JP3237718B2 - Multilayer electronic components for noise suppression - Google Patents
Multilayer electronic components for noise suppressionInfo
- Publication number
- JP3237718B2 JP3237718B2 JP09478292A JP9478292A JP3237718B2 JP 3237718 B2 JP3237718 B2 JP 3237718B2 JP 09478292 A JP09478292 A JP 09478292A JP 9478292 A JP9478292 A JP 9478292A JP 3237718 B2 JP3237718 B2 JP 3237718B2
- Authority
- JP
- Japan
- Prior art keywords
- coil
- dielectric
- noise
- noise suppression
- multilayer electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は、コイルを用いて高周波
用ノイズを除去するノイズ対策用積層型電子部品に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated electronic component for noise suppression which removes high frequency noise using a coil.
【０００２】[0002]
【従来の技術および発明が解決しようとする課題】従来
のノイズ除去コイルは、コイルのインピーダンスだけを
用いてノイズを除去するものであり、この構成によれ
ば、ノイズを効果的に除去するには限界があった。2. Description of the Related Art A conventional noise removing coil removes noise using only the impedance of the coil. According to this configuration, it is necessary to remove noise effectively. There was a limit.
【０００３】本発明は、上記問題点に鑑み、コイルを用
いたノイズ除去部品において、ノイズ除去を効果的に行
うことのできる構成のものを提供することを目的とす
る。[0003] In view of the above problems, an object of the present invention is to provide a noise elimination component using a coil that can effectively remove noise.
【０００４】[0004]
【課題を解決するための手段】この目的を達成するた
め、本発明は、誘電体による積層体内部に、コイル導体
を巻上げてなる少なくとも１個のコイルを形成し、コイ
ル導体層間の分布容量とコイル導体のインダクタンスと
によるトラップ回路を構成し、前記トラップ回路を構成
した積層体を、磁性体とコイル導体とを積層して少なく
とも１個のコイルを形成した積層体に一体に重ねて構成
したことを特徴とする。According to the present invention, at least one coil formed by winding a coil conductor is formed inside a laminate made of a dielectric material, and the distributed capacitance between the coil conductor layers is improved. A trap circuit is formed by the inductance of the coil conductor, and the laminated body constituting the trap circuit is integrally laminated on a laminated body in which at least one coil is formed by laminating a magnetic material and a coil conductor. It is characterized by.
【０００５】[0005]
【作用】本発明のノイズ対策用積層型電子部品は、上述
の構造を有するものであって、コイル部を誘電体内に埋
設することにより、コイル導体の層間の容量を上げ、コ
イル部と並列にコンデンサを形成し、ＬＣトラップを構
成し、このＬＣトラップの共振周波数をノイズを除去し
たい周波数に合わせて効果的なノイズ除去を行う。ま
た、磁性体内にコイルを埋設した積層体を誘電体にコイ
ルを埋設した積層体に重ねたことにより、誘電体とコイ
ルとの組合わせでは実現できない広い帯域についてのノ
イズ除去を行う。 The laminated electronic component for noise suppression according to the present invention has the above-mentioned structure. By embedding the coil portion in a dielectric material, the capacitance between the layers of the coil conductor is increased, and the noise is reduced in parallel with the coil portion. A capacitor is formed to constitute an LC trap, and effective noise removal is performed by adjusting the resonance frequency of the LC trap to the frequency at which noise is to be removed. Ma
Also, a laminated body with a coil embedded in a magnetic body is coiled into a dielectric.
Of the dielectric and coil
Over wide bandwidths that cannot be achieved by combining
Perform noise reduction.
【０００６】[0006]
【実施例】図１（Ａ）は本発明によるノイズ対策用積層
型電子部品の前提構成を示す断面図、（Ｂ）はそのモデ
ル図、（Ｃ）はその等価回路図である。図１（Ａ）にお
いて、１はセラミックでなる誘電体、２は銀、あるいは
銀−パラジウム等によりなるコイルであり、コイル導体
３を誘電体１と共に印刷法あるいはシート法により誘電
体１内に一部を除いて埋設するように積層し、焼成して
形成される。４はこの積層体の側面に焼き付けあるいは
電気めっきにより形成された端子電極である。1A is a cross-sectional view showing the premise of a laminated electronic component for noise suppression according to the present invention, FIG. 1B is a model diagram thereof, and FIG. 1C is an equivalent circuit diagram thereof. In FIG. 1 (A), 1 is a dielectric made of ceramic, 2 is a coil made of silver or silver-palladium, etc., and a coil conductor 3 is placed in the dielectric 1 together with the dielectric 1 by a printing method or a sheet method. It is formed by stacking and baking so as to be buried except for the part. Reference numeral 4 denotes a terminal electrode formed on the side surface of the laminate by baking or electroplating.
【０００７】この積層型電子部品は、図１（Ｂ）に示す
ように、誘電体１がコイル２の層間に介在することによ
り、分布容量が上がり、コイル２と並列にコンデンサ５
が形成され、図１（Ｃ）に示すように、コイル２とこの
コンデンサ５によりＬＣトラップが形成される。このよ
うに、共振を利用し、除去したい周波数に合わせて共振
周波数を設定すれば、従来のコイルのみによる場合に比
較して高減衰量のノイズ除去部品が構成でき、ノイズ除
去を効果的に行える。In this laminated electronic component, as shown in FIG. 1B, the dielectric 1 is interposed between the layers of the coil 2 to increase the distributed capacitance, and the capacitor 5 is connected in parallel with the coil 2.
Is formed, and as shown in FIG. 1C, the coil 2 and the capacitor 5 form an LC trap. As described above, if the resonance frequency is used and the resonance frequency is set in accordance with the frequency to be removed, a noise removal component having a higher attenuation can be configured as compared with the case where only the conventional coil is used, and the noise removal can be effectively performed. .
【０００８】なお、誘電体１としては種々のものが使用
可能であるが、一例としてＴｉＯ２＋ＣｕＯ＋ＮｉＯ＋
ＭｎＯ系ものが用いられ、また、１０ＭＨｚ〜１ＧＨｚ
の周波数帯域で使用するものとしては、誘電率が３０〜
２０，０００程度のものが好ましい。Although various dielectric materials 1 can be used, for example, TiO 2 + CuO + NiO +
MnO type is used, and 10 MHz to 1 GHz
For use in the frequency band, the dielectric constant is 30 to
Those of about 20,000 are preferred.
【０００９】図２（Ａ）は本発明の一実施例を示す断面
図であり、本実施例は、誘電体１内にコイル２を埋設し
てなる積層体６の両面に、それぞれフェライト等の磁性
体７、８内にコイル９、１０を埋設してなる積層体１
１、１２を、磁性体７、８と誘電体１との中間の縮率を
有する焼成時バッファゾーンとしての絶縁材でなる中間
層１３（この中間層は必ずしも必要ではない）を介して
一体に焼成したもので、このように、誘電体１からなる
積層体６に磁性体７、８からなる積層体１１、１２を組
合わせれば、磁性体７、８とコイル９、１０との組合わ
せによる積層体によって合成特性（相乗効果）が得られ
ることにより、図２（Ｃ）に示すように、誘電体１とコ
イル２との組合わせでは実現できない広い帯域につい
て、効果的なノイズ除去が行える。図２（Ｃ）におい
て、ｆ１、ｆ２、ｆ３はそれぞれ積層体１１、６、１２
における共振周波数を示している。また、コイル２、
７、８間にもコンデンサ１４が形成されることにより、
このコンデンサ１４を加味した共振もノイズ除去に利用
できる。FIG. 2A is a cross-sectional view showing one embodiment of the present invention. In this embodiment, a ferrite or the like is provided on both surfaces of a laminated body 6 in which a coil 2 is embedded in a dielectric 1. Laminated body 1 in which coils 9 and 10 are embedded in magnetic bodies 7 and 8
1 and 12 are integrated with each other via an intermediate layer 13 (which is not necessarily required) made of an insulating material serving as a buffer zone during sintering having a contraction ratio between the magnetic bodies 7 and 8 and the dielectric 1. When the laminates 11 and 12 composed of the magnetic bodies 7 and 8 are combined with the laminate 6 composed of the dielectric 1 in this way, the combination of the magnetic bodies 7 and 8 and the coils 9 and 10 By obtaining the combined characteristics (synergistic effect) by the laminated body, as shown in FIG. 2C, effective noise removal can be performed in a wide band which cannot be realized by the combination of the dielectric 1 and the coil 2. In FIG. 2 (C), f1, f2, and f3 are laminated bodies 11, 6, and 12, respectively.
At the resonance frequency. Also, coil 2,
By forming the capacitor 14 also between 7 and 8,
Resonance in consideration of the capacitor 14 can also be used for noise removal.
【００１０】なお、本発明において、この積層型電子部
品上に、厚膜印刷による配線パターンや抵抗ネットワー
クを構成し、ＩＣやトランジスタをその上に搭載して混
成集積回路素子として応用することも可能である。In the present invention, a wiring pattern or a resistor network formed by thick film printing is formed on the laminated electronic component, and an IC or a transistor can be mounted thereon to be applied as a hybrid integrated circuit device. It is.
【００１１】[0011]
【発明の効果】本発明によれば、コイル導体を誘電体内
に埋設することにより、分布容量を増大させ、コンデン
サを形成してＬＣトラップを構成したので、従来より減
衰量の大きなノイズ除去部品が提供でき、効果的にノイ
ズ除去を行うことができる。According to the present invention , the coil conductor is buried in the dielectric to increase the distributed capacitance, and the capacitor is formed to constitute the LC trap. Can be provided and noise can be effectively removed.
【００１２】また、磁性体内にコイルを埋設した積層体
を誘電体にコイルを埋設した積層体に重ねたので、誘電
体とコイルとの組合わせでは実現できない広い帯域につ
いてのノイズ除去が可能となる。 Further, since the laminate formed by embedding the coil in the magnetic body superimposed on laminate embedded coil in the dielectric, it is possible to denoising of a wide band that can not be realized in combination with a dielectric and the coil .
【図１】（Ａ）は本発明によるノイズ対策用積層型電子
部品の前提構成を示す断面図、 （Ｂ）は本実施例のモデル図、（Ｃ）はその等価回路図
である。FIG. 1A is a cross-sectional view showing a premise configuration of a multilayer electronic component for noise suppression according to the present invention, FIG. 1B is a model diagram of the present embodiment, and FIG. 1C is an equivalent circuit diagram thereof.
【図２】（Ａ）は本発明によるノイズ対策用積層型電子
部品の一実施例を示す断面図、 （Ｂ）は本実施例のモデル図、（Ｃ）はその周波数と利
得との関係を示す特性図である。2A is a cross-sectional view showing one embodiment of a multilayer electronic component for noise suppression according to the present invention, FIG. 2B is a model diagram of the present embodiment, and FIG. 2C is a diagram showing the relationship between the frequency and the gain. FIG.
１ 誘電体 ２、９、１０ コイル ３ コイル導体 ４ 端子電極 ５、１４ コンデンサ ６、１１、１２ 積層体 ７、８ 磁性体 １３ 中間層 DESCRIPTION OF SYMBOLS 1 Dielectric 2, 9, 10 Coil 3 Coil conductor 4 Terminal electrode 5, 14 Capacitor 6, 11, 12 Laminated body 7, 8 Magnetic body 13 Intermediate layer
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01F 27/00 H01G 4/40 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) H01F 27/00 H01G 4/40
Claims (1)
巻上げてなる少なくとも１個のコイルを形成し、 コイル導体層間の分布容量とコイル導体のインダクタン
スとによるトラップ回路を構成し、 前記トラップ回路を構成した積層体を、磁性体とコイル
導体とを積層して少なくとも１個のコイルを形成した積
層体に一体に重ねて構成した ことを特徴とするノイズ対
策用積層型電子部品。1. A inside the laminated body by the dielectric, to form at least one coil formed by winding a coil conductor, to constitute a trap circuit by the inductance of the distributed capacitance and the coil conductors of the coil conductor layers, the trap circuit The laminated body composed of
Product formed by laminating conductors to form at least one coil
A multilayer electronic component for noise suppression characterized by being integrally formed on a layer body .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP09478292A JP3237718B2 (en) | 1992-03-20 | 1992-03-20 | Multilayer electronic components for noise suppression |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP09478292A JP3237718B2 (en) | 1992-03-20 | 1992-03-20 | Multilayer electronic components for noise suppression |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05267059A JPH05267059A (en) | 1993-10-15 |
| JP3237718B2 true JP3237718B2 (en) | 2001-12-10 |
Family
ID=14119662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP09478292A Expired - Fee Related JP3237718B2 (en) | 1992-03-20 | 1992-03-20 | Multilayer electronic components for noise suppression |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3237718B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06283336A (en) * | 1993-03-26 | 1994-10-07 | Toko Inc | Trap element |
| JP2000196391A (en) * | 1998-12-24 | 2000-07-14 | Mitsubishi Materials Corp | Filter |
| JPWO2005036741A1 (en) * | 2003-10-14 | 2006-12-28 | エス・オー・シー株式会社 | Noise prevention coil circuit |
| TWI281781B (en) | 2004-08-25 | 2007-05-21 | Murata Manufacturing Co | Noise filter and noise filter array |
| JP4669722B2 (en) * | 2005-03-18 | 2011-04-13 | 太陽誘電株式会社 | Resonant circuit, filter circuit, multilayer substrate and circuit module |
-
1992
- 1992-03-20 JP JP09478292A patent/JP3237718B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05267059A (en) | 1993-10-15 |
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