CN205430884U - Electromagnetic shielding film - Google Patents
Electromagnetic shielding film Download PDFInfo
- Publication number
- CN205430884U CN205430884U CN201620166396.1U CN201620166396U CN205430884U CN 205430884 U CN205430884 U CN 205430884U CN 201620166396 U CN201620166396 U CN 201620166396U CN 205430884 U CN205430884 U CN 205430884U
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- Prior art keywords
- electromagnetic shielding
- shielding film
- layer
- conductive adhesive
- film
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- 239000010410 layer Substances 0.000 claims abstract description 48
- 239000012790 adhesive layer Substances 0.000 claims abstract description 22
- 230000004888 barrier function Effects 0.000 claims description 16
- 230000003746 surface roughness Effects 0.000 claims description 7
- 239000012528 membrane Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 5
- 238000007763 reverse roll coating Methods 0.000 description 5
- 238000007774 anilox coating Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 239000004744 fabric Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920003225 polyurethane elastomer Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Abstract
The utility model relates to an electromagnetic shielding film, electromagnetic shielding film is by from type membrane, insulating layer, anchor layer, conductive adhesive layer, constitute from the type protection film, the anchor level is between insulating layer and conductive adhesive layer. The utility model discloses electromagnetic shielding film is attached on flexible printed circuit board, has excellent shielding effectiveness, adhesion properties and excellent inflection nature, this electromagnetic shielding film of more importantly when guaranteeing shielding effectiveness and electric conductivity, effective reduce cost.
Description
Technical field
This utility model relates to electronic circuit package film applications, particularly to a kind of electromagnetic shielding film.
Background technology
Along with the raising of people's safety consciousness, precision instrument is anti-interference, the needs of holding precision, and " electromagnetic pollution " is increasingly paid attention to by society, and a lot of countries have put into effect the electromagenetic wave radiation limitation standards of each electronic product in succession.Present stage, the microprocessor of the precision instruments such as mobile phone, notebook, digital camera, medical apparatus and instruments needs certain electromagnetic protection means, in existing electromagnetic protection means, attachment electromagnetic shielding film has more preferable practicality, more preferable operability, more cost advantage, more can meet slimming requirement and more be favored by Ge great electronics firm.
Existing electromagnetic shielding film main flow structure consists of: done carrier film by the PET film scribbling matte release layer; the side scribbling matte release layer in carrier film arranges one layer of pliable and tough insulating barrier of black; the pliable and tough insulating barrier of black is formed there is isotropic conductive adhesive layer, be combined one layer of protecting film scribbling release layer thereon.But this structure causes metal packing addition in conductive adhesive layer higher, also brings the increase of electromagnetic shielding film cost.
Utility model content
Technical problem to be solved in the utility model is to provide the electromagnetic shielding film of a kind of new construction, and described electromagnetic shielding film adds one layer of anchor layer, thus decreases the interpolation of conductive particle in conductive adhesive layer.
For solving above-mentioned technical problem, this utility model adopts the following technical scheme that
A kind of electromagnetic shielding film, is made up of release carrier film, insulating barrier, anchor layer, conductive adhesive layer, release protecting film, and described anchor layer is between insulating barrier and conductive adhesive layer.
Above-mentioned electromagnetic shielding film, the surface roughness of described anchor layer is less than or equal to 0.1 μm.
Above-mentioned electromagnetic shielding film, the thickness of described anchor layer is 0.5-2 μm.
Above-mentioned electromagnetic shielding film, described conductive adhesive layer thickness is 8-14 μm.
Above-mentioned electromagnetic shielding film, the thickness of described insulating barrier is 5-6 μm.
Beneficial effect
Compared with prior art, this utility model increases by an anchor layer between insulating barrier and conductive adhesive layer, and the surface roughness of anchor layer reaches conductive filler in below 0.1 μm, beneficially conductive adhesive layer and forms continuous interfacial in anchor layer, promote electric conductivity and the shielding of conductive adhesive layer.Relative to being not provided with the electromagnetic shielding film of anchor layer, under reaching identical effectiveness, the metal packing addition in its conductive adhesive layer can reduce by 20～30%, greatly reduces the cost of electromagnetic shielding film.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
In figure, each label is expressed as: 1 carrier film；2 insulating barriers；3 anchor layer；4 conductive adhesive layers；5 release protecting film.
Detailed description of the invention
This utility model adds anchor layer 3 between insulating barrier 2 and conductive adhesive layer 4.Anchor layer uses the resin system identical with insulating barrier or conductive adhesive layer, form resin bed, and improve precuring degree, the most both the attachment fastness between electromagnetic shielding membrane coat can have been improved, ensure the surface smoothness of anchor layer simultaneously, surface roughness reaches below 0.1 μm, the resin of anchor layer can use the one or more combination in polyester resin, polyurethane resin, epoxy resin, acrylic resin, polyimide resin, polyurethane elastomer, rubber elastomer, phenolic resin, phenoxy resin etc., and the thickness of anchor layer is 0.5-2 μm.
The electromagnetic shielding film that this utility model provides, can be obtained by following method:
By known coating method sequential application insulating barrier, anchor layer, the conductive adhesive layer successively such as silk rod coating, intaglio plate coating, extrusion coated, reverse roll coating, anilox roll coating, comma scraper coating on mould release membrance；It is dried, the protecting film of composite band release layer, rolling, cuts, obtain electromagnetic shielding film.
Electromagnetic shielding film in use, can be worked on the PI film of flexible circuit board by the way of lamination.Finally throw off release carrier film.
Embodiment
Below in conjunction with detailed description of the invention, this utility model is further described, but is not limited to this.
Embodiment 1
The mould release membrance of 50 μm is coated with layer of cloth by anilox roll coating method；It is coated with anchor layer with anilox roll coating method the most on the insulating layer, then by reverse roll coating method applying conductive glue-line in anchor layer, is dried, by the way of online being combined, be combined release protecting film, cut, obtain the electromagnetic shielding film with low cost.Wherein the thickness of insulating barrier is 5 μm, and the thickness of anchor layer is 0.5 μm, and anchor layer surface roughness is 0.05 μm, and the thickness of conductive adhesive layer is 8 μm.
Embodiment 2
The mould release membrance of 50 μm is coated with layer of cloth by reverse roll coating method；It is coated with anchor layer with anilox roll coating method the most on the insulating layer, then by comma scraper coating method applying conductive glue-line in anchor layer, is dried, by the way of online being combined, be combined release protecting film, cut, obtain the electromagnetic shielding film with low cost.Wherein the thickness of insulating barrier is 6 μm, and the thickness of anchor layer is 1 μm, and anchor layer surface roughness is 0.08 μm, and the thickness of conductive adhesive layer is 12 μm.
Embodiment 3
The mould release membrance of 50 μm is coated with layer of cloth by reverse roll coating method；It is coated with anchor layer with reverse roll coating method the most on the insulating layer, then by comma scraper coating method applying conductive glue-line in anchor layer, is dried; rolling; by the way of off-line is compound, it is combined release protecting film, cuts, obtain the electromagnetic shielding film with low cost.Wherein the thickness of insulating barrier is 6 μm, and the thickness of anchor layer is 2 μm, and anchor layer surface roughness is 0.1 μm, and the thickness of conductive adhesive layer is 14 μm.
Claims (5)
1. an electromagnetic shielding film, it is characterised in that being made up of release carrier film, insulating barrier, anchor layer, conductive adhesive layer, release protecting film, described anchor layer is between insulating barrier and conductive adhesive layer.
Electromagnetic shielding film the most according to claim 1, it is characterised in that the surface roughness of described anchor layer is less than or equal to 0.1 μm.
Electromagnetic shielding film the most according to claim 1, it is characterised in that the thickness of described anchor layer is 0.5-2 μm.
Electromagnetic shielding film the most according to claim 1, it is characterised in that described conductive adhesive layer thickness is 8-14 μm.
Electromagnetic shielding film the most according to claim 1, it is characterised in that the thickness of described insulating barrier is 5-6 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620166396.1U CN205430884U (en) | 2016-03-05 | 2016-03-05 | Electromagnetic shielding film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620166396.1U CN205430884U (en) | 2016-03-05 | 2016-03-05 | Electromagnetic shielding film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205430884U true CN205430884U (en) | 2016-08-03 |
Family
ID=56533013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620166396.1U Active CN205430884U (en) | 2016-03-05 | 2016-03-05 | Electromagnetic shielding film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205430884U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108513427A (en) * | 2018-04-16 | 2018-09-07 | 东莞市航晨纳米材料有限公司 | A kind of ultra-thin low-k, low resistance electromagnetic shielding film |
| CN108541204A (en) * | 2017-03-01 | 2018-09-14 | 昆山雅森电子材料科技有限公司 | High shielding slimming emi shielding film of combined type and preparation method thereof |
-
2016
- 2016-03-05 CN CN201620166396.1U patent/CN205430884U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108541204A (en) * | 2017-03-01 | 2018-09-14 | 昆山雅森电子材料科技有限公司 | High shielding slimming emi shielding film of combined type and preparation method thereof |
| CN108541204B (en) * | 2017-03-01 | 2020-11-17 | 昆山雅森电子材料科技有限公司 | Composite high-shielding thin electromagnetic interference shielding film and preparation method thereof |
| CN108513427A (en) * | 2018-04-16 | 2018-09-07 | 东莞市航晨纳米材料有限公司 | A kind of ultra-thin low-k, low resistance electromagnetic shielding film |
| CN108513427B (en) * | 2018-04-16 | 2019-09-06 | 东莞市航晨纳米材料有限公司 | A kind of ultra-thin low-k, low resistance electromagnetic shielding film |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: No. 569 Herun Road, Baoding City, Hebei Province, 071021 Patentee after: Aerospace Intelligent Manufacturing Technology Co.,Ltd. Country or region after: China Address before: 071054, 6 Kennan Avenue, Baoding, Hebei Patentee before: BAODING LUCKY INNOVATIVE MATERIALS Co.,Ltd. Country or region before: China |