JP4200595B2 - Glass fiber fabric - Google Patents
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【０００１】
【発明の属する分野】
本発明は、プリント配線板用積層板の補強材として好適に用いられるガラス繊維織物、および前記ガラス繊維織物を補強材とするプリント配線板用積層板に関するものである。
【０００２】
【従来の技術】
ガラス繊維織物は、優れた耐熱性・寸法安定性・電気特性などの特性を有し、プリント配線板用の積層板の補強材として広く使われている。従来、前記補強材として１枚または２枚以上の厚さ６０〜２００μｍのガラス繊維織物が用いられている。厚さ６０μｍ未満のガラス繊維織物のみを１枚または２枚以上使用して成形した積層板は、積層板の寸法安定性が著しく低下するため、厚さ６０μｍ未満のガラス繊維織物は、主に積層板の厚さ調整用として、厚さ６０〜２００μｍのガラス繊維織物と組み合わせて使われている。しかし、近年のプリント配線板の高密度化・高多層化・薄物化に伴い、厚さ６０μｍ未満のガラス繊維織物のみを補強材として使用する検討がなされている。
【０００３】
特に、ガラス繊維織物を補強材とするプリント配線板用積層板の寸法安定性を向上させる目的で、ガラス繊維織物の製織方法が数多く開示されている。例えば、織り密度を経緯ほぼ同数のガラス繊維糸で製織する方法が特開昭６２−８６０２９号に開示されている。また、ガラス繊維織物のシランカップリング剤処理・開繊処理の際に織布の巾当たりの張力を調整する製造方法が特開平７−２２６５７１号に開示されている。これらに開示されているガラス繊維織物の製織条件は、質量が６０ｇ／ｍ２以上の比較的厚いガラス繊維織物については有効である。しかし、厚さが薄いガラス繊維織物を補強材とするプリント配線板において、寸法安定性の他、電気絶縁性や穴あけ加工性の点で満足する特性がえられないことがある。これは、上記従来技術はガラス繊維織物における糸空隙を小さくするには限界があり、このガラス繊維織物を積層板の補強材として用いた場合、積層板断面のガラス繊維部の均一性が不足しているためである。
【０００４】
また、厚さが薄いガラス繊維織物に関し、糸番手を小さくして、かつガラス繊維糸空隙を小さく製織する方法が特開平５−２８６０６５号、特願平９−２８４２４４号、特願平１１−２８９４２号などに開示されている。これらは、厚さが薄いガラス繊維織物を積層板の補強材として用いた場合、かなりの特性を得ることができるが、現在のプリント配線板にとっては更なる改善が切望されている。
【０００５】
【発明が解決しようとする課題】
本発明は、寸法安定性・絶縁抵抗・穴あけ加工性に優れたプリント配線板用積層板を得るため、この補強材に供されるガラス繊維織物に関するものである。特に厚さが薄いガラス繊維織物に関するものである。
【０００６】
【課題を解決するための手段】
プリント配線板用積層板に要求される特性である寸法安定性、絶縁特性、穴あけ加工性を向上させるためには、その補強材としてのガラス繊維織物について次の特性を有していることが必要である。
【０００７】
（１）寸法安定性について
プリント配線板用積層板の寸法安定性とは、プリント配線板をえるための積層成形工程、回路形成工程、実装工程における熱処理などによる寸法変化の度合いの少なさをいう。補強材としてのガラス繊維織物は次の特性を有するものが好ましい。
（ａ）ガラス繊維織物を構成する経糸、緯糸のうねりが小さい。
（ｂ）経糸と緯糸の接触面積が大きく、熱収縮に対する抵抗が大きい。
（ｃ）経糸方向と緯糸方向の織り組織がほぼ同じ。
【０００８】
（２）絶縁抵抗について
プリント配線板用積層板の絶縁抵抗は、ＪＩＳ規格 Ｒ ３４２０測定方法により求めることができる。補強材としてのガラス繊維織物は次の特性を有するものが好ましい。
（ａ）優れた電気特性を有するガラス組成からなるガラス繊維によるものである。
（ｂ）ガラス繊維糸の空隙が少ない。
【０００９】
（３）穴あけ加工性
プリント配線板用積層板の穴あけ加工性とは、ドリルやレーザによる穴あけ加工における位置精度、穴壁面の平滑性、穴径のばらつき度に関する特性をいう。補強材としてのガラス繊維織物は次の特性を有するものが好ましい。
（ａ）ガラス繊維糸の空隙が少ない。
（ｂ）任意の断面におけるガラス繊維の厚さのばらつきが小さい。
（ｃ）穴あけ加工に適したガラス組成からなるガラス繊維によるものである。
【００１０】
本発明は、前記ガラス繊維織物に要求される特性から、ガラス繊維織物においてガラス繊維糸が扁平の形状であり、かつ極めて低い空隙率で配置されることにより、厚さが薄いガラス繊維織物を補強材とするプリント配線板においても、優れた寸法安定性・絶縁抵抗・穴あけ加工性の特性を得ることができる知見に基づくものである。
【００１１】
すなわち、本発明は、平織りに製織されたガラス繊維織物にあって、通気度が１０ｃｍ３／ｃｍ２／ｓ以下であり、かつ質量が２０〜４５ｇ／ｍ２であることを特徴とする。通気度が１０ｃｍ３／ｃｍ２／ｓを超えると、特に電気絶縁性・穴あけ加工性・絶縁抵抗性が低下することがある。質量が２０ｇ／ｍ２未満は絶縁抵抗・寸法安定性が低下することがあり、質量が４５ｇ／ｍ２を超えるガラス繊維織物は、発明の課題を達成するものではない。
【００１２】
さらに、本発明におけるガラス繊維織物は厚さが４５μｍ以下であることが好ましく、４０μｍ以下であることがさらに望ましい。厚さが４５μｍを超えると前記通気度および質量の条件を満たさないことがある。
【００１３】
また、本発明のガラス繊維織物において通気度、質量、及び厚さの上記関係を達成する為に、ガラス繊維織物における経糸の番手；Ｘ［ｔｅｘ］、緯糸の番手；Ｙ［ｔｅｘ］、経糸の密度；Ａ［本／２５ｍｍ］、緯糸の密度；Ｂ［本／２５ｍｍ］は、下記の式（１）、（２）および（３）の関係を満たすことが必要である。更に好適には下記の式（１）、（４）および（５）の関係を満たすことが望ましい。
【００１４】
｜Ａ−Ｂ｜≦２ （１）
３００≦（Ｘ×Ａ）≦６００ （２）
３００≦（Ｙ×Ｂ）≦６００ （３）
４００≦（Ｘ×Ａ）≦５００ （４）
４００≦（Ｙ×Ｂ）≦５００ （５）
【００１５】
なお、本発明のガラス繊維織物における密度、通気度および厚さは、ＪＩＳ規格 Ｒ ３４２０に定める測定方法による。また、本発明のガラス繊維織物におけるガラス繊維糸の番手はＪＩＳ Ｒ ３４２０ ５．１．１のＡ法の測定方法による。
【００１６】
本発明におけるガラス繊維織物を得るためには、ガラス繊維を平織りに製織した後、開繊処理することが好ましく、特に熱脱油処理に先立って開繊処理することが望ましい。
【００１７】
開繊処理の方法は、高圧ウォータージェットによる方法、バイブロウォッシャーによる方法、超音波による方法などがある。開繊処理の方法は、ガラス繊維の紡糸時に被覆処理する１次サイズ剤、製織前に経糸に被覆処理する２次サイズ剤、シランカップリング剤などの表面処理剤の種類により、またガラス繊維の製織条件や目標とする開繊の程度により、適宜選定すればよい。なお、開繊処理は異なった種類の方法で複数回行ってもよい。
【００１８】
また、本発明におけるプリント配線板用積層板は、前記ガラス繊維織物を１枚または２枚以上を補強材とすることを特徴とする。
【００１９】
【発明の実施の形態】
本発明のガラス繊維織物に用いられるガラス組成は電気絶縁用に適しプリント配線板用として一般に用いられているＥガラスの他、低誘電率のＤガラス、耐酸性のＣガラス、機械的強度の高いＳガラスなど公知のガラス組成からなるものであれば良く、用途により適宜選定すればよい。
【００２０】
また、ガラス繊維の断面の形状は通常の円形ばかりでなく、扁平形状のものでもよく、特にガラス繊維織物の厚みをさらに小さくすることができ、ガラス繊維織物の通気度を更に小さくできる。
【００２１】
本発明のガラス繊維織物において、ガラス繊維織物の厚みが４５μｍ以下にすることが望ましいので、ガラス繊維の繊維径は、特に制限しないが、３μｍ〜１１μｍが好ましい。なお、ガラス繊維の断面形状が前記のように扁平形状のガラス繊維にあっては、扁平断面の短径が３μｍ〜６μｍであることが好ましい。
【００２２】
さらに、本発明のガラス繊維織物に用いるガラス繊糸の撚り数も、特に制限はないが、好ましくは１回／２５ｍｍ以下であることが好ましい。ガラス繊維糸の番手は２．８ｔｅｘ〜２２．５ｔｅｘが好ましい。ガラス繊維糸の経糸および緯糸の織り密度は、番手との関係で適宜設定する。
【００２３】
本発明のプリント配線板用積層板を得るにあたり、ガラス繊維と樹脂との接着力を強固にするために、ガラス繊維糸の製織に先立って、または製織後にシランカップリング剤などで表面処理することが好ましい。この表面処理工程は開繊処理工程の前であっても、後であってもよく、本発明のガラス繊維織物はシランカップリング剤で表面処理していても、表面処理していなくてもよい。
【００２４】
本発明に用いられるシランカップリング剤としては、従来公知のものを適宜使用できる。従来公知のシランカップリング剤としては、例えば、ビニルトリクロロシラン、ビニルトリメトキシシラン、γ−グリシドキシプロピルトリメトキシシラン、γ−メタクリロキシプロピルトリメトキシシラン、γ−メタクリロキシプロピルトリメトキシシラン、γ−アミノプロピルトリエトキシシラン、γ−（２−アミノエチル）アミノプロピルトリメトキシシラン、Ｎ−β−（Ｎ−ビニルベンジルアミノエチル）−γ−アミノプロピルトリメトキシシラン・塩酸塩、Ｎ−フェニル−γ−アミノプロピルトリメトキシシラン、γ−クロロプロピルトリメトキシシラン、γ−メルカプトプロピルトリメトキシシラン、ビニルトリエトキシシラン、β−（３，４−エポキシシクロヘキシル）エチルトリメトキシシランなどを挙げることができる。これらは単独で使用してもよく、または２種以上組み合わせて使用することもできる。
【００２５】
本発明のプリント配線板用積層板を作成するには、常法に従えばよく、ガラス繊維織物に熱硬化性樹脂からなるマトリックス樹脂を含浸、乾燥させて、プリプレグを作成し、このプリプレグを１枚ないし複数枚積層し、加熱加圧成形することにより、得ることができる。前記熱硬化性樹脂としては、エポキシ樹脂、ポリイミド樹脂、ポリエステル樹脂、フェノール樹脂などが用いられる。なお、本発明の積層板は表面の少なくとも一方に、銅、金、銀などからなる導電性金属層を有してもよい。
【００２６】
【実施例】
以下、本発明を実施例により、詳細に説明する。
【００２７】
［実施例１］
（１）ガラス繊維織物の作成
ガラス繊維糸 ＥＣＤ４５０ １／０（繊維径５．２μｍ、ガラス繊維糸束数２００本、番手１１．２ｔｅｘ）を用い、経糸および緯糸の織り密度を４８本／２５ｍｍで、平織りに製織後、バイブロウォッシャーによる開繊処理をした後、ヒートクリーニングし、実施例１のガラス繊維織物を得た。
【００２８】
（２）積層板の作成
（ａ）エポキシ樹脂ワニスの調製
下記に示すエポキシ樹脂ワニスを調整した。
臭素化エポキシ樹脂 １００重量部
（油化シェルエポキシ（株）製 エピコート５０４６−Ｂ−８）
ノボラック型エポキシ樹脂 ２０重量部
（油化シェルエポキシ（株）製 エピコート１５４）
ジシアンジアミド ４重量部
２−エチル−４−メチルイミダゾール ０．２重量部
メチルエチルケトン １５重量部
ジメチルホルムアミド ３０重量部
【００２９】
（ｂ）銅張積層板の作成
（１）で得たガラス繊維織物を、シランカップリング剤としてＮ−β−（Ｎ−ビニルベンジルアミノ）エチル−アミノプロピルトエリメトキシシラン・塩酸塩（東レダウコーニング社製、ＳＺ−６０３２）で表面処理し、前記（２）の（ａ）に示すエポキシ樹脂ワニスを含浸させ、１３０℃、６分間乾燥させてプリプレグとした後、得られたプリプレグ４層とその両面に銅箔を積層し成形して、実施例１の銅張積層板を得た。
【００３０】
［実施例2］
（１）ガラス繊維織物の作成
ガラス繊維糸 ＥＣＤ４５０ １／０（繊維径５．２μｍ、ガラス繊維糸束数２００本、番手１１．２ｔｅｘ）を用い、経糸および緯糸の織り密度を４８本／２５ｍｍで、平織りに製織後、ヒートクリーニングした後、バイブロウォッシャーによる開繊処理をし、実施例２のガラス繊維織物を得た。
（２）銅張積層板の作成
実施例１と同様の方法により実施例2の銅張積層板を得た。
【００３１】
［実施例３］
実施例１の（１）ガラス繊維織物の作成において、経糸および緯糸の織り密度を４０本／２５ｍｍにした以外は実施例１と同様の方法で、実施例３のガラス繊維織物および銅張積層板を得た。
【００３２】
［比較例１］
（１）ガラス繊維織物の作成
ガラス繊維糸 ＥＣＤ４５０ １／０（繊維径５．２μｍ、ガラス繊維糸束数２００本、番手１１．２ｔｅｘ）を用い、経糸および緯糸の織り密度を４８本／２５ｍｍで、平織りに製織後、ヒートクリーニングし、比較例１のガラス繊維織物を得た。
【００３３】
（２）銅張積層板の作成
実施例１と同様の方法で比較例１の銅張積層板を得た。
【００３４】
［比較例２］
比較例１の（１）ガラス繊維織物の作成において、経糸および緯糸の織り密度を４０本／２５ｍｍにした以外は比較例１と同様の方法で、比較例２のガラス繊維織物および銅張積層板を得た。
【００３５】
［ガラス繊維織物および積層板の評価］
（１）ガラス繊維織物の通気度
ＪＩＳ規格 Ｒ ３４２０の規定するガラス繊維織物の試験方法により、実施例および比較例で得たガラス繊維織物の通気度を測定した。
【００３６】
（２）ガラス繊維織物の質量および厚さ
ＪＩＳ規格 Ｒ ３４２０の規定するガラス繊維織物の試験方法により、前記（１）で得たガラス繊維織物の質量を測定した。
【００３７】
（３）積層板の寸法安定性の評価
実施例２および比較例１で得た銅張積層板をエッチング処理し、銅箔を取り除き、その後１７０℃で３０分キュアした後、寸法変化を測定し、寸法変化率を算出した。
【００３８】
（４）穴あけ加工性の評価
穴径０．２ｍｍのドリル加工により穴あけ加工し、穴位置、穴壁面の平滑性、穴径のばらつきについて評価し、４段階で総合評価した。
【００３９】
ガラス繊維織物の特性および積層板の評価を表１に示す。
【００４０】
【表１】
表１に示すように、本発明のガラス繊維織物を補強材とするプリント配線板用積層板は、優れた寸法安定性、穴あけ加工性を有する。
【００４２】
【発明の効果】
本発明のガラス繊維織物を補強材することにより、前記の如く優れた寸法安定性、穴あけ加工性を有するプリント配線板用積層板を得ることができ、かつレジンコンテントを小さくすることが可能なので、電気絶縁性の優れた積層板を得ることができる。また、本発明のプリント配線板は、それ以外に表面平滑性、樹脂含浸性に優れた特性を有する。[0001]
[Field of the Invention]
The present invention relates to a glass fiber fabric suitably used as a reinforcing material for a laminated board for printed wiring boards, and a laminated board for printed wiring boards using the glass fiber fabric as a reinforcing material.
[0002]
[Prior art]
Glass fiber fabric has excellent heat resistance, dimensional stability, electrical characteristics, and the like, and is widely used as a reinforcing material for laminated boards for printed wiring boards. Conventionally, one or two or more glass fiber fabrics having a thickness of 60 to 200 μm are used as the reinforcing material. Laminated plates formed by using only one or two or more glass fiber fabrics having a thickness of less than 60 μm significantly reduce the dimensional stability of the laminate plates. Therefore, glass fiber fabrics having a thickness of less than 60 μm are mainly laminated. It is used in combination with a glass fiber fabric having a thickness of 60 to 200 μm for adjusting the thickness of the plate. However, with recent increases in the density, multilayer, and thickness of printed wiring boards, studies have been made to use only glass fiber fabrics with a thickness of less than 60 μm as reinforcing materials.
[0003]
In particular, many methods for weaving glass fiber fabrics have been disclosed for the purpose of improving the dimensional stability of laminates for printed wiring boards using glass fiber fabrics as reinforcing materials. For example, JP-A-62-86029 discloses a method of weaving with glass fiber yarns having the same number of weaving densities. Japanese Patent Application Laid-Open No. 7-226571 discloses a manufacturing method for adjusting the tension per width of a woven fabric during the silane coupling agent treatment / opening treatment of a glass fiber fabric. The weaving conditions for the glass fiber fabric disclosed in these documents are effective for a relatively thick glass fiber fabric having a mass of 60 g / m 2 or more. However, in a printed wiring board using a thin glass fiber fabric as a reinforcing material, in addition to dimensional stability, characteristics that are satisfactory in terms of electrical insulation and drilling workability may not be obtained. This is because the conventional technology has a limit in reducing the yarn gap in the glass fiber fabric, and when this glass fiber fabric is used as a reinforcing material for the laminated plate, the uniformity of the glass fiber portion of the cross section of the laminated plate is insufficient. This is because.
[0004]
Further, regarding a glass fiber fabric having a small thickness, methods for weaving with a small yarn count and a small glass fiber yarn gap are disclosed in Japanese Patent Application Laid-Open Nos. 5-286605, 9-284244, and 11-28942. And the like. Although these can obtain considerable characteristics when a thin glass fiber fabric is used as a reinforcing material for a laminated board, further improvement is desired for the current printed wiring board.
[0005]
[Problems to be solved by the invention]
The present invention relates to a glass fiber fabric used for a reinforcing material in order to obtain a laminated board for printed wiring board excellent in dimensional stability, insulation resistance, and punching workability. In particular, it relates to a thin glass fiber fabric.
[0006]
[Means for Solving the Problems]
In order to improve the dimensional stability, insulation characteristics, and drilling workability that are required for laminated boards for printed wiring boards, it is necessary to have the following characteristics for glass fiber fabric as a reinforcing material. It is.
[0007]
(1) Dimensional stability Dimensional stability of a laminated board for printed wiring boards refers to a small degree of dimensional change caused by heat treatment in a lamination molding process, a circuit forming process, and a mounting process for obtaining a printed wiring board. . The glass fiber fabric as the reinforcing material preferably has the following characteristics.
(A) Waviness of the warp and weft constituting the glass fiber fabric is small.
(B) The contact area between the warp and the weft is large, and the resistance to heat shrinkage is large.
(C) The weave structures in the warp direction and the weft direction are almost the same.
[0008]
(2) About insulation resistance The insulation resistance of the laminated board for printed wiring boards can be calculated | required by the JIS specification R3420 measuring method. The glass fiber fabric as the reinforcing material preferably has the following characteristics.
(A) It is based on the glass fiber which consists of a glass composition which has the outstanding electrical property.
(B) There are few voids of the glass fiber yarn.
[0009]
(3) Drilling workability The drilling workability of the laminated board for printed wiring boards refers to characteristics relating to positional accuracy, hole wall smoothness, and hole diameter variation in drilling with a drill or laser. The glass fiber fabric as the reinforcing material preferably has the following characteristics.
(A) There are few voids of glass fiber yarn.
(B) The variation in the thickness of the glass fiber in an arbitrary cross section is small.
(C) It is based on glass fibers having a glass composition suitable for drilling.
[0010]
The present invention reinforces a thin glass fiber woven fabric by arranging the glass fiber yarn in a flat shape and a very low porosity in the glass fiber woven fabric because of the characteristics required for the glass fiber woven fabric. This is based on the knowledge that excellent dimensional stability, insulation resistance and drilling properties can be obtained even in the printed wiring board used as a material.
[0011]
That is, the present invention is a glass fiber woven woven into a plain weave, and has an air permeability of 10 cm 3 / cm 2 / s or less and a mass of 20 to 45 g / m 2 . When the air permeability exceeds 10 cm 3 / cm 2 / s, particularly electrical insulation, drilling workability, and insulation resistance may be deteriorated. If the mass is less than 20 g / m 2, the insulation resistance and dimensional stability may decrease, and a glass fiber fabric having a mass exceeding 45 g / m 2 does not achieve the object of the invention.
[0012]
Furthermore, the glass fiber fabric in the present invention preferably has a thickness of 45 μm or less, and more preferably 40 μm or less. When the thickness exceeds 45 μm, the air permeability and mass conditions may not be satisfied.
[0013]
In addition, in order to achieve the above-described relationships of air permeability, mass, and thickness in the glass fiber fabric of the present invention, the warp count in the glass fiber fabric; X [tex], the weft count; Y [tex], warp The density: A [lines / 25 mm] and the density of the wefts; B [lines / 25 mm] are required to satisfy the following expressions (1), (2), and (3) . More preferably, it is desirable to satisfy the following expressions (1), (4) and (5).
[0014]
| AB | ≦ 2 (1)
300 ≦ (X × A) ≦ 600 (2)
300 ≦ (Y × B) ≦ 600 (3)
400 ≦ (X × A) ≦ 500 (4)
400 ≦ (Y × B) ≦ 500 (5)
[0015]
In addition, the density, the air permeability, and the thickness in the glass fiber fabric of the present invention are determined by a measuring method defined in JIS standard R 3420. Moreover, the count of the glass fiber yarn in the glass fiber fabric of this invention is based on the measuring method of A method of JISR3420 5.1.1.
[0016]
In order to obtain the glass fiber woven fabric in the present invention, it is preferable that the glass fiber is woven into a plain weave and then subjected to a fiber opening treatment, and it is particularly preferable to perform the fiber opening treatment prior to the thermal deoiling treatment.
[0017]
As a method of the fiber opening treatment, there are a method using a high-pressure water jet, a method using a vibro washer, a method using an ultrasonic wave, and the like. The method of fiber opening treatment depends on the type of surface treatment agent such as a primary sizing agent that is coated during spinning of the glass fiber, a secondary sizing agent that is coated on the warp before weaving, and a silane coupling agent. What is necessary is just to select suitably according to the weaving conditions and the target opening degree. The opening process may be performed a plurality of times by different types of methods.
[0018]
Moreover, the laminated board for printed wiring boards in the present invention is characterized in that one or two or more glass fiber fabrics are used as a reinforcing material.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
The glass composition used in the glass fiber fabric of the present invention is suitable for electrical insulation and is generally used for printed wiring boards, such as E glass, low dielectric constant D glass, acid resistant C glass, and high mechanical strength. What is necessary is just to consist of well-known glass compositions, such as S glass, and should just select suitably by a use.
[0020]
The cross-sectional shape of the glass fiber may be not only a normal circular shape but also a flat shape. In particular, the thickness of the glass fiber fabric can be further reduced, and the air permeability of the glass fiber fabric can be further reduced.
[0021]
In the glass fiber woven fabric of the present invention, it is desirable that the thickness of the glass fiber woven fabric is 45 μm or less. Therefore, the fiber diameter of the glass fiber is not particularly limited, but is preferably 3 μm to 11 μm. In addition, when the cross-sectional shape of the glass fiber is a flat glass fiber as described above, the minor axis of the flat cross-section is preferably 3 μm to 6 μm.
[0022]
Further, the number of twists of the glass fiber used in the glass fiber fabric of the present invention is not particularly limited, but is preferably 1 time / 25 mm or less. The count of the glass fiber yarn is preferably 2.8 tex to 22.5 tex. The weave density of the warp yarn and the weft yarn of the glass fiber yarn is appropriately set in relation to the count.
[0023]
In obtaining the laminated board for a printed wiring board of the present invention, in order to strengthen the adhesion between the glass fiber and the resin, the surface treatment is performed with a silane coupling agent or the like prior to weaving the glass fiber yarn or after weaving. Is preferred. This surface treatment step may be before or after the fiber opening treatment step, and the glass fiber fabric of the present invention may or may not be surface treated with a silane coupling agent. .
[0024]
A conventionally well-known thing can be used suitably as a silane coupling agent used for this invention. Conventionally known silane coupling agents include, for example, vinyltrichlorosilane, vinyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ -Aminopropyltriethoxysilane, γ- (2-aminoethyl) aminopropyltrimethoxysilane, N-β- (N-vinylbenzylaminoethyl) -γ-aminopropyltrimethoxysilane hydrochloride, N-phenyl-γ -Aminopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, vinyltriethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane and the like. These may be used alone or in combination of two or more.
[0025]
The laminate for a printed wiring board of the present invention may be prepared by a conventional method. A glass fiber fabric is impregnated with a matrix resin composed of a thermosetting resin and dried to prepare a prepreg. It can be obtained by laminating one sheet or a plurality of sheets and heating and pressing. As the thermosetting resin, epoxy resin, polyimide resin, polyester resin, phenol resin, or the like is used. In addition, the laminated board of this invention may have an electroconductive metal layer which consists of copper, gold | metal | money, silver, etc. on at least one surface.
[0026]
【Example】
Hereinafter, the present invention will be described in detail by way of examples.
[0027]
[Example 1]
(1) Preparation of glass fiber fabric Glass fiber yarn ECD450 1/0 (fiber diameter 5.2 μm, number of glass fiber yarn bundles 200, count 11.2 tex), and weaving density of warp and weft yarns at 48 yarns / 25 mm After weaving into a plain weave, the fiber was opened with a vibro washer and then heat-cleaned to obtain the glass fiber fabric of Example 1.
[0028]
(2) Preparation of laminate (a) Preparation of epoxy resin varnish The epoxy resin varnish shown below was prepared.
Brominated epoxy resin 100 parts by weight (Epicoat 5046-B-8 manufactured by Yuka Shell Epoxy Co., Ltd.)
20 parts by weight of novolac type epoxy resin (Epicoat 154 manufactured by Yuka Shell Epoxy Co., Ltd.)
Dicyandiamide 4 parts by weight 2-ethyl-4-methylimidazole 0.2 parts by weight Methyl ethyl ketone 15 parts by weight Dimethylformamide 30 parts by weight
(B) Preparation of copper clad laminate The glass fiber fabric obtained in (1) was used as a silane coupling agent with N-β- (N-vinylbenzylamino) ethyl-aminopropyltrimethoxysilane hydrochloride (Toray Dow Corning). (SZ-6032), impregnated with the epoxy resin varnish shown in (a) of (2) above, dried at 130 ° C. for 6 minutes to form a prepreg, and then the obtained prepreg 4 layers and its A copper foil was laminated and molded on both sides to obtain a copper-clad laminate of Example 1.
[0030]
[Example 2]
(1) Preparation of glass fiber fabric Glass fiber yarn ECD450 1/0 (fiber diameter 5.2 μm, number of glass fiber yarn bundles 200, count 11.2 tex), and weaving density of warp and weft yarns at 48 yarns / 25 mm After weaving into a plain weave, heat cleaning, and fiber-opening treatment with a vibro washer, the glass fiber fabric of Example 2 was obtained.
(2) Preparation of copper clad laminate A copper clad laminate of Example 2 was obtained in the same manner as in Example 1.
[0031]
[Example 3]
Example 1 (1) Glass fiber fabric and copper-clad laminate of Example 3 in the same manner as in Example 1 except that the weave density of warps and wefts was 40/25 mm in the production of the glass fiber fabric. Got.
[0032]
[Comparative Example 1]
(1) Preparation of glass fiber fabric Glass fiber yarn ECD450 1/0 (fiber diameter 5.2 μm, number of glass fiber yarn bundles 200, count 11.2 tex), and weaving density of warp and weft yarns at 48 yarns / 25 mm After weaving into a plain weave, heat cleaning was performed to obtain a glass fiber fabric of Comparative Example 1.
[0033]
(2) Preparation of copper clad laminate A copper clad laminate of Comparative Example 1 was obtained in the same manner as in Example 1.
[0034]
[Comparative Example 2]
Comparative Example 1 (1) Glass fiber fabric and copper-clad laminate of Comparative Example 2 in the same manner as Comparative Example 1 except that the weaving density of warps and wefts was 40/25 mm in the production of glass fiber fabric Got.
[0035]
[Evaluation of glass fiber fabrics and laminates]
(1) Air permeability of glass fiber woven fabric The air permeability of the glass fiber woven fabrics obtained in Examples and Comparative Examples was measured by the test method for glass fiber woven fabric defined by JIS standard R 3420.
[0036]
(2) Mass and thickness of glass fiber fabric The mass of the glass fiber fabric obtained in the above (1) was measured by the test method for glass fiber fabric defined by JIS Standard R 3420.
[0037]
(3) Evaluation of dimensional stability of laminated board The copper clad laminated board obtained in Example 2 and Comparative Example 1 was etched, the copper foil was removed, and then cured at 170 ° C for 30 minutes, and then the dimensional change was measured. The dimensional change rate was calculated.
[0038]
(4) Evaluation of drilling workability Drilling was performed by drilling with a hole diameter of 0.2 mm, and the hole position, the smoothness of the hole wall surface, and the variation in hole diameter were evaluated, and comprehensive evaluation was performed in four stages.
[0039]
Table 1 shows the characteristics of the glass fiber fabric and the evaluation of the laminate.
[0040]
[Table 1]
As shown in Table 1, the laminated board for printed wiring boards using the glass fiber fabric of the present invention as a reinforcing material has excellent dimensional stability and drilling workability.
[0042]
【The invention's effect】
By reinforcing the glass fiber fabric of the present invention, it is possible to obtain a laminated board for printed wiring board having excellent dimensional stability and drillability as described above, and the resin content can be reduced. A laminate having excellent electrical insulation can be obtained. Moreover, the printed wiring board of this invention has the characteristic excellent in surface smoothness and resin impregnation property other than that.
Claims (4)
｜Ａ−Ｂ｜≦２ （１）
３００≦（Ｘ×Ａ）≦６００ （２）
３００≦（Ｙ×Ｂ）≦６００ （３）A glass fiber fabric woven into a plain weave, wherein the air permeability of the glass fiber fabric is 10 cm 3 / cm 2 / s or less, the mass of the glass fiber fabric is 20 to 45 g / m 2 , and the thickness is 40 μm or less. And the warp count of the glass fiber fabric; X [tex], weft count; Y [tex], warp density; A [lines / 25 mm], weft density; B [lines / 25 mm] A glass fiber fabric in a relationship satisfying the following formulas (1), (2) and (3).
| AB | ≦ 2 (1)
300 ≦ (X × A) ≦ 600 (2)
300 ≦ (Y × B) ≦ 600 (3)
である請求項１に記載のガラス繊維織物。2.8 ≦ X ≦ 22.5 and 2.8 ≦ Y ≦ 22.5
The glass fiber fabric according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18292599A JP4200595B2 (en) | 1999-06-29 | 1999-06-29 | Glass fiber fabric |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18292599A JP4200595B2 (en) | 1999-06-29 | 1999-06-29 | Glass fiber fabric |
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| JP4200595B2 true JP4200595B2 (en) | 2008-12-24 |
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| JP18292599A Expired - Lifetime JP4200595B2 (en) | 1999-06-29 | 1999-06-29 | Glass fiber fabric |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101251141B1 (en) * | 2009-08-26 | 2013-04-05 | 아사히 가세이 이-매터리얼즈 가부시키가이샤 | Glass cloth for printed wiring board |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5202775B2 (en) * | 2000-05-23 | 2013-06-05 | 三菱瓦斯化学株式会社 | Prepreg, metal-clad laminate and use thereof |
| JP4774702B2 (en) * | 2004-03-04 | 2011-09-14 | 日立化成工業株式会社 | Prepreg, and metal foil-clad laminate and printed circuit board obtained using the same |
| KR100906286B1 (en) | 2004-03-04 | 2009-07-06 | 히다치 가세고교 가부시끼가이샤 | Prepreg, metal-clad laminate and printed circuit board using same |
| JP2007277463A (en) * | 2006-04-10 | 2007-10-25 | Hitachi Chem Co Ltd | Low dielectric prepreg, and metal foil clad laminate and multilayer printed wiring board using the same |
| JP5195232B2 (en) * | 2008-09-29 | 2013-05-08 | 日東紡績株式会社 | Manufacturing method of glass fiber fabric |
| JP6015303B2 (en) * | 2012-09-27 | 2016-10-26 | 日立化成株式会社 | Prepreg, laminated board and printed wiring board |
| CN105442158A (en) * | 2015-11-12 | 2016-03-30 | 通城县同力玻纤有限公司 | Weaving method for novel mica base cloth |
-
1999
- 1999-06-29 JP JP18292599A patent/JP4200595B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101251141B1 (en) * | 2009-08-26 | 2013-04-05 | 아사히 가세이 이-매터리얼즈 가부시키가이샤 | Glass cloth for printed wiring board |
| US9161441B2 (en) | 2009-08-26 | 2015-10-13 | Asahi Kasei E-Materials Corporation | Glass cloth for printed wiring board |
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| JP2001011750A (en) | 2001-01-16 |
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