CN206167022U - Semiconductor cold therapy appearance - Google Patents

Semiconductor cold therapy appearance Download PDF

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Publication number
CN206167022U
CN206167022U CN201620900020.9U CN201620900020U CN206167022U CN 206167022 U CN206167022 U CN 206167022U CN 201620900020 U CN201620900020 U CN 201620900020U CN 206167022 U CN206167022 U CN 206167022U
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CN
China
Prior art keywords
semiconductor
cold
therapeutic apparatus
semiconductor cooler
freeze
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201620900020.9U
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Chinese (zh)
Inventor
卓凡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lincang Medical Equipment Co Ltd
Original Assignee
Lincang Medical Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lincang Medical Equipment Co Ltd filed Critical Lincang Medical Equipment Co Ltd
Priority to CN201620900020.9U priority Critical patent/CN206167022U/en
Application granted granted Critical
Publication of CN206167022U publication Critical patent/CN206167022U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model provides a semiconductor cold therapy appearance, semiconductor cold therapy appearance includes that therapeutic instrument body, semiconductor cooler and the different cold of a plurality of effective area treat the probe. A plurality of colds treat the probe swing joint in the one end of therapeutic instrument body, semiconductor cooler set up in the therapeutic instrument is originally internal, semiconductor cooler's cold junction is hugged closely the therapeutic instrument body with probe swing joint's one end is treated in a plurality of colds. The utility model discloses a transportation that semiconductor refrigeration had avoided the liquid nitrogen refrigeration to bring is inconvenient, treats the probe and has satisfied the freezing demand that has the focus of different areas through setting up a plurality of colds that have different effective area.

Description

Semiconductor freeze therapeutic apparatus
Technical field
The utility model is related to medical instruments field, in particular to a kind of semiconductor freeze therapeutic apparatus.
Background technology
Cold therapy is a kind of freezing by local organization, controllably destroys or removal lesion tissue is to reach treatment The treatment method of purpose.Existing freeze therapeutic apparatus are realized using the method for liquid nitrogen refrigerating mostly, but the transport of liquid nitrogen is extremely Inconvenience, and with certain danger.
Utility model content
In view of this, the utility model embodiment provides a kind of semiconductor freeze therapeutic apparatus, to solve the above problems.
To achieve these goals, the utility model embodiment is adopted the following technical scheme that:
A kind of semiconductor freeze therapeutic apparatus, the semiconductor freeze therapeutic apparatus include therapeutic equipment body, semiconductor cooler Popped one's head in cold treatment of the multiple with different effective areas;
The multiple cold treatment probe is movably connected on one end of the therapeutic equipment body, and the semiconductor cooler is arranged at In the therapeutic equipment body, the cold end of the semiconductor cooler is close to the therapeutic equipment body and is lived with the multiple cold probe for the treatment of One end of dynamic connection.
Preferably, the semiconductor cooler includes multi-stage refrigerating piece, and the multi-stage refrigerating piece is in parallel.
Preferably, electric-insulation heat-conduction layer is provided between cooling piece described in adjacent two-stage.
Preferably, cooling piece described in every one-level includes multiple PN junction galvanic couples, the multiple PN junction galvanic couple series connection.
Preferably, the cold end of each PN junction galvanic couple and hot junction are respectively arranged with thermal conductive ceramic plate, the thermal conductive ceramic The surface smear of piece has heat-conducting silicone grease.
Preferably, between the cold end of each PN junction galvanic couple and hot junction filled with heat-barrier material.
Preferably, radiator and cooler are additionally provided with the therapeutic equipment body, the radiator is arranged at described half The hot junction of conductor refrigerator, the cooler is arranged at the cold end of the semiconductor cooler.
Preferably, the semiconductor freeze therapeutic apparatus also include that the semiconductor freeze therapeutic apparatus also include detection described half The hot junction of conductor refrigerator and the temperature measuring unit of the temperature data of cold end, and the semiconductor is controlled according to the temperature data The supply voltage of refrigerator, so that the temperature in the cold end of the semiconductor cooler and hot junction reaches the centre of preset temperature value Reason device;
The central processing unit and temperature measuring unit are arranged at the therapeutic equipment body, the temperature measuring unit and semiconductor refrigerating Device is electrically connected with the central processing unit respectively;The temperature measuring unit includes multiple temperature sensors, and the multiple temperature is passed Sensor is arranged at cold end and the hot junction of the semiconductor cooler.
Preferably, the semiconductor freeze therapeutic apparatus also include that the semiconductor freeze therapeutic apparatus are also included from the center Processor obtains the temperature data and the display unit for being shown, the display unit is arranged at the therapeutic equipment body, And be electrically connected with the central processing unit.
Preferably, the semiconductor freeze therapeutic apparatus also include obtaining the temperature data from the central processing unit, and The temperature data of the semiconductor cooler cold end is compared with the first preset temperature threshold value, by the semiconductor cooler The temperature data in hot junction is compared with the second preset temperature threshold value, when the temperature data of the semiconductor cooler cold end exceedes The temperature data in the first preset temperature threshold value or the semiconductor cooler hot junction exceedes the second preset temperature threshold The alarm unit alarmed during value, the alarm unit is electrically connected with the central processing unit.
The semiconductor freeze therapeutic apparatus that the utility model embodiment is provided are freezed using semiconductor, it is to avoid use liquid The transport inconvenience that nitrogen refrigeration band is come.Popped one's head in by setting multiple cold treatments with different effective areas, can met with difference The freezing demand of the focus of area.
Brief description of the drawings
In order to illustrate more clearly of the technical scheme of the utility model embodiment, below will be to be used needed for embodiment Accompanying drawing be briefly described, it will be appreciated that the following drawings illustrate only some embodiments of the present utility model, therefore should not be by Regard the restriction to scope as, for those of ordinary skill in the art, on the premise of not paying creative work, may be used also Other related accompanying drawings are obtained with according to these accompanying drawings.
A kind of structural representation of semiconductor freeze therapeutic apparatus that Fig. 1 is provided for the utility model embodiment.
A kind of internal structure schematic diagram of cooling piece that Fig. 2 is provided for the utility model embodiment.
A kind of internal structure schematic diagram of PN junction galvanic couple that Fig. 3 is provided for the utility model embodiment.
A kind of annexation schematic diagram of central processing unit that Fig. 4 is provided for the utility model embodiment.
Reference:
Specific embodiment
It is new below in conjunction with this practicality to make the purpose, technical scheme and advantage of the utility model embodiment clearer Accompanying drawing in type embodiment, is clearly and completely described, it is clear that retouched to the technical scheme in the utility model embodiment The embodiment stated is a part of embodiment of the utility model, rather than whole embodiments.Generally described in accompanying drawing herein and The component of the utility model embodiment for showing can be arranged and designed with a variety of configurations.
Therefore, the detailed description of embodiment of the present utility model below to providing in the accompanying drawings is not intended to limit requirement The scope of the present utility model of protection, but it is merely representative of selected embodiment of the present utility model.Based in the utility model Embodiment, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, all Belong to the scope of the utility model protection.
It should be noted that:Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi It is defined in individual accompanying drawing, then it need not be further defined and explained in subsequent accompanying drawing.
A kind of semiconductor freeze therapeutic apparatus 100 that Fig. 1 is provided for the utility model embodiment.As shown in figure 1, described partly lead Body freeze therapeutic apparatus 100 include therapeutic equipment body 110, semiconductor cooler 120 and multiple cold treatment probes 130.
Wherein, the multiple cold probe 130 for the treatment of has different effective areas.It should be noted that described herein has Effect area refers specifically to the cold probe 130 for the treatment of to be used for focal contact so as to reach the area of refrigerating effect.Alternatively, each institute Stating cold probe 130 for the treatment of can also have different shapes.By taking the cold therapy of body surface lesion as an example, in practical application, needing The position for carrying out cold therapy is not of uniform size.By setting the cold treatment probe 130 that multiple shapes and effective area are differed, energy Enough better meet the Treatment need at different lesions position.
The multiple cold treatment probe 130 is movably connected on one end of the therapeutic equipment body 110, the semiconductor cooler 120 are arranged in the therapeutic equipment body 110, and the semiconductor cooler 120 includes cold end and hot junction, the semiconductor refrigerating The cold end of device 120 is close to one end that the therapeutic equipment body 110 is flexibly connected with the multiple cold treatment probe 130.
Alternatively, the multiple cold treatment probe 130 is easy in cold treatment with the therapeutic equipment body 110 to be detachably connected When probe 130 breaks down, the cold treatment probe 130 is disassembled and is repaired or is changed, be easy to the semiconductor cooling Freeze the long-term use of therapeutic equipment 100.
Alternatively, the therapeutic equipment body 110 can be the interior cube for being provided with cavity, and the cube is by insulating heat-conductive Material is made, and the multiple cold probe 130 for the treatment of is flexibly connected by connector with the therapeutic equipment body 110, the connector Inside be made from a material that be thermally conductive, the outer surface of the connector is equipped with heat-insulating material, so as to the semiconductor cooler 120 The cold that produces of cold end multiple cold treatments only passed to by the Heat Conduction Material of the inside of the connector pop one's head in 130.Alternatively, The connector can be elongated flexible tube.
It is the PN junction galvanic couple 122 as shown in Figure 3 that the utility model embodiment is provided also referring to Fig. 2 and Fig. 3, Fig. 2 The cooling piece 121 of composition.The semiconductor cooler 120 can include the multistage cooling piece 121, the multistage cooling piece 121 is parallel with one another, and electric-insulation heat-conduction layer is provided between cooling piece 121 described in adjacent the two poles of the earth.Fig. 2 is referred to, per one-level institute Stating cooling piece 121 includes multiple PN junction galvanic couples 122, and the multiple PN junction galvanic couple 122 is connected.
Referring again to Fig. 3, the cold end of each PN junction galvanic couple 122 and hot junction are respectively arranged with thermal conductive ceramic plate 123, institute The surface smear for stating thermal conductive ceramic plate 123 has heat-conducting silicone grease.It is filled between the cold end of each PN junction galvanic couple 122 and hot junction Heat-barrier material.Wherein, the cold end of multiple PN junction galvanic couples 122 constitutes the cold end of the cooling piece 121, the multiple PN junction galvanic couple 122 hot junction constitutes the hot junction of the cooling piece 121.
During implementation, electric current has excess electron by the PN junction galvanic couple 122 in N-type semiconductor, forms negative thermoelectric force.P Electron deficiency in type semiconductor, forms positive thermoelectric force.When electronics flow to N-type semiconductor from P-type semiconductor, corresponding node Temperature reduction, its energy is necessarily increased, and the energy that increased energy equivalence is consumed in node.On the contrary, working as electronics When flowing to the P-type semiconductor from N-type semiconductor, the temperature of corresponding node can be raised.Refer to Fig. 3, the sense of current be from N to The node of P, temperature drop and absorbs heat, used as cold end.The sense of current is the node from P to N, and temperature rises and heat release, makees It is hot junction.
By above-mentioned design, realize semiconductor refrigerating, it is to avoid using the inconvenience in the transport that liquid nitrogen refrigerating brings.
According to the actual requirements, alternatively, the semiconductor freeze therapeutic apparatus 100 also include radiator and cold guide apparatus, institute State radiator and cold guide apparatus are arranged in the therapeutic equipment body 110.The radiator is arranged at the semiconductor cooler 120 hot junction, the cold guide apparatus are arranged at the cold end of the semiconductor cooler 120.
Wherein, the radiator can be heat-pipe radiator, be cooled down using natural convection air.Alternatively, the heat pipe The shell material of radiator can be red copper.The cold guide apparatus can be heat transfer substrate and the spaced refrigeration heat of Duo Gen Pipe.The heat-transfer surface of the heat transfer substrate is fitted with the cold end of the semiconductor cooler 120, the middle part of every refrigeration heat pipe and institute State heat transfer substrate to be fixedly connected, preset length is extended in the every two ends of refrigeration heat pipe along the heat transfer substrate respectively, and respectively It is bent to the two sides for stating heat transfer substrate.By above-mentioned setting, it is possible to use many refrigeration heat pipes equably conduct described The cold of the cold end of semiconductor cooler 120.
Alternatively, as shown in figure 4, the semiconductor freeze therapeutic apparatus 100 also include being arranged at above-mentioned therapeutic equipment body 110 In central processing unit 140 and temperature measuring unit 150, the temperature measuring unit 150 and semiconductor cooler 120 respectively with the center Processor 140 is electrically connected with.The temperature measuring unit 150 includes multiple temperature sensors, and the multiple temperature sensor sets respectively It is placed in cold end and the hot junction of the semiconductor cooler 120, hot junction and cold end for detecting the semiconductor cooler 120 Temperature data, and it is sent to the central processing unit 140.The central processing unit 140, will after the temperature data is received The temperature of the cold end of the semiconductor cooler 120 is compared with default cold junction temperature value, if both differences are more than 0.5 DEG C, then the supply voltage of the semiconductor cooler 120 is adjusted, so that the temperature of the cold end of the semiconductor cooler 120 reaches To default cold junction temperature value.Because the cold end of semiconductor cooler 120 and the temperature in hot junction are associated, the semiconductors The temperature in the hot junction of refrigerator 120 also reaches corresponding preset temperature value.
Alternatively, the semiconductor freeze therapeutic apparatus 100 also include being arranged at the display unit of the therapeutic equipment body 110 160, the display unit 160 is electrically connected with the central processing unit 140.Alternatively, the display unit 160 is arranged at institute State the lateral surface of therapeutic equipment body 110.The display unit 160 is used to obtain in real time the cold end of the semiconductor cooler 120 With the temperature data in hot junction, and shown, to facilitate user to be adjusted according to the temperature data of display.
It should be noted that the semiconductor freeze therapeutic apparatus 100 are also provided with input block 190, the input Unit 190 can be the button on the surface for being arranged at the therapeutic equipment body 110, it is also possible to set the display unit 160 It is touch-screen, allows the user to be input into preset temperature value by the touch-screen.
Alternatively, the semiconductor freeze therapeutic apparatus 100 can also include alarm unit 170, and the alarm unit 170 sets The therapeutic equipment body 110 is placed in, and is electrically connected with the central processing unit 140.
Alternatively, the alarm unit 170 can be LED, be arranged at the surface of the therapeutic equipment body 110.It is described Alarm unit 170 can also be buzzer, and the surface that the buzzer can both be arranged at the therapeutic equipment body 110 can also It is arranged in the therapeutic equipment body 110.
According to the actual requirements, alternatively, the semiconductor freeze therapeutic apparatus 100 can also include and the central processing unit 140 communication units 180 being electrically connected with, the communication unit 180 can be communicated with intelligent terminal.Intelligence described herein Terminal includes mobile phone, panel computer etc., but not limited to this.User can be freezed to the semiconductor by the intelligent terminal and be controlled Treat instrument 100 to be remotely controlled, it is also possible to obtain the semiconductor cooler in real time from central processing unit 140 by the intelligent terminal 120 cold end and the temperature data in hot junction are shown.
In sum, the semiconductor freeze therapeutic apparatus 100 that the utility model embodiment is provided have abandoned traditional liquid nitrogen system Cold mode, according to Peltier effect principle, freezed using semiconductor, it is to avoid the inconvenience of transporting liquid nitrogen band.It is logical Cross and multiple cold treatment probes 130 with different effective areas are set, meet the cold treatment demand of the focus of different area.By setting Temperature measuring unit 150, display unit 160 and alarm unit 170 are put, the automatic of the semiconductor freeze therapeutic apparatus 100 is realized Temperature control, substantially increases the convenience of the semiconductor freeze therapeutic apparatus 100.
, it is necessary to explanation in description of the present utility model, term " on ", D score, " interior ", the orientation of the instruction such as " outward " Or position relationship is that, based on orientation shown in the drawings or position relationship, or the utility model product is usually put when using Orientation or position relationship, are for only for ease of description the utility model and simplify description, rather than the dress for indicating or implying meaning Put or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to the utility model Limitation.Additionally, term " first ", " second " etc. are only used for distinguishing description, and it is not intended that indicating or implying relatively important Property.
In description of the present utility model, in addition it is also necessary to explanation, term " setting ", " connection ", " connected ", " connection " are answered It is interpreted broadly, for example, it may be being fixedly connected, or being detachably connected, or is integrally connected;Can be that machinery connects Connect, or electrically connect;Can be joined directly together, it is also possible to be indirectly connected to by intermediary, can be in two elements The connection in portion.For the ordinary skill in the art, can understand above-mentioned term in the utility model with concrete condition Concrete meaning.
Obviously, those skilled in the art should be understood that the function of above-mentioned the utility model embodiment can be with general Computing device realize that they can be concentrated on single computing device, or be distributed in multiple computing devices and constituted Network on, alternatively, the existing program code or algorithm that they can be can perform with computing device be realized, it is thus possible to It is stored in being performed by computing device in storage device, or they is fabricated to each integrated circuit modules respectively, Or be fabricated to single integrated circuit module to realize by the multiple modules or step in them.So, work(of the present utility model Can realize that being not restricted to any specific hardware and software combines.
Preferred embodiment of the present utility model is the foregoing is only, the utility model is not limited to, for this For the technical staff in field, the utility model can have various modifications and variations.It is all it is of the present utility model spirit and principle Within, any modification, equivalent substitution and improvements made etc. should be included within protection domain of the present utility model.

Claims (10)

1. a kind of semiconductor freeze therapeutic apparatus, it is characterised in that, the semiconductor freeze therapeutic apparatus include therapeutic equipment body, partly lead Chiller and multiple cold treatments with different effective areas are popped one's head in;
The therapeutic equipment body is made up of insulating heat-conduction material, and the multiple cold treatment probe is movably connected on the therapeutic equipment body One end, the semiconductor cooler is arranged in the therapeutic equipment body, and the cold end of the semiconductor cooler is close to described One end that therapeutic equipment body is flexibly connected with the multiple cold treatment probe.
2. semiconductor freeze therapeutic apparatus according to claim 1, it is characterised in that the semiconductor cooler includes multistage Cooling piece, the multi-stage refrigerating piece is in parallel.
3. semiconductor freeze therapeutic apparatus according to claim 2, it is characterised in that between cooling piece described in adjacent two-stage It is provided with electric-insulation heat-conduction layer.
4. semiconductor freeze therapeutic apparatus according to claim 2, it is characterised in that cooling piece includes multiple described in per one-level PN junction galvanic couple, the multiple PN junction galvanic couple series connection.
5. semiconductor freeze therapeutic apparatus according to claim 4, it is characterised in that the cold end of each PN junction galvanic couple and Hot junction is respectively arranged with thermal conductive ceramic plate, and the surface smear of the thermal conductive ceramic plate has heat-conducting silicone grease.
6. semiconductor freeze therapeutic apparatus according to claim 5, it is characterised in that the cold end of each PN junction galvanic couple and Heat-barrier material is filled between hot junction.
7. semiconductor freeze therapeutic apparatus according to claim 6, it is characterised in that be additionally provided with the therapeutic equipment body scattered Hot device and cold guide apparatus, the radiator are arranged at the hot junction of the semiconductor cooler, and the cold guide apparatus are arranged at described The cold end of semiconductor cooler.
8. semiconductor freeze therapeutic apparatus according to claim 1-7 any one, it is characterised in that the semiconductor freezing Therapeutic equipment also includes the temperature measuring unit of the hot junction of the detection semiconductor cooler and the temperature data of cold end, and according to described Temperature data controls the supply voltage of the semiconductor cooler, so that the temperature in the cold end of the semiconductor cooler and hot junction Reach the central processing unit of preset temperature value;
The central processing unit and temperature measuring unit are arranged at the therapeutic equipment body, the temperature measuring unit and semiconductor cooler point It is not electrically connected with the central processing unit;The temperature measuring unit includes multiple temperature sensors, the multiple temperature sensor It is arranged at cold end and the hot junction of the semiconductor cooler.
9. semiconductor freeze therapeutic apparatus according to claim 8, it is characterised in that the semiconductor freeze therapeutic apparatus are also wrapped Include from the central processing unit and obtain the temperature data and the display unit for being shown, the display unit is arranged at described Therapeutic equipment body, and be electrically connected with the central processing unit.
10. semiconductor freeze therapeutic apparatus according to claim 9, it is characterised in that the semiconductor freeze therapeutic apparatus are also Including obtaining the temperature data from the central processing unit, and by the temperature data and first of the semiconductor cooler cold end Preset temperature threshold value is compared, and the temperature data in the semiconductor cooler hot junction is compared with the second preset temperature threshold value Compared with when the temperature data of the semiconductor cooler cold end exceedes the first preset temperature threshold value or the semiconductor refrigerating The temperature data in device hot junction exceedes the alarm unit alarmed during the second preset temperature threshold value, the alarm unit and institute State central processing unit electric connection.
CN201620900020.9U 2016-08-18 2016-08-18 Semiconductor cold therapy appearance Expired - Fee Related CN206167022U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620900020.9U CN206167022U (en) 2016-08-18 2016-08-18 Semiconductor cold therapy appearance

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Application Number Priority Date Filing Date Title
CN201620900020.9U CN206167022U (en) 2016-08-18 2016-08-18 Semiconductor cold therapy appearance

Publications (1)

Publication Number Publication Date
CN206167022U true CN206167022U (en) 2017-05-17

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106264706A (en) * 2016-08-18 2017-01-04 临沧慈康医疗器械有限公司 Quasiconductor freeze therapeutic apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106264706A (en) * 2016-08-18 2017-01-04 临沧慈康医疗器械有限公司 Quasiconductor freeze therapeutic apparatus

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170517

Termination date: 20190818

CF01 Termination of patent right due to non-payment of annual fee