GB2435719A - Gripping device with a multitude of small fibres using van der Waals forces - Google Patents

Gripping device with a multitude of small fibres using van der Waals forces Download PDF

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Publication number
GB2435719A
GB2435719A GB0604274A GB0604274A GB2435719A GB 2435719 A GB2435719 A GB 2435719A GB 0604274 A GB0604274 A GB 0604274A GB 0604274 A GB0604274 A GB 0604274A GB 2435719 A GB2435719 A GB 2435719A
Authority
GB
United Kingdom
Prior art keywords
chucking
fibres
previous
chucking device
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0604274A
Other versions
GB0604274D0 (en
Inventor
Darrell Lee Mann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAROTEC CO. LTD.,
SM-TECH
Original Assignee
BAROTEC CO Ltd
Sm Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BAROTEC CO Ltd, Sm Tech filed Critical BAROTEC CO Ltd
Priority to GB0604274A priority Critical patent/GB2435719A/en
Publication of GB0604274D0 publication Critical patent/GB0604274D0/en
Priority to KR1020070021088A priority patent/KR20070090839A/en
Publication of GB2435719A publication Critical patent/GB2435719A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A device comprises at least one structural substrate 3 with a multitude of small scale fibres 2 protruding from the said substrate 3 which are profiled and arranged such that a van der Waals' interaction force is created to grip an object 1. The substrate 3 may be made of flexible material which allows deformation to assists in the removal of the gripping device from the said object 1. The surface of the fibres 2 may have different roughness, porosity, perforations, depressions, grooves or projections. Pores may be arranged in different directions. The fibres 2 may have rigid and flexible portions and their cross-sectional profile may vary along the length of the fibre. The orientation and distribution of the fibres 2 may vary across the surface of the said substrate 3. The fibres 2 may be hydrophobic and self-cleaning. The device may be used to assist in the accurate location, securing and transport of glass sheets or semiconductor wafers and similar materials during manufacturing operations.

Description

<p>CHUCK</p>
<p>Description</p>
<p>FIELD OF THE iNVENTION AND RELATED ART</p>
<p>The present invention relates to chucking device used for holding and transporting, for example, a semiconductor silicon wafer, liquid crystal display panel or other articles under processing in the manufactunng process of electronic devices by means of van der Waals interaction forces.</p>
<p>It is a remarkable trend in recent years in the manufacturing process, in particular, of electronic devices such as semiconductor devices based on silicon wafers, liquid crystal display panels and the like that various processing steps such as etching, ion-implantation and the like are conducted under dry conditions since high productivity by automatization can be obtained by these dry processes easily as compared with traditional wet processes.</p>
<p>One of the remarkable characteristics in these dry processes is that the treatment of the articles is performed in an atmosphere of high vacuum. Further, devices having a larger and larger size and finer and finer patterning with high precision for an increased density of circuit integration are required in the modem electronic industry.</p>
<p>Needless to say, the material under processing, e.g., semiconductor silicon wafers, glass substrate plates and the like, in such a processing treatment must be held or transported by some chucking means. One of the conventional chucking devices used for such a purpose is a vacuum chuck using a chucking plate having perforations and connected to an evacuation means so as to attract the work piece by the sucking action. In principle, such a vacuum chuck cannot be used in a vacuum atmosphere because of the absence of any pressure difference between the surfaces of the work piece. Even as a chucking means used under normal pressure, vacuum chucks have a problem that the attractive force by suction is localized on and around the perforations in the chucking plate so that a local strain is caused in the work piece under working chucked thereby resulting in a decreased accuracy of alignment of the work piece ibr processing. Acconiingly, vacuum chucks are considered not to be suitable for use in the manufacturing process of electronic devices due to this serious problem.</p>
<p>In place of the above mentioned vacuum chucks, electrostatic chucks, in which the work piece is held to the chucking plate by means of the electrostatic attractive force, have been known in the art for some time. Electrostatic chucks have been developed in order to overcome many of the problems of vacuum methods. They do, however, create a number of new problems. Amongst these problems are issues relating to non- homogeneity of loads, insufficient load generating capability, long chucking and de-chucking times, charge management issues and, in many applications, very high capital cost.</p>
<p>It is the aim of this invention to help resolve these and other problems as may appear in</p>
<p>the prior art devices.</p>
<p>SUMMARY OF THE INVENTION</p>
<p>The proposed invention resolves the above stated problems due in the main to the replacement of artificially generated electrostatic charges with the naturally occurring van der Waals forces known to be present in certain configurations of material surface finish.</p>
<p>While these van der Waals forces have been known about for some time, it has only been the recent study of the extraordinaiy gripping capabilities of the gecko by engineers and biologists that practical applications of the forces have become a practically realizable option. The gecko is able to walk suspended upside-down on even the smoothest of surfaces due to the shape and texture of the small-scale fibres present on their feet pads.</p>
<p>Gripping forces in the region of several hundred grams per square centimeter are known to be possible -a figure that is considerably greater than is possible in even the most advanced electrostatic chuck. Further, the gecko is able to rapidly engage and dis-engage the gripping forces in order to achieve locomotion across a surface. Such a capability is also of relevance with respect to the need in manufacturing for rapid chucking and de-chucking of materials.</p>
<p>Clearly, however, the gecko is a living system, whereas a manufacturing chucking operation requires a capability that is inorganic and capable of enduring the ngours of activity in a high-speed, high temperature manufacturing operation. To this end, the invention presented here builds on pioneering rk to create practical engineering facsimiles of the design solution evolved by the gecko.</p>
<p>Thus, starting from the basic premise of employing van der Waals interaction forces in an appropriately formed material surface to achieve a basic chucking force, the invention presented here presents a number of ancillary features and benefits that have also been incorporated into the design. These and the main inventive steps are described in more detail in the next sections.</p>
<p>BRIEF DESCRIPTION OF THE DRAWINGS</p>
<p>FIG. 1 is an overall drawing of a typical prior art LCD manufacture machine employing an electrostatic chuck.</p>
<p>FIG. 2 shows a pair of microscope close-up images of gecko feet.</p>
<p>FIG. 3 shows a pair of man-made equivalents of the gecko foot.</p>
<p>FIG. 4 is a schematic view of a typical arrangement of fibres attached to a substrate and gripping' a piece ofsheet material.</p>
<p>FIG. 5 is a schematic view of surface profile achieving the Lotus Effect.</p>
<p>DESCRIPTION OF THE PREFERRED EMBODIMENTS</p>
<p>Hereinafter, the embodiments of the present invention will be described with reference to the drawings.</p>
<p>Next, desirable embodiments of the present invention will be described. In the following description, the general principles of construction are illustrated by specific examples.</p>
<p>These specific examples should not be interpreted as limiting to the Claims attached to</p>
<p>this disclosure.</p>
<p>Figure 1 illustrates a typical machine tool used in the manufacture of LCD and similar products. In this device the chucking of sheet materials is performed using an electrostatic chuck (ESC). The top-plate of the electrostatic chuck (labeled ESC' in the Figure) has the most difficult duty as it has to carry the weight of a sheet of glass or equivalent material that, due to the forces of gravity, is inclined to drop in a downward direction. In order to satisfactonly grip such matenals, the ESC has to generate an upward lbrce greater than or equal to the gravitational forces acting on the sheet material being gripped.</p>
<p>Figure 2 illustrates a pair of close-up views of the foot pads of the gecko. This figure shows the natural evolution solution to the gripping force problem. The shape, size and relative position of the fibres on the gecko's foot obtain grip forces through the creation and appropriate orientation of van der Waals forces.</p>
<p>Figure 3 illustrates tw man-made surfaces known to be capable of achieving a grip force approaching that of the gecko. These pictures come from the research being undertaken at the University of Manchester and at the Nanorobotics Laboratory at Carnegie-Mellon University. The invention described here may utilize the profiles shown in these figures, but it is certainly not limited to these geometries, as other configurations -as described in the Claims -are known to produce the desired van der Waals interaction forces required in the chucking operation.</p>
<p>Figure 4 shows a schematic arrangement of the fibres (2) attached into a substrate (3) and gripping onto a sheet-like material (1). Various configurations and arrangements of these fibres are envisaged -they may, for example, be evenly dispersed over the total surface area of a component or sheet to be lifted, or they may be grouped into clusters.</p>
<p>This figure shows a static arrangement wherein the van der Waals interaction forces generated around the fibres are being utilized to achieve a gripping force onto the sheet material (3). At certain points during a chucking/de-chucking operation, it becomes necessaiy to reduce or eliminate the gripping fbrce. The invention envisages a number of means of achieving this force-switching capability. In the simplest arrangement, it is envisaged that the substrate will be deformable in such a way that the substrate and attached fibres may be physically rolled-up'. Such a mechanical means may operate at a macro or micro-level. The important factor in either case is to mimick the mechanisms employed in the gecko, wherein physical deformation create shear forces that act to remove the van der Waals interaction forces. In other applications, it is envisaged that local electrical or electrostatic forces may be applied to interrupt the van der Waals forces.</p>
<p>Figure 5 illustrates a material surface known to exhibit the Lotus Effect. Also known in the prior art, this local surface finish is capable of delivenng self-cleaning capabilities to any surface onto which it is applied. It is envisaged that in order to achieve the desired long life of the substrate and fibre chucking method, it will be beneficial to incorporate some means of self-cleaning capability. The essence of the Lotus Effect is to achieve a surface with low surface energy. The Lotus plant achieves this using small-scale surface profiling. In other practical applications, the same low surface-energy capability may be achieved using materials (such as Teflon) which naturally exhibit such properties.</p>
<p>The actual construction material for the fibres and substrate is not particularly important to the successful operation of the chuck. It is known, however, that the longer term presence of moisture and moisture vapour can have an adverse impact on the achievable gripping force when fibres are made from materials that absorb moisture. In the preferred embodiments, therefore, the fibres will be formed from a non-absorbing material such as silicon rubber. The fibres may also be coated with a moisture-impermeable barrier. They may also be constructed from a naturally hydrophobic material or have a hydrophobic coating applied. The substrate onto which the fibres are attached, or from which they are formed, may also feature a Lotus Effect surface profile. Likewise it is also preferably hydrophobic and non-absorbing.</p>

Claims (1)

  1. <p>Claims This list of claims is intended to be provisional only. Formal
    claims will be submitted in due course according to the rules and regulations governing the submission of patent app! ications.</p>
    <p>What is provisionally claimed is: I. A chucking arid dc-chucking device for use during manufacture operations involving the location, secunng and transport of objects comprising: a) At least one structural substrate, and b) A multitude of small-scale fibres prutruding from said structural substrate and profiled and arranged in such a way as to produce a van der Waals interaction force hamessable in a manner that forms a gripping force on the object to be lifted.</p>
    <p>2. A chucking and de-chuckmg device as described in Claim I, wherein the structural substrate is flexible, and where the deformation of the surface can be used to alter the van der Waals interaction forces in order to achieve application and removal of the chucking force.</p>
    <p>3. A chucking and de-chucking device as described in Claims I and 2, wherein the surface and structure of fibre members may be bricated with different roughness.</p>
    <p>4. A chucking and dc-chucking device as described in previous Claims, wherein the surface and structure of fibre members may be fabricated with different porosity and size of pores.</p>
    <p>5. A chucking and dc-chucking device as described in previous Claims, wherein the surface and structure of fibre members may be fabricated with different directions of pore channels pores on micro- level and on macrn-level - 6. A chucking and dc-chucking device as described in previous Claims, wherein the surface and structure of fibre members may include surface perforations, depressions, grooves, outstanding fibres, etc 7. A chucking and dc-chucking device as described in previous Claims, wherein the surface and structure of one or more of the fibre members may be adapted to form at least one capillaiy channel to form a wick structure.</p>
    <p>8. A chucking and dc-chucking device as described in previous Claims, wherein the surface and structure of the fibres must be adapted to move relative to the substrate, and where the fibres need not be completely flexible, and may comprise both rigid and flexible portions.</p>
    <p>9. A chucking and de-chucking device as described in previous Claims, wherein the surface and structure of the fibres may be oriented at a range of different angles to the substrate.</p>
    <p>10. A chucking and de-chucking device as described in previous Claims, wherein the distribution of fibres may be uneven II. A chucking and de-chucking device as described in previous Claims, wherein the fibres may be bundled.</p>
    <p>12. A chucking and de-chucking device as described in previous Claims, wherein the orientation of adjacent fibres is altered by mechanical means in order to vary the level and direction of the van der Waa!s forces.</p>
    <p>13. A chucking and de-chucking device as described in previous Claims, wherein the orientation of adjacent fibres is altered by an electrical or other field means in order to vary the level and direction of the van der Waals forces.</p>
    <p>14. A chucking and de-chucking device as described in previous Claims, wherein the surface finish of fibres is such that they exhibit characteristics of the so-called Lotus Effect, wherein they achieve self-cleaning properties.</p>
    <p>15. A chucking and de-chucking device as described in previous Claims, wherein at least one of the fibres is twisted about its longitudinal axis.</p>
    <p>16. A chucking and de-chucking device as described in previous Claims, wherein the fibres have at least one direction of curvature 17. A chucking and de-chucking device as described in previous Claims, wherein the fibres are manufactured using an auxetic (Negative Poisson's Ratio) material.</p>
    <p>18. A chucking and de-chucking device as described in previous Claims, wherein the fibres have a non-constant cross-sectional profile at different heights.</p>
    <p>19. A chucking and de-chucking device as described in previous Claims, wherein the fibres are made from a hydrophobic, non-moisture absorbing material.</p>
    <p>20. A chucking and de-chucking device as described by the drawings in this disclosure.</p>
GB0604274A 2006-03-03 2006-03-03 Gripping device with a multitude of small fibres using van der Waals forces Withdrawn GB2435719A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB0604274A GB2435719A (en) 2006-03-03 2006-03-03 Gripping device with a multitude of small fibres using van der Waals forces
KR1020070021088A KR20070090839A (en) 2006-03-03 2007-03-02 Chuck

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0604274A GB2435719A (en) 2006-03-03 2006-03-03 Gripping device with a multitude of small fibres using van der Waals forces

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GB0604274D0 GB0604274D0 (en) 2006-04-12
GB2435719A true GB2435719A (en) 2007-09-05

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Cited By (7)

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Publication number Priority date Publication date Assignee Title
DE102013105803A1 (en) * 2013-06-05 2014-08-07 Cascade Microtech, Inc. Carrier for supporting semiconductor substrate, used for chuck in prober for testing test substrate, has control device which reduces adhesion of micro-structured surface formed in support surface for supporting substrate
US20150174768A1 (en) * 2013-12-23 2015-06-25 Lam Research Corporation Microstructures for improved wafer handling
DE202016100186U1 (en) 2015-01-15 2016-02-01 Fhr Anlagenbau Gmbh substrate holder
EP3288866A4 (en) * 2015-04-26 2018-04-18 Frumkin, Ted Greg Lee Gecko carrier
WO2018082792A1 (en) * 2016-11-07 2018-05-11 Applied Materials, Inc. Carrier for holding a substrate, use of the carrier in a processing system, processing system employing the carrier, and method for controlling a temperature of a substrate
WO2019096426A1 (en) * 2017-11-20 2019-05-23 Applied Materials, Inc. Substrate process arrangement and method for holding a substrate
US10499704B2 (en) 2013-09-18 2019-12-10 Nike, Inc. Sole for an article of footwear having regionally varied Auxetic structures

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KR100864732B1 (en) * 2007-03-21 2008-10-23 (주)바로텍 chuck using nano-scale cilium, fabricating method and chucking/de-chucking method for the same
KR100859765B1 (en) * 2007-08-23 2008-09-24 엔티엠 주식회사 Apparatus for processing substrate of flat panel display
KR100914529B1 (en) * 2007-09-28 2009-09-02 세메스 주식회사 Apparatus for chucking substrate
KR20110091197A (en) * 2010-02-05 2011-08-11 서울대학교산학협력단 Upward-type fabrication method of structure using adhesion system with fine ciliary and fabrication apparatus using the same
WO2016154052A1 (en) 2015-03-25 2016-09-29 Applied Materials, Inc. Chamber components for epitaxial growth apparatus
JP6851382B2 (en) 2016-01-13 2021-03-31 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ A holding configuration for holding the board, a carrier for supporting the board, a vacuum processing system, a method for holding the board, and a method for releasing the board.
CN107790721B (en) * 2017-10-24 2019-07-12 西北有色金属研究院 A kind of preparation process of 316L stainless steel fibre sintering felt
KR102150279B1 (en) * 2020-02-10 2020-09-01 건호이엔씨(주) jig for coupling flanges of pipes

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WO2003097702A2 (en) * 2002-01-02 2003-11-27 Lewis & Clark College Adhesive microstructure and method of forming same
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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013105803A1 (en) * 2013-06-05 2014-08-07 Cascade Microtech, Inc. Carrier for supporting semiconductor substrate, used for chuck in prober for testing test substrate, has control device which reduces adhesion of micro-structured surface formed in support surface for supporting substrate
US10499704B2 (en) 2013-09-18 2019-12-10 Nike, Inc. Sole for an article of footwear having regionally varied Auxetic structures
US20150174768A1 (en) * 2013-12-23 2015-06-25 Lam Research Corporation Microstructures for improved wafer handling
US9698035B2 (en) * 2013-12-23 2017-07-04 Lam Research Corporation Microstructures for improved wafer handling
DE202016100186U1 (en) 2015-01-15 2016-02-01 Fhr Anlagenbau Gmbh substrate holder
EP3288866A4 (en) * 2015-04-26 2018-04-18 Frumkin, Ted Greg Lee Gecko carrier
WO2018082792A1 (en) * 2016-11-07 2018-05-11 Applied Materials, Inc. Carrier for holding a substrate, use of the carrier in a processing system, processing system employing the carrier, and method for controlling a temperature of a substrate
CN108292619A (en) * 2016-11-07 2018-07-17 应用材料公司 The method of processing system for keeping the use in the processing system of the carrier of substrate, carrier, application vector and the temperature for control base board
TWI686495B (en) * 2016-11-07 2020-03-01 美商應用材料股份有限公司 Carrier for holding a substrate, use of the carrier in a processing system, processing system employing the carrier, and method for controlling a temperature of a substrate
CN108292619B (en) * 2016-11-07 2023-02-24 应用材料公司 Carrier for holding a substrate, use of a carrier in a processing system, processing system applying a carrier, and method for controlling the temperature of a substrate
WO2019096426A1 (en) * 2017-11-20 2019-05-23 Applied Materials, Inc. Substrate process arrangement and method for holding a substrate

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