CN212704360U - Capillary structure - Google Patents
Capillary structure Download PDFInfo
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- CN212704360U CN212704360U CN202020336170.8U CN202020336170U CN212704360U CN 212704360 U CN212704360 U CN 212704360U CN 202020336170 U CN202020336170 U CN 202020336170U CN 212704360 U CN212704360 U CN 212704360U
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- cuprous oxide
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Abstract
The utility model provides a capillary structure, include the copper lamination that forms with the sintering of pure copper powder, be formed by the sintering of cuprous oxide powder in the scattering body around pure copper powder, and the capillary clearance, this capillary clearance contains big clearance and little clearance, this big clearance relies on the particle diameter of pure copper powder to be greater than the particle diameter of cuprous oxide powder, form this big clearance between each granule of the pure copper powder of messenger's copper lamination, this little clearance is formed between each granule of the cuprous oxide powder of scattering the body, and the particle of the cuprous oxide powder of scattering the body scatters around the copper lamination, the part is filled in the big clearance in above-mentioned capillary clearance.
Description
Technical Field
The present invention relates to a capillary structure, and more particularly to a capillary structure with high porosity formed by sintering two different copper powders on a carrier.
Background
The conventional heat dissipation devices, such as a vapor chamber, a heat dissipation conduit, etc., have various designs for the capillary structure, and there are four common capillary structures, which are groove type, mesh type (woven), fiber type and sintered type, wherein the sintered type is the most common.
Copper powder is mostly used in the manufacturing mode of the capillary structure, the porous structure formed by sintering the copper powder, the particle size and the particle size distribution of the copper powder, and the sintering furnace temperature and time all influence the porosity of a sintering layer, the common practice at present is to improve the porosity of the capillary structure by mixing the copper powder with a hole forming agent, the manufacturing is complicated, and the porosity is not easy to control. In addition, taking the micro-heating conduit capillary structure of the sintered copper powder as an example, a central rod is placed in the center of the copper tube body, the copper powder is poured into the copper tube body, then the high-temperature sintering treatment is carried out, the copper tube body is cooled after the sintering is finished, and then the copper tube body is pulled out to form the capillary structure on the wall of the copper tube body. The manufacturing method needs to sinter the copper powder into a copper tube under the condition of partial dissolution, and also needs to avoid too low porosity and deformation of the copper tube, so that the sintering time and temperature must be accurately controlled in practice, and the manufacturing process is too complicated and has difficulty.
SUMMERY OF THE UTILITY MODEL
The main objective of the present invention is to utilize the copper powder with a non-copper particle size to produce a capillary structure with high porosity, thereby improving the heat dissipation efficiency of the capillary structure, and the porosity of the capillary structure can be easily controlled.
The secondary objective of the present invention is to form a capillary structure by sintering the slurry made of copper powder, to simplify the required process of the capillary structure before sintering, and to facilitate and effectively manufacture the capillary structure.
In order to achieve the above object, the present invention provides a capillary structure, which utilizes two different copper powders to sinter on a carrier to form a capillary structure with high porosity, the capillary structure comprises a copper lamination formed by sintering pure copper powders, a dispersion body formed around the pure copper powders by sintering cuprous oxide powders, and a capillary gap, the capillary gap comprises a large gap and a small gap, the large gap is larger than the particle diameter of the cuprous oxide powders by the particle diameter of the pure copper powders, so as to form the large gap between the particles of the pure copper powders of the copper lamination, the small gap is formed between the particles of the cuprous oxide powders of the dispersion body, and the particles of the cuprous oxide powders of the dispersion body are dispersed around the copper lamination, and the particles are partially filled in the large gap of the capillary gap.
In the above-mentioned capillary structure, the cuprous oxide powder of the spreader and the pure copper powder of the copper laminate are mixed uniformly with a coating agent to form an adhesive before sintering.
In an embodiment of the present invention, the adhesive system is coated on the substrate and sintered, so that the coating agent of the adhesive body is completely volatilized during the sintering process, thereby forming the capillary structure.
In the capillary structure, the coating agent is formed by mixing a resin, a solvent, a dispersant and a printing aid.
The utility model has the main advantages that the copper powder with the diameter of copper particles is utilized to manufacture the capillary structure with high porosity, the heat dissipation efficiency of the capillary structure is improved, and the porosity of the capillary structure can be easily controlled.
Another advantage of the present invention is that the slurry made of copper powder is sintered to form a capillary structure, thereby simplifying the manufacturing process of the capillary structure before sintering, and facilitating and effectively manufacturing.
Drawings
Fig. 1 is a flow chart of the steps of the present invention.
Fig. 2 is a schematic diagram of a Scanning Electron Microscope (SEM) capture capillary structure according to the present invention.
FIG. 3 is a schematic view of the adhesive of the present invention applied to a substrate.
Description of reference numerals: 1, pure copper powder; 2, cuprous oxide powder; 3 an adherent; 4, a carrier; 10 capillary structure.
Detailed Description
Please refer to fig. 2, the capillary structure 10 of the present invention includes a copper layer formed by sintering pure copper powder 1, a dispersion body formed by sintering cuprous oxide powder 2 around the pure copper powder 1, and a capillary gap, wherein the capillary gap includes a large gap and a small gap, the large gap is larger than the particle diameter of the cuprous oxide powder 2 by the particle diameter of the pure copper powder 1, so that the large gap is formed between the particles of the pure copper powder 1 of the copper layer, the small gap is formed between the particles of the cuprous oxide powder 2 of the dispersion body, and the particles of the cuprous oxide powder 2 of the dispersion body are dispersed around the copper layer, and are partially filled in the large gap of the capillary gap.
Referring to fig. 1 to 3, the capillary structure 10 of the present invention is manufactured according to the following steps:
step S10: the adhesive body 3 is prepared by uniformly mixing cuprous oxide powder 2, pure copper powder 1 and a coating agent, wherein the particle size of the cuprous oxide powder 2 is smaller than that of the pure copper powder 1, and the coating agent comprises resin, a solvent, a dispersing agent and a printing aid.
Step S12: coating, namely, coating, printing and the like the adhesive body 3 prepared in the step S10 on the surface of the carrier 4 on which the capillary structure 10 is to be generated.
Step S14: and sintering, wherein the sintering is performed in a protective atmosphere and a reducing atmosphere for about 1 to 8 hours, the sintering time can be properly adjusted according to the area or the thickness of the adhesive body 3 on the surface of the carrier 4, the sintering temperature is about 650 to 850 ℃, the coating agent of the adhesive body 3 is completely volatilized in the sintering process, the pure copper powder 1 is sintered to form a copper lamination layer with large gaps, the cuprous oxide powder 2 is sintered to form a dispersion body around the pure copper powder 1 and has small gaps, and the particles of the cuprous oxide powder 2 of the dispersion body are dispersed around the copper lamination layer and are partially filled in the large gaps of the capillary gaps.
Claims (2)
1. A capillary structure, comprising: the copper powder is sintered to form a copper lamination, the cuprous oxide powder is sintered to form a dispersion body around the pure copper powder, and the capillary gap comprises a large gap and a small gap, wherein the large gap is formed among the particles of the pure copper powder by means that the particle diameter of the pure copper powder is larger than that of the cuprous oxide powder, so that the large gap is formed among the particles of the pure copper powder of the copper lamination, the small gap is formed among the particles of the cuprous oxide powder of the dispersion body, and the particles of the cuprous oxide powder of the dispersion body are dispersed around the copper lamination and are partially filled in the large gap of the capillary gap.
2. The capillary structure of claim 1 wherein: the cuprous oxide powder of the scattering body and the pure copper powder of the copper lamination are uniformly mixed by coating agent to form an adhesive body before sintering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020336170.8U CN212704360U (en) | 2020-03-17 | 2020-03-17 | Capillary structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020336170.8U CN212704360U (en) | 2020-03-17 | 2020-03-17 | Capillary structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212704360U true CN212704360U (en) | 2021-03-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202020336170.8U Active CN212704360U (en) | 2020-03-17 | 2020-03-17 | Capillary structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113245543A (en) * | 2021-07-15 | 2021-08-13 | 江苏集萃先进金属材料研究所有限公司 | Copper powder, preparation method thereof and capillary core prepared from copper powder |
-
2020
- 2020-03-17 CN CN202020336170.8U patent/CN212704360U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113245543A (en) * | 2021-07-15 | 2021-08-13 | 江苏集萃先进金属材料研究所有限公司 | Copper powder, preparation method thereof and capillary core prepared from copper powder |
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