CN201707425U - Detection device for integrated circuit testing - Google Patents

Detection device for integrated circuit testing Download PDF

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Publication number
CN201707425U
CN201707425U CN2010202273975U CN201020227397U CN201707425U CN 201707425 U CN201707425 U CN 201707425U CN 2010202273975 U CN2010202273975 U CN 2010202273975U CN 201020227397 U CN201020227397 U CN 201020227397U CN 201707425 U CN201707425 U CN 201707425U
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CN
China
Prior art keywords
base material
tangent plane
insulating material
integrated circuit
circuit testing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010202273975U
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Chinese (zh)
Inventor
王正仪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JUNYANG ELECTRONICS CO Ltd
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JUNYANG ELECTRONICS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to CN2010202273975U priority Critical patent/CN201707425U/en
Application granted granted Critical
Publication of CN201707425U publication Critical patent/CN201707425U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a detection device for integrated circuit testing, which at least comprises a substrate, a probe and a bypass capacitor. The substrate comprising an inner conductor filled with an insulating material is fixed into an outer conductor, a tangent plane is arranged at the tail end of the substrate to expose both the inner conductor and the insulating material on the tangent plane, one end of the probe is electrically connected with the inner conductor exposed on the tangent plane, the tail end of the probe is used for contacting a welding pad of an element to be detected, the bypass capacitor is provided with a first electrode end and a second electrode end, the first electrode end is electrically connected with the probe, and the second electrode end is connected with the outer conductor at the tail end of the substrate.

Description

The sniffer that is used for integrated circuit testing
Technical field
The utility model relates to the sniffer that is used for integrated circuit testing of the interchange noise of a kind of effectively filter out power or earth point.
Background technology
In the integrated circuit testing field, probe partly is the interface between the signal transmssion line of probe and integrated circuit determinand.The integrated circuit determinand is to can be in the semiconductor wafer a wherein crystal grain, can be formed with on the surface of crystal grain to visit the weld pad that touches for probe.
Generally speaking, a probe groups has plurality of probes.Weld pad on electrical contact measured semiconductor grain, the electrical specification that can test its integrated circuit is to judge whether semiconductor grain serves as good.Good semiconductor grain will be proceeded follow-up encapsulation or assembling processing procedure.Bad semiconductor grain will be rejected or repair, in order to avoid increase extra packaging cost.Yet, in the signals transmission of integrated circuit testing, except that need connect high-frequency signal, Chang Shangxu Extra Supply dc bias power, this dc bias power is subjected to that (noise of the generation of L * di/dt) and coupling power or earth point disturbs because of the inductance of the switch current bonding probes of conducting high frequency itself, cause distorted signals, and can't accurately measure the electrical specification of described semiconductor grain.
Therefore, see also Fig. 3, U.S. Pat 4,764 promptly discloses a kind of aluminum oxide substrate that utilizes for No. 723 and makes the Low ESR transmission line probe, with the stable dc bias power of supply integrated circuit, though it is provided with the setting of capacitor c, yet build the substrate front end that is equipped with capacitor c, need be contracted to the wafer-level size, cause complex manufacturing process and cost higher, unactual and present nothing is commercial to be used.
In addition, see also Fig. 4, U.S. Pat 5,373, also disclose for No. 231 a kind of outer sniffer of building the formula shunt capacitance that has is arranged, described sniffer is to include a rf probe a (RF probe), one circuit probe b (wire probe) and be located at described rf probe and described circuit probe between capacitor c, described coaxial probe a and described circuit probe b directly are installed in a detecting card, described capacitor c is described coaxial probe a of the soft connection of mechanical type and described circuit probe b, exchange noise and guarantee precision of test result to reach effective reduction, because building the formula capacitor outside described must be installed between per two probes, when cost height and production costs, though be applicable to the connection installing of cantalever type probe, yet, in case when running into the weld pad of element to be tested high low head being arranged, two probes promptly form mutual interference and restraint, and are unsatisfactory.And described circuit probe b and shielding not yet in effect can't completely cut off the coupling noise.
In view of this, the utility model designer is research and development and improvement constantly, and generation of the present utility model is arranged then.
Summary of the invention
Fundamental purpose of the present utility model provides the sniffer that is used for integrated circuit testing of the interchange noise of a kind of effectively filter out power or earth point.
In order to achieve the above object, the utility model is a kind of sniffer that is used for integrated circuit testing, at least comprise a base material, one surveys needle body and a bypass electric capacity, wherein said base material is to be fixed in the outer conductor after an insulating material filling by an inner wire, and described base material end is provided with a tangent plane, make inner wire, insulating material all exposes on the described tangent plane, described detection needle body one end is to electrically connect with the inner wire that exposes to above-mentioned tangent plane, survey the needle body end then for the weld pad that is used for the contact measured element, and described shunt capacitance has first electrode tip and second electrode tip, wherein first electrode tip is and surveys needle body and electrically connect, and second electrode tip then joins with the outer conductor of base material end.
During enforcement, described base material is the coaxial transmission line structure.
During enforcement, described insulating material is that pi (polyimide) constitutes.
During enforcement, described shunt capacitance is to be incorporated on the above-mentioned insulating material that exposes to above-mentioned tangent plane.
During enforcement, the described insulating material that exposes to the terminal tangent plane of base material is to protrude in the terminal tangent plane of base material, can be in conjunction with being fixed on the described insulating material that protrudes in the terminal tangent plane of base material for shunt capacitance.
Compared with prior art, adopt the advantage that the utlity model has of technique scheme to be:
1. the utility model is directly to be connected with a bypass electric capacity between detection needle body and base material outer conductor (earth terminal), be that each is surveyed needle body and all independently possesses a bypass electric capacity is arranged, make when measuring the rugged influence of the weld pad of no longer limited element under test or be subjected to the restraint of other cantilever-type probe bodies.
2. the set shunt capacitance of the utility model is to be directly connected between the outer conductor of surveying needle body and base material end, make described shunt capacitance more near element under test, effectively improve the validity of described shunt capacitance, and then the interchange noise of filter out power or earth point more effectively.
3. the outer conductor of the set base material of the utility model can constitute effective shielding, by the thickness of control insulating material, reduces and surveys the needle body impedance, reaches the purpose of uncoupling.
Description of drawings
Fig. 1 is the three-dimensional appearance synoptic diagram after the utility model embodiment sniffer and the probe assembling;
Fig. 2 A is that shunt capacitance is incorporated into schematic appearance on the insulating material among the utility model embodiment;
Fig. 2 B is that shunt capacitance is incorporated into schematic appearance on the insulating material among the utility model embodiment;
Fig. 2 C is that shunt capacitance is incorporated into the schematic appearance that protrudes on the base material tangent plane insulating material among the utility model embodiment;
Fig. 3 is the structural representation of prior art U.S. Patent number;
Fig. 4 is the structural representation of another patent No. of the prior art U.S..
Description of reference numerals: 1-base material; The 10-tangent plane; The 11-inner wire; The 12-insulating material; The 13-outer conductor; 2-surveys needle body; The 3-shunt capacitance; 31-first electrode tip; 32-second electrode tip; The 4-probe; The a-rf probe; B-circuit probe; The c-capacitor.
Embodiment
See also Fig. 1, Fig. 2 A, graphic content is an embodiment of the utility model sniffer of being used for integrated circuit testing, and it is by comprising that at least a base material 1, is surveyed needle body 2 and a bypass electric capacity 3 is formed.
Described base material 1 can be concentric cable or other transmission line structures, and described base material 1 is to be fixed in the outer conductor 13 after an insulating material 12 fillings by an inner wire 11, and described insulating material 12 is that pi (polyimide) constitutes.Described base material 1 end is provided with a tangent plane 10, make inner wire 11, insulating material 12 all exposes on the described tangent plane 10, described detection needle body 2 one ends are to electrically connect with the inner wire 11 that exposes to above-mentioned tangent plane 10, survey needle body 2 ends then for the weld pad that is used for the contact measured element, and described shunt capacitance 3 has first electrode tip 31 and second electrode tip 32, wherein first electrode tip 31 electrically connects with detection needle body 2,32 outer conductors 13 with base material 1 end of second electrode tip join, so, after the sniffer that the utility model is used for integrated circuit testing is installed in a probe 4, when measuring, survey the weld pad of needle body 2 terminal contact measured elements, because shunt capacitance 3 is directly connected between the outer conductor 13 of surveying needle body 2 and base material 1, make outer conductor 13 form earth terminal, to produce the interchange noise of power supply or earth point because of the switch current of conducting high frequency by described shunt capacitance 3 direct filterings.In addition, the outer conductor 13 of base material 1 also can constitute effective shielding, by the thickness of control insulating material 12, reduces and surveys needle body 2 impedances, reaches the purpose of uncoupling.
During enforcement, the set shunt capacitance 3 of the utility model can be incorporated on the above-mentioned insulating material 12 that exposes to above-mentioned tangent plane 10 (shown in Fig. 2 B), or, the described insulating material 12 that exposes to base material 1 terminal tangent plane 10 is to protrude in base material 1 terminal tangent plane 10, can be in conjunction with being fixed on the described insulating material 12 that protrudes in base material 1 terminal tangent plane 10 (shown in Fig. 2 C) for shunt capacitance 3.
Therefore, the utlity model has following advantage:
1. the utility model is directly to be connected with a bypass electric capacity between detection needle body and base material outer conductor (earth terminal), be that each is surveyed needle body and all independently possesses a bypass electric capacity is arranged, make when measuring the rugged influence of the weld pad of no longer limited element under test or be subjected to the restraint of other cantilever-type probe bodies.
2. the set shunt capacitance of the utility model is to be directly connected between the outer conductor of surveying needle body and base material end, make described shunt capacitance more near element under test, effectively improve the validity of described shunt capacitance, and then the interchange noise of filter out power or earth point more effectively.
3. the outer conductor of the set base material of the utility model can constitute effective shielding, by the thickness of control insulating material, reduces and surveys the needle body impedance, reaches the purpose of uncoupling.
More than explanation is just illustrative for the utility model; and nonrestrictive, those of ordinary skills understand, under the situation of the spirit and scope that do not break away from claim and limited; can make many modifications, variation or equivalence, but all will fall within the protection domain of the present utility model.

Claims (5)

1. a sniffer that is used for integrated circuit testing is characterized in that, comprises at least:
One base material be to be fixed in the outer conductor after an insulating material filling by an inner wire, and described base material end is provided with a tangent plane, and inner wire, insulating material are all exposed on the described tangent plane;
One surveys needle body, and described detection needle body one end electrically connects with the inner wire that exposes to above-mentioned tangent plane, surveys the needle body end then for the weld pad that is used for the contact measured element; And
One bypass electric capacity has first electrode tip and second electrode tip, and wherein first electrode tip electrically connects with surveying needle body, and second electrode tip then joins with the outer conductor of base material end.
2. the sniffer that is used for integrated circuit testing according to claim 1 is characterized in that: described base material is the coaxial transmission line structure.
3. the sniffer that is used for integrated circuit testing according to claim 1 is characterized in that: described insulating material is that pi constitutes.
4. the sniffer that is used for integrated circuit testing according to claim 1 is characterized in that: described shunt capacitance is incorporated on the above-mentioned insulating material that exposes to above-mentioned tangent plane.
5. the sniffer that is used for integrated circuit testing according to claim 4, it is characterized in that: the described insulating material that exposes to the terminal tangent plane of base material protrudes in the terminal tangent plane of base material, can be in conjunction with being fixed on the described insulating material that protrudes in the terminal tangent plane of base material for shunt capacitance.
CN2010202273975U 2010-06-12 2010-06-12 Detection device for integrated circuit testing Expired - Fee Related CN201707425U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010202273975U CN201707425U (en) 2010-06-12 2010-06-12 Detection device for integrated circuit testing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010202273975U CN201707425U (en) 2010-06-12 2010-06-12 Detection device for integrated circuit testing

Publications (1)

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CN201707425U true CN201707425U (en) 2011-01-12

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103869109A (en) * 2012-12-12 2014-06-18 华邦电子股份有限公司 Probe card and welding method
CN106199385A (en) * 2016-07-20 2016-12-07 苏州韬盛电子科技有限公司 A kind of test jack for chip and test circuit thereof
CN107024646A (en) * 2016-02-01 2017-08-08 致茂电子(苏州)有限公司 Detection components for electrostatic discharge testing
TWI630394B (en) * 2017-09-29 2018-07-21 中華精測科技股份有限公司 Probe assembly and capacitive probe thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103869109A (en) * 2012-12-12 2014-06-18 华邦电子股份有限公司 Probe card and welding method
CN107024646A (en) * 2016-02-01 2017-08-08 致茂电子(苏州)有限公司 Detection components for electrostatic discharge testing
CN106199385A (en) * 2016-07-20 2016-12-07 苏州韬盛电子科技有限公司 A kind of test jack for chip and test circuit thereof
TWI630394B (en) * 2017-09-29 2018-07-21 中華精測科技股份有限公司 Probe assembly and capacitive probe thereof

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110112

Termination date: 20180612

CF01 Termination of patent right due to non-payment of annual fee