CN215988284U - Embedded device and network transformer - Google Patents

Embedded device and network transformer Download PDF

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Publication number
CN215988284U
CN215988284U CN202121393679.7U CN202121393679U CN215988284U CN 215988284 U CN215988284 U CN 215988284U CN 202121393679 U CN202121393679 U CN 202121393679U CN 215988284 U CN215988284 U CN 215988284U
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transformer
filter
rlc
embedded device
electronic element
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CN202121393679.7U
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郭伟静
陆平
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Shennan Circuit Co Ltd
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Shennan Circuit Co Ltd
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Abstract

The application discloses provide a bury formula device and network transformer, this bury formula device includes: the transformer, the filter, the peripheral electronic element and the two substrates are arranged in a stacked mode; wherein, each base plate all inlays and is equipped with wave filter, transformer, and each base plate is including the first surface and the second surface that back of the body set up, and first surface does not have peripheral electronic component sets up, and two base plates are through first surface adjacent/meet the setting. Through two adjacent non-functional surfaces of the two circuit boards, no peripheral electronic element is arranged, so that the distance between the two circuit boards can be small, the structure of the laminated circuit is strengthened, and the distance between the peripheral electronic elements corresponding to the two circuit boards is further increased.

Description

Embedded device and network transformer
Technical Field
The application relates to the technical field of manufacturing and production processes, in particular to an embedded device and a network transformer thereof.
Background
The embedded device can embed a large number of electronic components on the substrate, thereby improving the reliability of the package and reducing the cost, and can be widely applied.
Nowadays, with the rapid increase of portable electronic products and high-speed information receiving and transmitting digital products, the high-density packaging technology is more and more important, and it is more and more difficult to arrange a large number of original components on a substrate, and the structure, the structure size, the arrangement position and even the arrangement distance of the components are more and more important.
The inventor of the present application finds, in long-term research and development work, that the conventional method makes the arrangement of electronic elements in the embedded device unreasonable, and leads to a large volume of the embedded device and a long distance of peripheral electronic elements on a miniaturized embedded device.
SUMMERY OF THE UTILITY MODEL
The application provides an embedded device and a network transformer, which are used for solving the problems of the embedded device in the prior art.
In order to solve the technical problem, the application adopts a technical scheme that: the embedded device includes: the transformer, the filter, the peripheral electronic element and the two substrates are arranged in a stacked mode; wherein, each base plate all inlays and is equipped with wave filter, transformer, and each base plate is including the first surface and the second surface that back of the body set up mutually, and the first surface does not have peripheral electronic component to set up, and two base plates are through first surface adjacent/meet the setting. Through two adjacent non-functional surfaces of the two circuit boards, no peripheral electronic element is arranged, so that the distance between the two circuit boards can be small, the structure of the laminated circuit is strengthened, and the distance between the peripheral electronic elements corresponding to the two circuit boards is further increased.
The peripheral electronic element is an RLC electronic element and is arranged on the second surface of each substrate; the two substrates and the respective resistance, inductance, capacitance (RLC) electronic elements, the embedded transformer and the filter are symmetrically arranged by taking a central line between the two first surfaces as an axis, so that the RLC electronic elements are far away from the central line, and signals on the respective RLC electronic elements of the two substrates are kept from interfering with each other. The RLC electronic elements are arranged at the position far away from the central line of the first surface, so that the RLC electronic elements of the two substrates are far away from each other, signals on the RLC electronic elements are not interfered with each other, and the working efficiency of the embedded device is improved.
Wherein the horizontal projections of the transformer, the filter and the RLC electronic component on the midline between the two first surfaces are completely overlapped, and the centers of the projections of the two are coincident. By arranging the transformer, the filter and the RLC electronic element to be completely overlapped in horizontal projection on the middle line between the two first surfaces, all the assemblies can be located on the same horizontal line, the arrangement rule among all the assemblies is compact, the size of the embedded device is favorably reduced, and the production cost is reduced.
The transformer comprises a first transformer and a second transformer; the filter comprises a first filter and a second filter; the RLC electronic elements comprise a first RLC electronic element and a second RLC electronic element; the first filter is connected with the first transformer, the first transformer is connected with the first RLC electronic element, the second filter is connected with the second transformer, and the second transformer is connected with the second RLC electronic element. By arranging at least two transformers, two filters and two RLC electronic elements, the connection relation among the transformers is clear, arrangement of all components is facilitated, and design and manufacturing are facilitated.
The first filter is arranged between the first transformer and the first RLC electronic element; the second filter is disposed between the second transformer and the second RLC electronic component. The filter is arranged between the transformer and the RLC electronic element, so that design and manufacturing are facilitated.
The middle line distance between the first filter and the second filter is larger than the middle line distance between the first transformer and the second transformer and smaller than the middle line distance between the first RLC electronic element and the second RLC electronic element, so that the RLC electronic elements respectively positioned on the two substrates are far away from each other, and mutual interference is reduced. The comparison standards can be unified by comparing the distance between the assemblies far away from the centerline, and the centerline distance between the first RLC electronic element and the second RLC electronic element is the largest, so that the RLC electronic elements are arranged at the farthest ends far away from the centerline, the RLC electronic elements on the two substrates are far away from each other to reach the reachable far positions, and signals on the RLC electronic elements are not interfered with each other.
Wherein, the two substrates are arranged at intervals. By setting the thickness between the two substrates at intervals, the distance between the RLC electronic components, at which signals are not interfered, can be designed as required.
The embedded device further comprises a plurality of power end filters, every two power end filters are arranged on the peripheral electronic elements of each substrate and further comprise fuses, capacitors and indicator lamps, the power end filters are connected with the transformer, and the fuses and the electrical indicator lamps are arranged between the power end filters and the transformer. The fuse is arranged between the power supply end filter and the transformer and can be used for protecting the power supply end filter, and the capacitor is arranged to adjust the filtering performance of the power supply end filter.
The distance between the capacitors correspondingly arranged on the two substrates is larger than the distance between the power supply end filters correspondingly arranged on the two substrates. The distance between the capacitors of the two substrates is larger than the distance between the power end filters of the two substrates, so that the signal interference between the capacitors in the embedded device is reduced.
Another solution provided by the present application to solve the above problem is to provide a network transformer comprising the above mentioned buried device.
The beneficial effect of this application is: different from the prior art, the distance between the two circuit boards can be made very small by arranging the peripheral electronic elements on the two adjacent non-functional surfaces of the two circuit boards, so that the structure of the laminated circuit is strengthened, and the distance between the peripheral electronic elements corresponding to the two circuit boards is further increased.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic cross-sectional structure diagram of an embedded device in an embodiment of the present application;
fig. 2 is a schematic diagram of a substrate in an embedded device according to an embodiment of the present disclosure.
In fig. 1 and 2, 10, 20-substrate, 11, 21-transformer, 12, 22-filter, and 13, 23-RLC electronic component.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the present application and in the drawings described above, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Referring to fig. 1, fig. 1 is a schematic cross-sectional structure diagram of an embedded device according to an embodiment of the present application. Wherein, this bury formula device includes: substrate 10, substrate 20, transformer 11, transformer 21, filter 12, filter 22, RLC electronics 13, and RLC electronics 23. The substrate 10 and the substrate 20 are stacked in a horizontal direction. The filter 12 and the transformer 11 are embedded in the substrate 10, and the filter 22 and the transformer 21 are embedded in the substrate 20.
The substrate 10 includes a first surface 14 and a second surface 15 opposite to each other, and the substrate 20 includes a first surface 24 and a second surface 25 opposite to each other. The first surface 14 and the first surface 24 have no electronic device and are an inactive surface, the substrate 10 and the substrate 20 are disposed adjacent to or connected to each other through the first surface 14 and the first surface 24, and no peripheral electronic component is disposed through two adjacent inactive surfaces of the two circuit boards, so that the distance between the two circuit boards can be made small, thereby strengthening the structure of the laminated circuit and further extending the distance between the peripheral electronic components corresponding to the two circuit boards.
The transformer 11 and the transformer 21 are disposed axisymmetrically with respect to a center line between the first surface 14 and the first surface 24, the filter 12 and the filter 22 are disposed axisymmetrically with respect to a center line between the first surface 14 and the first surface 24, and the RLC electronic element 13 and the RLC electronic element 23 are disposed axisymmetrically with respect to a center line between the first surface 14 and the first surface 24.
Optionally, at least a plurality of RLC electronic components are included in the second surface 15 and the second surface 25, and the plurality of RLC electronic components are positioned away from a centerline between the first surface 14 and the first surface 24 to keep signals on the plurality of RLC electronic components of the substrate 10 and the substrate 20 from interfering with each other. By disposing the RLC electronic element at a position far from the centerline between the first surface 14 and the first surface 24, the plurality of RLC electronic elements of the substrate 10 and the substrate 20 are far away from each other, so that signals on the plurality of RLC electronic elements do not interfere with each other, thereby improving the working efficiency of the embedded device.
Alternatively, the horizontal projections of the transformer 11 and the transformer 21 on the center line between the first surface 14 and the first surface 24 completely overlap and the projection centers of the two coincide, the horizontal projections of the filter 12 and the filter 22 on the center line between the first surface 14 and the first surface 24 completely overlap and the projection centers of the two coincide, and the horizontal projections of the RLC electronic element 13 and the RLC electronic element 23 on the center line between the first surface 14 and the first surface 24 completely overlap and the projection centers of the two coincide. By arranging the transformer 11 and the transformer 21, the filter 12 and the filter 22, and the RLC electronic element 13 and the RLC electronic element 23 to be completely overlapped in horizontal projection on the center line between the two first surfaces, the components can be located on the same horizontal line, so that the arrangement rules among the components are compact, the size of the embedded device is reduced, and the production cost is reduced.
Wherein the transformer comprises a first transformer 11 and a second transformer 21; the filters include a first filter 12 and a second filter 22; the RLC electronic elements include a first RLC electronic element 13 and a second RLC electronic element 23; the first filter 12 is connected to the first transformer 11, the first transformer 11 is connected to the first RLC electronic component 13, the second filter 22 is connected to the second transformer 21, and the second transformer 21 is connected to the second RLC electronic component 23. By arranging at least two transformers, two filters and two RLC electronic elements, the connection relation among the transformers is clear, arrangement of all components is facilitated, and design and manufacturing are facilitated.
Wherein, the first filter 12 is arranged between the first transformer 11 and the first RLC electronic element 13; the second filter 22 is disposed between the second transformer 21 and the second RLC electronic element 23. The filter is arranged between the transformer and the RLC electronic element, so that design and manufacturing are facilitated.
Wherein the centerline distance between the first filter 12 and the second filter 22 is greater than the centerline distance between the first transformer 11 and the second transformer 21 and less than the centerline distance between the first RLC electronic element 13 and the second RLC electronic element 23, so that the RLC electronic elements respectively located at the substrate 10 and the substrate 20 are far away from each other, thereby reducing mutual interference. By using the components at a distance from the centerline for comparison, the comparison criteria can be unified, and the centerline distance between the first RLC electronic element 13 and the second RLC electronic element 23 is the largest, so that the RLC electronic elements are disposed at the farthest ends from the centerline, so that the RLC electronic elements on the substrate 10 and the substrate 20 are far away from each other to reach a reachable far position, and thus signals on the RLC electronic elements do not interfere with each other.
Wherein, the substrate 10 and the substrate 20 are arranged at intervals. By setting the thickness of the space between the substrate 10 and the substrate 20 according to a preset value, the size of the distance between the RLC electronic components where signals are not interfered can be designed as required.
Referring to fig. 2, fig. 2 is a schematic diagram of a substrate in an embedded device according to an embodiment of the present disclosure. The substrate 10 includes a transformer 11, a transformer 21, a transformer 110 and a transformer 210, a filter 12, a filter 22, a filter 120 and a filter 220, a power supply terminal filter 31 and a power supply terminal filter 32, a capacitor C1, a capacitor C2, a capacitor C3, a capacitor C4, a capacitor C5, a capacitor C6, an inductor L1, an inductor L2, an inductor L3, an inductor L4, a fuse FU1, a fuse FU2, a capacitor C7, a capacitor C8, an indicator lamp HL1 and an indicator lamp HL 2.
The substrate 10 includes four branches, namely a first branch including a transformer 11, a filter 12, a capacitor C1 and an inductor L1, a second branch including a transformer 21, a filter 22, a capacitor C2 and an inductor L2, a third branch including a transformer 110, a filter 120, a capacitor C3 and an inductor L3, and a fourth branch including a transformer 210, a filter 220, a capacitor C4 and an inductor L4.
The transformer comprises a transformer input coil and a transformer output coil which are mutually coupled, the filter comprises a filter input coil and a filter output coil which are mutually coupled, the transformer further comprises a transformer tap, the filter further comprises a filter tap, one end of the transformer tap of the first branch is connected with the transformer input coil, and the other end of the transformer tap is grounded after being sequentially connected with the filter, the capacitor and the inductor in series.
As shown in fig. 2, a fuse FU1, a fuse FU2, a capacitor C7, a capacitor C8, an indicator lamp HL1 and an indicator lamp HL2 are arranged between the power supply end filter and the transformer, the fuse FU1 is connected in series with the power supply end filter 31, the fuse FU2 is connected in series with the power supply end filter 32, the power supply end filter 31 is connected in parallel with the capacitor C7 and the indicator lamp HL1, and the capacitor C8 is connected in parallel with the indicator lamp HL2 with the power supply end filter 32; wherein fuse FU1 is used to protect power supply terminal filter 31 and fuse FU2 is used to protect power supply terminal filter 32. Through set up fuse FU1 and fuse FU2, electric capacity C7, electric capacity C8 and pilot lamp HL1, pilot lamp HL2 between power end filter and transformer, can be when making the power end filter for the transformer power supply, according to the design demand promote the filtering performance of power end filter and promote the security of using power end filter.
The transformer 11, the transformer 21, the transformer 110, and the transformer 210 are respectively connected to the filter 12, the filter 22, the filter 120, and the filter 220. The RLC electronic element 13 comprises a capacitor C1, a capacitor C2, a capacitor C3, a capacitor C4, a capacitor C5, a capacitor C6, an inductor L1, an inductor L2, an inductor L3 and an inductor L4 which are grounded, and common mode noise of the embedded device can be reduced. The power supply terminal filter 31 is connected with the transformer 210 and the transformer 110 through the fuse FU1, the capacitor C7 and the indicator light HL1, and the power supply terminal filter 32 is connected with the transformer 11 and the transformer 21 through the fuse FU2, the capacitor C8 and the indicator light HL2, so that noise can be filtered while power is supplied to the transformer 11, the transformer 21, the transformer 110 and the transformer 210.
The centerline distance between the capacitor C7 of the power supply terminal filter 31 of the substrate 10 and the capacitor C8 of the power supply terminal filter 32 of the other substrate 20 is greater than the centerline distance between the power supply terminal filter 31 of the substrate 10 and the power supply terminal filter 32 of the other substrate 20. By setting the distance between the capacitor C7 and the capacitor C8 of the substrate 10 and the substrate 20 to be greater than the distance between the power supply terminal filter 31 and the power supply terminal filter 32 of the substrate 10 and the substrate 20, signal interference between the capacitors in the embedded device is reduced.
In addition, another solution provided by the embodiments of the present application to solve the above problem is to provide a network transformer, which includes the above-mentioned embedded device.
Therefore, in the embodiment, the two adjacent nonfunctional surfaces of the two circuit boards are not provided with peripheral electronic elements, so that the distance between the two circuit boards can be made very small, the structure of the laminated circuit is strengthened, and the distance between the peripheral electronic elements corresponding to the two circuit boards is further increased. And by arranging the substrate 10 and the substrate 20 axisymmetrically with respect to a center line between the first surface 14 and the second surface 24, the filter 12, the transformer 11 and the RLC electronic component 13 embedded in the substrate 10, and the filter 22, the transformer 21 and the RLC electronic component 23 embedded in the substrate 20 are also axisymmetrically arranged with respect to a center line between the first surface 14 and the second surface 24 in the same manner, thereby distancing the electronic components in the embedded device and reducing signal interference between the electronic components in the embedded device.
The above embodiments are merely examples, and not intended to limit the scope of the present application, and all modifications, equivalents, and flow charts using the contents of the specification and drawings of the present application, or those directly or indirectly applied to other related arts, are included in the scope of the present application.

Claims (10)

1. An embedded device, comprising:
the transformer, the filter, the peripheral electronic element and the two substrates are arranged in a stacked mode;
the filter and the transformer are embedded in each substrate, each substrate comprises a first surface and a second surface which are arranged in a back-to-back mode, the peripheral electronic elements are not arranged on the first surfaces, and the two substrates are arranged through the first surfaces in an adjacent/connected mode.
2. The embedded device of claim 1,
the peripheral electronic element is an RLC electronic element and is arranged on the second surface of each substrate;
the two substrates and the RLC electronic elements, the transformer and the filter which are embedded in the two substrates are symmetrically arranged by taking a central line between the two first surfaces as an axis, so that the RLC electronic elements are far away from the central line, and signals on the RLC electronic elements of the two substrates are kept from interfering with each other.
3. The embedded device of claim 2,
the horizontal projections of the transformer, the filter and the RLC electronic element on the midline between the two first surfaces are completely overlapped, and the projection centers of the two are coincident.
4. The embedded device of claim 3,
the transformer comprises a first transformer and a second transformer;
the filter comprises a first filter and a second filter;
the RLC electronic elements include a first RLC electronic element and a second RLC electronic element;
the first filter is connected with the first transformer, the first transformer is connected with the first RLC electronic element, the second filter is connected with the second transformer, and the second transformer is connected with the second RLC electronic element.
5. The embedded device of claim 4,
the first filter is arranged between the first transformer and the first RLC electronic element; the second filter is disposed between the second transformer and the second RLC electronic component.
6. The embedded device of claim 5,
the middle line distance between the first filter and the second filter is larger than the middle line distance between the first transformer and the second transformer and smaller than the middle line distance between the first RLC electronic element and the second RLC electronic element, so that the RLC electronic elements respectively positioned on the two substrates are far away from each other, and mutual interference of signals is reduced.
7. The embedded device of claim 1,
the two substrates are arranged at intervals.
8. The embedded device as claimed in claim 7, wherein the embedded device comprises a plurality of power filters, two of the power filters being disposed on each of the substrates, the peripheral electronic component further comprises a fuse, a capacitor and an indicator, the power filters being connected to the transformer, the fuse, the capacitor and the indicator being disposed between the power filters and the transformer.
9. The embedded device of claim 8,
the distance between the capacitors correspondingly arranged on the two substrates is larger than the distance between the power end filters correspondingly arranged on the two substrates.
10. A network transformer comprising the embedded device of any one of claims 1-9.
CN202121393679.7U 2021-06-22 2021-06-22 Embedded device and network transformer Active CN215988284U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121393679.7U CN215988284U (en) 2021-06-22 2021-06-22 Embedded device and network transformer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121393679.7U CN215988284U (en) 2021-06-22 2021-06-22 Embedded device and network transformer

Publications (1)

Publication Number Publication Date
CN215988284U true CN215988284U (en) 2022-03-08

Family

ID=80517193

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202121393679.7U Active CN215988284U (en) 2021-06-22 2021-06-22 Embedded device and network transformer

Country Status (1)

Country Link
CN (1) CN215988284U (en)

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