JP2585148Y2 - Chip type electronic components - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip type electronic component mounted on an electronic circuit board.

[0002]

2. Description of the Related Art In recent years, there has been a strong demand for miniaturization of electronic equipment and the like, and accordingly, inductors and capacitors mounted on an electronic circuit board incorporated in the electronic equipment have also been reduced in size, and an insulating package has been used. Automatic mounting by a mounting machine is being attempted as a coated chip shape.

In general, chip-type electronic components cover an element body to which lead terminals are fixed with an insulating sheath such as a resin, and fold the lead terminals derived from the sheath along the side and bottom surfaces of the sheath to form a package. It has a structure attached to the bottom surface of the body so as to be soldered to the substrate.

[0004] The terminal structure of the above-described conventional chip-type electronic component will be described with reference to FIGS.

In the sectional views shown in FIGS. 4 to 6, the structures of the exterior resin and the lead terminals are symmetrical, and the materials are the same.

In the chip-type electronic component 10 shown in FIG. 4, lead terminals 5 protruding from both sides of the element body 3 are led out from the insulating sheath 1 and bent in an L shape along the side surface. It is an example of the structure which pressed and bent to the bottom of the insulating exterior body.

At this time, the element body 3 is a body such as an inductor or a capacitor, and the insulating sheath 1 is a thermosetting resin such as an alkyd resin or an epoxy resin. By doing so, it is formed integrally with the element body 3. The lead terminal 5 is a plate-shaped metal, which is formed by rolling a good conductor such as copper into a thin plate and punching and molding the same.

Next, the chip-type electronic component 20 shown in FIG. 5 is provided with a concave portion 27 having an inclined surface which becomes deeper inward toward the tip of the attached lead terminal 5 on the bottom surface of the insulating sheath 1. This is an example of a structure in which the bending angle 25 of the lead terminal 5 is acute.

Next, in the chip-type electronic component 30 shown in FIG. 6, the claw portion 39 is formed by slightly bending the tip of the plate-like lead terminal 5 and the concave groove 37 is formed on the bottom surface of the insulating sheath. This is an example of a structure in which the claw portion 39 engages with the concave groove 37 after the terminal 5 is bent.

[0010]

However, according to the terminal structure of the first conventional example (FIG. 4), the lead terminal 5
When bending is performed, the elastic return of the metal occurs at the tip 9 of the lead terminal, and the tip floats away from the bottom surface of the exterior resin. For this reason, there has been a problem that the mounting on the substrate becomes unstable at the time of mounting soldering, and soldering failure is likely to occur.

Further, when the lead terminal tip 9 is pressed, a strong pressure is applied to the resin bottom surface to cause cracks 7 in the resin, thereby deteriorating reliability such as a decrease in physical strength and a deterioration in moisture resistance due to ingress of moisture. Had a point.

Next, according to the terminal structure of the second conventional example (FIG. 5), when the tip of the lead terminal is bent to the bottom surface of the insulating sheath, even if the tip of the lead terminal slightly returns, it is bent. Corner 2
5 can be kept at a right angle or an acute angle, and the problem of instability described above is improved, but there is still a problem that the crack 7 is easily formed on the resin bottom surface when the lead terminal tip 9 is pressed. .

Next, according to the terminal structure of the third conventional example (FIG. 6), the claw portion 39 at the tip of the lead terminal is replaced with the concave portion 3 on the bottom surface of the resin.
7, the tip of the lead terminal is fixed, and no floating due to elastic force occurs.
In order to firmly engage with the concave portion of the resin bottom surface, as in the conventional example of FIG. 4, it is necessary to strongly press the leading end of the lead terminal. Furthermore, there is a problem that high precision is required for resin sealing and bending of the lead terminal in order to satisfactorily engage the claw portion with the concave portion, and there is a problem that the processing is difficult.

The present invention has been made in view of the above circumstances, and prevents cracking of an insulating sheath due to pressure during bending of a lead terminal, and eliminates return due to the elasticity of the lead terminal. It is intended to provide a chip-type electronic component having a terminal structure for preventing a soldering failure due to unstable mounting of the electronic component at the time.

[0015]

In order to achieve the above-mentioned object, the present invention covers an element body to which a lead terminal is fixed with an insulating sheath, and a lead terminal derived from the insulating sheath is used as an insulating sheath. A chip-shaped electronic component bent along the side surface and bent at an acute angle along the bottom surface, wherein a rectangular or substantially trapezoidal convex portion is provided at a corner of a lead terminal-attached portion on the bottom surface of the insulating exterior body; An adjacent concave portion, and pressing and bending the leading end portion of the lead terminal so that a bending angle becomes an acute angle with the convex portion as a corner, so that the leading end of the lead terminal is located in a hollow space in the space of the concave portion. In addition, the present invention provides a chip-type electronic component characterized in that the lead terminal tip is bent while leaving a margin for bending.

[0016]

In the chip-type electronic component of the present invention, when the lead terminal is bent on the bottom surface of the insulating sheath, the lead terminal tip is pressed so as to be located in the space of the concave portion provided on the bottom surface. Therefore, a strong force is not directly applied to the bottom surface of the insulating sheath. Therefore, cracks are prevented from being formed on the bottom surface of the insulating sheath.

The lead terminal portion bent on the bottom surface of the insulating sheath is bent at an acute angle with a rectangular or substantially trapezoidal convex portion provided at a corner of the lead terminal attachment portion on the bottom surface.
Furthermore, since the lead terminal tip is bent while leaving a margin to be bent so that the lead terminal tip is located in the hollow in the space of the concave portion, the return due to the elasticity of the lead terminal does not pose a problem. The mounting stability is good. Therefore, defective soldering to the substrate is reduced.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a sectional view showing an embodiment of a chip type electronic component having a terminal structure according to the present invention, and FIG. 2 is a perspective view showing a state in which the electronic component of the embodiment is mounted on a substrate.

The chip-type electronic component 40 according to the present embodiment
The element body 3 to which the lead terminals 5 are fixed is covered with the insulating sheath 1, and the lead terminals 5 derived from the insulating sheath 1 are bent along the side surfaces of the insulating sheath 1 and at acute angles along the bottom surface. A chip-shaped electronic component, particularly a rectangular convex portion 45 having a height lower than the bottom surface of the insulating exterior body, at a corner of a lead terminal-attached portion on the bottom surface of the insulating exterior body 1, and adjacent to the convex portion 45; A concave portion 47 is provided, and the lead terminal tip 9 is pressed and bent so that the bent portion 49 becomes an acute angle with the convex portion 45 being a corner, and the lead terminal tip 9 is hollow in the space of the concave portion 47. The lead terminal tip 9 has a structure in which it is bent while leaving a margin to be bent.

Therefore, the lead terminal tip 9 still has a margin to be bent in the recessed space, and a strong force is not directly applied to the bottom surface of the exterior body, thereby preventing the occurrence of cracks.

In this embodiment, the element body 3 is a body such as an inductor or a capacitor, and the insulating sheath 1 is a thermosetting resin such as an alkyd resin or an epoxy resin. It is formed integrally with the element body 3 by molding. Further, the lead terminal 5 is a plate-like metal, for example, a good conductor such as copper is rolled into a thin plate and punched and molded with nickel solder as in the conventional example.

In the present embodiment, in the shape of the insulating sheath 1, the side surface portion 43 along the plate-like lead terminal 5 has a notch larger than the thickness of the lead terminal, and the lead terminal attached to the side surface portion is a chip. It is molded so as not to be out of shape. The height of the convex portion 45 at the bottom corner of the exterior body is
The lead terminal portion abutting on 5 is set so as to slightly come out of the mounting substrate side from the bottom surface of the exterior body, and can be securely bonded to the substrate with thin solder.

The space of the concave portion 47 has a sufficient volume to press the lead terminal tip 9 with a pressing force P at the time of bending.

Although the insulating sheath 1 in this embodiment is typically made of a synthetic resin, it is not limited to this as long as it is an insulator, and may be, for example, ceramic.

The shape of the convex portion 45 provided at the bottom corner of the insulating sheath is not limited to the rectangular shape as in the present embodiment, but is a substantially trapezoidal convex portion 61 as shown in FIG. You may.

[0027]

[Effect of the invention] In the chip type electronic component of the invention,
The configuration described above has the following effects.

(1) When bending the lead terminal on the bottom surface of the insulating sheath, the lead terminal tip is still bent so that the lead terminal tip is located in the hollow space in the recess provided on the bottom face. Since the pressing is performed while leaving a margin, there is an excellent effect that a force is not directly applied to the bottom surface of the insulating exterior body, and a crack can be prevented from entering the bottom surface of the exterior housing.

(2) Since the lead terminal portion bent on the bottom surface of the resin is sharply double-bent at an acute angle with the convex portion provided on the bottom surface, the return of the lead terminal due to the elasticity of the lead terminal is prevented. It has an excellent effect that it can be effectively prevented and the mounting on the mounting substrate does not become unstable, so that the defective soldering to the substrate is reduced.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of a chip-type electronic component according to the present invention.

FIG. 2 is a perspective view showing a state in which the chip-type electronic component of the embodiment is mounted on a substrate.

FIG. 3 is a partial cross-sectional view showing another embodiment of the protrusion provided on the bottom surface of the insulating sheath according to the present invention.

FIG. 4 is a sectional view showing a terminal structure of a conventional resin-molded chip-type electronic component.

FIG. 5 is a cross-sectional view showing a terminal structure of a conventional resin mold chip type electronic component.

FIG. 6 is a sectional view showing a terminal structure of a conventional resin-molded chip-type electronic component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulation exterior body 3 Element main body 5 Lead terminal 7 Crack 9 Lead terminal tip 10 Chip-type electronic component 20 Chip-type electronic component 25 Lead terminal bending angle 27 Depression of insulating insulation body bottom surface 29 Lead terminal tip 30 Chip-type electronic component 37 Depressed groove 39 Lead terminal claw part 40 Chip type electronic component 43 Lead terminal attached part on the side of the insulating outer body 45 Convex part 47 Concave part 49 Lead terminal bending angle 51 Solder land 53 Solder 55 Mounting board 61 Trapezoidal convex part P Pressing force

Continuation of the front page (72) Inventor Izumi Igawa 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Yuden Co., Ltd. (56) References JP-A-63-32901 (JP, A) JP-A-3-4505 ( JP, A) JP-A-62-213226 (JP, A) JP-A-62-134201 (JP, U) JP-A-62-163919 (JP, U) (58) Fields investigated (Int. Cl. ⁶ , (DB name) H01G 4/228-4/252 H01C 1/14 H01F 27/29

Claims (1)

(57) [Scope of request for utility model registration] 1. A chip in which an element body to which a lead terminal is fixed is covered with an insulating sheath, and a lead terminal derived from the insulating sheath is bent along a side surface of the insulating sheath and at an acute angle along a bottom surface. In the shaped electronic component, a rectangular or substantially trapezoidal convex portion at a corner of a lead terminal-attached portion on the bottom surface of the insulating exterior body, and a concave portion adjacent to the convex portion,
The tip of the lead terminal is bent by pressing the tip of the lead terminal so that the bending angle becomes an acute angle with the projection as a corner, and the tip of the lead terminal is positioned in the hollow space in the space of the recess. Characterized by being bent while leaving room for bending.