CN219918716U - Circuit structure, frequency converter drive plate and air conditioner - Google Patents

Abstract

The utility model discloses a circuit structure, a frequency converter driving plate and an air conditioner, wherein the circuit structure comprises a substrate, a power assembly and a chip assembly, a plurality of output terminals are arranged on the substrate, the power assembly comprises a plurality of power devices, the power devices are respectively connected with the output terminals through different output end power wiring lines, the chip assembly comprises a plurality of driving chips, and the driving chips are connected with the power assembly and are arranged with the output end power wiring lines. According to the circuit structure provided by the embodiment of the utility model, the plurality of driving chips and the power assembly are arranged at intervals, so that the damage such as ignition and the like generated during the working of the circuit structure can be avoided, and the normal operation of each device in the circuit can be ensured.

Description

Circuit structure, frequency converter drive plate and air conditioner

Technical Field

The utility model relates to the technical field of air conditioners, in particular to a circuit structure, a frequency converter driving plate and an air conditioner.

Background

In the multi-split air conditioner industry, power devices such as a rectifier bridge, an inverter bridge and the like in the driving of a compressor and a fan generally adopt PIM (Power integrated module) or IPM (Intelligent power module) modules, and the dependency on partial module manufacturers is particularly high. With the rising of industries such as electric automobiles and energy storage, the demand for semiconductor power devices is increased, the price of PIM or IPM modules is continuously increased, and the impact is caused to household appliance industries such as air conditioners.

In the related art, in order to solve the problem of reducing the cost of the frequency converter, a circuit board can be used for replacing the module, but in the circuit board, a driving chip and a power wiring are arranged together, so that the damage such as ignition and the like is easily caused, and the normal operation of the driving chip and even the whole frequency converter is influenced.

Disclosure of Invention

The present utility model aims to solve at least one of the technical problems in the related art to some extent.

Therefore, an object of the present utility model is to provide a circuit structure, which can avoid the damage such as ignition during the operation of the circuit structure, and ensure the normal operation of each device in the circuit.

Another object of the present utility model is to provide a frequency converter driving board, which includes the aforementioned circuit structure.

It is still another object of the present utility model to provide an air conditioner including the aforementioned inverter driving board.

According to the circuit structure in the embodiment of the utility model, the circuit structure comprises a substrate, a power component and a chip component, wherein a plurality of output terminals are arranged on the substrate, the power component comprises a plurality of power devices, the power devices are respectively connected with the output terminals through different output end power wires, and the chip component comprises a plurality of driving chips, and the driving chips are connected with the power component and are arranged with the output end power wires in a spacing manner.

According to the circuit structure provided by the embodiment of the utility model, the plurality of driving chips and the power assembly are arranged at intervals, so that the damage such as ignition and the like generated during the working of the circuit structure can be avoided, and the normal operation of each device in the circuit can be ensured.

In addition, the circuit structure according to the above embodiment of the present utility model may further have the following additional technical features:

optionally, the power component comprises a first power device, a second power device and a third power device, and the first power device, the second power device and the third power device form a three-phase inverter bridge upper bridge circuit.

Optionally, the plurality of output terminals include a first terminal, a second terminal and a third terminal, the output power trace includes a first output power trace, a second output power trace and a third output power trace, an emitter of the first power device is connected with the first terminal through the first output power trace, an emitter of the second power device is connected with the second terminal through the second output power trace, and an emitter of the third power device is connected with the third terminal through the third output power trace.

Optionally, the chip assembly includes a first driving chip and a second driving chip, a primary side of the first driving chip and a primary side of the second driving chip are both connected with the controller, a secondary side of the first driving chip is connected with the gate of the first power device, and a secondary side of the second driving chip is connected with the gate of the second power device.

Optionally, the first driving chip is spaced from the first output power trace, and the second driving chip is spaced between the first output power trace and the second output power trace.

Optionally, the substrate includes an upper layer and a lower layer along a thickness direction, and the primary side of the first driving chip and the primary side of the second driving chip are respectively configured with the upper layer and the lower layer to be grounded.

Optionally, the secondary side ground terminal individual lead of the first driving chip is connected with the emitter of the first power device, and the secondary side ground terminal individual lead of the second driving chip is connected with the emitter of the second power device.

Optionally, the three-phase inverter bridge upper bridge circuit further adopts a bootstrap circuit to supply power to the chip assembly.

According to the frequency converter driving board provided by the embodiment of the utility model, the frequency converter driving board comprises the circuit structure.

According to the frequency converter driving board provided by the embodiment of the utility model, through the circuit structure, electromagnetic interference of the power wiring to the chip assembly can be reduced, and normal operation of devices in the circuit can be ensured.

According to the air conditioner provided by the embodiment of the utility model, the air conditioner comprises the frequency converter driving plate.

According to the air conditioner provided by the embodiment of the utility model, through the application of the frequency converter driving plate, the electromagnetic interference of the power wiring to the chip assembly can be reduced, and the normal operation of devices in a circuit can be ensured.

Drawings

Fig. 1 is a schematic diagram of a circuit configuration in some embodiments of the utility model.

Reference numerals:

the circuit structure 100, the substrate 10, the bus 11, the output terminal 12, the first terminal 121, the second terminal 122, the third terminal 123, the power component 20, the first power device 21, the second power device 22, the third power device 23, the chip component 30, the first driving chip 31, the second driving chip 32, the first output power trace 40, the second output power trace 50, and the third output power trace 60.

Detailed Description

The utility model provides a circuit structure 100, a frequency converter driving board and an air conditioner, which can reduce electromagnetic interference of power wiring to a chip assembly 30 and ensure that devices in the circuit can normally operate.

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.

As shown in fig. 1, according to the circuit structure 100 in the embodiment of the utility model, the circuit structure 100 includes a substrate 10, a power component 20 and a chip component 30, a plurality of output terminals 12 are disposed on the substrate 10, the power component 20 includes a plurality of power devices, the plurality of power devices are respectively connected with the plurality of output terminals 12 through different output terminal power traces, the chip component 30 includes a plurality of driving chips, and the plurality of driving chips are connected with the power component 20 and are spaced apart from the output terminal power traces, so that damages such as ignition when the circuit structure 100 works can be avoided, and safe operation of devices in the circuit can be ensured.

In the circuit structure 100, the plurality of power devices can be electrically connected with the plurality of output terminals 12 in a one-to-one correspondence manner through different output terminal power wires, at this time, in order to improve the integration level of the circuit structure 100, a plurality of driving chips can be arranged between the adjacent output terminal power wires, so that the circuit structure 100 is more compact, and in addition, the distance between the plurality of driving chips and the output terminal power wires is greater than or equal to the creepage distance between the driving chips and the output terminal power wires (i.e. the driving chips and the output terminal power wires), so as to avoid the risk of striking fire and the like between the driving chips and the output terminal power wires when the circuit structure 100 works, and ensure the working safety of the frequency converter.

It should be noted that a plurality of driving chips may be connected to the power module to control the operation of the power module.

Therefore, according to the circuit structure 100 in the embodiment of the utility model, the damage such as ignition and the like generated during the operation of the circuit structure can be avoided, so that the normal operation of devices in the circuit can be ensured.

As shown in fig. 1, in some embodiments of the present utility model, the power assembly 20 may include a first power device 21, a second power device 22, and a third power device 23.

The first power device 21, the second power device 22 and the third power device 23 may form a three-phase inverter bridge upper bridge circuit, so as to reduce electromagnetic interference of the circuit structure 100.

Alternatively, in the inverter driving board, a rectifying circuit and an inverter circuit may be provided, wherein the rectifying circuit and the inverter circuit may be electrically connected through bus bars, the bus bars may be electrically connected to the first power device 21, the second power device 22, and the third power device 23, respectively, one by one, while the first power device 21, the second power device 22, and the third power device 23 may be electrically connected to the output terminal 12 through output terminal power traces, respectively, so that by controlling the switching of the first power device 21, the second power device 22, and the third power device 23, a current may flow to a part of the first power device 21, the second power device 22, and the third power device 23, and the dc power may be inverted to ac power in combination with a lower bridge circuit of the three-phase inverter bridge.

In addition, the first, second and third power devices 21, 22 and 23 may be arranged at intervals in the left-right direction at an upper portion of the substrate 10.

Of course, according to practical situations, the power device may be an IGBT (i.e. an insulated gate bipolar transistor), a MOSFET (i.e. a metal oxide semiconductor field effect transistor), a triode, a thyristor, and other electrical components, which may be used in the circuit structure 100.

As shown in fig. 1, in some embodiments of the present utility model, the plurality of output terminals 12 may include a first terminal 121, a second terminal 122, and a third terminal 123, and the output power trace may include a first output power trace 40, a second output power trace 50, and a third output power trace 60.

The emitter of the first power device 21 may be connected to the first terminal 121 through the first output power trace 40, the emitter of the second power device 22 may be connected to the second terminal 122 through the second output power trace 50, and the emitter of the third power device 23 may be connected to the third terminal 123 through the third output power trace 60.

Specifically, the first output power trace 40 may be connected to the emitter of the first power device 21 and the first terminal 121, and the first output power trace 40 may be disposed in the middle of the substrate 10, at this time, a portion of the plurality of driving chips may be disposed at a side of the first output power trace 40 away from the second output power trace 50 at intervals, and a portion of the plurality of driving chips may be spaced from the first output power trace 40 by a predetermined creepage distance, so as to ensure operation safety of the circuit structure 100, and the creepage distance may be as small as possible, so as to improve the integration of the circuit structure 100, and enable the frequency converter to be miniaturized.

Similarly, the second output power trace 50 may be connected to the emitter of the second power device 22 and the second terminal 122, and the second output power trace 50 may be disposed in the middle of the substrate 10, at this time, another portion of the plurality of driving chips may be disposed between the first output power trace 40 and the second output power trace 50 at intervals, and another portion of the plurality of driving chips may be separated from the first output power trace 40 and the second output power trace 50 by a predetermined creepage distance, so as to ensure the operation of the circuit structure 100, and the creepage distance may be as small as possible under the condition of meeting the requirement, so as to improve the integration level of the circuit structure 100.

In addition, the third output power trace 60 may be connected to the emitter of the third power device 23 and the third terminal 123, respectively, and spaced apart from the second output power trace 50 by a predetermined creepage distance, so as to ensure operation safety of the circuit structure 100.

Next, the first terminal 121, the second terminal 122, and the third terminal 123 may be arranged at intervals in the up-down direction at opposite right portions of the substrate 10.

As shown in fig. 1, in some embodiments of the present utility model, the chip assembly 30 may include a first driving chip 31 and a second driving chip 32.

The primary side of the first driving chip 31 and the primary side of the second driving chip 32 may be connected to the controller, the secondary side of the first driving chip 31 is connected to the gate of the first power device 21, and the secondary side of the second driving chip 32 is connected to the gate of the second power device 22, so that the controller controls the driving chip to control the power device, thereby implementing the frequency conversion function of the frequency converter.

The primary side of the first driving chip 31 is an input side, the secondary side of the first driving chip 31 is an output side, the primary side of the second driving chip 32 is an input side, and the secondary side of the second driving chip 32 is an output side; in addition, the primary side and the secondary side in the driver chip are isolated from each other.

Specifically, the controller may be connected to the primary side of the first driving chip 31 and the primary side of the second driving chip 32, and the secondary side of the first driving chip 31 may be connected to the gate of the first power device 21, so that the controller may control the on-off between the collector and the emitter of the first power device 21 through the first driving chip 31, and likewise, the secondary side of the second driving chip 32 may be connected to the gate of the second power device 22, so that the controller may control the on-off between the collector and the emitter of the second power device 22 through the second driving chip 32, and the controller may also control the remaining power devices in the three-phase inverter circuit to invert the direct current into the alternating current through the three-phase inverter circuit, and may combine with other circuits of the frequency converter to implement the frequency conversion function of the frequency converter.

As shown in fig. 1, in some embodiments of the present utility model, the first driver chip 31 is spaced apart from the first output power trace 40, and the second driver chip 32 is spaced apart between the first output power trace 40 and the second output power trace 50.

In detail, the first output power trace 40 may be connected to the emitter of the first power device 21 and the first terminal 121, and the first output power trace 40 may be disposed in the middle of the substrate 10, the first driving chip 31 may be disposed at a side of the first output power trace 40 away from the second output power trace 50, and the first driving chip 31 may be separated from the first output power trace 40 by a predetermined creepage distance, so as to ensure operation safety of the circuit structure 100, and the creepage distance may be as small as possible under the condition of meeting the requirement, so as to improve the integration level of the circuit structure 100, and make the frequency converter miniaturized.

Similarly, the second output power trace 50 may be connected to the emitter of the second power device 22 and the second terminal 122, and the second output power trace 50 may be disposed in the middle of the substrate 10, where the second driving chip 32 may be disposed between the first output power trace 40 and the second output power trace 50 at intervals, and the plurality of second driving chips 32 may be separated from the first output power trace 40 and the second output power trace 50 by a predetermined creepage distance, so as to ensure the operation of the circuit structure 100, and the creepage distance may be as small as possible, so as to improve the integration level of the circuit structure 100.

As shown in fig. 1, the substrate 10 may include upper and lower layers in a thickness direction in some embodiments of the present utility model.

The primary side of the first driving chip 31 and the primary side of the second driving chip 32 are respectively configured with an upper layer and a lower layer for grounding, so as to better reduce electromagnetic interference of the output end power wiring to the driving chip.

Specifically, the primary side of the first driving chip 31 is further provided with a first peripheral circuit, the primary side of the second driving chip 32 is further provided with a second peripheral circuit, the upper layer of the substrate 10 in the thickness direction may be provided with the first peripheral circuit and the second peripheral circuit, in addition, the upper layer and the lower layer of the substrate 10 may be paved with copper foil in the lower layer in the thickness direction, wherein the copper foil paved on the lower layer may include a first part and a second part, the first peripheral circuit may be laminated on the first part, and the second peripheral circuit may be laminated on the second part, so that the ground impedance may be reduced, shielding protection and noise suppression may be provided, in other words, the copper paving is connected with a ground layer, a good ground loop may be provided, and the anti-interference capability of the circuit structure 100 may also be improved, and electromagnetic interference to the driving chip may be reduced.

As shown in fig. 1, in some embodiments of the present utility model, the secondary side ground separate lead of the first driving chip 31 is connected to the emitter of the first power device 21, and the secondary side ground separate lead of the second driving chip 32 is connected to the emitter of the second power device 22, so that electromagnetic interference of the power trace to the driving chip can be reduced, and loss can be reduced.

For convenience of description, the following description will take the power module as an IGBT as an example:

specifically, the first power device 21 includes a collector, a gate, and an emitter, and the controller can turn on the collector and the emitter by inputting a positive voltage to the gate, and conversely, stop inputting a positive voltage to the gate, and turn off the collector and the emitter, and in the same way, turn on and off a plurality of power modules in the three-phase inverter circuit to invert the direct current into alternating current; in this process, the first driving chip 31 may be connected to the gate of the first power device 21, and at the same time, the first driving chip 31 may be connected to the emitter of the first power device 21, so as to form a kelvin emitter, in other words, a kelvin connection method may be adopted in the three-phase inverter circuit, so as to increase the switching speed of the first power device 21, and further reduce the loss of the first power device 21, and at the same time reduce the electromagnetic interference of the power trace to the first driving chip 31.

Similarly, the second power device 22 includes a collector, a gate and an emitter, and the controller can make the collector and the emitter be turned on by inputting a positive voltage to the gate, and conversely, stop inputting a positive voltage to the gate and turn the collector and the emitter off, and in the same way, convert direct current into alternating current by turning on and off a plurality of power modules in the three-phase inverter circuit; in this process, the second driving chip 32 may be connected to the gate of the second power device 22, and at the same time, the second driving chip 32 may be connected to the emitter of the second power device 22, so as to form a kelvin emitter, in other words, a kelvin connection method may be adopted in the three-phase inverter circuit, so as to increase the switching speed of the second power device 22, and also reduce the loss of the second power device 22, and at the same time, reduce the electromagnetic interference of the power trace to the second driving chip 32.

As shown in fig. 1, in some embodiments of the present utility model, the three-phase inverter bridge upper bridge circuit further employs a bootstrap circuit to supply power to the chip assembly 30, it is understood that the bootstrap circuit is used to supply power to the secondary side of the chip assembly 30, so that the chip assembly 30 is convenient to input or stop inputting a positive voltage to the gate of the power module, so that the collector and the emitter of the power module can be turned on or off, and the function of the three-phase inverter circuit for converting direct current into alternating current is realized; meanwhile, in the circuit structure 100, power devices are saved, and the integration level of the circuit structure 100 is further improved.

According to the frequency converter driving board in the embodiment of the utility model, the frequency converter driving board can comprise the circuit structure 100 in the embodiment, by applying the circuit structure 100, electromagnetic interference of power wiring to the chip assembly 30 can be reduced, normal operation of devices in a circuit can be ensured, and meanwhile, damage such as ignition and the like during operation of the circuit structure 100 can be avoided, so that safe operation of the devices in the circuit can be ensured.

Specifically, the first power device 21, the second power device 22 and the third power device 23 may be disposed on the substrate 10, where the collector of the first power device 21, the collector of the second power device 22 and the collector of the third power device 23 are connected, so that the bus is connected with one of the collectors of the three power devices, thereby reducing the arrangement length of the power routing.

In addition, the first power device 21 is connected to the first terminal 121 through the first output power trace 40, the second power device 22 is connected to the second terminal 122 through the second output power trace 50, the third power device 23 is connected to the third terminal 123 through the third output power trace 60, wherein the first driver chip 31 may be disposed on a side of the first output power trace 40 away from the second output power trace 50, the second driver chip 32 may be disposed between the first output power trace 40 and the second output power trace 50, and the first driver chip 31 and the second driver chip 32 may be separated from adjacent power traces by a predetermined creepage distance, so as to avoid damages such as ignition, and electromagnetic interference of the power traces to the driver chip, and at the same time, the creepage distance may be as small as possible, so as to improve the integration of the circuit structure 100,

further, the primary side of the first driving chip 31 and the primary side of the second driving chip 32 are both configured with an upper layer and a lower layer of ground for grounding, wherein the ground refers to that a copper foil is laid on the substrate 10, the copper foil may include a first portion and a second portion, specifically, the primary side of the first driving chip 31 may be provided with a first peripheral circuit, the primary side of the second driving chip 32 may be provided with a second peripheral circuit, the first peripheral circuit may be laminated on the copper foil of the first portion, and the second peripheral circuit may be laminated on the copper foil of the second portion, so as to better reduce electromagnetic interference of the power routing to the driving chip.

Further, the secondary side of the first driving chip 31 is connected to the collector of the first power device 21, and the secondary side ground terminal of the first driving chip 31 may be connected to the emitter of the first power device 21 through a separate lead, in other words, by using kelvin connection in the three-phase inverter circuit, the switching speed of the first power device 21 is increased, and the loss of the first power device 21 may be reduced, while reducing the electromagnetic interference of the power trace to the first driving chip 31. Likewise, the secondary side of the second driving chip 32 may be connected to the collector of the second power device 22, and the secondary side ground terminal of the first driving chip 31 may be separately wired to the emitter of the second power device 22 to form a kelvin connection.

Second, the upper bridge circuit of the three-phase inverter circuit can supply power to the chip assembly 30 by adopting a bootstrap circuit mode, so that the number of electrical components in the circuit structure 100 is reduced, the weight of the frequency converter is reduced, and the volume of the frequency converter is reduced.

It should be noted that, the electrode terminal of the first power device 21 is sequentially a gate, a collector and an emitter from left to right, and the electrode terminal of the second power device 22 and the electrode terminal of the third power device 23 are arranged in the same manner as the electrode terminal of the first power device 21.

According to the air conditioner provided by the embodiment of the utility model, the air conditioner can comprise the frequency converter driving plate in the embodiment, and by applying the frequency converter driving plate, the electromagnetic interference of the power wiring to the chip assembly 30 can be reduced, the normal operation of devices in a circuit can be ensured, and meanwhile, the damage such as ignition and the like during the operation of the air conditioner can be avoided, so that the safe operation of the air conditioner can be ensured.

As shown in fig. 1, because of the line installation requirements of the heat radiator of the multi-split external machine and the U-phase, V-phase and W-phase of the compressor motor, the upper bridge IGBT single tube of the three-phase inverter bridge of the frequency converter needs to be placed at the opposite uppermost side of the substrate 10, and the U-phase, V-phase and W-phase of the emitter outgoing line terminal of the IGBT single tube are respectively arranged at the opposite rightmost side of the substrate 10. At this time, the power wiring is arranged at the position of the driving plate at the upper part of the IGBT, so that the driving circuit of the driving plate is arranged at no position, and the U-phase and V-phase IGBT driving circuits are arranged in the middle of the high-power wiring on the premise of ensuring the creepage distance. The U-phase upper bridge IGBT driving circuit is arranged between the three-phase input terminal and the U-phase output power wiring, and the V-phase upper bridge IGBT driving circuit is arranged between the U-phase high-power wiring and the V-phase high-power wiring, so that the problem that the two circuits in the frequency converter are greatly interfered by the high-power wiring electromagnetic interference is caused.

The utility model can shield high-power wiring electromagnetic interference by reasonably paving ground and designing ground loops on the premise of ensuring high-power wiring heat dissipation, current carrying capacity, creepage distance and the like. According to the method, each component of the driving circuit is reasonably distributed on the limited area of the driving board of the frequency converter, the power components are not influenced by high-power wiring around the power components when the normal switch works, and the EMC (electromagnetic compatibility) standard of the whole machine is met.

The primary side signals of the driving chip are all laid in an upper layer and a lower layer, so that interference of the primary side signals from surrounding high-power wires is reduced.

In the application, the upper bridge of the three-phase inverter adopts a bootstrap circuit to supply power to the driving chip, so that the secondary side of the driving chip and the corresponding U, V phase potential are respectively in the same level. The U-phase and V-phase upper bridge IGBT driving chips are respectively taken from the independent leads on the respective IGBT collector pads at the secondary sides and are separately wired with the high-power wiring of the compressor power source U, V, W so as to reduce the interference from large current, and the upper layer and the lower layer are comprehensively paved to further reduce the surrounding electromagnetic interference.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

While embodiments of the present utility model have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the utility model, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the utility model.

Claims (10)

1. A circuit structure, comprising:

a substrate (10), wherein a plurality of output terminals (12) are provided on the substrate (10);

the power assembly (20), the power assembly (20) comprises a plurality of power devices, and the power devices are respectively connected with the output terminals (12) through different output end power wires;

the chip assembly (30) comprises a plurality of driving chips, and the driving chips are connected with the power assembly (20) and are arranged at intervals with the power wiring of the output end.

2. The circuit structure according to claim 1, wherein the power assembly (20) comprises a first power device (21), a second power device (22) and a third power device (23), and the first power device (21), the second power device (22) and the third power device (23) form a three-phase inverter bridge upper bridge circuit.

3. The circuit arrangement according to claim 2, characterized in that the plurality of output terminals (12) comprises a first terminal (121), a second terminal (122) and a third terminal (123), the output power traces comprise a first output power trace (40), a second output power trace (50) and a third output power trace (60), an emitter of the first power device (21) is connected with the first terminal (121) through the first output power trace (40), an emitter of the second power device (22) is connected with the second terminal (122) through the second output power trace (50), and an emitter of the third power device (23) is connected with the third terminal (123) through the third output power trace (60).

4. A circuit arrangement according to claim 3, characterized in that the chip assembly (30) comprises a first driver chip (31) and a second driver chip (32), the primary side of the first driver chip (31) and the primary side of the second driver chip (32) being connected to a controller, the secondary side of the first driver chip (31) being connected to the gate of the first power device (21), the secondary side of the second driver chip (32) being connected to the gate of the second power device (22).

5. The circuit arrangement according to claim 4, characterized in that the first driver chip (31) is arranged at a distance from the first output power track (40), and the second driver chip (32) is arranged at a distance between the first output power track (40) and the second output power track (50).

6. The circuit structure according to claim 4, wherein the substrate (10) includes upper and lower layers in a thickness direction, and the primary side of the first driving chip (31) and the primary side of the second driving chip (32) are grounded by being arranged with the upper and lower layers.

7. The circuit structure according to claim 4, characterized in that a secondary side ground individual lead of the first driving chip (31) is connected to an emitter of the first power device (21), and a secondary side ground individual lead of the second driving chip (32) is connected to an emitter of the second power device (22).

8. The circuit arrangement according to any of claims 2-7, characterized in that the three-phase inverter bridge-on-bridge circuit also employs a bootstrap circuit for powering the chip assembly (30).

9. A frequency converter drive board, characterized in that it comprises a circuit arrangement as claimed in any one of claims 1-8.

10. An air conditioner comprising the inverter drive board of claim 9.