GB2571791B - Heat-sink formulation and method of manufacture thereof - Google Patents

Heat-sink formulation and method of manufacture thereof Download PDF

Info

Publication number
GB2571791B
GB2571791B GB1803856.2A GB201803856A GB2571791B GB 2571791 B GB2571791 B GB 2571791B GB 201803856 A GB201803856 A GB 201803856A GB 2571791 B GB2571791 B GB 2571791B
Authority
GB
United Kingdom
Prior art keywords
sink
formulation
manufacture
heat
sink formulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB1803856.2A
Other versions
GB2571791A (en
GB201803856D0 (en
Inventor
Juliussen Gaute
Broughton Simon
Smith Michael
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Graphitene Ltd
Original Assignee
Graphitene Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Graphitene Ltd filed Critical Graphitene Ltd
Priority to GB1803856.2A priority Critical patent/GB2571791B/en
Publication of GB201803856D0 publication Critical patent/GB201803856D0/en
Priority to PCT/EP2019/055917 priority patent/WO2019170894A1/en
Publication of GB2571791A publication Critical patent/GB2571791A/en
Application granted granted Critical
Publication of GB2571791B publication Critical patent/GB2571791B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/02—Organic and inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/042—Graphene or derivatives, e.g. graphene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
GB1803856.2A 2018-03-09 2018-03-09 Heat-sink formulation and method of manufacture thereof Active GB2571791B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB1803856.2A GB2571791B (en) 2018-03-09 2018-03-09 Heat-sink formulation and method of manufacture thereof
PCT/EP2019/055917 WO2019170894A1 (en) 2018-03-09 2019-03-08 Heat-sink formulation and method of manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1803856.2A GB2571791B (en) 2018-03-09 2018-03-09 Heat-sink formulation and method of manufacture thereof

Publications (3)

Publication Number Publication Date
GB201803856D0 GB201803856D0 (en) 2018-04-25
GB2571791A GB2571791A (en) 2019-09-11
GB2571791B true GB2571791B (en) 2022-07-13

Family

ID=61972945

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1803856.2A Active GB2571791B (en) 2018-03-09 2018-03-09 Heat-sink formulation and method of manufacture thereof

Country Status (2)

Country Link
GB (1) GB2571791B (en)
WO (1) WO2019170894A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112164682A (en) * 2020-08-24 2021-01-01 杰群电子科技（东莞）有限公司 Bare chip packaging structure with graphene layer on back surface

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130299140A1 (en) * 2012-05-10 2013-11-14 National Tsing Hua University Insulated thermal interface material
WO2016007287A1 (en) * 2014-07-11 2016-01-14 Henkel IP & Holding GmbH Thermal interface material with mixed aspect ratio particle dispersions
WO2017012116A1 (en) * 2015-07-23 2017-01-26 Dow Global Technologies Llc Thermally conductive particles formed by spray-drying process
US20170315596A1 (en) * 2016-04-28 2017-11-02 Dell Products, Lp Graphene Based Conformal Heat Sink and Method Therefor

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7871533B1 (en) * 2006-01-12 2011-01-18 South Dakota School Of Mines And Technology Carbon nanoparticle-containing nanofluid
US20160276056A1 (en) * 2013-06-28 2016-09-22 Graphene 3D Lab Inc. Dispersions for nanoplatelets of graphene-like materials and methods for preparing and using same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130299140A1 (en) * 2012-05-10 2013-11-14 National Tsing Hua University Insulated thermal interface material
WO2016007287A1 (en) * 2014-07-11 2016-01-14 Henkel IP & Holding GmbH Thermal interface material with mixed aspect ratio particle dispersions
WO2017012116A1 (en) * 2015-07-23 2017-01-26 Dow Global Technologies Llc Thermally conductive particles formed by spray-drying process
US20170315596A1 (en) * 2016-04-28 2017-11-02 Dell Products, Lp Graphene Based Conformal Heat Sink and Method Therefor

Also Published As

Publication number Publication date
GB2571791A (en) 2019-09-11
GB201803856D0 (en) 2018-04-25
WO2019170894A1 (en) 2019-09-12

Similar Documents

Publication Publication Date Title
EP3345215A4 (en) Semiconductor apparatus and method of manufacturing the same
SG11202002947TA (en) Substituted pyrrolopyrimidine jak inhibitors and methods of making and using the same
EP3558475A4 (en) Seated treadmill and method of use
EP3749343A4 (en) Formulation and method of use
EP3600716A4 (en) X-joints and methods of manufacture
EP3416665A4 (en) Formulation and method of use
GB201709213D0 (en) Opoelectronic device and method of manufacturing thereof
SG11202103709VA (en) Semiconductor structure and method of forming the same
SG11202009315WA (en) Formulation and method of preparation
GB2589747B (en) Photodetector and method of manufacture thereof
EP3349592A4 (en) Animal chew formulation and method of making the same
GB201717885D0 (en) Prothesis and method of manufacture
EP3426621A4 (en) Ceramic additive formulation and method of making
EP3416536A4 (en) Winguide and method of using same
IL276053A (en) Therapeutic-gard and method of use thereof
GB2571791B (en) Heat-sink formulation and method of manufacture thereof
IL283703A (en) Polymorphic form of meisoindigo and modified formulation of meisoindigo
EP3340929A4 (en) Implant device and method of making the same
SG11202002351SA (en) Poloxamer compositions and methods of making and using same
EP3706507A4 (en) Heater and method of manufacturing same
EP3645000A4 (en) Method of treatment and dosage forms thereof
GB201810923D0 (en) Compositions and method of treatment
KR102245308B9 (en) Clinker composition and manufacturing method of the same
EP3639369A4 (en) Circuit and method of forming the same
GB201617161D0 (en) Insect repelient composition and method of use