CN208444833U - Air conditioner and power device - Google Patents
Air conditioner and power device Download PDFInfo
- Publication number
- CN208444833U CN208444833U CN201820975486.4U CN201820975486U CN208444833U CN 208444833 U CN208444833 U CN 208444833U CN 201820975486 U CN201820975486 U CN 201820975486U CN 208444833 U CN208444833 U CN 208444833U
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- CN
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- Prior art keywords
- substrate
- power device
- layer
- power
- module
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of air conditioner and power devices, wherein power device includes: substrate；The insulating layer being covered on substrate；The wiring layer being formed on insulating layer；The device layer being formed on wiring layer, wherein device layer includes at least one power module and at least one control device；Cover the packaging body of substrate, insulating layer, wiring layer and device layer, wherein substrate protrudes from packaging body.As a result, by protruding from substrate except packaging body, to increase substrate and extraneous contact area, the heat-sinking capability of power device is improved, heat-sinking capability is avoided to reduce in use, the reliability of hoisting power device.
Description
Technical field
The utility model relates to electronic circuit technology field, in particular to a kind of power device and a kind of air conditioner.
Background technique
Fever is a kind of common invalidation of air conditioner failure.In the related technology, the power device of air conditioner such as intelligence
Energy power module is commonly provided with radiator, to reduce the running temperature of module, and sets between radiator and power device
There is heat-conducting cream.
But the problem of the relevant technologies, is, heat conducting paste thickness is only set as tens microns, in use, heat-conducting cream meeting
Weathering phenomenon is generated over time, and thermal conductivity reduces, and influences the reliability service of power device.
Utility model content
The utility model is intended to solve one of the technical problem in above-mentioned technology at least to a certain extent.For this purpose, this reality
It is to propose a kind of power device with a novel purpose, it is ensured that the heat-sinking capability of power device avoids heat-sinking capability from making
With reducing in the process.
Second purpose of the utility model is to propose a kind of air conditioner.
In order to achieve the above objectives, a kind of power device that the utility model first aspect proposes includes: substrate；It is covered in institute
State the insulating layer on substrate；The wiring layer being formed on the insulating layer；The device layer being formed on the wiring layer,
Wherein, the device layer includes at least one power module and at least one control device；Cover the substrate, insulating layer, cloth
The packaging body of line layer and device layer, wherein the substrate protrudes from the packaging body.
According to the utility model proposes power device, by protruding from substrate except packaging body, to increase substrate
With extraneous contact area, the heat-sinking capability of power device is improved, heat-sinking capability is avoided to reduce in use, hoisting power device
The reliability of part.
In addition, can also have the following additional technical features: according to the utility model power device set forth above
In some instances, the power device further include: the radiator under the substrate is set.
In some instances, the power device further include: the thermally conductive sheet between the radiator and substrate is set.
In some instances, the thermally conductive sheet is plasticity thermally conductive sheet.
In some instances, the substrate is metal substrate.
In some instances, at least one described power module include rectifier bridge, PFC module, driven compressor module and
Blower drive module.
In some instances, at least one described control device includes compressor control chip and air-blower control chip.
In order to achieve the above objectives, the utility model second aspect proposes a kind of air conditioner comprising above-mentioned power device.
According to the utility model proposes air conditioner, using above-mentioned power device, by by substrate protrude from packaging body it
Outside, to increase substrate and extraneous contact area, the heat-sinking capability of power device is improved, avoids heat-sinking capability in use
It reduces, the reliability of hoisting power device.
The additional aspect of the utility model and advantage will be set forth in part in the description, partially will be from following description
In become obvious, or recognized by the practice of the utility model.
Detailed description of the invention
The utility model is above-mentioned and/or additional aspect and advantage from the following description of the accompanying drawings of embodiments will
Become obvious and be readily appreciated that, wherein
Fig. 1 is the block diagram according to the power device of the utility model embodiment；
Fig. 2 is the structural schematic diagram according to the power device of one specific embodiment of the utility model；
Fig. 3 is the block diagram according to the power device of the utility model one embodiment；
Fig. 4 is the block diagram according to the power device of the utility model another embodiment；
Fig. 5 is the structural schematic diagram according to the power device of the utility model another specific embodiment；
Fig. 6 is the block diagram according to the air conditioner of the utility model embodiment.
Specific embodiment
The embodiments of the present invention are described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, it is intended to for explaining the utility model, and should not be understood as to the utility model
Limitation.
The air conditioner and power device of the utility model embodiment described with reference to the accompanying drawing.
Fig. 1 is the block diagram according to the power device of the utility model embodiment.
As shown in Figure 1, power device 100 includes: substrate 1, insulating layer 2, wiring layer 3, device layer 4 and packaging body 5.
Specifically, as shown in Fig. 2, insulating layer 2 is covered on substrate 1；Wiring layer 3 is formed on insulating layer 2；Device
Layer 4 is formed on wiring layer 3, wherein device layer 4 includes at least one power module 41 and at least one control device 42；
Packaging body 5 covers substrate 1, insulating layer 2, wiring layer 3 and device layer 4, wherein substrate 1 protrudes from packaging body 5.
Further, as shown in Fig. 2, at least one power module 41 and at least one control device 42 can pass through metal binding
Line a is connected, and optionally, multiple pin b can be also drawn from wiring layer 3.
It is understood that can be by protruding from substrate 1 except packaging body 5, increase substrate 1 and extraneous contact area,
The heat-sinking capability for improving power device 100, thus the reliability of hoisting power device 100.
Further, as shown in figure 3, power device 100 further include: the radiator 6 under substrate 1 is arranged in.
That is, radiator 6 can be arranged under substrate 1, to improve the heat-sinking capability of power device 100, mention
The reliability of power per liter device.
Further, as shown in figure 4, power device 100 further include: the thermally conductive sheet between radiator 6 and substrate 1 is arranged in
7。
That is, can be attached by thermally conductive sheet 7 between radiator 6 and substrate 1, i.e., power device 100 is worked
The heat that period generates is thermally conductive to radiator 6 by thermally conductive sheet 7 from substrate 1, further increases the heat radiation energy of power device 100
Power, the reliability of hoisting power device 100.
Further, thermally conductive sheet 7 is plasticity thermally conductive sheet.
Specifically, can be incited somebody to action by having the thermally conductive sheet 7 of compliance profiles when substrate 1 is radiated by radiator 6
Substrate 1 and radiator 6 realize seamless connection as shown in Figure 5, improve the bonding tightness of substrate 1 and radiator 6, and then improve
The heat-sinking capability of power device 100, the reliability of hoisting power device 100.
In addition, heat can be generated in 100 course of normal operation of power device, thermally conductive sheet 7 is become into solid state, thus
Extend the service life of thermally conductive sheet 7, the reliability of hoisting power device 100.
Specifically, the substrate 1 of the power device 100 of the utility model embodiment protrudes from packaging body 5, i.e. power device
100 bottom be it is non-planar, when by radiator 6 be power device 100 radiate when, can pass through thermally conductive sheet 7 improve 6 He of radiator
The conjugation of power device 100, thus the heat dissipation performance of hoisting power device 100, simultaneously as thermally conductive sheet 7 is led for plasticity
Thermally conductive sheet 7 can be solidified when power device 100 carries out automatically controlled work for the first time, be not likely to produce thermally conductive sheet 7 by backing
Weathering phenomenon promotes the service life of thermally conductive sheet 7, and then the reliability of hoisting power device 100.
Further, substrate 1 is metal substrate.
It that is, substrate 1 can be set to the metal substrate of high heat conductance, lead to the heat on substrate 1 can preferably
It is thermally conductive to radiator 6 to cross thermally conductive sheet 7, so that the heat-sinking capability of power device 100 is improved, the reliability of hoisting power device 100.
Further, at least one power module 41 includes that rectifier bridge, PFC module, driven compressor module and blower drive
Dynamic model block.
It is understood that rectifier bridge, PFC module, driven compressor module and blower drive module may make up power device
The power module region of part 100.
Wherein, rectifier bridge is connected with PFC module, and specifically, the electric current after PFC module can be rectified according to rectifier bridge carries out function
Rate factor correcting.
Further, at least one control device 42 includes compressor control chip and air-blower control chip.
It is understood that compressor control chip and air-blower control chip may make up the control module of power device 100
Region.
Wherein, compressor control chip is connected with driven compressor module, air-blower control chip and blower drive module phase
Even, specifically, to drive compressor, air-blower control chip controls blower drives compressor control chip controls driven compressor module
Dynamic model block is to drive blower.
To sum up, the power device proposed according to the utility model embodiment, by the way that substrate is protruded from except packaging body, from
And increase substrate and extraneous contact area, and the heat-sinking capability of power device is improved, avoiding heat-sinking capability in use reduces,
The reliability of hoisting power device.
Fig. 6 is the block diagram according to the air conditioner of utility model embodiment.As shown in fig. 6, the air conditioner 1000 wraps
Include the power device 100 of above-described embodiment.
According to the utility model proposes air conditioner, using above-mentioned power device, by by substrate protrude from packaging body it
Outside, to increase substrate and extraneous contact area, the heat-sinking capability of power device is improved, avoids heat-sinking capability in use
It reduces, the reliability of hoisting power device.
In the description of the present invention, it should be understood that term " center ", " longitudinal direction ", " transverse direction ", " length ", " width
Degree ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside",
The orientation or positional relationship of the instructions such as " clockwise ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " is based on the figure
Orientation or positional relationship is merely for convenience of describing the present invention and simplifying the description, rather than the dress of indication or suggestion meaning
It sets or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to the utility model
Limitation.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.The meaning of " plurality " is two or two in the description of the present invention,
More than, unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " Gu
It is fixed " etc. terms shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be
Mechanical connection, is also possible to be electrically connected；It can be directly connected, two can also be can be indirectly connected through an intermediary
The interaction relationship of connection or two elements inside element.It for the ordinary skill in the art, can basis
Concrete condition understands the concrete meaning of above-mentioned term in the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature is in the second feature " on " or " down "
It can be that the first and second features directly contact or the first and second features are by intermediary mediate contact.Moreover, first is special
Sign can be fisrt feature above the second feature " above ", " above " and " above " and be directly above or diagonally above the second feature, or only
Indicate that first feature horizontal height is higher than second feature.Fisrt feature under the second feature " below ", " below " and " below " can be with
It is that fisrt feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is contained at least one embodiment or example of the utility model.In the present specification, to the schematic table of above-mentioned term
It states and is necessarily directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be with
It can be combined in any suitable manner in any one or more of the embodiments or examples.In addition, without conflicting with each other, this field
Technical staff can by the feature of different embodiments or examples described in this specification and different embodiments or examples into
Row combination and combination.
Although the embodiments of the present invention have been shown and described above, it is to be understood that above-described embodiment is
Illustratively, it should not be understood as limiting the present invention, those skilled in the art are in the scope of the utility model
Inside it can make changes, modifications, alterations, and variations to the above described embodiments.
Claims (8)
1. a kind of power device characterized by comprising
Substrate；
The insulating layer being covered on the substrate；
The wiring layer being formed on the insulating layer；
The device layer being formed on the wiring layer, wherein the device layer includes at least one power module and at least one
A control device；
Cover the packaging body of the substrate, insulating layer, wiring layer and device layer, wherein the substrate protrudes from the packaging body.
2. power device as described in claim 1, which is characterized in that further include:
Radiator under the substrate is set.
3. power device as claimed in claim 2, which is characterized in that further include:
Thermally conductive sheet between the radiator and substrate is set.
4. power device as claimed in claim 3, which is characterized in that the thermally conductive sheet is plasticity thermally conductive sheet.
5. power device as described in claim 1, which is characterized in that the substrate is metal substrate.
6. power device as described in claim 1, which is characterized in that at least one described power module includes rectifier bridge, PFC
Module, driven compressor module and blower drive module.
7. power device as described in claim 1, which is characterized in that at least one described control device includes compressor control
Chip and air-blower control chip.
8. a kind of air conditioner, which is characterized in that including such as described in any item power devices of claim 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820975486.4U CN208444833U (en) | 2018-06-22 | 2018-06-22 | Air conditioner and power device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820975486.4U CN208444833U (en) | 2018-06-22 | 2018-06-22 | Air conditioner and power device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208444833U true CN208444833U (en) | 2019-01-29 |
Family
ID=65090787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820975486.4U Active CN208444833U (en) | 2018-06-22 | 2018-06-22 | Air conditioner and power device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208444833U (en) |
-
2018
- 2018-06-22 CN CN201820975486.4U patent/CN208444833U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230113 Address after: 400064 plant 1, No. 70, Meijia Road, Nan'an District, Chongqing Patentee after: Meiken Semiconductor Technology Co.,Ltd. Address before: 528311 Lingang Road, Beijiao Town, Shunde District, Foshan, Guangdong Patentee before: GD MIDEA AIR-CONDITIONING EQUIPMENT Co.,Ltd. Patentee before: MIDEA GROUP Co.,Ltd. |