CN116496752B - High-toughness organosilicon shingle conductive adhesive and preparation method thereof - Google Patents
High-toughness organosilicon shingle conductive adhesive and preparation method thereof Download PDFInfo
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- CN116496752B CN116496752B CN202310378020.1A CN202310378020A CN116496752B CN 116496752 B CN116496752 B CN 116496752B CN 202310378020 A CN202310378020 A CN 202310378020A CN 116496752 B CN116496752 B CN 116496752B
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- 239000000853 adhesive Substances 0.000 title claims abstract description 45
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 45
- 238000002360 preparation method Methods 0.000 title abstract description 9
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 27
- 229920002545 silicone oil Polymers 0.000 claims abstract description 25
- 239000004944 Liquid Silicone Rubber Substances 0.000 claims abstract description 22
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 22
- 239000010703 silicon Substances 0.000 claims abstract description 22
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 15
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 15
- 239000003054 catalyst Substances 0.000 claims abstract description 14
- 239000001257 hydrogen Substances 0.000 claims abstract description 13
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 13
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000002245 particle Substances 0.000 claims abstract description 11
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 4
- 238000003756 stirring Methods 0.000 claims description 18
- 229920001296 polysiloxane Polymers 0.000 claims description 15
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 14
- 229910052796 boron Inorganic materials 0.000 claims description 14
- 239000003085 diluting agent Substances 0.000 claims description 10
- 239000003112 inhibitor Substances 0.000 claims description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical group CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000003921 oil Substances 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 230000008014 freezing Effects 0.000 claims description 2
- 238000007710 freezing Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 238000004321 preservation Methods 0.000 claims description 2
- 239000002671 adjuvant Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000011159 matrix material Substances 0.000 abstract description 4
- 230000003014 reinforcing effect Effects 0.000 abstract description 3
- 230000000712 assembly Effects 0.000 abstract description 2
- 238000000429 assembly Methods 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 3
- 238000005303 weighing Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000011231 conductive filler Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- -1 methyl hydrogen Chemical class 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920004482 WACKER® Polymers 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a high-toughness organosilicon shingle conductive adhesive and a preparation method thereof, comprising the following steps: vinyl silicone oil 1-20wt%; 1-20wt% of hydrogen-containing silicone oil; 5-15wt% of organic silicon liquid silicone rubber; 60-80wt% of conductive particles; 0.01-2wt% of catalyst; the balance of the auxiliary agent; wherein the viscosity of the organic silicon liquid silicone rubber is 300,000-450,000mPa.s, the hardness is 40-60Shore A, the tensile strength is more than 7MPa, and the elongation at break is more than 400%. The invention creatively introduces the organic silicon liquid silicone rubber into the organic silicon laminated tile conductive adhesive as a reinforcing and toughening matrix, aims at optimizing the optimal addition amount and proportion, ensures that the conductive adhesive has excellent conductive performance and adhesive performance, has good toughness, can well solve the problem of broken strings of the organic silicon conductive adhesive in the assembly production process, and has high practical value in the manufacture of laminated tile assemblies.
Description
Technical Field
The invention belongs to the technical field of laminated tile conductive adhesive, and particularly relates to high-toughness organic silicon laminated tile conductive adhesive and a preparation method thereof.
Background
The solar photovoltaic module is fast in progress, the relative concept of the efficient module is continuously changed, and the shingle module is a novel photovoltaic packaging technology. The imbricating technology redesigns the grid line of the battery piece into a graph which can be reasonably cut into small pieces, so that the positive and negative poles of each small piece after cutting are in accordance with the imbricating design technology. And each small piece is welded to be made into a string, and the traditional welding strip serial battery structure is abandoned, and the technology of welding the small pieces into the string by using a conductive adhesive material is utilized, so that gaps in the assembly are fully utilized, more than 13% of battery pieces of a conventional assembly can be placed under the same area, and due to the optimization of the assembly structure, the welding strip-free design is adopted, the line loss of the assembly is reduced, and the output power of the assembly is greatly improved. From the above, it can be seen that the conductive glue is one of the key materials determining the reliability of the shingle assembly.
The conductive adhesive is an adhesive with certain conductive and heat-conductive properties after solidification, and is generally composed of matrix resin conductive filler, auxiliary agent and the like, and can be divided into an acrylic acid system, an epoxy system, an organosilicon system and the like according to the structure of the basic resin, wherein the organosilicon system is fast in solidification, good in ageing resistance, excellent in reliability and good in room temperature reworkability, and is widely applied to small and medium photovoltaic solar components. Because the overlapping parts of the cell sheets in the laminated tile assembly are required to be connected in series by conductive adhesive, the conductive adhesive is required to have good flexibility and excellent bonding performance, however, the conductive adhesive of the current organic silicon system has poor mechanical performance, especially toughness, due to the addition of conductive filler, so that the phenomenon of 'broken strings' often occurs in the production process of the laminated tile assembly, and the application of the conductive adhesive in the laminated tile photovoltaic assembly is limited.
Disclosure of Invention
Aiming at the technical problems, the invention provides the high-toughness organosilicon shingle conductive adhesive and the preparation method thereof, and the organosilicon liquid silicone rubber is innovatively introduced into the organosilicon shingle conductive adhesive to serve as a reinforcing and toughening matrix, so that the optimal addition amount and proportion are optimized, the conductive adhesive has excellent conductive performance and bonding performance, meanwhile, the conductive adhesive has good toughness, the problem of broken strings of the organosilicon conductive adhesive in the assembly production process can be well solved, and the conductive adhesive has high practical value in the manufacture of shingle assemblies.
In order to achieve the above purpose, the technical scheme of the invention is as follows:
a high-toughness organic shingle conductive adhesive comprising: vinyl silicone oil 1-20wt%; 1-20wt% of hydrogen-containing silicone oil; 5-15wt% of organic silicon liquid silicone rubber; 60-80wt% of conductive particles; 0.01-2wt% of catalyst; the balance of the auxiliary agent;
wherein the viscosity of the organic silicon liquid silicone rubber is 300,000-450,000mPa.s, the hardness is 40-60Shore A, the tensile strength is more than 7MPa, and the elongation at break is more than 400%.
In a preferred embodiment of the present invention, the vinyl silicone oil has a vinyl content of 0.05-1.5% and a viscosity of 1000-50000cp.
In a preferred embodiment of the present invention, the viscosity of the hydrogen-containing silicone oil is 10-100cp.
In a preferred embodiment of the present invention, the conductive particles are silver powder, copper powder or graphite powder.
In a preferred embodiment of the present invention, the catalyst is a platinum catalyst.
In a preferred embodiment of the invention, the auxiliary comprises 1-15wt% of a diluent; 0.1-5wt% of tackifier; 0.01-2wt% of inhibitor.
In a preferred embodiment of the present invention, the diluent is light white oil; the tackifier is a boron-containing tackifier, the viscosity of the boron-containing tackifier is less than 200 mPa.s, the refractive index of the boron-containing tackifier is 1.48-1.50, and the volatile content in the boron-containing tackifier is less than 5%; the inhibitor is 3, 5-dimethyl-1-hexyn-3-ol.
Based on the same inventive concept, the invention also provides a preparation method of the high-toughness organosilicon shingle conductive adhesive, which comprises the following steps:
adding vinyl silicone oil, hydrogen-containing silicone oil, liquid silicone rubber and a diluent into a stirring kettle according to the weight percentage, and uniformly stirring; then adding the conductive particles into the bottom of the stirring kettle, and uniformly stirring; finally, adding the tackifier, the inhibitor and the catalyst into a stirring kettle, and uniformly stirring; split charging and freezing preservation.
By adopting the technical scheme, the invention has the following advantages and positive effects compared with the prior art:
the invention innovatively introduces the organic silicon liquid silicon rubber into the organic silicon conductive rubber of the shingle solar energy component as a reinforcing and toughening matrix, aims to ensure that the conductive rubber has excellent conductive performance and bonding performance when the addition proportion is 5-15wt%, has good toughness, can well solve the problem of broken strings of the organic silicon conductive rubber in the production process of the component, and has high practical value in the manufacture of the shingle component.
Detailed Description
The high-toughness organosilicon shingle conductive adhesive and the preparation method thereof are further described in detail below with reference to specific examples. The advantages and features of the present invention will become more apparent from the following description.
Examples 1 to 3
A high-toughness organic shingle conductive adhesive comprising: 3.6 to 8.0 weight percent of vinyl silicone oil and 3.0 to 7.6 weight percent of hydrogen-containing silicone oil; 5-15wt% of organic silicon liquid silicone rubber; 70wt% of conductive particles; 0.3wt% of catalyst; 6-7.0wt% of a diluent; 2.0wt% of tackifier; 0.1wt% of inhibitor.
Wherein the vinyl silicone oil is purchased from Runfa organic silicon New Material Co.Ltd, the vinyl content in the vinyl silicone oil is between 0.05 and 1.5 percent, and the viscosity is between 1000 and 50000cp.
The hydrogen-containing silicone oil is methyl hydrogen silicone oil from Runfa organic silicon New material Co-Ltd, and the viscosity of the hydrogen-containing silicone oil is 10-100cp.
The conductive particles were purchased from silver powder of a Huizhu bright conductive material.
The diluent was purchased from Shanghai Jiarong trade company as a light white oil.
The tackifier is a boron-containing tackifier and is boron-containing methyl polysiloxane, the viscosity of the boron-containing tackifier in the embodiment is less than 200 mPa.s, the refractive index of the boron-containing tackifier is 1.48-1.50, the volatile content in the boron-containing tackifier is less than 5%, and specifically, the boron-containing tackifier in the embodiment is purchased from the tackifier with the brand Z-1501 manufactured by Jiangxi Lutai technology Co.
Catalyst was purchased from the Berster company as a Karster catalyst with a platinum content of 5000ppm;
inhibitors were purchased from Shanghai Meilin Biochemical technology Co.Ltd.3, 5-dimethyl-1-hexyn-3-ol.
Weighing the corresponding component contents according to the formula at 25-30 ℃, sequentially adding vinyl silicone oil, hydrogen-containing silicone oil, liquid silicone rubber and diluent into a stirring kettle, fully stirring for 1 hour, and uniformly mixing; then adding the conductive particles with the formula amount into the bottom of a stirring kettle, fully stirring for 0.5 hour, and uniformly mixing; weighing tackifier, inhibitor and catalyst in the amount of the formula, sequentially adding into a stirring kettle, fully stirring for 0.5 hour to obtain high-toughness organosilicon conductive adhesive, and then subpackaging into needle tubes for storage at the temperature of minus 40 ℃.
The organosilicon conductive adhesive prepared by the method is prepared by weighing the required raw materials according to the table 1
TABLE 1
| Component content (wt%) | Example 1 | Example 2 | Example 3 | Blank comparative example 1 | Comparative example 2 |
| Vinyl silicone oil | 8.0 | 6.6 | 3.6 | 13.3 | 3.0 |
| Hydrogen-containing silicone oil | 7.6 | 5.0 | 3.0 | 13.3 | 2.6 |
| Organic silicon liquid silicone rubber | 5.0 | 10.0 | 15.0 | 0 | 18.0 |
| Conductive particles | 70.0 | 70.0 | 70.0 | 70.0 | 70.0 |
| Diluent agent | 7.0 | 6.0 | 6.0 | 1.0 | 4.0 |
| Tackifier(s) | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 |
| Catalyst | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 |
| Inhibitors | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 |
After the preparation of the above comparative examples and examples was completed, the conductive paste was used to bond the battery sheets and cured, and the elongation at break, volume resistivity and adhesion were measured using the GT-TCS-2000 standard, and the results are shown in table 2:
TABLE 2
From the results shown in Table 2, it can be demonstrated that the addition of the silicone liquid silicone rubber to the silicone conductive adhesive increases the elongation at break and improves the toughness, as compared with examples 1 to 3, respectively, but the more the silicone liquid silicone rubber is added, the greater the elongation at break, but at an addition level of more than 15% by weight and 18% by weight (comparative example 2), the resistivity increases, the conductivity decreases, and the adhesion decreases, and therefore, the addition level of the silicone rubber is preferably 5 to 15% by weight, and the optimum conductivity, adhesion, and toughness of the silicone conductive adhesive can be ensured.
Examples 4 to 6
Although the silicone liquid silicone rubber can increase the toughness of the conductive adhesive after curing, the silicone liquid silicone rubber needs to be matched or synergistic with other components in the formula, an optimal combination needs to be sought, taking the mass ratio of the components in the embodiment 2 as an example, the silicone liquid silicone rubber with different performances, specifically ELASSIL LR 3070/40,ELASTOSIL LR 3070/50 and ELASSIL LR 3070/60 of Wacker, is selected from TYL-6B20/15, TYL-6B20/30 of Santa Clay silicone Limited, and the main performance parameters of the silicone liquid silicone rubber with different performances are shown in Table 3. And (5) examining influences of the organosilicon liquid silicone rubber with different properties on the finally synthesized conductive adhesive, and the hardness, tensile strength and elongation at break of the cured organosilicon liquid silicone rubber.
TABLE 3 Table 3
The organic silicon liquid silicone rubber with different performances in the table 3 and other components are synthesized into the conductive adhesive according to the preparation method, and the required raw materials are specifically referred to in the table 4:
TABLE 4 Table 4
The viscosity of the synthesized conductive adhesive is tested by a rheometer, ISO 3219, test method of D=101/s, and the conductive adhesive is used for testing the adhesion, elongation at break and volume resistivity after the bonding of the battery piece is cured. The test results are shown in Table 5.
TABLE 5
From the results of Table 5, the volume resistivity and the adhesion force of examples 4 to 6 and comparative examples 3 to 4 were not greatly different, but the elongation at break was greatly different, and the elongation at break of comparative examples 3 and 4 was much lower than that of examples 4 to 6.
In summary, in order to achieve the preferred conductive adhesive combination, the conductive adhesive is obtained by selecting the organic silicon liquid silicon rubber with the viscosity of 300,000-450,000mPa.s, the hardness of 40-60Shore A, the tensile strength of more than 7MPa and the elongation at break of more than 400 percent, and when the mass percentage of the organic silicon liquid silicon rubber is 5-15wt%, the organic silicon liquid silicon rubber is matched with other components, and has better toughness, conductivity and adhesive force.
The embodiments of the present invention have been described in detail, but the present invention is not limited to the above embodiments. Even if various changes are made to the present invention, it is within the scope of the appended claims and their equivalents to fall within the scope of the invention.
Claims (8)
1. The high-toughness organosilicon shingle conductive adhesive is characterized by comprising the following components: vinyl silicone oil 1-20wt%; 1-20wt% of hydrogen-containing silicone oil; 5-15wt% of organic silicon liquid silicone rubber; 60-80wt% of conductive particles; 0.01-2wt% of catalyst; the balance of the auxiliary agent;
wherein the viscosity of the organic silicon liquid silicone rubber is 300,000-450,000mPa.s, the hardness is 40-60Shore A, the tensile strength is more than 7MPa, and the elongation at break is more than 400%.
2. The high-toughness organosilicon shingle conductive adhesive according to claim 1, wherein the vinyl silicone oil has a vinyl content of 0.05-1.5% and a viscosity of 1000-50000cp.
3. The high-toughness silicone shingle conductive adhesive of claim 1, wherein the hydrogen-containing silicone oil has a viscosity of 10 to 100cp.
4. The high-toughness silicone shingle conductive paste of claim 1, wherein the conductive particles are silver powder, copper powder, or graphite powder.
5. The high-toughness silicone shingle conductive adhesive of claim 1, wherein the catalyst is a platinum catalyst.
6. The high-toughness silicone shingle conductive adhesive of claim 1, wherein the adjuvant comprises 1-15wt% of a diluent; 0.1-5wt% of tackifier; 0.01-2wt% of inhibitor.
7. The high-toughness silicone shingle conductive adhesive of claim 6, wherein the diluent is a light white oil; the tackifier is a boron-containing tackifier, the viscosity of the boron-containing tackifier is less than 200 mPa.s, the refractive index of the boron-containing tackifier is 1.48-1.50, and the volatile content in the boron-containing tackifier is less than 5%; the inhibitor is 3, 5-dimethyl-1-hexyn-3-ol.
8. A method for preparing the high-toughness organosilicon shingle conductive adhesive as claimed in claim 6 or 7, which comprises the following steps:
adding vinyl silicone oil, hydrogen-containing silicone oil, liquid silicone rubber and a diluent into a stirring kettle according to the weight percentage, and uniformly stirring; then adding the conductive particles into the bottom of the stirring kettle, and uniformly stirring; finally, adding the tackifier, the inhibitor and the catalyst into a stirring kettle, and uniformly stirring; split charging and freezing preservation.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110229648A (en) * | 2019-06-05 | 2019-09-13 | 苏州晶银新材料股份有限公司 | A kind of mono-component organic silicone conducting resinl and its preparation method and application |
| CN111961436A (en) * | 2020-08-11 | 2020-11-20 | 上海锐朗光电材料有限公司 | Photovoltaic laminated tile assembly organic silicon conductive adhesive and preparation method thereof |
| CN113789148A (en) * | 2021-09-27 | 2021-12-14 | 江苏矽时代材料科技有限公司 | Organic silicon foaming pouring sealant and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2020061988A1 (en) * | 2018-09-28 | 2020-04-02 | Dow Silicones Corporation | Liquid silicone rubber composition |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110229648A (en) * | 2019-06-05 | 2019-09-13 | 苏州晶银新材料股份有限公司 | A kind of mono-component organic silicone conducting resinl and its preparation method and application |
| CN111961436A (en) * | 2020-08-11 | 2020-11-20 | 上海锐朗光电材料有限公司 | Photovoltaic laminated tile assembly organic silicon conductive adhesive and preparation method thereof |
| CN113789148A (en) * | 2021-09-27 | 2021-12-14 | 江苏矽时代材料科技有限公司 | Organic silicon foaming pouring sealant and preparation method thereof |
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