JP2010171054A - Wire wound electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vertical wire wound electronic component which has a superior mounting stability, the appearance of an electrode clearly recognized, and solder or the like for forming the electrode easily applied. <P>SOLUTION: External electrode parts 10a and 10b formed at a lower flange 4 include grooves 12a and 12b, first recesses 13a and 13b, second recesses 14a and 14b, and notches 15a and 15b. Then, the grooves 12a and 12b, the first recesses 13a and 13b, the second recesses 14a and 14b and the notches 15a and 15b are all connected, recessed and formed. Also, wall surfaces of the grooves 12a and 12b, the first recesses 13a and 13b, the second recesses 14a and 14b and the notches 15a and 15b are all formed in an inclined shape so as to form an obtuse angle with the bottom surfaces of the grooves 12a and 12b, the first recesses 13a and 13b, the second recesses 14a and 14b and the notches 15a and 15b. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a longitudinally wound wire-wound electronic component in which a conductor is wound around a core and mounted such that a winding direction of the conductor is perpendicular to a mounting substrate.

  2. Description of the Related Art Conventionally, various wound electronic components that are configured by winding a conductive wire around a core, such as an inductor, a transformer, and a choke coil used in various electronic devices, and generating a magnetic flux by energizing the conductive wire have been proposed.

  For example, a vertically wound type inductance element disclosed in Patent Document 1 includes flanges at the upper and lower ends of a core arranged perpendicular to the mounting board, and is cut out between the bottom surface of the flange facing the mounting board and a part of the side surface thereof. The part is formed. Then, a conductive paint is applied in the notch, and an electrode is formed to which the end portion of the conducting wire wound around the core is connected. Further, the notch is electrically connected to a predetermined position of the mounting board with solder or the like, and the inductance element is mounted on the mounting board.

  Further, the chip coil of Patent Document 2 has flanges formed at the upper and lower ends of the core around which the conductive wire is wound, and groove portions having a rectangular cross section are formed on the left and right sides of the mounting surface of the flange facing the mounting substrate. It is provided over the both ends of the width direction. Electrodes are formed by means such as screen printing over the bottom surface of the groove, the wall surface, the mounting surface of the flange outside the groove, and the outer peripheral surface of the flange adjacent to the mounting surface of the flange and perpendicular to the mounting surface of the flange. Furthermore, the terminal part of the conducting wire wound around the core is drawn into the groove part, and the terminal part of the conducting wire is electrically connected to the electrode of the groove part by means such as crimping, welding, or soldering.

Japanese Utility Model Publication No. 58-5320 (page 4, lines 2 to 10, FIG. 7 etc.) Japanese Patent Laid-Open No. 7-245227 (paragraph 0007, FIG. 1, etc.)

  In the technique of Patent Document 1, since a dedicated groove or hole for routing the terminal portion of the conductive wire wound around the core is not formed, the terminal portion of the conductive wire extends from the outer peripheral surface of the flange to the electrode of the notch portion. Directly routed. For this reason, a fillet electrode made of solder or the like for electrically connecting the electrode formed on the notch and the mounting substrate is attached to the lead wire routed from the outer peripheral surface of the flange to the electrode of the notch, and the fillet electrode is attached. It was difficult to form in a desired position and size. Therefore, the inductance element may not be accurately mounted on the mounting substrate, and mounting stability may be impaired.

  In addition, when the chip coil is recognized by a mounting machine camera or the like before being mounted on the mounting board, it is recognized based on the reflection of the metal of the electrode part. Since the terminal portion of the conductive wire directly routed is also recognized, it is difficult to clearly recognize the chip coil from the appearance of the electrode.

  Further, in the technique of Patent Document 2, electrodes are formed on the outer peripheral surface of the flange adjacent to the mounting surface of the flange outside the groove portion or the flange mounting surface by means such as screen printing. Thus, the external appearance of the electrode is not recognized sharply when it is recognized by, for example, and it is not easy to clearly recognize the shape and position of the electrode.

  Furthermore, in the techniques of Patent Documents 1 and 2, the wall surfaces of the notches and grooves are formed substantially perpendicular to the bottom so that the cross section is rectangular. Therefore, when the solder electrode is formed in the groove portion or the like by the solder dipping method, the heat-melted solder is difficult to be applied to the wall surface such as the groove portion or the corner portion formed by the wall surface and the bottom surface. For this reason, the end portion or flange of the lead wire drawn into the groove or the like is deeply immersed in the solder bath or immersed in the solder bath for a long time, and there is a possibility that heat is applied to the end portion of the flange or lead wire for a long time. It was. In addition, when the base electrode is formed on the external electrode portion by sputtering or the like, it is difficult to form the base electrode on the vertical wall surface under the same conditions as when the base electrode is formed on the bottom surface. It was necessary to change or form a new electrode on the wall surface by silver coating or the like, which was complicated.

  Therefore, an object of the present invention is to provide a longitudinally wound wire-wound electronic component that has good mounting stability, the external appearance of the electrode is clearly recognized, and solder or the like for forming the electrode is easily applied.

  In order to achieve the above-described object, in the wound electronic component according to the present invention, the external electrode portion is formed on the bottom surface of the lower flange, the groove portion for drawing the terminal portion of the conductor, and the bottom surface of the lower flange. A first concave portion and a second concave portion formed in a concave shape at the center side of the bottom surface of the lower flange and the outer side opposite to the groove portion, and a part of the second concave portion of the bottom surface of the lower flange To the outer peripheral surface of the lower flange, and the groove, the first recess, the second recess, and the notch are all connected to form one external electrode portion. (Claim 1).

  In addition, in the wound electronic component according to the present invention, the groove, the first recess, the second recess, and the wall surface of the notch are the bottom of the groove, the first recess, the second recess, and the notch. And an obtuse angle so as to form an obtuse angle (claim 2).

  According to the first aspect of the present invention, the groove, the first recess, the second recess, and the notch included in the external electrode portion are formed so as to be recessed from the bottom surface of the lower flange, so that the electrode finally filled in the recess The shape (linearity) of the boundary between the material and the bottom surface of the lower flange is sharply formed. Therefore, when the external electrode part is recognized by the mounting camera before mounting, the external shape and position of the external electrode part can be clearly recognized.

  In addition, since the groove portion, the first recess portion, the second recess portion, and the notch portion of the external electrode portion are all connected to form one external electrode portion, the groove portion, the first recess portion, the second recess portion, and the notch portion are electrically connected respectively. As a result, since electrical continuity is obtained from the terminal portion of the conducting wire drawn into the groove portion to the cutout portion, the terminal portion of the conducting wire may be directly routed from the outside of the external electrode portion to the cutout portion. Absent. Therefore, the terminal part of the conducting wire routed to the external electrode part is not recognized by the mounting machine camera, and the external appearance of the external electrode part with linearity can be clearly recognized. In addition, a fillet electrode for electrically connecting the notch portion of the external electrode portion and the mounting substrate can be formed at a desired position and a desired size of the mounting substrate, and the wound electronic component can be mounted on the mounting substrate. It can be mounted with high accuracy.

  According to the invention of claim 2, the wall surface of the groove portion, the first recess portion, the second recess portion, and the notch portion of the external electrode portion is inclined so as to form an obtuse angle with the bottom surface of the groove portion, the first recess portion, the second recess portion, and the notch portion. Therefore, when the external electrode part is formed by filling the groove, the first concave part, the second concave part, and the notch part with the solder by the solder dipping method, the wet-up of the heat-melted solder is good. Thus, the molten solder is easily applied to the bottom surface and the wall surface of the external electrode portion. Accordingly, it is not necessary to immerse the flange or the end portion of the conductive wire deeply in the solder bath or to immerse the terminal portion of the flange or the conductive wire for a long time, and it is possible to prevent the heat from being applied to the end portion of the flange or the conductive wire for a long time. Also, when the base electrode is formed by sputtering or the like, it is not necessary to form the base electrode again on the wall surface, and the external electrode portion can be easily formed.

It is a schematic block diagram of the winding type electronic component in embodiment of this invention. It is a schematic block diagram which shows the manufacturing process of the winding type | mold electronic component of FIG. FIG. 2 is a partial cross-sectional view of the wire wound electronic component of FIG. 1. It is a schematic block diagram which shows the manufacturing process of the winding type | mold electronic component of FIG.

  Embodiments corresponding to claims 1 and 2 will be described with reference to FIGS. 1, 2 and 4 are schematic configuration diagrams of a longitudinally wound wire-wound electronic component, and FIG. 3 is a partial sectional view of a lower flange. 1 to 4, the wound electronic component is shown upside down so that the bottom surface of the lower flange mounted on the mounting board faces upward.

1. Configuration of Wire Wound Electronic Component As shown in FIGS. 1 and 2, a chip inductor 1 that is a wire wound electronic component according to the present embodiment includes a core 2, an upper flange 3, a lower flange 4, and a winding portion 5. It has.

  The core 2 is made of ferrite and has a quadrangular prism shape as shown in FIG. Further, at the upper end and the lower end of the core 2, an upper flange 3 and a lower flange 4 having a substantially rectangular parallelepiped shape are integrally formed with the core 2 from ferrite. As shown in FIG. 1, the lower flange 4 includes a pair of external electrode portions 10 a and 10 b at different positions on the bottom end. Further, the conductor 2 made of a conductive material is wound around the core 2 to form a winding portion 5.

  As shown in FIG. 2, the external electrode portions 10a and 10b include groove portions 12a and 12b formed to be recessed from the bottom surface of the lower flange 4, first recess portions 13a and 13b, and second recess portions 14a and 14b. And notches 15a and 15b.

  The groove portions 12a and 12b are formed in a concave shape from one end to the other end of the bottom surface of the lower flange 4 so that the terminal portions 17a and 17b of the conducting wire 6 wound around the core 2 are drawn. Moreover, the 1st recessed parts 13a and 13b are formed in the position of the center side of the bottom face of the lower flange 4 adjacent to the groove parts 12a and 12b. In addition, second concave portions 14a and 14b are formed at positions outside the first concave portions 13a and 13b adjacent to the groove portions 12a and 12b. Further, notches 15 a and 15 b are formed from the second recesses 14 a and 14 b to the outer peripheral surface of the lower flange 4.

  FIG. 3 is a cross-sectional view in the direction perpendicular to the bottom surface of the lower flange 4 of the external electrode portions 10a and 10b. As shown in FIG. 3, the external electrode portions 10a and 10b are formed by connecting all the groove portions 12a and 12b, the first concave portions 13a and 13b, the second concave portions 14a and 14b, and the notches 15a and 15b. The wall surfaces of the groove portions 12a and 12b, the first recess portions 13a and 13b, the second recess portions 14a and 14b, and the cutout portions 15a and 15b are all groove portions 12a and 12b, the first recess portions 13a and 13b, the second recess portions 14a and 14b, It is formed in an inclined shape so as to form an obtuse angle with the bottom surfaces of the notches 15a and 15b. As an example, the inclination angle of the wall surface is formed between 30 ° and 60 °. In the figure, since the external electrode portion 10b is the same as the external electrode portion 10a, only the cross-sectional view of the external electrode portion 10a is shown, and the external electrode portion 10b is not shown.

  In addition, base electrodes 18a and 18b are formed on the bottom surfaces and wall surfaces of the grooves 12a and 12b, the first recesses 13a and 13b, the second recesses 14a and 14b, and the notches 15a and 15b.

  And the terminal parts 17a and 17b of the conducting wire 6 wound around the core 2 are drawn into the groove parts 12a and 12b, and the groove parts 12a and 12b, the first recessed parts 13a and 13b, the second recessed parts 14a and 14b, and the notched parts 15a and 15b. Is filled with solder 20 to form external electrode portions 10a and 10b. And the notch 15a, 15b of the end surface of the outer peripheral surface of the lower flange 4 becomes a structure electrically mounted by soldering etc. to the predetermined position of a mounting board.

  As an example, the bottom surfaces of the first recesses 13a and 13b and the bottom surfaces of the second recesses 14a and 14b are formed at the same height, and the bottom surface of the lower flange 4 and the first recesses 13a and 13b, the second recesses 14a, The difference in the height of the bottom of 14b is about 30 μm. The difference in height between the bottom surfaces of the groove portions 12a and 12b and the bottom portions of the first concave portions 13a and 13b and the second concave portions 14a and 14b is formed to be about 50 μm. Moreover, the thickness of the conducting wire 6 is about 30 to 50 μm, and in some cases, the conducting wire 6 having a thickness of 30 to 350 μm may be used. In addition, if the edge parts 17a and 17b of the conducting wire 6 drawn into the groove parts 12a and 12b do not protrude from the bottom surface of the lower flange 4, the groove parts 12a and 12b, the first recessed parts 13a and 13b, and the second recessed parts 14a and 14b. The height of the notches 15a and 15b may be formed in any manner.

2. Manufacturing Method Next, a manufacturing method of the chip inductor 1 will be described below.

  First, the core 2, the upper flange 3, and the lower flange 4 are formed. A mold having a recess processed into an outer shape in which the core 2, the upper flange 3, and the lower flange 4 are integrated is prepared. This mold has a desired shape as described above with respect to the grooves 12a and 12b, the first recesses 13a and 13b, the second recesses 14a and 14b, and the notches 15a and 15b. Then, ferrite powder is filled in the concave portion of the mold, and the ferrite powder is compressed to form the core 2, the upper flange 3, and the lower flange 4 as shown in FIG. The core 2 may not be a quadrangular prism as shown in FIG. Further, the core 2, the upper flange 3, and the lower flange 4 are not limited to ferrite and may be formed of other materials.

  Next, as shown in FIG. 3, on the bottom surfaces and wall surfaces of the grooves 12a and 12b, the first recesses 13a and 13b, the second recesses 14a and 14b, and the notches 15a and 15b formed on the bottom surface of the lower flange 4, Base electrodes 18a and 18b are formed by sputtering. At this time, the wall surfaces of the grooves 12a and 12b, the first recesses 13a and 13b, the second recesses 14a and 14b, and the notches 15a and 15b are the grooves 12a and 12b, the first recesses 13a and 13b, the second recesses 14a and 14b, Since it is formed so as to form an obtuse angle with the bottom surface of the notches 15a and 15b, the bottom surfaces and wall surfaces of the grooves 12a and 12b, the first recesses 13a and 13b, the second recesses 14a and 14b, and the notches 15a and 15b. Further, the base electrode is formed by simultaneously performing sputtering in the direction perpendicular to the bottom surface of the lower flange 4 from the upper side to the lower side in FIG. The base electrode is not limited to the sputtering method, and may be formed by other methods.

  Then, as shown in FIG. 4, the conducting wire 6 is wound around the core 2. The conductor 6 has a diameter of about 50 μm as an example, and is wound in a plurality of layers while reciprocating between the lower flange 4 side and the upper flange 3 side of the core 2.

  Moreover, the terminal parts 17a and 17b of the conducting wire 6 are drawn into the groove parts 12a and 12b of the lower flange 4, respectively.

  Thereafter, the solder 20 is filled into the grooves 12a and 12b, the first recesses 13a and 13b, the second recesses 14a and 14b, and the cutouts 15a and 15b formed by being recessed from the bottom surface of the lower flange 4 by a solder dipping method. The lower flange 4 is immersed in a heat-melted solder bath and the end portions 17a and 17b and the groove portions 12a and 12b of the lead wire 6 drawn into the groove 12a, the first recesses 13a and 13b, the second recesses 14a and 14b, the notches The base electrodes 18a and 18b formed in the portions 15a and 15b are immersed in the molten solder. And the film of the terminal parts 17a and 17b of the conducting wire 6 is peeled off by heat, and the solder adheres to the terminal parts 17a and 17b of the conducting wire 6 and the base electrodes 18a and 18b.

  Then, after pulling up the lower flange 4 from the solder tank, the molten solder is cooled and solidified, and external electrode portions 10a and 10b as shown in FIG. 1 are formed. The external electrode portions 10a and 10b are not limited to the solder dipping method described above, and may be formed by other methods. Moreover, you may form not only with a solder but with another electroconductive material.

  As described above, according to the present embodiment, the grooves 12a and 12b, the first recesses 13a and 13b, the second recesses 14a and 14b, and the notches 15a and 15b included in the external electrode portions 10a and 10b are formed on the bottom surface of the lower flange 4. Therefore, the shape (linearity) of the boundary between the solder 20 filled in the recess and the bottom surface of the lower flange 4 is sharply formed (see FIG. 1). Therefore, when the external electrode units 10a and 10b are recognized by the mounting camera before mounting, the external shape and position of the external electrode units 10a and 10b can be clearly recognized.

  Further, since the grooves 12a and 12b, the first recesses 13a and 13b, the second recesses 14a and 14b, and the notches 15a and 15b of the external electrode portions 10a and 10b are all connected to each other, the grooves 12a and 12b, the first The recesses 13a and 13b, the second recesses 14a and 14b, and the notches 15a and 15b are electrically connected to each other. Therefore, since electrical conduction is made from the terminal portions 17a, 17b of the conducting wire 6 drawn into the grooves 12a, 12b to the cutout portions 15a, 15b, the terminal portions 17a, 17b of the conducting wire 6 are outside the external electrode portions 10a, 10b. Is not routed directly from the first to the notches 15a and 15b. Therefore, the terminal portions 17a and 17b of the lead wire 6 routed around the external electrode portions 10a and 10b are not recognized by the mounting machine camera, and the linear appearance of the external electrode portions 10a and 10b is clearly recognized. be able to. Further, the fillet electrode for electrically connecting the cutout portions 15a and 15b of the external electrode portions 10a and 10b and the mounting substrate can be formed at a desired position and a desired size of the mounting substrate, and the chip inductor 1 can be mounted on the mounting substrate with high accuracy.

  Furthermore, the wall surfaces of the groove portions 12a and 12b, the first recess portions 13a and 13b, the second recess portions 14a and 14b, and the cutout portions 15a and 15b of the external electrode portions 10a and 10b are the groove portions 12a and 12b, the first recess portions 13a and 13b, 2 Since the recesses 14a and 14b and the notches 15a and 15b are formed so as to form an obtuse angle with the bottom surface, the grooves 12a and 12b, the first recesses 13a and 13b, and the second recesses 14a and 14b are formed by solder dipping. When the external electrode portions 10a and 10b are formed by filling the notches 15a and 15b with the solder, the hot melted solder is better wetted and the bottom surface and the wall surface of the external electrode portions 10a and 10b are melted solder. Is easily applied. Therefore, the end portions 17a and 17b of the lower flange 4 and the conductor 6 need not be deeply immersed in the solder bath, or do not have to be immersed for a long time, and heat is applied to the ends 17a and 17b of the lower flange 4 and the conductor 6 for a long time. It is possible to prevent this. Also, when the base electrodes 18a and 18b are formed by sputtering or the like, it is not necessary to form the base electrodes 18a and 18b again on the wall surface, and the external electrode portions 10a and 10b can be easily formed.

  Note that the present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention.

  For example, in the above-described embodiment, the external electrode portions 10 a and 10 b are formed on the lower flange 4, but may be formed not only on the lower flange 4 but also on the upper flange 3.

  Further, the height of the bottom surface and the inclination angle of the wall surface of the grooves 12a and 12b, the first recesses 13a and 13b, the second recesses 14a and 14b, and the cutouts 15a and 15b may be appropriately changed according to the diameter of the conductor 6 and the like. Good.

1 Chip inductor (winding type electronic component)
2 Core 3 Upper flange 4 Lower flange 6 Conductor 10a, 10b External electrode portion 12a, 12b Groove portion 13a, 13b First recess portion 14a, 14b Second recess portion 15a, 15b Notch portion 17a, 17b Terminal portion 20 Solder

Claims (2)

A core around which a conducting wire is wound, an upper flange and a lower flange formed at the upper end and lower end of the core, and both end portions of the conducting wire formed at different positions on the bottom end of the lower flange are connected to each other. A longitudinally wound wire-wound electronic component in which the external electrode portions are mounted by being connected to a mounting substrate.
The external electrode portion is
Formed on the bottom surface of the lower flange, and a groove portion for drawing a terminal portion of the conductor;
A first concave portion and a second concave portion formed in a concave shape at the center side of the bottom surface of the lower flange and on the outer side opposite to the groove portion on the bottom surface of the lower flange;
A notch formed from a part of the second recess on the bottom surface of the lower flange to the outer peripheral surface of the lower flange,
The wound electronic component, wherein the groove, the first recess, the second recess, and the notch are all connected to form one external electrode portion.   Wall surfaces of the groove portion, the first recess portion, the second recess portion, and the notch portion are formed to be inclined so as to form an obtuse angle with the bottom surface of the groove portion, the first recess portion, the second recess portion, and the notch portion. The wound electronic component according to claim 1, wherein:

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