DE102019218953A1 - Electronic circuit unit - Google Patents

Abstract

A connection arrangement (2) for making electrical contact between an inverter and an intermediate circuit capacitor is proposed. The connection arrangement (2) comprises a carrier substrate (5) and a pair of busbars (15, 25), with at least one first conductor surface (10) and two second conductor surfaces (20) electrically insulated from the first conductor surface (10) on the carrier substrate (5). are formed, the two second conductor surfaces (20) being formed next to one another in a first direction (R1) on the carrier substrate (5), a web region (11) of the first conductor surface (10) extending in a second direction (R2) between the two second conductor areas (20) extending through it, the second direction (R2) being arranged perpendicular to the first direction (R1), a connecting area (12) of the first conductor area (10) being attached to the web area (11) of the first conductor area (10) adjoins, the connecting area (12) having a connecting width (v) in the first direction (R1) and the web area (11) having a web width (s) in the first direction (R1), the connecting width (v) being greater a Is the web width (s), the pair of busbars (15, 25) comprising a first busbar (15) with a first connection area (16) and a second busbar (25) with a second connection area (26), the first connection area ( 16) of the first busbar (15) extends plane-parallel to the first conductor surface (10) in the first direction (R1) and the first connection area (16) extends along the first direction (R1) at the connection area (12) with the first conductor surface (10) ) is electrically conductively connected, the second connection area (26) of the second busbar (25) extending in the first direction (R1) plane-parallel to the second conductor surfaces (20) and the second connection area (26) along the first direction (R1) is electrically conductively connected at the second connection area (26) to the second conductor surfaces (20), a recess (29) being formed in the second busbar (25) in the area of the web area (11) so that the second St romschiene (25) is spaced apart from the web area (11) in this area and is therefore electrically insulated.

Description

State of the art

The invention relates to an electronic circuit unit, in particular a circuit unit which serves as an inverter for an electrical machine or as a converter, with the features of the preamble of independent claim 1.

In hybrid vehicles or electric vehicles, inverter structures and converter structures with commutation circuits made up of intermediate circuit capacitors and half bridges, which are embodied in power modules, for example, are used. For example, inverters are used to operate an electrical machine, which provide phase currents for the electrical machine. The inverters and converters include, for example, power modules and at least one intermediate circuit capacitor that briefly provides the electrical energy. The power modules can include, for example, a carrier substrate with conductor tracks on which, for example, power semiconductors are arranged, which together with the carrier substrate form an electronic assembly. It is known that connection contacts of the intermediate circuit capacitor are connected to the power modules in an electrically conductive manner. For this purpose, contact elements led out of the power module, which make electrical contact with the electronic assembly, are connected to the connection contacts of the intermediate circuit capacitor, which are designed, for example, as busbars.

The US 2007 0109715 A1 shows such an intermediate circuit capacitor, which is connected to power modules in an electrically conductive manner.

Due to the high electrical currents, the current-carrying elements through which the electrical and / or electronic components are connected to one another must have correspondingly low electrical resistances and thus have large cross-sections. Due to the repeated occurrence of switching processes, frequency-dependent high power losses occur due to alternating currents. It is known that flat and parallel current conduction and the magnetic interaction between current levels caused by the opposite current direction result in a significant reduction in the inductance resulting from the switching processes and thus significantly reduced power losses. In such arrangements, current is conducted via busbars which, for example, originate from the intermediate circuit capacitor and which are also called busbars. For example, two busbars with opposite current directions, a forward conductor and a return conductor, are routed directly one above the other and parallel to one another at a small distance.

In the case of connections between different electrical and / or electronic components, such as the connection between power modules and intermediate circuit capacitor, this parallel and superimposed guidance of the busbars in the area in which the connection is made is interrupted to establish a secure and secure connection. This interruption of the superimposed guidance of the busbars leads to increased inductances and associated increased losses in the arrangement in the area of the connection of the electrical and / or electronic components.

Disclosure of the invention

According to the invention, a connection arrangement for making electrical contact between an inverter and an intermediate circuit capacitor is proposed. The connection arrangement comprises a carrier substrate and a pair of busbars, with at least one first conductor surface and two second conductor surfaces electrically insulated from the first conductor surface being formed on the carrier substrate, the two second conductor surfaces being formed next to one another in a first direction on the carrier substrate, with a web area of the first conductor surface extends in a second direction between the two second conductor surfaces, the second direction being arranged perpendicular to the first direction, a connection region of the first conductor surface adjoining the web region of the first conductor surface, the connection region having a connection width in the first direction and the web region has a web width in the first direction, the connection width being greater than the web width, the pair of busbars having a first busbar with a first connection area and a second busbar ne with a second connection area, wherein the first connection area of the first busbar extends plane-parallel to the first conductor surface in the first direction and the first connection area is electrically conductively connected to the connection area with the first conductor surface along the first direction, the second connection area being connected of the second busbar extends plane-parallel to the second conductor surfaces in the first direction and the second connection area is connected in an electrically conductive manner along the first direction at the second connection area to the second conductor areas, a recess being formed in the second busbar in the area of the web area, so that the second busbar in this area is spaced apart from the web area and is therefore electrically insulated.

Advantages of the invention

Compared to the prior art, the connection arrangement according to the invention has an advantageously low inductance. The busbars can also be arranged flat one above the other at a small distance in the area in which they are connected to the carrier substrate. The decrease in the line cross-section of the busbars towards the carrier substrate is advantageously minimized and has to be reduced comparatively little in the connection arrangement with the features of the independent claim, whereby a particularly low-resistance connection of the busbars to the carrier substrate can be ensured. In the connection arrangement, the current-carrying areas of the two busbars also lie closely above one another in the area in which the busbars run towards the carrier substrate, as a result of which these areas are designed to be particularly low-inductive. The first conductor surface is also covered by the second busbar. The total inductance of the connection arrangement is thus advantageously reduced.

The connection arrangement according to the invention can moreover be manufactured advantageously well and simply and is particularly insensitive to tolerances.

Further advantageous refinements and developments of the inventions are made possible by the features specified in the subclaims.

According to an advantageous embodiment, it is provided that the two second conductor areas extend in the first direction over a width, the width being essentially equal to the connection width of the connection area of the first conductor area. Areas formed in this way on the carrier substrate can be contacted by busbars, which are formed with essentially the same width, over a similarly wide area along the first direction with the conductor areas. In this way, an advantageously low-inductance connection arrangement is produced.

According to an advantageous embodiment, it is provided that the web width is less than 30%, preferably less than 20%, particularly preferably less than 10% of the connection width. Thus, the two second conductor surfaces can advantageously be arranged close to one another despite the web region of the first conductor surface between the second conductor surfaces. The recess in the second busbar, which bridges the first conductor surface, can thus advantageously be made small. Thus, the area in which the second busbar is in electrical contact with the second conductor surfaces along the first direction is particularly large and is only interrupted by a comparative recess in the second busbar, which bridges the web area of the first conductor surface.

According to an advantageous embodiment, it is provided that the web area of the first conductor area is T-shaped together with the connection area of the first conductor area. This results in a narrow web area of the first conductor area compared to the connection area. The busbars can thus be connected to the conductor surfaces in an electrically conductive manner over an advantageously wide area along the first direction.

According to an advantageous embodiment, it is provided that the first connection area of the first busbar is arranged between the connection area of the first conductor surface and the second busbar. The second busbar thus covers the first busbar up to its end at the first connection area, where the current from the first busbar is then conducted into the first conductor surface. The connection area of the first conductor surface is also covered by the second busbar.

According to an advantageous embodiment, it is provided that the first busbar is stepped with a first intermediate area angled from the first connection area and a first base area angled from the first intermediate area and / or the second busbar is stepped with a second intermediate area angled from the second connection area and a from the second intermediate region angled second base region is formed. Due to the stepped guidance of the busbars, the busbars can advantageously be guided easily and easily from the top of the substrate, on which the first conductor surface and the second conductor surface are arranged, to the conductor surfaces. The connection regions of the busbars can be arranged plane-parallel to the carrier substrate while the base regions can be spaced from the carrier substrate in a third direction perpendicular to the carrier substrate, although they are plane-parallel to the carrier substrate.

According to an advantageous embodiment, it is provided that the first base region and the second base region are arranged plane-parallel to one another and / or the first intermediate region and the second intermediate region are arranged plane-parallel to one another. This ensures that the current in the two busbars is conducted largely parallel to one another. Thus becomes a advantageously achieved low inductance in the connection arrangement.

According to an advantageous embodiment it is provided that between the first busbar and the second busbar, in particular between the first base area of the first busbar and the second base area of the second busbar, an electrically insulating insulation element is arranged, which electrically isolates the first busbar from the second busbar.

Furthermore, according to the invention, an electronic circuit unit, in particular a circuit unit which serves as an inverter for an electrical machine or as a converter, comprising a contacting arrangement according to the invention is proposed. Thus, the electronic circuit unit can advantageously be designed to be particularly low-inductive if the connection arrangement is used, for example, in the intermediate circuit of the inverter, in order to connect the power electronics unit to the intermediate circuit capacitor.

According to an advantageous embodiment, it is provided that at least one electronics unit, in particular a power electronics unit, is formed on the carrier substrate, the electronic circuit unit further comprising at least one electrical or electronic component, the first busbar for making electrical contact with the electronic component and the second busbar for electrical contacting of the electronic component are formed.

Figure list

• 1 eine Darstellung eines Ausführungsbeispiels eines Trägersubstrats,
• 2 eine Darstellung des Trägersubstrats aus 1 einer ersten Stromschiene,
• 3 eine Darstellung eines Ausführungsbeispiels der Verbindungsanordnung mit dem Trägersubstrat und der ersten Stromschiene aus 2 und einer zweiten Stromschiene,
• 4 eine Seitenansicht des Ausführungsbeispiels der Verbindungsanordnung aus 3.

An embodiment of the invention is shown in the drawing and is explained in more detail in the following description. Show it

• 1 a representation of an embodiment of a carrier substrate,
• 2 a representation of the carrier substrate 1 a first busbar,
• 3rd a representation of an embodiment of the connection arrangement with the carrier substrate and the first busbar from 2 and a second busbar,
• 4th a side view of the embodiment of the connection arrangement from 3rd .

Embodiments of the invention

The connection arrangement according to the invention 2 can be used in an electronic circuit unit, for example for inverters or converters in automotive engineering. For example, the electronic circuit unit 1 as an inverter, which is also referred to as an inverter, can be used to operate an electrical machine, for example in hybrid or electric vehicles.

The circuit unit includes 1 an electronics unit, in particular a power electronics unit, which is the carrier substrate 5 includes. On a substrate top side of the carrier substrate 5 Various electrical and / or electronic components not shown in the figures, such as power semiconductors such as field effect transistors such as MIS-FETs (Metal Insulated Semiconductor Field Effect Transistor), IGBTs (insulated-gate bipolar transistor), power MOSFETs (metal oxide semiconductor field- effect transistor) and / or diodes, for example rectifier diodes, be arranged. It can, for example, be power semiconductors without a housing (bare die). Furthermore, passive components such as resistors or capacitors can also be used as electrical and / or electronic components on the carrier substrate 5 be arranged. The carrier substrate 5 can form an electronics unit, in particular a power electronics unit, in particular a circuit unit, with the electrical and / or electronic components arranged on the carrier substrate.

The electronic circuit unit also includes 1 furthermore an electrical and / or electronic component 8th that is outside the carrier substrate 5 is arranged. In which electrical and / or electronic component 8th it can be a capacitor, for example. For example, it can be a power capacitor, which is used, for example, as an intermediate circuit capacitor of the electronic circuit unit 1 serves. Such a capacitor can also comprise several capacitor elements which are electrically conductively connected to one another and which form individual capacitances for themselves, and for example also the electrically conductive connecting elements required for the electrically conductive connection of these capacitor elements. Different capacitor technologies such as, for example, film capacitors, such as stack or round-wound capacitors, or other suitable capacitor technologies can be used as the capacitor or as the capacitor elements. The power rails 15th , 25th can, for example, the busbars 15th , 25th an electrical and / or electronic component 8th , for example of the intermediate circuit capacitor. The power rails 15th , 25th can be made in one piece and differ from the electrical and / or electronic component 8th starting in one piece up to the carrier substrate 5 extend. The power rails 15th , 25th but can also be designed in several parts, the individual parts together being one of the electrical and / or electronic component 8th outgoing power rail 15th , 25th form. In particular, the first busbar can be used 15th one-piece and the second busbar 15th be made in two parts.

In the circuit unit 1 can the busbars 15th , 25th of the electrical and / or electronic component 8th through the connection arrangement 2 with the power electronics unit on the carrier substrate 5 electrically contacted.

The connection arrangement 2 comprises a carrier substrate 5 with conductor surfaces 10 , 20th and a pair of busbars 15th , 25th , the one with the conductor surfaces 10 , 20th of the carrier substrate 5 is electrically connected. Here is the first busbar 15th with a first conductor surface 10 electrically connected. A second power rail 25th is with two second conductor surfaces 20th electrically connected. The following is an exemplary embodiment of the connection arrangement 2 based on 1 to 4th described.

1 shows only the carrier substrate 5 . The carrier substrate 5 may comprise multiple layers of electrically conductive materials such as metals and / or diaelectric materials. With the carrier substrate 5 it is, for example, a circuit carrier, in this exemplary embodiment a DBC (Direct Bonded Copper) substrate. The carrier substrate 5 but can also be, for example, an AMB (Active Metal Brazed) substrate, an IMS (Insulated Metal Substrate), a printed circuit board (PCB) or another substrate suitable for power modules.

The carrier substrate 5 furthermore comprises conductor tracks and / or conductor surfaces. The electrical and / or electronic components can be arranged with one another or with further electrical and / or electronic elements arranged outside the electronics unit, for example via the conductor tracks and / or conductor surfaces of the carrier substrate 5 , be connected in an electrically conductive manner via bonding wires or other suitable electrically conductive contact elements, for example by soldering or sintering. As in this exemplary embodiment, the conductor tracks can be used as conductor surfaces 10 , 20th be trained. The first ladder surface 10 has for example one of the second conductor surfaces 20th opposite polarity, which is denoted by T-, the polarity of the second conductor surfaces 20th is denoted by T +. The second conductor surfaces 20th have the same polarity T +. Only the part of the carrier substrate is shown in the pictures 5 that is used to connect the busbars 15th , 25th is provided, shown. The first ladder surface 10 is used as a connection point for electrical connection with the first busbar 15th provided and represents only one end of a larger conductor surface or conductor track on the carrier substrate 5 The second conductor surface 20th is used as a connection point for electrical connection with the second busbar 25th provided and represents only one end of a larger conductor surface or conductor track on the carrier substrate 5 represent.

The carrier substrate 5 of the electronics unit can for example be arranged on a top side of a heat sink, not shown in the figures, and can for example be soldered onto the top side of the heat sink. The carrier substrate 5 can lie directly on the heat sink or with a thermal conductive layer in between. The heat sink is used to dissipate in the electronics unit 4th generated heat and is characterized by high thermal conductivity. The heat sink is made of a material with good thermal conductivity such as aluminum or copper. The heat sink can be made of copper, for example, and designed as a plate. Structures to improve heat dissipation, such as ribs, pins or channels, for example, can also be formed on the heat sink. The carrier substrate 5 the electronics unit can, for example, also rest directly on the top of the heat sink and, for example, through one of the carrier substrate 5 comprised electrically insulating layer to be isolated from the heat sink.

The ladder surfaces 10 , 20th are on the substrate surface of the carrier substrate 5 educated. The first ladder surface 10 is from the second conductor area 20th electrically isolated. The arrangement of the conductor surfaces with respect to one another is described using directions. There is a first direction R1 and a second direction R2 parallel to the carrier substrate 5 , being the second direction R2 perpendicular to the first direction R1 runs. A third direction R3 runs perpendicular to the first direction R1 and perpendicular to the second direction R2 and thus perpendicular to the carrier substrate 5 . The two second conductor surfaces 20th are in the first direction R1 side by side on the carrier substrate 5 arranged. The two second conductor surfaces 20th are through a gap on the carrier substrate 5 spaced from each other. A dock area 11 the first conductor surface 10 is in the space between the two second conductor surfaces 20th arranged. The bridge area 11 the conductor surface 10 runs in the second direction R2 between the two second conductor surfaces 20th through and then widens on both sides to a connecting area 12th the first conductor surface 10 . Thus forms the web area 11 along with the connection area 12th a T shape.

In the first direction R1 shows the bridge area 11 a web width s. The connection area 12th points in the first direction R1 a connection width v. The two second conductor surfaces 20th extend together in the first direction R1 across a width b. In this exemplary embodiment, the connection width v is greater than the web width s. The web width s can, for example, be less than 30%, preferably less than 20% or particularly preferably less than 10% of the connection width v. As in this exemplary embodiment, the connection width v can, for example, essentially correspond to the width b. Thus, the connection area extends 12th the first conductor surface 10 in the first direction R1 up to the outer edges of the two second conductor surfaces.

The first ladder surface 10 and the second conductor surfaces 20th are with respect to one through the web area 11 the first conductor surface 10 extending and perpendicular to the carrier substrate 5 extending plane E formed symmetrically.

The following is the connection of the pair of busbars 15th , 25th to the carrier substrate 5 described. Under a power rail 15th , 25th In the context of the present application, an electrically conductive flat conductor, for example an electrically conductive strip or an electrically conductive strip, is understood. A power rail 15th , 25th can thus be a busbar, for example. The power rails 15th , 25th can be bent or curved, for example, or also run in a curve or step-like manner.

2 shows the carrier substrate 5 out 1 together with the first busbar 15th . The first power rail 15th has a connection area 16 , an intermediate area 17th and a base area 18th on. The first power rail 15th is stepped, with the intermediate area 17th from the base area 18th is angled and the connection area 16 again from the intermediate area 17th is angled. The connection area 16 is parallel to the carrier substrate 5 arranged and extends parallel to the connection area 12th the first conductor surface in the first direction R1 . Along the first direction R1 is the connection area 16 the first busbar 15th with the connection area 12th the first conductor surface 10 electrically connected, for example welded. The connection between the connection area 16 and the connection area 12th the first conductor surface 10 extends in the first direction R1 . The first power rail 15th can for example have incisions so that the first busbar 15th divided into several parallel tabs.

3rd shows the carrier substrate 5 out 1 and 2 together with the first busbar 15th and the second busbar 15th . The second busbar 25th has a second connection area 26th , a second intermediate area 27 and a second base area 28 on. The second busbar 25th is stepped, with the intermediate area 27 from the second base area 28 is angled and the connection area 26th again from the intermediate area 27 is angled.

The connection area 26th is parallel to the carrier substrate 5 arranged and extends parallel to the two second conductor surfaces 20th in the first direction R1 . Along the first direction R1 is the connection area 26th the first busbar 25th with the two second conductor surfaces 20th electrically connected, for example welded. The electrical connection between the second connection area 26th and the two second conductor surfaces 20th extends in the first direction R1 and is through the bridge area 11 the first conductor surface 10 interrupted the two second conductor surfaces 20th separates from each other. In the area where the bridge area 11 the first conductor surface 10 the two second conductor surfaces 20th separates from each other is in the second busbar 25th a recess 29 formed through which the second busbar 25th in the area of the land area 11 the first conductor surface 10 is spaced apart and thus electrically isolated from this.

The first power rail 15th and the second busbar 25th are related to through the web area 11 the first conductor surface 10 extending and perpendicular to the carrier substrate 5 arranged plane E formed symmetrically.

As in 4th shown is the first connection area 16 the first busbar 15th between the carrier substrate 5 and the second busbar 25th arranged. The second busbar 25th overlaps the first busbar 15th . The second busbar 25th is in the first direction R1 above the first power rail 15th and the connection area 12th arranged and covers this at least partially. The power rails 15th , 25th run at least partially parallel to one another. For example, the first is the base area 18th the first busbar 15th plane-parallel to the base area 28 the second busbar 25th guided. The base areas 18th , 28 the busbars 15th , 25th are for example only through the interposition of an insulation element 40 , such as an insulation film, separated from each other. The isolation element 40 between the busbars 15th , 25th The two busbars are used for this purpose 15th , 25th electrically isolate from each other.

Of course, further exemplary embodiments and mixed forms of the exemplary embodiments shown are also possible.

QUOTES INCLUDED IN THE DESCRIPTION

This list of the documents listed by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Patent literature cited

• US 20070109715 A1 [0003]

Claims (10)

Connection arrangement (2) for making electrical contact between an inverter and an intermediate circuit capacitor, comprising a carrier substrate (5) and a pair of busbars (15, 25), with at least one first conductor surface (10) and two of the first conductor surface (10) on the carrier substrate (5) ) electrically insulated second conductor surfaces (20) are formed, wherein the two second conductor surfaces (20) are formed next to one another in a first direction (R1) on the carrier substrate (5), a web region (11) of the first conductor surface (10) extending in a second direction (R2) between the two second conductor surfaces (20) extends through it, wherein the second direction (R2) is arranged perpendicular to the first direction (R1), wherein a connection area (12) of the first conductor area (10) adjoins the web area (11) of the first conductor area (10), the connection area (12) having a connection width (v) in the first direction (R1) and the web area (11 ) has a web width (s) in the first direction (R1), the connection width (v) being greater than the web width (s), wherein the pair of busbars (15, 25) comprises a first busbar (15) with a first connection area (16) and a second busbar (25) with a second connection area (26), wherein the first connection area (16) of the first busbar (15) extends plane-parallel to the first conductor surface (10) in the first direction (R1) and the first connection area (16) extends along the first direction (R1) at the connection area (12) is electrically conductively connected to the first conductor surface (10), wherein the second connection area (26) of the second busbar (25) extends plane-parallel to the second conductor surfaces (20) in the first direction (R1) and the second connection area (26) extends along the first direction (R1) at the second connection area (26) ) is connected to the second conductor surfaces (20) in an electrically conductive manner, wherein a recess (29) is formed in the second busbar (25) in the area of the web area (11), so that the second busbar (25) in this area is spaced from the web area (11) and is thus electrically insulated. Connection arrangement according to Claim 1 , characterized in that the two second conductor surfaces (20) extend in the first direction (R1) over a width (b), the width (b) being essentially equal to the connection width (v) of the connection region (12) of the first conductor surface (10) is. Contact arrangement according to one of the preceding claims, characterized in that the web width (s) is less than 30%, preferably less than 20%, particularly preferably less than 10% of the connection width (v). Connecting arrangement according to one of the preceding claims, characterized in that the web region (11) of the first conductor surface (10) is T-shaped together with the connecting region (12) of the first conductor surface (10). Connection arrangement according to one of the preceding claims, characterized in that the first connection area (16) of the first busbar (15) is arranged between the connection area (12) of the first conductor surface (10) and the second busbar (25). Connecting arrangement according to one of the preceding claims, characterized in that the first busbar (15) is step-shaped with a first intermediate area (17) angled from the first connection area (16) and a first base area (18) angled from the first intermediate area (17) and / or the second busbar (25) is step-shaped with a second intermediate area (27) angled from the second connection area (26) and a second base area (28) angled from the second intermediate area (27). Connection arrangement according to Claim 6 , characterized in that the first base region (18) and the second base region (28) are arranged plane-parallel to one another and / or the first intermediate region (17) and the second intermediate region (27) are arranged plane-parallel to one another. Connecting arrangement according to one of the preceding claims, characterized in that between the first busbar (15) and the second busbar (25), in particular between the first base area (18) of the first busbar (15) and the second base area (28) of the second busbar (25) an electrically insulating insulation element (40) is arranged, which electrically isolates the first busbar (15) from the second busbar (25). Electronic circuit unit (1), in particular a circuit unit which serves as an inverter for an electrical machine or as a converter, comprising a contact-making arrangement according to one of the preceding claims. Electronic circuit unit according to Claim 9 , characterized in that at least one electronics unit (4), in particular a power electronics unit, is formed on the carrier substrate (5), the electronic circuit unit (1) further comprising at least one electrical or electronic component (8), the first busbar (15) for making electrical contact with the electronic component (8) and the second busbar (25) for making electrical contact with the electronic component (8).

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