CN205546176U - Graphite alkene heat dissipation type screened film - Google Patents
Graphite alkene heat dissipation type screened film Download PDFInfo
- Publication number
- CN205546176U CN205546176U CN201620033742.9U CN201620033742U CN205546176U CN 205546176 U CN205546176 U CN 205546176U CN 201620033742 U CN201620033742 U CN 201620033742U CN 205546176 U CN205546176 U CN 205546176U
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- Prior art keywords
- layer
- film
- graphene heat
- screened film
- heat dissipation
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- 230000017525 heat dissipation Effects 0.000 title abstract description 12
- -1 Graphite alkene Chemical class 0.000 title abstract 10
- 229910002804 graphite Inorganic materials 0.000 title abstract 10
- 239000010439 graphite Substances 0.000 title abstract 10
- 239000010410 layer Substances 0.000 claims abstract description 132
- 239000010408 film Substances 0.000 claims abstract description 67
- 239000012790 adhesive layer Substances 0.000 claims abstract description 24
- 239000010409 thin film Substances 0.000 claims abstract description 22
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 10
- 229910021389 graphene Inorganic materials 0.000 claims description 48
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 44
- 239000000843 powder Substances 0.000 claims description 17
- 229920002545 silicone oil Polymers 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 7
- 239000004925 Acrylic resin Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 229920001971 elastomer Polymers 0.000 claims description 6
- 229920001225 polyester resin Polymers 0.000 claims description 6
- 239000004645 polyester resin Substances 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 3
- 229920002799 BoPET Polymers 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920003986 novolac Polymers 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000009719 polyimide resin Substances 0.000 claims description 3
- 229920005749 polyurethane resin Polymers 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 abstract 3
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Abstract
The utility model relates to a screened film technical field, concretely relates to graphite alkene heat dissipation type screened film, including the carrier thin film layer, coat carrier thin film layer upper surface the printing ink layer, coat printing ink layer upper surface graphite alkene heat dissipation layer, coat the electrically conductive gluing layer of graphite alkene heat dissipation layer upper surface. The utility model discloses a graphite alkene heat dissipation type screened film has good insulating nature through adopting the printing ink layer, the utility model discloses a graphite alkene heat dissipation type screened film has good heat conduction, thermal diffusivity through adopting graphite alkene heat dissipation layer, and shielding property is good, the utility model discloses a graphite alkene heat dissipation type screened film is through adopting electrically conductive gluing agent layer, and it can to have excellent conduction, the utility model discloses an adopt printing ink layer and electrically conductive gluing agent layer, have fabulous pliability, can satisfy the compliance requirement of flexible line way board trade. The utility model discloses a graphite alkene heat dissipation type screened film thickness is ultra -thin, printing ink layer, graphite alkene heat dissipation layer and the minimum 8 -16 mu m that is of conductive adhesive layer gross thickness.
Description
Technical field
This utility model relates to screened film technical field, is specifically related to a kind of Graphene heat radiating type screened film.
Background technology
Printed substrate is material indispensable in electronic product, it is widely used at present in computer and ancillary equipment, communication product and consumption electronic products, along with consumption electronic products demand sustainable growth, the requirement for printed circuit board (PCB) also grows with each passing day.
In flexible print circuit board industry, along with the update of the electronic equipment such as smart mobile phone, Ipad, the requirement to electromagnetic shielding is more and more higher.In the course of processing of flexible circuit board, circuit will use electromagnetic shielding membrane material in large quantities.
Now with the raising of the whole integrated level of wiring board, while considering excellent shielding, the heat dissipation problem that also can consider.For preferably solving this problem, in the urgent need to a kind of Novel shielding film product.
Summary of the invention
In order to overcome shortcoming and defect present in prior art, the purpose of this utility model is to provide a kind of good heat dissipation effect and the thin Graphene heat radiating type screened film of thickness.
The purpose of this utility model is achieved through the following technical solutions: a kind of Graphene heat radiating type screened film, the ink layer including carrier film layer, coating carrier film layer upper surface, the Graphene heat dissipating layer coating ink layer upper surface, coats the conduction adhesive layer of Graphene heat dissipating layer upper surface.
Further, described carrier film layer is high molecular polymer thin film.
Further, described high molecular polymer thin film is any one of PET film, PEN thin film, PI thin film, PBT thin film and PPS thin film.
Further, any one during described ink layer is epoxy resin ink layer, polyacrylic resin ink layer, modified rubber ink layer, phenolic resin ink layer, polyester resin ink layer and polyurethane resin ink layer.
Further, described Graphene heat dissipating layer is nano-graphene heat dissipating layer.
Further, described conduction adhesive layer is to be added with the mucigel of conducting powder；Described conducting powder is any one in argentum powder, silver-coated copper powder, copper powder and nikel powder, and the particle diameter of conducting powder is 1-15 μm；Described mucigel is any one in modified epoxy layer, polyacrylic resin layer, polyimide resin layer, modified rubber layer, novolac resin layer, polyester resin layer and urethane resin layer.
Further, the thickness of described carrier film layer is 25-200 μm；The thickness of described ink layer is 5-50 μm；The thickness of described Graphene heat dissipating layer is 2-50 μm；The thickness of described conduction adhesive layer is 3-15 μm.
Further, the upper surface of described conduction adhesive layer is provided with a leafing type protecting film layer；The thickness of described release protecting film layer is 12-200 μm.
Further, described release protecting film layer is any one in PET mould release membrance, PP mould release membrance, PBT mould release membrance and release paper.
Further, it is coated with silicone oil parting agent layer or non-silicone oil parting agent layer between lower surface and the upper surface of described conduction adhesive layer of described release protecting film layer.
The beneficial effects of the utility model are: Graphene heat radiating type screened film of the present utility model, by using ink layer, has good insulating properties；Graphene heat radiating type screened film of the present utility model, by using Graphene heat dissipating layer, has excellent heat conduction, thermal diffusivity, advantages of good shielding performance；Graphene heat radiating type screened film of the present utility model, by using conductive adhesive layer, has the conduction property of excellence；This utility model, by using ink layer and conductive adhesive layer, has fabulous pliability, can meet the softness requirements of flexible circuitry board industry.Graphene heat radiating type screened film thickness ultrathin of the present utility model, ink layer, Graphene heat dissipating layer and conductive adhesive layer gross thickness minimum 8-16 μm.
Accompanying drawing explanation
Fig. 1 is the partial sectional view of this utility model embodiment one.
Fig. 2 is the partial sectional view of this utility model embodiment two.
Reference is: 1 carrier film layer, 2 ink layeies, 3 Graphene heat dissipating layers, 4 conduction adhesive layer, 5 release protecting film layers.
Detailed description of the invention
For the ease of the understanding of those skilled in the art, being further described this utility model below in conjunction with embodiment and accompanying drawing 1-2, the content that embodiment is mentioned is not to restriction of the present utility model.
It is illustrated in figure 1 the embodiment one of a kind of Graphene heat radiating type screened film described in the utility model, the ink layer 2 including carrier film layer 1, coating carrier film layer 1 upper surface, the Graphene heat dissipating layer 3 coating ink layer 2 upper surface, coats the conduction adhesive layer 4 of Graphene heat dissipating layer 3 upper surface.
Graphene heat radiating type screened film of the present utility model, by using ink layer 2, has good insulating properties；Graphene heat radiating type screened film of the present utility model, by using Graphene heat dissipating layer 3, has excellent heat conduction, thermal diffusivity, advantages of good shielding performance；Graphene heat radiating type screened film of the present utility model, by using conductive adhesive layer, has the conduction property of excellence；This utility model, by using ink layer 2 and conductive adhesive layer, has fabulous pliability, can meet the softness requirements of flexible circuitry board industry.Graphene heat radiating type screened film thickness ultrathin of the present utility model, ink layer 2, Graphene heat dissipating layer 3 and conductive adhesive layer gross thickness minimum 8-16 μm.
In the present embodiment, described carrier film layer 1 is high molecular polymer thin film.This utility model, by using high molecular polymer thin film as carrier film layer 1, has preferable light transmission and light diffusing.
In the present embodiment, described high molecular polymer thin film is any one of PET film, PEN thin film, PI thin film, PBT thin film and PPS thin film.This utility model, by using above-mentioned thin film as carrier film layer 1, has preferable light transmission and light diffusing.
In the present embodiment, described ink layer 2 is any one in epoxy resin ink layer, polyacrylic resin ink layer, modified rubber ink layer, phenolic resin ink layer, polyester resin ink layer and polyurethane resin ink layer.This utility model is by using above-mentioned ink layer 2 so that Graphene heat radiating type screened film has good insulating properties.
In the present embodiment, described Graphene heat dissipating layer is nano-graphene heat dissipating layer.This utility model is by using nano-graphene heat dissipating layer so that Graphene heat radiating type screened film has excellent heat conduction, thermal diffusivity, advantages of good shielding performance.
In the present embodiment, described conduction adhesive layer 4 is the mucigel being added with conducting powder.This utility model is added with the mucigel of conducting powder by employing so that Graphene heat radiating type screened film has the conduction property of excellence.
Described conducting powder is any one in argentum powder, silver-coated copper powder, copper powder and nikel powder, and the particle diameter of conducting powder is 1-15 μm.This utility model is by using above-mentioned conducting powder, and to control its particle diameter be 1-15 μm so that Graphene heat radiating type screened film has the conduction property of excellence.
Described mucigel is any one in modified epoxy layer, polyacrylic resin layer, polyimide resin layer, modified rubber layer, novolac resin layer, polyester resin layer and urethane resin layer.This utility model is by using above-mentioned mucigel, and it coheres effective.
In the present embodiment, the thickness of described carrier film layer 1 is 25-200 μm；The thickness of described ink layer 2 is 5-50 μm；The thickness of described Graphene heat dissipating layer 3 is 2-50 μm；The thickness of described conduction adhesive layer 4 is 3-15 μm.
It is illustrated in figure 2 the embodiment two of a kind of Graphene heat radiating type screened film described in the utility model, is with the difference of above-described embodiment one: the upper surface of described conduction adhesive layer 4 is provided with a leafing type protecting film layer 5；The thickness of described release protecting film layer 5 is 12-200 μm.This utility model is by arranging a leafing type protecting film layer 5 at the upper surface of conduction adhesive layer 4, and its protected effect is good.
In the present embodiment, described release protecting film layer 5 is any one in PET mould release membrance, PP mould release membrance, PBT mould release membrance and release paper.This utility model is by using above-mentioned mould release membrance as release protective layer, and its protected effect is good.
In the present embodiment, between lower surface and the upper surface of described conduction adhesive layer 4 of described release protecting film layer 5, it is coated with silicone oil parting agent layer or non-silicone oil parting agent layer.This utility model is coated with silicone oil parting agent layer or non-silicone oil parting agent layer by using the lower surface at release protecting film layer 5 so that release protecting film layer 5 can easily be peeled off in use.
Above-described embodiment is this utility model preferably implementation, and in addition, this utility model can realize with alternate manner, and the most any obvious replacement is all within protection domain of the present utility model.
Claims (10)
1. a Graphene heat radiating type screened film, it is characterised in that: include carrier film layer, coat the ink layer of carrier film layer upper surface, coat the Graphene heat dissipating layer of ink layer upper surface, coat the conduction adhesive layer of Graphene heat dissipating layer upper surface.
A kind of Graphene heat radiating type screened film the most according to claim 1, it is characterised in that: described carrier film layer is high molecular polymer thin film.
A kind of Graphene heat radiating type screened film the most according to claim 2, it is characterised in that: described high molecular polymer thin film is any one of PET film, PEN thin film, PI thin film, PBT thin film and PPS thin film.
A kind of Graphene heat radiating type screened film the most according to claim 1, it is characterised in that: described ink layer is any one in epoxy resin ink layer, polyacrylic resin ink layer, modified rubber ink layer, phenolic resin ink layer, polyester resin ink layer and polyurethane resin ink layer.
A kind of Graphene heat radiating type screened film the most according to claim 1, it is characterised in that: described Graphene heat dissipating layer is nano-graphene heat dissipating layer.
A kind of Graphene heat radiating type screened film the most according to claim 1, it is characterised in that: described conduction adhesive layer is to be added with the mucigel of conducting powder；Described conducting powder is any one in argentum powder, silver-coated copper powder, copper powder and nikel powder, and the particle diameter of conducting powder is 1-15 μm；Described mucigel is any one in modified epoxy layer, polyacrylic resin layer, polyimide resin layer, modified rubber layer, novolac resin layer, polyester resin layer and urethane resin layer.
A kind of Graphene heat radiating type screened film the most according to claim 1, it is characterised in that: the thickness of described carrier film layer is 25-200 μm；The thickness of described ink layer is 5-50 μm；The thickness of described Graphene heat dissipating layer is 2-50 μm；The thickness of described conduction adhesive layer is 3-15 μm.
A kind of Graphene heat radiating type screened film the most according to claim 1, it is characterised in that: the upper surface of described conduction adhesive layer is provided with a leafing type protecting film layer；The thickness of described release protecting film layer is 12-200 μm.
A kind of Graphene heat radiating type screened film the most according to claim 8, it is characterised in that: described release protecting film layer is any one in PET mould release membrance, PP mould release membrance, PBT mould release membrance and release paper.
A kind of Graphene heat radiating type screened film the most according to claim 8, it is characterised in that: it is coated with silicone oil parting agent layer or non-silicone oil parting agent layer between lower surface and the upper surface of described conduction adhesive layer of described release protecting film layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620033742.9U CN205546176U (en) | 2016-01-14 | 2016-01-14 | Graphite alkene heat dissipation type screened film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620033742.9U CN205546176U (en) | 2016-01-14 | 2016-01-14 | Graphite alkene heat dissipation type screened film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205546176U true CN205546176U (en) | 2016-08-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620033742.9U Expired - Fee Related CN205546176U (en) | 2016-01-14 | 2016-01-14 | Graphite alkene heat dissipation type screened film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205546176U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105491788A (en) * | 2016-01-14 | 2016-04-13 | 苏州城邦达力材料科技有限公司 | Graphene heat radiation type shielding film and preparation method thereof |
| CN108215370A (en) * | 2016-12-09 | 2018-06-29 | 松本涂层科技（昆山）有限公司 | A kind of flexible circuit board pressing resistance glue release paper and manufacturing process |
| TWI703921B (en) * | 2019-10-01 | 2020-09-01 | 十銓科技股份有限公司 | Dissipating heat device |
-
2016
- 2016-01-14 CN CN201620033742.9U patent/CN205546176U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105491788A (en) * | 2016-01-14 | 2016-04-13 | 苏州城邦达力材料科技有限公司 | Graphene heat radiation type shielding film and preparation method thereof |
| CN105491788B (en) * | 2016-01-14 | 2019-02-19 | 苏州城邦达力材料科技有限公司 | A kind of graphene heat radiating type screened film and preparation method thereof |
| CN108215370A (en) * | 2016-12-09 | 2018-06-29 | 松本涂层科技（昆山）有限公司 | A kind of flexible circuit board pressing resistance glue release paper and manufacturing process |
| CN108215370B (en) * | 2016-12-09 | 2019-09-13 | 松本涂层科技（昆山）有限公司 | A kind of flexible circuit board pressing resistance glue release paper and manufacturing process |
| TWI703921B (en) * | 2019-10-01 | 2020-09-01 | 十銓科技股份有限公司 | Dissipating heat device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215300 Dongping Road 399, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Suzhou Chengbang Dayi Material Technology Co.,Ltd. Address before: 215300 Dongping Road 399, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: SUZHOU CHENGBANGDALI MATERIAL TECHNOLOGY Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160831 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |