DE102013013147B4 - SENSOR ARRANGEMENT, METHOD FOR MANUFACTURING A SENSOR ARRANGEMENT, AND USE OF A SENSOR FILM IN SUCH A SENSOR ARRANGEMENT - Google Patents

Abstract

Sensor arrangement (34) with a base structure (10), a sensor foil (18) and an electrical connector (24) for connecting the sensor foil (18) to a voltage source and/or an electric circuit, wherein the sensor foil (18) and the electrical connector ( 24) are arranged on opposite sides (28, 30) of the base structure (10), the sensor film (18) having at least one contact element (38) and the electrical connector (24) having a contacting arrangement (32) with at least one contact surface (50) for having separable electrical contacting of the contact element (38), wherein the contacting arrangement (32) is fixed in an insertion opening (14) of the base structure (10).

Description

The invention relates to a sensor arrangement, a method for producing a sensor arrangement and the use of a sensor film in such a sensor arrangement.

Sensor arrangements that are provided for detecting physical parameters, for example on surfaces of components, often have sensor foils that cling flatly to the surface of the component to be measured and detect the desired parameters. In order to be able to forward the recorded data, it is necessary to communicate with the measuring area or areas of the sensor foil, for example via an electrical connection. This usually requires bringing the electrical connection into physical contact with the sensor foil.

The sensor foil is then attached to the surface of the component, while the electronic processing of the recorded parameters preferably takes place opposite this surface on the inside of the component. For this reason, it is advantageous if the electronic connection to the sensor film is routed through a feedthrough on the opposite side of the surface of the component.

Out DE 100 34 692 A1 a keyboard with keys is known. A contact element is provided on the underside of the key, which touches a mating contact when the top side is pressed. The keyboard is routed through an opening in a housing and connected to a circuit board by means of a connector.

DE 199 23 087 A1 discloses a pressure, acoustic and vibration sensor assembly. A sensor foil is placed inside a wing to be measured and electrically connected to an amplifier board.

In WO 2012/125919 A1 describes a laminated sensor arrangement with a sensor film, in which a plug is provided for connecting the sensor film.

U.S. 7,127,948 B2 shows a sensor array mounted on an aircraft wing and connected to an electrical connector.

U.S.A. 4,727,751 also shows a wing-mounted sensor arrangement whose leads are routed through openings in the wing.

U.S. 7,302,866 B1 discloses a sensor arrangement with a sensor film on an aircraft wing. The sensor foil has contact surfaces for contacting a connector.

8th and 9 show a common method for attaching such a sensor film to the surface of a component, as is currently carried out.

In 8th a base structure 10, for example a portion of a component 12 of, for example, an aircraft (not shown) is shown. The base structure 10 has an insertion opening 14 whose length I corresponds to the length of a broad side 16 of a sensor film 18 .

The sensor foil 18 has a measuring area 20 and a connecting cable 22 attached to the sensor foil 18 in order to connect the sensor foil 18 to an electrical connector 24 , for example a plug 26 . The connection cable 22 is permanently connected to the sensor film 18, that is, if the connection cable 22 is removed from the sensor film 18, the connection between the sensor film 18 and the electrical connector 24 is finally destroyed.

In order to attach the sensor foil 18 to a surface 28 of the base structure 10 in such a way that the sensor foil 18 and the electrical connector 24 are on opposite sides of the base structure 10, as in FIG 9 shown, the sensor film 18 is pushed from a rear side 30 of the base structure 10 through the insertion opening 14 so that the connection cable 22 protrudes through the insertion opening 14 from the surface 28 to the rear side 30 . Then the sensor foil 18 is attached to the surface 28 of the base structure 10 .

If the sensor foil 18 or the measuring area 20 on the sensor foil 18 is damaged during use and it is therefore necessary to replace the sensor foil 18, the connection to the electrical connector 24 will be destroyed if the sensor foil 18 is not simply torn off. Therefore, in order to replace the sensor sheet 18, it is preferred that the entire assembly of sensor sheet 18, connecting cable 22 and electrical connector 24 remain accessible so that all components can be removed and replaced with a new assembly.

It is therefore the object of the invention to propose an improved sensor arrangement which is more robust and easier to repair or assemble than previous solutions.

This object is achieved with a sensor arrangement having the features of claim 1.

A method for producing such a sensor arrangement and the use of a sensor film in such a sensor arrangement are the subject matter of the independent claims.

Advantageous configurations of the invention are the subject matter of the dependent claims.

A sensor arrangement has a base structure, a sensor foil and an electrical connector for connecting the sensor foil to a voltage source and/or an electrical circuit. The sensor film and the electrical connector are arranged on opposite sides of the base structure, the sensor film having at least one contact element and the electrical connector having a contacting arrangement with at least one contact surface for detachable electrical contacting of the contact element. The contact arrangement is fixed in an insertion opening in the base structure.

In comparison to the known sensor arrangement, in which the connecting cable is firmly connected to the sensor foil, the sensor foil and connecting cable are no longer directly connected to one another, but the electrical connector has a contacting arrangement with which a contact element attached to the sensor foil can be contacted. in such a way that the contacting arrangement and the contact element can be separated from one another without being destroyed. In this way, the electrical connector can be arranged on a rear side of the base structure, while the sensor foil is on the surface. The electrical connector can be fully integrated into the base structure and no longer needs to be touched when replacing the sensor foil; it is sufficient to simply separate the sensor foil from the contacting arrangement and bring a new sensor foil into contact with this contacting arrangement.

The sensor film is preferably designed for removable attachment to a surface of the base structure, the sensor film having a measuring area for detecting physical parameters on the surface of the base structure and at least one conductive contact plate designed as a thin film as a contact element.

In order to be able to replace the sensor film after it has been damaged, it is advantageous if it is designed in such a way that it can be easily removed from the surface again, for example if it is glued to it. In order to be able to detect parameters on the surface of the base structure, it is advantageous if the sensor film has a corresponding measuring range. This measurement area can be formed, for example, by an array of small sensor plates that have been applied to the sensor film using MEMS technology, for example. In order to be able to retain the properties of the sensor foil with regard to, for example, the ability to conform to the surface, it is advantageous if the contact element is formed as a thin contact plate, for example as a thin-layer film, which has also been applied using MEMS technology, for example. It is preferred if the measuring area, for example the sensor array, and the contact plate or a plurality of contact plates are arranged on opposite sides of the sensor film, so that the measuring area is advantageously exposed to an outside of the surface of the base structure, while the contact plate is advantageously in Contact can be brought to the contact surface of the contacting arrangement.

The base structure can be formed, for example, by a component of an aircraft, for example a wing, in particular a CFRP wing of an aircraft.

It is also preferred if the dimensions of the contact surface on the contacting arrangement correspond to the dimensions of the contact element on the sensor film, in order to advantageously produce reliable contact between the sensor film and the electrical connector.

The contact plate and/or the contact surface preferably has an adhesion promoter. In this way, the contact between the contact pad and the contact surface can preferably be further improved via the adhesion promoter. For example, only the contact plate has the adhesion promoter, because then an advantageous new layer of the adhesion promoter is advantageously available on the contact plate of the new sensor film after replacing or removing the old sensor film in order to establish contact between the contact plate and the contact surface. Alternatively or additionally, however, the contact surface can also have the adhesion promoter.

In one embodiment, the adhesion promoter is formed from conductive silver, which is applied to the contact pad and/or contact surface using a mask, for example. The mask advantageously prevents conductive silver from reaching undesired areas of the sensor film or contacting arrangement, in particular by virtue of the fact that the mask has cutouts of the same shape and size as the contact plates or contact surface.

Alternatively, an adhesion promoter that can be activated by increasing the temperature can be used, which is applied to the contact plate or the contact surface and is advantageously activated by increasing the temperature after the contact plate and contact surface have been placed one on top of the other, in order to establish contact between the contact plate and contact surface. An advantageous adhesion promoter that can be activated by increasing the temperature is, for example, soldering material, that is available at low cost. The application of such an activatable adhesion promoter can also be advantageously supported by using a mask. Either the layer of the adhesion promoter can be produced directly in the desired shape and dimensions by using the mask, for example by the mask having gaps in the form of contact plates or contact surface and the conductive silver is only brought to the contact plate or contact surface through these gaps, or it a layer of soldering material can preferably be vapour-deposited in the area of the contact plate or the contact surface and then removed by an advantageous lithographic process with a lithographic mask in the areas in which the adhesion promoter should not be present.

The sensor film preferably has first position markings and/or positioning openings for inserting positioning bolts, the contacting arrangement having second position markings and/or positioning bolts for positioning the sensor film on the base structure in a predetermined position.

The provision of position markings both on the sensor film and on the contacting arrangement is preferred if the sensor film is designed to be transparent. In the event that the sensor film is opaque, it is advantageous if, instead of position markings, which are then difficult to see, positioning openings are provided in the sensor film and positioning bolts on the contacting arrangement.

These elements advantageously make it easier to attach the sensor film in a correct position over the contacting arrangement, so that the small contact plates and the contact surface advantageously come into complete contact with one another.

The contacting arrangement preferably has a base body which is formed from a non-conductive material and is firmly fastened in an insertion opening in the base structure.

In this way, the contacting arrangement is advantageously fastened precisely in the insertion opening that has been used in the prior art for pushing through the sensor film. The contacting arrangement is preferably fixed and non-detachable in this insertion opening, so that the contacting arrangement with the electrical connector attached to it can be accommodated in a stationary manner in the base structure and advantageously no longer has to be influenced when replacing the sensor film. In addition, the insertion opening is advantageously completely covered by the contacting arrangement and the sensor arrangement is thus preferably more robust.

PLA (polylactic acid, polylactide, polylactic acids) or PAEK (polyaryl ether ketone) is particularly preferably used as the non-conductive material for the contacting arrangement. If the base body, on which the contact surface is preferably arranged, is formed from non-conductive material, it is advantageously possible to prevent faulty contacts from occurring, which would result in faulty signal transmission.

In an advantageous embodiment, the base body is designed to form the contact surface with at least one drilled hole into which a conductive channel is introduced. The end of this conductive channel directed towards the sensor film then advantageously forms the contact surface for bringing into contact with the contact plate of the sensor film. By providing a drilled hole, such a locally limited contact area can advantageously be easily produced in a base body made of non-conductive material.

In a particularly preferred embodiment, the conductive channel is formed from copper wire, because copper wire preferably has particularly good conductivity. The copper wire or any other conductive channel can advantageously be glued into the drilled hole with epoxy adhesive, for example, or alternatively screwed into the drilled hole. This is preferably done from above, that is to say from the side which is oriented towards the sensor foil in use.

In a particularly preferred embodiment, the conductive channel is introduced into the base body in such a way that it terminates flush with the surface of the base body to form the contact surface on the surface of the base body to be directed towards the contact plates during use.

This can be achieved, for example, in that the conductive channel is preferably smoothed after it has been introduced into the borehole, so that it ends flush with the surface of the base body, for example by using a milling cutter.

1. a) Bereitstellen einer Basisstruktur mit wenigstens einer Einbringöffnung;
2. b) Bereitstellen einer Kontaktieranordnung mit wenigstens einer Kontaktfläche;
3. c) Bereitstellen eines elektrischen Verbinders mit einer Verlängerungseinrichtung;
4. d) Verbinden der Kontaktieranordnung mit der Verlängerungseinrichtung;
5. e) Befestigen der Kontaktieranordnung in der Einbringöffnung der Basisstruktur;
6. f) Bereitstellen einer Sensorfolie mit wenigstens einem Messbereich und wenigstens einem Kontaktplättchen;
7. g) Befestigen der Sensorfolie an der Basisstruktur derart, dass das Kontaktplättchen und die Kontaktfläche sich berührend übereinander angeordnet sind.

A method for producing a sensor arrangement for detecting physical parameters on the surface of a base structure has the following steps:

1. a) providing a base structure with at least one insertion opening;
2. b) providing a contacting arrangement with at least one contact surface;
3. c) providing an electrical connector with an extension device;
4. d) connecting the contacting arrangement to the extension device;
5. e) Fastening the contacting arrangement in the insertion opening of the base structure;
6. f) providing a sensor film with at least one measuring area and at least one small contact plate;
7. g) Fastening the sensor foil to the base structure in such a way that the contact plate and the contact surface are arranged one above the other touching.

According to this method, a sensor arrangement is produced which is basically made up of two main elements, namely the electrical connector with the contacting arrangement, which is fixedly arranged on the base structure, and the sensor foil, which is replaceably attached to the surface of the base structure . An extension device, for example a connecting cable, is arranged between the electrical connector and the contacting arrangement in order to be able to bring the electrical connector into contact with, for example, a circuit, a voltage source or a computer at a distance from the base structure, and to be able to hold the electrical connector flexibly in terms of location. In contrast to this locally flexible electrical connector, the contacting arrangement is arranged firmly in the base structure, namely in the insertion opening of the base structure, in order to enable contacting of the sensor film. If a sensor foil that needs to be replaced is now removed, the contact surface of the contacting arrangement is exposed and locally fixed to the surface of the base structure, so that only a new sensor foil has to be attached to the surface of the base structure in a predetermined position in order to restore contact between the contact plate and the contact surface produce and provide the sensor array.

To this end, it is advantageous that, before step g), the contacting arrangement is provided with position markings and/or positioning bolts and that the sensor film is provided with position markings and/or with positioning openings for inserting positioning bolts.

Therefore, the sensor foil can advantageously be brought into the correct position without any problems using the position markings or positioning bolts.

An adhesion promoter is also advantageously provided on the contact plate and/or the contact surface before step g) in order to make it advantageously possible to further improve the contact between the contact plate and the contact surface.

Conductive silver or an adhesion promoter that can be activated by increasing the temperature, in particular a soldering material, is preferably used as the adhesion promoter.

The adhesion promoter is advantageously vapour-deposited onto the contact pad and/or the contact surface.

More preferably, a lithographic mask is used to apply the adhesion promoter exclusively in the area of the contact pad and/or the contact surface.

If an adhesion promoter that can be activated by increasing the temperature is used, it is preferred if after step g) there is a step h) in which the structure or at least parts of the structure are heated in order to advantageously activate the adhesion promoter and establish contact between the contact surface and the contact plate .

A sensor film, which has a contact element and a measuring area for detecting physical parameters on a surface of a base structure, is advantageously used in a sensor arrangement which has a base structure and an electrical connector for connecting the sensor film to a voltage source and/or a circuit, wherein the sensor film is to be arranged when used on a side of the base structure opposite the electrical connector, the electrical connector having a contacting arrangement with at least one contact surface for separable electrical contacting of the contact element, the contacting arrangement being fastened in an insertion opening of the base structure.

• 1 voneinander getrennten Einzelelemente einer Sensoranordnung;
• 2 die Sensoranordnung aus 1, wobei die Einzelelemente zusammengebaut sind;
• 3 die Herstellung einer Kontaktieranordnung zur Verwendung in der Sensoranordnung aus 2;
• 4 die fertige Kontaktieranordnung aus 3;
• 5 die Kontaktieranordnung aus 4 vor Einbringen in eine Basisstruktur;
• 6 die Basisstruktur mit Kontaktieranordnung aus 5 mit darüber anzuordnender Sensorfolie;
• 7 die durch Aufbringen der Sensorfolie auf die Kontaktieranordnung in 6 erzeugte Sensoranordnung;
• 8 den Aufbau einer Sensoranordnung gemäß Stand der Technik; und
• 9 einen Sensoraufbau gemäß Stand der Technik.

An embodiment of the invention is explained in more detail below with reference to the accompanying drawings. It shows:

• 1 separate individual elements of a sensor arrangement;
• 2 the sensor arrangement 1 , wherein the individual elements are assembled;
• 3 the production of a contact arrangement for use in the sensor arrangement 2 ;
• 4 the finished contact arrangement 3 ;
• 5 the contact arrangement 4 prior to incorporation into a base structure;
• 6 the base structure with contacting arrangement 5 with sensor foil to be arranged above;
• 7 by applying the sensor film to the contacting arrangement in 6 generated sensor array;
• 8th the construction of a sensor arrangement according to the prior art; and
• 9 a sensor structure according to the prior art.

1 shows a base structure 10 with insertion opening 14, a sensor film 18 with a first side 18a and a second side 18b and an electrical connector 24 with contact arrangement 32, which, as indicated by the arrows, are to be assembled into a sensor arrangement 34.

The sensor film 18 has a measurement area 20 , formed by a sensor array 36 in the present embodiment, and a contact element 38 . The measuring area 20 and the contact element 38 are arranged on opposite sides 18a, 18b of the sensor foil 18, so that when the sensor arrangement 34 is in use, the measuring area 20 is exposed to an outer area 40 of the base structure 10, while the contact element 38 is oriented toward the contacting arrangement 32.

The contact element 38 has a plurality of contact plates 42 . However, it is also possible to provide the contact element 38 as a continuous individual element on the sensor film 18 .

The base structure 10 has the insertion opening 14 which corresponds to the contact element 38 in terms of its dimensions.

The contacting arrangement 32 is connected to the electrical connector 24 via an extension device 44, in particular a connecting cable 22. The contacting arrangement 32 has a base body 46 which is formed from a non-conductive material 48 and a plurality of contact surfaces 15 made from conductive material 52 . Instead of several contact surfaces 50, a single continuous contact surface 50 can also be provided, depending on the design of the contact element 38 on the sensor film 18.

To construct the sensor arrangement 36, the contacting arrangement 32 is now firmly introduced from a rear side 30 of the base structure 10 into the insertion opening 14 of the base structure 10 and the sensor film 18 is placed from above on the surface 28 of the base structure 10 and fastened, for example glued. In this case, the sensor film 18 is placed on the surface 28 in such a way that contact plates 42 and contact surfaces 50 are arranged one above the other touching one another and contact is thus established between contact plates 42 and contact surfaces 50 .

So that the sensor film 18 can cling to the structure of the surface 28 of the base structure 10, it is advantageous if the contact plates 42 are formed as a thin film 54 made of conductive material 52.

In addition, an adhesion promoter 56 is provided on the contact plate 42, which can improve the contact of the two elements after the contact plate 42 and the contact surface 50 have been placed one on top of the other. For example, conductive silver 58 or a soldering material 60 can be used as an adhesion promoter. Conductive silver 58 is advantageously applied to contact pads 42 shortly before contact pads 42 and contact areas 50 are brought together, while soldering material 60 can be vapor-deposited onto contact pads 42 beforehand, for example by a lithography process, and then activated by increasing the temperature after contact pads 42 and contact areas 50 have been brought together can be.

The contacting arrangement 32 and the sensor film 18 have positioning elements 62 in order to be able to apply the sensor film 18 in a predetermined position to the base structure 10 in such a way that contact plates 42 and contact surfaces 50 come to lie exactly one above the other. The positioning elements 62 can be formed from first position markings 64 on the sensor film 18 and second position markings 66 on the contacting arrangement 32, which is particularly advantageous if the sensor film 18 is a transparent sensor film 18. Alternatively or additionally, the sensor film 18 can have positioning openings 68 through which positioning bolts 70 attached to the contacting arrangement 32 are inserted.

3 shows the production of the contacting arrangement 32. Boreholes 72 are made in the base body 46 of the contacting arrangement 32, in which tubes 74 made of conductive material 52 are introduced as conductive channels 76 in the present embodiment. The tubes 74 can be formed from copper wire 78, for example. They are fixed in the drill holes 72 either by gluing or by screwing.

The extension device 44, that is to say the connecting cable 22, is brought into contact with the tubes 74 from below via individual wires 80. FIG.

After inserting the tubes 74 into the boreholes 72, the surface of the contacting arrangement 32 is smoothed, for example by protruding Upcoming areas of the tubes 74 are ground or milled off, so that a flush surface 82 of the base body 46 and tube 74 is formed.

5 shows the base structure 10 with insertion opening 14 into which a contact arrangement 32 with a correspondingly shaped base body 46 is to be inserted. Insertion opening 14 and base body 46 are designed to be complementary to one another, so that an intimate connection between base structure 10 and contacting arrangement 32 can be produced.

In 6 the contacting arrangement 32 is now firmly introduced into the insertion opening 14 of the base structure 10, so that the contact surfaces 50 are located in the area of the surface 28 of the base structure 10, while the connecting cable 22 with the electrical connector 24 is located on the rear side 30 of the base structure 10. The sensor film 18 is now arranged with the contact plates 42 on the surface 28 of the base structure 10 that contact surfaces 50 and contact plates 42 come to lie on top of one another and contact can thus be established.

7 shows the sensor film 18 attached to the surface 28 of the base structure 10, with contact surfaces 50 and contact plates 42 lying on top of one another and being in contact with one another, for example mediated by the adhesion promoter 56.

It is therefore about the attachment and replacement of sensor foils 18.

In doing so, the electrical connector 24 and the sensor foil 18 are separated from one another and a contacting arrangement 32 in the form of a connection insert, which is adapted to the base structure 10, is added.

Sensors, i.e. sensor foils 18, can thus be easily replaced once they are destroyed or a different type of sensor is required without having to touch the electrical connector 24. In addition, the overall structure is more stable since the slot designed for the connection, the insertion opening 14, is closed by the contacting arrangement 32.

The goal is to simplify the assembly process of sensor foils 18 by separating the sensor foil 18 from the electrical connector 24, such as an electronic connector plug. In this way, the electronic plug-in connection is first integrated into the base structure 10 (for example a CFRP surface of a wing model) and remains there while the sensor film 18 is glued to the surface 28 . The contact pads 42 of the sensor on the foil are particularly preferably adapted to the contact surfaces 50 of the integrated connector part. The connection itself is advantageously produced by a very thin layer of soldering material over the contact plate 42 on the sensor film 18, which can be applied there by a wide variety of methods, for example vaporization and the use of a corresponding mask. Once the contact pads 42 of the sensor foil 18 and the connection insert 16, i.e. the contacting arrangement 32, have been brought together, the soldering material 60 is rapidly heated so as to finally connect the two parts together. An advantage of this method of sensor attachment is that a sensor foil 18 can be removed and replaced with a new sensor foil 18 without having to deal with the electrical connector 24 that has already been integrated into the base structure 10 . This allows sensors to be replaced much more easily if a sensor is destroyed or a different type of sensor is required.

Therefore, it is described here that the sensor connection terminal and the sensor itself are fixed independently by separating the two components from each other. They are then reconnected once the sensor connection port has been integrated into the base structure 10.

Sensor components and types can thus be easily replaced by replacing the sensor foil 18 without affecting the structure on which the sensor is mounted, since the sensor connection terminal has been fully integrated.

Furthermore, two contact areas, the contact pads 42 and the contact areas 50, are connected with soldering material 60 by the soldering material 60 being vapor-deposited onto them and then the soldering material 60 being removed using a lithography process with an appropriate mask, so that the soldering material 60 is only on the corresponding contact surfaces - contact plates 42 or contact surfaces 50 - remains.

A convenient way to attach sensors to surfaces 28 is to attach them to thin foil that has electrical contacts and conductors stamped on its back, and then connect the appropriate connection pads on the foil with a cable leading to a connector plug , the electrical connector 24, leads. These sensors are integrated into a base structure 10 by being inserted through the base structure 10 from the back 30 of the base structure 10 . This procedure is in the 8th and 9 shown. The sensor is pulled through the slit, i.e. the insertion opening 14, which causes the sensor foil 18 can damage or the entire sensor itself. In the event that the sensor foil 18 is replaced, the connector is also removed from the overall structure. However, sometimes this is not possible. In addition, the slit is not completely filled by the sensor foil 18, so the sensor foil 18 is subject to possible damage in this area or even deform slightly due to pressure differences, for example in avionics experiments, where significant free-stream velocities can occur.

All of this can be avoided if the connection terminal is separated from the actual sensor foil 18 and the two parts are integrated separately into the structure, as for example in 1 and 2 shown. An additional connection insert as used in 3 and 4 1 is manufactured to connect to the connector plug, and once integrated into the structure the insert can remain there while the sensor foil 18 can be connected and repeatedly removed from the connector insert.

The connector insert itself is formed from a non-conductive material 48 incorporating conductive connectors. An example of such a material is PLA or PAEK and the connections are simply drilled into the material 48. The connection channel can be made of any conductive material 52, for example copper wire, epoxy glued into the connection insert. Once the connection channels, i.e. the conductive channels 76, have been integrated, the surface 82 is leveled, for example by a milling cutter. A possible structure of such a connection insert with connector is in the 3 and 4 shown.

The connection insert can then be glued or screwed into the structure, e.g. via a structure adapted to the base structure 10, such as a step structure or any other method which allows the connection insert to be fixed in the base structure 20. A connection is made between the connection insert and the conductive parts that lead to the sensor of the sensor foil 18 . This can be realized, for example, by positioning bolts 70 or, in the preferred case of a transparent sensor foil 18, by position markings 64, 66 on both the sensor foil 18 and on the connection insert or any structure which is to be brought into a predetermined position.

Furthermore, it is advantageous if a connection between the contact surfaces 42, 50 on the sensor film 18 and on the connection insert is continuously provided. This can be accomplished by adding a thin layer of solder material to both contact pads 42,50. The contact surface of the sensor film 18 is preferably selected for this purpose, since a vapor deposition technology can be selected for this. After evaporation, a lithographic mask and process is used to remove the solder material 60 from the sensor foil 18 except for the contact pad 42 area. All this makes it possible to connect the contact pads 42, 50 by heating the solder material 60 and thus to provide a connection over a longer period of time. As an alternative to using solder 60 with the evaporated solder layer, a mask may be applied over both contact pads 42 and contact pads 50, and conductive epoxy such as silver epoxy may be used to make the connection. The entire assembly process for manufacturing the sensor array 34 is shown in FIGS 5 until 7 shown.

Reference List

10

base structure

12

component

14

insertion opening

16

broadside

18

sensor foil

18a

first page

18b

second page

20

measuring range

22

connection cable

24

electrical connector

26

plug

28

surface

30

back

32

contact arrangement

34

sensor arrangement

36

sensor array

38

contact element

40

outdoor area

42

contact plate

44

extension device

46

base body

48

non-conductive material

50

contact surfaces

52

conductive material

54

thin film

56

adhesion promoter

58

conductive silver

60

soldering material

62

positioning elements

64

first position marker

66

second position marker

68

positioning hole

70

positioning bolts

72

borehole

74

tube

76

conductive channel

78

copper wire

80

wire

82

flush surface

I

length extension

Claims (15)

Sensor arrangement (34) with a base structure (10), a sensor foil (18) and an electrical connector (24) for connecting the sensor foil (18) to a voltage source and/or an electric circuit, wherein the sensor foil (18) and the electrical connector ( 24) are arranged on opposite sides (28, 30) of the base structure (10), the sensor film (18) having at least one contact element (38) and the electrical connector (24) having a contacting arrangement (32) with at least one contact surface (50) for having separable electrical contacting of the contact element (38), wherein the contacting arrangement (32) is fixed in an insertion opening (14) of the base structure (10). Sensor arrangement (34) after claim 1 , characterized in that the sensor film (18) is designed for removable attachment to a surface (28) of the base structure (10), the sensor film (18) having a measuring area (20) for detecting physical parameters on the surface (28) of the Base structure (10) and at least one as a thin film (54) formed conductive contact plate (42) as a contact element (38). Sensor arrangement (34) after claim 2 , characterized in that the contact plate (42) and / or the contact surface (50) has an adhesion promoter (56). Sensor arrangement (34) according to one of Claims 1 until 3 , characterized in that the sensor film (18) has first position markings (64) and/or positioning openings (68) for inserting positioning bolts (70), the contacting arrangement (32) having second position markings (66) and/or positioning bolts (70) for Positioning the sensor film (18) on the base structure (10) in a predetermined position. Sensor arrangement (34) according to one of Claims 1 until 4 , characterized in that the contacting arrangement (32) has a base body (46) formed from a non-conductive material (48) and fixed in the insertion opening (14) of the base structure (10). Sensor arrangement (34) after claim 5 , characterized in that to form the contact surface of the base body (46) is formed with at least one borehole (72), in which a conductive channel (76) is introduced. Sensor arrangement (34) according to claims 5 and 6 as far as that claim 5 directly or indirectly to one of the claims 2 or 3 is withdrawn, characterized in that the conductive channel (76) is introduced into the base body (46) in such a way that it is on the surface (28) of the base body (46) to be directed towards the contact pad (42) in use to form the contact surface (50) is flush with the surface (28) of the base body (46). Method for producing a sensor arrangement (34) for detecting physical parameters on the surface (28) of a base structure (10), with the steps a) providing a base structure (10) with at least one insertion opening (14); b) providing a contacting arrangement (32) with at least one contact surface (50); c) providing an electrical connector (24) having an extension means (44); d) connecting the contacting arrangement (32) to the extension device (44); e) fixing the contacting arrangement (32) in the insertion opening (14) of the base structure (10); f) providing a sensor film (18) with at least one measuring area (20) and at least one contact plate (42); g) Fastening the sensor film (18) to the base structure (10) in such a way that the contact plate (42) and the contact surface (50) are arranged one above the other touching. procedure after claim 8 , characterized in that before step g) the contacting arrangement (32) with position markings (66) and/or is provided with positioning bolts (70) and that the sensor film (18) is provided with position markings (64) and/or with positioning openings (68) for inserting positioning bolts (70). Procedure according to one of Claims 8 or 9 , characterized in that before step g) an adhesion promoter (56) is provided on the contact plate (42) and/or the contact surface (50). procedure after claim 10 , characterized in that conductive silver (58) or an adhesion promoter (56) that can be activated by increasing the temperature is used as the adhesion promoter (56). procedure after claim 11 , characterized in that the adhesion promoter (56) is vapour-deposited onto the contact plate (42) and/or the contact surface (59). Procedure according to one of Claims 10 until 12 , characterized in that a lithographic mask for applying the adhesion promoter (56) is used exclusively in the area of the contact plate (42) and/or the contact surface (50). Procedure according to one of Claims 10 until 13 , characterized in that after step g) a step h) heating to activate the adhesion promoter (56) is carried out. Use of a sensor film (18) with a contact element (38) and a measuring area (20) for detecting physical parameters on a surface (28) of a base structure (10) in a sensor arrangement (34) having a base structure (10) and an electrical Connector (24) for connecting the sensor foil (18) to a voltage source and/or an electric circuit, wherein the sensor foil (18) is to be arranged on a side (30) of the base structure (10) opposite the electrical connector (24), wherein the electrical connector (24) has a contacting arrangement (32) with at least one contact surface (50) for detachable electrical contacting of the contact element (38), the contacting arrangement (32) being fastened in an insertion opening (14) of the base structure (10).

Images