方の面に貼合された透明導電性フィルムを提供する。 Further, the present invention provides the above-mentioned surface protective film for a transparent conductive film formed by peeling off the release film, which is attached to the other surface of a transparent conductive film having a transparent conductive film formed on one surface of a substrate. A combined transparent conductive film is provided.

本発明の透明導電性フィルム用表面保護フィルムは、ロール体から巻き戻された状態において、形成されている粘着剤層の被着面に貼合される表面が平滑であり、透明導電性フィルムに貼合しても優れたハンドリング性を有し、透明導電性フィルムの製造・加工工程において、表面保護フィルムに起因する外観の欠点不良が改善された、透明導電性フィルム用表面保護フィルム及びそれを用いた透明導電性フィルムを提供することができる。
また、近年、スマートフォンなどの高機能携帯端末の筐体の薄型化に伴い、使用される透明導電性フィルムの薄型化が進んでいる。本発明の透明導電性フィルム用表面保護フィルムは、タッチパネル用の透明電極の製造工程において、薄型化された透明導電性フィルムに、貼合された状態で加熱工程を経た後でも、発生するカールが非常に小さい。このことにより、タッチパネル用の透明電極の製造工程の作業性、生産効率を大幅に改善できる。 The surface protective film for a transparent conductive film of the present invention has a smooth surface bonded to the adherend surface of the pressure-sensitive adhesive layer formed in the state of being rewound from the roll body. Surface protective film for transparent conductive film, which has excellent handling properties even when pasted, and improved defects in appearance due to the surface protective film in the manufacturing and processing steps of transparent conductive film, and the The transparent conductive film used can be provided.
Further, in recent years, with the thinning of the housing of a high-performance portable terminal such as a smartphone, the transparent conductive film used has been thinned. The surface protective film for a transparent conductive film of the present invention has a curl that occurs even after a heating process in a state of being bonded to a thin transparent conductive film in a manufacturing process of a transparent electrode for a touch panel. Very small. As a result, the workability and production efficiency of the transparent electrode manufacturing process for the touch panel can be greatly improved.

本発明の透明導電性フィルム用表面保護フィルムの、一例を示す断面図である。It is sectional drawing which shows an example of the surface protection film for transparent conductive films of this invention. 透明導電性フィルムの、一例を示す断面図である。It is sectional drawing which shows an example of a transparent conductive film. 本発明の透明導電性フィルム用表面保護フィルムを、透明導電性フィルムに貼合した例を示す断面図である。It is sectional drawing which shows the example which bonded the surface protection film for transparent conductive films of this invention to the transparent conductive film. 本発明の透明導電性フィルム用表面保護フィルムの、製造方法の一例を示す概念図である。It is a conceptual diagram which shows an example of the manufacturing method of the surface protection film for transparent conductive films of this invention.

以下、実施の形態に基づいて、本発明を詳しく説明する。
図１は、本発明の透明導電性フィルム用表面保護フィルムの、一例を示す断面図である。この透明導電性フィルム用表面保護フィルム５は、透明な可撓性を有する基材フィルム１の片面に、粘着剤層２が積層されている粘着フィルム４を有する。粘着剤層２の被着面に貼合される表面上には、粘着面を保護するための剥離処理された剥離フィルム３が、剥離処理された面を介して積層されている。 Hereinafter, the present invention will be described in detail based on embodiments.
FIG. 1 is a cross-sectional view showing an example of the surface protective film for a transparent conductive film of the present invention. This surface protective film 5 for transparent conductive film has the adhesive film 4 by which the adhesive layer 2 is laminated | stacked on the single side | surface of the base film 1 which has transparency flexibility. On the surface bonded to the adherend surface of the pressure-sensitive adhesive layer 2, a release film 3 subjected to a release treatment for protecting the adhesive surface is laminated via a surface subjected to the release treatment.

基材フィルム１としては、透明な可撓性を有する樹脂フィルムが用いられる。透明な樹脂フィルムとすることにより、図２に示した、基材６の一方の面６ａに透明導電膜７が形成された透明導電性フィルム１０の他方の面６ｂに、本発明の透明導電性フィルム用表面保護フィルム５から得た粘着フィルム４を貼合した状態のまま（図３参照）、透明導電性フィルム１０の外観検査を行うことができる。基材フィルム１として使用される樹脂フィルムとしては、好適には、ポリエチレンテレフタレート、ポリエチレンナフタレート、ポリエチレンイソフタレート、ポリブチレンテレフタレートのようなポリエステルフィルムが挙げられる。また、ポリエステルフィルムのほか、必要な強度を有し、且つ、光学適性を有するものであれば、他の種類の樹脂フィルムも使用可能である。基材フィルム１は、無延伸フィルム、一軸または二軸延伸されたフィルムなど、特に制約は受けないが、基材フィルム１の加熱収縮率が、低いことが好ましい。   As the base film 1, a transparent flexible resin film is used. The transparent conductive film of the present invention is formed on the other surface 6b of the transparent conductive film 10 in which the transparent conductive film 7 is formed on one surface 6a of the substrate 6 shown in FIG. The appearance inspection of the transparent conductive film 10 can be performed with the pressure-sensitive adhesive film 4 obtained from the film surface protective film 5 being bonded (see FIG. 3). As a resin film used as the base film 1, a polyester film such as polyethylene terephthalate, polyethylene naphthalate, polyethylene isophthalate, or polybutylene terephthalate is preferably used. In addition to the polyester film, other types of resin films can be used as long as they have necessary strength and optical suitability. The base film 1 is not particularly limited, such as an unstretched film, a uniaxially or biaxially stretched film, but the base film 1 preferably has a low heat shrinkage rate.

また、本発明に係わる透明導電性フィルム用表面保護フィルムは、基材フィルム１の厚みが、１００μｍ以上であることが必要である。基材フィルム１の厚みが１００μｍ未満であると、薄型の透明導電性フィルムに貼合した時のハンドリング性が低下する。基材フィルム１の厚みが１００μｍ以上であれば、特に限定はないものの、例えば１００〜２５０μｍ程度の厚みが好ましく、さらに１００〜１８８μｍ程度の厚みがより好ましい。基材フィルム１の厚みが３００μｍを超えると、剛性が強まり、本発明に係わる透明導電性フィルム用表面保護フィルムを、ロール状に巻取り、透明導電性フィルム用表面保護フィルムのロール体にすることが困難となる。
また、必要に応じて、基材フィルム１の粘着剤層２が積層された面の反対側面に、表面の汚れを防止する目的の防汚層や、帯電防止層や、傷つき防止のハードコート層を積層することや、コロナ放電処理やアンカーコート処理などの易接着性の処理を施してもよい。 Moreover, the surface protection film for transparent conductive films concerning this invention needs that the thickness of the base film 1 is 100 micrometers or more. When the thickness of the base film 1 is less than 100 μm, handling properties when bonded to a thin transparent conductive film are lowered. Although there will be no limitation if the thickness of the base film 1 is 100 micrometers or more, For example, the thickness of about 100-250 micrometers is preferable, and the thickness of about 100-188 micrometers is more preferable. When the thickness of the base film 1 exceeds 300 μm, the rigidity is increased, and the surface protective film for a transparent conductive film according to the present invention is rolled up into a roll body of the surface protective film for a transparent conductive film. It becomes difficult.
If necessary, an antifouling layer for the purpose of preventing surface contamination, an antistatic layer, and a hard coat layer for preventing scratches on the side opposite to the surface of the base film 1 on which the adhesive layer 2 is laminated. Or may be subjected to easy adhesion treatment such as corona discharge treatment or anchor coating treatment.

また、本発明に係わる透明導電性フィルム用表面保護フィルムの粘着剤層２は、加熱処理した前後での粘着力の変化の少ない粘着剤であれば、粘着剤組成物については特に限定されるものではなく、公知の材料を使用できる。使用できる粘着剤組成物としては、ゴム系、アクリル系、ウレタン系などが挙げられる。
ゴム系粘着剤としては、天然ゴム、合成ゴムなどのエラストマーに粘着付与剤、軟化剤、老化防止剤、充填剤などを配合した粘着剤であって、必要に応じて、架橋剤を添加しても良い。 Moreover, if the adhesive layer 2 of the surface protective film for transparent conductive films concerning this invention is an adhesive with little change of the adhesive force before and behind heat processing, it will be specifically limited about an adhesive composition. Instead, known materials can be used. Examples of the pressure-sensitive adhesive composition that can be used include rubber, acrylic and urethane.
Rubber-based adhesives are adhesives that are blended with elastomers such as natural rubber and synthetic rubber with tackifiers, softeners, anti-aging agents, fillers, etc. Also good.

アクリル系粘着剤としては、（メタ）アクリルポリマーに必要に応じて硬化剤や粘着付与剤を添加した粘着剤である。（メタ）アクリルポリマーは、ｎ−ブチルアクリレート、２−エチルヘキシルアクリレート、イソオクチルアクリレート、イソノニルアクリレートなどの主モノマーと、アクリロニトリル、酢酸ビニル、メチルメタクリレート、エチルアクリレートなどのコモノマー、アクリル酸、メタクリル酸、ヒドロキシエチルアクリレート、ヒドロキシブチルアクリレート、グリシジルメタクリレート、Ｎ−メチロールメタクリルアミドなどの官能性モノマーを共重合したポリマーが一般的である。硬化剤としては、イソシアネート化合物、エポキシ化合物、メラミン化合物、金属キレート化合物などが挙げられる。粘着付与剤としては、ロジン系、クマロンインデン系、テルペン系、石油系、フェノール系などが挙げられる。   As an acrylic adhesive, it is an adhesive which added the hardening | curing agent and the tackifier to the (meth) acrylic polymer as needed. The (meth) acrylic polymer is composed of main monomers such as n-butyl acrylate, 2-ethylhexyl acrylate, isooctyl acrylate, and isononyl acrylate, comonomers such as acrylonitrile, vinyl acetate, methyl methacrylate, and ethyl acrylate, acrylic acid, methacrylic acid, Polymers obtained by copolymerizing functional monomers such as hydroxyethyl acrylate, hydroxybutyl acrylate, glycidyl methacrylate, N-methylol methacrylamide are common. Examples of the curing agent include isocyanate compounds, epoxy compounds, melamine compounds, and metal chelate compounds. Examples of tackifiers include rosin, coumarone indene, terpene, petroleum, and phenol.

ウレタン系粘着剤としては、ハードセグメントとソフトセグメントの種類、組成比を変えたものが挙げられる。
シリコーン系粘着剤としては、ポリジメチルシロキサンとシリコーンレジンの種類、組成比を変えたものが挙げられる。硬化反応形態としては付加反応型、過酸化物反応型などがあり、どちらも使用可能である。 Examples of the urethane-based pressure-sensitive adhesive include those in which the types and composition ratios of the hard segment and the soft segment are changed.
Examples of the silicone-based pressure-sensitive adhesive include those in which the types and composition ratios of polydimethylsiloxane and silicone resin are changed. There are an addition reaction type, a peroxide reaction type, and the like as a curing reaction type, and both can be used.

また、本発明に係わる透明導電性フィルム用表面保護フィルムの粘着剤層２に使用される粘着剤は、耐熱性を有すること、加熱処理した前後での粘着力の急上昇を容易に抑えること、被着体への汚染が低いこと、などの観点から、アクリル系粘着剤がより好適である。また、粘着剤層には、必要に応じて、硬化剤や粘着付与剤を添加できる。
また、本発明に係わる透明導電性フィルム用表面保護フィルムの粘着剤層２には、必要に応じて、帯電防止剤を混合しても良い。帯電防止剤としては、（メタ）アクリル系ポリマーに対して分散または相溶性の良いものが好ましい。使用できる帯電防止剤としては、界面活性剤系、イオン性液体、アルカリ金属塩、金属酸化物、金属微粒子、導電性ポリマー、カーボン、カーボンナノチューブなどが挙げられる。透明性や（メタ）アクリル系ポリマーに対する親和性などから、界面活性剤系、イオン性液体、アルカリ金属塩などが、好ましい。粘着剤に対する帯電防止剤の添加量は、帯電防止剤の種類やベースポリマーとの相溶性を考慮して適宜決めることができる。また、本発明に係わる透明導電性フィルム用表面保護フィルムを、透明導電性フィルムから剥離時の、必要とされる剥離帯電圧、被着体の汚染性、粘着力などを考慮して、帯電防止剤の種類や、添加量を具体的に設定する。 Moreover, the pressure-sensitive adhesive used for the pressure-sensitive adhesive layer 2 of the surface protective film for transparent conductive film according to the present invention has heat resistance, easily suppresses a sudden increase in pressure-sensitive adhesive strength before and after heat treatment, From the viewpoint of low contamination of the adherend, an acrylic pressure-sensitive adhesive is more preferable. Moreover, a hardening | curing agent and a tackifier can be added to an adhesive layer as needed.
Moreover, you may mix an antistatic agent with the adhesive layer 2 of the surface protection film for transparent conductive films concerning this invention as needed. As the antistatic agent, those having good dispersion or compatibility with the (meth) acrylic polymer are preferable. Antistatic agents that can be used include surfactants, ionic liquids, alkali metal salts, metal oxides, fine metal particles, conductive polymers, carbon, carbon nanotubes, and the like. From the viewpoint of transparency and affinity for (meth) acrylic polymers, surfactants, ionic liquids, alkali metal salts and the like are preferable. The amount of the antistatic agent added to the adhesive can be appropriately determined in consideration of the type of antistatic agent and the compatibility with the base polymer. In addition, the surface protection film for a transparent conductive film according to the present invention is antistatic in consideration of the required stripping voltage, contamination of the adherend, adhesive force, etc. when peeling from the transparent conductive film. The type and amount of the agent are specifically set.

また、本発明に係わる透明導電性フィルム用表面保護フィルムの粘着剤層２の厚みは、特に限定はないが、例えば、５〜５０μｍ程度の厚みにすることが好ましい、さらに１０〜３０μｍ程度の厚みにすることがより好ましい。粘着剤層２の厚みが、５０μｍを超えると、透明導電性フィルム用表面保護フィルムを製造するコストが、増大するので競争力を損なう。また、上記のとおり、基材フィルム１の厚みは、１００〜２５０μｍ程度の厚みが好ましい。本発明に係わる透明導電性フィルム用表面保護フィルムの粘着剤層２の厚みは、基材フィルム１の厚みの１／２０〜１／５の厚みであることが好ましい。
また、本発明に係わる透明導電性フィルム用表面保護フィルムは、被着体の表面に対する剥離強度が、０．０３〜０．３Ｎ／２５ｍｍ程度の、軽度な粘着性を有する微粘着剤層であることが好ましい。このような、微粘着剤層を有する透明導電性フィルム用表面保護フィルムとすることにより、被着体から容易に剥がし易い、優れた操作性が得られる。 Moreover, the thickness of the pressure-sensitive adhesive layer 2 of the surface protective film for transparent conductive film according to the present invention is not particularly limited, but is preferably about 5 to 50 μm, and more preferably about 10 to 30 μm. More preferably. If the thickness of the pressure-sensitive adhesive layer 2 exceeds 50 μm, the cost for producing the surface protective film for transparent conductive film increases, so the competitiveness is impaired. Moreover, as above-mentioned, the thickness of the base film 1 has a preferable thickness of about 100-250 micrometers. The thickness of the pressure-sensitive adhesive layer 2 of the surface protective film for transparent conductive film according to the present invention is preferably 1/20 to 1/5 of the thickness of the base film 1.
Moreover, the surface protective film for transparent conductive films according to the present invention is a slight pressure-sensitive adhesive layer having a light adhesiveness with a peel strength of about 0.03 to 0.3 N / 25 mm with respect to the surface of the adherend. It is preferable. By setting it as the surface protection film for transparent conductive films which has such a slightly adhesive layer, the outstanding operativity which is easy to peel off from a to-be-adhered body is obtained.

また、本発明に係わる透明導電性フィルム用表面保護フィルムの剥離フィルム３の材質は、特に限定されない。使用できる剥離フィルムの材質としては、ポリエチレンフィルム、ポリプロピレンフィルム、ポリメチルペンテンフィルムなどのポリオレフィンフィルムや、ポリエステルフィルムなどのフィルムの表面に、シリコーン系剥離剤などの剥離剤を用いて剥離処理を施した剥離フィルム、フッ素樹脂フィルム、ポリイミドフィルムなどが挙げられる。また、複数のフィルムを、接着剤を用いて積層したものや、フィルムに樹脂を溶融押出してラミネートした積層フィルムでも良い。これらの単層又は積層フィルムに、シリコーン系剥離剤などの剥離剤を用いて剥離処理を施し、剥離フィルムが得られる。   Moreover, the material of the peeling film 3 of the surface protective film for transparent conductive films concerning this invention is not specifically limited. As the material of the release film that can be used, the surface of a polyolefin film such as a polyethylene film, a polypropylene film, a polymethylpentene film, or a film such as a polyester film was subjected to a release treatment using a release agent such as a silicone release agent. Examples include a release film, a fluororesin film, and a polyimide film. Moreover, the laminated film which laminated | stacked several films using the adhesive agent, and melt-extruded resin to the film may be sufficient. A release film is obtained by subjecting these single layers or laminated films to a release treatment using a release agent such as a silicone release agent.

また、本発明に係わる透明導電性フィルム用表面保護フィルムの剥離フィルム３は、剥離フィルム３の厚みが５０μｍ〜２５０μｍであり、且つ、剥離フィルム３の４０℃における剛軟度が０．３０ｍＮ〜４０ｍＮである。剥離フィルム３の剛軟度は、剥離フィルム３の厚みにも関係する。剥離フィルム３を厚くすれば、剛軟度は上がるが、剥離フィルム３を厚くすると、ロール状に巻いた同じ巻き径のロール体において、透明導電性フィルム用表面保護フィルムの全長が短くなることや、製造コストが増えることから、剥離フィルム３の適切な厚みが導かれる。また、剥離フィルム３は、単層のポリエステルフィルムに剥離処理した剥離フィルムや、ポリエステルフィルムを、接着剤を用いて多層に積層したフィルムに、剥離処理を施した剥離フィルムが好ましい。
本発明に係わる透明導電性フィルム用表面保護フィルムは、剥離フィルム３の４０℃における剛軟度が、０．３０ｍＮ〜４０ｍＮであることが好ましい。４０℃における剛軟度が０．３０ｍＮ未満の剥離フィルム３を用いた場合、粘着剤層２の養生期間において、ロール状に巻かれた透明導電性フィルム用表面保護フィルム５の、剥離フィルム３が貼合された粘着剤層２が、剥離フィルムの伸縮に引きずられて変形し、粘着剤層２の表面に凹凸が生じる。その結果、図３に示すように、粘着フィルム４を透明導電性フィルム１０に貼合した後に、粘着剤層２の表面に形成された凹凸の形状が、透明導電性フィルム１０の粘着フィルム４が貼合された面６ｂに、転写され、透明導電性フィルム１０の外観不良となる。
また、剥離フィルム３の４０℃における剛軟度が、４０ｍＮを超えると、剛性が過剰に強いため、本発明に係わる透明導電性フィルム用表面保護フィルム５を、ロール状に巻取り、透明導電性フィルム用表面保護フィルムのロール体にすることが困難となる。剥離フィルム３の剛軟度は、詳しくは後述するように、ＪＩＳ Ｌ１０９６の曲げ反発性Ａ法（ガーレ法）に準じて測定することができる。 Moreover, the release film 3 of the surface protective film for transparent conductive films according to the present invention has a release film 3 thickness of 50 μm to 250 μm, and the release film 3 has a bending resistance at 40 ° C. of 0.30 mN to 40 mN. It is. The bending resistance of the release film 3 is also related to the thickness of the release film 3. Increasing the thickness of the release film 3 increases the bending resistance, but increasing the thickness of the release film 3 reduces the overall length of the surface protective film for the transparent conductive film in a roll body of the same winding diameter wound in a roll shape. Since the manufacturing cost increases, an appropriate thickness of the release film 3 is derived. Moreover, the release film 3 is preferably a release film obtained by subjecting a release film to a single layer polyester film or a release film obtained by subjecting a polyester film to a multilayer film using an adhesive.
As for the surface protection film for transparent conductive films concerning this invention, it is preferable that the bending softness in 40 degreeC of the peeling film 3 is 0.30mN-40mN. When the release film 3 having a bending resistance at 40 ° C. of less than 0.30 mN is used, the release film 3 of the surface protective film 5 for a transparent conductive film wound in a roll shape during the curing period of the pressure-sensitive adhesive layer 2 is The bonded pressure-sensitive adhesive layer 2 is dragged and deformed by expansion and contraction of the release film, and irregularities are generated on the surface of the pressure-sensitive adhesive layer 2. As a result, as shown in FIG. 3, after bonding the adhesive film 4 to the transparent conductive film 10, the uneven shape formed on the surface of the pressure-sensitive adhesive layer 2 is the pressure-sensitive adhesive film 4 of the transparent conductive film 10. It is transferred to the bonded surface 6b and the appearance of the transparent conductive film 10 becomes poor.
Moreover, since the rigidity is excessively strong when the bending softness at 40 ° C. of the release film 3 exceeds 40 mN, the surface protection film 5 for the transparent conductive film according to the present invention is wound into a roll shape, and the transparent conductive It becomes difficult to make a roll body of the surface protective film for film. The bending softness of the release film 3 can be measured according to the bending repulsion A method (Gurley method) of JIS L1096, as will be described in detail later.

また、基材フィルム１に、粘着剤層２および剥離フィルム３を、順に積層する方法は、公知の方法で行えばよく、特に限定されない。具体的には、基材フィルム１に、粘着剤層２を塗布・乾燥させた後に剥離フィルム３を貼合する方法、剥離フィルム３に、粘着剤層２を塗布・乾燥させた後に基材フィルム１を貼合する方法など、いずれの方法でも良い。
また、基材フィルム１に、粘着剤層を形成するのは、公知の方法で行うことができる。具体的には、リバースコート法、コンマコート法、グラビアコート法、スロットダイコート法、メイヤーバーコート法、エアーナイフコート法などの、公知の塗工方法を採用することができる。 Moreover, the method of laminating | stacking the adhesive layer 2 and the peeling film 3 in order on the base film 1 should just be performed by a well-known method, and is not specifically limited. Specifically, a method of laminating the release film 3 after applying and drying the pressure-sensitive adhesive layer 2 to the base film 1, and a base film after applying and drying the pressure-sensitive adhesive layer 2 to the release film 3 Any method such as a method of laminating 1 may be used.
In addition, the pressure-sensitive adhesive layer can be formed on the base film 1 by a known method. Specifically, known coating methods such as reverse coating, comma coating, gravure coating, slot die coating, Mayer bar coating, and air knife coating can be employed.

また、ポリエステルフィルム又はポリエステルフィルムの単層フィルムからなる剥離フィルム３に、あるいは、これらの単層フィルムを、接着剤を用いて多層に積層した剥離フィルム３に、剥離処理を施す方法は、公知の方法で行えばよい。具体的には、グラビアコート法、メイヤーバーコート法、エアーナイフコート法などの塗工方法により、剥離フィルム３の片面に剥離剤を塗工し、加熱または紫外線照射などにより剥離剤を乾燥・硬化すれば良い。必要に応じて、剥離処理するフィルムにあらかじめコロナ処理やプラズマ処理、アンカーコートなどの剥離剤のフィルムへの密着性を向上させる前処理を行っても良い。   Moreover, the method of performing a peeling process to the peeling film 3 which consists of a polyester film or the single layer film of a polyester film, or the peeling film 3 which laminated | stacked these single layer films on the multilayer using the adhesive agent is well-known. It can be done by the method. Specifically, a release agent is applied to one side of the release film 3 by a coating method such as a gravure coating method, a Mayer bar coating method, an air knife coating method, and the release agent is dried and cured by heating or ultraviolet irradiation. Just do it. If necessary, the film to be peeled may be subjected to a pretreatment for improving the adhesion of a release agent such as corona treatment, plasma treatment or anchor coat to the film in advance.

また、図３は、本発明の透明導電性フィルム用表面保護フィルム５の粘着フィルム４を、透明導電性フィルム１０に貼合した積層フィルムの、一例を示す概略構成図である。
この積層フィルムは、本発明の透明導電性フィルム用表面保護フィルム５をロール体（図４の符号２７）から巻き戻して略平坦な状態とし、剥離フィルム３を除去して粘着剤面を表出した粘着フィルム４を、その粘着剤層２を利用して、透明導電性フィルム１０の表面に貼合したものである。透明導電性フィルム１０（図２参照）としては、基材６の一方の面６ａに透明導電膜７が形成されたものであり、具体的には、ＩＴＯの導電膜が形成されたポリエチレンテレフタレートフィルム、ＩＴＯの導電膜が形成された環状ポリオレフィンフィルム、ＺｎＯの導電膜が形成されたポリエチレンテレフタレートフィルムなどが挙げられる。透明導電膜７としては、十分な透明性と導電性を兼ね備えるものであれば特に限定されず、ＩＴＯやＺｎＯ等の金属酸化物の薄膜、金属の薄膜、導電性高分子膜等が挙げられる。このような透明導電性フィルム１０は、タッチパネル、電子ペーパー、電磁波シールド材、各種センサ、液晶パネル、有機ＥＬ、太陽電池などの技術分野において、透明電極などの形成用として広く利用される。透明導電性フィルム１０の基材６の他方の面６ｂに、傷つき防止のハードコート層（図示略）を積層してもよい。
本発明の透明導電性フィルム用保護フィルムは、タッチパネルなどの透明電極の製造工程において、作業性、生産効率を大幅に改善でき、薄型化した透明導電性フィルムであっても、作業性、ハンドリング性を低下させることがないという優れた効果を奏する。 Moreover, FIG. 3 is a schematic block diagram which shows an example of the laminated film which bonded the adhesive film 4 of the surface protection film 5 for transparent conductive films of this invention to the transparent conductive film 10. FIG.
In this laminated film, the surface protective film 5 for transparent conductive film of the present invention is rewound from the roll body (reference numeral 27 in FIG. 4) to be in a substantially flat state, and the release film 3 is removed to expose the pressure-sensitive adhesive surface. The pressure-sensitive adhesive film 4 is bonded to the surface of the transparent conductive film 10 using the pressure-sensitive adhesive layer 2. As the transparent conductive film 10 (see FIG. 2), a transparent conductive film 7 is formed on one surface 6a of the substrate 6. Specifically, a polyethylene terephthalate film in which an ITO conductive film is formed. And a cyclic polyolefin film on which an ITO conductive film is formed, and a polyethylene terephthalate film on which a ZnO conductive film is formed. The transparent conductive film 7 is not particularly limited as long as it has sufficient transparency and conductivity, and examples thereof include a metal oxide thin film such as ITO and ZnO, a metal thin film, and a conductive polymer film. Such a transparent conductive film 10 is widely used for forming transparent electrodes and the like in technical fields such as a touch panel, electronic paper, an electromagnetic shielding material, various sensors, a liquid crystal panel, an organic EL, and a solar cell. A hard coat layer (not shown) for preventing scratches may be laminated on the other surface 6 b of the substrate 6 of the transparent conductive film 10.
The protective film for transparent conductive film of the present invention can greatly improve the workability and production efficiency in the manufacturing process of transparent electrodes such as touch panels, and even if it is a thin transparent conductive film, the workability and handling properties are improved. There is an excellent effect of not lowering.

また、図４は、本発明の透明導電性フィルム用表面保護フィルムの、製造方法の一例を示す概念図である。
剥離処理された剥離フィルム３の巻かれたロール体２１と、基材フィルム１の巻かれたロール体２２から、それぞれ剥離フィルム３及び基材フィルム１が繰り出される。基材フィルム１の一方の面には、粘着剤塗布装置２３により粘着剤が塗布される。粘着剤が塗布された基材フィルム１は、乾燥炉２４にて乾燥し、粘着フィルム４となる。粘着フィルム４の粘着剤層が形成された面と、剥離フィルム３の剥離処理された面とを対向させ、圧着ロール２５，２６にて熱圧着され、透明導電性フィルム用表面保護フィルム５が得られる。透明導電性フィルム用表面保護フィルム５は、ロール体２７に巻き取られる。 Moreover, FIG. 4 is a conceptual diagram which shows an example of the manufacturing method of the surface protection film for transparent conductive films of this invention.
The release film 3 and the base film 1 are fed out from the roll body 21 wound with the release film 3 subjected to the release treatment and the roll body 22 wound with the base film 1, respectively. An adhesive is applied to one surface of the base film 1 by the adhesive application device 23. The base film 1 to which the pressure-sensitive adhesive has been applied is dried in a drying furnace 24 to become the pressure-sensitive adhesive film 4. The surface of the pressure-sensitive adhesive film 4 on which the pressure-sensitive adhesive layer is formed and the surface of the release film 3 subjected to the release treatment are opposed to each other and heat-pressed by the pressure-bonding rolls 25 and 26 to obtain the surface protective film 5 for transparent conductive film. It is done. The surface protective film 5 for a transparent conductive film is wound around a roll body 27.

次に、実施例に基づいて、本発明をさらに説明する。
（実施例１の透明導電性フィルム用表面保護フィルムの作製）
厚みが７５μｍの二軸延伸したポリエステルフィルムの片面に、付加反応型シリコーン（東レダウコーニング製、品名：ＳＲＸ−２１１の１００重量部に対して、白金触媒ＳＲＸ−２１２の１重量部を添加したもの）を、トルエン・酢酸エチル１：１混合溶媒にて希釈した塗料を、メイヤバー工法にて、乾燥後のシリコーン膜の厚みが０．１μｍとなるように塗工した。さらに、温度１２０℃の熱風循環式のオーブンにて、１分間に渡り乾燥・硬化させて、実施例１の剥離フィルムを得た。得られた実施例１の剥離フィルムは、４０℃における剛軟度が０．９１ｍＮであった。
また、粘着剤層は、ブチルアクリレート、２−エチルヘキシルアクリレート、アクリル酸、２−ヒドロキシエチルアクリレートを共重合した、固形分４０％のアクリル系ポリマー１００重量部に対して、ＨＤＩ系硬化剤（日本ポリウレタン工業社製、品名：コロネートＨＸ）２．４重量部を添加、混合した粘着剤組成物を用いて形成した。厚みが１００μｍのポリエチレンテレフタレートフィルム上に、乾燥後の粘着剤層の厚みが２０μｍとなるように、前記粘着剤組成物を塗布し、温度１００℃の熱風循環式のオーブンにて２分間に渡り乾燥させた。その後、前記にて作製した実施例１の剥離フィルムのシリコーン処理面を、粘着剤層の表面上に貼合して積層し、実施例１の透明導電性フィルム用表面保護フィルムを得た。 Next, based on an Example, this invention is further demonstrated.
(Preparation of surface protective film for transparent conductive film of Example 1)
One side of a biaxially stretched polyester film having a thickness of 75 μm is obtained by adding 1 part by weight of platinum catalyst SRX-212 to 100 parts by weight of addition-reactive silicone (product name: SRX-211, manufactured by Toray Dow Corning) ) Was diluted with a toluene / ethyl acetate 1: 1 mixed solvent by a Meyer bar method so that the thickness of the silicone film after drying was 0.1 μm. Furthermore, it was dried and cured for 1 minute in a hot-air circulating oven at a temperature of 120 ° C. to obtain a release film of Example 1. The obtained release film of Example 1 had a bending resistance at 40 ° C. of 0.91 mN.
The pressure-sensitive adhesive layer is composed of an HDI curing agent (Nippon Polyurethane) based on 100 parts by weight of an acrylic polymer having a solid content of 40%, which is a copolymer of butyl acrylate, 2-ethylhexyl acrylate, acrylic acid, and 2-hydroxyethyl acrylate. It was formed using an adhesive composition in which 2.4 parts by weight of Kogyo Co., Ltd., product name: Coronate HX) was added and mixed. The pressure-sensitive adhesive composition is applied onto a polyethylene terephthalate film having a thickness of 100 μm so that the thickness of the pressure-sensitive adhesive layer after drying is 20 μm, and dried for 2 minutes in a hot air circulation oven at a temperature of 100 ° C. I let you. Thereafter, the silicone-treated surface of the release film of Example 1 prepared above was laminated on the surface of the pressure-sensitive adhesive layer to obtain a surface protective film for a transparent conductive film of Example 1.

（実施例２の透明導電性フィルム用表面保護フィルムの作製）
粘着剤層を形成するために、粘着剤組成物としてブチルアクリレート、２−エチルヘキシルアクリレート、アクリル酸を共重合した、固形分４０％のアクリル系ポリマー１００重量部に対して、エポキシ系硬化剤（三菱瓦斯化学社製、品名：テトラッドＸ）４重量部を添加、混合した粘着剤組成物を用いた以外は、実施例１と同様にして、実施例２の透明導電性フィルム用表面保護フィルムを得た。 (Preparation of surface protective film for transparent conductive film of Example 2)
In order to form the pressure-sensitive adhesive layer, 100 parts by weight of an acrylic polymer having a solid content of 40% obtained by copolymerizing butyl acrylate, 2-ethylhexyl acrylate and acrylic acid as a pressure-sensitive adhesive composition (Mitsubishi) A surface protective film for a transparent conductive film of Example 2 was obtained in the same manner as in Example 1 except that 4 parts by weight of Gas Chemical Co., Ltd., product name: Tetrad X) was added and mixed. It was.

（実施例３の透明導電性フィルム用表面保護フィルムの作製）
厚みが２５μｍの二軸延伸したポリエチレンテレフタレートフィルムと、厚みが３８μｍの二軸延伸したポリエチレンテレフタレートフィルムとを、ウレタン系接着剤（三井化学製、品名：タケラックＡ−５０５／タケネートＡ−２０）を用いて、乾燥後の厚みが５μｍとなるように塗布・乾燥した接着剤層にて貼合して積層フィルムを作成した。この積層フィルムの片面に、コロナ処理を施した後、実施例１と同様に、シリコーン処理を行い、実施例３の剥離フィルムを得た。得られた実施例３の剥離フィルムは、４０℃における剛軟度が０．８６ｍＮであった。次に、剥離フィルムを実施例３の剥離フィルムにし、基材フィルムとして使用するポリエステルフィルムの厚みを、１００μｍから１２５μｍに変更した以外は、実施例１と同様にして、実施例３の透明導電性フィルム用表面保護フィルムを得た。 (Production of surface protective film for transparent conductive film of Example 3)
A biaxially stretched polyethylene terephthalate film with a thickness of 25 μm and a biaxially stretched polyethylene terephthalate film with a thickness of 38 μm were used with a urethane-based adhesive (product name: Takelac A-505 / Takenate A-20). Then, a laminated film was prepared by pasting with an adhesive layer applied and dried so that the thickness after drying was 5 μm. After the corona treatment was performed on one side of this laminated film, the silicone treatment was performed in the same manner as in Example 1 to obtain the release film of Example 3. The obtained release film of Example 3 had a bending resistance at 40 ° C. of 0.86 mN. Next, the transparent film of Example 3 was used in the same manner as in Example 1 except that the release film was changed to the release film of Example 3 and the thickness of the polyester film used as the base film was changed from 100 μm to 125 μm. A surface protective film for film was obtained.

（実施例４の透明導電性フィルム用表面保護フィルムの作製）
剥離フィルムの基材として、厚みが１００μｍの二軸延伸したポリエステルフィルムを用いた以外は、実施例１と同様にして、実施例４の剥離フィルムを得た。得られた実施例４の剥離フィルムは、４０℃における剛軟度が２．３２ｍＮであった。次に、剥離フィルムを実施例４の剥離フィルムにした以外は、実施例１と同様にして、実施例４の透明導電性フィルム用表面保護フィルムを得た。 (Preparation of surface protective film for transparent conductive film of Example 4)
A release film of Example 4 was obtained in the same manner as in Example 1 except that a biaxially stretched polyester film having a thickness of 100 μm was used as the base of the release film. The obtained release film of Example 4 had a bending resistance at 40 ° C. of 2.32 mN. Next, a surface protective film for a transparent conductive film of Example 4 was obtained in the same manner as in Example 1 except that the release film was changed to the release film of Example 4.

（実施例５の透明導電性フィルム用表面保護フィルムの作製）
粘着剤層の厚みを１０μｍにし、剥離フィルムの基材として、厚みが５０μｍの二軸延伸したポリエステルフィルムを用いた以外は、実施例１と同様にして、実施例５の剥離フィルムを得た。得られた実施例５の剥離フィルムは、４０℃における剛軟度が０．３５ｍＮであった。次に、剥離フィルムを実施例５の剥離フィルムにした以外は、実施例１と同様にして、実施例５の透明導電性フィルム用表面保護フィルムを得た。 (Production of surface protective film for transparent conductive film of Example 5)
A release film of Example 5 was obtained in the same manner as in Example 1 except that the thickness of the pressure-sensitive adhesive layer was 10 μm, and a biaxially stretched polyester film having a thickness of 50 μm was used as the release film substrate. The obtained release film of Example 5 had a bending resistance at 40 ° C. of 0.35 mN. Next, a surface protective film for a transparent conductive film of Example 5 was obtained in the same manner as in Example 1 except that the release film was changed to the release film of Example 5.

（比較例１の透明導電性フィルム用表面保護フィルムの作製）
剥離フィルムの基材として、厚みが２５μｍの二軸延伸したポリエステルフィルムを用いた以外は、実施例１と同様にして、比較例１の剥離フィルムを得た。得られた比較例１の剥離フィルムは、４０℃における剛軟度が０．０５ｍＮであった。次に、剥離フィルムを比較例１の剥離フィルムにした以外は、実施例１と同様にして、比較例１の透明導電性フィルム用表面保護フィルムを得た。 (Production of surface protective film for transparent conductive film of Comparative Example 1)
A release film of Comparative Example 1 was obtained in the same manner as in Example 1 except that a biaxially stretched polyester film having a thickness of 25 μm was used as the base of the release film. The obtained release film of Comparative Example 1 had a bending resistance at 40 ° C. of 0.05 mN. Next, a surface protective film for a transparent conductive film of Comparative Example 1 was obtained in the same manner as in Example 1 except that the release film was changed to the release film of Comparative Example 1.

（比較例２の透明導電性フィルム用表面保護フィルムの作製）
剥離フィルムの基材として、厚みが３８μｍの二軸延伸したポリエステルフィルムを用いた以外は、実施例１と同様にして、比較例２の剥離フィルムを得た。得られた比較例２の剥離フィルムは、４０℃における剛軟度が０．１６ｍＮであった。剥離フィルムを比較例２の剥離フィルムにし、粘着剤組成物として、実施例２の粘着剤組成物を用いた以外は、実施例１と同様にして、比較例２の透明導電性フィルム用表面保護フィルムを得た。 (Production of surface protective film for transparent conductive film of Comparative Example 2)
A release film of Comparative Example 2 was obtained in the same manner as in Example 1 except that a biaxially stretched polyester film having a thickness of 38 μm was used as the release film substrate. The obtained release film of Comparative Example 2 had a bending resistance at 40 ° C. of 0.16 mN. The surface protection for a transparent conductive film of Comparative Example 2 was performed in the same manner as in Example 1 except that the release film was changed to the release film of Comparative Example 2 and the pressure-sensitive adhesive composition of Example 2 was used as the pressure-sensitive adhesive composition. A film was obtained.

（比較例３の透明導電性フィルム用表面保護フィルムの作製）
基材フィルムとして使用するポリエステルフィルムの厚みを、１００μｍから７５μｍに変更した以外は、実施例１と同様にして、比較例３の透明導電性フィルム用表面保護フィルムを得た。 (Production of surface protective film for transparent conductive film of Comparative Example 3)
A surface protective film for a transparent conductive film of Comparative Example 3 was obtained in the same manner as in Example 1 except that the thickness of the polyester film used as the base film was changed from 100 μm to 75 μm.

（比較例４の透明導電性フィルム用表面保護フィルムの作製）
粘着剤の厚みを４０μｍにした以外は、実施例１と同様にして、比較例４の透明導電性フィルム用表面保護フィルムを得た。 (Preparation of surface protective film for transparent conductive film of Comparative Example 4)
A surface protective film for a transparent conductive film of Comparative Example 4 was obtained in the same manner as in Example 1 except that the thickness of the pressure-sensitive adhesive was 40 μm.

（比較例５の透明導電性フィルム用表面保護フィルムの作製）
剥離フィルムの基材として、厚みが８０μｍの未延伸ポリプロピレンフィルムを用いた以外は、実施例１と同様にして、比較例５の剥離フィルムを得た。得られた比較例５の剥離フィルムは、４０℃における剛軟度が０．１２ｍＮであった。次に、剥離フィルムを比較例５の剥離フィルムにした以外は、実施例１と同様にして、比較例５の透明導電性フィルム用表面保護フィルムを得た。 (Preparation of surface protective film for transparent conductive film of Comparative Example 5)
A release film of Comparative Example 5 was obtained in the same manner as in Example 1 except that an unstretched polypropylene film having a thickness of 80 μm was used as the base of the release film. The release film of Comparative Example 5 obtained had a bending resistance at 40 ° C. of 0.12 mN. Next, a surface protective film for a transparent conductive film of Comparative Example 5 was obtained in the same manner as in Example 1 except that the release film was changed to the release film of Comparative Example 5.

以下、評価試験の方法および、試験結果について示す。
（剥離フィルムの剛軟度の測定）
ＪＩＳ Ｌ１０９６の曲げ反発性Ａ法（ガーレ法）に準じて、４０℃における剛軟度（ｍＮ）を測定した。
測定装置は、大栄科学精器製作所社製の、型式：ＧＡＳ−１０の、ガーレー剛軟度試験装置を用いた。 The evaluation test method and test results will be described below.
(Measurement of bending softness of release film)
The bending resistance (mN) at 40 ° C. was measured according to the bending repulsion A method (Gurley method) of JIS L1096.
As a measuring apparatus, a Gurley stiffness test apparatus of Model: GAS-10 manufactured by Daiei Scientific Instruments Co., Ltd. was used.

（透明導電性フィルム用表面保護フィルムの初期粘着力の測定）
透明導電性フィルム用基材として、厚みが５０μｍの二軸延伸したポリエステルフィルムの片面に、ハードコート処理が施された、ＩＴＯフィルムにも使用されるハードコート処理したＰＥＴフィルム（きもと社製、品名：ＫＢフィルム＃５０Ｇ０１）を用いた。２５ｍｍ巾に裁断した透明導電性フィルム用表面保護フィルムを、透明導電性フィルム用基材であるＰＥＴフィルムのハードコート処理が施された面に貼合した後、２３℃、５０％ＲＨの環境下に１時間保管し、初期粘着力の測定サンプルとした。その後、引張試験機を用いて、３００ｍｍ／分の剥離速度で１８０°の方向に、透明導電性フィルム用表面保護フィルムを剥離したときの強度を測定し、これを初期粘着力（Ｎ／２５ｍｍ）とした。
測定装置は、島津製作所社製の、型式：ＥＺ−Ｌの、小型卓上試験装置を用いた。 (Measurement of initial adhesive strength of surface protective film for transparent conductive film)
As a substrate for transparent conductive film, a hard-coated PET film used for ITO film, which is hard coated on one side of a biaxially stretched polyester film with a thickness of 50 μm : KB film # 50G01) was used. After pasting the surface protective film for a transparent conductive film cut to a width of 25 mm on the surface subjected to the hard coat treatment of the PET film, which is a substrate for a transparent conductive film, in an environment of 23 ° C. and 50% RH The sample was stored for 1 hour and used as a sample for measuring the initial adhesive strength. Then, using a tensile tester, the strength when the surface protective film for transparent conductive film was peeled in the direction of 180 ° at a peeling speed of 300 mm / min was measured, and this was measured as the initial adhesive strength (N / 25 mm). It was.
The measuring apparatus used was a small tabletop testing apparatus manufactured by Shimadzu Corporation, model EZ-L.

〈透明導電性フィルム用表面保護フィルムの加熱後粘着力の測定〉
２５ｍｍ巾に裁断した透明導電性フィルム用表面保護フィルムを、透明導電性フィルム用基材であるＰＥＴフィルムのハードコート処理が施された面に貼合した後、１５０℃環境下に１時間保管し、加熱後粘着力の測定サンプルとした以外は、初期粘着力の測定と同様にして測定し、これを加熱後粘着力（Ｎ／２５ｍｍ）とした。
測定装置は、島津製作所社製の、型式：ＥＺ−Ｌの、小型卓上試験装置を用いた。 <Measurement of adhesive strength after heating of surface protective film for transparent conductive film>
The surface protective film for a transparent conductive film cut to a width of 25 mm is bonded to the surface of the PET film, which is a substrate for a transparent conductive film, which has been hard-coated, and then stored in an environment at 150 ° C. for 1 hour. The adhesive strength after heating was measured in the same manner as the initial adhesive strength except that the sample was used as the adhesive strength after heating (N / 25 mm).
The measuring apparatus used was a small tabletop testing apparatus manufactured by Shimadzu Corporation, model EZ-L.

（ハードコート処理ＰＥＴフィルムに透明導電性フィルム用表面保護フィルムを貼合した時の、ハンドリング性の確認方法）
透明導電性フィルム用表面保護フィルムの外観検査（後述）を行ったサンプルの透明導電性フィルム用表面保護フィルム（外観検査した位置から切り出して、剥離フィルムを除去したもの）を、透明導電性フィルム用基材である、ハードコート処理したＰＥＴフィルム（きもと社製、品名：ＫＢフィルム＃５０Ｇ０１）のハードコート処理面に貼合し、その後積層品をＡ４サイズにカットする。カットしたサンプルの４つの角の内１つの角を持ち、フィルム面で空中を扇ぐように前後に往復２０回振る。その後ハードコート処理ＰＥＴフィルムに折れや変形が無いかを目視にて確認する。ハードコート処理ＰＥＴフィルムに折れや変形のないものを（○）、折れまたは変形があるものを（×）とした。 (Handling property confirmation method when a surface protective film for a transparent conductive film is bonded to a hard-coated PET film)
For the transparent conductive film, the surface protective film for the transparent conductive film of the sample subjected to the visual inspection (described later) of the surface protective film for the transparent conductive film (from which the peel film was removed by cutting out from the visual inspection position) The substrate is bonded to the hard coat treated surface of a hard coat treated PET film (product name: KB film # 50G01, manufactured by Kimoto Co.), and then the laminated product is cut into A4 size. Hold one corner out of the four corners of the cut sample, and shake it back and forth 20 times so as to fan the air on the film surface. Thereafter, it is visually confirmed whether the hard coat-treated PET film is bent or deformed. A hard coat-treated PET film that was not folded or deformed was indicated by (O), and a film that was folded or deformed was denoted by (X).

（透明導電性フィルム用表面保護フィルムの外観検査の方法）
テストコーターにて、透明導電性フィルム用表面保護フィルムのロール品（４００ｍｍ幅×１００ｍ巻）を作成し、４０℃のオーブンにて５日間保温して、粘着剤の養生を行う。その後、表面保護フィルムをロール品から巻き戻し、剥離フィルムを除去して粘着剤面を表出し、表面保護フィルムの端部から長手方向に５０ｍの所（両端から略等距離の位置）のサンプルの外観を目視にて観察する。粘着剤面が平滑なものを（○）、粘着剤面に弱い凹凸が発生しているものを（△）、粘着剤面に強い凹凸が発生しているものを（×）とした。 (Method of visual inspection of surface protective film for transparent conductive film)
A roll product (400 mm width × 100 m roll) of a surface protective film for a transparent conductive film is prepared with a test coater, and kept in an oven at 40 ° C. for 5 days to cure the adhesive. Thereafter, the surface protective film is rewound from the roll product, the release film is removed, the pressure-sensitive adhesive surface is exposed, and the sample at a position of 50 m in the longitudinal direction from the end of the surface protective film (position at approximately equal distance from both ends). Observe the appearance visually. The case where the pressure-sensitive adhesive surface was smooth was designated as (◯), the case where weak unevenness was generated on the pressure-sensitive adhesive surface (Δ), and the case where strong unevenness was generated on the pressure-sensitive adhesive surface was indicated as (×).

（ハードコート処理フィルムに透明導電性フィルム用表面保護フィルムを貼合した時の外観検査の方法）
透明導電性フィルム用表面保護フィルムの外観検査を行ったサンプルの透明導電性フィルム用表面保護フィルム（外観検査した位置から切り出して、剥離フィルムを除去したもの）を、透明導電性フィルム用基材である、ハードコート処理ＰＥＴフィルム（きもと社製、品名：ＫＢフィルム＃５０Ｇ０１）のハードコート処理面に貼合し、その後１５０℃で１時間の加熱処理を行う。透明導電性フィルム用保護フィルムを剥離した後、ハートーコート処理ＰＥＴフィルムの表面状態を目視にて観察する。ハードコート処理ＰＥＴフィルムの外観が平滑なものを（○）、凹凸状に弱い変形が発生しているものを（△）、凹凸状に強い変形が発生しているものを（×）とした。 (Appearance inspection method when a surface protective film for a transparent conductive film is bonded to a hard-coated film)
The surface protective film for transparent conductive film of the sample subjected to the visual inspection of the surface protective film for transparent conductive film (extracted from the position where the visual inspection was performed and the release film was removed) with the substrate for transparent conductive film A hard coat-treated PET film (manufactured by Kimoto Co., Ltd., product name: KB film # 50G01) is bonded to the hard coat-treated surface, followed by heat treatment at 150 ° C. for 1 hour. After peeling off the protective film for transparent conductive film, the surface state of the heart-coated PET film is visually observed. A hard coat-treated PET film having a smooth appearance was marked with (◯), a film with weak deformation in the irregularities (Δ), and a film with strong deformation in the irregularities (×).

それぞれのサンプルについての測定結果を、表１及び表２に示す。これらの表の「基材フィルム」及び「剥離フィルムの基材」の中で、「１２５Ｅ」、「１００Ｅ」、「７５Ｅ」、「５０Ｅ」、「３８Ｅ」、「２５Ｅ」は、それぞれ厚みが１２５μｍ、１００μｍ、７５μｍ、５０μｍ、３８μｍ、２５μｍのポリエステルフィルムを表し、「８０ＣＰＰ」は、厚みが８０μｍの無延伸ポリプロピレンフィルムを表す。また、表の「粘着剤」の中で、「粘着１」は、実施例１で説明した粘着剤（イソシアネート硬化）を表し、「粘着２」は、実施例２で説明した粘着剤（エポキシ硬化）を表す。   The measurement results for each sample are shown in Tables 1 and 2. Among the “substrate film” and “substrate of release film” in these tables, “125E”, “100E”, “75E”, “50E”, “38E”, and “25E” each have a thickness of 125 μm. , 100 μm, 75 μm, 50 μm, 38 μm, 25 μm polyester film, and “80 CPP” represents an unstretched polypropylene film with a thickness of 80 μm. In the table, “Adhesion 1” represents the adhesive (isocyanate curing) described in Example 1, and “Adhesion 2” represents the adhesive (epoxy curing) described in Example 2. ).

Figure 0005820762
Figure 0005820762

Figure 0005820762
Figure 0005820762

表１及び表２に示した測定結果から、以下のことが判る。
実施例１〜５において、透明導電性フィルム用表面保護フィルムに用いた剥離フィルムの剛軟度は、０．３５〜２．３２であり、加熱工程の前後で粘着力の変化が小さく、かつ、粘着剤表面の凹凸が非常に少ない。また、実施例１〜５の透明導電性フィルム用表面保護フィルムを、透明導電性フィルム用基材である、ハードコート処理ＰＥＴフィルムに貼合した時のハンドリング性も、非常に良好であった。
一方、比較例１、２、５において、透明導電性フィルム用表面保護フィルムに用いた剥離フィルムの、４０℃における剛軟度はそれぞれ０．０５、０．１６、０．１２と低い値であった。その結果、比較例１、２、５の透明導電性フィルム用表面保護フィルム剥離フィルムは、粘着剤面に凹凸が生じており、透明導電性フィルム用基材である、ハードコート処理ＰＥＴフィルムと貼合した積層品を加熱処理した際に粘着剤表面の凹凸形状がハードコート処理ＰＥＴフィルムに転写して、ハードコート処理ＰＥＴフィルムの外観が低下した。
また、比較例３の透明導電性フィルム用表面保護フィルムは、基材フィルムの厚みが１００μｍ未満であり、透明導電性フィルム用基材である、ハードコート処理ＰＥＴフィルムと貼合した積層品のハンドリング性が低下した。
また、比較例４の透明導電性フィルム用表面保護フィルムは、粘着剤層の厚みを４０μｍと厚くしたが、粘着剤表面に凹凸が生じており、透明導電性フィルム用基材である、ハードコート処理ＰＥＴフィルムと貼合した積層品を加熱処理した際に粘着剤表面の凹凸形状がハードコート処理ＰＥＴフィルムに転写して、ハードコート処理ＰＥＴフィルムの外観が低下した。
また、実施例１〜５、比較例１〜５の透明導電性フィルム用表面保護フィルムにおいて、使用した粘着剤層の２０℃での貯蔵弾性率は、いずれも、１．０×１０５〜８．０×１０６ＭＰａの範囲であった。なお、粘着剤層の貯蔵弾性率は、せん断型レオメーター（ＡｎｔｏｎＰａａｒ社製，装置名粘弾性測定装置、型式：ＭＣＲ３０１）にて線形領域内の、周波数１Ｈｚの条件で動的粘弾性試験を行なった。貯蔵弾性率の測定値は、−４０℃〜＋１５０℃の温度範囲で、昇温速度３℃／ｍｉｎの条件により、２０℃における値を読み取り、貯蔵弾性率を得た。 The following can be understood from the measurement results shown in Tables 1 and 2.
In Examples 1 to 5, the bending resistance of the release film used for the surface protective film for a transparent conductive film is 0.35 to 2.32, and the change in the adhesive strength before and after the heating step is small, and There are very few irregularities on the surface of the adhesive. Moreover, the handleability at the time of bonding the surface protection film for transparent conductive films of Examples 1-5 to the hard coat process PET film which is a base material for transparent conductive films was also very favorable.
On the other hand, in Comparative Examples 1, 2, and 5, the release films used for the surface protective film for transparent conductive films had low values of 0.05, 0.16, and 0.12 at 40 ° C., respectively. It was. As a result, the surface protective film peelable film for transparent conductive film of Comparative Examples 1, 2, and 5 has an uneven surface on the pressure-sensitive adhesive surface, and is bonded to a hard coat-treated PET film that is a substrate for transparent conductive film. When the combined laminate was heat-treated, the uneven shape on the surface of the pressure-sensitive adhesive was transferred to the hard-coated PET film, and the appearance of the hard-coated PET film was deteriorated.
Moreover, the surface protection film for transparent conductive films of Comparative Example 3 has a substrate film thickness of less than 100 μm, and is a substrate for transparent conductive films. Decreased.
Further, the surface protective film for transparent conductive film of Comparative Example 4 has a hard coat that is a substrate for a transparent conductive film, although the pressure-sensitive adhesive layer has a thickness of 40 μm, and the pressure-sensitive adhesive surface is uneven. When the laminated product bonded with the treated PET film was heat-treated, the uneven shape of the pressure-sensitive adhesive surface was transferred to the hard-coated PET film, and the appearance of the hard-coated PET film was deteriorated.
Moreover, in the surface protection film for transparent conductive films of Examples 1-5 and Comparative Examples 1-5, the storage elastic modulus at 20 degreeC of the used adhesive layer is 1.0 * 10 < 5 > -8, respectively. The range was 0.0 × 10 6 MPa. The storage elastic modulus of the pressure-sensitive adhesive layer was determined by performing a dynamic viscoelasticity test using a shear rheometer (manufactured by Anton Paar, apparatus name viscoelasticity measuring apparatus, model: MCR301) in a linear region at a frequency of 1 Hz. It was. The measured value of the storage elastic modulus was a temperature range of −40 ° C. to + 150 ° C., and the value at 20 ° C. was read under the condition of a temperature increase rate of 3 ° C./min to obtain the storage elastic modulus.

本発明の透明導電性フィルム用表面保護フィルムは、タッチパネル用の透明電極の製造工程において、薄型化された透明導電性フィルムに、貼合した状態で加熱工程を経た後でも、発生するカールが非常に小さい。このことにより、タッチパネル用の透明電極の製造工程の作業性、生産効率を大幅に改善できる。また、本発明の透明導電性フィルム用表面保護フィルムは、タッチパネル、電子ペーパー、電磁波シールド材、各種センサ、液晶パネル、有機ＥＬ、太陽電池などの技術分野において使用される、透明導電性フィルムの製造・加工用の表面保護フィルムとして幅広く利用できる。   The surface protective film for a transparent conductive film of the present invention has a curl that is generated even after a heating process in a state of being bonded to a thin transparent conductive film in a transparent electrode manufacturing process for a touch panel. Small. As a result, the workability and production efficiency of the transparent electrode manufacturing process for the touch panel can be greatly improved. Moreover, the surface protective film for transparent conductive films of this invention is a manufacture of a transparent conductive film used in technical fields, such as a touch panel, electronic paper, an electromagnetic shielding material, various sensors, a liquid crystal panel, organic EL, and a solar cell. -Widely used as a surface protective film for processing.

１…基材フィルム、２…粘着剤層、３…剥離フィルム、４…粘着フィルム、５…透明導電性フィルム用表面保護フィルム、６…基材、６ａ…基材の一方の面、６ｂ…基材の他方の面、７…ＩＴＯ（透明導電膜）、１０…透明導電性フィルム、２１…剥離フィルムのロール体、２２…基材フィルムのロール体、２３…粘着剤塗布装置、２４…乾燥炉、２５，２６…圧着ロール、２７…透明導電性フィルム用表面保護フィルムのロール体。 DESCRIPTION OF SYMBOLS 1 ... Base film, 2 ... Adhesive layer, 3 ... Release film, 4 ... Adhesive film, 5 ... Surface protection film for transparent conductive films, 6 ... Base material, 6a ... One side of base material, 6b ... Base 7 ... ITO (transparent conductive film), 10 ... transparent conductive film, 21 ... roll body of release film, 22 ... roll body of base film, 23 ... adhesive coating device, 24 ... drying furnace , 25, 26 ... pressure-bonding rolls, 27 ... rolls of surface protective films for transparent conductive films.

Claims (3)

基材の一方の面に透明導電膜が形成された透明導電性フィルムの、他方の面に貼合して使用される透明導電性フィルム用表面保護フィルムであって、ロール体から巻き戻されてなり、可撓性を有する基材フィルムの片面に粘着剤層が積層され、前記粘着剤層の被着面に貼合される表面上に、剥離処理された剥離フィルムが、前記剥離処理された面を介して積層され、前記剥離フィルムの厚みが５０μｍ〜２５０μｍであり、且つ、前記剥離フィルムの４０℃における剛軟度が０．３０ｍＮ〜４０ｍＮであり、
前記透明導電性フィルム用表面保護フィルムの前記基材フィルムが、ポリエチレンテレフタレート樹脂フィルムであり、前記基材フィルムの厚みが１００μｍ〜２５０μｍであり、前記粘着剤層の厚みが、前記基材フィルムの厚みの１／２０〜１／５の厚みであり、被着体である前記他方の面に対する剥離強度が０．０３〜０．３Ｎ／２５ｍｍであることを特徴とする透明導電性フィルム用表面保護フィルム。 A transparent conductive film having a transparent conductive film formed on one surface of a base material, and is a surface protective film for a transparent conductive film that is used by being bonded to the other surface. The adhesive film is laminated on one side of the base film having flexibility, and the release film subjected to the release treatment on the surface to be bonded to the adherent surface of the adhesive layer was subjected to the release treatment. Laminated through the surface, the release film has a thickness of 50 μm to 250 μm, and the release film has a bending resistance at 40 ° C. of 0.30 mN to 40 mN,
The base film of the surface protective film for transparent conductive film is a polyethylene terephthalate resin film, the thickness of the base film is 100 μm to 250 μm, and the thickness of the pressure-sensitive adhesive layer is the thickness of the base film. The surface protective film for a transparent conductive film, having a thickness of 1/20 to 1/5 and a peel strength of 0.03 to 0.3 N / 25 mm with respect to the other surface being an adherend . 請求項１に記載の透明導電性フィルム用表面保護フィルムが、ロール状に巻かれた透明導電性フィルム用表面保護フィルムのロール体。   The roll body of the surface protection film for transparent conductive films by which the surface protection film for transparent conductive films of Claim 1 was wound by roll shape. 前記剥離フィルムが剥離されてなる請求項１に記載の透明導電性フィルム用表面保護フィルムが、基材の一方の面に透明導電膜が形成された透明導電性フィルムの、他方の面に貼合された透明導電性フィルム。 The surface protective film for a transparent conductive film according to claim 1 , wherein the release film is peeled off, and is bonded to the other surface of the transparent conductive film having a transparent conductive film formed on one surface of the substrate. Transparent conductive film.
JP2012099176A 2012-04-24 2012-04-24 Surface protective film for transparent conductive film and transparent conductive film using the same Active JP5820762B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012099176A JP5820762B2 (en) 2012-04-24 2012-04-24 Surface protective film for transparent conductive film and transparent conductive film using the same
KR1020130035054A KR101471921B1 (en) 2012-04-24 2013-04-01 Surface-protective adhesive film for transparent conductive film, and transparent conductive film using the same
TW102112646A TWI479513B (en) 2012-04-24 2013-04-10 Surface-protective adhesive film for transparent conductive film, and transparent conductive film using the same
CN201310140779.2A CN103374308B (en) 2012-04-24 2013-04-22 Transparent and electrically conductive film surface protection film and use its transparent and electrically conductive film
KR1020140155981A KR101549475B1 (en) 2012-04-24 2014-11-11 Surface-protective adhesive film for transparent conductive film, and transparent conductive film using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012099176A JP5820762B2 (en) 2012-04-24 2012-04-24 Surface protective film for transparent conductive film and transparent conductive film using the same

Publications (3)

Publication Number Publication Date
JP2013226676A JP2013226676A (en) 2013-11-07
JP2013226676A5 JP2013226676A5 (en) 2015-04-16
JP5820762B2 true JP5820762B2 (en) 2015-11-24

Family

ID=49460160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012099176A Active JP5820762B2 (en) 2012-04-24 2012-04-24 Surface protective film for transparent conductive film and transparent conductive film using the same

Country Status (4)

Country Link
JP (1) JP5820762B2 (en)
KR (2) KR101471921B1 (en)
CN (1) CN103374308B (en)
TW (1) TWI479513B (en)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101687077B1 (en) * 2013-11-15 2016-12-15 주식회사 엘지화학 Pressure sensitive adhesive composition
JP6049904B2 (en) * 2013-11-15 2016-12-21 エルジー・ケム・リミテッド Adhesive composition
CN104903976B (en) 2013-11-21 2017-11-21 Lg化学株式会社 Diaphragm
JP2015191347A (en) * 2014-03-27 2015-11-02 株式会社カネカ Transparent conductive film laminate and method for manufacturing touch panel
JP6291679B2 (en) * 2014-03-31 2018-03-14 リンテック株式会社 Method for producing surface protective film for transparent conductive substrate, surface protective film for transparent conductive substrate, and laminate
JP6190520B2 (en) * 2014-03-31 2017-08-30 リンテック株式会社 Protective film and film for laminating transparent conductive film with protective film
JP2015193099A (en) * 2014-03-31 2015-11-05 リンテック株式会社 Protective film, method for using protective film, and protective film-fitted transparent conductive substrate
JP6515445B2 (en) * 2014-05-03 2019-05-22 三菱ケミカル株式会社 Polyester film roll for surface protection film and conductive film laminate
JP6218332B2 (en) 2014-08-07 2017-10-25 藤森工業株式会社 Method for producing roll body of surface protective film for transparent conductive film
JP6068403B2 (en) 2014-08-07 2017-01-25 藤森工業株式会社 Surface protective film for transparent conductive film and transparent conductive film using the same
JP6207087B2 (en) * 2014-08-07 2017-10-04 藤森工業株式会社 Surface protective film for transparent conductive film and transparent conductive film using the same
WO2016039296A1 (en) * 2014-09-09 2016-03-17 住友化学株式会社 Polarizing plate and method for producing liquid crystal panel
WO2016043275A1 (en) * 2014-09-19 2016-03-24 リンテック株式会社 Surface-protective film
KR102207876B1 (en) * 2014-11-25 2021-01-26 동우 화인켐 주식회사 Windable optical multilayer film
JP6453443B2 (en) * 2015-03-26 2019-01-16 富士フイルム株式会社 Conductive film laminate
KR20170010695A (en) * 2015-07-20 2017-02-01 재단법인 나노기반소프트일렉트로닉스연구단 Flexible substrate laminate for releasing surface strain and flexible electronic device compring same
JP6696866B2 (en) * 2015-09-07 2020-05-20 積水化学工業株式会社 Process for producing light-transmitting conductive film and laminate for producing light-transmitting conductive film
JP6697876B2 (en) * 2015-12-28 2020-05-27 日東電工株式会社 Protective film for transparent conductive film and laminate
JP6791647B2 (en) * 2016-03-29 2020-11-25 リンテック株式会社 Laminate and protective film
JP6741232B2 (en) * 2016-07-20 2020-08-19 リンテック株式会社 Release film and adhesive sheet
KR101886576B1 (en) * 2016-07-20 2018-08-07 스미또모 가가꾸 가부시키가이샤 Separator film layered adhesive layer-containing optical film
JP6403353B2 (en) * 2017-09-01 2018-10-10 藤森工業株式会社 Method for producing surface protective film for transparent conductive film
CN107643640A (en) * 2017-10-16 2018-01-30 广州奥翼电子科技股份有限公司 Electrophoresis showed diaphragm and electrophoretic display device (EPD)
CN107993747B (en) * 2017-11-23 2020-11-20 清华大学深圳研究生院 Transparent conductive film, conductive structure and preparation method thereof
JP7219082B2 (en) * 2018-12-25 2023-02-07 リンテック株式会社 protective sheets and laminates
CN110437755A (en) * 2019-06-28 2019-11-12 南京五人光学薄膜有限公司 High temperature resistant acrylate protective film
CN111394001B (en) * 2020-04-28 2021-09-17 广东硕成科技有限公司 High-pressure forming protective film for mobile phone back cover and preparation method thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11268168A (en) * 1998-03-24 1999-10-05 Kanegafuchi Chem Ind Co Ltd Plastic film with transparent conducting film and protective film
JP4151821B2 (en) * 2002-01-11 2008-09-17 日東電工株式会社 Surface protective film for transparent conductive film and transparent conductive film
JP4342775B2 (en) * 2002-07-31 2009-10-14 日東電工株式会社 Surface protective film for transparent conductive film, method for producing the same, and transparent conductive film with surface protective film
JP4137551B2 (en) * 2002-08-09 2008-08-20 日東電工株式会社 Surface protective film for transparent conductive substrate and transparent conductive substrate with surface protective film
KR101447311B1 (en) * 2007-09-20 2014-10-06 도요보 가부시키가이샤 Adhesive sheet, upper electrode for touch panel, and image display device
JP2011177892A (en) * 2008-06-24 2011-09-15 Bridgestone Corp Composite liner for winding rubber member
JP5406615B2 (en) * 2009-07-15 2014-02-05 日東電工株式会社 Transparent film and surface protective film using the film
JP5740124B2 (en) * 2010-09-29 2015-06-24 リンテック株式会社 Double-sided adhesive tape and display device with touch panel

Also Published As

Publication number Publication date
TWI479513B (en) 2015-04-01
KR101471921B1 (en) 2014-12-24
JP2013226676A (en) 2013-11-07
KR101549475B1 (en) 2015-09-03
KR20150003109A (en) 2015-01-08
TW201351448A (en) 2013-12-16
KR20130119860A (en) 2013-11-01
CN103374308B (en) 2016-03-02
CN103374308A (en) 2013-10-30

Similar Documents

Publication Publication Date Title
JP5820762B2 (en) Surface protective film for transparent conductive film and transparent conductive film using the same
JP5877122B2 (en) Surface treatment film, surface protection film, and precision electrical and electronic parts on which it is bonded
KR101837940B1 (en) Method for producing roll-body of surface-protective film for transparent conductive film
JP6319919B2 (en) Method for producing surface protective film for transparent conductive film
JP5560965B2 (en) Energy ray easy-release adhesive composition
KR101841967B1 (en) Surface-protective film for transparent conductive film, and transparent conductive film using the same
JP5565173B2 (en) Heat-resistant temporary adhesive tape
JP6403353B2 (en) Method for producing surface protective film for transparent conductive film
JP5565174B2 (en) Heat-resistant temporary adhesive tape
KR101897475B1 (en) Surface-protective film for transparent conductive film, and transparent conductive film using the same
JP4749587B2 (en) Surface protective film and method for peeling the same
JP6076517B2 (en) Release film for antistatic surface protection film
JP2009091476A (en) Protective film with no separator
JP2022153096A (en) double-sided adhesive sheet

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150120

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150302

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20150302

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20150610

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20150626

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150630

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150817

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150908

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20151005

R150 Certificate of patent or registration of utility model

Ref document number: 5820762

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250